WO2024255751A1 - 车灯模组及其制造方法及车辆 - Google Patents

车灯模组及其制造方法及车辆 Download PDF

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Publication number
WO2024255751A1
WO2024255751A1 PCT/CN2024/098581 CN2024098581W WO2024255751A1 WO 2024255751 A1 WO2024255751 A1 WO 2024255751A1 CN 2024098581 W CN2024098581 W CN 2024098581W WO 2024255751 A1 WO2024255751 A1 WO 2024255751A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
light
emitting layer
conductive tape
cover plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2024/098581
Other languages
English (en)
French (fr)
Inventor
赵一号
肖博文
陶璇
冯彬峰
许志财
刘少宁
王佳祥
李飞
王紫洁
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
Chengdu BOE Optoelectronics Technology Co Ltd
Original Assignee
BOE Technology Group Co Ltd
Chengdu BOE Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BOE Technology Group Co Ltd, Chengdu BOE Optoelectronics Technology Co Ltd filed Critical BOE Technology Group Co Ltd
Publication of WO2024255751A1 publication Critical patent/WO2024255751A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/10—Protection of lighting devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05F—STATIC ELECTRICITY; NATURALLY-OCCURRING ELECTRICITY
    • H05F3/00—Carrying-off electrostatic charges
    • H05F3/02—Carrying-off electrostatic charges by means of earthing connections
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2107/00—Use or application of lighting devices on or in particular types of vehicles
    • F21W2107/10—Use or application of lighting devices on or in particular types of vehicles for land vehicles

Definitions

  • the present application relates to the automotive field, and in particular to a vehicle lamp module, a manufacturing method thereof, and a vehicle.
  • the purpose of the present application is to provide an anti-static vehicle lamp module, a manufacturing method thereof, and a vehicle.
  • the present application discloses a vehicle lamp module, which includes: a supporting layer; a packaging layer, which is arranged on one side of the supporting layer; a light-emitting layer, which is arranged on a side of the packaging layer away from the supporting layer; a cover plate, which is located on a side of the light-emitting layer away from the packaging layer; and a conductive tape, which is connected to the cover plate and is grounded.
  • the vehicle lamp module also includes a circuit board
  • the light-emitting layer includes a middle area bonded to the packaging layer and an edge area located around the middle area, and the circuit board is bonded to a side of the edge area close to the packaging layer;
  • the conductive tape is arranged on the surrounding sides of the supporting layer, the light-emitting layer, the packaging layer and the cover plate and avoids the circuit board.
  • the conductive tape is connected to a side of the cover plate away from the light-emitting layer.
  • the conductive tape is connected to a side of the support layer away from the packaging layer, and the conductive tape is directly grounded.
  • the conductive tape is connected to a side of the support layer close to the encapsulation layer.
  • the support layer is provided with a grounding mechanism; a portion of the grounding mechanism is located in a connection area between the support layer and the conductive tape; and the portion of the grounding mechanism is connected to the conductive tape.
  • the vehicle lamp module further includes a circuit board, wherein the circuit board is in contact with an edge of the light-emitting layer, and the grounding mechanism avoids the circuit board.
  • a middle portion of the conductive tape is connected to a side of the encapsulation layer away from the light-emitting layer.
  • the conductive tape is connected to a side of the encapsulation layer away from the light-emitting layer.
  • part of the conductive tape is disposed in a layer between the support layer and the packaging layer.
  • a double-sided adhesive layer is provided between the support layer and the packaging layer; the thickness of the conductive tape is not less than the thickness of the double-sided adhesive layer and is not more than 1.5 times the thickness of the double-sided adhesive layer.
  • a light filter film is disposed on a side of the cover plate close to the light-emitting layer; or a light filter film is disposed on a side of the cover plate away from the light-emitting layer.
  • an optically transparent adhesive layer is disposed on a side of the light emitting layer close to the cover plate.
  • the circuit board and the light-emitting layer are connected via anisotropic conductive adhesive; the outer side of the anisotropic conductive adhesive is coated with shadowless adhesive; the outer side of the shadowless adhesive is coated with waterproof adhesive.
  • the present application also discloses a method for manufacturing a vehicle lamp module, comprising: encapsulating a light-emitting layer to form an encapsulation layer; laminating a support layer on a side of the encapsulation layer away from the light-emitting layer; laminating a cover plate on a side of the light-emitting layer away from the encapsulation layer; and bonding a conductive tape, wherein the conductive tape is grounded and connected to the cover plate.
  • the present application also discloses a method for manufacturing a vehicle lamp module, comprising: encapsulating a light-emitting layer to form an encapsulation layer; laminating a cover plate on a side of the light-emitting layer away from the encapsulation layer; bonding a conductive tape, wherein the conductive tape is grounded and connected to the cover plate; and laminating a support layer on a side of the encapsulation layer away from the light-emitting layer.
  • the present application also discloses a vehicle, comprising the vehicle light module as described above. It should be understood that the above general description and the following detailed description are only exemplary and explanatory and cannot limit the present specification.
  • FIG. 1 is a schematic diagram of a vehicle light module according to an embodiment of the present application.
  • FIG. 2 is a front view schematic diagram of a vehicle light module according to an embodiment of the present application.
  • FIG3 is a partial cross-sectional schematic diagram of the connection between the vehicle light module circuit board and the light-emitting layer according to an embodiment of the present application.
  • FIG. 4 is a partial cross-sectional schematic diagram of the area A in FIG. 2 according to an embodiment of the present application.
  • FIG. 5 is a partial cross-sectional schematic diagram of region A in FIG. 2 according to another embodiment of the present application.
  • FIG. 6 is a partial cross-sectional schematic diagram of the area A in FIG. 2 according to another embodiment of the present application.
  • FIG. 7 is a flow chart of a method for manufacturing a vehicle lamp module according to an embodiment of the present application.
  • FIG. 8 is a flow chart of a method for manufacturing a vehicle lamp module according to another embodiment of the present application.
  • Words such as “include” or “comprise” mean that the elements or objects appearing in front of “include” or “comprise” include the elements or objects listed after “include” or “comprise” and their equivalents, and do not exclude other elements or objects.
  • Words such as “connect” or “connected” are not limited to physical or mechanical connections, and can include electrical connections, whether direct or indirect.
  • static electricity is a problem that cannot be ignored for electronic products, especially for highly sensitive electronic screens such as OLED (Organic Light-Emitting Diode), LED (Light-Emitting Diode) and LCD screens.
  • OLED Organic Light-Emitting Diode
  • LED Light-Emitting Diode
  • LCD LCD screens.
  • the material of the headlight shell is mainly antistatic, and its surface impedance is greater than or equal to 10 ⁇ 11 ⁇ . This characteristic makes it difficult for the static electricity on the lamp shell to dissipate in a short time.
  • the lamp shell of the headlight module will generate static electricity after friction, which will significantly increase the probability of damage to the OLED headlight.
  • a vehicle lamp module which includes: a supporting layer; a packaging layer, arranged on one side of the supporting layer; a light-emitting layer, arranged on the side of the packaging layer away from the supporting layer; a cover plate, located on the side of the light-emitting layer away from the packaging layer; a conductive tape, connected to the cover plate, and the conductive tape is grounded.
  • the present application also provides a method for manufacturing a vehicle lamp module, which includes: encapsulating the light-emitting layer to form a packaging layer; laminating the support layer on the side of the packaging layer away from the light-emitting layer; laminating the cover plate on the side of the light-emitting layer away from the packaging layer; and bonding a conductive tape, wherein the conductive tape is grounded and connected to the cover plate.
  • the present application also provides a method for manufacturing a vehicle lamp module, which includes: encapsulating the light-emitting layer to form a packaging layer; laminating a cover plate on the side of the light-emitting layer away from the packaging layer; bonding a conductive tape, the conductive tape is grounded and connected to the cover plate; and laminating a support layer on the side of the packaging layer away from the light-emitting layer.
  • the present application further provides a vehicle, which includes the vehicle light module as described above.
  • the present application can quickly dissipate the static electricity generated on the cover plate by providing a conductive tape to ground the cover plate.
  • the conductive tape is provided around the periphery of the lamp module to enhance the sealing performance of the lamp module and thus increase its durability.
  • the embodiment of the present application discloses a vehicle light module, which can be applied to vehicle taillights, roof decorative lights, vehicle side decorative lights and other scenes.
  • the vehicle lamp module includes a support layer 10, an encapsulation layer 20, a light-emitting layer 30, a cover plate 50, and a conductive tape 70.
  • the encapsulation layer 20 is located on one side of the support layer 10
  • the light-emitting layer 30 is located on a side of the encapsulation layer 20 away from the support layer 10
  • the cover plate 50 is located on a side of the light-emitting layer 30 away from the encapsulation layer 20.
  • the conductive tape 70 is connected to the cover plate 50, and the conductive tape 70 is grounded.
  • the vehicle lamp module further includes a circuit board 40, and the circuit board 40 is attached to the edge of the light emitting layer 30.
  • the vehicle lamp module further includes a filter film 60, and the filter film 60 is disposed on a side of the cover plate 50 close to the light emitting layer 30 or on a side of the cover plate 50 away from the light emitting layer 30.
  • the material of the support layer 10 is ABS composite material. In some embodiments, the material of the support layer 10 can also be stainless steel, aluminum alloy or titanium alloy.
  • the thickness of the support layer 10 can be not less than 0.5 mm, for example, the thickness of the support layer 10 can be 0.5 mm or 0.52 mm or 0.55 mm or 0.58 mm or 0.6 mm, etc.
  • a grounding mechanism 11 is disposed around the edge of the support layer 10.
  • the grounding mechanism 11 may be a conductive mechanism such as a copper leakage mechanism or a metal area connected to the vehicle body or the vehicle interior assembly.
  • the mechanism 11 avoids the bonding area between the circuit board 40 and the light-emitting layer 30, and the distance from the bonding area is not less than 5 mm.
  • the distance between the grounding mechanism 11 and the bonding area can be 5 mm, 5.2 mm, 5.5 mm, 6 mm, 7 mm, etc.
  • a double-sided adhesive layer 12 may be provided between the support layer 10 and the encapsulation layer 20.
  • the double-sided adhesive layer 12 may be formed of a thermally conductive adhesive having a thermal conductivity of not less than 0.5 W/(m ⁇ k).
  • the support layer 10 and the encapsulation layer 20 are fixed by the double-sided adhesive layer 12.
  • the orthographic projection of the double-sided adhesive layer 12 onto the support layer 10 falls within the support layer 10; the orthographic projection of the double-sided adhesive layer 12 onto the encapsulation layer 20 falls within the encapsulation layer 20.
  • the encapsulation adopts a glass encapsulation process, such as Frit encapsulation.
  • the encapsulation adopts a thin film encapsulation (TFE) process.
  • the light-emitting layer 30 may be an OLED light-emitting layer.
  • the OLED light-emitting layer is used for lighting.
  • the OLED light-emitting layer is also used for display.
  • the brightness and color of pixels in each region may be controlled according to user input or manipulation to display a specific image externally.
  • the OLED light-emitting layer includes an anode, a cathode, and an organic light-emitting material layer. By applying different voltages to the anode and the cathode, the organic light-emitting material layer is driven to emit light.
  • the encapsulation layer 20 includes an inorganic insulating layer. In one embodiment, the encapsulation layer 20 includes a laminated structure of an inorganic insulating layer-an organic material layer-an inorganic insulating layer.
  • the material of the inorganic insulating layer may be silicon oxide, silicon nitride, silicon oxynitride, etc.
  • the material of the organic material layer may be a polymer. The encapsulation layer 20 provided can effectively prevent water and oxygen from entering the light-emitting layer 30.
  • a circuit board 40 is connected to the edge of the light-emitting layer 30.
  • the light-emitting layer 30 includes a middle area 32 bonded to the encapsulation layer 20 and an edge area 33 located on the periphery of the middle area 32.
  • the area on the left side of the dotted line in FIG3 is the middle area 32
  • the area on the right side of the dotted line is the edge area 33.
  • the dotted line in the figure does not represent any physical structure, but only illustrates the middle area 32 and the edge area 33.
  • the circuit board 40 is bonded to the side of the edge area 33 close to the encapsulation layer 20.
  • the circuit board 40 is a flexible printed circuit board (FPC).
  • the orthographic projection of the encapsulation layer 20 toward the light-emitting layer 30 falls within the light-emitting layer 30 and overlaps with the projection of the middle area 32.
  • the periphery of the middle area 32 extends outward with the edge area 33.
  • the circuit board 40 is bonded to the edge area 33 of the light-emitting layer 30.
  • the circuit board 40 is bonded to the side of the edge area 33 close to the encapsulation layer 20.
  • the circuit board 40 is bonded to the light emitting layer 30 through an anisotropic conductive adhesive 41.
  • the outer side of the bonding area between the circuit board 40 and the light emitting layer 30 is coated with a shadowless adhesive 42 to protect the area.
  • the outer side of the shadowless adhesive 42 is also coated with a waterproof adhesive 43 to enhance the packaging quality of the circuit board 40.
  • the anisotropic conductive adhesive 41 is perpendicular to the light emitting layer.
  • the projection of the shadowless adhesive 42 in the direction perpendicular to the light-emitting layer 30 falls within the projection of the shadowless adhesive 42 in the direction perpendicular to the light-emitting layer 30; the projection of the shadowless adhesive 42 in the direction perpendicular to the light-emitting layer 30 falls within the projection of the waterproof adhesive 43 in the direction perpendicular to the light-emitting layer 30.
  • connection between the circuit board 40 and the light-emitting layer 30 is achieved through the three-layer adhesive structure of the anisotropic conductive adhesive 41, the shadowless adhesive 42 and the waterproof adhesive 43, so that the electrical connection performance between the circuit board 40 and the light-emitting layer 30 is excellent, and at the same time, the packaging quality between the circuit board 40 and the light-emitting layer 30 is excellent.
  • the cover plate 50 may be a composite material cover plate. In some embodiments, the cover plate 50 may also be made of other materials such as glass. In this embodiment, the cover plate 50 is made of a composite material. The composite material has a lower cost than the glass material, which is conducive to cost saving, and its safety level after processing is also higher. The cover plate 50 is used to protect the light-emitting layer 30.
  • the transmittance of the cover plate 50 is not less than 88%. For example, the transmittance of the cover plate 50 may be 88%, 89%, 90%, 91%, 92%, etc.
  • the edge of the cover plate 50 close to the light-emitting layer 30 is provided with an antistatic glue mechanism, and the antistatic glue avoids the bonding area between the circuit board 40 and the light-emitting layer 30.
  • the edge of the cover plate 50 close to the light-emitting layer 30 is provided with an antistatic foam mechanism, and the antistatic foam avoids the bonding area between the circuit board 40 and the light-emitting layer 30.
  • the cover plate 50 is subjected to surface strengthening treatment, such as anti-glare, anti-reflection and surface hardening.
  • the cover plate 50 is subjected to light filtering treatment, so that the cover plate 50 has a light filtering function.
  • the cover plate 50 can selectively transmit the light of the specified wavelength band emitted by the light-emitting layer 30 to enhance the display effect of the vehicle light module.
  • the cover plate 50 can also prevent harmful light, i.e., light with a wavelength band less than or equal to 500nm, from entering the light-emitting layer 30, thereby avoiding damage to the structure of the light-emitting layer 30.
  • the cover plate 50 is not subjected to light filtering treatment and does not have a light filtering function, and a filter film 60 is further provided in the vehicle lamp module.
  • the filter film 60 can be provided on a side of the cover plate 50 close to the light-emitting layer 30, or on a side of the cover plate 50 away from the light-emitting layer 30.
  • an optically transparent adhesive layer 31 is provided between the filter film 60 and the light-emitting layer 30, and the filter film 60 and the light-emitting layer 30 are connected by the optically transparent adhesive layer 31.
  • an optically transparent adhesive layer 31 is provided between the cover plate 50 and the light-emitting layer 30, and the cover plate 50 and the light-emitting layer 30 are connected by the optically transparent adhesive layer 31.
  • the projection of the optically transparent adhesive layer 31 in a direction perpendicular to the light-emitting layer 30 falls within the projection of the light-emitting layer 30, the cover plate 50 and the filter film 60 in a direction perpendicular to the light-emitting layer 30.
  • the filter film 60 can selectively absorb or transmit light of a specific color to enhance the luminous effect of the luminescent layer 30.
  • the filter film 60 can also prevent harmful light, i.e. light with a wavelength of less than or equal to 500 nm, from entering the luminescent layer 30, thereby avoiding damage to the luminescent layer 30.
  • the conductive tape 70 may be made of conductive adhesive. In some embodiments, the conductive tape 70 may also be conductive cloth or conductive cloth tape with a thickness not exceeding 0.5 mm. For example, the thickness of the conductive cloth or conductive cloth tape may be 0.5 mm, 0.55 mm, 0.53 mm, 0.4 mm, 0.3 mm, etc.
  • the conductive tape 70 is disposed around the supporting layer 10, the light-emitting layer 30, the encapsulation layer 20 and the cover plate 50.
  • the conductive tape 70 When the conductive tape 70 is disposed, it avoids the bonding area between the circuit board 40 and the light-emitting layer 30, and the distance from the bonding area is not less than 2 mm.
  • the distance between the conductive tape 70 and the bonding area can be 2 mm, 2.5 mm, 2.8 mm, 3 mm, 4 mm, etc.
  • the conductive tape 70 starts from 2 mm on one side of the bonding area between the circuit board 40 and the light-emitting layer 30, surrounds the side of the lamp module, and reaches 2 mm on the other side of the bonding area between the circuit board 40 and the light-emitting layer 30.
  • the conductive tape 70 is fixedly attached to the support layer 10 and the cover plate 50 to seal the periphery of the lamp module.
  • the conductive tape 70 is disposed around the periphery of the lamp module to improve the waterproof and moisture-proof performance of the lamp module and increase the durability of the lamp module.
  • the conductive tape 70 is disposed around the periphery of the lamp module and will not block the light path of the light-emitting layer 30, so that the lamp module has a larger effective light-emitting area.
  • one side of the conductive tape 70 is bonded and fixed to the side of the cover plate 50 away from the light-emitting layer 30.
  • the other side of the conductive tape 70 is bonded and fixed to the side of the support layer 10 close to the encapsulation layer 20, and is bonded and fixed to the side of the encapsulation layer 20 close to the support layer 10.
  • the effective bonding length of the bonding section of the conductive tape 70 and the encapsulation layer 20 is greater than or equal to 0.5% of the maximum length of the encapsulation layer 20 in the length direction.
  • the effective bonding length of the bonding section of the conductive tape 70 and the encapsulation layer 20 is 0.5%, 1%, 3%, 5%, 10%, etc. of the maximum length of the encapsulation layer 20 in the length direction.
  • Part of the conductive tape 70 is disposed in the interlayer between the support layer 10 and the encapsulation layer 20.
  • the thickness of the conductive tape 70 connected to the encapsulation layer 20 is not less than the thickness of the double-sided adhesive layer 12, and is not more than 1.5 times the thickness of the double-sided adhesive layer 12.
  • the thickness of the conductive tape 70 is 1 times, 1.1 times, 1.2 times, 1.3 times, 1.5 times, etc., of the thickness of the double-sided adhesive layer 12.
  • the peeling force of the conductive tape 70 after being attached and fixed is greater than or equal to 1200 gf/inch.
  • connection area/attachment area between the conductive tape 70 and the support layer 10 covers all the grounding mechanisms 11 on the support layer 10, and the conductive tape 70 is grounded through the grounding mechanisms 11. In one embodiment, the connection area between the conductive tape 70 and the support layer 10 covers part of the grounding mechanisms 11 on the support layer 10, and the conductive tape 70 is grounded through the part of the grounding mechanisms 11.
  • the cover plate 50 or the packaging layer 20 can be grounded through the conductive tape 70, thereby eliminating the static electricity charge and preventing it from damaging the components.
  • one side of the conductive tape 70 is bonded and fixed to the side of the cover plate 50 away from the light-emitting layer 30.
  • the other side of the conductive tape 70 is bonded and fixed to the side of the support layer 10 away from the encapsulation layer 20.
  • the effective bonding length of the cross section of the conductive tape 70 bonded to the support layer 10 is greater than or equal to 5% of the maximum length of the support layer 10 in the length direction.
  • the effective bonding length of the cross section of the conductive tape 70 bonded to the support layer 10 can be 5% or 5.3% or 5.5% or 6% or 8% of the maximum length of the support layer 10 in the length direction.
  • the conductive tape 70 is bonded and fixed
  • the final peel force is greater than or equal to 1200gf/inch.
  • the portion of the conductive tape 70 located on the side of the support layer 10 away from the encapsulation layer 20 is in direct contact with the body shell or the vehicle interior assembly, thereby achieving direct grounding.
  • the bonding area/connection area between the conductive tape 70 and the support layer 10 covers all the grounding mechanisms 11 on the support layer 10, thereby achieving grounding.
  • the connection area between the conductive tape 70 and the support layer 10 covers part of the grounding mechanism 11 on the support layer 10, and the conductive tape 70 is grounded through the part of the grounding mechanism 11.
  • the conductive tape 70 can be grounded in two ways, which can more efficiently eliminate the electrostatic charge generated on the cover plate 50, thereby protecting the components.
  • one side of the conductive tape 70 is bonded and fixed to the side of the cover plate 50 away from the light-emitting layer 30.
  • the other side of the conductive tape 70 is bonded and fixed to the side of the support layer 10 away from the encapsulation layer 20.
  • the middle section/middle portion of the conductive tape 70 is bonded and fixed to the side of the encapsulation layer 20 close to the support layer 10 (or the side of the encapsulation layer 20 away from the light-emitting layer 30).
  • the effective bonding length of the cross section bonded between the conductive tape 70 and the encapsulation layer 20 is greater than or equal to 0.5% of the maximum length of the encapsulation layer 20 in the length direction.
  • the effective bonding length of the cross section bonded between the conductive tape 70 and the encapsulation layer 20 is 0.5%, 1%, 3%, 5%, 10%, etc., of the maximum length of the encapsulation layer 20 in the length direction.
  • the peeling force of the conductive tape 70 after bonding and fixing is greater than or equal to 1200 gf/inch.
  • the thickness of the conductive tape 70 connected to the packaging layer 20 is not less than 1.5 mm.
  • the thickness of the conductive tape 70 may be 1.5 mm, 1.53 mm, 1.55 mm, 1.6 mm, 1.7 mm, etc.
  • the portion of the conductive tape 70 located on the side of the support layer 10 away from the packaging layer 20 is in direct contact with the body shell or the vehicle interior assembly, thereby achieving grounding.
  • the bonding area/connection area between the conductive tape 70 and the support layer 10 covers all the grounding mechanisms 11 on the support layer 10, thereby achieving grounding.
  • the connection area between the conductive tape 70 and the support layer 10 covers part of the grounding mechanism 11 on the support layer 10, and the conductive tape 70 is grounded through the part of the grounding mechanism 11.
  • the conductive tape 70 can be grounded in two ways, and the conductive tape 70 is connected to the cover plate 50 and the packaging layer 20 at the same time, which can more efficiently eliminate the electrostatic charge generated on the cover plate 50 and the packaging layer 20, thereby protecting the components.
  • the headlight module of the present application proposes a solution of providing conductive tape to ground the cover plate, which can quickly dissipate the static electricity charge generated by the cover plate.
  • the conductive tape is arranged around the periphery of the headlight module to enhance the sealing performance of the headlight module and thus increase its durability.
  • the headlight module of the present application improves its anti-static ability, so that the product has a higher ESD (Electro-Static discharge) level.
  • the headlight module of the present application integrates the electrostatic protection mechanism into the headlight module itself, so that the end customer does not need to integrate the anti-static mechanism, which improves the assembly yield of the terminal product, reduces the entry barrier for the end customer, and facilitates the promotion of the product.
  • the present application also solves the technical bottleneck for the subsequent development of touch and other functions of the headlight module.
  • the present application also discloses a method for manufacturing a vehicle light module, which can be used to manufacture the above vehicle light module.
  • the manufacturing method may include: step 101, encapsulating the light-emitting layer to form an encapsulation layer; step 102, laminating a support layer on a side of the encapsulation layer away from the light-emitting layer; step 103, laminating a cover plate on a side of the light-emitting layer away from the encapsulation layer; step 104, bonding a conductive tape, the conductive tape being grounded and connected to the cover plate.
  • the manufacturing method may include: first encapsulating the light-emitting layer 30 to form the encapsulation layer 20; then laminating the support layer 10 on the side of the encapsulation layer 20 away from the light-emitting layer 30; then laminating the cover plate 50 on the side of the light-emitting layer 30 away from the encapsulation layer 20; and finally bonding the conductive tape 70, which is grounded and connected to the cover plate 50.
  • the manufacturing method may include: bonding the circuit board 40 to the edge of the light-emitting layer 30 through the anisotropic conductive adhesive 41, then coating the outer side of the bonding area between the circuit board 40 and the light-emitting layer 30 with shadowless adhesive 42, and coating the outer side of the shadowless adhesive 42 with waterproof adhesive 43, thereby forming a three-layer adhesive structure consisting of the anisotropic conductive adhesive 41, the shadowless adhesive 42 and the waterproof adhesive 43 from the inside to the outside.
  • the manufacturing method may include: laminating the support layer 10 on the side of the encapsulation layer 20 away from the light-emitting layer 30, wherein a double-sided adhesive layer 12 is provided on one side of the support layer 10, and the double-sided adhesive layer 12 is used to achieve lamination and fixation between the support layer 10 and the encapsulation layer 20.
  • the manufacturing method may include: laminating a cover plate 50 and a filter film 60 on a side of the light-emitting layer 30 away from the encapsulation layer 20, and laminating the cover plate 50 and the filter film 60 to the light-emitting layer 30 through an optically transparent adhesive layer 31.
  • the cover plate 50 may be laminating first, and then the filter film 60; in another embodiment, the filter film 60 may be laminating first, and then the cover plate 50. In yet another embodiment, only the cover plate 50 may be laminating, and the filter film 60 may not be laminating.
  • step 104 includes: bonding the conductive tape 70 to the edge regions of the support layer 10, the encapsulation layer 20, the light emitting layer 30, the cover plate 50 and the filter film 60, wherein the conductive tape 70 avoids the bonding region of the circuit board 40 and the light emitting layer 30.
  • the conductive tape 70 starts from 2 mm on one side of the bonding region of the circuit board 40 and the light emitting layer 30, surrounds the circumference of the vehicle lamp module, and reaches 2 mm on the other side of the bonding region of the circuit board 40 and the light emitting layer 30.
  • the two long sides of the conductive tape 70 are bonded to the support layer 10 and the cover plate 50, so that the encapsulation layer 20, the light emitting layer 30 and the filter film 60 between the support layer 10 and the cover plate 50 are all covered by the conductive tape 70, thereby enhancing the sealing performance and durability of the vehicle lamp module.
  • the present application also discloses another method for manufacturing a vehicle light module, which can be used to manufacture the above vehicle light module.
  • the manufacturing method may include: step 201, encapsulating the light-emitting layer to form an encapsulation layer; step 202, laminating a cover plate on the side of the light-emitting layer away from the encapsulation layer; step 203, bonding a conductive tape, the conductive tape is grounded and connected to the cover plate; step 204, laminating a support layer on the side of the encapsulation layer away from the light-emitting layer.
  • the manufacturing method may include: first encapsulating the light-emitting layer 30 to form the encapsulation layer 20; then laminating the cover plate 50 on the side of the light-emitting layer 30 away from the encapsulation layer 20; then bonding the conductive tape 70, wherein the conductive tape 70 is grounded and connected to the cover plate 50; and finally laminating the support layer 10 on the side of the encapsulation layer 20 away from the light-emitting layer 30.
  • the manufacturing method may include: bonding the circuit board 40 to the edge of the light-emitting layer 30 through the anisotropic conductive adhesive 41, then coating the shadowless adhesive 42 on the outside of the bonding area between the circuit board 40 and the light-emitting layer 30, and coating the waterproof adhesive 43 on the outside of the shadowless adhesive 42, thereby forming a three-layer adhesive structure consisting of the anisotropic conductive adhesive 41, the shadowless adhesive 42 and the waterproof adhesive 43 from the inside to the outside.
  • the manufacturing method may include: laminating a cover plate 50 and a filter film 60 on a side of the light-emitting layer 30 away from the encapsulation layer 20, and laminating the cover plate 50 and the filter film 60 to the light-emitting layer 30 through an optically transparent adhesive layer 31.
  • the cover plate 50 may be laminating first, and then the filter film 60; in another embodiment, the filter film 60 may be laminating first, and then the cover plate 50. In yet another embodiment, only the cover plate 50 may be laminating, and the filter film 60 may not be laminating.
  • step 203 includes: bonding the conductive tape 70 to the edge areas of the support layer 10, the encapsulation layer 20, the light emitting layer 30, the cover plate 50 and the filter film 60, wherein the conductive tape 70 avoids the bonding area between the circuit board 40 and the light emitting layer 30.
  • the conductive tape 70 starts from 2 mm on one side of the bonding area between the circuit board 40 and the light emitting layer 30, surrounds the circumference of the vehicle lamp module, and reaches 2 mm on the other side of the bonding area between the circuit board 40 and the light emitting layer 30.
  • the two long sides of the conductive tape 70 are bonded to the support layer 10 and the cover plate 50, so that the encapsulation layer 20, the light emitting layer 30 and the filter film 60 between the support layer 10 and the cover plate 50 are all covered by the conductive tape 70, thereby enhancing the sealing performance and durability of the vehicle lamp module.
  • the manufacturing method may include: laminating the support layer 10 on the side of the encapsulation layer 20 away from the light-emitting layer 30, wherein a double-sided adhesive layer 12 is provided on one side of the support layer 10, and the double-sided adhesive layer 12 is used to achieve lamination and fixation between the support layer 10 and the encapsulation layer 20.
  • the present application also discloses a vehicle, comprising the above-mentioned vehicle light module, which can be applied to the vehicle's rear lights, body decorative lights, roof lights, etc.
  • the present application uses conductive tape to ground the cover plate, which can effectively eliminate the static electricity generated by friction and other reasons on the cover plate, and prevent the static electricity from damaging the components.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

一种车灯模组及车灯模组的制造方法及车辆。车灯模组包括支撑层（10）、封装层（20）、发光层（30）、盖板（50）以及导电胶带（70）。封装层（10）设置于支撑层（10）的一侧。发光层（30）设置于封装层（20）远离支撑层（10）的一侧。盖板（50）位于发光层（30）远离封装层（20）的一侧。导电胶带（70）与盖板（50）连接，导电胶带（70）接地。通过导电胶带（70）使盖板（50）接地，能有效的消除盖板（50）因摩擦等原因产生的静电电荷，防止静电电荷对元器件的损害。

Description

车灯模组及其制造方法及车辆 技术领域
本申请涉及汽车领域，尤其涉及一种车灯模组及其制造方法及车辆。
背景技术
目前将OLED发光层集成至车灯壳的技术趋势与市场趋势越发明显。然而，现有的集成车灯模组由摩擦产生的静电电荷难以自车灯模组内消除或导出，导致车灯模组内的元器件的损坏几率明显增加。
发明内容
本申请的目的在于提供一种防静电的车灯模组及其制造方法及车辆。
本申请公开了一种车灯模组，车灯模组包括：支撑层；封装层，设置于所述支撑层的一侧；发光层，设置于所述封装层远离所述支撑层的一侧；盖板，位于所述发光层远离所述封装层的一侧；导电胶带，与所述盖板连接，且接地。
在一些实施例中，所述车灯模组还包括电路板，所述发光层包括与所述封装层贴合的中间区以及位于所述中间区周侧的边缘区，所述电路板与所述边缘区靠近所述封装层的一侧贴合；所述导电胶带设置于所述支撑层、所述发光层、所述封装层及所述盖板的周侧且避让开所述电路板。
在一些实施例中，所述导电胶带与所述盖板远离所述发光层的一侧连接。
在一些实施例中，所述导电胶带与所述支撑层远离所述封装层的一侧连接，且所述导电胶带直接接地。
在一些实施例中，所述导电胶带与所述支撑层靠近所述封装层的一侧连接。
在一些实施例中，所述支撑层设置有接地机构；所述接地机构的一部分位于所述支撑层与所述导电胶带的连接区域；所述接地机构的该部分与所述导电胶带连接。
在一些实施例中，所述车灯模组还包括电路板，其中，所述电路板与所述发光层的边缘贴合，所述接地机构避让开所述电路板。
在一些实施例中，所述导电胶带的中部与所述封装层远离所述发光层的一侧连接。
在一些实施例中，所述导电胶带与所述封装层远离所述发光层的一侧连接。
在一些实施例中，部分所述导电胶带设置于所述支撑层与所述封装层之间的夹层中。
在一些实施例中，所述支撑层与所述封装层之间设置有双面胶层；所述导电胶带的厚度不小于所述双面胶层的厚度且不超过所述双面胶层的厚度的1.5倍。
在一些实施例中，所述盖板靠近所述发光层的一侧设置有滤光膜；或所述盖板远离所述发光层的一侧设置有滤光膜。
在一些实施例中，所述发光层靠近所述盖板一侧设置有光学透明胶层。
在一些实施例中，所述电路板与所述发光层之间通过各向异性导电胶连接；所述各向异性导电胶的外侧涂覆有无影胶；所述无影胶的外侧涂覆有防水胶。
本申请还公开了一种车灯模组的制造方法，包括：对发光层进行封装形成封装层；在所述封装层远离所述发光层的一侧贴合支撑层；在所述发光层远离所述封装层的一侧贴合盖板；键合导电胶带，其中，所述导电胶带接地且与所述盖板连接。
本申请还公开了一种车灯模组的制造方法，包括：对发光层进行封装形成封装层；在所述发光层远离所述封装层的一侧贴合盖板；键合导电胶带，其中，所述导电胶带接地且与所述盖板连接；在所述封装层远离所述发光层的一侧贴合支撑层。
本申请还公开了一种车辆，包括如上所述的车灯模组。应当理解的是，以上的一般描述和后文的细节描述仅是示例性和解释性的，并不能限制本说明书。
附图说明
此处的附图被并入说明书中并构成本说明书的一部分，示出了符合本说明书的实施例，并与说明书一起用于解释本说明书的原理。
图1为本申请一实施例的车灯模组的示意图。
图2为本申请一实施例的车灯模组的正视示意图。
图3为本申请一实施例的车灯模组电路板与发光层连接处的局部截面示意图。
图4为本申请一实施例的图2中A区域的局部截面示意图。
图5为本申请另一实施例的图2中A区域的局部截面示意图。
图6为本申请又一实施例的图2中A区域的局部截面示意图。
图7为本申请一实施例的车灯模组的制造方法的流程图。
图8为本申请另一实施例的车灯模组的制造方法的流程图。
附图标记说明：支撑层、10；接地机构、11；双面胶层、12；封装层、20；发光层、30；光学透明胶层、31；中间区、32；边缘区、33；电路板、40；各向异性导电胶、41；无影胶、42；防水胶、43；盖板、50；滤光膜、60；导电胶带、70。
具体实施方式
这里将详细地对示例性实施例进行说明，其示例表示在附图中。下面的描述涉及附图时，除非另有表示，不同附图中的相同数字表示相同或相似的要素。以下示例性实施例中所描述的实施方式并不代表与本说明书相一致的所有实施方式。相反，它们仅是与如所附权利要求书中所详述的、本说明书的一些方面相一致的装置和方法的例子。
本申请使用的术语仅仅出于描述特定实施例的目的，而非旨在限制本公开。除非另作定义，本说明书使用的技术术语或者科学术语应当为本申请所属领域内设有一般技能的人士所理解的通常意义。本说明书以及权利要求书中使用的“第一”“第二”以及类似的词语并不表示任何顺序、数量或者重要性，而只是用来区分不同的组成部分。同样，“一个”或者“一”等类似词语也不表示数量限制，而是表示存在。“多个”或者“若干”表示两个及两个以上。除非另行指出，“前部”、“后部”、“下部”和/或“上部”等类似词语只是为了便于说明，而并非限于一个位置或者一种空间定向。“包括”或者“包含”等类似词语意指出现在“包括”或者“包含”前面的元件或者物件涵盖出现在“包括”或者“包含”后面列举的元件或者物件及其等同物，并不排除其他元件或者物件。“连接”或者“相连”等类似的词语并非限定于物理的或者机械的连接，而且可以包括电性的连接，不管是直接的还是间接的。
本说明书使用的术语仅仅出于描述特定实施例的目的，而非旨在限制本公开。在本说明书和所附权利要求书中所使用的单数形式的“一种”、“所述”和“该”也旨在包括多数形式，除非上下文清楚地表示其他含义。还应当理解，本文中使用的术语“和/或”是指并包含一个或多个相关联的列出项目的任何或所有可能组合。
相关技术中，静电是电子产品不可忽略的一个问题，尤其是对于OLED(Organic Light-Emitting Diode，有机发光二极管)、LED(Light-Emitting Diode，发光二极管)及液晶屏幕等高灵敏电子屏幕来说。车灯壳的材料主要为抗静电体，其表面阻抗大于等于10^11Ω，该特性导致灯壳上的静电难以短时间内消散。车灯模组的灯壳摩擦后会产生静电，该静电对于OLED车灯来说会显著增加其损坏几率。
为解决上述技术问题，本申请提供一种车灯模组，其包括：支撑层；封装层，设置于支撑层的一侧；发光层，设置于封装层远离支撑层的一侧；盖板，位于发光层远离封装层的一侧；导电胶带，与盖板连接，导电胶带接地。
为解决上述技术问题，本申请还提供一种车灯模组的制造方法，其包括：对发光层进行封装形成封装层；在封装层远离发光层的一侧贴合支撑层；在发光层远离封装层的一侧贴合盖板；键合导电胶带，导电胶带接地且与盖板连接。
为解决上述技术问题，本申请另提供一种车灯模组的制造方法，其包括：对发光层进行封装形成封装层；在发光层远离封装层的一侧贴合盖板；键合导电胶带，导电胶带接地且与盖板连接；在封装层远离发光层的一侧贴合支撑层。
为解决上述技术问题，本申请又提供一种车辆，其包括如前所述的车灯模组。
本申请通过设置导电胶带使盖板接地，可以快速地使盖板上产生的静电电荷消散。在一些实施例中，导电胶带环绕设置于车灯模组的周侧，可以增强车灯模组的密封性能，进而增加其耐久性。
以下将对本申请的各个实施例进行详细说明。
本申请实施例公开了一种车灯模组，该车灯模组可应用于车辆尾灯、车顶装饰灯及车侧身装饰灯等场景。
如图1所示，车灯模组包括支撑层10、封装层20、发光层30、盖板50以及导电胶带70。封装层20位于支撑层10的一侧，发光层30位于封装层20远离支撑层10的一侧，盖板50位于发光层30远离封装层20的一侧。导电胶带70与盖板50连接，并且导电胶带70接地。
如图1所示，在一些实施例中，车灯模组还包括电路板40，电路板40与发光层30的边缘贴合。在一些实施例中，车灯模组还包括滤光膜60，滤光膜60设置于盖板50靠近发光层30的一侧或设置于盖板50远离发光层30的一侧。
在一些实施例中，支撑层10的材料为ABS复合材料。在一些实施例中，支撑层10的材料也可以是不锈钢、铝合金或者是钛合金等材料。支撑层10的厚度可不小于0.5mm，例如，支撑层10的厚度可以为0.5mm或0.52mm或0.55mm或0.58mm或0.6mm等。
请参阅图1至图2，在一些实施例中，支撑层10的边缘环绕设置有接地机构11，该接地机构11可以是漏铜机构或金属区等与车身或车内总成相连接的导电机构。该接地 机构11避让开了电路板40与发光层30的贴合区域，且与该贴合区域的距离不小于5mm，例如，接地机构11与该贴合区域的距离可以为5mm或5.2mm或5.5mm或6mm或7mm等。
在一些实施例中，支撑层10与封装层20之间可设置有双面胶层12，该双面胶层12可以由导热胶形成，导热胶的导热系数不小于0.5W/(m·k)。支撑层10与封装层20通过该双面胶层12固定。该双面胶层12向支撑层10的正投影落在支撑层10内；该双面胶层12向封装层20的正投影落在封装层20内。
封装层20远离支撑层10的一侧与发光层30贴合固定。在一实施例中，封装采用玻璃封装工艺，例如Frit封装。在另一实施例中，封装采用薄膜封装(TFE)工艺。
在一个实施例中，发光层30可以为OLED发光层。在一个实施例中，OLED发光层用于照明。在一个实施例中，OLED发光层还用于显示，比如，可根据用户的输入或操控，控制各区域像素的亮度和颜色等，以向外显示特定的图像。在一个实施例中，OLED发光层包括阳极、阴极和有机发光材料层。通过向阳极、阴极施加不同的电压，驱动有机发光材料层发光。
在一个实施例中，封装层20包括无机绝缘层。在一个实施例中，封装层20包括无机绝缘层-有机材料层-无机绝缘层的叠层结构。其中，无机绝缘层的材料可以是氧化硅、氮化硅、氮氧化硅等。有机材料层的材料可以是聚合物。设置的封装层20可以有效阻隔水和氧气进入发光层30。
如图3所示，在一些实施例中，发光层30的边缘连接有电路板40。发光层30包括与封装层20贴合的中间区32以及位于中间区32周侧的边缘区33。例如，图3中虚线左侧的区域为中间区32，虚线右侧的区域为边缘区33，图中虚线不代表任何实体结构，仅示意出中间区32与边缘区33。电路板40与边缘区33靠近封装层20的一侧贴合。在一个实施例中，电路板40为柔性印刷电路板(FPC)。封装层20朝发光层30的正投影落在发光层30内，并且与中间区32的投影重叠。中间区32的周侧向外延展有边缘区33。电路板40贴合于发光层30的边缘区33。电路板40贴合于边缘区33靠近封装层20的一侧面。
在一些实施例中，电路板40通过各向异性导电胶41与发光层30贴合。电路板40与发光层30的贴合区域的外侧涂覆有无影胶42以保护该区域。无影胶42的外侧还涂覆有防水胶43，以加强对电路板40的封装质量。各向异性导电胶41在垂直于发光层 30方向上的投影落在无影胶42在垂直于发光层30方向上的投影内；无影胶42在垂直于发光层30方向上的投影落在防水胶43在垂直于发光层30方向上的投影内。通过各向异性导电胶41、无影胶42以及防水胶43的三层胶粘结构实现电路板40与发光层30的连接，使电路板40与发光层30之间的电连接性能优异，同时使电路板40与发光层30之间的封装质量优异。
在一些实施例中，盖板50可以为复合材料盖板。在一些实施例中，盖板50也可以由玻璃等其他材料制成。在本实施例中，盖板50采用复合材料，复合材料相较于玻璃材料的成本更低，有利于节约成本，其加工完成后的安全等级也更高。盖板50用于保护发光层30，盖板50的透过率不小于88％，例如，盖板50的透过率可以为88％或89％或90％或91％或92％等。盖板50靠近发光层30的一侧的边缘设置有抗静电胶机构，抗静电胶避让开电路板40与发光层30的贴合区域。在一实施例中，盖板50靠近发光层30的一侧的边缘设置有抗静电泡棉机构，抗静电泡棉避让开电路板40与发光层30的贴合区域。
在一实施例中，盖板50经过表面强化处理，如防眩光、抗反射及表面硬化等处理。在一实施例中，盖板50经过滤光处理，使盖板50具有滤光功能。盖板50可以选择性的透过发光层30发出的指定波段的光线，以增强车灯模组的显示效果。盖板50也可以防止有害光即波段小于等于500nm的光进入发光层30，从而避免损坏发光层30的结构。
在另一实施例中，盖板50未经过滤光处理，不具备滤光功能，车灯模组中还设置有滤光膜60。滤光膜60可以设置于盖板50靠近发光层30的一侧，也可以设置于盖板50远离发光层30的一侧。当滤光膜60设置于盖板50靠近发光层30的一侧时，滤光膜60与发光层30之间设置有光学透明胶层31，滤光膜60与发光层30通过光学透明胶层31连接。当滤光膜60设置于盖板50远离发光层30的一侧时，盖板50与发光层30之间设置有光学透明胶层31，盖板50与发光层30通过光学透明胶层31连接。光学透明胶层31在垂直于发光层30方向上的投影落在发光层30、盖板50以及滤光膜60在垂直于发光层30方向上的投影内。滤光膜60可以选择性地吸收或透过特定颜色的光，以增强发光层30的发光效果。滤光膜60也可以防止有害光即波段小于等于500nm的光进入发光层30，从而避免损坏发光层30。
在一些实施例中，导电胶带70可以由导电胶制成。在一些实施例中，导电胶带70也可以是厚度不超过0.5mm的导电布或者是导电布胶带等。例如，导电布或者导电布胶带的厚度可以为0.5mm或0.55mm或0.53mm或0.4mm或0.3mm等。
在一些实施例中，导电胶带70环绕设置于支撑层10、发光层30、封装层20及盖板50的周侧。导电胶带70设置时避让开电路板40与发光层30的贴合区域，并且与该贴合区域的距离不小于2mm。例如，导电胶带70与该贴合区域的距离可以为2mm或2.5mm或2.8mm或3mm或4mm等。在一实施例中，导电胶带70自电路板40与发光层30的贴合区域的一侧2mm处开始，环绕车灯模组的周侧一圈，到达电路板40与发光层30的贴合区域的另一侧2mm处。
该导电胶带70与支撑层10及盖板50贴合固定使车灯模组的周侧密封。导电胶带70环绕设置于车灯模组的周侧，可以提升车灯模组的防水防潮性能，增加车灯模组的耐久性。相较于相关技术，导电胶带70环绕设置于车灯模组的周侧，不会遮挡发光层30的发光路径，使车灯模组有更大的有效发光面积。
如图4所示，在一实施例中，导电胶带70的一侧与盖板50远离发光层30的一侧贴合固定。导电胶带70的另一侧与支撑层10靠近封装层20的一侧贴合固定，同时与封装层20靠近支撑层10的一侧贴合固定。导电胶带70与封装层20贴合截面的有效贴合长度大于等于封装层20在长度方向上的最大长度的0.5％，例如，导电胶带70与封装层20贴合截面的有效贴合长度为封装层20在该长度方向上的最大长度的0.5％或1％或3％或5％或10％等。部分导电胶带70设置于支撑层10与封装层20之间的夹层中。
在一实施例中，与封装层20连接的导电胶带70的厚度不小于双面胶层12的厚度，且不超过双面胶层12的厚度的1.5倍，例如，导电胶带70的厚度为双面胶层12的厚度的1倍或1.1倍或1.2倍或1.3倍或1.5倍等。导电胶带70贴合固定后的剥离力大于等于1200gf/inch。
在一实施例中，导电胶带70与支撑层10的连接区域/贴合区域覆盖支撑层10上的全部接地机构11，导电胶带70通过接地机构11实现接地。在一实施例中，导电胶带70与支撑层10的连接区域覆盖支撑层10上的部分接地机构11，导电胶带70通过该部分接地机构11实现接地。当盖板50或者封装层20产生静电时，盖板50或者封装层20可通过导电胶带70实现接地，从而消除静电电荷，防止其对元件造成损坏。
如图5所示，在另一实施例中，导电胶带70的一侧与盖板50远离发光层30的一侧贴合固定。导电胶带70的另一侧与支撑层10远离封装层20的一侧贴合固定。导电胶带70与支撑层10贴合截面的有效贴合长度大于等于支撑层10在该长度方向上的最大长度的5％，例如，导电胶带70与支撑层10贴合截面的有效贴合长度可以为支撑层10在该长度方向上的最大长度的5％或5.3％或5.5％或6％或8％等。导电胶带70贴合固定 后的剥离力大于等于1200gf/inch。
导电胶带70位于支撑层10远离封装层20的一侧的部分直接与车身外壳或车内总成接触，从而实现直接接地。在一实施例中，导电胶带70与支撑层10的贴合区域/连接区域覆盖支撑层10上的全部接地机构11，从而实现接地。在一实施例中，导电胶带70与支撑层10的连接区域覆盖支撑层10上的部分接地机构11，导电胶带70通过该部分接地机构11实现接地。导电胶带70可通过两种方式实现接地，可以更高效地消除盖板50上产生的静电电荷，从而保护元器件。
如图6所示，在又一实施例中，导电胶带70的一侧与盖板50远离发光层30的一侧贴合固定。导电胶带70的另一侧与支撑层10远离封装层20的一侧贴合固定。导电胶带70的中段/中部贴合固定于封装层20靠近支撑层10的一侧(或封装层20远离所述发光层30的一侧)。导电胶带70与封装层20贴合截面的有效贴合长度大于等于封装层20在该长度方向上的最大长度的0.5％，例如，导电胶带70与封装层20贴合截面的有效贴合长度为封装层20在该长度方向上的最大长度的0.5％或1％或3％或5％或10％等。导电胶带70贴合固定后的剥离力大于等于1200gf/inch。
在一实施例中，与封装层20连接的导电胶带70的厚度不小于1.5mm，例如，导电胶带70的厚度可以为1.5mm或1.53mm或1.55mm或1.6mm或1.7mm等。
导电胶带70位于支撑层10远离封装层20的一侧的部分直接与车身外壳或车内总成接触，从而实现接地。在一实施例中，导电胶带70与支撑层10的贴合区域/连接区域覆盖支撑层10上的全部接地机构11，从而实现接地。在一实施例中，导电胶带70与支撑层10的连接区域覆盖支撑层10上的部分接地机构11，导电胶带70通过该部分接地机构11实现接地。导电胶带70可通过两种方式实现接地，且导电胶带70同时与盖板50及封装层20连接，可以更高效地消除盖板50及封装层20上产生的静电电荷，从而保护元器件。
本申请的车灯模组针对车灯外壳摩擦产生的静电难以短时间消除的问题，提出设置导电胶带，使盖板接地的方案，可以快速地使盖板产生的静电电荷消散。同时导电胶带环绕设置于车灯模组的周侧，可以增强车灯模组的密封性能，进而增加其耐久性。本申请的车灯模组提升了其抗静电能力，使产品具有更高的ESD(Electro-Static discharge，静电释放)等级。本申请的车灯模组将静电防护机构集成于车灯模组本身，使终端客户无需进行抗静电机构的集成，提升了终端产品的组装良率，降低了终端客户的准入门栏，便于产品的推广。同时本申请也为后续开发车灯模组的触控等功能解决了技术瓶颈。
如图7所示，本申请还公开了一种制造车灯模组的方法，该方法可用于制造上述车灯模组。制造方法可包括：步骤101，对发光层进行封装形成封装层；步骤102，在所述封装层远离所述发光层的一侧贴合支撑层；步骤103，在所述发光层远离所述封装层的一侧贴合盖板；步骤104，键合导电胶带，导电胶带接地且与盖板连接。
例如，该制造方法可以包括：先对发光层30进行封装形成封装层20；随后在封装层20远离发光层30的一侧贴合支撑层10；再在发光层30远离封装层20的一侧贴合盖板50；最后键合导电胶带70，导电胶带70接地且与盖板50连接。
在一些实施例中，在步骤101之后且步骤102之前，该制造方法可包括：将电路板40通过各向异性导电胶41贴合至发光层30的边缘，接着在电路板40与发光层30的贴合区域的外侧涂覆无影胶42，在无影胶42的外侧涂覆防水胶43，从而，由内至外形成各向异性导电胶41、无影胶42及防水胶43构成的三层胶粘结构。
在一些实施例中，该制造方法可包括：在封装层20远离发光层30的一侧贴合支撑层10，其中支撑层10的一侧设置有双面胶层12，通过双面胶层12实现支撑层10与封装层20之间的贴合固定。
在一些实施例中，该制造方法可包括：在发光层30远离封装层20的一侧贴合盖板50以及滤光膜60，盖板50以及滤光膜60通过光学透明胶层31贴合至发光层30。在一实施例中，可以先贴合盖板50，再贴合滤光膜60；在另一实施例中，可以先贴合滤光膜60，再贴合盖板50。在又一实施例中，可以仅贴合盖板50，不贴合滤光膜60。
在一些实施例中，步骤104包括：将导电胶带70键合至支撑层10、封装层20、发光层30、盖板50以及滤光膜60的边缘区域，其中导电胶带70避让开电路板40与发光层30的贴合区域。在一实施例中，导电胶带70自电路板40与发光层30的贴合区域的一侧2mm处开始，环绕车灯模组的周侧一圈，到达电路板40与发光层30的贴合区域的另一侧2mm处。导电胶带70的两长边贴合支撑层10与盖板50，使支撑层10与盖板50之间的封装层20、发光层30及滤光膜60均被导电胶带70覆盖，增强了车灯模组的密封性能以及耐久性。
如图8所示，本申请还公开了另一种制造车灯模组的方法，该方法可用于制造上述车灯模组。制造方法可包括：步骤201，对发光层进行封装形成封装层；步骤202，在所述发光层远离所述封装层的一侧贴合盖板；步骤203，键合导电胶带，导电胶带接地且与盖板连接；步骤204，在所述封装层远离所述发光层的一侧贴合支撑层。
例如，该制造方法可以包括：先对发光层30进行封装形成封装层20；随后在发光层30远离封装层20的一侧贴合盖板50；再键合导电胶带70，所述导电胶带70接地且与所述盖板50连接；最后在封装层20远离发光层30的一侧贴合支撑层10。
在一些实施例中，在步骤201之后且步骤202之前，该制造方法可包括：将电路板40通过各向异性导电胶41贴合至发光层30的边缘，接着在电路板40与发光层30的贴合区域的外侧涂覆无影胶42，在无影胶42的外侧涂覆防水胶43，从而，由内至外形成各向异性导电胶41、无影胶42及防水胶43构成的三层胶粘结构。
在一些实施例中，该制造方法可包括：在发光层30远离封装层20的一侧贴合盖板50以及滤光膜60，盖板50以及滤光膜60通过光学透明胶层31贴合至发光层30。在一实施例中，可以先贴合盖板50，再贴合滤光膜60；在另一实施例中，可以先贴合滤光膜60，再贴合盖板50。在又一实施例中，可以仅贴合盖板50，不贴合滤光膜60。
在一些实施例中，步骤203包括：将导电胶带70键合至支撑层10、封装层20、发光层30、盖板50以及滤光膜60的边缘区域，其中导电胶带70避让开电路板40与发光层30的贴合区域。在一实施例中，导电胶带70自电路板40与发光层30的贴合区域的一侧2mm处开始，环绕车灯模组的周侧一圈，到达电路板40与发光层30的贴合区域的另一侧2mm处。导电胶带70的两长边贴合支撑层10与盖板50，使支撑层10与盖板50之间的封装层20、发光层30及滤光膜60均被导电胶带70覆盖，增强了车灯模组的密封性能以及耐久性。
在一些实施例中，该制造方法可包括：在封装层20远离发光层30的一侧贴合支撑层10，其中支撑层10的一侧设置有双面胶层12，通过双面胶层12实现支撑层10与封装层20之间的贴合固定。
本申请还公开了一种车辆，包括上述的车灯模组，该车灯模组可以应用于车辆的后车灯，车身的装饰灯，车顶灯等。
本申请通过导电胶带使盖板接地，能有效地消除盖板因摩擦等原因产生的静电电荷，防止静电电荷对元器件的损害。
本领域技术人员在考虑说明书及实践这里申请的发明后，将容易想到本说明书的其它实施方案。本说明书旨在涵盖本说明书的任何变型、用途或者适应性变化，这些变型、用途或者适应性变化遵循本说明书的一般性原理并包括本说明书未申请的本技术领域中的公知常识或惯用技术手段。说明书和实施例仅被视为示例性的，本说明书的真正范 围和精神由下面的权利要求指出。
应当理解的是，本说明书并不局限于上面已经描述并在附图中示出的精确结构，并且可以在不脱离其范围进行各种修改和改变。本说明书的范围仅由所附的权利要求来限制。
以上仅为本说明书的较佳实施例而已，并不用以限制本说明书，凡在本说明书的精神和原则之内，所做的任何修改、等同替换、改进等，均应包含在本说明书保护的范围之内。

Claims (17)

  1. 一种车灯模组，包括：
    支撑层；
    封装层，设置于所述支撑层的一侧；
    发光层，设置于所述封装层远离所述支撑层的一侧；
    盖板，位于所述发光层远离所述封装层的一侧；
    导电胶带，与所述盖板连接，且接地。
  2. 根据权利要求1所述的车灯模组，其特征在于，所述车灯模组还包括电路板，
    所述发光层包括与所述封装层贴合的中间区以及位于所述中间区周侧的边缘区，所述电路板与所述边缘区靠近所述封装层的一侧贴合；
    所述导电胶带设置于所述支撑层、所述发光层、所述封装层及所述盖板的周侧且避让开所述电路板。
  3. 根据权利要求1所述的车灯模组，其特征在于，所述导电胶带与所述盖板远离所述发光层的一侧连接。
  4. 根据权利要求3所述的车灯模组，其特征在于，所述导电胶带与所述支撑层远离所述封装层的一侧连接，且所述导电胶带直接接地。
  5. 根据权利要求3所述的车灯模组，其特征在于，所述导电胶带与所述支撑层靠近所述封装层的一侧连接。
  6. 根据权利要求4或5所述的车灯模组，其特征在于，所述支撑层设置有接地机构；所述接地机构的一部分位于所述支撑层与所述导电胶带的连接区域；所述接地机构的该部分与所述导电胶带连接。
  7. 根据权利要求6所述的车灯模组，其特征在于，所述车灯模组还包括电路板，其中，所述电路板与所述发光层的边缘贴合，所述接地机构避让开所述电路板。
  8. 根据权利要求4所述的车灯模组，其特征在于，所述导电胶带的中部与所述封装层远离所述发光层的一侧连接。
  9. 根据权利要求5所述的车灯模组，其特征在于，所述导电胶带与所述封装层远离所述发光层的一侧连接。
  10. 根据权利要求9所述的车灯模组，其特征在于，部分所述导电胶带设置于所述支撑层与所述封装层之间的夹层中。
  11. 根据权利要求10所述的车灯模组，其特征在于，所述支撑层与所述封装层之间设置有双面胶层；所述导电胶带的厚度不小于所述双面胶层的厚度且不超过所述双面 胶层的厚度的1.5倍。
  12. 根据权利要求1所述的车灯模组，其特征在于，所述盖板靠近所述发光层的一侧设置有滤光膜；或所述盖板远离所述发光层的一侧设置有滤光膜。
  13. 根据权利要求12所述的车灯模组，其特征在于，所述发光层靠近所述盖板一侧设置有光学透明胶层。
  14. 根据权利要求2或7所述的车灯模组，其特征在于，所述电路板与所述发光层之间通过各向异性导电胶连接；所述各向异性导电胶的外侧涂覆有无影胶；所述无影胶的外侧涂覆有防水胶。
  15. 一种车灯模组的制造方法，包括：
    对发光层进行封装形成封装层；
    在所述封装层远离所述发光层的一侧贴合支撑层；
    在所述发光层远离所述封装层的一侧贴合盖板；
    键合导电胶带，其中，所述导电胶带接地且与所述盖板连接。
  16. 一种车灯模组的制造方法，包括：
    对发光层进行封装形成封装层；
    在所述发光层远离所述封装层的一侧贴合盖板；
    键合导电胶带，其中，所述导电胶带接地且与所述盖板连接；
    在所述封装层远离所述发光层的一侧贴合支撑层。
  17. 一种车辆，其特征在于，包括如权利要求1-14任意一项所述的车灯模组。
PCT/CN2024/098581 2023-06-16 2024-06-12 车灯模组及其制造方法及车辆 Ceased WO2024255751A1 (zh)

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Publication number Priority date Publication date Assignee Title
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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102207577A (zh) * 2011-05-16 2011-10-05 深圳市华星光电技术有限公司 防静电导光板及背光模块
CN105114876A (zh) * 2015-09-21 2015-12-02 京东方科技集团股份有限公司 背光模组和显示装置
CN107272260A (zh) * 2017-07-19 2017-10-20 京东方科技集团股份有限公司 背光灯条、背光模组及显示装置
CN115394940A (zh) * 2022-09-19 2022-11-25 京东方科技集团股份有限公司 发光模组及车灯
WO2023005619A1 (zh) * 2021-07-28 2023-02-02 京东方科技集团股份有限公司 显示装置及其制造方法
US20230180582A1 (en) * 2019-08-27 2023-06-08 Boe Technology Group Co., Ltd. Display Device and Manufacturing Method Thereof, Electronic Apparatus
CN116734191A (zh) * 2023-06-16 2023-09-12 京东方科技集团股份有限公司 车灯模组及其制造方法及车辆

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100306231B1 (ko) * 1998-12-30 2002-03-21 마이클 디. 오브라이언 반도체패키지의회로기판구조및회로기판을이용한접지방법
CN212740731U (zh) * 2020-07-29 2021-03-19 杭州海康微影传感科技有限公司 一种封装结构
CN113179623B (zh) * 2021-04-06 2022-11-01 武汉华星光电半导体显示技术有限公司 显示模组
CN115866861A (zh) * 2022-11-24 2023-03-28 合肥维信诺科技有限公司 一种显示模组及电子装置
CN116171070A (zh) * 2023-02-23 2023-05-26 京东方科技集团股份有限公司 一种显示装置、车灯及车辆

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102207577A (zh) * 2011-05-16 2011-10-05 深圳市华星光电技术有限公司 防静电导光板及背光模块
CN105114876A (zh) * 2015-09-21 2015-12-02 京东方科技集团股份有限公司 背光模组和显示装置
CN107272260A (zh) * 2017-07-19 2017-10-20 京东方科技集团股份有限公司 背光灯条、背光模组及显示装置
US20230180582A1 (en) * 2019-08-27 2023-06-08 Boe Technology Group Co., Ltd. Display Device and Manufacturing Method Thereof, Electronic Apparatus
WO2023005619A1 (zh) * 2021-07-28 2023-02-02 京东方科技集团股份有限公司 显示装置及其制造方法
CN115394940A (zh) * 2022-09-19 2022-11-25 京东方科技集团股份有限公司 发光模组及车灯
CN116734191A (zh) * 2023-06-16 2023-09-12 京东方科技集团股份有限公司 车灯模组及其制造方法及车辆

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