WO2024240261A1 - 触控模组、显示装置以及触控驱动方法 - Google Patents

触控模组、显示装置以及触控驱动方法 Download PDF

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Publication number
WO2024240261A1
WO2024240261A1 PCT/CN2024/095334 CN2024095334W WO2024240261A1 WO 2024240261 A1 WO2024240261 A1 WO 2024240261A1 CN 2024095334 W CN2024095334 W CN 2024095334W WO 2024240261 A1 WO2024240261 A1 WO 2024240261A1
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WIPO (PCT)
Prior art keywords
touch
substrate
driving
module
signal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2024/095334
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English (en)
French (fr)
Inventor
罗鸿强
具松
龚庆
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
Chengdu BOE Optoelectronics Technology Co Ltd
Original Assignee
BOE Technology Group Co Ltd
Chengdu BOE Optoelectronics Technology Co Ltd
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Filing date
Publication date
Application filed by BOE Technology Group Co Ltd, Chengdu BOE Optoelectronics Technology Co Ltd filed Critical BOE Technology Group Co Ltd
Priority to US18/992,606 priority Critical patent/US12656906B2/en
Publication of WO2024240261A1 publication Critical patent/WO2024240261A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416—Control or interface arrangements specially adapted for digitisers
    • G06F3/04164—Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416—Control or interface arrangements specially adapted for digitisers
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416—Control or interface arrangements specially adapted for digitisers
    • G06F3/04166—Details of scanning methods, e.g. sampling time, grouping of sub areas or time sharing with display driving
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416—Control or interface arrangements specially adapted for digitisers
    • G06F3/04166—Details of scanning methods, e.g. sampling time, grouping of sub areas or time sharing with display driving
    • G06F3/041662—Details of scanning methods, e.g. sampling time, grouping of sub areas or time sharing with display driving using alternate mutual and self-capacitive scanning
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04102—Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04111—Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate

Definitions

  • the present disclosure relates to the field of display technology, and in particular to a touch module, a display device, and a touch driving method.
  • the touch display device includes a touch panel and a display panel.
  • the touch panel is used to provide a touch function for the display panel.
  • multiple display panels are integrated. It is necessary to configure a touch panel for each display panel to provide a touch function for each display panel separately.
  • a touch driver chip Touch Integrated Circuit, TIC
  • the embodiments of the present disclosure provide a touch module, a display device and a touch driving method.
  • a touch module comprising:
  • a touch control driving module and a plurality of touch control substrates respectively connected to the touch control driving module, wherein different touch control substrates are used to provide touch control functions for different display panels, wherein:
  • the touch driving module is configured to perform touch switching among the plurality of touch substrates, wherein the touch switching includes: opening a connection path with a target touch substrate to perform touch detection on the target touch substrate, and closing a connection path with touch substrates other than the target touch substrate; and
  • the target touch control substrate is a touch control substrate currently providing the touch control function.
  • each touch substrate includes a plurality of touch signal lines
  • the touch driving module includes: a touch chip and a plurality of integrated units respectively connected to the touch chip; each integrated unit is used to integrate touch signal lines respectively from the plurality of touch substrates; and
  • each integrated unit includes multiple signal transmission circuits in parallel, each signal transmission circuit is connected to a touch signal line on one of the multiple touch substrates, and is used to transmit the signal output by the touch chip to the touch signal line, and transmit the signal input via the touch signal line to the touch chip.
  • the plurality of touch signal lines on each touch substrate include touch driving lines extending along a first direction and touch sensing lines extending along a second direction, and the first direction intersects with the second direction;
  • Each integrated unit includes a first integrated unit and a second integrated unit, wherein the first integrated unit is used to integrate a plurality of touch driving lines respectively from different touch substrates, and the second integrated unit is used to integrate a plurality of touch sensing lines respectively from different touch substrates;
  • the first integrated unit comprises a plurality of driving circuits connected in parallel, each driving circuit being used to transmit the driving signal output by the touch control chip to one of the touch control driving lines on one of the plurality of touch control substrates;
  • each sensing circuit includes: a first switch, a second switch and a third switch;
  • Each touch sensing line is connected to a first end of the first switch, a first end of the second switch and a first end of the third switch respectively;
  • the second end of the first switch is grounded, the second ends of the second switch and the third switch are respectively connected to the touch chip, the second switch is used to receive the positive voltage output by the touch chip, and the third switch is used to input the sensing signal on the touch sensing line to the touch chip.
  • each driving circuit includes: a fourth switch, a fifth switch, a sixth switch and a seventh switch;
  • each touch driving line is respectively connected to the first end of the fourth switch, the first end of the fifth switch, the first end of the sixth switch and the first end of the seventh switch;
  • the fourth switch is used to receive the positive voltage output by the power signal terminal
  • the fifth switch is used to receive the negative voltage output by the power signal terminal
  • the drive signal output terminal is used to output the drive signal
  • each driving circuit further includes an anti-static unit;
  • the touch driving module and the first touch substrate are located in the same panel, and the touch module further includes: a first flexible circuit board;
  • the first flexible circuit board is used to connect the plurality of touch signal lines on the second touch substrate to the touch driving module;
  • the first touch control substrate is any one of the plurality of touch control substrates, and the second touch control substrate is a touch control substrate other than the first touch control substrate.
  • the touch control driving module includes a first binding area and a second binding area; each integrated unit is located in the first binding area or in the second binding area.
  • the number of the plurality of touch control signal lines is the same or different;
  • the present disclosure also provides a display device, comprising the touch module, and display panels corresponding to the plurality of touch substrates in the touch module;
  • Each touch control substrate provides a touch control function for the corresponding display panel.
  • the display device further comprises a main control module, and the main control module is connected to the touch driving module in the touch module;
  • the main control module is configured to determine a target touch substrate to be switched to, and send a touch switching signal for the target touch substrate to the touch driving module;
  • the touch driving module is used for conducting a connection path between the touch driving module and the target touch driving substrate in response to the touch switching signal, so as to perform touch detection on the target touch driving substrate.
  • each touch substrate is configured in a corresponding display panel, and the display panel has two different panel states; the panel state is used to indicate whether the display surface of the display panel is facing the observation line of sight; and
  • the main control module is configured to detect a panel state of the display panel and determine the target touch substrate based on the panel state.
  • each display panel further comprises a plurality of signal lines, the plurality of signal lines comprising a signal line connecting a display driving module on the display panel with the main control module, and a signal line connecting the touch driving module with the main control module
  • the display device further comprises: a second flexible circuit board
  • the second flexible circuit board is used to transfer a plurality of signal lines in at least one first display panel to the second display panel;
  • the plurality of signal lines on the second display panel are connected to the main control module via a switching interface on the second display panel.
  • the touch driving module in the touch module is located in the second display panel, wherein the second flexible circuit board is also used to transfer multiple touch signal lines of the touch substrate corresponding to at least one of the first display panels to the second display panel, so that the transferred multiple touch signal lines are connected to the touch driving module.
  • the display panel has a display area and a non-display area
  • the non-display area includes a border area close to at least one side of the display area, and the touch drive module and the multiple signal lines are located in the border area; wherein the size of the border area of the second display panel is larger than the size of the border area of the first display panel.
  • the third display panel is located on a non-display surface side of the fourth display panel, wherein the fourth display panel is a foldable panel;
  • the fourth display panel When the fourth display panel is in a folded state, the third display panel displays a picture, and when the fourth display panel is in an unfolded state, the fourth display panel displays a picture.
  • the present disclosure also provides a touch driving method, which is applied to the touch module or the display device, and the method includes:
  • the touch control driving module performs touch control detection on the target touch control substrate.
  • the touch detection is a periodic touch detection
  • the method further includes:
  • the touch control driving module performs touch scanning on the third touch control substrate to obtain a reference sensing signal of the touch control electrode on the third touch control substrate;
  • the reference sensing signal is used to provide a reference signal when performing touch detection on the third touch substrate.
  • the target touch substrate includes a plurality of touch drive lines and a plurality of touch sensing lines, the plurality of touch drive lines are connected in series to a plurality of drive electrodes arranged along a first direction, and the plurality of touch sensing lines are connected in series to a plurality of sensing electrodes arranged along a second direction; the first direction intersects the second direction; and performing touch detection on the target substrate by using the touch drive module includes:
  • the first sub-period is different from the second sub-period.
  • the touch module provided in the present disclosure includes a touch driving module and multiple touch substrates, wherein the touch driving module is connected to the multiple touch substrates respectively, wherein the touch driving module is configured to perform touch switching among the multiple touch substrates, and the touch switching includes: turning on a connection path between the touch substrate and a target touch substrate to perform touch detection on the target touch substrate, and turning off a connection path between touch substrates other than the target touch substrate; wherein the target touch substrate is a touch substrate to be provided with a touch function.
  • FIG1 is a schematic diagram showing the overall structure of a first touch control module in an embodiment of the present disclosure
  • FIG2 shows a schematic structural diagram of a touch control driving module in an embodiment of the present disclosure
  • FIG3 shows a schematic structural diagram of a second touch module in an embodiment of the present disclosure
  • FIG4 shows a schematic structural diagram of a third touch module in an embodiment of the present disclosure
  • FIG5a shows a schematic diagram of the detailed structure of the first integrated unit, the second integrated unit and the touch chip in the third touch module shown in FIG4 ;
  • FIG5 b shows a schematic diagram of the overall structure of a touch driving module of the third touch module shown in FIG4 ;
  • FIG6 shows a schematic diagram of a connection structure between a touch control substrate and a touch control driving module in an embodiment of the present disclosure
  • FIG7 shows a schematic structural diagram of a display device in an embodiment of the present disclosure
  • FIG8 shows a schematic structural diagram of yet another display device in an embodiment of the present disclosure.
  • FIG9 a shows a schematic diagram of a planar structure of an exemplary display device, taking the touch module shown in FIG5 a as an example;
  • FIG9 b shows a schematic diagram of a planar structure of another exemplary display device, taking the touch module shown in FIG5 a as an example;
  • FIG10 is a schematic diagram showing a step flow of a touch driving method in an embodiment of the present disclosure.
  • FIG. 11 shows a timing diagram of a mutual capacitance touch driving circuit for periodically detecting the target touch substrate shown in FIG. 5 a ;
  • FIG. 12 shows a mutual capacitance touch driving timing diagram for periodically detecting the target touch substrate shown in FIG. 5 a ;
  • 13a-13b are schematic diagrams showing a driving circuit for performing mutual capacitive touch detection on the touch module shown in FIG5a;
  • 14a-14b are schematic diagrams showing a driving circuit for performing self-capacitive touch detection based on driving electrodes on the touch module shown in FIG. 5a;
  • FIG. 15 a - FIG. 15 b show schematic diagrams of a driving circuit for performing self-capacitive touch detection based on sensing electrodes on the touch module shown in FIG. 5 a .
  • a foldable screen mobile phone generally includes a main screen and a secondary screen. Both the main screen and the secondary screen need to display and touch normally. Therefore, both the main screen and the secondary screen need to have separate display chips (Display Integrated Circuit, DIC) and touch ICs (touch IC, TIC). In this way, there are the following two problems:
  • a foldable phone needs to use 2 DICs, 2 TICs, and twice the number of capacitors and resistors.
  • each TIC needs to be equipped with capacitors, resistors, transient voltage suppressors (TVS), crystal oscillators and other components.
  • the production cost and power consumption are high, resulting in high prices for foldable phones, affecting market share.
  • foldable phones generally require that both the main screen and the secondary screen support the active pen function.
  • the main screen and the secondary screen are two different TICs, these two TICs may come from different manufacturers and are not synchronized in terms of signal-to-noise ratio, linearity, accuracy, jitter and other performance. This makes it difficult to debug the active pen function of the main screen and the secondary screen, and often one can only turn off the active pen function of one display.
  • the present disclosure provides a touch module that can be applied to a display device that needs to integrate multiple display panels.
  • the touch module includes multiple touch substrates, and the multiple touch substrates share a touch driving module.
  • the touch driving module can perform touch detection on the touch substrates that need to provide touch functions by performing touch switching among the multiple touch substrates.
  • multiple touch modules only need one TIC. Since only one TIC is needed, the following effects can be achieved:
  • multiple touch substrates can share one TIC, it is possible to ensure that the active pen functions and performances configured on each of the multiple touch substrates in the touch module are synchronized, thereby making the multiple touch substrates uniform.
  • the active pen function can be maintained.
  • the touch module includes a touch driving module 200 and a plurality of touch substrates 100 .
  • different touch substrates 100 provide touch functions for different display panels 400;
  • the touch driving modules 200 are respectively connected to the plurality of touch substrates 100;
  • the touch driving module 200 is configured to perform touch switching among the plurality of touch substrates 100, and the touch switching includes: opening a connection path between the touch substrate 100 and the target touch substrate 100 to perform touch detection on the target touch substrate 100, and closing a connection path between the touch substrates 100 except the target touch substrate 100;
  • the target touch control substrate 100 is a touch control substrate 100 to be provided with a touch control function.
  • the touch substrate 100 may be a self-capacitive touch substrate 100 or a mutual-capacitive touch substrate 100.
  • the plurality of touch substrates 100 may all be self-capacitive touch substrates 100 or mutual-capacitive touch substrates 100.
  • the plurality of touch substrates 100 may include self-capacitive touch substrates 100 and mutual-capacitive touch substrates 100.
  • the touch substrate 1001 is a self-capacitive touch substrate 100
  • the touch substrate 1002 is a mutual-capacitive touch substrate 100.
  • the touch driving module 200 may be connected to the plurality of touch substrates 100 and implement switching among the plurality of touch substrates 100.
  • the sizes of the touch control substrates 100 may be different, that is, different touch control substrates 100 may provide touch control functions for display panels 400 of different sizes. Of course, in some embodiments, the sizes of the touch control substrates 100 may also be the same.
  • the touch area is provided with touch electrodes 106, the touch electrodes 106 are connected to touch signal lines 102, and the touch signals can be gathered to one side of the edge area after being routed in the edge area; wherein, the touch signal lines 102 are used to realize signal transmission between the touch electrodes 106 on the touch substrate 100 and the touch driving module 200.
  • the connection path between the touch driving module 200 and the touch substrate 100 may refer to the connection between the touch driving module 200 and the touch signal lines 102 on a plurality of touch substrates 100.
  • the touch control signal lines 102 of the plurality of touch control substrates 100 may be multiplexed.
  • MUX is an electronic circuit that can switch among multiple signals.
  • the touch driving module 200 can reuse the existing touch chip 201. For hardware, it is only necessary to add a multiplexing circuit between the touch chip 201 and the touch signal line 102 of the touch substrate 100.
  • the connection path between the touch chip 201 and a certain target touch substrate 100 can be turned on, the signal output by the touch chip 201 can be transmitted to the target touch substrate 100, and the signal fed back by the target touch substrate 100 can be received to realize touch detection, which can further reduce costs.
  • the touch driving module 200 can perform touch switching among multiple touch substrates 100.
  • the touch driving module 200 can conduct the connection path between the touch driving module 200 and the target touch substrate 100.
  • the touch driving module 200 can input a driving signal to the touch signal line 102 on the target touch substrate 100, and receive a sensing signal transmitted back by the touch signal line 102 on the target touch substrate 100. Based on the sensing signal, the touch position on the target touch substrate 100 can be obtained to realize touch detection of the target touch substrate 100.
  • the touch driving module 200 needs to perform touch detection on multiple touch substrates 100 in a one-to-many manner, when performing touch detection on the target touch substrate 100, the connection path between the touch driving module 200 and the touch substrates 100 other than the target touch substrate 100 (hereinafter referred to as other touch substrates 100) can be turned off.
  • the connection path between the touch driving module 200 and the touch signal lines 102 on the other touch substrates 100 is turned off, and it can neither output driving signals to the touch signal lines 102 on the other touch substrates 100, nor receive sensing signals transmitted back by the touch signal lines 102 on the touch substrates 100.
  • the other touch substrates 100 can be considered to be in a dormant state and will not provide touch function to the corresponding display panel 400.
  • the touch driving module 200 can conduct the connection path between the target touch substrate 100 to perform touch detection on the target touch substrate 100, and cut off the connection path between the touch substrates 100 except the target touch substrate 100, so that one touch driving module 200 can realize one-to-many touch detection by touch switching. In this way, even if there are multiple touch substrates 100, touch detection can be performed by one touch driving module 200, thereby reducing the manufacturing cost.
  • one integrated unit 202 corresponds to a plurality of first touch signal lines 102 respectively coming from a plurality of touch substrates 100 ;
  • the integrated unit 202 includes multiple signal transmission circuits in parallel, one signal transmission circuit is connected to a touch signal line 102 on a touch substrate 100, and is used to transmit the signal output by the touch chip 201 to the touch signal line 102, and transmit the signal input by the touch signal line 102 to the touch chip 201.
  • FIG. 2 shows a schematic diagram of the structure of a touch driving module 200 in an embodiment of the present disclosure.
  • the touch driving module 200 includes a touch chip 201 and a plurality of integrated units 202, wherein the internal schematic diagram of the touch chip 201 is shown in FIG. 2 , including a sensing signal module, a driving signal module, a driving control, a digital-to-analog conversion, a power management unit, etc.;
  • the touch signal line 102 is integrated into the integrated unit 202 , and is connected to the touch chip 201 via the integrated unit 202 .
  • the sensing signal module can choose to use a rectifier/feedback unit (Active Front End, AFE).
  • AFE Active Front End
  • the number of general sensing signal modules can match the number of touch signal lines set on the touch substrate.
  • the touch substrate C and the touch substrate D both include 40 touch signal lines, and the number of sensing signal modules is 40.
  • One sensing signal module corresponds to the touch signal lines with the same serial number on multiple touch substrates, and is used to rectify the sensing signal transmitted by the touch sensing line 1021, and feed back the voltage signal output by the power management unit to the touch sensing line 1021;
  • the driving signal module is used to output a driving signal to the touch driving line 1022, and the driving signal is output by the driving control;
  • the power management unit is used to provide the required positive voltage and negative voltage to the integrated unit 202;
  • the DSP, MCU and the like are internal modules of the driver chip, and are used to determine the touch position according to the sensing signal, and transmit the determination result of the touch position to the main control module 500 (subsequent embodiments) through the signal line 404 such as SPI/INT.
  • the signal output by the touch chip 201 may be a driving signal, and the signal input by the touch signal line 102 may be a sensing signal.
  • the signal output by the touch control chip 201 may be a driving signal output for the driving electrode, and the signal input by the touch control signal line 102 may be a capacitance signal sensed by the sensing electrode.
  • the number of integrated units 202 is related to the number of touch signal lines 102 on the touch substrate 100 .
  • One touch signal line 102 is regarded as one touch channel.
  • the number of integrated units 202 needs to meet the access requirements of all touch signal lines 102 set on the touch substrate 100 .
  • the signal transmission circuit may be determined according to the type of the touch control substrate 100. Specifically, at least a switch connected to the touch control chip 201 needs to be provided on the signal transmission circuit to control the on or off of the connection path between the touch control signal line 102 and the touch control chip 201. Specifically, the touch control chip 201 may control the on and off of the switch through an internal timing control circuit.
  • Each integrated unit 202 includes two signal transmission circuits connected in parallel.
  • the signal transmission circuit A is used to connect to the touch signal line 102 on the touch substrate 100A
  • the signal transmission circuit B is used to connect to the touch signal line 102 on the touch substrate 100B.
  • the touch driving module 200 includes n integrated units 202, and the i-th integrated unit 202 is used to correspond to the i-th touch signal line 102 on the two touch substrates 100, that is, to correspond to the i-th touch electrode 106 on the two touch substrates 100.
  • the signal transmission circuit in the i-th integrated unit 202 is used to transmit the signal output by the touch chip 201 to the i-th touch signal line 102 on the touch substrate 100, and to transmit the signal input by the i-th touch signal line 102 on the touch substrate 100A to the touch chip 201.
  • FIG. 3 shows the case where the touch signal lines 102 of the touch substrates 100 are the same.
  • the number of touch signal lines 102 of different touch substrates 100 may be different.
  • the number of integrated units 202 may be greater than or equal to the number of touch signal lines 102 on the first touch substrate 100, and the first touch substrate 100 is the touch substrate 100 with the largest number of touch signal lines 102.
  • the touch driving module 200 can have more redundant designs to meet the touch detection requirements of touch substrates 100 of different sizes.
  • n1 integrated units 202 may be included, wherein among the n1 integrated units 202, there are n1-n2 integrated units 202, and the signal transmission circuit A thereon is connected to the touch signal line 102 on the touch substrate 100A, while the signal transmission circuit B is not connected to the touch signal line 102.
  • the multiple touch substrates 100 can all be mutual capacitive touch substrates 100, and the multiple touch signal lines 102 on the mutual capacitive touch substrate 100 include touch driving lines 1022 extending along a first direction and touch sensing lines 1021 extending along a second direction, and the first direction intersects the second direction.
  • the touch substrate 100 may include a touch layer and a sensing layer, the touch layer includes a plurality of driving electrodes arranged along a first direction, and the sensing layer includes a plurality of sensing electrodes arranged along a second direction, wherein the touch driving line 1022 is connected to the plurality of driving electrodes, and the touch sensing line 1021 is connected to the plurality of sensing electrodes.
  • the integrated unit 202 in the touch driving module 200 can be divided into a first integrated unit 2021 corresponding to the touch driving line 1022 and a second integrated unit 2022 corresponding to the touch sensing line 1021 .
  • the integrated unit 202 includes a first integrated unit 2021 and a second integrated unit 2022; the touch chip 201 is used to output a driving signal to a plurality of first integrated units 2021, and receive a plurality of second integrated units 2022. Input sensing signal;
  • a first integrated unit 2021 corresponds to a plurality of touch driving lines 1022 from different touch substrates 100
  • a second integrated unit 2022 corresponds to a plurality of touch sensing lines 1021 from different touch substrates 100 .
  • the first integrated unit 2021 includes multiple driving circuits in parallel, each driving circuit is used to introduce a driving signal for a touch driving line 1022 on a touch substrate 100;
  • the second integrated unit 2022 includes multiple sensing circuits in parallel, each sensing circuit is used to receive a sensing signal on a touch sensing line 1021 on a touch substrate 100.
  • the touch substrates 100 are all mutual capacitance touch substrates 100.
  • the self-capacitive touch substrate it includes sensing electrodes and driving electrodes, wherein the driving electrodes can be arranged along a first direction, and the sensing electrodes can be arranged along a second direction.
  • the first direction can be the horizontal direction when looking down on the touch substrate 100
  • the second direction can be the vertical direction when looking down on the touch substrate 100, thereby forming multiple rows of driving electrodes and multiple columns of sensing electrodes.
  • a touch driving line 1022 is connected in series with multiple driving electrodes located in the same row
  • a touch sensing line 1021 is connected in series with multiple sensing electrodes located in the same column.
  • the first direction can be the vertical direction when looking down on the touch substrate 100
  • the second direction can be the horizontal direction when looking down on the touch substrate 100, thereby forming multiple columns of driving electrodes and multiple rows of sensing electrodes.
  • the touch position needs to be determined according to the capacitance between the driving electrode and the sensing electrode. Therefore, the orthographic projection of the driving electrode on the sensing layer overlaps with the sensing electrode.
  • the first integrated unit 2021 may be a unit for integrating touch driving lines 1022 from different touch substrates 100
  • the second integrated unit 2022 may be a unit for integrating touch sensing lines 1021 from different touch substrates 100 .
  • the number of first integrated units 2021 can be determined according to the number of touch drive lines 1022 in the touch substrate 100. As mentioned above, the number of first integrated units 2021 needs to be redundantly set to meet the number requirements of touch drive lines 1022 on multiple touch substrates 100. For example, for the touch substrate 100 with the largest number of touch drive lines 1022, the number of touch drive lines 1022 it has is m, then the number of first integrated units 2021 needs to be greater than m.
  • the touch control substrate C includes touch control driving lines 1022 Tx_M(0)-Tx_M(39), with a total of 40 touch control driving lines 1022 .
  • the touch control substrate D includes touch control driving lines 1022 Tx_S(0)-Tx_S(39), with a total of 40 touch control driving lines 1022 . Accordingly, there are 40 first integrated units 2021 . Similarly, the touch control chip 201 needs to have 40 I/O interfaces.
  • the touch control substrate C includes the touch control driving lines 1022 of Tx_M(0)-Tx_M(39), and the touch control substrate D includes the touch control driving lines 1022 of Tx_S(0)-Tx_S(19), for a total of 20 touch control driving lines 1022, then 40 first integrated units 2021 are required accordingly, and the touch control chip 201 similarly needs to have 40 I/O interfaces.
  • the number of the second integrated units 2022 can be determined according to the number of touch sensing lines 1021 in the touch substrate 100. As described above, the number of the second integrated units 2022 needs to be redundantly set to meet the number requirement of the touch sensing lines 1021 on multiple touch substrates 100. For example, for the touch substrate 100 with the largest number of touch sensing lines 1021, the number of touch sensing lines 1021 it has is j, then the number of the first integrated units 2021 needs to be greater than j.
  • the touch sensing lines 1021 included in the touch substrate C are Rx_M(0)-Rx_M(39), with a total of 40 touch sensing lines 1021.
  • the touch sensing lines 1021 included in the touch substrate D are Rx_S(0)-Rx_S(39), with a total of 40 touch sensing lines 1021. Accordingly, there are 40 second integrated units 2022. Similarly, the touch chip 201 needs to have 40 I/O interfaces.
  • the touch sensing lines 1021 included in the touch substrate C are Rx_M(0)-Rx_M(29), and the touch sensing lines 1021 included in the touch substrate D are Rx_S(0)-Rx_S(29), for a total of 40 touch sensing lines 1021, then 40 second integrated units 2022 are required accordingly, and the touch chip 201 similarly needs to have 40 I/O interfaces.
  • the first integrated unit 2021 corresponds to the touch drive line 1022, and it can receive the drive signal output by the touch chip 201, and input the drive signal to the touch drive line 1022 on the corresponding touch substrate 100.
  • a plurality of drive circuits connected in parallel can be used to achieve the purpose of inputting the drive signal to the touch drive line 1022 on a touch substrate 100.
  • Different drive circuits are connected to the touch drive lines 1022 on different touch substrates 100.
  • the drive signal output by the touch chip 201 is input to a touch drive line 1022 on the target touch substrate 100 via the drive circuit corresponding to the target touch substrate.
  • the second integrated unit 2022 corresponds to the touch sensing line 1021, and it can receive the sensing signal input by the touch sensing line 1021 on the corresponding touch substrate 100, and transmit the sensing signal to the touch chip 201.
  • a plurality of sensing circuits connected in parallel can be used to input the sensing signal of the touch sensing line 1021 on a touch substrate 100 to the touch chip 201.
  • Different sensing circuits are connected to the touch sensing lines 1021 on different touch substrates 100.
  • the sensing signal of the touch sensing line 1021 on the target touch substrate 100 is input to the touch chip 201.
  • the sensing signal outputted is input to the touch control chip 201 via the sensing circuit corresponding to the target touch control substrate.
  • FIG. 5a shows a detailed structural diagram of the first integrated unit 2021, the second integrated unit 2022 and the touch chip 201 in the third touch module shown in FIG. 4, and
  • FIG. 5b shows an overall structural diagram of the touch drive module in the third touch module shown in FIG. 4.
  • the touch drive lines of the touch substrate C and the touch substrate D are respectively connected to the drive signal module and the sensing signal module after passing through the MUX, and the touch sensing lines of the touch substrate C and the touch substrate D are connected to the sensing signal module after passing through the MUX.
  • the first integrated unit 2021 includes a plurality of parallel drive circuits, and the drive circuit may include a fourth switch, a fifth switch, a sixth switch, and a seventh switch according to actual needs;
  • the touch driving line 1022 is respectively connected to the first end of the fourth switch, the first end of the fifth switch, the first end of the sixth switch and the first end of the seventh switch;
  • the second ends of the fourth switch and the fifth switch are connected to the power signal output end of the touch chip 201, the second end of the sixth switch is grounded, and the second end of the seventh switch is connected to the drive signal output end of the touch chip 201;
  • the fourth switch is used to receive the positive voltage output by the power signal terminal
  • the fifth switch is used to receive the negative voltage output by the power signal terminal
  • the drive signal output terminal is used to output the drive signal
  • FIG5 a only shows the schematic diagram of the driving circuit of the 19th channel and the driving circuit of the 20th channel.
  • the driving circuits of other channels are consistent with the driving circuit of the 19th channel and the driving circuit of the 20th channel.
  • the driving circuit connected to the touch substrate C includes a fourth switch HCTRL, a fifth switch LCTRL, a sixth switch GCTRL and a seventh switch P1; wherein the touch driving line of the touch substrate C is respectively connected to the first end of the fourth switch HCTRL, the first end of the fifth switch LCTRL, the first end of the sixth switch GCTRL and the first end of the seventh switch P1.
  • the fourth switch HCTRL is connected to the power signal output terminal of the touch chip 201, and is used to receive the sent positive voltage signal.
  • the second end of the fifth switch LCTRL is connected to the power signal output terminal of the touch chip 201, and is used to receive the sent negative voltage signal.
  • the second end of the sixth switch GCTRL is grounded, and the second end of the seventh switch P1 is connected to the drive signal output terminal of the touch chip 201, and is used to control the connection path between the touch chip and the touch drive line. It should be noted that in mutual capacitive touch detection, the seventh switch P1 is disconnected, and in the self-capacitive touch detection, the seventh switch P1 is closed, and details may be referred to the description of the subsequent embodiments.
  • the touch driving module 200 can output a timing control signal, and under the control of the timing control signal, control the opening and closing of the fourth switch and the fifth switch to input pulse signals to the touch driving line 1022 on the target touch substrate 100 at different timings.
  • the specific process can be found in the description of the subsequent touch driving method embodiment, which will not be repeated here.
  • HVDD in Figure 5a refers to a positive voltage
  • LVDD refers to a negative voltage, which is generated by the internal power management unit (Power Management Unit, PMU) of the touch chip 201 and output to the fourth switch and the fifth switch through the power signal terminal
  • the power signal terminal may include a positive voltage terminal and a negative voltage terminal, the positive voltage terminal is connected to the fourth switch, and the negative voltage terminal is connected to the fifth switch.
  • the states of the fourth switch and the fifth switch can be controlled by a timing control signal in the driving chip.
  • the second integrated unit 2022 includes a plurality of parallel sensing circuits, and the sensing circuit may include a first switch, a second switch, and a third switch according to actual needs;
  • the touch sensing line 1021 is respectively connected to the first end of the first switch, the first end of the second switch and the first end of the third switch;
  • the second end of the first switch is grounded, the second ends of the second switch and the third switch are respectively connected to the touch chip 201 , the second switch is used to receive the positive voltage output by the touch chip 201 , and the third switch is used to input the sensing signal on the touch sensing line 1021 to the touch chip 201 .
  • FIG. 5 a only shows a schematic diagram of the sensing circuit of the 0th channel.
  • the driving circuits of other channels are consistent with the sensing circuit of the 0th channel.
  • the sensing circuit connected to the touch substrate C includes: a first switch RGCTRL, a second switch RHCTRL and a third switch P1'; wherein the touch sensing line 1021 of the touch substrate C is respectively connected to the first end of the first switch RGCTRL, the first end of the second switch RHCTRL and the first end of the third switch RHCTRL; wherein the second end of the first switch RGCTRL is grounded, and the second ends of the second switch RHCTRL and the third switch P1' are respectively connected to the touch chip 201, the second switch RHCTRL is used to receive the positive voltage output by the touch chip 201, and the third switch P1' is used to input the sensing signal on the touch sensing line 1021 to the touch chip 201.
  • the third switch P1' can be used to control the conduction and disconnection between the touch sensing line 1021 of the touch substrate C and the touch chip.
  • an anti-static unit may be provided for the touch driving line 1022 , and the anti-static unit is used to avoid interference from static electricity generated by the driving circuit when the driving signal passes through the driving circuit.
  • the touch driving line 1022 is connected to the first end of the fourth switch, the first end of the fifth switch and the first end of the sixth switch respectively, and is connected to the first end of the seventh switch after being connected in series with the antistatic unit.
  • the touch control chip 201 may include a first binding area and a second binding area, and the integrated unit 202 may be located in the first binding area or in the second binding area.
  • the first binding area may be a pin (PIN) area of the chip, or may be an I/O interface area of the chip.
  • the touch signal line 102 on the touch substrate 100 is led out from the touch substrate 100, laid in the touch driving module 200, and connected to the touch chip 201 after passing through the MUX in the integrated unit 202 in the first binding area of the touch driving module 200; or connected to the touch chip 201 after passing through the MUX in the integrated unit 202 in the second binding area of the touch driving module 200.
  • the number of I/O interfaces of the touch chip 201 needs to be the same as the number of integrated units 202, or at least greater than the number of integrated units 202.
  • the number of I/O interfaces of the touch chip 201 needs to be the same as the number of integrated units 202, and the number of integrated units 202 needs to be at least greater than the number of touch signal lines 102 on the touch substrate 100 having the largest number of corresponding touch signal lines 102.
  • the number of signal input interfaces (used to receive sensing signals from touch sensing lines 1021) of the touch chip 201 needs to be the same as the number of second integrated units 2022, and the number of second integrated units 2022 needs to be at least greater than the number of touch sensing lines 1021 on the corresponding touch substrate 100 with the largest number of touch sensing lines 1021;
  • the number of signal output interfaces (used to output driving signals to the outside) of the touch chip 201 needs to be the same as the number of first integrated units 2021, and the number of first integrated units 2021 needs to be at least greater than the number of touch driving lines 1022 on the corresponding touch substrate 100 with the largest number of touch driving lines 1022.
  • a redundant design of the touch substrate 100 can be achieved, so that the touch driving module 200 can meet the needs of multiple touch substrates 100 with different numbers of touch signal lines 102.
  • the integrated unit 202 may include a first An integrated unit 2021 and a second integrated unit 2022, wherein the first integrated unit 2021 includes at least one parallel driving circuit, the driving circuit is used to connect a touch driving line 1022 on a mutual capacitive touch substrate 100, and the second integrated unit 2022 includes at least one parallel sensing circuit, the sensing circuit is used to connect a touch sensing line 1021 on a mutual capacitive touch substrate 100;
  • the touch signal line 102 on the self-capacitive touch substrate 100 can be connected to the signal transmission circuit in the first integrated unit 2021, or connected to the signal transmission circuit in the second integrated unit 2022, and the signal transmission circuit can be the same as the sensing circuit, or the same as the driving circuit.
  • a driving circuit on the first integrated unit 2021 is used to input a driving signal to the touch driving line 1022 on the mutual capacitive touch substrate 100
  • a sensing circuit on the second integrated unit 2022 is used to receive a sensing signal input through the touch sensing line 1021 on the mutual capacitive touch substrate 100, so as to perform touch detection based on the sensing signal.
  • the signal transmission circuit on the first integrated unit 2021 is used to input a driving signal to the touch signal line 102 on the self-capacitive touch substrate 100, and receive a sensing signal input through the touch signal line 102 on the self-capacitive touch substrate 100, so as to perform self-capacitive touch detection based on the sensing signal.
  • the touch module includes a self-capacitive touch substrate 100 and a mutual-capacitive touch substrate 100 , touch switching between the self-capacitive touch substrate 100 and the mutual-capacitive touch substrate 100 can still be achieved to meet different touch requirements.
  • the touch signal lines 102 of multiple touch substrates 100 need to be connected to the same touch driving module 200, the touch signal lines 102 of the touch substrate 100 need to be routed to the location where the touch driving module 200 is located.
  • the touch driving module 200 can be located on the same panel 300 as any one of the touch substrates 100, so the touch signal lines 102 of the remaining touch substrates 100 need to be routed to the panel where the touch driving module 200 is located.
  • a large number of touch signal lines 102 need to be routed across the panel, and routing across the panel can easily lead to the breakage of the signal line when crossing the panel, such as the breakage of the touch signal line 102 due to folding/unfolding between the panels.
  • a flexible circuit board can be used to transfer the touch signal lines 102 of the remaining touch substrates 100 to the panel where the touch driving module 200 is located.
  • the panel 300 may be a display panel, or may be a base substrate on which a touch control substrate is located.
  • a schematic diagram of a connection structure between a touch substrate 100 and a touch driving module 200 is shown.
  • a flexible circuit board may be added between the touch substrate 100 and the touch driving module 200, and the touch signal lines 102 on the touch substrate 100 may be connected to the touch driving module 200 using the flexible circuit board.
  • the touch driving module 200 and the first touch substrate 100 are arranged in the same panel, and the touch module further includes: a first flexible circuit board 103; the first flexible circuit board 103 is used to connect the plurality of touch signal lines 102 on the second touch substrate 100 to the touch driving module 200; wherein the second touch substrate 100 is a touch substrate 100 other than the first touch substrate 100.
  • the first flexible circuit board 103 can be a highly reliable, excellent flexible printed circuit board (Flexible Printed Circuit, FPC) made of polyimide or polyester film as the substrate, which has the characteristics of high wiring density, light weight, thin thickness and good bendability.
  • FPC Flexible Printed Circuit
  • the touch substrate 100 generally includes a touch area and a non-touch area adjacent to the touch area.
  • the non-touch area is generally used for routing the touch signal line 102, while the touch area is used to set the touch electrode 106. After the touch signal line 102 is connected to the touch electrode 106, it is led out from the touch area and routed in the non-touch area.
  • the touch signal line 102 on the first touch substrate 100 (the touch substrate on the left side of FIG. 6 ) is led out to the non-touch area 105, it is connected to the touch driving module 200 located in the panel. Since the touch driving module 200 and the first touch substrate 100 are located in the same panel, after the touch signal line 102 of the first touch substrate 100 is led out, its routing distance is short and the space occupied is small. It can be directly connected to the touch driving module 200, specifically, it can be connected to the signal transmission circuit in the integrated unit 202 in the touch driving module 200.
  • the touch signal line 102 on the second touch substrate 100 (the touch substrate on the right side of FIG. 6 ) is led out to the non-touch area 105, it can be connected to the first flexible circuit board 103, and connected to the touch driving module 200 on another panel through the first flexible circuit board 103. Then, after the touch signal line 102 of the second touch substrate 100 is led out, its routing distance is relatively long because it needs to be laid across the panel to another panel. After being transferred through the first flexible circuit board 103, the problem of the touch signal line 102 being easily broken during the routing across the panel can be avoided.
  • the touch module shown in FIG. 5 a includes two mutual capacitive touch substrates 100 and a touch driving module 200.
  • the structures of the two touch substrates 100 include:
  • a touch layer on which a plurality of driving electrodes arranged along a first direction are disposed, the first direction being a row direction, a touch driving line 1022 is connected in series with a plurality of driving electrodes in a row and then led out to the outside of the touch substrate 100;
  • the sensing layer is provided with a plurality of sensing electrodes arranged along a second direction, the second direction being a column direction, and a touch sensing line 1021 is connected in series with a plurality of sensing electrodes in a column and then led out to the outside of the touch substrate 100;
  • the touch driving line 1022 may be routed on the touch layer, the touch sensing line 1021 may be routed on the sensing layer, and the orthographic projection of the driving electrode on the sensing layer overlaps with the sensing electrode.
  • one of the two touch substrates 100 in the touch module in this example has a 40 ⁇ 40 channel, i.e., includes 40 rows of driving electrodes and 40 columns of sensing electrodes
  • the other touch substrate F has a 20 ⁇ 40 channel, i.e., includes 20 rows of driving electrodes and 40 columns of sensing electrodes.
  • the touch sensing lines 1021 of the touch substrate C are Rx_M(0)-Rx_M(39), and the touch driving lines 1022 of the touch substrate C are Tx_M(0)-Tx_M(39); the touch driving lines 1022 of the touch substrate D are Tx_S(0)-Tx_S(19), and the touch sensing lines 1021 are Rx_M(0)-Rx_M(39).
  • the touch driving module 200 includes 40 first integrated units 2021 and 40 second integrated units 2022, wherein each first integrated unit 2021 corresponds to a row of touch driving lines 1022 in two touch substrates 100, and each second integrated unit 2022 corresponds to a column of touch sensing lines 1021 in two touch substrates 100;
  • the first integrated unit 2021 includes two parallel driving circuits, one driving circuit is used to connect a touch driving line 1022 on the touch substrate E, and the other driving circuit is used to connect a touch driving line 1022 on the touch substrate F.
  • the two driving circuits in the 20 first integrated units 2021 are both connected to a touch driving line 1022 on the touch substrates E and F, and only one driving circuit in the other 20 first integrated units 2021 is connected to a touch driving line 1022 on the touch substrate E.
  • the circuit structure of the driving circuit is shown in FIG5a.
  • the second integrated unit 2022 includes two parallel sensing circuits, one sensing circuit is used to connect a touch sensing line 1021 on the touch substrate E, and the other sensing circuit is used to connect the touch sensing line 1021 on the touch substrate E.
  • a touch sensing line 1021 on the substrate F as shown in FIG. 5 a , two sensing circuits connected in parallel in each of the 40 second integrated units 2022 are connected to the touch sensing line 1021 on the touch substrate E and the touch substrate F.
  • the circuit structure of the driving circuit is shown in FIG5 a in detail.
  • the active pen functions and performances configured on the multiple touch substrates 100 in the touch module can be synchronized, so that the multiple touch substrates 100 can all maintain the active pen function.
  • the embodiment of the present disclosure further provides a display device, which includes the touch module described in the above embodiment, and a display panel 400 corresponding to multiple touch substrates 100 in the touch module, and the touch substrate 100 provides a touch function for the display panel 400.
  • the touch substrate 100 can be embedded in the display panel 400, that is, an embedded touch substrate 100, or the touch substrate 100 can also be configured in the display panel 400 as an independent substrate, that is, an external touch substrate 100.
  • the touch module constituted by it can use a touch driving module 200 to provide touch function for multiple display panels 400 of the display device.
  • the display device only needs to be configured with one touch chip 201, which reduces the manufacturing cost of the display device.
  • the space occupied by the touch driving module 200 in the display device can be reduced, thereby leaving enough space for wiring of the display device, or laying a larger battery, so as to increase the standby time of the display device.
  • a touch driving module 200 since a touch driving module 200 is used, a set of capacitors, resistors, and TVS can be constructed to achieve ESD resistance, thereby eliminating the need to reduce the number of capacitor and resistor components, further reducing manufacturing costs, and thus reducing the manufacturing cost of the display device.
  • the display device may be a mobile phone, and the display panel 400 serves as a display screen of the mobile phone.
  • the display device may include an inward-folding display device, which may be divided into an up-and-down folding type and a left-and-right folding type. When the inward-folding display device is in an unfolded state, one display panel 400 is used. When in a folded state, another display panel 400 is used.
  • the display device takes an inward-folding display device as an example, and includes two display panels 400.
  • a third display panel 400 is located on a non-display surface side of another fourth display panel 400, wherein the fourth display panel 400 is a foldable panel.
  • the fourth display panel 400 When the fourth display panel 400 is in the folded state, the third display panel 400 displays a picture, and when the fourth display panel 400 is in the unfolded state, the fourth display panel 400 displays a picture.
  • the third display panel 400 is located on the non-display side of the fourth display panel 400, that is, the third display panel 400 can be stacked on the side of the fourth display panel 400 away from the display surface, and the fourth display panel 400 can be folded inwards. When folded inwards, the display surface of the fourth display panel 400 is buckled, and the third display panel 400 is used to display the picture. When the fourth display panel 400 is in the unfolded state, the display surface of the fourth display panel 400 is fully displayed, so that the fourth display panel 400 displays the picture.
  • the display device may completely include multiple display panels 400 and a touch substrate 100 configured on each display panel 400, and the multiple touch substrates 100 all share the same touch driving module 200.
  • the touch driving module 200 is located in any display panel 400 among the multiple display panels 400.
  • each display panel 400 is configured with an independent display driving module 402, such as a DIC (display driver chip).
  • each display panel 400 includes a display area 401 and a non-display area adjacent to the display area 401, and the display area 401 includes multiple display driving lines, and the multiple display driving lines extend from the display area 401 to the non-display area, and after converging on one side of the non-display area, they are connected to the display driving module 402; the display driving module 402 is used to generate a driving signal corresponding to each pixel unit in the display area 401 according to the picture to be displayed in the current week, so that each sub-pixel in the pixel unit emits light under the drive of the driving signal, thereby realizing picture display.
  • the display drive line can be routed at the edge of the non-display area, that is, at the frame.
  • the display drive line can be connected to the display drive module 402 after converging at the binding area of the display panel 400.
  • the binding area can be located on one side of the frame of the display panel 400. Generally, it is on a larger frame. If the display panel 400 is designed with a narrow frame, the binding area on one side of the frame can be bent and located on the side away from the display surface of the display panel 400.
  • the touch driving module 200 may be used to connect the connection path with the target touch substrate 100 in response to the touch switching signal, so as to perform touch detection on the target touch substrate 100 .
  • the main control module 500 can be a module that controls the display screen and touch function of the display device.
  • the main control module 500 can detect the target display panel 400 to be displayed. Specifically, based on the status presented between multiple display panels 400, the target display panel 400 to be displayed can be determined, and the touch substrate 100 configured with the target display panel 400 can be determined as the target touch substrate 100.
  • At least one display panel 400 among the multiple display panels 400 has two different panel states; the main control module 500 is configured to detect the panel state of the display panel 400 and determine the target touch substrate 100 based on the panel state.
  • the touch substrate 100 is generally configured in the display panel 400, and the panel state of the display panel 400 can be determined to determine whether the display panel 400 needs to display the picture.
  • its panel state can be: the display surface is facing the user's observation line of sight; when the display panel 400 does not need to display the picture, its panel state can be: the display surface is away from the user's observation line of sight.
  • the main control module 500 can determine whether the display panel 400 needs to display the picture by detecting the panel state of the display panel 400, and further determine whether the touch substrate 100 configured on the display panel 400 needs to perform touch display.
  • the other display panel 400 can be determined as the target display panel 400; if the display panel 400 is in an unfolded state and its display surface is facing the observation line of sight, the display panel 400 can be determined as the target display panel 400.
  • the main control module 500 can detect the folding state of the fourth display panel 400, that is, determine the target display panel 400 to be displayed.
  • the target display panel 400 is determined to be the third display panel 400.
  • the target display panel 400 is determined to be the fourth display panel 400, and the touch substrate 100 on the fourth display panel 400 is used as the target touch substrate 100.
  • the main control module 500 may also be connected to the display driver module 402 of the display panel 400, and is used to send display data to the target display panel 400 to be displayed, so as to instruct the display driver module 402 of the target display panel 400 to drive the target display panel 400 for display. Specifically, after determining the target display panel 400, the main control module 500 may transmit the picture data to be displayed on the target display panel 400 to the target display driver module 402 on the target display panel 400, and the target display driver module 402 drives the target display panel 400 for display according to the picture data.
  • the touch driver module 200 and the display driver module 402 on each display panel 400 also need to be connected to the main control module 500 to receive signals from the main control module 500 and send signals to the main control module 500.
  • the display panel 400 also includes a plurality of signal lines, the plurality of signal lines including a signal line connecting the display driver module 402 on the display panel 400 with the main control module 500, and a signal line connecting the touch driver module 200 with the main control module 500; wherein the plurality of signal lines include: at least two signal lines of a MIPI signal line, an SPI signal line, and a power line.
  • the plurality of signal lines are arranged in a non-display area of the display panel 400, for example, arranged in a binding area of the display panel 400.
  • multiple signal lines in multiple display panels 400 can be concentrated in one display panel 400 through a flexible circuit board, so that the display panel 400 can connect the signal lines of multiple display panels 400 to the main control module 500 through its configured adapter.
  • the display device further includes: a second flexible circuit board 104;
  • the second flexible circuit board 104 is used to transfer multiple signal lines in at least one first display panel 400 to the second display panel 400; the multiple signal lines on the second display panel 400 are connected to the main control module 500 through the adapter on the second display panel 400.
  • the size of the non-display area 401 of the second display panel 400 may be larger than that of the first display panel 400.
  • the size of the non-display area 401 of a display panel 400, specifically, the display area and the non-display area of the display panel 400, the non-display area including a frame area close to at least one side of the display area, the touch driving module 200 and the plurality of signal lines are located in the frame area, specifically, when the touch driving module 200 is located in the frame area of the second display panel 400; wherein the size of the frame area of the second display panel 400 is greater than the size of the frame area of the first display panel 400.
  • multiple signal lines and the touch driving module 200 can be routed on the second display panel 400 with a larger border area to fully utilize the space of the large border area.
  • a larger routing space can be freed up for the first display panel 400 to be used for routing the display driving lines in the first display panel 400, and to provide installation space for other components in the first display panel 400, such as battery components.
  • the size of the display area 401 of the second display panel 400 can be larger than the size of the display area 401 of the first display panel 400, or the size of the display area 401 of the second display panel 400 can be smaller than the size of the display area 401 of the first display panel 400, which is not limited here.
  • the touch driving module 200 can also be located in the second display panel 400.
  • the touch signal lines 102 of the touch substrate 100 configured on the first display panel 400 can also be transferred to the second display panel 400 through the second flexible circuit board 104.
  • multiple signal lines of the first display panel 400 can be transferred to the second display panel 400, and the touch signal lines 102 of the touch substrate 100 can also be transferred to the second display panel 400, so that the touch signal lines 102 of other touch substrates 100 are connected to the touch driving module 200 in the second display panel 400.
  • the display device in this embodiment is exemplarily described below by taking a specific example.
  • FIG. 9a takes the touch module shown in FIG. 5a as an example and shows a schematic diagram of a planar structure of an exemplary display device.
  • the display device may be an inward folding mobile phone, including:
  • the two display panels 400 are display panel C and display panel D, wherein display panel C is configured with touch substrate C in FIG. 5a , and touch substrate C provides touch function for display panel C; display panel D is configured with touch substrate D in FIG. 5a , and touch substrate D provides touch function for display panel D.
  • the display panel D is located on the side of the display panel C away from the display surface.
  • the display panel C can be folded toward the display surface. When the display panel C is folded, the display panel D is in a state of being displayed to the user.
  • the display panel D needs to display the picture when the picture is in the position; when the display panel C is unfolded, the display surface of the display panel C is fully exposed, and it needs to display the picture.
  • the touch driving module 200 is located in the non-display area 401 of the display panel C, specifically, in the lower frame area of the non-display area 401 of the display panel C.
  • the lower frame area also includes a display driving module 402 of the display panel C, such as a display driving chip DIC.
  • a display driving module 402 of the display panel D such as a display driving chip DIC, is arranged in the lower frame area of the non-display area 401 of the display panel D;
  • the multiple touch driving lines 1022 and the multiple touch sensing lines 1021 of the touch substrate D on the display panel D are led out from the non-touch area of the touch substrate D, routed in the frame area of the display panel D, and transferred to the display panel C through the flexible circuit board MFPC104, so as to be connected to the touch driving module 200 on the display panel C through the flexible circuit board MFPC104; and, after being routed in the non-display area, the multiple display driving lines on the display panel D converge to the binding area (interface area) 403 of the display panel D, and are connected to the display driving module 402, and the multiple signal lines 404 (including MIPI signal lines, SPI signal lines and power lines) led out by the display driving module 402 are also connected to the flexible circuit board MDPC, and the multiple signal lines are laid out in the frame area of the display panel C through the flexible circuit board MDPC;
  • a plurality of touch driving lines 1022 and a plurality of touch sensing lines 1021 of the touch substrate C on the display panel C are led out from the non-touch area of the touch substrate C, routed in the frame area of the display panel C, and connected to the touch driving module 200 on the display panel C;
  • multiple signal lines 404 (including MIPI signal lines, SPI signal lines and power lines) led out from the display driver module 402 on the display panel C, and multiple signal lines from the display panel D introduced by the flexible circuit board MDPC are all connected to the main control module 500 through an adapter.
  • the main control module 500 detects the state of the two display panels 400. If the display panel C is folded, the display panel D is determined to be the panel to be displayed. The main control module 500 sends the picture data of the display panel D to the display driving module 402 on the display panel D through multiple signal lines, and sends a touch switching signal to the touch driving module 200 through multiple signal lines.
  • the display driving module 402 of the display panel D drives a plurality of sub-pixels in the display panel D to emit light according to the picture data, thereby displaying the picture;
  • the touch driving module 200 cuts off the connection path with the touch substrate C according to the touch switching signal, and conducts the connection path with the touch substrate D, that is, establishes the connection path with the touch signal line 102 on the flexible circuit board MDPC, thereby performing touch detection on the touch substrate D.
  • the touch control substrate D is used to provide a touch control function for the display panel D while the display panel D is driving the display.
  • the main control module 500 sends the picture data of the display panel C to the display driving module 402 on the display panel C through multiple signal lines, and sends a touch switching signal to the touch driving module 200 through multiple signal lines;
  • the touch detection of the touch substrate C may refer to the touch detection of the touch substrate D, which will not be described in detail herein.
  • a display device in a specific example in which there are a display panel C and a display panel D, wherein the display panel C is configured with the touch substrate C in FIG. 5a , and the touch substrate C provides a touch function for the display panel C; the display panel D is configured with the touch substrate D in FIG. 5a , and the touch substrate D provides a touch function for the display panel D.
  • a plurality of signal lines of the display panel C and the display panel D are respectively connected to the main control module 500 through respective adapters. The rest of the structure is shown in FIG. 9a .
  • the display device only needs to be configured with one touch control chip 201 , thereby reducing the manufacturing cost of the display device.
  • the space occupied by the touch driving module 200 in the display device can be reduced, thereby leaving enough space for wiring of the display device or laying out a larger battery to increase the standby time of the display device.
  • a touch driving module 200 since a touch driving module 200 is used, a set of capacitors, resistors, and TVS can be constructed to achieve ESD resistance, thereby eliminating the need to reduce the number of capacitor and resistor components, further reducing manufacturing costs, and thus reducing the manufacturing cost of the display device.
  • the present disclosure further provides a touch function driving method.
  • the touch function driving method can be applied to the above touch module or the above display device, and specifically can include the following steps:
  • Step S1001 determining a target touch substrate 100 to be touch-driven currently
  • Step S1002 cutting off the connection path between the touch driving module 200 and the third touch substrate 100 except the target touch substrate 100, and opening the connection path between the touch driving module 200 and the target touch substrate 100;
  • Step S1003 performing touch detection on the target touch substrate 100 by the touch driving module 200 .
  • the target touch substrate 100 to be touch-driven can be determined by the main control module 500. Further, the main control module 500 can be determined based on the state of the touch substrates 100, for example, based on the folding state of the panel where the touch substrate C is located. If it is folded, another touch substrate D is determined as the target touch substrate 100. If it is unfolded, the touch substrate E is driven as the target touch substrate 100. Specifically, the description of the above-mentioned embodiment of the display device can be referred to.
  • the touch driving module 200 may cut off the connection path with the third touch substrate 100 except the target touch substrate 100 , and connect the connection path between the touch driving module 200 and the target touch substrate 100 , so that the touch driving module 200 performs touch detection on the target touch substrate 100 .
  • touch detection may include mutual capacitance touch detection and self capacitance touch detection.
  • the touch detection of the target touch substrate 100 may be mutual capacitance touch detection or self capacitance touch detection, or the touch detection of the target touch substrate 100 may include both mutual capacitance touch detection and self capacitance touch detection.
  • the touch substrate 100 can be a mutual capacitive touch substrate 100, that is, it includes multiple touch drive lines 1022 and multiple touch sensing lines 1021, the touch drive lines 1022 are connected in series with multiple drive electrodes arranged along the first direction, and the touch sensing lines 1021 are connected in series with multiple sensing electrodes arranged along the first direction; the first direction intersects or is orthogonal to the second direction.
  • mutual capacitance touch detection and self capacitance touch detection can be performed in different time periods. Specifically, in the first time period, mutual capacitance touch detection is performed on the target touch substrate 100; in the second time period, self capacitance touch detection is performed on the target touch substrate 100; then, touch signals can be obtained based on mutual capacitance touch detection and self capacitance touch detection; wherein the first time period and the second time period have no overlapping time period.
  • the mutual capacitance detection principle is as follows: Since the sensing electrode and the driving electrode overlap, a capacitor will be formed at the overlap of the electrodes, that is, the two layers of electrodes at the overlap constitute the two poles of the capacitor.
  • a finger touches the touch substrate it affects the coupling between the two electrodes near the touch point, thereby changing the capacitance between the two electrodes.
  • the touch sensing line 1021 transmits the change in capacitance as a sensing signal to the touch chip 201, and the touch chip 201 can detect the change in capacitance based on the change in the sensing signal and the position of the sensing line. Position and determine the touch position.
  • each touch electrode 106 is connected to a touch signal line 102, and the capacitance borne by each touch electrode 106 is a fixed value.
  • the capacitance borne by the corresponding touch electrode 106 is a fixed value superimposed on the human body capacitance.
  • the touch chip 201 scans the touch electrodes 106 row by row or column by column, and receives feedback signals from the touch electrodes 106. When a touch occurs, the capacitance value of the touch electrode 106 at the touched position changes, and the touch chip 201 determines the touch position based on the capacitance change.
  • the touch substrate 100 may be a mutual capacitance touch substrate 100 .
  • the touch driving module 200 can input a driving signal to the touch driving line 1022 of the target touch substrate 100, and receive a sensing signal transmitted back by the touch sensing line 1021 of the target touch substrate 100; after a touch detection is performed on the entire surface of the target touch substrate 100, a self-capacitive touch detection can be performed on the target touch substrate 100 in the second time period, and the touch driving module 200 can input a driving signal to the touch driving line 1022 of the target touch substrate 100, and receive a sensing signal transmitted back by the touch driving line 1022 of the target touch substrate 100; or, the touch driving module 200 can input a driving signal to the touch sensing line 1021 of the target touch substrate 100, and receive a sensing signal transmitted back by the touch sensing line 1021 of the target touch substrate 100.
  • the first time period may be before the second time period, or the first time period may be after the second time period.
  • it can be determined according to the needs, and will not be elaborated here.
  • the touch driving module 200 can determine the touch position by combining the results of mutual capacitance touch detection and the results of self capacitance touch detection, thereby improving the accuracy of the touch position determination and avoiding misdetermination.
  • the interval between the first time period and the second time period can be small, for example, less than 1ms, thereby avoiding the problem of reduced accuracy of touch position determination due to a long time interval.
  • FIG11 shows a timing diagram of a mutual capacitance touch driving circuit for periodically detecting the target touch substrate 100 shown in FIG5 a
  • FIG12 shows a timing diagram of a mutual capacitance touch driving circuit for periodically detecting the target touch substrate 100 shown in FIG5 a .
  • FIGS. 13a and 13b a schematic diagram of a circuit for performing mutual capacitive touch detection on the target touch substrate in FIG. 5 is shown.
  • FIGS. 13a and 13b taking the target touch substrate as the touch substrate C as an example, when performing mutual capacitive touch detection on the target touch substrate 100, Disconnecting the connection path between the touch control substrate D and the touch control chip can be performed in the following stages:
  • the first stage Reset stage, LCTRL is closed, GCTRL, HCTRL and P1 are disconnected, Tx PAD voltage is stable at LVDD (negative voltage) ⁇ Rx PAD, RGCTRL' is closed, P1' is disconnected, Rx PAD is grounded, and the voltage is stable at 0V;
  • Tx driving stage GCTRL is closed, LCTRL, HCTRL, P1 are disconnected, Tx PAD voltage jumps to 0V ⁇ Rx PAD, RGCTRL is disconnected, P1' is closed, and AFE receives the charge signal of Rx;
  • Tx driving stage HCTRL is closed, LCTRL, GCTRL, P1 are disconnected, Tx PAD voltage jumps to HVDD ⁇ Rx PAD, RGCTRL is disconnected, P1' is closed, and AFE receives the charge signal of Rx;
  • Tx driving stage GCTRL is closed, LCTRL, HCTRL, P1 are disconnected, Tx PAD voltage jumps to 0V ⁇ Rx PAD, RGCTRL is disconnected, P1' is closed, and AFE receives the Rx signal;
  • Tx driving stage LCTRL is closed, HCTRL, GCTRL, P1 are disconnected, Tx PAD voltage jumps to LVDD ⁇ Rx PAD, RGCTRL is disconnected, P1' is closed, and AFE receives the Rx signal;
  • the seventh stage Reset stage, LCTRL is closed, GCTRL, HCTRL, P1 are disconnected, and the Tx PAD voltage is stabilized at LVDD (negative pressure);
  • the touch detection on the touch substrate D may refer to the touch detection on the touch substrate C, which will not be described in detail.
  • the self-capacitive touch detection since it includes the sensing electrodes and the driving electrodes, the self-capacitive touch detection can be performed based on the sensing electrodes, or based on the driving electrodes.
  • a driving signal may be provided to the touch driving line 1022 in the target touch substrate 100 in the first sub-period of the second period, and based on the touch driving line 1022, the touch driving line 1022 may be driven.
  • the sensing signal fed back is used to obtain the touch position on the touch substrate 100;
  • the first sub-period is different from the second sub-period.
  • Figure 14a shows a schematic diagram of a driving circuit for performing self-capacitive touch detection on the driving electrodes in the touch module shown in Figure 5a
  • Figure 14b shows a schematic diagram of a driving circuit for performing self-capacitive touch detection on the driving electrodes in another touch module shown in Figure 5a
  • Figure 15a shows a schematic diagram of a driving circuit for performing self-capacitive touch detection on the sensing electrodes in the touch module shown in Figure 5a
  • Figure 15a shows a schematic diagram of a driving circuit for performing self-capacitive touch detection on the sensing electrodes in another touch module shown in Figure 5a.
  • the process may be:
  • the touch substrate C when the touch substrate C is self-capacitively driven, it can be performed based on the driving electrodes in the touch substrate C, wherein the switch S1 on the touch driving line on the touch substrate D is disconnected, and the switch S1' on the touch sensing line on the touch substrate D is disconnected.
  • the switch P1' on the touch sensing line on the touch substrate C is disconnected, and the switch P1 on the touch driving line on the touch substrate C is closed, and the AFE directly performs self-capacitive scanning and sensing on the driving electrodes on the touch substrate C;
  • the touch substrate D when the touch substrate D is self-capacitively driven, it can be based on the driving electrodes in the touch substrate D, wherein the switch P1 on the touch driving line on the touch substrate C is disconnected, and the switch P1' on the touch sensing line on the touch substrate C is disconnected.
  • the switch S1' on the touch sensing line on the touch substrate D is disconnected, and the switch S1 on the touch driving line on the touch substrate D is closed; the AFE directly performs self-capacitive scanning and sensing on the driving electrodes on the touch substrate D.
  • the touch substrate C when the touch substrate C is driven by self-capacitive method, it can be driven based on the sensing electrodes in the touch substrate C, wherein the switch S1 on the touch driving line on the touch substrate D is disconnected, and the switch S1' on the touch sensing line on the touch substrate D is disconnected.
  • the switch P1' on the touch sensing line on the touch substrate C is closed, and the switch P1 on the touch driving line on the touch substrate C is disconnected, and the AFE directly performs self-capacitive scanning and sensing on the sensing electrodes on the touch substrate C.
  • the touch substrate D when the touch substrate D is driven by self-capacitance, it can be driven based on the sensing electrodes in the touch substrate D, wherein the switch P1' on the touch sensing line on the touch substrate C is disconnected.
  • the switch P1 on the touch driving line on the touch substrate C is turned off, the switch S1 on the touch driving line on the touch substrate D is turned off, and the switch S1' on the touch sensing line on the touch substrate D is turned on.
  • the AFE directly performs self-capacitive scanning and sensing on the sensing electrodes on the touch substrate D.
  • self-capacitive touch detection may be performed only based on sensing electrodes, or only based on driving electrodes.
  • the other touch substrate 100 in order to prevent the touch sensitivity of the other touch substrate 100 from being reduced when switching from the target touch substrate 100 to the other touch substrate 100, the other touch substrate 100 also needs to be refreshed at a low frequency (for example, 1 Hz) while touch detection is being performed on the target touch substrate 100, that is, the other touch substrate 100 can be touch driven in the gap between touch drives of the target touch substrate 100 to obtain reference signals of each sensing electrode and driving electrode on the other touch substrate 100.
  • a low frequency for example, 1 Hz
  • the touch driving module 200 performs touch scanning on the third touch substrate 100 to obtain a reference sensing signal of the touch electrode 106 on the third touch substrate 100; the reference sensing signal is used to provide a reference signal when performing touch detection on the third touch substrate 100.
  • the detection gap may refer to the period between the completion of one touch detection on the entire touch substrate 100 and the next touch detection.
  • the touch detection on the third touch substrate 100 may be performed in the same manner as the touch detection on the target touch substrate 100. Specifically, when the third touch substrate 100 is subjected to touch detection, the third switch P1' in the sensing circuit connected to the touch sensing line 1021 on the third touch substrate 100 in the touch driving module 200 will be closed in an instant, so that the touch chip 201 can receive the sensing signal transmitted by the touch sensing line 1021 on the third touch substrate 100.
  • the completion of one touch detection on the entire surface of the target touch substrate 100 may refer to the completion of one mutual capacitance touch detection and one self capacitance touch detection on the entire surface of the target touch substrate 100 .
  • the touch electrodes 106 (including the driving electrodes and the sensing electrodes) thereon will not be touched by fingers. Therefore, the sensing signals obtained therefrom can represent the reference signals when the touch electrodes 106 are not touched, thereby forming a comparison with the signals when the touch electrodes 106 are touched. Based on the difference obtained by the comparison, It is determined whether the touch electrode 106 is touched.
  • the touch detection performed on the third touch substrate 100 may be a mutual capacitance touch detection. Alternatively, it may include mutual capacitance touch detection and self capacitance touch detection. Of course, when the touch detection performed on the third touch substrate 100 includes mutual capacitance touch detection and self capacitance touch detection, the accuracy of the reference signal may be improved, thereby providing a more accurate reference signal when the third touch substrate 100 provides a touch function, thereby improving the accuracy of determining the touch position.
  • the method embodiment is similar to the above-mentioned embodiments of the touch module and the display device, so the description is relatively simple, and the relevant parts can be referred to the method embodiment.
  • the present disclosure also provides an electronic device, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor implements the touch driving method described in the embodiment of the present disclosure when executed.
  • the embodiment of the present disclosure further provides a computer-readable storage medium, which stores a computer program that enables a processor to execute the touch control driving method as described in the embodiment of the present disclosure.
  • references herein to "one embodiment,” “embodiment,” or “one or more embodiments” mean that a particular feature, structure, or characteristic described in conjunction with the embodiment is included in at least one embodiment of the present disclosure.
  • examples of the term “in one embodiment” do not necessarily all refer to the same embodiment.
  • any reference signs placed between brackets shall not be construed as limiting the claims.
  • the word “comprising” does not exclude the presence of elements or steps not listed in the claims.
  • the word “a” or “an” preceding an element does not exclude the presence of a plurality of such elements.
  • the present disclosure may be implemented by means of hardware comprising a number of different elements and by means of a suitably programmed computer. In a unit claim enumerating a number of means, several of these means may be embodied by the same item of hardware.
  • the use of the words first, second, and third, etc. does not indicate any order. These words may be interpreted as names.

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Abstract

提供了触控模组、显示装置以及触控驱动方法，触控模组，包括：触控驱动模块（200），以及与触控驱动模块（200）分别连接的多个触控基板（100），不同的触控基板（100）用于为不同的显示面板（400）提供触控功能，其中：触控驱动模块（200），被配置为在多个触控基板（100）中进行触控切换，触控切换包括：导通与目标触控基板（100）之间的连接通路，以对目标触控基板（100）进行触控检测，以及关断与除目标触控基板（100）外的触控基板（100）之间的连接通路；其中，目标触控基板（100）为当前提供触控功能的触控基板（100）。

Description

触控模组、显示装置以及触控驱动方法
相关申请的交叉引用
本公开要求在2023年5月25日提交中国专利局、申请号为202310602720.4、名称为“触控模组、显示装置以及触控驱动方法”的中国专利申请的优先权，其全部内容通过引用结合在本公开中。
技术领域
本公开涉及显示技术领域，特别是涉及一种触控模组、显示装置以及触控驱动方法。
背景技术
随着显示技术的不断发展，触控显示装置得到了广泛的应用，触控显示装置中包括触控面板和显示面板，触控面板用于为显示面板提供触控功能。在一些显示装置中集成了多个显示面板，需要为每个显示面板配置触控面板，以单独针对每个显示面板提供触控功能。相关技术中，对于集成有多个显示面板的显示装置而言，需要为每个触控面板配置对应的触控驱动芯片(Touch Integrated Circuit，TIC)。
发明内容
鉴于上述问题，本公开实施例提出了一种触控模组、显示装置以及触控驱动方法。
本公开提供一种触控模组，包括：
触控驱动模块，以及与所述触控驱动模块分别连接的多个触控基板，不同触控基板用于为不同显示面板提供触控功能，其中：
所述触控驱动模块，被配置为在所述多个触控基板中进行触控切换，所述触控切换包括：导通与目标触控基板之间的连接通路，以对所述目标触控基板进行触控检测，以及关断与除所述目标触控基板外的触控基板之间的连接通路；并且
其中，所述目标触控基板为当前提供所述触控功能的触控基板。
可选地，每个触控基板包括多条触控信号线，所述触控驱动模块包括：触控芯片以及与所述触控芯片分别连接的多个集成单元；每个集成单元用于集成分别来自所述多个触控基板上的触控信号线；并且
其中，每个集成单元包括并联的多个信号传输电路，每个信号传输电路与所述多个触控基板之一上的一条触控信号线连接，用于将所述触控芯片输出的信号传输至该触控信号线，以及将经由该触控信号线输入的信号传输至所述触控芯片。
可选地，每个触控基板上的多条所述触控信号线中包括沿第一方向延伸的触控驱动线和沿第二方向延伸的触控感应线，所述第一方向与所述第二方向交叉；
其中，每个集成单元包括第一集成单元和第二集成单元，所述第一集成单元用于集成分别来自不同触控基板的多条触控驱动线，所述第二集成单元用于集成分别来自不同触控基板的多条触控感应线；
其中，所述第一集成单元包括并联的多个驱动电路，每个驱动电路用于将所述触控芯片输出的驱动信号，传输给所述多个触控基板之一上的一条所述触控驱动线；并且
所述第二集成单元包括并联的多个感应电路，每个所述感应电路用于将所述多个触控基板之一上的一条所述触控感应线上的感应信号传输给所述触控芯片。
可选地，每个感应电路包括：第一开关、第二开关以及第三开关；
其中，每条触控感应线分别与所述第一开关的第一端、所述第二开关的第一端和所述第三开关的第一端连接；并且
所述第一开关的第二端接地，所述第二开关和所述第三开关的第二端分别与所述触控芯片连接，所述第二开关用于接收所述触控芯片输出的正电压，所述第三开关用于向所述触控芯片输入该触控感应线上的感应信号。
可选地，每个驱动电路包括：第四开关、第五开关、第六开关和第七开关；
其中，每条触控驱动线分别与所述第四开关的第一端、第五开关的第一端、所述第六开关的第一端和第七开关的第一端连接；
所述第四开关和所述第五开关的第二端分别与所述触控芯片的电源信号端连接，所述第六开关的第二端接地，所述第七开关的第二端与所述触控芯片 的驱动信号输出端连接；
其中，所述第四开关用于接收所述电源信号端输出的正电压，所述第五开关用于接收所述电源信号端输出的负电压，所述驱动信号输出端用于输出所述驱动信号。
可选地，每个驱动电路还包括防静电单元；并且
每条触控驱动线分别与所述第四开关的第一端、第五开关的第一端和所述第六开关的第一端连接，并在与所述防静电单元串接后，与所述第七开关的第一端连接。
可选地，所述触控驱动模块与第一触控基板位于同一面板中，所述触控模组还包括：第一柔性电路板；
所述第一柔性电路板用于将第二触控基板上的多条触控信号线，连接到所述触控驱动模块；
其中，所述第一触控基板为所述多个触控基板中的任一触控基板，所述第二触控基板为除所述第一触控基板外的触控基板。
可选地，所述触控驱动模块包括第一绑定区和第二绑定区；每个集成单元位于所述第一绑定区或位于所述第二绑定区。
可选地，在不同触控基板中，所述多条触控信号线的数量相同或不同；
其中，所述多个集成单元的数量大于或等于第一触控基板上的触控信号线的数量，所述第一触控基板为触控信号线的数量最多的触控基板。
本公开还提供了一种显示装置，包括所述触控模组，以及与所述触控模组中多个触控基板分别对应的显示面板；
其中，每个触控基板为对应的显示面板提供触控功能。
可选地，所述显示装置还包括主控模块，所述主控模块与所述触控模组中的触控驱动模块连接；
其中，所述主控模块，被配置为确定待切换到的目标触控基板，并向所述触控驱动模块发送针对所述目标触控基板的触控切换信号；并且
所述触控驱动模块，用于响应于所述触控切换信号，导通与所述目标触控基板之间的连接通路，以对所述目标触控基板进行触控检测。
可选地，每个触控基板配置到对应的显示面板中，该显示面板具有两种不同面板状态；所述面板状态用于表征该显示面板的显示面是否正对观察视线； 并且
所述主控模块，被配置为检测该显示面板所处的面板状态，并基于所述面板状态，确定所述目标触控基板。
可选地，每个显示面板还包括多条信号线，所述多条信号线包括连接该显示面板上的显示驱动模块与所述主控模块的信号线，以及连接所述触控驱动模块与所述主控模块的信号线，所述显示装置还包括：第二柔性电路板；
其中，所述第二柔性电路板用于将至少一个第一显示面板中的多条信号线，转接到第二显示面板中；
所述第二显示面板上的多条信号线，通过所述第二显示面板上的转接口连接到所述主控模块。
可选地，所述触控模组中的触控驱动模块位于所述第二显示面板中，其中，所述第二柔性电路板还用于将至少一个所述第一显示面板对应的触控基板的多条触控信号线，转接到所述第二显示面板中，以使被转接的多条触控信号线与所述触控驱动模块连接。
可选地，所述显示面板显示区和非显示区，所述非显示区包括靠近所述显示区的至少一侧的边框区，所述触控驱动模块和所述多条信号线位于所述边框区；其中，所述第二显示面板的边框区的尺寸大于所述第一显示面板的边框区的尺寸。
可选地，在所述多个显示面板中，第三显示面板位于第四显示面板的非显示面一侧，其中，所述第四显示面板为可折叠面板；
在所述第四显示面板处于折叠状态的情况下，所述第三显示面板显示画面，在所述第四显示面板处于展开状态的情况下，所述第四显示面板显示画面。
本公开还提供了一种触控驱动方法，应用于所述触控模组，或应用于所述显示装置中，所述方法包括：
确定当前待触控驱动的目标触控基板；
切断所述触控驱动模块与除所述目标触控基板外的第三触控基板的连接通路，并导通所述触控驱动模块与所述目标触控基板之间的连接通路；并且
通过所述触控驱动模块对所述目标触控基板进行触控检测。
可选地，所述触控检测为周期性的触控检测，所述方法还包括：
在对所述目标触控基板进行周期性的触控检测的检测间隙，通过所述触 控驱动模块对所述第三触控基板进行触控扫描，得到所述第三触控基板上的触控电极的基准感应信号；并且
其中，所述基准感应信号，用于在对所述第三触控基板进行触控检测时，提供参考信号。
可选地，所述目标触控基板包括多条触控驱动线和多条触控感应线，所述多条触控驱动线串接沿第一方向排布的多个驱动电极，所述多条触控感应线串接沿第二方向排布的多个感应电极；所述第一方向与所述第二方向相交；通过所述触控驱动模块对所述目标基板进行触控检测，包括：
在第一时段，对所述目标触控基板进行互电容式触控检测；
在第二时段，对所述目标触控基板进行自电容式触控检测；
基于所述互电容式触控检测和所述自电容式触控检测，获取触控信号；
其中，所述第一时段与所述第二时段无重叠时段。
可选地，在所述第二时段，对所述目标触控基板进行自电容式触控检测，包括：
在所述第二时段的第一子时段，向所述目标触控基板中的所述多条触控驱动线提供驱动信号，并基于所述触控驱动线反馈的感应信号，获取所述触控基板上的触控位置；
和/或，在所述第二时段的第二子时段，向所述目标触控基板中的所述多条触控感应线提供驱动信号，并基于所述多条触控感应线反馈的感应信号，获取所述目标触控基板上的触控位置；
其中，所述第一子时段不同于所述第二子时段。
本公开中提供的触控模组，包括触控驱动模块和多个触控基板，触控驱动模块分别与多个触控基板连接，其中，触控驱动模块被配置为在多个触控基板中进行触控切换，触控切换包括：导通与目标触控基板之间的连接通路，以对目标触控基板进行触控检测，以及关断除目标触控基板外的触控基板之间的连接通路；其中，目标触控基板为待提供触控功能的触控基板。
上述说明仅是本公开技术方案的概述，为了能够更清楚了解本公开的技术手段，而可依照说明书的内容予以实施，并且为了让本公开的上述和其它目的、特征和优点能够更明显易懂，以下特举本公开的具体实施方式。
附图说明
为了更清楚地说明本公开实施例的技术方案，下面将对本公开实施例的描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本公开的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动性的前提下，还可以根据这些附图获得其他的附图。
图1示出了本公开一种实施例中的第一种触控模组的整体结构示意图；
图2示出了本公开一种实施例中的触控驱动模块的结构示意图；
图3示出了本公开一种实施例中的第二种触控模组的结构示意图；
图4示出了本公开一种实施例中的第三种触控模组的结构示意图；
图5a示出了图4所示的第三种触控模组中第一集成单元、第二集成单元和触控芯片的细节结构示意；
图5b示出了图4所示的第三种触控模组的触控驱动模块的整体结构示意图；
图6示出了本公开一种实施例中触控基板与触控驱动模块之间的一种连接结构示意图；
图7示出了本公开一种实施例中一种显示装置的结构示意图；
图8示出了本公开一种实施例中又一种显示装置的结构示意图；
图9a所示以图5a所示的触控模组为例，示出了一种示例性的显示装置的平面结构示意图；
图9b所示以图5a所示的触控模组为例，示出了又一种示例性的显示装置的平面结构示意图；
图10示出了本公开一种实施例中一种触控驱动方法的步骤流程示意图；
图11示出了对图5a所示的目标触控基板进行周期性检测的互容触控驱动电路时序图；
图12示出了对图5a所示的目标触控基板进行周期性检测的互容触控驱动时序图；
图13a-图13b示出了对图5a所示的触控模组进行互电容式触控检测的驱动电路示意图；
图14a-图14b示出了对图5a所示的触控模组，进行基于驱动电极的自电容式触控检测的驱动电路示意图；并且
图15a-图15b示出了对图5a所示的触控模组，进行基于感应电极的自电容式触控检测的驱动电路示意图。
具体实施例
为使本公开的上述目的、特征和优点能够更加明显易懂，下面将结合本公开实施例中的附图，对本公开实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本公开一部分实施例，而不是全部的实施例。基于本公开中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本公开保护的范围。
相关技术中，在一些显示装置中集成了多个显示面板，以折叠屏手机为例，折叠手机一般包括主屏和副屏，主屏与副屏均需要正常显示和触控，因此主屏和副屏均需要有单独的显示芯片(Display Integrated Circuit，DIC)和触控IC(touch IC,TIC)。这样，便存在以下两方面的问题：
第一方面，一个折叠手机需要使用2颗DIC，2颗TIC，以及2倍的电容电阻器件，如需要为每个TIC配置电容电阻、瞬态二极管(Transient Voltage Suppressor，TVS)、晶振等元器件，制作成本和功耗都较高，导致所售卖的折叠手机售价都很高，影响市场的占有率。
第二方面，折叠手机一般均要求主屏和副屏都支持主动笔功能，但是，由于主屏与副屏是两颗不同的TIC，这两颗TIC可能来自不同厂商，在信噪比、线性度、精准度、抖动度等性能上不同步，导致主屏与副屏的主动笔功能调试工作难度大，往往只能关掉一个显示屏的主动笔功能。
有鉴于此，本公开提供了一种触控模组，可以应用到需要集成多个显示面板的显示装置中，具体地，触控模组包括多个触控基板，多个触控基板共享一个触控驱动模块，触控驱动模块可以通过在多个触控基板中进行触控切换，对需要提供触控功能的触控基板进行触控检测。由此，使得多个触控模组可以只需要一个TIC，由于只需要一个TIC，从而可以达到以下效果：
第一，只需要为触控驱动模块配置一套电容电阻器件，制作成本和功耗都得到降低；
第二，由于多个触控基板可以共享一个TIC，则可以保证触控模组中多个触控基板各自所配置的主动笔功能同步、性能同步，从而使得多个触控基板均 可以保持主动笔功能。
参照图1所示，示出了本公开一种实施例中的触控模组的整体结构示意图，结合图1所示，对本公开的一种触控模组进行介绍，如图1所示，触控模组包括触控驱动模块200和多个触控基板100。
其中，不同触控基板100为不同显示面板400提供触控功能；
其中，触控驱动模块200分别与多个触控基板100连接；
其中，触控驱动模块200，被配置为在多个触控基板100中进行触控切换，触控切换包括：导通与目标触控基板100之间的连接通路，以对目标触控基板100进行触控检测，以及关断除目标触控基板100外的触控基板100之间的连接通路；
其中，目标触控基板100为待提供触控功能的触控基板100。
本实施例中，触控基板100可以是自电容式触控基板100或互电容式触控基板100，对多个触控基板100而言，多个触控基板100可以均是自电容式触控基板100或均是互电容式触控基板100，或者，多个触控基板100中可以包括自电容式触控基板100以及互电容式触控基板100，例如，触控基板1001是自电容式触控基板100，触控基板1002是互电容式触控基板100。不论是哪种情况，触控驱动模块200均可以与多个触控基板100连接，并在多个触控基板100中实现切换。
其中，多个触控基板100的尺寸可以不同，也就是说，不同触控基板100可以为不同尺寸的显示面板400提供触控功能。当然，在一些实施例中，多个触控基板100的尺寸也可以相同。
其中，无论是自电容式触控基板100还是互电容式触控基板100，其都具有触控区域和围绕触控区域的边缘区域，触控区域布设触控电极106，触控电极106连接触控信号线102，触控信号在边缘区域走线后可以汇聚到边缘区域的一侧；其中，触控信号线102用于实现触控基板100上的触控电极106与触控驱动模块200之间的信号传输。其中，触控驱动模块200与触控基板100之间的连接通路，可以是指触控驱动模块200与多个触控基板100上的触控信号线102之间的连接。
具体地，由于多个触控基板100共享同一个触控驱动模块200，则在一些可选实现方式中，多个触控基板100的触控信号线102可以经过多路复用电 路(Multiplexer，MUX)后，集成到触控驱动模块200中，MUX是一种电子电路，它可以在多路信号中进行切换。此种情况下，触控驱动模块200可以复用现有的触控芯片201，对硬件而言，只需要在触控芯片201与触控基板100的触控信号线102之间增加多路复用电路即可。由此，可以通过触控芯片201的内部切换逻辑，通过多路复用电路，通过通路复用电路可以导通触控芯片201与某一个目标触控基板100之间的连接通路，将触控芯片201输出的信号传输给目标触控基板100，以及接收目标触控基板100反馈的信号即可实现触控检测，可以进一步降低成本。
触控驱动模块200可以在多个触控基板100中进行触控切换，在一次触控切换中，触控驱动模块200可以导通与目标触控基板100之间的连接通路，此种情况下，触控驱动模块200可以向目标触控基板100上的触控信号线102输入驱动信号，以及接收目标触控基板100上的触控信号线102传输回的感应信号，基于感应信号，可以获取目标触控基板100上的触控位置，以实现对目标触控基板100的触控检测。
当然，由于触控驱动模块200需要一对多地对多个触控基板100进行触控检测，则在对目标触控基板100进行触控检测时，可以关断触控驱动模块200与除目标触控基板100外的触控基板100(以下称其他触控基板100)之间的连接通路，也就是说，触控驱动模块200与其他触控基板100上的触控信号线102之间的连接通路是关断的，既不能向其他触控基板100上的触控信号线102输出驱动信号，也不会接收触控基板100上的触控信号线102传回的感应信号，此种情况下，其他触控基板100可以被认为处于休眠状态，不会向对应的显示面板400提供触控功能。
采用此种实施例中的触控模组，可以在多个触控基板100中的目标触控基板100需要提供触控功能时，触控驱动模块200可以导通与目标触控基板100之间的连接通路，以对目标触控基板100进行触控检测，以及关断除目标触控基板100外的触控基板100之间的连接通路，从而使得一个触控驱动模块200可以通过触控切换的方式，实现一对多的触控检测。这样，即使存在多个触控基板100，也可以通过一个触控驱动模块200进行触控检测，从而降低了制造成本。
如上所述，触控基板100一般包括自电容式触控基板100和互电容式触 控基板100。无论是自电容式触控基板100还是互电容式触控基板100，都具有触控信号线102。在一种示例性实施例中，触控驱动模块200包括：触控芯片201以及与触控芯片201分别连接的多个集成单元202；
其中，一个集成单元202对应分别来自多个触控基板100的多条第一触控信号线102；
其中，集成单元202包括并联的多个信号传输电路，一个信号传输电路与一个触控基板100上的一条触控信号线102连接，用于将触控芯片201输出的信号传输至触控信号线102，以及将触控信号线102输入的信号传输至触控芯片201。
参照图2所示，图2示出了本公开一种实施例中的触控驱动模块200的结构示意图，如图2所示，触控驱动模块200包括触控芯片201和多个集成单元202，其中，触控芯片201的内部示意图如图2所示，包括感应信号模块、驱动信号模块、驱动控制、数模转换、电源管理单元等；
其中，触控信号线102集成到集成单元202，通过集成单元202连接至触控芯片201。
其中，感应信号模块可以选择采用整流/回馈单元(Active Front End，AFE)，需要说明的是，如图5a所示，一般感应信号模块的数量可以与触控基板上设置的触控信号线的数量匹配，例如，触控基板C和触控基板D都包括40条触控信号线，则感应信号模块的数量为40个，一个感应信号模块对应多个触控基板上的具有同一序列号的触控信号线，用于将触控感应线1021所传输的感应信号进行整流，以及将电源管理单元输出的电压信号回馈至触控感应线1021；
其中，驱动信号模块用于向触控驱动线1022输出驱动信号，其驱动信号由驱动控制输出；
其中，电源管理单元用于为集成单元202提供所需的正电压、负电压；
其中，DSP、MCU等作为驱动芯片的内部模块，用于根据感应信号确定触控位置，并通过SPI/INT等信号线404向主控模块500(后续实施例)传输触控位置的确定结果。
其中，触控芯片201输出的信号可以是驱动信号，触控信号线102输入的信号可以是感应信号，实际中，根据触控基板100的类型，如是互电容式触 控基板100，则触控芯片201输出的信号可以是针对驱动电极输出的驱动信号，触控信号线102输入的信号可以是感应电极感应到的电容信号。
其中，集成单元202的数量与触控基板100具有的触控信号线102的数量相关，一条触控信号线102视为一个触控通道，则集成单元202的数量需要满足全部触控基板100上设置的触控信号线102的接入需求。
其中，信号传输电路可以根据触控基板100的类型确定，具体而言，在信号传输电路上至少需要设置与触控芯片201连接的开关，以控制触控信号线102与触控芯片201之间的连接通路的导通或关断。具体地，触控芯片201可以通过内部时序控制电路，控制开关的导通与关断。
在一个具体示例中，多个触控基板100可以均是自电容式触控基板100，该自电容式触控基板100可以包括触控层，在触控层上排布多个呈网格状的触控电极106，每个触控电极106连接一条触控信号线102。参照图3所示，图3示出了第二种触控模组的结构示意图，如图3所示，包括触控基板100A和触控基板100B，该两个触控基板100均是自电容式触控基板100，其中，两个触控基板100的尺寸可以相同，包括相同数量的触控电极106，假设数量为n，触控电极106呈阵列排布。
其中，每个集成单元202包括并联的两个信号传输电路，信号传输电路A用于与触控基板100A上的触控信号线102连接，信号传输电路B用于与触控基板100B上的触控信号线102连接。
其中，触控驱动模块200包括n个集成单元202，第i个集成单元202用于对应两个触控基板100上的第i条触控信号线102，即对应两个触控基板100上的第i个触控电极106。具体地，第i个集成单元202中的信号传输电路，用于将触控芯片201输出的信号传输至触控基板100上的第i条触控信号线102，以及将触控基板100A上的第i条触控信号线102输入的信号传输至触控芯片201。
示例地，在触控驱动模块200对触控基板100A进行触控检测时，触控驱动模块200可以导通触控芯片201与所有集成单元202中的信号传输电路A之间的通路，从而使得触控芯片201输出的信号可以经由信号传输电路A传输到触控基板100A上，触控基板100A上的触控电极106接收这一信号后，会在触控电极106上形成感应电容，感应电容会因为人的手指的触摸，而产 生电容变化，这一电容变化被该触控电极106连接的触控信号线102又传回到信号传输电路A；由此，触控芯片201可以接收经由信号传输电路A传回的信号，以根据传回的信号，确定触控位置，从而实现触控检测。
当然，上述图3示出的是触控基板100的触控信号线102相同的情况。在一些示例中，不同触控基板100的触控信号线102的数量可以不同，则此种情况下，集成单元202的数量可以大于或等于第一触控基板100上的触控信号线102的数量，第一触控基板100为触控信号线102的数量最多的触控基板100。
由此，可以使得触控驱动模块200具有较多的冗余设计，以满足不同尺寸的触控基板100的触控检测需求。
在不同触控基板100具有不同数量的触控信号线102的情况下，以图3为例，假设触控基板100A包括n1条触控信号线102，触控基板100B包括n2条触控信号线102，其中，n1大于n2，则可以包括n1个集成单元202，其中，在n1个集成单元202中，存在n1-n2个集成单元202，其上的信号传输电路A与触控基板100A上的触控信号线102连接，而信号传输电路B未与触控信号线102连接。
在一个具体示例中，多个触控基板100可以均是互电容式触控基板100，该互电容式触控基板100上的多条触控信号线102中包括沿第一方向延伸的触控驱动线1022和沿第二方向延伸的触控感应线1021，第一方向与所述第二方向交叉。
其中，触控基板100可以包括触控层和感应层，在触控层上包括多个沿第一方向排列的驱动电极，在感应层上包括多个沿第二方向排列的感应电极，其中，触控驱动线1022与多个驱动电极连接，触控感应线1021与多个感应电极连接。
在该示例中，触控驱动模块200中的集成单元202可以分为与触控驱动线1022对应的第一集成单元2021，以及与触控感应线1021对应的第二集成单元2022。
参照图4所示，示出了第三种触控模组的结构示意图，如图4所示，集成单元202包括第一集成单元2021和第二集成单元2022；触控芯片201用于向多个第一集成单元2021输出驱动信号，以及接收多个第二集成单元2022 输入的感应信号；
其中，一个第一集成单元2021对应分别来自不同的触控基板100上的多条触控驱动线1022，一个第二集成单元2022对应分别来自不同的触控基板100上的多条触控感应线1021；
其中，第一集成单元2021包括并联的多个驱动电路，每个驱动电路用于为一个触控基板100上的一条触控驱动线1022引入驱动信号；第二集成单元2022包括并联的多个感应电路，每个感应电路用于接收一个触控基板100上的一条触控感应线1021上的感应信号。
如图4所示，触控基板100均是互电容式触控基板100，对于自电容式触控基版而言，其包括感应电极和驱动电极，其中，驱动电极可以沿第一方向排布，感应电极沿第二方向排布，第一方向可以是俯视触控基板100的横向，第二方向可以是俯视触控基板100的纵向，由此形成多行驱动电极和多列感应电极。其中，一条触控驱动线1022与位于同一行的多个驱动电极串接，一条触控感应线1021与位于同一列的多个感应电极串接。当然，在其他一些示例中，第一方向可以是俯视触控基板100的纵向，第二方向可以是俯视触控基板100的横向，由此形成多列驱动电极和多行感应电极。
由于是互电容式触控基版，需要根据驱动电极与感应电极之间的电容确定触控位置，因此，驱动电极在感应层上的正投影与感应电极存在交叠。
其中，第一集成单元2021可以是用于集成分别来自不同的触控基板100上的触控驱动线1022的单元，第二集成单元2022可以是用于集成分别来自不同的触控基板100上的触控感应线1021的单元。
其中，第一集成单元2021的数量可以依据触控基板100中所具有的触控驱动线1022的数量确定，如上所述，第一集成单元2021的数量需要进行冗余设置，以满足多个触控基板100上的触控驱动线1022的数量需求，如对触控驱动线1022的数量最多的触控基板100，其具有的触控驱动线1022的数量是m，则第一集成单元2021的数量需要大于m。
如图4所示，触控基板C包括的触控驱动线1022为Tx_M(0)-Tx_M(39)，共40条触控驱动线1022，触控基板D包括的触控驱动线1022为Tx_S(0)-Tx_S(39)，共40条触控驱动线1022，则相应有40个第一集成单元2021，触控芯片201同理需要具备40个I/O接口。
当然，若触控基板C包括的触控驱动线1022为Tx_M(0)-Tx_M(39)，触控基板D包括的触控驱动线1022为Tx_S(0)-Tx_S(19)，共20条触控驱动线1022，则相应需要40个第一集成单元2021，触控芯片201同理需要具备40个I/O接口。
同理，第二集成单元2022的数量可以依据触控基板100中所具有的触控感应线1021的数量确定，如上所述，第二集成单元2022的数量需要进行冗余设置，以满足多个触控基板100上的触控感应线1021的数量需求，如对触控感应线1021的数量最多的触控基板100，其具有的触控感应线1021的数量是j，则第一集成单元2021的数量需要大于j。
如图4所示，触控基板C包括的触控感应线1021为Rx_M(0)-Rx_M(39)，共40条触控感应线1021，触控基板D包括的触控感应线1021为Rx_S(0)-Rx_S(39)，共40条触控感应线1021，则相应有40个第二集成单元2022，触控芯片201同理需要具备40个I/O接口。
当然，若触控基板C包括的触控感应线1021为Rx_M(0)-Rx_M(29)，触控基板D的触控感应线1021为包括Rx_S(0)-Rx_S(29)，共40条触控感应线1021，则相应需要40个第二集成单元2022，触控芯片201同理需要具备40个I/O接口。
实际中，第一集成单元2021对应触控驱动线1022，则其可以接收触控芯片201输出的驱动信号，并将驱动信号输入到对应的触控基板100上的触控驱动线1022。如图4所示，可以通过并联的多个驱动电路，实现将驱动信号输入某一个触控基板100上的触控驱动线1022的目的。其中，不同的驱动电路连接不同的触控基板100上的触控驱动线1022，在对目标触控基板100进行触控检测时，触控芯片201输出的驱动信号经由目标触控基版对应的驱动电路输入给目标触控基板100上的一条触控驱动线1022。
同理，第二集成单元2022对应触控感应线1021，则其可以接收对应的触控基板100上的触控感应线1021输入的感应信号，并将该感应信号传输给触控芯片201。如图4所示，可以通过并联的多个感应电路，实现将某一个触控基板100上的触控感应线1021的感应信号输入到触控芯片201的目的。其中，不同的感应电路连接不同的触控基板100上的触控感应线1021，在对目标触控基板100进行触控检测时，目标触控基板100上的一条触控感应线1021输 出的感应信号，经由与目标触控基版对应的感应电路输入给触控芯片201。
参照图5a和图5b所示，图5a示出了图4所示的第三种触控模组中第一集成单元2021、第二集成单元2022和触控芯片201的细节结构示意图，图5b示出了图4所示的第三种触控模组中的触控驱动模块的整体结构示意图，如图5b所示，触控基板C和触控基板D的触控驱动线经过MUX后分别与驱动信号模块和感应信号模块连接，触控基板C和触控基板D的触控感应线经过MUX后与感应信号模块连接。由此，可以方便后续在对触控基板C和触控基板D进行基于驱动电极的自电容式触控检测。
在一些实施例中，如图5a所示，第一集成单元2021包括多个并联的驱动电路，则该驱动电路可以根据实际需求，包括第四开关、第五开关、第六开关和第七开关；
其中，所述触控驱动线1022分别与所述第四开关的第一端、第五开关的第一端、所述第六开关的第一端和第七开关的第一端连接；
其中，第四开关与第五开关的第二端与触控芯片201的电源信号输出端连接，第六开关的第二端接地，第七开关的第二端与触控芯片201的驱动信号输出端连接；
其中，第四开关用于接收电源信号端输出的正电压，第五开关用于接收电源信号端输出的负电压，驱动信号输出端用于输出驱动信号。
其中，图5a仅示出了第19个通道的驱动电路和第20个通道的驱动电路的示意图，实际中，其他通道的驱动电路与第19个通道的驱动电路和第20个通道的驱动电路一致。
以触控基板C为例，与触控基板C连接的驱动电路包括第四开关HCTRL、第五开关LCTRL、第六开关GCTRL和第七开关P1；其中，触控基板C的触控驱动线分别与第四开关HCTRL的第一端、第五开关LCTRL的第一端、第六开关GCTRL的第一端和第七开关P1的第一端连接。
第四开关HCTRL连接触控芯片201的电源信号输出端，用于接收发送的正电压信号，第五开关LCTRL的第二端与触控芯片201的电源信号输出端连接，用于接收发送的负电压信号；第六开关GCTRL的第二端接地，第七开关P1的第二端与触控芯片201的驱动信号输出端连接，用于控制触控芯片与触控驱动线之间的连接通路，需要说明的是，在互电容式触控检测中，第七开关 P1断开，在自电容式触控检测中，第七开关P1闭合，具体详见后续实施例的描述即可。
在对目标触控基板100进行触控检测时，触控驱动模块200可以输出时序控制信号，并在时序控制信号的控制下，控制第四开关和第五开关的开闭，以在不同时序向目标触控基板100上的触控驱动线1022输入脉冲信号，具体的过程，可以详见后续的触控驱动方法实施例的描述，在此不再赘述。
其中，图5a中的HVDD指正电压，LVDD指负电压，由触控芯片201内部电源管理单元(Power Management Unit,PMU)生成，并通过电源信号端输出给第四开关和第五开关，其中，电源信号端可以包括正电压端和负电压端，正电压端连接第四开关，负电压端连接第五开关。
第四开关和第五开关的状态，可以由驱动芯片中的时序控制信号控制。
在一些实施例中，如图5a所示，第二集成单元2022包括多个并联的感应电路，则该感应电路可以根据实际需求，包括第一开关、第二开关以及第三开关；
其中，触控感应线1021分别与第一开关的第一端、第二开关的第一端和第三开关的第一端连接；
其中，第一开关的第二端接地，第二开关和第三开关的第二端分别与触控芯片201连接，第二开关用于接收触控芯片201输出的正电压，第三开关用于向触控芯片201输入触控感应线1021上的感应信号。
其中，图5a仅示出了第0个通道的感应电路的示意图，实际中，其他通道的驱动电路与第0个通道的感应电路一致。
以触控基板C为例，与触控基板C连接的感应电路包括：第一开关RGCTRL、第二开关RHCTRL以及第三开关P1'；其中，触控基板C的触控感应线1021分别与第一开关RGCTRL的第一端、第二开关RHCTRL的第一端和第三开关RHCTRL的第一端连接；其中，第一开关RGCTRL的第二端接地，第二开关RHCTRL和第三开关P1'的第二端分别与触控芯片201连接，第二开关RHCTRL用于接收触控芯片201输出的正电压，第三开关P1'用于向触控芯片201输入触控感应线1021上的感应信号，在互电容式和自电容式触控检测中，第三开关P1'可以用于控制触控基板C的触控感应线1021与触控芯片之间的导通和关断。
如图5a所示，对于互电容式触控基板100，其还可以针对触控驱动线1022设置防静电单元，该防静电单元用于避免驱动信号经由驱动电路时，驱动电路所产生的静电的干扰。
具体地，触控驱动线1022与所述第四开关的第一端、第五开关的第一端和所述第六开关的第一端分别连接，并与所述防静电单元串接后，与所述第七开关的第一端连接。
在一些可选的实施例中，触控芯片201可以包括第一绑定区和第二绑定区，集成单元202可以位于第一绑定区或位于第二绑定区。
其中，第一绑定区可以是芯片的引脚(PIN)区，或者可以是芯片的I/O接口区。此种实施例中，触控基板100上的触控信号线102由触控基板100引出后，布设到触控驱动模块200中，并在触控驱动模块200的第一绑定区中的集成单元202中经过MUX后，与触控芯片201连接；或者，在触控驱动模块200的第二绑定区中的集成单元202中经过MUX后，与触控芯片201连接。
需要说明的是，在上述两种触控模组中，触控芯片201的I/O接口数量需要与集成单元202的数量相同，或至少大于集成单元202的数量，如针对自电容式触控基板100，触控芯片201的I/O接口数量需要与集成单元202的数量相同，而集成单元202的数量又需要至少大于对应的触控信号线102数量最多的触控基板100上的触控信号线102的数量。
如针对互电容式触控基板100，触控芯片201的信号输入接口(用于接收触控感应线1021的感应信号)的数量需要与第二集成单元2022的数量相同，而第二集成单元2022的数量又需要至少大于对应的触控感应线1021数量最多的触控基板100上的触控感应线1021的数量；触控芯片201的信号输出接口(用于向外输出驱动信号)的数量需要与第一集成单元2021的数量相同，而第一集成单元2021的数量又需要至少大于对应的触控驱动线1022数量最多的触控基板100上的触控驱动线1022的数量。由此，可以实现对触控基板100的冗余设计，使得触控驱动模块200可以满足触控信号线102数量不同的多个触控基板100。
当然，在一些可选实施例中，在触控基板100中既包括自电容式触控基板100，也包括互电容式触控基板100的情况下，集成单元202可以包括第一 集成单元2021和第二集成单元2022，其中，第一集成单元2021包括至少一个并联的驱动电路，该驱动电路用于连接一个互电容式触控基板100上的触控驱动线1022，第二集成单元2022包括至少一个并联的感应电路，该感应电路用于连接一个互电容式触控基板100上的触控感应线1021；
其中，自电容式触控基板100上的触控信号线102可以与第一集成单元2021中的信号传输电路连接，或者与第二集成单元2022中的信号传输电路连接，信号传输电路可以与感应电路相同，或者与驱动电路相同。
其中，在需要对互电容式触控基板100进行触控检测时，利用第一集成单元2021上的驱动电路，向互电容式触控基板100上的触控驱动线1022输入驱动信号，利用第二集成单元2022上的感应电路，接收经互电容式触控基板100上的触控感应线1021输入的感应信号，以基于感应信号进行触控检测。
其中，在需要对自电容式触控基板100进行触控检测时，假设信号传输电路位于第一集成单元2021中，则可以关断所有第一集成单元2021中的驱动电路，以及第二集成单元2022中的感应电路，以切断互电容式触控基板100与驱动芯片之间的连接，同时，利用第一集成单元2021上的信号传输电路，向自电容式触控基板100上的触控信号线102输入驱动信号，并接收经自电容式触控基板100上的触控信号线102输入的感应信号，以基于感应信号进行自电容式触控检测。
采用此种实施方案时，可以在触控模组中包括自电容式触控基板100和互电容式触控基板100的情况下，仍然可以实现自电容式触控基板100和互电容式触控基板100之间的触控切换，满足不同的触控需求。
由于多个触控基板100的触控信号线102需要与同一个触控驱动模块200连接，触控基板100的触控信号线102便需要走线到触控驱动模块200所在的位置。触控驱动模块200可以与其中任一个触控基板100位于同一面板300上，由此，其余触控基板100的触控信号线102都需要走线到触控驱动模块200所位于的面板上。由此，有较多数量的触控信号线102需要跨面板走线，而跨面板走线容易导致信号线在跨面板时的断裂，如跨面板之间因折叠/展开等动作，会导致触控信号线102的断裂。在一种示例中，可以采用柔性电路板，将其余触控基板100的触控信号线102转接到触控驱动模块200所位于的面板上。
其中，面板300可以是显示面板，或者可以是触控基板所位于的衬底基板。
参照图6所示，示出了触控基板100与触控驱动模块200之间的一种连接结构示意图，实际中，为了使得多个触控基板100上的触控信号线102，与触控驱动模块200连接，可以在触控基板100与触控驱动模块200之间增加柔性电路板，利用柔性电路板将触控基板100上的触控信号线102连接到触控驱动模块200中。
具体地，如图6所示，触控驱动模块200与第一触控基板100设置在同一面板中，触控模组还包括：第一柔性电路板103；所述第一柔性电路板103用于将第二触控基板100上的多条触控信号线102，连接到触控驱动模块200；其中，第二触控基板100为除第一触控基板100外的触控基板100。
其中，第一柔性电路板103可以是以聚酰亚胺或聚酯薄膜为基材制成的一种具有高度可靠性，绝佳的柔性印刷电路板(Flexible Printed Circuit,FPC)，具有配线密度高、重量轻、厚度薄、弯折性好的特点。
在本实施例中，触控基板100一般包括触控区和与触控区相邻的非触控区，非触控区一般用于触控信号线102的走线，而触控区用于设置触控电极106，触控信号线102连接触控电极106后，由触控区引出并在非触控区走线。
其中，如图6所示，第一触控基板100(图6左侧的触控基板)上的触控信号线102引出到非触控区105后，与位于面板中的触控驱动模块200连接，由于触控驱动模块200与第一触控基板100位于同一面板中，则该第一触控基板100的触控信号线102被引出后，其走线距离较短，空间占用小，其可以直接与触控驱动模块200连接，具体地，可以与触控驱动模块200中的集成单元202中的信号传输电路连接。
其中，如图6所示，第二触控基板100(图6右侧的触控基板)上的触控信号线102引出到非触控区105后，可以与第一柔性电路板103连接，通过第一柔性电路板103与另一面板上的触控驱动模块200连接，则该第二触控基板100的触控信号线102被引出后，其走线由于需要跨面板布设到另一面板中，走线距离较长，在通过第一柔性电路板103转接后，可以避免触控信号线102在跨面板走线中容易发生断裂的问题。
下面，通过一个具体示例，对一种示例性的触控模组进行说明。
以图5a所示的触控模组为例，包括两个互电容式触控基板100，以及一个触控驱动模块200，两个触控基板100的结构均包括：
触控层，在触控层上设置有沿第一方向排列的多个驱动电极，第一方向为行方向，一条触控驱动线1022与一行的多个驱动电极串接后，引出到触控基板100的外侧；
感应层，在感应层上设置有沿第二方向排列的多个感应电极，第二方向为列方向，一条触控感应线1021与一列的多个感应电极串接后，引出到触控基板100的外侧；
其中，触控驱动线1022可以在触控层走线，触控感应线1021可以在感应层走线，驱动电极在感应层上的正投影与感应电极之间具有交叠。
与图5a所示的不同的是，该示例中的触控模组中两个触控基板100中的一个触控基板E是40×40的通道，即包括40行驱动电极和40列感应电极，另一个触控基板F包括20×40的通道，即包括20行驱动电极和40列感应电极。
其中，触控基板C的触控感应线1021为Rx_M(0)-Rx_M(39)，触控基板C的触控驱动线1022为Tx_M(0)-Tx_M(39)；触控基板D的触控驱动线1022为Tx_S(0)-Tx_S(19)，触控感应线1021为Rx_M(0)-Rx_M(39)。
其中，触控驱动模块200包括40个第一集成单元2021和40个第二集成单元2022，其中，每一个第一集成单元2021对应两个触控基板100中的一行触控驱动线1022，每个第二集成单元2022对应两个触控基板100中的一列触控感应线1021；
其中，第一集成单元2021中包括两个并联的驱动电路，一个驱动电路用于连接触控基板E上的一条触控驱动线1022，另一个驱动电路用于连接触控基板F上的一条触控驱动线1022，以图5a所示为参考，20个第一集成单元2021中的两个驱动电路均连接触控基板E和F上的一条触控驱动线1022，另外20个第一集成单元2021中仅有一个驱动电路连接触控基板E上的一条触控驱动线1022。
其中，驱动电路的电路结构详见图5a所示。
其中，第二集成单元2022中包括两个并联的感应电路，一个感应电路用于连接触控基板E上的一条触控感应线1021，另一个感应电路用于连接触控 基板F上的一条触控感应线1021，如图5a所示，40个第二集成单元2022中各自并联的两个感应电路均连接触控基板E和触控基板F上的触控感应线1021。
其中，驱动电路的电路结构详见图5a所示。
采用本实施例的触控模组，具有以下优点：
第一，只需要为触控驱动模块200配置一套电容电阻器件，制作成本和功耗都得到降低；
第二，由于多个触控基板100可以共享一个TIC，则可以保证触控模组中多个触控基板100各自所配置的主动笔功能同步、性能同步，从而使得多个触控基板100均可以保持主动笔功能。
基于相同的发明构思，本公开实施例还提供了一种显示装置，该显示装置包括上述实施例所述的触控模组，以及与触控功模组中多个触控基板100分别对应的显示面板400，触控基板100为显示面板400提供触控功能。
其中，触控基板100可以内嵌到显示面板400中，即为内嵌式触控基板100，或者，触控基板100也可以作为独立基板配置到显示面板400中，即为外挂式触控基板100，无论哪一种触控基板100，其所构成的触控模组，均可以采用一个触控驱动模块200为该显示装置的多个显示面板400提供触控功能。
由此，显示装置可以只需配置一个触控芯片201即可，降低了显示装置的制造成本。同时，由于只需配置一个触控驱动模块200，相比相关技术中需要为每个触控基板100配置一个TIC的方式，可以降低触控驱动模块200在显示装置中所占据的空间，从而为显示装置留出足够的空间进行布线、或者布设尺寸更大的电池，以提高显示装置的待机时长。
此外，由于采用一个触控驱动模块200，这样，便可以搭建一套电容，电阻，TVS，便能实现抗ESD能力，从而无需减少电容电阻器件的数量，进一步降低制造成本，从而使得显示装置的制造成本下降。
本实施例中，显示装置可以是手机，显示面板400作为手机的显示屏，具体地，显示装置可以包括内折式显示装置，内折式显示装置又可以分为上下折叠式和左右折叠式，其内折式显示装置在展开状态时，使用一个显示面板400。折叠状态时，使用另一个显示面板400。
参照图7所示，示出了一种显示装置的结构示意图，如图7所示，该显示装置以内折式显示装置为例，包括两个显示面板400，在两个显示面板400中一个第三显示面板400位于另一第四显示面板400的非显示面一侧，其中，第四显示面板400为可折叠面板；
在第四显示面板400处于折叠状态的情况下，第三显示面板400显示画面，在第四显示面板400处于展开状态的情况下，第四显示面板400显示画面。
在一种具体的示例中，显示装置中的第四显示面板400可以作为主显示屏，第三显示面板400可以作为副显示屏，其中，第四显示面板400的尺寸可以大于第三显示面板400，具体地，如第四显示面板400可以是7.0～8.0寸，第三显示面板400可以为6.0～7.0寸。
其中，第三显示面板400位于第四显示面板400的非显示面一侧，也就是说，第三显示面板400可以层叠在第四显示面板400的背离显示面的一侧上，第四显示面板400可以内折，内折时，第四显示面板400的显示面被扣合，第三显示面板400则用于显示画面。在第四显示面板400展开状态时，第四显示面板400的显示面完整展现，从而使得第四显示面板400显示画面。
如图7所示，显示装置完整的可以包括多个显示面板400，以及配置到每个显示面板400上的触控基板100，多个触控基板100均共享同一个触控驱动模块200。其中，触控驱动模块200位于多个显示面板400中的任一显示面板400中。如图7所示，每个显示面板400配置独立的显示驱动模块402，如DIC(显示驱动芯片)。
其中，每个显示面板400包括显示区域401和与显示区域401相邻的非显示区，显示区域401中包括多个显示驱动线，多条显示驱动线从显示区域401延伸到非显示区，并在非显示区的一侧汇聚后，连接到显示驱动模块402；显示驱动模块402用于根据当前周期待显示的画面，生成与显示区域401中每个像素单元对应的驱动信号，从而使得像素单元中的各个子像素在驱动信号的驱动下发光，从而实现画面显示。
其中，对于显示驱动线的走线，如图7所示，可以是在非显示区的边缘走线，也就是在边框处走线，显示驱动线可以在显示面板400的绑定区汇聚后与显示驱动模块402连接，该绑定区可以位于显示面板400的一侧边框上， 一般是尺寸较大的边框上，若显示面板400是窄边框设计，则一侧边框上的绑定区可以弯折后位于显示面板400的显示面的背离面上。
在一种示例中，显示装置还包括主控模块500，该主控模块500用于与多个显示驱动模块402以及触控驱动模块200连接，其中，主控模块500，可以被配置为确定待切换到的目标显示面板400，目标显示面板400的目标显示驱动模块402发送显示驱动信号，以指示目标显示驱动模块402驱动目标显示面板400进行画面显示，以及向触控驱动模块200发送触控切换信号。
其中，触控驱动模块200可以用于响应于触控切换信号，导通与目标触控基板100之间的连接通路，以对目标触控基板100进行触控检测。
具体地，主控模块500可以是对显示装置的显示画面和触控功能进行控制的模块，实际中，主控模块500可以检测当前待显示的目标显示面板400，具体地，可以基于多个显示面板400之间所呈现的状态，确定当前待显示的目标显示面板400，并将目标显示面板400配置的触控基板100确定为目标触控基板100。
在一种示例中，多个显示面板400中至少存在一个显示面板400具有两种不同的面板状态；主控模块500，被配置为检测显示面板400所处的面板状态，并基于面板状态，确定目标触控基板100。
其中，触控基板100一般配置到显示面板400中，则可以显示面板400所处的面板状态，确定显示面板400是否需要进行画面显示，一般而言，在显示面板400需要进行画面显示时，其面板状态可以是：显示面正对用户的观察视线；在显示面板400不需要进行画面显示时，其面板状态可以是：显示面背离用户的观察视线。则主控模块500可以通过检测显示面板400所处的面板状态，确定显示面板400是否需要进行画面显示，进而确定显示面板400上配置的触控基板100是否需要进行触控显示。
示例地，在包括两个显示面板400的情况下，若一个显示面板400处于折叠状态，其显示面不正对观察视线，则可以确定另一显示面板400作为目标显示面板400，若显示面板400处于展开状态，其显示面正对观察视线，则可以确定该显示面板400为目标显示面板400。
相应地，在一些实施例中，主控模块500可以检测第四显示面板400的折叠状态，即可确定待显示的目标显示面板400。也就是说，在检测到第四显 示面板400处于折叠状态时，确定目标显示面板400为第三显示面板400，在检测到第四显示面板400处于展开状态时，确定目标显示面板400为第四显示面板400，并将第四显示面板400上的触控基板100作为目标触控基板100。
在一种示例中，主控模块500还可以与显示面板400的显示驱动模块402连接，用于向待显示的目标显示面板400发送显示数据，以指示目标显示面板400的显示驱动模块402对目标显示面板400进行驱动显示。具体地，主控模块500在确定目标显示面板400后，可以将需要在目标显示面板400上显示的画面数据传输给目标显示面板400上的目标显示驱动模块402，由目标显示驱动模块402根据画面数据驱动目标显示面板400进行显示。
在一种实施例中，在显示装置具有主控模块500的情况下，触控驱动模块200以及每个显示面板400上的显示驱动模块402还需要与主控模块500连接，以接收主控模块500的信号，并向主控模块500发送信号。具体地，显示面板400还包括多条信号线，多条信号线中包括连接显示面板400上的显示驱动模块402与主控模块500的信号线，以及连接触控驱动模块200与主控模块500的信号线；其中，多条信号线包括：MIPI信号线、SPI信号线以及电源线中的至少两种信号线。其中，该多条信号线布设在显示面板400的非显示区，例如，布设在显示面板400的绑定区。
其中，一种示例中，多个所述显示面板400通过各自对应的转接口将多条信号线连接到主控模块500。如图7所示，示出了此种情况下的信号线的连接。
其中，在又一种示例中，为减少走线面积，多个显示面板400中的多条信号线可以通过柔性电路板集中布设在一个显示面板400中，从而该显示面板400可以通过其所配置的转接口，将多个显示面板400的信号线均连接到主控模块500。
参照图8所示，示出了一种显示装置的结构示意图，如图8所示，显示装置还包括：第二柔性电路板104；
其中，第二柔性电路板104用于将至少一个第一显示面板400中的多条信号线，转接到第二显示面板400中；第二显示面板400上的多条信号线，通过第二显示面板400上的转接口连接到所述主控模块500。
在一种示例中，第二显示面板400的非显示区域401的尺寸可以大于第 一显示面板400的非显示区域401的尺寸，具体地，显示面板400显示区和非显示区，非显示区包括靠近显示区的至少一侧的边框区，触控驱动模块200和多条所述信号线位于所述边框区，具体地，在触控驱动模块200位于第二显示面板400的边框区的情况下；其中，第二显示面板400的边框区的尺寸大于第一显示面板400的边框区的尺寸。
由此，多条信号线和触控驱动模块200可以在边框区域较大的第二显示面板400上走线，以对大的边框区域的空间进行充分利用，由此，可以为第一显示面板400腾出更大的走线空间，以用于第一显示面板400中显示驱动线的走线，以及为第一显示面板400中的其他组件提供安装空间，如电池组件。
其中，第二显示面板400的显示区域401的尺寸可以大于第一显示面板400的显示区域401的尺寸，或者，第二显示面板400的显示区域401的尺寸可以小于第一显示面板400的显示区域401的尺寸，在此不做限定。
在一种实施例中，在多个第一显示面板400中的多条信号线可以通过第二柔性电路板104集中布设在一个第二显示面板400中时，如图8所示，触控驱动模块200也可以位于第二显示面板400中，此种情况下，第一显示面板400上配置的触控基板100的触控信号线102也可以通过第二柔性电路板104转接到第二显示面板400上。也就是说，通过同一个柔性电路板，可以将第一显示面板400的多条信号线转接到第二显示面板400中，也可以将触控基板100的触控信号线102一并转接到第二显示面板400中，使得其他触控基板100的触控信号线102与第二显示面板400中的触控驱动模块200连接。
下面，通过一个具体示例，对本实施例中的显示装置进行示例性说明。
参照图9a所示，图9a以图5a所示的触控模组为例，示出了一种示例性的显示装置的平面结构示意图，如图9a所示，该显示装置可以为内折手机，包括：
两个显示面板400，分别为显示面板C和显示面板D，其中，显示面板C配置的是图5a中触控基板C，触控基板C为显示面板C提供触控功能；显示面板D配置的是图5a中触控基板D，触控基板D为显示面板D提供触控功能。
其中，显示面板D位于显示面板C的背离显示面的一侧，显示面板C可以向显示面的方向折叠，在显示面板C折叠时，显示面板D处于向用户展示 画面的位置，显示面板D需要显示画面；在显示面板C展开时，显示面板C的显示面全部展露，其需要显示画面。
其中，触控驱动模块200位于显示面板C的非显示区域401，具体地，位于显示面板C的非显示区域401的下边框区，在该下边框区还包括显示面板C的显示驱动模块402，如显示驱动芯片DIC；
其中，在显示面板D的非显示区域401的下边框区中布设有显示面板D的显示驱动模块402，如显示驱动芯片DIC；
其中，显示面板D上的触控基板D的多条触控驱动线1022和多条触控感应线1021，由触控基板D的非触控区引出后，在显示面板D的边框区走线，并通过柔性电路板MFPC104转接到显示面板C上，以通过柔性电路板MFPC104与显示面板C上的触控驱动模块200连接；以及，显示面板D上的多条显示驱动线在非显示区走线后，汇聚到显示面板D的绑定区(接口区)403，并与显示驱动模块402连接，显示驱动模块402所引出的多条信号线404(包括MIPI信号线、SPI信号线以及电源线)，也与柔性电路板MDPC连接，通过柔性电路板MDPC将多条信号线布设到显示面板C的边框区中；
其中，显示面板C上的触控基板C的多条触控驱动线1022和多条触控感应线1021，由触控基板C的非触控区引出后，在显示面板C的边框区走线，与显示面板C上的触控驱动模块200连接；
其中，显示面板C上的显示驱动模块402引出的多条信号线404(包括MIPI信号线、SPI信号线以及电源线)，以及由柔性电路板MDPC引入的来自显示面板D的多条信号线，均通过一个转接口与主控模块500连接。
在显示装置处于工作状态时，主控模块500检测两个显示面板400的状态，若显示面板C折叠，则确定显示面板D为待显示的面板，主控模块500将显示面板D的画面数据通过多条信号线发送给显示面板D上的显示驱动模块402，以及通过多条信号线向触控驱动模块200发送触控切换信号；
其中，显示面板D的显示驱动模块402，根据画面数据，驱动显示面板D中的多个子像素发光，从而显示画面；
其中，触控驱动模块200根据触控切换信号，切断与触控基板C之间的连接通路，并导通与触控基板D之间的连接通路，即建立起与柔性电路板MDPC上的触控信号线102之间的连接通路，从而对触控基板D进行触控检 测，使得在显示面板D进行驱动显示的同时，利用触控基板D为显示面板D提供触控功能。
当然，若显示面板C展开，则确定显示面板C为待显示的面板，主控模块500将显示面板C的画面数据通过多条信号线发送给显示面板C上的显示驱动模块402，以及通过多条信号线向触控驱动模块200发送触控切换信号；
对于触控基板C的触控检测，可以参照上述触控基板D的触控检测即可，在此不再赘述。
参照图9b所示，还提供了一个具体示例中的显示装置，该显示装置中，分别为显示面板C和显示面板D，其中，显示面板C配置的是图5a中触控基板C，触控基板C为显示面板C提供触控功能；显示面板D配置的是图5a中触控基板D，触控基板D为显示面板D提供触控功能。其中，图9b中，显示面板C和显示面板D的多条信号线分别通过各自的转接口连接到主控模块500。其余结构参照图9a所示。
采用上述的显示装置，具有以下优点：
第一，显示装置可以只需配置一个触控芯片201即可，降低了显示装置的制造成本。
第二，由于只需配置一个触控驱动模块200，相比相关技术中需要为每个触控基板100配置一个TIC的方式，可以降低触控驱动模块200在显示装置中所占据的空间，从而为显示装置留出足够的空间进行布线、或者布设尺寸更大的电池，以提高显示装置的待机时长。
第三，由于采用一个触控驱动模块200，这样，便可以搭建一套电容，电阻，TVS，便能实现抗ESD能力，从而无需减少电容电阻器件的数量，进一步降低制造成本，从而使得显示装置的制造成本下降。
基于相同的发明构思，本公开还提供了一种触控驱动方法，参照图10所示，该触控功能驱动方法可以应用于上述触控模组或上述显示装置中，具体可以包括以下步骤：
步骤S1001：确定当前待触控驱动的目标触控基板100；
步骤S1002：切断触控驱动模块200与除目标触控基板100外的第三触控基板100的连接通路，并导通触控驱动模块200与目标触控基板100之间的连接通路；
步骤S1003：通过触控驱动模块200对目标触控基板100进行触控检测。
本实施例中，当前待触控驱动的目标触控基板100，可以通过主控模块500确定，进一步地，主控模块500可以基于触控基板100之间的状态确定，例如，基于触控基板C所位于的面板的折叠状态确定，若是折叠的，则确定另外一个触控基板D为目标触控基板100，若是展开的，则驱动该触控基板E为目标触控基板100。具体地，可以参照上述显示装置的实施例的描述即可。
在确定目标触控基板100后，触控驱动模块200可以切断与除目标触控基板100外的第三触控基板100的连接通路，并导通触控驱动模块200与目标触控基板100之间的连接通路，从而触控驱动模块200对目标触控基板100进行触控检测。
在一种示例中，触控检测可以包括互电容式触控检测和自电容式触控检测。其中，对目标触控基板100的触控检测可以为互电容式触控检测或自电容式触控检测，或者，对目标触控基板100的触控检测可以既包括互电容式触控检测，也包括自电容式触控检测。
触控检测的具体过程可以参照上述触控模组的实施例的描述即可，在此不再赘述。
具体地，在该种示例中，触控基板100可以是互电容式触控基板100，即包括多条触控驱动线1022和多条触控感应线1021，触控驱动线1022串接沿第一方向排布的多个驱动电极，触控感应线1021串接沿第一方向排布的多个感应电极；第一方向与第二方向相交或正交。
其中，在通过触控驱动模块200对目标触控基板100进行触控检测时，可以分时进行互电容式触控检测和自电容式触控检测。具体地，在第一时段，对目标触控基板100进行互电容式触控检测；在第二时段，对目标触控基板100进行自电容式触控检测；接着，可以基于互电容式触控检测和自电容式触控检测，获取触控信号；其中，第一时段与第二时段无重叠时段。
其中，互电容式检测原理如下：由于感应电极和驱动电极之间有交叠，则电极交叠处将会形成电容，即交叠处的两层电极分别构成了电容的两极。当手指触摸到触摸基板时，影响了触摸点附近两个电极之间的耦合，从而改变了这两个电极之间的电容量，触控感应线1021会将电容量的变化作为感应信号传输给触控芯片201，触控芯片201则可以基于感应信号的变化和感应线所在位 置，确定出触控位置。
其中，自电容式检测原理如下：每个触控电极106连接一条触控信号线102，各触控电极106所承受的电容为固定值，当人进行触控操作时，对应的触控电极106所承受的电容为固定值叠加人体电容，触控芯片201对触控电极106逐行或逐列进行扫描，接收触控电极106的反馈信号，当触控发生时，被触控的位置的触控电极106的电容值发生变化，触控芯片201根据电容变化确定触控位置。
其中，在需要进行互电容式触控检测和自电容式触控检测的情况下，触控基板100可以是互电容式触控基板100。在第一时段，对目标触控基板100进行互电容式触控检测时，触控驱动模块200可以向目标触控基板100的触控驱动线1022输入驱动信号，并接收目标触控基板100的触控感应线1021传回的感应信号；在对目标触控基板100的整面基板进行一次触控检测后，可以在第二时段对目标触控基板100进行自电容式触控检测，触控驱动模块200可以向目标触控基板100的触控驱动线1022输入驱动信号，并接收目标触控基板100的触控驱动线1022传回的感应信号；或者，触控驱动模块200可以向目标触控基板100的触控感应线1021输入驱动信号，并接收目标触控基板100的触控感应线1021传回的感应信号。
当然，第一时段可以位于第二时段之前，或者第一时段位于第二时段之后，实际中，可以根据需求确定即可，在此不再赘述。
在基于互电容式触控检测和自电容式触控检测获取触控信号时，可以使得触控驱动模块200，综合互电容式触控检测的结果和自电容式触控检测的结果，确定触控位置，提高触控位置的确定准确性，避免误确定。其中，第一时段和第二时段之间的间隔可以较小，例如，小于1ms，从而避免时间间隔较长，触控位置的确定准确性降低的问题。
参照图11和图12所示，图11示出了对图5a所示的目标触控基板100进行周期性检测的互容触控驱动电路时序图，图12示出了对图5a所示的目标触控基板100进行周期性检测的互容触控驱动时序图。
其中，参照图13a和图13b所示，示出了对图5中所述的目标触控基板进行互电容式触控检测的电路示意图，如图13a和13b所示，其中，以目标触控基板为触控基板C为例，在对目标触控基板100进行互电容式触控检测时， 断开触控基板D与触控芯片之间的连接通路，可以按照以下阶段进行：
a)第一阶段：Reset阶段，LCTRL闭合，GCTRL，HCTRL和P1断开，Tx PAD电压稳定在LVDD(负压)→Rx PAD处，RGCTRL'闭合，P1’断开，Rx PAD接地，电压稳定在0V；
b)第二阶段：Tx驱动阶段，GCTRL闭合，LCTRL，HCTRL，P1断开，Tx PAD电压跳变为0V→Rx PAD处，RGCTRL断开，P1’闭合，AFE接收到Rx的电荷信号；
c)第三阶段：Tx驱动阶段，HCTRL闭合，LCTRL,GCTRL，P1断开，Tx PAD电压跳变为HVDD→Rx PAD处，RGCTRL断开，P1’闭合，AFE接收到Rx的电荷信号；
d)第四阶段：Reset阶段，HCTRL闭合，LCTRL,GCTRL，P1断开，Tx PAD电压稳定在HVDD(正压)；
e)第五阶段：Tx驱动阶段，GCTRL闭合，LCTRL，HCTRL，P1断开，Tx PAD电压跳变为0V→Rx PAD处，RGCTRL断开，P1’闭合，AFE接收到Rx的信号；
f)第六阶段：Tx驱动阶段，LCTRL闭合，HCTRL，GCTRL，P1断开，Tx PAD电压跳变为LVDD→Rx PAD处，RGCTRL断开，P1’闭合，AFE接收到Rx的信号；
g)第七阶段：Reset阶段，LCTRL闭合，GCTRL，HCTRL，P1断开，Tx PAD电压稳定在LVDD(负压)；
以上完成对一行触控驱动线1022和一列触控感应线1021的触控检测。
h)…如此反复循环驱动，直到扫描完整面的触控基板100，又开始下一轮触控检测。
其中，如图13b所示，在对触控基板D进行触控检测时，对触控基板D的触控检测可以参照对触控基板C的触控检测即可，在此不再赘述。
其中，对于自电容式触控检测，由于包括感应电极和驱动电极，其中，可以以感应电极为准，进行自电容式触控检测，也可以以驱动电极为准，进行自电容式触控检测。
在一种示例中，如图12所示，可以在第二时段的第一子时段，向目标触控基板100中的触控驱动线1022提供驱动信号，并基于触控驱动线1022反 馈的感应信号，获取触控基板100上的触控位置；
和/或，在第二时段的第二子时段，向目标触控基板100中的触控感应线1021提供驱动信号，并基于触控感应线1021反馈的感应信号，获取触控基板100上的触控位置；
其中，第一子时段不同于第二子时段。
也就是说，可以分别基于感应电极和驱动电极，进行分时段自电容式驱动。参照图14a-图15b所示，图14a示出了对图5a所示的触控模组中的驱动电极进行自电容式触控检测的驱动电路示意图，图14b示出了对图5a所示的另一触控模组中的驱动电极进行自电容式触控检测的驱动电路示意图；图15a示出了对图5a所示的触控模组中的感应电极进行自电容式触控检测的驱动电路示意图，图15a示出了对图5a所示的另一触控模组中的感应电极进行自电容式触控检测的驱动电路示意图。
如图14a-图15b所示，其过程可以是：
a)如图14a所示，在对触控基板C进行自电容式驱动时，可以基于触控基板C中的驱动电极进行，其中，触控基板D上的触控驱动线上的开关S1断开，触控基板D上的触控感应线上的开关S1'断开。触控基板C上的触控感应线上的开关P1'断开，触控基板C上的触控驱动线上的开关P1闭合，AFE直接对触控基板C上的驱动电极进行自容式扫描以及感应；
b)如图14b所示，在对触控基板D进行自电容式驱动时，可以基于触控基板D中的驱动电极进行，其中，触控基板C上的触控驱动线上的开关P1断开，触控基板C上的触控感应线上的开关P1'断开。触控基板D上的触控感应线上的开关S1'断开，触控基板D上的触控驱动线上的开关S1闭合；AFE直接对触控基板D上的驱动电极进行自容式扫描以及感应。
c)如图15a所示，在对触控基板C进行自电容式驱动时，可以基于触控基板C中的感应电极进行，其中，触控基板D上的触控驱动线上的开关S1断开，触控基板D上的触控感应线上的开关S1'断开。触控基板C上的触控感应线上的开关P1'闭合，触控基板C上的触控驱动线上的开关P1断开，AFE直接对触控基板C上的感应电极进行自容式扫描以及感应。
d)如图15b所示，在对触控基板D进行自电容式驱动时，可以基于触控基板D中的感应电极进行，其中，触控基板C上的触控感应线上的开关P1'断 开，触控基板C上的触控驱动线上的开关P1断开，触控基板D上的触控驱动线上的开关S1断开，触控基板D上的触控感应线上的开关S1'闭合。AFE直接对触控基板D上的感应电极进行自容式扫描以及感应。
实际中，为降低触控驱动模块200进行触控检测的功耗，在自电容式触控检测中，可以仅基于感应电极进行自电容式触控检测，或仅基于驱动电极进行自电容式触控检测。
在一种可选示例中，为防止从目标触控基板100切换到另一个触控基板100时，另一个触控基板100出现触控灵敏度降低的情况，在对目标触控基板100进行触控检测的状态下，另一个触控基板100也需要进行低频率(比如1HZ)的刷新，即在目标触控基板100的触控驱动的间隙，可以对另一个触控基板100进行触控驱动，以得到另一个触控基板100上的各个感应电极和驱动电极的基准信号。
具体地，在对目标触控基板100进行周期性触控检测的检测间隙，通过触控驱动模块200对第三触控基板100进行触控扫描，得到第三触控基板100上的触控电极106的基准感应信号；基准感应信号，用于在对第三触控基板100进行触控检测时，提供参考信号。
其中，该检测间隙可以是指：对整面触控基板100完成一次触控检测后与进行下一次触控检测之间的时段。对第三触控基板100进行触控检测可以是按照对目标触控基板100进行触控检测的方式进行。具体地，在第三触控基板100进行触控检测时，触控驱动模块200中与第三触控基板100上的触控感应线1021连接的感应电路中的第三开关P1'会在一瞬间闭合，使得触控芯片201可以接收到第三触控基板100上的触控感应线1021传输的感应信号。
其中，对整面的目标触控基板100完成一次触控检测，可以是指：对整面的目标触控基板100完成了一次互电容式触控检测以及一次自电容式触控检测。
在对第三触控基板100进行触控检测时，由于第三触控基板100不是触控面，其上的触控电极106(包括驱动电极和感应电极)不会受到手指触控，由此，其所得到的感应信号可以代表触控电极106未被触控时的基准信号，从而与触控电极106被触控时的信号形成对比，基于对比得到的差异，可以 确定触控电极106是否被触控。
在一种示例中，对第三触控基板100进行的触控检测可以为互电容式触控检测。或者，可以包括互电容式触控检测以及自电容式触控检测。当然，在对第三触控基板100进行的触控检测包括互电容式触控检测以及自电容式触控检测的情况下，可以提高基准信号的准确性，从而在第三触控基板100提供触控功能时，提供更准确的基准信号，从而提高触控位置的确定准确性。
需要说明的是，该方法实施例与上述的触控模组和显示装置的实施例相近，故描述的较为简单，相关之处参见方法实施例即可。
基于相同的发明构思，本公开还提供了一种电子设备，包括存储器、处理器及存储在存储器上并可在处理器上运行的计算机程序，所述处理器执行时实现本公开实施例所述的触控驱动方法。
本公开实施例还提供了一种计算机可读存储介质，其存储的计算机程序使得处理器执行如本公开实施例所述的触控驱动方法。
最后，还需要说明的是，在本文中，诸如第一和第二等之类的关系术语仅仅用来将一个实体或者操作与另一个实体或操作区分开来，而不一定要求或者暗示这些实体或操作之间存在任何这种实际的关系或者顺序。而且，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、商品或者设备不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、商品或者设备所固有的要素。在没有更多限制的情况下，由语句“包括一个……”限定的要素，并不排除在包括所述要素的过程、方法、商品或者设备中还存在另外的相同要素。
以上对本公开所提供的一种触控模组、显示装置以及触控驱动方法进行了详细介绍，本文中应用了具体示例对本公开的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本公开的方法及其核心思想；同时，对于本领域的一般技术人员，依据本公开的思想，在具体实施方式及应用范围上均会有改变之处，综上所述，本说明书内容不应理解为对本公开的限制。
本领域技术人员在考虑说明书及实践这里公开的发明后，将容易想到本公开的其它实施方案。本公开旨在涵盖本公开的任何变型、用途或者适应性变化，这些变型、用途或者适应性变化遵循本公开的一般性原理并包括本公开未 公开的本技术领域中的公知常识或惯用技术手段。说明书和实施例仅被视为示例性的，本公开的真正范围和精神由下面的权利要求指出。
应当理解的是，本公开并不局限于上面已经描述并在附图中示出的精确结构，并且可以在不脱离其范围进行各种修改和改变。本公开的范围仅由所附的权利要求来限制。
本文中所称的“一个实施例”、“实施例”或者“一个或者多个实施例”意味着，结合实施例描述的特定特征、结构或者特性包括在本公开的至少一个实施例中。此外，请注意，这里“在一个实施例中”的词语例子不一定全指同一个实施例。
在此处所提供的说明书中，说明了大量具体细节。然而，能够理解，本公开的实施例可以在没有这些具体细节的情况下被实践。在一些实例中，并未详细示出公知的方法、结构和技术，以便不模糊对本说明书的理解。
在权利要求中，不应将位于括号之间的任何参考符号构造成对权利要求的限制。单词“包含”不排除存在未列在权利要求中的元件或步骤。位于元件之前的单词“一”或“一个”不排除存在多个这样的元件。本公开可以借助于包括有若干不同元件的硬件以及借助于适当编程的计算机来实现。在列举了若干装置的单元权利要求中，这些装置中的若干个可以是通过同一个硬件项来具体体现。单词第一、第二、以及第三等的使用不表示任何顺序。可将这些单词解释为名称。
最后应说明的是，以上实施例仅用以说明本公开的技术方案，而非对其限制；尽管参照前述实施例对本公开进行了详细的说明，本领域的普通技术人员应当理解，其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本公开各实施例技术方案的精神和范围。

Claims (20)

  1. 一种触控模组，包括：触控驱动模块，以及与所述触控驱动模块分别连接的多个触控基板，不同触控基板用于为不同显示面板提供触控功能，
    所述触控驱动模块，被配置为在所述多个触控基板中进行触控切换，所述触控切换包括：导通与目标触控基板之间的连接通路，以对所述目标触控基板进行触控检测，以及关断与除所述目标触控基板外的触控基板之间的连接通路；
    其中，所述目标触控基板为当前提供所述触控功能的触控基板。
  2. 根据权利要求1所述的触控模组，其中，每个触控基板包括多条触控信号线，所述触控驱动模块包括：触控芯片以及与所述触控芯片分别连接的多个集成单元；每个集成单元用于集成分别来自所述多个触控基板上的触控信号线；并且
    其中，每个集成单元包括并联的多个信号传输电路，每个信号传输电路与所述多个触控基板之一上的一条触控信号线连接，用于将所述触控芯片输出的信号传输至该触控信号线，以及将经由该触控信号线输入的信号传输至所述触控芯片。
  3. 根据权利要求2所述的触控模组，其中，每个触控基板上的多条触控信号线中包括沿第一方向延伸的触控驱动线和沿第二方向延伸的触控感应线，所述第一方向与所述第二方向交叉；
    其中，每个集成单元包括第一集成单元和第二集成单元，所述第一集成单元用于集成分别来自不同触控基板上的多条触控驱动线，所述第二集成单元用于集成分别来自不同触控基板上的多条触控感应线；
    其中，所述第一集成单元包括并联的多个驱动电路，每个驱动电路用于将所述触控芯片输出的驱动信号，传输给所述多个触控基板之一上的一条触控驱动线；并且
    所述第二集成单元包括并联的多个感应电路，每个感应电路用于将所述多个触控基板之一上的一条触控感应线上的感应信号传输给所述触控芯片。
  4. 根据权利要求3所述的显示模组，其中，每个感应电路包括：第一开关、第二开关以及第三开关；
    其中，每条触控感应线分别与所述第一开关的第一端、所述第二开关的第一端和所述第三开关的第一端连接；并且
    所述第一开关的第二端接地，所述第二开关和所述第三开关的第二端分别与所述触控芯片连接，所述第二开关用于接收所述触控芯片输出的正电压，所述第三开关用于向所述触控芯片输入该触控感应线上的感应信号。
  5. 根据权利要求3所述的显示模组，其中，每个驱动电路包括：第四开关、第五开关、第六开关和第七开关；
    其中，每条触控驱动线分别与所述第四开关的第一端、第五开关的第一端、所述第六开关的第一端和第七开关的第一端连接；
    所述第四开关与所述第五开关的第二端分别与所述触控芯片的电源信号端连接，所述第六开关的第二端接地，所述第七开关的第二端与所述触控芯片的驱动信号输出端连接；并且
    其中，所述第四开关用于接收所述电源信号端输出的正电压，所述第五开关用于接收所述电源信号端输出的负电压，所述驱动信号输出端用于输出所述驱动信号。
  6. 根据权利要求5所述的显示模组，其中，每个驱动电路还包括防静电单元，并且
    每条触控驱动线分别与所述第四开关的第一端、第五开关的第一端和所述第六开关的第一端连接，并在与所述防静电单元串接后，与所述第七开关的第一端连接。
  7. 根据权利要求1-6任一所述的显示模组，其中，所述触控驱动模块与第一触控基板位于同一面板中，所述触控模组还包括：第一柔性电路板；
    所述第一柔性电路板用于将第二触控基板上的多条触控信号线，连接到所述触控驱动模块；
    其中，所述第一触控基板为所述多个触控基板中的任一触控基板，所述第二触控基板为除所述第一触控基板外的触控基板。
  8. 根据权利要求2-6任一所述的显示模组，其中，所述触控驱动模块包括第一绑定区和第二绑定区；每个集成单元位于所述第一绑定区或位于所述第二绑定区。
  9. 根据权利要求2-6任一所述的显示模组，其中，在不同触控基板中，所述多条触控信号线的数量相同或不同；
    其中，所述多个集成单元的数量大于或等于第一触控基板上的触控信号线的数量，所述第一触控基板为触控信号线的数量最多的触控基板。
  10. 一种显示装置，包括权利要求1-9所述的触控模组，以及与所述触控模组中多个触控基板分别对应的多个显示面板；
    其中，每个触控基板为对应的显示面板提供触控功能。
  11. 根据权利要求10所述的显示装置，其中，所述显示装置还包括主控模块，所述主控模块与所述触控模组中的触控驱动模块连接；
    其中，所述主控模块，被配置为确定待切换到的目标触控基板，并向所述触控驱动模块发送针对所述目标触控基板的触控切换信号；并且
    所述触控驱动模块，用于响应于所述触控切换信号，导通与所述目标触控基板之间的连接通路，以对所述目标触控基板进行触控检测。
  12. 根据权利要求11所述的显示装置，其中，每个触控基板配置到对应的显示面板中，该显示面板具有两种不同面板状态；所述面板状态用于表征该显示面板的显示面是否面向观察视线；并且
    所述主控模块，被配置为检测该显示面板所处的面板状态，并基于所述面板状态，确定所述目标触控基板。
  13. 根据权利要求11所述的显示装置，其中，每个显示面板还包括多条 信号线，所述多条信号线包括连接该显示面板上的显示驱动模块与所述主控模块的信号线，以及连接所述触控驱动模块与所述主控模块的信号线，所述显示装置还包括：第二柔性电路板；
    其中，所述第二柔性电路板用于将至少一个第一显示面板中的多条信号线，转接到第二显示面板中；并且
    所述第二显示面板上的多条信号线，通过所述第二显示面板上的转接口连接到所述主控模块。
  14. 根据权利要求13所述的显示装置，其中，所述触控模组中的触控驱动模块位于所述第二显示面板中，其中，所述第二柔性电路板还用于将至少一个所述第一显示面板对应的触控基板的多条触控信号线，转接到所述第二显示面板中，以使被转接的多条触控信号线与所述触控驱动模块连接。
  15. 根据权利要求13或14所述的显示装置，其中，所述显示面板包括显示区和非显示区，所述非显示区包括靠近所述显示区的至少一侧的边框区，所述触控驱动模块和所述多条信号线位于所述边框区；其中，所述第二显示面板的边框区的尺寸大于所述第一显示面板的边框区的尺寸。
  16. 根据权利要求10所述的显示装置，其特征在于，在多个所述显示面板中，第三显示面板位于第四显示面板的非显示面一侧，其中，所述第四显示面板为可折叠面板；并且
    在所述第四显示面板处于折叠状态的情况下，所述第三显示面板显示画面，在所述第四显示面板处于展开状态的情况下，所述第四显示面板显示画面。
  17. 一种触控驱动方法，应用于权利要求1-9任一所述的触控模组，或应用于权利要求10-16任一所述的显示装置中，所述方法包括：
    确定当前待触控驱动的目标触控基板；
    切断所述触控驱动模块与除所述目标触控基板外的第三触控基板的连接通路，并导通所述触控驱动模块与所述目标触控基板之间的连接通路；并且
    通过所述触控驱动模块对所述目标触控基板进行触控检测。
  18. 根据权利要求17所述的触控驱动方法，其中，所述触控检测为周期性触控检测，所述方法还包括：
    在对所述目标触控基板进行周期性触控检测的检测间隙，通过所述触控驱动模块对所述第三触控基板进行触控扫描，得到所述第三触控基板上的触控电极的基准感应信号；
    其中，所述基准感应信号，用于在对所述第三触控基板进行触控检测时，提供参考信号。
  19. 根据权利要求17所述的触控驱动方法，其中，所述目标触控基板包括多条触控驱动线和多条触控感应线，所述多条触控驱动线串接沿第一方向排布的多个驱动电极，所述多条触控感应线串接沿第二方向排布的多个感应电极；所述第一方向与所述第二方向相交；通过所述触控驱动模块对所述目标触控基板进行触控检测，包括：
    在第一时段，对所述目标触控基板进行互电容式触控检测；
    在第二时段，对所述目标触控基板进行自电容式触控检测；以及
    基于所述互电容式触控检测和所述自电容式触控检测，获取触控信号；
    其中，所述第一时段与所述第二时段无重叠时段。
  20. 根据权利要求19所述的触控驱动方法，其中，在所述在第二时段，对所述目标触控基板进行自电容式触控检测，包括：
    在所述第二时段的第一子时段，向所述目标触控基板中的所述多条触控驱动线提供驱动信号，并基于所述多条触控驱动线反馈的感应信号，获取所述目标触控基板上的触控位置；
    和/或，在所述第二时段的第二子时段，向所述目标触控基板中的所述多条触控感应线提供驱动信号，并基于所述多条触控感应线反馈的感应信号，获取所述目标触控基板上的触控位置；
    其中，所述第一子时段不同于所述第二子时段。
PCT/CN2024/095334 2023-05-25 2024-05-24 触控模组、显示装置以及触控驱动方法 Ceased WO2024240261A1 (zh)

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