ZA200805201B - Improved heat sink assembly - Google Patents
Improved heat sink assemblyInfo
- Publication number
- ZA200805201B ZA200805201B ZA200805201A ZA200805201A ZA200805201B ZA 200805201 B ZA200805201 B ZA 200805201B ZA 200805201 A ZA200805201 A ZA 200805201A ZA 200805201 A ZA200805201 A ZA 200805201A ZA 200805201 B ZA200805201 B ZA 200805201B
- Authority
- ZA
- South Africa
- Prior art keywords
- heat sink
- improved heat
- sink assembly
- assembly
- improved
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F19/00—Preventing the formation of deposits or corrosion, e.g. by using filters or scrapers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/291,247 US7472742B2 (en) | 2005-12-01 | 2005-12-01 | Heat sink assembly |
Publications (1)
Publication Number | Publication Date |
---|---|
ZA200805201B true ZA200805201B (en) | 2009-04-29 |
Family
ID=37895868
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ZA200805201A ZA200805201B (en) | 2005-12-01 | 2008-06-13 | Improved heat sink assembly |
Country Status (8)
Country | Link |
---|---|
US (3) | US7472742B2 (xx) |
CN (2) | CN101317264B (xx) |
AU (1) | AU2006320803B9 (xx) |
BR (1) | BRPI0620483A2 (xx) |
CA (1) | CA2630041A1 (xx) |
RU (1) | RU2419558C2 (xx) |
WO (1) | WO2007064572A1 (xx) |
ZA (1) | ZA200805201B (xx) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7472742B2 (en) * | 2005-12-01 | 2009-01-06 | General Electric Company | Heat sink assembly |
US7394654B2 (en) * | 2006-10-19 | 2008-07-01 | Cisco Technology, Inc. | Method and apparatus for providing thermal management in an electronic device |
US8944896B2 (en) * | 2007-02-22 | 2015-02-03 | Tellabs Operations, Inc. | Apparatus, system, and method for venting a chassis |
EP2261416B1 (en) * | 2009-06-09 | 2013-02-20 | Electrolux Home Products Corporation N.V. | Heat exchanger for a dryer, especially for a domestic dryer |
DE102009038806A1 (de) * | 2009-08-25 | 2011-03-03 | Ziehl-Abegg Ag | Elektronische Einheit mit Kühlrippen |
CN102483642B (zh) * | 2009-09-01 | 2014-12-24 | 生命科技公司 | 为快速热循环提供低热不均匀的热块组件和仪器 |
US8899043B2 (en) | 2010-01-21 | 2014-12-02 | The Abell Foundation, Inc. | Ocean thermal energy conversion plant |
US9086057B2 (en) | 2010-01-21 | 2015-07-21 | The Abell Foundation, Inc. | Ocean thermal energy conversion cold water pipe |
EP4273372A3 (en) | 2010-01-21 | 2024-01-24 | The Abell Foundation Inc. | Ocean thermal energy conversion power plant |
US10103089B2 (en) * | 2010-03-26 | 2018-10-16 | Hamilton Sundstrand Corporation | Heat transfer device with fins defining air flow channels |
CN103597918B (zh) * | 2011-05-17 | 2016-08-24 | 开利公司 | 可变频驱动散热器总成 |
WO2012161611A1 (ru) * | 2011-05-25 | 2012-11-29 | Valyentsov Mikhail Jur Yevich | Радиатор системы охлаждения, стойкий к появлению загрязнений, и способ его изготовления |
US9151279B2 (en) | 2011-08-15 | 2015-10-06 | The Abell Foundation, Inc. | Ocean thermal energy conversion power plant cold water pipe connection |
US20130042996A1 (en) * | 2011-08-15 | 2013-02-21 | Yunho Hwang | Transferring heat between fluids |
MX2014012678A (es) * | 2012-04-20 | 2015-09-22 | Renato Bastos Ribeiro | Sistema de movimiento mecanico para generacion de energia. |
US20130311940A1 (en) * | 2012-05-15 | 2013-11-21 | Salvadore V. Ragusa | System of Organizing Digital Images |
KR102317701B1 (ko) | 2012-10-16 | 2021-10-25 | 더 아벨 파운데이션, 인크. | 매니폴드를 포함한 열교환기 |
TWI482244B (zh) * | 2012-11-19 | 2015-04-21 | Ind Tech Res Inst | 熱交換器以及半導體模組 |
CN106461345B (zh) | 2014-02-18 | 2019-08-13 | 福斯德物理学有限责任公司 | 用于冷却的组件和方法 |
CA2914383A1 (en) * | 2015-12-29 | 2017-06-29 | John Stockdale | Compartmentalized heat exchanger in industrial component system |
CN105679721B (zh) * | 2016-01-19 | 2019-01-11 | 上海交通大学 | 用于防散热工质泄漏及芯片导线穿越的微通道流体散热器 |
CN106500171A (zh) * | 2016-12-14 | 2017-03-15 | 河南三元光电科技有限公司 | 一种用于电暖器的散热器 |
US10446741B2 (en) * | 2017-10-23 | 2019-10-15 | Taiwan Semiconductor Manufacturing Company, Ltd. | Multiple hard mask patterning to fabricate 20nm and below MRAM devices |
CN110149781B (zh) * | 2019-05-16 | 2020-12-08 | 珠海格力电器股份有限公司 | 散热装置及设有其的电器设备 |
USD1009399S1 (en) | 2021-07-20 | 2023-12-26 | Transportation Ip Holdings, Llc | Fluid control device |
Family Cites Families (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3517149A1 (de) * | 1985-05-11 | 1986-11-13 | Zinser Textilmaschinen Gmbh, 7333 Ebersbach | Kuehlvorrichtung |
US4765397A (en) * | 1986-11-28 | 1988-08-23 | International Business Machines Corp. | Immersion cooled circuit module with improved fins |
US5038858A (en) * | 1990-03-13 | 1991-08-13 | Thermalloy Incorporated | Finned heat sink and method of manufacture |
US5253613A (en) | 1992-04-30 | 1993-10-19 | General Electric Company | High power AC traction inverter cooling |
JPH06104583A (ja) * | 1992-09-22 | 1994-04-15 | Matsushita Electric Ind Co Ltd | 自然空冷放熱装置 |
US5535094A (en) * | 1995-04-26 | 1996-07-09 | Intel Corporation | Integrated circuit package with an integral heat sink and fan |
JP3220724B2 (ja) * | 1995-10-24 | 2001-10-22 | 昭和電工株式会社 | ヒートシンク |
DE19543902C1 (de) * | 1995-11-24 | 1997-06-05 | Voith Turbo Kg | Kühlluftanlage |
US5957194A (en) * | 1996-06-27 | 1999-09-28 | Advanced Thermal Solutions, Inc. | Plate fin heat exchanger having fluid control means |
US5832986A (en) * | 1996-06-28 | 1998-11-10 | Eastman Kodak Company | Heat exchanger |
DE19628545A1 (de) * | 1996-07-16 | 1998-01-22 | Abb Patent Gmbh | Hochleistungs-Kühler für ein luftgekühltes Stromrichtergerät |
US6233149B1 (en) * | 1997-04-23 | 2001-05-15 | General Electric Company | High power inverter air cooling |
US5946190A (en) * | 1997-08-29 | 1999-08-31 | Hewlett-Packard Company | Ducted high aspect ratio heatsink assembly |
FI974293A0 (fi) * | 1997-11-21 | 1997-11-21 | Muuntolaite Oy | Kylelement foer ojaemnt foerdelad vaermebelastning |
US6118656A (en) * | 1998-06-23 | 2000-09-12 | Dell Usa, Lp | Heat sink having a pressure gradient |
US6415852B1 (en) * | 2001-01-11 | 2002-07-09 | Foxconn Precision Components Co., Ltd. | Heat sink assembly |
US7314318B2 (en) * | 2001-03-15 | 2008-01-01 | International Business Machines Corporation | Compact optical transceivers including thermal distributing and electromagnetic shielding systems and methods thereof |
DE20109355U1 (de) * | 2001-06-06 | 2001-08-02 | Shih, John Wun-Chang, Chiung-Lin, Hsinchu | Verbesserter Strahler für zentrale Mikroprozessoren |
US6742581B2 (en) * | 2001-11-21 | 2004-06-01 | Fujikura Ltd. | Heat sink and fin module |
US6698500B2 (en) * | 2002-01-22 | 2004-03-02 | The Furukawa Electric Co., Ltd. | Heat sink with fins |
US6935419B2 (en) * | 2002-02-20 | 2005-08-30 | Hewlett-Packard Development Company, L.P. | Heat sink apparatus with air duct |
US20030173060A1 (en) * | 2002-03-13 | 2003-09-18 | Krassowski Daniel W. | Heat sink with cooling channel |
US6950306B2 (en) * | 2002-05-10 | 2005-09-27 | Delta Electronics, Inc. | Connection frame for fan |
TW584260U (en) * | 2002-06-28 | 2004-04-11 | Hon Hai Prec Ind Co Ltd | Heat sink device |
EP1478019A1 (en) * | 2003-05-14 | 2004-11-17 | Thomson Licensing S.A. | Streamline heat sink and method for manufacturing the heat sink |
JP2005026642A (ja) * | 2003-07-04 | 2005-01-27 | Furukawa Electric Co Ltd:The | 熱交換器 |
TWM243912U (en) * | 2003-08-25 | 2004-09-11 | Tatung Co | Heating dissipating device |
US20050072563A1 (en) * | 2003-10-03 | 2005-04-07 | Wang Chin Wen | Heat sink structure |
JP4411147B2 (ja) * | 2004-06-24 | 2010-02-10 | 株式会社日立製作所 | ファン付きヒートシンク |
US7472742B2 (en) * | 2005-12-01 | 2009-01-06 | General Electric Company | Heat sink assembly |
-
2005
- 2005-12-01 US US11/291,247 patent/US7472742B2/en not_active Expired - Fee Related
-
2006
- 2006-11-27 AU AU2006320803A patent/AU2006320803B9/en active Active
- 2006-11-27 BR BRPI0620483-0A patent/BRPI0620483A2/pt not_active IP Right Cessation
- 2006-11-27 CN CN200680044931.5A patent/CN101317264B/zh active Active
- 2006-11-27 CA CA002630041A patent/CA2630041A1/en not_active Abandoned
- 2006-11-27 CN CN201310002081.4A patent/CN103066034B/zh active Active
- 2006-11-27 WO PCT/US2006/045347 patent/WO2007064572A1/en active Application Filing
- 2006-11-27 RU RU2008126718/07A patent/RU2419558C2/ru active
-
2008
- 2008-06-13 ZA ZA200805201A patent/ZA200805201B/xx unknown
- 2008-12-22 US US12/340,824 patent/US8028744B2/en active Active
-
2011
- 2011-10-03 US US13/251,615 patent/US20120018138A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
US20070125518A1 (en) | 2007-06-07 |
AU2006320803B9 (en) | 2013-03-07 |
US20120018138A1 (en) | 2012-01-26 |
CN103066034B (zh) | 2016-12-28 |
RU2419558C2 (ru) | 2011-05-27 |
CN101317264B (zh) | 2013-08-28 |
AU2006320803A1 (en) | 2007-06-07 |
CN101317264A (zh) | 2008-12-03 |
BRPI0620483A2 (pt) | 2011-11-16 |
CA2630041A1 (en) | 2007-06-07 |
CN103066034A (zh) | 2013-04-24 |
US8028744B2 (en) | 2011-10-04 |
WO2007064572A1 (en) | 2007-06-07 |
AU2006320803B2 (en) | 2013-02-07 |
US20090101307A1 (en) | 2009-04-23 |
RU2008126718A (ru) | 2010-01-10 |
US7472742B2 (en) | 2009-01-06 |
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