WO2025251970A1 - 接口装置及其驱动机构、半导体工艺设备 - Google Patents

接口装置及其驱动机构、半导体工艺设备

Info

Publication number
WO2025251970A1
WO2025251970A1 PCT/CN2025/097639 CN2025097639W WO2025251970A1 WO 2025251970 A1 WO2025251970 A1 WO 2025251970A1 CN 2025097639 W CN2025097639 W CN 2025097639W WO 2025251970 A1 WO2025251970 A1 WO 2025251970A1
Authority
WO
WIPO (PCT)
Prior art keywords
sleeve
sliding member
driving
opening
magnetic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/CN2025/097639
Other languages
English (en)
French (fr)
Inventor
常江
黄敏涛
王文卓
钱存存
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Beijing Naura Microelectronics Equipment Co Ltd
Original Assignee
Beijing Naura Microelectronics Equipment Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Beijing Naura Microelectronics Equipment Co Ltd filed Critical Beijing Naura Microelectronics Equipment Co Ltd
Publication of WO2025251970A1 publication Critical patent/WO2025251970A1/zh
Pending legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations

Definitions

  • This application belongs to the field of semiconductor equipment technology, specifically relating to an interface device and its driving mechanism, and semiconductor process equipment.
  • FIMS Front-opening Interface Mechanical Standard
  • FOUP Front-opening Unified Pod
  • FIMS modules are needed to fix, purge, open, and close the wafer transport pod, ensuring a seal between the pod and the outside environment before and after opening, allowing the wafer to be transported cleanly between the wafer carrier area and the wafer transport pod.
  • the interface device includes a drive mechanism, which drives the movement of components that can open and close the wafer transfer box.
  • the drive mechanism is usually a pneumatic drive, and its components are prone to contact friction during relative movement, which can generate particles. In a vacuum environment, the diffusion of these particles can contaminate the wafer and thus affect the wafer's processing performance.
  • the purpose of this application is to provide an interface device and its driving mechanism, as well as semiconductor process equipment, which can solve the problem in related technologies that the driving mechanism of the interface device is prone to generating particles and thus contaminating the wafer during operation.
  • embodiments of this application provide a driving mechanism for an interface device, the interface device including an opening and closing cover device for opening and closing a wafer transfer box, the driving mechanism for driving the opening and closing cover device to perform linear motion, the driving mechanism including a sleeve, a first sliding member and a second sliding member, the first sliding member being sleeved on the outside of the sleeve, and a first gap being provided between the first sliding member and the outer wall surface of the sleeve, the second sliding member being slidably disposed inside the sleeve, the first sliding member or the sleeve being used to connect the opening and closing cover device;
  • the first sliding member is provided with a first magnetic element
  • the second sliding member is provided with a second magnetic element.
  • the first magnetic element and the second magnetic element are magnetically engaged.
  • embodiments of this application also provide an interface device, including an opening and closing cover device and the aforementioned driving mechanism.
  • the opening and closing cover device is used to open and close a wafer transfer box, and one of the first sliding member and the sleeve of the driving mechanism is connected to the opening and closing cover device.
  • embodiments of this application also provide a semiconductor process apparatus, including the interface device described above.
  • the first sliding member and the sleeve will not directly contact each other, avoiding friction and particle generation caused by direct contact between the two, thereby preventing particle diffusion and contamination of the wafer, and ensuring the wafer's process effect.
  • Figure 1 is a schematic diagram of the structure of the driving mechanism applied to the interface device disclosed in an embodiment of this application;
  • Figure 2 is a schematic diagram of the external structure of the sleeve disclosed in an embodiment of this application;
  • Figure 3 is a schematic diagram of the structure of the second sliding member disclosed in an embodiment of this application.
  • Figure 4 is a side view of the interface device disclosed in an embodiment of this application.
  • Figure 5 is a cross-sectional view at point D-D in Figure 4.
  • Figure 6 is an enlarged view of point E in Figure 4.
  • Figure 7 is an enlarged view of point F in Figure 4.
  • 10-Drive mechanism 10'-First drive component, 10"-Second drive component, 100-Sleeve, 110-Cap, 110a-First opening, 111-End cap, 112-Interface block 210-First sliding member, 210a-First gap, 220-First magnetic member, 220a-Second gap, 230- First spacer, 230a-third gap, 241-First stop block, 242-Second stop block, 240a-Fourth gap, 251 - First retaining ring, 252 - Second retaining ring, 250a - Fifth clearance.
  • first,” “second,” etc. used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first,” “second,” etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more.
  • “and/or” indicates at least one of the connected objects, and the character “/” generally indicates that the preceding and following objects are in an “or” relationship.
  • the interface device includes a drive mechanism that drives the movement of components capable of opening and closing the wafer transfer box.
  • the drive mechanism typically includes a sleeve, a first sliding member, and a second sliding member.
  • the first sliding member is located outside the sleeve, and the second sliding member is located inside the sleeve.
  • Both the first and second sliding members are slidably disposed, and the first sliding member or the sleeve is connected to the components capable of opening and closing the wafer transfer box.
  • gas When gas is introduced into the sleeve, the gas drives the second sliding member to move relative to the sleeve.
  • the second sliding member drives the first sliding member to move relative to the sleeve by means of a magnetically coupled magnetic assembly.
  • the sleeve and the first sliding part are prone to contact and friction, which in turn generates particles.
  • the diffusion of these particles can contaminate the wafer and thus affect the wafer's processing performance.
  • the driving mechanism 10 disclosed in this application embodiment is applied to an interface device, which can be a FIMS module.
  • the interface device includes an opening and closing cover device 20 for opening and closing the wafer transfer box 60.
  • the driving mechanism 10 is connected to the opening and closing cover device 20.
  • the driving mechanism 10 is used to drive the opening and closing cover device 20 to perform linear motion so that the opening and closing cover device 20 approaches the wafer transfer box 60, thereby facilitating the opening and closing cover device 20 to open the wafer transfer box 60.
  • the drive mechanism 10 includes a sleeve 100, a first sliding member 210, and a second sliding member 300.
  • the sleeve 100 provides a mounting base for the first sliding member 210 and the second sliding member 300.
  • the first sliding member 210 is sleeved on the outside of the sleeve 100, and the second sliding member 300 is slidably disposed inside the sleeve 100. Both the first sliding member 210 and the second sliding member 300 can move along the axial direction of the sleeve 100.
  • the first sliding member 210 or the sleeve 100 is used to connect the opening and closing cover device 20.
  • the second sliding member 300 when the second sliding member 300 is moved by gas, it can drive the first sliding member 210 to move together relative to the sleeve 100.
  • the first sliding member 210 When the sleeve 100 is fixedly installed, the first sliding member 210 is connected to the opening and closing cover device 20; or, when the first sliding member 210 is fixedly installed, the sleeve 100 is connected to the opening and closing cover device 20.
  • one of the first sliding member 210 and the sleeve 100 can be directly connected to the opening and closing device 20. Further, in some embodiments, one of the first sliding member 210 and the sleeve 100 can be fixedly connected to the opening and closing device 20 by welding, bonding or other means; or, in other embodiments, one of the first sliding member 210 and the sleeve 100 can be indirectly connected to the opening and closing device 20.
  • a first gap 210a is provided between the first sliding member 210 and the outer wall surface of the sleeve 100.
  • the first gap 210a can be greater than or equal to 0.5mm, that is, the first gap 210a is not less than 0.5mm, to avoid the first sliding member 210 from contacting the outer wall surface of the sleeve 100 due to the first gap 210a being too small.
  • the first gap 210a should not be too large to avoid affecting the magnetic attraction force between the first magnetic member 220 and the second magnetic member 310.
  • the first gap 210a can be provided between a local area of the first sliding member 210 and the outer wall surface of the sleeve 100 in the axial direction of the sleeve 100, or the first gap 210a can be provided between various positions of the first sliding member 210 and the outer wall surface of the sleeve 100.
  • the first sliding member 210 is completely isolated from the sleeve 100 to prevent the first sliding member 210 from contacting the sleeve 100 during sliding.
  • first sliding member 210 and the sleeve 100 are respectively connected to different components of the interface device. These two components of the interface device naturally form a first gap 210a between the first sliding member 210 and the sleeve 100. Therefore, no other structure is needed on the outside of the sleeve 100 to support the first sliding member 210 to form the first gap 210a.
  • these two components of the interface device are the connector 45 and the support plate 32b, respectively, as described below.
  • the first sliding member 210 is provided with a first magnetic element 220
  • the second sliding member 300 is provided with a second magnetic element 310, with the first magnetic element 220 and the second magnetic element 310 magnetically engaged.
  • the second sliding member 300 slides relative to the sleeve 100 along the axial direction of the sleeve 100
  • the second sliding member 300 drives the first sliding member 210 to slide synchronously relative to the sleeve 100 through the first magnetic element 220 and the second magnetic element 310.
  • the magnetic poles of the first magnetic element 220 and the second magnetic element 310 are opposite. According to the principle of opposite poles attracting, an attractive magnetic force is generated between the first magnetic element 220 and the second magnetic element 310.
  • the second magnetic element 310 attracts the first magnetic element 220, thereby causing the first magnetic element 220 to drive the first sliding member 210 to slide synchronously relative to the sleeve 100.
  • first gap 210a between the first sliding member 210 located outside the sleeve 100 and the sleeve 100. Therefore, during the operation of the drive mechanism 10, that is, during the sliding of the first sliding member 210 relative to the sleeve 100, the first sliding member 210 and the sleeve 100 will not directly contact each other, thus avoiding friction and particle generation caused by direct contact between the two, thereby preventing particle diffusion and contamination of the wafer, and ensuring the wafer's process effect.
  • the first sliding member 210 is a slide cylinder
  • the first magnetic member 220 is disposed inside the slide cylinder
  • the first magnetic member 220 is in contact with the outer wall surface of the sleeve 100, that is, the first magnetic member 220 protrudes from the inner wall surface of the slide cylinder.
  • a second gap 220a is provided between the first magnetic element 220 and the outer wall surface of the sleeve 100.
  • the second gap 220a may also be greater than or equal to 0.5mm, that is, the second gap 220a is not less than 0.5mm, to avoid the second gap 220a being too small and causing the first magnetic element 220 to contact the outer wall surface of the sleeve 100.
  • the second gap 220a should not be too large to avoid affecting the magnetic attraction force between the first magnetic element 220 and the second magnetic element 310.
  • the inner wall surface of the slide cylinder may be provided with a first slot, and the first magnetic element 220 is disposed in the first slot to ensure that the second gap 220a is formed between the first magnetic element 220 and the sleeve 100.
  • the first magnetic component 220 will not directly contact the sleeve 100 during the operation of the drive mechanism 10, thus avoiding friction between the two and the generation of particles, optimizing the environment of the wafer, and further ensuring the cleanliness of the wafer and the process effect.
  • the number of the first magnetic element 220 and the second magnetic element 310 is one.
  • first magnetic elements 220 and multiple second magnetic elements 310 there are multiple first magnetic elements 220 and multiple second magnetic elements 310.
  • the first magnetic elements 220 and the second magnetic elements 310 are magnetically coupled in a one-to-one correspondence. In this way, by setting multiple sets of first magnetic elements 220 and second magnetic elements 310, it is beneficial to increase the magnetic force between the first sliding element 210 and the second sliding element 300, and it is more conducive to the smooth sliding of the first sliding element 210 when the second sliding element 300 slides, thereby improving the synchronization of their sliding.
  • the drive mechanism 10 further includes a first spacer 230, which is used to separate two adjacent first magnetic elements 220.
  • the first spacer 230 is disposed on the inner wall surface of the slide cylinder, and the first magnetic elements 220 are spaced apart, with the first spacer 230 separating two adjacent first magnetic elements 220.
  • the first spacer 230 may be made of a material such as rubber.
  • a third gap 230a is provided between the first spacer 230 and the outer wall surface of the sleeve 100.
  • the third gap 230a may be greater than or equal to 0.5mm, that is, the third gap 230a is not less than 0.5mm, to avoid the first spacer 230 from contacting the outer wall surface of the sleeve 100 due to the third gap 230a being too small.
  • the third gap 230a should not be too large to avoid affecting the magnetic attraction force between the first magnetic element 220 and the second magnetic element 310.
  • the inner wall surface of the slide cylinder may be provided with a first slot, and the first spacer 230 and a plurality of first magnetic elements 220 are all disposed in the first slot, so that a third gap 230a is formed between the first spacer 230 and the sleeve 100.
  • the first spacer 230 will not directly contact the sleeve 100 during the operation of the drive mechanism 10, thus avoiding friction between the two and the generation of particles, optimizing the environment of the wafer, and further ensuring the cleanliness of the wafer and the process effect.
  • the first spacer 230 may protrude from the inner wall surface of the slide, and the first spacer 230 may contact the outer wall surface of the sleeve 100.
  • the drive mechanism 10 further includes a first stop 241 and a second stop 242.
  • the first stop 241 and the second stop 242 are located on both sides of the first magnetic element 220.
  • both the first stop 241 and the second stop 242 can be annular structures.
  • the first stop 241 and the second stop 242 are located on both sides of a magnetic assembly formed by the multiple first magnetic elements 220.
  • first stop 241 and the second stop 242 are connected to the slide cylinder and fixed relative to it, thereby confining the first magnetic element 220 between the first stop 241 and the second stop 242.
  • first stop 241 and the second stop 242 can be directly connected to the inner wall surface of the slide cylinder by welding, bonding, or other methods, or they can be indirectly connected to the slide cylinder through other components.
  • a fourth gap 240a is provided between the first stop 241 and the second stop 242 and the outer wall surface of the sleeve 100.
  • the fourth gap 240a may be greater than or equal to 0.5mm, that is, the fourth gap 240a is not less than 0.5mm, to avoid the first stop 241 and the second stop 242 from contacting the outer wall surface of the sleeve 100 due to the fourth gap 240a being too small.
  • the fourth gap 240a should not be too large to avoid affecting the magnetic attraction force between the first magnetic element 220 and the second magnetic element 310.
  • the first stop 241 and the second stop 242 will not directly contact the sleeve 100, thus avoiding friction between them and the generation of particles, optimizing the environment of the wafer, and further ensuring the cleanliness of the wafer and the process effect.
  • the drive mechanism 10 further includes a first retaining ring 251 and a second retaining ring 252.
  • the first retaining ring 251 and the second retaining ring 252 are located on opposite sides of the first stop block 241 and the second stop block 242, thereby confining the first stop block 241 and the second stop block 242 between the first retaining ring 251 and the second retaining ring 252.
  • the first retaining ring 251 and the second retaining ring 252 are respectively connected to the slide cylinder.
  • the first retaining ring 251 and the second retaining ring 252 are directly connected to the slide cylinder.
  • the inner wall surface of the slide cylinder is provided with a first annular groove and a second annular groove.
  • the first retaining ring 251 extends into the first annular groove and protrudes from the inner wall surface of the slide cylinder, and the second retaining ring 252 extends into the second annular groove and protrudes from the inner wall surface of the slide cylinder.
  • a fifth gap 250a is provided between the first retaining ring 251 and the second retaining ring 252 and the outer wall surface of the sleeve 100.
  • the fifth gap 250a may be greater than or equal to 0.5mm, that is, the fifth gap 250a is not less than 0.5mm, to avoid the first retaining ring 251 and the second retaining ring 252 contacting the outer wall surface of the sleeve 100 due to the fifth gap 250a being too small.
  • the fifth gap 250a should not be too large to avoid affecting the magnetic attraction force between the first magnetic element 220 and the second magnetic element 310.
  • the fifth gap 250a is greater than the fourth gap 240a.
  • the first retaining ring 251 and the second retaining ring 252 will not directly contact the sleeve 100, thus avoiding friction between them and the generation of particles, optimizing the environment of the wafer, and further ensuring the cleanliness of the wafer and the process effect.
  • the port of the sleeve 100 is in an open state, and a portion of the second slider 300 can extend beyond the sleeve 100.
  • the drive mechanism 10 further includes a cover 110, which is connected to the end of the sleeve 100 to close the port of the sleeve 100.
  • the cover 110 and the sleeve 100 remain relatively fixed.
  • the cover 110 closes the port of the sleeve 100, the second sliding member 300 slides only within the internal space of the sleeve 100.
  • the cover 110 is provided with an airflow channel a, which connects to the internal space of the sleeve 100. External gas flows into the sleeve 100 through the airflow channel a, and the gas, as a power source, can push the second sliding member 300 to slide relative to the sleeve 100.
  • both ends of the sleeve 100 are provided with a cover 110, and both covers 110 are provided with an airflow channel a. Gas flows into the sleeve 100 through different airflow channels a, which can drive the second sliding member 300 to slide relative to the sleeve 100 in different directions.
  • the cover 110 or the first sliding member 210 is used to connect the opening and closing cover device 20.
  • the cover 110 includes an end cap 111 and an interface block 112, the end cap 111 closing the port of the sleeve 100, and the interface block 112 being disposed on the end cap 111.
  • the particles generated by the friction between the two will not be discharged to the outside of the sleeve 100, thereby preventing the particles from spreading to the surface of the wafer, which is more conducive to optimizing the environment of the wafer and ensuring the process effect of the wafer.
  • the drive mechanism 10 further includes a cylinder 400, which sequentially passes through a cover 110 and a second sliding member 300 along the axial direction of the sleeve 100.
  • the cylinder 400 forms a channel 400a for gas or line access
  • the cover 110 has a first opening 110a communicating with the channel 400a.
  • the cover opening and closing device 20 typically includes an unlocking component, which needs to be connected to an external power supply device via a line. In this way, the line can directly pass through the first opening 110a and through the cylinder 400, avoiding the line from drooping directly and contacting other components to generate particles, thereby avoiding wafer contamination.
  • the first opening 110a is formed in the interface block 112, and the cylinder 400 passes through the first opening 110a, the end cap 111, and the second sliding member 300 in sequence.
  • the cylinder 400 can be made of stainless steel, or other materials.
  • the drive mechanism 10 may not have a cylinder 400, and the interior of the second sliding member 300 may be a solid structure, that is, the second sliding member 300 may not have a channel 400a, and the line connected to the opening and closing cover device 20 may be directly suspended downwards.
  • the drive mechanism 10 further includes at least one of a first seal 510, a second seal 520, and a third seal 530.
  • the first seal 510 is disposed between the second sliding member 300 and the cylinder 400; the second seal 520 is disposed between the cap 110 and the cylinder 400. Further, in some embodiments, the second seal 520 is disposed between the end cap 111 and the cylinder 400; and the third seal 530 is disposed on the outer peripheral surface of the second sliding member 300.
  • the second sliding member 300 includes a piston
  • the third sealing member 530 is disposed on the outer peripheral surface of the piston. That is, the drive mechanism 10 may only include one of the first sealing member 510, the second sealing member 520, and the third sealing member 530, or only include two of the first sealing member 510, the second sealing member 520, and the third sealing member 530, or all three may be present simultaneously.
  • the first sealing member 510, the second sealing member 520, and the third sealing member 530 may be sealing rings, which may be rubber rings or other components that provide a sealing effect.
  • the first sealing element 510 seals the gap between the second sliding element 300 and the cylinder 400
  • the second sealing element 520 seals the gap between the cap 110 and the cylinder 400, which helps to improve the sealing performance of the cylinder 400
  • the third sealing element 530 seals the gap between the second sliding element 300 and the sleeve 100, which helps to improve the sealing performance of the sleeve 100.
  • the drive mechanism 10 may not be provided with the first seal 510, the second seal 520 and the third seal 530, and the drive mechanism 10 may use other methods for sealing.
  • the second sliding member 300 includes a piston and a second spacer 320.
  • the outer peripheral surface of the piston may be provided with a second slot, and each second magnetic member 310 is disposed at intervals within the second slot.
  • the second spacer 320 is located between two adjacent second magnetic members 310 to isolate the two adjacent second magnetic members 310. In some embodiments, any two adjacent second magnetic members 310 are separated by the second spacer 320.
  • the second sliding member 300 includes a first piston 331, a second piston 332, and a second spacer 320.
  • the number of second magnetic members 310 is at least two, with each second magnetic member 310 spaced apart between the first piston 331 and the second piston 332.
  • the cylinder 400 sequentially passes through the combined structure of the first piston 331, the second magnetic member 310, and the second spacer 320, as well as the second piston 332.
  • the first piston 331 and the second magnetic member 310, the second magnetic member 310 and the adjacent second spacer 320, and the second magnetic member 310 and the second piston 332 can be connected by welding, bonding, or other methods.
  • the outer peripheral surfaces of the first piston 331 and the second piston 332 are each provided with a third sealing member 530, and the third sealing member 530 is disposed adjacent to the second magnetic member 310.
  • the drive mechanism 10 further includes a wear-resistant ring 340, which is sleeved on the outside of the piston 330. Further, in some embodiments, the wear-resistant ring 340 is sleeved on the outside of both the first piston 331 and the second piston 332. Additionally, in some embodiments, the outer circumferential surfaces of both the first piston 331 and the second piston 332 are provided with a third annular groove for mounting the wear-resistant ring 340.
  • the piston slides against the inner wall of the sleeve 100 via the wear-resistant ring 340, avoiding prolonged direct contact between the piston and the sleeve 100, which would cause severe wear on the piston and extend its service life.
  • the interface device includes an opening/closing cover device 20 and the aforementioned drive mechanism 10.
  • Figure 4 only schematically shows the overall structure of the drive mechanism 10 and does not show the internal structure of the sleeve 100, such as the second sliding member 300.
  • the opening/closing cover device 20 is used to open and close the wafer transfer box 60.
  • One of the first sliding member 210 of the drive mechanism 10 and the sleeve 100 is connected to the opening/closing cover device 20.
  • the other of the first sliding member 210 and the sleeve 100 drives the opening and closing device 20 to move relative to the fixed one of the first sliding member 210 and the sleeve 100, so that the opening and closing device 20 is close to the wafer transfer box 60, thereby facilitating the opening and closing device 20 to open the wafer transfer box 60.
  • the second sliding member 300 is fixed under the magnetic attraction between the first magnetic member 220 and the second magnetic member 310.
  • the sleeve 100 slides relative to the second sliding member 300, so that the opening and closing device 20 moves closer to the wafer transfer box 60, thereby facilitating the opening and closing device 20 to open the wafer transfer box 60.
  • the first sliding member 210 moves relative to the sleeve 100, so that the opening and closing device 20 moves closer to the wafer transfer box 60, thereby facilitating the opening and closing device 20 to open the wafer transfer box 60.
  • first gap 210a between the first sliding member 210 of the drive mechanism 10 of the interface device and the sleeve 100. Therefore, during the operation of the drive mechanism 10, that is, during the sliding of the first sliding member 210 relative to the sleeve 100, the first sliding member 210 and the sleeve 100 will not directly contact each other, avoiding friction and particle generation caused by direct contact between the two, thereby preventing particle diffusion and contamination of the wafer. This is beneficial to optimizing the environment of the interface device and ensuring the process effect of the wafer.
  • the interface device includes a fixed plate 31 and a drive mechanism 10.
  • the drive mechanism 10 is disposed on the fixed plate 31 and is connected to the opening and closing cover device 20.
  • the drive mechanism 10 can drive the opening and closing cover device 20 to move relative to the fixed plate 31 along a first direction A.
  • the first sliding member 210 of the drive mechanism 10 can be connected to other components (e.g., the support frame 32 (i.e., the support plate 32b) hereinafter referred to as the support frame 32).
  • the sleeve 100 of the drive mechanism 10 can be connected to the opening and closing cover device 20.
  • the sleeve 100 of the drive mechanism 10 is connected to the opening and closing cover device 20 through a cover 110.
  • the first sliding member 210 and the support frame 32 i.e., the support base 32a or the support plate 32b
  • the sleeve 100 and the cover 110 can be connected by welding, bonding, or other methods.
  • the interface device further includes a support frame 32, a first driving member 10', and a second driving member 10"".
  • the first driving member 10' is disposed on the support frame 32 and connected to the opening and closing cover device 20.
  • the first driving member 10' can drive the opening and closing cover device 20 to move relative to the support frame 32 along a first direction A.
  • the second driving member 10" is disposed on a fixed plate 31 and connected to the support frame 32.
  • the second driving member 10" can drive the support frame 32 to move the first driving member 10' and the opening and closing cover device 20 relative to the fixed plate 31 along a second direction B.
  • the first direction A and the second direction B intersect.
  • the first direction A intersects the second direction B
  • the first direction A is perpendicular to the plane where the opening and closing cover device 20 is located
  • the second direction B is parallel to the plane where the opening and closing cover device 20 is located.
  • At least one of the first driving member 10' and the second driving member 10" is a driving mechanism 10. Specifically, only the first driving member 10' or only the second driving member 10" may use the driving mechanism 10 described above; or, both the first driving member 10' and the second driving member 10" may use the driving mechanism 10 described above.
  • the first sliding member 210 of the first driving member 10' may be connected to the support frame 32, and the sleeve 100 of the first driving member 10' may be connected to the opening and closing cover device 20.
  • the sleeve 100 of the first driving member 10' is connected to the opening and closing cover device 20 through the cover 110; the sleeve 100 of the second driving member 10" is connected to the fixing plate 31, and the first sliding member 210 of the second driving member 10" is connected to the support frame 32. Further, in some embodiments, the sleeve 100 of the second driving member 10" is connected to the fixing plate 31 through the cover 110.
  • the first sliding member 210 of the first driving member 10' and the support frame 32, the cover 110 of the first driving member 10' and the opening and closing cover device 20, the cover 110 of the second driving member 10" and the fixing plate 31, and the first sliding member 210 of the second driving member 10" and the support frame 32 can all be connected by welding, bonding or other means.
  • the first driving member 10' and the second driving member 10" can drive the opening and closing device 20 to move in different directions, which is beneficial for the opening and closing device 20 to be opposite to the opening of the wafer transfer box 60, and is more conducive to the opening and closing device 20 opening the wafer transfer box 60.
  • both the first driving member 10' and the second driving member 10" are driving mechanisms 10 as described above, when at least two driving mechanisms 100 work simultaneously, the first sliding member 210 of each driving mechanism 100 will not directly contact the sleeve 100, which is beneficial for further optimizing the environment of the interface device and ensuring the process effect of the wafer.
  • the fixing plate 31 is provided with a second opening 31a, which is used to face the opening of the wafer transfer box 60.
  • the opening and closing cover device 20 can extend into the second opening 31a so that the opening and closing cover device 20 faces the opening of the wafer transfer box 60.
  • the interface device also includes a support plate 54, a clamping assembly 53, a third driving member 51, and a fourth driving member 52.
  • the third driving member 51 and the fourth driving member 52 are both disposed on the fixing plate 31, and the third driving member 51 is connected to the support plate 54.
  • the third driving member 51 can drive the support plate 54 to move.
  • the support plate 54 is used to support the wafer transfer box 60.
  • the fourth driving member 52 is connected to the clamping assembly 53.
  • the fourth driving member 52 can drive the clamping assembly 53 to move.
  • the clamping assembly 53 is used to cooperate with the support plate 54 to clamp the wafer transfer box 60.
  • the third driving member 51 can drive the support plate 54 to move the wafer transfer box 60 along the first direction A.
  • the fourth driving member 52 drives the clamping assembly 53 to move along the third direction C, so that the clamping assembly 53 cooperates with the support plate 54 to clamp the wafer transfer box 60, and the position of the wafer transfer box 60 is fixed.
  • the third direction C can be perpendicular to the first direction A and the second direction B.
  • the first driving member 10' is a driving mechanism 10
  • the first sliding member 210 of the first driving member 10' is connected to the support frame 32
  • the sleeve 100 of the first driving member 10' is connected to the opening and closing cover device 20
  • the interface device further includes a first guide rail 40 and a first guide member 41, the first guide rail 40 extends along a first direction A, one of the first guide rail 40 and the first guide member 41 is disposed on the support frame 32, and the other is connected to the sleeve 100 of the first driving member 10', and the first guide member 41 is guided and engaged with the first guide rail 40 so that a first gap 210a is formed between the first sliding member 210 of the first driving member 10' and the sleeve 100.
  • the first guide rail 40 is disposed on the support frame 32, and the first guide member 41 is connected to the sleeve 100 of the first drive member 10'; or, the first guide member 41 is disposed on the support frame 32, and the first guide rail 40 is connected to the sleeve 100 of the first drive member 10'.
  • the relative movement direction of the sleeve 100 of the first driving member 10' and the support frame 32 is only the first direction A, and the relative movement direction of the sleeve 100 of the first driving member 10' and the first sliding member 210 is also the first direction A. Therefore, the first sliding member 210 and the sleeve 100 will not produce relative displacement in any direction other than the first direction A. Thus, the first sliding member 210 and the sleeve 100 of the first driving member 10' can maintain the formation of the first gap 210a.
  • the interface device may not have the first guide rail 40 and the first guide member 41.
  • the interface device may use other structures to form a first gap 210a between the sleeve 100 of the first drive member 10' and the first sliding member 210.
  • the second driving member 10" is a driving mechanism 10, and the sleeve 100 of the second driving member 10" is connected to the fixed plate 31.
  • the interface device also includes a second guide rail 42 and a second guide member 43.
  • the second guide rail 42 extends along the second direction B.
  • One of the second guide rail 42 and the second guide member 43 is disposed on the fixed plate 31, and the other is connected to the support frame 32 and the first sliding member 210 of the second driving member 10" respectively.
  • the second guide member 43 guides and cooperates with the second guide rail 42 so that a first gap 210a is formed between the first sliding member 210 of the second driving member 10" and the sleeve 100.
  • the second guide rail 42 is disposed on the fixed plate 31, and the second guide member 43 is connected to the first sliding member 210 of the support frame 32 and the second driving member 10" respectively; or, the second guide member 43 is disposed on the fixed plate 31, and the second guide rail 42 is connected to the first sliding member 210 of the support frame 32 and the second driving member 10" respectively.
  • the first sliding member 210 of the second driving member 10" can only move relative to the fixed plate 31 in the second direction B. Therefore, the first sliding member 210 of the second driving member 10" and the sleeve 100 will not produce relative displacement in any direction other than the second direction B. Therefore, the first sliding member 210 of the second driving member 10" and the sleeve 100 can maintain the formation of the first gap 210a.
  • the second guide rail 42 and the fixed plate 31, the second guide member 43 and the first sliding member 210 of the second driving member 10', the first guide rail 40 and the support frame 32, and the first guide member 41 and the sleeve 100 of the first driving member 10' can all be connected by welding, bonding or other means.
  • the interface device may not provide the second guide rail 42 and the second guide member 43.
  • the interface device may use other structures to form a first gap 210a between the sleeve 100 of the second drive member 10" and the first sliding member 210.
  • the interface device further includes a movable member 44, which is slidably connected to the second guide member 43 along the first direction A, and is connected to the support frame 32. That is, the second guide member 43 is slidably connected to the support frame 32 through the movable member 44. Moreover, the movable member 44 is driven by a separate drive member to move along the first direction A, so the movable member 44 can drive the support frame 32, the first drive member 10', and the opening and closing cover device 20 to move along the first direction A.
  • the movable member 44 can drive the support frame 32, the first drive member 10', and the opening and closing cover device 20 away from the wafer transfer box 60 along the first direction A, making way for the wafer transfer device to extend into the wafer transfer box 60 and pick up the wafer, ensuring the smooth operation of the wafer transfer process.
  • the support frame 32 may include a connected support plate 32b and a support base 32a, the first sliding member 210 of the first driving member 10' is connected to the support plate 32b, the first sliding member 210 of the second driving member 10" is connected to the support base 32a, and the first guide rail 40 is disposed on the support plate 32b.
  • the interface device may not have a moving part 44, that is, the guide is directly connected to the support frame 32, and the support frame 32 can only move relative to the fixed plate 31 in the second direction B.
  • the interface device further includes a connector 45.
  • the other of the first guide rail 40 and the first guide member 41 is connected to the sleeve 100 of the first drive member 10' via the connector 45. That is, the other of the first guide rail 40 and the first guide member 41 is indirectly connected to the sleeve 100 of the first drive member 10'.
  • the connector 45 can be a connecting plate or similar structure, sufficient to connect the first guide rail 40 and the sleeve 100.
  • the connector 45 is provided with an annular protrusion 45a, which forms a space into which the first sliding member 210 of the first driving member 10' can extend.
  • the sleeve 100 of the first driving member 10' passes through the space of the annular protrusion 45a and is connected to the connector 45.
  • the first sliding member 210 slides relative to the annular protrusion 45a, thereby extending into or disengaging from the annular protrusion 45a.
  • the interface device also includes a fourth seal 45b.
  • the fourth seal 45b is disposed on the annular protrusion 45a.
  • the fourth seal 45b seals the gap between the support frame 32 and the annular protrusion 45a.
  • the fourth seal 45b seals the gap between the support plate 32b and the annular protrusion 45a.
  • the fourth seal 45b can be a sealing ring, which can be a rubber ring, or other types of seals.
  • the fourth sealing element 45b is used to seal the gap between the support frame 32 and the annular protrusion 45a, preventing particles generated during the relative movement of the first guide rail 40 and the first guide element 41 from entering between the first sliding element 210 and the sleeve 100 through the gap between the first sliding element 210 and the sleeve 100 of the first drive element 10', thereby preventing particle diffusion and contamination of the wafer, and ensuring the wafer's processing effect.
  • the connector 45 may not have the annular protrusion 45a, and the interface device may not have the fourth seal 45b. That is, the other of the first guide rail 40 and the first guide member 41 is connected to the sleeve 100 of the first drive member 10' only through the connector 45.
  • the interface device further includes a fifth seal 21.
  • the fifth seal 21 is disposed on the opening/closing cover device 20 and is located outside the sleeve 100 of the first drive member 10'.
  • the fifth seal 21 can seal the gap between the opening/closing cover device 20 and the support frame 32.
  • the fifth seal 21 can seal the gap between the opening/closing cover device 20 and the support plate 32b.
  • the fifth seal 21 can be a sealing ring, which can be a rubber ring, and the sealing ring is located on the periphery of the sleeve 100 of the first drive member 10'.
  • the fifth seal 21 can also be a seal with other structures.
  • the fifth sealing element 21 is used to seal the gap between the opening and closing cover device 20 and the support frame 32. This prevents particles generated by the relative movement of the first guide rail 40 and the first guide element 41 from entering the space between the first sliding element 210 and the sleeve 100 through the gap between the opening and closing cover device 20 and the support frame 32 during the process of the opening and closing cover device 20 approaching the support frame 32. This avoids particle diffusion and thus prevents contamination of the wafer, ensuring the wafer's processing performance.
  • the interface device may not have a fifth seal 21, and the opening and closing cover device 20 may directly contact the support frame 32 during the operation of the first drive member 10'.
  • the second drive member 10" is a drive mechanism 10, and the number of the second drive member 10" is one.
  • each second driving member 10 is a driving mechanism 10 as described above, no particles are generated during operation, avoiding wafer contamination, further optimizing the environment, and improving wafer processing performance.
  • this application embodiment also provides a semiconductor process apparatus, which includes the aforementioned interface device.
  • the interface device of the semiconductor process apparatus relying on the drive mechanism 10, avoids the generation of particles that contaminate the wafer, thus optimizing the environment and improving the wafer's processing performance.

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

本公开提供一种接口装置及其驱动机构、半导体工艺设备，属于半导体设备技术领域。接口装置包括用于开启和关闭晶圆传送盒的开合盖装置及驱动机构，驱动机构包括套筒、第一滑动件和第二滑动件，第一滑动件套设在套筒的外部，且第一滑动件与套筒的外壁面之间设有第一间隙，第二滑动件可滑动地设置于套筒内，第一滑动件或套筒用于连接开合盖装置；第一滑动件设有第一磁性件，第二滑动件设有第二磁性件，第一磁性件与第二磁性件磁性配合，在第二滑动件相对于套筒沿套筒的轴向滑动的情况下，第二滑动件通过第一磁性件和第二磁性件带动第一滑动件相对于套筒滑动。半导体工艺设备包括上述的接口装置。如此，从根源上避免产生颗粒，避免污染晶圆。

Description

接口装置及其驱动机构、半导体工艺设备 技术领域
本申请属于半导体设备技术领域，具体涉及一种接口装置及其驱动机构、半导体工艺设备。
背景技术
在半导体技术领域，FIMS(Front-opening Interface Mechanical Standard，前开式接口机械单元)模块作为一种接口装置，是半导体工艺设备的重要组成部分。目前多使用FOUP(Front Opening Unified Pod，前开式晶圆传送盒)作为晶圆传送、暂存的容器，在放入和取出晶圆的过程中，需要使用FIMS模块固定、吹扫、打开和关闭晶圆传送盒，保证晶圆传送盒开门前后与外界的密封，使晶圆可以被清洁地在晶圆承载区和晶圆传送盒之间传输。
相关技术中，接口装置包括驱动机构，利用驱动机构驱动能够打开和关闭晶圆传送盒的部件移动，但是，驱动机构通常为气动驱动件，其自身部件容易在相对移动的过程中产生接触摩擦，进而产生颗粒，在真空环境中颗粒的扩散会污染晶圆，进而影响晶圆的工艺效果。
发明内容
本申请实施例的目的是提供一种接口装置及其驱动机构、半导体工艺设备，能够解决相关技术中接口装置的驱动机构工作时容易产生颗粒进而污染晶圆的问题。
第一方面，本申请实施例提供一种应用于接口装置的驱动机构，所述接口装置包括用于开启和关闭晶圆传送盒的开合盖装置，所述驱动机构用于驱动所述开合盖装置进行直线运动，所述驱动机构包括套筒、第一滑动件和第二滑动件，所述第一滑动件套设在所述套筒的外部，且所述第一滑动件与所述套筒的外壁面之间设有第一间隙，所述第二滑动件可滑动地设置于所述套筒内，所述第一滑动件或所述套筒用于连接所述开合盖装置；
所述第一滑动件设有第一磁性件，所述第二滑动件设有第二磁性件，所述第一磁性件与所述第二磁性件磁性配合，在所述第二滑动件相对于所述套筒沿所述套筒的轴向滑动的情况下，所述第二滑动件通过所述第一磁性件和所述第二磁性件带动所述第一滑动件相对于所述套筒同步滑动。
第二方面，本申请实施例还提供一种接口装置，包括开合盖装置以及上述的驱动机构，所述开合盖装置用于开启和关闭晶圆传送盒，所述驱动机构的所述第一滑动件和所述套筒中的一者与所述开合盖装置相连。
第三方面，本申请实施例还提供一种半导体工艺设备，包括上述的接口装置。
在本申请实施例中，位于套筒外的第一滑动件与套筒之间存在第一间隙，那么，在驱动机构工作的过程中，即第一滑动件相对于套筒滑动的过程中，第一滑动件与套筒之间不会直接接触，避免二者之间直接接触产生摩擦而产生颗粒，进而避免颗粒扩散从而污染晶圆，保证晶圆的工艺效果。
附图说明
图1是本申请实施例公开的应用于接口装置的驱动机构的结构示意图；
图2是本申请实施例公开的套筒外部的结构示意图；
图3是本申请实施例公开的第二滑动件的结构示意图；
图4是本申请实施例公开的接口装置的侧视图；
图5是图4中D-D处的剖视图；
图6是图4中E处的放大图；
图7是图4中F处的放大图。
附图标记说明：
10-驱动机构、10＇-第一驱动件、10＂-第二驱动件、
100-套筒、110-封盖、110a-第一开口、111-端盖、112-接口块、
210-第一滑动件、210a-第一间隙、220-第一磁性件、220a-第二间隙、230-
第一隔套、230a-第三间隙、
241-第一挡块、242-第二挡块、240a-第四间隙、
251-第一挡圈、252-第二挡圈、250a-第五间隙、
300-第二滑动件、310-第二磁性件、320-第二隔套、331-第一活塞、332-
第二活塞、340-耐磨环、
400-筒体、400a-通道、
510-第一密封件、520-第二密封件、530-第三密封件、
a-气流通道、
20-开合盖装置、21-第五密封件、
31-固定板、31a-第二开口、32-支撑架、32a-支撑座、32b-支持板、
40-第一导轨、41-第一导向件、42-第二导轨、43-第二导向件、44-移动
件、45-连接件、45a-环状凸起、45b-第四密封件、
51-第三驱动件、52-第四驱动件、53-夹紧组件、54-支撑板、
60-晶圆传送盒、
A-第一方向、B-第二方向、C-第三方向。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚地描述，显然，所描述的实施例是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员获得的所有其他实施例，都属于本申请保护的范围。
本申请的说明书和权利要求书中的术语“第一”、“第二”等是用于区别类似的对象，而不用于描述特定的顺序或先后次序。应该理解这样使用的数据在适当情况下可以互换，以便本申请的实施例能够以除了在这里图示或描述的那些以外的顺序实施，且“第一”、“第二”等所区分的对象通常为一类，并不限定对象的个数，例如第一对象可以是一个，也可以是多个。此外，说明书以及权利要求中“和/或”表示所连接对象的至少其中之一，字符“/”，一般表示前后关联对象是一种“或”的关系。
相关技术中，接口装置包括驱动机构，利用驱动机构驱动能够打开和关闭晶圆传送盒的部件移动，具体地，驱动机构通常包括套筒、第一滑动件和第二滑动件，其中，第一滑动件位于套筒的外部，第二滑动件位于套筒的内部，第一滑动件和第二滑动件均可滑动设置，且第一滑动件或者套筒与能够打开和关闭晶圆传送盒的部件相连，当对套筒内通入气体时，气体驱动第二滑动件相对于套筒移动，同时，第二滑动件依靠磁性配合的磁组带动第一滑动件相对于套筒移动。
但是，套筒与第一滑动件之间容易接触产生摩擦，进而产生颗粒，在真空环境中颗粒的扩散会污染晶圆，进而影响晶圆的工艺效果。
本申请实施例能够解决相关技术中接口装置的驱动机构工作时容易产生颗粒进而污染晶圆的问题。下面结合附图，通过具体的实施例及其应用场景对本申请实施例提供的接口装置及其驱动机构、半导体工艺设备进行详细地说明。
请参考图1-图7，本申请实施例公开的驱动机构10应用于接口装置，接口装置可以为FIMS模块，具体地，接口装置包括用于开启和关闭晶圆传送盒60的开合盖装置20，驱动机构10与开合盖装置20相连，驱动机构10用于驱动开合盖装置20进行直线运动，以使开合盖装置20靠近晶圆传送盒60，进而方便开合盖装置20开启晶圆传送盒60。
参考图1所示，驱动机构10包括套筒100、第一滑动件210和第二滑动件300，套筒100为第一滑动件210和第二滑动件300提供安装基础，第一滑动件210套设在套筒100的外部，第二滑动件300可滑动地设置于套筒100内，第一滑动件210和第二滑动件300均可沿套筒100的轴向移动。而且，第一滑动件210或套筒100用于连接开合盖装置20，具体地，第二滑动件300受气体驱动而移动时，能够带动第一滑动件210一起相对于套筒100移动，当套筒100固定设置时，第一滑动件210与开合盖装置20相连；或者，当第一滑动件210固定设置时，套筒100与开合盖装置20相连。
在一些实施例中，第一滑动件210和套筒100中的一者可以与开合盖装置20直接相连，进一步地，在一些实施例中，第一滑动件210和套筒100中的一者与开合盖装置20之间可以通过焊接、粘接等方式固定连接；或者，在另一些实施例中，第一滑动件210和套筒100中的一者可以与开合盖装置20间接相连。
第一滑动件210与套筒100的外壁面之间设有第一间隙210a，在一些实施例中，第一间隙210a可以大于或等于0.5mm，即第一间隙210a不小于0.5mm，避免第一间隙210a过小导致第一滑动件210与套筒100的外壁面接触，同时，第一间隙210a不可过大，避免影响第一磁性件220和第二磁性件310之间的磁吸作用力。在一些实施例中，在套筒100的轴向上，可以是第一滑动件210的局部区域与套筒100的外壁面之间设有第一间隙210a，也可以是第一滑动件210的各个位置与套筒100的外壁面之间设有第一间隙210a。总之，第一滑动件210与套筒100完全隔离开，避免第一滑动件210滑动过程中与套筒100接触。
需要说明的是，第一滑动件210和套筒100分别连接于接口装置的不同的构件，而接口装置的这两个构件使得第一滑动件210与套筒100之间自然形成第一间隙210a，因此，套筒100的外部无需再设置其他结构来支撑第一滑动件210以形成第一间隙210a。在一些实施例中，接口装置的这两个构件分别为下文中的连接件45和支持板32b。
具体地，第一滑动件210设有第一磁性件220，第二滑动件300设有第二磁性件310，第一磁性件220与第二磁性件310磁性配合。在第二滑动件300相对于套筒100沿套筒100的轴向滑动的情况下，第二滑动件300通过第一磁性件220和第二磁性件310带动第一滑动件210相对于套筒100同步滑动。进一步地，在一些实施例中，第一磁性件220的磁极和第二磁性件310的磁极相异。根据异极相吸的原则，第一磁性件220与第二磁性件310之间产生相吸的磁性作用力，故在第二磁性件310随第二滑动件300运动过程中，第二磁性件310吸引第一磁性件220，进而第一磁性件220带动第一滑动件210相对于套筒100同步滑动。
在本申请实施例中，位于套筒100外的第一滑动件210与套筒100之间存在第一间隙210a，那么，在驱动机构10工作的过程中，即第一滑动件210相对于套筒100滑动的过程中，第一滑动件210与套筒100之间不会直接接触，避免二者之间直接接触产生摩擦而产生颗粒，进而避免颗粒扩散从而污染晶圆，保证晶圆的工艺效果。
在一种实施例中，第一滑动件210为滑筒，第一磁性件220设置于滑筒内，且第一磁性件220与套筒100的外壁面接触，也就是说，第一磁性件220凸出于滑筒的内壁面。
在另一种实施例中，第一磁性件220与套筒100的外壁面之间设有第二间隙220a，在一些实施例中，第二间隙220a也可以大于或等于0.5mm，即第二间隙220a不小于0.5mm，避免第二间隙220a过小导致第一磁性件220与套筒100的外壁面接触，同时，第二间隙220a不可过大，避免影响第一磁性件220和第二磁性件310之间的磁吸作用力。在一些实施例中，滑筒的内壁面可以设置第一开槽，第一磁性件220设置于第一开槽内，以保证第一磁性件220与套筒100之间形成第二间隙220a。
如此设置，在驱动机构10工作的过程中，第一磁性件220也不会与套筒100直接接触，避免二者之间产生摩擦而生成颗粒，优化晶圆所处的环境，进一步保证晶圆的洁净程度和工艺效果。
在一种实施例中，第一磁性件220和第二磁性件310的数量均为一个。
在另一种实施例中，第一磁性件220和第二磁性件310的数量均为多个，第一磁性件220与第二磁性件310一一对应磁性配合，如此，通过设置多组第一磁性件220和第二磁性件310，有利于增大第一滑动件210和第二滑动件300之间的磁性作用力，更有利于第二滑动件300滑动时顺利带动第一滑动件210滑动，提高二者滑动的同步性。
在一些实施例中，驱动机构10还包括第一隔套230，第一隔套230用于隔离开相邻的两个第一磁性件220，第一隔套230设置于滑筒的内壁面，各第一磁性件220间隔设置，且第一隔套230隔离开相邻的两个第一磁性件220。进一步地，在一些实施例中，第一隔套230可以采用橡胶等材质。如此，利用第一隔套230将相邻的两个第一磁性件220隔离开，避免相邻的两个第一磁性件220距离较近导致磁性作用力相互影响。
进一步地，在一些实施例中，第一隔套230与套筒100的外壁面之间设有第三间隙230a，例如，第三间隙230a也可以大于或等于0.5mm，即第三间隙230a不小于0.5mm，避免第三间隙230a过小导致第一隔套230与套筒100的外壁面接触，同时，第三间隙230a不可过大，避免影响第一磁性件220和第二磁性件310之间的磁吸作用力。在一些实施例中，滑筒的内壁面可以设置第一开槽，第一隔套230和多个第一磁性件220均设置于第一开槽内，以使第一隔套230与套筒100之间形成第三间隙230a。
如此设置，在驱动机构10工作的过程中，第一隔套230也不会与套筒100直接接触，避免二者之间产生摩擦而生成颗粒，优化晶圆所处的环境，进一步保证晶圆的洁净程度和工艺效果。
当然，在其他实施例中，第一隔套230可以凸出于滑筒的内壁面，第一隔套230与套筒100的外壁面可以相接触。
在一些实施例中，参考图1和图2所示，驱动机构10还包括第一挡块241和第二挡块242，沿滑筒的轴向，第一挡块241和第二挡块242分别位于第一磁性件220的两侧，在一些实施例中，第一挡块241和第二挡块242均可以为环状结构，第一磁性件220的数量为多个，各第一磁性件220沿滑筒的轴向间隔设置，第一挡块241和第二挡块242分别位于多个第一磁性件220形成的磁组的两侧。而且，第一挡块241和第二挡块242分别与滑筒相连，第一挡块241和第二挡块242相对于滑筒固定，从而将第一磁性件220限位于第一挡块241和第二挡块242之间。在一些实施例中，第一挡块241和第二挡块242可以分别与滑筒的内壁面通过焊接、粘接等方式直接相连，也可以通过其他部件与滑筒间接相连。
如图2所示，第一挡块241和第二挡块242分别与套筒100的外壁面之间设有第四间隙240a。在一些实施例中，第四间隙240a也可以大于或等于0.5mm，即第四间隙240a不小于0.5mm，避免第四间隙240a过小导致第一挡块241和第二挡块242与套筒100的外壁面接触，同时，第四间隙240a不可过大，避免影响第一磁性件220和第二磁性件310之间的磁吸作用力。
采用本实施例，在驱动机构10工作的过程中，第一挡块241和第二挡块242不会与套筒100直接接触，避免二者之间产生摩擦而生成颗粒，优化晶圆所处的环境，进一步保证晶圆的洁净程度和工艺效果。
在进一步的实施例中，参考图1和图2所示，驱动机构10还包括第一挡圈251和第二挡圈252，沿滑筒的轴向，第一挡圈251和第二挡圈252分别位于第一挡块241和第二挡块242相互背离的两侧，从而将第一挡块241和第二挡块242限位于第一挡圈251和第二挡圈252之间。而且，第一挡圈251和第二挡圈252分别与滑筒相连。在一些实施例中，第一挡圈251和第二挡圈252分别与滑筒直接相连，进一步地，在一些实施例中，滑筒的内壁面设有第一环形开槽和第二环形开槽，第一挡圈251伸入第一环形开槽内，且凸出于滑筒的内壁面，第二挡圈252伸入第二环形开槽内，且凸出于滑筒的内壁面。
如图2所示，第一挡圈251和第二挡圈252分别与套筒100的外壁面之间设有第五间隙250a。在一些实施例中，第五间隙250a也可以大于或等于0.5mm，即第五间隙250a不小于0.5mm，避免第五间隙250a过小导致第一挡圈251和第二挡圈252与套筒100的外壁面接触，同时，第五间隙250a不可过大，避免影响第一磁性件220和第二磁性件310之间的磁吸作用力。在本实施例中，第五间隙250a大于第四间隙240a。
采用本实施例，在驱动机构10工作的过程中，第一挡圈251和第二挡圈252不会与套筒100直接接触，避免二者之间产生摩擦而生成颗粒，优化晶圆所处的环境，进一步保证晶圆的洁净程度和工艺效果。
在一种实施例中，套筒100的端口处于开放状态，第二滑动件300的一部分可伸出至套筒100之外。
在另一种实施例中，如图1所示，驱动机构10还包括封盖110，封盖110与套筒100的端部相连，以封闭套筒100的端口，封盖110与套筒100保持相对固定，如此，由于封盖110封闭套筒100的端口，故第二滑动件300仅在套筒100的内部空间内滑动。而且，封盖110设有气流通道a，气流通道a连通套筒100的内部空间，那么，外部气体通过气流通道a流入套筒100内，气体作为动力来源，可推动第二滑动件300相对于套筒100滑动，在一些实施例中，套筒100的两端均设有封盖110，两个封盖110均设有气流通道a，气体由不同的气流通道a流入套筒100内，能够驱动第二滑动件300相对于套筒100沿不同的方向滑动。封盖110或第一滑动件210用于连接开合盖装置20。
进一步地，在一些实施例中，封盖110包括端盖111和接口块112，端盖111封闭套筒100的端口，接口块112设置于端盖111。
采用本实施例，依靠封盖110封闭套筒100的端口，第二滑动件300与套筒100的内壁面相对滑动的过程中，二者摩擦产生的颗粒不会排出至套筒100的外部，进而避免颗粒扩散至晶圆的表面，更有利于优化晶圆所处环境，保证晶圆的工艺效果。
在一些实施例中，参考图1所示，驱动机构10还包括筒体400，筒体400沿套筒100的轴向依次贯穿封盖110和第二滑动件300，筒体400形成用于供气体或线路通入的通道400a，且封盖110设有与通道400a连通的第一开口110a。开合盖装置20通常包括开锁部件，开锁部件需要通过线路连接外部的供电装置，如此，线路可直接通过第一开口110a并贯穿筒体400，避免线路直接下垂并接触其他部件而产生颗粒，进而避免污染晶圆。而且，利用筒体400贯穿第二滑动件300来自然形成形状规整的通道400a，无需对第二滑动件300单独开设通道400a，有利于降低加工难度。在一些实施例中，第一开口110a开设于接口块112，筒体400依次贯穿第一开口110a、端盖111和第二滑动件300，筒体400的材质可以为不锈钢，当然，筒体400也可以采用其他材质。
当然，在其他实施例中，驱动机构10可以不设置筒体400，第二滑动件300的内部为实心结构，即第二滑动件300不设置通道400a，开合盖装置20连接的线路直接下垂设置。
在一些实施例中，参考图1所示，驱动机构10还包括第一密封件510、第二密封件520和第三密封件530中的至少一者，第一密封件510设置于第二滑动件300和筒体400之间；第二密封件520设置于封盖110和筒体400之间，进一步地，在一些实施例中，第二密封件520设置于端盖111和筒体400之间；第三密封件530设置于第二滑动件300的外周面。
在一种实施例中，第二滑动件300包括活塞，第三密封件530设置于活塞的外周面。也就是说，驱动机构10可以仅设置第一密封件510、第二密封件520和第三密封件530中的一者，也可以仅设置第一密封件510、第二密封件520和第三密封件530中的两者，也可以同时第一密封件510、第二密封件520和第三密封件530。其中，第一密封件510、第二密封件520和第三密封件530可以为密封圈，密封圈可以为橡胶圈，也可以为其他起到密封效果的部件。
采用本实施例，利用第一密封件510密封第二滑动件300和筒体400之间的间隙，以及利用第二密封件520密封封盖110与筒体400之间的间隙，有利于提升筒体400的密封性能。同时，利用第三密封件530密封第二滑动件300和套筒100之间的间隙，有利于提升套筒100的密封性能。
当然，在其他实施例中，驱动机构10可以不设置第一密封件510、第二密封件520和第三密封件530，驱动机构10可以采用其他方式进行密封。
在本申请的方案中，第二滑动件300包括活塞和第二隔套320，活塞的外周面可以设置第二开槽，各第二磁性件310间隔设置于第二开槽内，第二隔套320位于相邻的两个第二磁性件310之间，以隔离开相邻的两个第二磁性件310。在一些实施例中，任意相邻的两个第二磁性件310分别通过第二隔套320隔离开。
在另一种实施例中，参考图1和图3所示，第二滑动件300包括第一活塞331、第二活塞332和第二隔套320，第二磁性件310的数量为至少两个，各第二磁性件310间隔设置于第一活塞331和第二活塞332之间。在本实施例中，筒体400依次贯穿第一活塞331、第二磁性件310和第二隔套320的组合结构、以及第二活塞332。在一些实施例中，第一活塞331与第二磁性件310之间、第二磁性件310与相邻的第二隔套320之间、第二磁性件310与第二活塞332之间分别可通过焊接、粘接等方式相连。
如此，利用第一活塞331和第二活塞332共同夹持各第二磁性件310和各第二隔套320，并对各第二磁性件310和各第二隔套320进行限位，无需对活塞单独开设安装第二磁性件310和第二隔套320的结构，有利于简化第二滑动件300的结构。
在一些实施例中，第一活塞331和第二活塞332的外周面均设有第三密封件530，且第三密封件530与第二磁性件310相邻设置。
在一些实施例中，驱动机构10还包括耐磨环340，耐磨环340套设于活塞330的外部。进一步地，在一些实施例中，第一活塞331和第二活塞332的外部均套设有耐磨环340，另外，在一些实施例中，第一活塞331和第二活塞332的外周面均设有用于安装耐磨环340的第三环形开槽。
采用本实施例，活塞通过耐磨环340与套筒100的内壁面滑动配合，避免活塞与套筒100长时间直接接触导致活塞严重磨损，延长活塞的使用寿命。
基于本申请公开的驱动机构10，本申请实施例还提供一种接口装置，参考图4-图7所示，接口装置包括开合盖装置20以及上述的驱动机构10，图4仅示意性地示出了驱动机构10的整体结构，并未示出套筒100内部诸如第二滑动件300等的结构。开合盖装置20用于开启和关闭晶圆传送盒60，驱动机构10的第一滑动件210和套筒100中的一者与开合盖装置20相连。如此，在驱动机构10的第一滑动件210和套筒100中的一者被固定，且第二滑动件300和套筒100在流入套筒100内的外部气体的驱动作用下相对滑动时，第一滑动件210和套筒100中的另一者带动开合盖装置20相对于第一滑动件210和套筒100中被固定的一者移动，以使开合盖装置20靠近晶圆传送盒60，进而方便开合盖装置20开启晶圆传送盒60。具体来说，在一个示例中，在驱动机构10的第一滑动件210被固定，套筒100与开合盖装置20相连，在第一磁性件220与第二磁性件310之间产生相吸的磁性作用力下，第二滑动件300被固定，在流入套筒100内的外部气体的驱动作用下，套筒100相对于第二滑动件300滑动，以使开合盖装置20靠近晶圆传送盒60，进而方便开合盖装置20开启晶圆传送盒60。在另一个示例中，在驱动机构10的套筒100被固定，第一滑动件210与开合盖装置20相连，且第二滑动件300在流入套筒100内的外部气体的驱动作用下相对于套筒100滑动时，带动第一滑动件210相对于套筒100移动，以使开合盖装置20靠近晶圆传送盒60，进而方便开合盖装置20开启晶圆传送盒60。
采用本实施例，接口装置的驱动机构10的第一滑动件210与套筒100之间存在第一间隙210a，那么，在驱动机构10工作的过程中，即第一滑动件210相对于套筒100滑动的过程中，第一滑动件210与套筒100之间不会直接接触，避免二者之间直接接触产生摩擦而产生颗粒，进而避免颗粒扩散从而污染晶圆，有利于优化接口装置的环境，保证晶圆的工艺效果。
在一些实施例中，接口装置包括固定板31和驱动机构10，驱动机构10设置于固定板31，且驱动机构10与开合盖装置20相连，驱动机构10可驱动开合盖装置20相对于固定板31沿第一方向A移动。具体地，驱动机构10的第一滑动件210可以与其他构件(例如下文中的支撑架32(即支持板32b))相连，驱动机构10的套筒100可以与开合盖装置20相连，在一些实施例中，驱动机构10的套筒100通过封盖110与开合盖装置20相连。进一步地，在一些实施例中，第一滑动件210与支撑架32(即支撑座32a或支持板32b)之间、套筒100与封盖110之间均可以通过焊接、粘接等方式相连。
在另一种实施例中，参考图4和图5所示，接口装置还包括支撑架32、第一驱动件10＇和第二驱动件10＂，第一驱动件10＇设置于支撑架32，第一驱动件10＇与开合盖装置20相连，第一驱动件10＇可驱动开合盖装置20相对于支撑架32沿第一方向A移动。第二驱动件10＂设置于固定板31，且第二驱动件10＂与支撑架32相连，第二驱动件10＂可驱动支撑架32带动第一驱动件10＇和开合盖装置20相对于固定板31沿第二方向B移动，第一方向A与第二方向B相交。在一些实施例中，第一方向A与第二方向B相交，第一方向A与开合盖装置20所在的平面相垂直，第二方向B与开合盖装置20所在的平面相平行。
第一驱动件10＇和第二驱动件10＂中的至少一者为驱动机构10。具体地，可以仅第一驱动件10＇或仅第二驱动件10＂采用上文中的驱动机构10；或者，也可以第一驱动件10＇和第二驱动件10＂均采用上文中的驱动机构10。在一些实施例中，第一驱动件10＇的第一滑动件210可以与支撑架32相连，第一驱动件10＇的套筒100与开合盖装置20相连，进一步地，在一些实施例中，第一驱动件10＇的套筒100通过封盖110与开合盖装置20相连；第二驱动件10＂的套筒100与固定板31相连，第二驱动件10＂的第一滑动件210与支撑架32相连，进一步地，在一些实施例中，第二驱动件10＂的套筒100通过封盖110与固定板31相连。
其中，第一驱动件10＇的第一滑动件210与支撑架32之间、第一驱动件10＇的封盖110与开合盖装置20之间、第二驱动件10＂的封盖110与固定板31之间、以及第二驱动件10＂的第一滑动件210与支撑架32之间均可以通过焊接、粘接等方式相连。
采用本实施例，利用第一驱动件10＇和第二驱动件10＂分别可驱动开合盖装置20沿不同的方向移动，有利于开合盖装置20与晶圆传送盒60的开启口相对，更有利于开合盖装置20开启晶圆传送盒60。
在第一驱动件10＇和第二驱动件10＂均为上文中的驱动机构10的实施例中，至少两个驱动机构100同时工作时，各个驱动机构100的第一滑动件210与套筒100之间均不会直接接触，有利于进一步优化接口装置的环境，保证晶圆的工艺效果。
在一些实施例中，如图4所示，固定板31设有第二开口31a，第二开口31a用于与晶圆传送盒60的开启口相对，开合盖装置20可伸入第二开口31a处，以使开合盖装置20与晶圆传送盒60的开启口相对。而且，接口装置还包括支撑板54、夹紧组件53、第三驱动件51和第四驱动件52，其中，第三驱动件51和第四驱动件52均设置于固定板31，且第三驱动件51与支撑板54相连，第三驱动件51可驱动支撑板54移动，支撑板54用于承载晶圆传送盒60，第四驱动件52与夹紧组件53相连，第四驱动件52可驱动夹紧组件53移动，夹紧组件53用于与支撑板54配合夹紧晶圆传送盒60。
具体地，第三驱动件51可驱动支撑板54带动晶圆传送盒60沿第一方向A移动，当晶圆传送盒60的开启口与第二开口31a相对时，第四驱动件52驱动夹紧组件53沿第三方向C移动，以使夹紧组件53与支撑板54配合夹紧晶圆传送盒60，晶圆传送盒60的位置被固定。其中，第三方向C可以与第一方向A和第二方向B相垂直。
在一些实施例中，参考图4和图5所示，第一驱动件10＇为驱动机构10，第一驱动件10＇的第一滑动件210与支撑架32相连，第一驱动件10＇的套筒100与开合盖装置20相连；接口装置还包括第一导轨40和第一导向件41，第一导轨40沿第一方向A延伸，第一导轨40和第一导向件41中的一者设置于支撑架32，另一者与第一驱动件10＇的套筒100相连，且第一导向件41与第一导轨40导向配合，以使第一驱动件10＇的第一滑动件210和套筒100之间形成第一间隙210a。
具体地，第一导轨40设置于支撑架32，第一导向件41与第一驱动件10＇的套筒100相连；或者，第一导向件41设置于支撑架32，第一导轨40与第一驱动件10＇的套筒100相连。
如此，依靠相配合的第一导轨40与第一导向件41，使得第一驱动件10＇的套筒100与支撑架32的相对运动方向仅为第一方向A，第一驱动件10＇的套筒100与第一滑动件210的相对运动方向也即第一方向A，故第一滑动件210与套筒100不会产生除第一方向A以外的其他方向的相对位移，故第一驱动件10＇的第一滑动件210和套筒100之间能够维持形成第一间隙210a。
当然，在其他实施例中，接口装置可以不设置第一导轨40与第一导向件41，接口装置利用其他结构使第一驱动件10＇的套筒100与第一滑动件210之间形成第一间隙210a。
在一些实施例中，第二驱动件10＂为驱动机构10，第二驱动件10＂的套筒100与固定板31相连，接口装置还包括第二导轨42和第二导向件43，第二导轨42沿第二方向B延伸，第二导轨42和第二导向件43中的一者设置于固定板31，另一者分别与支撑架32和第二驱动件10＂的第一滑动件210相连，且第二导向件43与第二导轨42导向配合，以使第二驱动件10＂的第一滑动件210和套筒100之间形成第一间隙210a。
具体地，第二导轨42设置于固定板31，第二导向件43分别与支撑架32和第二驱动件10＂的第一滑动件210相连；或者，第二导向件43设置于固定板31，第二导轨42分别与支撑架32和第二驱动件10＂的第一滑动件210相连。
如此，依靠相配合的第二导轨42与第二导向件43，使得第二驱动件10＂的第一滑动件210仅能相对于固定板31沿第二方向B运动，故第二驱动件10＂的第一滑动件210与套筒100不会产生除第二方向B以外的其他方向的相对位移，故第二驱动件10＂的第一滑动件210和套筒100之间能够维持形成第一间隙210a。
在一些实施例中，第二导轨42与固定板31之间、第二导向件43与第二驱动件10＂的第一滑动件210之间、第一导轨40与支撑架32之间、以及第一导向件41与第一驱动件10＇的套筒100之间均可以通过焊接、粘接等方式相连。
当然，在其他实施例中，接口装置可以不设置第二导轨42与第二导向件43，接口装置利用其他结构使第二驱动件10＂的套筒100与第一滑动件210之间形成第一间隙210a。
在进一步的实施例中，接口装置还包括移动件44，移动件44与第二导向件43沿第一方向A滑动连接，且移动件44与支撑架32相连，也就是说，第二导向件43通过移动件44与支撑架32滑动连接。而且，移动件44由单独的驱动件驱动而沿第一方向A移动，故移动件44可带动支撑架32、第一驱动件10＇和开合盖装置20沿第一方向A移动。如此设置，在第一驱动件10＇驱动开合盖装置20开启晶圆传送盒60后，移动件44可带动支撑架32、第一驱动件10＇和开合盖装置20沿第一方向A远离晶圆传送盒60，为晶圆传送装置伸入晶圆传送盒60并拿取晶圆避让出空间，保证晶圆传送过程的顺利进行。
在一些实施例中，如图4所示，支撑架32可以包括相连的支持板32b和支撑座32a，第一驱动件10＇的第一滑动件210与支持板32b相连，第二驱动件10＂的第一滑动件210与支撑座32a相连，且第一导轨40设置于支持板32b。
当然，在其他实施例中，接口装置可以不设置移动件44，即导向件直接与支撑架32相连，支撑架32仅能相对于固定板31沿第二方向B移动。
在一些实施例中，参考图4和图6所示，接口装置还包括连接件45，第一导轨40和第一导向件41中的另一者通过连接件45与第一驱动件10＇的套筒100相连，即，第一导轨40和第一导向件41中的另一者与第一驱动件10＇的套筒100间接连接。在一些实施例中，连接件45可以为连接板等结构，能够用来连接第一导轨40和套筒100即可。
在进一步的实施例中，连接件45设有环状凸起45a，环状凸起45a用于形成可供第一驱动件10＇的第一滑动件210伸入的空间，具体地，第一驱动件10＇的套筒100贯穿环状凸起45a的空间并与连接件45相连。在第一驱动件10＇工作过程中，第一滑动件210相对于环状凸起45a滑动，进而伸入环状凸起45a内或者脱离环状凸起45a。
接口装置还包括第四密封件45b，参考图6所示，第四密封件45b设置于环状凸起45a，在第一驱动件10＇的第一滑动件210伸入环状凸起45a内的情况下，支撑架32与环状凸起45a相互靠近，第四密封件45b密封支撑架32与环状凸起45a之间的间隙，在一些实施例中，第四密封件45b密封支持板32b与环状凸起45a之间的间隙。其中，第四密封件45b可以为密封圈，密封圈可以为橡胶圈，当然也可以采用其他结构的密封件。
采用本实施例，利用第四密封件45b对支撑架32与环状凸起45a之间的间隙进行密封，避免第一导轨40和第一导向件41相对运动过程中产生的颗粒通过第一驱动件10＇的第一滑动件210和套筒100之间的间隙进入第一滑动件210和套筒100之间，进而避免颗粒扩散从而污染晶圆，保证晶圆的工艺效果。
当然，在其他实施例中，连接件45可以不设置环状凸起45a，接口装置可以不设置第四密封件45b，即第一导轨40和第一导向件41中的另一者仅通过连接件45与第一驱动件10＇的套筒100相连。
在一些实施例中，参考图4和图7所示，接口装置还包括第五密封件21，第五密封件21设置于开合盖装置20，且第五密封件21位于第一驱动件10＇的套筒100的外部，第五密封件21可密封开合盖装置20与支撑架32之间的间隙，在一些实施例中，第五密封件21可密封开合盖装置20与支持板32b之间的间隙。在第一驱动件10＇工作的过程中，开合盖装置20相对于支撑架32运动，当第一驱动件10＇工作至开合盖装置20与支撑架32接触的位置时，第五密封件21密封开合盖装置20与支撑架32之间的间隙。
在一些实施例中，第五密封件21可以为密封圈，密封圈可以为橡胶圈，密封圈位于第一驱动件10＇的套筒100的外围，当然，第五密封件21也可以采用其他结构的密封件。
采用本实施例，利用第五密封件21对开合盖装置20和支撑架32之间的间隙进行密封，避免在开合盖装置20靠近支撑架32的过程中，第一导轨40和第一导向件41相对运动产生的颗粒通过开合盖装置20和支撑架32之间的间隙进入第一滑动件210和套筒100之间，进而避免颗粒扩散从而污染晶圆，保证晶圆的工艺效果。
当然，在其他实施例中，接口装置可以不设置第五密封件21，在第一驱动件10＇工作的过程中，开合盖装置20直接与支撑架32接触。
在一些实施例中，第二驱动件10＂为驱动机构10，且第二驱动件10＂的数量为一个。
在另一种实施例中，如图5所示，第二驱动件10＂的数量为至少两个，各第二驱动件10＂间隔分布于支撑架32。进一步地，各第二驱动件10＂间隔分布于支持板32b。采用本实施例，利用至少两个第二驱动件10＂同时驱动开合盖装置20移动，有利于增大驱动作用力，更有利于移动开合盖装置20，而且，各第二驱动件10＂均为上文中的驱动机构10，那么，各第二驱动件10＂工作时均不会产生颗粒，避免污染晶圆，进一步优化环境，有利于提升晶圆的工艺效果。
基于本申请公开的接口装置，本申请实施例还提供一种半导体工艺设备，半导体工艺设备包括上述的接口装置。采用本实施例，该半导体工艺设备的接口装置依靠驱动机构10，避免产生颗粒而污染晶圆，环境得到优化，有利于提升晶圆的工艺效果。
上面结合附图对本申请的实施例进行了描述，但是本申请并不局限于上述的具体实施方式，上述的具体实施方式仅仅是示意性的，而不是限制性的，本领域的普通技术人员在本申请的启示下，在不脱离本申请宗旨和权利要求所保护的范围情况下，还可做出很多形式，均属于本申请的保护之内。

Claims (14)

  1. 一种应用于接口装置的驱动机构，所述接口装置包括用于开启和关闭晶圆传送盒的开合盖装置，所述驱动机构用于驱动所述开合盖装置进行直线运动，其特征在于，所述驱动机构包括套筒、第一滑动件和第二滑动件，所述第一滑动件套设在所述套筒的外部，且所述第一滑动件与所述套筒的外壁面之间设有第一间隙，所述第二滑动件可滑动地设置于所述套筒内，所述第一滑动件或所述套筒用于连接所述开合盖装置；
    所述第一滑动件设有第一磁性件，所述第二滑动件设有第二磁性件，所述第一磁性件与所述第二磁性件磁性配合，在所述第二滑动件相对于所述套筒沿所述套筒的轴向滑动的情况下，所述第二滑动件通过所述第一磁性件和所述第二磁性件带动所述第一滑动件相对于所述套筒同步滑动。
  2. 根据权利要求1所述的驱动机构，其特征在于，所述第一滑动件为滑筒，所述第一磁性件设置于所述滑筒内，且所述第一磁性件与所述套筒的外壁面之间设有第二间隙。
  3. 根据权利要求2所述的驱动机构，其特征在于，所述第一磁性件和所述第二磁性件的数量均为多个，所述第一磁性件与所述第二磁性件一一对应磁性配合；
    所述驱动机构还包括第一隔套，所述第一隔套设置于所述滑筒的内壁面，各所述第一磁性件间隔设置，且所述第一隔套隔离开相邻的两个所述第一磁性件，所述第一隔套与所述套筒的外壁面之间设有第三间隙。
  4. 根据权利要求1所述的驱动机构，其特征在于，所述驱动机构还包括封盖，所述封盖与所述套筒的端部相连，以封闭所述套筒的端口，且所述封盖设有气流通道，所述气流通道连通所述套筒的内部空间，所述封盖或所述第一滑动件用于连接所述开合盖装置。
  5. 根据权利要求4所述的驱动机构，其特征在于，所述驱动机构还包括筒体，所述筒体沿所述套筒的轴向依次贯穿所述封盖和所述第二滑动件，所述筒体形成用于供气体或线路通入的通道，且所述封盖设有与所述通道连通的第一开口。
  6. 根据权利要求5所述的驱动机构，其特征在于，所述驱动机构还包括第一密封件、第二密封件和第三密封件中的至少一者，所述第一密封件设置于所述第二滑动件和所述筒体之间，所述第二密封件设置于所述封盖和所述筒体之间，所述第三密封件设置于所述第二滑动件的外周面。
  7. 根据权利要求1所述的驱动机构，其特征在于，所述第二滑动件包括第一活塞、第二活塞和第二隔套，所述第二磁性件的数量为至少两个，各所述第二磁性件间隔设置于所述第一活塞和所述第二活塞之间，所述第二隔套位于相邻的两个所述第二磁性件之间，以隔离开相邻的两个所述第二磁性件。
  8. 一种接口装置，其特征在于，包括开合盖装置以及权利要求1-7任一项所述的驱动机构，所述开合盖装置用于开启和关闭晶圆传送盒，所述驱动机构的所述第一滑动件和所述套筒中的一者与所述开合盖装置相连。
  9. 根据权利要求8所述的接口装置，其特征在于，所述接口装置还包括固定板、支撑架、第一驱动件和第二驱动件，所述第一驱动件设置于所述支撑架，所述第一驱动件与所述开合盖装置相连，所述第一驱动件可驱动所述开合盖装置相对于所述支撑架沿第一方向移动，
    所述第二驱动件设置于所述固定板，且所述第二驱动件与所述支撑架相连，所述第二驱动件可驱动所述支撑架带动所述第一驱动件和所述开合盖装置相对于所述固定板沿第二方向移动，所述第一方向与所述第二方向相交，
    所述第一驱动件和所述第二驱动件中的至少一者为所述驱动机构。
  10. 根据权利要求9所述的接口装置，其特征在于，所述第一驱动件为所述驱动机构，所述第一驱动件的所述第一滑动件与所述支撑架相连，所述第一驱动件的所述套筒与所述开合盖装置相连，所述接口装置还包括第一导轨和第一导向件，所述第一导轨沿所述第一方向延伸，所述第一导轨和所述第一导向件中的一者设置于所述支撑架，另一者与所述第一驱动件的所述套筒相连，且所述第一导向件与所述第一导轨导向配合，以使所述第一驱动件的所述第一滑动件和所述套筒之间形成所述第一间隙；
    和/或，所述第二驱动件为所述驱动机构，所述第二驱动件的所述套筒与所述固定板相连，所述接口装置还包括第二导轨和第二导向件，所述第二导轨沿所述第二方向延伸，所述第二导轨和所述第二导向件中的一者设置于所述固定板，另一者分别与所述支撑架和所述第二驱动件的所述第一滑动件相连，且所述第二导向件与所述第二导轨导向配合，以使所述第二驱动件的所述第一滑动件与所述套筒之间形成所述第一间隙。
  11. 根据权利要求10所述的接口装置，其特征在于，所述接口装置还包括连接件和第四密封件，所述第一导轨和所述第一导向件中的另一者通过所述连接件与所述第一驱动件的所述套筒相连，所述连接件设有环状凸起，所述环状凸起用于形成可供所述第一驱动件的所述第一滑动件伸入的空间，所述第四密封件设置于所述环状凸起；
    在所述第一驱动件的所述第一滑动件伸入所述环状凸起内的情况下，所述第四密封件密封所述支撑架与所述环状凸起之间的间隙。
  12. 根据权利要求9所述的接口装置，其特征在于，所述接口装置还包括第五密封件，所述第五密封件设置于所述开合盖装置，且所述第五密封件位于所述第一驱动件的所述套筒的外部，所述第五密封件可密封所述开合盖装置与所述支撑架之间的间隙。
  13. 根据权利要求9所述的接口装置，其特征在于，所述第二驱动件为所述驱动机构，且所述第二驱动件的数量为至少两个，各所述第二驱动件间隔分布于所述支撑架。
  14. 一种半导体工艺设备，其特征在于，包括权利要求8-13任一项所述的接口装置。
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US20050265812A1 (en) * 2004-05-28 2005-12-01 Tdk Corporation Load port for clean system
CN101951114A (zh) * 2010-10-08 2011-01-19 中南大学 一种永磁悬浮支承圆筒型直线电机
CN112688530A (zh) * 2019-10-18 2021-04-20 费斯托股份两合公司 线性驱动装置
CN115116914A (zh) * 2022-07-13 2022-09-27 北京北方华创微电子装备有限公司 接口装置、晶圆装卸载装置和半导体工艺设备

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050265812A1 (en) * 2004-05-28 2005-12-01 Tdk Corporation Load port for clean system
CN101951114A (zh) * 2010-10-08 2011-01-19 中南大学 一种永磁悬浮支承圆筒型直线电机
CN112688530A (zh) * 2019-10-18 2021-04-20 费斯托股份两合公司 线性驱动装置
CN115116914A (zh) * 2022-07-13 2022-09-27 北京北方华创微电子装备有限公司 接口装置、晶圆装卸载装置和半导体工艺设备

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