WO2024255318A1 - 一种供电电路及电子设备 - Google Patents

一种供电电路及电子设备 Download PDF

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Publication number
WO2024255318A1
WO2024255318A1 PCT/CN2024/079296 CN2024079296W WO2024255318A1 WO 2024255318 A1 WO2024255318 A1 WO 2024255318A1 CN 2024079296 W CN2024079296 W CN 2024079296W WO 2024255318 A1 WO2024255318 A1 WO 2024255318A1
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WIPO (PCT)
Prior art keywords
module
power supply
voltage
thermoelectric
electrically connected
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PCT/CN2024/079296
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English (en)
French (fr)
Inventor
潘信佑
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Suzhou Metabrain Intelligent Technology Co Ltd
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Suzhou Metabrain Intelligent Technology Co Ltd
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Publication of WO2024255318A1 publication Critical patent/WO2024255318A1/zh
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Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—ELECTRIC POWER NETWORKS; CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J9/00—Circuit arrangements for emergency or stand-by power supply, e.g. for emergency lighting
    • H02J9/04—Circuit arrangements for emergency or stand-by power supply, e.g. for emergency lighting in which the distribution system is disconnected from the normal source and connected to a standby source
    • H02J9/06—Circuit arrangements for emergency or stand-by power supply, e.g. for emergency lighting in which the distribution system is disconnected from the normal source and connected to a standby source with automatic change-over, e.g. UPS systems
    • H02J9/061—Circuit arrangements for emergency or stand-by power supply, e.g. for emergency lighting in which the distribution system is disconnected from the normal source and connected to a standby source with automatic change-over, e.g. UPS systems for DC powered loads
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—ELECTRIC POWER NETWORKS; CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J7/00—Circuit arrangements for charging or discharging batteries or for supplying loads from batteries
    • H02J7/32—Circuit arrangements for charging or discharging batteries or for supplying loads from batteries for charging batteries from a charging set comprising a non-electric prime mover rotating at constant speed
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N11/00—Generators or motors not provided for elsewhere; Alleged perpetua mobilia obtained by electric or magnetic means
    • H02N11/002—Generators

Definitions

  • the present application relates to a power supply circuit and an electronic device.
  • FIG 1 shows the circuit module of a single digital power supply.
  • the primary control module of the transformer communicates with the secondary control module through an optical coupler (the primary and secondary control modules are usually microcontroller units, MCU ((Microcontroller Unit); or digital signal processor, DSP (Digital Signal Processing)).
  • the secondary control module communicates with the server system and transmits primary and secondary real-time parameters to the server system.
  • the primary control module can communicate with the system: transmit the primary real-time parameters of the power supply, and receive system data.
  • FIG1 also shows that the primary control module of the power supply is powered by a primary low-voltage power supply, the primary low-voltage power supply is powered by a primary rectifier output, and the secondary control module is powered by a secondary low-voltage power supply; at the same time, the primary control module monitors whether the input voltage signal is normal. Once a fault occurs at the input end of the power supply, the communication between the primary and secondary control modules of the faulty power supply, and between the secondary control module and the host computer is cut off, and the communication function with the host computer is lost.
  • the inventors realize that if a power failure occurs on the primary side of the power supply during the firmware update of the digital power supply, the firmware code cannot be completely written into the primary control module of the power supply because the communication between its primary control module and the secondary control module is interrupted, resulting in the complete loss of function of the power supply and inability to work normally.
  • a power supply circuit includes at least two power modules, the power module includes: a rectifier module, a power factor correction module, a transformer, an output rectifier module connected in sequence, and also includes a thermoelectric standby module, a primary low-voltage power supply module, a secondary low-voltage power supply module, a primary control module, and a secondary control module, the primary control module is used to control the power factor correction module to perform power correction, and the secondary control module is used to modulate the output rectifier module;
  • the rectifier output end of the rectifier module is electrically connected to the thermoelectric standby output end of the thermoelectric standby module and then electrically connected to the primary low-voltage input end of the primary low-voltage power supply module.
  • the primary low-voltage output end of the primary low-voltage power supply module is electrically connected to the primary control input end of the primary control module.
  • the primary low-voltage power supply module is coupled to the secondary low-voltage power supply module through a low-voltage transformer.
  • the primary control module In response to the primary control module receiving a power failure signal sent by the rectifier module, the primary control module sends a circuit start signal to the thermoelectric backup module, so that the thermoelectric backup module generates electrical energy and then inputs it into the low-voltage power supply module, so that the primary control module can maintain operation;
  • the primary control module transmits signals bidirectionally to the secondary control module.
  • an electronic device in a second aspect, includes the power supply circuit described in the first aspect.
  • FIG1 is a schematic diagram of a digital power supply circuit module
  • FIG2 is a schematic diagram of a power module provided in an embodiment of the present application.
  • FIG3 is a schematic diagram of a connection of a secondary low-voltage power supply module provided in an embodiment of the present application.
  • FIG4 is a schematic diagram of a thermoelectric module provided in an embodiment of the present application.
  • FIG5 is a schematic diagram of a thermal electronic module provided in an embodiment of the present application.
  • FIG6 is a schematic diagram of a thermoelectric conversion module provided in an embodiment of the present application.
  • FIG7 is a schematic diagram of the principle of the Seebeck effect
  • FIG8 is a schematic diagram of a thermoelectric chip provided in an embodiment of the present application.
  • FIG9 is a schematic diagram of fan airflow of a power module provided in an embodiment of the present application.
  • FIG10 is a schematic diagram of a first voltage conversion circuit provided in an embodiment of the present application.
  • FIG11 is a schematic diagram of another first voltage conversion circuit provided in an embodiment of the present application.
  • FIG12 is a schematic diagram of a thermoelectric chip attachment method provided in an embodiment of the present application.
  • FIG13 is a schematic diagram of a second voltage conversion circuit provided in an embodiment of the present application.
  • FIG14 is a schematic diagram of another second voltage conversion circuit provided in an embodiment of the present application.
  • FIG15 is a schematic diagram of a power supply module including a voltage stabilizing module provided in an embodiment of the present application.
  • FIG16 is a schematic diagram of a low voltage drop linear voltage regulator circuit
  • FIG17 is a schematic diagram of a TL431 controllable precision voltage regulator
  • FIG18 is a schematic diagram of a power module including a rectifier circuit provided in an embodiment of the present application.
  • FIG19 is a schematic diagram of a rectifier circuit provided in an embodiment of the present application.
  • FIG20 is a schematic diagram of a signal timing sequence of a power supply method provided in an embodiment of the present application.
  • FIG. 21 is a schematic diagram of an electronic device provided in an embodiment of the present application.
  • Words such as "connect” or “connected” and similar words are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Up”, “down”, “left”, “right” and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.
  • a power supply circuit has at least two power supply modules, the power supply module includes: a rectifier module 0, a power factor correction module, a transformer, an output rectifier module connected in sequence, and also includes a thermoelectric standby module 1, a primary low-voltage power supply module 2, a secondary low-voltage power supply module 3, a primary control module 4, and a secondary control module 5.
  • the primary control module is used to control the power factor correction module to perform power correction
  • the secondary control module is used to modulate the output rectifier module;
  • the rectifier output terminal 00 of the rectifier module 0 is electrically connected to the thermoelectric standby output terminal 10 of the thermoelectric standby module 1 and then connected to the primary low-voltage power supply module 2.
  • the primary low-voltage input terminal 2 I is electrically connected to the primary low-voltage output terminal 2 O of the primary low-voltage power supply module 2 and the primary control input terminal 4 I of the primary control module 4, and the primary low-voltage power supply module 2 and the secondary low-voltage power supply module 3 are coupled through the low-voltage transformer 8; the primary low-voltage power supply module 2 and the secondary low-voltage power supply module 3 are coupled through the low-voltage transformer 8 to provide the secondary low-voltage power supply module with a corresponding input voltage.
  • thermoelectric backup module 1 In response to the primary control module 4 receiving the power failure signal sent by the rectifier module 0, a circuit start signal is sent to the thermoelectric backup module 1, so that the thermoelectric backup module 1 generates electrical energy and inputs it into the low-voltage power supply module 2 for the primary control module 4 to maintain operation; wherein, the circuit start signal includes: the circuit start signal includes a first start signal and a second start signal.
  • the primary control module 4 and the secondary control module 5 transmit signals bidirectionally.
  • the primary low-voltage power supply module is used to supply power to the control circuit, drive circuit or monitoring circuit of the power main circuit to meet the requirements of different voltages. Usually, the voltage specifications provided are 12V, 5V, 3.3V, etc.
  • the thermoelectric standby module 1 supplies power to the primary low-voltage power supply module 2, thereby ensuring the normal operation of the primary control module 4 and maintaining its communication with the secondary control module 5.
  • the rectifier module and the output rectifier module can be implemented based on the rectifier circuit, and the power factor correction module can be implemented based on the power factor correction circuit.
  • the secondary low-voltage output terminal 30 of the secondary low-voltage power supply module 3 is electrically connected to the secondary control input terminal 51 of the secondary control module 5 to provide input voltage for the secondary control module 5.
  • the power module further includes: a first output diode D O1 and a second output diode D O2 ;
  • the cathode of the first output diode D O1 is electrically connected to the anode of the second output diode D O2 , the cathode and the anode are electrically connected to the secondary output terminal S O.
  • the power modules are used for redundant design of server power supply. Under the redundant design architecture, if a power supply primary input terminal loses power, its secondary control module 5 can be powered by other power modules to ensure the normal operation of the secondary control module 5. However, based on power safety regulations, the secondary low-voltage power supply module 3 cannot supply power to the primary low-voltage power supply module 2 through the low-voltage transformer 8.
  • the power supply path from the primary low-voltage power supply module to the secondary low-voltage power supply module through the low-voltage transformer is disconnected.
  • the secondary low-voltage power supply module can obtain power from other power supply modules to supply the secondary control module; and because the thermal electric backup module generates less power, closing the power supply path to the secondary low-voltage power supply module can ensure that the power generated by the thermal electric backup module is used by the primary control module.
  • the thermoelectric standby module 1 includes: a first thermoelectronic module 11 and a second thermoelectronic module 12.
  • the first thermoelectronic module 11 includes: a first thermoelectronic module output terminal 11 O
  • the second thermoelectronic module 12 includes: a second thermoelectronic module output terminal 12 O
  • the first thermoelectronic module output terminal 11 O and the second thermoelectronic module output terminal 12 O are electrically connected to serve as the thermoelectric standby output terminal 1 O .
  • the first thermoelectric module 11 includes: a first thermoelectric conversion module 111 and a first voltage conversion circuit 112.
  • the first thermoelectric conversion module 111 includes: a first thermoelectric conversion module output terminal 111 O ;
  • the first voltage conversion circuit 112 includes: a first voltage conversion circuit input terminal 112 I , and a first voltage conversion circuit output terminal 112 O ;
  • the first thermoelectric conversion module output terminal 111 O is electrically connected to the first voltage conversion circuit input terminal 112 I , and the first voltage conversion circuit output terminal 112 O serves as the first thermoelectric module output terminal 11 O .
  • the first thermoelectric conversion module 111 is a first thermoelectric chip TG 1.
  • the first thermoelectric chip TG 1 includes: a first thermoelectric chip positive output terminal TG 1P and a first thermoelectric chip negative output terminal TG 1N ; the first thermoelectric chip positive output terminal TG 1P serves as the first thermoelectric conversion module output terminal 111 O , and the first thermoelectric chip negative output terminal TG 1N is grounded.
  • Thermoelectric chips are based on the Seebeck Effect, which uses two different metals or semiconductors to generate electromotive force under a temperature difference environment.
  • Figure 7 simply illustrates the principle of the Seebeck effect.
  • thermoelectric emf The thermoelectric emf can be expressed as:
  • SA and SB are the Seebeck coefficients of the two materials respectively.
  • thermoelectric chip used in the embodiment of the present application can be any one of TGM-127-1.0-0.8, TGM-127-1.0-1.3, TGM-127-1.0-2.5, TGM-127-1.4-1.5, TGM-127-1.4-2.5, TGM-199-1.4-0.8, TGM-199-1.4-1.5, TGM-199-1.4-3.2, TGM-254-1.0-1.3, TGM-287-1.0-1.3, and TGM-287-1.0-1.5 produced by KRYOTHERM.
  • the brand and specific model of the thermoelectric chip are not limited in this application.
  • the structure of the first thermoelectric chip TG 1 and the second thermoelectric chip TG 2 are explained only with the help of the thermoelectric chip products of KRYOTHERM.
  • the first thermoelectric chip TG1 further includes: a first thermoelectric chip hot end TG1H .
  • the first thermoelectric chip hot end TG1H is attached to a first preset position, wherein the first preset position is set at: when the power supply is working, the surface of the heat sink located in the power supply housing and closest to the highest temperature point, as shown in the position B in FIG9 . Attaching the first thermoelectric chip hot end TG1H to the first preset position can cause the first chip to generate a temperature difference electromotive force.
  • the airflow driven by the blowing device passes through the inside of the power supply from the air inlet and is discharged by the fan.
  • the airflow driven by the blowing device usually a fan
  • the airflow driven by the blowing device passes through the inside of the power supply from the air inlet and is discharged by the fan.
  • position B is the highest temperature point inside the power supply, and a heat sink is usually set near it.
  • the temperature of the heat source near the heat sink can be as high as 100-110°C, and the airflow takes away the heat, causing a temperature difference between the heat sink and the internal environment of the power supply.
  • the first thermoelectric chip TG1 uses this temperature difference to generate electromotive force.
  • the primary control module 4 of the power supply usually includes: MCU (Microcontroller Unit), and/or DSP (Digital Signal Processor).
  • MCU Microcontroller Unit
  • DSP Digital Signal Processor
  • the working current of MICROCHIP-dsPIC33FJ64GS606 and TI-UCD3138 is in the milliampere level, and no high-power power supply circuit is required to power the primary control module 4 of the power supply.
  • the voltage and current generated by the thermoelectric chip are sufficient for its use.
  • the temperature difference electromotive force generated by the thermoelectric chip cannot accurately match the input voltage of the MCU/DSP. Therefore, a circuit needs to be added in the rear stage of the first thermoelectric conversion module 111 to obtain a voltage that meets the input requirements of the MCU/DSP.
  • the first voltage conversion circuit 112 includes: a first transistor T 1 , a first resistor R 1 , a first mutual inductance coil L 1 , and a second mutual inductance coil L 2 .
  • the first transistor first pole T 11 is connected in series with the first resistor R 1 and then electrically connected to one end of the first mutual inductance coil L 1
  • the first transistor second pole T 12 is electrically connected to one end of the second mutual inductance coil L 2
  • the other end of the second mutual inductance coil L 2 is electrically connected to the other end of the first mutual inductance coil L 1 and then serves as the first voltage conversion circuit input terminal 112 I
  • the first transistor second pole T 12 serves as the first voltage conversion circuit output terminal 112 O
  • the first transistor third pole T 13 is grounded.
  • One end of the first mutual inductance coil L 1 and the other end of the second mutual inductance coil L 2 are the same end.
  • FIG. 10 shows a Joule Thief circuit, which is a self-oscillating boost circuit.
  • the embodiment of the present application takes the Joule Thief circuit as an example to describe the specific form of the first voltage conversion circuit 112.
  • the first voltage conversion circuit 112 converts the voltage converted by the temperature of the first thermoelectric conversion module 111 into a higher voltage pulse form.
  • the principle of the Joule Thief circuit is not described here. Voltage converters of other topological structures can also be used as specific forms of the first voltage conversion circuit 112.
  • the first voltage conversion circuit 112 further includes: a second transistor T 2 and a second resistor R 2 .
  • the first electrode T 21 of the second transistor is electrically connected to one end of the second resistor R 2 , and the other end of the second resistor R 2 is used to receive the first start signal, the second electrode T 22 of the second transistor is electrically connected to the first electrode T 11 of the first transistor, and the third electrode T 23 of the second transistor is grounded, wherein the first start signal is used to start the first voltage conversion circuit 112 .
  • the first transistor T 1 is an NPN transistor
  • the first electrode T 11 of the first transistor is the base
  • the second electrode T 12 of the first transistor is the collector
  • the third electrode T 13 of the first transistor is the emitter.
  • the second transistor T 2 can be an NPN transistor or a NMOS transistor. Taking the NMOS transistor as an example, the first electrode T21 of the second transistor is a gate electrode, the second electrode T22 of the second transistor is a drain electrode, and the third electrode T23 of the second transistor is a source electrode.
  • the first shutdown signal is at a high level, so that the first voltage conversion circuit 112 does not work; the first start signal is at a low level, so that the first voltage conversion circuit 112 starts working.
  • the first voltage conversion circuit 112 receives the first start signal sent by the power primary control module 4, the second transistor T2 is turned off, so that the current passing through the first mutual inductance coil L1 and the first resistor R1 flows into the first electrode T11 of the first transistor, and the first voltage conversion circuit 112 is turned on, and the voltage is output from the output terminal 112O of the first voltage conversion circuit to the next stage.
  • the second thermoelectric module 12 includes: a second thermoelectric conversion module 121 and a second voltage conversion circuit 122.
  • the second thermoelectric conversion module 121 includes: a second thermoelectric conversion module output terminal 121 O ;
  • the second voltage conversion circuit 122 includes: a second voltage conversion circuit input terminal 122 I , and a second voltage conversion circuit output terminal 122 O ;
  • the second thermoelectric conversion module output terminal 121 O is electrically connected to the second voltage conversion circuit input terminal 122 I , and the second voltage conversion circuit output terminal 122 O serves as the second thermoelectric module output terminal 12 O .
  • the second thermoelectric conversion module 121 is a second thermoelectric chip TG 2.
  • the second thermoelectric chip TG 2 includes: a second thermoelectric chip positive output terminal TG 2P , a second thermoelectric chip negative output terminal TG 2N ; the second thermoelectric chip positive output terminal TG 2P serves as the second thermoelectric conversion module output terminal 121 O , and the second thermoelectric chip negative output terminal TG 2N is grounded.
  • the second thermoelectric chip TG 2 also includes: a second thermoelectric chip cold end TG 2C .
  • the second thermoelectric chip cold end TG 2C is attached to a second preset position, wherein the second preset position is set at: the surface of the heat sink closest to the power supply air inlet or power supply air outlet in the power supply housing, such as the position shown in A or C in FIG9 .
  • FIG9 schematically shows the direction of the wind flow inside the power supply.
  • the wind flow will carry the heat discharged from the server chassis. Therefore, the temperature of the air flow blowing into the air inlet of the power supply usually reaches 45-55°C.
  • the maximum temperature of the heat sink at the air outlet is lower than the air flow temperature at the air inlet or the air outlet of the power supply.
  • the cold end TG 2C of the second thermoelectric chip is attached to the second preset position, so that the second chip can generate a temperature difference electromotive force.
  • FIG. 12 schematically shows the attachment positions of the hot end of the first thermoelectric chip and the cold end of the second thermoelectric chip at point B and point A.
  • the second voltage conversion circuit 122 includes: a third transistor T 3 , a third resistor R 3 , a third mutual inductance coil L 3 , and a fourth mutual inductance coil L 4 .
  • the first electrode T 31 of the third transistor is electrically connected to one end of the third mutual inductance coil L 3 after being connected in series with the third resistor R 3
  • the second electrode T 32 of the third transistor is electrically connected to one end of the fourth mutual inductance coil L 4
  • the other end of the fourth mutual inductance coil L 4 is electrically connected to the other end of the third mutual inductance coil L 3 and serves as the input end 122 I of the second voltage conversion circuit
  • the second electrode T 32 of the third transistor serves as the output end 122 O of the second voltage conversion circuit
  • the third electrode T 33 of the third transistor is grounded.
  • One end of the third mutual inductance coil L3 and the other end of the fourth mutual inductance coil L4 are the same end.
  • the second voltage conversion circuit 122 further includes: a fourth transistor T 4 and a fourth resistor R 4 .
  • the first electrode T 41 of the fourth transistor is electrically connected to one end of the fourth resistor R 4 , and the other end of the fourth resistor R 4 is used to receive the second start signal, the second electrode T 42 of the fourth transistor is electrically connected to the first electrode T 31 of the third transistor, and the third electrode T 43 of the fourth transistor is grounded, wherein the second start signal is used to start the second voltage conversion circuit 122 .
  • the third transistor T 3 is an NPN transistor
  • the first electrode T 31 of the third transistor is the base
  • the second electrode T 32 of the third transistor is the collector
  • the third electrode T 33 of the third transistor is the emitter.
  • the fourth transistor T 4 can be an NPN transistor or an NMOS transistor. Taking the NMOS transistor as an example, the first electrode T 41 of the fourth transistor is the gate, the second electrode T 42 of the fourth transistor is the drain, and the third electrode T 43 of the fourth transistor is the source.
  • the second shutdown signal is at a high level, so that the second voltage conversion circuit 122 does not work; the second start signal is at a low level, so that the second voltage conversion circuit 122 starts working.
  • the fourth transistor T4 is turned off, so that the current passing through the third mutual inductance coil L3 and the third resistor R3 flows into the first electrode T31 of the third transistor, and the second voltage conversion circuit 122 is turned on, and the voltage is output from the output terminal 122O of the second voltage conversion circuit to the next stage.
  • the first transistor T 1 and the third transistor T 3 are NPN transistors.
  • the output voltage Due to the self-excited oscillation characteristics of the Joule thief circuit, the output voltage has large ripples. Adding a voltage stabilizing circuit to the back stage of the voltage conversion circuit can provide a stable voltage input for the power primary control module 4.
  • the power module further comprises a voltage stabilizing module 6; as shown in FIG15, a voltage stabilizing input terminal 61 of the voltage stabilizing module 6 and a thermal power standby output terminal 10
  • the voltage stabilization output terminal 60 of the voltage stabilization module 6 is electrically connected to the primary low voltage input terminal 21 .
  • the voltage stabilizing module 6 is a low dropout linear regulator (Low Dropout, LDO).
  • FIG16 shows a typical circuit of a low dropout linear regulator.
  • a voltage stabilizing circuit can be formed by using TL431 in conjunction with a power transistor, as shown in FIG17. The working principles of the LDO and TL431 circuits are not described here.
  • the power module further comprises: a rectifier circuit 7, as shown in FIG18, wherein the rectifier circuit input terminal 7 I is electrically connected to the thermal power standby output terminal 1 O , and the rectifier circuit output terminal 7 O is electrically connected to the voltage stabilization output port 6 I.
  • a rectifier circuit 7 as shown in FIG18, wherein the rectifier circuit input terminal 7 I is electrically connected to the thermal power standby output terminal 1 O , and the rectifier circuit output terminal 7 O is electrically connected to the voltage stabilization output port 6 I.
  • the rectifier circuit 7 includes: a diode D, a capacitor C;
  • the cathode of the diode D C is electrically connected to one end of the capacitor, and the other end of the capacitor is grounded;
  • the diode anode D A serves as the input terminal 7 I of the rectifier circuit, and the diode cathode DC serves as the output terminal 7 O of the rectifier circuit.
  • a power supply method is applied to the power supply circuit described in the first aspect above, so that the primary low-voltage power supply module supplies power to the primary control module and maintains communication between the primary control module and the secondary control module, and the method includes:
  • thermoelectric backup module In response to obtaining a power failure signal, a circuit start signal is sent to the thermoelectric backup module to enable the thermoelectric backup module to operate and provide input voltage for the primary low-voltage power supply module.
  • S110 obtaining a power input indication signal and a power primary control module input monitoring signal, and determining whether the power input is abnormal according to the power input indication signal and the power primary control module input monitoring signal;
  • the power input indication signal can be a power failure signal or a power normal working signal; the power primary control module input monitoring signal is a monitoring signal input by the primary control module itself. If the power input indication signal is abnormal and the power primary control module input signal is abnormal, it means that the power input is abnormal.
  • S120 In response to the abnormal power input, sending a first start signal to the first thermal electronic module, and acquiring a first thermal electronic module monitoring signal;
  • S130 Obtain a power input indication signal and a first thermal electronic module monitoring signal, and determine whether the first thermal electronic module is abnormal according to the power input indication signal and the first thermal electronic module monitoring signal; if the power input indication signal is abnormal and the first thermal electronic module detection signal is abnormal at the same time, it indicates that the first thermal electronic module is abnormal.
  • the redundant power supply module itself has two alarm signals, one is Input_OK, which is an alarm signal for whether the input is normal or not, and the other is Output_OK, which is an alarm signal for whether the output is normal or not.
  • the power control module can obtain the status of its own input and output. Under normal working conditions, the power input indication signal is normal, and the power primary control module 4 continues to send a first shutdown signal to the first thermal electronic module 11, and the first shutdown signal is a high level.
  • the second transistor T2 is turned on by the first shutdown signal, thereby lowering the voltage of the first pole T11 of the first transistor, and the first voltage conversion circuit 112 does not work.
  • the primary low-voltage power supply 3 is powered by the power input and supplies power to the primary control module 4, as shown in the t1 period in Figure 20.
  • the power input indication signal When the power input indication signal is monitored to be abnormal, it indicates that the power input is faulty.
  • the power primary control module 4 cannot maintain normal operation by the power input, and the input voltage of the power primary control module is abnormal, as shown in the t2 period in Figure 20.
  • a first start signal is sent to the first thermal electronic module 11, and the first start signal is low.
  • the second transistor T2 is turned off by the first start signal, so that the current passing through the first mutual inductance coil L1 and the first resistor R1 flows into the first transistor first pole T11 , and the first voltage conversion circuit 112 is turned on.
  • the primary control module 4 is then powered by the first thermal electronic module 11, as shown in the t3 period in Figure 20. In the power supply process of the first thermal electronic module 11, due to the discharge of the large capacitor of the primary low-voltage power supply, the first thermal electronic module 11 and the primary low-voltage power supply are alternately powered, but the two do not affect each other.
  • the primary fails, the primary power devices no longer work, and stop generating heat.
  • the fan continues to rotate to dissipate heat, and the internal temperature of the power supply gradually decreases, so that the temperature difference between the heat sink and the heat flow driven by the fan gradually decreases.
  • the internal temperature difference of the power supply is not enough to support the first thermal electronic module 11 to supply power to the primary control module 4 of the power supply, the operation of the first thermal electronic module 11 becomes abnormal.
  • the primary control module 4 of the power supply sends a first shutdown signal to the first thermal electronic module 11, and sends a second start signal to the second thermal electronic module 12, and the second start signal is low.
  • the operation of the first thermal electronic module 11 is cut off by the first shutdown signal; the fourth transistor T4 is turned off by the second start signal, so that the third mutual inductance line
  • the current of the third resistor R3 flows into the first electrode T31 of the third transistor, the second voltage conversion circuit 122 is turned on, and the primary control module 4 is randomly powered by the second thermal electronic module 12 as shown in the period t4 in FIG. 20 .
  • the monitoring of the input voltage of the primary control module of the power supply can be obtained by comparing the input voltage with the reference voltage.
  • the monitoring of the working state of the first thermal electronic module can be realized by detecting the input voltage of the primary control module of the power supply.
  • the input voltage of the primary control module of the power supply is less than the first voltage threshold, that is, the first thermal electronic module is determined to be working abnormally; it can also be obtained by the temperature difference that causes the first thermoelectric conversion module 111 to work.
  • the temperature difference is less than the first temperature difference threshold, it is determined that the first thermal electronic module is working abnormally.
  • the second thermal electronic module when the input voltage of the primary control module of the power supply is less than the second voltage threshold, it is determined that the second thermal electronic module is working abnormally; it can also be obtained by the temperature difference that causes the second thermoelectric conversion module 121 to work. When the temperature difference is less than the second temperature difference threshold, it is determined that the second thermal electronic module is working abnormally.
  • the acquisition of the temperature difference can be realized by a thermistor or a thermocouple in combination with a voltage detection circuit, which will not be elaborated here.
  • the second voltage threshold is usually higher than the first voltage threshold; the second temperature difference threshold is usually higher than the first temperature difference threshold. Since the second thermal electronic module 12 is the last power supply mode to provide input to the primary control module of the power supply when the power input is abnormal. Therefore, the monitoring of the abnormal working state of the second thermal electronic module is more stringent, so that before the second thermal electronic module 12 fails, the primary control module 4 of the power supply can still communicate with the secondary control module 5 of the power supply, and the power supply is taken in time to prevent the power supply from completely failing. This measure is particularly important during the firmware update process of the digital power supply. When the temperature difference electromotive force is not maintained for a long enough time to complete the firmware update, an alarm is required immediately. The maintenance personnel shall further replace the power supply or re-update it.
  • the power supply method further comprises:
  • S200 Disconnect the power supply path from the primary low-voltage power supply module to the secondary low-voltage power supply module through the low-voltage transformer.
  • thermal electric standby module Since the thermal electric standby module generates less electric energy, closing the power supply path to the secondary low-voltage power supply module can ensure that the electric energy generated by the thermal electric standby module is used by the primary control module.
  • the secondary low-voltage power supply module can obtain electrical energy from other power supply modules to supply the secondary control module.
  • an electronic device includes the power supply circuit described in the first aspect.
  • the primary control module when the primary of the digital power supply loses power due to a fault, the primary control module can continue to be powered and the communication between the primary control module and the secondary control module can be maintained; during the digital power supply firmware update process, the power supply environment for the firmware update is guaranteed, and an alarm signal is issued before the energy of the power supply circuit is about to be exhausted, so as to take further measures to ensure the implementation of the digital power supply firmware update operation; and the waste heat generated by the power supply and chassis during the operation of the server is fully utilized as the energy source for power supply.
  • a power supply circuit has at least two power supply modules, the power supply module is shown in FIG2 and includes:
  • a rectifier module 0, a power factor correction module, a transformer, and an output rectifier module are connected in sequence; it also includes a thermoelectric standby module 1, a primary low-voltage power supply module 2, a secondary low-voltage power supply module 3, a primary control module 4, a secondary control module 5, and the primary control module is used to control the power factor correction module to perform power correction, and the secondary control module is used to modulate the output of the rectifier module 0;
  • the rectifier output terminal 0 O of the rectifier module 0 is electrically connected to the thermoelectric standby output terminal 1 O of the thermoelectric standby module 1 and then electrically connected to the primary low-voltage input terminal 2 I of the primary low-voltage power supply module 2, the primary low-voltage output terminal 2 O of the primary low-voltage power supply module 2 is electrically connected to the primary control input terminal 4 I of the primary control module 4, and the primary low-voltage power supply module 2 and the secondary low-voltage power supply module 3 are coupled through a low-voltage transformer 6;
  • thermoelectric backup module 1 In response to the primary control module 4 receiving the power failure signal sent by the rectifier module 0, a circuit start signal is sent to the thermoelectric backup module 1, so that the thermoelectric backup module 1 generates electric energy and then inputs it to the low-voltage power supply module 2, so that the primary control module 4 can maintain operation;
  • the primary control module 4 and the secondary control module 5 transmit signals bidirectionally.
  • the secondary low-voltage output terminal 30 of the secondary low-voltage power supply module 3 is electrically connected to the secondary control input terminal 51 of the secondary control module 5 to provide an input voltage for the secondary control module 5.
  • the power module further includes: a first output diode D O1 and a second output diode D O2 ;
  • the cathode of the first output diode D O1 is electrically connected to the anode of the second output diode D O2 , the cathode and the anode are electrically connected to the secondary output terminal S O.
  • the power supply path from the primary low-voltage power supply module to the secondary low-voltage power supply module through the low-voltage transformer is disconnected.
  • the thermoelectric standby module 1 includes: a first thermoelectronic module 11 and a second thermoelectronic module 12.
  • the first thermoelectronic module 11 includes: a first thermoelectronic module output terminal 11 O
  • the second thermoelectronic module 12 includes: a second thermoelectronic module output terminal 12 O
  • the first thermoelectronic module output terminal 11 O and the second thermoelectronic module output terminal 12 O are electrically connected to serve as the thermoelectric standby output terminal 1 O .
  • the first thermoelectric conversion module 111 is a first thermoelectric chip TG 1.
  • the first thermoelectric chip TG 1 includes: a first thermoelectric chip positive output terminal TG 1P and a first thermoelectric chip negative output terminal TG 1N ; the first thermoelectric chip positive output terminal TG 1P serves as the first thermoelectric conversion module output terminal 111 O , and the first thermoelectric chip negative output terminal TG 1N is grounded.
  • the first thermoelectric chip TG1 further includes: a first thermoelectric chip hot end TG1H .
  • the first thermoelectric chip hot end TG1H is attached to a first preset position, wherein the first preset position is set at: when the power supply is working, the surface of the heat sink located in the power supply housing and closest to the highest temperature point, as shown in the position B in FIG9 . Attaching the first thermoelectric chip hot end TG1H to the first preset position can cause the first chip to generate a temperature difference electromotive force.
  • the first voltage conversion circuit 112 includes: a first transistor T 1 , a first resistor R 1 , a first mutual inductance coil L 1 , and a second mutual inductance coil L 2 .
  • the first transistor first pole T 11 is connected in series with the first resistor R 1 and then electrically connected to one end of the first mutual inductance coil L 1
  • the first transistor second pole T 12 is electrically connected to one end of the second mutual inductance coil L 2
  • the other end of the second mutual inductance coil L 2 is electrically connected to the other end of the first mutual inductance coil L 1 and then serves as the first voltage conversion circuit input terminal 112 I
  • the first transistor second pole T 12 serves as the first voltage conversion circuit output terminal 112 O
  • the first transistor third pole T 13 is grounded.
  • One end of the first mutual inductance coil L 1 and the other end of the second mutual inductance coil L 2 are the same end.
  • the first voltage conversion circuit 112 further includes: a second transistor T 2 and a second resistor R 2 .
  • the first electrode T 21 of the second transistor is electrically connected to one end of the second resistor R 2 , and the other end of the second resistor R 2 is used to receive the first start signal
  • the second electrode T 22 of the second transistor is electrically connected to the first electrode T 11 of the first transistor
  • the third electrode T 23 of the second transistor is grounded, wherein the first start signal is used to start the first voltage conversion circuit 112 .
  • the first transistor T 1 is an NPN transistor
  • the first electrode T 11 of the first transistor is the base
  • the second electrode T 12 of the first transistor is the collector
  • the third electrode T 13 of the first transistor is the emitter.
  • the second thermoelectric module 12 includes: a second thermoelectric conversion module 121 and a second voltage conversion circuit 122.
  • the second thermoelectric conversion module 121 includes: a second thermoelectric conversion module output terminal 121 O ;
  • the second voltage conversion circuit 122 includes: a second voltage conversion circuit input terminal 122 I , and a second voltage conversion circuit output terminal 122 O ;
  • the second thermoelectric conversion module output terminal 121 O is electrically connected to the second voltage conversion circuit input terminal 122 I , and the second voltage conversion circuit output terminal 122 O serves as the second thermoelectric module output terminal 12 O .
  • the second thermoelectric conversion module 121 is a second thermoelectric chip TG 2.
  • the second thermoelectric chip TG 2 includes: a second thermoelectric chip positive output terminal TG 2P , a second thermoelectric chip negative output terminal TG 2N ; the second thermoelectric chip positive output terminal TG 2P serves as the second thermoelectric conversion module output terminal 121 O , and the second thermoelectric chip negative output terminal TG 2N is grounded.
  • the second thermoelectric chip TG 2 also includes: a second thermoelectric chip cold end TG 2C .
  • the second thermoelectric chip cold end TG 2C is attached to a second preset position, wherein the second preset position is set at: the surface of the heat sink closest to the power supply air inlet or power supply air outlet in the power supply housing, such as the position shown in A or C in FIG9 .
  • FIG9 schematically shows the direction of the wind flow inside the power supply.
  • the wind flow will carry the heat discharged from the server chassis. Therefore, the temperature of the air flow blowing into the air inlet of the power supply usually reaches 45-55°C.
  • the maximum temperature of the heat sink at the air outlet is lower than the air flow temperature at the air inlet or the air outlet of the power supply.
  • the cold end TG 2C of the second thermoelectric chip is attached to the second preset position, so that the second chip can generate a temperature difference electromotive force.
  • FIG. 12 schematically shows the attachment positions of the hot end of the first thermoelectric chip and the cold end of the second thermoelectric chip at point B and point A.
  • the second voltage conversion circuit 122 includes: a third transistor T 3 , a third resistor R 3 , a third mutual inductance coil L 3 , and a fourth mutual inductance coil L 4 .
  • the first electrode T 31 of the third transistor is connected in series with the third resistor R 3 and then electrically connected to one end of the third mutual inductance coil L 3
  • the second electrode T 32 of the third transistor is electrically connected to one end of the fourth mutual inductance coil L 4
  • the other end of the fourth mutual inductance coil L 4 is electrically connected to the other end of the third mutual inductance coil L 3 and then serves as the second voltage conversion circuit input terminal 122 I
  • the second electrode T 32 of the third transistor serves as the second voltage conversion circuit output terminal 122 O
  • the third electrode T 33 of the third transistor is grounded.
  • One end of the third mutual inductance coil L3 and the other end of the fourth mutual inductance coil L4 are the same end.
  • the second voltage conversion circuit 122 further includes: a fourth transistor T 4 and a fourth resistor R 4 .
  • the first electrode T 41 of the fourth transistor is electrically connected to one end of the fourth resistor R 4 , and the other end of the fourth resistor R 4 is used to receive the second start signal
  • the second electrode T 42 of the fourth transistor is electrically connected to the first electrode T 31 of the third transistor
  • the third electrode T 43 of the fourth transistor is grounded, wherein the second start signal is used to start the second voltage conversion circuit 122 .
  • the third transistor T 3 is an NPN transistor
  • the first electrode T 31 of the third transistor is the base
  • the second electrode T 32 of the third transistor is the collector
  • the third electrode T 33 of the third transistor is the emitter.
  • the fourth transistor T 4 can be an NPN transistor or an NMOS transistor. Taking the NMOS transistor as an example, the first electrode T 41 of the fourth transistor is the gate, the second electrode T 42 of the fourth transistor is the drain, and the third electrode T 43 of the fourth transistor is the source.
  • the first transistor T 1 and the third transistor T 3 are NPN transistors.
  • the power module also includes a voltage stabilizing module 6; as shown in FIG15, the voltage stabilizing input terminal 61 of the voltage stabilizing module 6 is electrically connected to the thermal power standby output terminal 10 , and the voltage stabilizing output terminal 60 of the voltage stabilizing module 6 is electrically connected to the primary low voltage input terminal 21 .
  • the rectifier circuit 7 includes: a diode D, a capacitor C;
  • the cathode of the diode D C is electrically connected to one end of the capacitor, and the other end of the capacitor is grounded;
  • a power supply method is applied to the power supply circuit described in the first aspect, so that the primary low-voltage power supply module supplies power to the primary control module, and the primary control module maintains communication with the secondary control module, and the method includes:
  • S200 Disconnect the power supply path from the primary low-voltage power supply module to the secondary low-voltage power supply module through the low-voltage transformer.
  • An electronic device includes the power supply circuit described in Embodiment 2.
  • the process described with reference to the flowchart above can be implemented as a computer software program.
  • an embodiment of the present application includes a computer program product, which The computer program includes a computer program loaded on a computer readable medium, and the computer program includes a program code for executing the method shown in the flowchart.
  • the computer program can be downloaded and installed from a network through a communication device, or installed from a memory, or installed from a ROM.
  • the computer program is executed by an external processor, the above-mentioned functions defined in the method of the embodiment of the present application are executed.
  • the primary control module when the primary of the digital power supply loses power due to a fault, the primary control module can continue to be powered, the communication between the primary control module and the secondary control module can be maintained, and the communication between the primary control module and the server system or the host computer can be maintained;
  • the computer-readable medium of the embodiment of the present application may be a computer-readable signal medium or a computer-readable storage medium or any combination of the above two.
  • the computer-readable storage medium may be, for example, but not limited to, an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, device or device, or any combination of the above.
  • Computer-readable storage media may include, but are not limited to: an electrical connection with one or more wires, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the above.
  • a computer-readable storage medium may be any tangible medium containing or storing a program that can be used by or in combination with an instruction execution system, device or device.
  • a computer-readable signal medium may include a data signal propagated in a baseband or as part of a carrier wave, in which a computer-readable program code is carried.
  • This propagated data signal may take a variety of forms, including but not limited to electromagnetic signals, optical signals, or any suitable combination of the above.
  • Computer readable signal media may also be any computer readable medium other than computer readable storage media, which may send, propagate or transmit a program for use by or in conjunction with an instruction execution system, apparatus or device.
  • the program code contained on the computer readable medium may be transmitted using any appropriate medium, including but not limited to: wires, optical cables, RF (Radio Frequency), etc., or any suitable combination of the above.
  • the computer-readable medium may be included in the server; or it may exist independently without being installed in the server.
  • the computer-readable medium carries one or more programs.
  • the server in response to detecting that the peripheral mode of the terminal is not activated, obtains the frame rate of the application on the terminal; when the frame rate meets the screen-off condition, determines whether the user is obtaining the screen information of the terminal; in response to the judgment result that the user is not obtaining the screen information of the terminal, controls the screen to enter the immediate dimming mode.
  • Computer program code for performing the operation of the embodiments of the present application can be written in one or more programming languages or a combination thereof, including object-oriented programming languages, such as Java, Smalltalk, C++, and conventional procedural programming languages, such as "C" language or similar programming languages.
  • the program code can be executed entirely on the user's computer, partially on the user's computer, as an independent software package, partially on the user's computer, partially on a remote computer, or entirely on a remote computer or server.
  • the remote computer can be connected to the user's computer through any type of network, including a local area network (LAN) or a wide area network (WAN), or can be connected to an external computer (e.g., using an Internet service provider to connect through the Internet).
  • LAN local area network
  • WAN wide area network

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Abstract

一种供电电路及电子设备，供电电路包括至少两个电源模块，其中，整流输出端（0 O）与热电备用输出端（1 O）电性连接后与初级低压输入端（2 I）电性连接，初级低压输出端（2 O）与初级控制模块（4）的初级控制输入端（4 I）电性连接，初级低压供电模块（2）与次级低压供电模块（3）通过低压变压器耦合；响应于初级控制模块（4）接收到整流模块（0）发出的电源故障信号，则向热电备用模块（1）发出电路启动信号，使热电备用模块（1）产生电能后输入至初级低压供电模块（2），以供初级控制模块（4）维持工作；初级控制模块（4）与次级控制模块（5）双向传输信号。

Description

一种供电电路及电子设备
相关申请的交叉引用
本申请要求于2023年06月13日提交中国专利局，申请号为202310695735.X，申请名称为“一种供电电路及电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及一种供电电路及电子设备。
背景技术
为了提高服务器供电的稳定性，现在常采用数字电源作为服务器的电源设备。图1示出了单个数字电源的电路模块。数字电源在工作时，变压器初级控制模块通过光耦与次级控制模块进行通信(初、次级控制模块通常是微控制单元，MCU((Microcontroller Unit)；或数字信号处理器，DSP(Digital Signal Processing))。同时，次级控制模块与服务器系统进行通信，向服务器系统传输初级、次级实时参数。借助次级控制模块，初级控制模块能够与系统进行通信：传输电源初级实时参数，并接收系统数据。
图1还示出了电源初级控制模块由初级低压电源供电，初级低压电源由初级整流输出供电，次级控制模块由次级低压电源供电；同时初级控制模块监测输入电压信号是否正常。一旦电源输入端发生故障，故障电源的初、次级控制模块之间，次级控制模块与上位机之间的通信被切断，丧失与上位机的通信功能。发明人意识到，若在数字电源进行固件更新的过程中，电源初级侧发生掉电故障，因其初级控制模块与次级控制模块通信中断，固件代码无法完整写入该电源初级控制模块，从而导致该电源完全丧失功能，无法正常工作。
发明内容
根据本申请公开的各种实施例，第一方面，提供一种供电电路，电路包括至少两个电源模块，电源模块包括：依次连接的整流模块，功率因数校正模块，变压器，输出整流模块，还包括热电备用模块，初级低压供电模块，次级低压供电模块，初级控制模块，次级控制模块，初级控制模块用于控制功率因数校正模块进行功率校正，次级控制模块用于调制输出整流模块；
整流模块的整流输出端与热电备用模块的热电备用输出端电性连接后与初级低压供电模块的初级低压输入端电性连接，初级低压供电模块的初级低压输出端与初级控制模块的初级控制输入端电性连接，初级低压供电模块与次级低压供电模块通过低压变压器耦合；
响应于初级控制模块接收到整流模块发出的电源故障信号，则向热电备用模块发出电路启动信号，使热电备用模块产生电能后输入至低压供电模块，以供初级控制模块维持工作；以及
初级控制模块与次级控制模块双向传输信号。
根据本申请公开的各种实施例，第二方面，提供一种电子设备，电子设备包括上述第一方面记载的供电电路。
附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是一种数字电源电路模块示意图；
图2是本申请实施例提供的一种电源模块示意图；
图3是本申请实施例提供的一种次级低压供电模块连接示意图；
图4是本申请实施例提供的一种热电模块示意图；
图5是本申请实施例提供的一种热电子模块示意图；
图6是本申请实施例提供的一种热电转换模块示意图；
图7是塞贝克效应的原理示意图；
图8是本申请实施例提供的热电芯片示意图；
图9是本申请实施例提供的电源模块的风扇气流示意图；
图10是本申请实施例提供的一种第一电压转换电路示意图；
图11是本申请实施例提供的另一种第一电压转换电路示意图；
图12是本申请实施例提供的热电芯片贴附方式示意图；
图13是本申请实施例提供的一种第二电压转换电路示意图；
图14是本申请实施例提供的另一种第二电压转换电路示意图；
图15是本申请实施例提供的一种包括稳压模块的电源模块示意图；
图16是低压差线性稳压电路示意图；
图17是TL431可控精密稳压源示意图；
图18是本申请实施例提供的一种包括整流电路的电源模块示意图；
图19是本申请实施例提供的整流电路示意图；
图20是本申请实施例提供的供电方法信号时序示意图；
图21是本申请实施例提供的一种电子设备示意图。
具体实施方式
为使本申请的目的、技术方案和优点更加清楚，下面将结合本申请实施方式中的附图，对本申请实施方式中的技术方案进行清楚、完整地描述，显然，所描述的实施方式仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
除非另外定义，本申请使用的技术术语或者科学术语应当为本申请所属领域内具有一般技能的人士所理解的通常意义。本申请中使用的“第一”、“第二”以及类似的词语并不表示任何顺序、数量或者重要性，而只是用来区分不同的组成部分。同样，“一个”、“一”或者“该”等类似词语也不表示数量限制，而是表示存在至少一个。说明书附图中的编号，仅表示对各个功能部件或模块的区分，不表示部件或模块之间的逻辑关系。“包括”或者“包含”等类似的词语意指出现该词前面的元件或者物件涵盖出现在该词后面列举的元件或者物件及其等同，而不排除其他元件或者物件。“连接”或者“相连”等类似的词语并非限定于物理的或者机械的连接，而是可以包括电性的连接，不管是直接的还是间接的。“上”、“下”、“左”、“右”等仅用于表示相对位置关系，当被描述对象的绝对位置改变后，则该相对位置关系也可能相应地改变。
下面，将参照附图详细描述根据本申请的各个实施例。需要注意的是，在附图中，将相同的附图标记赋予基本上具有相同或类似结构和功能的组成部分，并且将省略关于它们的重复描述。
针对现有技术中，数字电源初级因故障掉电后，其初级控制模块供电中断，丧失与次级控制模块通信能力的问题，本申请提供如下实施方式：
在一些实施例中，如图2所示，一种供电电路至少两个电源模块，电源模块包括：依次连接的整流模块0，功率因数校正模块，变压器，输出整流模块，还包括热电备用模块1，初级低压供电模块2，次级低压供电模块3，初级控制模块4，次级控制模块5，初级控制模块用于控制功率因数校正模块进行功率校正，次级控制模块用于调制输出整流模块；
整流模块0的整流输出端0O与热电备用模块1的热电备用输出端1O电性连接后与初级低压供电模块2 的初级低压输入端2I电性连接，初级低压供电模块2的初级低压输出端2O与初级控制模块4的初级控制输入端4I电性连接，初级低压供电模块2与次级低压供电模块3通过低压变压器8耦合；通过低压变压器8耦合初级低压供电模块2与次级低压供电模块3，为次级低压供电模块提供相应的输入电压。
响应于初级控制模块4接收到整流模块0发出的电源故障信号，则向热电备用模块1发出电路启动信号，使热电备用模块1产生电能后输入至低压供电模块2，以供初级控制模块4维持工作；其中，电路启动信号包括：电路启动信号包括第一启动信号、第二启动信号。
初级控制模块4与次级控制模块5双向传输信号。
初级低压供电模块，用来给功率主回路的控制电路、驱动电路或电源系统的监控电路供电，满足不同电压的需求。通常，提供的电压规格为12V，5V，3.3V等。当初级侧输入端掉电时，热电备用模块1向初级低压供电模块2供电，进而保障初级控制模块4的正常工作，维持其与次级控制模块5的通信。
其中，整流模块、输出整流模块可以基于整流电路实现，功率因数校正模块可以基于功率因素校正电路实现。
如图3所示(图3中未示出功率因数校正模块、变压器、输出整流模块)，次级低压供电模块3的次级低压输出端3O与次级控制模块5的次级控制输入端5I电性连接，为次级控制模块5提供输入电压。
电源模块还包括：第一输出二极管DO1和第二输出二极管DO2；
第一输出二极管DO1的阳极与第二输出二极管DO2的阴极电性连接后，与次级低压输出端3O电性连接；
第一输出二极管DO1的阴极与第二输出二极管DO2的阳极电性连接后，与次级总输出端SO电性连接。
上述电源模块之间是用于服务器电源的冗余设计。在冗余设计的架构下，某一电源初级侧输入端发生掉电，其次级控制模块5可以通过其他电源模块进行供电，以保障次级控制模块5的正常运转。但是，基于电源安全规定，次级低压供电模块3无法通过低压变压器8向初级低压供电模块2供电。
响应于初级控制模块接收到整流模块发出的电源故障信号，断开初级低压供电模块通过低压变压器向次级低压供电模块的供电通路。
由于电源的冗余设计，次级低压供电模块，可以从其他路电源模块处获得电能，以供应次级控制模块工作；并且由于热电备用模块产生电能较小，关闭向次级低压供电模块的供电通路，能够保障热电备用模块产生的电能都供初级控制模块使用。
如图4所示，热电备用模块1包括：第一热电子模块11，第二热电子模块12。第一热电子模块11包括：第一热电子模块输出端11O，第二热电子模块12包括：第二热电子模块输出端12O，第一热电子模块输出端11O与第二热电子模块输出端12O电性连接后作为热电备用输出端1O。
如图5中(a)部分所示，第一热电子模块11包括：第一热电转换模块111，第一电压转换电路112。第一热电转换模块111包括：第一热电转换模块输出端111O；第一电压转换电路112包括：第一电压转换电路输入端112I，第一电压转换电路输出端112O；第一热电转换模块输出端111O与第一电压转换电路输入端112I电性连接，第一电压转换电路输出端112O作为第一热电子模块输出端11O。
具体地，如图6中(a)部分所示，第一热电转换模块111为第一热电芯片TG1。第一热电芯片TG1包括：第一热电芯片正输出端TG1P，第一热电芯片负输出端TG1N；第一热电芯片正输出端TG1P作为第一热电转换模块输出端111O，第一热电芯片负输出端TG1N接地。
热电芯片是基于塞贝克(Seebeck Effect)，利用两种不同金属或半导体在具有温差环境下，产生电动势的元器件。图7简单地示意了塞贝克效应的原理。
温差电动势可表示为：
其中，SA，SB分别为两种材料的塞贝克系数。
应用于本申请实施例的热电芯片可以是，KRYOTHERM生产的TGM-127-1.0-0.8、TGM-127-1.0-1.3、TGM-127-1.0-2.5、TGM-127-1.4-1.5、TGM-127-1.4-2.5、TGM-199-1.4-0.8、TGM-199-1.4-1.5、TGM-199-1.4-3.2、TGM-254-1.0-1.3、TGM-287-1.0-1.3、TGM-287-1.0-1.5中的任意一种。本申请对热电芯片的品牌和具体型号不加以限定。为便于进行说明，仅借助KRYOTHERM的热电芯片产品阐述第一热电芯片TG1、第二热电芯片TG2的结构。
如图8中(a)部分所示，第一热电芯片TG1还包括：第一热电芯片热端TG1H。第一热电芯片热端TG1H贴附于第一预设位置，其中，第一预设位置设置于：电源工作时，位于电源壳体内、距温度最高点最近的散热片表面，如图9中B所示位置。将第一热电芯片热端TG1H贴附于第一预设位置，可使第一芯片产生温差电动势。
由鼓风装置(通常是风扇)带动的气流从入风口，经过电源内部，由风扇排出。电源内部封装了很多功率器件，工作时产生大量的热量，由风扇吹出。示意性的，B位置为电源内部温度最高点，其附近通常设置有散热片，电源工作时，散热片附近热源温度可高达100-110℃，而气流带走热量，使散热片与电源内部环境之间产生温度差，第一热电芯片TG1便利用该温度差产生电动势。
下面，简要介绍散热片的热学特性。电源模块在散热片的使用上经常以铝或铜为主，因此，可利用铜与铝的导热率，热容，比热容等特性做设计。铝的比热容为0.9J/g℃，而铜为0.39J/g℃，比热容越大则代表温度上升越慢，以1克的铝与铜做计算，等同于铝每上升1℃必需要有0.9J的热能提供，铜每上升1℃必需要有0.39J的热能提供；另外，铜的导热系数为401W/mK，而铝的导热系数为237W/mK，铜为铝的1.69倍，即同样的条件下，铜比铝更容易导热，但是铜的密度是8.9kg/m3，而铝的只有是2.7kg/m3，接近铝的3.3倍，同样体积的散热片,纯铜材质比纯铝材质的热容量高，即使容易导热，但更不易散热，因此，热容量大,散热就变慢，而高比热容则需更高的热能才能提升温度。
电源初级控制模块4通常包括：MCU(微控制单元，Microcontroller Unit)，和/或DSP(数字信号处理器，Digital Signal Processor)。以数字电源中常采用的MCU芯片和DSP为例，MICROCHIP-dsPIC33FJ64GS606，TI-UCD3138的工作电流为毫安级，无需大功率的电源电路对电源初级控制模块4供电。采用热电芯片产生的电压与电流已足以供其使用。但是通过热电芯片产生的温差电动势无法精确匹配MCU/DSP的输入电压，因此，在第一热电转换模块111的后级需要增加电路，获得满足MCU/DSP输入要求的电压。
具体地，如图10所示，第一电压转换电路112包括：第一晶体管T1，第一电阻R1，第一互感线圈L1，第二互感线圈L2。第一晶体管第一极T11串联第一电阻R1后与第一互感线圈L1的一端电性连接，第一晶体管第二极T12与第二互感线圈L2的一端电性连接，第二互感线圈L2的另一端与第一互感线圈L1的另一端电性连接后作为第一电压转换电路输入端112I，第一晶体管第二极T12作为第一电压转换电路输出端112O，第一晶体管第三极T13接地。第一互感线圈L1的一端与第二互感线圈L2的另一端为同名端。
通常，需要对热电芯片产生的温差电动势进行升压，以满足MCU/DSP的输入电压要求。图10示出的是焦耳小偷(Joule Thief)电路，焦耳小偷电路是一种自振荡升压电路，本申请实施例以焦耳小偷电路为例，描述第一电压转换电路112的具体形式。第一电压转换电路112将第一热电转换模块111由温度转转化的电压，转换为较高的电压脉冲形式。焦耳小偷电路的原理不在此赘述。其他拓扑结构的电压转换器亦可作为第一电压转换电路112的具体形式。
在另一些实施例中，如图11所示，第一电压转换电路112还包括：第二晶体管T2，第二电阻R2。第二晶体管第一极T21与第二电阻R2的一端电性连接，第二电阻R2的另一端用于接收第一启动信号，第二晶体管第二极T22与第一晶体管第一极T11电性连接，第二晶体管第三极T23接地，其中，第一启动信号用于开启第一电压转换电路112。当第一晶体管T1为NPN三极管时，第一晶体管第一极T11为基极，第一晶体管第二极T12为集电极，第一晶体管第三极T13为发射极。第二晶体管T2可以是NPN三极管，亦可以是 NMOS管。以NMOS管为例，第二晶体管第一极T21为栅极，第二晶体管第二极T22为漏极，第二晶体管第三极T23为源极。
第一关闭信号为高电平，使第一电压转换电路112不工作；第一启动信号为低电平，使第一电压转换电路112开始工作。当第一电压转换电路112接收到电源初级控制模块4发出的第一启动信号，第二晶体管T2被关断，使经过第一互感线圈L1，第一电阻R1的电流流入第一晶体管第一极T11，开启第一电压转换电路112，由第一电压转换电路输出端112O向后级输出电压。
如图5中(b)部分所示，第二热电子模块12包括：第二热电转换模块121，第二电压转换电路122。第二热电转换模块121，包括：第二热电转换模块输出端121O；第二电压转换电路122包括：第二电压转换电路输入端122I，第二电压转换电路输出端122O；第二热电转换模块输出端121O与第二电压转换电路输入端122I电性连接，第二电压转换电路输出端122O作为第二热电子模块输出端12O。
具体地，如图6中(b)部分所示，第二热电转换模块121为第二热电芯片TG2。第二热电芯片TG2包括：第二热电芯片正输出端TG2P，第二热电芯片负输出端TG2N；第二热电芯片正输出端TG2P作为第二热电转换模块输出端121O，第二热电芯片负输出端TG2N接地。
如图8中(b)部分所示，第二热电芯片TG2还包括：第二热电芯片冷端TG2C。第二热电芯片冷端TG2C贴附于第二预设位置，其中，第二预设位置设置于：电源壳体内距电源入风口或电源出风口最近的散热片表面，如图9中A或C所示位置。
图9示意性地展示了电源内部风流的方向，在服务器正常工作时，该风流会携带服务器机箱内排出的热量。因此，吹入电源入风口处的气流温度通常达到45-55℃。在电源正常工作的情况下，风口处散热片的最高温度低于电源入风口或电源出风口的气流温度，将第二热电芯片冷端TG2C贴附于第二预设位置，可使第二芯片产生温差电动势。
图12示意性的展示了B点以及A点处，第一热电芯片热端和第二热电芯片冷端的贴附位置。
具体地，如图13所示，第二电压转换电路122包括：第三晶体管T3，第三电阻R3，第三互感线圈L3，第四互感线圈L4。第三晶体管第一极T31串联第三电阻R3后与第三互感线圈L3的一端电性连接，第三晶体管第二极T32与第四互感线圈L4的一端电性连接，第四互感线圈L4的另一端与第三互感线圈L3的另一端电性连接后作为第二电压转换电路输入端122I，第三晶体管第二极T32作为第二电压转换电路输出端122O，第三晶体管第三极T33接地。
第三互感线圈L3的一端与第四互感线圈L4的另一端为同名端。
在另一些实施例中，如图14所示，第二电压转换电路122还包括：第四晶体管T4，第四电阻R4。第四晶体管第一极T41与第四电阻R4的一端电性连接，第四电阻R4的另一端用于接收第二启动信号，第四晶体管第二极T42与第三晶体管第一极T31电性连接，第四晶体管第三极T43接地，其中，第二启动信号用于开启第二电压转换电路122。当第三晶体管T3为NPN三极管时，第三晶体管第一极T31为基极，第三晶体管第二极T32为集电极，第三晶体管第三极T33为发射极。第四晶体管T4可以是NPN三极管，亦可以是NMOS管。以NMOS管为例，第四晶体管第一极T41为栅极，第四晶体管第二极T42为漏极，第四晶体管第三极T43为源极。
第二关闭信号为高电平，使第二电压转换电路122不工作；第二启动信号为低电平，使第二电压转换电路122开始工作。当第二电压转换电路122接收到电源初级控制模块4发出的第二启动信号，第四晶体管T4被关断，使经过第三互感线圈L3，第三电阻R3的电流流入第三晶体管第一极T31，开启第二电压转换电路122，由第二电压转换电路输出端122O向后级输出电压。
优选地，第一晶体管T1，第三晶体管T3为NPN三极管。
由于焦耳小偷电路的自激振荡特性，其输出的电压存在较大纹波，在电压转换电路的后级增加稳压电路，可以为给电源初级控制模块4提供稳定的电压输入。
优选地，电源模块还包括稳压模块6；如图15所示，稳压模块6的稳压输入端6I与热电备用输出端1O 电性连接，稳压模块6的稳压输出端6O与初级低压输入端2I电性连接。
优选地，稳压模块6为低压差线性稳压器(Low Dropout，LDO)。图16示出了低压差线性稳压器的典型电路。可替代地，通过TL431与功率晶体管配合使用，亦可组成稳压电路，如图17所示。LDO与TL431电路的工作原理，不在此赘述。
优选地，电源模块还包括：整流电路7，如图18所示，整流电路输入端7I与热电备用输出端1O电性连接，整流电路输出端7O与稳压输出端口6I电性连接。
具体地，如图19所示，整流电路7包括：二极管D，电容C；
二极管阴极DC与电容的一端电性连接，电容的另一端接地；
二极管阳极DA作为整流电路输入端7I，二极管阴极DC作为整流电路输出端7O。
在另一些实施例中，一种供电方法，应用于上述第一方面记载的供电电路，使初级低压供电模块为初级控制模块供电，维持初级控制模块与次级控制模块进行通信，方法包括：
S100：响应于获取电源故障信号，向热电备用模块发出电路启动信号，使热电备用模块工作，为初级低压供电模块提供输入电压。
具体地，S110：获取电源输入指示信号，以及电源初级控制模块输入监测信号，并根据电源输入指示信号，以及电源初级控制模块输入监测信号判断电源输入是否异常；
电源输入指示信号，可以是电源故障信号，也可以是电源正常工作信号；电源初级控制模块输入监测信号，是初级控制模块自身输入的监测信号。电源输入指示信号异常，同时电源初级控制模块输入信号异常，表示电源输入异常。
S120：响应于电源输入异常，向级第一热电子模块发送第一启动信号，并获取第一热电子模块监测信号；
S130：获取电源输入指示信号，以及第一热电子模块监测信号，并根据电源输入指示信号，以及第一热电子模块监测信号判断第一热电子模块是否异常；电源输入指示信号异常，同时第一热电子模块检测信号异常，表示第一热电子模块异常。
S140：响应于第一热电子模块异常，则向第二热电子模块发出第二启动信号。
通常冗余电源模块本身具备两种告警信号，一为Input_OK，即为输入正常与否的告警信号，另一为Output_OK，即为输出正常与否的告警信号。通过上述两种告警信号电源控制模块可以获取自身输入、输出的状态。在正常工作情况下，电源输入指示信号正常，电源初级控制模块4持续向第一热电子模块11发送第一关闭信号，第一关闭信号为高电平。通过第一关闭信号开启第二晶体管T2，从而拉低第一晶体管第一极T11的电压，第一电压转换电路112不工作，初级低压电源3由电源输入供电，向初级控制模块4供电，如图20中t1时段所示。
当监测到电源输入指示信号异常，说明电源输入出现故障。电源初级控制模块4无法由电源输入维持正常工作，电源初级控制模块输入电压出现异常，如图20中t2时段。此时，向第一热电子模块11发送第一启动信号，第一启动信号为低电平。通过第一启动信号关断第二晶体管T2，使经过第一互感线圈L1，第一电阻R1的电流流入第一晶体管第一极T11，开启第一电压转换电路112，初级控制模块4随即由第一热电子模块11供电，如图20中t3时段。其中，第一热电子模块11供电过程中，因初级低压电源大电容放电的原因，呈现出第一热电子模块11与初级低压电源交替供电的情况，但二者互不影响。
电源输入出现故障后，初级失效，初级的功率器件不再参与工作，停止发热。冗余设计下，风扇持续转动进行散热，电源内部温度逐渐降低，使散热片与风扇带动的热流之间的温度差逐渐降低。当电源内部温度差不足以支持第一热电子模块11向电源初级控制模块4供电时，第一热电子模块11的工作出现异常。当监测到电源输入指示信号异常，并且第一热电子模块11工作异常时，电源初级控制模块4向第一热电子模块11发送第一关闭信号，并向第二热电子模块12发送第二启动信号，第二启动信号为低电平。通过第一关闭信号切断第一热电子模块11的工作；通过第二启动信号关断第四晶体管T4，使经过第三互感线 圈L3，第三电阻R3的电流流入第三晶体管第一电极T31，开启第二电压转换电路122，初级控制模块4随机由第二热电子模块12供电如图20中t4时段。
S150：响应于电源输入指示信号异常，以及第二热电子模块工作异常，中断电源当前任务，并发出电源失效告警。
响应于电源输入指示信号异常，以及第二热电子模块12工作异常，则需要对电源及时采取保全措施，避免电源完全失效。
对于电源初级控制模块输入电压的监测可以通过输入电压与基准电压进行比较得到。对于第一热电子模块工作状态的监测可以通过检测电源初级控制模块输入电压实现，当第一热电子模块工作时，电源初级控制模块输入电压小于第一电压阈值时，即判定第一热电子模块工作异常；亦可以通过对促使第一热电转换模块111工作的温度差获得，当温度差小于第一温差阈值时，及判定第一热电子模块工作异常。同理，在第二热电子模块工作时，电源初级控制模块输入电压小于第二电压阈值时，即判定第二热电子模块工作异常；亦可以通过对促使第二热电转换模块121工作的温度差获得，当温度差小于第二温差阈值时，及判定第二热电子模块工作异常。对于温度差的获取，可以通过热敏电阻或热电偶，配合电压检测电路的方式实现，在此不加赘述。
需要说明的是，第二电压阈值通常高于第一电压阈值；第二温差阈值通常高于第一温差阈值。由于第二热电子模块12是在电源输入异常时，为电源初级控制模块提供输入的最后一道供电方式。因此，对于第二热电子模块工作异常状态的监测更为严苛，使得在第二热电子模块12失效前，电源初级控制模块4尚能与电源次级控制模块5进行通信的情况下，及时对电源采取保全措施，避免电源完全失效。尤其是在数字电源的固件更新过程中，这一措施尤为重要。当温差电动势维持的时间不足以完成固件更新，需立刻告警。进一步由维护人员更换电源或重新进行更新。
优选地，供电方法还包括：
S200：断开初级低压供电模块通过低压变压器向次级低压供电模块的供电通路。
由于热电备用模块产生电能较小，关闭向次级低压供电模块的供电通路，能够保障热电备用模块产生的电能都为初级控制模块使用。
同时，由于电源的冗余设计，次级低压供电模块，可以从其他路电源模块处获得电能，以供应次级控制模块工作。
在另一些实施例中，如图21所示，一种电子设备，电子设备包括上述第一方面记载的供电电路。
通过实施本申请实施例公开的供电电路及电子设备，能够在数字电源初级因故障掉电的情况下，持续为其初级控制模块供电，维持其初级控制模块与次级控制模块之间的通信；在数字电源固件更新过程中，保障固件更新的供电环境，并在供电电路能量即将消耗殆尽前发出告警信号，以便采取进一步措施，保障数字电源固件更新作业的实施；充分利用服务器运转过程中，电源、机箱产生的废热，作为供电的能源。
上述所有可选技术方案，可以采用任意结合形成本申请的可选实施例，在此不再一一赘述。
实施例一
一种供电电路至少两个电源模块，电源模块如图2所示，包括：
依次连接的整流模块0，功率因数校正模块，变压器，输出整流模块；还包括热电备用模块1，初级低压供电模块2，次级低压供电模块3，初级控制模块4，次级控制模块5，以及初级控制模块用于控制功率因数校正模块进行功率校正，次级控制模块用于调制输出整流模块0；整流模块0的整流输出端0O与热电备用模块1的热电备用输出端1O电性连接后与初级低压供电模块2的初级低压输入端2I电性连接，初级低压供电模块2的初级低压输出端2O与初级控制模块4的初级控制输入端4I电性连接，初级低压供电模块2与次级低压供电模块3通过低压变压器6耦合；
响应于初级控制模块4接收到整流模块0发出的电源故障信号，则向热电备用模块1发出电路启动信号，使热电备用模块1产生电能后输入至低压供电模块2，以供初级控制模块4维持工作；
初级控制模块4与次级控制模块5双向传输信号。
实施例二
在实施例一的基础上，如图3所示，次级低压供电模块3的次级低压输出端3O与次级控制模块5的次级控制输入端5I电性连接，为次级控制模块5提供输入电压。
电源模块还包括：第一输出二极管DO1和第二输出二极管DO2；
第一输出二极管DO1的阳极与第二输出二极管DO2的阴极电性连接后，与次级低压输出端3O电性连接；
第一输出二极管DO1的阴极与第二输出二极管DO2的阳极电性连接后，与次级总输出端SO电性连接。
响应于初级控制模块接收到整流模块发出的电源故障信号，断开初级低压供电模块通过低压变压器向次级低压供电模块的供电通路。
如图4所示，热电备用模块1包括：第一热电子模块11，第二热电子模块12。第一热电子模块11包括：第一热电子模块输出端11O，第二热电子模块12包括：第二热电子模块输出端12O，第一热电子模块输出端11O与第二热电子模块输出端12O电性连接后作为热电备用输出端1O。
如图5中(a)部分所示，第一热电子模块11包括：第一热电转换模块111，第一电压转换电路112。第一热电转换模块111包括：第一热电转换模块输出端111O；第一电压转换电路112包括：第一电压转换电路输入端112I，第一电压转换电路输出端112O；第一热电转换模块输出端111O与第一电压转换电路输入端112I电性连接，第一电压转换电路输出端112O作为第一热电子模块输出端11O。
具体地，如图6中(a)部分所示，第一热电转换模块111为第一热电芯片TG1。第一热电芯片TG1包括：第一热电芯片正输出端TG1P，第一热电芯片负输出端TG1N；第一热电芯片正输出端TG1P作为第一热电转换模块输出端111O，第一热电芯片负输出端TG1N接地。
如图8中(a)部分所示，第一热电芯片TG1还包括：第一热电芯片热端TG1H。第一热电芯片热端TG1H贴附于第一预设位置，其中，第一预设位置设置于：电源工作时，位于电源壳体内、距温度最高点最近的散热片表面，如图9中B所示位置。将第一热电芯片热端TG1H贴附于第一预设位置，可使第一芯片产生温差电动势。
具体地，如图10所示，第一电压转换电路112包括：第一晶体管T1，第一电阻R1，第一互感线圈L1，第二互感线圈L2。第一晶体管第一极T11串联第一电阻R1后与第一互感线圈L1的一端电性连接，第一晶体管第二极T12与第二互感线圈L2的一端电性连接，第二互感线圈L2的另一端与第一互感线圈L1的另一端电性连接后作为第一电压转换电路输入端112I，第一晶体管第二极T12作为第一电压转换电路输出端112O，第一晶体管第三极T13接地。第一互感线圈L1的一端与第二互感线圈L2的另一端为同名端。
如图11所示，第一电压转换电路112还包括：第二晶体管T2，第二电阻R2。第二晶体管第一极T21与第二电阻R2的一端电性连接，第二电阻R2的另一端用于接收第一启动信号，第二晶体管第二极T22与第一晶体管第一极T11电性连接，第二晶体管第三极T23接地，其中，第一启动信号用于开启第一电压转换电路112。当第一晶体管T1为NPN三极管时，第一晶体管第一极T11为基极，第一晶体管第二极T12为集电极，第一晶体管第三极T13为发射极。第二晶体管T2可以是NPN三极管，亦可以是NMOS管。以NMOS管为例，第二晶体管第一极T21为栅极，第二晶体管第二极T22为漏极，第二晶体管第三极T23为源极。
如图5中(b)部分所示，第二热电子模块12包括：第二热电转换模块121，第二电压转换电路122。第二热电转换模块121，包括：第二热电转换模块输出端121O；第二电压转换电路122包括：第二电压转换电路输入端122I，第二电压转换电路输出端122O；第二热电转换模块输出端121O与第二电压转换电路输入端122I电性连接，第二电压转换电路输出端122O作为第二热电子模块输出端12O。
具体地，如图6中(b)部分所示，第二热电转换模块121为第二热电芯片TG2。第二热电芯片TG2包括：第二热电芯片正输出端TG2P，第二热电芯片负输出端TG2N；第二热电芯片正输出端TG2P作为第二热电转换模块输出端121O，第二热电芯片负输出端TG2N接地。
如图8中(b)部分所示，第二热电芯片TG2还包括：第二热电芯片冷端TG2C。第二热电芯片冷端TG2C贴附于第二预设位置，其中，第二预设位置设置于：电源壳体内距电源入风口或电源出风口最近的散热片表面，如图9中A或C所示位置。
图9示意性地展示了电源内部风流的方向，在服务器正常工作时，该风流会携带服务器机箱内排出的热量。因此，吹入电源入风口处的气流温度通常达到45-55℃。在电源正常工作的情况下，风口处散热片的最高温度低于电源入风口或电源出风口的气流温度，将第二热电芯片冷端TG2C贴附于第二预设位置，可使第二芯片产生温差电动势。
图12示意性的展示了B点以及A点处，第一热电芯片热端和第二热电芯片冷端的贴附位置。
如图13所示，第二电压转换电路122包括：第三晶体管T3，第三电阻R3，第三互感线圈L3，第四互感线圈L4。第三晶体管第一极T31串联第三电阻R3后与第三互感线圈L3的一端电性连接，第三晶体管第二极T32与第四互感线圈L4的一端电性连接，第四互感线圈L4的另一端与第三互感线圈L3的另一端电性连接后作为第二电压转换电路输入端122I，第三晶体管第二极T32作为第二电压转换电路输出端122O，第三晶体管第三极T33接地。
第三互感线圈L3的一端与第四互感线圈L4的另一端为同名端。
如图14所示，第二电压转换电路122还包括：第四晶体管T4，第四电阻R4。第四晶体管第一极T41与第四电阻R4的一端电性连接，第四电阻R4的另一端用于接收第二启动信号，第四晶体管第二极T42与第三晶体管第一极T31电性连接，第四晶体管第三极T43接地，其中，第二启动信号用于开启第二电压转换电路122。当第三晶体管T3为NPN三极管时，第三晶体管第一极T31为基极，第三晶体管第二极T32为集电极，第三晶体管第三极T33为发射极。第四晶体管T4可以是NPN三极管，亦可以是NMOS管。以NMOS管为例，第四晶体管第一极T41为栅极，第四晶体管第二极T42为漏极，第四晶体管第三极T43为源极。
第一晶体管T1，第三晶体管T3为NPN三极管。
电源模块还包括稳压模块6；如图15所示，稳压模块6的稳压输入端6I与热电备用输出端1O电性连接，稳压模块6的稳压输出端6O与初级低压输入端2I电性连接。
稳压模块6为低压差线性稳压器(Low Dropout，LDO)。图16示出了低压差线性稳压器的典型电路。可替代地，通过TL431与功率晶体管配合使用，亦可组成稳压电路，如图17所示。LDO与TL431电路的工作原理，不在此赘述。
电源模块还包括：整流电路7，如图18所示，整流电路输入端7I与热电备用输出端1O电性连接，整流电路输出端7O与稳压输出端口6I电性连接。
如图19所示，整流电路7包括：二极管D，电容C；
二极管阴极DC与电容的一端电性连接，电容的另一端接地；
二极管阳极DA作为整流电路输入端7I，二极管阴极DC作为整流电路输出端7O。
实施例三
一种供电方法，应用于上述第一方面记载的供电电路，使初级低压供电模块为初级控制模块供电，维持初级控制模块与次级控制模块进行通信，方法包括：
S100：响应于获取电源故障信号，向热电备用模块发出电路启动信号，使热电备用模块工作，为初级低压供电模块提供输入电压。
实施例四
在实施例三的基础上供电方法还包括：
S200：断开初级低压供电模块通过低压变压器向次级低压供电模块的供电通路。
实施例五
一种电子设备，如图21所示，包括实施例二记载的供电电路。特别地，根据本申请的实施例，上文参考流程图描述的过程可以被实现为计算机软件程序。例如，本申请的实施例包括一种计算机程序产品，其 包括装载在计算机可读介质上的计算机程序，该计算机程序包含用于执行流程图所示的方法的程序代码。在这样的实施例中，该计算机程序可以通过通信装置从网络上被下载和安装，或者从存储器被安装，或者从ROM被安装。在该计算机程序被外部处理器执行时，执行本申请的实施例的方法中限定的上述功能。
根据本申请的实施例，所提供的技术方案带来的有益效果是：
1.通过实施本申请实施例公开的供电电路及电子设备，能够在数字电源初级因故障掉电的情况下，持续为其初级控制模块供电，维持其初级控制模块与次级控制模块之间的通信，进而维持初级控制模块与服务器系统或上位机的通信；
2.在数字电源固件更新过程中，保障固件更新的供电环境，并在供电电路能量即将消耗殆尽前发出告警信号，以便采取进一步措施，保障数字电源固件更新作业的实施，提高数字电源可靠性；
3.在备用电源失效前，安全地中断数字电源当前任务，保障数字电源正常功能不丧失；
4.充分利用服务器运转过程中，电源、机箱产生的废热，作为供电的能源。
需要说明的是，本申请的实施例的计算机可读介质可以是计算机可读信号介质或者计算机可读存储介质或者是上述两者的任意组合。计算机可读存储介质例如可以是——但不限于——电、磁、光、电磁、红外线、或半导体的系统、装置或器件，或者任意以上的组合。计算机可读存储介质的更具体的例子可以包括但不限于：具有一个或多个导线的电连接、便携式计算机磁盘、硬盘、随机访问存储器(RAM)、只读存储器(ROM)、可擦式可编程只读存储器(EPROM或闪存)、光纤、便携式紧凑磁盘只读存储器(CD-ROM)、光存储器件、磁存储器件、或者上述的任意合适的组合。在本申请的实施例中，计算机可读存储介质可以是任何包含或存储程序的有形介质，该程序可以被指令执行系统、装置或者器件使用或者与其结合使用。而在本申请的实施例中，计算机可读信号介质可以包括在基带中或者作为载波一部分传播的数据信号，其中承载了计算机可读的程序代码。这种传播的数据信号可以采用多种形式，包括但不限于电磁信号、光信号或上述的任意合适的组合。计算机可读信号介质还可以是计算机可读存储介质以外的任何计算机可读介质，该计算机可读信号介质可以发送、传播或者传输用于由指令执行系统、装置或者器件使用或者与其结合使用的程序。计算机可读介质上包含的程序代码可以用任何适当的介质传输，包括但不限于：电线、光缆、RF(Radio Frequency，射频)等等，或者上述的任意合适的组合。
上述计算机可读介质可以是上述服务器中所包含的；也可以是单独存在，而未装配入该服务器中。上述计算机可读介质承载有一个或者多个程序，当上述一个或者多个程序被该服务器执行时，使得该服务器：响应于检测到终端的外设模式未激活时，获取终端上应用的帧率；在帧率满足息屏条件时，判断用户是否正在获取终端的屏幕信息；响应于判断结果为用户未获取终端的屏幕信息，控制屏幕进入立即暗淡模式。
可以以一种或多种程序设计语言或其组合来编写用于执行本申请的实施例的操作的计算机程序代码，程序设计语言包括面向对象的程序设计语言—诸如Java,Smalltalk,C++，还包括常规的过程式程序设计语言—诸如“C”语言或类似的程序设计语言。程序代码可以完全地在用户计算机上执行、部分地在用户计算机上执行、作为一个独立的软件包执行、部分在用户计算机上部分在远程计算机上执行、或者完全在远程计算机或服务器上执行。在涉及远程计算机的情形中，远程计算机可以通过任意种类的网络——包括局域网(LAN)或广域网(WAN)—连接到用户计算机，或者，可以连接到外部计算机(例如利用因特网服务提供商来通过因特网连接)。
本说明书中的各个实施例均采用递进的方式描述，各个实施例之间相同相似的部分互相参见即可，每个实施例重点说明的都是与其他实施例的不同之处。尤其，对于系统或系统实施例而言，由于其基本相似于方法实施例，所以描述得比较简单，相关之处参见方法实施例的部分说明即可。以上所描述的系统及系统实施例仅仅是示意性的，其中所述作为分离部件说明的单元可以是或者也可以不是物理上分开的，作为单元显示的部件可以是或者也可以不是物理单元，即可以位于一个地方，或者也可以分布到多个网络单元上。可以根据实际的需要选择其中的部分或者全部模块来实现本实施例方案的目的。本领域普通技术人员 在不付出创造性劳动的情况下，即可以理解并实施。
以上对本申请所提供的技术方案进行了详细介绍，本文中应用了具体个例对本申请的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本申请的方法及其核心思想；同时，对于本领域的一般技术人员，依据本申请的思想，在具体实施方式及应用范围上均会有改变之处。综上所述，本说明书内容不应理解为对本申请的限制。
以上所述仅为本申请的较佳实施例，并不用以限制本申请，凡在本申请的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本申请的保护范围之内。

Claims (24)

  1. 一种供电电路，包括至少两个电源模块，所述电源模块包括：依次连接的整流模块，功率因数校正模块，变压器，输出整流模块，其特征在于，所述电源模块还包括热电备用模块，初级低压供电模块，次级低压供电模块，初级控制模块，次级控制模块，所述初级控制模块用于控制所述功率因数校正模块进行功率校正，所述次级控制模块用于调制输出整流模块；
    所述整流模块的整流输出端与所述热电备用模块的热电备用输出端电性连接后与所述初级低压供电模块的初级低压输入端电性连接，所述初级低压供电模块的初级低压输出端与所述初级控制模块的初级控制输入端电性连接，所述初级低压供电模块与所述次级低压供电模块通过低压变压器耦合；
    响应于所述初级控制模块接收到所述整流模块发出的电源故障信号，向所述热电备用模块发出电路启动信号，使所述热电备用模块产生电能后输入至所述低压供电模块，以供所述初级控制模块维持工作；以及
    所述初级控制模块与所述次级控制模块双向传输信号。
  2. 根据权利要求1所述的供电电路，其特征在于，所述次级低压供电模块的次级低压输出端与所述次级控制模块的次级控制输入端电性连接，为所述次级控制模块提供输入电压。
  3. 根据权利要求1或2所述的供电电路，其特征在于，所述至少两个电源模块的次级低压供电模块的次级低压输出端电性连接于次级总输出端；
    所述电源模块还包括：第一输出二极管和第二输出二极管；
    所述第一输出二极管的阳极与所述第二输出二极管的阴极电性连接后，与所述次级低压输出端电性连接；以及
    所述第一输出二极管的阴极与所述第二输出二极管的阳极电性连接后，与次级总输出端电性连接。
  4. 根据权利要求1所述的供电电路，其特征在于，响应于所述初级控制模块接收到所述整流模块发出的电源故障信号，断开初级低压供电模块通过低压变压器向次级低压供电模块的供电通路。
  5. 根据权利要求1所述的供电电路，其特征在于，所述热电备用模块包括：第一热电子模块，第二热电子模块；以及
    所述第一热电子模块包括：第一热电子模块输出端，所述第二热电子模块包括：第二热电子模块输出端，所述第一热电子模块输出端与所述第二热电子模块输出端电性连接后作为所述热电备用输出端。
  6. 根据权利要求5所述的供电电路，其特征在于，所述第一热电子模块包括：第一热电转换模块，第一电压转换电路；
    所述第一热电转换模块包括：第一热电转换模块输出端；
    所述第一电压转换电路包括：第一电压转换电路输入端，第一电压转换电路输出端；以及
    所述第一热电转换模块输出端与所述第一电压转换电路输入端电性连接，所述第一电压转换电路输出端作为所述第一热电子模块输出端。
  7. 根据权利要求6所述的供电电路，其特征在于，所述第一热电转换模块为第一热电芯片；
    所述第一热电芯片包括：第一热电芯片正输出端，第一热电芯片负输出端；以及
    所述第一热电芯片正输出端作为所述第一热电转换模块输出端，所述第一热电芯片负输出端接地。
  8. 根据权利要求7所述的供电电路，其特征在于，所述第一热电芯片还包括：第一热电芯片热端；以及
    所述第一热电芯片热端贴附于第一预设位置，其中，所述第一预设位置设置于：电源工作时，位于电源壳体内、距温度最高点最近的散热片表面。
  9. 根据权利要求6所述的供电电路，其特征在于，所述第一电压转换电路包括：第一晶体管，第一电阻，第一互感线圈，第二互感线圈；以及
    第一晶体管第一极串联所述第一电阻后与所述第一互感线圈的一端电性连接，第一晶体管第二极与 所述第二互感线圈的一端电性连接，所述第二互感线圈的另一端与所述第一互感线圈的另一端电性连接后作为所述第一电压转换电路输入端，所述第一晶体管第二极作为所述第一电压转换电路输出端，第一晶体管第三极接地。
  10. 根据权利要求9所述的供电电路，其特征在于，所述第一互感线圈的一端与所述第二互感线圈的另一端为同名端。
  11. 根据权利要求6所述的供电电路，其特征在于，所述第一电压转换电路还包括：第二晶体管，第二电阻；
    第二晶体管第一极与所述第二电阻的一端电性连接，所述第二电阻的另一端用于接收第一启动信号，第二晶体管第二极与第一晶体管第一极电性连接，所述第二晶体管第三极接地，其中，所述第一启动信号用于开启所述第一电压转换电路。
  12. 根据权利要求5所述的供电电路，其特征在于，所述第二热电子模块包括：第二热电转换模块，第二电压转换电路；
    所述第二热电转换模块，包括：第二热电转换模块输出端；
    所述第二电压转换电路包括：第二电压转换电路输入端，第二电压转换电路输出端；
    所述第二热电转换模块输出端与所述第二电压转换电路输入端电性连接，所述第二电压转换电路输出端作为所述第二热电子模块输出端。
  13. 根据权利要求12所述的供电电路，其特征在于，所述第二热电转换模块为第二热电芯片；
    所述第二热电芯片包括：第二热电芯片正输出端，第二热电芯片负输出端；
    所述第二热电芯片正输出端作为所述第二热电转换模块输出端，所述第二热电芯片负输出端接地。
  14. 根据权利要求13所述的供电电路，其特征在于，所述第二热电芯片还包括：第二热电芯片冷端；
    所述第二热电芯片冷端贴附于第二预设位置，其中，所述第二预设位置设置于：电源壳体内距电源入风口或电源出风口最近的散热片表面。
  15. 根据权利要求12所述的供电电路，其特征在于，所述第二电压转换电路包括：第三晶体管，第三电阻，第三互感线圈，第四互感线圈；
    第三晶体管第一极串联所述第三电阻后与所述第三互感线圈的一端电性连接，第三晶体管第二极与所述第四互感线圈的一端电性连接，所述第四互感线圈的另一端与所述第三互感线圈的另一端电性连接后作为所述第二电压转换电路输入端，所述第三晶体管第二极作为所述第二电压转换电路输出端，第三晶体管第三极接地。
  16. 根据权利要求15所述的供电电路，其特征在于，所述第三互感线圈的一端与所述第四互感线圈的另一端为同名端。
  17. 根据权利要求12所述的供电电路，其特征在于，所述第二电压转换电路还包括：第四晶体管，第四电阻；
    第四晶体管第一极与所述第四电阻的一端电性连接，所述第四电阻的另一端用于接收第二启动信号，第四晶体管第二极与第三晶体管第一极电性连接，所述第四晶体管第三极接地，其中，所述第二启动信号用于开启所述第二电压转换电路。
  18. 根据权利要求9或15所述的供电电路，其特征在于，第一晶体管，第三晶体管为NPN三极管。
  19. 根据权利要求1所述的供电电路，其特征在于，所述电源模块还包括稳压模块；所述稳压模块的稳压输入端与所述热电备用输出端电性连接，所述稳压模块的稳压输出端与所述初级低压输入端电性连接。
  20. 根据权利要求19所述的供电电路，其特征在于，所述稳压模块为低压差线性稳压器。
  21. 根据权利要求19所述的供电电路，其特征在于，所述电源模块还包括：整流电路，整流电路输入端与所述热电输出端口电性连接，整流电路输出端与所述稳压输出端口电性连接。
  22. 根据权利要求21所述的供电电路，其特征在于，所述整流电路包括：二极管，电容；
    二极管阴极与所述电容的一端电性连接，所述电容的另一端接地；
    二极管阳极作为所述整流电路输入端，所述二极管阴极作为所述整流电路输出端。
  23. 根据权利要求1所述的供电电路，其特征在于，所述热电备用模块包括：第一热电子模块、第二热电子模块；以及
    所述供电电路被设置为：响应于所述第一热电子模块工作异常，向所述第一热电子模块发送第一关闭信号，并向所述第二热电子模块发送第二启动信号，使所述第二热电子模块向电源初级控制模块供电；响应于所述第二热电子模块工作异常，则对所述电源采取保全措施；其中，所述第一热电子模块工作异常表示电源初级控制模块输入电压小于第一电压阈值，或促使第一热电转换模块工作的温度差小于第一温差阈值；所述第二热电子模块工作异常表示电源初级控制模块输入电压小于第二电压阈值，或促使第二热电转换模块工作的温度差小于第二温差阈值，所述第二电压阈值高于所述第一电压阈值，所述第二温差阈值高于所述第一温差阈值。
  24. 一种电子设备，其特征在于，所述电子设备包括权利要求1至23中任一权利要求所述的供电电路。
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