WO2025065337A1 - 一种mems麦克风 - Google Patents

一种mems麦克风 Download PDF

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Publication number
WO2025065337A1
WO2025065337A1 PCT/CN2023/122032 CN2023122032W WO2025065337A1 WO 2025065337 A1 WO2025065337 A1 WO 2025065337A1 CN 2023122032 W CN2023122032 W CN 2023122032W WO 2025065337 A1 WO2025065337 A1 WO 2025065337A1
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WO
WIPO (PCT)
Prior art keywords
diaphragm
back plate
mems microphone
adhesion
insulating layer
Prior art date
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Pending
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PCT/CN2023/122032
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English (en)
French (fr)
Inventor
赵转转
王凯杰
张睿
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AAC Technologies Holdings Shenzhen Co Ltd
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AAC Acoustic Technologies Shenzhen Co Ltd
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Publication date
Application filed by AAC Acoustic Technologies Shenzhen Co Ltd filed Critical AAC Acoustic Technologies Shenzhen Co Ltd
Priority to PCT/CN2023/122032 priority Critical patent/WO2025065337A1/zh
Priority to US18/393,754 priority patent/US12477278B2/en
Publication of WO2025065337A1 publication Critical patent/WO2025065337A1/zh
Anticipated expiration legal-status Critical
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/003—Mems transducers or their use

Definitions

  • the invention belongs to the field of acoustic and electrical technology, and in particular relates to a MEMS microphone.
  • the traditional MEMS microphone chip structure mainly includes a base structure with a back cavity, and a diaphragm and back plate structure located on the top of the base.
  • the diaphragm and back plate structure constitute a capacitor system.
  • an anti-adhesion column (dimple) structure is usually provided between the back plate and the diaphragm.
  • the dimples can be provided on the back plate side or on the diaphragm side.
  • a pit will be left at the position of the diaphragm facing the dimples on the back plate.
  • the object of the present invention is to provide a MEMS microphone, which can solve the problem in the related art that the diaphragm is easily broken under the repeated impact of dimples.
  • a MEMS microphone comprises a substrate having a back cavity and a capacitor system arranged on the substrate, wherein the capacitor system comprises a back plate and a diaphragm arranged opposite to and spaced from the back plate, an anti-adhesion member is provided on the surface of the back plate facing the diaphragm or on the surface of the diaphragm facing the back plate, and when the diaphragm moves to make the anti-adhesion member contact the diaphragm and the back plate at the same time, the anti-adhesion member can be elastically deformed along the vibration direction of the diaphragm.
  • the anti-adhesion component includes a connecting portion connected to the back plate or the diaphragm, a bending portion extending from the connecting portion toward the diaphragm or the back plate, and an abutting portion connected to one end of the bending portion away from the connecting portion, and when the diaphragm moves so that the anti-adhesion component contacts the diaphragm or the back plate, the abutting portion abuts against the diaphragm or the back plate.
  • the capacitor system further comprises a first electrode member arranged on a side of the back plate close to the diaphragm, the first electrode member being opposite to and spaced from the diaphragm, and the connecting portion of the anti-adhesion member being fixed to a surface of a side of the first electrode member away from the back plate.
  • a surface of the first electrode element on one side away from the back plate is flush with a surface of the back plate facing the diaphragm.
  • the anti-adhesion member is a spring, and the length of the anti-adhesion member extends along the vibration direction of the diaphragm.
  • the interior of the anti-adhesion component is hollow or solid.
  • the anti-adhesion member is an insulator or at least one end of the anti-adhesion member is an insulating end.
  • the MEMS microphone further includes a first insulating layer respectively connected to the substrate and the diaphragm, and a second insulating layer respectively connected to the diaphragm and the back plate, the back plate, the first insulating layer and the diaphragm together form a sound cavity, and the back plate is provided with a sound hole communicating with the sound cavity.
  • the MEMS microphone further includes a protection layer disposed outside the first insulating layer and the second insulating layer, one side of the protection layer is connected to the substrate, and the other side of the protection layer extends to be flush with the second insulating layer.
  • the beneficial effect of the present invention is that when the diaphragm vibrates under a large sound pressure until the anti-adhesion member contacts the diaphragm and the back plate at the same time, the diaphragm will continue to move under the action of the sound pressure and the electric field force, compressing the anti-adhesion member until the restoring force provided by the anti-adhesion member is greater than the electric field force and the sound pressure, the diaphragm movement speed is 0, and the diaphragm begins to move away from the back plate.
  • the anti-adhesion member will provide a buffer for the movement of the diaphragm, avoiding the rapid concentration of stress at the contact position of the diaphragm with the anti-adhesion member, thereby preventing the formation of pits on the diaphragm and preventing the diaphragm from breaking under repeated impacts of the anti-adhesion member.
  • FIG1 is a cross-sectional view of an anti-adhesion component provided by the present invention disposed on a back plate in a MEMS microphone;
  • FIG2 is an enlarged view of detail A in FIG1 ;
  • FIG3 is a cross-sectional view of a MEMS microphone provided by the present invention in which an anti-adhesion member is disposed on a diaphragm;
  • FIG. 4 is an enlarged view of detail B in FIG. 3 .
  • An embodiment of the present invention provides a MEMS microphone, including a substrate having a back cavity 11 and a capacitor system arranged on the substrate, the capacitor system including a back plate 2 and a diaphragm 3 opposite to and spaced from the back plate 2, the surface of the back plate 2 facing the diaphragm 3 or the surface of the diaphragm 3 facing the back plate 2 is provided with an anti-adhesion member 4, when the diaphragm 3 moves so that the anti-adhesion member 4 contacts the diaphragm 3 and the back plate 2 at the same time, the anti-adhesion member 4 can undergo elastic deformation along the vibration direction of the diaphragm 3.
  • the diaphragm 3 When the diaphragm 3 vibrates under the action of a large sound pressure until the anti-adhesion member 4 contacts the diaphragm 3 and the back plate 2 at the same time, the diaphragm 3 will continue to move under the action of the sound pressure and the electric field force, compressing the anti-adhesion member 4 until the restoring force provided by the anti-adhesion member 4 is greater than the electric field force and the sound pressure, the movement speed of the diaphragm 3 is 0, and the diaphragm 3 begins to move away from the back plate 2.
  • the anti-adhesion member 4 will provide a buffer for the movement of the diaphragm 3, avoiding the rapid concentration of stress on the contact position of the diaphragm 3 with the anti-adhesion member 4, thereby preventing the formation of pits on the diaphragm 3 and preventing the diaphragm 3 from breaking under the repeated impact of the anti-adhesion member 4.
  • the anti-adhesion member 4 includes a connection portion 41 connected to the back plate 2 or the diaphragm 3, a bending portion 42 extending from the connection portion 41 toward the diaphragm 3 or the back plate 2, and a contact portion 43 connected to the end of the bending portion 42 away from the connection portion 41.
  • the contact portion 43 abuts against the diaphragm 3 or the back plate 2.
  • the anti-adhesion member 4 can elastically extend or elastically contract along the vibration direction of the diaphragm 3, so that the anti-adhesion member 4 provides a buffer for the movement of the diaphragm 3.
  • two bending portions 42 can be provided, and the two bending portions 42 are connected, and the connection portion 41 and the contact portion 43 are respectively connected to the two bending portions 42.
  • the bending portion 42 can be U-shaped, which is convenient for realizing the elastic extension or contraction of the anti-adhesion member 4 along the vibration direction of the diaphragm.
  • the number of the bending portions 42 is set according to actual needs, such as one, three, four, etc.; the bending portion 42 can also be V-shaped; the connecting portion 41 and the abutting portion 43 can be connected to the middle or end of the bending portion 42, for example, the connecting portion 41 is connected to the end of the bending portion 42, and the abutting portion 43 is connected to the middle of the bending portion 42.
  • the anti-adhesion member 4 is a spring, and the length of the anti-adhesion member 4 extends along its protruding direction, so as to achieve elastic extension or contraction of the anti-adhesion member 4 along its protruding direction.
  • the interior of the anti-adhesion member 4 is hollow or solid, as shown in Figures 2 and 4, preferably solid, which is conducive to reducing the manufacturing difficulty of the anti-adhesion member 4.
  • the cross-sectional shape of the anti-adhesion member 4 can be a combination of one or more of a circle, a sector or a polygon, preferably a circle, which can reduce the contact area between the substrate and the anti-adhesion member 4, thereby reducing the adhesion between the substrate and the anti-adhesion member 4, effectively avoiding the adhesion between the diaphragm 3 and the substrate, and thus improving the reliability of the MEMS microphone.
  • the number of anti-adhesion members 4 is set according to actual needs, such as one, three, seven and ten, etc. All anti-adhesion members 4 are spaced and evenly distributed along the circumferential direction, which can make the stress on the diaphragm 3 or the back plate 2 more uniform, and further avoid the diaphragm 3 or the back plate 2 from being fractured by force.
  • the capacitor system also includes a first electrode member 5 arranged on a side of the back plate 2 close to the diaphragm 3, and a second electrode member (not shown) arranged on a side of the diaphragm 3 close to the back plate 2.
  • the first electrode member 5 and the second electrode member are spaced apart and arranged opposite to each other.
  • the anti-adhesion member 4 is fixed to the surface of the first electrode member 5 on one side away from the back plate 2.
  • a plurality of anti-adhesion members 4 may be provided, and the plurality of anti-adhesion members 4 are evenly distributed on the first electrode member 5.
  • a mounting groove (not shown) is provided on the side of the back plate 2 close to the diaphragm 3.
  • the first electrode member 5 is installed in the mounting groove so that the surface of the first electrode member 5 on one side away from the back plate 2 is flush with the surface of the back plate 2 facing the diaphragm 3, which is conducive to preventing the diaphragm 3 from contacting the back plate 2.
  • the anti-adhesion member 4 is fixed to a surface of the second electrode member away from the diaphragm 3 .
  • a plurality of anti-adhesion members 4 may be provided, and the plurality of anti-adhesion members 4 are evenly distributed on the second electrode member.
  • the first electrode member 5 and the second electrode member are always insulated to ensure that the capacitance of the capacitance system can be changed, thereby realizing the corresponding function of the microphone.
  • the anti-adhesion member 4 is an insulator or at least one end of the anti-adhesion member 4 is an insulating end, so that when the diaphragm 3 moves to the anti-adhesion member 4 and is respectively connected to the diaphragm 3 and the back plate 2, the diaphragm 3 and the back plate 2 are insulated.
  • the anti-adhesion member 4 can be made of an insulating material as a whole; or, one end of the anti-adhesion member 4 is made of an insulating material, for example, the end of the anti-adhesion member 4 connected to the back plate 2 or the diaphragm 3 is made of an insulating material; or, both ends of the anti-adhesion member 4 are made of insulating materials.
  • the anti-adhesion member 4 can be a conductor, that is, the anti-adhesion member 4 is made of a conductive material, and the insulating end of the anti-adhesion member 4 can be formed by coating an insulating layer.
  • first electrode member 5 and the second electrode member are both conductors, made of polysilicon-doped or single-crystal silicon-doped conductive materials.
  • the back plate 2 and the diaphragm 3 will carry charges of opposite polarities to form a capacitor system.
  • the diaphragm 3 vibrates under the action of sound waves, the distance between the first electrode member 5 and the second electrode member will change, causing the capacitance of the capacitor system to change, thereby converting the sound wave signal into an electrical signal to achieve the corresponding function of the microphone.
  • the MEMS microphone further includes a first insulating layer 6 connected to the substrate and the diaphragm 3, and a second insulating layer 7 connected to the diaphragm 3 and the back plate 2, respectively.
  • the back plate 2 is provided with a sound hole 21 connected to the sound cavity 8.
  • the first insulating layer 6 and the second insulating layer 7 can both be made of semiconductor silicon oxide insulating material; the first insulating layer 6 can both support the diaphragm 3 and ensure the insulation between the diaphragm 3 and the substrate; the second insulating layer 7 can both support the back plate 2 and ensure the insulation between the back plate 2 and the diaphragm 3.
  • the sound holes 21 can connect the sound cavity 8 and the external environment, so that the sound wave airflow can enter or flow out of the sound cavity 8; when the pressure (sound wave) acts on the diaphragm 3 through the multiple sound holes 21, the diaphragm 3 vibrates in the direction of approaching or moving away from the back plate 2 so that the capacitance of the capacitor between the diaphragm 3 and the back plate 2 changes, thereby generating an electrical signal corresponding to the change in pressure (sound wave), and the electrical signal is output through an external circuit connected to the capacitor system, ultimately realizing the function of a MEMS microphone.
  • the MEMS microphone also includes a protective layer 9 arranged on the outside of the first insulating layer 6 and the second insulating layer 7. One side of the protective layer 9 is connected to the substrate, and the other side extends to be flush with the second insulating layer 7.
  • the protective layer 9 can be made of materials such as single crystal silicon, polycrystalline silicon or silicon nitride, and the protective layer 9 can protect the diaphragm 3.
  • the positions of the back plate 2 and the diaphragm 3 can be adjusted as long as the two can form a capacitor system, that is, the back plate 2 can be located between the diaphragm 3 and the base, or the diaphragm 3 can be located between the back plate 2 and the base.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)

Abstract

一种MEMS麦克风，包括具有背腔（11）的基底和设置在基底上的电容系统，电容系统包括背板（2）以及与背板（2）相对且间隔设置的振膜（3），背板（2）的朝向振膜（3）的表面或振膜（3）的朝向背板（2）的表面设有防黏连件（4），其特征在于，当振膜（3）运动至使防黏连件（4）同时与振膜（3）和背板（2）接触时，防黏连件（4）可沿振膜（3）的振动方向发生弹性形变。该MEMS麦克风的防黏连件（4）具有弹性，可以给振膜（3）的运动提供缓冲，避免振膜（3）的与防黏连件（4）相接触位置所受应力快速集中，从而防止在振膜（3）上形成凹坑，避免振膜（3）在防黏连件（4）的反复冲击下断裂。

Description

一种MEMS麦克风 技术领域
本发明属于声电技术领域，尤其涉及一种MEMS麦克风。
 背景技术
传统的MEMS麦克风芯片结构主要包括具有背腔的基底结构、以及位于基底上部的振膜与背板结构，振膜与背板结构组成了电容系统，当声压作用于振膜时，正对背板与背对背板的振膜两面存在压强差，使得振膜做靠近背板或远离背板的运动，从而引起振膜与背板间电容的变化，实现声音信号到电信号的转换。
在相关技术中，当振膜在声压的作用下靠近背板运动时，为了防止振膜和背板接触导致的麦克风短路，同时为了降低吸膜风险，通常会在背板和振膜之间设置有防黏连柱(dimple)结构，dimples可以设置在背板侧，也可以设置在振膜侧。然而，对于设置在背板侧的dimples，当振膜在较大的声压的作用下朝靠近或远离背板的运动时，在振膜正对背板dimples的位置会留下凹坑，凹坑反复被作用会导致此位置应力集中，当应力超过振膜材料的断裂强度，振膜发生断裂；同理，对于设置在振膜侧的dimples，在背板正对振膜dimples的位置也会由于振膜的反复冲击而留下凹坑，对背板的断裂也留下隐患。
因此，有必要提供一种新的MEMS麦克风解决上述技术问题。
 技术问题
本发明的目的在于提供一种MEMS麦克风，能够解决相关技术中振膜在dimples的反复冲击下容易发生断裂的问题。
 技术解决方案
一种MEMS麦克风，包括具有背腔的基底和设置在所述基底上的电容系统，所述电容系统包括背板以及与所述背板相对且间隔设置的振膜，所述背板的朝向所述振膜的表面或所述振膜的朝向所述背板的表面设有防黏连件，当所述振膜运动至使所述防黏连件同时与所述振膜和所述背板接触时，所述防黏连件可沿所述振膜的振动方向发生弹性形变。
可选地，所述防黏连件包括连接于所述背板或所述振膜的连接部、自所述连接部朝向所述振膜或所述背板延伸的弯折部，以及连接于所述弯折部远离所述连接部一端的抵接部，当所述振膜运动至使所述防黏连件与所述振膜或所述背板接触时，所述抵接部抵接于所述振膜或所述背板。
可选地，所述电容系统还包括设置于所述背板靠近所述振膜的一侧的第一电极件，所述第一电极件与所述振膜相对且间隔设置，所述防黏连件的所述连接部固定于所述第一电极件远离所述背板的一侧表面。
可选地，所述第一电极件远离所述背板的一侧表面与所述背板的朝向所述振膜的表面相齐平。
可选地，所述防黏连件为弹簧，且所述防黏连件的长度沿所述振膜的振动方向延伸。
可选地，所述防黏连件的内部中空或实心设置。
可选地，所述防黏连件为绝缘体或所述防黏连件的至少一端为绝缘端。
可选地，所述MEMS麦克风还包括分别连接于所述基底和所述振膜的第一绝缘层、以及分别连接于所述振膜和所述背板的第二绝缘层，所述背板、所述第一绝缘层和所述振膜共同围合形成声腔，所述背板设有与所述声腔连通的声孔。
可选地，所述MEMS麦克风还包括设置在所述第一绝缘层和所述第二绝缘层的外侧的保护层，所述保护层的一侧与所述基底相连，另一侧延伸至与所述第二绝缘层相齐平。
 有益效果
本发明的有益效果在于：当振膜在较大的声压作用下振动至防黏连件同时与振膜和背板接触时，振膜会在声压和电场力的作用下继续运动，压缩防黏连件，直到防黏连件提供的回复力大于电场力和声压，振膜运动速度为0，振膜开始做远离背板的运动。在该过程中，防黏连件会给振膜的运动提供缓冲，避免振膜的与防黏连件相接触位置所受应力快速集中，从而防止在振膜上形成凹坑，避免振膜在防黏连件的反复冲击下断裂。
 附图说明
图1为本发明提供的MEMS麦克风中防黏连件设置在背板上的剖视图；
图2是图1中细节A的放大图；
图3为本发明提供的MEMS麦克风中防黏连件设置在振膜上的剖视图；
图4是图3中细节B的放大图。
 本发明的实施方式
下面结合附图和实施方式对本发明作进一步说明。
请参阅图1和图3，本发明实施例提供了一种MEMS麦克风，包括具有背腔11的基底和设置在基底上的电容系统，电容系统包括背板2以及与背板2相对且间隔设置的振膜3，背板2的朝向振膜3的表面或振膜3的朝向背板2的表面设有防黏连件4，当振膜3运动至使防黏连件4同时与振膜3和背板2接触时，防黏连件4可沿振膜3的振动方向发生弹性形变。
当振膜3在较大的声压作用下振动至防黏连件4同时与振膜3和背板2接触时，振膜3会在声压和电场力的作用下继续运动，压缩防黏连件4，直到防黏连件4提供的回复力大于电场力和声压，振膜3运动速度为0，振膜3开始做远离背板2的运动。在该过程中，防黏连件4会给振膜3的运动提供缓冲，避免振膜3的与防黏连件4相接触位置所受应力快速集中，从而防止在振膜3上形成凹坑，避免振膜3在防黏连件4的反复冲击下断裂。
请参阅图2和图4，在一些实施例中，防黏连件4包括连接于背板2或振膜3的连接部41、自连接部41朝向振膜3或背板2延伸的弯折部42，以及连接于弯折部42远离连接部41一端的抵接部43，当振膜3运动至使防黏连件4与振膜3或背板2接触时，抵接部43抵接于振膜3或背板2。具体的，弯折部42内具有空隙，使得防黏连件4可以沿振膜3的振动方向弹性伸长或弹性收缩，实现防黏连件4给振膜3的运动提供缓冲。其中，弯折部42可以设置两个，两个弯折部42相连，且连接部41和抵接部43分别与两个弯折部42相连，弯折部42可以呈U型，便于实现防黏连件4沿振膜的振动方向的弹性伸长或收缩。
应当理解的是，弯折部42的数量根据实际需要设置，例如一个、三个、四个等；弯折部42还可以呈V型；连接部41和抵接部43可以与弯折部42的中部或端部相连，例如，连接部41与弯折部42的端部相连，抵接部43与弯折部42的中部相连。
在另一些实施例中，防黏连件4为弹簧，且防黏连件4的长度沿其凸起方向延伸，实现防黏连件4沿其凸起方向的弹性伸长或收缩。
防黏连件4的内部中空或实心设置，如图2和图4所示，优选为实心设置，有利于降低防黏连件4的制造难度。防黏连件4的横截面形状可以为圆形、扇形或多边形中的一种或多种的组合，优选为圆形，可以使基底与防黏连件4之间的接触面积减小，从而降低了基底与防黏连件4的粘黏力，有效避免了振膜3与基底产生粘黏现象，进而提高了MEMS麦克风的可靠性。防黏连件4的数量根据实际需要设置，例如一个、三个、七个和十个等，所有的防黏连件4沿周向间隔且均匀分布，可以使振膜3或背板2所受的应力更加均匀，进一步避免振膜3或背板2受力断裂。
请参阅图1和图3，电容系统还包括设置于背板2靠近振膜3的一侧的第一电极件5、以及设置于振膜3靠近背板2的一侧的第二电极件（未图示），第一电极件5与第二电极件间隔且相对设置，在振膜3向靠近或远离背板2的方向振动时，第一电极件5和第二电极件之间电容的电容量产生变化。
请参阅图1和图2，在一些实施例中，防黏连件4固定于第一电极件5远离背板2的一侧表面，防黏连件4可以设置多个，且多个防黏连件4在第一电极件5上均匀分布。具体的，背板2靠近振膜3的一侧设有安装槽（未图示），第一电极件5安装在安装槽内，以使第一电极件5远离背板2的一侧表面与背板2的朝向振膜3的表面相齐平，有利于防止振膜3与背板2相接触。
请参阅图3和图4，在另一些实施例中，防黏连件4固定于第二电极件远离振膜3的一侧表面，防黏连件4可以设置多个，且多个防黏连件4在第二电极件上均匀分布。
在本发明中，第一电极件5和第二电极件始终保持绝缘设置，以保证电容系统的电容能够发生改变，从而实现麦克风的相应功能。
在一些实施例中，防黏连件4为绝缘体或防黏连件4的至少一端为绝缘端，以使在振膜3运动至防黏连件4分别与振膜3和背板2相连时，振膜3和背板2绝缘设置。其中，防黏连件4可以整体由绝缘材料制成；或者，防黏连件4的一端由绝缘材料制成，例如，防黏连件4与背板2或振膜3相连的一端由绝缘材料制成；或者，防黏连件4的两端均由绝缘材料制成。应当理解的是，当防黏连件4的至少一端为绝缘端时，防黏连件4可以为导电体，即防黏连件4由导电材料制成，防黏连件4的绝缘端可以通过涂覆绝缘层形成。
需要说明的是，第一电极件5和第二电极件均为导电体，由多晶硅掺杂或单晶硅掺杂导电材料制成，在MEMS麦克风的通电工作状态下，背板2和振膜3会带上极性相反的电荷，形成电容系统。当振膜3在声波的作用下产生振动时，第一电极件5和第二电极件之间的距离会发生变化，从而导致电容系统的电容发生改变，从而将声波信号转化为了电信号，实现麦克风的相应功能。
请参阅图1和图3，MEMS麦克风还包括分别连接于基底和振膜3的第一绝缘层6、以及分别连接于振膜3和背板2的第二绝缘层7，背板2、第一绝缘层6和振膜3共同围合形成声腔8，背板2设有与声腔8连通的声孔21。其中，第一绝缘层6和第二绝缘层7可以均由半导体氧化硅绝缘材料制成；第一绝缘层6既可以支撑振膜3，也可以保证振膜3和基底之间的绝缘；第二绝缘层7既可以支撑背板2，也可以保证背板2和振膜3之间的绝缘。声孔21可以连通声腔8和外界环境，使得声波气流可以进入或流出声腔8；当压力(声波)通过多个声孔21作用在振膜3上时，振膜3向靠近或远离背板2的方向振动以使得振膜3与背板2之间电容的电容量产生变化，从而可以生成与压力(声波)的变化相对应的电信号，该电信号通过与电容系统连接的外部电路输出，最终实现MEMS麦克风的功能。
请参阅图1和图3，MEMS麦克风还包括设置在第一绝缘层6和第二绝缘层7的外侧的保护层9，保护层9的一侧与基底相连，另一侧延伸至与第二绝缘层7相齐平；其中，保护层9可以由单晶硅、多晶硅或氮化硅等材料制成，保护层9可以保护振膜3。
需要说明的是，背板2和振膜3的位置是可以调整的，只要两者能够形成电容系统即可，即可以是背板2位于振膜3与基座之间，也可以是振膜3位于背板2与基座之间。
以上所述的仅是本发明的实施方式，在此应当指出，对于本领域的普通技术人员来说，在不脱离本发明创造构思的前提下，还可以做出改进，但这些均属于本发明的保护范围。

Claims (9)

  1. 一种MEMS麦克风，包括具有背腔的基底和设置在所述基底上的电容系统，所述电容系统包括背板以及与所述背板相对且间隔设置的振膜，所述背板的朝向所述振膜的表面或所述振膜的朝向所述背板的表面设有防黏连件，其特征在于，当所述振膜运动至使所述防黏连件同时与所述振膜和所述背板接触时，所述防黏连件可沿所述振膜的振动方向发生弹性形变。
  2. 根据权利要求1所述的MEMS麦克风，其特征在于，所述防黏连件包括连接于所述背板或所述振膜的连接部、自所述连接部朝向所述振膜或所述背板延伸的弯折部，以及连接于所述弯折部远离所述连接部一端的抵接部，当所述振膜运动至使所述防黏连件与所述振膜或所述背板接触时，所述抵接部抵接于所述振膜或所述背板。
  3. 根据权利要求2所述的MEMS麦克风，其特征在于，所述电容系统还包括设置于所述背板靠近所述振膜的一侧的第一电极件，所述第一电极件与所述振膜相对且间隔设置，所述防黏连件的所述连接部固定于所述第一电极件远离所述背板的一侧表面。
  4. 根据权利要求3所述的MEMS麦克风，其特征在于，所述第一电极件远离所述背板的一侧表面与所述背板的朝向所述振膜的表面相齐平。
  5. 根据权利要求1所述的MEMS麦克风，其特征在于，所述防黏连件为弹簧，且所述防黏连件的长度沿所述振膜的振动方向延伸。
  6. 根据权利要求1所述的MEMS麦克风，其特征在于，所述防黏连件的内部中空或实心设置。
  7. 根据权利要求1所述的MEMS麦克风，其特征在于，所述防黏连件为绝缘体或所述防黏连件的至少一端为绝缘端。
  8. 根据权利要求1所述的MEMS麦克风，其特征在于，所述MEMS麦克风还包括分别连接于所述基底和所述振膜的第一绝缘层、以及分别连接于所述振膜和所述背板的第二绝缘层，所述背板、所述第一绝缘层和所述振膜共同围合形成声腔，所述背板设有与所述声腔连通的声孔。
  9. 根据权利要求8所述的MEMS麦克风，其特征在于，所述MEMS麦克风还包括设置在所述第一绝缘层和所述第二绝缘层的外侧的保护层，所述保护层的一侧与所述基底相连，另一侧延伸至与所述第二绝缘层相齐平。
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Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN200983677Y (zh) * 2006-08-22 2007-11-28 美律实业股份有限公司 硅晶电容式麦克风
WO2011114398A1 (ja) * 2010-03-16 2011-09-22 パナソニック株式会社 Ｍｅｍｓデバイス
CN207531079U (zh) * 2017-10-24 2018-06-22 歌尔科技有限公司 电容式麦克风
CN207911007U (zh) * 2018-01-31 2018-09-25 瑞声声学科技(深圳)有限公司 Mems麦克风
CN211184244U (zh) * 2019-12-02 2020-08-04 杭州士兰微电子股份有限公司 Mems麦克风
CN111664874A (zh) * 2019-03-08 2020-09-15 英飞凌科技股份有限公司 具有膜电极、对电极、以及至少一个弹簧的传感器
CN211792036U (zh) * 2019-12-31 2020-10-27 杭州士兰微电子股份有限公司 Mems麦克风
CN113873413A (zh) * 2021-09-30 2021-12-31 瑞声声学科技(深圳)有限公司 一种电容式传感器及麦克风

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ITTO20130313A1 (it) * 2013-04-18 2014-10-19 St Microelectronics Srl Struttura di rilevamento micromeccanica perfezionata per un trasduttore acustico mems e relativo procedimento di fabbricazione
DE102016123130B4 (de) * 2016-11-30 2020-12-10 Infineon Technologies Austria Ag MEMS-Vorrichtung und Verfahren zum Herstellen einer MEMS-Vorrichtung
CN110958548B (zh) * 2019-12-02 2025-06-10 杭州士兰集成电路有限公司 Mems麦克风及其制造方法
CN117241196A (zh) * 2022-06-08 2023-12-15 深圳奇思微电子有限公司 微机电电容式麦克风及微机电电容式麦克风的制作方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN200983677Y (zh) * 2006-08-22 2007-11-28 美律实业股份有限公司 硅晶电容式麦克风
WO2011114398A1 (ja) * 2010-03-16 2011-09-22 パナソニック株式会社 Ｍｅｍｓデバイス
CN207531079U (zh) * 2017-10-24 2018-06-22 歌尔科技有限公司 电容式麦克风
CN207911007U (zh) * 2018-01-31 2018-09-25 瑞声声学科技(深圳)有限公司 Mems麦克风
CN111664874A (zh) * 2019-03-08 2020-09-15 英飞凌科技股份有限公司 具有膜电极、对电极、以及至少一个弹簧的传感器
CN211184244U (zh) * 2019-12-02 2020-08-04 杭州士兰微电子股份有限公司 Mems麦克风
CN211792036U (zh) * 2019-12-31 2020-10-27 杭州士兰微电子股份有限公司 Mems麦克风
CN113873413A (zh) * 2021-09-30 2021-12-31 瑞声声学科技(深圳)有限公司 一种电容式传感器及麦克风

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