WO2024104594A1 - Procédé et dispositif de liaison de substrats - Google Patents
Procédé et dispositif de liaison de substrats Download PDFInfo
- Publication number
- WO2024104594A1 WO2024104594A1 PCT/EP2022/082396 EP2022082396W WO2024104594A1 WO 2024104594 A1 WO2024104594 A1 WO 2024104594A1 EP 2022082396 W EP2022082396 W EP 2022082396W WO 2024104594 A1 WO2024104594 A1 WO 2024104594A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- substrate
- substrate holder
- bonding
- substrates
- fixing
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 512
- 238000000034 method Methods 0.000 title claims abstract description 74
- 230000005484 gravity Effects 0.000 claims description 28
- 238000012546 transfer Methods 0.000 claims description 6
- 238000013461 design Methods 0.000 description 13
- 235000012431 wafers Nutrition 0.000 description 9
- 230000000694 effects Effects 0.000 description 8
- 239000000463 material Substances 0.000 description 6
- 230000007547 defect Effects 0.000 description 5
- 238000013459 approach Methods 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- 238000007600 charging Methods 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 238000005280 amorphization Methods 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 238000009832 plasma treatment Methods 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 230000002269 spontaneous effect Effects 0.000 description 2
- 238000012876 topography Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000007786 electrostatic charging Methods 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 230000002040 relaxant effect Effects 0.000 description 1
- 230000000284 resting effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 230000002277 temperature effect Effects 0.000 description 1
- 238000013519 translation Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
L'invention concerne un procédé et un dispositif de collage de substrats.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/EP2022/082396 WO2024104594A1 (fr) | 2022-11-18 | 2022-11-18 | Procédé et dispositif de liaison de substrats |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/EP2022/082396 WO2024104594A1 (fr) | 2022-11-18 | 2022-11-18 | Procédé et dispositif de liaison de substrats |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2024104594A1 true WO2024104594A1 (fr) | 2024-05-23 |
Family
ID=84389143
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/EP2022/082396 WO2024104594A1 (fr) | 2022-11-18 | 2022-11-18 | Procédé et dispositif de liaison de substrats |
Country Status (1)
| Country | Link |
|---|---|
| WO (1) | WO2024104594A1 (fr) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6383890B2 (en) | 1997-12-26 | 2002-05-07 | Canon Kabushiki Kaisha | Wafer bonding method, apparatus and vacuum chuck |
| DE102004009647A1 (de) * | 2003-02-28 | 2004-09-30 | Canon K.K. | Bondsystem und Halbleitersubstratherstellungsvefahren |
| KR20050099384A (ko) * | 2004-04-09 | 2005-10-13 | 박재근 | 기판 접착 장치 |
| US8918989B2 (en) | 2009-04-25 | 2014-12-30 | Ev Group Gmbh | Device for aligning and pre-fixing a wafer |
| US20150122412A1 (en) * | 2013-11-01 | 2015-05-07 | Nikon Corporation | System and method for clamping wafers together in alignment using pressure |
| WO2015183197A1 (fr) | 2014-05-27 | 2015-12-03 | Fa Systems Automation (S) Pte Ltd | Appareil et procédé d'empilage de plaquettes |
| US9613840B2 (en) | 2011-08-12 | 2017-04-04 | Ev Group E. Thallner Gmbh | Apparatus and method for bonding substrates |
-
2022
- 2022-11-18 WO PCT/EP2022/082396 patent/WO2024104594A1/fr unknown
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6383890B2 (en) | 1997-12-26 | 2002-05-07 | Canon Kabushiki Kaisha | Wafer bonding method, apparatus and vacuum chuck |
| DE102004009647A1 (de) * | 2003-02-28 | 2004-09-30 | Canon K.K. | Bondsystem und Halbleitersubstratherstellungsvefahren |
| KR20050099384A (ko) * | 2004-04-09 | 2005-10-13 | 박재근 | 기판 접착 장치 |
| US8918989B2 (en) | 2009-04-25 | 2014-12-30 | Ev Group Gmbh | Device for aligning and pre-fixing a wafer |
| US9613840B2 (en) | 2011-08-12 | 2017-04-04 | Ev Group E. Thallner Gmbh | Apparatus and method for bonding substrates |
| US20150122412A1 (en) * | 2013-11-01 | 2015-05-07 | Nikon Corporation | System and method for clamping wafers together in alignment using pressure |
| WO2015183197A1 (fr) | 2014-05-27 | 2015-12-03 | Fa Systems Automation (S) Pte Ltd | Appareil et procédé d'empilage de plaquettes |
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