YU34807B - Process for preparing a body from an insulating material with a metal coating bonded to it by means of a binder - Google Patents

Process for preparing a body from an insulating material with a metal coating bonded to it by means of a binder

Info

Publication number
YU34807B
YU34807B YU212770A YU212770A YU34807B YU 34807 B YU34807 B YU 34807B YU 212770 A YU212770 A YU 212770A YU 212770 A YU212770 A YU 212770A YU 34807 B YU34807 B YU 34807B
Authority
YU
Yugoslavia
Prior art keywords
binder
preparing
insulating material
metal coating
coating bonded
Prior art date
Application number
YU212770A
Other languages
English (en)
Other versions
YU212770A (en
Original Assignee
Schering Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schering Ag filed Critical Schering Ag
Publication of YU212770A publication Critical patent/YU212770A/xx
Publication of YU34807B publication Critical patent/YU34807B/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22—Roughening, e.g. by etching
    • C23C18/24—Roughening, e.g. by etching using acid aqueous solutions
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0789—Aqueous acid solution, e.g. for cleaning or etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0796—Oxidant in aqueous solution, e.g. permanganate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
YU212770A 1970-02-27 1970-08-24 Process for preparing a body from an insulating material with a metal coating bonded to it by means of a binder YU34807B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19702010438 DE2010438A1 (en) 1970-02-27 1970-02-27 Metallizing insulators for printed circuits e - tc

Publications (2)

Publication Number Publication Date
YU212770A YU212770A (en) 1979-09-10
YU34807B true YU34807B (en) 1980-03-15

Family

ID=5764210

Family Applications (1)

Application Number Title Priority Date Filing Date
YU212770A YU34807B (en) 1970-02-27 1970-08-24 Process for preparing a body from an insulating material with a metal coating bonded to it by means of a binder

Country Status (5)

Country Link
CS (1) CS166260B2 (enExample)
DE (1) DE2010438A1 (enExample)
PL (1) PL82788B1 (enExample)
RO (1) RO57550A (enExample)
YU (1) YU34807B (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1793013B1 (en) * 2005-12-05 2017-07-19 Rohm and Haas Electronic Materials LLC Metallization of dielectrics
EP2853619A1 (en) * 2013-09-25 2015-04-01 ATOTECH Deutschland GmbH Method for treatment of recessed structures in dielectric materials for smear removal

Also Published As

Publication number Publication date
RO57550A (enExample) 1974-12-15
CS166260B2 (enExample) 1976-02-27
PL82788B1 (enExample) 1975-10-31
YU212770A (en) 1979-09-10
DE2010438A1 (en) 1971-09-09

Similar Documents

Publication Publication Date Title
IT997786B (it) Procedimento di metallizzazione mediante getto di polvere metallica
JPS5282608A (en) Process for solidification of metallic powder
JPS5217449A (en) Process for manufacture of 155alkylprostaglandin
YU33450B (en) Process for electrophoretic coating by means of a small-particled ceramic material
YU39064B (en) Process for obtaining 8:14-dihydro-thebaine by means of thebaine reduction
HK22576A (en) Process for the production of nonwovens containing binder
YU314070A (en) Process for preparing an aqueous dispersion of an epoxy binder
HU171574B (hu) Sposob poluchenija proizvodnogo insulina s hhelochnym metallom ili ammiakom
YU212770A (en) Process for preparing a body from an insulating material with a metal coating bonded to it by means of a binder
YU226772A (en) Process for the production of metal like aluminium
ZA714050B (en) Production of metal powder
CS182229B2 (en) Process for preparing 1-alkyl-4-phenyl-2/1h/-chinazolines
PH10028A (en) Production of metals from metalliferous materials
JPS5416434A (en) Process for preparing unsaturated esters
YU34434B (en) Process for obtaining zinc from ferrites
CA928248A (en) Method for coating the surface of a metallic material
IL37238A0 (en) Process for the manufacture of a pyroglutamylpeptide
ZA725972B (en) Process for the production of unsaturated nitriles
JPS532458A (en) Process for preparing organic metallic compound
CA779910A (en) Process for the production of unsaturated nitriles containing a carbonylgroup
CA787881A (en) Process for production of long metallic whiskers
GB1344350A (en) Target for a vidicon
CA860628A (en) Method of surface binding metallic articles by means of explosives
ZA716361B (en) Improved process for the production of nickel
CA970348A (en) Catalytic composition for the production of unsaturated nitriles