WO2024245288A1 - 显示模组及其制备方法、显示装置 - Google Patents

显示模组及其制备方法、显示装置 Download PDF

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Publication number
WO2024245288A1
WO2024245288A1 PCT/CN2024/096077 CN2024096077W WO2024245288A1 WO 2024245288 A1 WO2024245288 A1 WO 2024245288A1 CN 2024096077 W CN2024096077 W CN 2024096077W WO 2024245288 A1 WO2024245288 A1 WO 2024245288A1
Authority
WO
WIPO (PCT)
Prior art keywords
display
area
circuit board
flexible circuit
display panel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2024/096077
Other languages
English (en)
French (fr)
Inventor
李少鹏
李汶泽
邓豪
张卫本
范荣坤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
Chengdu BOE Optoelectronics Technology Co Ltd
Original Assignee
BOE Technology Group Co Ltd
Chengdu BOE Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BOE Technology Group Co Ltd, Chengdu BOE Optoelectronics Technology Co Ltd filed Critical BOE Technology Group Co Ltd
Priority to US18/992,180 priority Critical patent/US20260013384A1/en
Publication of WO2024245288A1 publication Critical patent/WO2024245288A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/8794—Arrangements for heating and cooling
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • G09F9/335—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes being organic light emitting diodes [OLED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
    • H05K7/20963—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/90—Assemblies of multiple devices comprising at least one organic light-emitting element
    • H10K59/95—Assemblies of multiple devices comprising at least one organic light-emitting element wherein all light-emitting elements are organic, e.g. assembled OLED displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

Definitions

  • the present disclosure relates to the field of display technology, and in particular to a display module and a preparation method thereof, and a display device.
  • the foldable display module generally includes: a display panel having a display area, a bending area and a non-display area, a plurality of pixels located in the display area, and a flexible circuit board and a driver chip located in the non-display area.
  • the non-display area can be bent to the side of the display area away from the light-emitting surface of the display panel through the bending area.
  • the flexible circuit board and the driver chip work together to light up the plurality of pixels, thereby driving the display panel to display the picture.
  • the driver chip is generally covered by the flexible circuit board.
  • the present disclosure provides a display module and a manufacturing method thereof, and a display device, and the technical solution is as follows:
  • a display module comprising:
  • the display panel comprises a display area, a bending area and a non-display area connected in sequence, wherein the non-display area is bent through the bending area to a side of the display area away from a light emitting surface of the display panel;
  • a flexible circuit board is located at a side of the non-display area away from the display area, and in a first direction, the flexible circuit board has a groove area exposing the non-display area;
  • a driving chip located on a side of the non-display area away from the display area, and located in a slotted area of the flexible circuit board, and spaced apart from the flexible circuit board in a second direction, wherein the second direction intersects the first direction;
  • the heat conducting structure is located in the gap between the driver chip and the flexible circuit board and is in contact with the driver chip.
  • the chip and the flexible circuit board are in contact with each other.
  • the heat-conducting structure includes heat-conducting glue.
  • the orthographic projection of the heat-conducting structure on the display panel covers the orthographic projection of the driving chip on the display panel.
  • the non-display area includes: a first binding area and a second binding area spaced apart from each other in the second direction, and the first binding area is farther away from the bending area than the second binding area;
  • the flexible circuit board is bound and connected to the display panel in the first binding area, and the groove area of the flexible circuit board exposes the second binding area;
  • the driving chip is located at a side of the second binding area away from the display area, and is bound and connected to the display panel in the second binding area.
  • the heat-conducting structure is also located between the flexible circuit board and the non-display area.
  • a cross section of the heat conducting structure includes an arc edge.
  • the display module further includes:
  • a first back film, a support layer, and a second back film located between the display area and the non-display area and sequentially stacked along the first direction;
  • the support layer has at least one first groove, and the orthographic projection of the at least one first groove on the display panel overlaps with the orthographic projection of the heat-conducting structure on the display panel.
  • the display module further includes:
  • a first adhesive layer located between the first backing film and the support layer, and used for bonding the first backing film and the support layer;
  • a second adhesive layer located between the second backing film and the support layer, and used for bonding the second backing film and the support layer;
  • the material of the first adhesive layer includes a flexible material
  • the material of the second adhesive layer includes: a non-flexible material
  • the second adhesive layer has at least one second groove, and an orthographic projection of the at least one second groove on the display panel overlaps with an orthographic projection of the heat conducting structure on the display panel.
  • the display module further includes:
  • the heat-conducting reinforcement layer is located between the support layer and at least one of the first backing film and the second backing film.
  • the thermally conductive reinforcement layer is located between the support layer and the second backing film, and The second bonding layer is bonded to the support layer;
  • the thermally conductive reinforcement layer has at least one third groove, and an orthographic projection of the at least one third groove on the display panel overlaps with an orthographic projection of the thermally conductive structure on the display panel.
  • the support layer has a plurality of first grooves spaced apart from each other along the second direction, the plurality of first grooves are located on a side of the support layer close to the flexible circuit board in the first direction, and the orthographic projections of the plurality of first grooves on the display panel overlap with the orthographic projection of the heat conducting structure on the display panel;
  • the second adhesive layer has a second groove, the second groove penetrates the second adhesive layer in the first direction, and the orthographic projection of the second groove on the display panel is located within the orthographic projection of the heat conductive structure on the display panel;
  • the thermally conductive reinforcement layer has a plurality of third grooves spaced apart from each other along the second direction, the plurality of third grooves are located in the middle of the thermally conductive reinforcement layer in the first direction, and the orthographic projections of the plurality of third grooves on the display panel cover the orthographic projections of the thermally conductive structure on the display panel.
  • the support layer has a plurality of first slots
  • the thermally conductive reinforcement layer has a plurality of third slots; and the plurality of first slots and the plurality of third slots are arranged in any of the following ways:
  • the plurality of first slots and the plurality of third slots are sequentially arranged along the second direction and the third direction, and in any direction, the orthographic projections of the plurality of first slots and the plurality of third slots on the display panel are staggered;
  • the plurality of first slots and the plurality of third slots are sequentially arranged along the second direction and the third direction, and the plurality of first slots and the plurality of third slots correspond to each other one by one, and their orthographic projections on the display panel overlap with each other;
  • the plurality of first grooves are arranged in sequence along the third direction, the plurality of third grooves are arranged in sequence along the second direction, and the orthographic projections of the plurality of first grooves and the plurality of third grooves on the display panel overlap with each other;
  • the third direction intersects the second direction in the same plane, and both intersect the first direction in different planes.
  • any one of the first slot, the second slot and the third slot is The orthographic projection on the display panel is hexagonal or rectangular.
  • the material of the first adhesive layer includes: polyimide; the material of the bracket layer includes: stainless steel or metallic copper; the material of the second adhesive layer includes: polyethylene terephthalate; and the material of the thermal conductive reinforcement layer includes: metallic copper.
  • the flexible circuit board includes:
  • a plurality of protective layers and metal wiring layers are alternately stacked along the first direction, and the material of the metal wiring layers includes: metal copper.
  • the display module further includes:
  • the connecting portion is located between the flexible circuit board and the non-display area and is used to connect the flexible circuit board and the display panel.
  • the display module further includes:
  • the double-sided adhesive tape covers the surface of the bending area away from the display area and the non-display area, and is used to protect the bending area.
  • a method for preparing a display module for preparing the display module as described in the above aspect; the method comprises:
  • a display panel is provided, wherein the display panel has a display area, a bending area and a non-display area connected in sequence, and the non-display area is bent through the bending area to a side of the display area away from a light emitting surface of the display panel;
  • a heat-conducting structure is formed in a gap between the driving chip and the flexible circuit board, and the heat-conducting structure is in contact with both the driving chip and the flexible circuit board.
  • a display module comprising:
  • the display panel comprises a display area, a bending area and a non-display area connected in sequence, wherein the non-display area is bent through the bending area to a side of the display area away from a light emitting surface of the display panel;
  • a flexible circuit board is located at a side of the non-display area away from the display area and is bound and connected to the non-display area, and in a first direction, the flexible circuit board has a groove area exposing the non-display area;
  • a driving chip is located in the slotted area of the flexible circuit board and is bound and connected to the non-display area, and In the second direction, any side wall of the driving chip and any side wall of the flexible circuit board are spaced from each other, and the second direction intersects with the first direction;
  • the heat-conducting structure is located in the interval between the driving chip and the flexible circuit board, and is in contact with the driving chip, the flexible circuit board and the non-display area.
  • a display device comprising: a power supply component, and the display module as described in the above one aspect and the further aspect;
  • the power supply component is coupled to the display module and is used to supply power to the display module.
  • FIG1 is a schematic diagram of a film structure of a display module provided by an embodiment of the present disclosure.
  • FIG2 is a schematic diagram of an unfolded plan view of a display panel in a display module provided by an embodiment of the present disclosure
  • FIG3 is a schematic diagram of a partial film layer structure of a display module provided by an embodiment of the present disclosure
  • FIG4 is a schematic diagram of a partial film layer structure of another display module provided by an embodiment of the present disclosure.
  • FIG5 is a schematic diagram of a partial film layer structure of another display module provided by an embodiment of the present disclosure.
  • FIG6 is a schematic diagram of a film layer structure of another display module provided in an embodiment of the present disclosure.
  • FIG7 is a schematic diagram of a partial film structure of another display module provided by an embodiment of the present disclosure.
  • FIG8 is a schematic diagram of slot arrangement in a display module provided by an embodiment of the present disclosure.
  • FIG9 is a schematic diagram of another slot arrangement in a display module provided by an embodiment of the present disclosure.
  • FIG10 is a schematic diagram of another slot arrangement in a display module provided by an embodiment of the present disclosure.
  • FIG11 is a flow chart of a method for preparing a display module provided by an embodiment of the present disclosure.
  • FIG12 is a flow chart of a manufacturing process of a display module provided by an embodiment of the present disclosure.
  • FIG. 13 is a schematic diagram of the structure of a display device provided in an embodiment of the present disclosure.
  • the embodiment of the present disclosure provides a display module that can solve the display abnormality caused by the heating problem.
  • Fig. 1 is a schematic diagram of the structure of a display module provided by an embodiment of the present disclosure.
  • the display module includes: a display panel 01, a flexible printed circuit (FPC) 02, a driving chip 03, and a heat conduction structure 04.
  • FPC flexible printed circuit
  • Figure 2 shows a plan schematic diagram of the display panel 01 when it is in an unfolded state.
  • the display panel 01 has a display area A1, a bending area A2, and a non-display area A3 that are connected in sequence, and the non-display area A3 is bent through the bending area A2 to the side of the display area A1 away from the light-emitting surface of the display panel 01.
  • the display area A1, the bending area A2, and the non-display area A3 of the display panel 01 belong to different parts of the same substrate in the display panel 01.
  • the display area A1 can also be bent like the bending area A2, and the form shown in Figure 1 is only illustrated by taking the display area A1 as an example without being bent.
  • the light-emitting surface of the display panel 01 refers to the side that displays the image.
  • the side away from the light-emitting surface of the display panel 01 can also be called the backlight surface of the display panel 01.
  • the side of the display area A1 can be the light-emitting surface for displaying the image
  • the side of the non-display area A3 can be the backlight surface that does not display the image
  • the bending area A2 can be partially or completely used to display the image, or of course, it can also not display the image.
  • This type of display module is usually used in foldable display products, such as foldable mobile phones.
  • the display panel 01 described in the embodiment of the present disclosure may be an organic light-emitting diode (OLED) display panel.
  • the display panel 01 may also include a plurality of pixels.
  • Each pixel includes a pixel circuit and a light-emitting element, and the pixel circuit is coupled to the light-emitting element and is used to drive the light-emitting element to emit light.
  • the light-emitting element is an OLED including an anode, a light-emitting layer and a cathode stacked in sequence, and the light-emitting layer has a light-emitting material for emitting light of a corresponding color.
  • the flexible circuit board 02 is located on the side of the non-display area A3 away from the display area A1, and in the first direction Z shown in FIG. 1 , the flexible circuit board 02 may have a slot area (also referred to as an opening area) B1 exposing the non-display area A3. That is, as shown in FIG. 1 , the flexible circuit board 02 may be disposed on the backlight surface of the display panel 01 and divided into two by the slot area B1, so that the non-display area A3 is exposed.
  • a slot area also referred to as an opening area
  • the driver chip 03 i.e., the integrated circuit (IC)
  • the chip is located on a side of the non-display area A3 away from the display area A1, and is located in the slot area B1 of the flexible circuit board 02, and is spaced apart from the flexible circuit board 02 in the second direction X. That is, in the embodiment of the present disclosure, the driving chip 03 can be disposed on the backlight surface of the display panel 01 like the flexible circuit board 02, and can be located in the slot area B1 of the flexible circuit board 02, and is spaced apart from the flexible circuit board 02.
  • the driver chip 03 can be exposed in the slot area B1, and interact with the outside world to provide a heat dissipation path for the driver chip 03, so that the driver chip 03 can be better dissipated, which can prevent the driver chip 03 from getting hot after working for a long time, and further prevent the light-emitting material at the corresponding position of the driver chip 03 from being damaged by high temperature.
  • the driver chip 03 can be electrically connected to the pixel circuit recorded in the above embodiment, and is used to drive the pixel circuit to control the light-emitting element to emit light.
  • the second direction X intersects the first direction Z.
  • the first direction Z may be a direction perpendicular to the carrying surface of the display panel 01
  • the second direction X may be a direction parallel to the carrying surface of the display panel 01 .
  • the second direction X and the first direction Z may be perpendicular to each other as shown in FIG1 .
  • the heat-conducting structure 04 is located in the gap between the driver chip 03 and the flexible circuit board 02, and is in contact with both the driver chip 03 and the flexible circuit board 02. That is, in the embodiment of the present disclosure, the heat-conducting structure 04 capable of conducting heat can also be filled between the gap between the driver chip 03 and the flexible circuit board 02, and the heat-conducting structure 04 at least wraps the side wall of the driver chip 03 and is in contact with the hole wall of the slot area B1 of the flexible circuit board 02.
  • a better heat dissipation path can be further provided for the driver chip 03, so that the heat on the driver chip 03 can be conducted through the heat-conducting structure 04, and evenly dispersed to the flexible circuit board 02, and heat interaction with the outside world can be carried out through the flexible circuit board 02. That is, it can further enable better heat dissipation for the driver chip 03, avoid the driver chip 03 from getting seriously hot after working for a long time, and then avoid the light-emitting material at the corresponding position of the driver chip 03 from being damaged by high temperature.
  • the slot area B1 and filling the heat-conducting structure 04 it is possible to effectively avoid the display abnormality problem such as yellowing at the corresponding position of the driver chip 03 on the display panel 01.
  • the embodiments of the present disclosure provide a display module.
  • the flexible circuit board located in the non-display area where the bending area is bent to the side of the display area away from the light-emitting surface has a groove area that exposes the non-display area.
  • the driver chip is located in the groove area and is spaced apart from the flexible circuit board.
  • a heat-conducting structure is filled in the space between the driver chip and the flexible circuit board. In this way, the driver chip can be better dissipated to avoid the problem of abnormal pixel brightness at the corresponding position of the driver chip due to the driver chip becoming hot after working for a long time, thereby avoiding the display panel in the display module from having similar yellowing.
  • the display abnormality problem can be solved to ensure that the display effect of the display panel is better.
  • the flexible circuit board 02 described in the embodiment of the present disclosure may include: a plurality of protective layers 021 and metal wiring layers 022 alternately stacked along a first direction Z (eg, a direction away from the non-display area A3).
  • the two parts of the flexible circuit board 02 divided into two by the slot area B1 can include multiple groups of sequentially stacked protective layers 021 and metal wiring layers 022.
  • the heat-conducting structure 04 can connect the driver chip 03 and the metal wiring layer 022 of the flexible circuit board 02, at least increase the heat diffusion in the first direction Z and the second direction X, so that the heat of the driver chip 03 can be reliably extracted through the metal wiring layer 022, and the heat can be evenly distributed on the flexible circuit board 02, effectively interact with the outside world, and achieve reliable heat dissipation of the driver chip 03.
  • the protective layer 021 may be solder resist ink, such as green solder resist ink, also known as green oil.
  • the material of the metal wiring layer 022 may include: metal copper Cu, and accordingly, the metal wiring layer 022 may also be called a Cu foil wiring layer. Since the metal copper Cu has a good heat dissipation capacity, the heat transferred by the heat conductive structure 04 can be further reliably conducted out.
  • the heat-conducting structure 04 described in the embodiment of the present disclosure may include heat-conducting glue. That is, the heat-conducting glue may be filled between the driver chip 03 and the flexible circuit board 02 in the slot area B1 to conduct heat away from the driver chip 03.
  • the heat-conducting glue as the heat-conducting structure 04 for filling, the strength of the driver chip 03 may be enhanced, and the process reliability of the display module may be improved.
  • the heat conducting structure 04 may only wrap the left and right side walls of the driver chip 03 in the slot area B1 .
  • the orthographic projection of the heat-conducting structure 04 recorded in the embodiment of the present disclosure on the display panel 01 can cover the orthographic projection of the driver chip 03 on the display panel 01. That is, the heat-conducting structure 04 can not only wrap the left and right side walls of the driver chip 03 in the slot area B1, but also wrap the upper side of the driver chip 03 in the slot area B1 (that is, the side of the upper and lower sides of the driver chip 03 away from the non-display area A3). In this way, the heat-conducting area can be expanded to further ensure reliable heat dissipation of the driver chip 03.
  • the non-display area A3 recorded in the embodiment of the present disclosure may include: a first binding area A31 and a second binding area A32 spaced apart from each other in the second direction X, and the first binding area A31 is away from the bending area A2 relative to the second binding area A32.
  • the flexible circuit board 02 is connected to the display panel 01 in the first binding area A31, and the slot area B1 of the flexible circuit board 02 exposes the second binding area A32.
  • the driver chip 03 is located on the side of the second binding area A32 away from the display area A1, and is connected to the display panel 01 in the second binding area A32.
  • the flexible circuit board 02 can be electrically connected to the conductive pad P1 on the side of the first binding area A31 away from the display area A1 through a binding member B2 (such as binding glue), thereby achieving a binding connection with the display panel 01.
  • a binding member B2 such as binding glue
  • the heat-conducting structure 04 provided in the embodiment of the present disclosure can also be located between the flexible circuit board 02 and the non-display area A3. That is, the heat-conducting structure 04 similar to the heat-conducting glue can also be filled into the gap between the flexible circuit board 02 and the non-display area A3 of the display panel 01. In this way, a larger heat dissipation area can be further ensured, so that the heat dissipation effect is better.
  • the cross section of the heat conducting structure 04 may include an arc edge.
  • the arc edge may be concave toward the direction close to the non-display area A3; or, the arc edge may be convex toward the direction away from the non-display area A3.
  • the arc edge of the heat-conducting structure 04 shown therein protrudes in the direction away from the non-display area A3 in the first direction Z, and accordingly, the cross-section of the heat-conducting structure 04 can be considered to be semicircular.
  • the arc edge of the heat-conducting structure 04 shown therein is recessed in the direction close to the non-display area A3 in the first direction Z, and accordingly, the cross-section of the heat-conducting structure 04 can be considered to be a rectangle with concave edges.
  • the concave edge can be one of the sides of the rectangular heat-conducting structure 04, which is away from the non-display area A3 (i.e., the upper side of the driver chip 03), and the concave edge is recessed in the direction close to the non-display area A3.
  • the above is only a schematic description of the shape of the heat-conducting structure 04, and does not limit the shape of the heat-conducting structure 04.
  • FIG6 is a schematic diagram of the structure of another display module provided by an embodiment of the present disclosure.
  • the display module recorded in the embodiment of the present disclosure may also include: a first back film (U-Film) 05, a bracket (BKT) layer 06, and a second back film 07, which are located between the display area A1 and the non-display area A3 and are stacked in sequence along a first direction Z (e.g., a direction away from the display area A1).
  • a first back film U-Film
  • BKT bracket
  • second back film 07 which are located between the display area A1 and the non-display area A3 and are stacked in sequence along a first direction Z (e.g., a direction away from the display area A1).
  • the support layer 06 may have at least one first slot K1, and the orthographic projection of the at least one first slot K1 on the display panel 01 may overlap with the orthographic projection of the heat conducting structure 04 on the display panel 01. That is, the embodiment of the present disclosure may perform slotting processing on the support layer 06 included in the display module.
  • the support layer 06 shown therein has a plurality of first slots K1 spaced apart from each other along the second direction X (four first slots K1 are schematically shown in FIG. 6 ), and the plurality of first slots K1
  • the support layer 06 is located on one side close to the flexible circuit board 02 in the first direction Z, and the orthographic projections of the plurality of first slots K1 on the display panel 01 just overlap with the orthographic projections of the heat conducting structure 04 on the display panel 01 .
  • the contact area between the driver chip 03 and the display panel 01 in the first direction Z can be reduced, thereby reducing the temperature propagation in the first direction Z, thereby further facilitating the heat dissipation of the driver chip 03 .
  • the material of the support layer 06 may include: stainless steel (SUS) or metal copper Cu. Since both stainless steel SUS and metal copper Cu have good thermal conductivity, the heat conduction of the driver chip 03 can be better achieved on the basis of achieving good heat dissipation by slotting.
  • the display module described in the embodiment of the present disclosure may further include: a first adhesive layer 08 and a second adhesive layer 09 .
  • the first adhesive layer 08 may be located between the first back film 05 and the support layer 06 , and may be used to bond the first back film 05 and the support layer 06 .
  • the second adhesive layer 09 may be located between the second backing film 07 and the support layer 06 , and may be used to bond the second backing film 07 and the support layer 06 .
  • the material of the first adhesive layer 08 may include a flexible material, such as polyimide (PI).
  • the material of the second adhesive layer 09 may include a non-flexible material, such as polyethylene terephthalate (PET). Accordingly, the first adhesive layer 08 may also be called PI glue, and the second adhesive layer 09 may also be called a PET glue, which is a kind of flexible tape (bending tape).
  • the second adhesive layer 09 with greater strength on one side of the support layer 06 may also be grooved, so that the second adhesive layer 09 has at least one second groove K2, and the orthographic projection of at least one second groove K2 on the display panel 01 may overlap the orthographic projection of the heat-conducting structure 04 on the display panel 01.
  • a groove may also be provided on the first adhesive layer 08.
  • the first adhesive layer 08 is provided as a flexible material in order to protect the display panel 01.
  • the second adhesive layer 09 shown therein has a second groove K2, and the second groove K2 penetrates the second adhesive layer 09 in the first direction Z (correspondingly, the second groove K2 can also be called a through groove), and the orthographic projection of the second groove K2 on the display panel 01 is located within the orthographic projection of the thermal conductive structure 04 on the display panel 01.
  • a second slot K2 (i.e., a through slot) on the second adhesive layer 09 as described in the above embodiment, It can facilitate air circulation, so that the heat emitted by the driver chip 03 can be taken away by the air flowing in the first slot K1, thereby reducing heat concentration and improving heat dissipation speed.
  • a through second slot K2 is also provided on the second adhesive layer 09.
  • This can reduce the contact area of the stacked layers in the first direction Z and reduce the temperature propagation in the first direction Z.
  • it can increase air circulation and reduce heat concentration, thereby effectively improving the heat dissipation speed and achieving uniform heat dissipation, thereby avoiding the driver chip 03 from heating up and causing yellowing display abnormalities at the corresponding position of the display panel 01.
  • the display module described in the embodiment of the present disclosure may further include: a thermal conductive reinforcement layer 010 .
  • the thermally conductive reinforcement layer 010 may be located between the support layer 06 and at least one of the first back film 05 and the second back film 07 .
  • the thermal conductive reinforcement layer 010 shown in FIG. 7 is located between the support layer 06 and the second back film 07 , and can be bonded to the support layer 06 via the second bonding layer 09 .
  • the material of the thermally conductive reinforcing layer 010 may include: metal copper Cu, and accordingly, the thermally conductive reinforcing layer 010 may also be called a reinforcing Cu sheet.
  • the material of the thermally conductive reinforcing layer 010 may also be other metal materials, such as stainless steel SUS.
  • the heat dissipation area in at least the second direction X can be further increased, the heat dissipation efficiency can be improved, and reliable heat dissipation of the driver chip 03 can be ensured.
  • the heat dissipation area in the third direction Y that is located in the same plane as the second direction X (e.g., a plane parallel to the bearing surface of the display panel 01) and intersects can also be increased, so that more heat can be diffused and released through the second direction X and the third direction Y, thereby improving the heat dissipation efficiency.
  • the thermal conductive reinforcement layer 010 may also be grooved, that is, the thermal conductive reinforcement layer 010 may have at least one third groove K3, and the orthographic projection of the at least one third groove K3 on the display panel 01 may also overlap with the orthographic projection of the thermal conductive structure 04 on the display panel 01.
  • the thermally conductive reinforcing layer 010 has a plurality of third slots K3 spaced from each other along the second direction X ( FIG7 schematically shows five third slots K3 ), and the plurality of third slots K3 are located in the middle of the thermally conductive reinforcing layer 010 in the first direction Z.
  • the middle of the thermally conductive reinforcing layer 010 in the first direction Z can be understood as being located on the central axis of the thermally conductive reinforcing layer 010 in the second direction X.
  • the orthographic projections of the plurality of third slots K3 on the display panel 01 cover the thermally conductive structure 04 on the display panel.
  • the contact area of the stacked layers in the first direction Z can be further reduced, the temperature propagation in the first direction Z can be reduced, and the heat dissipation area can be increased, so that the heat can be evenly spread, the heat dissipation efficiency can be further improved, and reliable heat dissipation of the driver chip 03 can be achieved.
  • first slot K1, the second slot K2 and the third slot K3 in FIG6 and FIG7 can be combined or independent.
  • the support layer 06 can also have only one first slot K1, instead of having four first slots K1 spaced apart from each other as shown in FIG6.
  • the plurality of first slots K1 i.e., the slots on the support layer 06
  • the plurality of third slots K3 i.e., the slots on the reinforcing Cu sheet 010 recorded in the embodiment of the present disclosure
  • the plurality of first slots K1 i.e., the slots on the support layer 06
  • the plurality of third slots K3 i.e., the slots on the reinforcing Cu sheet 010 recorded in the embodiment of the present disclosure
  • the plurality of first slots K1 and the plurality of third slots K3 may be arranged in sequence along the second direction X and the third direction Y, and in any direction, the orthographic projections of the plurality of first slots K1 and the plurality of third slots K3 on the display panel 01 may be arranged in an alternating manner.
  • the plurality of first slots K1 and the plurality of third slots K3 may be sequentially arranged along the second direction X and the third direction Y, and the plurality of first slots K1 and the plurality of third slots K3 may correspond one to one, and their orthographic projections on the display panel 01 may overlap with each other.
  • the plurality of first slots K1 may be arranged in sequence along the third direction Y
  • the plurality of third slots K3 may be arranged in sequence along the second direction X
  • the orthographic projections of the plurality of first slots K1 and the plurality of third slots K3 on the display panel 01 may overlap with each other.
  • the third direction Y and the second direction X may intersect in the same plane, and both may intersect in different planes with the first direction Z.
  • the first direction Z may be perpendicular to the bearing surface of the display panel 01
  • the second direction X and the third direction Y may be parallel to the bearing surface of the display panel 01.
  • the orthographic projection of any of the first slot K1, the second slot K2 and the third slot K3 on the display panel 01 may be hexagonal.
  • the display panel 01 may also include multiple pixels, and the orthographic projection of the pixel on the display panel 01 may be hexagonal, which generally refers to the anode shape.
  • the above-mentioned hexagonal slot arrangement can refer to the arrangement of multiple pixels.
  • the slot shown in FIG8 can also be called a pixel-type slot.
  • the slots can be further formed with reference to the process etching for forming pixels. Thereby simplifying the process, saving manufacturing costs and improving manufacturing efficiency.
  • the orthographic projection of any of the first slot K1, the second slot K2 and the third slot K3 on the display panel 01 may also be rectangular.
  • the rectangular slots may be referred to as square slots; and for the arrangement shown in FIG. 10, the rectangular slots may be referred to as through-hole row slots.
  • some shapes are only schematically illustrated here, and the slots may also be in other shapes, such as circular, elliptical or triangular.
  • the following implementation methods may be provided:
  • the shapes of the various slots may be the same.
  • the shapes of the multiple first slots K1 may be the same, all of which are hexagonal.
  • the shapes of the multiple slots included in the same type of slot may also be different.
  • a portion of the first slots K1 may be rectangular, and another portion of the first slots K1 may be hexagonal.
  • the shapes of the different types of slots can be the same.
  • the shapes of the first slot K1 and the third slot K3 can be the same, both hexagonal.
  • the shapes of the different types of slots can also be different.
  • the first slot K1 can be rectangular, and the third slot K3 can be hexagonal.
  • the spacing between any two adjacent slots can be a fixed spacing, that is, the spacing between any two adjacent slots is the same.
  • the spacing between any two adjacent slots can also be different.
  • the sizes of the grooves of the same type may be equal, and the size here may refer to the cross-sectional area of the groove on the bearing surface perpendicular to the display panel 01.
  • the sizes of the grooves of the same type may also be different.
  • first groove K1 , the second groove K2 and the third groove K3 described in the above embodiment can all be formed by an etching process, and thus can also be referred to as etching grooves.
  • the display module described in the embodiment of the present disclosure may further include: a connection portion B0 located between the flexible circuit board 02 and the non-display area A3 of the display panel 01, and the connection portion B0 may be used to reliably fix the flexible circuit board 02 on the display panel 01, and enhance the connection strength between the flexible circuit board 02 and the display panel 01. Avoid tearing.
  • the connection portion B0 here may be a pressure sensitive adhesive (PSA), a double-sided adhesive, or a thermally conductive copper foil.
  • the display module described in the embodiment of the present disclosure may further include: a double-sided adhesive tape J1 covering the surface of the bending area A2 of the display panel 01 away from the display area A1 and the non-display area A3.
  • the double-sided adhesive tape J1 can be used to protect the bending area A2 (e.g., to protect the metal wiring in the bending area A2).
  • the display module recorded in the embodiment of the present disclosure may also include: a device area Q1 located on the side of the flexible circuit board 02 away from the non-display area A3.
  • the device area Q1 may include electronic components such as capacitors, resistors and/or flash memory.
  • the display module recorded in the embodiment of the present disclosure may also include: other modules M0 located on the side of the support layer 06 away from the display area A1, such as a power supply battery.
  • the bonding solution adopted by the display module provided by the embodiment of the present disclosure can be called an FPC reverse bonding IC solution that is conducive to heat dissipation.
  • This solution can better and effectively export the heat in the IC, improve the reliability of the display module, reduce the heat in the first direction Z, and increase the heat conduction in the second direction X and the third direction Y, and improve the heat dissipation efficiency, so as to achieve the purpose of uniform heat dissipation, and solve the yellowing problem of the display panel.
  • the solution provided by the embodiment of the present disclosure can be applied to various FPC IC opening structures, and the etching groove design is made for the bending of folding products, which can improve the heat dissipation efficiency while reducing the weight of the product.
  • the embodiments of the present disclosure provide a display module.
  • the flexible circuit board located in the non-display area where the bending area is bent to the display area away from the light-emitting surface has a slotted area that exposes the non-display area.
  • the driver chip is located in the slotted area and is spaced apart from the flexible circuit board.
  • a heat-conducting structure is filled in the space between the driver chip and the flexible circuit board.
  • the driver chip can be better dissipated to avoid the problem of abnormal pixel brightness at the corresponding position of the driver chip due to the driver chip becoming hot after working for a long time, thereby avoiding the display abnormality problem such as yellowing of the display panel in the display module, and thus ensuring a better display effect of the display panel.
  • FIG11 is a flow chart of a method for preparing a display module provided in an embodiment of the present disclosure, which is used to prepare a display module as described in the above embodiment. As shown in FIG11 , the method includes:
  • Step 1101 providing a display panel, wherein the provided display panel has a display area, a bending area and a non-display area connected in sequence, and the non-display area is bent through the bending area to a side of the display area away from a light emitting surface of the display panel.
  • Step 1102 forming a flexible circuit board on a side of the non-display area away from the display area, and forming a flexible circuit board
  • the circuit board has a groove area exposing the non-display area in a first direction.
  • Step 1103 forming a driving chip in the slotted area of the flexible circuit board, and the formed driving chip and the flexible circuit board are spaced apart from each other in the second direction.
  • the second direction X and the first direction Z may intersect (eg, be perpendicular to each other).
  • Step 1104 forming a heat-conducting structure in the gap between the driving chip and the flexible circuit board, and the formed heat-conducting structure is in contact with both the driving chip and the flexible circuit board.
  • FIG. 12 shows a flow chart of a preparation process.
  • a COP process can be performed on the substrate, that is, an IC is bound and set in the non-display area A3 of the display panel 01, and a flexible circuit board FPC is bound and set.
  • FIG. 12 schematically shows two bound ICs.
  • a pressure-sensitive adhesive can be attached, that is, a PSA attach process.
  • the FOP process can be continued in the non-display area A3, that is, the FPC carrier film is set in the non-display area.
  • the setting of the FPC and the IC is completed.
  • the set FPC has a slotted area B1, and the bound IC is located in the slotted area B1.
  • the thermal conductive structure 04 (such as thermal conductive glue) recorded in the above embodiment can be filled into the slotted area B1, which can also be called dispenser, and the thermal conductive structure 04 can be filled into the gap between the IC and the FPC to achieve the purpose of thermal conduction.
  • grooves or holes in the embodiments of the present disclosure can be realized by using the etching process described in the above embodiments, and different film layers can be processed and etched together, which will not lead to an increase in cost.
  • the embodiments of the present disclosure provide a method for preparing a display module.
  • the flexible circuit board located in the non-display area where the bending area is bent to the display area away from the light-emitting surface has a slotted area exposing the non-display area.
  • the driver chip is located in the slotted area and is spaced apart from the flexible circuit board.
  • a heat-conducting structure is filled in the space between the driver chip and the flexible circuit board.
  • the driver chip can be better dissipated to avoid the problem of abnormal pixel brightness at the corresponding position of the driver chip due to the driver chip becoming hot after working for a long time, thereby avoiding the display abnormality problem such as yellowing of the display panel in the display module, which can ensure that the display effect of the display panel is better.
  • the embodiment of the present disclosure further provides a display module.
  • the display module includes:
  • the display panel 01 has a display area A1 , a bending area A2 , and a non-display area A3 connected in sequence, and the non-display area A3 is bent through the bending area A2 to the side of the display area A1 away from the light emitting surface of the display panel 01 .
  • the flexible circuit board 02 is located on the side of the non-display area A3 away from the display area A1 and is bound to the non-display area A3.
  • the flexible circuit board 02 is connected in a fixed manner, and in the first direction Z, the flexible circuit board 02 has a groove area B1 exposing the non-display area A3.
  • the driving chip 03 is located in the slot area B1 of the flexible circuit board 02 and is bound and connected to the non-display area A3.
  • any side wall of the driving chip 03 and any side wall of the flexible circuit board 02 are spaced apart from each other.
  • the second direction X intersects the first direction Y.
  • the heat-conducting structure 04 is located in the gap between the driving chip 03 and the flexible circuit board 02 , and is in contact with the driving chip 03 , the flexible circuit board 02 and the non-display area A3 .
  • Fig. 13 is a schematic diagram of the structure of a display device provided by an embodiment of the present disclosure. As shown in Fig. 13, the display device includes: a power supply component J0, and a display module 00 as described in the above embodiment.
  • the power supply component J0 may be coupled to the display module 00 and used to supply power to the display module 00 .
  • the display module 00 may be a foldable display module as described in the above embodiment.
  • the display device may be any product or component with a display function, such as a mobile phone, a tablet computer, a flexible display device, a television, and a monitor.
  • a and/or B can mean: A exists alone, A and B exist at the same time, and B exists alone.
  • the character "/” generally indicates a before-and-after relationship. Objects are in an "or" relationship.

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Abstract

提供了一种显示模组及其制备方法、显示装置，属于显示技术领域。该显示模组中，位于被弯折区弯折至显示区远离出光面一侧的非显示区的柔性电路板具有暴露非显示区的开槽区。驱动芯片位于该开槽区内，且与柔性电路板间隔设置。除此之外，在驱动芯片和柔性电路板的间隔内还填充有导热结构。如此，可以对驱动芯片进行较好的散热，避免驱动芯片在长时间工作后出现发烫而导致驱动芯片对应位置处像素亮度异常的问题，进而可以避免显示模组中显示面板出现类似发黄的显示异常问题，即可以确保显示面板的显示效果较好。

Description

显示模组及其制备方法、显示装置
本公开要求于2023年5月30日提交的申请号为202310632197.X、发明名称为“显示模组及其制备方法、显示装置”的中国专利申请的优先权，其全部内容通过引用结合在本公开中。
技术领域
本公开涉及显示技术领域，特别涉及一种显示模组及其制备方法、显示装置。
背景技术
随着显示技术的发展，一种便于用户携带的可折叠显示模组应运而生。
相关技术中，可折叠显示模组一般包括：具有显示区、弯折区和非显示区的显示面板，位于显示区的多个像素，以及位于非显示区的柔性电路板和驱动芯片。其中非显示区可以通过弯折区弯折至显示区远离显示面板的出光面的一侧。柔性电路板和驱动芯片配合工作，以点亮多个像素，从而驱动显示面板显示画面。并且，驱动芯片一般被柔性电路板所包覆。
发明内容
本公开提供了一种显示模组及其制备方法、显示装置，所述技术方案如下：
一方面，提供了一种显示模组，所述显示模组包括：
显示面板，具有依次连接的显示区、弯折区和非显示区，且所述非显示区通过所述弯折区弯折至所述显示区远离所述显示面板的出光面的一侧；
柔性电路板，位于所述非显示区远离所述显示区的一侧，且在第一方向上，所述柔性电路板具有暴露所述非显示区的开槽区；
驱动芯片，位于所述非显示区远离所述显示区的一侧，且位于所述柔性电路板的开槽区内，并与所述柔性电路板在第二方向上相互间隔，所述第二方向与所述第一方向相交；
导热结构，位于所述驱动芯片与所述柔性电路板的间隔内，且与所述驱动 芯片和所述柔性电路板均相互接触。
可选的，所述导热结构包括导热胶。
可选的，所述导热结构在所述显示面板上的正投影覆盖所述驱动芯片在所述显示面板上的正投影。
可选的，所述非显示区包括：在所述第二方向上相互间隔的第一绑定区和第二绑定区，且所述第一绑定区相对于所述第二绑定区远离所述弯折区；
其中，所述柔性电路板与所述显示面板在所述第一绑定区绑定连接，且所述柔性电路板具有的开槽区暴露所述第二绑定区；
所述驱动芯片位于所述第二绑定区远离所述显示区的一侧，且与所述显示面板在所述第二绑定区绑定连接。
可选的，所述导热结构还位于所述柔性电路板与所述非显示区之间。
可选的，在所述第一方向上，所述导热结构的横截面包括圆弧边。
可选的，所述显示模组还包括：
位于所述显示区与所述非显示区之间，且沿所述第一方向依次层叠设置的第一背膜、支架层和第二背膜；
其中，所述支架层具有至少一个第一开槽，且所述至少一个第一开槽在所述显示面板上的正投影与所述导热结构在所述显示面板上的正投影交叠。
可选的，所述显示模组还包括：
第一粘接层，位于所述第一背膜与所述支架层之间，且用于粘接所述第一背膜与所述支架层；
第二粘接层，位于所述第二背膜与所述支架层之间，且用于粘接所述第二背膜与所述支架层；
其中，所述第一粘接层的材料包括柔性材料，所述第二粘接层的材料包括：非柔性材料；
并且，所述第二粘接层具有至少一个第二开槽，且所述至少一个第二开槽在所述显示面板上的正投影与所述导热结构在所述显示面板上的正投影交叠。
可选的，所述显示模组还包括：
导热补强层，位于所述支架层与所述第一背膜和所述第二背膜中的至少一个背膜之间。
可选的，所述导热补强层位于所述支架层与所述第二背膜之间，且通过所 述第二粘接层与所述支架层粘接；
并且，所述导热补强层具有至少一个第三开槽，所述至少一个第三开槽在所述显示面板上的正投影与所述导热结构在所述显示面板上的正投影交叠。
可选的，所述支架层具有沿所述第二方向相互间隔的多个第一开槽，所述多个第一开槽位于所述支架层在所述第一方向上靠近所述柔性电路板的一侧，且所述多个第一开槽在所述显示面板上的正投影与所述导热结构在所述显示面板上的正投影重叠；
和/或，
所述第二粘接层具有一个第二开槽，所述一个第二开槽在所述第一方向上贯通所述第二粘接层，且所述一个第二开槽在所述显示面板上的正投影位于所述导热结构在所述显示面板上的正投影内；
和/或，
所述导热补强层具有沿所述第二方向相互间隔的多个第三开槽，所述多个第三开槽位于所述导热补强层在所述第一方向上的中间位置，且所述多个第三开槽在所述显示面板上的正投影覆盖所述导热结构在所述显示面板上的正投影。
可选的，所述支架层具有多个第一开槽，所述导热补强层具有多个第三开槽；并且，所述多个第一开槽和所述多个第三开槽按照下述任一方式排布：
所述多个第一开槽和所述多个第三开槽均沿所述第二方向和第三方向依次排布，且在任一方向上，所述多个第一开槽和所述多个第三开槽在所述显示面板上的正投影均交错排布；
所述多个第一开槽和所述多个第三开槽均沿所述第二方向和第三方向依次排布，且所述多个第一开槽和所述多个第三开槽一一对应，并在所述显示面板上的正投影相互交叠；
所述多个第一开槽沿所述第三方向依次排布，所述多个第三开槽沿所述第二方向依次排布，且所述多个第一开槽和所述多个第三开槽在所述显示面板上的正投影均相互交叠；
其中，所述第三方向与所述第二方向在同一平面相交，且均与所述第一方向在不同平面相交。
可选的，所述第一开槽、所述第二开槽和所述第三开槽中，任一开槽在所 述显示面板上的正投影呈六边形或矩形。
可选的，所述第一粘接层的材料包括：聚酰亚胺；所述支架层的材料包括：不锈钢或金属铜；所述第二粘接层的材料包括：聚对苯二甲酸乙二酯；所述导热补强层的材料包括：金属铜。
可选的，所述柔性电路板包括：
沿所述第一方向交替层叠设置的多层保护层和金属走线层，且所述金属走线层的材料包括：金属铜。
可选的，所述显示模组还包括：
连接部，位于所述柔性电路板与所述非显示区之间，且用于连接所述柔性电路板与所述显示面板。
可选的，所述显示模组还包括：
双面胶，覆着于所述弯折区远离所述显示区和所述非显示区一侧的表面，且用于保护所述弯折区。
另一方面，提供了一种显示模组的制备方法，用于制备如上述一方面所述的显示模组；所述方法包括：
提供显示面板，所述显示面板具有依次连接的显示区、弯折区和非显示区，且所述非显示区通过所述弯折区弯折至所述显示区远离所述显示面板的出光面的一侧；
在所述非显示区远离所述显示区的一侧形成柔性电路板，且形成的所述柔性电路板在第一方向上具有暴露所述非显示区的开槽区；
在所述柔性电路板的开槽区内形成驱动芯片，且形成的所述驱动芯片与所述柔性电路板在第二方向上相互间隔，所述第二方向与所述第一方向相交；
在所述驱动芯片与所述柔性电路板的间隔内形成导热结构，且形成的所述导热结构与所述驱动芯片和所述柔性电路板均相互接触。
又一方面，提供了一种显示模组，所述显示模组包括：
显示面板，具有依次连接的显示区、弯折区和非显示区，且所述非显示区通过所述弯折区弯折至所述显示区远离所述显示面板的出光面的一侧；
柔性电路板，位于所述非显示区远离所述显示区的一侧与所述非显示区绑定连接，且在第一方向上，所述柔性电路板具有暴露所述非显示区的开槽区；
驱动芯片，位于所述柔性电路板的开槽区内与所述非显示区绑定连接，且 在第二方向上，所述驱动芯片的任一侧壁与所述柔性电路板的任一侧壁均相互间隔，所述第二方向与所述第一方向相交；
导热结构，位于所述驱动芯片与所述柔性电路板的间隔内，且与所述驱动芯片、所述柔性电路板和所述非显示区均相互接触。
再一方面，提供了一种显示装置，所述显示装置包括：供电组件，以及如上述一方面和又一方面所述的显示模组；
其中，所述供电组件与所述显示模组耦接，并用于为所述显示模组供电。
附图说明
为了更清楚地说明本公开实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本公开的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本公开实施例提供的一种显示模组的膜层结构示意图；
图2是本公开实施例提供的一种显示模组中显示面板的展开平面示意图；
图3是本公开实施例提供的一种显示模组的部分膜层结构示意图；
图4是本公开实施例提供的另一种显示模组的部分膜层结构示意图；
图5是本公开实施例提供的又一种显示模组的部分膜层结构示意图；
图6是本公开实施例提供的另一种显示模组的膜层结构示意图；
图7是本公开实施例提供的又一种显示模组的部分膜层结构示意图；
图8是本公开实施例提供的一种显示模组中开槽排布示意图；
图9是本公开实施例提供的另一种显示模组中开槽排布示意图；
图10是本公开实施例提供的又一种显示模组中开槽排布示意图；
图11是本公开实施例提供的一种显示模组的制备方法流程图；
图12是本公开实施例提供的一种显示模组的制备工艺流程图；
图13是本公开实施例提供的一种显示装置的结构示意图。
具体实施方式
为了使本公开的目的、技术方案和优点更加清楚，下面将结合附图对本公开实施方式作进一步地详细描述。
受刷新率需求不断升高，目前显示模组的驱动芯片在长时间工作后会出现发烫问题。如此，会导致驱动芯片对应位置处像素的亮度异常，造成类似发黄的显示异常问题。基于此，本公开实施例提供了一种显示模组，可以解决该发烫问题导致的显示异常问题。
图1是本公开实施例提供的一种显示模组的结构示意图。如图1所示，该显示模组包括：显示面板01，柔性电路板(flexible printed circuit，FPC)02，驱动芯片03，以及导热结构04。
其中，在图1基础上，图2示出了显示面板01处于展开状态时的平面示意图。参考图1和图2可以看出，显示面板01具有依次连接的显示区A1、弯折区A2和非显示区A3，且非显示区A3通过弯折区A2弯折至显示区A1远离显示面板01的出光面的一侧。需要说明的是，在本公开实施例中，显示面板01具有的显示区A1、弯折区A2和非显示区A3属于显示面板01中同一个衬底的不同部分。相应的可知，显示区A1也可以同弯折区A2一样进行弯折，图1示出的形态仅是以显示区A1未进行弯折为例进行说明的。
显示面板01的出光面是指显示画面的一面，相应的，远离显示面板01的出光面的一侧也可以称为显示面板01的背光面。换言之，显示区A1一侧可以为出光面用于显示画面，非显示区A3一侧可以为背光面不显示画面，而弯折区A2可以部分或全部用于显示画面，当然也可以不显示画面。该类显示模组通常应用于折叠类显示产品，如折叠手机。
可选的，本公开实施例开记载的显示面板01可以为有机发光二极管(organic light-emitting diode，OLED)显示面板。且显示面板01还可以包括多个像素。每个像素包括像素电路和发光元件，像素电路与发光元件耦接，并用于驱动发光元件发光。对于OLED显示面板而言，发光元件即为包括依次层叠的阳极、发光层和阴极的OLED，发光层中具有用于发出对应颜色光线的发光材料。
继续参考图1还可以看出，柔性电路板02位于非显示区A3远离显示区A1的一侧，且在图1所示的第一方向Z上，柔性电路板02可以具有暴露非显示区A3的开槽区(也可以称为开孔区)B1。即，如图1所示，柔性电路板02可以设置于显示面板01的背光面，且被开槽区B1一分为二，使得非显示区A3被暴露出来。
继续参考图1可以看出，驱动芯片03，即集成电路(integrated circuit，IC) 芯片位于非显示区A3远离显示区A1的一侧，且位于柔性电路板02的开槽区B1内，并与柔性电路板02在第二方向X上相互间隔。即，在本公开实施例中，驱动芯片03可以同柔性电路板02一样设置于显示面板01的背光面，且可以位于柔性电路板02的开槽区B1内，与柔性电路板02彼此间隔。
如此，可以使得驱动芯片03在该开槽区B1内被暴露出来，与外界进行热量交互，为驱动芯片03提供散热路径，使得能够针对驱动芯片03进行较好的散热，可以避免驱动芯片03长时间工作后出现发烫问题，进而可以避免驱动芯片03对应位置处的发光材料受高温影响而损伤。驱动芯片03可以与上述实施例记载的像素电路电连接，并用于驱动像素电路控制发光元件发光。
其中，第二方向X与第一方向Z相交。如，参考图1，第一方向Z可以为垂直于显示面板01的承载面的方向，第二方向X可以为平行于显示面板01的承载面的方向，在此基础上，第二方向X与第一方向Z可以如图1相互垂直。
继续参考图1可以看出，导热结构04位于驱动芯片03与柔性电路板02的间隔内，且与驱动芯片03和柔性电路板02均相互接触。即，在本公开实施例中，还可以在驱动芯片03与柔性电路板02的间隔之间填充能够导热的导热结构04，导热结构04至少包裹驱动芯片03的侧壁，并与柔性电路板02的开槽区B1的孔壁接触。
如此，可以进一步为驱动芯片03提供较好的散热路径，使得驱动芯片03上的热量能够通过导热结构04被导出，并均匀分散至柔性电路板02上，通过柔性电路板02与外界进行热量交互。即，可以进一步使得能够针对驱动芯片03进行较好的散热，避免驱动芯片03长时间工作后出现严重发烫问题，进而避免驱动芯片03对应位置处的发光材料受高温影响而损伤。通过设置开槽区B1和填充导热结构04可以有效的避免显示面板01在驱动芯片03对应位置处出现类似发黄的显示异常问题。
综上所述，本公开实施例提供了一种显示模组。该显示模组中，位于被弯折区弯折至显示区远离出光面一侧的非显示区的柔性电路板具有暴露非显示区的开槽区。驱动芯片位于该开槽区内，且与柔性电路板间隔设置。除此之外，在驱动芯片和柔性电路板的间隔内还填充有导热结构。如此，可以对驱动芯片进行较好的散热，避免驱动芯片在长时间工作后出现发烫而导致驱动芯片对应位置处像素亮度异常的问题，进而可以避免显示模组中显示面板出现类似发黄 的显示异常问题，即可以确保显示面板的显示效果较好。
可选的，参考图1还可以看出，本公开实施例记载的柔性电路板02可以包括：沿第一方向Z(如，远离非显示区A3的方向)交替层叠设置的多层保护层021和金属走线层022。
即，如图1所示，柔性电路板02被开槽区B1一分为二的两部分均可以包括多组依次层叠的保护层021和金属走线层022。在该结构基础上，导热结构04可以连通驱动芯片03和柔性电路板02的金属走线层022，至少增加第一方向Z和第二方向X的热量扩散，使得驱动芯片03的热量能够通过金属走线层022可靠导出，并使得热量能够均匀分布至柔性电路板02上，与外界有效的进行热量交互，实现对驱动芯片03的可靠散热。
可选的，保护层021可以为阻焊油墨，如绿色的阻焊油墨，也称为绿油。金属走线层022的材料可以包括：金属铜Cu，相应的，金属走线层022也可以称为Cu箔走线层。因金属铜Cu的散热能力较好，故可以进一步可靠导出经导热结构04传递的热量。
可选的，本公开实施例记载的导热结构04可以包括导热胶。即，可以在开槽区B1内，驱动芯片03与柔性电路板02的间隔之间填充导热胶，以导出驱动芯片03的热量。此外，通过设置导热胶作为导热结构04进行填充，还可以加强驱动芯片03的强度，提升显示模组的工艺可靠性。
可选的，在一种实现方式中，结合上述图1和图3所示的部分膜层示意图可以看出，导热结构04可以仅包裹驱动芯片03在开槽区B1内的左右两侧侧壁。
或者，在另一种实现方式中，分别参考图4和图5所示的部分膜层示意图可以看出，本公开实施例记载的导热结构04在显示面板01上的正投影可以覆盖驱动芯片03在显示面板01上的正投影。即，导热结构04不仅可以包裹驱动芯片03在开槽区B1内的左右两侧侧壁，而且还可以包裹驱动芯片03在开槽区B1内的上侧(即，驱动芯片03的上下两侧中，远离非显示区A3的一侧)。如此，可以扩大导热面积，进一步确保对驱动芯片03进行可靠散热。
可选的，参考图3至图5还可以看出，本公开实施例记载的非显示区A3可以包括：在第二方向X上相互间隔的第一绑定区A31和第二绑定区A32，且第一绑定区A31相对于第二绑定区A32远离弯折区A2。
其中，柔性电路板02与显示面板01在第一绑定区A31绑定连接，且柔性电路板02具有的开槽区B1暴露第二绑定区A32。驱动芯片03位于第二绑定区A32远离显示区A1的一侧，且与显示面板01在第二绑定区A32绑定连接。
可选的，结合图1，以及图3至图5还可以看出，在本公开实施例中，柔性电路板02可以通过绑定件B2(如，绑定胶)与第一绑定区A31远离显示区A1一侧的导电焊盘P1电连接，从而实现与显示面板01的绑定连接。
可选的，继续参考图1和图3至图5还可以看出，本公开实施例提供的导热结构04还可以位于柔性电路板02与非显示区A3之间。即，类似导热胶的导热结构04还可以填充至柔性电路板02与显示面板01的非显示区A3之间的间隔内。如此，可以进一步确保散热面积较大，使得散热效果较好。
可选的，在本公开实施例中，在第一方向Z上，导热结构04的横截面可以包括圆弧边。并且，该圆弧边可以朝靠近非显示区A3的方向凹陷；或者，该圆弧边可以朝远离非显示区A3的方向凸出。
示例的，参考图1、图3和图4，其示出的导热结构04具有的圆弧边在第一方向Z上朝远离非显示区A3的方向凸出，相应的，可以认为导热结构04的横截面呈半圆形。或者，参考图5，其示出的导热结构04具有的圆弧边在第一方向Z上朝靠近非显示区A3的方向凹陷，相应的，可以认为导热结构04的横截面呈具有凹边的矩形。其中，凹边可以为呈矩形的导热结构04的各边中，远离非显示区A3的一边(即，驱动芯片03的上侧)，且凹边朝靠近非显示区A3的方向凹陷。当然，以上仅是对导热结构04形状的示意性说明，而不对导热结构04的形状进行限定。
可选的，图6是本公开实施例提供的另一种显示模组的结构示意图。结合图1和图6可以看出，本公开实施例记载的显示模组还可以包括：位于显示区A1与非显示区A3之间，且沿第一方向Z(如，远离显示区A1的方向)依次层叠设置的第一背膜(U-Film)05、支架(bracket，BKT)层06和第二背膜07。
并且，其中的支架层06可以具有至少一个第一开槽K1，该至少一个第一开槽K1在显示面板01上的正投影与导热结构04在显示面板01上正投影可以交叠。即，本公开实施例可以对显示模组包括的支架层06进行开槽处理。
示例的，如图6所示，其示出的支架层06具有沿第二方向X相互间隔的多个第一开槽K1(图6中示意性示出4个第一开槽K1)，且该多个第一开槽K1 位于支架层06在第一方向Z上靠近柔性电路板02的一侧，以及，该多个第一开槽K1在显示面板01上的正投影与导热结构04在显示面板01上的正投影恰好重叠。
通过在支架层06上开设上述实施例记载的多个第一开槽K1，可以减小驱动芯片03与显示面板01在第一方向Z上叠层的接触面积，达到降低第一方向Z上温度传播的目的，从而进一步利于对驱动芯片03的散热。
可选的，支架层06的材料可以包括：不锈钢(steel use stainless，SUS)或金属铜Cu。因不锈钢SUS和金属铜Cu的导热性能均较好，故可以在开槽实现较好散热的基础上，更好的实现对驱动芯片03的导热。
可选的，继续结合图1和图6还可以看出，本公开实施例记载的显示模组还可以包括：第一粘接层08和第二粘接层09。
其中，第一粘接层08可以位于第一背膜05与支架层06之间，且可以用于粘接第一背膜05与支架层06。
第二粘接层09可以位于第二背膜07与支架层06之间，且可以用于粘接第二背膜07与支架层06。
并且，第一粘接层08的材料可以包括柔性材料，如聚酰亚胺(polyimide，PI)。第二粘接层09的材料可以包括：非柔性材料，如，聚对苯二甲酸乙二酯(polyethylene terephthalate，PET)。相应的，第一粘接层08也可以称为PI胶，第二粘接层09也可以称为一种PET胶，PET胶属于一种挠性胶带(bending tape)。
在此基础上，如图6所示，也可以对支架层06一侧强度较大的第二粘接层09进行开槽处理，使得第二粘接层09具有至少一个第二开槽K2，且可以设置至少一个第二开槽K2在显示面板01上的正投影与导热结构04在显示面板01上的正投影交叠。当然，若第一粘接层08的强度也较大，则也可以在第一粘接层08上开设开槽，这里设置第一粘接层08为柔性材料，是为了保护显示面板01。
示例的，如图6所示，其示出的第二粘接层09具有一个第二开槽K2，且该一个第二开槽K2在第一方向Z上贯通第二粘接层09(相应的，该一个第二开槽K2也可以称为通槽)，以及该一个第二开槽K2在显示面板01上的正投影位于导热结构04在显示面板01上的正投影内。
通过在第二粘接层09上开设如上述实施例记载的第二开槽K2(即，通槽)， 可以利于空气循环，使得驱动芯片03散发的热量能够被第一开槽K1处流动的空气带走，减少热量集中，提高散热速度。
结合上述实施例记载可知，在支架层06上开设多个相互间隔的第一开槽K1的同时，还在第二粘接层09上开设一个贯通的第二开槽K2，可以在减小第一方向Z上叠层的接触面积，降低第一方向Z的温度传播的基础上，还增加空气循环，减少热量集中，从而有效提高散热速度，达到均匀散热，避免驱动芯片03发烫而造成显示面板01对应位置处出现发黄的显示异常的目的。
可选的，结合图7示出的再一种显示模组的膜层示意图还可以看出，本公开实施例记载的显示模组还可以包括：导热补强层010。
其中，该导热补强层010可以位于支架层06与第一背膜05和第二背膜07中的至少一个背膜之间。
示例的，图7示出的导热补强层010位于支架层06与第二背膜07之间，且可以通过第二粘接层09与支架层06粘接。
可选的，导热补强层010的材料可以包括：金属铜Cu，相应的，导热补强层010也可以称为补强Cu片。当然，在一些其他实施例中，导热补强层010的材料也可以为其他金属材料，例如不锈钢SUS。
在本公开实施例中，通过在支架层06一侧增加该补强Cu片，可以进一步增加在至少第二方向X上的散热面积，提高散热效率，确保对驱动芯片03进行可靠散热。当然，也可以增加在与第二方向X位于同一平面(如，平行于显示面板01的承载面的平面)且相交的第三方向Y上的散热面积，使得更多的热量能够通过第二方向X和第三方向Y进行扩散释放，提高散热效率。
可选的，继续参考图7可以看出，在本公开实施例中，也可以对导热补强层010进行开槽处理，即导热补强层010可以具有至少一个第三开槽K3，且该至少一个第三开槽K3在显示面板01上的正投影也可以与导热结构04在显示面板01上的正投影交叠。
示例的，图7示出的显示模组中，导热补强层010具有沿第二方向X相互间隔的多个第三开槽K3(图7中示意性示出5个第三开槽K3)，多个第三开槽K3位于导热补强层010在第一方向Z上的中间位置，导热补强层010在第一方向Z上的中间位置可以理解为位于导热补强层010在第二方向X的中轴线上。并且，多个第三开槽K3在显示面板01上的正投影覆盖导热结构04在显示面板 01上的正投影。同第一开槽K1的设置，通过在导热补强层010上增加该第三开槽K3，也可以进一步减小第一方向Z上叠层的接触面积，降低第一方向Z的温度传播，且增加散热面积，使得热量能够均摊开，进一步加快散热效率，实现对驱动芯片03的可靠散热。
需要说明的是，上述关于图6和图7中第一开槽K1、第二开槽K2和第三开槽K3的设置方式可以相组合，也可以相独立。如，在第二粘接层09具有如图6所示的一个第二开槽K2的基础上，支架层06也可以仅具有一个第一开槽K1，而不是具有如图6所示相互间隔的4个第一开槽K1。
可选的，结合图8至图10分别示出的显示模组平面图可以看出，本公开实施例记载的多个第一开槽K1(即，支架层06上的开槽)和多个第三开槽K3(即，补强Cu片010上的开槽)可以按照下述任一方式排布：
如图8所示：多个第一开槽K1和多个第三开槽K3可以均沿第二方向X和第三方向Y依次排布，且在任一方向上，多个第一开槽K1和多个第三开槽K3在显示面板01上的正投影均可以交错排布。
如图9所示：多个第一开槽K1和多个第三开槽K3可以均沿第二方向X和第三方向Y依次排布，且多个第一开槽K1和多个第三开槽K3可以一一对应，并在显示面板01上的正投影可以相互交叠。
如图10所示：多个第一开槽K1可以沿第三方向Y依次排布，多个第三开槽K3可以沿第二方向X依次排布，且多个第一开槽K1和多个第三开槽K3在显示面板01上的正投影均可以相互交叠。
其中，如上述实施例记载，第三方向Y与第二方向X可以在同一平面相交，且均可以与第一方向Z在不同平面相交。如，第一方向Z可以垂直于显示面板01的承载面，第二方向X和第三方向Y可以均平行于显示面板01的承载面。要说明的是，以上图8至图10所示仅为对开槽排布的示意性说明。
可选的，结合图8可以看出，第一开槽K1、第二开槽K2和第三开槽K3中，任一开槽在显示面板01上的正投影可以呈六边形。可选的，显示面板01还可以包括多个像素，且像素在显示面板01上的正投影可以呈六边形，这里一般指阳极形状。在此基础上，上述呈六边形的开槽排布方式可以参考多个像素的排布方式。相应的，图8示出的开槽也可以称为像素型开槽。在参考多个像素排布方式开设开槽的基础上，可以进一步参考形成像素的工艺蚀刻形成开槽， 从而简化工艺方式，节省制造成本，加快制造效率。
或者，结合图9和图10可以看出，第一开槽K1、第二开槽K2和第三开槽K3中，任一开槽在显示面板01上的正投影还可以呈矩形。并且，对于图9所示结构而言，其呈矩形的开槽可以称为方块型开槽；而对于图10所示排布方式而言，其呈矩形的开槽可以称为通孔行开槽。当然，这里也仅是示意性说明一些形状，开槽也可以呈其他形状，如圆形、椭圆形或三角形。
可选的，对于第一开槽K1(也可以是指第一种开槽)、第二开槽K2(也可以是指第二种开槽)和第三开槽K3(也可以是指第三种开槽)的任一种开槽而言，还可以具有以下几种实现方式：
其一，结合图8至图10，同种开槽包括的多个开槽中，各个开槽的形状可以相同。如，结合图8，多个第一开槽K1的形状可以相同，均为六边形。当然，在一些其他实施例中，同种开槽包括的多个开槽的形状也可以不同。如，多个第一开槽K1中，一部分第一开槽K1可以呈矩形，另一部分第一开槽K1可以呈六边形。
其二，不同种开槽的形状可以相同。如，结合图8，第一开槽K1和第三开槽K3的形状可以相同，均为六边形。当然，在一些其他实施例中，不同种开槽的形状也可以不同。如，第一开槽K1可以呈矩形，第三开槽K3可以呈六边形。
其三，同种开槽包括的多个开槽中，每相邻两个开槽的间距均可以为固定间距，即任意相邻两个开槽的间距均相同。当然，在一些其他实施例中，任意相邻两个开槽的间距也可以不同。
其四，同种开槽包括的各个开槽的尺寸可以相等，这里的尺寸可以是指在垂直于显示面板01的承载面上，开槽的横截面面积。当然，在一些其他实施例中，同种开槽包括的各个开槽的尺寸也可以不同。
可选的，上述实施例记载的第一开槽K1、第二开槽K2和第三开槽K3均可以通过蚀刻工艺形成，故也可以称为蚀刻槽。
可选的，结合图1还可以看出，本公开实施例记载的显示模组还可以包括：位于柔性电路板02与显示面板01的非显示区A3之间的连接部B0，该连接部B0可以用于将柔性电路板02可靠固定在显示面板01上，增强柔性电路板02与显示面板01的连接强度。避免发生撕裂。示例的，这里的连接部B0可以为压敏胶(pressure sensitive adhesive，PSA)、双面胶或导热铜箔。
可选的，结合图6和图7还可以看出，本公开实施例记载的显示模组还可以包括：覆着于显示面板01的弯折区A2远离显示区A1和非显示区A3一侧表面的双面胶J1。该双面胶J1可以用于保护弯折区A2(如，保护弯折区A2内的金属布线)。
可选的，结合图1、图6和图7还可以看出，本公开实施例记载的显示模组还可以包括：位于柔性电路板02远离非显示区A3一侧的器件区Q1。该器件区Q1可以包括如电容、电阻和/或闪存的电子元件。以及，结合图6和图7还可以看出，本公开实施例记载的显示模组还可以包括：位于支架层06远离显示区A1一侧的其他模组M0，如供电电池。
基于以上记载可知，本公开实施例提供的显示模组采用的绑定(bonding)方案可以称为一种有利于散热的FPC反向bonding IC方案，该方案可以更好的将IC中的热量有效导出，提高显示模组的信赖能力，可以减小在第一方向Z上的热量，且可以增加第二方向X和第三方向Y上的导热，并提高散热效率，达到均匀散热的目的，可以解决显示面板出现的显示发黄问题。此外，本公开实施例提供的方案可以适用于各类FPC IC开孔结构，为折叠产品弯折做蚀刻槽设计，可以在提高散热效率的同时，还减轻产品重量。
综上所述，本公开实施例提供了一种显示模组。该显示模组中，位于被弯折区弯折至显示区远离出光面一侧的非显示区的柔性电路板具有暴露非显示区的开槽区。驱动芯片位于该开槽区内，且与柔性电路板间隔设置。除此之外，在驱动芯片和柔性电路板的间隔内还填充有导热结构。如此，可以对驱动芯片进行较好的散热，避免驱动芯片在长时间工作后出现发烫而导致驱动芯片对应位置处像素亮度异常的问题，进而可以避免显示模组中显示面板出现类似发黄的显示异常问题，即可以确保显示面板的显示效果较好。
图11是本公开实施例提供的一种显示模组的制备方法流程图，用于制备如上述实施例记载的显示模组。如图11所示，该方法包括：
步骤1101、提供显示面板，且提供的显示面板具有依次连接的显示区、弯折区和非显示区，非显示区通过弯折区弯折至显示区远离显示面板的出光面的一侧。
步骤1102、在非显示区远离显示区的一侧形成柔性电路板，且形成的柔性 电路板在第一方向上具有暴露非显示区的开槽区。
步骤1103、在柔性电路板的开槽区内形成驱动芯片，且形成的驱动芯片与柔性电路板在第二方向上相互间隔。
其中，如图1所示，第二方向X与第一方向Z可以相交(如，相互垂直)。
步骤1104、在驱动芯片与柔性电路板的间隔内形成导热结构，且形成的导热结构与驱动芯片和柔性电路板均相互接触。
可选的，以图1所示结构为例，图12示出了一种制备工艺流程图。如图12所示：首先，可以进行在基板上进行COP工艺，即在显示面板01的非显示区A3绑定设置IC，且绑定设置柔性电路板FPC。图12示意性示出了绑定的2个IC。然后，可以进行压敏胶的附着，即PSA attach工艺。再然后，可以在非显示区A3继续进行FOP工艺，即将FPC承载膜设置于非显示区。至此即完成了FPC和IC的设置。并且，在本公开实施例中，设置的FPC具有开槽区B1，绑定的IC位于该开槽区B1。最后，可以将上述实施例记载的导热结构04(如，导热胶)填充至开槽区B1，也可以称为点胶(Dispenser)，且可以将该导热结构04填充至IC与FPC的间隔之间，实现导热目的。
需要说明的是，本公开实施例中的开槽或开孔均可以采用如上述实施例记载的蚀刻工艺实现，针对不同膜层可以一同加工蚀刻，如此不会导致成本上升。
综上所述，本公开实施例提供了一种显示模组的制备方法。采用该方法制备的显示模组中，位于被弯折区弯折至显示区远离出光面一侧的非显示区的柔性电路板具有暴露非显示区的开槽区。驱动芯片位于该开槽区内，且与柔性电路板间隔设置。除此之外，在驱动芯片和柔性电路板的间隔内还填充有导热结构。如此，可以对驱动芯片进行较好的散热，避免驱动芯片在长时间工作后出现发烫而导致驱动芯片对应位置处像素亮度异常的问题，进而可以避免显示模组中显示面板出现类似发黄的显示异常问题，即可以确保显示面板的显示效果较好。
可选的，本公开实施例还提供一种显示模组，结合图1，该显示模组包括：
显示面板01，具有依次连接的显示区A1、弯折区A2和非显示区A3，且非显示区A3通过弯折区A2弯折至显示区A1远离显示面板01的出光面的一侧。
柔性电路板02，位于非显示区A3远离显示区A1的一侧与非显示区A3绑 定连接，且在第一方向Z上，柔性电路板02具有暴露非显示区A3的开槽区B1。
驱动芯片03，位于柔性电路板02的开槽区B1内与非显示区A3绑定连接，且在第二方向X上，驱动芯片03的任一侧壁与柔性电路板02的任一侧壁均相互间隔，第二方向X与第一方向Y相交。
导热结构04，位于驱动芯片03与柔性电路板02的间隔内，且与驱动芯片03、柔性电路板02和非显示区A3均相互接触。
图13是本公开实施例提供的一种显示装置的结构示意图。如图13所示，该显示装置包括：供电组件J0，以及如上述实施例记载的显示模组00。
其中，供电组件J0可以与显示模组00耦接，并用于为显示模组00供电。
可选的，显示模组00可以为如上述实施例记载的折叠显示模组。显示装置可以为：手机、平板电脑、柔性显示装置、电视机和显示器等任何具有显示功能的产品或部件。
本公开的实施方式部分使用的术语仅用于对本公开的实施例进行解释，而非旨在限定本公开。除非另作定义，本公开的实施方式使用的技术术语或者科学术语应当为本公开所属领域内具有一般技能的人士所理解的通常意义。
如，本公开专利申请说明书以及权利要求书中使用的“第一”、“第二”或者“第三”以及类似的词语并不表示任何顺序、数量或者重要性，而只是用来区分不同的组成部分。
同样，“一个”或者“一”等类似词语也不表示数量限制，而是表示存在至少一个。
“包括”或者“包含”等类似的词语意指出现在“包括”或者“包含”前面的元件或者物件涵盖出现在“包括”或者“包含”后面列举的元件或者物件及其等同，并不排除其他元件或者物件。
“上”、“下”、“左”或者“右”等仅用于表示相对位置关系，当被描述对象的绝对位置改变后，则所述相对位置关系也可能相应地改变。“连接”或者“耦接”是指电连接。
“和/或”，表示可以存在三种关系，例如，A和/或B，可以表示：单独存在A，同时存在A和B，单独存在B这三种情况。字符“/”一般表示前后关联 对象是一种“或”的关系。
以上所述仅为本公开的可选实施例，并不用以限制本公开，凡在本公开的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本公开的保护范围之内。

Claims (20)

  1. 一种显示模组，所述显示模组包括：
    显示面板，具有依次连接的显示区、弯折区和非显示区，且所述非显示区通过所述弯折区弯折至所述显示区远离所述显示面板的出光面的一侧；
    柔性电路板，位于所述非显示区远离所述显示区的一侧，且在第一方向上，所述柔性电路板具有暴露所述非显示区的开槽区；
    驱动芯片，位于所述非显示区远离所述显示区的一侧，且位于所述柔性电路板的开槽区内，并与所述柔性电路板在第二方向上相互间隔，所述第二方向与所述第一方向相交；
    导热结构，位于所述驱动芯片与所述柔性电路板的间隔内，且与所述驱动芯片和所述柔性电路板均相互接触。
  2. 根据权利要求1所述的显示模组，其中，所述导热结构包括导热胶。
  3. 根据权利要求1或2所述的显示模组，其中，所述导热结构在所述显示面板上的正投影覆盖所述驱动芯片在所述显示面板上的正投影。
  4. 根据权利要求1至3任一所述的显示模组，其中，所述非显示区包括：在所述第二方向上相互间隔的第一绑定区和第二绑定区，且所述第一绑定区相对于所述第二绑定区远离所述弯折区；
    其中，所述柔性电路板与所述显示面板在所述第一绑定区绑定连接，且所述柔性电路板具有的开槽区暴露所述第二绑定区；
    所述驱动芯片位于所述第二绑定区远离所述显示区的一侧，且与所述显示面板在所述第二绑定区绑定连接。
  5. 根据权利要求1至4任一所述的显示模组，其中，所述导热结构还位于所述柔性电路板与所述非显示区之间。
  6. 根据权利要求1至5任一所述的显示模组，其中，在所述第一方向上，所 述导热结构的横截面包括圆弧边。
  7. 根据权利要求1至6任一所述的显示模组，其中，所述显示模组还包括：
    位于所述显示区与所述非显示区之间，且沿所述第一方向依次层叠设置的第一背膜、支架层和第二背膜；
    其中，所述支架层具有至少一个第一开槽，且所述至少一个第一开槽在所述显示面板上的正投影与所述导热结构在所述显示面板上的正投影交叠。
  8. 根据权利要求7所述的显示模组，其中，所述显示模组还包括：
    第一粘接层，位于所述第一背膜与所述支架层之间，且用于粘接所述第一背膜与所述支架层；
    第二粘接层，位于所述第二背膜与所述支架层之间，且用于粘接所述第二背膜与所述支架层；
    其中，所述第一粘接层的材料包括柔性材料，所述第二粘接层的材料包括：非柔性材料；
    并且，所述第二粘接层具有至少一个第二开槽，且所述至少一个第二开槽在所述显示面板上的正投影与所述导热结构在所述显示面板上的正投影交叠。
  9. 根据权利要求8所述的显示模组，其中，所述显示模组还包括：
    导热补强层，位于所述支架层与所述第一背膜和所述第二背膜中的至少一个背膜之间。
  10. 根据权利要求9所述的显示模组，其中，所述导热补强层位于所述支架层与所述第二背膜之间，且通过所述第二粘接层与所述支架层粘接；
    并且，所述导热补强层具有至少一个第三开槽，所述至少一个第三开槽在所述显示面板上的正投影与所述导热结构在所述显示面板上的正投影交叠。
  11. 根据权利要求10所述的显示模组，其中，所述支架层具有沿所述第二方向相互间隔的多个第一开槽，所述多个第一开槽位于所述支架层在所述第一方向上靠近所述柔性电路板的一侧，且所述多个第一开槽在所述显示面板上的正 投影与所述导热结构在所述显示面板上的正投影重叠；
    和/或，
    所述第二粘接层具有一个第二开槽，所述一个第二开槽在所述第一方向上贯通所述第二粘接层，且所述一个第二开槽在所述显示面板上的正投影位于所述导热结构在所述显示面板上的正投影内；
    和/或，
    所述导热补强层具有沿所述第二方向相互间隔的多个第三开槽，所述多个第三开槽位于所述导热补强层在所述第一方向上的中间位置，且所述多个第三开槽在所述显示面板上的正投影覆盖所述导热结构在所述显示面板上的正投影。
  12. 根据权利要求10或11所述的显示模组，其中，所述支架层具有多个第一开槽，所述导热补强层具有多个第三开槽；并且，所述多个第一开槽和所述多个第三开槽按照下述任一方式排布：
    所述多个第一开槽和所述多个第三开槽均沿所述第二方向和第三方向依次排布，且在任一方向上，所述多个第一开槽和所述多个第三开槽在所述显示面板上的正投影均交错排布；
    所述多个第一开槽和所述多个第三开槽均沿所述第二方向和第三方向依次排布，且所述多个第一开槽和所述多个第三开槽一一对应，并在所述显示面板上的正投影相互交叠；
    所述多个第一开槽沿所述第三方向依次排布，所述多个第三开槽沿所述第二方向依次排布，且所述多个第一开槽和所述多个第三开槽在所述显示面板上的正投影均相互交叠；
    其中，所述第三方向与所述第二方向在同一平面相交，且均与所述第一方向在不同平面相交。
  13. 根据权利要求10至12任一所述的显示模组，其中，所述第一开槽、所述第二开槽和所述第三开槽中，任一开槽在所述显示面板上的正投影呈六边形或矩形。
  14. 根据权利要求9至13任一所述的显示模组，其中，所述第一粘接层的材料包括：聚酰亚胺；所述支架层的材料包括：不锈钢或金属铜；所述第二粘接层的材料包括：聚对苯二甲酸乙二酯；所述导热补强层的材料包括：金属铜。
  15. 根据权利要求1至14任一所述的显示模组，其中，所述柔性电路板包括：
    沿所述第一方向交替层叠设置的多层保护层和金属走线层，且所述金属走线层的材料包括：金属铜。
  16. 根据权利要求1至15任一所述的显示模组，其中，所述显示模组还包括：
    连接部，位于所述柔性电路板与所述非显示区之间，且用于连接所述柔性电路板与所述显示面板。
  17. 根据权利要求1至16任一所述的显示模组，其中，所述显示模组还包括：
    双面胶，覆着于所述弯折区远离所述显示区和所述非显示区一侧的表面，且用于保护所述弯折区。
  18. 一种显示模组的制备方法，用于制备如权利要求1至17任一所述的显示模组；所述方法包括：
    提供显示面板，所述显示面板具有依次连接的显示区、弯折区和非显示区，且所述非显示区通过所述弯折区弯折至所述显示区远离所述显示面板的出光面的一侧；
    在所述非显示区远离所述显示区的一侧形成柔性电路板，且形成的所述柔性电路板在第一方向上具有暴露所述非显示区的开槽区；
    在所述柔性电路板的开槽区内形成驱动芯片，且形成的所述驱动芯片与所述柔性电路板在第二方向上相互间隔，所述第二方向与所述第一方向相交；
    在所述驱动芯片与所述柔性电路板的间隔内形成导热结构，且形成的所述导热结构与所述驱动芯片和所述柔性电路板均相互接触。
  19. 一种显示模组，所述显示模组包括：
    显示面板，具有依次连接的显示区、弯折区和非显示区，且所述非显示区 通过所述弯折区弯折至所述显示区远离所述显示面板的出光面的一侧；
    柔性电路板，位于所述非显示区远离所述显示区的一侧与所述非显示区绑定连接，且在第一方向上，所述柔性电路板具有暴露所述非显示区的开槽区；
    驱动芯片，位于所述柔性电路板的开槽区内与所述非显示区绑定连接，且在第二方向上，所述驱动芯片的任一侧壁与所述柔性电路板的任一侧壁均相互间隔，所述第二方向与所述第一方向相交；
    导热结构，位于所述驱动芯片与所述柔性电路板的间隔内，且与所述驱动芯片、所述柔性电路板和所述非显示区均相互接触。
  20. 一种显示装置，所述显示装置包括：供电组件，以及如权利要求1至17或19任一所述的显示模组；
    其中，所述供电组件与所述显示模组耦接，并用于为所述显示模组供电。
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