WO2025251802A1 - 一种可折叠设备 - Google Patents

一种可折叠设备

Info

Publication number
WO2025251802A1
WO2025251802A1 PCT/CN2025/090825 CN2025090825W WO2025251802A1 WO 2025251802 A1 WO2025251802 A1 WO 2025251802A1 CN 2025090825 W CN2025090825 W CN 2025090825W WO 2025251802 A1 WO2025251802 A1 WO 2025251802A1
Authority
WO
WIPO (PCT)
Prior art keywords
motherboard
middle frame
fpc
foldable device
main board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/CN2025/090825
Other languages
English (en)
French (fr)
Inventor
苏仰泉
刘子豪
白亮
楚姣
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honor Device Co Ltd
Original Assignee
Honor Device Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honor Device Co Ltd filed Critical Honor Device Co Ltd
Publication of WO2025251802A1 publication Critical patent/WO2025251802A1/zh
Pending legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack

Definitions

  • This application relates to the field of terminal technology, and more particularly to a foldable device.
  • a foldable device includes at least one hinge and two main bodies, which can be connected via the hinge.
  • Each main body includes at least one motherboard.
  • the different motherboards need to be electrically connected to transmit electrical signals, provide power, and complete the overall grounding return.
  • the connection between the two motherboards needs to pass through the hinge. Taking advantage of the bendability and flexibility of flexible circuits, flexible circuit boards can be used for connection at the hinge.
  • the grounding return path of the entire device is significantly limited, resulting in high impedance and insufficient battery power release.
  • increasing the thickness of the flexible circuit board would also increase the overall thickness of the device, affecting its usability and design.
  • This application discloses a foldable device that can increase the return path of the whole machine, reduce the return impedance between different main components, reduce the heat loss of the whole machine, and ensure that the battery power is fully released.
  • this application provides a foldable device, wherein: the foldable device includes a first main body, a second main body, and a hinge; the first main body and the second main body are connected via the hinge; the foldable device is foldable at the hinge; the first main body includes a first middle frame and a first main board; the second main body includes a second middle frame and a second main board; the first main board is fixed to the first middle frame; the second main board is fixed to the second middle frame; the ground terminal of the first main board is electrically connected to the first middle frame; the ground terminal of the second main board is electrically connected to the second middle frame; the foldable device includes a first flexible printed circuit board (FPC) and a second FPC; the first FPC passes through the hinge and connects the first main board and the second main board; the second FPC passes through the hinge and connects the ground terminal of the first main body and the ground terminal of the second main body.
  • FPC flexible printed circuit board
  • the first motherboard is fixed to the first mid-frame; the second motherboard is fixed to the second mid-frame in that the first motherboard is mechanically fixed to the first mid-frame, and the second motherboard is mechanically fixed to the second mid-frame.
  • the ground terminal of the first motherboard is electrically connected to the first mid-frame; the ground terminal of the second motherboard is electrically connected to the second mid-frame.
  • the ground terminal (GND) of the motherboards of the same main body is electrically connected to the mid-frame.
  • the pin position and connection method of the ground terminal are not limited.
  • the return current path of the whole machine is increased, which can reduce the ground return current impedance between different main bodies, reduce the heat loss of the whole machine, and ensure that the battery power is fully released.
  • one end of the second FPC is connected to the ground terminal of the first mid-frame or the motherboard in the first main body; the other end of the second FPC is connected to the ground terminal of the second mid-frame or the motherboard in the second main body.
  • the first main body further includes a third main board; the second main body further includes a fourth main board, the third main board being fixed to the first middle frame; the fourth main board being fixed to the second middle frame, and the ground terminal of the third main board being electrically connected to the first middle frame; the ground terminal of the fourth main board being electrically connected to the second middle frame; the ground terminal of the first main body includes at least one of the ground terminal of the first main board, the ground terminal of the third main board, and the first middle frame; the ground terminal of the second main body includes at least one of the ground terminal of the second main board, the ground terminal of the fourth main board, and the second middle frame.
  • the ground terminal of each main board is connected to its corresponding middle frame, and the middle frame can connect the ground terminals of all main boards, reducing the number of wires required to connect the ground terminals of different main boards in the same main body. Furthermore, the middle frame has a large volume and low impedance, and the second FPC increases the overall ground return path, resulting in even lower overall return impedance, reducing heat loss, and allowing for full release of battery power.
  • the second FPC passes through the hinge and connects to the ground terminals of the first and second main bodies, including: the second FPC passes through the hinge and connects to the first and second mid-frames. This allows the two ends of the second FPC to be directly connected to the mid-frames, reducing the length of the second PFC, decreasing the number of interfaces on the motherboard, and optimizing wiring design space. Similarly, the overall grounding return path results in lower overall return impedance, reducing heat loss and allowing for full battery charge release.
  • the first motherboard is fixed to the first mid-frame; the ground terminal of the first motherboard is electrically connected to the first mid-frame, including: the first motherboard is electrically connected to the first mid-frame via a first connector; the first connector is electrically connected to the ground terminal of the first motherboard; the first connector, which is a first screw or a first pin, fixes the first motherboard to the first mid-frame; the second motherboard is fixed to the second motherboard; the ground terminal of the second motherboard is electrically connected to the second mid-frame, including: the second motherboard is electrically connected to the second mid-frame via a second connector; the second connector is electrically connected to the ground terminal of the second motherboard; the second connector, which is a second screw or a second pin, fixes the second motherboard to the second mid-frame.
  • the first motherboard is fixed to the first mid-frame, including: the first motherboard is fixed to the first mid-frame by welding, screws, or pins; the ground terminal of the first motherboard is electrically connected to the first mid-frame, including: the ground terminal of the first motherboard is electrically connected to the first mid-frame via a spring and/or a wire; the second motherboard is fixed to the second mid-frame, including: the second motherboard is fixed to the second mid-frame by welding, screws, or pins; the ground terminal of the second motherboard is electrically connected to the second mid-frame, including: the ground terminal of the second motherboard is electrically connected to the second mid-frame via a spring and/or a wire.
  • welding, screws, or pins can provide mechanical structural fixation between the motherboard and the mid-frame, while connecting the motherboard's ground terminal to the mid-frame via wires or springs ensures the impedance of the overall ground return current, thereby reducing heat loss and ensuring full release of battery power.
  • the first FPC includes power lines and data control lines; the data control lines include camera lines and screen signal lines. In this way, the first FPC can transmit power, camera signals, and screen signals.
  • the first FPC includes a ground wire. This allows the entire device to include at least two return paths through the shaft FPCs, reducing the impedance of the return current between different components, minimizing heat loss, and ensuring full battery charge release. Furthermore, the ground wire can return directly through the second FPC, sharing the thickness of the first FPC, thus reducing the space occupied in the battery thickness direction and increasing battery capacity. The reduced FPC thickness also decreases the bending radius through the shaft, improving the overall bending life of the FPC.
  • the first FPC does not include a ground wire.
  • the second FPC also includes antenna signal traces
  • these traces connect the first motherboard and the fourth motherboard. In this way, when the second FPC includes antenna signal traces, the antenna signal needs to be transmitted to the motherboard, ensuring design flexibility and the feasibility of the solution.
  • the first FPC has two or one layer of wiring. This reduces the number of FPC layers, lowers the overall FPC thickness, increases the bending radius of the through-axis FPC to improve FPC board life, reduces the space occupied in the thickness direction of the entire device, and can also optimize battery space.
  • the second FPC has two or one layer of wiring. This reduces the number of FPC layers, lowers the overall FPC thickness, increases the bending radius of the through-axis FPC to improve FPC board life, reduces the space occupied in the thickness direction of the entire device, and can also optimize battery space.
  • the first FPC has three or more layers.
  • the second FPC has three or more layers.
  • the pivot includes a first rotating assembly, a second rotating assembly, and a third rotating assembly; the second rotating assembly is located between the first rotating assembly and the third rotating assembly; a first pivot gap exists between the first rotating assembly and the second rotating assembly; a second pivot gap exists between the second rotating assembly and the third rotating assembly; the first, second, and third rotating assemblies of the pivot are used to movably connect the first mid-frame and the second mid-frame. In this way, the space between the pivot gaps in the multiple rotating assemblies is limited.
  • the number of FPCs can be increased to reduce the thickness of the FPCs, improving the bending life of the FPCs while reducing the space occupied in the thickness direction of the FPCs, reducing the space occupied in the thickness direction of the overall device, and also optimizing the battery space.
  • the first main body further includes a first battery
  • the second main body further includes a second battery.
  • the first battery is fixed to one side of the first mid-frame
  • the second battery is fixed to one side of the second mid-frame.
  • the second FPC connects the first motherboard and the fourth motherboard
  • the second FPC portion, the first battery, and the first mid-frame are stacked together in the thickness direction of the terminal device
  • the second FPC portion, the second battery, and the second mid-frame are also stacked together in the thickness direction of the terminal device.
  • the mid-frame, battery, and FPC are stacked in the thickness direction of the foldable device.
  • Increasing the number of FPC layers leads to a decrease in battery thickness and a smaller battery capacity.
  • the introduction of the second PFC reduces the overall thickness of the through-axis FPC, reducing the space occupied in the thickness direction of the entire device, thereby increasing battery thickness and resulting in a larger battery capacity.
  • the first main body includes a first battery; the second main body also includes a second battery, the first battery being fixed to the first mid-frame; the second battery being fixed to the second mid-frame, and the first FPC portion and the second battery being stacked together in the thickness direction of the terminal device.
  • the mid-frame, battery, and FPC are stacked in the thickness direction of the foldable device.
  • Increasing the number of FPC layers leads to a decrease in battery thickness and a smaller battery capacity.
  • the introduction of the second PFC reduces the overall thickness of the through-axis FPC, reducing the space occupied in the thickness direction of the entire device, thereby increasing battery thickness and resulting in a larger battery capacity.
  • this application provides a circuit return system, which includes any one of the foldable devices described in the first aspect above.
  • Figure 1 is a schematic diagram of the folded structure of a foldable device provided in an embodiment of this application;
  • Figure 2 is a schematic diagram of the unfolded structure of a foldable device according to an embodiment of this application;
  • Figure 3 is a schematic diagram of the spatial structure of a foldable device provided in an embodiment of this application.
  • Figure 4 is a disassembled structural diagram of a foldable device in the unfolded state according to an embodiment of this application;
  • Figure 5 is a cross-sectional structural diagram of a foldable device provided in an embodiment of this application.
  • Figure 6 is a cross-sectional structural diagram of a foldable device provided in an embodiment of this application.
  • Figure 7 is a schematic cross-sectional view of the FPC in a foldable device provided in an embodiment of this application.
  • Figure 8 is a disassembled structural diagram of a foldable device in the unfolded state according to an embodiment of this application.
  • Figure 9 is a schematic diagram of a first motherboard ground wire connected to a first middle frame by screws according to an embodiment of this application;
  • Figure 10 is a disassembled structural diagram of a foldable device in the unfolded state according to an embodiment of this application;
  • Figure 11 is a schematic cross-sectional view of a first flexible circuit board and a second flexible circuit board provided in an embodiment of this application;
  • Figure 12 is a disassembled structural diagram of another foldable device provided in the embodiment of this application in the unfolded state;
  • Figure 13 is a schematic cross-sectional view of a second flexible circuit board provided in an embodiment of this application.
  • first and second are used to distinguish identical or similar items with substantially the same function and purpose.
  • first chip and second chip are used only to distinguish different chips and do not limit their order of execution.
  • terms such as “first” and “second” do not limit the quantity or execution order, and that "first” and “second” do not necessarily imply that they are different.
  • This application proposes a foldable device that increases the return path, thereby reducing the return impedance between different components, reducing overall heat loss, and ensuring full release of battery power.
  • Figure 1 is a schematic diagram of the folded structure of a foldable device disclosed in an embodiment of this application. As shown in Figure 1, the foldable device is in a fully folded or nearly fully folded state.
  • Figure 2 is a schematic diagram of the unfolded structure of a foldable device disclosed in an embodiment of this application. As shown in Figure 2, the foldable device is in a fully unfolded or nearly fully unfolded state.
  • Figure 3 is a schematic diagram of the spatial structure of a foldable device disclosed in an embodiment of this application.
  • the width direction of the foldable device 100 is defined as the X direction
  • the length direction of the foldable device 100 is defined as the Y direction
  • the thickness direction of the foldable device 100 is defined as the Z direction.
  • the X, Y, and Z directions are all perpendicular to each other.
  • Foldable devices 100 include, but are not limited to, cellphones, notebook computers, tablet computers, laptop computers, personal digital assistants, wearable devices, or mobile devices.
  • a cellphone is used as an example for illustration.
  • the foldable device 100 may include a first body 110, a second body 120, and a pivot 130.
  • the pivot 130 is located between the first body 110 and the second body 120, that is, the first body 110 and the second body 120 are rotatably connected through the pivot 130, thereby enabling the first body 110 and the second body 120 to be folded and unfolded.
  • the first body 110 and the second body 120 rotate about the pivot 130 in directions that are far apart from each other, that is, the first body 110 rotates in the direction 11a and the second body 120 rotates in the direction 11b.
  • the foldable device is in a fully unfolded state or a near-fully unfolded state.
  • the first body 110 and the second body 120 rotate about the pivot 130 in a direction that approaches each other, that is, the first body 110 rotates in the direction of 22a and the second body 120 rotates in the direction of 22b.
  • the foldable device is in a fully folded state or a near-fully folded state.
  • the rotating shaft 130 may include a first rotating assembly 131, a second rotating assembly 133, and a third rotating assembly 135.
  • the first rotating assembly 131, the second rotating assembly 133, and the third rotating assembly 135 are arranged sequentially at intervals along the Y direction.
  • the second rotating assembly 133 is located between the first rotating assembly 131 and the third rotating assembly 135.
  • There are shaft gaps between adjacent rotating assemblies specifically, there is a first shaft gap 132 between the first rotating assembly 131 and the second rotating assembly 133, and a second shaft gap 134 between the second rotating assembly 133 and the third rotating assembly 135.
  • the rotating shaft 130 may be a rotating shaft structure or a hinge structure, etc.
  • the foldable device 100 may also include a first middle frame 111, a second middle frame 121, a first back cover 141, a second back cover 142, and a display screen 150.
  • the first body 110 includes the first middle frame 111, the first back cover 141, and a first part of the display screen 150;
  • the second body 120 includes the second middle frame 121, the second back cover 142, and a second part of the display screen 150.
  • the first middle frame 111 and the second middle frame 121 can serve as structural support components of the foldable device 100.
  • the first middle frame 111 and the second middle frame 121 can be used to mount other components such as the display screen 150 and the first back cover 141.
  • the display screen 150 can cover one side of the first middle frame 111, the second middle frame 121, and the hinge 130; the first back cover 141 covers the other side of the first middle frame 111 and the second middle frame 121; and the second back cover 142 covers the other side of the second middle frame 121. That is, along the thickness direction of the foldable device 100, the display screen 150 and the back cover are respectively connected to opposite sides of the middle frame.
  • the first middle frame 111, the display screen 150, and the first back cover 141 cooperate to form a first receiving space for the foldable device; the second middle frame 121, the display screen 150, and the second back cover 142 cooperate to form a second receiving space for the foldable device.
  • the receiving space can be used to accommodate electronic components such as the processor, circuit board, and battery, as well as structural components of the foldable device.
  • the foldable device 100 may exemplarily include a first battery 161, a second battery 162, a first motherboard 171, a second motherboard 172, a third motherboard 173, and a fourth motherboard 174.
  • the first main body 110 includes the first battery 161, the first motherboard 171, and the third motherboard 173;
  • the second main body 120 includes the second battery 162, the second motherboard 172, and the fourth motherboard 174.
  • the first receiving space may include the first battery 161, the first motherboard 171, and the fourth motherboard 174.
  • the first receiving space may also include the second battery 162, the third motherboard 173, and the second motherboard 172.
  • the number, size, and positional arrangement of the batteries and motherboards in the first and second receiving spaces are merely illustrative examples, and this application embodiment does not limit these aspects.
  • each module is shown in two dimensions. That is, the display screen 150, battery, motherboard, middle frame, hinge 130, first back cover 141 and second back cover 142 are not specifically drawn in the Z-axis thickness direction, but the actual components do have a certain thickness.
  • the foldable device 100 may include more or fewer components than illustrated, or combine some components, or separate some components, or have different component arrangements.
  • the foldable device 100 may also include a camera module and devices such as a flash.
  • Figures 4 to 7 are schematic diagrams illustrating the circuit connections between different motherboards according to embodiments of this application.
  • Figure 4 shows the unfolded structure of a foldable device.
  • Figure 5 is a cross-sectional view of cut surface 1 in Figure 4;
  • Figure 6 is a cross-sectional view of cut surface 2 in Figure 4.
  • Figure 7 is a cross-sectional view of the FPC in Figure 4.
  • Figure 4 the layout of the motherboard and battery in the first and second receiving spaces is illustrated using the plane containing the X and Y axes (XOY plane) as an example.
  • Figure 4 includes the layout and connection relationship of each component on the XOY plane.
  • the first receiving space of the first middle frame 111 includes a first motherboard 171, a third motherboard 173, and a first battery 161.
  • the second receiving space of the second middle frame 121 includes a second motherboard 172, a second battery 162, and a fourth motherboard 174.
  • the descriptions of the structures and components such as the middle frame, receiving space, motherboard, battery, hinge assembly, and hinge gap can be found in the relevant content of Figure 3, and will not be repeated here.
  • each motherboard needs to be fixed to the middle frame with at least one screw.
  • screws 311, 312, 313, 314, and 315 connect the first motherboard 171 to the first middle frame 111.
  • the positions of screws 311, 312, 313, 314, and 315 can be located at five different positions on the first motherboard 171 to ensure the stability of the connection.
  • the number of screws used to connect each motherboard to the middle frame can be different.
  • the second motherboard 172 is connected to the first middle frame with four screws, and the third and fourth motherboards can each be connected to the middle frame with two screws. This application does not limit the number and position of screws connecting each motherboard to the middle frame.
  • the connection method of other motherboards to the middle frame can refer to the screw connection method of the first motherboard, and will not be described again.
  • the foldable device 100 may further include a flexible circuit board (FPC) 321, which can connect to the first motherboard 171 and the second motherboard 172.
  • FPC flexible circuit board
  • the FPC 321 can pass through the first hinge gap 132, pass one side of the second battery 162 (the FPC 321 and the second battery 162 are stacked together in the thickness direction of the foldable device), and connect to the first motherboard 171 and the second motherboard 172.
  • the first end of the FPC 321 is connected to the first motherboard 171, and the second end is connected to the second motherboard 172.
  • the FPC 321 may include power lines, ground lines, and other lines.
  • the power lines can transmit power signals and provide voltage.
  • the ground lines can transmit ground signals, enabling the power signals to return.
  • the power circuit may include Vph_pwr (main power circuit), Vbus (charging circuit), Vbat (battery circuit), etc.
  • Other lines may include front-facing camera wiring, microphone wiring, screen IC wiring, and antenna switch signals, etc.
  • the specific layout of other lines is related to the overall circuit layout, and this application does not limit it.
  • the ground wires of all motherboards need to be connected to form the signal return path for the complete foldable device 100.
  • the first motherboard 171 can be connected to the second motherboard 172 via FPC 321; the first motherboard 171 can be connected to the third motherboard 173 via wire 322; and the second motherboard 172 can be connected to the fourth motherboard 174 via wire 323.
  • FPC 321, wire 322, and wire 323 can all include ground wires, power wires, and other traces. The specific type of trace depends on the specific hardware layout of the device, and this application does not limit this. Wire 323, wire 322, and wire 323 can also be FCBs or other types of traces, and this application does not limit this.
  • the second battery 162 and the second motherboard 172 are placed on the same side of the second middle frame 121 and are located in the second receiving space.
  • the second mainboard 172 is connected to the second middle frame 121 by screws.
  • the mainboard (second mainboard 172) includes a printed circuit board (PCB), multiple components, and a shielding cover. Multiple components (e.g., chips, inductors, etc.) can be soldered onto the PCB, and the components connect and cooperate to achieve different functions.
  • the shielding cover is also fixed to the PCB, which can shield external interference signals, reduce electromagnetic radiation, and strengthen the mainboard.
  • the PCB is fixedly connected to the second middle frame 121 by screws; one end of the screw passes through a hole in the PCB, and the other end is fixed in the second middle frame 121.
  • the PCB board can be connected to the FPC circuitry via a connector.
  • the FPC circuitry runs from one side of the second battery 162, makes a bend, and passes through the first pivot gap 132.
  • the connector is fixed to one side of the second main board 172, with one end connected to the PCB board.
  • the PCB board can also be connected to the FPC circuitry by soldering. This application does not limit the connection method between the PCB board and the FPC circuitry.
  • Figure 6 shows the distribution of the battery and screws on the Z-axis and Y-axis planes of the cut surface 2 in Figure 4.
  • the FPC wiring undergoes (multiple) bends.
  • the two ends of the hinge gap are adjacent to the first motherboard 171 and the second battery 162, respectively.
  • the FPC wiring passes through one side of the first motherboard, it undergoes two complete bends after being fixed, passes through a hole, and then undergoes two more bends. After being fixed again, it continues to pass through one side of the second battery, and then connects to the second motherboard 172 as shown in Figure 5.
  • the foldable device can undergo multiple bends in the FPC wiring in the hinge area.
  • the bending radius is large; when the FPC thickness is large, the bending radius is small.
  • One end of the FPC connects to the first motherboard 171, passes through the first hinge gap 132, and is located on one side of the second battery 162. The FPC then needs to bend to connect to the second motherboard 172.
  • the FPC bends. The thicker the FPC, the smaller the bending radius, and the shorter the lifespan of the FPC.
  • FIG. 7 is a schematic cross-sectional view of the FPC.
  • the FPC wiring includes three types of lines: power lines, ground lines, and other traces.
  • Power lines e.g., the Vbus charging path
  • ground lines are used to complete the circuit return of the entire device.
  • Other traces can provide electrical signals for transmission between different components.
  • the FPC wiring consists of three layers. Due to the low impedance required for the circuit return, the ground signal has high requirements. However, because the rotating components in the shaft occupy a large space and the shaft gap is very narrow, the width of the FPC cannot be increased.
  • the FPC has many trace resources, requiring an increase in the number of FPC layers.
  • a thicker FPC occupies space in the thickness direction of the entire device, which is detrimental to the overall structural layout. Furthermore, the three-layer FPC wiring is approximately 0.162mm thick, with a bending radius of 0.69mm and a bending life of approximately 243,805 cycles. Therefore, increasing the number of FPC layers to reduce impedance is not feasible.
  • the mainboards of the two main bodies are connected by a single through-shaft via FPC traces to complete the overall return current.
  • the flexible printed circuit board includes power lines, ground lines, and other circuits. Therefore, the ground return current path between the two main bodies is achieved through the ground line in a single through-shaft flexible printed circuit board.
  • the electronic device cannot infinitely increase the number of FPC layers to reduce the return current impedance. This results in a high ground return current impedance, severe heat loss, and insufficient battery power release.
  • the width of the through-shaft gap in the Y-axis direction is limited, increasing the number of FPC trace layers is necessary to meet the overall return current impedance requirements. This increased number of layers occupies space in the thickness direction of the foldable device, reducing the space available for the battery and thus decreasing battery capacity.
  • increasing the number and thickness of the FPC trace layers also reduces the bending radius, introducing issues related to the reliability and bending lifespan of the FPC traces.
  • the increased thickness and reduced bending radius of the FPC traces increase the risk of damage to the top screen of the FPC circuitry.
  • connecting two motherboards with an FPC also requires increasing the number of BTB pins. The FPC BTB is often located in the core of the motherboard layout, which will occupy more motherboard layout resources.
  • the foldable device includes a first main body, a second main body, and a hinge.
  • the first and second main bodies are connected via the hinge, allowing the foldable device to be folded at the hinge.
  • the first main body includes a first mid-frame and a first main board, while the second main body includes a second mid-frame and a second main board.
  • the first main board is fixed to the first mid-frame; the second main board is fixed to the second mid-frame; the ground terminal of the first main board is electrically connected to the first mid-frame; the ground terminal of the second main board is electrically connected to the second mid-frame.
  • the foldable device includes a first flexible printed circuit board (FPC) and a second FPC.
  • the first FPC passes through the hinge and connects to the first and second main boards; the second FPC passes through the hinge and connects to the ground terminals of the first and second main bodies.
  • the return current path of the FPC passing through the hinge is increased, reducing the impedance of the ground return current between different main bodies, reducing heat loss, and ensuring full release of battery power.
  • one end of the second FPC is connected to the ground terminal of the motherboard in the first middle frame or the first body; the other end of the second FPC is connected to the ground terminal of the motherboard in the second middle frame or the second body.
  • the second FPC passes through a pivot and connects the first and second mid-frames.
  • Figure 8 is a structural diagram of a foldable device in its unfolded state, as exemplarily disclosed in an embodiment of this application.
  • the foldable device may include a first middle frame 111, a second middle frame 121, a hinge 130, a first battery 161, a second battery 162, a first main board 171, a second main board 172, a third main board 173, a fourth main board 174, a first rotating assembly 131, a second rotating assembly 133, and a third rotating assembly 135.
  • the layout and structure of the above modules and components can be referred to the relevant descriptions in Figures 3 and 4, and will not be repeated here.
  • each motherboard in the foldable device is fixedly connected to the mid-frame by at least one screw.
  • the first motherboard 171 is fixedly connected to the first mid-frame 111 by five screws: screws 311, 312, 313, 314, and 315.
  • the ground pin of the first motherboard 171 can be located at at least one of these screws to ensure that the ground of the first motherboard 171 is connected to the first mid-frame 111.
  • the screws are made of conductive materials, such as metal.
  • the mid-frame is also made of conductive materials, such as aluminum alloy or titanium alloy.
  • the screws securely connect the mid-frame to each motherboard, and are also connected to the grounding terminals of each motherboard. This allows the grounding terminals of each motherboard to conduct electricity through the screws and the mid-frame. Furthermore, connecting the first and second mid-frames ensures that the grounding terminals of each motherboard are connected, forming a complete grounding return path for the entire system.
  • the electrical connection between the mid-frame and the motherboard ground terminal can be made by screws, pins, or welding, etc., and this application does not limit this.
  • the fixing connection between the mid-frame and the motherboard can be screws, pins, or welding
  • the electrical connection between the mid-frame and the grounding terminal of the motherboard can be wires (e.g., FPC, metal wires) or springs (springs are conductors), etc.
  • Figure 9 shows a schematic diagram of a first motherboard ground wire connected to a first middle frame via a screw, according to an embodiment of this application.
  • the first motherboard 171 includes a PCB board, a shielding cover, and multiple components.
  • a screw passes through a hole in the PCB board's ground wire pin and connects to the first middle frame 111. Since both the screw and the middle frame are conductors, the middle frame can be connected to the ground wire of the first motherboard.
  • Figure 9 only shows a single screw connecting the ground wire; multiple screws can be used to connect the ground wire, and this application is not limited to this.
  • the foldable device includes a first flexible circuit board 411 and a second flexible circuit board 412 (different from Figure 4).
  • the first flexible circuit board 411 is located between the first rotating assembly 131 and the second rotating assembly 133; the second flexible circuit board 412 is located between the second rotating assembly 133 and the third rotating assembly 135.
  • the foldable device may include one, two, four, or more rotating assemblies.
  • the first flexible circuit board 411 and the second flexible circuit board 412 can be connected to the shaft gaps on both sides (or one side) of at least one rotating assembly for shaft connection.
  • the specific location of the shaft-connecting FPC is not limited in this application. This process, by connecting the grounding terminals of the first and second main bodies via the second FPC traces, increases the return current path, reduces the impedance of the return current between different main bodies, reduces heat loss, and ensures full release of battery power.
  • fixed connection and electrical connection are two different types of connections.
  • Fixed connection is a mechanical structural connection.
  • Electrical connection is a connection used to conduct electrical signals.
  • screws or pins, welding, etc.
  • screws serve as mechanical connectors, fixing the positions of the main body and the middle frame on the same substrate. That is, screws, welding, and insertion devices all contribute to the fixed connection between the main body and the middle frame.
  • screws, welding, and insertion devices are all conductors. If one end of a screw, welding, or insertion device is connected to the grounding terminal on the main body, it can serve as a return path for the grounding signal. In this case, screws, welding, and insertion devices also function as electrical connections.
  • each of the aforementioned main units all motherboard grounding terminals are connected via the mid-frame, which reduces the number of wires required to connect the grounding terminals of different motherboards within the same main unit. Furthermore, the large size and low impedance of the mid-frame better meet the impedance requirements for the overall ground return current, reducing heat loss and ensuring full battery charge release.
  • connection structure at both ends of the first flexible circuit board 411 can be referred to the relevant description of the flexible circuit board 321 in Figure 4. For details, please refer to the relevant descriptions in Figures 4 to 6, which will not be repeated here.
  • the first main grounding terminal includes at least one of the grounding terminal of the first main board 171, the grounding terminal of the third main board 173, and the first middle frame 111;
  • the second main grounding terminal includes at least one of the grounding terminal of the second main board 172, the grounding terminal of the fourth main board 174, and the second middle frame 121.
  • Example 1 The two ends of the second flexible circuit board are connected to two main boards of different subjects.
  • the two ends of the second flexible circuit board 412 are connected to the first main board 171 and the fourth main board 174.
  • the second flexible circuit board 412 includes a ground line and a first data control line (which may include an antenna signal line, etc.).
  • the first flexible circuit board 411 includes a power line and a second data control line (which may include a screen display line, camera line, etc.).
  • the first flexible circuit board 411 may or may not include a ground line.
  • FIG 10 is an illustrative structural diagram of a foldable device in its unfolded state, as disclosed in an embodiment of this application.
  • one end of the second flexible circuit board 412 is connected to the first main board 171, and the other end is connected to the fourth main board 174.
  • one end of the second flexible circuit board 412 starts from its connection to the first main board 171, passes through one side of the first battery 161 (the first battery, the second FPC, and the mid-frame are stacked in the thickness direction of the foldable device), passes through the pivot gap between the second rotating assembly 133 and the third rotating assembly 135, continues through one side of the second battery 162, and then connects to the fourth main board 174 after a turn.
  • the return current path is increased, which can reduce the impedance of the return current between different main bodies, reduce the heat loss of the whole machine, and ensure that the battery power is fully released.
  • the second flexible circuit board 412 may include a ground line and other signals.
  • the first flexible circuit board 411 may include a power line and a first data control line.
  • the first flexible circuit board 411 may or may not include a ground line.
  • FIG11 is a cross-sectional schematic diagram of a first flexible circuit board and a second flexible circuit board disclosed in an embodiment of this application.
  • FIG11(a) and (b) show cross-sectional schematic diagrams of the first flexible circuit board.
  • the first flexible circuit board includes power lines and a first data control line, but does not include a ground line.
  • the second flexible circuit board includes power lines, a first data control line, and a ground line.
  • the second flexible circuit board may include a ground line and a second data control line.
  • the first flexible circuit board is changed from three layers in FIG4 to two layers.
  • the FPC board thickness changes from 0.162mm to 0.122mm, the thickness is reduced by 25%, and the manufacturing cost is reduced by 40%.
  • the FPC board thickness is reduced to two layers, the bending radius of the FPC board in the hinge gap is large, and the bending life can be increased by tens of thousands of times. At the same time, it can also reduce the occurrence of FPC top screen or abnormal noise, and improve the life of foldable devices.
  • the first flexible circuit board can also be a single layer.
  • the first flexible circuit board can be three layers.
  • the first motherboard includes a first power management unit (PMU) and a first power supply controller (SC), among other component modules.
  • the second motherboard 172 may include a second PMU and a second SC, among other components.
  • the third motherboard 173 may include a Type-C module and an overvoltage protection (OVP) module. The Type-C module and the OVP module are connected via the third motherboard 173.
  • a Power Management Unit is a chip used to manage and control the power supply and power consumption of a device. As an integrated circuit, it can achieve optimal power management and functional control through effective power management.
  • the PMU can connect to a battery to manage battery power and supply power to other modules of the foldable device.
  • the first battery 161 can be connected to the first PMU and the first battery switching charger (SC) chip via line 512 (bat1).
  • the second battery 162 can be connected to the second PMU and the second SC via line 513 (bat2).
  • the Type-C interface module has the function of charging the battery and PMU with an external charger, as well as the OTG function of connecting external devices (the foldable device needs to supply power to the Type-C interface module).
  • the Type-C interface module After the Type-C interface module is connected to the OVP module, it needs to be connected to the first PMU and the second PMU, as well as the first SC and the second SC via Vbus.
  • the voltage of the first SC and the second SC is converted to a voltage suitable for charging the battery.
  • the Type-C module needs to supply power to the first SC and the second SC, as well as the first PMU and the second PMU.
  • the first motherboard 171 and the third motherboard 173 are connected via Vbus trace 511. Vbus trace 511.
  • the Vbus trace 511 in the first motherboard 171 is connected to the first PMU and the first SC. Further, the Vbus trace 511 is connected to one end of the power line in the first FPC; the other end of the power line in the first FPC is connected to the second PMU and the second SC of the second motherboard 172.
  • the foldable device when connected to an external charger, it can supply power to the first PMU and the second PMU, as well as the first SC and the second SC via the Type-C interface module. With OTG enabled, either the first PMU or the second PMU can supply power to the Type C interface module.
  • the fourth motherboard 174 connects to the antenna's metallic radiating stub.
  • the fourth motherboard 174 needs to transmit antenna signals to the first motherboard 171. Therefore, other lines connecting the first motherboard 171 and the fourth motherboard 174 may include antenna signal lines for transmitting antenna signals.
  • the Type-C interface module can charge the first battery 161 through the first SC and charge the second battery 162 through the second SC.
  • the following example of a foldable device connected to the charger illustrates the return current path during charging.
  • the ground terminals of the first motherboard 171 and the third motherboard 173 are both connected to the first middle frame 111 via screws; the ground terminals of the second motherboard 172 and the fourth motherboard 174 are both connected to the second middle frame 121 via screws; the second flexible circuit board 412 is connected to the ground terminals of the first motherboard 171 and the second motherboard 172 via a shaft.
  • the return current path is from the second motherboard 172 to the second middle frame 121, then to the second flexible circuit board 412, and then back to the first motherboard 171.
  • the current then flows from the first motherboard 171 through the first middle frame 111 to the charging terminal of the third motherboard 173, completing the return current. Since the ground terminals of all the motherboards are connected to the middle frame, the return current path is increased, the middle frame impedance is low, the return current path impedance is even lower, heat loss is low, battery power is released more fully, and the ground return current is more ideal.
  • the TypeC interface module is just one example of an interface type; other interface types are also possible and are not limited here.
  • the return path may also include a path from the second motherboard 172 to the first flexible circuit board 411 to the first motherboard 171 and then to the first middle frame 111, and then from the first middle frame 111 to the third motherboard 173, thus completing another path of return process.
  • motherboards may also include other components and modules, which are not limited in this application.
  • the two ends of the second flexible circuit board 412 can be connected to either the first middle frame 111 or the second middle frame 121, respectively.
  • This application only limits the two motherboards to be located in the two middle frames, without limiting the position or size of the motherboards.
  • the two ends of the second flexible circuit board 412 can be connected to the third motherboard 173 and the fourth motherboard 174, respectively.
  • the wiring between the first motherboard 171 and the third motherboard 173 can include antenna signal wiring.
  • At least one end of the second flexible circuit board is connected to a middle frame, and the other end is connected to another middle frame or the main board in another middle frame.
  • the two ends of the second flexible circuit board 412 are connected to the first middle frame 111 and the second middle frame 121.
  • the second flexible circuit board 412 includes a ground wire but does not include other lines and power lines.
  • the first flexible circuit board 411 includes a power line and a first data control line.
  • the first flexible circuit board 411 may or may not include a ground wire. The specific connection between the first flexible circuit board 411 and the second flexible circuit board 412 is described in detail with reference to Figures 12 and 13.
  • Figure 12 is a disassembled structural diagram of another foldable device disclosed in the present application in an exemplary embodiment, in its unfolded state.
  • one end of the second flexible circuit board 412 is connected to the first middle frame 111, and the other end is connected to the second middle frame 121.
  • the second flexible circuit board 412 may include a ground wire but does not include other types of lines (second data control lines).
  • the first flexible circuit board 411 may include a power line and a first data control line.
  • the first flexible circuit board 411 may or may not include a ground wire.
  • the return current path is increased, which can reduce the impedance of the return current between different main bodies, reduce the heat loss of the whole machine, and ensure that the battery power is fully released.
  • Figure 13 is a schematic cross-sectional view of a second flexible circuit board disclosed in an embodiment of this application.
  • the second flexible circuit board includes a ground wire.
  • the first flexible circuit board 411 in Embodiment 2 can be referred to the relevant descriptions in Figures 11(a) and (b), which will not be repeated here.
  • the second flexible circuit board has two layers; optionally, it can have one or three layers.
  • the second flexible circuit board 412 in Figure 12 only includes a ground wire and does not include other lines.
  • the fourth motherboard 174 needs to transmit the antenna signal to the first motherboard 171 through the second motherboard 172.
  • the antenna signal trace 514 can transmit the antenna signal from the fourth motherboard 174 to the second motherboard 172, and the second motherboard 172 can continue to transmit the antenna signal to the first motherboard 171 through other traces in the first flexible circuit board 411.
  • the connection and charging return paths of the first PMU, second PMU, first SC, second SC, Type C module, OVP module and battery in Figure 12 can all refer to the relevant descriptions in Figures 10 and 11 above, and will not be repeated here.
  • one end of the second flexible circuit board 412 is connected to the first middle frame 111 and the other end is connected to the fourth main board 174; or one end of the second flexible circuit board 412 is connected to the second middle frame 121 and the other end is connected to the first main board 171.
  • the second FPC includes a ground line and a second data control line (e.g., an antenna signal trace).
  • the ground line of the second FPC is connected at both ends to the first and second mid-frames, and the second data control line (e.g., an antenna signal trace) of the second FPC is connected at both ends to two motherboards located in the first and second main bodies, respectively.
  • a second FPC is added, resulting in two FPCs.
  • One FPC connects the signals of the fourth mainboard from the second mainboard to the first mainboard, while the other FPC connects the return current path.
  • the return current path is increased, reducing the impedance of the return current between different main bodies, reducing heat loss, and ensuring full battery power release.
  • the mid-frame for return current connection, the low impedance of the mid-frame allows for better conduction of the structural characteristics of each mainboard.
  • Adding a through-shaft FPC reduces the number of FPC board layers, providing more space in the thickness direction for the battery, ensuring a complete and stable return current path, optimizing the overall structure and setup, improving battery performance, and enhancing the reliability of the through-shaft wiring. Therefore, the quality of the foldable device is improved.
  • the foldable device may further include a third body, and the second and third bodies can be rotatably connected via another pivot.
  • the FPC wiring between the second and third bodies can refer to any of the FPC layouts between the first and second bodies shown in Figures 4 to 12 above, and will not be repeated here.
  • the foldable device is a three-fold device; however, the foldable device may also have more folds, which is not limited in this application.
  • the foldable device may further include a third FPC, which may also be connected to the grounding terminal of the first body and the grounding terminal of the second body.
  • the grounding terminal of the first body may be at least one of the motherboard grounding terminal and the grounding terminal of the first middle frame.
  • the grounding terminal of the second body may be at least one of the motherboard grounding terminal and the grounding terminal of the second middle frame.
  • the connection method of the third FPC may refer to that of the second FPC, which will not be elaborated here.
  • the FPC wiring may include two or more, which is not limited in this application.
  • implementation can be achieved entirely or partially through software, hardware, firmware, or any combination thereof.
  • software When implemented using software, it can be implemented entirely or partially as a computer program product.
  • the computer program product includes one or more computer instructions. When the computer program instructions are loaded and executed on a computer, all or part of the processes or functions described in the embodiments of this application are generated.
  • the computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device.
  • the computer instructions can be stored in a computer-readable storage medium or transmitted from one computer-readable storage medium to another.
  • the computer instructions can be transmitted from one website, computer, server, or data center to another website, computer, server, or data center via wired (e.g., coaxial cable, fiber optic, digital subscriber line) or wireless (e.g., infrared, wireless, microwave, etc.) means.
  • the computer-readable storage medium can be any available medium that a computer can access or a data storage device such as a server or data center that integrates one or more available media.
  • the available medium can be a magnetic medium (e.g., floppy disk, hard disk, magnetic tape), an optical medium (e.g., DVD), or a semiconductor medium (e.g., solid-state drive), etc.

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Abstract

本申请公开一种可折叠设备，其中：可折叠设备包括第一主体、第二主体和转轴，第一主体和第二主体通过转轴连接，可折叠设备能够在转轴处被折叠；第一主体包括第一中框和第一主板，第二主体包括第二中框和第二主板；第一主板与第一中框固定连接；第二主板与第二中框固定连接；第一主板的接地端连接到第一中框；第二主板的接地端连接到第二中框；可折叠设备包括第一柔性电路板FPC和第二FPC；第一FPC穿过转轴连接第一主板和第二主板；第二FPC穿过转轴连接第一主体的接地端和第二主体的接地端。在本申请实施例中，增加回流路径，可以降低不同主体之间地回流阻抗，减少整机热损耗，保证电池电量充分释放。

Description

一种可折叠设备
本申请要求于2024年06月07日提交中国专利局、申请号为202410745075.6、发明名称为“一种可折叠设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及终端技术领域，尤其涉及一种可折叠设备。
背景技术
可折叠设备至少包括一个转轴和两个主体，两个主体可以通过转轴进行连接。两个主体中包括至少一个主板，为了能够使可折叠设备正常运行，不同的主板之间需要进行电连接，以传输电信号，提供电源以及完成整机接地回流。在需要连接的两主板分别处于不同主体时，两主板的连接需要穿过转轴。借助于柔性电路可弯折、柔韧性强等特点，可以使用柔性电路板在转轴处进行连接。
然而，由于转轴处的空间有限，柔性电路板厚度受限，因此整机接地回流路径限制较大，阻抗大，电池电量无法得以充分释放。此外，若增加柔性电路板的厚度，会造成整机的厚度也会增加，影响整机的使用和设计。
发明内容
本申请实施例公开了一种可折叠设备，可以增加整机的回流路径，可以降低不同主体之间地回流阻抗，减少整机热损耗，保证电池电量充分释放。
第一方面，本申请提供了一种可折叠设备，其中：所述可折叠设备包括第一主体、第二主体和转轴，所述第一主体和所述第二主体通过所述转轴连接，所述可折叠设备能够在所述转轴处被折叠；所述第一主体包括第一中框和第一主板，所述第二主体包括第二中框和第二主板；所述第一主板与所述第一中框固定；所述第二主板与所述第二中框固定；所述第一主板的接地端电连接到所述第一中框；所述第二主板的接地端电连接到所述第二中框；所述可折叠设备包括第一柔性电路板FPC和第二FPC；所述第一FPC穿过所述转轴连接所述第一主板和所述第二主板；所述第二FPC穿过所述转轴连接所述第一主体的接地端和所述第二主体的接地端。
其中，所述第一主板与所述第一中框固定；所述第二主板与所述第二中框固定是指所述第一主板之间所述第一中框机械结构固定，所述第二主板与所述第二中框的机械结构固定。所述第一主板的接地端电连接到所述第一中框；所述第二主板的接地端电连接到所述第二中框，同一主体的主板的接地端(即GND)与中框电连接，不限定接地端的引脚位置，连接方式等。
本申请实施例中，借助于第二FPC走线连接第一主体的接地端和第二主体的接地端，增加整机的回流路径，可以降低不同主体之间的地回流阻抗，减少整机热损耗，保证电池电量充分释放。
在一种可能是实施方式中，所述第二FPC的一端连接所述第一中框或者所述第一主体中主板的接地端；所述第二FPC的另一端连接所述第二中框或者所述第二主体中主板的接地端。这样，借助于第二FPC走线连接第一主体的接地端和第二主体的接地端，增加整机的回流路径，可以降低不同主体之间的地回流阻抗，减少整机热损耗，保证电池电量充分释放。
在一种可能是实施方式中，所述第一主体还包括第三主板；所述第二主体还包括第四主板，所述第三主板与所述第一中框固定；所述第四主板与所述第二中框固定，所述第三主板的接地端电连接所述第一中框；所述第四主板的接地端电连接所述第二中框；所述第一主体接地端包括所述第一主板的接地端、所述第三主板的接地端和所述第一中框其中至少一个；所述第二主体接地端包括所述第二主板的接地端、所述第四主板的接地端和所述第二中框其中至少一个。这样，各个主板的接地端均连接到对应的中框，中框可以连通所有主板的接地端，减少同一主体中不同主板接地端连通所需的导线数量，且中框体积大阻抗低，且第二FPC增加整机接地回流路径，整机回流阻抗更低，减少热损耗，使得电池电量充分释放。
在一种可能是实施方式中，所述第二FPC穿过所述转轴连接所述第一主体的接地端和所述第二主体的接地端，包括：所述第二FPC穿过所述转轴连接所述第一中框和所述第二中框。这样，第二FPC两端可以直接连接中框，可以减少第二PFC的长度，减少主板的接口数量，优化走线设计空间。同样，整机接地回流路径，整机回流阻抗更低，减少热损耗，使得电池电量充分释放。
在一种可能是实施方式中，所述第一主板与所述第一中框固定；所述第一主板的接地端电连接所述第一中框，包括：所述第一主板通过第一连接件电连接所述第一中框；所述第一连接件电连接所述第一主板的接地端；所述第一连接件固定所述第一主板与所述第一中框，所述第一连接件为第一螺钉或第一插销；所述第二主板与所述第二主板固定；所述第二主板的接地端电连接所述第二中框，包括：所述第二主板通过第二连接件电连接所述第二中框；所述第二连接件电连接所述第二主板的接地端；所述第二连接件固定所述第二主板与所述第二中框，所述第二连接件为第二螺钉或第二插销。这样，借助于螺钉和插销的导电功能和主板与中框的固定连接作用，将主板的接地端与螺钉或插销连接，可以将各个主板的接地端与对应中框连接，可以减少同一主体中不同主板接地端连通所需的导线数量。进一步地，中框体积大阻抗低，更充分地满足整机回流的阻抗要求，减少热损耗，保证电池电量的充分释放。
在一种可能是实施方式中，所述第一主板与所述第一中框固定，包括：所述第一主板通过焊接、螺钉或插销与所述第一中框固定；所述第一主板的接地端电连接所述第一中框，包括：所述第一主板的接地端通过弹片和/或导线电连接所述第一中框；所述第二主板与所述第二中框固定，包括：所述第二主板通过焊接、螺钉或插销与所述第二中框固定；所述第二主板的接地端电连接所述第二中框，包括：所述第二主板的接地端通过弹片和/或导线电连接所述第二中框。这样，焊接、螺钉或插销可以在主板和中框之间进行机械结构的固定，单另通过导线或者弹片的方式将主板接地端与中框连接，保证整机地回流的阻抗，以减少热损耗，保证电池电量的充分释放。
在一种可能是实施方式中，第一FPC包括电源线和数据控制线；所述数据控制线包括摄像线路和屏幕信号线。这样，第一FPC可以完成电源、摄像信号和屏幕信号的传输。
在一种可能是实施方式中，第一FPC包括地线。这样，整机可以包括至少两个穿轴FPC的回流路径，可以降低不同主体之间地回流的阻抗，减少热损耗，保证电池电量充分释放。此外，地线可以直接通过第二FPC进行回流，分担第一FPC的厚度，可以整个减少电池厚度方向空间的占用，增加电池电量。FPC厚度减小，可以减少穿轴的弯折半径，提高FPC整体弯折寿命。
在一种可能是实施方式中，第一FPC不包括地线。
在一种可能是实施方式中，在所述第二FPC还包括天线信号走线的情况下，所述天线信号走线连接所述第一主板和所述第四主板。这样，所述第二FPC还包括天线信号走线时，需要将天线信号传输到主板，保证设计的灵活性和方案的可实现性。
在一种可能是实施方式中，第一FPC为两层或一层走线。这样，减少FPC层数，降低整体的FPC厚度，增加穿轴FPC弯折半径以提高FPC板寿命，减少对整机厚度方向上的空间占用，还可优化电池空间。
在一种可能是实施方式中，第二FPC为两层或一层走线。这样，减少FPC层数，降低整体的FPC厚度，增加穿轴FPC弯折半径以提高FPC板寿命，减少对整机厚度方向上的空间占用，还可优化电池空间。
在一种可能是实施方式中，第一FPC为三层及三层以上层。
在一种可能是实施方式中，第二FPC为三层及三层以上层。
在一种可能是实施方式中，所述转轴包括第一转动组件、第二转动组件和第三转动组件；所述第二转动组件处于所述第一转动组件和所述第三转动组件之间；所述第一转动组件和所述第二转动组件之间存在第一转轴间隙；所述第二转动组件和所述第三转动组件之间存在第二转轴间隙；所述转轴的所述第一转动组件、所述第二转动组件和所述第三转动组件用于活动连接所述第一中框和所述第二中框。这样，多个转动组件中的转轴间隙空间有限，借助多个转轴间隙的走线穿轴，增加FPC的数量以减少FPC的厚度，提高FPC弯折寿命的同时，减少FPC厚度方向占用空间，减少对整机厚度方向上的空间占用，还可优化电池空间。
在一种可能是实施方式中，所述第一主体还包括第一电池，所述第二主体还包括第二电池，所述第一电池固定在所述第一中框一侧；所述第二电池固定在所述第二中框一侧；所述第二FPC连接所述第一主板和所述第四主板的情况下，所述第二FPC部分、所述第一电池与所述第一中框在所述终端设备的厚度方向上叠加在一起；所述第二FPC部分、所述第二电池与所述第二中框在所述终端设备的厚度方向上叠加在一起。这样，中框、电池和FPC在可折叠设备的厚度方向上叠加，FPC层数的增加会导致电池厚度降低，电池容量小。上述引入第二PFC使得穿轴FPC整体厚度降低，减少对整机厚度方向空间的占用，以增加电池厚度，电池更容量大。
在一种可能是实施方式中，所述第一主体包括第一电池；所述第二主体还包括第二电池，所述第一电池固定在所述第一中框上；所述第二电池固定在所述第二中框上，所述第一FPC部分与所述第二电池在所述终端设备的厚度方向上叠加在一起。这样，中框、电池和FPC在可折叠设备的厚度方向上叠加，FPC层数的增加会导致电池厚度降低，电池容量小。上述引入第二PFC使得穿轴FPC整体厚度降低，减少对整机厚度方向空间的占用，以增加电池厚度，电池更容量大。
第二方面，本申请提供一种电路回流系统，所述电路回流系统包括上述第一方面的可折叠设备中的任一一项。
附图说明
图1是本申请实施例提供的一种可折叠设备的折叠态结构示意图；
图2是本申请实施例提供的一种可折叠设备的展开态结构示意图；
图3是本申请实施例提供的一种可折叠设备的空间结构示意图；
图4是本申请实施例提供的一种可折叠设备的在展开态的拆分结构图；
图5是本申请实施例提供的一种可折叠设备的剖面结构示意图；
图6是本申请实施例提供的一种可折叠设备的剖面结构示意图；
图7是本申请实施例提供的一种可折叠设备中FPC的横截面结构示意图；
图8是本申请实施例提供的一种可折叠设备在展开态的拆分结构图；
图9是本申请实施例提供的一种第一主板地线通过螺钉与第一中框连接的结构示意图；
图10是本申请实施例提供的一种可折叠设备的在展开态的拆分结构图；
图11是本申请实施例提供的一种第一柔性电路板和第二柔性电路板横截面示意图；
图12是本申请实施例提供的另一种可折叠设备的在展开态的拆分结构图；
图13是本申请实施例提供的一种第二柔性电路板横截面示意图。
具体实施方式
在本申请的实施例中，采用了“第一”、“第二”等字样对功能和作用基本相同的相同项或相似项进行区分。例如，第一芯片和第二芯片仅仅是为了区分不同的芯片，并不对其先后顺序进行限定。本领域技术人员可以理解“第一”、“第二”等字样并不对数量和执行次序进行限定，并且“第一”、“第二”等字样也并不限定一定不同。
需要说明的是，本申请实施例中，“示例性的”或者“例如”等词用于表示例子、例证或说明。本申请中被描述为“示例性的”或者“例如”的任何实施例或设计方案不应被解释为比其它实施例或设计方案更优选或更具优势。确切而言，使用“示例性的”或者“例如”等词旨在以具体方式呈现相关概念。
本申请实施例提出一种可折叠设备，增加回流路径，可以降低不同主体之间地回流阻抗，减少整机热损耗，保证电池电量充分释放。
为了方便理解本申请实施例的方案，以下对可折叠设备的结构进行介绍：
图1是本申请实施例示例性地公开的一种可折叠设备的折叠态结构示意图。如图1所示，可折叠设备处于完全折叠态或者近完全折叠态。图2是本申请实施例示例性地公开的一种可折叠设备的展开态结构示意图。如图2所示，可折叠设备处于完全展开态或者近完全展开态。图3是本申请实施例示例性地公开的一种可折叠设备的空间结构示意图。
为了便于描述，将可折叠设备100的宽度方向定义为X方向，将可折叠设备100的长度方向定义为Y方向，将可折叠设备100的厚度方向定义为Z方向。X方向、Y方向和Z方向两两相互垂直。
可折叠设备100包括但不限于手机(cellphone)、笔记本电脑(notebook computer)、平板电脑(tablet personal computer)、膝上型电脑(laptop computer)、个人数字助理(personal digital assistant)、可穿戴式设备(wearable device)或车载设备(mobile device)等。本申请实施例中，以可折叠设备100为手机为例进行说明。
如图1和图2所示，可折叠设备100可以包括第一主体110、第二主体120和转轴130。转轴130位于第一主体110和第二主体120之间，即第一主体110和第二主体120通过转轴130转动连接，从而使得第一主体110和第二主体120进行折叠和展开。
在图1中，第一主体110和第二主体120以转轴130为轴朝着相互远离的方向转动，即第一主体110朝着11a方向转动，第二主体120朝着11b方向转动，在第一主体110和第二主体120转动至距离最远的位置，如图2所示，可折叠设备处于完全展开态或者近完全展开态。
在图2中，第一主体110和第二主体120以转轴130为轴朝着相互接近的方向转动，即第一主体110朝着22a方向转动，第二主体120朝着22b方向转动，在第一主体110和第二主体120转动至距离最近的位置，如图1所示，可折叠设备处于完全折叠态或者近完全折叠态。
如图2所示，转轴130可以包括第一转动组件131、第二转动组件133和第三转动组件135。第一转动组件131、第二转动组件133、第三转动组件135沿Y方向依次间隔排布。其中，第二转动组件133位于第一转动组件131和第三转动组件135之间。其中，相邻两转动组件之间存在转轴间隙，即第一转动组件131与第二转动组件133之间存在第一转轴间隙132，第二转动组件133与第三转动组件135之间存在第二转轴间隙134。在其他实施例中，转动组件两个、四个或者五个以上。本申请对转动组件的数量不做具体限制。其中，转轴130可以是转轴结构或铰链结构等。
可折叠设备100还可以包括第一中框111、第二中框121、第一后盖141、第二后盖142和显示屏150。第一主体110包括第一中框111、第一后盖141和显示屏150第一部分；第二主体120包括第二中框121、第二后盖142和显示屏150第二部分。
其中，第一中框111、第二中框121可以作为可折叠设备100的结构承载部件。第一中框111、第二中框121可以用于安装显示屏150、第一后盖141等其他部件。显示屏150可以覆盖在第一中框111、第二中框121和转轴130的一面，第一后盖141覆盖在第一中框111第二中框121的另一面；第二后盖142覆盖在第二中框121的另一面。即沿可折叠设备100的厚度方向，显示屏150和后盖分别连接在中框的相背两侧。第一中框111、显示屏150、第一后盖141配合围设出可折叠设备的第一收容空间；第二中框121、显示屏150和第二后盖142配合围设出可折叠设备的第二收容空间。收容空间可以用于容纳可折叠设备的处理器、电路板、电池等电子元件以及结构元件。
如图3所示，可折叠设备100示例性地可以包括第一电池161、第二电池162、第一主板171、第二主板172、第三主板173和第四主板174。其中，第一主体110包括第一电池161、第一主板171和第三主板173；第二主体120包括第二电池162、第二主板172和第四主板174。其中，第一收容空间可以包括第一电池161、第一主板171和第四主板174。第一收容空间可以包括第二电池162、第三主板173和第二主板172。其中，第一收容空间和第二收容空间中电池和主板的数量、大小以及位置布局等仅仅是示例性说明，本申请实施例对此不限定。
需要说明的是，图3中，为了说明不同模块结构，将各个模块进行二维化示意，即显示屏150、电池、主板、中框、转轴130、第一后盖141和第二后盖142在Z轴厚度方向上没有具体画出来，但是实际的具体器件是存在一定厚度的。
需要说明的是，图1～图3示意的结构并不构成对可折叠设备100的具体限定。在本申请实施例的另一些实施例中，可折叠设备100可以包括比图示更多或更少的部件，或者组合某些部件，或者拆分某些部件，或者不同的部件布置。例如，可折叠设备100还可以包括摄像模组以及闪光灯等器件。
上述图1～图3中，不同主板之间需要进行电连接，才能实现在可折叠设备100的基本功能。第一中框111的第一收容空间中的主板需要与第二中框121中的第二收容空间中的主板进行电连接。第一中框111和第二中框121之间可以设有柔性电路板(Flexible Printed Circuit，FPC)，柔性电路板可以穿过转动组件两侧的转轴间隙(或者是两相邻转动组件之间的转轴间隙)，连接两个不同中框位置的主板，从而可以传输电源信号，完成整机接地回流，还可以传输其他信号。上述连接之后，使得可折叠设备能够正常运行，实现对应功能。下面针对于上述柔性电路板穿过转轴间隙的线路连接方式，结合图4～图7具体说明：
图4～图7是本申请实施例说明的一种不同主板之间的电路连接示意图。其中，图4是一种可折叠设备的在展开态的拆分结构图。图5是图4中切割面1的剖面结构示意图；图6是图4中切割面2中剖面结构示意图。图7是图4中FPC的横截面结构示意图。
如图4所示，为了方便说明的第一收容空间和第二收容空间中主板和电池的布局情况，图4以X轴和Y轴所在的面(XOY面)为例进行说明，图4中包括XOY面上各个部件的布局连接关系。
结合图3中的主板和电池布局，第一中框111的第一收容空间中包括第一主板171、第三主板173和第一电池161。第二中框121的第二收容空间中包括第二主板172、第二电池162和第四主板174。其中，中框、收容空间、主板、电池、转轴组件和转轴间隙等结构以及器件的描述可以参考图3的相关内容，此处不再赘述。
如图4所示，中框置于主板和电池的下面(此时，中框被覆盖，不可见)，为了将各个主板固定其底部的中框上，每个主板需要至少通过一个螺钉将主板与中框进行固定连接。图4中，螺钉311、螺钉312、螺钉313、螺钉314和螺钉315连接第一主板171与第一中框111。螺钉311、螺钉312、螺钉313、螺钉314和螺钉315的位置可以分别位于的第一主板171的五个不同的位置，保证连接的稳定性。当然，各主板与中框之间的连接所使用的螺钉数量可以不同。第二主板172通过四个螺钉与第一中框连接，第三主板和第四主板可以均通过两个螺钉与中框连接，本申请对各个主板与中框连接的螺钉数量和螺钉位置均不限定。其他主板与中框的连接可以参考第一主板中螺钉的连接方法，不再赘述。
如图4所示，可折叠设备100还可以包括柔性电路板FPC321，柔性电路板FPC321可以连接第一主板171和第二主板172。具体地，柔性电路板FPC321可以穿过第一转轴间隙132，经过第二电池162的一侧(FPC321和第二电池162一侧在可折叠设备厚度方向上叠加在一次)，连接第一主板171和第二主板172。柔性电路板FPC321的第一端连接第一主板171，第二端连接第二主板172。其中，柔性电路板FPC321可以包括电源线、接地线和其他线路。电源线可以传输电源信号，提供电压。接地线可以传输接地信号，使得电源信号完成回流。其他线路可以传输其他信号，例如，电源路可以包括Vph_pwr(主电源电路)、Vbus(充电电路)、Vbat(电池电路)等。其他线路可以包括前置摄像头走线、麦克风走线、屏幕IC走线和天线开关信号等。其中，其他线路具体线路布局与整机电路布局有关，本申请对此不限定。
如图4所示，为了穿过转轴，FPC321需要穿过转轴间隙，第一主板171和第二主板172的大小又不同。因此，FPC线路在XOY面需要经过转弯，才能进行连接。因此，为了进一步清楚的说明图4中的FPC连接情况，分别在转弯前后的切割面1、切割面2，以及FPC横截面上分别说明线路结构，即下面通过图5～图7的切面图分别说明在厚度方向上的结构。
进一步地，图4中，所有主板的地线需要连通，形成可折叠设备100完整整机的信号的回流。如图4所示，第一主板171可以通过FPC321与第二主板172连接；第一主板171可以通过导线322与第三主板173连接；第二主板172可以通过导线323与第四主板174连接。其中，FPC321、导线322和导线323均可以包括地线、电源线和其他走线，具体的走线种类与设备的具体硬件布局有关，本申请对此不限定。其中，导线323、导线322和导线323也可以是FCB，也可以是其它类型的走线，本申请不限定。
如图5所示，在图4中的切割面1所在面上，第二电池162和第二主板172置于第二中框121同侧，且处于第二收容空间。
第二主板172与第二中框121通过螺钉连接。其中，主板(第二主板172)包括印刷电路板(Printed Circuit Board，PCB)，多个元器件和屏蔽罩等。多个元器件可以(例如，芯片、电感等等)焊接在PCB板上，元器件之间连接相互配合实现不同功能。屏蔽罩也固定在PCB板上，可以屏蔽外部干扰信号，减少电磁辐射，加强主板强度等。PCB印刷电路板可以通过螺钉与第二中框121固定连接，即螺钉的一端穿孔经过PCB，另一端固定在第二中框121中。
PCB板可以通过连接器与FPC线路连接，FPC线路从第二电池162的一侧走线，经过转弯，经过到第一转轴间隙132。其中，连接器固定在第二主板172的一侧，连接器的一端连接PCB板。可选地，在本申请实施例中，PCB板也可以通过焊接的方式与FPC线路连接，本申请对PCB板与FPC线路的连接方式不限定。
如图6所示，在图4中的切割面2所在面上，电池和螺钉在Z轴和Y轴所在面上的分布情况。在第一转轴间隙132区域，FPC线路发生(多次)弯折。如图6所示，转轴空隙两端分别近邻第一主板171和第二电池162。FPC走线在第一主板的一侧之后，经过固定后发生两次完折，穿孔后继续发生两次弯折，再次固定后继续经过第二电池的一侧，之后如图5所示连接第二主板172。上述过程中可折叠设备可以在转轴区域FPC线路发生多次弯折。在FPC层数小，厚度较小的情况下，弯折半径较大；在FPC厚度较大的情况下，弯折半径较小。FPC的一端连接第一主板171，穿过第一转轴间隙132之后，位于第二电池162的一侧。之后FPC需要经过转弯连接到第二主板172上。具体描述可以参考图5的相关描述内容，不赘述。穿轴过程中FPC发生弯折，FPC越厚，弯折半径越小，FPC的寿命越小。
图7是FPC的横截面示意图。如图7所示，FPC线路包括电源线、地线和其他走线3种线路。电源线(例如，Vbus充电路径)用于供电；接地线用于完成整机线路回流。其他线路可以提供不同主体之间传输电信号。FPC线路一共包括三层，其中，由于所需的整机回流的阻抗小，地线信号的要求高。然而，由于转轴中，转动组件所占空间大，转轴缝隙的宽度很窄，导致FPC不能增加宽度，FPC的走线资源较多，需要增加FPC的层数，FPC较厚，占用整机厚度方向上空间，不利于整机的结构布局。此外，三层的FPC线路约为0.162mm，其弯折半径为0.69mm，弯折寿命在243805次左右。因此，增加FPC层数来减少阻抗不可行。
图4～图7的可折叠设备中，通过FPC走线单个穿轴连接两个主体的主板来完成整机回流。柔性电路板FPC包括电源线、接地线和其他线路。因此，两个主体之间的接地回流路径均是通过一个穿轴柔性电路板中的接地线实现回流路径，然而，由于转动组件之间的转轴缝隙空间有限，电子设备无法无限量地增加柔性电路板FPC层数来减少回流阻抗，因此，使得接地回流阻抗较大，热损耗严重，电池电量无法充分释放。此外，由于穿轴间隙在Y轴方向的宽度有限，为了满足整机回流阻抗的要求，需要增加FPC走线层数，层数增加占用了可折叠设备在厚度方向上的空间，挤占了整机在厚度方向上的空间，电池在厚度方向上空间减少，电池容量会变少。此外，FPC走线的层数增加，厚度增加，也会减少弯折半径，会引入FPC走线的可靠性和弯折寿命等问题。进一步地，FPC走线厚度增加、弯折半径减少，增加FPC线路顶屏的风险。另外，FPC连接两主板也需要增加引脚BTB PIN的数量，FPC BTB的位置常常在主板的布局核心位置，会占用更多的主板布局资源。
基于上述问题，本申请提出一种可折叠设备。可折叠设备包括第一主体、第二主体和转轴，第一主体和第二主体通过转轴连接，可折叠设备能够在转轴处被折叠；第一主体包括第一中框和第一主板，第二主体包括第二中框和第二主板；第一主板与第一中框固定；第二主板与第二中框固定；第一主板的接地端电连接到所述第一中框；第二主板的接地端电连接到第二中框；可折叠设备包括第一柔性电路板FPC和第二FPC；第一FPC穿过转轴连接第一主板和第二主板；第二FPC穿过转轴连接第一主体的接地端和第二主体的接地端。这样，借助于第二FPC走线连接第一主体和第二主体的接地端，以及主板的接地端连接到所在主体的中框，增加穿轴FPC的回流路径，可以降低不同主体之间接地回流的阻抗，减少热损耗，保证电池电量的充分释放。此外，可以减少整机上的FPC层数，降低FPC厚度，增加穿轴FPC弯折半径以提高FPC板寿命，减少整机厚度上的空间占用，还可优化电池空间。
在一些实施例中，第二FPC的一端连接第一中框或者第一主体中主板的接地端；第二FPC的另一端连接第二中框或者第二主体中主板的接地端。
在一些实施例中，第二FPC穿过转轴连接第一中框和第二中框。
结合上述技术方案和实施例本申请提出图8～图13说明可折叠设备的回流线路布局情况。
图8是本申请实施例示例性地公开的一种可折叠设备在展开态的拆分结构图。
可折叠设备可以包括第一中框111、第二中框121、转轴130、第一电池161、第二电池162、第一主板171、第二主板172、第三主板173、第四主板174、第一转动组件131、第二转动组件133和第三转动组件135。其中，上述模块和器件的布局方式和结构可以参考图3和图4中的相关描述，不赘述。
可折叠设备所包括的每一个主板的接地端至少通过一个螺钉与中框固定连接。即可以理解为，每个主板的地线引脚(接地端)至少有一个设置于螺钉处。例如，第一主板171通过螺钉311、螺钉312、螺钉313、螺钉314和螺钉315一共五个螺钉与第一中框111固定连接。其中，第一主板171的地线引脚可以设置于螺钉311、螺钉312、螺钉313、螺钉314和螺钉315中至少一个螺钉处，保证第一主板171的地线与第一中框111导通。
其中，螺钉为导电材质，例如金属等。中框也是导电材质，例如，铝合金，钛合金等材质。借助于螺钉固定连接中框与各个主板的结构，螺钉与各个主板的接地端连接，且螺钉与中框连接，此时各个主板的接地端可以通过螺钉与中框导通。此外，将第一中框和第二中框连接之后，使得各个主板的接地端导通，形成整机接地回流路径。
可选地，中框与主板接地端的之间的电连接方式可以是螺钉，还可以是插销或者焊接等当时进行连接，本申请对此不限定。
可选地，中框与主板之间的固定连接方式可以是螺钉、插销或者焊接等，中框与主板接地端的之间的电连接方式可以是导线(例如，FPC等、金属线)或者弹片(弹片为导体)等。
示例性地，如图9所示是本申请实施例提出的一种第一主板地线通过螺钉与第一中框连接的结构示意图。如图9所示，第一主板171包括PCB板、屏蔽罩和多个元器件等。其中，一个螺钉穿孔经过PCB板的地线引脚，连接到第一中框111。由于螺钉和中框均为导体，因此中框可以与第一主板的地线连通。需要说明的是，图9仅仅是以一个螺钉为例连接地线，可以是过多个螺钉连接地线，本申请不限定。
其中，可折叠设备包括第一柔性电路板411和第二柔性电路板412(与图4不同)。其中，第一柔性电路板411位于第一转动组件131和第二转动组件133之间；第二柔性电路板412位于第二转动组件133和第三转动组件135之间。可选地，本申请实施例中，可折叠设备包括转动组件的数量可以是一个、两个、四个或者更多。第一柔性电路板411和第二柔性电路板412可以连接与至少一个转动组件两侧(或者一侧)的转轴缝隙，进行穿轴，本申请对穿轴FPC的具体位置不限定。上述过程，借助于第二FPC走线连接第一主体和第二主体的接地端，增加的回流路径，可以降低不同主体之间地回流的阻抗，减少热损耗，保证电池电量充分释放。
需要说明的是，固定连接和电连接为两种不同的含义的连接。固定连接是一种机械结构上的连接。电连接是用于导通电信号的连接。本申请实施例中，螺钉(或者插销、焊接方式等)作为一种机械连接件，可以固定同一主体上主体和中框的位置，即螺钉、焊接和插损均存在固定连接主板和中框的作用。此外，螺钉、焊接和插损均是导体，螺钉、焊接和插损的一端若连接主板上的接地端，即可以作为接地信号的回流路径，此时，螺钉、焊接和插损也存在电连接的作用。
上述每个主体中所有主板接地端通过中框连接，可以减少同一主体中不同主板接地端连通所需的导线数量。且中框体积大阻抗低，更充分地满足整机地回流的阻抗要求，减少热损耗，保证电池电量的充分释放。
其中，第一柔性电路板411两端的连接结构可以参考图4中柔性电路板321的相关描述，具体可以参考图4～图6的相关描述，此处不再赘述。
其中，第一主体接地端包括第一主板171的接地端、第三主板173的接地端和第一中框111其中至少一个；第二主体接地端包括第二主板172的接地端、第四主板174的接地端和第二中框121其中至少一个。
此外，图8中第一柔性电路板和第二柔性电路板所包括的走线不同，主板间的连接线路不同，形成的回流路径也不同，下面在图8的基础上通过两个实施例分别说明第二FPC的连接情况：
【实施例一】第二柔性电路板两端连接不同主体的两主板。
一种可能的实施方式中，第二柔性电路板FPC412的两端连接第一主板171和第四主板174，第二柔性电路板412包括地线和第一数据控制线(可以包括天线信号线等)。第一柔性电路板411包括电源线和第二数据控制线(可以包括屏幕显示线、摄像头线路等)。其中，第一柔性电路板411中可以包括或者不包括地线。具体结合图10和图11说明第一柔性电路板411和第二柔性电路板412的具体连接，以及电源回流路径以及其他信号的路径情况。
图10是本申请实施例示例性地公开的一种可折叠设备的在展开态的拆分结构图。如图10所示，第二柔性电路板412的一端连接第一主板171，另一端连接第四主板174。具体地，第二柔性电路板412的一端从连接到第一主板171开始，经过第一电池161的一侧(第一电池，第二FPC以及中框在可折叠设备厚度方向上叠加)，穿轴经过第二转动组件133和第三转动组件135中间的转轴间隙，继续经过第二电池162的一侧，经过转弯连接到第四主板174。
上述的连接结构中，借助于第二FPC走线连接第一主体和第二主体的接地端，增加回流路径，可以降低不同主体之间地回流的阻抗，减少整机热损耗，保证电池电量充分释放。
在图10的连接结构中，第二柔性电路板412可以包括地线和其他信号。第一柔性电路板411可以包括电源线和第一数据控制线。可选地，第一柔性电路板411可以包括或不包括地线。
示例性地，图11是本申请实施例公开的一种第一柔性电路板和第二柔性电路板横截面示意图。图11中的(a)和(b)示出了第一柔性电路板的横截面示意图。图11中的(a)中，第一柔性电路板包括电源线和第一数据控制线，不包括地线。在图11中的(b)中，第二柔性电路板包括电源线、第一数据控制线和地线。图11中的(c)中，第二柔性电路板的可以包括地线和第二数据控制线。其中，第一柔性电路板从图4中的三层变为两层，经过测量FPC板厚度从0.162mm变化到0.122mm，厚度减少25％，制造成本降低40％。在FPC板厚度变为两层之后，转轴间隙中FPC板的弯折半径大，弯折寿命可以提升几万次。同时，也可以减少FPC顶屏或者异响的情况，提高可折叠设备的寿命。可选地，第一柔性电路板还可以是一层。可选地，第一柔性电路板可以为三层。
由于每个主板所包括的器件不同，连接方式和电源充电，接地路径等均有所不同。以下以图10为例说明的走线连接情况和信号路径。
首先说明各个主板的器件模块。第一主板包括第一电源管理单元PMU和第一SC等器件模块。第二主板172可以包括第二PMU和第二SC等。第三主板173可以包括Type C模块和过压保护OVP模块。其中，TypeC模块与OVP模块通过第三主板173连接。
电源管理单元(Power Management Unit，PMU)是一种用于管理和控制设备的电能供应和功耗的芯片，作为一种集成电路，可以通过对电源的有效管理，从而实现最佳的电能管理和功能控制。PMU可以连接电池将电池电能进行管理，并向可折叠设备的其他模块进行供电。如图10所示，第一电池161可以通过bat1走线512分别连接第一PMU和第一电池开关(switching charger，SC)芯片。第二电池162可以通过bat2走线513分别连接第二PMU和第二SC。
可选地，Type C接口模块具备外接充电器向电池和PMU充电的功能，以及连接外部器件的OTG功能(可折叠设备需要向Type C接口模块供电)。Type C接口模块连接OVP模块后，需要通过Vbus连接到第一PMU和第二PMU，以及第一SC和第二SC。第一SC和第二SC对充电器的电压转化为适于向电池充电的电压，外接充电器时，Type C模块需向第一SC和第二SC，以及第一PMU和第二PMU供电。第一主板171和第三主板173通过Vbus走线511连接。Vbus走线511。第一主板171中Vbus走线511与第一PMU和第一SC连接。进一步地Vbus走线511连接第一FPC(中的电源线)的一端；第一FPC(中的电源线)的另一端连接第二主板172的第二PMU和第二SC。上述连接中，可折叠设备外接充电器，通过Type C接口模块可以向第一PMU和第二PMU，以及第一SC和第二SC供电。在OTG功能开启的情况下，第一PMU或第二PMU可以向Type C接口模块供电。
可选地，第四主板174连接天线金属辐射枝节。第四主板174需要将天线信号向第一主板171传输。因此，连接第一主板171和第四主板174中的其他线路可以包括天线信号线路，用于传输天线信号。
上述线路连接中，在可折叠设备连接充电器的情况下，TypeC接口模块可以通过第一SC向第一电池161充电，通过第二SC向第二电池162充电。下面以可折叠设备连接充电器为例，说明充电过程中的回流路径。第一主板171和第三主板173的接地端均通过螺钉与第一中框111相连接；第二主板172和第四主板174的接地端均通过螺钉与第二中框121相连接；第二柔性电路板412穿轴与地线第一主板171和第二主板172的接地端相连接。在充电过程中，回流路径为从第二主板172到第二中框121再到第二柔性电路板412再到第一主板171，进而第一主板171流经第一中框111到第三主板173的充电端，完成回流。上述各个主板的接地端均连接中框，回流路径增加，中框阻抗低，回流路径的阻抗更小，热损耗小，电池电量释放更加充分，地回流更理想。其中，TypeC接口模块仅仅是一种示例性地接口类型的，还可以是其它接口类型，此处不限定。
可选地，在第一柔性电路板411也包括地线的情况下，回流路径还包括第二主板172到第一柔性电路板411到第一主板171再到第一中框111，之后第一中框111到第三主板173的路径，完成另一种路径的回流过程。
需要说明的是，上述的各个主板还可以包括其他器件和模块，本申请对此不限定。
可选地，在实施例一中，第二柔性电路板412的两端可以分别连接第一中框111和第二中框121中任一主板，本申请仅仅限定两主板分别位于两个中框，不限定主板的位置和大小等。例如，第二柔性电路板412的两端可以分别连接第三主板173和第四主板174，此时，第一主板171和第三主板173之间走线可以包括天线信号的走线。
【实施例二】第二柔性电路板两端至少有一端连接一中框，另一端连接另一中框或另一中框中的主板。
另一种可能的实施方式中，第二柔性电路板412的两端连接第一中框111和第二中框121，第二柔性电路板412包括地线，不包括其他的线路和电源线。第一柔性电路板411包括电源线和第一数据控制线。其中，第一柔性电路板411中可以包括或者不包括地线。具体结合图12和图13说明第一柔性电路板411和第二柔性电路板412的具体连接情况。
图12是本申请实施例示例性地公开的另一种可折叠设备的在展开态的拆分结构图。如图12所示，第二柔性电路板412的一端连接第一中框111，另一端连接第二中框121。在图12的连接结构中，第二柔性电路板412可以包括地线，不包括其他类型的线路(第二数据控制线)。第一柔性电路板411可以包括电源线和第一数据控制线。可选地，第一柔性电路板411可以包括或不包括地线。
上述的连接结构中，借助于第二FPC走线连接第一主体和第二主体的接地端，增加回流路径，可以降低不同主体之间地回流的阻抗，减少整机热损耗，保证电池电量充分释放。
示例性地，图13是本申请实施例公开的一种第二柔性电路板横截面示意图。图13中的，第二柔性电路板包括地线。需要说明的是，实施例二中第一柔性电路板411可以参考图11中(a)和(b)的相关描述，不赘述。其中，第二柔性电路板为两层，可选地，第二柔性电路板可以为一层或三层。
在图12中与图10中第二柔性电路板412不同的是，第二柔性电路板412仅仅包括地线不包括其他线路，此时，第四主板174向第一主板171传输天线信号，需要通过第二主板172进行传输。如图12所示，天线信号走线514可以将天线信号从第四主板174传输到第二主板172，第二主板172可以继续通过第一柔性电路板411中的其他走线将天线信号传输到第一主板171。此外，图12中，第一PMU、第二PMU、第一SC、第二SC、TypeC模块、OVP模块和电池的连接与充电时回流路径均可以参考上述图10和图11的相关描述，不赘述。
可选地，图12实施中，第二柔性电路板412的一端连接第一中框111，另一端连接第四主板174；或者第二柔性电路板412的一端连接第二中框121，另一端连接第一主板171。
可选地，在又一种可能的实施例中，不同与实施例1和实施例2，第二FPC包括地线和第二数据控制线(例如，天线信号走线等)。其中，第二FPC的地线两端连接第一中框和第二中框，第二FPC的第二数据控制线(例如，天线信号走线等)两端连接分别位于第一主体和第二主体中的两主板。
上述图8、图10和图12中，增加了一个第二FPC，两个FPC，一个FPC将第四主板的信号从第二主板连接到第一主板，另一个FPC将回流地连通回流路径。上述可折叠设备中，借助于第二FPC走线连接第一主体和第二主体的接地端，增加回流路径，可以降低不同主体之间地回流的阻抗，减少热损耗，保证电池电量充分释放。此外，借助于中框进行接回流，由于中框阻抗小，能够导通各个主板的结构特性，增加一个穿轴FPC板，减少FPC板线路层数，在设备整体上的厚度，为电池提供更多厚度方向上的空间，保证回流路径完整且稳定的同时，优化整机的结构和设置，提高电池性能，以及提高穿轴线路的可靠性。因此，提高可折叠设备的质量。
一种可能的实施方式中，可折叠设备还可以包括第三主体，第二主体与第三主体之间可以通过另一个转轴转动连接。第二主体与第三主体之间的FPC走线可以参考上述图4～图12中任一一种第一主体和第二主体之间FPC布局情况，不再赘述。此时，可折叠设备为三折设备，可折叠设备还可以更多折设备，本申请不限定。
一种可能的实施方式中，可折叠设备还可以包括第三FPC，第三FPC也可以连接第一主体的接地端和第二主体的接地端。第一主体的接地端可以第一主体中主板接地端和第一中框中的至少一种。第二主体的接地端可以第二主体中主板接地端和第二中框中的至少一种。第三FPC可以参考第二FPC的连接方式，此处不赘述。上述，FPC走线可以包括两个或以上，本申请不限定。
在上述实施例中，可以全部或部分地通过软件、硬件、固件或者其任意组合来实现。当使用软件实现时，可以全部或部分地以计算机程序产品的形式实现。所述计算机程序产品包括一个或多个计算机指示。在计算机上加载和执行所述计算机程序指示时，全部或部分地产生按照本申请实施例所述的流程或功能。所述计算机可以是通用计算机、专用计算机、计算机网络、或者其它可编程装置。所述计算机指示可以存储在计算机可读存储介质中，或者从一个计算机可读存储介质向另一个计算机可读存储介质传输，例如，所述计算机指示可以从一个网站站点、计算机、服务器或数据中心通过有线(例如同轴电缆、光纤、数字用户线)或无线(例如红外、无线、微波等)方式向另一个网站站点、计算机、服务器或数据中心进行传输。所述计算机可读存储介质可以是计算机能够存取的任何可用介质或者是包含一个或多个可用介质集成的服务器、数据中心等数据存储设备。所述可用介质可以是磁性介质，(例如，软盘、硬盘、磁带)、光介质(例如DVD)、或者半导体介质(例如固态硬盘)等。

Claims (12)

  1. 一种可折叠设备，其特征在于，其中：
    所述可折叠设备包括第一主体、第二主体和转轴，所述第一主体和所述第二主体通过所述转轴连接，所述可折叠设备能够在所述转轴处被折叠；所述第一主体包括第一中框和第一主板，所述第二主体包括第二中框和第二主板；
    所述第一主板与所述第一中框固定；所述第二主板与所述第二中框固定；所述第一主板的接地端电连接到所述第一中框；所述第二主板的接地端电连接到所述第二中框；
    所述可折叠设备包括第一柔性电路板FPC和第二FPC；所述第一FPC穿过所述转轴连接所述第一主板和所述第二主板；所述第二FPC穿过所述转轴连接所述第一主体的接地端和所述第二主体的接地端。
  2. 根据权利要求1所述的可折叠设备，其特征在于，所述第二FPC的一端连接所述第一中框或者所述第一主体中主板的接地端；所述第二FPC的另一端连接所述第二中框或者所述第二主体中主板的接地端。
  3. 根据权利要求2所述的可折叠设备，其特征在于，所述第一主体还包括第三主板；所述第二主体还包括第四主板，所述第三主板与所述第一中框固定；所述第四主板与所述第二中框固定，所述第三主板的接地端电连接所述第一中框；所述第四主板的接地端电连接所述第二中框；所述第一主体接地端包括所述第一主板的接地端、所述第三主板的接地端和所述第一中框其中至少一个；所述第二主体接地端包括所述第二主板的接地端、所述第四主板的接地端和所述第二中框其中至少一个。
  4. 根据权利要求1或2所述的可折叠设备，其特征在于，所述第二FPC穿过所述转轴连接所述第一主体的接地端和所述第二主体的接地端，包括：
    所述第二FPC穿过所述转轴连接所述第一中框和所述第二中框。
  5. 根据权利要求1-4任一项所述的可折叠设备，其特征在于，所述第一主板与所述第一中框固定；所述第一主板的接地端电连接所述第一中框，包括：
    所述第一主板通过第一连接件电连接所述第一中框；所述第一连接件电连接所述第一主板的接地端；所述第一连接件固定所述第一主板与所述第一中框，所述第一连接件为第一螺钉或第一插销；
    所述第二主板与所述第二主板固定；所述第二主板的接地端电连接所述第二中框，包括：
    所述第二主板通过第二连接件电连接所述第二中框；所述第二连接件电连接所述第二主板的接地端；所述第二连接件固定所述第二主板与所述第二中框，所述第二连接件为第二螺钉或第二插销。
  6. 根据权利要求1-4任一项所述的可折叠设备，其特征在于，所述第一主板与所述第一中框固定，包括：所述第一主板通过焊接、螺钉或插销与所述第一中框固定；
    所述第一主板的接地端电连接所述第一中框，包括：所述第一主板的接地端通过弹片和/或导线电连接所述第一中框；
    所述第二主板与所述第二中框固定，包括：所述第二主板通过焊接、螺钉或插销与所述第二中框固定；
    所述第二主板的接地端电连接所述第二中框，包括：所述第二主板的接地端通过弹片和/或导线电连接所述第二中框。
  7. 根据权利要求1-6任一项所述的可折叠设备，其特征在于，第一FPC包括电源线和数据控制线；所述数据控制线包括摄像线路和屏幕信号线。
  8. 根据权利要求1-7任一项所述的可折叠设备，其特征在于，第一FPC包括地线。
  9. 根据权利要求3所述的可折叠设备，其特征在于，在所述第二FPC还包括天线信号走线的情况下，所述天线信号走线连接所述第一主板和所述第四主板。
  10. 根据权利要求1-9任一项所述的可折叠设备，其特征在于，第一FPC为两层或一层走线。
  11. 根据权利要求1-10任一项所述的可折叠设备，其特征在于，第二FPC为两层或一层走线。
  12. 根据权利要求1-11任一项所述的可折叠设备，其特征在于，所述转轴包括第一转动组件、第二转动组件和第三转动组件；所述第二转动组件处于所述第一转动组件和所述第三转动组件之间；所述第一转动组件和所述第二转动组件之间存在第一转轴间隙；所述第二转动组件和所述第三转动组件之间存在第二转轴间隙；所述转轴的所述第一转动组件、所述第二转动组件和所述第三转动组件用于活动连接所述第一中框和所述第二中框。
PCT/CN2025/090825 2024-06-07 2025-04-24 一种可折叠设备 Pending WO2025251802A1 (zh)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024022140A1 (zh) * 2022-07-25 2024-02-01 华为技术有限公司 可折叠电子设备
US20240073307A1 (en) * 2021-05-07 2024-02-29 Samsung Electronics Co., Ltd. Flexible circuit board and foldable electronic device comprising same
WO2024067215A1 (zh) * 2022-09-28 2024-04-04 荣耀终端有限公司 可折叠电子设备

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20240073307A1 (en) * 2021-05-07 2024-02-29 Samsung Electronics Co., Ltd. Flexible circuit board and foldable electronic device comprising same
WO2024022140A1 (zh) * 2022-07-25 2024-02-01 华为技术有限公司 可折叠电子设备
WO2024067215A1 (zh) * 2022-09-28 2024-04-04 荣耀终端有限公司 可折叠电子设备

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