WO2025241069A1 - 一种扬声器模组 - Google Patents

一种扬声器模组

Info

Publication number
WO2025241069A1
WO2025241069A1 PCT/CN2024/094284 CN2024094284W WO2025241069A1 WO 2025241069 A1 WO2025241069 A1 WO 2025241069A1 CN 2024094284 W CN2024094284 W CN 2024094284W WO 2025241069 A1 WO2025241069 A1 WO 2025241069A1
Authority
WO
WIPO (PCT)
Prior art keywords
disposed
main body
side plate
shock
magnet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/CN2024/094284
Other languages
English (en)
French (fr)
Inventor
金鑫
宋威
马杰
汤赟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AAC Microtech Changzhou Co Ltd
Original Assignee
AAC Microtech Changzhou Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AAC Microtech Changzhou Co Ltd filed Critical AAC Microtech Changzhou Co Ltd
Priority to PCT/CN2024/094284 priority Critical patent/WO2025241069A1/zh
Priority to US18/986,798 priority patent/US20250358564A1/en
Publication of WO2025241069A1 publication Critical patent/WO2025241069A1/zh
Pending legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H04R7/16—Mounting or tensioning of diaphragms or cones
    • H04R7/18—Mounting or tensioning of diaphragms or cones at the periphery
    • H04R7/20—Securing diaphragm or cone resiliently to support by flexible material, springs, cords, or strands
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/025—Arrangements for fixing loudspeaker transducers, e.g. in a box, furniture
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2869—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself
    • H04R1/2876—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself by means of damping material, e.g. as cladding
    • H04R1/288—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself by means of damping material, e.g. as cladding for loudspeaker transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
    • H04R7/04—Plane diaphragms
    • H04R7/06—Plane diaphragms comprising a plurality of sections or layers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H04R9/025—Magnetic circuit
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H04R9/04—Construction, mounting, or centering of coil
    • H04R9/045—Mounting
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06—Loudspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R2400/00—Loudspeakers
    • H04R2400/11—Aspects regarding the frame of loudspeaker transducers

Definitions

  • This invention relates to the field of electroacoustics, and more specifically to a loudspeaker module.
  • the purpose of this invention is to provide a speaker module that can prevent the overflow of shock-absorbing raw materials during the molding process of the shock-absorbing structure.
  • a loudspeaker module includes a mounting bracket, a shock-absorbing structure disposed on the mounting bracket, and a loudspeaker assembly;
  • the loudspeaker assembly includes a vibration system and a magnetic circuit system for driving the vibration system to vibrate, the magnetic circuit system including an upper clamping plate disposed on top of the shock-absorbing structure and an anti-overflow layer disposed on the upper clamping plate;
  • the upper clamping plate includes a first body, a first hole structure disposed in the middle of the first body, and a first platform protruding upward along the edge region of the first hole structure;
  • the anti-overflow layer is disposed circumferentially on the surface of the first body along the first platform, the anti-overflow layer being used to prevent the raw material of the shock-absorbing structure from overflowing during the molding process.
  • the shock-absorbing structure is disposed on the inner side of the mounting bracket;
  • the mounting bracket includes a second main body and a first side plate disposed perpendicularly to the second main body along a first direction;
  • the shock-absorbing structure includes a third main body and a second side plate and a third side plate disposed perpendicularly to the edge region of the third main body along a first direction, the third main body is disposed on the second main body, the second side plate is connected to the first side plate, and the third side plate is disposed between the second side plates.
  • the third side plate protrudes from the first main body plane, and the area corresponding to the spill-proof layer and the third side plate fills the space between the outer wall of the first platform and the inner wall of the third side plate.
  • the second side plate is provided with a connecting structure that connects to the first side plate, and the first side plate is provided with a mating structure that cooperates with the connecting structure;
  • the second main body is annular, and a second hole structure is provided in the middle of the second main body, and a mounting groove is provided on the second hole structure, and the third main body is connected to the mounting groove.
  • the magnetic circuit system further includes a lower clamping plate disposed on the third main body, an inner magnet disposed on the lower clamping plate in the area corresponding to the first hole structure, a side magnet disposed between the first main body and the lower clamping plate, an outer magnet disposed above the inner magnet, and a pole core sandwiched between the outer magnet and the inner magnet; the outer magnet protrudes from the first hole structure; the side magnet is disposed along the circumference of the inner magnet, and a gap is provided between the inner magnet and the first hole structure.
  • the vibration system includes an inner diaphragm disposed above the outer magnet, a frame disposed around the outer periphery of the inner diaphragm, an upper diaphragm disposed around the outer periphery of the frame, a voice coil suspended in the gap, and a lower diaphragm disposed outside the third side plate.
  • the loudspeaker module further includes a flexible circuit board disposed on the lower diaphragm and connected to the voice coil; the frame is connected to the flexible circuit board to support the vibration system on the flexible circuit board, and the lower diaphragm is concave from top to bottom.
  • the frame includes a fourth main body connected between the inner diaphragm and the upper diaphragm, and a fourth side plate perpendicularly disposed on the side of the fourth main body corresponding to the flexible circuit board, the fourth side plate being connected to the inner side of the flexible circuit board;
  • the upper diaphragm includes a fifth main body connected to the frame, and a fifth side plate perpendicularly disposed on the side of the fifth main body corresponding to the flexible circuit board, the fifth side plate being connected to the outer side of the flexible circuit board.
  • the first body has a connecting ear on the side corresponding to the second side plate, and the top of the second side plate has a groove that mates with the connecting ear.
  • the shock-absorbing structure is a flexible shock-absorbing structure; the spill-proof layer is a flexible adhesive layer.
  • the speaker module of the present invention provides an anti-overflow layer on the first main body.
  • the anti-overflow layer compensates for the gap between the molding fixture and the upper clamping plate, preventing the overflow of raw materials of the shock-absorbing structure, ensuring the vibration space of the voice coil in the speaker module, and ensuring the performance of the speaker.
  • the anti-overflow layer does not require the addition of additional parts, and the method is simple, efficient and low in production cost.
  • Figure 1 is a schematic diagram of the speaker module of the present invention
  • Figure 2 is a cross-sectional schematic diagram of the speaker module of the present invention along the A-A direction;
  • Figure 3 is a cross-sectional schematic diagram of the speaker module of the present invention along the B-B direction;
  • Figure 4 is an exploded view of the speaker module of the present invention.
  • Figure 5 is a schematic diagram of the assembly of the upper clamping plate, the anti-overflow layer and the shock-absorbing structure.
  • Figure 6 is a cross-sectional view along C-C of the assembly schematic diagram in Figure 5;
  • Figure 7 is a cross-sectional view along D-D of the assembly diagram in Figure 5.
  • Example 1 This embodiment of the invention provides a speaker module, as shown in Figures 1 to 4, which includes a mounting bracket 1, a shock-absorbing structure 2 disposed on the mounting bracket 1, and a speaker assembly; the speaker assembly includes a vibration system 31 and a magnetic circuit system 32 for driving the vibration system 31 to vibrate, the magnetic circuit system 32 includes an upper clamping plate 321 disposed on the top of the shock-absorbing structure 2 and an anti-overflow layer 322 disposed on the upper clamping plate 321; the upper clamping plate 321 includes a first body 3211, a first hole structure 3212 disposed in the middle of the first body 3211, and a first platform 3214 protruding upward along the edge region of the first hole structure 3212; the anti-overflow layer 322 is disposed circumferentially on the surface of the first body 3211 along the first platform 3214, and the anti-overflow layer 322 is used to prevent the raw material of the shock-absorbing structure 2 from overflowing during the molding process.
  • the speaker assembly includes a vibration system 31 and a
  • An anti-overflow layer 322 is provided on the upper surface of the first main body 3211 of the present invention.
  • the anti-overflow layer 322 compensates for the gap between the molding fixture and the upper clamping plate 321, preventing the overflow of the raw material of the shock-absorbing structure 2, ensuring the vibration space of the speaker assembly, and ensuring the performance of the speaker.
  • the anti-overflow layer 322 does not require the addition of additional parts, making the method simple, efficient, and low in production cost.
  • the first direction z is a direction parallel to the vibration direction.
  • the shock-absorbing structure 2 is disposed on the inner side of the mounting bracket 1.
  • the mounting bracket 1 includes a second main body 11 and a first side plate 12 perpendicularly disposed on the second main body 11 along a first direction z.
  • the shock-absorbing structure 2 includes a third main body 21 and second side plates 22 and 23 perpendicularly disposed on the edge region of the third main body 21 along the first direction z.
  • the third main body 21 is disposed on the second main body 11, the second side plate 22 is connected to the first side plate 12, and the third side plate 23 is disposed between the second side plates 22.
  • the top surface of the second side plate 22 is flush with the plane of the first main body 3211.
  • the shock-absorbing structure 2 buffers the impact force when the speaker module is impacted, so as to prevent the speaker assembly from being affected by impact, affecting the sound quality or damaging the components.
  • the third side plate 23 protrudes from the plane of the first main body 3211.
  • the area corresponding to the third side plate 23 and the anti-overflow layer 322 fills the space between the outer wall of the first platform 3214 and the inner wall of the third side plate 23.
  • the anti-overflow layer 322 prevents the material of the damping structure 2 from overflowing into the speaker assembly during the speaker molding process, ensuring the molding quality of the speaker and guaranteeing both the damping effect of the damping structure 2 and the performance of the speaker.
  • the second side plate 22 is provided with a connecting structure 221 that connects to the first side plate 12, and the first side plate 12 is provided with a mating structure 121 that cooperates with the connecting structure 221.
  • the connecting structure 221 is a protrusion on the outer wall of the second side plate 22, and the mating structure 121 is a groove on the first side plate 12 that mates with the protrusion, with the protrusion embedded in the groove.
  • the connection between the connecting structure 221 and the mating structure 121 enhances the connection strength between the second side plate 22 and the first side plate 12.
  • the second main body 11 has an annular structure, and a second hole structure 111 is provided in the middle of the second main body 11.
  • a first mounting groove 112 is provided on the second hole structure 111, and the third main body 21 is connected to the first mounting groove 112.
  • the magnetic circuit system 32 further includes a lower clamping plate 323 disposed on the third main body 21, an inner magnet 324 disposed on the area corresponding to the lower clamping plate 323 and the first hole structure 3212, a side magnet 325 disposed between the first main body 3211 and the lower clamping plate 323, an outer magnet 326 disposed above the inner magnet 324, and a pole core 327 sandwiched between the outer magnet 326 and the inner magnet 324; the outer magnet 326 protrudes from the first hole structure 3212; the side magnet 325 is disposed along the circumference of the inner magnet 324, and a gap is provided between the inner magnet 324 and the first hole structure 3212.
  • the vibration system 31 includes an inner diaphragm 311 disposed above the outer magnet 326, a frame 312 disposed on the outer periphery of the inner diaphragm 311, an upper diaphragm 313 disposed on the outer periphery of the frame 312, a voice coil 314 suspended in the gap, and a lower diaphragm 315 disposed on the outer side of the third side plate 23.
  • the loudspeaker module further includes a flexible circuit board 4 disposed on the lower diaphragm 315 and connected to the voice coil 314; the frame 312 is connected to the flexible circuit board 4 to support the vibration system 31 on the flexible circuit board 4, and the lower diaphragm 315 is concave from top to bottom.
  • Down refers to the direction along the first direction z towards the lower clamping plate 323, and “up” refers to the direction along the first direction z away from the lower clamping plate 323.
  • the frame 312 includes a fourth main body 3121 connected between the inner diaphragm 311 and the upper diaphragm 313, and a fourth side plate 3122 perpendicularly disposed on the side of the fourth main body 3121 corresponding to the flexible circuit board 4.
  • the fourth side plate 3122 is connected to the inner side of the flexible circuit board 4.
  • the upper diaphragm 313 includes a fifth main body 3131 connected to the frame 312, and a fifth side plate 3132 perpendicularly disposed on the side of the fifth main body 3131 corresponding to the flexible circuit board 4.
  • the fifth side plate 3132 is connected to the outer side of the flexible circuit board 4. It should be noted that “inner” refers to the direction close to the central axis of the first hole structure 3212, and “outer” refers to the direction away from the central axis of the first hole structure 3212.
  • the first main body 3211 has a connecting ear 3213 on the side corresponding to the second side plate 22, and the top of the second side plate 22 has a second mounting groove 222 for mounting the connecting ear 3213.
  • the connecting ear 3213 is embedded in the second mounting groove 222.
  • the shock-absorbing structure 2 is a flexible shock-absorbing structure; the spill-proof layer 322 is a flexible adhesive layer.
  • the shock-absorbing structure 2 is made of rubber material.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Health & Medical Sciences (AREA)
  • Otolaryngology (AREA)
  • Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)

Abstract

本发明提供了一种扬声器模组，其包括安装支架、设于所述安装支架上的减震结构，以及扬声器组件；所述扬声器组件包括振动系统和驱动所述振动系统的磁路系统，所述磁路系统包括设于减震结构顶部的上夹板以及设于所述上夹板上的防溢层；所述上夹板包括第一主体、设于所述第一主体中部的第一孔结构以及沿所述第一孔结构边沿区域设置的向上凸起的第一平台；所述防溢层沿所述第一平台周向设于所述第一主体的表面，所述防溢层用于防止成型过程中所述减震结构的原材料内溢。本发明所述扬声器模组包括防溢层，在所述减震结构成型过程中，阻隔了减震结构原材料的溢出；此外，所述防溢层的设置无需增加额外的零部件，实现方法简单、高效且生产成本低。

Description

一种扬声器模组 技术领域
本发明涉及电声领域，具体涉及一种扬声器模组。
 背景技术
现有技术的随着移动电子设备的普及，移动电子设备逐渐向着多功能化发展。其中，高品质的音乐功能成为了移动电子设备具备常用功能之一，进而用于播放声音的扬声器被大量应用于移动电子设备中。现有技术中，扬声器中设置减震结构，用以提升扬声器的抗震效果、避免扬声器在受到强烈冲击时损坏，提升扬声器以及移动电子设备的可靠性。然而，现有技术中的减震结构在成型过程中由于扬声器中的磁路结构存在多次高度公差累积，导致磁路结构与成型治具之间存在间隙无法高度匹配，进而导致减震材料内溢，缩减音圈的震动空间，最终影响扬声器的性能。
因此，如何得到一种能够在成型过程中防止减震原材料内溢的扬声器模组是十分必要的。
 技术问题
本发明的目的在于提供一种扬声器模组，所述扬声器模组能够在减震结构成型过程中防止减震原材料溢出。
 技术解决方案
本发明的技术方案如下：
一种扬声器模组，其包括安装支架、设于所述安装支架上的减震结构，以及扬声器组件；所述扬声器组件包括振动系统和驱动所述振动系统振动的磁路系统，所述磁路系统包括设于所述减震结构顶部的上夹板以及设于所述上夹板上的防溢层；所述上夹板包括第一主体、设于所述第一主体中部的第一孔结构，以及沿所述第一孔结构边沿区域向上凸起的第一平台；所述防溢层沿所述第一平台周向设于所述第一主体的表面，所述防溢层用于防止成型过程中所述减震结构的原材料内溢。
优选地，所述减震结构设于所述安装支架的内侧；所述安装支架包括第二主体以及沿第一方向垂直设于所述第二主体上的第一侧板；所述减震结构包括第三主体以及沿第一方向分别垂直设于所述第三主体的边沿区域的第二侧板和第三侧板，所述第三主体设于所述第二主体上，所述第二侧板连接于所述第一侧板上，所述第三侧板设于所述第二侧板之间。
优选地，所述第三侧板凸出于所述第一主体平面设置，所述防溢层与所述第三侧板对应的区域填充于所述第一平台的外壁和所述第三侧板的内壁之间。
优选地，所述第二侧板上设有与所述第一侧板连接的连接结构，所述第一侧板上设有与所述连接结构相互配合的配合结构；所述第二主体呈环状结构，所述第二主体的中部设有第二孔结构，所述第二孔结构上设有安装槽，所述第三主体连接于所述安装槽。
优选地，所述磁路系统还包括设于所述第三主体上的下夹板、设于所述下夹板与所述第一孔结构对应区域上的内磁钢、设于所述第一主体和所述下夹板之间的边磁钢、设于所述内磁钢上方的外磁钢以及夹设于所述外磁钢和所述内磁钢之间的极芯；所述外磁钢凸出于所述第一孔结构设置；所述边磁钢沿所述内磁钢的周向设置，所述内磁钢与所述第一孔结构之间设有间隙。
优选地，所述振动系统包括设于所述外磁钢上方的内振膜、设于所述内振膜外周的骨架、设于所述骨架外周的上振膜、悬置于所述间隙内的音圈以及设于所述第三侧板外侧的下振膜。
优选地，所述扬声器模组还包括设于所述下振膜上并与所述音圈导通的柔性线路板；所述骨架连接于所述柔性线路板上以将所述振动系统支撑于所述柔性线路板上，所述下振膜由上至下凹陷。
优选地，所述骨架包括连接于所述内振膜和所述上振膜之间的第四主体以及垂直设于所述第四主体与所述柔性线路板对应的侧边上的第四侧板，所述第四侧板连接于所述柔性线路板的内侧；所述上振膜包括与所述骨架连接的第五主体以及垂直设于所述第五主体与所述柔性线路板对应的侧边上的第五侧板，所述第五侧板连接于所述柔性线路板的外侧。
优选地，所述第一主体与所述第二侧板对应的侧边上设有连接耳，所述第二侧板的顶部设有与所述连接耳配合的凹槽。
优选地，所述减震结构为柔性减震结构；所述防溢层为柔性胶水层。
 有益效果
本发明的有益效果在于：
本发明所述扬声器模组通过在所述第一主体的上设置防溢层，在所述减震结构成型过程中，所述防溢层所述减震结构在成型过程中对成型治具与上夹板之间的间隙进行弥补，阻隔了减震结构原材料的溢出，保证了扬声器模组中音圈的振动空间，保证扬声器的使用性能；此外，所述防溢层的设置无需增加额外的零部件，实现方法简单、高效且生产成本低。
 附图说明
图1为本发明的扬声器模组的结构示意图；
图2为本发明的扬声器模组沿A-A方向的截面示意图；
图3为本发明的扬声器模组沿B-B方向的截面示意图；
图4为本发明的扬声器模组的爆炸图示；
图5为上夹板、防溢层以及减震结构的装配示意图；
图6为图5的装配示意图沿C-C的截面示意图；
图7为图5的装配示意图沿D-D的截面示意图。
 本发明的实施方式
下面结合附图和实施方式对本发明作进一步说明。
实施例1：本发明实施例提供一种扬声器模组，参见图1至图4所示，其包括安装支架1、设于所述安装支架1上的减震结构2，以及扬声器组件；所述扬声器组件包括振动系统31和驱动所述振动系统31振动的磁路系统32，所述磁路系统32包括设于所述减震结构2顶部的上夹板321以及设于所述上夹板321上的防溢层322；所述上夹板321包括第一主体3211、设于所述第一主体3211中部的第一孔结构3212，以及沿所述第一孔结构3212边沿区域向上凸起的第一平台3214；所述防溢层322沿所述第一平台3214周向设于所述第一主体3211的表面，所述防溢层322用于防止成型过程中所述减震结构2的原材料内溢。
本发明的所述第一主体3211的上表面上设置防溢层322，在所述减震结构2成型过程中，所述防溢层322所述减震结构2在成型过程中对成型治具与上夹板321之间的间隙进行弥补，阻隔了减震结构2原料的溢出，保证了扬声器组件的振动空间，保证扬声器的使用性能；此外，所述防溢层322的设置无需增加额外的零部件，实现方法简单、高效且生产成本低。本发明中，所述第一方向z为与振动方向平行的方向。
所述减震结构2设于所述安装支架1的内侧；所述安装支架1包括第二主体11以及沿第一方向z垂直设于所述第二主体11上的第一侧板12；所述减震结构2包括第三主体21以及沿第一方向z分别垂直设于所述第三主体21的边沿区域的第二侧板22和第三侧板23，所述第三主体21设于所述第二主体11上，所述第二侧板22连接于所述第一侧板12上，所述第三侧板23设于所述第二侧板22之间。所述第二侧板22的顶面与所述第一主体3211平面齐平。所述减震结构2在所述扬声器模组受到撞击时对冲击力进行缓冲，以防止所述扬声器组件受冲击影响发声品质或者部件损伤。
参见图2和图5所示，所述第三侧板23凸出于所述第一主体3211平面设置，所述防溢层322与所述第三侧板23对应的区域填充于所述第一平台3214的外壁和所述第三侧板23的内壁之间。在本实施例中，所述第二侧板22与所述第三侧板23、第一主体3211的形状结构之间存在高度差，所述防溢层322的设置，防止了在扬声器的成型过程中所述减震结构2的材料向所述扬声器组件溢出，保证了扬声器的成型质量，既保证了减震结构2的减震效果又保证了扬声器的使用性能。
进一步地，所述第二侧板22上设有与所述第一侧板12连接的连接结构221，所述第一侧板12上设有与所述连接结构221相互配合的配合结构121。具体地，在一些实施例中，所述连接结构221为设于所述第二侧板22外壁上的凸起结构，所述配合结构121为设于所述第一侧板12、并与所述凸起结构配合连接的凹槽，所述凸起结构嵌入所述凹槽内。通过所述连接结构221与所述配合结构121之间的配合连接，提升了所述第二侧板22与所述第一侧板12之间的连接强度。所述第二主体11呈环状结构，所述第二主体11的中部设有第二孔结构111，所述第二孔结构111上设有第一安装槽112，所述第三主体21连接于所述第一安装槽112。
参见图2至图7所示，所述磁路系统32还包括设于所述第三主体21上的下夹板323、设于所述下夹板323与所述第一孔结构3212对应区域上的内磁钢324、设于所述第一主体3211和所述下夹板323之间的边磁钢325、设于所述内磁钢324上方的外磁钢326以及夹设于所述外磁钢326和所述内磁钢324之间的极芯327；所述外磁钢326凸出于所述第一孔结构3212设置；所述边磁钢325沿所述内磁钢324的周向设置，所述内磁钢324与所述第一孔结构3212之间设有间隙。
所述振动系统31包括设于外磁钢326上方的内振膜311、设于所述内振膜311外周的骨架312、设于所述骨架312外周的上振膜313、悬置于所述间隙内的音圈314以及设于所述第三侧板23外侧的下振膜315。
所述扬声器模组还包括设于所述下振膜315上并与所述音圈314导通的柔性线路板4；所述骨架312连接于所述柔性线路板4上以将所述振动系统31支撑于所述柔性线路板4上，所述下振膜315由上至下凹陷。所述下指的是沿所述第一方向z靠近所述下夹板323的方向，所述上指的是沿所述第一方向z远离所述下夹板323的方向。
所述骨架312包括连接于所述内振膜311和所述上振膜313之间的第四主体3121以及垂直设于所述第四主体3121与所述柔性线路板4对应的侧边上的第四侧板3122，所述第四侧板3122连接于所述柔性线路板4的内侧；所述上振膜313包括与所述骨架312连接的第五主体3131以及垂直设于所述第五主体3131与所述柔性线路板4对应的侧边上的第五侧板3132，所述第五侧板3132连接于所述柔性线路板4的外侧。需要说明的是，所述内指的是靠近所述第一孔结构3212中心轴的方向，所述外指的是远离所述第一孔结构3212中心轴的方向。
进一步地，所述第一主体3211与所述第二侧板22对应的侧边上设有连接耳3213，所述第二侧板22的顶部设有用于设置所述连接耳3213的第二安装槽222。所述连接耳3213嵌设于所述第二安装槽222内。
作为优选地，所述减震结构2为柔性减震结构；所述防溢层322为柔性胶水层。具体地，所述减震结构2由橡胶材料制得。
以上所述的仅是本发明的实施方式，在此应当指出，对于本领域的普通技术人员来说，在不脱离本发明创造构思的前提下，还可以做出改进，但这些均属于本发明的保护范围。

Claims (10)

  1. 一种扬声器模组，其特征在于，包括安装支架、设于所述安装支架上的减震结构，以及扬声器组件；所述扬声器组件包括振动系统和驱动所述振动系统振动的磁路系统，所述磁路系统包括设于所述减震结构顶部的上夹板以及设于所述上夹板上的防溢层；所述上夹板包括第一主体、设于所述第一主体中部的第一孔结构，以及沿所述第一孔结构边沿区域向上凸起的第一平台；所述防溢层沿所述第一平台周向设于所述第一主体的表面，所述防溢层用于防止成型过程中所述减震结构的原材料内溢。
  2. 根据权利要求1所述的扬声器模组，其特征在于：所述减震结构设于所述安装支架的内侧；所述安装支架包括第二主体以及沿第一方向垂直设于所述第二主体上的第一侧板；所述减震结构包括第三主体以及沿第一方向分别垂直设于所述第三主体的边沿区域的第二侧板和第三侧板，所述第三主体设于所述第二主体上，所述第二侧板连接于所述第一侧板上，所述第三侧板设于所述第二侧板之间。
  3. 根据权利要求2所述的扬声器模组，其特征在于：所述第三侧板凸出于所述第一主体平面设置，所述防溢层与所述第三侧板对应的区域填充于所述第一平台的外壁和所述第三侧板的内壁之间。
  4. 根据权利要求2所述的扬声器模组，其特征在于：所述第二侧板上设有与所述第一侧板连接的连接结构，所述第一侧板上设有与所述连接结构相互配合的配合结构；所述第二主体呈环状结构，所述第二主体的中部设有第二孔结构，所述第二孔结构上设有安装槽，所述第三主体连接于所述安装槽。
  5. 根据权利要求2所述的扬声器模组，其特征在于：所述磁路系统还包括设于所述第三主体上的下夹板、设于所述下夹板与所述第一孔结构对应区域上的内磁钢、设于所述第一主体和所述下夹板之间的边磁钢、设于所述内磁钢上方的外磁钢以及夹设于所述外磁钢和所述内磁钢之间的极芯；所述外磁钢凸出于所述第一孔结构设置；所述边磁钢沿所述内磁钢的周向设置，所述内磁钢与所述第一孔结构之间设有间隙。
  6. 根据权利要求5所述的扬声器模组，其特征在于：所述振动系统包括设于所述外磁钢上方的内振膜、设于所述内振膜外周的骨架、设于所述骨架外周的上振膜、悬置于所述间隙内的音圈以及设于所述第三侧板外侧的下振膜。
  7. 根据权利要求6所述的扬声器模组，其特征在于：所述扬声器模组还包括设于所述下振膜上并与所述音圈导通的柔性线路板；所述骨架连接于所述柔性线路板上以将所述振动系统支撑于所述柔性线路板上，所述下振膜由上至下凹陷。
  8. 根据权利要求7所述的扬声器模组，其特征在于：所述骨架包括连接于所述内振膜和所述上振膜之间的第四主体以及垂直设于所述第四主体与所述柔性线路板对应的侧边上的第四侧板，所述第四侧板连接于所述柔性线路板的内侧；所述上振膜包括与所述骨架连接的第五主体以及垂直设于所述第五主体与所述柔性线路板对应的侧边上的第五侧板，所述第五侧板连接于所述柔性线路板的外侧。
  9. 根据权利要求2所述的扬声器模组，其特征在于：所述第一主体与所述第二侧板对应的侧边上设有连接耳，所述第二侧板的顶部设有与所述连接耳配合的凹槽。
  10. 根据权利要求1所述的扬声器模组，其特征在于：所述减震结构为柔性减震结构；所述防溢层为柔性胶水层。
PCT/CN2024/094284 2024-05-20 2024-05-20 一种扬声器模组 Pending WO2025241069A1 (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/CN2024/094284 WO2025241069A1 (zh) 2024-05-20 2024-05-20 一种扬声器模组
US18/986,798 US20250358564A1 (en) 2024-05-20 2024-12-19 Speaker module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2024/094284 WO2025241069A1 (zh) 2024-05-20 2024-05-20 一种扬声器模组

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US18/986,798 Continuation US20250358564A1 (en) 2024-05-20 2024-12-19 Speaker module

Publications (1)

Publication Number Publication Date
WO2025241069A1 true WO2025241069A1 (zh) 2025-11-27

Family

ID=97678292

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2024/094284 Pending WO2025241069A1 (zh) 2024-05-20 2024-05-20 一种扬声器模组

Country Status (2)

Country Link
US (1) US20250358564A1 (zh)
WO (1) WO2025241069A1 (zh)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0984179A (ja) * 1995-09-11 1997-03-28 Pioneer Electron Corp エッジレススピーカ及びエッジレススピーカの組立方法
CN110049412A (zh) * 2019-03-22 2019-07-23 华为技术有限公司 一种振动发声的屏幕组件的制备方法
CN209390346U (zh) * 2018-12-29 2019-09-13 瑞声科技(新加坡)有限公司 扬声器
CN111034224A (zh) * 2017-10-19 2020-04-17 松下知识产权经营株式会社 扬声器和振动板单元
CN111327998A (zh) * 2020-02-25 2020-06-23 瑞声科技(新加坡)有限公司 发声器件
CN112165675A (zh) * 2020-10-22 2021-01-01 瑞声新能源发展(常州)有限公司科教城分公司 扬声器
CN214627352U (zh) * 2020-12-25 2021-11-05 瑞声光电科技(常州)有限公司 一种扬声器
CN218387880U (zh) * 2022-09-02 2023-01-24 瑞声光电科技(常州)有限公司 扬声器
CN117560608A (zh) * 2024-01-09 2024-02-13 瑞声光电科技(常州)有限公司 扬声器及扬声器箱

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0984179A (ja) * 1995-09-11 1997-03-28 Pioneer Electron Corp エッジレススピーカ及びエッジレススピーカの組立方法
CN111034224A (zh) * 2017-10-19 2020-04-17 松下知识产权经营株式会社 扬声器和振动板单元
CN209390346U (zh) * 2018-12-29 2019-09-13 瑞声科技(新加坡)有限公司 扬声器
CN110049412A (zh) * 2019-03-22 2019-07-23 华为技术有限公司 一种振动发声的屏幕组件的制备方法
CN111327998A (zh) * 2020-02-25 2020-06-23 瑞声科技(新加坡)有限公司 发声器件
CN112165675A (zh) * 2020-10-22 2021-01-01 瑞声新能源发展(常州)有限公司科教城分公司 扬声器
CN214627352U (zh) * 2020-12-25 2021-11-05 瑞声光电科技(常州)有限公司 一种扬声器
CN218387880U (zh) * 2022-09-02 2023-01-24 瑞声光电科技(常州)有限公司 扬声器
CN117560608A (zh) * 2024-01-09 2024-02-13 瑞声光电科技(常州)有限公司 扬声器及扬声器箱

Also Published As

Publication number Publication date
US20250358564A1 (en) 2025-11-20

Similar Documents

Publication Publication Date Title
US7548632B2 (en) Speaker, module using the same, electronic equipment and device, and speaker producing method
CN110366080A (zh) 扬声器和音频装置
US10979819B2 (en) Sound device
US20230179921A1 (en) Speaker
WO2020248194A1 (zh) 扬声器
CN117560608B (zh) 扬声器及扬声器箱
WO2020134309A1 (zh) 一种扬声器
WO2024045280A1 (zh) 扬声器
JP7612024B2 (ja) スピーカー及び音響システム
CN202261781U (zh) 改良的扬声器及其防尘盖结构
US12335705B2 (en) Speaker
US12452607B2 (en) Speaker
JP7827883B2 (ja) カースピーカー及びオーディオシステム
JP2003111189A (ja) スピーカ
CN209731566U (zh) 一种浅安装的扬声器结构
CN218450510U (zh) 一种高低音集成式的激励器
CN118200819B (zh) 一种扬声器模组
US20250358564A1 (en) Speaker module
US12212924B2 (en) Speaker core, speaker, and electronic device
CN112492457B (zh) 扬声器
WO2011134250A1 (zh) 薄型汽车扬声器
CN222786077U (zh) 扬声器音盆、扬声器及车辆
JP3687235B2 (ja) スピーカ
CN223231320U (zh) 磁路组件、扬声器、耳机及音箱
CN217428285U (zh) 一种大振幅微型扬声器

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 24939112

Country of ref document: EP

Kind code of ref document: A1