WO2024136802A1 - External cooling system for magnetron sputtering systems - Google Patents

External cooling system for magnetron sputtering systems Download PDF

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Publication number
WO2024136802A1
WO2024136802A1 PCT/TR2023/051490 TR2023051490W WO2024136802A1 WO 2024136802 A1 WO2024136802 A1 WO 2024136802A1 TR 2023051490 W TR2023051490 W TR 2023051490W WO 2024136802 A1 WO2024136802 A1 WO 2024136802A1
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Prior art keywords
magnetron sputtering
vacuum chamber
water
cooling
copper
Prior art date
Application number
PCT/TR2023/051490
Other languages
French (fr)
Inventor
Mustafa Tolga YURTCAN
Original Assignee
Atatürk Üni̇versi̇tesi̇ Fi̇kri̇ Mülki̇yet Haklari Koordi̇natörlüğü Döner Sermaye İşletmesi̇
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Filing date
Publication date
Priority claimed from TR2022/020016 external-priority patent/TR2022020016A2/en
Application filed by Atatürk Üni̇versi̇tesi̇ Fi̇kri̇ Mülki̇yet Haklari Koordi̇natörlüğü Döner Sermaye İşletmesi̇ filed Critical Atatürk Üni̇versi̇tesi̇ Fi̇kri̇ Mülki̇yet Haklari Koordi̇natörlüğü Döner Sermaye İşletmesi̇
Publication of WO2024136802A1 publication Critical patent/WO2024136802A1/en

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H01J37/3408—Planar magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3488—Constructional details of particle beam apparatus not otherwise provided for, e.g. arrangement, mounting, housing, environment; special provisions for cleaning or maintenance of the apparatus
    • H01J37/3497—Temperature of target

Definitions

  • the present invention relates to an external cooling system that will prevent the internal water cooling system in magnetron sputtering systems used for commercial and scientific purposes from damaging the vacuum system and/or the magnetron sputtering source as a result of water-related problems, and will enable the system to be cooled much more effectively with the help of heat pipes, thermoelectric modules and water circulationfrom outside the vacuum chamber.
  • Magnetron sputtering systems are used for commercial and scientific purposes for deposition (coating) of a target material onto a substrate in a vacuum chamber. Therefore, it has unlimited applications in R&D, medical, military and commercial applications, especially in the semiconductor industry.
  • an inert gas (usually argon) is sent into the environment to ablate the deposition material from the surface of the target material and these atoms, ionized under high voltage, hit the surface of the target material placed on the cathode and sputter the deposition material and deposit the same on the surface to be coated, i.e. the substrate.
  • an inert gas usually argon
  • DC direct current
  • AC alternating current
  • RF radio frequency
  • neodymium magnets of opposite polarity are used to guide the ionized atoms to the target material. Most of the power sent to the system is released as heat.
  • the maximum operating temperatures at which neodymium magnets can maintain their magnetic fields vary depending on the type (Standard 80 °C, M 100 °C, H 120 °C, SH 150 °C, UH 180 °C, EH 200 °C and VH/AH 230 °C). Uncoated neodymium magnets corrode easily, while the epoxy coating, which provides the best protection against water, limits the maximum operating temperature to 150 °C. For this reason, nickel plating is mostly preferred in neodymium magnets.
  • Heat generated during system operation is transferred to protect both the target material and the neodymium magnets.
  • the direct water cooling method the cooling water contacts the metal if the target material is metal, or the copper support plate placed behind it if the target material is not metal.
  • the indirect water cooling method water cools the cathode to which voltage is applied and the insulated cathode body is used for heat transfer.
  • a flange called a sputter gun or sputter source containing these components is placed in the vacuum chamber.
  • the present invention relates to a cooling system which fulfills the abovementioned requirements, eliminates all disadvantages and brings some additional advantages.
  • Magnetron sputtering systems are deposition systems used for commercial and scientific purposes and have an internal water cooling system. As a result of possible problems with water, the vacuum system and/or magnetron sputtering source may be damaged. With the prepared external cooling system, water does not enter the vacuum chamber and cooling is carried out much more effectively from outside the vacuum chamber with the help of heat pipes, thermoelectric modules and external water circulation.
  • the primary aim of the present invention is to move water cooling out of the vacuum chamber in order to eliminate water-related risks and problems.
  • Another aim of the present invention is to use water only for cooling thermoelectric modules located outside the vacuum chamber to prevent any water-related problems from damaging the vacuum system or magnetron sputtering source.
  • Another aim of the present invention is to provide much more effective cooling externally from outside of the vacuum chamber.
  • Another aim of the present invention is to eliminate all the problems that may occur with the use of water by not using any material other than copper rods and plates in the vacuum chamber for heat conduction.
  • Another aim of the present invention is to cool the water used in the closed circuit above the freezing temperature with another thermoelectric module, if necessary, and to reach much lower temperatures on the cold surface of the thermoelectric module.
  • the invention relates to a system for the external cooling of magnetron sputtering systems used for commercial and scientific purposes by using thermoelectric modules and heat pipes outside the vacuum chamber by water.
  • the invention is a system that eliminates the risks in magnetron sputtering systems by allowing water cooling to take place outside the vacuum chamber.
  • the invention is an external cooling system for magnetron sputtering systems.
  • FIG 1 shows the atmosphere side of the magnetron sputtering source, with the thermoelectric module, the heat transfer tubes and the external water circulation cooling system.
  • the system given in Figure 1 i.
  • the water block will make physical contact with the heated thermoelectric module and transfer the heat to the water circulation by the closed circuit water cooling system. In this way, by cooling the hot surface of the thermoelectric module, it will help the cold surface to reach lower temperatures.
  • Thermoelectric modules are semiconductor materials that transfer heat on their opposite surfaces as a result of the applied potential difference (usually 5-16V DC) and thus provide cooling of small surfaces (The Peltier effect).
  • thermoelectric module At room temperature, while one side of the thermoelectric module heats up with the applied potential, the other side cools down and can easily reach low temperature values, and much lower temperatures (negative Celsius) can be reached by using multiple thermoelectric modules.
  • the thermoelectric module will be used so as to cool the cathode to temperatures previously unattainable with water cooling methods.
  • Thermoelectric module DC power input will be used to easily achieve the required cooling with the help of applied low voltage (12V).
  • the thermally conductive silicone pad will be used for electrical insulation due to its high dielectric coefficient, while its high thermal conductivity allows heat to be easily transferred between the surfaces it comes into contact with. v.
  • the bottom copper plate will be used to transfer the heat of the cathode to the thermoelectric module by contacting the cold surface of the thermoelectric module with the help of a thermally conductive silicone pad.
  • the most important reason for using copper is that the thermal conductivity of copper is very high.
  • AI2O3 (alumina) insulation will provide both thermal and electrical insulation of copper. Thermal insulation will reduce the heating of the copper plate by being affected by the room temperature, and electrical insulation will insulate the cathode with high voltage and prevent the risks that may occur. vi.
  • the copper rods will provide heat transfer between the bottom and middle copper plate spot welded through the flange.
  • the most important reason for using copper is that the thermal conductivity of copper is very high.
  • Alumina insulation will provide both thermal and electrical insulation of the copper.
  • the HN connector is a standard connector used in sputtering systems to transfer high direct (DC) and alternating (AC/RF) voltage from outside the vacuum chamber to the cathode.
  • the flange will be used for sealing the vacuum chamber and separating the vacuum chamber from the atmosphere, and at the same time it will help insulated electricity and heat transfer with the help of the feedthroughs thereon.
  • Figure 2 shows the vacuum side of the magnetron sputtering source, with the external water and thermoelectric module cooled system.
  • the system given in Figure 2 consists of the following; ix.
  • the DC/RF power input will be used to physically connect the HN Connector to the cathode.
  • Anode/Housing will make physical contact with the anode of the HN Connector to form the anode, but will not contact the neodymium magnets, the middle copper plate and copper ring and will act as the housing by enclosing.
  • xi. The middle copper plate has two main purposes, the first of which is to remove the heat of the copper ring and magnets out of the vacuum chamber with thermal conductivity by placing the same under the magnets, and the other is to act as a cathode by making contact with the DC/RF Power input.
  • xii The middle copper plate has two main purposes, the first of which is to remove the heat of the copper ring and magnets out of the vacuum chamber with thermal conductivity by placing the same under the magnets, and the other is to act as a cathode by making contact with the DC/RF Power input.
  • Neodymium magnets will be used as magnetic deflectors so as to guide the ionized atoms into the target material.
  • the copper ring will make physical contact with the middle copper plate and the top copper plate, aligning the magnets and allowing heat and electricity to conduct between the plates.
  • xiv. The top copper plate and copper ring with 1 mm height will be spot welded to each other.
  • the copper ring with 1 mm height will have the same inner and outer diameter as the copper ring placed between the magnets. In this way, a 1 mm height copper ring will be easily placed in the groove between the magnets and heat and electricity will be transmitted.
  • the easily removable top copper plate will allow the target material to be taken out of the vacuum chamber for easy replacement.
  • the system will use a water block (i) in the outermost layer to take the cooling system out of the vacuum chamber and the closed circuit water cooling system currently used in magnetron sputtering systems will be used externally, by placing the heated surface of the thermoelectric module (ii) on the water block and applying a low DC voltage (12V) (iii), and the required cooling will be provided by increasing the number of thermoelectric modules.
  • the ceramic cold surface of the thermoelectric module will make thermal contact with the usage of the same dimensioned thermally conductive silicon pad (iv) to the bottom copper plate (v).
  • the components (i-v) under the copper rods will be clamped to keep them in contact, and the cooled bottom copper plate (v) will enter the vacuum chamber through spot welding to the copper rods (vi) and middle copper plate (xi) placed under the magnets (xii).
  • a copper ring (xiii) which will be placed between the outer and inner neodymium magnets with a height of approximately 1 mm less than the magnets, will be spot welded to the middle copper plate (xi) under the magnet and the heat conduction between the thermoelectric module (ii) and the copper ring (xiii) will be provided entirely through copper.
  • Alumina which has very high thermal and electrical insulation, will be responsible for achieving the electrical and thermal insulation of the copper components (v-vi) with the external environment.
  • the middle copper plate (xi) in contact with the DC/RF power input (ix), the neodymium magnets (xii), the copper ring (xiii) and the top copper plate and copper ring with 1 mm height (xiv) form the cathode, while the housing (x), which has no physical contact with them and is placed outside them, will act as the anode, a 1 mm high copper ring (xiv) spot welded to the underside of the top copper plate to be placed on the neodymium magnets (xii) will easily fit into the copper groove between the magnets, allowing the target material to be easily removed and replaced from the vacuum chamber.
  • the high power input for magnetron sputtering will be provided by the standard HN connector (vii) which is electrically isolated from the flange (viii).

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  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
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Abstract

The present invention relates to an external cooling system for magnetron sputtering systems, which is used in magnetron sputtering systems for coating the target material on a substrate in a vacuum chamber for commercial and scientific purposes, where water cooling is used to cool thermoelectric modules located outside the vacuum chamber, preventing water-related problems from damaging the vacuum system and/or magnetron sputtering source, and providing a much more effective cooling externally outside the vacuum chamber.

Description

DESCRIPTION
EXTERNAL COOLING SYSTEM FOR MAGNETRON SPUTTERING SYSTEMS
Field of the Invention
The present invention relates to an external cooling system that will prevent the internal water cooling system in magnetron sputtering systems used for commercial and scientific purposes from damaging the vacuum system and/or the magnetron sputtering source as a result of water-related problems, and will enable the system to be cooled much more effectively with the help of heat pipes, thermoelectric modules and water circulationfrom outside the vacuum chamber.
State of the Art
Magnetron sputtering systems are used for commercial and scientific purposes for deposition (coating) of a target material onto a substrate in a vacuum chamber. Therefore, it has unlimited applications in R&D, medical, military and commercial applications, especially in the semiconductor industry.
In the magnetron sputtering method, an inert gas (usually argon) is sent into the environment to ablate the deposition material from the surface of the target material and these atoms, ionized under high voltage, hit the surface of the target material placed on the cathode and sputter the deposition material and deposit the same on the surface to be coated, i.e. the substrate. If the material to be coated is conductive, direct current (DC) is used, if not, alternating current (AC) is used. Since alternating current is in the radio frequency (RF) range, it is also called RF Sputtering.
At the cathode, where the target material is placed, powerful neodymium magnets of opposite polarity are used to guide the ionized atoms to the target material. Most of the power sent to the system is released as heat. The maximum operating temperatures at which neodymium magnets can maintain their magnetic fields vary depending on the type (Standard 80 °C, M 100 °C, H 120 °C, SH 150 °C, UH 180 °C, EH 200 °C and VH/AH 230 °C). Uncoated neodymium magnets corrode easily, while the epoxy coating, which provides the best protection against water, limits the maximum operating temperature to 150 °C. For this reason, nickel plating is mostly preferred in neodymium magnets.
Heat generated during system operation is transferred to protect both the target material and the neodymium magnets. There are two main internal water cooling methods used for this heat transfer. In the direct water cooling method, the cooling water contacts the metal if the target material is metal, or the copper support plate placed behind it if the target material is not metal. In the indirect water cooling method, water cools the cathode to which voltage is applied and the insulated cathode body is used for heat transfer.
In order to water cool the target material and the components exposed to high voltage, a flange called a sputter gun or sputter source containing these components is placed in the vacuum chamber.
Although direct water cooling used in magnetron sputtering systems is more effective, it is risky due to the possibility of breakdown of the vacuum seal and target material replacement. With indirect water cooling, the cooling efficiency is much lower, limiting the power used for coating and greatly reducing the coating speed. Another problem with the water used in magnetron sputtering systems is that the water used must remain in a fluid state as it circulates in the closed circuit, so a much higher amount of cooling cannot be achieved.
Regardless of the type, internal water cooling used in a high voltage environment involves high risk. Dissolved substances in impure water will change the cathode resistance and hence the coating rate and may accumulate at the cathode and cause overheating of the sputtering device. If the vacuum seal is broken due to high temperature or failure of the cooling system, the water used for cooling will enter the vacuum chamber. As a result, high voltage will cause arcing and corrosion in the system and will damage even the pumps used for vacuum, rendering the system unusable. The water cooling systems used in the known state of the art are internal and there is no external system.
When the studies in the present art are examined, it is seen that an effective and safe cooling system is needed in magnetron sputtering systems.
Brief Description of the Invention
The present invention relates to a cooling system which fulfills the abovementioned requirements, eliminates all disadvantages and brings some additional advantages. Magnetron sputtering systems are deposition systems used for commercial and scientific purposes and have an internal water cooling system. As a result of possible problems with water, the vacuum system and/or magnetron sputtering source may be damaged. With the prepared external cooling system, water does not enter the vacuum chamber and cooling is carried out much more effectively from outside the vacuum chamber with the help of heat pipes, thermoelectric modules and external water circulation.
The primary aim of the present invention is to move water cooling out of the vacuum chamber in order to eliminate water-related risks and problems.
Another aim of the present invention is to use water only for cooling thermoelectric modules located outside the vacuum chamber to prevent any water-related problems from damaging the vacuum system or magnetron sputtering source.
Another aim of the present invention is to provide much more effective cooling externally from outside of the vacuum chamber.
Another aim of the present invention is to eliminate all the problems that may occur with the use of water by not using any material other than copper rods and plates in the vacuum chamber for heat conduction.
Another aim of the present invention is to cool the water used in the closed circuit above the freezing temperature with another thermoelectric module, if necessary, and to reach much lower temperatures on the cold surface of the thermoelectric module. The structural and characteristic features of the present invention will be clearly understood by the following detailed description. Therefore the evaluation shall be made by taking this detailed description into consideration.
Detailed Description of the Invention
In this detailed explanation, the external cooling system for magnetron sputtering systems is described for a better understanding of the subject and without any limiting effect.
The invention relates to a system for the external cooling of magnetron sputtering systems used for commercial and scientific purposes by using thermoelectric modules and heat pipes outside the vacuum chamber by water.
In its most preferred form, the invention is a system that eliminates the risks in magnetron sputtering systems by allowing water cooling to take place outside the vacuum chamber.
More preferably, the invention is an external cooling system for magnetron sputtering systems.
Figure 1 shows the atmosphere side of the magnetron sputtering source, with the thermoelectric module, the heat transfer tubes and the external water circulation cooling system. The system given in Figure 1 ; i. The water block will make physical contact with the heated thermoelectric module and transfer the heat to the water circulation by the closed circuit water cooling system. In this way, by cooling the hot surface of the thermoelectric module, it will help the cold surface to reach lower temperatures. ii. Thermoelectric modules are semiconductor materials that transfer heat on their opposite surfaces as a result of the applied potential difference (usually 5-16V DC) and thus provide cooling of small surfaces (The Peltier effect). At room temperature, while one side of the thermoelectric module heats up with the applied potential, the other side cools down and can easily reach low temperature values, and much lower temperatures (negative Celsius) can be reached by using multiple thermoelectric modules. The thermoelectric module will be used so as to cool the cathode to temperatures previously unattainable with water cooling methods. iii. Thermoelectric module DC power input will be used to easily achieve the required cooling with the help of applied low voltage (12V). iv. The thermally conductive silicone pad will be used for electrical insulation due to its high dielectric coefficient, while its high thermal conductivity allows heat to be easily transferred between the surfaces it comes into contact with. v. The bottom copper plate will be used to transfer the heat of the cathode to the thermoelectric module by contacting the cold surface of the thermoelectric module with the help of a thermally conductive silicone pad. The most important reason for using copper is that the thermal conductivity of copper is very high. AI2O3 (alumina) insulation will provide both thermal and electrical insulation of copper. Thermal insulation will reduce the heating of the copper plate by being affected by the room temperature, and electrical insulation will insulate the cathode with high voltage and prevent the risks that may occur. vi. The copper rods will provide heat transfer between the bottom and middle copper plate spot welded through the flange. The most important reason for using copper is that the thermal conductivity of copper is very high. Alumina insulation will provide both thermal and electrical insulation of the copper. Thermal insulation will reduce the heating of copper rods affected by room temperature, and electrical insulation will insulate the cathode with high voltage and prevent the risks that may occur. vii. The HN connector is a standard connector used in sputtering systems to transfer high direct (DC) and alternating (AC/RF) voltage from outside the vacuum chamber to the cathode. viii. The flange will be used for sealing the vacuum chamber and separating the vacuum chamber from the atmosphere, and at the same time it will help insulated electricity and heat transfer with the help of the feedthroughs thereon.
Figure 2 shows the vacuum side of the magnetron sputtering source, with the external water and thermoelectric module cooled system.
The system given in Figure 2 consists of the following; ix. The DC/RF power input will be used to physically connect the HN Connector to the cathode. x. Anode/Housing will make physical contact with the anode of the HN Connector to form the anode, but will not contact the neodymium magnets, the middle copper plate and copper ring and will act as the housing by enclosing. xi. The middle copper plate has two main purposes, the first of which is to remove the heat of the copper ring and magnets out of the vacuum chamber with thermal conductivity by placing the same under the magnets, and the other is to act as a cathode by making contact with the DC/RF Power input. xii. Neodymium magnets will be used as magnetic deflectors so as to guide the ionized atoms into the target material. xiii. The copper ring will make physical contact with the middle copper plate and the top copper plate, aligning the magnets and allowing heat and electricity to conduct between the plates. xiv.The top copper plate and copper ring with 1 mm height will be spot welded to each other. The copper ring with 1 mm height will have the same inner and outer diameter as the copper ring placed between the magnets. In this way, a 1 mm height copper ring will be easily placed in the groove between the magnets and heat and electricity will be transmitted. The easily removable top copper plate will allow the target material to be taken out of the vacuum chamber for easy replacement. As a working principle, the system will use a water block (i) in the outermost layer to take the cooling system out of the vacuum chamber and the closed circuit water cooling system currently used in magnetron sputtering systems will be used externally, by placing the heated surface of the thermoelectric module (ii) on the water block and applying a low DC voltage (12V) (iii), and the required cooling will be provided by increasing the number of thermoelectric modules. The ceramic cold surface of the thermoelectric module will make thermal contact with the usage of the same dimensioned thermally conductive silicon pad (iv) to the bottom copper plate (v). The components (i-v) under the copper rods will be clamped to keep them in contact, and the cooled bottom copper plate (v) will enter the vacuum chamber through spot welding to the copper rods (vi) and middle copper plate (xi) placed under the magnets (xii). To form the groove, a copper ring (xiii), which will be placed between the outer and inner neodymium magnets with a height of approximately 1 mm less than the magnets, will be spot welded to the middle copper plate (xi) under the magnet and the heat conduction between the thermoelectric module (ii) and the copper ring (xiii) will be provided entirely through copper. Alumina, which has very high thermal and electrical insulation, will be responsible for achieving the electrical and thermal insulation of the copper components (v-vi) with the external environment.)
The middle copper plate (xi) in contact with the DC/RF power input (ix), the neodymium magnets (xii), the copper ring (xiii) and the top copper plate and copper ring with 1 mm height (xiv) form the cathode, while the housing (x), which has no physical contact with them and is placed outside them, will act as the anode, a 1 mm high copper ring (xiv) spot welded to the underside of the top copper plate to be placed on the neodymium magnets (xii) will easily fit into the copper groove between the magnets, allowing the target material to be easily removed and replaced from the vacuum chamber. The high power input for magnetron sputtering will be provided by the standard HN connector (vii) which is electrically isolated from the flange (viii).
With the external cooling system for magnetron sputtering systems having all these features, by using water cooling in the magnetron sputtering systems subject to the invention for cooling the thermoelectric modules located outside the vacuum chamber, the problems that may be experienced with water will be prevented from damaging the vacuum system and/or the magnetron sputtering source, in addition, a much more effective cooling will be provided externally outside the vacuum chamber and the existing problems specific to this process will be eliminated.
With the system of the present invention, the negative effects caused by water cooling used in the field of the invention are eliminated and improvements are provided in R&D, medical, military and commercial applications, especially in the semiconductor industry.

Claims

1. External cooling system for magnetron sputtering systems, a system that uses water cooling in magnetron sputtering systems to cool thermoelectric modules located outside the vacuum chamber to prevent water-related problems from damaging the vacuum system and/or the magnetron sputtering source and to provide a much more effective cooling externally outside the vacuum chamber, characterized in that; the system comprises of the following; i. Water block, ii. Thermoelectric modules iii. Thermoelectric module DC power input iv. Thermal conductive silicone pad v. Bottom copper plate vi. Copper rods vii. HN connector viii. Flange ix. DC/RF power input x. Anode/Housing xi. Middle copper plate xii. Neodymium magnets xiii. Copper ring xiv. Top copper plate and copper ring with 1 mm height
2. Method according to claim 1 , characterized in that; the cooling system is a system that is outside the vacuum chamber.
PCT/TR2023/051490 2022-12-22 2023-12-07 External cooling system for magnetron sputtering systems WO2024136802A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TR2022020016 2022-12-22
TR2022/020016 TR2022020016A2 (en) 2022-12-22 EXTERNAL COOLING SYSTEM FOR MAGNETRON SPOTTING SYSTEMS

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JP2015086471A (en) * 2013-10-28 2015-05-07 ベイパー テクノロジーズ、インコーポレイテッド Low pressure arc plasma immersion coat vapor deposition and ion processing
CN107151784A (en) * 2017-05-26 2017-09-12 中国电子科技集团公司第四十八研究所 A kind of negative electrode magnetron sputtering target assembly

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JP2015086471A (en) * 2013-10-28 2015-05-07 ベイパー テクノロジーズ、インコーポレイテッド Low pressure arc plasma immersion coat vapor deposition and ion processing
CN107151784A (en) * 2017-05-26 2017-09-12 中国电子科技集团公司第四十八研究所 A kind of negative electrode magnetron sputtering target assembly

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