WO2025199708A1 - 一种垂直供电系统 - Google Patents

一种垂直供电系统

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Publication number
WO2025199708A1
WO2025199708A1 PCT/CN2024/083663 CN2024083663W WO2025199708A1 WO 2025199708 A1 WO2025199708 A1 WO 2025199708A1 CN 2024083663 W CN2024083663 W CN 2024083663W WO 2025199708 A1 WO2025199708 A1 WO 2025199708A1
Authority
WO
WIPO (PCT)
Prior art keywords
power supply
fixing members
module
carrier board
processor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/CN2024/083663
Other languages
English (en)
French (fr)
Inventor
张玉君
陆岩
朱仕银
刘锋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
New H3C Technologies Co Ltd
Original Assignee
New H3C Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by New H3C Technologies Co Ltd filed Critical New H3C Technologies Co Ltd
Priority to PCT/CN2024/083663 priority Critical patent/WO2025199708A1/zh
Priority to CN202480000587.8A priority patent/CN121002467A/zh
Publication of WO2025199708A1 publication Critical patent/WO2025199708A1/zh
Pending legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/26—Power supply means, e.g. regulation thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits

Definitions

  • the present application relates to the field of circuit design technology, and in particular to a vertical power supply system.
  • the power supply and the processor are located on the same plane, so that the distance between the power supply and the processor is relatively far, such as 2 to 3 cm, resulting in large power transmission loss.
  • the large power transmission loss is released in the form of heat, which in turn leads to poor heat dissipation of the power supply system.
  • the power transmission loss is calculated as follows: I*I*DCR, and DCR (Direct Current Resistance) is related to the power transmission distance. The longer the power transmission distance, the greater the DCR.
  • the processor is connected to the first side of the mainboard via a plurality of first fixing members, and the PB carrier board is connected to the second side of the mainboard via a plurality of second fixing members; the first side is the front side, and the second side is the back side, or the first side is the back side, and the second side is the front side;
  • the plurality of second fixing members correspond to the plurality of first fixing members one by one, and the second fixing members are connected to the first fixing members corresponding to the second fixing members through via holes on the mainboard;
  • the PB module is connected to the PB carrier board via a plurality of third fixing members, and the PB module is used to convert the input power into the target power;
  • the target power supply supplies power to the processor through the multiple third fixing members, the PB carrier board, the multiple second fixing members, the via holes on the mainboard, and the multiple first fixing members.
  • the input power enters the PB module through the input capacitor
  • the target power passes through the output capacitor and the plurality of third fixing members and enters the PB carrier board.
  • the PB module corresponds to multiple input capacitors and multiple output capacitors, and the number of output capacitors is greater than the number of input capacitors.
  • the PB module is used to convert an input power supply of a first voltage into a target power supply of a second voltage; the first voltage is a voltage supported by an external power supply, the second voltage is a voltage supported by the processor, and the first voltage is greater than the second voltage.
  • the power type supported by the second fixing member is the same as the power type supported by the first fixing member; the power type is a positive power pole or a negative power pole.
  • the PB module when the PB module is connected to the PB carrier board via a plurality of third fixing members, the PB module and the plurality of third fixing members are placed on the front side of the PB carrier board;
  • the plurality of second fixing members are placed on the back surface of the PB carrier board.
  • the processor is a high-performance processor used in artificial intelligence or big data
  • the high-performance processor includes a high-performance CPU, a high-performance GPU, and a high-performance DPU.
  • the processor and the PB carrier board are designed to be back-to-back, that is, the processor is connected to the first side of the motherboard through multiple first fixing members, and the PB carrier board is connected to the second side of the motherboard through multiple second fixing members, thereby significantly reducing the distance between the processor and the PB carrier board.
  • the distance between the processor and the PB carrier board is small. Therefore, when the PB module supplies power to the processor through the PB carrier board, the power transmission loss can be reduced and the heat dissipation of the power supply system is better.
  • the distance between the PB carrier board and the processor can limit power transmission losses. For example, if the distance is reduced from 2-3cm to 2-3mm, the distance is reduced by an order of magnitude, and the power transmission loss limit is reduced.
  • FIG1 is a schematic diagram of the horizontal power supply method proposed in this application.
  • FIG3 is a schematic structural diagram of the vertical power supply system proposed in this application.
  • the solid line represents the positive power connection between the VRM and the processor
  • the dashed line represents the negative power connection between the VRM and the processor.
  • Ground can be used to represent the negative power connection.
  • the positive and negative power connections can be routed on the motherboard.
  • FIG 2 is a schematic diagram of the vertical power supply method.
  • the VRM can be the power supply and the processor can be the powered device. Obviously, the VRM and the processor are placed back to back on two sides of the motherboard.
  • the solid line represents the positive power connection between the VRM and the processor
  • the dashed line represents the negative power connection between the VRM and the processor.
  • Ground can be used to represent the negative power connection.
  • the positive and negative power connections can be routed on the motherboard.
  • the vertical power supply method can significantly reduce the power supply transmission loss.
  • the smaller power supply transmission loss is released in the form of heat, it will lead to better heat dissipation of the power supply system.
  • power transmission loss is calculated as follows: I*I*DCR.
  • DCR is related to the power transmission distance; the shorter the power transmission distance, the smaller the DCR.
  • the operating current is high (such as 1000A)
  • a closer distance between the power supply and the processor can significantly reduce power transmission loss.
  • a vertical power supply system which may include: a processor, a motherboard, and a vertical power supply circuit.
  • the vertical power supply circuit may be a power supply, and the vertical power supply circuit may include a PB (Power Block) carrier board and a PB module (i.e., a small package power module).
  • PB Power Block
  • the vertical power supply circuit may only supply power to the processor, but not to other devices (such as memory, hard disk, etc.) except the processor. That is, the vertical power supply circuit is a power supply for the processor.
  • high-performance processors are required to perform computing and other processing functions. Therefore, a separate power supply can be provided for the high-performance processor, that is, the power supply can be used to power the high-performance processor alone, rather than having the power supply power multiple devices simultaneously.
  • a motherboard can also be called a motherboard.
  • the motherboard is a circuit board used to carry the processor and vertical power circuit. There is no restriction on the structure and design of this motherboard.
  • the vertical power circuit can be a power supply, and the vertical power circuit can power the processor using a vertical power supply method, that is, the vertical power circuit and the processor are placed back-to-back on opposite sides of the motherboard.
  • the vertical power circuit can be placed on the front of the motherboard and the processor can be placed on the back of the motherboard, or the vertical power circuit can be placed on the back of the motherboard and the processor can be placed on the front of the motherboard.
  • the vertical power supply system can include xPU, motherboard, PB carrier board and PB module.
  • xPU can be CPU, GPU, DPU, etc., and xPU acts as a processor.
  • Motherboard can be used as a main board.
  • PB carrier board and PB module can act as a vertical power supply circuit, that is, vertical power supply circuit.
  • the source circuit includes a PB carrier board and a PB module.
  • the processor is connected to the first side of the motherboard via multiple first fasteners
  • the PB carrier board is connected to the second side of the motherboard via multiple second fasteners.
  • the first side can be the front side
  • the second side can be the back side, or the first side can be the back side, and the second side can be the front side.
  • Figure 3 uses the example of a processor connected to the front side of the motherboard via multiple first fasteners, and the PB carrier board connected to the back side of the motherboard via multiple second fasteners.
  • the first fixture may include, but is not limited to, a BGA (Ball Grid Array) solder ball.
  • the first fixture may also be other types of solder balls, or other types of fixtures that can securely connect the processor to the motherboard.
  • the first fixture also has a conductive function, enabling electricity to flow from the motherboard to the processor.
  • the second fixing member may include, but is not limited to, a BGA solder ball.
  • the second fixing member may be another type of solder ball, or another type of fixing member, as long as it can securely connect the PB carrier board to the motherboard.
  • the second fixing member also has a conductive function, i.e., it can conduct electricity from the PB carrier board to the motherboard.
  • the number of the first fixing members may be greater than or equal to the number of the second fixing members.
  • FIG3 an example is given in which the number of the first fixing members is greater than the number of the second fixing members.
  • first fixing elements a1, a2, a6, and a7 do not correspond to any second fixing elements.
  • each second fixing member is connected to the corresponding first fixing member via a via on the mainboard, i.e., the second fixing member and the first fixing member are connected via the via.
  • second fixing member b1 is connected to first fixing member a3 via via c1 on the mainboard
  • second fixing member b2 is connected to first fixing member a4 via via c2 on the mainboard
  • second fixing member b3 is connected to first fixing member a5 via via c3 on the mainboard.
  • the vias on the motherboard can be vias that support electrical conduction, and the vias can include but are not limited to copper-plated vias, that is, copper-plated vias support electrical conduction.
  • the vias can also be other types of vias, as long as the vias support electrical conduction.
  • the via c1 between the second fixing member b1 and the first fixing member a3 is a copper-plated via
  • the via c2 between the second fixing member b2 and the first fixing member a4 is a copper-plated via
  • the via c3 between the second fixing member b3 and the first fixing member a5 is a copper-plated via.
  • the power type supported by the second fixture refers to the pin definition of the PB carrier board. That is, when a pin of the PB carrier board contacts the second fixture, the pin definition of that pin serves as the power type supported by the second fixture. For example, if a pin of the PB carrier board contacts the second fixture b1, and the pin definition of that pin is a positive power source, the power type of the second fixture b1 is a positive power source.
  • the power type supported by the second fixing part is the same as the power type supported by the first fixing part, which means that the pin definition corresponding to the second fixing part is the same as the pin definition corresponding to the first fixing part, and the PB carrier board can convert the output of the PB module into an output pin that corresponds one-to-one to the input pin of the processor.
  • the PB module can be connected to the PB carrier board via multiple third fixings, and the PB carrier board can be connected to the main board via multiple second fixings.
  • the PB module and multiple third fixings are placed on the front of the PB carrier board, i.e., the PB module is connected to the front of the PB carrier board via multiple third fixings.
  • the PB carrier board is connected to the main board via multiple second fixings
  • multiple second fixings are placed on the back of the PB carrier board, i.e., the back of the PB carrier board is connected to the main board via multiple second fixings.
  • the PB module When the PB module is connected to the PB carrier board through multiple third fixing members, the PB module is placed on the back of the PB carrier board. The PB module is connected to the back of the PB carrier board via the multiple third fixing members.
  • the multiple second fixing members are placed on the front of the PB carrier board, i.e., the front of the PB carrier board is connected to the main board via the multiple second fixing members.
  • the third fixing member may include, but is not limited to, a BGA solder ball.
  • the third fixing member may be another type of solder ball, or another type of fixing member that can securely connect the PB module to the PB carrier board.
  • the third fixing member also has a conductive function, enabling electrical conduction from the PB module to the PB carrier board.
  • the number of third fixing members may be greater than the number of second fixing members, the number of third fixing members may be equal to the number of second fixing members, or the number of third fixing members may be less than the number of second fixing members. There is no restriction on the number of third fixing members and it can be set according to actual application.
  • target optimization methods may include, but are not limited to, at least one of the following: copper optimization, stackup optimization, via optimization, and blind via optimization.
  • Copper optimization refers to optimizing the copper of the PB carrier board traces during the design process, such as optimizing copper size, copper thickness, and copper area. These optimization methods are used to reduce the DC resistance (DCR).
  • the stacking optimization method refers to optimizing the stacking of the PB carrier board during the design process of the PB carrier board. For example, if the PB carrier board includes multiple stacking layers, these stacking layers are optimized to reduce the DCR DC impedance.
  • the via optimization method refers to: during the design process of the PB carrier board, the vias of the PB carrier board are optimized, and the DCR DC impedance is reduced by optimizing the vias of the PB carrier board.
  • the blind hole optimization method refers to: during the design process of the PB carrier board, the blind holes of the PB carrier board are optimized, and the DCR DC impedance is reduced by optimizing the blind holes of the PB carrier board.
  • the target power supply can be provided to the processor through multiple third fixing members, PB carrier boards, multiple second fixing members, vias on the mainboard, and multiple first fixing members, thereby powering the processor through the target power supply.
  • the target power supply can be used to power only the processor without powering other devices.
  • the PB carrier board provides the target power supply to multiple second fixing parts
  • the multiple second fixing parts provide the target power supply to the vias on the mainboard
  • the vias on the mainboard provide the target power supply to multiple first fixing parts
  • the multiple first fixing parts provide the target power supply to the processor, that is, the processor is powered by the target power supply.
  • the PB module can obtain input power.
  • an external power supply can provide the input power to the PB module via the mainboard, the plurality of second fixing members, the PB carrier board, and the plurality of third fixing members.
  • the first voltage is a voltage supported by an external power supply, and thus the voltage of the input power supply is the first voltage.
  • the second voltage is a voltage supported by a processor, and thus the voltage of the target power supply is the second voltage.
  • the PB module can convert the first voltage input power to a target power at a second voltage (there are no restrictions on the conversion method), and then provide the target power at the second voltage to the PB carrier board via multiple third fixings.
  • the PB carrier board provides the target power at the second voltage to the processor via multiple second fixings, vias on the mainboard, and multiple first fixings.
  • PB modules when PB modules are deployed on a PB carrier board, there can be multiple PB modules.
  • the number of PB modules can be set according to the requirements of the processor, the size of the PB carrier board, and the size of the PB modules.
  • the PB module may correspond to multiple input capacitors and multiple output capacitors. There is no restriction on the number of input capacitors and the number of output capacitors, and they may be set arbitrarily.
  • the number of output capacitors is relatively large.
  • the processor can obtain a larger power supply, thereby meeting the needs of high-performance computing.
  • the number of output capacitors may be greater than the number of input capacitors.
  • the number of output capacitors may also be less than the number of input capacitors, or the number of output capacitors may be equal to the number of input capacitors.
  • the target power passes through the output capacitor (i.e., multiple output capacitors corresponding to the PB module) and multiple third fixing parts into the PB carrier board, and the target power passes through the output capacitor and multiple third fixing parts in turn into the PB carrier board.
  • the output capacitor i.e., multiple output capacitors corresponding to the PB module
  • the processor and the PB carrier board are designed back-to-back. That is, the processor is connected to the first side of the motherboard via multiple first fixings, and the PB carrier board is connected to the second side of the motherboard via multiple second fixings. This significantly reduces the distance between the processor and the PB carrier board. Because the distance between the processor and the PB carrier board is relatively small, when the PB module supplies power to the processor via the PB carrier board, power transmission losses can be reduced, and heat dissipation of the power supply system is improved.
  • the vertical power supply system may include: a processor, a mainboard and a vertical power supply circuit, and the vertical power supply circuit may include a PB carrier board and a PB module.
  • the processor may be connected to the first side of the motherboard via a plurality of first fixing members, and the PB carrier board may be connected to the second side of the motherboard via a plurality of second fixing members.
  • the first side may be the front side, and the second side may be the back side, or the first side may be the back side, and the second side may be the front side;
  • the PB module is connected to the PB carrier board via a plurality of third fixing members, the PB module being configured to convert an input power source into a target power source;
  • the PB module is used to convert an input power supply of a first voltage into a target power supply of a second voltage;
  • the first voltage may be a voltage supported by an external power supply,
  • the second voltage may be a voltage supported by a processor, and the first voltage is greater than the second voltage, such as the first voltage is 12V and the second voltage is 1V.
  • the power type supported by the second fixing member (such as the pin definition corresponding to the second fixing member) is the same as the power type supported by the first fixing member (such as the pin definition corresponding to the first fixing member); the power type is the positive pole of the power supply or the negative pole of the power supply.
  • the PB module and multiple third fixings are placed on the front side of the PB carrier board; when the PB carrier board is connected to the second side of the main board through multiple second fixings, multiple second fixings are placed on the back side of the PB carrier board.
  • the processor may be a high-performance processor used in artificial intelligence or big data; a high-performance processor may include but is not limited to a high-performance CPU, a high-performance GPU, and a high-performance DPU.
  • the PB carrier board can be a PB carrier board optimized using a target optimization method;
  • the target optimization method can include but is not limited to at least one of the following: copper plating optimization method, stacking optimization method, via optimization method, blind hole optimization method, and there is no restriction on this.
  • the via on the motherboard is a via that supports electrical conduction, and the via includes a copper-plated via.
  • the processor and the PB carrier board are designed back-to-back. That is, the processor is connected to the first side of the motherboard via multiple first fixings, and the PB carrier board is connected to the second side of the motherboard via multiple second fixings. This significantly reduces the distance between the processor and the PB carrier board. Because the distance between the processor and the PB carrier board is relatively small, when the PB module supplies power to the processor via the PB carrier board, power transmission losses can be reduced, and heat dissipation of the power supply system is improved.
  • the distance between the PB carrier board and the processor can limit power transmission losses. For example, if the distance is reduced from 2-3cm to 2-3mm, the distance is reduced by an order of magnitude, and the power transmission loss limit is reduced.

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Abstract

本申请提供一种垂直供电系统，所述垂直供电系统包括：处理器、主板和垂直电源电路，垂直电源电路包括PB承载板和PB模块；处理器通过多个第一固定件连接到主板的第一面，PB承载板通过多个第二固定件连接到主板的第二面；多个第二固定件与多个第一固定件一一对应，且第二固定件与该第二固定件对应的第一固定件通过主板上的过孔连接；PB模块通过多个第三固定件连接到PB承载板，PB模块，用于将输入电源转换为目标电源；所述目标电源经过多个第三固定件、PB承载板、多个第二固定件、主板上的过孔、多个第一固定件，为处理器供电。通过本申请的技术方案，能够降低供电传输损耗，供电系统的散热较好。

Description

一种垂直供电系统 技术领域
本申请涉及电路设计技术领域，尤其是涉及一种垂直供电系统。
背景技术
随着人工智能、大数据等应用需求的增长，对处理器的性能提出了更高要求，处理器的工作电流不断增加，如工作电流达到1000A及以上等。
在通过供电电源为处理器供电时，供电电源与处理器位于同一平面，使得供电电源与处理器之间的距离较远，如距离为2～3cm，从而导致供电传输损耗较大，而较大的供电传输损耗以热的形式释放，又会导致供电系统的散热较差。
比如说，供电传输损耗采用如下方式计算：I*I*DCR，而DCR(Direct Current Resistance，直流电阻)与供电传输距离有关，供电传输距离越大时DCR越大。
显然，在工作电流很大(如1000A)，且供电电源与处理器之间的距离较远(如距离为2～3cm)时，供电传输损耗较大，且供电系统的散热较差。
发明内容
本申请提供一种垂直供电系统，所述垂直供电系统包括：处理器、主板和垂直电源电路，所述垂直电源电路包括电源块PB承载板和PB模块；
所述处理器通过多个第一固定件连接到所述主板的第一面，所述PB承载板通过多个第二固定件连接到所述主板的第二面；所述第一面为正面，所述第二面为背面，或，所述第一面为背面，所述第二面为正面；
所述多个第二固定件与所述多个第一固定件一一对应，且第二固定件与该第二固定件对应的第一固定件通过所述主板上的过孔连接；
所述PB模块通过多个第三固定件连接到所述PB承载板，所述PB模块，用于将输入电源转换为目标电源；
所述目标电源经过所述多个第三固定件、所述PB承载板、所述多个第二固定件、所述主板上的所述过孔、所述多个第一固定件，为所述处理器供电。
一个例子中，所述垂直电源电路还包括所述PB模块对应的输入电容和输出电容，所述PB模块与所述输入电容连接，且所述PB模块与所述输出电容连接；
所述输入电源经过所述输入电容进入所述PB模块；
一个例子中，所述PB模块将所述输入电源转换为所述目标电源之后，所述目标电源经过所述输出电容、所述多个第三固定件进入所述PB承载板。
一个例子中，所述PB模块的数量为多个，针对每个PB模块，PB模块对应多个输入电容和多个输出电容，且输出电容的数量大于输入电容的数量。
一个例子中，所述PB模块，用于将第一电压的输入电源转换为第二电压的目标电源；所述第一电压是外部电源支持的电压，所述第二电压是所述处理器支持的电压，且所述第一电压大于所述第二电压。
在第二固定件与第一固定件对应时，该第二固定件支持的电源类型与该第一固定件支持的电源类型相同；该电源类型为电源正极或电源负极。
一个例子中，在所述PB模块通过多个第三固定件连接到所述PB承载板时，则所述PB承载板的正面放置所述PB模块和所述多个第三固定件；
在所述PB承载板通过多个第二固定件连接到所述主板的第二面时，则所述PB承载板的背面放置所述多个第二固定件。
一个例子中，所述第一固定件包括球栅阵列封装BGA焊球；所述第二固定件包括BGA焊球；所述第三固定件包括BGA焊球。
一个例子中，所述处理器为人工智能或大数据中采用的高性能处理器；
所述高性能处理器包括高性能CPU、高性能GPU、高性能DPU。
一个例子中，所述PB承载板是采用目标优化方式优化后的PB承载板；
所述目标优化方式包括以下至少一种：
敷铜优化方式、叠层优化方式、过孔优化方式、盲孔优化方式。
所述主板上的过孔为支持导电的过孔，且所述过孔包括镀铜过孔。
由以上技术方案可见，通过提出一种垂直供电系统，使得处理器与PB承载板为背靠背设计，即处理器通过多个第一固定件连接到主板的第一面，PB承载板通过多个第二固定件连接到主板的第二面，从而显著降低处理器与PB承载板之间的距离。由于处 理器与PB承载板之间的距离较小，因此，在PB模块通过PB承载板为处理器供电时，能够降低供电传输损耗，供电系统的散热较好。
比如说，在工作电流很大(如1000A)时，即使PB承载板与处理器之间的距离变化较小，也能够限制降低供电传输损耗。比如说，若距离从2～3cm降低为2～3mm，那么，距离低了一个数量级，且供电传输损耗限制降低。
通过采用PB模块实现供电，能够降低电源成本，提高用电效率。
附图说明
为了更加清楚地说明本申请实施例或者现有技术中的技术方案，下面将对本申请实施例或者现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请中记载的一些实施例，对于本领域普通技术人员来讲，还可以根据本申请实施例的这些附图获得其他的附图。
图1是本申请中提出的水平供电方式的示意图；
图2是本申请中提出的垂直供电方式的示意图；
图3是本申请中提出的垂直供电系统的结构示意图；
图4是本申请中提出的垂直电源电路的结构示意图。
具体实施方式
在本申请实施例使用的术语仅仅是出于描述特定实施例的目的，而非限制本申请。本申请和权利要求书中所使用的单数形式的“一种”、“所述”和“该”也旨在包括多数形式，除非上下文清楚地表示其它含义。还应当理解，本文中使用的术语“和/或”是指包含一个或多个相关联的列出项目的任何或所有可能组合。
应当理解，尽管在本申请实施例可能采用术语第一、第二、第三等来描述各种信息，但这些信息不应限于这些术语。这些术语仅用来将同一类型的信息彼此区分开。例如，在不脱离本申请范围的情况下，第一信息也可以被称为第二信息，类似地，第二信息也可以被称为第一信息。取决于语境，此外，所使用的词语“如果”可以被解释成为“在……时”或“当……时”或“响应于确定”。
在通过供电电源为处理器供电时，通常采用水平供电方式，水平供电方式是指：供 电电源与处理器位于同一个平面。参见图1所示，为水平供电方式的示意图。VRM(Voltage Regulator Module，电压调节模组)可以是供电电源，处理器可以是受电器件，显然，VRM和处理器位于同一个平面。
在图1中，实线表示VRM与处理器之间的电源正极连线，虚线表示VRM与处理器之间的电源负极连线，可以通过地(GND)表示电源负极连线。电源正极连线和电源负极连线可以是主板上部署的，即经过主板走线实现。
参见图1所示，供电电源与处理器位于同一个平面时，供电电源与处理器之间的距离较远，如距离为2～3cm。从而导致供电传输损耗较大，而较大的供电传输损耗以热的形式释放，又会导致供电系统的散热比较差。
比如说，供电传输损耗采用如下方式计算：I*I*DCR。DCR指的是，在直流电流(DC)条件下，电子组件或电路的电阻值。DCR影响电流流动的效率和电力损耗。DCR与供电传输距离有关，供电传输距离越大时DCR越大。
随着人工智能、大数据等应用需求的增长，对处理器的性能提出了更高要求。处理器的工作电流不断增加，如工作电流达到1000A及以上，如I为1000A。显然，在工作电流很大(如1000A)时，若供电电源与处理器之间的距离较远(如距离为2～3cm)，则供电传输损耗较大，且供电系统的散热较差。
针对上述发现，本申请中提出一种垂直供电系统，基于垂直供电系统，在通过供电电源为处理器供电时，可以采用垂直供电方式。比如说，垂直供电方式是指：供电电源与处理器背靠背放置在主板的两面(如正面和背面)。
参见图2所示，为垂直供电方式的示意图，VRM可以是供电电源，处理器可以是受电器件，显然，VRM和处理器背靠背放置在主板的两面。
在图2中，实线表示VRM与处理器之间的电源正极连线，虚线表示VRM与处理器之间的电源负极连线，可以通过地(GND)表示电源负极连线。电源正极连线和电源负极连线可以是主板上部署的，即经过主板走线实现。
参见图2所示，供电电源与处理器背靠背放置在主板的两面时，供电电源与处理器之间的距离较近，如距离为2～3mm。显然，与水平供电方式的距离相比，垂直供电方式的距离降低了一个数量级，DCR也会降低一个数量级。
垂直供电方式与水平供电方式相比，可以显著降低供电传输损耗，而较小的供电传输损耗以热的形式释放时，又会导致供电系统的散热比较好。
比如说，供电传输损耗采用如下方式计算：I*I*DCR，DCR与供电传输距离有关，供电传输距离越小时DCR越小。显然，在工作电流很大(如1000A)时，若供电电源与处理器之间的距离较近，则能够显著降低供电传输损耗。
本申请中提出一种垂直供电系统，该垂直供电系统可以包括：处理器、主板和垂直电源电路。垂直电源电路可以是供电电源，且垂直电源电路可以包括PB(Power Block，电源块)承载板和PB模块(即小封装电源模块)。
一个例子中，垂直电源电路可以只为处理器供电，而不为除处理器之外的其它器件(如内存、硬盘等)供电，即垂直电源电路是针对处理器的供电电源。
一个例子中，处理器可以为高性能处理器，如人工智能或大数据中采用的高性能处理器，当然，处理器也可以是其它场景中采用的高性能处理器。
比如说，在人工智能或大数据中，需要采用高性能处理器实现计算等处理功能。基于此，可以为高性能处理器单独提供供电电源，即，由供电电源单独为高性能处理器供电，而不是由供电电源同时为多个器件供电。
比如说，高性能处理器可以包括但不限于高性能CPU(Central Processing Unit，中央处理器)、高性能GPU(Graphics Processing Unit，图形处理器)、高性能DPU(Data Processing Unit，数据处理器)，可以将CPU、GPU、DPU等统称为xPU。当然，CPU、GPU、DPU只是几个示例，对此不做限制。
一个例子中，主板也可以称为母板(mother board)，主板是用于承载处理器和垂直电源电路的电路板，对此主板的结构和设计不做限制。
一个例子中，垂直电源电路可以是供电电源，垂直电源电路可以采用垂直供电方式为处理器供电，即，垂直电源电路与处理器背靠背放置在主板的两面。比如说，垂直电源电路放置在主板的正面，处理器放置在主板的背面，或者，垂直电源电路放置在主板的背面，处理器放置在主板的正面。
垂直电源电路可以包括PB承载板和PB模块，PB模块可以放置在PB承载板上。其中，PB承载板是用于承载PB模块的电路板，而PB模块是小封装电源模块，是用于提供电源的模块，即PB模块用于构建处理器的供电电源。
参见图3所示，为垂直供电系统的结构示意图，该垂直供电系统可以包括xPU、母板(mother board)、PB承载板和PB模块。xPU可以是CPU、GPU、DPU等，xPU作为处理器。母板可以作为主板。PB承载板和PB模块可以作为垂直电源电路，即垂直电 源电路包括PB承载板和PB模块。
参见图3所示，处理器通过多个第一固定件连接到主板的第一面，PB承载板通过多个第二固定件连接到主板的第二面。第一面可以为正面，第二面为背面，或者，第一面可以为背面，第二面为正面。图3以处理器通过多个第一固定件连接到主板的正面，PB承载板通过多个第二固定件连接到主板的背面为例。
一个例子中，第一固定件可以包括但不限于BGA(Ball Grid Array，球栅阵列封装)焊球。当然，第一固定件也可以是其它类型的焊球，或者，第一固定件也可以是其它类型的固定件，能够将处理器固定连接到主板即可。第一固定件除了固定连接功能，还具有导电功能，即电能够从主板导通到处理器。
第二固定件可以包括但不限于BGA焊球。第二固定件也可以是其它类型的焊球，或者，第二固定件也可以是其它类型的固定件，能够将PB承载板固定连接到主板即可。第二固定件还具有导电功能，即电能够从PB承载板导通到主板。
一个例子中，第一固定件的数量可以大于或者等于第二固定件的数量，在图3中，以第一固定件的数量大于第二固定件的数量为例进行说明。
多个第二固定件与多个第一固定件一一对应。针对每个第二固定件，该第二固定件会对应一个第一固定件，且该第二固定件最多对应一个第一固定件。针对每个第一固定件，该第一固定件可能对应一个第二固定件，且该第一固定件最多对应一个第二固定件，或者，该第一固定件可能未对应第二固定件。
比如说，假设多个第二固定件包括第二固定件b1-b3，多个第一固定件包括第一固定件a1-a7，那么，第二固定件b1对应第一固定件a3、第二固定件b2对应第一固定件a4、第二固定件b3对应第一固定件a5。然而，第一固定件a1、第一固定件a2、第一固定件a6、第一固定件a7并未对应第二固定件。
一个例子中，多个第二固定件与多个第一固定件一一对应时，针对每个第二固定件，该第二固定件与该第二固定件对应的第一固定件通过主板上的过孔连接，即通过过孔连通第二固定件与第一固定件。比如说，第二固定件b1与第一固定件a3通过主板上的过孔c1连接，第二固定件b2与第一固定件a4通过主板上的过孔c2连接，第二固定件b3与第一固定件a5通过主板上的过孔c3连接。
比如说，主板上的过孔可以为支持导电的过孔，且过孔可以包括但不限于镀铜过孔，即通过镀铜过孔支持导电功能。当然，过孔也可以为其它类型的过孔，只要过孔支持导 电功能即可。比如说，第二固定件b1与第一固定件a3之间的过孔c1为镀铜过孔，第二固定件b2与第一固定件a4之间的过孔c2为镀铜过孔，第二固定件b3与第一固定件a5之间的过孔c3为镀铜过孔。
比如说，在第二固定件与第一固定件对应时，该第二固定件支持的电源类型与该第一固定件支持的电源类型相同，其中，该电源类型可以为电源正极或者电源负极(如通过地(GND)表示电源负极)。比如说，第二固定件b1支持的电源类型与第一固定件a3支持的电源类型相同，如第二固定件b1支持电源正极，且第一固定件a3支持电源正极。第二固定件b2支持的电源类型与第一固定件a4支持的电源类型相同，如第二固定件b2支持电源负极，且第一固定件a4支持电源负极。第二固定件b3支持的电源类型与第一固定件a5支持的电源类型相同，如第二固定件b3支持电源负极，且第一固定件a5支持电源负极。
一个例子中，第二固定件支持的电源类型是指PB承载板的管脚定义，即PB承载板的管脚与第二固定件接触时，该管脚的管脚定义作为第二固定件支持的电源类型。比如说，PB承载板的某个管脚与第二固定件b1接触时，若该管脚的管脚定义是电源正极，则第二固定件b1的电源类型为电源正极。
第一固定件支持的电源类型是指处理器(如处理器芯片)的管脚定义，即处理器的管脚与第一固定件接触时，该管脚的管脚定义作为第一固定件支持的电源类型。比如说，处理器的某个管脚与第一固定件a3接触时，若该管脚的管脚定义是电源正极，则第一固定件a3的电源类型为电源正极。
综上所述，第二固定件支持的电源类型与第一固定件支持的电源类型相同是指，第二固定件对应的管脚定义与第一固定件对应的管脚定义相同，PB承载板能够将PB模块的输出转化成和处理器的输入管脚一一对应的输出管脚。
继续参见图3所示，PB模块可以通过多个第三固定件连接到PB承载板，且PB承载板可以通过多个第二固定件连接到主板。比如说，在PB模块通过多个第三固定件连接到PB承载板时，PB承载板的正面放置PB模块和多个第三固定件，即PB模块通过多个第三固定件连接到PB承载板的正面。在PB承载板通过多个第二固定件连接到主板时，则PB承载板的背面放置多个第二固定件，即PB承载板的背面通过多个第二固定件连接到主板。或者，
在PB模块通过多个第三固定件连接到PB承载板时，PB承载板的背面放置PB模 块和多个第三固定件，即PB模块通过多个第三固定件连接到PB承载板的背面。在PB承载板通过多个第二固定件连接到主板时，则PB承载板的正面放置多个第二固定件，即PB承载板的正面通过多个第二固定件连接到主板。
图3中以PB承载板的正面放置PB模块和多个第三固定件为例。
一个例子中，第三固定件可以包括但不限于BGA焊球。第三固定件也可以是其它类型的焊球，或，其它类型的固定件，能够将PB模块固定连接到PB承载板即可。第三固定件还具有导电功能，即电能够从PB模块导通到PB承载板。
一个例子中，第三固定件的数量可以大于第二固定件的数量，第三固定件的数量可以等于第二固定件的数量，第三固定件的数量可以小于第二固定件的数量，对此第三固定件的数量不做限制，可以根据实际应用进行设置。
一个例子中，PB承载板可以是采用目标优化方式优化后的PB承载板，即，采用目标优化方式对PB承载板进行优化，对此优化方式不做限制。通过采用目标优化方式对PB承载板进行优化，可以降低DCR直流阻抗。
比如说，目标优化方式可以包括但不限于以下至少一种：敷铜优化方式、叠层优化方式、过孔优化方式、盲孔优化方式。敷铜优化方式是指：在PB承载板的设计过程中，对PB承载板的走线进行敷铜优化，如敷铜大小优化、敷铜厚度敷铜、敷铜面积优化等，通过这些优化方式来降低DCR直流阻抗。
叠层优化方式是指：在PB承载板的设计过程中，对PB承载板的叠层进行优化，如PB承载板包括多个叠层，对这些叠层进行优化，降低DCR直流阻抗。
过孔优化方式是指：在PB承载板的设计过程中，对PB承载板的过孔进行优化，通过对PB承载板的过孔进行优化，来降低DCR直流阻抗。
盲孔优化方式是指：在PB承载板的设计过程中，对PB承载板的盲孔进行优化，通过对PB承载板的盲孔进行优化，来降低DCR直流阻抗。
继续参见图3所示，PB模块将输入电源转换为目标电源，在得到目标电源之后，目标电源经过PB模块、多个第三固定件、PB承载板、多个第二固定件、主板上的过孔、多个第一固定件，为处理器供电。
比如说，可以通过多个第三固定件、PB承载板、多个第二固定件、主板上的过孔、多个第一固定件，最终将目标电源提供给处理器，从而通过目标电源为处理器供电，即 可以只通过目标电源为处理器供电，而不为其它器件供电。
比如说，PB承载板将目标电源提供给多个第二固定件，多个第二固定件将目标电源提供给主板上的过孔，主板上的过孔将目标电源提供给多个第一固定件，多个第一固定件将目标电源提供给处理器，即通过目标电源为处理器供电。
一个例子中，PB模块可以获取输入电源。比如说，外部电源可以通过主板、多个第二固定件、PB承载板和多个第三固定件将输入电源提供给PB模块。
PB模块焊接在PB承载板上，PB模块是小封装电源模块，是用于提供电源的模块。PB模块在得到输入电源之后，PB模块可以将输入电源转换为目标电源。比如说，PB模块可以将第一电压的输入电源转换为第二电压的目标电源。
比如说，第一电压是外部电源支持的电压，因此，输入电源的电压为第一电压。第二电压是处理器支持的电压，因此，目标电源的电压为第二电压。
第一电压可以大于第二电压。比如说，第一电压可以是12V电压，第二电压可以是1V电压或者0.75V电压，对此第一电压和第二电压不做限制。
PB模块在得到第一电压的输入电源之后，可以将第一电压的输入电源转换为第二电压的目标电源，对此转换方式不做限制，并通过多个第三固定件将第二电压的目标电源提供给PB承载板。PB承载板通过多个第二固定件、主板上的过孔、多个第一固定件，将第二电压的目标电源提供给处理器。
一个例子中，由于PB承载板和处理器为背靠背，供电传输距离较小，因此，PB承载板在得到目标电源之后，可以通过主板上的过孔直接给处理器供电，即，目标电源通过多个第二固定件、主板上的过孔、多个第一固定件到达处理器。
PB承载板汇集多个PB模块的输出。比如说，PB承载板可以得到多个PB模块的目标电源，对多个PB模块的目标电源进行汇集，得到汇集后的目标电源。PB承载板通过主板上的过孔将汇集后的目标电源提供给处理器。
参见图4所示，为垂直电源电路的结构示意图，图4是垂直电源电路的俯视图。除了PB承载板和PB模块，垂直电源电路还可以包括PB模块对应的电容。可以将电容区分为输入电容和输出电容，因此，垂直电源电路还可以包括PB模块对应的输入电容和输出电容。PB模块与输入电容连接(图4中并未示出该连接关系)，且PB模块与输出电容连接(图4中并未示出该连接关系)。
参见图4所示，在PB承载板上部署PB模块时，PB模块的数量可以为多个，PB模块的数量可以根据处理器的需求、PB承载板的尺寸、PB模块的尺寸设定。
比如说，为了满足处理器的供电需求，需要9个PB模块同时为处理器供电，且基于PB承载板的尺寸和PB模块的尺寸，PB承载板上能够同时部署9个PB模块，那么，可以在PB承载板上部署9个PB模块或者更多PB模块。
参见图4所示，针对每个PB模块，该PB模块可以对应多个输入电容和多个输出电容，对此输入电容的数量和输出电容的数量不做限制，可以任意设定。
比如说，为了满足处理器的需求，输出电容的数量比较多，通过设计多个输出电容，使得处理器能够得到更大的电源，从而满足高性能计算需求。
比如说，输出电容的数量可以大于输入电容的数量，当然，输出电容的数量也可以小于输入电容的数量，输出电容的数量也可以等于输入电容的数量。
一个例子中，针对每个PB模块，PB模块在得到输入电源时，输入电源经过输入电容(即该PB模块对应的多个输入电容)进入PB模块。
一个例子中，针对每个PB模块，PB模块将输入电源转换为目标电源之后，目标电源经过输出电容(即该PB模块对应的多个输出电容)、多个第三固定件进入PB承载板，目标电源依次经过输出电容、多个第三固定件进入PB承载板。
由以上技术方案可见，通过提出一种垂直供电系统，使得处理器与PB承载板为背靠背设计，即处理器通过多个第一固定件连接到主板的第一面，PB承载板通过多个第二固定件连接到主板的第二面，从而显著降低处理器与PB承载板之间的距离。由于处理器与PB承载板之间的距离较小，因此，在PB模块通过PB承载板为处理器供电时，能够降低供电传输损耗，供电系统的散热较好。
比如说，在工作电流很大(如1000A)时，即使PB承载板与处理器之间的距离变化较小，也能够限制降低供电传输损耗。比如说，若距离从2～3cm降低为2～3mm，那么，距离低了一个数量级，且供电传输损耗限制降低。
通过采用PB模块实现供电，能够降低电源成本，提高用电效率。
垂直供电方式与水平供电方式相比，能够减少传输损耗，提高用电效率。验证结果显示，对10万台服务器，生命周期内可以节省4亿元电费。
基于与上述垂直供电系统同样的申请构思，本申请实施例中提出一种垂直供电 系统，该垂直供电系统可以包括：处理器、主板和垂直电源电路，且该垂直电源电路可以包括PB承载板和PB模块。
处理器可以通过多个第一固定件连接到主板的第一面，且PB承载板可以通过多个第二固定件连接到主板的第二面。第一面可以为正面，第二面可以为背面，或，第一面可以为背面，第二面可以为正面；
多个第二固定件与多个第一固定件一一对应，针对每个第二固定件，该第二固定件与该第二固定件对应的第一固定件通过主板上的过孔连接；
PB模块通过多个第三固定件连接到PB承载板，PB模块，用于将输入电源转换为目标电源；
目标电源经过多个第三固定件、PB承载板、多个第二固定件、主板上的过孔、多个第一固定件，为处理器供电。需要注意的是，目标电源只用于为处理器(单个处理器)供电，而不用于为除该处理器之外的其它器件供电。
一个例子中，垂直电源电路还可以包括PB模块对应的输入电容和输出电容，PB模块与输入电容连接，且PB模块与输出电容连接；
输入电源经过输入电容进入PB模块；PB模块将输入电源转换为目标电源之后，目标电源经过输出电容、多个第三固定件进入PB承载板。
一个例子中，PB模块的数量可以为多个，针对每个PB模块，该PB模块对应多个输入电容和多个输出电容，且输出电容的数量大于输入电容的数量。
一个例子中，PB模块，用于将第一电压的输入电源转换为第二电压的目标电源；第一电压可以是外部电源支持的电压，第二电压可以是处理器支持的电压，且第一电压大于第二电压，如第一电压为12V，第二电压为1V。
一个例子中，在第二固定件与第一固定件对应时，该第二固定件支持的电源类型(如第二固定件对应的管脚定义)与该第一固定件支持的电源类型(如第一固定件对应的管脚定义)相同；该电源类型为电源正极或电源负极。
一个例子中，在PB模块通过多个第三固定件连接到PB承载板时，则PB承载板的正面放置PB模块和多个第三固定件；在PB承载板通过多个第二固定件连接到主板的第二面时，则PB承载板的背面放置多个第二固定件。
一个例子中，第一固定件可以包括但不限于BGA焊球；第二固定件可以包括但 不限于BGA焊球；第三固定件可以包括但不限于BGA焊球。
一个例子中，处理器可以为人工智能或大数据中采用的高性能处理器；高性能处理器可以包括但不限于高性能CPU、高性能GPU、高性能DPU。
一个例子中，PB承载板可以是采用目标优化方式优化后的PB承载板；目标优化方式可以包括但不限于以下至少一种：敷铜优化方式、叠层优化方式、过孔优化方式、盲孔优化方式，对此不做限制。
一个例子中，主板上的过孔为支持导电的过孔，且过孔包括镀铜过孔。
由以上技术方案可见，通过提出一种垂直供电系统，使得处理器与PB承载板为背靠背设计，即处理器通过多个第一固定件连接到主板的第一面，PB承载板通过多个第二固定件连接到主板的第二面，从而显著降低处理器与PB承载板之间的距离。由于处理器与PB承载板之间的距离较小，因此，在PB模块通过PB承载板为处理器供电时，能够降低供电传输损耗，供电系统的散热较好。
比如说，在工作电流很大(如1000A)时，即使PB承载板与处理器之间的距离变化较小，也能够限制降低供电传输损耗。比如说，若距离从2～3cm降低为2～3mm，那么，距离低了一个数量级，且供电传输损耗限制降低。
通过采用PB模块实现供电，能够降低电源成本，提高用电效率。
以上所述仅为本申请的实施例而已，并不用于限制本申请。对于本领域技术人员来说，本申请可以有各种更改和变化。凡在本申请的精神和原理之内所作的任何修改、等同替换、改进等，均应包含在本申请的权利要求范围之内。

Claims (10)

  1. 一种垂直供电系统，其特征在于，所述垂直供电系统包括：处理器、主板和垂直电源电路，所述垂直电源电路包括电源块PB承载板和PB模块；
    所述处理器通过多个第一固定件连接到所述主板的第一面，所述PB承载板通过多个第二固定件连接到所述主板的第二面；所述第一面为正面，所述第二面为背面，或，所述第一面为背面，所述第二面为正面；
    所述多个第二固定件与所述多个第一固定件一一对应，且第二固定件与该第二固定件对应的第一固定件通过所述主板上的过孔连接；
    所述PB模块通过多个第三固定件连接到所述PB承载板，所述PB模块，用于将输入电源转换为目标电源；
    所述目标电源经过所述多个第三固定件、所述PB承载板、所述多个第二固定件、所述主板上的所述过孔、所述多个第一固定件，为所述处理器供电。
  2. 根据权利要求1所述的垂直供电系统，其特征在于，
    所述垂直电源电路还包括所述PB模块对应的输入电容和输出电容，所述PB模块与所述输入电容连接，且所述PB模块与所述输出电容连接；
    所述输入电源经过所述输入电容进入所述PB模块；
    所述PB模块将所述输入电源转换为所述目标电源之后，所述目标电源经过所述输出电容、所述多个第三固定件进入所述PB承载板。
  3. 根据权利要求2所述的垂直供电系统，其特征在于，
    所述PB模块的数量为多个，针对每个PB模块，PB模块对应多个输入电容和多个输出电容，且输出电容的数量大于输入电容的数量。
  4. 根据权利要求1所述的垂直供电系统，其特征在于，
    所述PB模块，用于将第一电压的输入电源转换为第二电压的目标电源；
    所述第一电压是外部电源支持的电压，所述第二电压是所述处理器支持的电压，且所述第一电压大于所述第二电压。
  5. 根据权利要求1所述的垂直供电系统，其特征在于，
    在第二固定件与第一固定件对应时，该第二固定件支持的电源类型与该第一固定件支持的电源类型相同；该电源类型为电源正极或电源负极。
  6. 根据权利要求1所述的垂直供电系统，其特征在于，
    在所述PB模块通过多个第三固定件连接到所述PB承载板时，则所述PB承载板的正面放置所述PB模块和所述多个第三固定件；
    在所述PB承载板通过多个第二固定件连接到所述主板的第二面时，则所述PB承载板的背面放置所述多个第二固定件。
  7. 根据权利要求1-6任一所述的垂直供电系统，其特征在于，
    所述第一固定件包括球栅阵列封装BGA焊球；
    所述第二固定件包括BGA焊球；
    所述第三固定件包括BGA焊球。
  8. 根据权利要求1-6任一所述的垂直供电系统，其特征在于，
    所述处理器为人工智能或大数据中采用的高性能处理器；
    所述高性能处理器包括高性能CPU、高性能GPU、高性能DPU。
  9. 根据权利要求1-6任一项所述的垂直供电系统，其特征在于，
    所述PB承载板是采用目标优化方式优化后的PB承载板；
    所述目标优化方式包括以下至少一种：
    敷铜优化方式、叠层优化方式、过孔优化方式、盲孔优化方式。
  10. 根据权利要求1-6任一所述的垂直供电系统，其特征在于，
    所述主板上的过孔为支持导电的过孔，且所述过孔包括镀铜过孔。
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