WO2025246790A1 - 一种封装结构的清洗装置及清洗方法 - Google Patents

一种封装结构的清洗装置及清洗方法

Info

Publication number
WO2025246790A1
WO2025246790A1 PCT/CN2025/092330 CN2025092330W WO2025246790A1 WO 2025246790 A1 WO2025246790 A1 WO 2025246790A1 CN 2025092330 W CN2025092330 W CN 2025092330W WO 2025246790 A1 WO2025246790 A1 WO 2025246790A1
Authority
WO
WIPO (PCT)
Prior art keywords
cleaning
packaging structure
module
clamping unit
lower cavity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/CN2025/092330
Other languages
English (en)
French (fr)
Inventor
麻森朋
赵悦
贾照伟
杨宏超
陆陈华
王坚
王晖
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ACM Research Shanghai Inc
Original Assignee
ACM Research Shanghai Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ACM Research Shanghai Inc filed Critical ACM Research Shanghai Inc
Publication of WO2025246790A1 publication Critical patent/WO2025246790A1/zh
Pending legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

Definitions

  • This application relates to the field of semiconductor packaging technology, specifically to a cleaning apparatus and cleaning method for a packaging structure.
  • SoC system-on-chip
  • heterogeneous chip design proposes breaking down a large system into several smaller systems, fabricating each of these smaller systems into individual chips, or even standard chips, and then re-integrating these chips onto a single carrier using soldering processes in packaging technology.
  • Each chip is stably connected to the carrier via bumps, achieving performance that may even surpass that of a SoC.
  • flux such as rosin
  • the packaged structure needs to be cleaned to remove residual flux, preventing it from adversely affecting subsequent packaging processes and thus impacting product yield.
  • the purpose of this application is to provide a cleaning device and method for packaging structures, which immerses the packaging structure in a cleaning solution to effectively remove flux residues within the packaging structure.
  • a cleaning device with a packaged structure includes an upper cavity module, a lower cavity module, and a control module, wherein the control module is connected to the upper cavity module and the lower cavity module respectively;
  • the upper cavity module is movably mounted on the lower cavity module.
  • the upper cavity module is used to cover the lower cavity module to form a closed chamber, and the upper cavity module is used to spray cleaning fluid onto the packaging structure to be cleaned.
  • the lower cavity module includes a retaining wall unit, a lifting mechanism, a clamping unit, and a lower cavity.
  • the retaining wall unit is fixedly installed on the bottom surface of the lower cavity.
  • the lifting mechanism is used to drive the clamping unit to move up and down.
  • the clamping unit is installed in the lower cavity and is used to clamp the packaging structure.
  • the control module is configured to control the lifting mechanism to lower the clamping unit and the clamped packaging structure to the process position. At this time, the clamping unit and the baffle unit together form a liquid storage chamber, which is used to accumulate the cleaning fluid to soak the packaging structure.
  • This application also provides a cleaning method for a packaging structure, including:
  • Step S100 The control module keeps the clamping unit in the initial position and places the package structure to be cleaned on the clamping unit;
  • Step S200 The upper cavity module is closed onto the lower cavity module to form a sealed chamber
  • Step S300 The clamping unit descends from the initial position to the process position, and the upper cavity module sprays cleaning fluid onto the packaging structure;
  • Step S400 Immerse the encapsulation structure in the cleaning solution within the liquid storage chamber for a predetermined time.
  • the cleaning apparatus provided in this application has a baffle unit fixedly installed in the lower cavity, and the upper cavity module covers the lower cavity module to form a closed chamber.
  • the clamping unit and the baffle unit together form a liquid storage chamber.
  • the upper cavity module sprays cleaning fluid onto the packaging structure, the liquid storage chamber stores the cleaning fluid.
  • the packaging structure continues to be immersed in the cleaning fluid in the liquid storage chamber, thereby cleaning the packaging structure more effectively and thoroughly.
  • Figure 1 is a perspective view of the cleaning device of the present invention.
  • Figure 2 is a cross-sectional view of the cleaning device of the present invention.
  • Figure 3 is a cross-sectional view of the cleaning device when the clamping unit of the present invention is in the initial position.
  • Figure 4 is a cross-sectional view of the cleaning device when the clamping unit of the present invention is in the process position.
  • Figure 5 is a flowchart of the cleaning method for the packaging structure.
  • connection should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components.
  • connection should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components.
  • the cleaning device includes a lower chamber module 1, an upper chamber module 2, an air extraction pipe (not shown), and a control module 5 connected to both the lower chamber module 1 and the upper chamber module 2.
  • the upper chamber module 2 is movably connected to the lower chamber module 1 and is movably mounted on the lower chamber module 1.
  • the air extraction pipe is mounted on the lower chamber module 1.
  • the upper chamber module 2 is driven down and covers the lower chamber module 1 to form a closed chamber.
  • An external air pump can be used to extract gas from the closed chamber through the air extraction pipe, creating a negative pressure within the closed chamber.
  • the upper chamber module 2 sprays cleaning fluid to clean the encapsulation structure.
  • the cleaning fluid can better penetrate the gaps in the encapsulation structure, thereby achieving a better cleaning effect.
  • the cleaning fluid includes, but is not limited to, deionized water and liquids containing saponifying agents.
  • the composition of the cleaning fluid can be selected according to the actual process.
  • the lower cavity module 1 includes a retaining wall unit 11, a lifting mechanism 12, a rotating mechanism 13, a magnetic fluid seal 14, a clamping unit 15, a lower cavity body 16, a cavity base plate 17, an elastic conduit 18, and an elastic conduit support 19.
  • the lower cavity body 16 is mounted on the cavity base plate 17.
  • the lower cavity body 16 and the cavity base plate 17 can be fixed, with the upper cavity module 2 descending and covering the lower cavity module 1 to form a closed chamber.
  • the upper cavity module 2 can also be fixed, with the lower cavity module 1 moving upward to close with the upper cavity module 2 to form a closed chamber.
  • the lower end 18a of the elastic conduit 18 is fixed to the bottom of the lower cavity body 16, and the upper end 18b of the elastic conduit 18 is fixed to the elastic conduit support 19.
  • the clamping unit 15 is used to clamp the encapsulation structure.
  • the elastic conduit 18 is a corrugated pipe.
  • the retaining wall unit 11 is fixedly installed inside the lower cavity 16.
  • the retaining wall unit 11 includes a surrounding wall 111, a chassis 112, and a support base 113.
  • the surrounding wall 111 has a ring structure and is installed on the chassis 112.
  • the upper end of the support base 113 is installed on the chassis 112, and the lower end of the support base 113 is fixedly connected to the bottom of the lower cavity 16.
  • the support base 113 is columnar, and the elastic tube 18 extends and retracts within the support base 113, while the elastic tube support member 19 moves up and down within the elastic tube 18.
  • the lifting mechanism 12 includes a second drive source 121, a lifting shaft 122, and a base 123.
  • the lifting shaft 122 is located at the output end of the second drive source 121, and the base 123 is located at one end of the lifting shaft 122.
  • the second drive source 121 drives the lifting shaft 122 and the base 123 to move up and down.
  • the second drive source 121 can be a cylinder.
  • the magnetic fluid seal 14 includes an inner shaft 141 and an outer ring 142, with the outer ring 142 fitted around the outer circumference of the inner shaft 141.
  • the outer ring 142 is connected to the bottom of the base 123, and the lower end of the elastic conduit support 19 is connected to the top of the base 123.
  • the outer ring 142, base 123, and elastic conduit support 19 are integrated into one unit, and the second drive source 121 drives the outer ring 142, base 123, and elastic conduit support 19 to rise and fall together.
  • the rotating mechanism 13 includes a first drive source 131 and a rotating shaft 132, with the rotating shaft 132 located at the output end of the first drive source 131.
  • the first drive source 131 can be a motor.
  • the lower end of the inner shaft 141 of the magnetohydrodynamic seal is located at the output end of the rotating shaft 132, and the upper end of the inner shaft 141 of the magnetohydrodynamic seal is connected to the bottom of the clamping unit 15. Therefore, the first drive source 131 drives the inner shaft 141 of the magnetohydrodynamic seal and the clamping unit 15 to rotate, and the inner shaft 141 of the magnetohydrodynamic seal and the clamping unit 15, along with their encapsulation structure, rotate together with the rotating shaft 132.
  • the outer ring 142 of the magnetohydrodynamic seal is disposed on the outer periphery of the inner shaft 141 of the magnetohydrodynamic seal.
  • the outer ring 142 of the magnetohydrodynamic seal rises and falls, it drives the inner shaft 141 of the magnetohydrodynamic seal to rise and fall, thereby driving the first drive source 131 and the rotating shaft 132 to rise and fall. That is, when the second drive source 121 is working, the base 123, the rotating mechanism 13, the magnetohydrodynamic seal 14, the clamping unit 15, and the elastic pipeline support 19 rise and fall simultaneously.
  • the clamping unit 15 includes a support column 153, a clamping plate 151, and three clamping members 152 disposed on the clamping plate 151.
  • the clamping members 152 are used to clamp the packaging structure.
  • the clamping plate 151 is disposed on the support column 153.
  • the support column 153 is connected to the upper end of the inner shaft 141 of the magnetohydrodynamic seal.
  • the support column 153 moves up and down within the elastic tubing support 19.
  • the bottom surface of the clamping plate 151 is provided with an annular protrusion 1511.
  • a first drain hole is provided on the support base 113, and a second drain hole is provided at the bottom of the lower cavity 16.
  • a drain chamber is formed between the support base 113 and the outer periphery of the elastic pipe 18. The first drain hole is connected to the lower cavity 16 and the drain chamber.
  • the encapsulation structure when the encapsulation structure needs cleaning, according to one embodiment of this application, the encapsulation structure is placed on the clamping unit 15, the upper cavity module 2 is driven down and covers the lower cavity module 1 to form a closed chamber, the second drive source 121 drives the lifting shaft 122 down, and the base 123 and the rotating mechanism 13 descend with the lifting shaft 122.
  • the base 123 moves, the magnetohydrodynamic seal 14 and the clamping unit 15 descend with the base 123, and the clamping unit 15, carrying the encapsulation structure, descends from the initial position (shown in FIG. 3) to the process position (shown in FIG.
  • the sealed chamber is evacuated to create a negative pressure.
  • the upper chamber module 2 then sprays the packaged structure with cleaning fluid. During spraying, the cleaning fluid accumulates in the reservoir 4. After spraying, the cleaning fluid covers the packaged structure, which is then immersed in the reservoir 4 under negative pressure. Setting the immersion environment to negative pressure reduces the surface tension of the cleaning fluid, improves its diffusion ability, and allows it to penetrate more easily into the gaps of the packaged structure, spreading evenly between bumps and between the chip and the carrier.
  • the second drive source 121 drives the lifting shaft 122 to rise.
  • the magnetohydrodynamic seal 14 and the clamping unit 15 rise with the base 123.
  • the clamping unit 15, carrying the packaging structure rises from the process position to the initial position and disengages from the support base 113.
  • the cleaning fluid accumulated in the liquid storage chamber 4 begins to drain and empty.
  • the elastic tubing support 19 rises, the elastic tubing 18 is stretched.
  • the elastic conduit 18 and the elastic conduit support 19 are columnar structures to prevent corrosion of the magnetic fluid seal 14 when the cleaning fluid is drained.
  • a certain gap is preset between the top of the elastic conduit support 19 and the bottom of the clamping unit 15 to avoid interference between the clamping unit 15 and the elastic conduit support 19 when the clamping unit 15 rotates.
  • the first drive source 131 drives the inner shaft 141 of the magnetohydrodynamic seal and the clamping unit 15 to rotate together.
  • the packaging structure rotates with the clamping unit 15, using the centrifugal force generated by the rotation to remove the cleaning fluid from the clamping unit 15 and the packaging structure, thereby drying the packaging structure.
  • a drying gas e.g., N2
  • N2 is blown onto the packaging structure to remove the cleaning fluid from the surface of the packaging structure, achieving rapid drying. Removing the cleaning fluid from the surface of the packaging structure through the drying process facilitates its entry into the next process, while preventing the cleaning fluid from contaminating the process environment of the next process, thus improving process safety and stability.
  • the upper cavity module 2 when the encapsulation structure is in its initial position, the upper cavity module 2 is driven down and covers the lower cavity module 1 to form a closed chamber.
  • the closed chamber is evacuated to create a negative pressure state, and the upper cavity module 2 performs the first spraying operation on the encapsulation structure. After the first spraying, the vacuum in the closed chamber is broken, restoring it to normal pressure.
  • the clamping unit 15, carrying the encapsulation structure descends from the initial position (shown in Figure 3) to the process position (shown in Figure 4) and abuts against the inner circumference of the support base 113, thus forming a liquid storage chamber 4.
  • the closed chamber is evacuated again to create a negative pressure state, and the upper cavity module 2 performs a second spraying operation on the encapsulation structure.
  • the cleaning fluid accumulates in the liquid storage chamber 4.
  • the cleaning fluid covers the encapsulation structure, and the encapsulation structure is completely immersed in the cleaning fluid in the liquid storage chamber 4.
  • the vacuum in the closed chamber is broken, restoring it to normal pressure.
  • the clamping unit 15, carrying the packaging structure rises from the process position to the initial position for the drying process.
  • the clamping unit 15, carrying the packaging structure rises from the process position back to the initial position, and the upper cavity module 2 performs a third spraying operation on the packaging structure under normal pressure.
  • a drying process is then performed.
  • the third spraying operation can also be performed under negative pressure.
  • the packaging structure when the packaging structure is in its initial position, after the cleaning fluid is sprayed onto the packaging structure, the packaging structure is kept still for a preset time to allow the cleaning fluid to enter the gaps in the packaging structure and soak and clean the contaminants in the gaps, which helps to promote the complete cleaning of residual contaminants.
  • the sealed chamber is not limited to a negative pressure state; for example, it can also be in a normal pressure state.
  • the upper chamber module 2 first performs a spraying operation on the packaging structure. During the spraying process, the cleaning fluid accumulates in the liquid storage chamber 4. After the spraying is completed, the cleaning fluid covers the packaging structure, and then the sealed chamber is evacuated to make the pressure inside the sealed chamber negative. The packaging structure is immersed in the liquid storage chamber 4 under negative pressure, effectively cleaning the packaging structure.
  • the sealed chamber is not limited to maintaining a negative pressure state; for example, it can also be under normal pressure.
  • the upper chamber module 2 performs the spraying operation on the encapsulation structure
  • the sealed chamber is not limited to maintaining a negative pressure state.
  • the clamping unit 15 can move the encapsulation structure up and down under either negative pressure or normal pressure. It should be understood that, to further ensure the cleaning effect, during the cleaning process, the encapsulation structure can be sprayed multiple times in its initial position to ensure the cleaning effect. The number of repetitions can be selected according to process requirements.
  • the cavity base plate 17 is provided with four guide posts 171, and the rotating mechanism 13 is slidably mounted on the guide posts 171 through the connector.
  • the rotating mechanism 13 can smoothly rise and fall along the guide posts 171, thereby enabling the clamping unit 15 to drive the entire packaging structure to rise and fall smoothly, effectively avoiding the situation where the clamping unit 15 tilts during rise and fall.
  • a first sealing ring is provided on the outer surface of the annular protrusion 1511. After the packaging structure is lowered to the process position, the first sealing ring abuts against the inner surface of the support base 113. The first sealing ring is used to seal the gap between the barrier unit 11 and the clamping unit 15 to prevent the cleaning fluid from leaking.
  • the lower surface of the base 123 is provided with an annular second sealing ring.
  • the second sealing ring elastically abuts against the cavity bottom plate 17.
  • the second sealing ring is used to prevent external gas from entering the closed cavity.
  • the upper surface of the base 123 is provided with an annular third sealing ring.
  • the third sealing ring elastically abuts against the bottom of the lower cavity 16. The third sealing ring is used to prevent external gas from entering the closed cavity.
  • the lifting mechanism 12 includes at least two second drive sources 121, which are respectively disposed on the cavity base plate 17.
  • the control module 5 drives the at least two second drive sources 121 to work synchronously, and the clamping unit 15 drives the entire packaging structure to lift smoothly, effectively avoiding the situation where the clamping unit 15 tilts during lifting.
  • the cleaning device also includes at least two third drive sources 3, which are respectively disposed on the cavity bottom plate 17.
  • the upper cavity module 2 is disposed at the output end of the third drive source 3.
  • the control module 5 drives the at least two third drive sources 3 to work synchronously.
  • the third drive sources drive the upper cavity module 2 to rise and fall.
  • the upper cavity module 2 rises and falls smoothly as a whole, effectively avoiding the situation where the upper cavity module 2 tilts during rise and fall.
  • the package structure includes a carrier and at least one chiplet, which is flip-chip bonded to the carrier via bumps.
  • the chiplet when the chiplet is flip-chip bonded to the carrier, most of the flux evaporates at high temperatures, but some flux and other contaminants still remain in the gaps between the chiplet and the carrier, as well as in the gaps between the bumps.
  • the control module 5 changes the pressure of the sealed chamber, for example, by breaking the vacuum environment of the sealed chamber.
  • the pressure change in the sealed chamber causes the cleaning fluid on the surface of the packaging structure to enter the gaps between the chip and the carrier, as well as the gaps between the bumps.
  • the cleaning fluid in the gaps oscillates back and forth, which can better eliminate small air bubbles between the cleaning fluid and the flux, increase the effective contact area between the cleaning fluid and the flux, and improve the cleaning effect.
  • the pressure inside the sealed cavity can be further reduced to cause a change in the pressure of the cavity, so that the cleaning fluid in the liquid storage chamber 4 can oscillate back and forth in the gap between the chip and the carrier and in the gap between the bumps.
  • the pressure inside the closed chamber can change continuously or intermittently.
  • the pressure inside the closed chamber can rise from negative pressure to normal or positive pressure, or drop from positive pressure to normal or negative pressure. Pressure fluctuations inside the closed chamber will cause the cleaning fluid in the gaps to oscillate, thereby improving the cleaning effect.
  • the cleaning fluid is prone to generating bubbles because the pressure inside the sealed chamber is greater than the pressure outside.
  • the pressure change inside the sealed chamber is performed by de-vacuuming to atmospheric pressure or while maintaining a negative pressure state. Furthermore, periodic fluctuations in the pressure of the sealed chamber can more effectively improve the soaking and cleaning effect.
  • the cleaning device of this embodiment adds a baffle unit 11 inside the lower cavity 16.
  • the baffle unit 11 includes a surrounding wall 111, a chassis 112, and a support base 113.
  • the upper cavity module 2 covers the lower cavity module 1 to form a closed chamber.
  • the clamping unit 15 abuts against the inner surface of the support base 113 and together with the surrounding wall 111 and the chassis 112, forms a liquid storage chamber 4.
  • the upper cavity module 2 sprays cleaning fluid onto the encapsulation structure
  • the closed chamber maintains a negative pressure state.
  • the liquid storage chamber 4 stores cleaning fluid. After the spraying is completed, the entire encapsulation structure continues to be immersed in the liquid storage chamber 4, which more effectively and thoroughly cleans the encapsulation structure.
  • this application also proposes a cleaning method for the packaging structure, the cleaning method for the packaging structure including:
  • Step S100 The control module keeps the clamping unit in the initial position and places the package structure to be cleaned on the clamping unit.
  • the packaging structure to be cleaned is placed on the clamping unit 15, at which time the air pressure in the upper cavity module 2 and the lower cavity module 1 is at normal pressure.
  • Step S200 The upper cavity module is closed onto the lower cavity module to form a sealed chamber.
  • the cleaning device also includes two third drive sources 3, which are respectively set on the bottom plate 17 of the cavity.
  • the upper cavity module 2 is set at the output end of the third drive source 3.
  • the control module 5 drives the two third drive sources 3 to work synchronously.
  • the third drive source 3 drives the upper cavity module 2 to rise and fall.
  • the upper cavity module 2 is driven to fall and cover the lower cavity module 1 to form a closed cavity.
  • Step S300 The clamping unit descends from the initial position to the process position, and the upper cavity module sprays cleaning fluid onto the packaging structure.
  • the sealed chamber can be evacuated to create a negative pressure.
  • the upper chamber module 2 then sprays the packaging structure with cleaning fluid, which accumulates in the storage chamber 4 during the spraying process. It should be noted that the spraying operation mentioned in this application is not limited to a negative pressure environment; for example, it can also be performed under normal pressure.
  • Step S400 Immerse the encapsulation structure in the cleaning solution within the liquid storage chamber for a predetermined time.
  • the cleaning fluid covers the encapsulation structure, maintaining a negative pressure inside the sealed cavity.
  • the encapsulation structure is completely immersed in the cleaning fluid in the reservoir 4 under negative pressure, effectively cleaning the encapsulation structure.
  • the following step is further included: when the encapsulation structure is in its initial position, the upper cavity module 2 sprays cleaning fluid onto the encapsulation structure.
  • the sealed chamber is first evacuated to make the pressure inside the sealed chamber negative, or the upper cavity module 2 sprays cleaning fluid onto the encapsulation structure first, and then the sealed chamber is evacuated to make the pressure inside the sealed chamber negative; the encapsulation structure is kept stationary for a preset time to allow the cleaning fluid to enter the gaps in the encapsulation structure and clean the encapsulation structure.
  • Evacuating the sealed chamber removes residual gas from the packaging structure, ensuring that every crevice of the package is filled with cleaning fluid, thus guaranteeing effective cleaning.
  • setting the cleaning environment to negative pressure after spraying the cleaning fluid reduces the surface tension of the cleaning fluid, enhancing its diffusion capacity. This allows the cleaning fluid to penetrate more easily into the crevice of the package and diffuse evenly between bumps and between the chip and the carrier. Maintaining the package structure static under negative pressure for a preset time allows sufficient time for air bubbles to escape from the package and for the cleaning fluid to penetrate, resulting in even better cleaning.
  • the packaging structure can be either kept stationary or rotated at a predetermined speed.
  • the predetermined speed in this application can be a relatively low speed; for example, the predetermined speed is less than or equal to 600 rpm. Selecting a stationary state or rotating at a low speed effectively prevents the cleaning fluid from being directly ejected from the packaging structure due to the greater centrifugal force at high speeds, effectively avoiding the situation where the cleaning fluid is ejected from the packaging structure before effectively entering the gaps for cleaning.
  • the above-mentioned packaging structure when the above-mentioned packaging structure is in the initial position, it also includes: spraying cleaning fluid onto the packaging structure again, and during the spraying of cleaning fluid, changing the pressure in the sealed cavity at least once; and after the pressure stops changing, keeping the packaging structure stationary for a preset time.
  • the force on the cleaning fluid changes, resulting in a change in position. This makes it easier for the cleaning fluid to enter the gaps in the packaging structure, dissolve the contaminants, and thus facilitate the complete cleaning of the contaminants, further improving the cleaning effect.
  • the number of pressure changes within the sealed chamber can be selected based on actual process requirements, and this application does not impose a specific limit. It should be understood that, to improve cleaning efficiency, the number of pressure changes can be as high as possible. This allows the cleaning fluid to accelerate its entry into the gaps of the encapsulation structure as the ambient pressure within the sealed chamber continuously changes. After the cleaning fluid has completely dissolved the contaminants, it is then rapidly discharged from the encapsulation structure.
  • the pressure within the sealed chamber fluctuates periodically, with the pressure inside the sealed chamber in a negative pressure state both before and after the pressure change.
  • the cleaning method also includes step S500: the clamping unit is raised from the process position to the initial position; S600: a drying process, which includes: introducing gas into the sealed chamber to make the gas pressure in the sealed chamber reach atmospheric pressure, rotating the packaging structure under atmospheric pressure, and/or blowing dry gas into the packaging structure.
  • the first drive source 131 drives the inner shaft 141 of the magnetohydrodynamic seal and the clamping unit 15 to rotate together.
  • the encapsulation structure rotates with the clamping unit 15, and the centrifugal force generated by the rotation is used to shake off the cleaning liquid on the clamping unit 15 and the encapsulation structure to dry the encapsulation structure.
  • a drying gas e.g., N2
  • N2 a drying gas
  • step S500 further includes the upper cavity module spraying cleaning fluid onto the packaging structure to clean the packaging structure after the clamping unit returns from the process position to the initial position.
  • step S500a is further included between step S500 and step S600: evacuating the sealed chamber to bring the pressure inside the sealed chamber to a negative pressure; spraying cleaning fluid onto the packaging structure from the upper cavity module; keeping the packaging structure stationary for a preset time to allow the cleaning fluid to enter the gaps in the packaging structure and clean it.
  • steps S500a to S600 can be repeated multiple times.
  • step S500a is performed after step S600, and step S600 is performed again after step S500a, and the process of repeating step S500a to step S600 is repeated multiple times.
  • step S400 when immersing the packaging structure, the control module changes the pressure of the sealed chamber at least once.
  • the pressure change in the sealed chamber causes the cleaning fluid on the surface of the packaging structure to penetrate into the gaps between the chip and the carrier, as well as the gaps between the bumps.
  • the cleaning fluid in the gaps oscillates back and forth, which can better eliminate small air bubbles between the cleaning fluid and the flux, increase the effective contact area between the cleaning fluid and the flux, and improve the cleaning effect.
  • the pressure within the sealed chamber can vary continuously or intermittently.
  • the sealed chamber is maintained under negative pressure, and the pressure within the sealed chamber fluctuates periodically.

Landscapes

  • Cleaning By Liquid Or Steam (AREA)

Abstract

一种封装结构的清洗装置及清洗方法，用于清洗半导体封装结构，该清洗装置包括上腔模块（1）、下腔模块（2）和与上腔模块（1）、下腔模块（2）分别连接的控制模块（5）。上腔模块（1）盖合在下腔模块（2）上形成封闭腔室，且上腔模块（1）喷淋清洗液至待清洗的封装结构上。下腔模块（2）包括挡墙单元（11）、升降机构（12）、夹持单元（14）和下腔体（16），挡墙单元（11）固定设置在下腔体（16）的底面，升降机构（12）带动夹持单元（14）升降，夹持单元（14）设置在下腔体（16）内，夹持单元（14）用于夹持封装结构。其中，控制模块（5）被配置为：控制升降机构（12）带动夹持单元（14）及所夹持的封装结构下降至工艺位置时，夹持单元（14）与挡墙单元（11）共同形成蓄液腔，蓄液腔用于蓄积清洗液以浸泡封装结构，充分清洗封装结构。该清洗装置能充分有效地清除封装结构内助焊剂残留。

Description

一种封装结构的清洗装置及清洗方法 技术领域
本申请涉及半导体封装技术领域，具体为一种封装结构的清洗装置及清洗方法。
背景技术
系统级芯片(SoC，system-on-chip)是将一个复杂的大系统全部集成在一颗大芯片中。与系统级芯片的理念不同，芯粒异构提出将一个大系统拆分成若干个小系统，将各个小系统分别制作成小芯片，甚至是做成标准小芯片，再将这些小芯片通过封装技术中的焊接工艺重新集成在同一个载体上，每一个小芯片均通过若干凸点与载体稳定连接，达到甚至比系统级芯片更好的性能。在芯片进行封装的过程中，会采用助焊剂(例如松香)，以提高小芯片与载体之间焊接的可靠性。在焊接结束后，需要对完成焊接后的封装结构进行清洗，去除残留的助焊剂，避免残留的助焊剂对后续封装工序产生不良影响，进而影响产品良率。
随着封装密度的进一步提高，封装结构的尺寸不断缩小，芯片与载体之间的缝隙以及凸点与凸点之间的缝隙也会变得更小，清洗液进入芯片和载体之间的微小间隙更加困难，因此传统的大气压下高水压对缝冲洗已不再适用。因此亟需一种有效清除封装结构内助焊剂残留的清洗装置及清洗方法。
发明内容
针对上述存在的问题，本申请的目的在于提供一种封装结构的清洗装置及清洗方法，使封装结构浸泡在清洗液中，能够有效清除封装结构内助焊剂残留。
为实现上述目的，本申请提供如下技术方案：
一种封装结构的清洗装置，包括上腔模块、下腔模块和控制模块，其中，所述控制模块与所述上腔模块、所述下腔模块分别连接；
所述上腔模块活动设置在所述下腔模块上，所述上腔模块用于盖合在所述下腔模块上以形成封闭腔室，并且所述上腔模块用于喷淋清洗液至待清洗的封装结构上；
所述下腔模块包括挡墙单元、升降机构、夹持单元和下腔体，所述挡墙单元固定设置在所述下腔体的底面，所述升降机构用于带动所述夹持单元升降，所述夹持单元设置在所述下腔体中，所述夹持单元用于夹持所述封装结构；
所述控制模块被配置为：控制所述升降机构带动所述夹持单元及所夹持的封装结构下降至工艺位置，此时，所述夹持单元与所述挡墙单元共同形成蓄液腔，所述蓄液腔用于蓄积所述清洗液以浸泡所述封装结构。
本申请还提供一种封装结构的清洗方法，包括：
步骤S100：控制模块保持夹持单元在初始位置，将待清洗的封装结构放置在夹持单元上；
步骤S200：上腔模块盖合在下腔模块上形成封闭腔室；
步骤S300：夹持单元由初始位置下降至工艺位置，上腔模块向封装结构喷洒清洗液；
步骤S400：使封装结构在蓄液腔内的清洗液中浸泡预定时间。
与现有技术相比，本申请具有以下有益效果：
本申请提供的清洗装置在下腔体内固定设置有挡墙单元，上腔模块盖合在下腔模块上形成封闭腔室。封装结构随夹持单元由初始位置下降至工艺位置时，夹持单元与挡墙单元共同形成蓄液腔，上腔模块喷淋清洗液至封装结构时，蓄液腔储存清洗液，待喷淋结束，封装结构继续浸泡在蓄液腔中的清洗液内，从而更加有效充分地清洗封装结构。
附图概述
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其它的附图。
图1为本发明清洗装置的立体图。
图2为本发明清洗装置的剖视图。
图3为本发明夹持单元在初始位置时清洗装置的剖视图。
图4为本发明夹持单元在工艺位置时清洗装置的剖视图。
图5为封装结构的清洗方法的流程图。
本申请的较佳实施方式
以下由特定的具体实施例说明本发明的实施方式，本领域技术人员可由本说明书所揭示的内容轻易地了解本发明的其他优点及功效。虽然本发明的描述将结合较佳实施例介绍，但这并不代表此发明的特征仅限于该实施方式。恰恰相反，结合实施方式作发明介绍的目的是为了覆盖基于本发明的权利要求而有可能延伸出的其它选择或改造。为了提供对本发明的深度了解，以下描述中将包含许多具体的细节。本发明也可以不使用这些细节实施。此外，为了避免混乱或模糊本发明的重点，有些具体细节将在描述中被省略。需要说明的是，在不冲突的情况下，本发明中的实施例及实施例中的特征可以相互组合。
应注意的是，在本说明书中，相似的标号和字母在下面的附图中表示类似项，因此，一旦某一项在一个附图中被定义，则在随后的附图中不需要对其进行进一步定义和解释。
下面将结合附图对本发明的技术方案进行清楚、完整地描述，显然，所描述的实施例是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
在本发明的描述中，需要说明的是，术语“中心”、“上”、“下”、“左”、“右”、“竖直”、“水平”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本发明的限制。此外，术语“第一”、“第二”、“第三”仅用于描述目的，而不能理解为指示或暗示相对重要性。
在本发明的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本发明中的具体含义。
为使本发明的目的、技术方案和优点更加清楚，下面将结合附图对本发明的实施方式作进一步地详细描述。
参阅图1和图2，本申请实施例提供一种清洗装置。清洗装置包括下腔模块1、上腔模块2、抽气管路(未示出)以及与下腔模块1、上腔模块2分别连接的控制模块5。上腔模块2与下腔模块1活动连接，上腔模块2活动设置在下腔模块1上，抽气管路设置在下腔模块1上。需要清洗封装结构时，上腔模块2被驱下降并盖合在下腔模块1上形成封闭腔室，可以借助外部的抽气泵，通过抽气管路抽取封闭腔室内的气体，使封闭腔室内的压力为负压。例如，当封闭腔室内的压力为负压时，上腔模块2喷淋清洗液清洗封装结构，清洗液能够更好地进入封装结构的缝隙内，以此达到更优的清洗效果。其中，清洗液包括但不限于去离子水、含皂化剂的液体等，清洗液的组成成分可以根据实际工艺进行选择。
进一步参阅图3，下腔模块1包括挡墙单元11、升降机构12、旋转机构13、磁流体密封件14、夹持单元15、下腔体16、腔体底板17、弹性管路18和弹性管路支撑件19。下腔体16设置在腔体底板17上。本实施例中可以将下腔体16和腔体底板17设置为固定不动，由上腔模块2下降并盖合在下腔模块1上形成封闭腔室。可以理解的是，在其他实施例中，也可以将上腔模块2设置为固定不动，由下腔模块1向上运动与上腔模块2闭合形成封闭腔室。弹性管路18的下端18a固定在下腔体16的底部，弹性管路18的上端18b固定在弹性管路支撑件19上。夹持单元15用于夹持封装结构。本实施例中弹性管路18选用波纹管。
挡墙单元11固定设置在下腔体16内。具体的，挡墙单元11包括围墙111、底盘112和支撑座113，围墙111为环形结构，围墙111设置在底盘112上，支撑座113的上端设置在底盘112上，支撑座113的下端和下腔体16的底部固定连接。支撑座113呈柱状体，弹性管路18在支撑座113内伸缩，弹性管路支撑件19在弹性管路18内上下移动。
升降机构12包括第二驱动源121、升降轴122和基座123，升降轴122设置在第二驱动源121的输出端，基座123设置在升降轴122的一端，第二驱动源121驱动升降轴122和基座123升降。第二驱动源121可以为气缸。
磁流体密封件14包括磁流体密封件内轴141和磁流体密封件外圈142，磁流体密封件外圈142套设在磁流体密封件内轴141的外周。磁流体密封件外圈142和基座123的底部连接，弹性管路支撑件19的下端和基座123的顶部连接。磁流体密封件外圈142、基座123、弹性管路支撑件19连接为一体，第二驱动源121驱动磁流体密封件外圈142、基座123、弹性管路支撑件19共同升降。
旋转机构13包括第一驱动源131和旋转轴132，旋转轴132设置在第一驱动源131的输出端。第一驱动源131可以为电机。磁流体密封件内轴141的下端设置在旋转轴132的输出端，磁流体密封件内轴141的上端和夹持单元15的底部连接，因此第一驱动源131驱动磁流体密封件内轴141和夹持单元15旋转，磁流体密封件内轴141和夹持单元15带着封装结构随旋转轴132一起旋转。
此外，磁流体密封件外圈142设置在磁流体密封件内轴141的外周，磁流体密封件外圈142升降时，带动磁流体密封件内轴141升降从而带动第一驱动源131和旋转轴132升降。即，第二驱动源121工作时，基座123、旋转机构13、磁流体密封件14、夹持单元15、弹性管路支撑件19同时升降。
进一步地，夹持单元15包括支撑柱153、夹持板151和设置在夹持板151上的三个夹持件152，夹持件152用于夹持封装结构，夹持板151设置在支撑柱153上，支撑柱153与磁流体密封件内轴141的上端连接，支撑柱153在弹性管路支撑件19内上下移动。夹持板151的底面设有环形凸起1511，在封装结构随夹持单元15下降至工艺位置时，环形凸起1511的外表面抵接在支撑座113的内表面，从而夹持单元15与底盘112卡合，围墙111、底盘112、环形凸起1511共同形成蓄液腔4。
支撑座113上开设有第一排液孔，下腔体16的底部开设有第二排液孔，支撑座113与弹性管路18的外周之间形成排液腔，第一排液孔与下腔体16、排液腔连通。夹持单元15从工艺位置升起，蓄液腔4内的清洗液流入排液腔，再经第一排液孔、下腔体16的第二排液孔排到外部。
具体的，需要清洗封装结构时，根据本申请的一个实施例，封装结构放置在夹持单元15上，上腔模块2被驱下降并盖合在下腔模块1上形成封闭腔室，第二驱动源121驱动升降轴122下降，基座123和旋转机构13随升降轴122下降。基座123运动时，磁流体密封件14和夹持单元15随基座123下降，夹持单元15带着封装结构从初始位置(图3所示)下降至工艺位置(图4所示)并抵接在支撑座113的内周上从而使挡墙单元11的围墙111和底盘112与环形凸起1511形成蓄液腔4。同时，弹性管路18的上端18b随弹性管路支撑件19下降。弹性管路18的下端18a是固定不动的，弹性管路支撑件19下降时，弹性管路18恢复自然形状或被压缩。
封装结构降至工艺位置后，对封闭腔室抽气，使封闭腔室内的压力为负压，上腔模块2对封装结构进行喷淋作业，在喷淋过程中，清洗液积蓄在蓄液腔4内。待喷淋结束，清洗液覆盖封装结构，封装结构在负压环境下浸泡在蓄液腔4内。将浸泡环境设定在负压环境下，可以降低清洗液的表面张力，提高清洗液的扩散能力，使清洗液能够更顺利进入封装结构的缝隙中，并能够在凸点与凸点之间、芯片与载体之间的缝隙中均匀地扩散。
待浸泡结束后，向封闭腔室内输入气体，打破封闭腔室的真空环境，使封闭腔室内的气压达到常压，在常压状态下，第二驱动源121驱动升降轴122上升，磁流体密封件14和夹持单元15随基座123上升，夹持单元15带着封装结构从工艺位置上升至初始位置，夹持单元15与支撑座113脱离。在夹持单元15上升的过程中，积蓄在蓄液腔4内的清洗液开始排液并排空。弹性管路支撑件19上升时，弹性管路18被拉长。
本实施例中，弹性管路18和弹性管路支撑件19呈柱状体结构，用于防止清洗液排液时腐蚀磁流体密封件14。弹性管路支撑件19的顶部和夹持单元15的底部之间预设一定间隙以避免夹持单元15旋转时与弹性管路支撑件19发生干涉。
进一步地，封装结构回升至初始位置后，第一驱动源131驱动磁流体密封件内轴141和夹持单元15共同旋转，在常压状态下，封装结构随夹持单元15旋转，利用旋转产生的离心力甩干夹持单元15和封装结构上的清洗液，以对封装结构进行干燥。可选地，在旋转封装结构的同时向封装结构吹扫干燥气体(例如N2)将封装结构表面的清洗液吹扫至封装结构外，以达到快速干燥的目的。通过干燥工序将封装结构表面的清洗液去除，便于封装结构进入下一工艺，同时防止清洗液污染下一工艺的工艺环境，提高工艺安全性和稳定性。
在可选的其他实施方式中，封装结构在初始位置时，上腔模块2被驱下降并盖合在下腔模块1上形成封闭腔室，对封闭腔室抽气，使封闭腔室为负压状态，上腔模块2对封装结构进行第一次喷淋作业。待第一次喷淋结束，对封闭腔室进行破真空，使封闭腔室恢复至常压状态。夹持单元15带着封装结构从初始位置(图3所示)下降至工艺位置(图4所示)并抵接在支撑座113的内周上从而形成蓄液腔4。对封闭腔室再次抽气，使封闭腔室为负压状态，上腔模块2对封装结构进行第二次喷淋作业，在第二次喷淋过程中，清洗液积蓄在蓄液腔4内。待第二次喷淋结束，清洗液覆盖封装结构，封装结构完全浸泡在蓄液腔4内的清洗液中。待浸泡结束后，对封闭腔室进行破真空，使封闭腔室恢复至常压状态。夹持单元15带着封装结构从工艺位置上升至初始位置，进行干燥工序。
进一步地，在浸泡结束后，夹持单元15带着封装结构从工艺位置回升至初始位置，在常压状态下上腔模块2对封装结构进行第三次喷淋作业。接下来再进行干燥工序。可选地，第三次喷淋作业也可在负压状态下进行。
示例性地，封装结构在初始位置时，向封装结构喷洒清洗液完成之后，保持封装结构静止预设时间，使清洗液进入封装结构的缝隙中，对缝隙中的污染物进行浸泡清洗，有助于促进残留的污染物被清洗完全。
在一个可选的实施方式中，封装结构降至工艺位置后，封闭腔室不局限于负压状态，例如也可以是常压状态，上腔模块2先对封装结构进行喷淋作业，在喷淋过程中，清洗液积蓄在蓄液腔4内。待喷淋结束，清洗液覆盖封装结构，再对封闭腔室抽气，使封闭腔室内的压力为负压，封装结构在负压环境下浸泡在蓄液腔4内，有效清洗封装结构。
需要说明的是，上述封装结构浸泡在蓄液腔内的清洗液中时，封闭腔室不局限于保持负压状态，例如，也可以是常压状态。此外，上腔模块2对封装结构进行喷淋作业时，封闭腔室也不局限于保持负压状态。夹持单元15带着封装结构进行升降时可以在负压环境或常压下进行。应当理解的，为了进一步保障清洗效果，在清洗工艺过程中，封装结构在初始位置时，可以选择对封装结构进行多次喷淋作业，以确保清洗效果。重复的次数可以根据工艺要求进行选择。
在一个可选的实施方式中，腔体底板17上设有四个导向柱171，旋转机构13通过连接件滑动设置在导向柱171上，旋转机构13能够沿着导向柱171平稳升降，从而使得夹持单元15带动封装结构整体平稳升降，有效避免夹持单元15倾斜升降的情况。
在一个可选的实施方式中，环形凸起1511的外表面上设有第一密封圈，封装结构下降到工艺位置后，第一密封圈抵接在支撑座113的内表面，第一密封圈用于密封挡墙单元11与夹持单元15之间的缝隙，防止清洗液渗漏。
进一步地，基座123的下表面设有环状的第二密封圈，封装结构在工艺位置时，第二密封圈弹性抵接在腔体底板17上，第二密封圈用于防止外部气体进入封闭腔室。
进一步地，基座123的上表面设有环状的第三密封圈，封装结构在初始位置时，第三密封圈弹性抵接在下腔体16的底部上，第三密封圈用于防止外部气体进入封闭腔室。
在一个可选的实施方式中，升降机构12包括至少两个第二驱动源121，至少两个第二驱动源121分别设置在腔体底板17上，控制模块5驱动至少两个第二驱动源121同步工作，夹持单元15带动封装结构整体平稳升降，有效避免了夹持单元15倾斜升降的情况。
示例性的，清洗装置还包括至少两个第三驱动源3，至少两个第三驱动源3分别设置在腔体底板17上，上腔模块2设置在第三驱动源3的输出端，控制模块5驱动该至少两个第三驱动源3同步工作，第三驱动源驱动上腔模块2升降，上腔模块2整体平稳升降，有效避免上腔模块2倾斜升降的情况。
在芯片进行封装的过程中会采用助焊剂(例如松香)，以提高芯片与载体之间焊接的可靠性。以倒装芯片为例，封装结构包括载体和至少一个小芯片，小芯片通过凸点倒装焊接在载体上。如背景技术所述，小芯片倒装焊接在载体上时，大部分的助焊剂会在高温下挥发，但仍会有部分助焊剂等污染物残留在小芯片和载体之间的缝隙以及凸点与凸点之间的缝隙中。
为了进一步提升封装结构的清洗效果，在一个可选的实施方式中，在浸泡封装结构时，控制模块5改变封闭腔室的压力，例如打破封闭腔室的真空环境，在破真空过程中封闭腔室内的压力的变化使得封装结构表面的清洗液压入小芯片和载体之间的缝隙以及凸点与凸点之间的缝隙中，且由于封闭腔室压力波动使得缝隙内的清洗液实现往复振荡，更能排除清洗液与助焊剂之间的小气泡，增大清洗液与助焊剂之间的有效接触面积，提升清洗效果。
可选地，在浸泡封装结构时，可以继续减小封闭腔室内的压力使得腔室的压力发生变化，使得蓄液腔4的清洗液在小芯片和载体之间的缝隙以及凸点与凸点之间的缝隙中实现往复振荡。
需要说明的是，封闭腔室内的压力可以是连续性变化，或间断性变化，封闭腔室内的压力可以是由负压升至常压或正压，或由正压降至常压或负压，封闭腔室内的压力波动都会使得缝隙内的清洗液实现振荡，从而提升清洗效果。
若封闭腔室破真空至正压，由于封闭腔室内的压力大于封闭腔室外的压力，清洗液容易产生气泡。优选地，封闭腔室破真空至常压或仍保持在负压状态下进行腔室内压力的改变。进一步地，封闭腔室压力采用周期性波动，能更有效提升浸泡清洗效果。
综上，本实施例的清洗装置在下腔体16内增设挡墙单元11，挡墙单元11包括围墙111、底盘112和支撑座113。上腔模块2盖合在下腔模块1上形成封闭腔室，封装结构随夹持单元15下降至工艺位置时，夹持单元15抵接在支撑座113的内表面上与围墙111、底盘112共同形成蓄液腔4，在上腔模块2喷淋清洗液至封装结构时，封闭腔室保持负压状态，上腔模块2喷淋清洗液至封装结构的过程中，蓄液腔4储存清洗液，待喷淋结束，封装结构整体继续浸泡在蓄液腔4内，更加有效充分地清洗封装结构。
对应上述封装结构的清洗装置，本申请还提出一种封装结构的清洗方法，封装结构的清洗方法包括：
步骤S100：控制模块保持夹持单元在初始位置，将待清洗的封装结构放置在夹持单元上。
具体地，待清洗的封装结构放置在夹持单元15上，此时上腔模块2、下腔模块1内的气压均为常压状态。
步骤S200：上腔模块盖合在下腔模块上形成封闭腔室。
具体的，清洗装置还包括两个第三驱动源3，两个第三驱动源3分别设置在腔体底板17上，上腔模块2设置在第三驱动源3的输出端，控制模块5驱动两个第三驱动源3同步工作，第三驱动源3驱动上腔模块2升降，上腔模块2被驱下降并盖合在下腔模块1上形成封闭腔室。
步骤S300：夹持单元由初始位置下降至工艺位置，上腔模块向封装结构喷洒清洗液。
具体的，封装结构降至工艺位置后，可以对封闭腔室抽气，使封闭腔室内的压力为负压，上腔模块2对封装结构进行喷淋作业，在喷淋过程中，清洗液积蓄在蓄液腔4内。需要说明的是，本申请中所提到的喷淋作业不局限于负压环境下进行，例如，也可以在常压环境下进行。
步骤S400：使封装结构在蓄液腔内的清洗液中浸泡预定时间。
可选的，清洗液覆盖封装结构，保持封闭腔室内的压力为负压，封装结构在负压环境下完全浸泡在蓄液腔4内的清洗液中，有效清洗封装结构。
可选地，步骤S200和步骤S300之间，还包括如下步骤：封装结构在初始位置时，上腔模块2向封装结构喷洒清洗液。优选地，在上腔模块2向封装结构喷洒清洗液之前，先对封闭腔室抽气，使封闭腔室内的压力达到负压，或者先由上腔模块2向封装结构喷洒清洗液，再对封闭腔室抽气，使封闭腔室内的压力达到负压；保持封装结构静止预设时间，使清洗液进入封装结构的缝隙中对封装结构进行清洗。
对封闭腔室抽气可以将封装结构中残存的气体抽出封装结构，以使封装结构的每一处缝隙中均充满清洗液，进而确保封装结构的清洗效果。同时，喷洒清洗液之后，将封装结构的清洗环境设定在负压条件下，可以降低清洗液的表面张力，提高清洗液的扩散能力，使清洗液能够更顺利进入封装结构的缝隙中，并能够在凸点与凸点之间、芯片与载体之间的缝隙中均匀地扩散。在负压环境下保持封装结构静止预设时间，以便于封装结构的缝隙中气泡有足够的时间逸出封装结构，清洗液也有足够的时间进入封装结构的缝隙内，进而达到更好的清洗效果。
更进一步地，向初始位置的封装结构喷洒清洗液的过程中，封装结构可以选择保持静止也可以选择以一预定转速旋转。应当理解的，本申请中的预定转速可以选择为较低转速，示例性的，预定转速为小于或等于600rpm。选择封装结构为静止状态或者在低转速的状态下旋转能够有效防止清洗液因为高转速的离心力较大直接甩出封装结构，有效避免清洗液未进入待清洗的封装结构的缝隙内进行有效清洗便被甩出封装结构的情况的发生。
进一步地，上述封装结构在初始位置时，还包括：再次向封装结构喷洒清洗液，在喷洒清洗液的过程中，使封闭腔室内的压力至少改变一次；在压力停止改变之后，保持封装结构静止预设时间。
在封闭腔室形成压力差的过程中，清洗液所受的力发生改变，从而发生位置的改变，使清洗液更容易进入封装结构的缝隙中，对污染物进行溶解，进而便于清洗液将污染物清洗完全，进一步提高清洗效果。
封闭腔室内的压力改变次数具体可以根据实际工艺要求进行选择，本申请暂不做具体限定。应当理解的是，为了提高清洗效率，压力改变的次数可以尽可能多，以便于封闭腔室内环境压力在不停地变化的过程中，加速清洗液进入封装结构的缝隙中的速率，在清洗液溶解污染物完全之后，再加速将清洗液排出封装结构。可选地，封闭腔室的压力呈周期性波动，封闭腔室内的压力在改变之后与改变之前均处于负压状态。
进一步地，清洗方法还包括步骤S500：夹持单元由工艺位置回升至初始位置；S600：干燥工序，干燥工序包括：向封闭腔室内输入气体，使封闭腔室内的气压达到常压，在常压状态下，使封装结构旋转，和/或，向封装结构吹扫干燥气体。
具体的，封装结构升至初始位置后，第一驱动源131驱动磁流体密封件内轴141和夹持单元15共同旋转，在常压状态下，封装结构随夹持单元15旋转，利用旋转产生的离心力从而甩干夹持单元15和封装结构上的清洗液，以对封装结构进行干燥。
在其他可选的实施方式中，在旋转封装结构的同时向封装结构吹扫干燥气体(例如N2)将封装结构表面的清洗液吹扫至封装结构外，以达到快速干燥的目的。
示例性地，步骤S500还包括夹持单元由工艺位置回升至初始位置后，上腔模块向封装结构喷洒清洗液以对封装结构进行清洗。
示例性地，步骤S500与步骤S600之间还包括步骤S500a：对封闭腔室抽气，使封闭腔室内的压力达到负压；上腔模块向封装结构喷洒清洗液；保持封装结构静止预设时间，使清洗液进入封装结构的缝隙中对封装结构进行清洗。为进一步提升清洗效果，可多次循环重复步骤S500a至步骤S600。
可选地，步骤S600之后进行步骤S500a，步骤S500a之后再进行步骤S600，多次循环重复步骤S500a至步骤S600。
为了进一步提升封装结构的清洗效果，在一个可选的实施方式中，在步骤S400，浸泡封装结构时，控制模块改变封闭腔室的压力至少一次，封闭腔室内的压力的变化使得封装结构表面的清洗液压入小芯片和载体之间的缝隙以及凸点与凸点之间的缝隙中，且由于封闭腔室压力波动使得缝隙内的清洗液实现往复振荡，更能排除清洗液与助焊剂之间的小气泡，增大清洗液与助焊剂之间的有效接触面积，提升清洗效果。
需要说明的是，封闭腔室内的压力可以是连续性变化，或间断性变化。优选地，封闭腔室保持在负压状态下，封闭腔室压力采用周期性波动。
上文已对基本概念做了描述，显然，对于本领域技术人员来说，上述申请披露仅仅作为示例，而并不构成对本申请的限定。虽然此处并没有明确说明，本领域技术人员可能会对本申请进行各种修改、改进和修正。该类修改、改进和修正在本申请中被建议，所以该类修改、改进、修正仍属于本申请示范实施例的精神和范围。
同时，本申请使用了特定词语来描述本申请的实施例。如“一个实施例”、“一实施例”、和/或“一些实施例”意指与本申请至少一个实施例相关的某一特征、结构或特点。因此，应强调并注意的是，本说明书中在不同位置两次或多次提及的“一实施例”或“一个实施例”或“一替代性实施例”并不一定是指同一实施例。此外，本申请的一个或多个实施例中的某些特征、结构或特点可以进行适当的组合。
同理，应当注意的是，为了简化本申请披露的表述，从而帮助对一个或多个申请实施例的理解，前文对本申请实施例的描述中，有时会将多种特征归并至一个实施例、附图或对其的描述中。但是，这种披露方法并不意味着本申请对象所需要的特征比权利要求中提及的特征多。实际上，实施例的特征要少于上述披露的单个实施例的全部特征。

Claims (25)

  1. 一种封装结构的清洗装置，其特征在于，包括上腔模块、下腔模块和控制模块，其中，所述控制模块与所述上腔模块、所述下腔模块分别连接；
    所述上腔模块活动设置在所述下腔模块上，所述上腔模块用于盖合在所述下腔模块上以形成封闭腔室，并且所述上腔模块用于喷淋清洗液至待清洗的封装结构上；
    所述下腔模块包括挡墙单元、升降机构、夹持单元和下腔体，所述挡墙单元固定设置在所述下腔体的底面，所述升降机构用于带动所述夹持单元升降，所述夹持单元设置在所述下腔体中，所述夹持单元用于夹持所述封装结构；
    所述控制模块被配置为：控制所述升降机构带动所述夹持单元及所夹持的封装结构下降至工艺位置，此时，所述夹持单元与所述挡墙单元共同形成蓄液腔，所述蓄液腔用于蓄积所述清洗液以浸泡所述封装结构。
  2. 根据权利要求1所述的封装结构的清洗装置，其特征在于，所述挡墙单元包括围墙、底盘和支撑座，所述围墙设置在所述底盘上，所述支撑座呈柱状体，所述支撑座的上端设置在所述底盘上，所述支撑座的下端设置在所述下腔体的底面，所述封装结构下降至工艺位置时，所述夹持单元抵接在所述支撑座的内表面上并与所述围墙、所述底盘共同形成所述蓄液腔。
  3. 根据权利要求2所述的封装结构的清洗装置，其特征在于，所述夹持单元包括夹持板和设置在所述夹持板上的夹持件，所述夹持板的底面设有环形凸起，所述夹持单元带动所述封装结构下降至工艺位置时，所述环形凸起抵接在所述支撑座的内表面。
  4. 根据权利要求3所述的封装结构的清洗装置，其特征在于，所述环形凸起的外表面上设有第一密封圈，所述夹持单元带动所述封装结构下降至工艺位置时，所述第一密封圈抵接在所述支撑座的内表面。
  5. 根据权利要求3所述的封装结构的清洗装置，其特征在于，所述下腔模块还包括旋转机构，所述旋转机构设置在所述升降机构的输出端，所述夹持单元设置在所述旋转机构的输出端。
  6. 根据权利要求5所述的封装结构的清洗装置，其特征在于，所述旋转机构包括第一驱动源和旋转轴，所述旋转轴设置在所述第一驱动源的输出端，所述下腔模块还包括磁流体密封件，所述磁流体密封件包括磁流体密封件内轴和磁流体密封件外圈，所述磁流体密封件外圈套设在所述磁流体密封件内轴的外周；
    所述磁流体密封件内轴的上端和所述夹持单元的底部连接，所述磁流体密封件内轴的下端设置在所述旋转轴的输出端。
  7. 根据权利要求6所述的封装结构的清洗装置，其特征在于，所述升降机构包括第二驱动源、升降轴和基座，所述升降轴设置在所述第二驱动源的输出端，所述基座设置在所述升降轴的一端；
    所述磁流体密封件外圈的上端和所述基座的底部连接。
  8. 根据权利要求7所述的封装结构的清洗装置，其特征在于，所述下腔模块还包括弹性管路和弹性管路支撑件，所述弹性管路支撑件的底部固定在所述基座上，所述弹性管路支撑件的顶部和所述夹持单元的底部之间预设一定间隙，所述弹性管路的下端固定在所述下腔体上，所述弹性管路的上端固定在所述弹性管路支撑件上。
  9. 根据权利要求7所述的封装结构的清洗装置，其特征在于，所述下腔模块还包括腔体底板，所述下腔体设置在所述腔体底板上，所述基座的下表面设有环状的第二密封圈，所述封装结构下降至工艺位置时，所述第二密封圈弹性抵接在所述腔体底板上。
  10. 根据权利要求7所述的封装结构的清洗装置，其特征在于，所述基座的上表面设有环状的第三密封圈，所述封装结构在初始位置时，所述第三密封圈弹性抵接在所述下腔体的底部上。
  11. 根据权利要求8所述的封装结构的清洗装置，其特征在于，所述支撑座上开设有第一排液孔，所述下腔体的底部开设有第二排液孔，所述支撑座及所述弹性管路的外周合拢形成排液腔，所述第一排液孔与所述下腔体和所述排液腔连通。
  12. 根据权利要求1所述的封装结构的清洗装置，其特征在于，所述控制模块用于在所述封装结构浸泡在所述蓄液腔内的清洗液中时改变所述封闭腔室的压力。
  13. 根据权利要求12所述的封装结构的清洗装置，其特征在于，所述封闭腔室的压力呈周期性波动。
  14. 一种应用于权利要求1-13任一项所述的清洗装置的清洗方法，其特征在于，包括：
    步骤S100：控制模块保持夹持单元在初始位置，将待清洗的封装结构放置在夹持单元上；
    步骤S200：上腔模块盖合在下腔模块上形成封闭腔室；
    步骤S300：夹持单元由初始位置下降至工艺位置，上腔模块向封装结构喷洒清洗液；
    步骤S400：使封装结构在蓄液腔内的清洗液中浸泡预定时间。
  15. 根据权利要求14所述的清洗方法，其特征在于，所述步骤S300还包括：所述夹持单元由初始位置下降至工艺位置之后，对封闭腔室抽气，使封闭腔室内的压力为负压。
  16. 根据权利要求14所述的清洗方法，其特征在于，在步骤S200和步骤S300之间，还包括：使封闭腔室内的压力为常压，上腔模块向封装结构喷洒清洗液。
  17. 根据权利要求14所述的清洗方法，其特征在于，在步骤S200和步骤S300之间，还包括：向封装结构喷洒清洗液；对封闭腔室抽气，使封闭腔室内的压力达到负压；保持封装结构静止预设时间，使清洗液进入封装结构的缝隙中对封装结构进行清洗。
  18. 根据权利要求17所述的清洗方法，其特征在于，还包括：再次向封装结构喷洒清洗液，在喷洒清洗液的过程中，使封闭腔室内的压力至少改变一次；在所述压力停止改变之后，保持封装结构静止预设时间。
  19. 根据权利要求18所述的清洗方法，其特征在于，所述封闭腔室内的压力在改变之后与改变之前均处于负压状态。
  20. 根据权利要求14所述的清洗方法，其特征在于，还包括步骤S500：夹持单元由工艺位置回升至初始位置；S600：干燥工序，所述干燥工序包括：向所述封闭腔室内输入气体，使所述封闭腔室内的气压达到常压，在常压状态下，使封装结构旋转，和/或，向封装结构吹扫干燥气体。
  21. 根据权利要求20所述的清洗方法，其特征在于，在步骤S500与步骤S600之间还包括步骤S500a：对封闭腔室抽气，使封闭腔室内的压力达到负压；上腔模块向封装结构喷洒清洗液；保持封装结构静止预设时间，使清洗液进入封装结构的缝隙中对封装结构进行清洗。
  22. 根据权利要求20所述的清洗方法，其特征在于，在步骤S600之后还包括步骤S500a：对封闭腔室抽气，使封闭腔室内的压力达到负压；上腔模块向封装结构喷洒清洗液；保持封装结构静止预设时间，使清洗液进入封装结构的缝隙中对封装结构进行清洗，步骤S500a之后再进行步骤S600。
  23. 根据权利要求20所述的清洗方法，其特征在于，所述步骤S500还包括：夹持单元由工艺位置回升至初始位置后，上腔模块向封装结构喷洒清洗液以对封装结构进行清洗。
  24. 根据权利要求14所述的清洗方法，其特征在于，保持封装结构浸泡在蓄液腔内的清洗液中时，使封闭腔室内的压力至少改变一次。
  25. 根据权利要求24所述的清洗方法，其特征在于，所述封闭腔室的压力呈周期性波动。
PCT/CN2025/092330 2024-05-29 2025-04-30 一种封装结构的清洗装置及清洗方法 Pending WO2025246790A1 (zh)

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JP2000146434A (ja) * 1998-08-26 2000-05-26 Ebara Corp 減圧スピン乾燥装置
CN111589788A (zh) * 2020-06-08 2020-08-28 安徽拔沃乎机电科技有限公司 沉浸式pcb电路板清洁系统
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