JPWO2024246986A1 - - Google Patents
Info
- Publication number
- JPWO2024246986A1 JPWO2024246986A1 JP2025523635A JP2025523635A JPWO2024246986A1 JP WO2024246986 A1 JPWO2024246986 A1 JP WO2024246986A1 JP 2025523635 A JP2025523635 A JP 2025523635A JP 2025523635 A JP2025523635 A JP 2025523635A JP WO2024246986 A1 JPWO2024246986 A1 JP WO2024246986A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2023/019697 WO2024246986A1 (ja) | 2023-05-26 | 2023-05-26 | 回路形成方法、および回路形成装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2024246986A1 true JPWO2024246986A1 (https=) | 2024-12-05 |
Family
ID=93656887
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025523635A Pending JPWO2024246986A1 (https=) | 2023-05-26 | 2023-05-26 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2024246986A1 (https=) |
| WO (1) | WO2024246986A1 (https=) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61152045A (ja) * | 1984-12-26 | 1986-07-10 | Hitachi Micro Comput Eng Ltd | ピギ−バツクパツケ−ジ |
| JPH0722730A (ja) * | 1993-07-06 | 1995-01-24 | Murata Mfg Co Ltd | 複合電子部品 |
| JP3292798B2 (ja) * | 1995-10-04 | 2002-06-17 | 三菱電機株式会社 | 半導体装置 |
| US12249546B2 (en) * | 2019-03-29 | 2025-03-11 | Kyocera Corporation | Electronic element mounting substrate and electronic device |
-
2023
- 2023-05-26 WO PCT/JP2023/019697 patent/WO2024246986A1/ja not_active Ceased
- 2023-05-26 JP JP2025523635A patent/JPWO2024246986A1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024246986A1 (ja) | 2024-12-05 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20260326 |