WO2024246986A1 - 回路形成方法、および回路形成装置 - Google Patents

回路形成方法、および回路形成装置 Download PDF

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Publication number
WO2024246986A1
WO2024246986A1 PCT/JP2023/019697 JP2023019697W WO2024246986A1 WO 2024246986 A1 WO2024246986 A1 WO 2024246986A1 JP 2023019697 W JP2023019697 W JP 2023019697W WO 2024246986 A1 WO2024246986 A1 WO 2024246986A1
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WO
WIPO (PCT)
Prior art keywords
resin
forming
lid member
component
wall
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2023/019697
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English (en)
French (fr)
Japanese (ja)
Inventor
慎二 瀧川
公彦 安田
亮二郎 富永
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Corp
Original Assignee
Fuji Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Corp filed Critical Fuji Corp
Priority to JP2025523635A priority Critical patent/JPWO2024246986A1/ja
Priority to PCT/JP2023/019697 priority patent/WO2024246986A1/ja
Publication of WO2024246986A1 publication Critical patent/WO2024246986A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers

Definitions

  • the present invention relates to a circuit formation method and a circuit formation device for a circuit board that incorporates components.
  • Patent Document 1 describes a technology for forming a circuit board with built-in components.
  • the objective is to create a highly reliable circuit board that incorporates components.
  • this specification discloses a circuit formation method including a component placement step of placing a component on a base, a wall formation step of forming a wall using a curable resin that is higher than the top surface of the component so as to surround the side surface of the component, a covering step of covering the component by placing a lid member on the wall, and a resin layer formation step of forming a resin layer using the curable resin to fix the lid member.
  • This specification also discloses a circuit forming device that includes a mounting device, a forming device that forms an arbitrary component from a curable resin, and a control device, and the control device executes a component mounting process in which the mounting device mounts a component on a base, a wall forming process in which the forming device forms a wall higher than the top surface of the component so as to surround the side of the component, a covering process in which the mounting device covers the component by mounting a lid member on top of the wall, and a resin layer forming process in which the forming device forms a resin layer that fixes the lid member.
  • a wall higher than the top surface of the component is formed from a curable resin so as to surround the side of the component placed on the base.
  • a lid member is then placed on top of the wall to cover the component, and a resin layer that fixes the lid member is formed from the curable resin.
  • FIG. 1 is a diagram illustrating an example of a circuit forming device.
  • FIG. 2 is a block diagram showing an example of a control device.
  • FIG. 2 is a cross-sectional view showing an example of a circuit board in a state in which a resin laminate is formed.
  • FIG. 2 is a cross-sectional view showing an example of a circuit board in which wiring is formed on a resin laminate.
  • FIG. 2 is a cross-sectional view showing an example of a circuit board in which a resin laminate is further formed on the resin laminate.
  • FIG. 2 is a cross-sectional view showing an example of a circuit board in which a conductive paste is applied onto wiring.
  • FIG. 1 is a diagram illustrating an example of a circuit forming device.
  • FIG. 2 is a block diagram showing an example of a control device.
  • FIG. 2 is a cross-sectional view showing an example of a circuit board in a state in which a resin laminate is formed.
  • FIG. 2 is a
  • FIG. 2 is a cross-sectional view showing an example of a circuit board in a state in which a thermosetting resin is applied onto a resin laminate.
  • FIG. 2 is a cross-sectional view showing an example of a circuit board on which electronic components are mounted.
  • FIG. 2 is a cross-sectional view showing an example of a circuit board in a state in which an electronic component is pressed against a resin laminate.
  • 1 is a cross-sectional view showing an example of a circuit board in which a thermosetting resin is applied around an electronic component.
  • 1 is a cross-sectional view showing an example of a circuit board in which a resin laminate in close contact with the top and side surfaces of an electronic component is formed.
  • FIG. 1 is a cross-sectional view showing an example of a circuit board in which a resin laminate surrounding a side surface of an electronic component is formed.
  • FIG. 2 is a perspective view showing an example of a circuit board on which a resin laminate surrounding a side surface of an electronic component is formed.
  • FIG. 4 is a perspective view showing an example of a lid member formed from an ultraviolet curing resin.
  • 1 is a cross-sectional view showing an example of a circuit board in a state in which electronic components are covered with a lid member.
  • 1 is a perspective view showing an example of a circuit board in a state in which electronic components are covered with a lid member;
  • 1 is a cross-sectional view showing an example of a circuit board in a state in which a resin laminate covering a lid member is formed.
  • 1 is a perspective view showing an example of a circuit board in which a plurality of electronic components are covered with one lid member; 1 is a cross-sectional view showing an example of a circuit board in which an electronic component is covered with a lid member having a protrusion. 1 is a cross-sectional view showing an example of a circuit board to which a lid member is fixed by a resin laminate that covers the edge of the lid member with the central portion of the lid member exposed.
  • FIG. 1 shows an example of a circuit forming device 10.
  • the circuit forming device 10 includes a conveying device 20, a first modeling unit 22, a second modeling unit 23, a third modeling unit 24, a fourth modeling unit 25, a pressing unit 26, a mounting unit 27, and a control device (see FIG. 2) 28.
  • the conveying device 20, the first modeling unit 22, the second modeling unit 23, the third modeling unit 24, the fourth modeling unit 25, the pressing unit 26, and the mounting unit 27 are arranged on a base 29 of the circuit forming device 10.
  • the base 29 is generally rectangular in shape, and in the following description, the longitudinal direction of the base 29 is referred to as the X-axis direction, the lateral direction of the base 29 as the Y-axis direction, and the direction perpendicular to both the X-axis direction and the Y-axis direction as the Z-axis direction.
  • the transport device 20 includes an X-axis slide mechanism 30 and a Y-axis slide mechanism 32.
  • the X-axis slide mechanism 30 includes an X-axis slide rail 34 and an X-axis slider 36.
  • the X-axis slide rail 34 is disposed on the base 29 so as to extend in the X-axis direction.
  • the X-axis slider 36 is held by the X-axis slide rail 34 so as to be slidable in the X-axis direction.
  • the X-axis slide mechanism 30 also includes an electromagnetic motor (see FIG. 2) 38, and the X-axis slider 36 is moved to any position in the X-axis direction by the drive of the electromagnetic motor 38.
  • the Y-axis slide mechanism 32 also includes a Y-axis slide rail 50 and a stage 52.
  • the Y-axis slide rail 50 is disposed on the base 29 so as to extend in the Y-axis direction and is movable in the X-axis direction.
  • One end of the Y-axis slide rail 50 is connected to the X-axis slider 36.
  • the stage 52 is held by the Y-axis slide rail 50 so as to be slidable in the Y-axis direction.
  • the Y-axis slide mechanism 32 has an electromagnetic motor (see FIG. 2) 56, and the stage 52 moves to any position in the Y-axis direction by driving the electromagnetic motor 56. As a result, the stage 52 moves to any position on the base 29 by driving the X-axis slide mechanism 30 and the Y-axis slide mechanism 32.
  • the stage 52 has a base 60, a holding device 62, a lifting device (see FIG. 2) 64, and a heater (see FIG. 2) 66.
  • the base 60 is formed in a flat plate shape, and a substrate is placed on the upper surface.
  • the holding devices 62 are provided on both sides of the base 60 in the X-axis direction.
  • the substrate is fixedly held by clamping both edges in the X-axis direction of the substrate placed on the base 60 between the holding devices 62.
  • the lifting device 64 is disposed below the base 60, and raises and lowers the base 60.
  • the heater 66 is built into the base 60, and heats the substrate placed on the base 60 to a desired temperature.
  • the first modeling unit 22 is a unit that models the wiring of the circuit board, and has a first printing section 72 and a baking section 74.
  • the first printing section 72 has an inkjet head (see FIG. 2) 76 that ejects metal ink in lines.
  • the metal ink is a dispersion of nanometer-sized metal particles, such as silver particles, in a solvent. The surfaces of the metal particles are coated with a dispersant to prevent aggregation in the solvent.
  • the inkjet head 76 ejects the metal ink from multiple nozzles, for example, by a piezo method using piezoelectric elements.
  • the baking section 74 has an infrared irradiation device 78 (see Figure 2).
  • the infrared irradiation device 78 is a device that irradiates the ejected metal ink with infrared rays.
  • the metal ink irradiated with infrared rays is baked, and wiring is formed.
  • baking of metal ink is a phenomenon in which, by applying energy, the solvent is evaporated and the protective film for the metal particles, i.e., the dispersant is decomposed, and the metal particles come into contact or fuse together, thereby increasing the conductivity. Then, by baking the metal ink, metal wiring is formed.
  • the second modeling unit 23 is a unit that models the resin layer of the circuit board, and has a second printing unit 84 and a curing unit 86.
  • the second printing unit 84 has an inkjet head (see FIG. 2) 88 that ejects ultraviolet curable resin.
  • the ultraviolet curable resin is a resin that hardens when exposed to ultraviolet light.
  • the inkjet head 88 may be, for example, a piezo type that uses a piezoelectric element, or a thermal type that heats the resin to generate bubbles and ejects the resin from multiple nozzles.
  • the curing section 86 has a flattening device (see FIG. 2) 90 and an irradiation device (see FIG. 2) 92.
  • the flattening device 90 flattens the top surface of the UV-curable resin discharged by the inkjet head 88, for example by leveling the surface of the UV-curable resin while scraping off excess resin with a roller or blade, thereby making the thickness of the UV-curable resin uniform.
  • the irradiation device 92 has a mercury lamp or LED as a light source, and irradiates the discharged UV-curable resin with ultraviolet light. This hardens the discharged UV-curable resin, forming a resin layer.
  • the third modeling unit 24 is a unit that models the connection parts between the electrodes of electronic components and the wiring on the circuit board, and has a third printing unit 100.
  • the third printing unit 100 has a dispenser (see FIG. 2) 106 that dispenses conductive paste.
  • the conductive paste is a resin that hardens when heated at a relatively low temperature, with micrometer-sized metal particles dispersed in it. Incidentally, the metal particles are in the form of flakes, and the viscosity of the conductive paste is relatively high compared to metal ink.
  • the conductive paste dispensed by the dispenser 106 is then heated by the heater 66 built into the base 60.
  • the resin in the heated conductive paste hardens.
  • the resin in the conductive paste hardens and shrinks, and the flake-shaped metal particles dispersed in the resin come into contact with each other. This causes the conductive paste to exhibit conductivity.
  • the resin in the conductive paste is an organic adhesive, and exerts adhesive power by hardening when heated.
  • the fourth modeling unit 25 is a unit that models resin for fixing electronic components to a circuit board, and has a fourth printing unit 110.
  • the fourth printing unit 110 has a dispenser 116 (see FIG. 2), which dispenses thermosetting resin.
  • Thermosetting resin is resin that hardens when heated.
  • the dispenser 116 is, for example, an air pulse type that uses compressed air.
  • the thermosetting resin dispensed by the dispenser 116 is heated by a heater 66 built into the base 60 and hardens.
  • the pressing unit 26 is a unit for pressing the circuit board, and has a pressing section 120.
  • the pressing section 120 has a pressing plate (see FIG. 9) 122, a rubber plate (see FIG. 9) 124, and a cylinder (see FIG. 2).
  • the rubber plate 124 is molded, for example, from silicon rubber and has a plate shape.
  • the pressing plate 122 is molded, for example, from steel and has a plate shape.
  • the rubber plate 124 is attached to the underside of the pressing plate 122, and the pressing plate 122 is pressed against the circuit board by the operation of the cylinder 126. As a result, the circuit board is pressed by the pressing plate 122 via the rubber plate 124.
  • the force pressing the board can be controllably changed by controlling the operation of the cylinder 126.
  • the mounting unit 27 is a unit that mounts electronic components and other components on a circuit board, and has a supply section 130 and a mounting section 132.
  • the supply section 130 has multiple tape feeders (see FIG. 2) 134 that feed taped electronic components one by one, and supplies the electronic components at a supply position.
  • the supply section 130 not only has the tape feeders 134, but also a tray-type supply device that picks up and supplies electronic components from a tray.
  • the supply section 130 is not limited to the tape feeders 134 and the tray-type supply device, and may be configured to include a supply device other than the tape feeders 134 and the tray-type supply device.
  • the mounting section 132 has a mounting head (see FIG. 2) 136 and a moving device (see FIG. 2) 138.
  • the mounting head 136 has a suction nozzle (not shown) for suctioning and holding electronic components.
  • the suction nozzle sucks and holds the electronic component by sucking air when negative pressure is supplied from a positive and negative pressure supply device (not shown).
  • the positive and negative pressure supply device then supplies a slight positive pressure to release the electronic component.
  • the moving device 138 also moves the mounting head 136 between the supply position of electronic components by the tape feeder 134 and the board placed on the base 60. As a result, in the mounting section 132, the electronic component supplied from the tape feeder 134 is held by the suction nozzle, and the electronic component held by the suction nozzle is mounted on the board.
  • the control device 28 includes a controller 140 and a plurality of drive circuits 142.
  • the plurality of drive circuits 142 are connected to the electromagnetic motors 38, 56, the holding device 62, the lifting device 64, the heater 66, the inkjet head 76, the infrared irradiation device 78, the inkjet head 88, the flattening device 90, the irradiation device 92, the dispenser 106, the dispenser 116, the cylinder 126, the tape feeder 134, the mounting head 136, and the moving device 138.
  • the controller 140 includes a CPU, ROM, RAM, etc., and is mainly a computer, and is connected to the plurality of drive circuits 142. As a result, the operation of the transport device 20, the first modeling unit 22, the second modeling unit 23, the third modeling unit 24, the fourth modeling unit 25, the pressing unit 26, and the mounting unit 27 is controlled by the controller 140.
  • a resin laminate is formed on the base 60 with the above-mentioned configuration, and wiring is formed on the upper surface of the resin laminate. Then, the electrodes of the electronic components are electrically connected to the wiring via the conductive paste, and the electronic components are fixed with resin to form a circuit board.
  • a process for forming a circuit board will now be described. Specifically, first, the stage 52 is moved below the second modeling unit 23. Then, in the second modeling unit 23, as shown in FIG. 3, a resin laminate 152 is formed on the base 60 of the stage 52.
  • the resin laminate 152 is formed by repeatedly ejecting ultraviolet curable resin from the inkjet head 88 and irradiating the ejected ultraviolet curable resin with ultraviolet light by the irradiation device 92.
  • the inkjet head 88 ejects the ultraviolet curing resin in a thin film on the upper surface of the base 60.
  • the ultraviolet curing resin is flattened by the flattening device 90 in the curing section 86 so that the film thickness of the ultraviolet curing resin is uniform.
  • the irradiation device 92 irradiates the thin film of ultraviolet curing resin with ultraviolet light. This forms a thin film resin layer 153 on the base 60.
  • the inkjet head 88 ejects a thin film of ultraviolet curable resin onto the thin film resin layer 153.
  • the thin film of ultraviolet curable resin is then flattened by the flattening device 90, and the irradiation device 92 irradiates the ejected thin film of ultraviolet curable resin with ultraviolet light, thereby laminating a thin film of resin layer 153 on top of the thin film of resin layer 153.
  • the ejection of ultraviolet curable resin onto the thin film of resin layer 153 and the irradiation of ultraviolet light are repeated, and multiple resin layers 153 are laminated to form a resin laminate 152.
  • the stage 52 is moved below the first modeling unit 22.
  • the inkjet head 76 ejects metal ink 160 in lines on the top surface of the resin laminate 152 according to the circuit pattern, as shown in FIG. 4.
  • the infrared irradiation device 78 irradiates infrared rays onto the metal ink 160 ejected according to the circuit pattern. This bakes the metal ink 160, and wiring 162 is formed on the top surface of the resin laminate 152.
  • the stage 52 is moved below the second modeling unit 23.
  • the inkjet head 88 ejects the ultraviolet curing resin in a thin film so that the ends of the wiring 162 are exposed.
  • the ultraviolet curing resin is ejected in a thin film, the ultraviolet curing resin is flattened in the curing section 86 so that the film thickness of the ultraviolet curing resin is uniform.
  • the irradiation device 92 irradiates the thin film of ultraviolet curing resin with ultraviolet light.
  • a resin layer 156 is formed on the resin laminate 152, as shown in FIG. 5.
  • the inkjet head 88 ejects the ultraviolet curing resin in a thin film only on the resin layer 156. That is, the inkjet head 88 ejects the ultraviolet curing resin in a thin film on the resin layer 156 so that the ends of the wiring 162 are exposed.
  • the thin film of ultraviolet curing resin is then flattened by the flattening device 90, and the irradiation device 92 irradiates the ultraviolet curing resin ejected in a thin film with ultraviolet light, thereby laminating the resin layer 156 on the resin layer 156.
  • the ejection of the ultraviolet curing resin on the resin layer 156 and the irradiation of ultraviolet light are repeated, and a plurality of resin layers 156 are laminated to form a resin laminate 157.
  • the resin laminate 157 is formed on the resin laminate 152, and the step between the resin laminate 152 and the resin laminate 157 functions as the cavity 154.
  • the stage 52 is moved below the third modeling unit 24. Then, in the third printing section 100 of the third modeling unit 24, the dispenser 106 dispenses the conductive paste 166 onto the end of the wiring 162, as shown in FIG. 6.
  • the resin laminate 152 is heated by the heater 66 built into the base 60. At this time, the conductive paste 166 is heated through the resin laminate 152 and hardens. As a result, the conductive paste 166 exhibits conductivity.
  • the hardened conductive paste 166 functions as a bump, and therefore the hardened conductive paste 166 is described as a bump 168.
  • the stage 52 is moved below the fourth modeling unit 25.
  • the dispenser 116 dispenses the thermosetting resin 170 onto the upper surface of the resin laminate 152 between the wiring 162, as shown in FIG. 7.
  • thermosetting resin 170 is discharged onto the upper surface of the resin laminate 152 between the ends of the wiring 162 between the ends of the wiring 162
  • the stage 52 is moved below the mounting unit 27.
  • an electronic component (see FIG. 8) 172 is supplied by the tape feeder 134, and the electronic component 172 is held by the suction nozzle of the mounting head 136.
  • the electronic component 172 is composed of a component body 176 and two electrodes 178 arranged on the lower surface of the component body 176.
  • the mounting head 136 is then moved by the moving device 138, and the electronic component 172 held by the suction nozzle is mounted so as to be electrically connected to the wiring 162 inside the cavity 154, as shown in FIG. 8.
  • the electronic component 172 is mounted so that the electrode 178 of the electronic component 172 contacts the bump 168 formed on the wiring 162.
  • the component body 176 of the electronic component 172 comes into contact with the thermosetting resin 170 dispensed between the wiring 162. That is, the conductive paste 166 is dispensed at the intended mounting position of the electrode 178 on the wiring 162, and the thermosetting resin 170 is dispensed at the intended mounting position of the component body 176. Therefore, by mounting the electronic component 172, the electrode 178 comes into contact with the bump 168 formed on the wiring 162, and the component body 176 comes into contact with the thermosetting resin 170.
  • thermosetting resin 170 that comes into contact with the component body 176 is sealed between the component body 176 and the resin laminate 152. That is, the thermosetting resin 170 is sealed between the upper surface of the resin laminate 152 and the lower surface of the component body 176.
  • the stage 52 is moved below the pressing unit 26. Then, in the pressing portion 120 of the pressing unit 26, the electronic component 172 is pressed from above downward by the pressing plate 122 via the rubber plate 124, as shown in FIG. 9. Also, while the electronic component 172 is being pressed in the pressing unit 26, the resin laminate 152 is heated by the heater 66 built into the base 60. As a result, the thermosetting resin 170 is heated via the resin laminate 152 and hardens. In this manner, the electronic component 172 is pressed by the pressing plate 122, so that the component body 176 and the thermosetting resin 170 come into close contact with each other, and the electrodes 178 and the bumps 168 come into close contact with each other.
  • the adhesive force of the thermosetting resin 170 fixes the electronic component 172 to the upper surface of the resin laminate 152 in the component body 176, and the adhesive force between the electrodes 178 and the bumps 168 ensures electrical connection between the electronic component 172 and the wiring 162.
  • the stage 52 is moved below the fourth modeling unit 25.
  • the dispenser 116 ejects the thermosetting resin 180 between the side of the component body 176 of the electronic component 172 and the cavity 154, as shown in FIG. 10.
  • the resin laminate 152 is heated by the heater 66 built into the base 60.
  • the thermosetting resin 180 is heated through the resin laminate 152 and hardened.
  • the thermosetting resin 180 hardens while covering the side of the component body 176.
  • thermosetting resins 170, 180 are sealed between the upper surface of the resin laminate 152 and the lower surface of the component body 176, and harden while covering the side of the component body 176. This fixes the electronic component 172 mounted inside the cavity 154 with the hardened resin.
  • the inkjet head 88 ejects the ultraviolet curing resin in a thin film so as to cover the resin laminate 157 and the electronic component 172.
  • the ultraviolet curing resin is flattened in the curing section 86 so that the film thickness of the ultraviolet curing resin becomes uniform.
  • the irradiation device 92 irradiates the thin film of ultraviolet curing resin with ultraviolet light. As a result, a resin layer 182 is formed on the resin laminate 157 and the electronic component 172, as shown in FIG. 11.
  • the inkjet head 88 ejects the ultraviolet curing resin in a thin film on the resin layer 182. That is, the inkjet head 88 ejects the ultraviolet curing resin in a thin film on the resin layer 182 so as to cover the resin laminate 157 and the electronic component 172.
  • the thin film of ultraviolet curing resin is then flattened by the flattening device 90, and the irradiation device 92 irradiates the ultraviolet curing resin ejected in a thin film with ultraviolet light, thereby laminating the resin layer 182 on the resin layer 182.
  • the resin laminate 186 is formed on the resin laminate 157 and the electronic component 172, and the electronic component 172 is encapsulated inside the resin laminates 152, 157, and 186.
  • the circuit forming device 10 forms a circuit board 190 that incorporates an electronic component 172 electrically connected to the wiring 162.
  • the electronic component 172 is contained in a state of being in close contact with the resin laminate 186 and the thermosetting resins 170 and 180.
  • the lower surface and lower side of the electronic component 172 are in close contact with the thermosetting resins 170 and 180, and the upper surface and upper side of the electronic component 172 are in close contact with the resin laminate 186.
  • a circuit board incorporating the electronic component 172 is formed with a space between the electronic component 172 and the resin laminate.
  • a thermosetting resin 180 is discharged between the cavity 154 of the resin laminate 152 on which the electronic component 172 is mounted and the side surface of the electronic component 172, and after the thermosetting resin 180 is cured, the stage 52 is moved below the second modeling unit 23. Then, in the second modeling unit 23, as shown in FIG. 12, a resin laminate 200 is formed on the resin laminate 157. More specifically, the inkjet head 88 discharges the ultraviolet curing resin in a thin film on the upper surface of the resin laminate 157.
  • the ultraviolet curing resin is discharged in a thin film
  • the ultraviolet curing resin is flattened in the curing section 86 so that the film thickness of the ultraviolet curing resin is uniform.
  • the irradiation device 92 irradiates the thin ultraviolet curing resin with ultraviolet light.
  • a resin layer 202 is formed on the resin laminate 157. Note that since the UV-curable resin is dispensed only onto the resin laminate 157, the resin layer 202 is not formed on the electronic components 172 and the thermosetting resin 180.
  • the inkjet head 88 ejects the ultraviolet curing resin in a thin film on the resin layer 202.
  • the thin ultraviolet curing resin is then flattened by the flattening device 90, and the irradiation device 92 irradiates the ultraviolet curing resin ejected in a thin film with ultraviolet light, thereby laminating the resin layer 202 on the resin layer 202.
  • the ejection of the ultraviolet curing resin on the resin layer 202 and the irradiation of ultraviolet light are repeated, and a plurality of resin layers 202 are laminated to form the resin laminate 200.
  • the resin laminate 200 having an opening through which the electronic component 172 is exposed is formed.
  • the height dimension of the resin laminate 200 is set so that the upper surface of the resin laminate 200 is higher than the upper surface of the electronic component 172.
  • the resin laminate 200 is formed, which functions as a wall higher than the upper surface of the electronic component 172 so as to surround the side of the electronic component 172.
  • the opening in the resin laminate 200 where the electronic component 172 is exposed is formed in a stepped shape, and a stepped surface 206 located below the top surface of the resin laminate 200 is formed in the opening in the resin laminate 200.
  • the top surface of the resin laminate 200 is located above the top surface of the electronic component 172, and the stepped surface 206 is also located above the top surface of the electronic component 172.
  • a lid member (see FIG. 14) 210 is supplied by a tray-type supply device in the supply section 130.
  • the lid member 210 is formed in the second modeling unit 23 before the formation of the circuit board is performed.
  • the lid member 210 is a flat plate-shaped member, and the inkjet head 88 ejects the ultraviolet curing resin in a thin film on the upper surface of the base 60. At this time, the inkjet head 88 ejects the ultraviolet curing resin in a generally rectangular shape.
  • the outer dimensions of the ultraviolet curing resin ejected in this rectangular shape are larger than the inner edge of the step surface 206 of the resin laminate 200 described above and smaller than the outer edge.
  • the ultraviolet curing resin is flattened in the curing section 86 so that the film thickness of the ultraviolet curing resin is uniform.
  • the irradiation device 92 irradiates the rectangular ultraviolet curing resin with ultraviolet rays. This forms a rectangular resin layer 212.
  • the inkjet head 88 discharges the ultraviolet curing resin in a thin film on the resin layer 212.
  • the flattening device 90 flattens the thin ultraviolet curing resin, and the irradiation device 92 irradiates the thin ultraviolet curing resin with ultraviolet rays, thereby laminating the resin layer 212 on the resin layer 212.
  • the discharge of the ultraviolet curing resin on the resin layer 212 and the irradiation of ultraviolet rays are repeated, and a plurality of resin layers 212 are laminated, forming a lid member 210 with an outer dimension larger than the inner edge of the step surface 206 of the resin laminate 200 and smaller than the outer edge.
  • the thickness dimension of the lid member 210 is approximately the same as the difference in height between the top surface of the resin laminate 200 and the step surface 206.
  • the lid member 210 formed by the above-mentioned method is stored in a tray of a tray-type supply device before the formation of the circuit board is performed.
  • the lid member 210 is held by the suction nozzle of the mounting head 136 from the tray of the tray-type supply device in the supply section 130.
  • the mounting head 136 is then moved by the moving device 138, and the lid member 210 held by the suction nozzle is placed on the step surface 206 of the resin laminate 200, as shown in Figures 15 and 16.
  • the outer dimensions of the lid member 210 are larger than the inner edge and smaller than the outer edge of the step surface 206, and therefore, by placing the lid member 210 on the step surface 206, the entire opening of the step surface 206 is blocked by the lid member 210.
  • the step surface 206 is located above the upper surface of the electronic component 172, the entire opening of the step surface 206 is blocked by the lid member 210 with a clearance between the lid member 210 and the upper surface of the electronic component 172.
  • the electronic component 172 is covered by the lid member 210 inside the resin laminate 200 with a clearance between the lid member 210 and the upper surface of the electronic component 172.
  • the stage 52 is moved below the second modeling unit 23.
  • a resin laminate 220 is formed on the resin laminate 200 and the lid member 210.
  • the inkjet head 88 ejects ultraviolet curing resin in a thin film so as to cover the resin laminate 200 and the lid member 210.
  • the ultraviolet curing resin is flattened in the curing section 86 so that the film thickness of the ultraviolet curing resin becomes uniform.
  • the irradiation device 92 irradiates the thin film of the ultraviolet curing resin with ultraviolet light.
  • the lid member 210 that covers the electronic component 172 is formed from the same material as the resin laminates 152, 157, 200, and 220, that is, ultraviolet curing resin. Therefore, in the circuit board 230, the thermal expansion coefficients of the lid member 210 and the resin laminates 152, 157, 200, and 220 are the same, and the lid member 210 and the resin laminates 152, 157, 200, and 220 become an integrated member. This also makes it possible to further increase the reliability of the circuit board 230. Furthermore, since the lid member 210 is formed by the circuit forming device 10, the opening of the step surface 206 is blocked by the lid member 210 that corresponds to the shape of the step surface 206 of the resin laminate 200, so that the electronic component 172 can be appropriately covered.
  • the controller 140 of the control device 28 has a component placement section 250, a wall forming section 252, a lid member forming section 254, a covering section 256, and a resin layer forming section 258, as shown in FIG. 2.
  • the component placement section 250 is a functional section for placing the electronic component 172 inside the cavity 154 of the resin laminate 157.
  • the wall forming section 252 is a functional section for forming a resin laminate 200 higher than the upper surface of the electronic component 172 so as to surround the side of the electronic component 172.
  • the lid member forming section 254 is a functional section for forming the lid member 210 with ultraviolet curing resin before forming the circuit board 230.
  • the covering section 256 is a functional section for covering the electronic component 172 by placing the lid member 210 on the step surface 206 of the resin laminate 200.
  • the resin layer forming section 258 is a functional section for forming the resin laminate 220 that fixes the lid member 210.
  • the circuit forming device 10 is an example of a circuit forming device.
  • the second modeling unit 23 is an example of a forming device.
  • the mounting unit 27 is an example of a mounting device.
  • the control device 28 is an example of a control device.
  • the resin laminate 152 is an example of a base.
  • the resin laminate 200 is an example of a wall.
  • the lid member 210 is an example of a lid member.
  • the resin laminate 220 is an example of a resin layer.
  • the process and processing performed by the component mounting unit 250 are an example of a component mounting process and a component mounting process.
  • the process and processing performed by the wall forming unit 252 are an example of a wall forming process and a wall forming process.
  • the process and processing performed by the lid member forming unit 254 are an example of a lid member forming process and a lid member forming process.
  • the process and processing performed by the covering unit 256 are an example of a covering process and a covering process.
  • the process and processing performed by the resin layer forming unit 258 are an example of a resin layer forming process and a resin layer forming process.
  • a cover member 270 with outer dimensions larger than the inner edge and smaller than the outer edge of the step surface 262 of the resin laminate 260 is formed before the formation of the circuit board. Then, by placing a lid member 270 on the step surface 262 of the resin laminate 260, the multiple electronic components 172 mounted inside the cavity 154 are collectively covered by the lid member 270. Furthermore, by forming a resin laminate (not shown) so as to cover the lid member 270 and the resin laminate 260, a circuit board is formed that incorporates multiple electronic components 172 with a space therebetween. In this way, by collectively covering the multiple electronic components 172 with a single lid member 270, a circuit board can be formed efficiently.
  • the electronic component 172 is covered by the flat lid member 210, but as shown in FIG. 19, the electronic component 172 may be covered by a lid member 282 having a convex portion 280.
  • the lid member 282 is composed of a flat portion 284 having the same shape as the lid member 210, and a convex portion 280 formed around the entire outer edge of the flat portion 284. Meanwhile, a concave portion 290 having an inner dimension slightly larger than the outer dimension of the convex portion 280 is formed on the step surface 206 of the resin laminate 200. Then, the lid member 282 is placed on the step surface 206 so that the convex portion 280 of the lid member 282 fits into the concave portion 290 of the step surface 206.
  • the entire lid member 210 is covered by the resin laminate 220, but since it is only necessary that the lid member 210 is fixed in place while covering the electronic component 172, for example, the edge of the lid member 210 may be covered by the resin laminate.
  • a resin laminate 300 may be formed on top of the resin laminate 200 to cover the edge of the lid member 210 while leaving the center of the lid member 210 exposed, so that the lid member 210 is fixed by the resin laminate 300.
  • the lid member 210 is formed from an ultraviolet curing resin, but it may be formed from various resins such as a thermosetting resin. Furthermore, it is not limited to resin, and the lid member 210 may be formed from a metal ink or the like. Furthermore, the lid member 210 is formed in the circuit forming device 10, but it may be formed in a device other than the circuit forming device 10.
  • the electronic component 172 is built into the circuit board 230 with a space therebetween, but components other than the electronic component 172, for example, components that constitute the circuit board without being energized, specifically various components such as screws and bolts, may be built into the circuit board with a space therebetween.
  • Circuit forming device 23 Second modeling unit (forming device) 27: Mounting unit (mounting device) 28: Control device 152: Resin laminate (base) 200: Resin laminate (wall) 210: Lid member 220: Resin laminate (resin layer) 250: Part placement section (part placement process) (part mounting process) 252: Wall forming section (wall formation process) (wall formation process) 254: Lid member forming section (lid member formation process) (lid member formation process) 256: Covering section (covering process) (covering process) 258: Resin layer forming section (resin layer formation process) (resin layer formation process) (resin layer formation process)

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
PCT/JP2023/019697 2023-05-26 2023-05-26 回路形成方法、および回路形成装置 Ceased WO2024246986A1 (ja)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61152045A (ja) * 1984-12-26 1986-07-10 Hitachi Micro Comput Eng Ltd ピギ−バツクパツケ−ジ
JPH0722730A (ja) * 1993-07-06 1995-01-24 Murata Mfg Co Ltd 複合電子部品
JPH09102559A (ja) * 1995-10-04 1997-04-15 Mitsubishi Electric Corp 半導体装置及びその製造方法
JP7176103B2 (ja) * 2019-03-29 2022-11-21 京セラ株式会社 電子素子実装用基板、および、電子装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61152045A (ja) * 1984-12-26 1986-07-10 Hitachi Micro Comput Eng Ltd ピギ−バツクパツケ−ジ
JPH0722730A (ja) * 1993-07-06 1995-01-24 Murata Mfg Co Ltd 複合電子部品
JPH09102559A (ja) * 1995-10-04 1997-04-15 Mitsubishi Electric Corp 半導体装置及びその製造方法
JP7176103B2 (ja) * 2019-03-29 2022-11-21 京セラ株式会社 電子素子実装用基板、および、電子装置

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