ZA200805201B - Improved heat sink assembly - Google Patents

Improved heat sink assembly

Info

Publication number
ZA200805201B
ZA200805201B ZA200805201A ZA200805201A ZA200805201B ZA 200805201 B ZA200805201 B ZA 200805201B ZA 200805201 A ZA200805201 A ZA 200805201A ZA 200805201 A ZA200805201 A ZA 200805201A ZA 200805201 B ZA200805201 B ZA 200805201B
Authority
ZA
South Africa
Prior art keywords
heat sink
improved heat
sink assembly
assembly
improved
Prior art date
Application number
ZA200805201A
Other languages
English (en)
Inventor
Kumar Ajith Kuttannair
Brown Theodore Clark
Donajkowski Roland
Original Assignee
Gen Electric
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gen Electric filed Critical Gen Electric
Publication of ZA200805201B publication Critical patent/ZA200805201B/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F19/00—Preventing the formation of deposits or corrosion, e.g. by using filters or scrapers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
ZA200805201A 2005-12-01 2008-06-13 Improved heat sink assembly ZA200805201B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/291,247 US7472742B2 (en) 2005-12-01 2005-12-01 Heat sink assembly

Publications (1)

Publication Number Publication Date
ZA200805201B true ZA200805201B (en) 2009-04-29

Family

ID=37895868

Family Applications (1)

Application Number Title Priority Date Filing Date
ZA200805201A ZA200805201B (en) 2005-12-01 2008-06-13 Improved heat sink assembly

Country Status (8)

Country Link
US (3) US7472742B2 (xx)
CN (2) CN101317264B (xx)
AU (1) AU2006320803B9 (xx)
BR (1) BRPI0620483A2 (xx)
CA (1) CA2630041A1 (xx)
RU (1) RU2419558C2 (xx)
WO (1) WO2007064572A1 (xx)
ZA (1) ZA200805201B (xx)

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US7472742B2 (en) * 2005-12-01 2009-01-06 General Electric Company Heat sink assembly
US7394654B2 (en) * 2006-10-19 2008-07-01 Cisco Technology, Inc. Method and apparatus for providing thermal management in an electronic device
US8944896B2 (en) * 2007-02-22 2015-02-03 Tellabs Operations, Inc. Apparatus, system, and method for venting a chassis
EP2261416B1 (en) * 2009-06-09 2013-02-20 Electrolux Home Products Corporation N.V. Heat exchanger for a dryer, especially for a domestic dryer
DE102009038806A1 (de) * 2009-08-25 2011-03-03 Ziehl-Abegg Ag Elektronische Einheit mit Kühlrippen
CN102483642B (zh) * 2009-09-01 2014-12-24 生命科技公司 为快速热循环提供低热不均匀的热块组件和仪器
US8899043B2 (en) 2010-01-21 2014-12-02 The Abell Foundation, Inc. Ocean thermal energy conversion plant
US9086057B2 (en) 2010-01-21 2015-07-21 The Abell Foundation, Inc. Ocean thermal energy conversion cold water pipe
EP4273372A3 (en) 2010-01-21 2024-01-24 The Abell Foundation Inc. Ocean thermal energy conversion power plant
US10103089B2 (en) * 2010-03-26 2018-10-16 Hamilton Sundstrand Corporation Heat transfer device with fins defining air flow channels
CN103597918B (zh) * 2011-05-17 2016-08-24 开利公司 可变频驱动散热器总成
WO2012161611A1 (ru) * 2011-05-25 2012-11-29 Valyentsov Mikhail Jur Yevich Радиатор системы охлаждения, стойкий к появлению загрязнений, и способ его изготовления
US9151279B2 (en) 2011-08-15 2015-10-06 The Abell Foundation, Inc. Ocean thermal energy conversion power plant cold water pipe connection
US20130042996A1 (en) * 2011-08-15 2013-02-21 Yunho Hwang Transferring heat between fluids
MX2014012678A (es) * 2012-04-20 2015-09-22 Renato Bastos Ribeiro Sistema de movimiento mecanico para generacion de energia.
US20130311940A1 (en) * 2012-05-15 2013-11-21 Salvadore V. Ragusa System of Organizing Digital Images
KR102317701B1 (ko) 2012-10-16 2021-10-25 더 아벨 파운데이션, 인크. 매니폴드를 포함한 열교환기
TWI482244B (zh) * 2012-11-19 2015-04-21 Ind Tech Res Inst 熱交換器以及半導體模組
CN106461345B (zh) 2014-02-18 2019-08-13 福斯德物理学有限责任公司 用于冷却的组件和方法
CA2914383A1 (en) * 2015-12-29 2017-06-29 John Stockdale Compartmentalized heat exchanger in industrial component system
CN105679721B (zh) * 2016-01-19 2019-01-11 上海交通大学 用于防散热工质泄漏及芯片导线穿越的微通道流体散热器
CN106500171A (zh) * 2016-12-14 2017-03-15 河南三元光电科技有限公司 一种用于电暖器的散热器
US10446741B2 (en) * 2017-10-23 2019-10-15 Taiwan Semiconductor Manufacturing Company, Ltd. Multiple hard mask patterning to fabricate 20nm and below MRAM devices
CN110149781B (zh) * 2019-05-16 2020-12-08 珠海格力电器股份有限公司 散热装置及设有其的电器设备
USD1009399S1 (en) 2021-07-20 2023-12-26 Transportation Ip Holdings, Llc Fluid control device

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EP1478019A1 (en) * 2003-05-14 2004-11-17 Thomson Licensing S.A. Streamline heat sink and method for manufacturing the heat sink
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TWM243912U (en) * 2003-08-25 2004-09-11 Tatung Co Heating dissipating device
US20050072563A1 (en) * 2003-10-03 2005-04-07 Wang Chin Wen Heat sink structure
JP4411147B2 (ja) * 2004-06-24 2010-02-10 株式会社日立製作所 ファン付きヒートシンク
US7472742B2 (en) * 2005-12-01 2009-01-06 General Electric Company Heat sink assembly

Also Published As

Publication number Publication date
US20070125518A1 (en) 2007-06-07
AU2006320803B9 (en) 2013-03-07
US20120018138A1 (en) 2012-01-26
CN103066034B (zh) 2016-12-28
RU2419558C2 (ru) 2011-05-27
CN101317264B (zh) 2013-08-28
AU2006320803A1 (en) 2007-06-07
CN101317264A (zh) 2008-12-03
BRPI0620483A2 (pt) 2011-11-16
CA2630041A1 (en) 2007-06-07
CN103066034A (zh) 2013-04-24
US8028744B2 (en) 2011-10-04
WO2007064572A1 (en) 2007-06-07
AU2006320803B2 (en) 2013-02-07
US20090101307A1 (en) 2009-04-23
RU2008126718A (ru) 2010-01-10
US7472742B2 (en) 2009-01-06

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