ZA200303169B - Integrated circuit carrier with recesses. - Google Patents
Integrated circuit carrier with recesses. Download PDFInfo
- Publication number
- ZA200303169B ZA200303169B ZA200303169A ZA200303169A ZA200303169B ZA 200303169 B ZA200303169 B ZA 200303169B ZA 200303169 A ZA200303169 A ZA 200303169A ZA 200303169 A ZA200303169 A ZA 200303169A ZA 200303169 B ZA200303169 B ZA 200303169B
- Authority
- ZA
- South Africa
- Prior art keywords
- carrier
- integrated circuit
- wafer
- island
- receiving zone
- Prior art date
Links
- WYTGDNHDOZPMIW-RCBQFDQVSA-N alstonine Natural products C1=CC2=C3C=CC=CC3=NC2=C2N1C[C@H]1[C@H](C)OC=C(C(=O)OC)[C@H]1C2 WYTGDNHDOZPMIW-RCBQFDQVSA-N 0.000 claims description 27
- 208000002740 Muscle Rigidity Diseases 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 7
- 238000005530 etching Methods 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000011159 matrix material Substances 0.000 abstract description 4
- 229910000679 solder Inorganic materials 0.000 description 27
- 239000007787 solid Substances 0.000 description 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 9
- 229910052710 silicon Inorganic materials 0.000 description 9
- 239000010703 silicon Substances 0.000 description 9
- 238000003491 array Methods 0.000 description 4
- 239000000969 carrier Substances 0.000 description 4
- 230000000930 thermomechanical effect Effects 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- LVROLHVSYNLFBE-UHFFFAOYSA-N 2,3,6-trichlorobiphenyl Chemical compound ClC1=CC=C(Cl)C(C=2C=CC=CC=2)=C1Cl LVROLHVSYNLFBE-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000005382 thermal cycling Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
- H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/562—Protection against mechanical damage
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10734—Ball grid array [BGA]; Bump grid array
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Immobilizing And Processing Of Enzymes And Microorganisms (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/693,707 US7221043B1 (en) | 2000-10-20 | 2000-10-20 | Integrated circuit carrier with recesses |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ZA200303169B true ZA200303169B (en) | 2003-11-05 |
Family
ID=24785760
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ZA200303169A ZA200303169B (en) | 2000-10-20 | 2003-04-24 | Integrated circuit carrier with recesses. |
Country Status (12)
| Country | Link |
|---|---|
| US (4) | US7221043B1 (zh) |
| EP (1) | EP1410700B1 (zh) |
| JP (1) | JP3761520B2 (zh) |
| KR (1) | KR100526330B1 (zh) |
| CN (1) | CN1235453C (zh) |
| AT (1) | ATE381249T1 (zh) |
| AU (2) | AU2002210252B2 (zh) |
| DE (1) | DE60131906D1 (zh) |
| IL (2) | IL155466A0 (zh) |
| SG (1) | SG126771A1 (zh) |
| WO (1) | WO2002035896A1 (zh) |
| ZA (1) | ZA200303169B (zh) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7221043B1 (en) * | 2000-10-20 | 2007-05-22 | Silverbrook Research Pty Ltd | Integrated circuit carrier with recesses |
| JP4565339B2 (ja) * | 2003-05-16 | 2010-10-20 | ソニー株式会社 | 動き補正装置及び方法 |
| TW201241941A (en) * | 2010-10-21 | 2012-10-16 | Sumitomo Bakelite Co | A method for manufacturing an electronic equipment, and the electronic equipment obtained by using the method, as well as a method for manufacturing electronics and electronic parts, and the electronics and the electronic parts obtained using the method |
| US9513666B2 (en) * | 2014-07-25 | 2016-12-06 | VivaLnk, Inc. | Highly compliant wearable wireless patch having stress-relief capability |
| CN105338727B (zh) * | 2015-10-22 | 2018-05-25 | 北大方正集团有限公司 | 阶梯电路板的阶梯槽的制备方法以及阶梯电路板 |
| CN105392306A (zh) * | 2015-11-27 | 2016-03-09 | 北大方正集团有限公司 | 一种高频盲槽电路板及其加工方法 |
| US10064275B1 (en) | 2017-07-18 | 2018-08-28 | Mellanox Technologies, Ltd. | Extending the lifetime of a leadless SMT solder joint using pads comprising spring-shaped traces |
Family Cites Families (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4802277A (en) * | 1985-04-12 | 1989-02-07 | Hughes Aircraft Company | Method of making a chip carrier slotted array |
| WO1992006495A1 (en) | 1990-09-27 | 1992-04-16 | E.I. Du Pont De Nemours And Company | Thermal stress-relieved composite microelectronic device |
| US5483421A (en) * | 1992-03-09 | 1996-01-09 | International Business Machines Corporation | IC chip attachment |
| US5798909A (en) * | 1995-02-15 | 1998-08-25 | International Business Machines Corporation | Single-tiered organic chip carriers for wire bond-type chips |
| JP3294740B2 (ja) | 1995-07-31 | 2002-06-24 | 富士通株式会社 | 半導体装置 |
| DE19540814A1 (de) | 1995-11-02 | 1997-05-07 | Vdo Schindling | Platine |
| FR2745930B1 (fr) | 1996-03-11 | 1998-04-10 | Solaic Sa | Carte a circuit integre comportant une zone desolidarisee par une rainure |
| US6064576A (en) | 1997-01-02 | 2000-05-16 | Texas Instruments Incorporated | Interposer having a cantilevered ball connection and being electrically connected to a printed circuit board |
| US6121678A (en) * | 1997-12-19 | 2000-09-19 | Stmicroelectronics, Inc. | Wrap-around interconnect for fine pitch ball grid array |
| JP3020201B2 (ja) | 1998-05-27 | 2000-03-15 | 亜南半導体株式会社 | ボールグリッドアレイ半導体パッケージのモールディング方法 |
| JP2997746B2 (ja) | 1998-05-27 | 2000-01-11 | 亜南半導体株式会社 | 印刷回路基板 |
| JP2000012732A (ja) | 1998-06-24 | 2000-01-14 | Rohm Co Ltd | Ｂｇａ型半導体装置の構造 |
| US6050832A (en) | 1998-08-07 | 2000-04-18 | Fujitsu Limited | Chip and board stress relief interposer |
| TW399309B (en) * | 1998-09-30 | 2000-07-21 | World Wiser Electronics Inc | Cavity-down package structure with thermal via |
| US6341071B1 (en) | 1999-03-19 | 2002-01-22 | International Business Machines Corporation | Stress relieved ball grid array package |
| JP2000312075A (ja) | 1999-04-27 | 2000-11-07 | Nec Corp | プリント配線板への接続方法および構造 |
| US6078505A (en) | 1999-05-14 | 2000-06-20 | Triquint Semiconductor, Inc. | Circuit board assembly method |
| JP2001036222A (ja) | 1999-07-21 | 2001-02-09 | Fuji Photo Film Co Ltd | プリント回路基板 |
| US6524115B1 (en) * | 1999-08-20 | 2003-02-25 | 3M Innovative Properties Company | Compliant interconnect assembly |
| JP2001094228A (ja) | 1999-09-22 | 2001-04-06 | Seiko Epson Corp | 半導体装置の実装構造 |
| US7221043B1 (en) * | 2000-10-20 | 2007-05-22 | Silverbrook Research Pty Ltd | Integrated circuit carrier with recesses |
| US6775906B1 (en) * | 2000-10-20 | 2004-08-17 | Silverbrook Research Pty Ltd | Method of manufacturing an integrated circuit carrier |
| US6710457B1 (en) * | 2000-10-20 | 2004-03-23 | Silverbrook Research Pty Ltd | Integrated circuit carrier |
| US7443010B2 (en) * | 2001-04-05 | 2008-10-28 | Taiwan Semiconductor Manufacturing Co., Ltd. | Matrix form semiconductor package substrate having an electrode of serpentine shape |
| US7114961B2 (en) * | 2003-04-11 | 2006-10-03 | Neoconix, Inc. | Electrical connector on a flexible carrier |
| US6890185B1 (en) * | 2003-11-03 | 2005-05-10 | Kulicke & Soffa Interconnect, Inc. | Multipath interconnect with meandering contact cantilevers |
-
2000
- 2000-10-20 US US09/693,707 patent/US7221043B1/en not_active Expired - Fee Related
-
2001
- 2001-10-19 CN CNB01817762XA patent/CN1235453C/zh not_active Expired - Fee Related
- 2001-10-19 AU AU2002210252A patent/AU2002210252B2/en not_active Ceased
- 2001-10-19 SG SG200501873A patent/SG126771A1/en unknown
- 2001-10-19 EP EP01977988A patent/EP1410700B1/en not_active Expired - Lifetime
- 2001-10-19 IL IL15546601A patent/IL155466A0/xx unknown
- 2001-10-19 JP JP2002538727A patent/JP3761520B2/ja not_active Expired - Fee Related
- 2001-10-19 AU AU1025202A patent/AU1025202A/xx active Pending
- 2001-10-19 KR KR10-2003-7005533A patent/KR100526330B1/ko not_active IP Right Cessation
- 2001-10-19 WO PCT/AU2001/001330 patent/WO2002035896A1/en active IP Right Grant
- 2001-10-19 DE DE60131906T patent/DE60131906D1/de not_active Expired - Lifetime
- 2001-10-19 AT AT01977988T patent/ATE381249T1/de not_active IP Right Cessation
-
2003
- 2003-04-15 IL IL155466A patent/IL155466A/en not_active IP Right Cessation
- 2003-04-24 ZA ZA200303169A patent/ZA200303169B/en unknown
-
2007
- 2007-04-17 US US11/736,540 patent/US7402896B2/en not_active Expired - Fee Related
-
2008
- 2008-06-17 US US12/140,268 patent/US7974102B2/en not_active Expired - Fee Related
-
2011
- 2011-05-30 US US13/118,456 patent/US20110226520A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| US7221043B1 (en) | 2007-05-22 |
| CN1471804A (zh) | 2004-01-28 |
| WO2002035896A1 (en) | 2002-05-02 |
| US7402896B2 (en) | 2008-07-22 |
| EP1410700B1 (en) | 2007-12-12 |
| KR100526330B1 (ko) | 2005-11-08 |
| JP3761520B2 (ja) | 2006-03-29 |
| US20080247144A1 (en) | 2008-10-09 |
| IL155466A0 (en) | 2003-11-23 |
| US20110226520A1 (en) | 2011-09-22 |
| US20070284725A1 (en) | 2007-12-13 |
| IL155466A (en) | 2010-05-31 |
| EP1410700A1 (en) | 2004-04-21 |
| CN1235453C (zh) | 2006-01-04 |
| AU1025202A (en) | 2002-05-06 |
| ATE381249T1 (de) | 2007-12-15 |
| KR20030082931A (ko) | 2003-10-23 |
| EP1410700A4 (en) | 2006-05-03 |
| US7974102B2 (en) | 2011-07-05 |
| SG126771A1 (en) | 2006-11-29 |
| AU2002210252B2 (en) | 2004-12-09 |
| JP2004511922A (ja) | 2004-04-15 |
| DE60131906D1 (de) | 2008-01-24 |
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