WO2024209330A1 - 半導体装置、及び、半導体装置の作製方法 - Google Patents

半導体装置、及び、半導体装置の作製方法 Download PDF

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Publication number
WO2024209330A1
WO2024209330A1 PCT/IB2024/053141 IB2024053141W WO2024209330A1 WO 2024209330 A1 WO2024209330 A1 WO 2024209330A1 IB 2024053141 W IB2024053141 W IB 2024053141W WO 2024209330 A1 WO2024209330 A1 WO 2024209330A1
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Prior art keywords
insulator
oxide semiconductor
transistor
conductor
oxide
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PCT/IB2024/053141
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English (en)
French (fr)
Japanese (ja)
Inventor
山崎舜平
和久田真弘
山出直人
村川努
國武寛司
中山智則
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Semiconductor Energy Laboratory Co Ltd
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Semiconductor Energy Laboratory Co Ltd
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Priority to DE112024001636.7T priority Critical patent/DE112024001636T5/de
Priority to CN202480023847.3A priority patent/CN121014275A/zh
Priority to JP2025512208A priority patent/JPWO2024209330A1/ja
Priority to KR1020257033081A priority patent/KR20250169549A/ko
Publication of WO2024209330A1 publication Critical patent/WO2024209330A1/ja
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    • H—ELECTRICITY
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    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
    • H10B41/70—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates the floating gate being an electrode shared by two or more components
    • H—ELECTRICITY
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    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/1368—Active matrix addressed cells in which the switching element is a three-electrode device
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    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B10/00—Static random access memory [SRAM] devices
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    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
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    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H10B12/01—Manufacture or treatment
    • H10B12/02—Manufacture or treatment for one transistor one-capacitor [1T-1C] memory cells
    • H10B12/05—Making the transistor
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    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/01—Manufacture or treatment
    • H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
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    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/01—Manufacture or treatment
    • H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/031—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT]
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    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
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    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/6704—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device
    • H10D30/6713—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device characterised by the properties of the source or drain regions, e.g. compositions or sectional shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
    • H10D30/673—Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
    • H10D30/6736—Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes characterised by the shape of gate insulators
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    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/674—Thin-film transistors [TFT] characterised by the active materials
    • H10D30/6755—Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
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    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/6757—Thin-film transistors [TFT] characterised by the structure of the channel, e.g. transverse or longitudinal shape or doping profile
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    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/421—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/441—Interconnections, e.g. scanning lines
    • H—ELECTRICITY
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    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/471—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having different architectures, e.g. having both top-gate and bottom-gate TFTs
    • H—ELECTRICITY
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    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/30—Active-matrix LED displays

Definitions

  • One aspect of the present invention relates to a semiconductor device, a memory device, and an electronic device. Another aspect of the present invention relates to a method for manufacturing the semiconductor device.
  • one embodiment of the present invention is not limited to the above technical field.
  • Examples of technical fields of one embodiment of the present invention include semiconductor devices, display devices, light-emitting devices, power storage devices, memory devices, lighting devices, input devices (e.g., touch sensors), input/output devices (e.g., touch panels), electronic devices having them, driving methods thereof, or manufacturing methods thereof.
  • a semiconductor device refers to any device that can function by utilizing semiconductor characteristics.
  • Semiconductor elements such as transistors, as well as semiconductor circuits, arithmetic devices, and memory devices, are one embodiment of semiconductor devices.
  • Display devices (such as liquid crystal display devices and light-emitting display devices), projection devices, lighting devices, electro-optical devices, power storage devices, memory devices, semiconductor circuits, imaging devices, electronic devices, and the like may be said to have semiconductor devices.
  • a CPU is a collection of semiconductor elements that have semiconductor integrated circuits (at least transistors and memories) that are chipped by processing a semiconductor wafer and have electrodes that serve as connection terminals.
  • IC chips Semiconductor circuits (IC chips) such as LSIs, CPUs, and memories are mounted on circuit boards, such as printed wiring boards, and are used as components in a variety of electronic devices.
  • transistors are widely used in electronic devices such as integrated circuits (ICs) and image display devices (also simply referred to as display devices).
  • ICs integrated circuits
  • image display devices also simply referred to as display devices.
  • Silicon-based semiconductor materials are widely known as semiconductor thin films that can be used in transistors, but oxide semiconductors are also attracting attention as other materials.
  • Patent Document 1 discloses a low-power consumption CPU that utilizes the property of low leakage current of transistors using oxide semiconductors.
  • Patent Document 2 discloses a memory device that can retain stored contents for a long period of time by utilizing the property of low leakage current of transistors using oxide semiconductors.
  • Patent Document 3 and Non-Patent Document 1 disclose a technique for increasing the density of integrated circuits by stacking a first transistor using an oxide semiconductor film and a second transistor using an oxide semiconductor film to provide multiple overlapping memory cells.
  • Patent Document 4 discloses a technique for increasing the density of integrated circuits by vertically arranging the channel of a transistor using an oxide semiconductor film.
  • An object of one embodiment of the present invention is to provide a semiconductor device that can be miniaturized or highly integrated, and a method for manufacturing the semiconductor device.
  • An object of one embodiment of the present invention is to provide a semiconductor device with a large on-state current, and a method for manufacturing the semiconductor device.
  • An object of one embodiment of the present invention is to provide a semiconductor device with a high operating speed, and a method for manufacturing the semiconductor device.
  • An object of one embodiment of the present invention is to provide a highly reliable semiconductor device, and a method for manufacturing the semiconductor device.
  • An object of one embodiment of the present invention is to provide a semiconductor device with good electrical characteristics, and a method for manufacturing the semiconductor device.
  • An object of one embodiment of the present invention is to provide a semiconductor device with less variation in the electrical characteristics of transistors, and a method for manufacturing the semiconductor device.
  • An object of one embodiment of the present invention is to provide a semiconductor device with low power consumption, and a method for manufacturing the semiconductor device.
  • An object of one embodiment of the present invention is to provide a novel semiconductor device, and a method for manufacturing the semiconductor device.
  • An object of one embodiment of the present invention is to provide a method for manufacturing a semiconductor device with high productivity.
  • One embodiment of the present invention includes a transistor and an insulator.
  • the transistor has a first electrode, a second electrode, an oxide semiconductor, a gate insulator, and a gate electrode.
  • the first electrode functions as one of a source electrode and a drain electrode
  • the second electrode functions as the other of the source electrode and the drain electrode.
  • the first electrode and the second electrode are provided at different heights.
  • the insulator is provided on the first electrode, and the second electrode is provided on the insulator.
  • the insulator and the second electrode have an opening that reaches the first electrode.
  • the oxide semiconductor has an opening.
  • the gate insulator is provided on the oxide semiconductor, and the gate electrode is provided on the gate insulator so as to fill the opening.
  • the oxide semiconductor has a first region in contact with the first electrode, a second region in contact with the insulator, and a third region in contact with the second electrode, the first region and the third region having a lower resistance than the second region, the second region contains a halogen element, and the transistor is a semiconductor device having a threshold voltage greater than 0V.
  • the halogen element is one or more selected from chlorine, fluorine, bromine, and iodine.
  • the halogen element is preferably chlorine or fluorine.
  • the first region and the third region have a higher concentration of one or more of hydrogen, boron, carbon, nitrogen, phosphorus, sulfur, arsenic, aluminum, magnesium, silicon, and noble gases than the second region.
  • the insulator contains silicon and oxygen.
  • Another embodiment of the present invention is a method for manufacturing a semiconductor device, which includes forming a first conductor, forming a first insulator on the first conductor, forming a first conductive film on the first insulator, processing the first conductive film and the first insulator to form openings that reach a second conductor and the first conductor, forming an oxide semiconductor film in contact with a top surface of the first conductor in the opening, a side surface of the first insulator in the opening, and a side surface of the second conductor in the opening, and performing a process of supplying chlorine or fluorine to a first region of the oxide semiconductor film that is in contact with the side surface of the first insulator in the opening.
  • the process of supplying chlorine or fluorine is preferably carried out using an ion implantation method while the semiconductor device being manufactured is tilted at an angle of 15 degrees or more and 80 degrees or less with a point on the substrate surface as the fulcrum.
  • the oxide semiconductor film after the process of supplying chlorine or fluorine, it is preferable to process the oxide semiconductor film to form an oxide semiconductor, process the second conductor to form a third conductor, form a second insulator on the oxide semiconductor, and supply one or more of hydrogen, boron, carbon, nitrogen, fluorine, phosphorus, sulfur, arsenic, aluminum, magnesium, silicon, and a noble gas through the second insulator to a second region of the oxide semiconductor that contacts the first conductor in the opening and a third region that contacts the third conductor outside the opening.
  • a semiconductor device that can be miniaturized or highly integrated, and a method for manufacturing the semiconductor device can be provided.
  • a semiconductor device having a large on-state current, and a method for manufacturing the semiconductor device can be provided.
  • a semiconductor device having a high operating speed, and a method for manufacturing the semiconductor device can be provided.
  • a semiconductor device having good electrical characteristics, and a method for manufacturing the semiconductor device can be provided.
  • a semiconductor device having less variation in electrical characteristics of transistors, and a method for manufacturing the semiconductor device can be provided.
  • a semiconductor device having low power consumption, and a method for manufacturing the semiconductor device can be provided.
  • a novel semiconductor device, and a method for manufacturing the semiconductor device can be provided.
  • a method for manufacturing a semiconductor device with high productivity can be provided.
  • Fig. 1A is a plan view showing an example of a semiconductor device
  • Fig. 1B and Fig. 1C are cross-sectional views showing the example of the semiconductor device
  • 2A and 2B are cross-sectional views showing an example of a semiconductor device
  • Fig. 3A is a diagram showing potentials applied to various regions of a transistor
  • Fig. 3B and Fig. 3C are diagrams showing electrical characteristics of the transistor.
  • 4A and 4B are cross-sectional views showing an example of a semiconductor device.
  • 5A to 5C are diagrams showing band diagrams of oxide semiconductors having a stacked structure.
  • 6A and 6B are cross-sectional views showing an example of a semiconductor device.
  • Fig. 1A is a plan view showing an example of a semiconductor device
  • Fig. 1B and Fig. 1C are cross-sectional views showing the example of the semiconductor device.
  • 2A and 2B are cross-sectional views showing an example of a semiconductor device.
  • FIG. 7A is a plan view showing an example of a semiconductor device
  • Figs. 7B to 7D are cross-sectional views showing an example of the semiconductor device.
  • 8A and 8B are plan and cross-sectional views illustrating an example of a semiconductor device.
  • 9A to 9C are cross-sectional views showing an example of a method for manufacturing a semiconductor device.
  • 10A and 10B are cross-sectional views illustrating an example of a method for manufacturing a semiconductor device.
  • 11A and 11C are schematic perspective views illustrating an example of a method for manufacturing a semiconductor device
  • FIGS. 11B and 11D are schematic plan views illustrating an example of a method for manufacturing a semiconductor device.
  • 12A to 12C are cross-sectional views illustrating an example of a method for manufacturing a semiconductor device.
  • FIG. 13A and 13B are cross-sectional views illustrating an example of a method for manufacturing a semiconductor device.
  • FIG. 14 is a block diagram illustrating a configuration example of a semiconductor device.
  • 15A to 15H are diagrams for explaining examples of the circuit configuration of a memory cell.
  • 16A and 16B are perspective views illustrating a configuration example of a semiconductor device.
  • FIG. 17 is a block diagram illustrating the CPU.
  • 18A and 18B are perspective views of a semiconductor device.
  • 19A and 19B are perspective views of a semiconductor device.
  • 20A and 20B are diagrams showing various storage devices by hierarchical level.
  • FIG. 22 is a diagram showing an example of space equipment.
  • FIG. 23 is a diagram illustrating an example of a storage system that can be applied to a data center.
  • ordinal numbers “first” and “second” are used for convenience and do not limit the number of components or the order of the components (e.g., the order of processes or the order of stacking).
  • an ordinal number attached to a component in one place in this specification may not match an ordinal number attached to the same component in another place in this specification or in the claims.
  • film and “layer” can be interchanged depending on the circumstances.
  • conductive layer can be interchanged with the term “conductive film”.
  • insulating film can be interchanged with the term “insulating layer”.
  • conductor can be interchanged with the term “conductive layer” or the term “conductive film” depending on the circumstances.
  • insulator can be interchanged with the term “insulating layer” or the term “insulating film” depending on the circumstances.
  • oxide semiconductor can be interchanged with the term “oxide semiconductor layer” or the term “oxide semiconductor film” depending on the circumstances.
  • parallel refers to a state in which two straight lines are arranged at an angle of -10 degrees or more and 10 degrees or less. Therefore, it also includes cases in which the angle is -5 degrees or more and 5 degrees or less.
  • approximately parallel refers to a state in which two straight lines are arranged at an angle of -30 degrees or more and 30 degrees or less.
  • Perfect refers to a state in which two straight lines are arranged at an angle of 80 degrees or more and 100 degrees or less. Therefore, it also includes cases in which the angle is 85 degrees or more and 95 degrees or less.
  • approximately perpendicular refers to a state in which two straight lines are arranged at an angle of 60 degrees or more and 120 degrees or less.
  • Openings include, for example, grooves, slits, and recesses. Also, the area in which an opening is formed may be referred to as an opening.
  • the sidewalls of the insulator at the opening in the insulator are shown to be perpendicular or approximately perpendicular to the substrate surface or the surface on which the insulator is formed, but they may also be tapered.
  • a tapered shape refers to a shape in which at least a portion of the side of the structure is inclined relative to the substrate surface or the surface to be formed.
  • it refers to a shape having an area in which the angle between the inclined side and the substrate surface or the surface to be formed (hereinafter, sometimes referred to as the taper angle) is less than 90 degrees.
  • the side of the structure and the substrate surface do not necessarily need to be completely flat, but may be approximately planar with a slight curvature, or approximately planar with minute irregularities.
  • a reverse tapered shape refers to a shape having a side or top that protrudes in a direction parallel to the substrate more than the bottom.
  • “same height” refers to a configuration in which the heights from a reference surface (for example, a flat surface such as a substrate surface) are equal in cross-sectional view.
  • a planarization process typically a chemical mechanical polishing (CMP) process
  • CMP chemical mechanical polishing
  • the surfaces treated in the CMP process have a configuration in which the heights from the reference surface are equal.
  • the heights of multiple layers may differ depending on the processing device, processing method, or material of the processed surface during the CMP process. In this specification, this case is also treated as "same height".
  • first layer and a second layer when there are two layers (here, a first layer and a second layer) with different heights relative to the reference surface, and the difference in height between the top surface of the first layer and the top surface of the second layer is 20 nm or less, this is also referred to as "same height”.
  • side edges coincide means that at least a portion of the contours of the stacked layers overlap when viewed in a plane. For example, this includes cases where the upper and lower layers are processed using the same mask pattern, or where a portion of the mask pattern is the same. However, strictly speaking, the contours may not overlap, and the contour of the upper layer may be located inside the contour of the lower layer, or the contour of the upper layer may be located outside the contour of the lower layer, in which case it is also referred to as "side edges coincide”.
  • the first film thickness and the second film thickness being the same means that the absolute value of the difference between the first film thickness and the second film thickness divided by the first film thickness is 0.1 or less. Or, it means that the absolute value of the difference between the first film thickness and the second film thickness divided by the second film thickness is 0.1 or less.
  • distance A and distance B are the same means that the absolute value of the difference between distance A and distance B divided by distance A is 0.1 or less. Or, the absolute value of the difference between distance A and distance B divided by distance B is 0.1 or less.
  • Voltage refers to the potential difference from a reference potential, and if the reference potential is the ground potential, for example, then “voltage” can be used interchangeably as “potential.” Note that ground potential does not necessarily mean 0V. Potential is relative, and as the reference potential changes, the potential applied to wiring, the potential applied to circuits, etc., and the potential output from circuits, etc. also change.
  • connection includes “electrical connection.”
  • a and B are electrically connected means that, among A and B connected without an insulator (A and B connected via a conductor or semiconductor, or A and B in contact), there is a time when an electrical signal is exchanged or a potential interaction occurs between A and B during circuit operation. In other words, even if there is a time when an electrical signal is not exchanged or a potential interaction does not occur between A and B during circuit operation, if there is a time when an electrical signal is exchanged or a potential interaction occurs between A and B, it can be said that "A and B are electrically connected.”
  • Electrical connection includes a connection that does not involve a circuit element (e.g., a transistor, but excluding wiring) (direct connection), and a connection that involves one or more circuit elements (indirect connection).
  • a circuit element e.g., a transistor, but excluding wiring
  • indirect connection includes a connection that involves one or more circuit elements
  • Examples of "A and B being electrically connected” include when A and B are connected without a circuit element, and when A and B are connected via the source and drain of one or more transistors. However, this is subject to the premise that there is a timing when an electrical signal is exchanged or potential interaction occurs between A and B.
  • a and B are connected via an insulator and therefore it cannot be said that "A and B are electrically connected" is when there is a dielectric of a capacitive element, a gate insulating film of a transistor, etc. between A and B.
  • Examples of cases where A and B are connected without an insulator, but there is no timing when an electrical signal is sent or received between A and B or when potential interaction occurs between A and B, and therefore it cannot be said that "A and B are electrically connected” include a case where a potential V is supplied to the path from A to B from a power source, signal source, etc. (however, this does not include a case where potential V is supplied via a circuit element), or a case where A and C are connected via the source and drain of transistor TrP and B and C are connected via the source and drain of transistor TrQ, but there is no timing when both transistor TrP and transistor TrQ are on at the same time.
  • a semiconductor device has a transistor.
  • the transistor has a structure in which a source electrode and a drain electrode are provided overlapping each other at different heights with respect to a substrate surface, and a drain current flows in the height direction (vertical direction). Therefore, the transistor can be miniaturized more than a transistor having a structure in which a source electrode and a drain electrode are provided on the same plane.
  • the transistor having the above-described structure allows miniaturization and high integration of the semiconductor device.
  • the distance between the source electrode and the drain electrode of the above transistor can be controlled simply by adjusting the film thickness of the insulator.
  • the channel length of the above transistor can be controlled.
  • the channel length is no longer affected by the performance of the exposure device used to fabricate the transistor, so the channel length can be made shorter than the limit resolution of the exposure device, making it possible to realize a transistor with an extremely short channel length.
  • a normally-on transistor has a larger off-state current than a normally-off transistor. Therefore, for example, when a normally-on transistor is used in a memory device, the data retention time is shortened and the frequency of refreshing needs to be increased, which leads to an increase in power consumption.
  • transistors with extremely short channel lengths for use in memory devices, etc. the transistors must be manufactured to have normally-off characteristics.
  • a method that utilizes the body bias effect (also called the body effect) to make a transistor normally-off.
  • a backgate electrode (second gate electrode) is provided at a position facing the gate electrode (first gate electrode) across the semiconductor layer, and a reverse bias is applied from the backgate electrode to the semiconductor layer, thereby making the transistor normally-off.
  • the threshold voltage can be shifted in the positive direction compared to when a negative bias is not applied to the backgate electrode by sweeping the voltage of the gate electrode (first gate electrode) and acquiring the drain current (Id)-gate voltage (Vg) characteristics while applying a constant negative bias to the backgate electrode.
  • Id drain current
  • Vg drain current-gate voltage
  • forming a back gate increases the number of steps required to manufacture a transistor.
  • a power supply is required to apply a negative bias to the back gate, increasing the number of components required for the semiconductor device.
  • applying a negative bias to the back gate also leads to increased power consumption.
  • a process is performed in which negative charges (negative fixed charges) can be formed in the oxide semiconductor (particularly, the channel formation region) that functions as a semiconductor layer during the manufacturing process of the transistor.
  • a process is performed in which a halogen element such as chlorine or fluorine is added to the oxide semiconductor (particularly, the channel formation region) by ion implantation to replace the halogen element and generate oxygen (also referred to as excess oxygen), and then a process is performed in which oxygen contained in the insulator is supplied from an insulator in contact with the oxide semiconductor to the oxide semiconductor (particularly, the channel formation region) by heat treatment or the like.
  • the oxygen traps electrons, so that negative charges can be formed in the region of the oxide semiconductor to which the halogen element is added. Therefore, the transistor can exhibit an effect similar to that of a substrate bias effect, and a normally-off transistor can be realized without providing a backgate electrode.
  • FIGS. 1A to 1C are plan views and cross-sectional views of a semiconductor device including a transistor 200.
  • FIG. 1A is a plan view of the semiconductor device.
  • FIGS. 1B and 1C are cross-sectional views of the semiconductor device.
  • FIG. 1B is a cross-sectional view of a portion indicated by a dashed line A1-A2 in FIG. 1A.
  • FIG. 1C is a cross-sectional view of a portion indicated by a dashed line A3-A4 in FIG. 1A. Note that some elements are omitted from the plan view of FIG. 1A for clarity.
  • FIGS. 4A and 4B, and FIGS. 6A and 6B are enlarged views corresponding to FIG. 1B.
  • arrows indicating the X direction, Y direction, and Z direction may be used.
  • the "X direction” is the direction along the X axis, and unless explicitly stated, no distinction is made between the forward direction and the reverse direction. The same applies to the "Y direction” and "Z direction.”
  • the X direction, Y direction, and Z direction are directions that intersect with each other.
  • the X direction, Y direction, and Z direction are directions that are perpendicular to each other.
  • the semiconductor device shown in Figures 1A to 1C has an insulator 210 on a substrate (not shown), an insulator 222 on the insulator 210, a transistor 200 on the insulator 222, an insulator 280 on the insulator 222, and an insulator 283 on the transistor 200.
  • the insulator 210 functions as an interlayer film.
  • Transistor 200 has conductor 220 on insulator 222, conductor 240 on insulator 280, oxide semiconductor 230 in contact with at least a portion of the top surface of conductor 220, insulator 250 on oxide semiconductor 230, and conductor 260 on insulator 250.
  • the insulator 280 and the conductor 240 have openings 290 that reach the conductor 220.
  • the bottom of the opening 290 is the top surface of the conductor 220
  • the side walls of the opening 290 are the side surfaces of the insulator 280 and the conductor 240.
  • the opening 290 includes an opening in the insulator 280 and an opening in the conductor 240. In other words, the opening in the area where the insulator 280 overlaps with the conductor 220 is one part of the opening 290, and the opening in the area where the conductor 240 overlaps with the conductor 220 is another part of the opening 290.
  • At least a portion of the components of the transistor 200 are disposed within the opening 290.
  • the oxide semiconductor 230, the insulator 250, and the conductor 260 are each disposed such that at least a portion of them is located within the opening 290.
  • the portions of the oxide semiconductor 230, the insulator 250, and the conductor 260 that are disposed within the opening 290 are provided to reflect the shape of the opening 290.
  • the oxide semiconductor 230 is provided to cover the bottom and sidewalls of the opening 290
  • the insulator 250 is provided to cover the oxide semiconductor 230
  • the conductor 260 is provided to fill the recess of the insulator 250 that reflects the shape of the opening 290.
  • the oxide semiconductor 230 functions as a semiconductor layer
  • the conductor 260 functions as a gate electrode
  • the insulator 250 functions as a gate insulator
  • the conductor 220 functions as one of the source electrode or the drain electrode
  • the conductor 240 functions as the other of the source electrode or the drain electrode.
  • the oxide semiconductor 230 is provided inside the opening of the insulator 280.
  • the transistor 200 has a configuration in which one of the source electrode or drain electrode (here, the conductor 220) is located on the lower side and the other of the source electrode or drain electrode (here, the conductor 240) is located on the upper side, so that current flows in the vertical direction. In other words, a channel is formed along the side of the opening of the insulator 280.
  • the transistor 200 preferably uses a metal oxide (also referred to as an oxide semiconductor (OS)) that functions as a semiconductor for the oxide semiconductor 230 including the channel formation region.
  • a metal oxide also referred to as an oxide semiconductor (OS)
  • OS oxide semiconductor
  • Si transistor a transistor using silicon for the semiconductor layer
  • the transistor 200 is an OS transistor.
  • oxygen vacancies ( VO ) and impurities are present in a channel formation region in an oxide semiconductor, the electrical characteristics of an OS transistor are likely to fluctuate and the reliability may be reduced. Furthermore, hydrogen near the oxygen vacancies may form defects in which hydrogen is inserted into the oxygen vacancies (hereinafter sometimes referred to as VOH ), and may generate electrons that serve as carriers. For this reason, when oxygen vacancies are present in the channel formation region in the oxide semiconductor, the OS transistor is likely to have normally-on characteristics. Therefore, it is preferable that oxygen vacancies and impurities are reduced as much as possible in the channel formation region in the oxide semiconductor. In other words, it is preferable that the carrier concentration of the channel formation region in the oxide semiconductor is reduced and the channel formation region in the oxide semiconductor is made to be i-type (intrinsic) or substantially i-type.
  • the normally-on characteristic refers to a state in which a channel exists even when no voltage is applied to the gate, and current flows between the source and drain of the transistor.
  • the normally-off characteristic refers to a state in which no current flows between the source and drain of the transistor when no voltage is applied to the gate or when a ground potential is applied to the gate.
  • the source and drain regions of an OS transistor are preferably regions having more oxygen vacancies, more VOH , or a higher concentration of impurities such as hydrogen, nitrogen, or metal elements than the channel formation region, thereby increasing the carrier concentration and lowering the resistance. That is, the source and drain regions of an OS transistor are preferably n-type regions having a higher carrier concentration and lower resistance than the channel formation region.
  • the hydrogen concentration in the channel formation region of the oxide semiconductor measured by secondary ion mass spectrometry is preferably less than 1 ⁇ 10 20 atoms/cm 3 , more preferably less than 5 ⁇ 10 19 atoms/cm 3, still more preferably less than 1 ⁇ 10 19 atoms/cm 3 , still more preferably less than 5 ⁇ 10 18 atoms/cm 3 , still more preferably less than 1 ⁇ 10 18 atoms/cm 3 , and still more preferably less than 1 ⁇ 10 17 atoms/cm 3 .
  • the insulator 210 and the insulator 283 are preferably barrier insulators against hydrogen.
  • the insulator 210 and the insulator 283 are provided to sandwich the transistor 200 including the oxide semiconductor 230.
  • the insulator 210 and the insulator 283 provided on the outside of the oxide semiconductor 230 have a barrier property against hydrogen, the diffusion of hydrogen into the oxide semiconductor 230 can be suppressed.
  • a barrier insulator refers to an insulator having barrier properties.
  • the barrier properties refer to a property that a corresponding substance is difficult to diffuse (also referred to as a property that a corresponding substance is difficult to permeate, a property that the permeability of a corresponding substance is low, or a property that suppresses the diffusion of a corresponding substance).
  • hydrogen refers to at least one of, for example, a hydrogen atom, a hydrogen molecule, and a substance bonded to hydrogen such as a water molecule and OH ⁇ .
  • impurities when impurities are described as a corresponding substance, they refer to impurities in a channel formation region or a semiconductor layer, unless otherwise specified, and refer to at least one of, for example, a hydrogen atom, a hydrogen molecule, a water molecule, a nitrogen atom, a nitrogen molecule, a nitrogen oxide molecule (N 2 O, NO, NO 2 , etc.), a copper atom, etc.
  • oxygen when oxygen is described as a corresponding substance, it refers to at least one of, for example, an oxygen atom, an oxygen molecule, etc.
  • barrier insulators against hydrogen examples include aluminum oxide, magnesium oxide, hafnium oxide, gallium oxide, indium gallium zinc oxide, silicon nitride, silicon nitride oxide, and oxides containing hafnium and silicon (hereinafter sometimes referred to as hafnium silicate).
  • an oxynitride refers to a material whose composition contains more oxygen than nitrogen
  • a nitride oxide refers to a material whose composition contains more nitrogen than oxygen.
  • silicon oxynitride when silicon oxynitride is used, it refers to a material whose composition contains more oxygen than nitrogen, and when silicon nitride oxide is used, it refers to a material whose composition contains more nitrogen than oxygen.
  • the insulator 210 and the insulator 283 contain silicon and nitrogen.
  • Silicon nitride that can be used as insulator 210 and insulator 283 has a barrier property against hydrogen if the film thickness is, for example, 2 nm or more.
  • the film thickness of the silicon nitride is preferably 3 nm or more, and more preferably 5 nm or more.
  • the film thickness of the silicon nitride is preferably 1 nm or more.
  • the film thickness of the silicon nitride is preferably 2 nm or more.
  • silicon nitride formed with a film thickness that has a barrier property against hydrogen also has a barrier property against oxygen.
  • the insulator 222 is preferably an insulator having a function of trapping or fixing hydrogen.
  • the hydrogen concentration in the oxide semiconductor 230 located inside the insulator 210 and the insulator 283 can be reduced.
  • hydrogen in the oxide semiconductor 230 is trapped or fixed by the insulator 222, so that the hydrogen concentration in the insulator 222 is high.
  • the hydrogen concentration in the insulator 222 obtained by SIMS may be 1 ⁇ 10 19 atoms/cm 3 or higher or 1 ⁇ 10 20 atoms/cm 3 or higher in at least a part of a region between the oxide semiconductor 230 and the conductor 260.
  • the hydrogen concentration in at least a part of the insulator 222 is higher than the hydrogen concentration in the oxide semiconductor 230.
  • the oxide semiconductor 230 has a region where the hydrogen concentration is lower than the hydrogen concentration in the insulator 222.
  • the ability to capture or adhere to the corresponding substance can also be said to have the property of making the corresponding substance less likely to diffuse. Therefore, the ability to capture or adhere to the corresponding substance can be rephrased as barrier properties.
  • a metal oxide containing hafnium or the like e.g., hafnium oxide, etc.
  • the above metal oxide preferably has oxygen atoms with dangling bonds.
  • Such metal oxides may have the property of capturing or fixing hydrogen with dangling bonds.
  • the above metal oxide preferably has an amorphous structure. This is because in metal oxides with an amorphous structure, some oxygen atoms have dangling bonds.
  • the above metal oxide preferably has an amorphous structure, but crystalline regions may be formed in some parts. Furthermore, the above metal oxide may have crystal grain boundaries in some parts.
  • hafnium silicate an oxide containing hafnium and silicon (hafnium silicate) tends to have an amorphous structure. Therefore, hafnium silicate has the property of capturing or adhering hydrogen, making it suitable as the insulator 222. In this case, the insulator 222 contains hafnium, silicon, and oxygen.
  • the insulator 222 By making the insulator 222 have an amorphous structure, it is possible to suppress the formation of grain boundaries that accompany crystallization and polycrystallization. By suppressing the formation of grain boundaries, it is possible to improve the flatness of the insulator 222 film. This makes the film thickness distribution of the insulator 222 uniform, and reduces the number of areas where the film thickness is extremely thin, thereby improving the withstand voltage of the insulator 222. It is also possible to uniform the film thickness distribution of the film provided on the insulator 222.
  • the insulator 222 by suppressing the formation of grain boundaries in the insulator 222, it is possible to reduce leakage current caused by defect levels in the grain boundaries. This allows the insulator 222 to function as an insulating film with low leakage current.
  • oxides containing hafnium are mentioned as insulators having the function of capturing or fixing hydrogen, but the present invention is not limited to this.
  • oxides containing magnesium, oxides containing aluminum, oxides containing aluminum and hafnium (hafnium aluminate), etc. may be mentioned.
  • the above metal oxides may further be oxides containing zirconium.
  • oxides containing hafnium and zirconium, etc. it is preferable that these metal oxides have silicon added and have an amorphous structure.
  • the insulator 222 can capture or fix hydrogen released from the oxide semiconductor 230 by performing a heat treatment.
  • the insulator 222 and the oxide semiconductor 230 are preferably provided in a closed system consisting of the insulator 210 and the insulator 283, which have a barrier property against hydrogen. This makes it possible to prevent hydrogen from diffusing from the outside to the inside or from the inside to the outside of the closed system during the heat treatment, since the frequency of hydrogen movement between the inside and outside of the closed system is extremely low. Therefore, the hydrogen concentration in the oxide semiconductor 230 can be reduced by capturing or fixing hydrogen in the closed system to the insulator 222.
  • the closed system is a barrier insulator against hydrogen that covers at least a part of the oxide semiconductor and reduces hydrogen diffusing from the outside to the inside or from the inside to the outside of the closed system.
  • the part that functions as a channel formation region of the oxide semiconductor is located inside the barrier insulator against hydrogen.
  • the barrier insulator against hydrogen is preferably provided so as to extend in the channel length direction of the oxide semiconductor, and the oxide semiconductor is preferably provided so as to be surrounded or sandwiched between the barrier insulator against hydrogen.
  • the closed system does not completely block the movement of hydrogen, but only needs to reduce the frequency of hydrogen movement. Therefore, the closed system is not completely closed, and may be partially or multiplely open.
  • an oxide semiconductor with few oxygen vacancies and impurities can be provided. Therefore, the electrical characteristics of the transistor can be improved, and the reliability of the transistor can be improved. In addition, a semiconductor device with little variation in the electrical characteristics of the transistor can be provided.
  • the above structure can suppress the formation of oxygen vacancies in the channel formation region and the diffusion of hydrogen into the channel formation region. This can suppress the variation in the amount of oxygen vacancies and hydrogen concentration in the channel formation region from transistor to transistor. Therefore, the variation in the electrical characteristics of the transistors can be reduced.
  • the insulator 280 preferably contains oxygen that is released by heating (hereinafter may be referred to as excess oxygen).
  • excess oxygen oxygen can be supplied from the insulator 280 to the channel formation region of the oxide semiconductor 230, and oxygen vacancies and VOH of the oxide semiconductor 230 can be reduced. This can stabilize the electrical characteristics of the transistor and improve its reliability.
  • excess oxygen is generated by replacing the halogen element.
  • the oxygen can trap electrons and form negative charges (negative fixed charges) in the channel formation region. This can realize a normally-off transistor.
  • the above-mentioned barrier insulator against hydrogen may be used as the insulator 280.
  • silicon nitride may be used as the insulator 280.
  • the diffusion of hydrogen into the oxide semiconductor 230 can be suppressed.
  • the concentration of impurities such as water and hydrogen in the insulator 280 is reduced. This can suppress the intrusion of impurities such as water and hydrogen into the channel formation region of the oxide semiconductor 230.
  • the insulator 280 may be a single layer or a multilayer of the insulators described in the "Insulator” section below.
  • the sidewalls of the opening 290 are preferably perpendicular to the top surface of the insulator 210. This configuration allows for miniaturization or high integration of the semiconductor device.
  • the opening 290 is provided so that the sidewall of the opening 290 is perpendicular to the upper surface of the conductor 220, but the present invention is not limited to this.
  • the sidewall of the opening 290 may have a tapered shape rather than being strictly perpendicular to the upper surface of the conductor 220. If the sidewall of the opening 290 has a tapered shape, this is preferable because it improves the coverage of the film (e.g., oxide semiconductor 230) formed covering the sidewall of the opening 290.
  • the oxide semiconductor 230 has a region in contact with the side surface of the conductor 240 in the opening 290, and a region in contact with at least a portion of the top surface of the conductor 240. In this way, the oxide semiconductor 230 contacts not only the side surface but also the top surface of the conductor 240, so that the area of contact between the oxide semiconductor 230 and the conductor 240 can be increased. In addition, the oxide semiconductor 230 has a region in contact with the top surface of the conductor 220 exposed in the opening 290, and a region in contact with the side surface of the insulator 280 in the opening 290.
  • a portion of the oxide semiconductor 230 is located outside the opening 290, i.e., above the conductor 240.
  • Figure 1B shows a configuration in which the oxide semiconductor 230 is divided in the X direction
  • the present invention is not limited to this.
  • the oxide semiconductor 230 may be provided extending in the X direction. Note that even in this case, the oxide semiconductor 230 is divided in the Y direction.
  • FIG. 1C also shows a configuration in which the side end of the oxide semiconductor 230 is located inside the side end of the conductor 240.
  • the present invention is not limited to this.
  • a structure in which the side end of the oxide semiconductor 230 and the side end of the conductor 240 coincide in the Y direction may be used.
  • a structure in which the side end of the oxide semiconductor 230 is located outside the side end of the conductor 240 may be used.
  • the insulator 250 is provided in contact with the upper surface of the oxide semiconductor 230.
  • the insulator 250 has a region in contact with the upper surface of the conductor 240, a region in contact with the side surface of the conductor 240, and a region in contact with the upper surface of the insulator 280.
  • a portion of the insulator 250 is located outside the opening 290, i.e., above the conductor 240 and the insulator 280. At this time, it is preferable that the insulator 250 covers the side end of the oxide semiconductor 230. This can prevent the conductor 260 and the oxide semiconductor 230 from shorting out. It is also preferable that the insulator 250 covers the side end of the conductor 240. This can prevent the conductor 260 and the conductor 240 from shorting out.
  • the conductor 260 is provided in contact with the upper surface of the insulator 250.
  • the side end of the conductor 260 is preferably located inside the side end of the oxide semiconductor 230. This makes it possible to suppress the magnitude of the parasitic capacitance formed between the conductor 260 and the conductor 240. Note that the side end of the conductor 260 may coincide with the side end of the oxide semiconductor 230, or may be located outside the side end of the oxide semiconductor 230.
  • the conductor 260 is provided so as to fill the opening 290, but the present invention is not limited to this.
  • a recess reflecting the shape of the opening 290 may be formed in the conductor 260, and a part of the recess may be located within the opening 290.
  • the recess may be filled with an inorganic insulating material or the like.
  • the conductor 240 has an opening in a region overlapping with the conductor 220. Moreover, it is preferable that the conductor 240 is not provided inside the opening of the insulator 280. In other words, it is preferable that the conductor 240 does not have a region in contact with the side surface of the insulator 280 in the opening 290. With this configuration, the opening of the conductor 240 and the opening of the insulator 280 can be formed at the same time. Furthermore, by configuring the side surface of the conductor 240 in the opening 290 and the side surface of the insulator 280 in the opening 290 to roughly coincide with each other, the film thickness distribution of the oxide semiconductor 230 provided inside the opening 290 can be made uniform. Furthermore, it is possible to prevent the oxide semiconductor 230 from being divided by a step generated between the side surface of the conductor 240 in the opening 290 and the side surface of the insulator 280 in the opening 290.
  • Figures 1B and 1C show a configuration in which the side of conductor 240 in opening 290 and the side of insulator 280 in opening 290 roughly coincide with each other, the present invention is not limited to this.
  • the side of conductor 240 in opening 290 and the side of insulator 280 in opening 290 may be discontinuous.
  • the inclination of the side of conductor 240 in opening 290 and the inclination of the side of insulator 280 in opening 290 may differ from each other.
  • the conductor 240 may be any of the conductors described in the section below on [Conductors], either in a single layer or in a multilayer configuration. It is preferable to use a conductive material that is resistant to oxidation or a conductive material that has the function of suppressing the diffusion of oxygen as the conductor 240.
  • a conductive material that is resistant to oxidation or a conductive material that has the function of suppressing the diffusion of oxygen may be used.
  • titanium nitride, tantalum nitride, or indium tin oxide with added silicon also known as ITSO may be used.
  • the conductor 220 like the conductor 240 described above, the conductors described in the section below under [Conductor] can be used in a single layer or in a laminated form.
  • the conductor 220 it is preferable to use a conductive material that is difficult to oxidize, or a conductive material that has the function of suppressing the diffusion of oxygen.
  • a conductive material that is difficult to oxidize or a conductive material that has the function of suppressing the diffusion of oxygen.
  • titanium nitride, tantalum nitride, ITSO, or a structure in which titanium nitride, tungsten, and ITSO are laminated in this order can be used.
  • FIGS. 1B and 1C show a configuration in which the top surface of the conductor 220 is flat, but the present invention is not limited to this.
  • a configuration in which a recess overlapping the opening 290 is formed on the top surface of the conductor 220 may be used.
  • FIG. 2A shows an enlarged cross-sectional view of the semiconductor device in the XZ plane shown in FIG. 1B.
  • FIG. 2B shows a cross-sectional view of the semiconductor device shown in FIG. 2A cut in the XY plane so as to include the channel formation region of the oxide semiconductor 230.
  • the oxide semiconductor 230 has a region 230cd and regions 230na and 230nb that are arranged to sandwich the region 230cd.
  • Region 230na is a region of oxide semiconductor 230 in contact with conductor 220. At least a portion of region 230na functions as one of the source region or drain region of the transistor.
  • Region 230nb is a region of oxide semiconductor 230 in contact with conductor 240. At least a portion of region 230nb functions as the other of the source region or drain region of the transistor.
  • conductor 240 contacts the entire outer periphery of opening 290 that overlaps with oxide semiconductor 230.
  • the other of the source region or drain region of the transistor can be formed on the entire outer periphery of a portion of oxide semiconductor 230 that is formed at the same height as conductor 240.
  • the regions 230na and 230nb which function as the source and drain regions, have a lower resistance than the region 230cd, which functions as the channel formation region.
  • 230na and 230nb can be said to be regions with a higher oxygen vacancy density or a higher impurity concentration than the region 230cd.
  • the concentration of impurity elements in regions 230na and 230nb is higher than the concentration of the impurity elements in region 230cd.
  • noble gases include helium, neon, argon, krypton, and xenon.
  • the concentration of one or more of boron, phosphorus, aluminum, magnesium, and silicon is higher than the concentration of the impurity elements in region 230cd. This allows the resistance of regions 230na and 230nb to be reduced, thereby increasing the on-current of the transistor.
  • Region 230cd is a region between region 230na and region 230nb of oxide semiconductor 230. At least a part of region 230cd functions as a channel formation region of the transistor. In other words, the channel formation region of the transistor is located in a region of oxide semiconductor 230 between conductor 220 and conductor 240. It can also be said that the channel formation region of the transistor is located in a region of oxide semiconductor 230 that is in contact with insulator 280 or in a region in the vicinity of the region.
  • the channel length of a transistor is the distance between the source region and the drain region. In other words, it can be said that the channel length of a transistor is determined by the thickness of the insulator 280 on the conductor 220.
  • the channel length L of a transistor is indicated by a dashed double-headed arrow. In a cross-sectional view, the channel length L is the distance between the end of the region where the oxide semiconductor 230 and the conductor 220 contact each other and the end of the region where the oxide semiconductor 230 and the conductor 240 contact each other. In other words, the channel length L corresponds to the length of the side surface of the insulator 280 on the opening 290 side in a cross-sectional view.
  • the channel length is set by the exposure limit of photolithography, but in the present invention, the channel length can be set by the film thickness of the insulator 280. Therefore, the channel length of the transistor can be made an extremely fine structure below the exposure limit of photolithography (for example, 1 nm to 60 nm, 1 nm to 50 nm, 1 nm to 40 nm, 1 nm to 30 nm, 1 nm to 20 nm, 1 nm to 10 nm, or 5 nm to 10 nm). This increases the on-current of the transistor, improving the frequency characteristics. Therefore, a semiconductor device with high operating speed can be provided.
  • the exposure limit of photolithography for example, 1 nm to 60 nm, 1 nm to 50 nm, 1 nm to 40 nm, 1 nm to 30 nm, 1 nm to 20 nm, 1 nm to 10 nm, or 5 nm to 10 nm.
  • a channel formation region, a source region, and a drain region can be formed within the opening 290. This allows the area occupied by the transistor to be reduced compared to a planar type transistor in which the channel formation region, the source region, and the drain region are provided separately on the XY plane. This allows for a high degree of integration of the semiconductor device.
  • the oxide semiconductor 230, the insulator 250, and the conductor 260 are arranged concentrically. Therefore, the side of the conductor 260 arranged at the center faces the side of the oxide semiconductor 230 through the insulator 250. That is, in a plan view, the entire inner circumference of the oxide semiconductor 230 becomes the channel formation region.
  • the length of the outer circumference of the oxide semiconductor 230 determines the channel width of the transistor. In other words, it can be said that the channel width of the transistor is determined by the size of the maximum width of the opening 290 (the diameter when the opening 290 is circular in a plan view).
  • the maximum width D of the opening 290 is indicated by a double-headed arrow of a two-dot chain line.
  • the channel width W of the transistor is indicated by a double-dot chain line of a one-dot chain line.
  • the maximum width D of the opening 290 is preferably, for example, 5 nm to 100 nm, 10 nm to 100 nm, 20 nm to 100 nm, 20 nm to 60 nm, 20 nm to 50 nm, 20 nm to 40 nm, or 30 nm to 40 nm. This makes it possible to realize a semiconductor device that is finer and more highly integrated than when a planar transistor is used. As described above, when the opening 290 is circular in a planar view, the maximum width D of the opening 290 corresponds to the diameter of the opening 290, and the channel width W can be calculated as "D x ⁇ ".
  • the opening 290 is circular in plan view, but the present invention is not limited to this.
  • the opening 290 may be approximately circular such as an ellipse, polygonal such as a rectangle, or polygonal such as a rectangle with rounded corners in plan view.
  • the maximum width of the opening 290 may be calculated appropriately according to the shape of the top of the opening 290. For example, if the opening is rectangular in plan view, the maximum width of the opening 290 may be the length of the diagonal line at the top of the opening 290.
  • the channel length L of the transistor is preferably at least smaller than the channel width W of the transistor.
  • the channel length L of the transistor according to one embodiment of the present invention is 0.1 to 0.99 times, preferably 0.5 to 0.8 times, the channel width W of the transistor.
  • the distance between the conductor 260 and the oxide semiconductor 230 becomes approximately uniform. Therefore, a gate electric field can be applied approximately uniformly from the conductor 260 to the oxide semiconductor 230.
  • the sidewall of the opening 290 is preferably perpendicular to the top surface of the conductor 220, for example. This configuration allows the semiconductor device to be miniaturized or highly integrated.
  • the sidewall of the opening 290 may be tapered. When the sidewall of the opening 290 has a tapered shape, the coverage of the film (e.g., oxide semiconductor 230) formed to cover the sidewall of the opening 290 can be improved.
  • Normally-on transistors have a larger off-current than normally-off transistors. For this reason, for example, using normally-on transistors in a memory device can induce various problems, such as a shortened data retention time, increased refresh frequency, and increased power consumption.
  • transistors with extremely short channel lengths for use in memory devices, etc. the transistors must be manufactured to have normally-off characteristics.
  • the transistor according to one embodiment of the present invention can be an OS transistor that uses a metal oxide in the semiconductor layer.
  • OS transistors have higher resistance to short-channel effects than Si transistors. Therefore, as described above, even when a transistor with an extremely short channel length is manufactured, the influence of short-channel effects can be suppressed.
  • the oxide semiconductor 230 has a negative charge (negative fixed charge) in the region 230cd that functions as a channel formation region, and the potential in this region is lower than the potential in the regions 230na and 230nb that function as a source region and a drain region.
  • the negative charge can be generated when a halogen element such as chlorine or fluorine is added to the oxide semiconductor 230 (particularly, the region 230cd) by ion implantation or the like to generate excess oxygen during the manufacture of the transistor, and then oxygen contained in the insulator 280 is supplied to the oxide semiconductor 230 (particularly, the region 230cd) by heat treatment or the like, and the oxygen traps electrons.
  • a normally-off transistor can be realized due to the substrate bias effect.
  • Figures 3A to 3C show schematic diagrams that explain how the electrical characteristics (Id-Vg characteristics) of a transistor become normally off due to the substrate bias effect.
  • Figure 3A is a diagram explaining the potential applied to each region of a transistor (n-channel transistor).
  • Vs is the potential applied to the source of the transistor
  • Vd is the potential applied to the drain of the transistor
  • Vg is the potential applied to the gate of the transistor
  • Vb is the potential applied to the semiconductor layer (channel formation region) of the transistor
  • Id is the drain current.
  • Figure 3B shows an example where Id starts to flow when Vg is close to 0V.
  • FIG. 3C is a schematic diagram showing an example of the Id-Vg characteristics of a transistor when Vb is a lower potential than Vs (Vb ⁇ Vs).
  • Vb a lower potential than Vs
  • the substrate bias effect comes into play, and the transistor can obtain a normally-off Id-Vg characteristic that is more similar to that of FIG. 3B.
  • the potential is equivalent to the potential energy of a charge of 1C. Therefore, it can be said that the magnitude of the potential (Vs, Vd, Vg, Vb) applied to each region of the transistor corresponds to the magnitude (amount of charge) of the charge that each region of the transistor has. Therefore, when a region of a transistor, for example the channel formation region, has a certain magnitude of negative charge, it can be said to be equivalent to a negative potential (Vb) of a magnitude corresponding to that negative charge being applied to the channel formation region.
  • a transistor having a negative charge (negative fixed charge) in the channel formation region exhibits the same behavior (electrical characteristics) as a transistor having a negative potential (Vb) corresponding to the negative charge applied to the channel formation region.
  • a transistor having a negative charge (negative fixed charge) of a certain magnitude in the channel formation region exhibits an effect similar to the substrate bias effect that acts when a negative potential (Vb) of a magnitude corresponding to the negative charge is applied.
  • a negative charge (negative fixed charge) is formed in the channel formation region (region 230cd), causing the region to have a lower potential than the source region and drain region (region 230na and region 230nb). This allows the substrate bias effect to be exerted, thereby realizing a transistor with normally-off characteristics.
  • the transistor according to one embodiment of the present invention does not need to have a back gate for causing the substrate bias effect to occur. Therefore, the number of steps required for manufacturing the transistor can be reduced.
  • a power supply for applying a negative bias to the back gate is also not required, and a normally-off transistor can be realized without increasing the number of components associated with the semiconductor device. Furthermore, since it is not necessary to apply a negative bias to the back gate, a normally-off transistor can be realized without increasing power consumption.
  • the metal oxides described in the section [Metal Oxides] below can be used in a single layer or a stacked layer.
  • the composition close thereto includes a range of ⁇ 30% of the desired atomic ratio. It is also preferable to use one or more of gallium, aluminum, and tin as the element M.
  • the oxide semiconductor 230 may not contain the element M.
  • the metal oxide used as the oxide semiconductor 230 may be an In-Zn oxide.
  • indium oxide may be used as the oxide semiconductor 230.
  • the oxide semiconductor 230 may also have a composition containing a trace amount of the element M.
  • the composition of the metal oxide used in the oxide semiconductor 230 can be analyzed using, for example, energy dispersive X-ray spectrometry (EDX), X-ray photoelectron spectrometry (XPS), inductively coupled plasma mass spectrometry (ICP-MS), or inductively coupled plasma-atomic emission spectrometry (ICP-AES).
  • EDX energy dispersive X-ray spectrometry
  • XPS X-ray photoelectron spectrometry
  • ICP-MS inductively coupled plasma mass spectrometry
  • ICP-AES inductively coupled plasma-atomic emission spectrometry
  • a combination of these techniques may be used for the analysis.
  • the actual content may differ from the content obtained by analysis due to the influence of analytical accuracy. For example, if the content of element M is low, the content of element M obtained by analysis may be lower than the actual content.
  • the metal oxide can be formed preferably by sputtering or atomic layer deposition (ALD).
  • ALD atomic layer deposition
  • the composition of the formed metal oxide may differ from the composition of the sputtering target.
  • the zinc content in the formed metal oxide may decrease to about 50% compared to the sputtering target.
  • Examples of the ALD method include the Thermal ALD method, in which the reaction between the precursor and reactant is carried out using only thermal energy, and the Plasma Enhanced ALD (PEALD) method, in which a plasma-excited reactant is used.
  • Thermal ALD method in which the reaction between the precursor and reactant is carried out using only thermal energy
  • PEALD Plasma Enhanced ALD
  • the ALD method can deposit atoms one layer at a time, and therefore has the following advantages: extremely thin films can be formed; films can be formed on structures with high aspect ratios or surfaces with large steps; films can be formed with few defects such as pinholes; films can be formed with excellent coverage; and films can be formed at low temperatures.
  • the PEALD method may be preferable because it uses plasma, which allows films to be formed at lower temperatures.
  • some precursors used in the ALD method contain elements such as carbon or chlorine.
  • films formed by the ALD method may contain more elements such as carbon or chlorine than films formed by other film formation methods. Note that the quantification of these elements can be performed using XPS or SIMS.
  • the metal oxide film formation method of one embodiment of the present invention uses the ALD method, but adopts one or both of the conditions of a high substrate temperature during film formation and the implementation of an impurity removal process, so the amount of carbon and chlorine contained in the film may be smaller than when the ALD method is used without applying these.
  • the ALD method is a film formation method in which a film is formed by a reaction on the surface of a workpiece, unlike a film formation method in which particles released from a target are deposited. Therefore, it is a film formation method that is not easily affected by the shape of the workpiece and has good step coverage.
  • the ALD method has excellent step coverage and excellent thickness uniformity, making it suitable for coating the surface of an opening with a high aspect ratio.
  • the ALD method since the ALD method has a relatively slow film formation speed, it may be preferable to use it in combination with other film formation methods such as a sputtering method or a chemical vapor deposition (CVD) method, which have a fast film formation speed.
  • the metal oxide has a layered structure of a first metal oxide and a second metal oxide
  • a method of forming a first metal oxide film using a sputtering method and forming a second metal oxide film on the first metal oxide using an ALD method can be mentioned.
  • the first metal oxide has a crystalline portion
  • the second metal oxide may grow as a crystal using the crystalline portion as a nucleus.
  • the ALD method can control the composition of the resulting film by adjusting the amount of raw material gas introduced.
  • the ALD method can form a film of any composition by adjusting the amount of raw material gas introduced, the number of times it is introduced (also called the number of pulses), the time required for one pulse (also called the pulse time), and the like.
  • the ALD method can form a film whose composition changes continuously by changing the raw material gas while forming the film.
  • the time required for film formation can be shortened compared to forming a film using multiple film formation chambers because no time is required for transportation and pressure adjustment. Therefore, the productivity of semiconductor devices can be increased in some cases.
  • the method for forming the oxide semiconductor film that becomes the oxide semiconductor 230 is not particularly limited.
  • the oxide semiconductor film may be formed using a CVD method, an MBE method, a PLD method, or the like.
  • the oxide semiconductor 230 preferably has crystallinity.
  • oxide semiconductors having crystallinity include C-Axis Aligned Crystalline Oxide Semiconductor (CAAC-OS), nanocrystalline oxide semiconductor (nc-OS), polycrystalline oxide semiconductor, and single-crystalline oxide semiconductor. It is preferable to use CAAC-OS or nc-OS as the oxide semiconductor 230, and it is particularly preferable to use CAAC-OS.
  • CAAC-OS is a metal oxide that has a highly crystalline and dense structure and has few impurities and defects (e.g., oxygen vacancies).
  • the CAAC-OS can be made to have a more crystalline and dense structure. In this way, the density of the CAAC-OS can be further increased, thereby further reducing the diffusion of impurities or oxygen in the CAAC-OS.
  • the oxide semiconductor 230 by using a crystalline oxide such as CAAC-OS as the oxide semiconductor 230, it is possible to suppress the extraction of oxygen from the oxide semiconductor 230 by the source electrode or the drain electrode. As a result, even when heat treatment is performed, it is possible to suppress the extraction of oxygen from the oxide semiconductor 230, and the transistor is stable against high temperatures (so-called thermal budget) in the manufacturing process.
  • a crystalline oxide such as CAAC-OS
  • the crystallinity of the oxide semiconductor 230 can be analyzed, for example, by X-ray diffraction (XRD), a transmission electron microscope (TEM), or electron diffraction (ED). Alternatively, the analysis may be performed by combining a plurality of these techniques.
  • XRD X-ray diffraction
  • TEM transmission electron microscope
  • ED electron diffraction
  • the oxide semiconductor 230 in contact with the upper surfaces of the conductor 240 and the conductor 220 can be made into a CAAC-OS relatively easily.
  • the oxide semiconductor 230 can be polycrystallized by using polycrystallized indium tin oxide for the conductor 240.
  • the oxide semiconductor 230 is shown as a single layer, but the present invention is not limited thereto.
  • the oxide semiconductor 230 may have a stacked structure of a plurality of oxide layers having different chemical compositions.
  • the oxide semiconductor 230 may have a structure in which a plurality of types of metal oxides selected from those described in the section [Metal Oxide] described later are appropriately stacked.
  • the oxide semiconductor 230 may have a layered structure of an oxide semiconductor 230a and an oxide semiconductor 230b on the oxide semiconductor 230a.
  • the electrical conductivity of the material used for oxide semiconductor 230a is preferably different from the electrical conductivity of the material used for oxide semiconductor 230b.
  • the oxide semiconductor 230a can be made of a material having a higher conductivity than the oxide semiconductor 230b.
  • a material having a high conductivity for the oxide semiconductor 230a in contact with the conductor 220 and the conductor 240, which function as a source electrode or a drain electrode the contact resistance between the oxide semiconductor 230 and the conductor 220 and the contact resistance between the oxide semiconductor 230 and the conductor 240 can be reduced, and a transistor with a large on-current can be obtained.
  • the threshold voltage of the transistor may shift, and the drain current (hereinafter also referred to as cutoff current) that flows when the gate voltage is 0 V may become large.
  • the threshold voltage may become low. Therefore, it is preferable to use a material with lower conductivity than the oxide semiconductor 230a for the oxide semiconductor 230b.
  • the threshold voltage can be increased, and the transistor can have a small cutoff current. Note that a small cutoff current may be referred to as a normally-off transistor.
  • the oxide semiconductor 230 As described above, by forming the oxide semiconductor 230 into a stacked structure and using a material for the oxide semiconductor 230a that has a higher electrical conductivity than the oxide semiconductor 230b, a transistor that is normally off and has a large on-current can be obtained. Therefore, a semiconductor device that achieves both low power consumption and high performance can be obtained.
  • the carrier concentration of the oxide semiconductor 230a is preferably higher than that of the oxide semiconductor 230b. Increasing the carrier concentration of the oxide semiconductor 230a increases the conductivity, and the contact resistance between the oxide semiconductor 230 and the conductor 220 and the contact resistance between the oxide semiconductor 230 and the conductor 240 can be reduced, resulting in a transistor with a large on-current. Reducing the carrier concentration of the oxide semiconductor 230b decreases the conductivity, resulting in a normally-off transistor.
  • the oxide semiconductor 230a is made of a material having a higher conductivity than the oxide semiconductor 230b, but the present invention is not limited to this.
  • the oxide semiconductor 230a may be made of a material having a lower conductivity than the oxide semiconductor 230b.
  • a configuration can be used in which the carrier concentration of the oxide semiconductor 230a is lower than the carrier concentration of the oxide semiconductor 230b.
  • the band gap of the first metal oxide used in the oxide semiconductor 230a is preferably different from the band gap of the second metal oxide used in the oxide semiconductor 230b.
  • the difference between the band gap of the first metal oxide and the band gap of the second metal oxide is preferably 0.1 eV or more, more preferably 0.2 eV or more, and even more preferably 0.3 eV or more.
  • the band gap of the first metal oxide used in the oxide semiconductor 230a can be smaller than the band gap of the second metal oxide used in the oxide semiconductor 230b. This can reduce the contact resistance between the oxide semiconductor 230 and the conductor 220 and the contact resistance between the oxide semiconductor 230 and the conductor 240, resulting in a transistor with a large on-state current. Furthermore, when the transistor 200 is an n-channel transistor, the threshold voltage can be increased, resulting in a normally-off transistor.
  • the band gap of the first metal oxide is smaller than the band gap of the second metal oxide, but the present invention is not limited to this.
  • the band gap of the first metal oxide can be larger than the band gap of the second metal oxide.
  • the band gap of the first metal oxide used in the oxide semiconductor 230a can be smaller than the band gap of the second metal oxide used in the oxide semiconductor 230b.
  • the composition of the first metal oxide is preferably different from that of the second metal oxide.
  • the band gap can be controlled.
  • the content of element M in the first metal oxide is preferably lower than the content of element M in the second metal oxide.
  • the first metal oxide and the second metal oxide are In-M-Zn oxides
  • the first metal oxide may not contain the element M.
  • the first metal oxide used in the oxide semiconductor 230a may be an In-Zn oxide
  • the second metal oxide used in the oxide semiconductor 230b may be an In-M-Zn oxide.
  • the first metal oxide may be an In-Zn oxide
  • the second metal oxide may be an In-Ga-Zn oxide.
  • the first metal oxide may also have a composition containing a trace amount of the element M.
  • the content of element M in the first metal oxide is lower than the content of element M in the second metal oxide, but one embodiment of the present invention is not limited to this.
  • the content of element M in the first metal oxide may be higher than the content of element M in the second metal oxide. Note that it is sufficient that the first metal oxide and the second metal oxide have different compositions, and the contents of elements other than element M may be different.
  • FIG. 5A and 5B show an example of a band diagram (diagram of the conduction band minimum) when the oxide semiconductor 230 has a two-layer structure of the oxide semiconductor 230a and the oxide semiconductor 230b.
  • FIG. 5A shows an example of a band diagram when the oxide semiconductor 230a is made of a material having a higher conductivity than the oxide semiconductor 230b.
  • the energy level of the conduction band minimum of the oxide semiconductor 230a is lower than the energy level of the conduction band minimum of the oxide semiconductor 230b, so that the electrons that serve as carriers mainly flow as a carrier path in the oxide semiconductor 230a.
  • FIG. 5B is an example of a band diagram when a material with a lower conductivity than that of the oxide semiconductor 230b is used for the oxide semiconductor 230a.
  • the energy level of the lower end of the conduction band of the oxide semiconductor 230b is lower than the energy level of the lower end of the conduction band of the oxide semiconductor 230a, so that the electrons that serve as carriers mainly flow as a carrier path through the oxide semiconductor 230b.
  • the oxide semiconductor 230 has a two-layer stacked structure, by using materials with different electrical conductivity, band gaps, etc. for the oxide semiconductor 230a and the oxide semiconductor 230b, the band shape of the oxide semiconductor 230 changes, and the carrier path in the oxide semiconductor 230 can be changed.
  • the thickness of the oxide semiconductor 230 is preferably, for example, 1 nm or more and 20 nm or less, 3 nm or more and 15 nm or less, 5 nm or more and 12 nm or less, or 5 nm or more and 10 nm or less.
  • each layer (here, oxide semiconductor 230a and oxide semiconductor 230b) constituting oxide semiconductor 230 may be determined so that the thickness of oxide semiconductor 230 falls within the aforementioned range.
  • the thickness of oxide semiconductor 230a can be determined so that the contact resistance between oxide semiconductor 230a and conductor 220 and the contact resistance between oxide semiconductor 230a and conductor 240 fall within the required range.
  • the thickness of oxide semiconductor 230b can be determined so that the threshold voltage of the transistor falls within the required range. Note that the thickness of oxide semiconductor 230a may be the same as or different from the thickness of oxide semiconductor 230b.
  • the oxide semiconductor 230a and the oxide semiconductor 230b may have different ratios of film thickness at the portion where the top surface of the conductor 240 is to be formed to the portion where the side surface of the conductor 240 and the side surface of the insulator 280 are to be formed.
  • the oxide semiconductor 230 is shown to have a two-layer structure of the oxide semiconductor 230a and the oxide semiconductor 230b, but the present invention is not limited to this.
  • the oxide semiconductor 230 may have a three or more layer structure.
  • the oxide semiconductor 230 may have a layered structure of an oxide semiconductor 230a, an oxide semiconductor 230b on the oxide semiconductor 230a, and an oxide semiconductor 230c on the oxide semiconductor 230b.
  • an oxide semiconductor 230c may be provided between the conductor 260 and the oxide semiconductor 230b.
  • the atomic ratio of element M to In is preferably greater than the atomic ratio of element M to In in the metal oxide used for the oxide semiconductor 230b.
  • the oxide semiconductor 230a may not be provided.
  • the oxide semiconductor 230 may have a stacked structure of the oxide semiconductor 230b and the oxide semiconductor 230c on the oxide semiconductor 230b.
  • the oxide semiconductor 230a may not be provided.
  • the oxide semiconductor film that becomes the oxide semiconductor 230b is formed using an ALD method or a CVD method
  • the oxide semiconductor 230a may not be provided.
  • damage to the insulator 280 is reduced, and the diffusion of elements contained in the insulator 280 into the oxide semiconductor film can be suppressed.
  • the threshold voltage of the transistor 200 may shift and the cutoff current may become large. Specifically, when the transistor 200 is an n-channel transistor, the threshold voltage may become low. Therefore, it is preferable to use a material with lower conductivity than the oxide semiconductor 230b for the oxide semiconductor 230c. As a result, when the transistor 200 is an n-channel transistor, the threshold voltage can be increased and the transistor can have a small cutoff current.
  • the oxide semiconductor 230b As described above, by using a material having a higher conductivity than the oxide semiconductor 230c as the oxide semiconductor 230b, a normally-off transistor with a large on-state current can be obtained. Therefore, a semiconductor device that achieves both low power consumption and high performance can be obtained.
  • the carrier concentration of the oxide semiconductor 230b is preferably higher than that of the oxide semiconductor 230c.
  • the conductivity is increased, and a transistor with a large on-state current can be obtained.
  • the conductivity is decreased, and a normally-off transistor can be obtained.
  • the oxide semiconductor 230b is made of a material having a higher conductivity than the oxide semiconductor 230c; however, one embodiment of the present invention is not limited to this.
  • the oxide semiconductor 230b may be made of a material having a lower conductivity than the oxide semiconductor 230c.
  • the carrier concentration of the oxide semiconductor 230b may be lower than the carrier concentration of the oxide semiconductor 230c.
  • the band gap of the second metal oxide used in the oxide semiconductor 230b is preferably different from the band gap of the third metal oxide used in the oxide semiconductor 230c.
  • the difference between the band gap of the second metal oxide and the band gap of the third metal oxide is preferably 0.1 eV or more, more preferably 0.2 eV or more, and even more preferably 0.3 eV or more.
  • the band gap of the second metal oxide used in the oxide semiconductor 230b can be smaller than the band gap of the third metal oxide used in the oxide semiconductor 230c. This can reduce the contact resistance between the oxide semiconductor 230 and the conductor 220 and the contact resistance between the oxide semiconductor 230 and the conductor 240, resulting in a transistor with a large on-state current. Furthermore, when the transistor 200 is an n-channel transistor, the threshold voltage can be increased, resulting in a normally-off transistor.
  • the band gap of the second metal oxide is smaller than the band gap of the third metal oxide, but one embodiment of the present invention is not limited to this.
  • the band gap of the second metal oxide may be larger than the band gap of the third metal oxide.
  • the first metal oxide used in the oxide semiconductor 230a and the third metal oxide used in the oxide semiconductor 230c may have the same composition or different compositions.
  • Figure 5C shows an example of a band diagram (diagram of the bottom of the conduction band) when the oxide semiconductor 230 has a three-layer stacked structure of oxide semiconductor 230a, oxide semiconductor 230b, and oxide semiconductor 230c.
  • Figure 5C shows an example of a band diagram when, of the three layers, the oxide semiconductor 230b is made of a material with the highest conductivity, and the oxide semiconductor 230a and the oxide semiconductor 230c are made of materials with approximately the same conductivity.
  • the energy level of the conduction band minimum of the oxide semiconductor 230b becomes lower than the energy levels of the conduction band minimums of the oxide semiconductor 230a and the oxide semiconductor 230c, and a so-called buried channel can be formed. Therefore, electrons that serve as carriers mainly flow as a carrier path in the oxide semiconductor 230b. In this way, by applying a transistor with a buried channel structure, it is possible to operate the transistor in a state where influences (e.g., electron trapping in the interface state) at the interface between the oxide semiconductor 230 and the insulator 250 and the interface between the oxide semiconductor 230 and the insulator 280 are suppressed. Therefore, a transistor with good electrical characteristics and reliability can be realized.
  • influences e.g., electron trapping in the interface state
  • the configurations of the conductor 240, the conductor 220, the insulator 250, the conductor 260, and the insulator 283 are also different from those of the semiconductor device shown in Figures 1A to 1C.
  • the conductor 240 has a laminated structure.
  • the conductor 240 has a laminated structure of a conductor 240a and a conductor 240b that is in contact with the upper surface of the conductor 240a.
  • the bottom surface (surface on the insulator 210 side) of the conductor 240a contacts the insulator 280, and in the Y direction (not shown), one of the side surfaces (the side facing the opening 290) contacts the oxide semiconductor 230, and the other side surface (the side not facing the opening 290) contacts the insulator 250.
  • the conductor 240a is preferably made of a metal having a higher conductivity than the conductor 240b.
  • the conductor 240a is preferably made of a metal having a lower sheet resistance than the conductor 240b. With this configuration, the conductor 240 including the conductor 240a can function as wiring connected to one of the source electrode or the drain electrode.
  • the conductor 240a may be one or more of ruthenium, tantalum, nickel, titanium, molybdenum, tungsten, hafnium, vanadium, niobium, aluminum, chromium, copper, silver, gold, platinum, zinc, manganese, iron, cobalt, magnesium, zirconium, beryllium, indium, iridium, strontium, and lanthanum, as well as alloys containing one or more of the aforementioned metals.
  • a portion of the conductor 240a may contain a metal oxide of the above metal.
  • a layer of the metal oxide may be formed near the interface of the conductor 240a with the conductor 240b and near the interface with the oxide semiconductor 230.
  • ruthenium and ruthenium alloys are preferable because they are materials that maintain a relatively low electrical resistance even when oxidized.
  • the conductor 240b has one side (the side facing the opening 290) and a part of the top surface in contact with the oxide semiconductor 230.
  • the other side (the side not facing the opening 290) of the conductor 240b and another part of the top surface are in contact with the insulator 250.
  • the conductor 240b preferably has ohmic contact with the oxide semiconductor 230, and preferably has low contact resistance with the oxide semiconductor 230.
  • the contact resistance between the conductor 240b and the oxide semiconductor 230 is preferably lower than the contact resistance between the metal layer used in the conductor 240a and the oxide semiconductor 230.
  • the conductor 240b is preferably made of a metal oxide having conductivity (sometimes referred to as a conductive oxide). By configuring the conductor 240b as described above, the on-current, field effect mobility, and frequency characteristics of the transistor 200 can be improved.
  • the conductive oxide (OC: Oxide Conductor, also called conductive material containing oxygen) used for the conductor 240b is preferably a conductive oxide containing indium.
  • the conductive oxide containing indium it is preferable to use indium oxide, indium tin oxide (sometimes called ITO), indium zinc oxide, ITSO, etc.
  • indium oxide may contain tungsten or titanium, for example, In-W oxide, In-W-Zn oxide, In-Ti oxide, In-Ti-Sn oxide, etc. may be used.
  • a conductive oxide containing zinc may be used, for example, zinc oxide, zinc oxide with gallium added, In-Ga-Zn oxide, etc. may be used.
  • conductive oxide ruthenium oxide, oxide containing strontium and ruthenium, oxide containing lanthanum and nickel, etc. may be used.
  • a conductive oxide containing indium is preferable because of its high conductivity.
  • indium tin oxide with silicon added may be used for the conductor 240b.
  • the conductor 240b contains indium, tin, silicon, and oxygen.
  • silicon By adding silicon to the indium tin oxide, the polycrystallization of the indium tin oxide can be suppressed.
  • indium tin oxide with silicon added is likely to have an nc structure (nanocrystal structure) or an amorphous structure.
  • Polycrystallized indium tin oxide may also be used for the conductor 240b. In this case, the conductor 240b contains indium, tin, and oxygen.
  • oxygen in the conductor 240b diffuses to the vicinity of the interface with the conductor 240a, and oxygen vacancies (V O ) are formed in the conductor 240b. Furthermore, oxygen in the oxide semiconductor 230 near the conductor 240 diffuses to the vicinity of the interface with the conductor 240b and the conductor 240a where the oxygen vacancies (V O ) are formed, and oxygen vacancies (V O ) are formed in a region of the oxide semiconductor 230 near the conductor 240.
  • the reduced-resistance region functions as one of the source region and the drain region of the transistor 200.
  • the conductor 240 has a two-layer laminate structure of the conductor 240a and the conductor 240b, but the present invention is not limited to this.
  • the conductor 240 may have a laminate structure of three or more layers.
  • the conductor 220 may have a layered structure of conductor 220a and conductor 220b on conductor 220a.
  • the conductor 220a is made of a metal with high conductivity similar to that of the conductor 240a. Therefore, the conductor 220a may be made of a metal that can be used for the conductor 240a. For example, tungsten may be used for the conductor 220a.
  • the conductor 220 including the conductor 220a can function as a wiring connected to the other of the source electrode or the drain electrode.
  • the conductor 220b is preferably made of a conductive oxide similar to that of the conductor 240b. Therefore, the conductor 220b may be made of a conductive oxide that can be used for the conductor 240b. For example, indium tin oxide with silicon added may be used for the conductor 220b. In this case, the conductor 220b contains indium, tin, silicon, and oxygen. With this configuration, the on-current, field effect mobility, and frequency characteristics of the transistor 200 can be improved.
  • oxygen in the conductor 220b diffuses to the vicinity of the interface with the conductor 220a, and oxygen vacancies (V O ) are formed in the conductor 220b. Furthermore, oxygen in the oxide semiconductor 230 near the conductor 220 diffuses to the vicinity of the interface between the conductor 220b and the conductor 220a where the oxygen vacancies (V O ) are formed, and oxygen vacancies (V O ) are formed in a region of the oxide semiconductor 230 near the conductor 220.
  • the reduced-resistance region functions as the other of the source region and drain region of the transistor 200.
  • the insulator 222 disposed under the conductor 220 captures hydrogen in the oxide semiconductor 230 through the conductor 220 by the heat treatment. At this time, hydrogen in the channel formation region of the oxide semiconductor 230 diffuses to the other of the source region and the drain region, so that VOH can be more efficiently formed in the other of the source region and the drain region.
  • a metal oxide having conductivity for the conductor 240b and the conductor 220b it is preferable to use a metal oxide having conductivity for the conductor 240b and the conductor 220b. This allows the conductor 240b and the oxide semiconductor 230a, and the conductor 220b and the oxide semiconductor 230a to be in ohmic contact, respectively.
  • it is preferable to use indium tin oxide with added silicon for the conductor 240b and the conductor 220b, and to use a metal oxide having a relatively high conductivity of In:Ga:Zn 1:1:1 [atomic ratio] or a composition close to that for the oxide semiconductor 230a. This allows the on-current, field effect mobility, and frequency characteristics of the transistor 200 to be improved.
  • the insulator 250 may have a layered structure of an insulator 250a and an insulator 250b on the insulator 250a.
  • the insulator 250a is provided in contact with the upper surface of the oxide semiconductor 230.
  • the insulator 250a has a region in contact with the upper surface of the conductor 240, a region in contact with the side surface of the conductor 240, and a region in contact with the insulator 280.
  • the insulator 250b is provided in contact with the upper surface of the insulator 250a.
  • the insulator 250a is preferably an insulator having a function of capturing or fixing hydrogen.
  • hydrogen contained in the oxide semiconductor 230 can be captured or fixed more effectively.
  • the hydrogen concentration in the oxide semiconductor 230 can be reduced.
  • An insulator applicable to the insulator 222 can be used as the insulator 250a.
  • hafnium silicate or the like can be used as the insulator 250a.
  • the insulator 250a contains at least hafnium, silicon, and oxygen.
  • the insulator 250a preferably has an amorphous structure. Note that the insulators described in the [Insulator] section below may be used as the insulator 250a in a single layer or a stacked layer.
  • the insulator 250a By making the insulator 250a have an amorphous structure, it is possible to suppress the formation of crystal grain boundaries. By suppressing the formation of crystal grain boundaries, it is possible to improve the flatness of the film of the insulator 250a. This makes the film thickness distribution of the insulator 250a uniform, and it is possible to reduce areas where the film thickness is extremely thin, thereby improving the withstand voltage of the insulator 250a. It is also possible to uniform the film thickness distribution of the film provided on the insulator 250a.
  • the insulator 250a can function as an insulating film with low leakage current.
  • hafnium oxide is a high dielectric constant (high-k) material
  • hafnium silicate can also be a high dielectric constant (high-k) material depending on the silicon content. Therefore, when the insulator 250a is used as a gate insulator, it is possible to reduce the gate potential applied during transistor operation while maintaining the physical film thickness of the gate insulator. It is also possible to reduce the equivalent oxide thickness (EOT) of the insulator that functions as a gate insulator.
  • EOT equivalent oxide thickness
  • the thickness of the insulator 250a is preferably 0.5 nm to 15 nm, more preferably 0.5 nm to 12 nm, and even more preferably 0.5 nm to 10 nm.
  • the insulator 250a only needs to have a region with the above thickness in at least a portion.
  • the insulator 250a since the insulator 250a has an amorphous structure, the formation of crystal grain boundaries is reduced, and the insulator 250a has high flatness. Therefore, the insulator 250a can be a thin film with high voltage resistance and reduced leakage current. Therefore, the insulator 250a is suitable as a gate insulator.
  • the insulator 250b is preferably a barrier insulator against hydrogen. This can suppress the diffusion of impurities contained in the conductor 260 into the oxide semiconductor 230.
  • an insulator applicable to the insulators 210 and 283 can be used.
  • silicon nitride has high barrier properties against hydrogen and is therefore suitable as the insulator 250b.
  • the insulator 250b contains at least nitrogen and silicon. Note that as the insulator 250b, the insulators described in the [Insulator] section below may be used in a single layer or a stacked layer.
  • the thickness of the insulator 250b is preferably 2 nm or more, and more preferably 3 nm or more.
  • the thickness of the insulator 250b is preferably 20 nm or less, 10 nm or less, or 5 nm or less. Therefore, the thickness of the insulator 250b preferably has a range of 2 nm or more and 10 nm or less, and more preferably has a range of 2 nm or more and 5 nm or less.
  • the thickness of the insulator 250b preferably has a range of 3 nm or more and 10 nm or less, and more preferably has a range of 3 nm or more and 5 nm or less.
  • the insulator 250b When the insulator 250b has a barrier property against hydrogen, the insulator 250b also has a barrier property against oxygen. Furthermore, the insulator 250b has a region in contact with the conductor 260. Therefore, since the insulator 250b has a barrier property against oxygen, it is possible to prevent oxygen contained in the oxide semiconductor 230 or the insulator 250a from diffusing to the conductor 260 and oxidizing the conductor 260. It is also possible to prevent oxygen contained in the oxide semiconductor 230 from diffusing to the conductor 260 and forming oxygen vacancies in the oxide semiconductor 230.
  • the conductor 260 may be a single layer or a multilayer of the conductors described in the section below titled "Conductor.”
  • the conductor 260 may be a highly conductive material such as tungsten.
  • a conductive material that is resistant to oxidation or a conductive material that has the function of suppressing the diffusion of oxygen as the conductor 260.
  • conductive materials include conductive materials that contain nitrogen (e.g., titanium nitride or tantalum nitride) and conductive materials that contain oxygen (e.g., ruthenium oxide). This can suppress a decrease in the conductivity of the conductor 260.
  • the conductor 260 may have a layered structure of conductor 260a and conductor 260b on conductor 260a.
  • titanium nitride may be used as conductor 260a
  • tungsten may be used as conductor 260b.
  • conductor 260 has a two-layer laminate structure of conductor 260a and conductor 260b
  • the present invention is not limited to this.
  • Conductor 260 may have a laminate structure of three or more layers.
  • the insulator 283 is preferably a barrier insulator against hydrogen. This can prevent hydrogen from diffusing from above the insulator 283 to the oxide semiconductor 230. Silicon nitride films and silicon nitride oxide films each have the characteristics of releasing little impurities (e.g., water and hydrogen) from themselves and being less permeable to oxygen and hydrogen, and therefore can be suitably used for the insulator 283.
  • impurities e.g., water and hydrogen
  • the insulator 283 contains silicon and nitrogen.
  • the sputtering method does not require the use of molecules containing hydrogen in the deposition gas, and therefore the hydrogen concentration in the insulator 283 can be reduced. Furthermore, by depositing the insulator 283 by sputtering, silicon nitride with high density can be formed.
  • the insulator 283 may have a laminated structure of an insulator 283a and an insulator 283b on the insulator 283a.
  • an insulator having a function of capturing hydrogen or fixing hydrogen as the insulator 283a
  • an insulator that can be used for the insulator 222 may be used appropriately.
  • hafnium silicate may be used as the insulator 283a.
  • the insulator 283b has a laminated structure of the insulator 283a having a function of capturing hydrogen or fixing hydrogen, and the insulator 283b that is a barrier insulator against hydrogen.
  • This configuration makes it possible to suppress the diffusion of hydrogen from above the insulator 283 to the oxide semiconductor 230.
  • the insulator 283a and the insulator 222 which have the function of capturing or fixing hydrogen, are provided inside a closed system consisting of the insulator 283b, which has a barrier property against hydrogen, and the insulator 210, the hydrogen concentration in the oxide semiconductor 230 can be reduced.
  • the insulator 280 is shown as a single layer in FIGS. 1B and 1C, and in FIGS. 4A and 4B, the present invention is not limited to this.
  • the insulator 280 may have a laminated structure.
  • the insulator 280 may have a layered structure of an insulator 280a, an insulator 280b on the insulator 280a, and an insulator 280c on the insulator 280b.
  • Insulator 280a has an area in contact with the upper surface of insulator 210, an area in contact with the side surface of conductor 220, and an area in contact with the upper surface of conductor 220.
  • Insulator 280c has an area in contact with the lower surface of conductor 240.
  • FIG. 6B shows an example in which, in addition to the configuration shown in FIG. 6A, an insulator 223 having the function of capturing or adhering hydrogen and an insulator 221 having barrier properties against hydrogen are provided between the oxide semiconductor 230 and the insulator 280.
  • an insulator applicable to the insulator 222 can be used.
  • hafnium silicate can be used. This can suppress the diffusion of hydrogen into the oxide semiconductor 230 and further reduce the hydrogen concentration in the oxide semiconductor 230.
  • the film thickness of the insulator 223 (e.g., the width of the insulator 223 in the A1-A2 direction) is preferably 0.5 nm to 15 nm, more preferably 0.5 nm to 12 nm, and even more preferably 0.5 nm to 10 nm. It is sufficient that at least a portion of the insulator 223 has a region with the above width.
  • the insulator 221 is provided between the insulator 280 and the insulator 223.
  • the portions of the insulator 221, the insulator 223, the oxide semiconductor 230, the insulator 250, and the conductor 260 that are disposed within the opening 290 are provided to reflect the shape of the opening 290.
  • the insulator 221 is provided to cover the side walls of the opening 290
  • the insulator 223 is provided to cover the side surfaces of the insulator 221
  • the oxide semiconductor 230 is provided to cover the side surfaces of the insulator 223 and the bottom of the opening 290
  • the insulator 250 is provided to cover the oxide semiconductor 230
  • the conductor 260 is provided to fill the recesses of the insulator 250 that reflect the shape of the opening 290.
  • an insulator that can be used for the insulator 210 can be used.
  • silicon nitride can be used. This can suppress the diffusion of hydrogen into the oxide semiconductor 230 and further reduce the hydrogen concentration in the oxide semiconductor 230.
  • the film thickness of the insulator 221 (e.g., the width of the insulator 221 in the A1-A2 direction) is preferably 2 nm or more, and more preferably 3 nm or more. Note that there is no particular upper limit to the film thickness of the insulator 221, but from the viewpoint of miniaturization or high integration of semiconductor devices and improvement of productivity of semiconductor devices, it is preferably 20 nm or less, 10 nm or less, or 5 nm or less.
  • the film thickness of the insulator 221 preferably has a region of 2 nm or more and 10 nm or less, and more preferably has a region of 2 nm or more and 5 nm or less. Furthermore, the film thickness of the insulator 221 preferably has a region of 3 nm or more and 10 nm or less, and more preferably has a region of 3 nm or more and 5 nm or less.
  • the insulator 280b may be formed using, for example, a material with a low dielectric constant. By forming the insulator 280b using a material with a low dielectric constant, the parasitic capacitance occurring between the wirings sandwiching the insulator 280b can be reduced.
  • an insulator containing a material with a low dielectric constant as described in the [Insulator] section below, can be used in a single layer or a stacked layer.
  • the insulator 280b can be made of silicon oxide or silicon oxynitride.
  • the concentration of impurities such as water and hydrogen in the insulator 280b is reduced. This can suppress the intrusion of impurities such as water and hydrogen into the channel formation region of the oxide semiconductor 230.
  • insulator 280b When an insulator containing oxygen is used as insulator 280b, it is preferable to use a barrier insulator against oxygen, as described in the [Insulator] section below, for insulators 280a and 280c.
  • insulator 280a between insulator 280b and conductor 220, it is possible to prevent conductor 220 from being oxidized and the resistance of conductor 220 from increasing.
  • insulator 280c between insulator 280b and conductor 240, it is possible to prevent conductor 240 from being oxidized and the resistance of conductor 240 from increasing.
  • the insulator 280a and the insulator 280c may each be a barrier insulator against hydrogen. This allows the insulator 280b to be surrounded by barrier insulators against hydrogen (here, the insulator 280a, the insulator 280c, and the insulator 221). This allows the hydrogen contained in the insulator 280b to be prevented from diffusing into the oxide semiconductor 230.
  • the silicon nitride film and the silicon nitride oxide film each have the characteristics of releasing little impurities (e.g., water and hydrogen) from themselves and being difficult for oxygen and hydrogen to permeate, and therefore can be suitably used for the insulator 280a and the insulator 280c. Note that the insulator 280a and the insulator 280c may be made of the same material or different materials.
  • an insulator having a function of capturing or fixing hydrogen may be used as the insulator 280a.
  • the insulator 280a magnesium oxide, aluminum oxide, hafnium oxide, or an oxide containing hafnium and silicon may be used.
  • a stacked film of aluminum oxide and silicon nitride on the aluminum oxide may be used as the insulator 280a.
  • an insulator having a function of capturing or fixing hydrogen may be used as the insulator 280c.
  • silicon nitride can be used for insulators 280a and 280c
  • silicon oxide can be used for insulator 280b.
  • insulators 280a and 280c each contain at least silicon and nitrogen.
  • Insulator 280b contains at least silicon and oxygen.
  • FIGS. 6A and 6B show a configuration in which the insulator 280c is provided on the planarized insulator 280b, but the present invention is not limited to this.
  • the insulator 280c may be formed without performing a planarization process on the insulator 280b. By not performing a planarization process, the manufacturing cost can be reduced and the production yield can be increased.
  • the insulators 280a, 280b, and 280c can be formed successively without being exposed to the atmospheric environment.
  • the insulators 280a to 280c By forming the insulators 280a to 280c without exposing them to the atmospheric environment, it is possible to prevent impurities or moisture from the atmospheric environment from adhering to the insulators 280a to 280c, and it is possible to keep the vicinity of the interface between the insulators 280a and 280b, and the vicinity of the interface between the insulators 280b and 280c clean.
  • Figures 6A and 6B show a configuration in which the insulator 280 has a three-layer laminated structure, the present invention is not limited to this.
  • the insulator 280 may have a two-layer or four or more layer laminated structure.
  • the insulator 280b is in contact with at least a part of the oxide semiconductor 230.
  • the insulator 280b is preferably an insulator containing oxygen.
  • the insulator 280b preferably has a region with a higher oxygen content than at least one of the insulators 280a and 280c.
  • the insulator 280b preferably has a region with a higher oxygen content than each of the insulators 280a and 280c.
  • oxygen supplied from the insulator 280b to the channel formation region of the oxide semiconductor 230 can trap electrons and form negative charges (negative fixed charges) in the channel formation region. This allows the substrate bias effect to be expressed, and a transistor with normally-off characteristics can be realized.
  • oxygen can be supplied to the oxide semiconductor 230.
  • oxygen vacancies and VOH in the oxide semiconductor 230 can be reduced, and a transistor with good electrical characteristics and high reliability can be obtained.
  • the oxygen supplied from the insulator 280b to the oxide semiconductor 230 can form negative charges (negative fixed charges) in the channel formation region, so that a normally-off transistor can be realized.
  • the amount of released oxygen molecules from the insulator 280b is preferably equal to or greater than 1.0 ⁇ 10 14 molecules/cm 2 and less than 1.0 ⁇ 10 15 molecules/cm 2.
  • the amount of released oxygen molecules can be measured by thermal desorption spectrometry.
  • the channel length of the transistor 200 when the channel length of the transistor 200 is short, the influence of oxygen vacancies in the channel formation region and VOH on the electrical characteristics and reliability is particularly large. Therefore, by sufficiently reducing the hydrogen concentration in the oxide semiconductor 230 and then optimizing the amount of oxygen supplied to the oxide semiconductor 230, a transistor with a short channel length that has favorable electrical characteristics and high reliability can be realized.
  • the insulator 280b is preferably formed by a film formation method such as a sputtering method or a PECVD method.
  • a film formation method such as a sputtering method or a PECVD method.
  • hydrogen gas is not required as a film formation gas, and therefore a film with an extremely low hydrogen content can be obtained. Therefore, the supply of hydrogen to the oxide semiconductor 230 can be suppressed, and the electrical characteristics of the transistor 200 can be stabilized.
  • oxygen supplied to the oxide semiconductor 230 for example, after forming the insulator 280b, a heat treatment in an oxygen-containing atmosphere or a plasma treatment in an oxygen-containing atmosphere may be performed.
  • oxygen may be supplied by forming an oxide film in an oxygen atmosphere on the upper surface of the insulator 280b by a sputtering method. The oxide film may then be removed. By performing such a treatment, oxygen can be supplied to the insulator 280b, and the amount of oxygen supplied to the oxide semiconductor 230 can be increased.
  • the amount of oxygen supplied to the region of the oxide semiconductor 230 in contact with the insulator 280a and the region of the oxide semiconductor 230 in contact with the insulator 280c is smaller than that to the region of the oxide semiconductor 230 in contact with the insulator 280b. Therefore, the region of the oxide semiconductor 230 in contact with the insulator 280a and the region of the oxide semiconductor 230 in contact with the insulator 280c may have a lower resistance than the region of the oxide semiconductor 230 in contact with the insulator 280b. In other words, by adjusting the film thickness of the insulator 280a, the range of the region that functions as one of the source region and the drain region can be controlled.
  • the film thickness of the insulator 280c may be appropriately set according to the characteristics required for the transistor 200.
  • FIGS. 7A to 7D show another example of a semiconductor device according to one embodiment of the present invention.
  • FIGS. 7A to 7D are plan and cross-sectional views of a semiconductor device having a transistor 300.
  • FIG. 7A is a plan view of the semiconductor device.
  • FIGS. 7B to 7D are cross-sectional views of the semiconductor device.
  • FIG. 7B is a cross-sectional view of the portion indicated by the dashed line A1-A2 in FIG. 7A.
  • FIG. 7C is a cross-sectional view of the portion indicated by the dashed line A3-A4 in FIG. 7A.
  • FIG. 7D is a cross-sectional view in the XY plane including the insulator 280. Note that some elements are omitted from the plan view of FIG. 7A for clarity.
  • the semiconductor device shown in Figures 7A to 7D has an insulator 210 on a substrate (not shown), an insulator 222 on the insulator 210, a transistor 300 on the insulator 222, an insulator 280 on the insulator 210, and an insulator 283 on the transistor 300.
  • Transistor 300 has conductor 242 and conductor 243 on insulator 280, oxide semiconductor 230, insulator 250 on oxide semiconductor 230, and conductor 260 on insulator 250.
  • the semiconductor device shown in Figures 7A to 7D differs from the semiconductor device shown in Figures 1A to 1C in the shape of oxide semiconductor 230.
  • the semiconductor device shown in Figures 7A to 7D also differs from the semiconductor device shown in Figures 1A to 1C in that it does not have conductor 220 and has conductors 242 and 243 instead of conductor 240.
  • differences from the content explained using Figures 1A to 1C will be mainly explained, and overlapping parts will be referred to and explanations may be omitted.
  • the oxide semiconductor 230, the insulator 250, and the conductor 260 are provided inside the opening 290 of the insulator 280.
  • the side surface of the insulator 280 has a region in contact with the oxide semiconductor 230 and a region in contact with the insulator 250.
  • a part of the side surface of the insulator 280 contacts the insulator 250a that has the function of capturing or fixing hydrogen.
  • the oxide semiconductor 230 has a region that contacts the bottom of the opening 290.
  • the bottom surface of the oxide semiconductor 230 in the opening 290 contacts the insulator 222.
  • conductor 242 and conductor 243 are each shown as a single layer in Figures 7B and 7C, this is not limited thereto.
  • Conductor 242 and conductor 243 can each have a laminated structure of two or more layers.
  • the first layer of conductor can have a configuration similar to that of conductor 240a described above.
  • the second layer of conductor can have a configuration similar to that of conductor 240b described above.
  • the oxide semiconductor 230 functions as a semiconductor layer
  • the conductor 260 functions as a gate electrode
  • the insulator 250 functions as a gate insulator
  • the conductor 242 functions as one of the source electrode or the drain electrode
  • the conductor 243 functions as the other of the source electrode or the drain electrode.
  • the semiconductor device shown in Figures 7A to 7D has a configuration in which an oxide semiconductor 230, an insulator 250, and a conductor 260 are provided in this order inside an opening in an insulator 280.
  • the oxide semiconductor 230 is provided so that at least a portion of it is located inside the opening 290.
  • the transistor 300 has a configuration in which a current flows from one of the source electrode or drain electrode (e.g., conductor 242) to the other of the source electrode or drain electrode (e.g., conductor 243). That is, the channel length of the transistor 300 (length L indicated by the dashed double arrow in FIG. 7B) is the sum of twice the length of the side of the insulator 280 in the opening 290 and the length of the bottom of the opening 290. The length of the side of the insulator 280 in the opening 290 is also the film thickness of the insulator 280.
  • the length of the bottom of the opening 290 is also the shortest distance from the conductor 242 to the conductor 243, for example.
  • the channel length (length L) of the transistor 300 can be adjusted by the length of the side of the insulator 280 in the opening 290 and the length of the bottom of the opening 290. For example, when miniaturizing or increasing the integration density of a semiconductor device and lengthening the channel length, it is advisable to increase the thickness of the insulator 280.
  • the channel width of the transistor 300 corresponds to the width of the oxide semiconductor 230 in the Y direction in a plan view. Therefore, it is preferable that the channel width of the transistor 300 is smaller than the width of the bottom of the opening 290.
  • the opening of the insulator 280 has a rectangular shape with rounded corners in plan view.
  • the maximum width of the opening may be calculated appropriately according to the shape of the top of the opening. For example, if the opening has a rectangular shape with rounded corners in plan view, the maximum width of the opening may be the length of the diagonal or the distance between the opposing sides when the top of the opening is regarded as a rectangle. Note that the present invention is not limited to this.
  • the opening 290 may have a substantially circular shape such as a circle or an ellipse, a polygonal shape, or a polygonal shape with rounded corners in plan view.
  • the transistor 300 shown in FIGS. 7A to 7D can be manufactured on the same layer (the insulator 222 here) as the transistor 200 shown in FIGS. 1A to 1C. That is, the transistor 300 can be manufactured in parallel with the manufacturing process of the transistor 200. Thus, two transistors with different channel lengths and channel widths can be provided on the same layer. In this manner, the semiconductor device of one embodiment of the present invention has an excellent effect that transistors with different channel lengths can be freely designed on the same layer by changing the thickness of the insulating layer and pattern formation.
  • FIG. 8A is a plan view of the semiconductor device.
  • FIG. 8B is a cross-sectional view of the semiconductor device, taken along the dashed line A5-A6 in FIG. 8A.
  • the substrate on which the transistor is formed for example, an insulating substrate, a semiconductor substrate, or a conductive substrate may be used.
  • a glass substrate, a quartz substrate, a sapphire substrate, a stabilized zirconia substrate (such as an yttria stabilized zirconia substrate), a resin substrate, etc. are available.
  • a semiconductor substrate made of silicon or germanium, or a compound semiconductor substrate made of silicon carbide, silicon germanium, gallium arsenide, indium phosphide, zinc oxide, or gallium oxide, etc. are available.
  • a semiconductor substrate having an insulating region inside the aforementioned semiconductor substrate for example, an SOI (Silicon On Insulator) substrate, etc. are available.
  • the conductive substrate there is a graphite substrate, a metal substrate, an alloy substrate, a conductive resin substrate, etc. are available.
  • a substrate having a metal nitride, a substrate having a metal oxide, etc. are available.
  • a substrate in which a conductor or a semiconductor is provided on an insulating substrate, a substrate in which a conductor or an insulator is provided on a semiconductor substrate, a substrate in which a semiconductor or an insulator is provided on a conductive substrate, etc. are available.
  • a substrate having elements provided thereon may be used.
  • the elements provided on the substrate include a capacitor element, a resistor element, a switch element, a light-emitting element, a memory element, and the like.
  • Insulator examples include oxides, nitrides, oxynitrides, nitride oxides, metal oxides, metal oxynitrides, and metal nitride oxides, each of which has insulating properties.
  • Examples of materials with a high dielectric constant include aluminum oxide, gallium oxide, hafnium oxide, tantalum oxide, zirconium oxide, hafnium zirconium oxide, oxides containing aluminum and hafnium, oxynitrides containing aluminum and hafnium, oxides containing silicon and hafnium, oxynitrides containing silicon and hafnium, and nitrides containing silicon and hafnium.
  • Materials with a low relative dielectric constant include, for example, inorganic insulating materials such as silicon oxide, silicon oxynitride, and silicon nitride oxide, and resins such as polyester, polyolefin, polyamide (nylon, aramid, etc.), polyimide, polycarbonate, and acrylic.
  • inorganic insulating materials with a low relative dielectric constant include, for example, silicon oxide with added fluorine, silicon oxide with added carbon, and silicon oxide with added carbon and nitrogen. Another example is silicon oxide with vacancies. These silicon oxides may contain nitrogen.
  • a material that may have ferroelectricity may be used as the insulator.
  • materials that may have ferroelectricity include metal oxides such as hafnium oxide, zirconium oxide, and HfZrO x (X is a real number greater than 0).
  • materials that may have ferroelectricity include materials obtained by adding element J1 (here, element J1 is one or more selected from zirconium, silicon, aluminum, gadolinium, yttrium, lanthanum, strontium, etc.) to hafnium oxide.
  • the ratio of the number of atoms of hafnium atoms to the number of atoms of element J1 can be appropriately set, and for example, the ratio of the number of atoms of hafnium atoms to the number of atoms of element J1 may be set to 1:1 or close thereto.
  • materials that may have ferroelectricity include materials obtained by adding element J2 (here, element J2 is one or more selected from hafnium, silicon, aluminum, gadolinium, yttrium, lanthanum, strontium, etc.) to zirconium oxide.
  • the ratio of the number of zirconium atoms to the number of atoms of element J2 can be set appropriately, for example, the ratio of the number of zirconium atoms to the number of atoms of element J2 may be set to 1: 1 or close to that.
  • piezoelectric ceramics having a perovskite structure such as lead titanate (PbTiO x ), barium strontium titanate (BST), strontium titanate, lead zirconate titanate (PZT), strontium bismuthate tantalate (SBT), bismuth ferrite (BFO), and barium titanate, may also be used.
  • the electrical characteristics of a transistor using a metal oxide can be stabilized by surrounding it with an insulator that has a function of suppressing the permeation of impurities and oxygen.
  • an insulator that has a function of suppressing the permeation of impurities and oxygen for example, an insulator containing boron, carbon, nitrogen, oxygen, fluorine, magnesium, aluminum, silicon, phosphorus, chlorine, argon, gallium, germanium, yttrium, zirconium, lanthanum, neodymium, hafnium, or tantalum can be used in a single layer or a stacked layer.
  • metal oxides such as aluminum oxide, magnesium oxide, gallium oxide, germanium oxide, yttrium oxide, zirconium oxide, lanthanum oxide, neodymium oxide, hafnium oxide, and tantalum oxide
  • metal nitrides such as aluminum nitride, silicon nitride oxide, and silicon nitride can be used.
  • Insulators such as gate insulators that are in contact with the semiconductor layer or that are provided near the semiconductor layer are preferably insulators that have a region that contains oxygen (excess oxygen) that is released by heating. For example, by providing an insulator that has a region that contains excess oxygen in contact with the semiconductor layer or in the vicinity of the semiconductor layer, oxygen vacancies in the semiconductor layer can be reduced. In addition, oxygen supplied to the semiconductor layer (particularly the channel formation region) can trap electrons to form negative charges (negative fixed charges) in the channel formation region. Examples of insulators that are likely to form a region that contains excess oxygen include silicon oxide, silicon oxynitride, and silicon oxide with vacancies.
  • examples of the barrier insulator against oxygen include oxides containing one or both of aluminum and hafnium, oxides containing hafnium and silicon (hafnium silicate), magnesium oxide, or gallium oxide, gallium zinc oxide, indium gallium zinc oxide, silicon nitride, and silicon nitride oxide.
  • examples of oxides containing one or both of aluminum and hafnium include aluminum oxide, hafnium oxide, and oxides containing aluminum and hafnium (hafnium aluminate).
  • barrier insulators against hydrogen please refer to the above.
  • the barrier insulator against oxygen and the barrier insulator against hydrogen can be said to be a barrier insulator against either or both of oxygen and hydrogen.
  • the conductor it is preferable to use a metal element selected from aluminum, chromium, copper, silver, gold, platinum, tantalum, nickel, titanium, molybdenum, tungsten, hafnium, vanadium, niobium, manganese, magnesium, zirconium, beryllium, indium, ruthenium, iridium, strontium, lanthanum, etc., or an alloy containing the above-mentioned metal elements as a component, or an alloy combining the above-mentioned metal elements.
  • a nitride of the alloy or an oxide of the alloy may be used as the alloy containing the above-mentioned metal elements as a component.
  • tantalum nitride titanium nitride, tungsten, a nitride containing titanium and aluminum, a nitride containing tantalum and aluminum, ruthenium oxide, ruthenium nitride, an oxide containing strontium and ruthenium, an oxide containing lanthanum and nickel, etc.
  • a semiconductor with high electrical conductivity typified by polycrystalline silicon containing an impurity element such as phosphorus, or a silicide such as nickel silicide may be used.
  • conductive materials containing nitrogen such as nitrides containing tantalum, nitrides containing titanium, nitrides containing molybdenum, nitrides containing tungsten, nitrides containing ruthenium, nitrides containing tantalum and aluminum, or nitrides containing titanium and aluminum
  • conductive materials containing oxygen such as ruthenium oxide, oxides containing strontium and ruthenium, or oxides containing lanthanum and nickel
  • materials containing metal elements such as titanium, tantalum, or ruthenium are preferred because they are conductive materials that are difficult to oxidize, conductive materials that have a function of suppressing the diffusion of oxygen, or materials that maintain conductivity even when oxygen is absorbed.
  • examples of conductive materials containing oxygen include indium oxide containing tungsten oxide, indium oxide containing titanium oxide, indium tin oxide, indium tin oxide containing titanium oxide, indium tin oxide to which silicon has been added, indium zinc oxide, and indium zinc oxide containing tungsten oxide.
  • a conductive film formed using a conductive material containing oxygen may be called an oxide conductive film.
  • conductive materials primarily composed of tungsten, copper, or aluminum are preferred because they have high conductivity.
  • a laminate structure may be formed by combining the above-mentioned material containing a metal element with a conductive material containing oxygen.
  • a laminate structure may be formed by combining the above-mentioned material containing a metal element with a conductive material containing nitrogen.
  • a laminate structure may be formed by combining the above-mentioned material containing a metal element with a conductive material containing oxygen and a conductive material containing nitrogen.
  • a metal oxide is used for the channel formation region of a transistor, it is preferable to use a layered structure in which a material containing the above-mentioned metal element and a conductive material containing oxygen are combined for the conductor that functions as the gate electrode. In this case, it is preferable to provide the conductive material containing oxygen on the channel formation region side. By providing the conductive material containing oxygen on the channel formation region side, oxygen desorbed from the conductive material is easily supplied to the channel formation region.
  • a conductive material containing oxygen and a metal element contained in the metal oxide in which the channel is formed as a conductor that functions as a gate electrode may also be used.
  • a conductive material containing nitrogen such as titanium nitride or tantalum nitride, may be used.
  • indium tin oxide, indium oxide containing tungsten oxide, indium zinc oxide containing tungsten oxide, indium oxide containing titanium oxide, indium tin oxide containing titanium oxide, indium zinc oxide, and indium tin oxide with added silicon may also be used.
  • Indium gallium zinc oxide containing nitrogen may also be used.
  • Metal oxides may have lattice defects.
  • Lattice defects include point defects such as atomic vacancies and heteroatoms, line defects such as dislocations, surface defects such as grain boundaries, and volume defects such as voids.
  • Factors that cause the generation of lattice defects include a deviation in the ratio of the number of atoms of the constituent elements (an excess or deficiency of constituent atoms) and impurities.
  • the metal oxide used in the semiconductor layer of a transistor When a metal oxide is used in the semiconductor layer of a transistor, lattice defects in the metal oxide can cause carrier generation or capture. Therefore, if a metal oxide with many lattice defects is used in the semiconductor layer of a transistor, the electrical characteristics of the transistor may become unstable. Therefore, it is preferable that the metal oxide used in the semiconductor layer of a transistor has few lattice defects.
  • the types of lattice defects likely to exist in metal oxides and the amount of lattice defects present vary depending on the structure of the metal oxide or the method of forming the metal oxide film.
  • Non-single crystal structures include, for example, CAAC structures, polycrystalline structures, nc structures, pseudo-amorphous (a-like: amorphous-like) structures, and amorphous structures.
  • A-like structures have a structure between the nc structure and the amorphous structure.
  • metal oxides having an a-like structure and metal oxides having an amorphous structure have voids or low-density regions. That is, metal oxides having an a-like structure and metal oxides having an amorphous structure have lower crystallinity than metal oxides having an nc structure and metal oxides having a CAAC structure. Also, metal oxides having an a-like structure have a higher hydrogen concentration in the metal oxide than metal oxides having an nc structure and metal oxides having a CAAC structure. Therefore, lattice defects are likely to be generated in metal oxides having an a-like structure and metal oxides having an amorphous structure.
  • a metal oxide with high crystallinity for the semiconductor layer of a transistor.
  • a metal oxide having a CAAC structure or a metal oxide having a single crystal structure By using such a metal oxide for a transistor, a transistor with good electrical characteristics can be realized. In addition, a highly reliable transistor can be realized.
  • a metal oxide for the channel formation region of a transistor, which increases the on-state current of the transistor.
  • the crystal it is preferable to use a metal oxide with high crystallinity for the metal oxide including the channel formation region. Furthermore, it is preferable for the crystal to have a crystal structure in which multiple layers (e.g., a first layer, a second layer, and a third layer) are stacked. In other words, the crystal has a layered crystal structure (also called a layered crystal or layered structure). In this case, the c-axis of the crystal is oriented in the direction in which the multiple layers are stacked.
  • Metal oxides having the crystal include, for example, single crystal oxide semiconductors and CAAC-OS.
  • the c-axis of the crystal is oriented in the normal direction to the surface on which the metal oxide is formed or the film surface. This allows the multiple layers to be arranged parallel or approximately parallel to the surface on which the metal oxide is formed or the film surface. In other words, the multiple layers extend in the channel length direction.
  • the three-layered crystal structure described above will have the following structure.
  • the first layer has an atomic coordination structure in the form of an octahedron of oxygen with the metal of the first layer at the center.
  • the second layer has an atomic coordination structure in the form of a trigonal bipyramid or tetrahedron of oxygen with the metal of the second layer at the center.
  • the third layer has an atomic coordination structure in the form of a trigonal bipyramid or tetrahedron of oxygen with the metal of the third layer at the center.
  • Examples of the crystal structure of the above crystal include a YbFe 2 O 4 type structure, a Yb 2 Fe 3 O 7 type structure, and modified structures thereof.
  • each of the first to third layers is preferably composed of one metal element or multiple metal elements having the same valence, and oxygen.
  • the valence of the one or multiple metal elements constituting the first layer is preferably the same as the valence of the one or multiple metal elements constituting the second layer.
  • the first layer and the second layer may have the same metal element.
  • the valence of the one or multiple metal elements constituting the first layer is different from the valence of the one or multiple metal elements constituting the third layer.
  • the above structure improves the crystallinity of the metal oxide and increases the mobility of the metal oxide. Therefore, by using the metal oxide in the channel formation region of a transistor, the on-state current of the transistor increases and the electrical characteristics of the transistor can be improved.
  • Examples of the metal oxide of the present invention include indium oxide, gallium oxide, and zinc oxide.
  • the metal oxide of the present invention preferably contains at least indium (In) or zinc (Zn).
  • the metal oxide preferably contains two or three elements selected from indium, element M, and zinc.
  • the element M is a metal element or semi-metal element having a high bond energy with oxygen, for example, a metal element or semi-metal element having a higher bond energy with oxygen than indium.
  • the element M include aluminum, gallium, tin, yttrium, titanium, vanadium, chromium, manganese, iron, cobalt, nickel, zirconium, molybdenum, hafnium, tantalum, tungsten, lanthanum, cerium, neodymium, magnesium, calcium, strontium, barium, boron, silicon, germanium, and antimony.
  • the element M in the metal oxide is preferably one or more of the above elements, more preferably one or more selected from aluminum, gallium, tin, and yttrium, and even more preferably gallium.
  • the metal oxide of one embodiment of the present invention preferably has one or more selected from indium, gallium, and zinc.
  • metal elements and metalloid elements may be collectively referred to as “metal elements", and the "metal element” described in this specification may include metalloid elements.
  • Metal oxides according to one embodiment of the present invention include, for example, indium zinc oxide (In-Zn oxide), indium tin oxide (In-Sn oxide), indium titanium oxide (In-Ti oxide), indium gallium oxide (In-Ga oxide), indium gallium aluminum oxide (In-Ga-Al oxide), indium gallium tin oxide (In-Ga-Sn oxide, also referred to as IGTO), gallium zinc oxide (Ga-Zn oxide, also referred to as GZO), aluminum zinc oxide (Al-Zn oxide, also referred to as AZO), and indium gallium oxide (In-Ga-Ga oxide, also referred to as IGTO).
  • In-Zn oxide indium zinc oxide
  • In-Sn oxide indium titanium oxide
  • In-Ti oxide indium gallium oxide
  • In-Ga oxide indium gallium aluminum oxide
  • In-Ga-Al oxide indium gallium tin oxide
  • IGTO gallium zinc oxide
  • Ga-Zn oxide also
  • Indium aluminum zinc oxide (In-Al-Zn oxide, also written as IAZO), indium tin zinc oxide (In-Sn-Zn oxide), indium titanium zinc oxide (In-Ti-Zn oxide), indium gallium zinc oxide (In-Ga-Zn oxide, also written as IGZO), indium gallium tin zinc oxide (In-Ga-Sn-Zn oxide, also written as IGZTO), indium gallium aluminum zinc oxide (In-Ga-Al-Zn oxide, also written as IGAZO or IAGZO), etc.
  • IAZO Indium aluminum zinc oxide
  • indium tin oxide containing silicon gallium tin oxide (Ga-Sn oxide), aluminum tin oxide (Al-Sn oxide), etc.
  • indium tin oxide containing silicon gallium tin oxide (Ga-Sn oxide), aluminum tin oxide (Al-Sn oxide), etc.
  • the field effect mobility of the transistor can be increased.
  • the metal oxide may have one or more kinds of metal elements having a higher period number in the periodic table instead of indium.
  • the metal oxide may have one or more kinds of metal elements having a higher period number in the periodic table in addition to indium.
  • Examples of metal elements having a higher period number in the periodic table include metal elements belonging to the fifth period and metal elements belonging to the sixth period.
  • the metal elements include yttrium, zirconium, silver, cadmium, tin, antimony, barium, lead, bismuth, lanthanum, cerium, praseodymium, neodymium, promethium, samarium, and europium.
  • lanthanum, cerium, praseodymium, neodymium, promethium, samarium, and europium are called light rare earth elements.
  • the metal oxide may also contain one or more nonmetallic elements.
  • the field effect mobility of the transistor may be increased.
  • nonmetallic elements include carbon, nitrogen, phosphorus, sulfur, selenium, bromine, and hydrogen.
  • the metal oxide becomes highly crystalline, and the diffusion of impurities in the metal oxide can be suppressed. This suppresses fluctuations in the electrical characteristics of the transistor, and increases its reliability.
  • the transistor can obtain a large on-current and high frequency characteristics.
  • In-Ga-Zn oxide may be used as an example of a metal oxide.
  • the metal oxide film formation method of the present invention it is preferable to deposit atoms one layer at a time.
  • the ALD method is used, so that it is easy to form a metal oxide having the above-mentioned layered crystal structure.
  • a transistor with high field-effect mobility can be realized.
  • a highly reliable transistor can be realized.
  • a miniaturized or highly integrated transistor can be realized. For example, a transistor with a channel length of 2 nm or more and 30 nm or less can be manufactured.
  • an oxide semiconductor having a low carrier concentration is preferably used for the channel formation region of the transistor.
  • the carrier concentration of the channel formation region of the oxide semiconductor is 1 ⁇ 10 18 cm ⁇ 3 or less, preferably 1 ⁇ 10 17 cm ⁇ 3 or less, more preferably 1 ⁇ 10 15 cm ⁇ 3 or less, more preferably 1 ⁇ 10 13 cm ⁇ 3 or less, more preferably 1 ⁇ 10 11 cm ⁇ 3 or less, and further preferably less than 1 ⁇ 10 10 cm ⁇ 3 and 1 ⁇ 10 ⁇ 9 cm ⁇ 3 or more. Note that in order to reduce the carrier concentration of the oxide semiconductor film, it is only necessary to reduce the impurity concentration in the oxide semiconductor film and reduce the density of defect states.
  • a semiconductor having a low impurity concentration and a low density of defect states is referred to as a high-purity intrinsic or substantially high-purity intrinsic.
  • an oxide semiconductor having a low carrier concentration may be referred to as a high-purity intrinsic or substantially high-purity intrinsic oxide semiconductor.
  • a high-purity intrinsic or substantially high-purity intrinsic oxide semiconductor film has a low density of defect states, and therefore may also have a low density of trap states.
  • the charge trapped in the trap states of the oxide semiconductor takes a long time to disappear and may behave as if it were a fixed charge. Therefore, a transistor in which a channel formation region is formed in an oxide semiconductor with a high density of trap states may have unstable electrical characteristics.
  • an impurity in an oxide semiconductor refers to, for example, anything other than the main component that constitutes the oxide semiconductor.
  • an element with a concentration of less than 0.1 atomic % can be considered an impurity.
  • a fixed charge is formed by adding impurities to an oxide semiconductor, and the fixed charge is used to produce a substrate bias effect, thereby realizing a transistor with normally-off characteristics.
  • the band gap of the oxide semiconductor is preferably larger than that of silicon (typically 1.1 eV), and is preferably 2 eV or more, more preferably 2.5 eV or more, and further preferably 3.0 eV or more.
  • the off-current (also referred to as Ioff) of the transistor can be reduced.
  • OS transistors use oxide semiconductors, which are semiconductor materials with a wide band gap, and therefore the short channel effect can be suppressed. In other words, OS transistors are transistors that do not have the short channel effect or have an extremely small short channel effect.
  • the short channel effect is a degradation of electrical characteristics that becomes evident as transistors are miniaturized (channel length is reduced).
  • Specific examples of short channel effects include a decrease in threshold voltage, an increase in subthreshold swing value (sometimes referred to as S value), and an increase in leakage current.
  • S value refers to the amount of change in gate voltage in the subthreshold region that changes the drain current by one order of magnitude at a constant drain voltage.
  • Characteristic length is widely used as an index of resistance to short channel effects.
  • Characteristic length is an index of how easily the potential of the channel formation region bends. The smaller the characteristic length, the steeper the potential rises, and therefore the more resistant it is to short channel effects.
  • OS transistors are accumulation-type transistors, while Si transistors are inversion-type transistors. Therefore, compared to Si transistors, OS transistors have smaller characteristic lengths between the source region and the channel-forming region, and between the drain region and the channel-forming region. Therefore, OS transistors are more resistant to the short-channel effect than Si transistors. In other words, when it is desired to manufacture a transistor with a short channel length, OS transistors are more suitable than Si transistors.
  • the OS transistor can also be regarded as having an n + / n ⁇ / n + accumulation-type junction-less transistor structure or an n + /n ⁇ /n + accumulation-type non - junction transistor structure in which the channel formation region is an n ⁇ type region and the source region and drain region are n + type regions.
  • the OS transistor can have good electrical characteristics even when the semiconductor device is miniaturized or highly integrated. For example, good electrical characteristics can be obtained even when the channel length or gate length of the OS transistor is 1 nm to 20 nm, 3 nm to 15 nm, 5 nm to 10 nm, 5 nm to 7 nm, or 5 nm to 6 nm.
  • the OS transistor can be preferably used as a transistor having a shorter channel length than that of a Si transistor.
  • the gate length is the length of the gate electrode in the direction in which carriers move inside the channel formation region when the transistor is operating.
  • the cutoff frequency of the transistor can be improved.
  • the cutoff frequency of the transistor can be set to, for example, 50 GHz or more, preferably 100 GHz or more, and more preferably 150 GHz or more in a room temperature environment.
  • OS transistors As explained above, compared to Si transistors, OS transistors have the excellent advantages of having a smaller off-state current and being able to fabricate transistors with a short channel length.
  • the carbon concentration in a channel formation region of the oxide semiconductor measured by SIMS is 1 ⁇ 10 20 atoms/cm 3 or less, preferably 5 ⁇ 10 19 atoms/cm 3 or less, more preferably 3 ⁇ 10 19 atoms/cm 3 or less, more preferably 1 ⁇ 10 19 atoms/cm 3 or less, more preferably 3 ⁇ 10 18 atoms/cm 3 or less, and further preferably 1 ⁇ 10 18 atoms/cm 3 or less.
  • the silicon concentration in the channel formation region of the oxide semiconductor measured by SIMS is 1 ⁇ 10 20 atoms/cm 3 or less, preferably 5 ⁇ 10 19 atoms/cm 3 or less, more preferably 3 ⁇ 10 19 atoms/cm 3 or less, more preferably 1 ⁇ 10 19 atoms/cm 3 or less, more preferably 3 ⁇ 10 18 atoms/cm 3 or less, and still more preferably 1 ⁇ 10 18 atoms/cm 3 or less.
  • the nitrogen concentration in a channel formation region of an oxide semiconductor obtained by SIMS is set to 1 ⁇ 10 20 atoms/cm 3 or less, preferably 5 ⁇ 10 19 atoms/cm 3 or less, more preferably 1 ⁇ 10 19 atoms/cm 3 or less, more preferably 5 ⁇ 10 18 atoms/cm 3 or less, more preferably 1 ⁇ 10 18 atoms/cm 3 or less, and further preferably 5 ⁇ 10 17 atoms/cm 3 or less.
  • Hydrogen contained in the oxide semiconductor reacts with oxygen bonded to a metal atom to form water, and thus oxygen vacancies may be formed. When hydrogen enters the oxygen vacancies, electrons serving as carriers may be generated. In addition, some of the hydrogen may bond to oxygen bonded to a metal atom to generate electrons serving as carriers. Therefore, a transistor using an oxide semiconductor containing hydrogen is likely to have normally-on characteristics. For this reason, it is preferable that hydrogen in a channel formation region of the oxide semiconductor is reduced as much as possible.
  • the hydrogen concentration in the channel formation region of the oxide semiconductor obtained by SIMS is less than 1 ⁇ 10 20 atoms/cm 3 , preferably less than 5 ⁇ 10 19 atoms/cm 3 , more preferably less than 1 ⁇ 10 19 atoms/cm 3 , more preferably less than 5 ⁇ 10 18 atoms/cm 3 , more preferably less than 1 ⁇ 10 18 atoms/cm 3 , and further preferably less than 1 ⁇ 10 17 atoms/cm 3 .
  • the concentration of the alkali metal or the alkaline earth metal in a channel formation region of the oxide semiconductor obtained by SIMS is set to 1 ⁇ 10 18 atoms/cm 3 or less, preferably 2 ⁇ 10 16 atoms/cm 3 or less.
  • the oxide semiconductor 230 can be rephrased as a semiconductor layer including a channel formation region of a transistor.
  • a semiconductor material that can be used for the semiconductor layer is not limited to the above-mentioned metal oxides.
  • a semiconductor material having a band gap (a semiconductor material that is not a zero-gap semiconductor) may be used for the semiconductor layer.
  • a semiconductor material such as a single element semiconductor, a compound semiconductor, or a layered material (also referred to as an atomic layer material, a two-dimensional material, or the like) is preferably used.
  • layered material is a general term for a group of materials that have a layered crystal structure.
  • a layered crystal structure is a structure in which layers formed by covalent bonds or ionic bonds are stacked via bonds weaker than covalent bonds or ionic bonds, such as van der Waals forces.
  • Layered materials have high electrical conductivity within a unit layer, that is, high two-dimensional electrical conductivity.
  • Silicon and germanium are examples of elemental semiconductors that can be used in the semiconductor material.
  • Examples of silicon that can be used in the semiconductor layer include single crystal silicon, polycrystalline silicon, microcrystalline silicon, and amorphous silicon.
  • An example of polycrystalline silicon is low temperature polysilicon (LTPS).
  • Compound semiconductors that can be used for the semiconductor material include silicon carbide, silicon germanium, gallium arsenide, indium phosphide, boron nitride, and boron arsenide.
  • the boron nitride that can be used for the semiconductor layer preferably contains an amorphous structure.
  • the boron arsenide that can be used for the semiconductor layer preferably contains crystals with a cubic crystal structure.
  • Layered materials include graphene, silicene, boron carbonitride, and chalcogenides.
  • boron carbonitride carbon atoms, nitrogen atoms, and boron atoms are arranged in a hexagonal lattice structure on a plane.
  • Chalcogenides are compounds that contain chalcogen. Chalcogen is a general term for elements that belong to Group 16, and includes oxygen, sulfur, selenium, tellurium, polonium, and livermorium.
  • Other examples of chalcogenides include transition metal chalcogenides and Group 13 chalcogenides.
  • transition metal chalcogenide that functions as a semiconductor.
  • transition metal chalcogenides that can be used as the semiconductor layer include molybdenum sulfide (representatively MoS 2 ), molybdenum selenide (representatively MoSe 2 ), molybdenum tellurium (representatively MoTe 2 ), tungsten sulfide (representatively WS 2 ), tungsten selenide (representatively WSe 2 ), tungsten tellurium (representatively WTe 2 ), hafnium sulfide (representatively HfS 2 ), hafnium selenide (representatively HfSe 2 ), zirconium sulfide (representatively ZrS 2 ), and zirconium selenide (representatively ZrSe 2 ).
  • FIGS. 9A to 13B ⁇ Example of Manufacturing Method of Semiconductor Device>
  • FIGS. 9A to 10B and FIGS. 12A to 13B correspond to FIG. 1B.
  • insulating materials for forming insulators, conductive materials for forming conductors, or semiconductor materials for forming semiconductors can be formed as films using a sputtering method, a CVD method, a molecular beam epitaxy (MBE) method, a pulsed laser deposition (PLD) method, an ALD method, or the like, as appropriate.
  • MBE molecular beam epitaxy
  • PLD pulsed laser deposition
  • Sputtering methods include RF sputtering, which uses a high-frequency power source as the sputtering power source, DC sputtering, which uses a direct current power source, and pulsed DC sputtering, which changes the voltage applied to the electrodes in a pulsed manner.
  • RF sputtering is mainly used when depositing insulating films
  • DC sputtering is mainly used when depositing metal conductive films.
  • Pulsed DC sputtering is mainly used when depositing compounds such as oxides, nitrides, and carbides using the reactive sputtering method.
  • CVD methods can be classified into plasma enhanced CVD (PECVD), which uses plasma, thermal CVD (TCVD), which uses heat, and photo CVD (Photo CVD), which uses light. They can also be divided into metal CVD (MCVD) and metal organic CVD (MOCVD), depending on the source gas used.
  • PECVD plasma enhanced CVD
  • TCVD thermal CVD
  • Photo CVD photo CVD
  • MCVD metal CVD
  • MOCVD metal organic CVD
  • the plasma CVD method can produce high-quality films at relatively low temperatures. Furthermore, because the thermal CVD method does not use plasma, it is a film formation method that can reduce plasma damage to the workpiece. For example, wiring, electrodes, elements (transistors, capacitive elements, etc.) included in a semiconductor device may become charged up by receiving electric charge from the plasma. At this time, the accumulated electric charge may destroy the wiring, electrodes, elements, etc. included in the semiconductor device. On the other hand, with the thermal CVD method, which does not use plasma, such plasma damage does not occur, and the yield of semiconductor devices can be increased. Furthermore, with the thermal CVD method, no plasma damage occurs during film formation, so films with fewer defects can be obtained.
  • the ALD method can be a thermal ALD method in which the reaction between the precursor and reactant is carried out using only thermal energy, or a PEALD method in which a plasma-excited reactant is used.
  • the CVD and ALD methods are different from sputtering methods in which particles emitted from a target or the like are deposited. Therefore, they are film formation methods that are less affected by the shape of the workpiece and have good step coverage.
  • the ALD method has excellent step coverage and excellent thickness uniformity, making it suitable for coating the surfaces of openings with high aspect ratios.
  • the ALD method has a relatively slow film formation speed, it may be preferable to use it in combination with other film formation methods such as the CVD method, which has a faster film formation speed.
  • a film of any composition can be formed by changing the flow rate ratio of the raw material gases.
  • a film with a continuously changing composition can be formed by changing the flow rate ratio of the raw material gases while forming the film.
  • a film of any composition can be formed by introducing multiple different types of precursors.
  • a film of any composition can be formed by controlling the number of cycles of each precursor.
  • the type of oxidizing agent may be changed depending on each precursor.
  • ozone (O 3 ) may be used as an oxidizing agent for the first precursor
  • oxygen (O 2 ) may be used as an oxidizing agent for the second precursor.
  • a heat treatment may be performed.
  • the heat treatment may be performed under reduced pressure, and the film may be formed continuously without exposure to the atmosphere. By performing such a treatment, it is possible to remove moisture and hydrogen adsorbed on the surface on which the film is to be formed, and further reduce the moisture concentration and hydrogen concentration in the structure that is the surface on which the film is to be formed.
  • the temperature of the heat treatment is preferably 100°C or higher and 600°C or lower.
  • a substrate (not shown) is prepared, and an insulator 210 is formed on the substrate (see FIG. 9A).
  • the insulator 210 may be formed by a sputtering method, a CVD method, an MBE method, a PLD method, an ALD method, or the like, as appropriate.
  • a silicon nitride film may be formed as the insulator 210 by a sputtering method.
  • the insulator 222 is formed on the insulator 210 (see FIG. 9A).
  • the insulator 222 may be formed by a sputtering method, a CVD method, an MBE method, a PLD method, an ALD method, or the like, as appropriate.
  • a hafnium silicate film may be formed as the insulator 222 by a sputtering method.
  • a film formation target having hafnium and silicon may be used.
  • a co-sputtering method using a silicon oxide target and a hafnium oxide target may be used.
  • the insulator 222 may also be formed by a thermal ALD method.
  • hafnium tetrachloride and silicon tetrachloride may be used as precursors.
  • silicon may be added to the hafnium oxide film to form a hafnium silicate film.
  • Methods for adding silicon include, for example, ion implantation, in which ionized source gas is mass-separated before addition, or ion doping, in which ionized source gas is added without mass separation.
  • the conductor 220 is formed on the insulator 222 (see FIG. 9A).
  • the conductor 220 may be formed by forming a conductive film on the insulator 222 and patterning the conductive film by lithography.
  • the conductive film may be formed by appropriately using a sputtering method, a CVD method, an MBE method, a PLD method, an ALD method, or the like.
  • the conductive film may be formed by forming a film of tungsten by sputtering, and then forming a film of ITSO on the tungsten by sputtering.
  • the insulator 280 is formed on the insulator 222 and the conductor 220 (see FIG. 9A).
  • the insulator 280 may be formed using any of the insulating materials described above as appropriate.
  • the insulator 280 may be formed using a sputtering method, a CVD method, an MBE method, a PLD method, an ALD method, or the like as appropriate.
  • a silicon nitride film may be formed as the insulator 280 using a sputtering method.
  • the upper surface of the insulator 280 has an upwardly convex curved shape. By not performing the planarization process, it is possible to reduce manufacturing costs and increase production yields.
  • planarization treatment is not necessarily performed after the insulators 280a to 280c are formed.
  • a planarization treatment may be performed and then the insulator 280c may be formed.
  • the hydrogen concentration in the insulator 280 can be reduced.
  • the amount of hydrogen diffusing from the insulator 280 to the oxide semiconductor 230 can be reduced, and oxygen vacancies and VoH in the channel formation region can be reduced.
  • a conductive film 240f is formed on the insulator 280 (see FIG. 9A).
  • the conductive material described above may be used as appropriate for the conductive film 240f.
  • the conductive film 240f may be formed by a sputtering method, a CVD method, an MBE method, a PLD method, an ALD method, or the like as appropriate.
  • ruthenium may be formed as the conductive film 240f by a sputtering method, and ITSO may be formed thereon by a sputtering method.
  • the conductive film 240f and a part of the insulator 280 are processed to form an opening 290 that reaches the conductor 220 (see FIG. 9B).
  • the opening 290 may be formed by using a lithography method.
  • the conductor 240s is formed from the conductive film 240f.
  • the resist is first exposed through a mask.
  • the exposed area is removed or left using a developer to form a resist mask.
  • a conductor, semiconductor, or insulator can be processed into a desired shape by etching through the resist mask.
  • a resist mask can be formed by exposing the resist using KrF excimer laser light, ArF excimer laser light, or EUV (Extreme Ultraviolet) light.
  • a liquid immersion technique may be used in which a liquid (e.g., water) is filled between the substrate and the projection lens and exposure is performed.
  • an electron beam or an ion beam may be used instead of the light described above.
  • a mask may not be used.
  • the etching process for forming the opening 290 is preferably a dry etching method. Dry etching is suitable for forming the opening 290 because it allows anisotropic etching and has a high aspect ratio.
  • an etching gas containing halogen can be used, specifically, an etching gas containing one or more of fluorine, chlorine, and bromine can be used.
  • an etching gas containing one or more of fluorine, chlorine, and bromine can be used.
  • the etching gas C4F6 gas, C5F6 gas, C4F8 gas, CF4 gas, SF6 gas, CHF3 gas, CH2F2 gas, CH3F gas , Cl2 gas, BCl3 gas, SiCl4 gas, CCl4 gas, HBr gas, or BBr3 gas can be used alone or in a mixture of two or more gases.
  • oxygen gas, carbon dioxide gas, nitrogen gas, helium gas, argon gas, hydrogen gas, or hydrocarbon gas can be appropriately added to the above etching gas.
  • a gas containing no halogen gas and a hydrocarbon gas or a hydrogen gas can be used as the etching gas.
  • the hydrocarbon used in the etching gas may be one or more of methane ( CH4 ), ethane ( C2H6 ), propane ( C3H8 ), butane ( C4H10 ), ethylene ( C2H4 ), propylene ( C3H6 ) , acetylene ( C2H2 ), and propyne ( C3H4 ) .
  • the etching conditions may be appropriately set according to the target to be etched.
  • a capacitively coupled plasma (CCP) etching device having parallel plate electrodes can be used as the dry etching device.
  • a capacitively coupled plasma etching device having parallel plate electrodes may be configured to apply a high-frequency voltage to one of the parallel plate electrodes. Or, it may be configured to apply a high-frequency voltage of the same frequency to each of the parallel plate electrodes. Also, it may be configured to apply multiple different high-frequency voltages to the parallel plate electrodes.
  • Such a CCP etching device is called a dual frequency capacitively coupled plasma (DF-CCP) etching device. In the DF-CCP etching device, it is sufficient to apply high-frequency voltages of different frequencies to each of the parallel plate electrodes.
  • DF-CCP dual frequency capacitively coupled plasma
  • a configuration in which multiple different high-frequency voltages are applied to one of the parallel plate electrodes may be used.
  • a dry etching device having a high-density plasma source may be used.
  • an inductively coupled plasma (ICP) etching device may be used as the dry etching device having a high-density plasma source.
  • the etching device may be appropriately set according to the object to be etched.
  • the formation of the opening 290 is performed continuously without exposure to the outside air.
  • a multi-chamber etching device may be used to perform the processing without exposure to the outside air.
  • the transistor 200 shown in FIG. 4A or 4B can be formed by forming a recess in the upper surface of the conductor 220 that overlaps with the opening 290.
  • a microwave treatment may be performed in an atmosphere containing oxygen to reduce the impurity concentration in the insulator 280.
  • the microwave treatment refers to, for example, a treatment using an apparatus having a power source that generates high-density plasma using microwaves.
  • the microwave refers to an electromagnetic wave having a frequency of 300 MHz to 300 GHz.
  • impurities include hydrogen and carbon.
  • oxygen gas By performing microwave treatment in an atmosphere containing oxygen, oxygen gas can be turned into plasma using microwaves or high frequency waves such as RF, and the oxygen plasma can be applied.
  • oxygen plasma By applying oxygen plasma to the insulator 280 in this manner, hydrogen contained in the insulator 280 can be released to the outside as H 2 O.
  • the oxygen plasma treatment may oxidize the side surface of the insulator 280 in the opening 290.
  • oxygen by forming the oxide semiconductor 230 in contact with the insulator 280, oxygen can be supplied from the insulator 280 to the channel formation region of the oxide semiconductor 230 by performing heat treatment or the like.
  • oxygen vacancies and VOH in the channel formation region of the oxide semiconductor 230 can be reduced. This can stabilize the electrical characteristics of the transistor 200 and improve its reliability.
  • oxygen acting on the insulator 280 can take various forms, such as oxygen atoms, oxygen molecules, oxygen ions, and oxygen radicals (also referred to as O radicals, which are atoms, molecules, or ions having an unpaired electron). Furthermore, the oxygen acting on the insulator 280 may take any one or more of the forms described above, and is particularly preferably an oxygen radical.
  • the microwave treatment when performing the microwave treatment in the above-mentioned oxygen-containing atmosphere, it is preferable to heat the substrate, since this can further reduce the impurity concentration in the insulator 280.
  • the temperature at which the above-mentioned substrate is heated may be 100°C or higher and 650°C or lower, preferably 200°C or higher and 600°C or lower, and more preferably 300°C or higher and 450°C or lower.
  • the microwave treatment is preferably performed under reduced pressure, and the pressure is preferably 10 Pa or higher and 1000 Pa or lower, and more preferably 300 Pa or higher and 700 Pa or lower.
  • the microwave treatment can be performed using oxygen gas and argon gas.
  • the oxygen flow ratio (O 2 /(O 2 +Ar)) is greater than 0% and less than or equal to 100%.
  • the oxygen flow ratio (O 2 /(O 2 +Ar)) is greater than 0% and less than or equal to 50%.
  • the oxygen flow ratio (O 2 /(O 2 +Ar)) is greater than 10% and less than or equal to 40%.
  • the oxygen flow ratio (O 2 /(O 2 +Ar)) is greater than 10% and less than or equal to 30%.
  • the frequency of the microwave processing device is preferably 300 MHz or more and 300 GHz or less, more preferably 2.4 GHz or more and 2.5 GHz or less, and can be, for example, 2.45 GHz.
  • the power of the power source that applies microwaves in the microwave processing device is preferably 1000 W or more and 10000 W or less, and preferably 2000 W or more and 5000 W or less.
  • the microwave processing device may have a power source that applies RF to the substrate side. Furthermore, by applying RF to the substrate side, oxygen ions generated by the high-density plasma can be efficiently guided into the insulator 280.
  • a heat treatment may be performed.
  • the heat treatment may be performed continuously after the microwave treatment without exposure to the outside air.
  • the heat treatment may be performed at 250° C. to 650° C., preferably 300° C. to 500° C., more preferably 320° C. to 450° C.
  • the heat treatment is performed in an atmosphere of nitrogen gas or an inert gas, or an atmosphere containing an oxidizing gas at 10 ppm or more, 1% or more, or 10% or more.
  • the oxygen gas may be about 20%.
  • the heat treatment may be performed under reduced pressure.
  • the heat treatment may be performed in an atmosphere containing an oxidizing gas at 10 ppm or more, 1% or more, or 10% or more after the heat treatment in the nitrogen gas or inert gas atmosphere.
  • an oxidizing gas at 10 ppm or more, 1% or more, or 10% or more after the heat treatment in the nitrogen gas or inert gas atmosphere.
  • impurities such as water contained in the insulator 280 and the like can be reduced before the formation of an oxide semiconductor film that becomes the oxide semiconductor 230 described later. It is preferable that the heat treatment be performed under conditions that do not excessively oxidize the conductor 220 and the conductor 240s.
  • the gas used in the heat treatment is highly purified.
  • the amount of moisture contained in the gas used in the heat treatment is 1 ppb or less, preferably 0.1 ppb or less, and more preferably 0.05 ppb or less.
  • an oxide semiconductor film 230f which will later become the oxide semiconductor 230, is formed in contact with the upper surface of the conductor 220, the side surface of the insulator 280, and the upper surface and side surface of the conductor 240s (see FIG. 9C).
  • the oxide semiconductor film 230f may be formed using any of the metal oxides applicable to the oxide semiconductor 230 described above.
  • the oxide semiconductor film 230f may be formed by a sputtering method, a CVD method, an MBE method, a PLD method, an ALD method, or the like.
  • the oxide semiconductor film 230f is preferably formed in contact with the upper surface of the conductor 220, the side surface of the insulator 280, and the side surface of the conductor 240s.
  • a film formation method with good coverage for forming the oxide semiconductor film 230f it is preferable to use a film formation method with good coverage for forming the oxide semiconductor film 230f, and it is more preferable to use a CVD method, an ALD method, or the like.
  • a CVD method, an ALD method, or the like it is more preferable to use a CVD method, an ALD method, or the like.
  • an In-Ga-Zn oxide may be formed as the oxide semiconductor film 230f by using the ALD method.
  • the method that can be used to form the oxide semiconductor film 230f is not limited to the CVD method or the ALD method.
  • a sputtering method may be used.
  • the film formation methods for each layer included in the oxide semiconductor 230 may be the same or different.
  • the oxide semiconductor film 230f is preferably formed in contact with the top surface of the conductor 220 in the opening 290, the side surface of the insulator 280 in the opening 290, the side surface of the conductor 240s in the opening 290, and the top surface of the conductor 240s.
  • the conductor 220 functions as one of the source electrode or drain electrode of the transistor 200.
  • the conductor 240 formed later from the conductor 240s functions as the other of the source electrode or drain electrode of the transistor 200.
  • microwave treatment and heat treatment described above may be performed after the formation of the oxide semiconductor film 230f.
  • the impurities 160 may be, for example, any one or more selected from halogen elements such as chlorine, fluorine, bromine, and iodine.
  • the impurities 160 may be supplied by, for example, ion implantation, ion doping, plasma immersion ion implantation, or plasma processing.
  • the ion implantation method is preferable because it can mass-separate an ionized source gas and supply only the desired element to the oxide semiconductor film 230f.
  • impurities such as hydrogen are supplied to the oxide semiconductor film 230f (particularly, the region 230cd that becomes the channel formation region), and the hydrogen generates electrons that become carriers, which can suppress a negative shift (normally on) in the threshold voltage of the transistor.
  • boron trifluoride (BF 3 ) is used as a source gas, and fluorine (F) obtained by mass separation by ion implantation is supplied to the oxide semiconductor film 230f as the impurity 160.
  • fluorine is supplied as the impurity 160 to the oxide semiconductor film 230f by ion implantation at an acceleration voltage of 1 keV to 80 keV and a dose amount of 1.0 ⁇ 10 12 ions/cm 2 to 1.0 ⁇ 10 17 ions/cm 2.
  • fluorine is supplied to the oxide semiconductor film 230f by ion implantation under conditions such that the concentration of fluorine in the oxide semiconductor film 230f is 1.0 ⁇ 10 17 atoms/cm 3 to 1.0 ⁇ 10 22 atoms/cm 3 .
  • the impurity 160 is not limited to fluorine, and may be a halogen element other than fluorine, such as chlorine, as described above.
  • the above-described impurity supply process is performed on at least the region of the oxide semiconductor film 230f that will later become the channel formation region.
  • the region 230cd that functions as the channel formation region of the oxide semiconductor 230 is provided in contact with the sidewall of the opening 290 that is approximately perpendicular to the substrate surface. Therefore, in order to supply impurities to the region 230cd that will later become the channel formation region, it is preferable to perform the process while tilting the structure being fabricated with respect to the XY plane, as shown in FIG. 10A and FIG. 10B.
  • the impurity 160 is first supplied to the structure in a state in which the structure is tilted at an angle ⁇ in the ⁇ X direction with the point O in the XY plane (within the substrate surface) as a fulcrum (see FIG. 10A), and then the impurity 160 is supplied to the structure in a state in which the structure is tilted at an angle ⁇ in the +X direction with the point O as a fulcrum (see FIG. 10B).
  • the angle ⁇ is preferably an angle at which at least a part of the region 230cd appears exposed from the opening 290 when the structure being manufactured is viewed from the Z-axis direction.
  • the angle ⁇ is preferably greater than 0 degrees and less than 90 degrees, and more preferably 15 degrees or more and 80 degrees or less. This allows the impurity 160 to be supplied to the region 230cd that will later become the channel formation region in the oxide semiconductor film 230f at the cut surface of the dashed line A1-A2. Note that in FIGS. 10A and 10B, the direction perpendicular to the dashed line A1-A2 is indicated by a two-dot dashed line as the axis R.
  • the intersection of the plane that cuts the upper end of the region 230cd, which will later become the channel formation region, in the oxide semiconductor film 230f (which may also be referred to as a plane parallel to the interface between the insulator 280 and the conductor 240s) and the axis R is shown as point P.
  • the sidewalls of the opening 290 in the structure being fabricated are generally perpendicular to the bottom.
  • impurities 160 can be reliably supplied to the entire surface of region 230cd formed on the side wall of opening 290.
  • FIG. 11A shows a schematic diagram (outline perspective view) showing the trajectory of point P when axis R is rotated 360 degrees in the XY plane with point O as the fulcrum.
  • FIG. 11B is a planar schematic view of the trajectory of point P shown in FIG. 11A as viewed from a direction perpendicular to the XY plane.
  • FIGS. 11A and 11B show an example of rotating axis R clockwise in plan view.
  • the rotation direction of the axis R is not limited to clockwise. As shown in Figures 11C and 11D, the axis R may be rotated counterclockwise in plan view.
  • the supply process of the impurities 160 may be performed with the axis R fixed in one direction, and then the axis R may be rotated by an arbitrary angle and the next supply process of the impurities 160 may be performed while the axis R is fixed in that position. This series of processes may be repeated.
  • the supply process of impurities 160 is performed with axis R fixed in one direction, then axis R is rotated 90 degrees and the next supply process of impurities 160 is performed with axis R fixed in that state.
  • axis R is rotated 360 degrees, and impurities 160 can be supplied to the entire surface of region 230cd formed on the side wall of opening 290.
  • the rotation angle of axis R can be appropriately determined taking into consideration the shape of opening 290 in a plan view, the angle between the side wall and the bottom of opening 290, the desired amount of impurities 160 to be supplied to region 230cd, the specifications of the semiconductor manufacturing equipment, the productivity of the semiconductor device, etc.
  • the impurities 160 may be supplied to the oxide semiconductors of all layers, or the impurities 160 may be supplied mainly to the oxide semiconductors of some layers.
  • the impurity 160 may be supplied to both the oxide semiconductor 230a and the oxide semiconductor 230b, or the impurity 160 may be supplied mainly to one of them.
  • the band structure of the oxide semiconductor 230 of the transistor 200 shown in FIG. 4A is the structure shown in FIG. 5A, the electrons serving as carriers mainly flow through the oxide semiconductor 230a as the carrier path.
  • the impurity 160 can be supplied to the oxide semiconductor 230 without damaging the oxide semiconductor 230a side serving as the carrier path. This makes it possible to realize a transistor 200 with good electrical characteristics and reliability.
  • the impurity 160 may be supplied to all of the oxide semiconductors 230a to 230c, or the impurity 160 may be supplied mainly to a specific layer.
  • the band structure of the oxide semiconductor 230 of the transistor 200 shown in FIG. 4B is the structure shown in FIG. 5C (buried channel structure)
  • the impurity 160 can be supplied to the oxide semiconductor 230 without damaging the oxide semiconductor 230b serving as a carrier path.
  • the transistor 200 having good electrical characteristics and reliability can be realized.
  • the impurity 160 is supplied to the oxide semiconductor film 230f after the oxide semiconductor film 230f is formed, but this is not limited thereto.
  • a process of supplying the impurity 160 to the side surface of the insulator 280 in the opening 290 may be performed.
  • the impurity 160 is supplied to the entire side surface of the insulator 280 in the opening 290 by rotating the axis R 360 degrees in the XY plane with the point O as a fulcrum while tilting the structure being manufactured by the angle ⁇ .
  • both the above-mentioned supply process of impurities 160 to the insulator 280 and the supply process of impurities 160 to the oxide semiconductor film 230f may be performed.
  • a method of supplying impurities 160 with the structure tilted has been exemplified, but the present invention is not limited to this.
  • the structure may be fixed, and the device or equipment that supplies impurities 160 may be rotated to supply impurities 160 to the region 230cd that will later become the channel formation region in the oxide semiconductor film 230f at the cut surface of the dashed dotted line A1-A2.
  • heat treatment is performed (see FIG. 12A).
  • the above-mentioned contents can be referred to.
  • oxygen contained in the insulator 280 can be supplied to the oxide semiconductor film 230f (mainly, the channel formation region in contact with the insulator 280).
  • oxygen enters the oxygen vacancies (V 0 ) in the oxide semiconductor film 230f, and the oxygen vacancies can be reduced.
  • damage to the oxide semiconductor film 230f caused by the previous supplying process of the impurities 160 can be compensated for and the crystallinity can be restored.
  • the oxygen can trap electrons and form negative charges (negative fixed charges) in the channel formation region and its vicinity.
  • the substrate may be heated when the supplying process of the impurities 160 is performed.
  • the temperature of the substrate heating can be 200° C. or higher and 500° C. or lower.
  • the oxide semiconductor film 230f is processed using lithography to form the oxide semiconductor 230 (see FIG. 12B). As a result, a part of the oxide semiconductor 230 is formed in the opening 290.
  • the oxide semiconductor 230 can be processed using a dry etching method or a wet etching method. Processing using the dry etching method is suitable for fine processing.
  • the conductor 240s is processed to form the conductor 240 extending in the X direction as shown in Figs. 1A and 1C (see Fig. 12B).
  • the conductor 240 may be formed using a lithography method.
  • the conductor 240s may be processed using a dry etching method or a wet etching method. Processing using the dry etching method is suitable for fine processing.
  • the insulator 250 is formed on the oxide semiconductor 230, the conductor 240, and the insulator 280 (see FIG. 12C).
  • the insulator 250 may be formed using any of the insulating materials described above.
  • the insulator 250 may be formed using a sputtering method, a CVD method, an MBE method, a PLD method, an ALD method, or the like.
  • the insulator 250 is preferably formed in contact with the oxide semiconductor 230 provided in the opening 290. Therefore, the insulator 250 is preferably formed using a film formation method with good coverage, and more preferably using a CVD method or an ALD method.
  • silicon oxide may be formed as the insulator 250 using the PEALD method.
  • the method for forming the insulator 250 is not limited to the CVD method or the ALD method.
  • a sputtering method may be used.
  • the insulator 250 can have a laminated structure of an insulator 250a and an insulator 250b.
  • a film of hafnium silicate can be formed as the insulator 250a using a thermal ALD method.
  • a film of silicon nitride can be formed as the insulator 250b using a PEALD method.
  • the side end of the oxide semiconductor 230 is covered with the insulator 250. Therefore, it is possible to prevent a short circuit between the oxide semiconductor 230 and the conductor 260. Furthermore, by using the above configuration, the side end of the conductor 240 is covered with the insulator 250. Therefore, it is possible to prevent a short circuit between the conductor 240 and the conductor 260.
  • the microwave treatment and heat treatment described above may be performed after the formation of the insulator 250.
  • the heat treatment can be performed in a state where the insulators 222 and 250a are provided in a closed system made of the insulators 210 and 250b. This allows hydrogen in the closed system to be captured or fixed to the insulators 222 and 250a. This allows the hydrogen concentration in the channel formation region of the oxide semiconductor 230 to be reduced. This improves the electrical characteristics of the transistor and improves the reliability of the transistor.
  • a semiconductor device with less variation in the electrical characteristics of the transistor can be provided.
  • the microwave treatment by performing the microwave treatment, impurities such as carbon in the oxide semiconductor 230 can also be removed. By removing carbon, which is an impurity in the oxide semiconductor 230, the crystallinity of the oxide semiconductor 230 can be improved. As a result, the oxide semiconductor 230 can be made into a CAAC-OS. In particular, when the oxide semiconductor 230 is formed by an ALD method, carbon contained in the precursor may be taken into the oxide semiconductor 230, so it is preferable to remove carbon by the microwave treatment.
  • the microwave treatment is not necessarily performed after all of the insulators contained in the insulator 250 have been formed.
  • the microwave treatment may be performed after the insulator 250a is formed, and then the insulator 250b may be formed.
  • the microwave treatment may be performed after the insulator 250a is formed, and then the microwave treatment may be performed after the insulator 250b is formed. In this way, the microwave treatment in an oxygen-containing atmosphere may be performed multiple times.
  • the impurities 190 include impurities that can be contained in the regions 230na and 230nb described in FIG. 2A, such as one or more of hydrogen, boron, carbon, nitrogen, phosphorus, sulfur, arsenic, aluminum, magnesium, silicon, and noble gases.
  • noble gases include helium, neon, argon, krypton, and xenon.
  • the impurities 190 are preferably one or more of boron, phosphorus, aluminum, magnesium, and silicon.
  • the impurities 190 can be supplied, for example, by ion implantation, ion doping, plasma immersion ion implantation, or plasma treatment.
  • the impurity 190 is supplied for the purpose of reducing the resistance of the source and drain regions (regions 230na and 230nb shown in FIG. 2A) of the oxide semiconductor 230. Therefore, it is preferable that the impurity 190 is supplied only to the source and drain regions, and not to the channel formation region (region 230cd shown in FIG. 2A). Therefore, unlike the case where the impurity 160 is supplied to the oxide semiconductor film 230f, it is preferable that the impurity 190 is supplied in a direction approximately perpendicular to the substrate surface. This allows the impurity to be supplied mainly to the source and drain regions of the oxide semiconductor 230, and therefore the resistance of these regions can be selectively reduced.
  • the ion doping method in which an ionized source gas is supplied to a target without mass separation can supply all of the source gas including hydrogen to the oxide semiconductor 230 as the impurities 190.
  • the hydrogen supplied to the oxide semiconductor 230 forms VOH in the oxide semiconductor 230, which makes it easy to reduce the resistance of the oxide semiconductor 230. Therefore, the resistance of the source region and the drain region of the oxide semiconductor 230 can be easily reduced.
  • both boron (B) and hydrogen (H) described above can be simultaneously supplied to the oxide semiconductor 230 as the impurities 190.
  • This may allow the resistance of the source region and the drain region in the oxide semiconductor 230 to be reduced more efficiently than when an ion implantation method is used in which an ionized source gas is subjected to mass separation before being supplied to a target object.
  • ion implantation may also be used as a method for supplying the impurities 190.
  • impurities such as hydrogen are supplied not only to the source and drain regions but also to the channel formation region, even when the impurities 190 are supplied from a direction approximately perpendicular to the substrate surface.
  • boron (B) can be supplied as the impurity 190 to the oxide semiconductor 230 by mass separation. Therefore, it is possible to reduce the resistance of the source region and the drain region while preventing impurities such as hydrogen from being supplied to the channel formation region.
  • the source gas that can be used when supplying the impurity 190 is not limited to diborane (B 2 H 6 ), and may be a source gas that does not contain hydrogen (H), such as boron trifluoride (BF 3 ).
  • the supply process of the impurity 190 does not need to be performed.
  • a conductive film that will become the conductor 260 is formed so as to fill the recess of the insulator 250.
  • the conductive film may be formed using any of the conductive materials described above.
  • the conductive film may be formed using a sputtering method, a CVD method, an MBE method, a PLD method, an ALD method, or the like.
  • the conductive film is preferably formed in contact with the insulator 250 provided in the opening 290. Therefore, the conductive film is preferably formed using a film formation method that has good coverage or embedding properties, and more preferably using a CVD method or an ALD method.
  • the conductive film may be formed by forming titanium nitride using a CVD method or an ALD method, and then forming tungsten on the titanium nitride using a CVD method.
  • the conductive film that becomes the conductor 260 is provided so as to fill the opening 290, but the present invention is not limited to this.
  • a recess that reflects the shape of the opening 290 may be formed in the center of the conductive film.
  • the recess may also be filled with an inorganic insulating material or the like.
  • the conductor 260 may be formed by using a lithography method.
  • the above processing can be performed by a dry etching method or a wet etching method. Processing by the dry etching method is suitable for fine processing.
  • the above-mentioned process of supplying the impurity 190 may be performed after the formation of the conductor 260, not after the formation of the insulator 250.
  • the impurity 190 is supplied only to the region (region 230nb shown in FIG. 2A) of the source region and drain region of the oxide semiconductor 230 that does not overlap with the conductor 260, but the impurity 190 can be prevented from being supplied to the channel formation region (region 230cd shown in FIG. 2A) that overlaps with the conductor 260. This eliminates the risk of the impurity 190 being supplied to the channel formation region, even if the angle between the sidewall and the bottom of the opening 290 is less than 90 degrees.
  • the process of supplying the impurity 190 may be performed both after the formation of the insulator 250 and after the formation of the conductor 260.
  • the insulator 283 is formed to cover the conductor 260 and the insulator 250.
  • the insulator 283 may be formed using any of the insulating materials described above.
  • the insulator 283 may be formed using a sputtering method, a CVD method, an MBE method, a PLD method, an ALD method, or the like. As shown in FIG. 4A or FIG. 4B, the insulator 283 may have a layered structure of an insulator 283a and an insulator 283b.
  • the microwave treatment and heat treatment described above may be performed after the formation of the insulator 283.
  • the heat treatment can be performed in a state where the insulators 222 and 283a are provided in a closed system consisting of the insulators 210 and 283b. This allows hydrogen in the closed system to be captured or fixed to the insulators 222 and 283a. This allows the hydrogen concentration in the channel formation region of the oxide semiconductor 230 to be reduced. This improves the electrical characteristics of the transistor and improves the reliability of the transistor. In addition, a semiconductor device with less variation in the electrical characteristics of the transistor can be provided.
  • the transistor 200 shown in Figures 1A to 1C can be manufactured.
  • the semiconductor device 900 can function as a memory device.
  • FIG. 14 shows a block diagram illustrating an example of the configuration of a semiconductor device 900.
  • the semiconductor device 900 shown in FIG. 14 has a driver circuit 910 and a memory array 920.
  • the memory array 920 has one or more memory cells 950.
  • FIG. 14 shows an example in which the memory array 920 has a plurality of memory cells 950 arranged in a matrix.
  • the transistors exemplified in the above embodiment can be applied to the memory cell 950.
  • the memory device can be miniaturized and highly integrated.
  • the capacity per area of the memory device can be increased.
  • the drive circuit 910 includes a PSW 931 (power switch), a PSW 932, and a peripheral circuit 915.
  • the peripheral circuit 915 includes a peripheral circuit 911, a control circuit 912, and a voltage generation circuit 928.
  • each circuit, signal, and voltage can be selected or removed as needed. Alternatively, other circuits or signals may be added.
  • Signals BW, CE, GW, CLK, WAKE, ADDR, WDA, PON1, and PON2 are input signals from the outside, and signal RDA is an output signal to the outside.
  • Signal CLK is a clock signal.
  • signals BW, CE, and GW are control signals.
  • Signal CE is a chip enable signal
  • signal GW is a global write enable signal
  • signal BW is a byte write enable signal.
  • Signal ADDR is an address signal.
  • Signal WDA is write data
  • signal RDA is read data.
  • Signals PON1 and PON2 are power gating control signals. Signals PON1 and PON2 may be generated by the control circuit 912.
  • the control circuit 912 is a logic circuit that has the function of controlling the overall operation of the semiconductor device 900. For example, the control circuit 912 performs a logical operation on the signals CE, GW, and BW to determine the operation mode (e.g., write operation, read operation) of the semiconductor device 900. Alternatively, the control circuit 912 generates a control signal for the peripheral circuit 911 so that this operation mode is executed.
  • the control circuit 912 performs a logical operation on the signals CE, GW, and BW to determine the operation mode (e.g., write operation, read operation) of the semiconductor device 900.
  • the control circuit 912 generates a control signal for the peripheral circuit 911 so that this operation mode is executed.
  • the voltage generation circuit 928 has a function of generating a negative voltage.
  • the signal WAKE has a function of controlling the input of the signal CLK to the voltage generation circuit 928. For example, when an H-level signal is given as the signal WAKE, the signal CLK is input to the voltage generation circuit 928, and the voltage generation circuit 928 generates a negative voltage.
  • the peripheral circuit 911 is a circuit for writing and reading data to and from the memory cells 950.
  • the peripheral circuit 911 has a row decoder 941, a column decoder 942, a row driver 923, a column driver 924, an input circuit 925, an output circuit 926, and a sense amplifier 927.
  • the row decoder 941 and column decoder 942 have the function of decoding the signal ADDR.
  • the row decoder 941 is a circuit for specifying the row to be accessed
  • the column decoder 942 is a circuit for specifying the column to be accessed.
  • the row driver 923 has the function of selecting the row specified by the row decoder 941.
  • the column driver 924 has the function of writing data to the memory cell 950, the function of reading data from the memory cell 950, the function of retaining the read data, etc.
  • the input circuit 925 has a function of holding a signal WDA.
  • the data held by the input circuit 925 is output to the column driver 924.
  • the output data of the input circuit 925 is data (Din) to be written to the memory cell 950.
  • the data (Dout) read from the memory cell 950 by the column driver 924 is output to the output circuit 926.
  • the output circuit 926 has a function of holding Dout.
  • the output circuit 926 has a function of outputting Dout to the outside of the semiconductor device 900.
  • the data output from the output circuit 926 is the signal RDA.
  • the PSW 931 has a function of controlling the supply of V DD to the peripheral circuit 915.
  • the PSW 932 has a function of controlling the supply of V HM to the row driver 923.
  • the high power supply voltage of the semiconductor device 900 is V DD
  • the low power supply voltage is GND (ground potential).
  • V HM is a high power supply voltage used to set the word line to a high level, and is higher than V DD .
  • the on/off of the PSW 931 is controlled by a signal PON1, and the on/off of the PSW 932 is controlled by a signal PON2.
  • the number of power supply domains to which V DD is supplied in the peripheral circuit 915 is one, but it may be more than one. In this case, a power switch may be provided for each power supply domain.
  • [DOSRAM] 15A shows an example of a circuit configuration of a memory cell of a DRAM.
  • a DRAM using an OS transistor is referred to as a dynamic oxide semiconductor random access memory (DOSRAM).
  • a memory cell 951 includes a transistor M1 and a capacitor CA.
  • the transistor M1 may have a front gate (sometimes simply called a gate) and a back gate.
  • the back gate may be connected to a wiring that supplies a constant potential or a signal, or the front gate and the back gate may be connected.
  • the first terminal of transistor M1 is connected to the first terminal of capacitance element CA, the second terminal of transistor M1 is connected to wiring BIL, and the gate of transistor M1 is connected to wiring WOL.
  • the second terminal of capacitance element CA is connected to wiring CAL.
  • the wiring BIL functions as a bit line
  • the wiring WOL functions as a word line.
  • the wiring CAL functions as a wiring for applying a predetermined potential to the second terminal of the capacitance element CA. When writing and reading data, it is preferable to apply a low-level potential (sometimes called a reference potential) to the wiring CAL.
  • Data is written and read by applying a high-level potential to the wiring WOL, turning on the transistor M1, and connecting the wiring BIL to the first terminal of the capacitance element CA.
  • the memory cell that can be used for memory cell 950 is not limited to memory cell 951, and the circuit configuration can be changed.
  • the configuration of memory cell 952 shown in FIG. 15B may be used.
  • Memory cell 952 is an example of a case where memory cell 952 does not have a capacitance element CA and a wiring CAL.
  • the first terminal of transistor M1 is in an electrically floating state.
  • the potential written through transistor M1 is held in the capacitance (also called parasitic capacitance) between the first terminal and the gate, as shown by the dashed line. This configuration can greatly simplify the configuration of the memory cell.
  • the OS transistor described in the above embodiment As the transistor M1.
  • the area occupied by the memory cell can be reduced.
  • the OS transistor has a characteristic of having an extremely small off-state current.
  • the leakage current of the transistor M1 can be made extremely low. In other words, since written data can be held by the transistor M1 for a long time, the frequency of refreshing the memory cell can be reduced. Alternatively, the refresh operation of the memory cell can be made unnecessary.
  • the leakage current is extremely low, multi-value data or analog data can be held in the memory cell 951 and the memory cell 952.
  • [NOSRAM] 15C shows an example of a circuit configuration of a gain cell type memory cell having two transistors and one capacitor.
  • the memory cell 953 includes a transistor M2, a transistor M3, and a capacitor CB.
  • a storage device having a gain cell type memory cell using an OS transistor as the transistor M2 is referred to as a nonvolatile oxide semiconductor random access memory (NOSRAM).
  • NOSRAM nonvolatile oxide semiconductor random access memory
  • the first terminal of transistor M2 is connected to the first terminal of capacitance element CB, the second terminal of transistor M2 is connected to wiring WBL, and the gate of transistor M2 is connected to wiring WOL.
  • the second terminal of capacitance element CB is connected to wiring CAL.
  • the first terminal of transistor M3 is connected to wiring RBL, the second terminal of transistor M3 is connected to wiring SL, and the gate of transistor M3 is connected to the first terminal of capacitance element CB.
  • the wiring WBL functions as a write bit line
  • the wiring RBL functions as a read bit line
  • the wiring WOL functions as a word line.
  • the wiring CAL functions as a wiring for applying a predetermined potential to the second terminal of the capacitance element CB.
  • a low-level potential sometimes called a reference potential
  • Data is written by applying a high-level potential to the wiring WOL, turning on transistor M2, and connecting wiring WBL to the first terminal of capacitance element CB.
  • transistor M2 when transistor M2 is on, a potential corresponding to the information to be recorded is applied to wiring WBL, and that potential is written to the first terminal of capacitance element CB and the gate of transistor M3.
  • a low-level potential is applied to wiring WOL, turning off transistor M2, thereby maintaining the potential of the first terminal of capacitance element CB and the potential of the gate of transistor M3.
  • Data is read by applying a predetermined potential to the wiring SL.
  • the current flowing between the source and drain of transistor M3 and the potential of the first terminal of transistor M3 are determined by the potential of the gate of transistor M3 and the potential of the second terminal of transistor M3, so the potential held in the first terminal of capacitance element CB (or the gate of transistor M3) can be read by reading the potential of the wiring RBL connected to the first terminal of transistor M3.
  • the information written in this memory cell can be read from the potential held in the first terminal of capacitance element CB (or the gate of transistor M3).
  • the wiring WBL and the wiring RBL may be combined into a single wiring BIL.
  • An example of the circuit configuration of such a memory cell is shown in FIG. 15D.
  • the memory cell 954 is configured such that the wiring WBL and the wiring RBL of the memory cell 953 are combined into a single wiring BIL, and the second terminal of the transistor M2 and the first terminal of the transistor M3 are connected to the wiring BIL.
  • the memory cell 954 is configured to operate the write bit line and the read bit line as a single wiring BIL.
  • Memory cell 955 shown in FIG. 15E is an example in which the capacitance element CB and wiring CAL in memory cell 953 are omitted.
  • memory cell 956 shown in FIG. 15F is an example in which the capacitance element CB and wiring CAL in memory cell 954 are omitted.
  • the OS transistor described in the above embodiment for at least transistor M2.
  • the area occupied by the memory cell can be reduced.
  • the OS transistor Since the OS transistor has the characteristic of having an extremely small off-state current, written data can be held for a long time by the transistor M2, and therefore the frequency of refreshing the memory cell can be reduced. Alternatively, the refresh operation of the memory cell can be made unnecessary. In addition, since the leakage current is extremely low, multi-value data or analog data can be held in the memory cell 953, memory cell 954, memory cell 955, and memory cell 956.
  • Memory cell 953, memory cell 954, memory cell 955, and memory cell 956, in which an OS transistor is used as transistor M2, are one form of NOSRAM.
  • Si transistors may be used as transistor M3.
  • Si transistors can increase the field effect mobility and can also be used as p-channel transistors, allowing for greater freedom in circuit design.
  • the memory cell can be configured as a unipolar circuit.
  • FIG. 15G shows a 3-transistor, 1-capacitor gain cell type memory cell 957.
  • Memory cell 957 has transistors M4 to M6 and a capacitative element CC.
  • the first terminal of transistor M4 is connected to the first terminal of the capacitance element CC, the second terminal of transistor M4 is connected to the wiring BIL, and the gate of transistor M4 is connected to the wiring WOL.
  • the second terminal of the capacitance element CC is connected to the first terminal of transistor M5 and the wiring GNDL.
  • the second terminal of transistor M5 is connected to the first terminal of transistor M6, and the gate of transistor M5 is connected to the first terminal of the capacitance element CC.
  • the second terminal of transistor M6 is connected to the wiring BIL, and the gate of transistor M6 is connected to the wiring RWL.
  • the wiring BIL functions as a bit line
  • the wiring WOL functions as a write word line
  • the wiring RWL functions as a read word line.
  • the wiring GNDL is a wiring that provides a low-level potential.
  • Data is written by applying a high-level potential to the wiring WOL, turning on transistor M4, and connecting the wiring BIL to the first terminal of the capacitance element CC.
  • transistor M4 when transistor M4 is on, a potential corresponding to the information to be recorded is applied to the wiring BIL, and that potential is written to the first terminal of the capacitance element CC and the gate of transistor M5.
  • a low-level potential is applied to the wiring WOL, turning off transistor M4, thereby holding the potential of the first terminal of the capacitance element CC and the potential of the gate of transistor M5.
  • Data is read by precharging the wiring BIL to a predetermined potential, then electrically floating the wiring BIL, and applying a high-level potential to the wiring RWL. Since the wiring RWL is at a high-level potential, the transistor M6 is turned on, and the wiring BIL and the second terminal of the transistor M5 are connected. At this time, the potential of the wiring BIL is applied to the second terminal of the transistor M5, and the potential of the second terminal of the transistor M5 and the potential of the wiring BIL change depending on the potential held in the first terminal of the capacitance element CC (or the gate of the transistor M5).
  • the potential held in the first terminal of the capacitance element CC or the gate of the transistor M5 can be read. In other words, the information written in this memory cell can be read from the potential held in the first terminal of the capacitance element CC (or the gate of the transistor M5).
  • the OS transistor described in the above embodiment as at least transistor M4.
  • the area occupied by the memory cell can be reduced.
  • Si transistors may be used as transistors M5 and M6. As mentioned above, Si transistors may have higher field-effect mobility than OS transistors depending on the crystal state of the silicon used in the semiconductor layer.
  • the memory cell can be configured as a unipolar circuit.
  • [OS-SRAM] 15H shows an example of a static random access memory (SRAM) using an OS transistor.
  • SRAM static random access memory
  • OS-SRAM oxide semiconductor SRAM
  • a memory cell 958 shown in FIG. 15H is a memory cell of an SRAM capable of backing up data.
  • Memory cell 958 includes transistors M7 to M10, transistors MS1 to MS4, and capacitors CD1 and CD2. Note that transistors MS1 and MS2 are p-channel transistors, and transistors MS3 and MS4 are n-channel transistors.
  • the first terminal of transistor M7 is connected to the wiring BIL, and the second terminal of transistor M7 is connected to the first terminal of transistor MS1, the first terminal of transistor MS3, the gate of transistor MS2, the gate of transistor MS4, and the first terminal of transistor M10.
  • the gate of transistor M7 is connected to the wiring WOL.
  • the first terminal of transistor M8 is connected to the wiring BILB, and the second terminal of transistor M8 is connected to the first terminal of transistor MS2, the first terminal of transistor MS4, the gate of transistor MS1, the gate of transistor MS3, and the first terminal of transistor M9.
  • the gate of transistor M8 is connected to the wiring WOL.
  • the second terminal of transistor MS1 is connected to the wiring VDL.
  • the second terminal of transistor MS2 is connected to the wiring VDL.
  • the second terminal of transistor MS3 is connected to the wiring GNDL.
  • the second terminal of transistor MS4 is connected to the wiring GNDL.
  • the second terminal of transistor M9 is connected to the first terminal of capacitance element CD1, and the gate of transistor M9 is connected to wiring BRL.
  • the second terminal of transistor M10 is connected to the first terminal of capacitance element CD2, and the gate of transistor M10 is connected to wiring BRL.
  • the second terminal of the capacitance element CD1 is connected to the wiring GNDL, and the second terminal of the capacitance element CD2 is connected to the wiring GNDL.
  • the wiring BIL and the wiring BILB function as bit lines
  • the wiring WOL functions as a word line
  • the wiring BRL is a wiring that controls the conductive state and non-conductive state of the transistors M9 and M10.
  • the wiring VDL is a wiring that provides a high-level potential
  • the wiring GNDL is a wiring that provides a low-level potential.
  • Data is written by applying a high-level potential to the wiring WOL and a high-level potential to the wiring BRL. Specifically, when the transistor M10 is in a conductive state, a potential corresponding to the information to be recorded is applied to the wiring BIL, and the potential is written to the second terminal side of the transistor M10.
  • the memory cell 958 forms an inverter loop with the transistors MS1 and MS2, an inverted signal of the data signal corresponding to the potential is input to the second terminal of the transistor M8. Since the transistor M8 is in a conductive state, the potential applied to the wiring BIL, i.e., the inverted signal of the signal input to the wiring BIL, is output to the wiring BILB. Furthermore, since the transistors M9 and M10 are in a conductive state, the potential of the second terminal of the transistor M7 and the potential of the second terminal of the transistor M8 are held in the first terminal of the capacitance element CD2 and the first terminal of the capacitance element CD1, respectively.
  • a low-level potential is applied to the wiring WOL and a low-level potential is applied to the wiring BRL to make the transistors M7 to M10 non-conductive, thereby holding the potential of the first terminal of the capacitance element CD1 and the first terminal of the capacitance element CD2.
  • the wirings BIL and BILB are precharged to a predetermined potential beforehand, and then a high-level potential is applied to the wiring WOL and a high-level potential is applied to the wiring BRL.
  • the potential of the first terminal of the capacitance element CD1 is refreshed by the inverter loop of the memory cell 958 and output to the wiring BILB.
  • the potential of the first terminal of the capacitance element CD2 is refreshed by the inverter loop of the memory cell 958 and output to the wiring BIL.
  • the potentials of the wirings BIL and BILB change from the precharged potentials to the potential of the first terminal of the capacitance element CD2 and the potential of the first terminal of the capacitance element CD1, respectively, so that the potential held in the memory cell can be read from the potential of the wiring BIL or wiring BILB.
  • OS transistors as the transistors M7 to M10. This allows the written data to be held for a long time by the transistors M7 to M10, so that the frequency of refreshing the memory cells can be reduced. Alternatively, the refresh operation of the memory cells can be made unnecessary. In addition, by using the OS transistors described in the above embodiment as the transistors M7 to M10, the area occupied by the memory cells can be reduced.
  • Si transistors may be used as transistors MS1 to MS4.
  • the driving circuit 910 and memory array 920 of the semiconductor device 900 may be provided on the same plane. Also, as shown in FIG. 16A, the driving circuit 910 and memory array 920 may be provided overlapping each other. By providing the driving circuit 910 and memory array 920 overlapping each other, the signal propagation distance can be shortened. Also, as shown in FIG. 16B, the memory array 920 may be provided in multiple layers on the driving circuit 910.
  • FIG. 17 shows a block diagram of the arithmetic unit 960.
  • the arithmetic unit 960 shown in FIG. 17 can be applied to, for example, a CPU (Central Processing Unit).
  • the arithmetic unit 960 can also be applied to processors such as a GPU (Graphics Processing Unit), a TPU (Tensor Processing Unit), and an NPU (Neural Processing Unit) that have a large number (several tens to several hundreds) of processor cores capable of parallel processing more than a CPU.
  • processors such as a GPU (Graphics Processing Unit), a TPU (Tensor Processing Unit), and an NPU (Neural Processing Unit) that have a large number (several tens to several hundreds) of processor cores capable of parallel processing more than a CPU.
  • the arithmetic device 960 shown in FIG. 17 has an ALU 991 (ALU: Arithmetic Logic Unit, arithmetic circuit), an ALU controller 992, an instruction decoder 993, an interrupt controller 994, a timing controller 995, a register 996, a register controller 997, a bus interface 998, a cache 999, and a cache interface 989 on a substrate 990.
  • the substrate 990 is a semiconductor substrate, an SOI substrate, a glass substrate, or the like. It may have a rewritable ROM and a ROM interface.
  • the cache 999 and the cache interface 989 may also be provided on separate chips.
  • the cache 999 is connected to a main memory provided on a separate chip via a cache interface 989.
  • the cache interface 989 has a function of supplying a portion of the data held in the main memory to the cache 999.
  • the cache interface 989 also has a function of outputting a portion of the data held in the cache 999 to the ALU 991 or register 996, etc., via the bus interface 998.
  • a memory array 920 can be provided by stacking it on the arithmetic unit 960.
  • the memory array 920 can be used as a cache.
  • the cache interface 989 may have a function of supplying data held in the memory array 920 to the cache 999.
  • a drive circuit 910 is provided as part of the cache interface 989.
  • the arithmetic device 960 shown in FIG. 17 is merely one example of a simplified configuration, and the actual arithmetic device 960 has a wide variety of configurations depending on the application.
  • the more cores there are, the more preferable it is, but for example, two, preferably four, more preferably eight, even more preferably twelve, and even more preferably sixteen or more.
  • the number of bits that the arithmetic device 960 can handle in its internal arithmetic circuit, data bus, etc. can be, for example, 8 bits, 16 bits, 32 bits, 64 bits, etc.
  • Instructions input to the arithmetic unit 960 via the bus interface 998 are input to the instruction decoder 993, decoded, and then input to the ALU controller 992, the interrupt controller 994, the register controller 997, and the timing controller 995.
  • the ALU controller 992, interrupt controller 994, register controller 997, and timing controller 995 perform various controls based on the decoded instructions. Specifically, the ALU controller 992 generates signals for controlling the operation of the ALU 991. Furthermore, while the arithmetic unit 960 is executing a program, the interrupt controller 994 determines and processes interrupt requests from external input/output devices, peripheral circuits, etc. based on their priority and mask state. The register controller 997 generates the address of the register 996, and reads or writes to the register 996 depending on the state of the arithmetic unit 960.
  • the timing controller 995 also generates signals that control the timing of the operations of the ALU 991, the ALU controller 992, the instruction decoder 993, the interrupt controller 994, and the register controller 997.
  • the timing controller 995 includes an internal clock generating unit that generates an internal clock signal based on a reference clock signal, and supplies the internal clock signal to the various circuits described above.
  • the register controller 997 selects the holding operation in the register 996 according to instructions from the ALU 991. That is, it selects whether the memory cells in the register 996 will hold data using flip-flops or using capacitive elements. If holding data using flip-flops is selected, power supply voltage is supplied to the memory cells in the register 996. If holding data in capacitive elements is selected, data is rewritten to the capacitive elements, and the supply of power supply voltage to the memory cells in the register 996 can be stopped.
  • Figs. 18A and 18B show perspective views of a semiconductor device 970A.
  • the semiconductor device 970A has a layer 930 in which a memory array is provided on the arithmetic device 960.
  • the layer 930 has memory arrays 920L1, 920L2, and 920L3.
  • the arithmetic device 960 and each memory array have overlapping areas.
  • Fig. 18B shows the arithmetic device 960 and layer 930 separated.
  • connection distance between them can be shortened. This allows the communication speed between them to be increased. In addition, the short connection distance allows power consumption to be reduced.
  • a method for stacking the layer 930 having the memory array and the arithmetic device 960 As a method for stacking the layer 930 having the memory array and the arithmetic device 960, a method of stacking the layer 930 having the memory array directly on the arithmetic device 960 (also called monolithic stacking) may be used, or a method of forming the arithmetic device 960 and the layer 930 on different substrates, bonding the two substrates, and connecting them using through-vias or conductive film bonding technology (such as Cu-Cu bonding) may be used.
  • the former method does not require consideration of misalignment during bonding, so not only can the chip size be reduced, but also the manufacturing costs can be reduced.
  • the arithmetic device 960 does not have a cache 999, and the memory arrays 920L1, 920L2, and 920L3 provided in the layer 930 can each be used as a cache.
  • the memory array 920L1 can be used as an L1 cache (also called a level 1 cache)
  • the memory array 920L2 can be used as an L2 cache (also called a level 2 cache)
  • the memory array 920L3 can be used as an L3 cache (also called a level 3 cache).
  • the memory array 920L3 has the largest capacity and is accessed the least frequently.
  • the memory array 920L1 has the smallest capacity and is accessed the most frequently.
  • each memory array provided in the layer 930 can be used as a lower-level cache or a main memory.
  • the main memory has a larger capacity than the cache and is accessed less frequently.
  • a driving circuit 910L1, a driving circuit 910L2, and a driving circuit 910L3 are provided.
  • the driving circuit 910L1 is connected to the memory array 920L1 via a connection electrode 940L1.
  • the driving circuit 910L2 is connected to the memory array 920L2 via a connection electrode 940L2
  • the driving circuit 910L3 is connected to the memory array 920L3 via a connection electrode 940L3.
  • the drive circuit 910L1 may function as part of the cache interface 989, or the drive circuit 910L1 may be configured to be connected to the cache interface 989.
  • the drive circuit 910L2 and the drive circuit 910L3 may also function as part of the cache interface 989, or may be configured to be connected to it.
  • the control circuit 912 can cause some of the multiple memory cells 950 in the semiconductor device 900 to function as RAM based on a signal supplied from the arithmetic device 960.
  • the semiconductor device 900 can cause some of the multiple memory cells 950 to function as a cache, and the other part to function as a main memory. In other words, the semiconductor device 900 can function both as a cache and as a main memory.
  • the semiconductor device 900 according to one aspect of the present invention can function as, for example, a universal memory.
  • a layer 930 having one memory array 920 may be provided over the computing device 960.
  • Figure 19A shows a perspective view of the semiconductor device 970B.
  • one memory array 920 can be divided into multiple areas, each of which can be used for a different function.
  • Figure 19A shows an example in which area L1 is used as an L1 cache, area L2 as an L2 cache, and area L3 as an L3 cache.
  • the capacity of each of areas L1 to L3 can be changed depending on the situation. For example, if it is desired to increase the capacity of the L1 cache, this can be achieved by increasing the area of area L1. With this configuration, it is possible to improve the efficiency of calculation processing and increase the processing speed.
  • Figure 19B shows a perspective view of semiconductor device 970C.
  • Semiconductor device 970C has a layer 930L1 having memory array 920L1 stacked on top of a layer 930L2 having memory array 920L2, and a layer 930L3 having memory array 920L3 stacked on top of that.
  • the memory array 920L1 which is physically closest to the arithmetic device 960, can be used as a higher-level cache, and the memory array 920L3, which is the furthest, can be used as a lower-level cache or main memory. With this configuration, the capacity of each memory array can be increased, thereby further improving processing power.
  • Figure 20A shows various storage devices used in semiconductor devices by hierarchy. The higher the storage device, the faster the operating speed is required, and the lower the storage device, the larger the storage capacity and the higher the recording density are required.
  • a processor such as a CPU, an L1 cache, an L2 cache, an L3 cache, a main memory, storage, etc. Note that, although an example having up to an L3 cache is shown here, it is also possible to have even lower-level caches.
  • Registers also have the function of storing setting information for the processor.
  • a cache has the function of duplicating and storing a portion of the data stored in the main memory. By duplicating frequently used data and storing it in the cache, the speed of accessing the data can be increased.
  • the storage capacity required for a cache is less than that of the main memory, but it is required to operate at a faster speed than the main memory.
  • data that is rewritten in the cache is duplicated and supplied to the main memory.
  • the main memory has the function of holding programs, data, etc. read from storage.
  • Storage has the function of holding data that requires long-term storage, as well as various programs used by processing units. Therefore, storage requires a larger memory capacity and higher recording density than operating speed. For example, high-capacity, non-volatile storage devices such as 3D NAND can be used.
  • a storage device (OS memory) using an oxide semiconductor according to one embodiment of the present invention has a high operating speed and can retain data for a long period of time. Therefore, as shown in FIG. 20A, the storage device according to one embodiment of the present invention can be suitably used in both the hierarchy where the cache is located and the hierarchy where the main memory is located. In addition, the storage device according to one embodiment of the present invention can also be applied to the hierarchy where the storage is located.
  • FIG. 20B also shows an example in which SRAM is used as part of the cache, and an OS memory according to one aspect of the present invention is used as the other part.
  • the lowest level cache can be called an LLC (Last Level Cache).
  • LLC Low Level Cache
  • an LLC is not required to operate faster than higher level caches, it is desirable for it to have a large storage capacity.
  • the OS memory of one embodiment of the present invention is suitable for use as an LLC because it operates quickly and can retain data for long periods of time. Note that the OS memory of one embodiment of the present invention can also be applied to an FLC (Final Level Cache).
  • a configuration can be used in which SRAM is used for the higher-level cache (L1 cache, L2 cache, etc.), and the LLC uses an OS memory according to one aspect of the present invention. Also, as shown in FIG. 20B, not only OS memory but also DRAM can be used for the main memory.
  • Embodiment 4 electronic components, electronic devices, large scale computers, space equipment, and data centers (also referred to as data centers (DCs)) in which the semiconductor device described in the above embodiment can be used will be described.
  • the electronic devices, large scale computers, space equipment, and data centers using the semiconductor device of one embodiment of the present invention are effective in achieving high performance, such as low power consumption.
  • FIG. 21A a perspective view of an electronic device 6500 is shown in FIG. 21A.
  • the electronic device 6500 shown in FIG. 21A is a portable information terminal that can be used as a smartphone.
  • the electronic device 6500 includes a housing 6501, a display portion 6502, a power button 6503, a button 6504, a speaker 6505, a microphone 6506, a camera 6507, a light source 6508, a control device 6509, and the like.
  • the control device 6509 includes, for example, one or more selected from a CPU, a GPU, and a storage device.
  • the semiconductor device of one embodiment of the present invention can be applied to the display portion 6502, the control device 6509, and the like.
  • the electronic device 6600 shown in FIG. 21B is an information terminal that can be used as a notebook personal computer.
  • the electronic device 6600 includes a housing 6611, a keyboard 6612, a pointing device 6613, an external connection port 6614, a display portion 6615, a control device 6616, and the like.
  • the control device 6616 includes, for example, one or more selected from a CPU, a GPU, and a storage device.
  • the semiconductor device of one embodiment of the present invention can be applied to the display portion 6615, the control device 6616, and the like. Note that the use of the semiconductor device of one embodiment of the present invention for the above-described control device 6509 and control device 6616 is preferable because power consumption can be reduced.
  • Fig. 21C shows a perspective view of the large scale computer 5600.
  • the large scale computer 5600 shown in Fig. 21C has a rack 5610 housing a plurality of rack-mounted computers 5620.
  • the large scale computer 5600 may also be called a supercomputer.
  • Computer 5620 can have the configuration shown in the perspective view in FIG. 21D, for example.
  • computer 5620 has motherboard 5630, which has multiple slots 5631 and multiple connection terminals.
  • PC card 5621 is inserted into slot 5631.
  • PC card 5621 has connection terminals 5623, 5624, and 5625, which are each connected to motherboard 5630.
  • the PC card 5621 shown in FIG. 21E is an example of a processing board equipped with a CPU, a GPU, a storage device, and the like.
  • the PC card 5621 has a board 5622.
  • the board 5622 also has a connection terminal 5623, a connection terminal 5624, a connection terminal 5625, a semiconductor device 5626, a semiconductor device 5627, a semiconductor device 5628, and a connection terminal 5629.
  • FIG. 21E illustrates semiconductor devices other than the semiconductor devices 5626, 5627, and 5628, but for those semiconductor devices, please refer to the explanation of the semiconductor devices 5626, 5627, and 5628 described below.
  • connection terminal 5629 has a shape that allows it to be inserted into the slot 5631 of the motherboard 5630, and the connection terminal 5629 functions as an interface for connecting the PC card 5621 and the motherboard 5630.
  • An example of the standard for the connection terminal 5629 is PCIe.
  • Connection terminals 5623, 5624, and 5625 can be interfaces for supplying power to PC card 5621, inputting signals, and the like. They can also be interfaces for outputting signals calculated by PC card 5621, and the like. Examples of standards for connection terminals 5623, 5624, and 5625 include USB, SATA (Serial ATA), and SCSI (Small Computer System Interface). Examples of standards for outputting video signals from connection terminals 5623, 5624, and 5625 include HDMI (registered trademark), and the like.
  • the semiconductor device 5626 has a terminal (not shown) for inputting and outputting signals, and the semiconductor device 5626 can be connected to the board 5622 by inserting the terminal into a socket (not shown) provided on the board 5622.
  • the semiconductor device 5627 has a plurality of terminals, and the semiconductor device 5627 can be connected to the board 5622 by, for example, soldering the terminals to wiring provided on the board 5622 using a reflow method.
  • Examples of the semiconductor device 5627 include an FPGA, a GPU, and a CPU.
  • the semiconductor device 5628 has a plurality of terminals, and the semiconductor device 5628 can be connected to the board 5622 by, for example, soldering the terminals to wiring provided on the board 5622 using a reflow method.
  • An example of the semiconductor device 5628 is a memory device.
  • the mainframe computer 5600 can also function as a parallel computer. By using the mainframe computer 5600 as a parallel computer, it is possible to perform large-scale calculations required for artificial intelligence learning and inference, for example.
  • the semiconductor device of one embodiment of the present invention can be suitably used in space equipment, such as equipment for processing and storing information.
  • the semiconductor device may include an OS transistor.
  • the OS transistor exhibits small changes in electrical characteristics due to radiation exposure.
  • the OS transistor has high resistance to radiation and can be suitably used in an environment where radiation may be incident.
  • the OS transistor can be suitably used in outer space.
  • an artificial satellite 6800 is shown as an example of space equipment.
  • the artificial satellite 6800 has a body 6801, a solar panel 6802, an antenna 6803, a secondary battery 6805, and a control device 6807.
  • a planet 6804 is shown as an example of outer space. Note that outer space refers to an altitude of 100 km or more, for example, but the outer space described in this specification may also include the thermosphere, mesosphere, and stratosphere.
  • the secondary battery 6805 may be provided with a battery management system (also called BMS) or a battery control circuit.
  • BMS battery management system
  • the use of OS transistors in the above-mentioned battery management system or battery control circuit is preferable because it has low power consumption and high reliability even in space.
  • outer space is an environment with radiation levels 100 times higher than on Earth.
  • radiation include electromagnetic waves (electromagnetic radiation) such as X-rays and gamma rays, as well as particle radiation such as alpha rays, beta rays, neutron rays, proton rays, heavy ion rays, and meson rays.
  • the power required for the operation of the satellite 6800 is generated.
  • the amount of power generated is small. Therefore, there is a possibility that the power required for the operation of the satellite 6800 will not be generated.
  • the solar panel may be called a solar cell module.
  • Satellite 6800 can generate a signal.
  • the signal is transmitted via antenna 6803, and can be received, for example, by a receiver installed on the ground or by another satellite.
  • the position of the receiver that received the signal can be measured.
  • satellite 6800 can constitute a satellite positioning system.
  • the control device 6807 has a function of controlling the artificial satellite 6800.
  • the control device 6807 is configured using, for example, one or more of a CPU, a GPU, and a storage device.
  • the semiconductor device according to one embodiment of the present invention is preferably used for the control device 6807.
  • an OS transistor Compared to a Si transistor, an OS transistor has smaller fluctuations in electrical characteristics due to radiation exposure. In other words, the OS transistor has high reliability even in an environment where radiation may be incident, and can be preferably used.
  • the artificial satellite 6800 can also be configured to have a sensor. For example, by configuring it to have a visible light sensor, the artificial satellite 6800 can have the function of detecting sunlight reflected off an object on the ground. Or, by configuring it to have a thermal infrared sensor, the artificial satellite 6800 can have the function of detecting thermal infrared rays emitted from the earth's surface. From the above, the artificial satellite 6800 can have the function of, for example, an earth observation satellite.
  • an artificial satellite is given as an example of space equipment, but the present invention is not limited to this.
  • a semiconductor device according to one embodiment of the present invention can be suitably used in space equipment such as a spaceship, a space capsule, or a space probe.
  • OS transistors As explained above, compared to Si transistors, OS transistors have the advantages of being able to achieve a wider memory bandwidth and having higher radiation resistance.
  • the semiconductor device can be suitably used in a storage system applied to a data center or the like.
  • the data center is required to perform long-term management of data, such as by ensuring the immutability of the data.
  • it is necessary to increase the size of the building, for example, by installing storage and servers for storing a huge amount of data, by securing a stable power source for storing the data, or by securing cooling equipment required for storing the data.
  • a semiconductor device By using a semiconductor device according to one embodiment of the present invention in a storage system applied to a data center, it is possible to reduce the power required to store data and to miniaturize the semiconductor device that stores the data. This makes it possible to miniaturize the storage system, miniaturize the power source for storing data, and reduce the scale of cooling equipment. This makes it possible to save space in the data center.
  • the semiconductor device of one embodiment of the present invention consumes less power, and therefore heat generation from the circuit can be reduced. Therefore, adverse effects of the heat generation on the circuit itself, peripheral circuits, and modules can be reduced. Furthermore, by using the semiconductor device of one embodiment of the present invention, a data center that operates stably even in a high-temperature environment can be realized. Therefore, the reliability of the data center can be improved.
  • FIG. 23 shows a storage system applicable to a data center.
  • the storage system 6900 shown in FIG. 23 has multiple servers 6901sb as hosts 6901 (illustrated as Host Computer). It also has multiple storage devices 6903md as storage 6903 (illustrated as Storage).
  • the host 6901 and storage 6903 are shown connected via a storage area network 6904 (illustrated as SAN: Storage Area Network) and a storage control circuit 6902 (illustrated as Storage Controller).
  • SAN Storage Area Network
  • the host 6901 corresponds to a computer that accesses data stored in the storage 6903.
  • the hosts 6901 may be connected to each other via a network.
  • Storage 6903 uses flash memory to reduce data access speed, i.e. the time required to store and output data, but this time is significantly longer than the time required by DRAM, which can be used as cache memory within the storage.
  • cache memory is usually provided within the storage to reduce the time required to store and output data.
  • the above-mentioned cache memory is used in the storage control circuit 6902 and the storage 6903. Data exchanged between the host 6901 and the storage 6903 is stored in the cache memory in the storage control circuit 6902 and the storage 6903, and then output to the host 6901 or the storage 6903.
  • OS transistors as transistors for storing data in the above-mentioned cache memory and configuring it to hold a potential according to the data, it is possible to reduce the frequency of refreshing and lower power consumption.
  • configuring the memory cell array in a stacked structure it is possible to reduce the size.
  • the application of the semiconductor device of one embodiment of the present invention to any one or more selected from electronic components, electronic devices, mainframe computers, space equipment, and data centers is expected to have an effect of reducing power consumption. Therefore, while energy demand is expected to increase with the improvement in performance or high integration of semiconductor devices, the use of the semiconductor device of one embodiment of the present invention can also reduce emissions of greenhouse gases such as carbon dioxide (CO 2 ). In addition, the semiconductor device of one embodiment of the present invention is also effective as a measure against global warming because of its low power consumption.
  • CO 2 greenhouse gases

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