Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
  • H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00

Definitions

• Patent Document 1 Prior art methods for aligning laminated components and manufacturing laminated electronic components are described in, for example, Patent Document 1.
• FIG. 1 is a schematic perspective view of a laminated electronic component according to an embodiment of the present disclosure.
• 2 is a schematic diagram showing a laminated portion, a side margin portion, and a cover portion of an element body according to an embodiment of the present disclosure as a single unit.
• FIG. 2 is a schematic diagram showing a laminated portion, a side margin portion, and a cover portion of an element body according to an embodiment of the present disclosure as a single unit.
• FIG. FIG. 2 is a flow diagram showing a method for manufacturing a laminated electronic component according to an embodiment of the present disclosure.
• FIG. 2 is a diagram showing a first ceramic sheet and a first magnetic body.
• 9 is a cross-sectional view taken along the line IX-IX in FIG. 8, illustrating a state in which the laminate component is accommodated in the first recess.
• 9 is a cross-sectional view taken along the line IX-IX in FIG. 8, illustrating a state in which the laminate component is accommodated in the first recess.
• 11A and 11B are diagrams illustrating a rolling process when the bottom of a first recess in a conventional structure is flat.
• 13A to 13C are diagrams illustrating a rolling process in which the bottom of the first recess according to the embodiment of the present disclosure is arc-shaped.
• FIG. 11 is a perspective view showing a state in which a part of a ridge line of the stacked component is in contact with a part of the bottom of the first recess before rolling;
• FIG. 13 is a perspective view showing a schematic diagram of another configuration in which a portion of a ridge line of the stacked component contacts a portion of the bottom of the first recess before rolling.
• FIG. 13 is a diagram showing a state in which a cover member is disposed after stack components are accommodated in a first recess of the accommodation member.
• FIG. 13 is a diagram showing a state in which a cover member is disposed after stack components are accommodated in a first recess of the accommodation member.
• FIG. 13 illustrates a modified example of a rolling process according to an embodiment of the present disclosure.
• FIG. 13 illustrates a modified example of a rolling process according to an embodiment of the present disclosure.
• 1A to 1C are diagrams illustrating an attachment process according to an embodiment of the present disclosure.
• 1A to 1C are diagrams illustrating an attachment process according to an embodiment of the present disclosure.
• FIG. 2 is a schematic perspective view of an element precursor according to an embodiment of the present disclosure.
• FIG. 11 is an exploded perspective view showing a storage member 6 according to another embodiment of the present disclosure. 11 is a perspective view showing a state in which a laminate component is accommodated in a first recess of the accommodation member.
• FIG. 1A to 1C are diagrams illustrating an attachment process according to an embodiment of the present disclosure.
• FIG. 2 is a schematic perspective view of an element precursor according to an embodiment of the present disclosure.
• FIG. 11 is an exploded perspective view showing a storage member 6 according to another embodiment of the present disclosure. 11
• Patent document 1 describes a method in which a pallet with a concave pocket larger than the planar dimensions of the chip component is prepared, and with the chip component placed in the pocket, a magnet is moved in a direction parallel to the bottom of the pocket, causing the chip component to roll so that the orientation of the internal electrodes is perpendicular to the bottom of the pocket.
• Patent document 1 also describes a method in which the magnetic field lines of a magnet act on the lead electrodes of the internal electrodes of a laminated component, and the orientation of the laminated component is aligned by moving the magnet.
• a laminated electronic component 1 according to one embodiment of the present disclosure and a method for manufacturing the laminated electronic component 1 will be described with reference to the drawings.
• a laminated ceramic capacitor will be described as an example of the laminated electronic component 1, but the laminated electronic component 1 to which the present disclosure is directed is not limited to a laminated ceramic capacitor, and can be applied to various laminated electronic components such as laminated piezoelectric elements, laminated thermistor elements, laminated coils, and laminated ceramic multilayer substrates.
• [Configuration of laminated parts] 1 is a schematic perspective view of a laminated electronic component 1 according to an embodiment of the present disclosure.
• the laminated electronic component 1 has an element body 2 and external electrodes 3.
• the shape of the element body 2 is set as appropriate, but as one example, the element body 2 has a substantially rectangular parallelepiped shape.
• the external electrodes 3 are located on a pair of end faces of the element body 2 and may be formed to extend around to other faces adjacent to the end faces.
• the external electrode located on one end face is referred to as external electrode 3a, and the external electrode located on the other end face is referred to as external electrode 3b.
• any direction may be the first direction, the second direction, or the third direction.
• the lamination direction of the internal electrode layers 212 and the ceramic dielectric layers 211, which are magnetic layers described below, is defined as the first direction.
• the direction intersecting with the first direction and approximately parallel to the short sides of the element body 2, which has a substantially rectangular parallelepiped shape is defined as the second direction.
• the direction intersecting with the second direction and approximately parallel to the long sides of the element body 2, which has a substantially rectangular parallelepiped shape is defined as the third direction.
• the first direction may be the up-down direction
• the second direction may be the left-right direction
• the third direction may be the front-rear direction.
• the element body 2 is roughly rectangular and has six faces.
• the faces located above and below the element body 2 in the first direction are defined as main faces
• the faces located to the left and right of the element body 2 in the second direction are defined as side faces
• the faces located to the front and rear of the element body 2 in the third direction are defined as end faces.
• the main faces, side faces, and end faces are similarly defined for the laminate section 21 constituting the element body 2, which will be described later.
• the main faces, side faces, and end faces are similarly defined for the element body precursor 200 before firing, which will be described later.
• the main faces, side faces, and end faces are similarly defined for the laminate component 50 before firing, which will be described later.
• the main faces, side faces, and end faces are similarly defined for the mother laminate 500 before firing, which will be described later.
• the "principal surface,” “side surface,” and “end surface” do not necessarily have to be strictly flat.
• the principal surface, side surface, and end surface may each have some unevenness in some areas, and may be slightly warped overall.
• the external electrodes 3 are formed from a conductive material and function as terminals of the laminated electronic component 1.
• conductive materials that form the external electrodes 3 include metals such as nickel (Ni), copper (Cu), palladium (Pd), tin (Sn), zinc (Zn), platinum (Pt), silver (Ag) and gold (Au), or alloys of these metals.
• the external electrode 3 may have a single layer structure or a multi-layer structure.
• the multi-layer structure of the external electrode 3 may be a two-layer structure of a base film and a surface film, or a three-layer structure of a base film, an intermediate film, and a surface film.
• the base film may be a baked film of a metal whose main component is Ni, Cu, Pd, Pt, Ag, Au, etc., or an alloy of these.
• the intermediate film may be a plated film of a metal or alloy whose main component is Pt, Pd, Au, Cu, Ni, etc., for example.
• the surface film may be a plated film of a metal or alloy whose main component is Cu, Sn, Pd, Au, Zn, etc., for example.
• FIGS. 2A and 2B are schematic diagrams of element body 2.
• the element body 2 has a laminated portion 21, a side margin portion 22, and a cover portion 23.
• FIG. 2A is a schematic diagram showing the laminated portion 21, the side margin portion 22, and the cover portion 23 as a whole
• FIG. 2B is a schematic diagram showing the laminated portion 21, the side margin portion 22, and the cover portion 23 separated.
• FIG. 2 is a diagram showing element body 2 before firing, and also a diagram showing element body 2 after firing. Although element body 2 after firing has shrunk due to firing, it has approximately the same structure as element body 2 before firing.
• the laminated section 21 includes a plurality of ceramic dielectric layers 211 and a plurality of internal electrode layers 212 stacked in a first direction.
• the plurality of ceramic dielectric layers 211 may include various ceramic dielectrics. Examples of ceramic dielectrics include barium titanate (BaTiO 3 ) and calcium zirconate (CaZrO 3 ).
• the plurality of internal electrode layers 212 may include a ferromagnetic metal such as Ni, and may further include various metals such as Pd, Ag, Cu, and Sn.
• the multiple internal electrode layers 212 are alternately exposed from a pair of end faces of the laminated portion 21 and connected to the external electrode 3.
• the one connected to the external electrode 3a is referred to as the internal electrode layer 212a
• the one connected to the external electrode 3b is referred to as the internal electrode layer 212b.
• the side margin portions 22 are located on both side surfaces of the laminate portion 21 in the second direction.
• the side margin portions 22 may contain various ceramic dielectrics.
• the main component of the side margin portions 22 may be the same as the main component of the ceramic dielectric layer 211 of the laminate portion 21. In this case, compared to a case in which the main components of the ceramic dielectric layer 211 of the laminate portion 21 and the side margin portions 22 are different, manufacturing efficiency is improved, and internal stress in the element body 2 is reduced, improving reliability.
• the cover portion 23 is located on both main surfaces of the laminate portion 21 in the first direction.
• the cover portion 23 may contain various ceramic dielectrics.
• the main component of the cover portion 23 may be the same as the main component of the ceramic dielectric layer 211 of the laminate portion 21. In this case, compared to a case in which the main components of the ceramic dielectric layer 211 of the laminate portion 21 and the cover portion 23 are different, manufacturing efficiency is improved and internal stress in the element 2 is reduced, improving reliability.
• the configuration of the laminated electronic component 1 is not limited to a specific configuration, and any known configuration can be appropriately adopted depending on the size and performance required for the laminated electronic component 1. For example, the number of layers of the internal electrode layers 212 in the laminate section 21 can be appropriately determined.
• FIG. 3 is a flowchart showing a manufacturing method of the laminated electronic component 1.
• Figs. 4A to 4C, 5 to 8, 9A to 9C, 10A, 10B, 11A to 11C, 12A, 12B, 13A, 13B, 14A, 14B, 15A to 15C, and 16 are diagrams specifically showing each step of the manufacturing method of the laminated electronic component 1. The manufacturing method of the laminated electronic component 1 will be described below with reference to Figs. 4A to 16.
• a laminate component 50 is prepared, which has a plurality of dielectric layers 51 and a plurality of internal electrode layers 52, which are magnetic layers, stacked alternately.
• a base laminate 500 is prepared in which a plurality of ceramic sheets 400 and a plurality of magnetic sheets 410 are alternately laminated as shown in Figures 4A to 4C and 5.
• the base laminate 500 is formed by laminating a first ceramic sheet 401, a second ceramic sheet 402, a third ceramic sheet 403, a first magnetic sheet 411, and a second magnetic sheet 412 in multiple layers.
• FIGS. 4A to 4C show ceramic sheets 400 and magnetic sheets 410 arranged thereon.
• FIG. 4A shows a first ceramic sheet 401 and a first magnetic sheet 411
• FIG. 4B shows a second ceramic sheet 402 and a second magnetic sheet 412
• FIG. 4C shows a third ceramic sheet 403.
• the first ceramic sheet 401 and the second ceramic sheet 402 become the ceramic dielectric layer 211 (see FIG. 2) of the laminated portion 21 after firing.
• the third ceramic sheet 403 becomes the cover portion 23 after firing.
• the first magnetic material sheet 411 and the second magnetic material sheet 412 become the magnetic material layer after firing.
• the first ceramic sheet 401, the second ceramic sheet 402, and the third ceramic sheet 403 are sometimes collectively referred to as the ceramic sheet 400.
• the first magnetic material sheet 411 and the second magnetic material sheet 412 are sometimes collectively referred to as the magnetic material sheet 410.
• the ceramic sheet 400 is placed on, for example, a carrier film. This placement is performed using, for example, a die coater, but is not limited to this. For example, it may be performed using a doctor blade coater or a gravure coater.
• the thickness of the ceramic sheet 400 can be set appropriately. For example, the thickness of the ceramic sheet 400 may be about 0.5 to 10 ⁇ m. The thinner the ceramic sheet is, the higher the electrostatic capacitance of the laminated electronic component 1 can be.
• the ceramic sheet 400 may be made of various ceramic dielectric materials.
• the ceramic sheet 400 is made by wet grinding and mixing a ceramic powder mixture of BaTiO3 and an additive in a bead mill, and mixing the ground and mixed slurry with a polyvinyl butyral binder, a plasticizer, and an organic solvent.
• a first magnetic sheet 411 which will become the internal electrode layer 212a after firing, is placed at a distance on the first ceramic sheet 401 created above.
• a second magnetic sheet 412 which will become the internal electrode layer 212b after firing, is placed at a distance on the second ceramic sheet 402.
• FIGS. 4A and 4B show a magnetic sheet 410 printed with two types of conductor patterns with different polarities.
• the magnetic sheet 410 can be formed by, for example, screen printing or gravure printing.
• the magnetic sheet 410 may be made of various magnetic materials.
• the magnetic sheet 410 may be made of a conductive paste containing various conductive materials such as Ni, Pd, Ag, and Cu. Note that the magnetic sheet 410 is not limited to this example, and may be made of, for example, a ferromagnetic insulating material.
• the magnetic sheet 410 may not be formed on the third ceramic sheet 403 (see FIG. 4C) that corresponds to the cover portion 23 after firing.
• the third ceramic sheet 403 may have a magnetic sheet 410 (see FIG. 4B) disposed thereon that will become a dummy internal electrode layer after firing.
• the thickness of the magnetic sheet 410 can be set as appropriate. As long as the characteristics of a multilayer ceramic capacitor can be ensured, the thinner the magnetic sheet 410, the more likely it is to prevent internal defects caused by internal stress. For example, in a capacitor with a high number of layers, the thickness of the magnetic sheet 410 may be 1 ⁇ m or less. Furthermore, the spacing between the first magnetic sheet 411 (see FIG. 4A) and the second magnetic sheet 412 (see FIG. 4B) does not necessarily have to be constant and can be set as appropriate. For example, the spacing between the first magnetic sheet 411 and the second magnetic sheet 412 may be different.
• the first ceramic sheet 401 on which the first magnetic sheet 411 is formed may be referred to as the first sheet
• the second ceramic sheet 402 on which the second magnetic sheet 412 is formed may be referred to as the second sheet
• the third ceramic sheet 403 may be referred to as the third sheet.
• FIG. 5 is a schematic perspective view of the mother laminate 500.
• each ceramic sheet 400 is shown exploded in Figure 5.
• the mother laminate 500 is formed by compressing and integrating the ceramic sheets 400 using hydrostatic pressure, uniaxial pressure or the like. This results in a high-density mother laminate 500.
• first sheets and second sheets corresponding to the laminated portion 21 after firing are alternately stacked in the first direction.
• third sheets corresponding to the cover portion 23 after firing are stacked on the top and bottom surfaces in the first direction of the alternately stacked first and second sheets, respectively.
• the numbers of first sheets, second sheets, and third sheets can each be changed as appropriate.
• FIG. 6 is a perspective view of the base laminate 500
• FIG. 7 is a perspective view of an individualized laminate component 50.
• the base laminate 500 is cut along the cutting lines CL1 and CL2 while attached to tape as a holding member. This results in the base laminate 500 being individualized, and multiple laminate components 50 as shown in FIG. 7 are obtained.
• the cut surface of the base laminate 500 formed by cutting along the cutting line CL1 becomes the side surface of the laminate component 50 in the second direction.
• the cut surface of the base laminate 500 formed by cutting along the laminate cutting line CL2 becomes the end surface of the laminate component 50 in the third direction.
• the magnetic sheet 410 is exposed from the side surface and end surface of the laminate component 50.
• the configuration of the cutting blade used to cut the base laminate 500 may be changed as appropriate.
• the cutting blade may be a push blade or a rotary blade.
• a technique that does not require a cutting blade may be used to cut the base laminate 500, such as laser cutting or water jet cutting.
• the cut laminated component 50 has multiple dielectric layers 51 and multiple magnetic layers, which are stacked alternately, as internal electrode layers 52.
• the dielectric layers 51 correspond to the ceramic sheets 400 in the base laminate 500.
• the internal electrode layers 52 correspond to the magnetic sheets 410 in the base laminate 500.
• the laminate component 50 has a pair of main surfaces M, a pair of side surfaces S, and a pair of end surfaces T.
• the distance between the pair of main surfaces M of the laminate component 50 is LM
• the distance between the pair of side surfaces S is LS
• the distance between the pair of end surfaces T is LT.
• the sizes of LM, LS, and LT may be set appropriately. For example, as in one embodiment of the present disclosure, LM ⁇ LS ⁇ LT may be satisfied.
• the longest distance can be defined as LM.
• the side surface S is not strictly flat and there are multiple LSs, it can be defined in the same way as LM.
• the end surface T is not strictly flat and there are multiple LTs, it can be defined in the same way as LM.
• multiple internal electrode layers 52 are exposed from both sides of a pair of side faces S of the laminate component 50 formed by cutting. Additionally, multiple stacked internal electrode layers 52 are exposed alternately from both sides of a pair of end faces T of the laminate component 50 formed by cutting.
• an accommodation member 6 having a first recess 61 is prepared, and the laminate component 50 is accommodated in the first recess 61 .
• FIG. 8 shows the housing member 6 and the laminated component 50 housed in the housing member 6.
• the housing member 6 has a first recess 61.
• the laminated component 50 is housed in the first recess 61.
• the housing member 6 may have multiple first recesses 61.
• FIGS. 9A to 9C are cross-sectional views showing the state in which a stacked component is housed in the first recess 61 as viewed from the section line IX-IX in FIG. 8, with the first recess 61 having a bottom 62 and an opening surface 63.
• the "opening surface” is the planar area surrounded by the outer edge of the first recess 61 when the housing member 6 is viewed in plan. Note that FIGS. 9A to 9C show the rolling process, which will be described later.
• the shape of the opening surface 63 of the first recess 61 when the storage member 6 is viewed in a plane may be set appropriately.
• the outer edge shape of the first recess 61 when the storage member 6 is viewed in a plane may be set appropriately.
• the outer edge shape of the first recess 61 may be approximately rectangular.
• the part of the outer edge of the first recess 61 that corresponds to the long side of the rectangle is the long side 611
• the part that corresponds to the short side is the short side 612.
• the approximately rectangular shape does not necessarily have to be a rectangle in the strict sense.
• the length of the long side 611 is L1
• the length of the short side 612 is L2.
• L1 and L2 may be set appropriately, but for example, L1 may be greater than LT, and L2 may be greater than LS and smaller than LT. In other words, LS ⁇ L2 ⁇ LT ⁇ L1 may be satisfied.
• the stacked components 50 are stored so that their longitudinal direction is aligned with the longitudinal side 611 of the first recess 61, so that the storage directions of the multiple stacked components 50 can be aligned.
• the opening surface 63 of the first recess 61 when the laminate component 50 is accommodated, the opening surface 63 of the first recess 61 is located lower than the open surface of the laminate component 50. In other words, the opening surface 63 of the first recess 61 is located closer to the bottom 62 than the open surface of the laminate component 50. In other words, the open surface of the laminate component 50 protrudes from the first recess 61.
• the outer edge of the first recess 61 of the accommodation member 6 does not interfere when attaching the laminate component 50 to the adhesive sheet 9, so that the laminate component 50 can be easily attached to the adhesive sheet 9.
• the manufacturing process since it is not necessary to remove the laminate component 50 from the first recess 61 when attaching the laminate component 50 to the adhesive sheet 9, the manufacturing process can be simplified.
• the laminated components 50 need to be accommodated with the side surfaces S facing the bottom 62 of the first recess 61.
• the laminated components 50 are accommodated randomly in the first recess 61, they will be accommodated either with the main surface M of the laminated component 50 facing the bottom 62 of the first recess 61, or with the side surfaces S of the laminated components 50 facing the bottom 62.
• Rolling process In the rolling step, a magnetic field is applied to roll the laminated components 50. Through this rolling step, the orientation of the open faces of the laminated components 50 can be aligned.
• Figures 9A to 9C show the rolling process, with Figure 9A being a cross-sectional view showing the state in which the stacked component 50 is accommodated in the first recess 61, Figure 9B being a cross-sectional view showing the state in which a magnetic field is applied to the stacked component 50 using a magnet 8, and Figure 9C being a cross-sectional view showing the state of the stacked component 50 after rolling.
• the bottom 62 of the first recess 61 is arc-shaped.
• Two magnets 8 are arranged above and below the housing member 6 so that their opposite magnetic poles face each other.
• the bottom surface of the upper magnet 8 is the south pole
• the top surface of the lower magnet 8 is the north pole.
• the laminate component 50 rotates around the longitudinal axis so that the surface direction of the magnetic layer 52 is parallel to the magnetic flux lines.
• the side surface S of the laminate component 50 becomes an open surface within the first recess 61 due to the rotation, and the laminate component 50 whose side surface S was originally an open surface remains as it is. Therefore, the side surfaces S of all the laminate components 50 can be aligned as open surfaces.
• FIGS. 10A and 10B are diagrams comparing the first recess 61 in the present disclosure with a recess in a conventional structure.
• the conventional structure shown in FIG. 10A when the bottom 62 of the first recess 61 in a cross-sectional view is flat, the amount of movement of the center of gravity of the laminate component 50 when the laminate component 50 rotates is large, and the energy required for the laminate component 50 to roll is large.
• the contact area between the laminate component 50 and the bottom 62 of the first recess 61 is large, so the static friction force is large and the energy required for the laminate component 50 to roll is large.
• the alignment method of one embodiment of the present disclosure since the bottom 62 of the first recess 61 is arc-shaped, as shown in FIG. 10B, the amount of movement of the center of gravity of the laminate component 50 when the laminate component 50 rotates is smaller than that of the conventional structure, and the laminate component 50 can be rolled with less energy.
• the laminate component 50 and the bottom 62 of the first recess 61 are in contact with each other at the surface portion of the laminate component 50, whereas according to the alignment method of one embodiment of the present disclosure, the laminate component 50 and the bottom 62 of the first recess 61 are in contact with each other at the ridge portion of the laminate component 50, and therefore the contact area is smaller than that of the conventional structure. Therefore, the static friction force is smaller than that of the conventional structure, and the laminate component 50 can be rolled with less energy. Therefore, according to the alignment method of one embodiment of the present disclosure, the magnetic force required to roll the laminate component can be reduced, and the possibility of the occurrence of a problem in which the magnetic layer 52 or the entire laminate component 50 becomes magnetized can be reduced.
• the laminate component 50 and the bottom 62 of the first recess 61 are in contact with each other at the surface of the laminate component 50. Therefore, since the contact area between the laminate component 50 and the bottom 62 of the first recess 61 is large, if impurities such as dust are present in the first recess 61, they are likely to adhere to the laminate component 50 or to damage the contact surface. For example, if the side surface S where the magnetic layer 52 is exposed after rolling faces the bottom 62 of the first recess 61, and impurities present at the bottom 62 adhere to the side surface S, this may lead to defects such as short circuits between the magnetic layers.
• the alignment method in one embodiment of the present disclosure since the bottom 62 of the first recess 61 is arc-shaped, the laminate component 50 and the bottom 62 of the first recess 61 come into contact at the ridge portion of the laminate component 50. Therefore, compared to the conventional structure, the area of contact between the laminate component 50 and the bottom 62 of the first recess 61 is smaller, and the possibility of impurities such as dust present in the first recess 61 adhering to the laminate component 50 can be reduced.
• Figures 11A to 11C show an example of the cross-sectional shape of the bottom 62 of the first recess of the present disclosure.
• the bottom 62 of the first recess may be elliptical.
• the first recess 61 may have a wall 64 in addition to the arc-shaped bottom 62.
• the opening surface 63 of the first recess 61 may be located higher than the opening surface of the stack component 50.
• the opening surface of the stack component 50 may be located between the opening surface 63 and the bottom 62 of the first recess 61. In other words, the opening surface of the stack component 50 does not have to protrude from the first recess 61. In this case, the possibility that the stack component 50 will protrude out of the first recess 61 when it rolls can be reduced.
• FIGS. 12A and 12B show the first recess 61 and the state of the laminate component 50 housed in the first recess 61 before rolling.
• the first recess 61 is shown in a see-through manner so that the arrangement of the laminate component 50 housed therein can be seen.
• the ridgeline located between one of the pair of main surfaces M and one of the pair of side surfaces S of the laminate component 50 is referred to as ridgeline R1.
• the ridgeline located between one of the pair of main surfaces M and one of the pair of end surfaces T of the laminate component 50 is referred to as ridgeline R2.
• a portion of the ridgeline R1 of the laminate component 50 before rolling may be in contact with a portion of the bottom 62 of the first recess 61.
• the laminate component 50 is more likely to rotate in a direction in which the side surface S becomes an open surface during the rolling process.
• the embodiment of the present disclosure is not limited to the example of FIG. 12A.
• a part of the ridgeline R2 of the laminate component 50 before rolling may be in contact with a part of the bottom 62 of the first recess 61.
• the laminate component 50 is more likely to rotate in a direction in which the end face T becomes an open surface during the rolling process.
• edge R1 or edge R2 contacts bottom 62 depending on which surface of stacked component 50 is desired to be the open surface in the rolling process and subsequent processes.
• FIG. 9A to 9C only the housing member 6 is used to house the stacked component 50, but this is not limiting.
• a lid member 7 may also be provided.
• Figure 13A is a cross-sectional view of the lid member 7 placed after housing the stacked component 50 in the first recess 61 of the housing member 6.
• the cover member 7 is positioned so as to overlap at least a portion of the opening surface 63 of the first recess 61. With this configuration, it is possible to reduce the possibility that the stacked component 50 will jump out of the first recess 61 when it rolls during the rolling process.
• H may be greater than LS and LM, and less than LT (see FIG. 7). In other words, LS ⁇ H ⁇ LT and LM ⁇ H ⁇ LT may be satisfied.
• the shape of the lid member 7 is not limited to this example.
• the lid member 7 may have a second recess 71.
• FIG. 13B is a cross-sectional view of the lid member 7 having the second recess 71 placed after the stacked component 50 is accommodated in the first recess 61 of the accommodation member 6.
• the second recess 71 has a bottom and an opening surface 73.
• the lid member 7 is placed so that the opening surface 73 of the second recess 71 overlaps with the opening surface 63 of the first recess 61. With this configuration, it is possible to reduce the possibility that the stacked component 50 will jump out of the first recess 61 when it rolls in the rolling process.
• H may be greater than LS and LM, and less than LT. In other words, LS ⁇ H ⁇ LT and LM ⁇ H ⁇ LT may be satisfied.
• a magnetic field is generated by arranging two magnets 8 above and below the housing member 6, but this example is not limiting.
• one magnet 8 may be arranged either above or below the housing member 6.
• the orientation of the north and south poles of the magnet 8 may be set as appropriate.
• the direction of the magnetic flux lines in the magnetic field from the north pole to the south pole may be set as appropriate.
• FIGS. 14A and 14B show an example of a modification of the rolling process in the present disclosure, in which one magnet 8 is disposed below the housing member 6.
• FIG. 14A shows the state of the stacked component 50 housed in the first recess 61 before rolling
• FIG. 14B shows the state of the stacked component 50 housed in the first recess 61 before rolling.
• the first recess 61 is shown in a see-through manner so that the arrangement of the stacked component 50 housed therein can be seen.
• the stacked component 50 housed in the first recess 61 is rolled in the process of moving the housing member 6 relatively in parallel with the main surface of the magnet 8. In other words, the stacked component 50 moves relative to the magnet 8.
• the magnet 8 has a south pole and a north pole on the side that intersects with the direction in which the laminated component 50 moves.
• a magnetic field is generated in which magnetic flux lines point from the north pole on one side to the south pole on the other side.
• the direction of the magnetic field from the north pole to the south pole on the other side is parallel to the length direction of the laminated component 50, or is roughly the same direction within a specified angle.
• the aforementioned specified angle may be in the range of 0° to 30°, for example.
• the laminated component 50 stored in the first recess 61 moves to pass above the magnet 8
• the laminated component 50 is exposed to a strong vertical magnetic field due to the magnet end effect directly above the north pole as it passes the side of the magnet 8.
• the laminated component 50 rotates around its longitudinal axis so that the surface direction of the magnetic layer 52 is parallel to the magnetic flux lines.
• the side S of the laminated component 50 becomes an open surface due to the rotation within the first recess 61, and the laminated component 50, which originally had the side S as an open surface, remains as it is.
• the direction of the magnetic flux lines changes from vertical to horizontal, but the horizontal direction is the same as the surface direction of the magnetic layer 52, so the laminated component 50 remains as it is. Therefore, the side S of all the laminated components 50 can be aligned as open surfaces.
• the laminate component 50 and the bottom 62 of the first recess 61 come into contact at the ridge portion of the laminate component 50. Therefore, even in the modified example shown in FIG. 14A and FIG. 14B, the area where the laminate component 50 and the bottom 62 of the first recess 61 come into contact is smaller than in the conventional structure, and the possibility that impurities such as dust present in the first recess 61 will adhere to the laminate component 50 can be reduced.
• the laminate component 50 is more likely to rotate in the direction in which the side surface S becomes an open surface.
• a functional member 404 is attached to the side surface S of the laminate component 50.
• FIG. 15A to 15C are schematic diagrams showing the process of the fifth step, and the process proceeds in the order of FIG. 15A to 15C.
• an elastic member 60 is attached to the upper surface of a first flat plate 420, and a functional member 404 is provided on the elastic member 60.
• An adhesive sheet 9 is provided on the lower surface of a second flat plate 65.
• One side S of the laminated component 50 which is made an open surface in the rolling process, is attached to the adhesive sheet 9, and the other side S is arranged to face the functional member 404.
• the first flat plate 420 and the second flat plate 65 may be rigid bodies such as metal or resin, or elastic bodies such as rubber, and can be selected appropriately according to the characteristics of the functional member 404.
• the functional member 404 examples include a protective ceramic green sheet, a protective ceramic paste, and a terminal electrode paste.
• the functional member 404 may be made of various ceramic dielectric materials, similar to the ceramic sheet 400.
• the functional member 404 is made of the same material as the ceramic sheet 400.
• the functional member 404 is formed into a sheet using, for example, a roll coater or a doctor blade.
• the side surface S of the laminate component 50 is pressed against the functional member 404.
• the functional member 404 adheres to the side surface S of the laminate component 50.
• FIG. 15C when the laminate component 50 is lifted from the functional member 404, only the functional member 404 attached to the side surface S is separated from the elastic body and remains on the laminate component 50 side.
• the functional member 404 that becomes the side margin portion 22 after firing can be provided on one side surface S of the laminate component 50.
• the elastic member 60 is not essential, but by positioning the elastic member 60 between the functional member 404 and the flat plate 420, the functional member 404 can be attached when the side surface S of the laminate component 50 is pressed against the functional member 404.
• the functional member 404 is also provided on the other side surface S of the laminate component 50 by the same or a similar process.
• a body precursor 200 as shown in FIG. 16 can be obtained.
• the body precursor 200 becomes the body 2 after firing.
• the shape and size of the body precursor 200 can be set appropriately depending on the shape and properties of the body 2 after firing.
• the obtained unsintered element precursor 200 is fired to produce the element 2 as shown in Fig. 2.
• the firing can be carried out, for example, in a reducing atmosphere or a low oxygen partial pressure atmosphere.
• external electrodes 3 are formed on end faces T of the element body 2 obtained in the firing step.
• unsintered electrode material is applied so as to cover both end faces in the third direction of the element body 2.
• the unsintered electrode material applied to the element body 2 is baked, for example, in a reducing atmosphere or a low oxygen partial pressure atmosphere, to form a base film on the element body 2.
• an intermediate film and a surface film are formed on the base film baked on the element body 2 by a plating process such as electrolytic plating, to complete the external electrode 3.
• the processing in the external electrode formation step may be performed before the firing step.
• unsintered electrode material may be applied to both end faces in the third direction of the unsintered element precursor 200, and in the firing step, the element precursor 200 is fired and at the same time the unsintered electrode material is baked to form a base layer for the external electrode 3.
• the laminated electronic component 1 shown in FIG. 1 can be obtained.
• the method for manufacturing a laminated electronic component in one embodiment of the present disclosure includes the above-mentioned preparation step, accommodation step, rolling step, attachment step, firing step, and external electrode formation step. Therefore, according to the method for manufacturing a laminated electronic component in one embodiment of the present disclosure, it is possible to reduce the internal electrodes or the entire laminated component from becoming magnetized, thereby reducing the possibility of defects occurring.
• the above-described method for aligning stacked components can reduce the possibility of defects occurring in the stacked components.
• FIG. 17 is an exploded perspective view showing a housing member 6 according to another embodiment of the present disclosure
• FIG. 18 is a perspective view showing a state in which a stacked component 50 is housed in a first recess 61 of the housing member 6.
• the housing member 6 of this embodiment includes an upper frame 701 having a plurality of through holes 70 arranged in a matrix in a plan view, and a bottom cover 703 joined to the bottom surface of the upper frame 701 and having a plurality of recessed grooves 702 extending in the row direction of the plurality of through holes 70.
• the upper frame 701 constitutes a plurality of long side inner walls 711 and a plurality of short side inner walls 712.
• the upper frame 701 and the bottom cover 703 may be integrally formed, may be separate members bonded together with an adhesive, or may be detachably connected by a screw member such as a bolt.
• the through hole 70 is defined by a pair of mutually opposing long side inner walls 711 and a pair of mutually opposing short side inner walls 712.
• the first recess 61 is defined by each through hole 70 and a bottom surface 713 of the groove 722 in an area where the through hole 70 faces.
• the first recess 61 is open in an area 716 between the lower sides 714 of the pair of short side inner walls 712 and a projection line 715 of the lower sides 714 onto the bottom surface 713 of the groove 722.
• the bottom surface 713 may be partially formed of a cylindrical surface.
• the laminated component 50 can be housed in the first recess 61 and rotated easily by the bottom surface 713 of the groove 702, and can be rotated by the weak magnetic force of the magnet 8, reducing the possibility of the laminated component 50 becoming magnetized.
• the contact area between the bottom surface 713 of the groove 702 and the laminated component 50 after rotation of the laminated component 50 can be reduced, for example to a line contact, reducing the occurrence of contamination due to the adhesion of impurities such as dirt to the bottom surface 713 or the surface of the laminated component 50.
• the method for aligning stacked components according to the present disclosure can be implemented with the following configurations (1) to (7).
• a preparation step of preparing a laminate component having a plurality of magnetic layers and a plurality of dielectric layers alternately stacked an accommodating step of preparing an accommodating member having a first recess having a bottom that is arc-shaped in cross section, and accommodating the laminate component in the first recess; a rolling step of rolling the laminated component by applying a magnetic field; Equipped with How stacked parts are aligned.
• the laminate component has a pair of main surfaces, a pair of side surfaces, and a pair of end surfaces, the plurality of magnetic layers being exposed from the side surfaces,
• the side surface of the laminated component after rolling faces a bottom side of the first recess.
• a lid member having a second recess is further prepared, and the lid member is arranged so that an opening surface of the first recess and an opening surface of the second recess overlap with each other; a distance between a bottom of the first recess and a bottom of the second recess is smaller than a distance between the pair of end faces of the laminate component; A method for aligning stacked components according to any one of the above configurations (1) to (4).
• Laminated electronic component 2 Element body 21: Laminated portion 211: Ceramic dielectric layer 212: Internal electrode layer 22: Side margin portion 23: Cover portion 200: Element body precursor 3, 3a, 3b: External electrode 400: Ceramic sheet 404: Functional member 410: Magnetic sheet 50: Laminated component 51: Dielectric layer 52: Magnetic layer 500: Mother laminate 6: Housing member 61: First recess 611: Long side 612: Short side 62: Bottom 63: Opening surface 64: Wall 7: Lid member 70: Through hole 71: Second recess 72: Bottom 73: Opening surface 701: Upper frame 702: Groove 703: Bottom lid 713: Bottom surface 8: Magnet 9: Adhesive sheet

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• Engineering & Computer Science (AREA)
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• Manufacturing & Machinery (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

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  • 2024-06-03 JP JP2025531426A patent/JPWO2025009300A1/ja active Pending
  • 2024-06-03 WO PCT/JP2024/020270 patent/WO2025009300A1/ja not_active Ceased

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