WO2024143218A1 - 電解コンデンサ - Google Patents

電解コンデンサ Download PDF

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Publication number
WO2024143218A1
WO2024143218A1 PCT/JP2023/046241 JP2023046241W WO2024143218A1 WO 2024143218 A1 WO2024143218 A1 WO 2024143218A1 JP 2023046241 W JP2023046241 W JP 2023046241W WO 2024143218 A1 WO2024143218 A1 WO 2024143218A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
metal foil
electrolytic capacitor
cathode
anode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2023/046241
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
杏 日下部
さおり 上田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Intellectual Property Management Co Ltd
Original Assignee
Panasonic Intellectual Property Management Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Intellectual Property Management Co Ltd filed Critical Panasonic Intellectual Property Management Co Ltd
Priority to CN202380088131.7A priority Critical patent/CN120418909A/zh
Priority to JP2024567754A priority patent/JPWO2024143218A1/ja
Publication of WO2024143218A1 publication Critical patent/WO2024143218A1/ja
Priority to US19/235,189 priority patent/US20250308809A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/15—Solid electrolytic capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/008—Terminals
    • H01G9/012—Terminals specially adapted for solid capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/04—Electrodes or formation of dielectric layers thereon
    • H01G9/042—Electrodes or formation of dielectric layers thereon characterised by the material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/04—Electrodes or formation of dielectric layers thereon
    • H01G9/042—Electrodes or formation of dielectric layers thereon characterised by the material
    • H01G9/0425—Electrodes or formation of dielectric layers thereon characterised by the material specially adapted for cathode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/04—Electrodes or formation of dielectric layers thereon
    • H01G9/042—Electrodes or formation of dielectric layers thereon characterised by the material
    • H01G9/045—Electrodes or formation of dielectric layers thereon characterised by the material based on aluminium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/04—Electrodes or formation of dielectric layers thereon
    • H01G9/048—Electrodes or formation of dielectric layers thereon characterised by their structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/04—Electrodes or formation of dielectric layers thereon
    • H01G9/048—Electrodes or formation of dielectric layers thereon characterised by their structure
    • H01G9/055—Etched foil electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/08—Housing; Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/08—Housing; Encapsulation
    • H01G9/10—Sealing, e.g. of lead-in wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/14—Structural combinations or circuits for modifying, or compensating for, electric characteristics of electrolytic capacitors

Definitions

  • the adhesive strength between the metal foil and the capacitor element (cathode) via the conductive adhesive layer is low. This means that peeling between the metal foil and the capacitor element (hereinafter also referred to as “lamination peeling”) is likely to occur, increasing the contact resistance. In addition, misalignment between the capacitor element and the metal foil (hereinafter also referred to as “lamination misalignment”) is likely to occur when sealing the capacitor element. As a result, the reliability of the electrolytic capacitor is reduced.
  • One aspect of the present disclosure provides a capacitor including a capacitor element having an anode portion and a cathode portion, an exterior body sealing the capacitor element, a metal foil electrically connected to the cathode portion, a first external electrode electrically connected to the metal foil, and a conductive adhesive layer;
  • the present invention relates to an electrolytic capacitor, wherein the metal foil has a through hole penetrating in the thickness direction, the conductive adhesive layer includes a first layer interposed between the cathode portion and a main surface of the metal foil and a second layer filled in the through hole, the first layer and the second layer being integrated, and the metal foil has a first end face exposed from the outer casing, and the first end face is electrically connected to the first external electrode.
  • FIG. 1 is a cross-sectional view illustrating a schematic example of an electrolytic capacitor according to an embodiment of the present disclosure.
  • 2 is an enlarged schematic cross-sectional view of a main portion near a metal foil disposed between adjacent capacitor elements of the element laminate of the electrolytic capacitor shown in FIG. 1 .
  • 2 is an enlarged schematic cross-sectional view of a main portion in the vicinity of a metal foil disposed at one end of the element laminate of the electrolytic capacitor shown in FIG. 1 .
  • FIG. 2 is a top view showing a schematic diagram of an example of a metal foil having one through-hole having a circular cross section.
  • FIG. 2 is a top view showing a schematic diagram of an example of a metal foil having two through holes each having a circular cross section.
  • FIG. 2 is a top view showing a schematic diagram of an example of a metal foil having five through holes each having a circular cross section.
  • FIG. 2 is a top view showing a schematic diagram of an example of a metal foil having three through holes each having a linear cross section.
  • FIG. 2 is a top view showing a schematic diagram of an example of a metal foil having five through holes each having a linear cross section.
  • FIG. 2 is a top view showing a schematic diagram of an example of a metal foil having seven through holes each having a linear cross section.
  • FIG. 2 is a top view showing a schematic diagram of an example of a metal foil having nine through holes each having a linear cross section.
  • FIG. 2 is a top view showing a schematic diagram of an example of a metal foil having eleven through-holes each having a linear cross section.
  • the embodiments of the present disclosure are described using examples, but the present disclosure is not limited to the examples described below.
  • specific numerical values and materials may be exemplified, but other numerical values and materials may be applied as long as the effects of the present disclosure are obtained.
  • the expression "numerical value A to numerical value B" includes numerical value A and numerical value B and can be read as "numerical value A or more and numerical value B or less.”
  • any of the exemplified lower limits and any of the exemplified upper limits can be arbitrarily combined as long as the lower limit is not equal to or greater than the upper limit.
  • one of the materials may be selected and used alone, or two or more of the materials may be used in combination.
  • the present disclosure encompasses a combination of the features described in two or more claims arbitrarily selected from the multiple claims described in the appended claims.
  • the features described in two or more claims arbitrarily selected from the multiple claims described in the appended claims may be combined, provided that no technical contradiction arises.
  • the conductive adhesive layer may be formed, for example, by applying a conductive adhesive to one main surface of the metal foil (the area to be attached to the cathode portion), placing a capacitor element (cathode portion) on top of the conductive adhesive, and then filling the through-hole on the other main surface of the metal foil with the conductive adhesive through the opening of the through-hole. If a capacitor element (cathode portion) is then separately placed on the other main surface of the metal foil, the conductive adhesive may be applied on the conductive adhesive filled in the other main surface of the metal foil and the through-hole, and the capacitor element (cathode portion) may be placed on top of the conductive adhesive.
  • the separation layer may contain, for example, a resin, and may be one of the examples of the exterior body described below.
  • the dielectric layer formed in the porous portion of the first part may be compressed and densified to provide insulation.
  • Laminated samples a1 to a4 had a larger breaking load and higher adhesive strength than laminated sample b1.
  • laminated samples a1 to a3 which had a through-hole ratio of 15% or less, had excellent adhesive strength.

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
PCT/JP2023/046241 2022-12-27 2023-12-22 電解コンデンサ Ceased WO2024143218A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN202380088131.7A CN120418909A (zh) 2022-12-27 2023-12-22 电解电容器
JP2024567754A JPWO2024143218A1 (https=) 2022-12-27 2023-12-22
US19/235,189 US20250308809A1 (en) 2022-12-27 2025-06-11 Electrolytic capacitor

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022210806 2022-12-27
JP2022-210806 2022-12-27

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US19/235,189 Continuation US20250308809A1 (en) 2022-12-27 2025-06-11 Electrolytic capacitor

Publications (1)

Publication Number Publication Date
WO2024143218A1 true WO2024143218A1 (ja) 2024-07-04

Family

ID=91717946

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2023/046241 Ceased WO2024143218A1 (ja) 2022-12-27 2023-12-22 電解コンデンサ

Country Status (4)

Country Link
US (1) US20250308809A1 (https=)
JP (1) JPWO2024143218A1 (https=)
CN (1) CN120418909A (https=)
WO (1) WO2024143218A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0582401A (ja) * 1991-09-20 1993-04-02 Nippon Chemicon Corp 固体電解コンデンサ
WO2017090241A1 (ja) * 2015-11-27 2017-06-01 パナソニックＩｐマネジメント株式会社 電解コンデンサおよびその製造方法
WO2021125045A1 (ja) * 2019-12-18 2021-06-24 株式会社村田製作所 固体電解コンデンサ

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0582401A (ja) * 1991-09-20 1993-04-02 Nippon Chemicon Corp 固体電解コンデンサ
WO2017090241A1 (ja) * 2015-11-27 2017-06-01 パナソニックＩｐマネジメント株式会社 電解コンデンサおよびその製造方法
WO2021125045A1 (ja) * 2019-12-18 2021-06-24 株式会社村田製作所 固体電解コンデンサ

Also Published As

Publication number Publication date
CN120418909A (zh) 2025-08-01
JPWO2024143218A1 (https=) 2024-07-04
US20250308809A1 (en) 2025-10-02

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