WO2024204324A1 - 積層体の製造方法 - Google Patents

積層体の製造方法 Download PDF

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Publication number
WO2024204324A1
WO2024204324A1 PCT/JP2024/012220 JP2024012220W WO2024204324A1 WO 2024204324 A1 WO2024204324 A1 WO 2024204324A1 JP 2024012220 W JP2024012220 W JP 2024012220W WO 2024204324 A1 WO2024204324 A1 WO 2024204324A1
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Prior art keywords
layer
resin layer
resin
forming
laminate
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Ceased
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PCT/JP2024/012220
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English (en)
French (fr)
Japanese (ja)
Inventor
由奈 松原
裕馬 田中
健太 佐藤
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Sumitomo Bakelite Co Ltd
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Sumitomo Bakelite Co Ltd
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Priority to JP2024549757A priority Critical patent/JPWO2024204324A1/ja
Publication of WO2024204324A1 publication Critical patent/WO2024204324A1/ja
Anticipated expiration legal-status Critical
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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/13—Integrated optical circuits characterised by the manufacturing method
    • G02B6/138—Integrated optical circuits characterised by the manufacturing method by using polymerisation

Definitions

  • the present invention relates to a method for manufacturing a laminate.
  • optical/electrical composite substrate is one in which an optical waveguide is provided on a substrate.
  • Techniques relating to a method for manufacturing an optical waveguide include those described in, for example, Patent Documents 1 to 3.
  • Patent Document 1 describes a method for continuously manufacturing an optical waveguide having an embedded structure in which a core layer is surrounded by a lower clad and an upper clad, the method including the following steps A, B, C, D, and E, and characterized in that steps A, B, C, D, and E are continuously performed.
  • Step A a step of bonding a core layer-containing stamper film having a core layer in a groove of a stamper film on at least one surface thereof, the core layer being formed in the groove, and a laminate having a lower clad photocurable composition layer on one surface of a base film, to bring the core layer into contact with the lower clad photocurable composition layer;
  • Step B a step of curing the lower clad photocurable composition layer by light irradiation in parallel with or after step A;
  • Step C a step of peeling the stamper film from the laminated structure of the core layer-containing stamper film and the laminate after step B;
  • Step D a step of covering the core layer with an upper clad photocurable composition after step C;
  • Step E a step of curing the upper clad photocurable composition by light irradiation after step D.
  • Patent Document 1 The method for manufacturing optical waveguides described in Patent Document 1 is described as being easily adaptable to the manufacture of a wide variety of optical waveguides, and as being capable of manufacturing optical waveguides with high shape accuracy at low cost through a simpler process.
  • Patent Document 2 describes an opto-electrical hybrid board comprising a flexible circuit board in which electrical wiring having mounting pads is formed on the surface of an insulating layer, an element mounted on the mounting pad, and an optical waveguide laminated on the back surface side of the insulating layer, wherein the flexible circuit board is a flexible double-sided circuit board in which electrical wiring is also formed on the back surface of the insulating layer, and a metallic reinforcing layer is plated on at least the portion of the electrical wiring on the back surface side that corresponds to the mounting pad, and the optical waveguide is in contact with the metallic reinforcing layer.
  • an optical-electrical hybrid board According to the optical-electrical hybrid board described in Patent Document 2, a metallic reinforcing layer is adhered to an insulating layer of a flexible circuit board without an adhesive layer, and it is described that an optical-electrical hybrid board can be provided in which elements are properly mounted while suppressing deformation due to a pressure load when the elements are mounted by the metallic reinforcing layer.
  • Patent Document 2 describes a method of preparing a substrate having copper foil 21 formed on both sides of an insulating layer 1 made of a resin such as polyimide, and forming through holes 1a and via holes 1b for an optical path in the substrate (see paragraph 0023 of Patent Document 2).
  • Patent Document 2 also describes a flexible double-sided circuit board E on which a metallic reinforcing layer M is formed (see paragraph 0028 of Patent Document 2).
  • the flexible double-sided circuit board E includes the substrate.
  • Patent Document 2 describes that an undercladding layer 6 is formed on the back side of a flexible double-sided circuit board E in contact with a metal reinforcing layer M that covers the electrical wiring 2B on the back side, and describes that examples of a molding material for the undercladding layer 6 include a photosensitive resin and a thermosetting resin (see paragraph 0029 of Patent Document 2). According to Figures 4 to 6 of Patent Document 2, it can be seen that the molding material for the undercladding layer 6 is filled into a recess formed in the flexible double-sided circuit board E on which the metal reinforcing layer M is formed.
  • Patent Document 3 describes an optoelectronic wiring board that is formed by integrating a rigid section in which conductor circuits and insulating layers are laminated on both sides of a substrate with one or more bendable flex sections, wherein the rigid section is formed with external connection terminals for mounting optical elements and/or package substrates on which optical elements are mounted, and at least one of the flex sections is formed with optical wiring. According to the optoelectronic wiring board of Patent Document 3, it is described that large-volume information processing and high-speed information processing can be suitably performed without increasing the size of the wiring board.
  • Patent Document 3 describes that the rigid section has an optical signal transmitting region formed therein, and that the optical signal transmitting region is filled with a resin composition (see claims 4 and 5 of Patent Document 3). Furthermore, it describes that the optical signal transmitting region is formed so as to penetrate all of the substrates and insulating layers that make up the rigid section (see claim 6 of Patent Document 3).
  • Patent Document 3 describes a substrate 221 consisting of an optical waveguide film 250 and a surrounding resin layer (insulating layer) 221a, and describes that the resin layer 221a constitutes part of the optical signal transmitting regions 242a, 242b (see paragraph 0033 of Patent Document 3).
  • One of the required characteristics for an optical/electrical composite substrate is the suppression of propagation loss.
  • the present invention provides a method for manufacturing a laminate that can reduce the propagation loss of an optical/electrical composite substrate.
  • the present invention provides the following method for producing a laminate.
  • a method for manufacturing a laminate including, in this order, a substrate, a first clad layer of an optical waveguide, and a core layer of the optical waveguide, the method comprising the steps of: A step (A) of laminating the substrate and a film having a resin layer (a) made of a resin composition for forming the first clad layer; A step (B) of photocuring the resin layer (a) after the step (A); and (C) a step of laminating a film including a resin layer (b) made of a resin composition for forming the core layer on a surface of the resin layer (a) opposite to the substrate side after the step (B),
  • the resin layer (b) contains a photopolymerization initiator
  • the present invention provides a method for manufacturing a laminate that can reduce the propagation loss of an optical/electrical composite substrate.
  • 1 is a cross-sectional view showing a schematic example of a structure of an optical/electrical composite substrate according to an embodiment of the present invention.
  • 1A to 1C are cross-sectional views that diagrammatically show an example of a method for producing a laminate according to the present embodiment.
  • 1A to 1C are cross-sectional views that diagrammatically show an example of a method for producing a laminate according to the present embodiment.
  • an optical/electrical composite substrate 200 has an optical waveguide 100 provided on a substrate 110.
  • the optical waveguide 100 has a first cladding layer 20, a core layer 30, and a second cladding layer 40 laminated in this order.
  • the core layer 30 is patterned to have a first core portion 35 and a second core portion 36.
  • the first core portion 35 is a core layer that is a light propagation path
  • the second core portion 36 is a core layer that is not a light propagation path.
  • the core layer pattern may not be formed neatly.
  • the fact that the core layer pattern is not formed neatly means that, for example, the interface between the first core portion 35 and the second core portion 36 is blurred.
  • propagation loss in the optical/electrical composite substrate may occur if the core layer pattern is not formed neatly.
  • the present invention has been made in consideration of the above circumstances, and provides a method for producing a laminate capable of suppressing the propagation loss in an optoelectronic composite substrate.
  • the method for manufacturing a laminate in this embodiment is a method for manufacturing a laminate comprising, in this order, a substrate, a first clad layer of an optical waveguide, and a core layer of the optical waveguide, and comprises the steps of: (A) laminating the substrate and a film comprising a resin layer (a) made of a resin composition for forming the first clad layer; (B) photocuring the resin layer (a) after the step (A); and (C) laminating, after the step (B), a film comprising a resin layer (b) made of a resin composition for forming the core layer on the surface of the resin layer (a) opposite the substrate side, where the resin composition for forming the first clad layer contains a photopolymerization initiator.
  • the core layer pattern is not formed neatly, and propagation loss in the optical/electrical composite substrate may occur.
  • acid derived from the monomer and/or acid generator contained in the first clad layer and/or core layer migrates between the first clad layer and the core layer, resulting in an imperfect pattern being formed in the core layer.
  • a laminate capable of suppressing propagation loss in an optical/electrical composite substrate can be obtained by a method for manufacturing a laminate comprising a step (B) of photocuring a resin layer (a) made of a resin composition for forming a first clad layer prior to a step (C) of laminating a film comprising a resin layer (b) made of a resin composition for forming a core layer.
  • the inventors believe that by incorporating the above-mentioned steps, it is possible to suppress the migration of acid derived from the monomer and/or acid generator between the first clad layer and the core layer, and since the pattern of the core layer is formed neatly, it is possible to suppress the propagation loss of the optical-electrical composite substrate. That is, according to the method for producing a laminate of this embodiment, a laminate capable of suppressing the propagation loss of the optical/electrical composite substrate can be obtained.
  • FIGS. 2 and 3 are cross-sectional views that diagrammatically show an example of a method for producing the laminate of this embodiment. Hereinafter, each step of the method for producing the laminate of this embodiment will be specifically described.
  • Step (A) of laminating a substrate and a film having a resin layer (a) The method for producing the laminate of this embodiment includes a step (A) of laminating a substrate 110 and a film including a resin layer (a) 21 made of a resin composition for forming a first cladding layer.
  • step (A) the method for laminating the substrate 110 and the film having the resin layer (a) 21 is not particularly limited, but a preferred method is to heat and press the workpiece in which the substrate 110 and the film having the resin layer (a) 21 are superimposed.
  • the degree of vacuum when the workpiece is heated and pressed is not particularly limited, and the workpiece may be heated and pressed at normal pressure or under reduced pressure, but it is preferable to heat and press the workpiece under reduced pressure.
  • the degree of vacuum when the workpiece is heated and pressed under reduced pressure is not particularly limited, but is, for example, 500 Pa or less.
  • the pressure when the workpiece is heated and pressed is preferably 0.1 MPa or more, more preferably 0.3 MPa or more, and even more preferably 0.4 MPa or more, from the viewpoint of further improving the adhesion between the substrate 110 and the film having the resin layer (a) 21, and is preferably 10.0 MPa or less, more preferably 8.0 MPa or less, even more preferably 6.0 MPa or less, even more preferably 5.0 MPa or less, even more preferably 3.0 MPa or less, and even more preferably 1.0 MPa or less, from the viewpoint of preventing damage to the substrate.
  • the temperature at which the substrate 110 and the film having the resin layer (a) 21 are laminated is, from the viewpoint of further improving the adhesion between the substrate 110 and the film having the resin layer (a) 21, preferably 80°C or higher, more preferably 100°C or higher, even more preferably 120°C or higher, even more preferably 130°C or higher, and is preferably 180°C or lower, more preferably 160°C or lower, even more preferably 150°C or lower.
  • the time for laminating the substrate 110 and the film having the resin layer (a) 21 is preferably 10 seconds or more, more preferably 30 seconds or more, even more preferably 60 seconds or more, and even more preferably 100 seconds or more, from the viewpoint of further improving the adhesion between the substrate 110 and the film having the resin layer (a) 21, and is preferably 250 seconds or less, more preferably 200 seconds or less, even more preferably 180 seconds or less, and even more preferably 150 seconds or less, from the viewpoint of further improving the productivity.
  • the pressing method is not particularly limited, and may be a flat plate press or a roll press.
  • the device for laminating the film including the substrate 110 and the resin layer (a) 21 is not particularly limited, but is preferably a vacuum laminating device.
  • the substrate 110 is not particularly limited, and examples thereof include a printed circuit board and a flexible substrate, preferably a flexible substrate, and more preferably a flexible double-sided copper-clad laminate.
  • the substrate 110 may have a through hole.
  • the film including the resin layer (a) will be described in detail later.
  • the film including the resin layer (a) may be a film including a layer other than the resin layer (a) 21. That is, the laminate obtained in the step (A) may include a layer other than the substrate 110 and the resin layer (a) 21.
  • Step (B) of photocuring the resin layer (a) The method for producing a laminate according to the present embodiment includes, after step (A), step (B) of photocuring the resin layer (a) 21. That is, step (B) is a step of irradiating the resin layer (a) 21 with light to obtain a cured resin layer (a) 22.
  • the integrated light amount when irradiating with light is, from the viewpoint of further promoting the curing of the resin layer (a), preferably 10 mJ/ cm2 or more, more preferably 30 mJ/ cm2 or more, even more preferably 50 mJ/ cm2 or more, even more preferably 80 mJ/ cm2 or more, and is preferably 1500 mJ/cm2 or less , more preferably 1400 mJ/cm2 or less , even more preferably 1300 mJ/cm2 or less , even more preferably 1200 mJ/cm2 or less , even more preferably 1100 mJ/cm2 or less .
  • the light irradiation time is preferably 5 seconds or more, more preferably 10 seconds or more, and even more preferably 15 seconds or more, from the viewpoint of further promoting the curing of the resin layer (a), and is preferably 300 seconds or less, more preferably 250 seconds or less, and even more preferably 220 seconds or less, from the viewpoint of further improving productivity.
  • the wavelength of light used for the light irradiation is not particularly limited, and may be appropriately adjusted in accordance with the photopolymerization initiator contained in the resin composition for forming the first cladding layer.
  • the wavelength of the light can be, for example, in the range of 300 nm to 420 nm. More specifically, i-line (365 nm), h-line (405 nm), g-line (436 nm), etc. may be irradiated.
  • the resin layer (a) is preferably heated.
  • the resin layer (a) is heated, it may be heated simultaneously with the light irradiation or after the light irradiation.
  • the resin layer (a) is heated after the light irradiation.
  • the temperature to which the resin layer (a) is heated is preferably 100°C or higher, more preferably 120°C or higher, even more preferably 140°C or higher, even more preferably 150°C or higher, and is preferably 180°C or lower, more preferably 170°C or lower.
  • the device for performing light irradiation is not particularly limited, and for example, an exposure device, a UV irradiation device, etc. may be used.
  • Step (C) of laminating a film having a resin layer (b) The method for manufacturing the laminate of this embodiment includes, after step (B), a step (C) of laminating a film having a resin layer (b) 31 made of a resin composition for forming a core layer on the surface of the resin layer (a) 22 opposite the substrate 110. Since the step (C) is carried out after the step (B), in the step (C), the resin layer (a) is a cured resin layer (a) 22 .
  • the resin layer (a) is made of a resin composition for forming the first clad layer
  • the resin layer (b) is made of a resin composition for forming the core layer. Therefore, the laminate 300 obtained in step (C) can also be said to be a laminate 300 including, in this order, a substrate, a first cladding layer of an optical waveguide, and a core layer of an optical waveguide.
  • the method for laminating the film having the resin layer (b) 31 is not particularly limited, but may be a method of heating and pressing a workpiece in which the substrate 110, the resin layer (a) 22, and the film having the resin layer (b) 31 are superimposed.
  • the degree of vacuum when the workpiece is heated and pressed is not particularly limited, and the workpiece may be heated and pressed at normal pressure or under reduced pressure, but it is preferable to heat and press the workpiece under reduced pressure.
  • the degree of vacuum when the workpiece is heated and pressed under reduced pressure is not particularly limited, but is, for example, 500 Pa or less.
  • the pressure when the workpiece is heated and pressed is preferably 0.1 MPa or more, more preferably 0.3 MPa or more, and even more preferably 0.4 MPa or more, from the viewpoint of further improving the adhesion between the film having the resin layer (a) 22 and the resin layer (b) 31, and is preferably 10.0 MPa or less, more preferably 8.0 MPa or less, even more preferably 6.0 MPa or less, even more preferably 5.0 MPa or less, even more preferably 3.0 MPa or less, and even more preferably 1.0 MPa or less, from the viewpoint of preventing damage to the substrate.
  • the temperature at which the film having the resin layer (b) 31 is laminated is preferably 40°C or higher, more preferably 50°C or higher, even more preferably 55°C or higher, from the viewpoint of further improving the adhesion between the resin layer (a) 22 and the film having the resin layer (b) 31, and is preferably 180°C or lower, more preferably 150°C or lower, even more preferably 100°C or lower, even more preferably 80°C or lower.
  • the time for laminating the film having the resin layer (b) 31 is preferably 10 seconds or more, more preferably 20 seconds or more, from the viewpoint of further improving the adhesion between the resin layer (a) 22 and the film having the resin layer (b) 31, and is preferably 100 seconds or less, more preferably 70 seconds or less, and even more preferably 50 seconds or less, from the viewpoint of further improving the productivity.
  • the pressing method is not particularly limited, and may be a flat plate press or a roll press.
  • the device for laminating the film having the resin layer (b) 31 is not particularly limited, but is preferably a vacuum laminating device.
  • the resin layer (b) 31 is made of a resin composition for forming a core layer.
  • the resin contained in the resin layer (b) 31 is not particularly limited, and may be any resin that can be used to form a core layer of an optical waveguide.
  • the resin constituting the resin layer (b) 31 preferably contains a cyclic olefin resin, and more preferably contains a norbornene resin.
  • the resin layer (b) 31 may be in an uncured, semi-cured, or cured state, but is preferably in an uncured or semi-cured state from the viewpoint of further improving the adhesion between the resin layer (a) 22 and the film including the resin layer (b) 31.
  • the resin layer (b) 31 preferably contains a photopolymerization initiator, and more preferably, the photopolymerization initiator contained in the resin layer (b) 31 has the same chemical structure as the photopolymerization initiator contained in the resin composition for forming the first clad layer.
  • the inventors consider that when the photopolymerization initiator contained in resin layer (b) 31 has the same chemical structure as the photopolymerization initiator contained in the resin composition for forming the first clad layer, the acid derived from the photopolymerization initiator can be further inhibited from migrating between the first clad layer and the core layer, and the propagation loss of the resulting optical-electrical composite substrate can be further suppressed.
  • the resin layer (b) 31 may contain components such as antioxidants as appropriate.
  • the film including the resin layer (b) may be a film including a layer other than the resin layer (b) 31, and may further include a base film, for example.
  • the film having the resin layer (b) includes a base film, the handling properties of the film having the resin layer (b) are improved, and contamination of a laminating device can be prevented.
  • the substrate film include a polyethylene terephthalate substrate and a polyimide substrate.
  • Step (D) of heating the resin layer (a) The method for producing the laminate of the present embodiment preferably further includes a step (D) of heating the resin layer (a) 21 between the steps (A) and (B). Since the step (D) is carried out between the step (A) and the step (B), in the step (D), the resin layer (a) is the resin layer (a) 21 before curing.
  • the method for producing a laminate according to the present embodiment includes the step (D), and thus can further suppress the generation of lumps in the resin layer (a). By further suppressing the generation of grains in the resin layer (a), it becomes possible to further suppress the propagation loss of the resulting optical/electrical composite substrate.
  • the temperature to which the resin layer (a) is heated is preferably 120°C or higher, more preferably 125°C or higher, even more preferably 130°C or higher, even more preferably 135°C or higher, and preferably 160°C or lower, more preferably 155°C or lower, even more preferably 150°C or lower, even more preferably 145°C or lower.
  • the time for heating the resin layer (a) is preferably 10 minutes or more, more preferably 20 minutes or more, and from the viewpoint of further improving productivity, is preferably 60 minutes or less, more preferably 50 minutes or less, and even more preferably 40 minutes or less.
  • the method for producing a laminate according to the present embodiment may include other steps in addition to the steps described above. Examples of the other steps include the following steps.
  • the method for producing the laminate of this embodiment may include a step of forming a pattern in the resin layer (b) 31.
  • the step of forming a pattern in the resin layer (b) 31 is carried out, for example, after the step (C).
  • a first core portion 35 and a second core portion 36 are formed in the resin layer (b) 31.
  • the method for forming a pattern in the resin layer (b) 31 is not particularly limited, and examples include exposure methods, etching methods, and replication methods, with exposure methods being preferred.
  • the resin layer (b) may be heat-treated.
  • the method for producing the laminate of the present embodiment may include a step of forming the second clad layer 40 by laminating a film for forming the second clad layer 40 .
  • the step of forming the second cladding layer 40 is performed, for example, after the step of forming a pattern in the resin layer (b) 31 .
  • the second clad layer is preferably laminated so as to be in direct contact with the resin layer (b) 31 (ie, the core layer 30).
  • the method for laminating the film to form the second cladding layer 40 is not particularly limited, but a preferred method is the same as step (A) of this embodiment.
  • the resin composition constituting the second cladding layer 40 is not particularly limited, and may be any resin composition that can be used for a cladding layer of an optical waveguide.
  • the resin composition constituting the second cladding layer 40 may be the same as the resin composition for forming the first cladding layer, or may be a different resin composition.
  • the film for forming the second clad layer 40 may be a film including a layer other than the resin layer for forming the second clad layer, and may further include a base film, for example.
  • the substrate film is preferably a polyimide substrate. If the base film is a polyimide base material, it is possible to use the polyimide base material in the film for forming the second clad layer 40 as the polyimide layer contained in the optoelectronic composite substrate, which is preferable.
  • the method for manufacturing the laminate of this embodiment preferably further includes, after step (C), a step of forming a core layer 30 including a first core portion 35 consisting of an exposed portion of the resin layer (b) 31 and a second core portion 36 consisting of an unexposed portion of the resin layer (b) 31 by irradiating a portion of the resin layer (b) 31 with light, and a step of forming a second clad layer 40 on the core layer 30 including the first core portion 35 and the second core portion 36.
  • the first core portion 35 and the second core portion 36 have a different refractive index depending on whether or not light is irradiated.
  • the difference in refractive index allows the first core portion 35 and the second core portion 36 to be used as a waveguide pattern.
  • the core layer 30 preferably includes a plurality of first core portions 35 and a plurality of second core portions 36, as shown in FIG. 1.
  • the method of irradiating a part of the resin layer (b) 31 with light is not particularly limited, and may be, for example, under the conditions of an integrated light amount of 10 mJ/ cm2 to 1500 mJ/ cm2 and a light irradiation time of 5 seconds to 300 seconds.
  • the wavelength of the light used for light irradiation may be, for example, in the range of 300 nm to 420 nm.
  • the resin layer (b) 31 may be heated after a part of the resin layer (b) 31 is irradiated with light.
  • the resin layer (b) 31 is heated, it is preferable to heat the entire resin layer (b) 31. That is, it is preferable to heat both the exposed portion of the resin layer (b) 31 and the unexposed portion of the resin layer (b) 31.
  • the temperature at which the resin layer (b) 31 is heated may be, for example, 100° C. or higher and 180° C. or lower, and preferably 120° C. or higher and 170° C. or lower.
  • the method for producing the laminate of this embodiment preferably does not include a step of developing the resin layer (b) 31 after step (C). Also, the method for producing the laminate of this embodiment preferably does not include a step of etching the resin layer (b) 31 after step (C).
  • the laminate of this embodiment includes, in this order, a substrate, a first cladding layer of an optical waveguide, and a core layer of the optical waveguide.
  • the first cladding layer of the optical waveguide and the core layer of the optical waveguide also include resin layers for forming the first cladding layer and the core layer, respectively. That is, the first cladding layer of the optical waveguide is a concept that includes the resin layer (a), and the core layer of the optical waveguide is a concept that includes the resin layer (b).
  • the core layer of this embodiment is preferably a core layer including a first core portion consisting of an exposed portion of the resin layer (b) and a second core portion consisting of an unexposed portion of the resin layer (b).
  • the core layer of this embodiment preferably includes a plurality of first core portions and a plurality of second core portions.
  • the laminate of this embodiment may further include other layers, for example, a laminate including a substrate, a first clad layer of an optical waveguide, a core layer of an optical waveguide, and a base film in this order.
  • the laminate of the present embodiment is preferably an optoelectronic composite substrate further comprising a second clad layer on the core layer, i.e., the optoelectronic composite substrate comprises a substrate, a first clad layer of an optical waveguide, a core layer of the optical waveguide, and a second clad layer in this order.
  • the optical/electrical composite substrate of this embodiment may further include a polyimide substrate on the surface of the second clad layer opposite to the core layer.
  • the method for producing the photoelectric composite substrate of this embodiment is not particularly limited, but examples include the methods described in the examples.
  • the thickness of the resin layer (a) is preferably 10 ⁇ m or more, more preferably 15 ⁇ m or more, and even more preferably 20 ⁇ m or more, and from the viewpoint of further improving the optical propagation efficiency of the optical waveguide, it is preferably 200 ⁇ m or less, even more preferably 150 ⁇ m or less, even more preferably 100 ⁇ m or less, even more preferably 80 ⁇ m or less, even more preferably 60 ⁇ m or less, even more preferably 40 ⁇ m or less, and even more preferably 30 ⁇ m or less.
  • the thickness of the resin layer (a) in this specification refers to the thickness in a step prior to step (A).
  • pressing may be performed when laminating the resin layer (a), but the thickness of the resin layer (a) in this specification does not refer to the thickness after pressing.
  • the film having the resin layer (a) of this embodiment preferably further has a base film, and more preferably the resin layer (a) is provided on the base film.
  • the base film may be, for example, a resin film.
  • the resin constituting the base film is not particularly limited, but preferably contains at least one or more types selected from the group consisting of polyimide and polyethylene terephthalate, and more preferably contains polyethylene terephthalate.
  • the thickness of the base film in this embodiment is preferably 10 ⁇ m or more, more preferably 15 ⁇ m or more, even more preferably 20 ⁇ m or more, preferably 30 ⁇ m or more, and is preferably 100 ⁇ m or less, more preferably 80 ⁇ m or less, even more preferably 60 ⁇ m or less, even more preferably 40 ⁇ m or less.
  • the substrate film of this embodiment may be subjected to surface treatment such as antistatic treatment and release treatment.
  • the film having the resin layer (a) of this embodiment can be obtained, for example, by applying a resin composition for forming the first clad layer onto a substrate film, drying it, and forming the resin layer (a).
  • the resin composition is preferably a varnish-like resin composition containing an organic solvent.
  • the organic solvent in the resin composition is removed in the drying process.
  • the coating method include direct coating methods using various coater devices such as a pin coater, a die coater, a comma coater, and a curtain coater, and printing methods such as screen printing.
  • the resin composition for forming the first clad layer of this embodiment will be specifically described.
  • the resin composition for forming the first clad layer of this embodiment contains a photopolymerization initiator.
  • the resin contained in the resin composition for forming the first cladding layer of this embodiment is not particularly limited, and may be any resin that can be used for the cladding layer of an optical waveguide.
  • the resin composition for forming the first clad layer of this embodiment includes, for example, a polyimide resin, a compound having a cyclic ether structure, a norbornene-based resin, a copolymer of a styrene-based monomer and a diene-based monomer, etc., and preferably includes one or more types selected from the group consisting of a polyimide resin and a compound having a cyclic ether structure, and more preferably includes a polyimide resin and a compound having a cyclic ether structure.
  • the polyimide resin of the present embodiment preferably contains an imide ring structure in the molecule.
  • the polyimide resin of the present embodiment preferably contains a fluorinated polyimide, which means a polyimide containing a fluorine atom.
  • the polyimide resin of this embodiment may be a single type of polyimide resin, or may contain two or more types of polyimide resins.
  • the compound having a cyclic ether structure in this embodiment preferably contains at least one or more types selected from the group consisting of epoxy resins and oxetane compounds, and more preferably contains one or more types of epoxy resins.
  • the compound having a cyclic ether structure of this embodiment preferably contains an alicyclic structure in the molecule.
  • the compound having a cyclic ether structure contains an alicyclic structure in the molecule means that it contains an alicyclic structure in addition to the cyclic ether structure.
  • the alicyclic structure of this embodiment includes a condensed ring structure in which a cyclic ether and an aliphatic ring are condensed, and a spiro ring structure in which a cyclic ether and an aliphatic ring are bonded by a spiro bond atom.
  • the number of ring members in the alicyclic structure is not particularly limited, but is preferably a 4- to 10-membered ring, more preferably a 4- to 8-membered ring, even more preferably a 5- or 6-membered ring, and still more preferably a 6-membered ring.
  • the compound having a cyclic ether structure of this embodiment preferably contains two or more cyclic ether structures in the molecule, and more preferably contains two or three cyclic ether structures in the molecule.
  • the compound having a cyclic ether structure in this embodiment may be a compound having one type of cyclic ether structure, or may contain a compound having two or more types of cyclic ether structures.
  • the content of polyimide resin contained in the resin composition for forming the first clad layer of this embodiment is preferably 20 parts by mass or more, more preferably 23 parts by mass or more, even more preferably 25 parts by mass or more, even more preferably 28 parts by mass or more, and is preferably 80 parts by mass or less, more preferably 75 parts by mass or less, even more preferably 70 parts by mass or less, even more preferably 65 parts by mass or less, when the total content of the resin components in the resin composition for forming the first clad layer is 100 parts by mass.
  • the content of the compound having a cyclic ether structure contained in the resin composition for forming the first clad layer of this embodiment is preferably 20 parts by mass or more, more preferably 25 parts by mass or more, even more preferably 30 parts by mass or more, even more preferably 35 parts by mass or more, and is preferably 80 parts by mass or less, more preferably 75 parts by mass or less, when the total content of the resin components in the resin composition for forming the first clad layer is 100 parts by mass.
  • the total content of the polyimide resin and the compound having a cyclic ether structure contained in the resin composition for forming the first clad layer of this embodiment is preferably 80% by mass or more, more preferably 90% by mass or more, even more preferably 95% by mass or more, even more preferably 97% by mass or more, even more preferably 98% by mass or more, and is, for example, less than 100% by mass, when the total content of the non-volatile components in the resin composition for forming the first clad layer is taken as 100% by mass.
  • the resin composition for forming the first clad layer of this embodiment contains a photopolymerization initiator.
  • the photopolymerization initiator is not particularly limited, and a photocationic polymerization initiator, a photoradical polymerization initiator, or the like can be used.
  • the photopolymerization initiator of the present embodiment preferably includes a cationic photopolymerization initiator.
  • the photocationic polymerization initiator includes, for example, a sulfonium salt type polymerization initiator and an iodonium salt type polymerization initiator, preferably a sulfonium salt type polymerization initiator, more preferably a triarylsulfonium salt type polymerization initiator, and further preferably a triphenylsulfonium salt type polymerization initiator.
  • the anion moiety of the photocationic polymerization initiator of this embodiment preferably contains a fluorine atom.
  • the anion moiety of the cationic photopolymerization initiator of this embodiment preferably contains an aryl group.
  • the aryl group has, for example, 6 to 14 carbon atoms (not including the number of carbon atoms of the following substituents), and some of the hydrogen atoms in the aryl group may be substituted with an alkyl group having 1 to 18 carbon atoms, an alkyl group having 1 to 8 carbon atoms substituted with a halogen atom, an alkenyl group having 2 to 18 carbon atoms, an alkynyl group having 2 to 18 carbon atoms, an aryl group having 6 to 14 carbon atoms, a nitro group, a hydroxyl group, a cyano group, an alkoxy group or an aryloxy group represented by -OR1 , an acyl group represented by R2CO- , an acyloxy group represented by R3COO- , an alkylthio group or an arylthio group represented by -
  • R 1 to R 4 are each an alkyl group having 1 to 8 carbon atoms or an aryl group having 6 to 14 carbon atoms
  • R 5 and R 6 are each a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, or an aryl group having 6 to 14 carbon atoms.
  • the aryl group is preferably one in which some of the hydrogen atoms in the aryl group have been substituted with fluorine atoms.
  • the content of the photopolymerization initiator contained in the resin composition for forming the first clad layer is preferably 0.01 parts by mass or more, more preferably 0.03 parts by mass or more, even more preferably 0.05 parts by mass or more, even more preferably 0.07 parts by mass or more, and is preferably 5.00 parts by mass or less, more preferably 3.00 parts by mass or less, even more preferably 1.00 parts by mass or less, even more preferably 0.50 parts by mass or less, even more preferably 0.30 parts by mass or less, even more preferably 0.20 parts by mass or less, even more preferably 0.17 parts by mass or less, from the viewpoint of further suppressing the propagation loss of the photoelectric composite substrate, when the total content of the resin components in the resin composition for forming the first clad layer is taken as 100 parts by mass.
  • the resin composition for forming the first clad layer of this embodiment may contain components such as a surfactant as appropriate.
  • the content of the (meth)acrylic resin in the resin composition for forming the first clad layer is, from the viewpoint of further improving the heat resistance of the resin composition, preferably less than 50 mass%, more preferably less than 30 mass%, even more preferably less than 10 mass%, even more preferably less than 5 mass%, even more preferably less than 1 mass%, even more preferably less than 0.1 mass%, and even more preferably 0 mass%, when the total content of non-volatile components in the resin composition for forming the first clad layer is taken as 100 mass%.
  • the (meth)acrylic resin is a concept including both methacrylic resin and acrylic resin.
  • the resin composition for forming the first clad layer of this embodiment can be obtained, for example, by mixing the components.
  • the obtained polyimide solution was poured into 1,000 g of methanol in a 5 L container while stirring to precipitate a polyimide resin. Thereafter, the solid polyimide resin was filtered using a suction filtration device and washed with 1,000 g of methanol. The solid polyimide resin was then dried at 100° C. for 24 hours using a vacuum dryer and further dried at 200° C. for 3 hours to obtain a powdered polyimide resin (A-1).
  • the weight average molecular weight (Mw) of the polyimide resin (A-1) measured by GPC was 51,000.
  • the polyimide resin (A-1) was measured by 1 H-NMR, and the imidization rate was calculated from the quantitative value of the amide peak relative to the peak of the aromatic ring of the polyimide, and the imidization rate was found to be 99% or more.
  • Polyimide resin (A-1) was dissolved in propylene glycol monomethyl ether acetate to a solid content of 25%, and then coated using an applicator to a film thickness of 30 ⁇ m, followed by drying in an oven at 100° C. for 10 minutes to obtain a polyimide coating film.
  • the refractive index of the obtained coating film was measured using an Abbe refractometer (manufactured by Atago Co., Ltd., product name: NAR-1T SOLID) under conditions of 23° C. and 589 nm, and the refractive index of the polyimide was 1.54.
  • C Photopolymerization initiator
  • C-1 CPI-310B (manufactured by San-Apro Co., Ltd., photocationic polymerization initiator, triarylsulfonium salt)
  • C-2 CPI-310FG (manufactured by San-Apro Ltd., photocationic polymerization initiator, triarylsulfonium salt)
  • F ⁇ Thermal Polymerization Initiator (F)> (F-1) San-Aid SI-110 (manufactured by Sanshin Chemical Industry Co., Ltd., thermal cationic polymerization initiator) (F-2) San-Aid SI-150 (manufactured by Sanshin Chemical Industry Co., Ltd., thermal cationic polymerization initiator)
  • a film having a resin layer (a) used in Example 8 was obtained in the same manner as in the films having a resin layer (a) used in Examples 1 to 7 and Comparative Example 1, except that a polyethylene terephthalate substrate having a thickness of 38 ⁇ m (manufactured by Toyobo Co., Ltd., product name NB213) was used as the PET substrate.
  • Ni catalyst solution 1.56 g (3.2 mmol) of Ni catalyst and 10 mL of dehydrated toluene were weighed into a 100 mL vial, a stirrer tip was inserted and the vial was sealed, and the Ni catalyst was thoroughly stirred to completely dissolve, to obtain a Ni catalyst solution. 1 mL of the Ni catalyst solution was accurately weighed with a syringe, quantitatively injected into the vial in which the above two types of norbornene were dissolved, and stirred at room temperature for 1 hour, whereupon a significant increase in viscosity was confirmed. At this point, the stopper was removed, 60 g of tetrahydrofuran (THF) was added and stirred to obtain a reaction solution.
  • THF tetrahydrofuran
  • acetic anhydride 18 g of hydrogen peroxide (concentration 30%), and 30 g of ion-exchanged water were added to a 100 mL beaker and stirred to prepare an aqueous solution of peracetic acid.
  • the entire amount of the aqueous solution of peracetic acid was added to the reaction solution and stirred for 12 hours to carry out reduction treatment of Ni.
  • the reaction solution after the treatment was transferred to a separatory funnel, and the lower aqueous layer was removed, and then 100 mL of a 30% aqueous solution of isopropyl alcohol was added and vigorously stirred. After the mixture was left to stand and completely separated into two layers, the aqueous layer was removed.
  • the oil layer was dropped into a large excess of acetone to reprecipitate the produced polymer, which was then separated from the filtrate by filtration, and then heated and dried for 12 hours in a vacuum dryer set at 60 ° C. to obtain a polymer for forming a core layer.
  • the molar ratio of each structural unit in the polymer for forming the core layer was identified by NMR measurement and found to be 50 mol% hexylnorbornene structural units and 50 mol% diphenylmethylnorbornene methoxysilane structural units.
  • the resin composition for forming the second clad layer was applied as a varnish using an applicator onto a 25 ⁇ m-thick polyimide substrate (manufactured by UBE Corporation, product name: Upilex 25S) so that the film thickness after drying would be 10 ⁇ m, and then dried at 160° C. for 10 minutes.
  • an OPP cover film manufactured by Oji F-Tex Corporation, product name: E201F-50 ⁇ m was attached to the surface on the side of the resin layer formed by the resin composition, thereby obtaining a film for forming a second clad layer.
  • Examples 1 to 7 ⁇ Step (A) of laminating a substrate and a film having a resin layer (a)> A double-sided copper-clad laminate was placed on a stainless steel plate as a substrate.
  • the OPP cover film of the film having the resin layer (a) of Examples 1 to 7 was peeled off, and the double-sided copper-clad laminate and the film having the resin layer (a) of Examples 1 to 7 were superimposed on each other so that the surface of the double-sided copper-clad laminate opposite to the stainless steel plate was in contact with the resin layer (a) of the film having the resin layer (a) used in Examples 1 to 7.
  • the double-sided copper-clad laminate and the film having the resin layer (a) of Examples 1 to 7 were laminated under conditions of temperature: 140°C, pressure: 0.5 MPa, and time: 120 seconds, respectively, to obtain laminates having a layer structure of "double-sided copper-clad laminate/resin layer (a) (first clad layer)/PET substrate".
  • the PET substrate in the laminate was a PET substrate derived from the film having the resin layer (a) of Examples 1 to 7.
  • the PET substrate surface of each of the laminates having a layer structure of "double-sided copper-clad laminate/resin layer (a) (first clad layer)/PET substrate" in Examples 1 to 7 was irradiated with light under the conditions described in Table 1 using a direct imaging exposure machine (manufactured by SCREEN Co., Ltd., product name: LI-9000), and after the light irradiation, each of the laminates was placed in an oven at 160°C for 30 minutes to photocure the resin layer (a).
  • the PET substrate of the laminate having the layer structure of "double-sided copper-clad laminate/resin layer (a) (first clad layer)/PET substrate" of Examples 1 to 7 was peeled off, and the laminate and the film having the resin layer (b) were superimposed so that the resin layer (a) of the laminate and the resin layer (b) of the film having the resin layer (b) were in contact with each other.
  • the OPP cover film of the film having the resin layer (b) was peeled off.
  • the laminate and the film having the resin layer (b) were laminated using a vacuum laminator (manufactured by Nikko Materials Co., Ltd., product name: CVP-300) under conditions of temperature: 60 ° C., pressure: 0.5 MPa, and time: 30 seconds to obtain each of the laminates of "double-sided copper-clad laminate/resin layer (a) (first clad layer)/resin layer (b) (core layer)/PET substrate".
  • the PET substrate in the laminate is a PET substrate originating from the film having the resin layer (b).
  • ⁇ Step of forming a pattern on the resin layer (b)> The PET substrate was peeled off from the laminate of "double-sided copper-clad laminate/resin layer (a) (first cladding layer)/resin layer (b) (core layer)/PET substrate" of Examples 1 to 7, and 20 lines and spaces, each 9 cm long and 50 ⁇ m wide, were created on the resin layer (b) using a direct imaging exposure machine (manufactured by SCREEN Co., Ltd., product name: LI-9000). The product was then placed in an oven at 150° C. for 30 minutes. When the product was removed from the oven, it was confirmed that a clear waveguide pattern (multiple core portions) with a rectangular cross section appeared on the coating.
  • the laminate and the film for forming a second clad layer were laminated using a vacuum laminator (manufactured by Nikko Materials Co., Ltd., product name: CVP-300) under conditions of temperature: 140°C, pressure: 0.5 MPa, and time: 210 seconds to obtain laminates having a layer structure of "double-sided copper-clad laminate/first clad layer/core layer/second clad layer/polyimide substrate".
  • the polyimide substrate in the laminate is the polyimide substrate derived from the film for forming the second cladding layer.
  • the resulting laminates were used as the optoelectronic composite substrates of Examples 1 to 7.
  • Example 8 An optoelectronic composite substrate of Example 8 was obtained in the same manner as in Examples 1 to 7, except that the step (D) of heating the resin layer (a) was not carried out.
  • the film having the resin layer (a) used in Examples 1 to 8 and Comparative Example 1 and the PET film were laminated using a vacuum laminator (manufactured by Nikko Materials Co., Ltd., product name: CVP-300) under conditions of temperature: 140°C, pressure: 0.5 MPa, and time: 120 seconds to obtain a laminate.
  • the layer structure of the laminate was "PET film/resin layer (a)/PET substrate derived from the film having the resin layer (a)".
  • a laminate of the film having the resin layer (a) used in Example 8 and the PET film was irradiated with light under the conditions described in Table 1 using a direct imaging exposure machine (manufactured by SCREEN Co., Ltd., product name: LI-9000), and after the light irradiation, the resin layer (a) was photocured by placing it in an oven at 160°C for 30 minutes to obtain a sample for appearance evaluation.
  • the treatment of the laminate in Example 8 was a treatment simulating step (B).
  • a laminate that was not treated was used as a sample for evaluating appearance.
  • the resin layer (a) was observed using an optical measuring microscope (manufactured by Mitutoyo Corporation, product name: MF-UA1730THD) for the samples for appearance evaluation of Examples 1 to 8 and Comparative Example 1.
  • the observation results were evaluated according to the following criteria. A (good): no defects (grains about 5 ⁇ m in size) were observed. B (poor): defects (grains about 5 ⁇ m in size) were observed.
  • the results of the appearance evaluation are shown in Table 1.
  • the laminate manufacturing method of this embodiment can obtain a laminate that can suppress the propagation loss of the optical-electrical composite substrate.
  • the appearance evaluation samples of the examples had good results in the appearance evaluation.
  • the inventors believe that because the laminate obtained by the laminate manufacturing method of the examples has a good appearance evaluation, it is possible to suppress the propagation loss of the optical-electrical composite substrate.
  • Second cladding layer 20
  • First clad layer 21
  • Resin layer (a) 22
  • Cured resin layer (a) 30
  • Core layer 31 Resin layer (b) 35
  • First core portion 36
  • Second core portion 40
  • Second cladding layer 100
  • Optical waveguide 110 Substrate 200
  • Opto-electrical composite substrate 300 Laminate

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  • Optical Integrated Circuits (AREA)
  • Laminated Bodies (AREA)
PCT/JP2024/012220 2023-03-31 2024-03-27 積層体の製造方法 Ceased WO2024204324A1 (ja)

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JP2010072369A (ja) * 2008-09-18 2010-04-02 Sumitomo Bakelite Co Ltd 光導波路の製造方法
JP2010072370A (ja) * 2008-09-18 2010-04-02 Sumitomo Bakelite Co Ltd 光導波路
JP2010139970A (ja) * 2008-12-15 2010-06-24 Hitachi Chem Co Ltd 光導波路の製造方法
WO2012070585A1 (ja) * 2010-11-22 2012-05-31 日立化成工業株式会社 光導波路
WO2013105471A1 (ja) * 2012-01-11 2013-07-18 日立化成株式会社 光導波路及びその製造方法

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JP2005128513A (ja) * 2003-09-29 2005-05-19 Sumitomo Bakelite Co Ltd 光導波路の製造方法および光導波路
JP2005164650A (ja) * 2003-11-28 2005-06-23 Sumitomo Bakelite Co Ltd 光導波路の製造方法および光導波路
CN102057306A (zh) * 2008-06-10 2011-05-11 住友电木株式会社 电子设备、便携电话机、挠性电缆、光波导形成体的制造方法

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JP2005331779A (ja) * 2004-05-20 2005-12-02 Ngk Spark Plug Co Ltd 光導波路構造体及びその製造方法並びに光導波路デバイス
JP2010072369A (ja) * 2008-09-18 2010-04-02 Sumitomo Bakelite Co Ltd 光導波路の製造方法
JP2010072370A (ja) * 2008-09-18 2010-04-02 Sumitomo Bakelite Co Ltd 光導波路
JP2010139970A (ja) * 2008-12-15 2010-06-24 Hitachi Chem Co Ltd 光導波路の製造方法
WO2012070585A1 (ja) * 2010-11-22 2012-05-31 日立化成工業株式会社 光導波路
WO2013105471A1 (ja) * 2012-01-11 2013-07-18 日立化成株式会社 光導波路及びその製造方法

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