ZA200303180B - Thermoelastic actuator design. - Google Patents
Thermoelastic actuator design. Download PDFInfo
- Publication number
- ZA200303180B ZA200303180B ZA200303180A ZA200303180A ZA200303180B ZA 200303180 B ZA200303180 B ZA 200303180B ZA 200303180 A ZA200303180 A ZA 200303180A ZA 200303180 A ZA200303180 A ZA 200303180A ZA 200303180 B ZA200303180 B ZA 200303180B
- Authority
- ZA
- South Africa
- Prior art keywords
- pct
- chemically inert
- silicon
- thermoelastic
- expansive element
- Prior art date
Links
- 238000013461 design Methods 0.000 title claims description 33
- 239000000463 material Substances 0.000 claims description 96
- 229910052710 silicon Inorganic materials 0.000 claims description 28
- 239000010703 silicon Substances 0.000 claims description 28
- 238000000034 method Methods 0.000 claims description 18
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 12
- 239000010936 titanium Substances 0.000 claims description 12
- 229910052719 titanium Inorganic materials 0.000 claims description 12
- 150000001247 metal acetylides Chemical class 0.000 claims description 7
- 229910021332 silicide Inorganic materials 0.000 claims description 7
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 6
- 229910052804 chromium Inorganic materials 0.000 claims description 6
- 239000011651 chromium Substances 0.000 claims description 6
- 229910052758 niobium Inorganic materials 0.000 claims description 6
- 239000010955 niobium Substances 0.000 claims description 6
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 claims description 6
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 5
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims description 5
- 229910052750 molybdenum Inorganic materials 0.000 claims description 5
- 239000011733 molybdenum Substances 0.000 claims description 5
- 150000004767 nitrides Chemical class 0.000 claims description 5
- 229910052726 zirconium Inorganic materials 0.000 claims description 5
- 239000000956 alloy Substances 0.000 claims description 4
- 238000004544 sputter deposition Methods 0.000 claims description 4
- 229910052715 tantalum Inorganic materials 0.000 claims description 4
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 4
- 238000007736 thin film deposition technique Methods 0.000 claims description 4
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 4
- 229910052721 tungsten Inorganic materials 0.000 claims description 4
- 239000010937 tungsten Substances 0.000 claims description 4
- 229910052720 vanadium Inorganic materials 0.000 claims description 4
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 claims 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 26
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 10
- 230000008018 melting Effects 0.000 description 6
- 238000002844 melting Methods 0.000 description 6
- 239000004810 polytetrafluoroethylene Substances 0.000 description 6
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 6
- 238000013459 approach Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- DFJQEGUNXWZVAH-UHFFFAOYSA-N bis($l^{2}-silanylidene)titanium Chemical compound [Si]=[Ti]=[Si] DFJQEGUNXWZVAH-UHFFFAOYSA-N 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 230000003647 oxidation Effects 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 229910021352 titanium disilicide Inorganic materials 0.000 description 4
- 239000012925 reference material Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 206010065042 Immune reconstitution inflammatory syndrome Diseases 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910021486 amorphous silicon dioxide Inorganic materials 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000009795 derivation Methods 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 210000003371 toe Anatomy 0.000 description 2
- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 description 2
- INZDTEICWPZYJM-UHFFFAOYSA-N 1-(chloromethyl)-4-[4-(chloromethyl)phenyl]benzene Chemical compound C1=CC(CCl)=CC=C1C1=CC=C(CCl)C=C1 INZDTEICWPZYJM-UHFFFAOYSA-N 0.000 description 1
- OFEAOSSMQHGXMM-UHFFFAOYSA-N 12007-10-2 Chemical compound [W].[W]=[B] OFEAOSSMQHGXMM-UHFFFAOYSA-N 0.000 description 1
- 101100298995 Arabidopsis thaliana PBC1 gene Proteins 0.000 description 1
- QYEXBYZXHDUPRC-UHFFFAOYSA-N B#[Ti]#B Chemical compound B#[Ti]#B QYEXBYZXHDUPRC-UHFFFAOYSA-N 0.000 description 1
- 229910052580 B4C Inorganic materials 0.000 description 1
- 101100533230 Caenorhabditis elegans ser-2 gene Proteins 0.000 description 1
- 101100478320 Caenorhabditis elegans sre-2 gene Proteins 0.000 description 1
- -1 Hafnium Nitride Chemical class 0.000 description 1
- 235000014548 Rubus moluccanus Nutrition 0.000 description 1
- 101710150104 Sensory rhodopsin-1 Proteins 0.000 description 1
- 229910033181 TiB2 Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 241000863032 Trieres Species 0.000 description 1
- 229910007948 ZrB2 Inorganic materials 0.000 description 1
- 229910026551 ZrC Inorganic materials 0.000 description 1
- OTCHGXYCWNXDOA-UHFFFAOYSA-N [C].[Zr] Chemical compound [C].[Zr] OTCHGXYCWNXDOA-UHFFFAOYSA-N 0.000 description 1
- TWRSDLOICOIGRH-UHFFFAOYSA-N [Si].[Si].[Hf] Chemical compound [Si].[Si].[Hf] TWRSDLOICOIGRH-UHFFFAOYSA-N 0.000 description 1
- 239000008186 active pharmaceutical agent Substances 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- SKKMWRVAJNPLFY-UHFFFAOYSA-N azanylidynevanadium Chemical compound [V]#N SKKMWRVAJNPLFY-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- MANYRMJQFFSZKJ-UHFFFAOYSA-N bis($l^{2}-silanylidene)tantalum Chemical compound [Si]=[Ta]=[Si] MANYRMJQFFSZKJ-UHFFFAOYSA-N 0.000 description 1
- UHPOHYZTPBGPKO-UHFFFAOYSA-N bis(boranylidyne)chromium Chemical compound B#[Cr]#B UHPOHYZTPBGPKO-UHFFFAOYSA-N 0.000 description 1
- LGLOITKZTDVGOE-UHFFFAOYSA-N boranylidynemolybdenum Chemical compound [Mo]#B LGLOITKZTDVGOE-UHFFFAOYSA-N 0.000 description 1
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 description 1
- JEUVAEBWTRCMTB-UHFFFAOYSA-N boron;tantalum Chemical compound B#[Ta]#B JEUVAEBWTRCMTB-UHFFFAOYSA-N 0.000 description 1
- VWZIXVXBCBBRGP-UHFFFAOYSA-N boron;zirconium Chemical compound B#[Zr]#B VWZIXVXBCBBRGP-UHFFFAOYSA-N 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000013070 direct material Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- MELCCCHYSRGEEL-UHFFFAOYSA-N hafnium diboride Chemical compound [Hf]1B=B1 MELCCCHYSRGEEL-UHFFFAOYSA-N 0.000 description 1
- WHJFNYXPKGDKBB-UHFFFAOYSA-N hafnium;methane Chemical compound C.[Hf] WHJFNYXPKGDKBB-UHFFFAOYSA-N 0.000 description 1
- UNASZPQZIFZUSI-UHFFFAOYSA-N methylidyneniobium Chemical compound [Nb]#C UNASZPQZIFZUSI-UHFFFAOYSA-N 0.000 description 1
- NFFIWVVINABMKP-UHFFFAOYSA-N methylidynetantalum Chemical compound [Ta]#C NFFIWVVINABMKP-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 238000010187 selection method Methods 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 229910003468 tantalcarbide Inorganic materials 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 230000000930 thermomechanical effect Effects 0.000 description 1
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 description 1
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 1
- ZVWKZXLXHLZXLS-UHFFFAOYSA-N zirconium nitride Chemical compound [Zr]#N ZVWKZXLXHLZXLS-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C99/00—Subject matter not provided for in other groups of this subclass
- B81C99/0055—Manufacturing logistics
- B81C99/006—Design; Simulation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14427—Structure of ink jet print heads with thermal bend detached actuators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0018—Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors, generators
- B81B3/0024—Transducers for transforming thermal into mechanical energy or vice versa, e.g. thermal or bimorph actuators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0035—Constitution or structural means for controlling the movement of the flexible or deformable elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F03—MACHINES OR ENGINES FOR LIQUIDS; WIND, SPRING, OR WEIGHT MOTORS; PRODUCING MECHANICAL POWER OR A REACTIVE PROPULSIVE THRUST, NOT OTHERWISE PROVIDED FOR
- F03G—SPRING, WEIGHT, INERTIA OR LIKE MOTORS; MECHANICAL-POWER PRODUCING DEVICES OR MECHANISMS, NOT OTHERWISE PROVIDED FOR OR USING ENERGY SOURCES NOT OTHERWISE PROVIDED FOR
- F03G7/00—Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for
- F03G7/06—Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/0036—Switches making use of microelectromechanical systems [MEMS]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/03—Microengines and actuators
- B81B2201/038—Microengines and actuators not provided for in B81B2201/031 - B81B2201/037
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F05—INDEXING SCHEMES RELATING TO ENGINES OR PUMPS IN VARIOUS SUBCLASSES OF CLASSES F01-F04
- F05C—INDEXING SCHEME RELATING TO MATERIALS, MATERIAL PROPERTIES OR MATERIAL CHARACTERISTICS FOR MACHINES, ENGINES OR PUMPS OTHER THAN NON-POSITIVE-DISPLACEMENT MACHINES OR ENGINES
- F05C2203/00—Non-metallic inorganic materials
- F05C2203/08—Ceramics; Oxides
- F05C2203/0804—Non-oxide ceramics
- F05C2203/0813—Carbides
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F05—INDEXING SCHEMES RELATING TO ENGINES OR PUMPS IN VARIOUS SUBCLASSES OF CLASSES F01-F04
- F05C—INDEXING SCHEME RELATING TO MATERIALS, MATERIAL PROPERTIES OR MATERIAL CHARACTERISTICS FOR MACHINES, ENGINES OR PUMPS OTHER THAN NON-POSITIVE-DISPLACEMENT MACHINES OR ENGINES
- F05C2203/00—Non-metallic inorganic materials
- F05C2203/08—Ceramics; Oxides
- F05C2203/0804—Non-oxide ceramics
- F05C2203/083—Nitrides
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F05—INDEXING SCHEMES RELATING TO ENGINES OR PUMPS IN VARIOUS SUBCLASSES OF CLASSES F01-F04
- F05C—INDEXING SCHEME RELATING TO MATERIALS, MATERIAL PROPERTIES OR MATERIAL CHARACTERISTICS FOR MACHINES, ENGINES OR PUMPS OTHER THAN NON-POSITIVE-DISPLACEMENT MACHINES OR ENGINES
- F05C2251/00—Material properties
- F05C2251/04—Thermal properties
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F05—INDEXING SCHEMES RELATING TO ENGINES OR PUMPS IN VARIOUS SUBCLASSES OF CLASSES F01-F04
- F05C—INDEXING SCHEME RELATING TO MATERIALS, MATERIAL PROPERTIES OR MATERIAL CHARACTERISTICS FOR MACHINES, ENGINES OR PUMPS OTHER THAN NON-POSITIVE-DISPLACEMENT MACHINES OR ENGINES
- F05C2251/00—Material properties
- F05C2251/04—Thermal properties
- F05C2251/042—Expansivity
- F05C2251/044—Expansivity similar
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F05—INDEXING SCHEMES RELATING TO ENGINES OR PUMPS IN VARIOUS SUBCLASSES OF CLASSES F01-F04
- F05C—INDEXING SCHEME RELATING TO MATERIALS, MATERIAL PROPERTIES OR MATERIAL CHARACTERISTICS FOR MACHINES, ENGINES OR PUMPS OTHER THAN NON-POSITIVE-DISPLACEMENT MACHINES OR ENGINES
- F05C2251/00—Material properties
- F05C2251/04—Thermal properties
- F05C2251/042—Expansivity
- F05C2251/046—Expansivity dissimilar
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H61/00—Electrothermal relays
- H01H2061/006—Micromechanical thermal relay
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H61/00—Electrothermal relays
- H01H2061/006—Micromechanical thermal relay
- H01H2061/008—Micromechanical actuator with a cold and a hot arm, coupled together at one end
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Computer Hardware Design (AREA)
- Combustion & Propulsion (AREA)
- Manufacturing & Machinery (AREA)
- Analytical Chemistry (AREA)
- Electromagnetism (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Ceramic Products (AREA)
- Micromachines (AREA)
- Manufacture Of Alloys Or Alloy Compounds (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/693,079 US7095309B1 (en) | 2000-10-20 | 2000-10-20 | Thermoelastic actuator design |
| PCT/AU2001/001332 WO2002032806A1 (en) | 2000-10-20 | 2001-10-19 | Thermoelastic actuator design |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ZA200303180B true ZA200303180B (en) | 2003-10-31 |
Family
ID=24783221
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ZA200303180A ZA200303180B (en) | 2000-10-20 | 2003-04-24 | Thermoelastic actuator design. |
Country Status (10)
| Country | Link |
|---|---|
| US (7) | US7095309B1 (de) |
| EP (1) | EP1330411A4 (de) |
| JP (2) | JP3863108B2 (de) |
| KR (1) | KR100505268B1 (de) |
| CN (1) | CN100408336C (de) |
| AU (3) | AU2002211985B2 (de) |
| IL (1) | IL155490A0 (de) |
| SG (1) | SG125985A1 (de) |
| WO (1) | WO2002032806A1 (de) |
| ZA (1) | ZA200303180B (de) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU2004202250B2 (en) * | 1999-04-22 | 2006-08-10 | Silverbrook Research Pty Ltd | Long life actuator element |
| US20060232365A1 (en) | 2002-10-25 | 2006-10-19 | Sumit Majumder | Micro-machined relay |
| US7075393B2 (en) | 2002-10-25 | 2006-07-11 | Analog Devices, Inc. | Micromachined relay with inorganic insulation |
| US7073890B2 (en) | 2003-08-28 | 2006-07-11 | Eastman Kodak Company | Thermally conductive thermal actuator and liquid drop emitter using same |
| US20060006484A1 (en) * | 2004-07-06 | 2006-01-12 | Dilan Seneviratne | Functional material for micro-mechanical systems |
| US20110063068A1 (en) * | 2009-09-17 | 2011-03-17 | The George Washington University | Thermally actuated rf microelectromechanical systems switch |
| CN101912848B (zh) * | 2010-08-25 | 2012-06-20 | 清华大学 | 电致动清洁装置 |
| US8735200B2 (en) | 2010-12-13 | 2014-05-27 | Sagnik Pal | Fabrication of robust electrothermal MEMS with fast thermal response |
| US8643140B2 (en) * | 2011-07-11 | 2014-02-04 | United Microelectronics Corp. | Suspended beam for use in MEMS device |
| CN103231185B (zh) * | 2013-04-03 | 2014-12-10 | 株洲宏大高分子材料有限公司 | 一种HFSi焊销及其制备方法 |
| FR3012671B1 (fr) * | 2013-10-29 | 2015-11-13 | St Microelectronics Rousset | Dispositif mecanique integre a mouvement vertical |
| EP3531811A4 (de) | 2016-11-25 | 2019-10-30 | Huawei Technologies Co., Ltd. | Wärmeableitungstafel, wärmeableitungsvorrichtung und elektronische vorrichtung |
| CN111233518B (zh) * | 2020-02-20 | 2021-04-13 | 中南大学 | 一种金属网格优化的抗烧蚀ZrHfC/SiC复相陶瓷涂层的制备方法及抗烧蚀复合材料 |
Family Cites Families (34)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4719477A (en) * | 1986-01-17 | 1988-01-12 | Hewlett-Packard Company | Integrated thermal ink jet printhead and method of manufacture |
| US5006421A (en) * | 1988-09-30 | 1991-04-09 | Siemens-Bendix Automotive Electronics, L.P. | Metalization systems for heater/sensor elements |
| US5409762A (en) * | 1989-05-10 | 1995-04-25 | The Furukawa Electric Company, Ltd. | Electric contact materials, production methods thereof and electric contacts used these |
| GB2281016A (en) * | 1993-08-10 | 1995-02-15 | Ea Tech Ltd | Microwave-assisted processing of materials |
| DE19541242A1 (de) * | 1995-11-06 | 1997-05-07 | Hoechst Ag | Lagerstabile Kunststoffadditive |
| US5710070A (en) * | 1996-11-08 | 1998-01-20 | Chartered Semiconductor Manufacturing Pte Ltd. | Application of titanium nitride and tungsten nitride thin film resistor for thermal ink jet technology |
| US5903380A (en) * | 1997-05-01 | 1999-05-11 | Rockwell International Corp. | Micro-electromechanical (MEM) optical resonator and method |
| US5870007A (en) * | 1997-06-16 | 1999-02-09 | Roxburgh Ltd. | Multi-dimensional physical actuation of microstructures |
| US6447099B2 (en) | 1997-07-15 | 2002-09-10 | Silverbrook Research Pty Ltd | Ink jet mechanism with thermoelastic bend actuator having conductive and resistive beams |
| EP0999934B1 (de) | 1997-07-15 | 2005-10-26 | Silver Brook Research Pty, Ltd | Thermisch betätigter tintenstrahl |
| US6491833B1 (en) * | 1997-07-15 | 2002-12-10 | Silverbrook Research Pty Ltd | Method of manufacture of a dual chamber single vertical actuator ink jet printer |
| US6254793B1 (en) * | 1997-07-15 | 2001-07-03 | Silverbrook Research Pty Ltd | Method of manufacture of high Young's modulus thermoelastic inkjet printer |
| US6855264B1 (en) * | 1997-07-15 | 2005-02-15 | Kia Silverbrook | Method of manufacture of an ink jet printer having a thermal actuator comprising an external coil spring |
| US6336710B1 (en) * | 1997-07-15 | 2002-01-08 | Silverbrook Research Pty Ltd | Dual nozzle single horizontal actuator ink jet printing mechanism |
| AUPP087397A0 (en) * | 1997-12-12 | 1998-01-08 | Silverbrook Research Pty Ltd | Image creation method and apparatus (IJ36) |
| AUPP089397A0 (en) * | 1997-12-12 | 1998-01-08 | Silverbrook Research Pty Ltd | Image creation method and apparatus (IJ37) |
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-
2000
- 2000-10-20 US US09/693,079 patent/US7095309B1/en not_active Expired - Fee Related
-
2001
- 2001-10-19 IL IL15549001A patent/IL155490A0/xx not_active IP Right Cessation
- 2001-10-19 CN CNB018177468A patent/CN100408336C/zh not_active Expired - Fee Related
- 2001-10-19 AU AU2002211985A patent/AU2002211985B2/en not_active Ceased
- 2001-10-19 AU AU1198502A patent/AU1198502A/xx active Pending
- 2001-10-19 WO PCT/AU2001/001332 patent/WO2002032806A1/en not_active Application Discontinuation
- 2001-10-19 KR KR10-2003-7005527A patent/KR100505268B1/ko not_active IP Right Cessation
- 2001-10-19 JP JP2002535997A patent/JP3863108B2/ja not_active Expired - Fee Related
- 2001-10-19 SG SG200501708A patent/SG125985A1/en unknown
- 2001-10-19 EP EP01980048A patent/EP1330411A4/de not_active Withdrawn
-
2003
- 2003-04-24 ZA ZA200303180A patent/ZA200303180B/en unknown
- 2003-08-08 US US10/636,259 patent/US6793974B2/en not_active Expired - Fee Related
-
2004
- 2004-05-27 US US10/854,269 patent/US7270475B2/en not_active Expired - Fee Related
- 2004-08-02 AU AU2004203504A patent/AU2004203504B2/en not_active Ceased
-
2005
- 2005-12-28 JP JP2005378957A patent/JP4551323B2/ja not_active Expired - Fee Related
-
2006
- 2006-05-30 US US11/442,180 patent/US7545251B2/en not_active Expired - Fee Related
-
2007
- 2007-06-26 US US11/768,875 patent/US7607826B2/en not_active Expired - Fee Related
-
2009
- 2009-05-04 US US12/435,359 patent/US20090212658A1/en not_active Abandoned
- 2009-10-01 US US12/572,080 patent/US7887233B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| EP1330411A4 (de) | 2006-02-01 |
| CN1694842A (zh) | 2005-11-09 |
| WO2002032806A1 (en) | 2002-04-25 |
| US20070082228A9 (en) | 2007-04-12 |
| AU2002211985B2 (en) | 2004-05-13 |
| CN100408336C (zh) | 2008-08-06 |
| US20040059449A1 (en) | 2004-03-25 |
| JP2006142478A (ja) | 2006-06-08 |
| JP3863108B2 (ja) | 2006-12-27 |
| US20100020843A1 (en) | 2010-01-28 |
| EP1330411A1 (de) | 2003-07-30 |
| KR100505268B1 (ko) | 2005-08-03 |
| US20070243413A1 (en) | 2007-10-18 |
| JP4551323B2 (ja) | 2010-09-29 |
| AU1198502A (en) | 2002-04-29 |
| AU2004203504A1 (en) | 2004-08-19 |
| US7545251B2 (en) | 2009-06-09 |
| US7095309B1 (en) | 2006-08-22 |
| US20060214761A1 (en) | 2006-09-28 |
| US7607826B2 (en) | 2009-10-27 |
| US7887233B2 (en) | 2011-02-15 |
| KR20040021572A (ko) | 2004-03-10 |
| JP2004510597A (ja) | 2004-04-08 |
| US20090212658A1 (en) | 2009-08-27 |
| AU2004203504B2 (en) | 2006-01-19 |
| IL155490A0 (en) | 2003-11-23 |
| US7270475B2 (en) | 2007-09-18 |
| US20050058856A1 (en) | 2005-03-17 |
| US6793974B2 (en) | 2004-09-21 |
| SG125985A1 (en) | 2006-10-30 |
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