WO2025145488A1 - 麦克风模组 - Google Patents

麦克风模组 Download PDF

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Publication number
WO2025145488A1
WO2025145488A1 PCT/CN2024/076026 CN2024076026W WO2025145488A1 WO 2025145488 A1 WO2025145488 A1 WO 2025145488A1 CN 2024076026 W CN2024076026 W CN 2024076026W WO 2025145488 A1 WO2025145488 A1 WO 2025145488A1
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WIPO (PCT)
Prior art keywords
sound pickup
sound
hole
pickup hole
sealing ring
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PCT/CN2024/076026
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English (en)
French (fr)
Inventor
王德星
张金宇
唐远华
黄少屏
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AAC Technologies Holdings Shenzhen Co Ltd
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AAC Acoustic Technologies Shenzhen Co Ltd
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Priority to US18/764,339 priority Critical patent/US12610169B2/en
Publication of WO2025145488A1 publication Critical patent/WO2025145488A1/zh
Anticipated expiration legal-status Critical
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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/08—Mouthpieces; Microphones; Attachments therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones

Definitions

  • the existing microphone module has only one MEMS microphone, which has poor sound collection effect, resulting in the effect of sound recognition being difficult to meet current needs.
  • Another existing microphone module includes multiple MEMS microphone units and external structural parts that respectively fix the microphone units. When the microphone units are assembled with the external structural parts, an additional microphone front cavity is generated, which has a significant impact on the microphone pickup sound response. Therefore, certain constraints need to be placed on the front cavity structure and the spacing between multiple microphones.
  • the invention provides a microphone module, comprising a MEMS microphone with a sound inlet hole, a PCB board and a shell arranged in sequence from top to bottom, wherein there are at least two MEMS microphones and are arranged at intervals from each other, each of the MEMS microphones is electrically connected to the PCB board, a first sound pickup hole is provided on the PCB board corresponding to the sound inlet hole of each MEMS microphone, a second sound pickup hole is provided on the shell corresponding to the first sound pickup hole, the sound inlet hole, the first sound pickup hole and the second sound pickup hole are connected in sequence, and the diameter size of the first sound pickup hole is defined as D1mm, and the distance between the central axes of adjacent sound inlet holes is greater than or equal to 25D1mm and less than or equal to 43D1mm.
  • the diameter of the neck of the conical funnel-shaped sound pickup hole is greater than or equal to 4D1mm and less than or equal to 5D1mm.
  • the MEMS microphones are arranged sequentially along the same straight line.
  • the beneficial effect of the invention is: using at least two MEMS microphones, in conjunction with a PCB board and a housing, the perception of sound waves is achieved through the sound inlet hole on the MEMS microphone, the first sound pickup hole on the PCB board, and the second sound pickup hole on the housing.
  • the diameter size of the first sound pickup hole is D1mm, and the distance between the central axes of the adjacent sound inlet holes is greater than or equal to 25D1mm and less than or equal to 43D1mm, which enables the microphone module to pick up sounds at different positions, so that the microphone module has a good sound collection effect and improves the effect of recognizing sound.
  • FIG. 3 is a front view of the microphone module shown in FIG. 2 .
  • FIG. 5 is a partial structural diagram of the shell of the microphone module shown in FIG. 2 , illustrating the positional relationship between the sealing ring and the substrate.
  • the microphone module 100 of the first embodiment of the invention includes a housing 1, a PCB board 2 and at least two MEMS microphones 3.
  • the MEMS microphone 3, the PCB board 2 and the housing 1 are arranged sequentially from top to bottom. Multiple MEMS microphones are arranged at intervals.
  • Each MEMS microphone 3 has a sound inlet hole 31, which is electrically connected to the PCB board 2.
  • a first sound pickup hole 21 is provided on the PCB board 2 corresponding to the sound inlet hole 31 of the MEMS microphone 3, and a second sound pickup hole 13 is provided on the housing 1 corresponding to the first sound pickup hole 21, and the sound inlet hole 31, the first sound pickup hole 21 and the second sound pickup hole 13 are connected in sequence.
  • the number of the MEMS microphones 3 is at least 3. In this embodiment, 4 MEMS microphones 3 are used. All MEMS microphones 3 are located on a PCB board 2, and the PCB board 2 is located on a housing 1.
  • the connection method between the MEMS microphone 3 and the PCB board 2, and between the PCB board 2 and the housing 1 is not limited, for example, a connection method of adhesive bonding or welding is used.
  • the PCB board 2 is provided with a plurality of first sound pickup holes 21, and the first sound pickup holes 21 pass through the upper and lower surfaces of the PCB board 2.
  • the housing 1 is provided with a plurality of second sound pickup holes 13, and the second sound pickup holes 13 pass through the upper and lower surfaces of the housing 1.
  • the number of the first sound pickup holes 21, the number of the second sound pickup holes 13 and the number of the MEMS microphones 3 are the same.
  • the sound inlet holes 31 of the MEMS microphone 3 and the first sound pickup holes 21 are arranged in a one-to-one correspondence, and the first sound pickup holes 21 and the second sound pickup holes 13 are arranged in a one-to-one correspondence, and the sound is transmitted to the sound inlet holes 31 through the second sound pickup holes 13 and the first sound pickup holes 21.
  • the diameter of the first sound pickup hole 21 is greater than the diameter of the sound inlet hole 31
  • the diameter of the second sound pickup hole 13 is greater than the diameter of the first sound pickup hole 21 .
  • the second sound pickup hole 13 is a cone-shaped funnel-shaped sound pickup hole, which includes a neck and a cone-shaped portion connected to the neck, and the neck of the cone-shaped funnel-shaped sound pickup hole corresponds to the first sound pickup hole 21, and the neck of the cone-shaped funnel-shaped sound pickup hole is located on the upper side of the cone-shaped portion of the cone-shaped funnel-shaped sound pickup hole.
  • the second sound pickup hole 13 is a horn-shaped sound pickup hole.
  • the left and right ends of the substrate 11 have baffles 14, and the PCB board 2 is located between the left baffle and the right baffle 14.
  • the baffle can be omitted.
  • Figures 2 to 5 schematic diagrams of the substrate 11 without the baffle are shown.
  • a sealing ring installation position 111 is provided on the substrate 11, and the sealing ring 12 is located in the sealing ring installation position 111.
  • the sealing ring 12 protrudes from the sealing ring installation position 111.
  • the sealing ring 12 can also be flush with the sealing ring installation position 111.
  • the sealing ring installation position 111 is a groove provided on the substrate 11.
  • the sealing ring 12 is threadedly connected to the sealing ring installation position 111 or has an interference fit with the sealing ring installation position 111.
  • the number of the sealing ring installation position 111 and the sealing ring 12 is equal to the number of the MEMS microphones 3.
  • the PCB board 2 is connected to the upper end of the sealing ring 12, and a first through hole is provided on the substrate 11 corresponding to the center hole of the sealing ring 12.
  • the first through hole is connected to the center hole of the corresponding sealing ring 12, and together constitutes a second sound pickup hole 13.
  • the center hole of the sealing ring 12 serves as the neck of the conical funnel-shaped sound pickup hole, that is, as the upper sound pickup hole 131
  • the first through hole serves as the conical portion of the conical funnel-shaped sound pickup hole, that is, as the lower sound pickup hole 132.
  • the sealing ring installation position 111 is protruding from the substrate 11.
  • the diameter of the sound inlet hole 31 is defined as D mm
  • the diameter of the first sound pickup hole 21 is defined as D1 mm.
  • the diameter D1 mm of the first sound pickup hole 21 is greater than the diameter Dmm of the sound inlet hole 31, thereby ensuring the sound recognition effect.
  • the aperture size of the upper sound pickup hole 131 is D2 mm
  • D2 mm is greater than 4 D1 mm (4D1 mm means 4 times D1 mm) and less than or equal to 5D1 mm.
  • the aperture size D2 of the upper sound pickup hole 131 is 2-3 mm.
  • the distance between the central axes of the sound inlet holes 31 of the adjacent MEMS microphones 3 is D3 mm, and D3 mm is greater than or equal to 25D1mm and less than or equal to 43D1mm. Based on this design, the microphone module can pick up sounds at different positions, effectively improving the sound recognition effect.
  • the distance D3 between the central axes of the sound inlet holes 31 of the adjacent MEMS microphones 3 is 20-30 mm.
  • the distance between the surface of the PCB board 2 close to the side of the shell 1 and the surface of the shell 1 away from the PCB board 2 is less than 7mm.
  • the MEMS microphones 3 are arranged sequentially along the same straight line.
  • the microphone module 100 provided in this embodiment uses at least two MEMS microphones 3, cooperates with the same PCB board 2 and the same housing 1, and realizes the perception of sound waves through the sound inlet hole 31 on the MEMS microphone 3, the first sound pickup hole 21 on the PCB board 2 and the second sound pickup hole 13 on the housing 1.
  • the microphone module 100 has a good sound collection effect and improves the effect of recognizing sound.
  • the microphone module provided in this embodiment is applied to the automotive field, it can realize sound pickup at different positions in the car.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)

Abstract

一种麦克风模组，包括壳体、PCB板和至少两个具有入声孔的MEMS麦克风，所述MEMS麦克风、所述PCB板和所述壳体从上至下顺次设置，所述MEMS麦克风电连接所述PCB板，所述PCB板上对应所述MEMS麦克风的入声孔设有第一拾音孔，所述壳体上对应所述第一拾音孔设有第二拾音孔，所述入声孔、所述第一拾音孔和所述第二拾音孔依次相通。定义所述第一拾音孔的直径尺寸为D1mm，相邻所述入声孔中心轴的距离大于等于25D1mm且小于等于43D1mm。采用多个MEMS麦克风，配合PCB板和壳体，通过MEMS麦克风上的入声孔、PCB板上的第一拾音孔以及壳体上的第二拾音孔实现声波的感知，通过如此的声波感知结构，使得麦克风模组的收声效果好，提高了识别声音的效果。

Description

麦克风模组 技术领域
发明涉及一种麦克风模组，具体指一种具有多个MEMS麦克风的麦克风模组。
 背景技术
随着智能技术的迅速发展，语音识别技术的发展愈加关键，这对麦克风模组的识别能力也提出了更高的要求。麦克风模组中的MEMS（微型机电系统） 麦克风是基于MEMS技术制造的麦克风，具有质量小，体积轻巧等诸多优点，在很多领域均有应用，例如应用在手机领域、汽车领域。
现有的麦克风模组只具有一个MEMS麦克风，其收声效果差，导致识别声音的效果难以满足现今的需求。另一种现有的麦克风模组包括多个MEMS麦克风单体和分别固定所述麦克风单体的外结构件。所述麦克风单体与所述外结构件装配时会产生额外的麦克风前腔，该前腔对麦克风拾音频响有较大影响，因此需对前腔结构，多个麦克风之间的间距做一定的约束。
因此，有必要提供一种能够提高声音识别效果的麦克风模组。
 实用新型内容
发明针对解决麦克风模组的声音识别效果差的问题，提供一种新型的麦克风模组。
为实现上述目的，发明提供了一种麦克风模组，包括从上至下顺次设置的具有入声孔的MEMS麦克风、PCB板和壳体，所述MEMS麦克风至少两个且彼此之间间隔设置，每个所述MEMS麦克风均电连接所述PCB板，所述PCB板上对应每个所述MEMS麦克风的入声孔均设有第一拾音孔，所述壳体上对应所述第一拾音孔设有第二拾音孔，所述入声孔、所述第一拾音孔和所述第二拾音孔依次相通，定义所述第一拾音孔的直径尺寸为D1mm，相邻所述入声孔中心轴的距离大于等于25D1mm且小于等于43D1mm。
作为一种改进，所述第一拾音孔的直径尺寸大于所述入声孔的直径尺寸，所述第二拾音孔的直径尺寸大于所述第一拾音孔的直径尺寸。
作为一种改进，所述第二拾音孔为锥状漏斗型拾音孔，所述第一拾音孔、所述锥状漏斗型拾音孔的颈部和所述锥状漏斗型拾音孔的锥形部从上至下顺次设置。
作为一种改进，所述壳体包括基板和密封圈，所述基板上设有密封圈安装位，所述密封圈位于所述密封圈安装位中，所述PCB板连接所述密封圈，所述密封圈的中心孔作为所述锥状漏斗型拾音孔的颈部，所述基板上对应所述中心孔设有第一通孔，所述第一通孔作为所述锥状漏斗型拾音孔的锥形部。
作为一种改进，所述密封圈螺纹连接所述密封圈安装位或与所述密封圈安装位过盈配合。
作为一种改进，所述锥状漏斗型拾音孔的颈部的直径尺寸大于等于4D1mm且小于等于5D1mm。
作为一种改进，所述MEMS麦克风沿同一直线顺次设置。
作为一种改进，所述PCB板靠近所述壳体一侧的表面与所述壳体远离所述PCB板一侧的表面之间的距离小于7mm。
发明的有益效果是：采用至少两个MEMS麦克风，配合PCB板和壳体，通过MEMS麦克风上的入声孔、PCB板上的第一拾音孔以及壳体上的第二拾音孔实现声波的感知。第一拾音孔的直径尺寸D1mm，相邻所述入声孔中心轴的距离大于等于25D1mm且小于等于43D1mm，能够使得麦克风模组实现对不同位置上的声音的拾取，使得麦克风模组的收声效果好，提高了识别声音的效果。
 附图说明
图1是发明第一实施方式的麦克风模组的剖面图。
图2是发明第二实施方式的麦克风模组的立体图。
图3是图2所示麦克风模组的正视图。
图4是图2所示麦克风模组的基板的立体结构图。
图5是图2所示麦克风模组的壳体的部分结构图，展示了密封圈和基板的位置关系。
 具体实施方式
下面结合图1至图5对发明作详细描述。
如图1，发明第一实施方式的麦克风模组100包括壳体1、PCB板2和至少两个MEMS麦克风3。所述MEMS麦克风3、所述PCB板2和所述壳体1从上至下顺次设置。多个MEMS麦克风之间间隔设置。每个所述MEMS麦克风3具有入声孔31，其电连接所述PCB板2。所述PCB板2上对应所述MEMS麦克风3的入声孔31设有第一拾音孔21，所述壳体1上对应所述第一拾音孔21设有第二拾音孔13，所述入声孔31、所述第一拾音孔21和所述第二拾音孔13依次相通。
所述MEMS麦克风3数量至少为3个，在本实施例中，采用4个MEMS麦克风3。所有MEMS麦克风3位于一个PCB板2上，所述PCB板2位于一个所述壳体1上，不限定MEMS麦克风3和PCB板2、以及PCB板2和壳体1的连接方式，例如采用胶粘接或焊接的连接方式。所述PCB板2上设有若干第一拾音孔21，第一拾音孔21贯穿PCB板2上下表面，所述壳体1设有若干第二拾音孔13，第二拾音孔13贯穿壳体1上下表面，第一拾音孔21的数量、第二拾音孔13的数量和MEMS麦克风3的数量相同。MEMS麦克风3的入声孔31和第一拾音孔21一一对应设置，第一拾音孔21和第二拾音孔13一一对应设置，通过第二拾音孔13和第一拾音孔21将声音传至入声孔31。
在本实施例中，所述第一拾音孔21的直径尺寸大于所述入声孔31的直径尺寸，所述第二拾音孔13的直径尺寸大于所述第一拾音孔21的直径尺寸。
在本实施例中，第二拾音孔13包括上拾音孔131和下拾音孔132，上拾音孔131位于下拾音孔132上侧，上拾音孔131连通下拾音孔132。
本实施例中，所述第二拾音孔13为锥状漏斗型拾音孔，锥状漏斗型拾音孔包括颈部和连接颈部的锥形部，锥状漏斗型拾音孔的颈部正对应所述第一拾音孔21，锥状漏斗型拾音孔的颈部位于锥状漏斗型拾音孔的锥形部的上侧。在其他可选择的实施方式中，第二拾音孔13为喇叭型拾音孔。
作为一种例举，基板11的左右两端具有挡板14，PCB板2位于左侧挡板和右侧挡板14的中间。在第二实施方式中，挡板可以省略。如图2至图5，为基板11不具有挡板的示意图。
如图1，所述基板11上设有密封圈安装位111，所述密封圈12位于所述密封圈安装位111中，密封圈12突出于密封圈安装位111，当然密封圈12也可和密封圈安装位111平齐。密封圈安装位111为设于基板11上的凹槽。具体的，所述密封圈12螺纹连接所述密封圈安装位111或与密封圈安装位111过盈配合。所述密封圈安装位111和密封圈12的数量均等于MEMS麦克风3的数量。所述PCB板2连接所述密封圈12上端，基板11上对应密封圈12的中心孔设有第一通孔，第一通孔和与其对应的密封圈12的中心孔连通，共同构成第二拾音孔13。具体的，如图3，所述密封圈12的中心孔作为所述锥状漏斗型拾音孔的颈部，即作为上拾音孔131，所述第一通孔作为所述锥状漏斗型拾音孔的锥形部，即作为下拾音孔132。在第二实施方式中，如图2至图5所示，密封圈安装位111突出于基板11设置。
本实施例中，定义所述入声孔31的直径尺寸为D mm，所述第一拾音孔21的直径尺寸为D1 mm，所述第一拾音孔21的直径尺寸D1 mm大于入声孔31的直径尺寸Dmm，从而保证声音识别效果。在本实施例中，上拾音孔131的孔径尺寸为D2 mm，D2 mm大于4 D1 mm（4D1 mm表示D1 mm的4倍）且小于等于5D1 mm。具优选地，上拾音孔131的孔径尺寸D2为2-3mm。
本实施例中，相邻所述MEMS麦克风3的入声孔31中心轴的距离为D3 mm，D3 mm大于等于25D1mm且小于等于43D1mm，基于这一设计，能够使得麦克风模组实现对不同位置上的声音的拾取，有效提高了声音识别效果。优选地，相邻所述MEMS麦克风3的入声孔31中心轴的距离D3为20-30 mm。所述PCB板2靠近所述壳体1一侧的表面与所述壳体1远离所述PCB板2一侧的表面之间的距离小于7mm。
本实施例中，所述MEMS麦克风3沿同一直线顺次设置。
通过上述构造，可知本实施例提供的麦克风模组100采用至少两个MEMS麦克风3，配合同一PCB板2和同一壳体1，通过MEMS麦克风3上的入声孔31、PCB板2上的第一拾音孔21以及壳体1上的第二拾音孔13实现声波的感知，通过多个声波感知结构，使得麦克风模组100的收声效果好，提高了识别声音的效果。本实施例提供的麦克风模组应用于汽车领域时，可实现汽车内不同位置上的声音拾取。
以上所述的仅是发明的实施方式，在此应当指出，对于本领域的普通技术人员来说，在不脱离发明创造构思的前提下，还可以做出改进，但这些均属于发明的保护范围。

Claims (8)

  1. 一种麦克风模组，其特征在于：包括从上至下顺次设置的具有入声孔的MEMS麦克风、PCB板和壳体，所述MEMS麦克风至少两个且彼此之间间隔设置，每个所述MEMS麦克风均电连接所述PCB板，所述PCB板上对应每个所述MEMS麦克风的入声孔均设有第一拾音孔，所述壳体上对应所述第一拾音孔设有第二拾音孔，所述入声孔、所述第一拾音孔和所述第二拾音孔依次相通，定义所述第一拾音孔的直径尺寸为D1mm，相邻所述入声孔中心轴的距离大于等于25D1mm且小于等于43D1mm。
  2. 根据权利要求1所述的麦克风模组，其特征在于：所述第一拾音孔的直径尺寸大于所述入声孔的直径尺寸，所述第二拾音孔的直径尺寸大于所述第一拾音孔的直径尺寸。
  3. 根据权利要求2所述的麦克风模组，其特征在于：所述第二拾音孔为锥状漏斗型拾音孔，所述第一拾音孔、所述锥状漏斗型拾音孔的颈部和所述锥状漏斗型拾音孔的锥形部从上至下顺次设置。
  4. 根据权利要求3所述的麦克风模组，其特征在于：所述壳体包括基板和密封圈，所述基板上设有密封圈安装位，所述密封圈位于所述密封圈安装位中，所述PCB板连接所述密封圈，所述密封圈的中心孔作为所述锥状漏斗型拾音孔的颈部，所述基板上对应所述中心孔设有第一通孔，所述第一通孔作为所述锥状漏斗型拾音孔的锥形部。
  5. 根据权利要求4所述的麦克风模组，其特征在于：所述密封圈螺纹连接所述密封圈安装位或与所述密封圈安装位过盈配合。
  6. 根据权利要求3至5中任意一项所述的麦克风模组，其特征在于：所述锥状漏斗型拾音孔的颈部的直径尺寸大于等于4D1mm且小于等于5D1mm。
  7. 根据权利要求1所述的麦克风模组，其特征在于：所述MEMS麦克风沿同一直线顺次设置。
  8. 根据权利要求1所述的麦克风模组，其特征在于：所述PCB板靠近所述壳体一侧的表面与所述壳体远离所述PCB板一侧的表面之间的距离小于7mm。
PCT/CN2024/076026 2024-01-05 2024-02-05 麦克风模组 Pending WO2025145488A1 (zh)

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CN215187376U (zh) * 2021-04-21 2021-12-14 兴科迪科技（泰州）有限公司 一种车载阵列式数字麦克风
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CN207603917U (zh) * 2017-12-21 2018-07-10 歌尔科技有限公司 麦克风的密封结构及电子设备
CN209692990U (zh) * 2019-05-09 2019-11-26 联想(北京)有限公司 一种声音获取装置及电子设备
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