WO2024104285A1 - Antenna assembly, interactive tablet and electronic device - Google Patents
Antenna assembly, interactive tablet and electronic device Download PDFInfo
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- WO2024104285A1 WO2024104285A1 PCT/CN2023/131197 CN2023131197W WO2024104285A1 WO 2024104285 A1 WO2024104285 A1 WO 2024104285A1 CN 2023131197 W CN2023131197 W CN 2023131197W WO 2024104285 A1 WO2024104285 A1 WO 2024104285A1
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- Prior art keywords
- antenna
- antenna unit
- clearance area
- antenna assembly
- assembly according
- Prior art date
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- 239000000758 substrate Substances 0.000 claims abstract description 41
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- 101100012902 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) FIG2 gene Proteins 0.000 description 2
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
- H01Q5/20—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements characterised by the operating wavebands
- H01Q5/28—Arrangements for establishing polarisation or beam width over two or more different wavebands
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2291—Supports; Mounting means by structural association with other equipment or articles used in bluetooth or WI-FI devices of Wireless Local Area Networks [WLAN]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
- H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
- H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
- H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/48—Earthing means; Earth screens; Counterpoises
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
- H01Q5/20—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements characterised by the operating wavebands
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
- H01Q5/50—Feeding or matching arrangements for broad-band or multi-band operation
Definitions
- the present application relates to the field of antenna technology, for example, to an antenna assembly, an interactive tablet and an electronic device.
- wireless communication technology is applied in many fields such as interactive tablets.
- the realization of wireless communication technology requires the support of antennas.
- the screen ratio of interactive tablets is required to be higher and higher, and the development trend is gradually moving towards full screen.
- the purpose of the embodiments of the present application is to provide an antenna assembly, an interactive tablet and an electronic device to solve the problem in the related art that the same antenna board cannot simultaneously realize WiFi function, Bluetooth communication function and AP function.
- an antenna assembly comprising:
- a dielectric substrate wherein a first surface of the dielectric substrate is provided with a ground plane, and a first clearance area and a second clearance area located in the ground plane;
- a radio frequency chip wherein the radio frequency chip is arranged on the dielectric substrate;
- the first antenna module includes a first antenna unit and a second antenna unit;
- the second antenna module is connected to the radio frequency chip, and the second antenna module includes a third antenna unit and a fourth antenna unit.
- the antenna assembly of the embodiment of the present application can transform a single-module dual antenna into a dual-module four antenna without changing the area of the clearance zone and ensuring the antenna radiation efficiency, thereby realizing WiFi function, AP function and Bluetooth communication function on the same antenna board, greatly reducing the product production cost.
- the first antenna module is disposed in the first clearance area to implement WiFi communication functions and Bluetooth communication functions.
- the second antenna module is disposed in the second clearance area to implement wireless AP function. able.
- the antenna assembly further comprises:
- a metal resonant cavity is provided on the second surface of the dielectric substrate, and in a direction perpendicular to the second surface, the first clearance area and/or the second clearance area is located in the metal resonant cavity.
- projections of the first clearance region and the second clearance region on the metal resonant cavity are both located within the outer contour of the metal resonant cavity.
- the first antenna module includes a first antenna unit and a second antenna unit disposed in the first clearance area.
- the first antenna module further includes an isolation ground branch, and the isolation ground branch is arranged between the first antenna unit and the second antenna unit to improve the isolation between the first antenna unit and the second antenna unit.
- the first clearance area is a rectangle
- the first antenna unit is in contact with a first side of the rectangle
- the second antenna unit is in contact with a second side of the rectangle
- the second side is perpendicular to the first side
- one end of the isolated ground branch contacts an intersection of the first side and the second side.
- the first antenna unit is connected to the RF chip via a first coplanar waveguide transmission line
- the second antenna unit is connected to the RF chip via a second coplanar waveguide transmission line.
- impedance matching circuits are provided on both the first coplanar waveguide transmission line and the second coplanar waveguide transmission line.
- the second antenna module includes a third antenna unit and a fourth antenna unit disposed in the second clearance area.
- the third antenna unit is connected to the RF chip via a third coplanar waveguide transmission line
- the fourth antenna unit is connected to the RF chip via a fourth coplanar waveguide transmission line.
- impedance matching circuits are provided on the third coplanar waveguide transmission line and the fourth coplanar waveguide transmission line.
- the third antenna unit is a dual-band 2.4 GHz + 5 GHz antenna.
- the fourth antenna unit is a single-frequency 2.4 GHz antenna.
- the radio frequency chip is disposed on the first surface or the second surface of the dielectric substrate.
- an embodiment of the present application provides an interactive tablet, which includes a display screen and the antenna assembly of the first aspect, wherein the antenna assembly is located on the back of the display screen.
- the antenna assembly is arranged in the display area of the display screen, and can radiate signals forward through the through holes on the metal back plate and the display screen, thereby increasing the screen-to-body ratio of the interactive tablet and even realizing a full-screen design.
- the antenna assembly further includes a metal resonant cavity, which is disposed on the second surface of the dielectric substrate. In a direction perpendicular to the second surface, at least a portion of a projection of the first clearance area on the metal resonant cavity is located within an outer contour of the metal resonant cavity, and at least a portion of a projection of the second clearance area on the metal resonant cavity is located within an outer contour of the metal resonant cavity.
- an embodiment of the present application provides an electronic device, comprising a processor and the antenna assembly of the first aspect, wherein the processor is connected to the radio frequency chip.
- FIG1 is a schematic diagram of the structure of an antenna assembly according to some embodiments of the present application.
- FIG2 is a schematic structural diagram of antenna assemblies according to other embodiments of the present application.
- FIG3 is a schematic diagram of the exploded structure of antenna assemblies according to other embodiments of the present application.
- FIG4 is a schematic diagram of the overall structure of the antenna assembly of the embodiment shown in FIG3 ;
- FIG5 is a schematic diagram of an exploded structure of an antenna assembly according to some other embodiments of the present application.
- FIG6 is a schematic diagram of the overall structure of the antenna assembly of the embodiment shown in FIG5 ;
- FIG7 is a schematic diagram of the layout of an antenna assembly according to an embodiment of the present application.
- FIG8 is a schematic diagram of the layout of an antenna assembly according to another embodiment of the present application.
- FIG9 is a schematic diagram of the layout of antenna assemblies according to other embodiments of the present application.
- FIG10 is a schematic diagram of return loss and isolation of the first antenna unit and the second antenna unit of the antenna assembly shown in FIG7 ;
- FIG11 is a schematic diagram of return loss and isolation of the third antenna unit and the fourth antenna unit of the antenna assembly shown in FIG7 ;
- FIG12 is a schematic diagram of antenna isolation between a first clearance area and a second clearance area of the antenna assembly shown in FIG7 ;
- FIG13 is a schematic diagram of the layout of an antenna assembly loaded with an isolated ground branch
- FIG14 is a schematic diagram of the layout of antenna assemblies according to other embodiments of the present application.
- FIG15 is a schematic diagram of the structure of an interactive tablet in some embodiments of the present application.
- FIG16 is a schematic diagram of the structure of an electronic device according to some embodiments of the present application.
- connection should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements.
- connection can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements.
- a first feature being “above” or “below” a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them.
- a first feature being “above”, “above” and “above” a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature.
- a first feature being “below”, “below” and “below” a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.
- the problem with the related technology is that one antenna board can only be used to realize the AP function, or can only realize the WiFi function and the Bluetooth communication function at the same time; and the antenna board product usually needs to have the WiFi function, Bluetooth communication function and AP function at the same time, so at least four antennas need to be configured. Therefore, the antenna design of the whole machine requires another antenna board in addition to the under-screen antenna to realize the AP function, resulting in a waste of materials and costs, and the cost of re-opening the back panel of the whole machine to increase the cost of re-opening the mold.
- an embodiment of the present application provides an antenna assembly, including a dielectric substrate 1, a radio frequency chip 4, and an antenna module 2.
- the antenna module 2 includes a first antenna module and a second antenna module.
- the dielectric substrate 1 can be a PCB board with various dielectric constants.
- PCB board also known as printed circuit board, is an electronic device.
- the dielectric substrate 1 is a carrier for electrically connecting the electronic components in the antenna assembly.
- the dielectric substrate 1 can be a single-layer board or a multi-layer board.
- the dielectric substrate 1 can be used to carry various electronic components of the antenna assembly and arrange a wiring layer for electrically connecting various electronic components.
- the dielectric substrate 1 can be made of materials such as glass fiber epoxy resin, polytetrafluoroethylene glass cloth or ceramic.
- the thickness of the dielectric substrate 1 can also be adjusted according to actual application needs. This embodiment does not limit the material and thickness of the dielectric substrate 1.
- the first surface of the dielectric substrate 1 is provided with a ground plane 11, and a first clearance area 121 and a second clearance area 122 located in the ground plane.
- the ground plane 11 may be a copper-clad surface provided on the first surface of the dielectric substrate 1.
- the first clearance area 121 and the second clearance area 122 may be provided in a rectangular shape, for example, a square shape.
- the first clearance area 121 and the second clearance area 122 may also be provided in other shapes according to actual needs, which are not limited here.
- the RF chip 4 is disposed on the dielectric substrate 1. In one embodiment, the RF chip 4 is disposed on the first surface or the second surface of the dielectric substrate 1. The RF chip 4 is used to convert the original radio signal into a radio signal of a specific waveform, and transmit the radio signal of the specific waveform through the antenna module.
- the RF chip 4 can be disposed at a position between the first clearance area 121 and the second clearance area 122, so that the two clearance areas are respectively located on both sides of the RF chip 4, as shown in reference to FIG1; the RF chip 4 can also be disposed at a position between the first clearance area 121 or the second clearance area 122 and the edge of the dielectric substrate 1, so that the two clearance areas are located on the same side of the RF chip 4, as shown in reference to FIG2.
- the first antenna module is arranged in the first clearance area 121 and connected to the radio frequency chip 4 to realize the WiFi communication function and the Bluetooth communication function.
- the first antenna module is used to cooperate with the radio frequency chip 4 to realize the WiFi station mode function and the Bluetooth communication function.
- the second antenna module is arranged in the second clearance area 122 and connected to the radio frequency chip 4 to realize the wireless AP function.
- AP is the abbreviation of access point, i.e., access point.
- the wireless AP function is used to provide wireless workstations with access to the wired LAN and from the wired LAN to the wireless workstations.
- the first clearance area 121 can realize metal shielding between the RF chip 4 and the first antenna module
- the second clearance area 122 can realize metal shielding between the RF chip 4 and the second antenna module.
- the resonant frequency can also be adjusted by adjusting the area size of the first clearance area 121 and the second clearance area 122.
- the dielectric substrate 1 may be a PCB board of an antenna assembly
- the first antenna module and the second antenna module may be modules for radiating electromagnetic waves
- the first antenna module and the second antenna module may be metal sheets having a specific shape printed on the surface of the dielectric substrate 1, for example, they may be copper sheets of various shapes and sizes printed on the surface of the dielectric substrate 1.
- the antenna assembly further includes a metal resonant cavity.
- the metal resonant cavity is disposed on the second surface of the dielectric substrate 1, and in a direction perpendicular to the second surface, the first clearance area and/or the second clearance area are located in the metal resonant cavity.
- the metal resonant cavity 3 can be disposed on the second surface A of the dielectric substrate 1 by welding, snapping, screwing, etc.
- the metal resonant cavity 3 may be a housing made by stamping a metal material (such as stainless steel, galvanized steel plate, etc.).
- the metal resonant cavity 3 is provided with an opening.
- the metal resonant cavity 3 may be a cover structure, which includes a bottom surface and a side surface connected to the bottom surface, and a cover with an opening is formed by the bottom surface and the side surface.
- the metal resonant cavity 3 may be a rectangular metal resonant cavity that is easy to produce and manufacture, and the rectangular metal resonant cavity has five side surfaces and an opening.
- the contact surface between the metal resonant cavity 3 and the dielectric substrate 1 may also be provided with a conductive cloth, and the conductive cloth can improve the electromagnetic shielding performance of the metal resonant cavity 3.
- the projections of the first clearance area 121 and the second clearance area 122 on the metal resonant cavity are both located within the outer contour of the metal resonant cavity.
- the first clearance area 121 and the second clearance area 122 can be completely covered, and the first clearance area 121 and the second clearance area 122 are located on the inner side of the side of the metal resonant cavity.
- the metal resonant cavity is a rectangular parallelepiped metal resonant cavity with five sides and one opening
- the first clearance area 121 and the second clearance area 122 are located on the inner side of the opening.
- the first antenna module includes a first antenna unit and a second antenna unit disposed in the first clearance area 121.
- the first antenna unit and the second antenna unit may be respectively disposed similar to
- the shape of the antenna 120 is shown in the figure (the shape is shown in the reference figure), the first clearance area 121 is a rectangle, the first antenna unit is in contact with the first side of the rectangle, the second antenna unit is in contact with the second side of the rectangle, and the second side is perpendicular to the first side.
- the shape and size of the first antenna unit and the second antenna unit can be set according to actual needs, and the embodiment of the present application does not limit the shape and size of the antenna unit.
- the first antenna unit and the second antenna unit are disposed together in the first clearance area 121, which can improve the radiation efficiency of the antenna unit, reduce the area of the dielectric substrate 1 occupied by the antenna unit, and make the size of the entire antenna assembly smaller.
- the first antenna unit is connected to the RF chip 4 via a first coplanar waveguide transmission line
- the second antenna unit is connected to the RF chip 4 via a second coplanar waveguide transmission line.
- Both the first coplanar waveguide transmission line and the second coplanar waveguide transmission line include a central conductor strip and conductor planes located on both sides of the central conductor strip.
- a central conductor strip is made on one surface of the dielectric substrate 1, and conductor planes are made on both sides adjacent to the central conductor strip, thereby forming a coplanar waveguide transmission line.
- an impedance matching circuit may be provided on both the first coplanar waveguide transmission line and the second coplanar waveguide transmission line.
- the impedance matching circuit is used to adjust the load power and suppress signal reflection.
- the impedance matching circuit provided on the first coplanar waveguide transmission line can ensure that all high-frequency microwave signals from the RF chip 4 are transmitted to the first antenna unit through the first coplanar waveguide transmission line, and can ensure that the first antenna unit generates almost no reflected signals, thereby improving the signal transmission efficiency.
- the impedance matching circuit provided on the second coplanar waveguide transmission line can ensure that all high-frequency microwave signals from the RF chip 4 are transmitted to the second antenna unit through the second coplanar waveguide transmission line, and can ensure that the second antenna unit generates almost no reflected signals, thereby improving the signal transmission efficiency.
- the second antenna module includes a third antenna unit and a fourth antenna unit disposed in the second clearance area 122.
- the third antenna unit can be configured as a dual-band 2.4 GHz + 5 GHz antenna
- the fourth antenna unit can be configured as a single-band 2.4 GHz antenna.
- the third antenna unit is connected to the RF chip 4 via a third coplanar waveguide transmission line
- the fourth antenna unit is connected to the RF chip 4 via a fourth coplanar waveguide transmission line.
- the third coplanar waveguide transmission line and the fourth coplanar waveguide transmission line both include a central conductor strip and conductor planes located on both sides of the central conductor strip.
- impedance matching circuits are provided on both the third coplanar waveguide transmission line and the fourth coplanar waveguide transmission line.
- the impedance matching circuit provided on the third coplanar waveguide transmission line can ensure that all high-frequency microwave signals from the RF chip 4 are transmitted to the third antenna unit through the third coplanar waveguide transmission line, and can ensure that the third antenna unit generates almost no reflected signals, thereby improving signal transmission efficiency.
- the impedance matching circuit provided on the fourth coplanar waveguide transmission line can ensure that all high-frequency microwave signals from the RF chip 4 are transmitted to the fourth antenna unit through the fourth coplanar waveguide transmission line, and can ensure that the fourth antenna unit generates almost no reflected signals, thereby improving signal transmission efficiency.
- the impedance matching circuit may be, for example, a ⁇ -shaped impedance matching circuit, a T-shaped impedance matching circuit, etc., and this embodiment does not limit the type of the impedance matching circuit.
- the frequency can be adjusted after the antenna component has a frequency deviation, and the antenna component can be matched with an active device to improve the overall radiation performance of the antenna component.
- the distance from the bottom of the metal resonant cavity 3 to the antenna module equal to one quarter wavelength of the electromagnetic wave radiated by the antenna module, when the electromagnetic wave radiated by the antenna module to the bottom of the metal resonant cavity 3 is reflected and reaches the antenna module, the reflected electromagnetic wave has the same phase as the electromagnetic wave radiated by the antenna module, and the in-phase superposition of the electromagnetic waves can improve the signal strength of the electromagnetic wave, thereby improving the forward radiation performance of the entire antenna assembly.
- those skilled in the art may also set a first antenna unit, a second antenna unit, a third antenna unit and a fourth antenna unit of any structure.
- the antenna units of other examples of the present application are described below in conjunction with FIG. 7 .
- the first clearance area 121 is a rectangular clearance area
- the first antenna unit includes a first feeding branch 211 and a first grounding branch
- the second antenna unit includes a second grounding branch.
- the first feeding branch 211 extends from the first boundary 1211 of the first clearance area 121 into the first clearance area 121, and the feeding point of the first feeding branch 211 is connected to the RF chip 4 through the first coplanar waveguide transmission line 14.
- the first grounding branch node includes a first grounding sub-branch node 2121, a second grounding sub-branch node 2122, a third grounding sub-branch node 2123, and a fourth grounding sub-branch node 2124 connected in sequence.
- the fourth grounding sub-branch node 2124 is connected to the first feeding branch node 211.
- the first grounding sub-branch node 2121 is parallel to the first feeding branch node 211, and extends from the first boundary 1211 of the first clearance area 121 to the inside of the first clearance area 121.
- the second grounding sub-branch node 2122 is perpendicular to the first grounding sub-branch node 2121, and the fourth grounding sub-branch node 2124 is connected to the first feeding branch node 211.
- the ground sub-branch 2124 is connected to the first feeding branch 211.
- the first ground sub-branch 2121, the second ground sub-branch 2122, the third ground sub-branch 2123 and the fourth ground sub-branch 2124 are all located on the same side of the first feeding branch 211.
- the third ground sub-branch 2123 contacts the first boundary 1211.
- the second grounding branch node includes a fifteenth coupling sub-branch node 2131, a sixteenth coupling sub-branch node 2132, a seventeenth grounding sub-branch node 2133, an eighteenth grounding sub-branch node 2134 and a nineteenth grounding sub-branch node 2135 connected in sequence, and the two grounding sub-branches connected to each other are perpendicular to each other.
- the fifteenth coupling sub-branch node 2131, the seventeenth grounding sub-branch node 2133 and the nineteenth grounding sub-branch node 2135 are parallel to each other, and the sixteenth coupling sub-branch node 2132 and the eighteenth grounding sub-branch node 2134 are parallel to each other.
- the nineteenth grounding sub-branch node 2135 extends from the second boundary 1212 into the first clearance area 121.
- the second boundary 1212 is perpendicular to the first boundary 1211.
- the seventeenth grounding sub-branch node 2133 is in contact with the second boundary 1212.
- the second clearance area 122 is a rectangular clearance area
- the third antenna unit includes a second feed branch 221 and a third ground branch
- the fourth antenna unit includes a fourth ground branch.
- the second feed branch 221 extends from the third boundary 1221 of the second clearance area 122 to the inside of the second clearance area 122, and the feeding point of the second feed branch 221 is connected to the RF chip 4 through the second coplanar waveguide transmission line 15.
- the third grounding branch node includes a ninth grounding sub-branch node 2225 and a fifth grounding sub-branch node 2221, a sixth grounding sub-branch node 2222, a seventh grounding sub-branch node 2223 and an eighth grounding sub-branch node 2224 connected in sequence.
- the fifth grounding sub-branch node 2221 is connected to the second feeding branch node 221.
- the two grounding sub-branches connected to each other are perpendicular to each other.
- the fifth grounding sub-branch node 2221 and the seventh grounding sub-branch node 2223 are parallel to each other.
- the sixth grounding sub-branch node 2222 and the eighth grounding sub-branch node 2224 are parallel to each other.
- the ninth grounding sub-branch node 2225 extends from the fourth boundary 1222 of the second clearance area 122 to the inside of the second clearance area 122.
- the ninth grounding sub-branch node 2225 has no contact with the fifth grounding sub-branch node 2221, the sixth grounding sub-branch node 2222, the seventh grounding sub-branch node 2223, the eighth grounding sub-branch node 2224 and the second feeding branch node 221.
- the sixth grounding sub-branch 2222 contacts the third boundary 1221 .
- the fourth grounding branch node includes a fourteenth grounding sub-branch node 2230 and a tenth grounding sub-branch node 2226, an eleventh grounding sub-branch node 2227, a twelfth grounding sub-branch node 2228 and a thirteenth grounding sub-branch node 2229 connected in sequence.
- the fourteenth grounding sub-branch node 2230 has no contact with the tenth grounding sub-branch node 2226, the eleventh grounding sub-branch node 2227, the twelfth grounding sub-branch node 2228, the thirteenth grounding sub-branch node 2229 and the second feeding branch node 221.
- the two grounding sub-branches connected to each other are perpendicular to each other.
- the tenth grounding sub-branch node 2226 and the twelfth grounding sub-branch node 2228 are parallel to each other.
- the eleventh grounding sub-branch node 2227 and the thirteenth grounding sub-branch node 2229 are parallel to each other.
- the fourteenth grounding sub-branch node 2230 and the eleventh grounding sub-branch node 2227 are parallel to each other.
- the fourteenth grounding sub-branch node 2230 extends from the first boundary 1223 of the second clearance area 122 to the inner side of the second clearance area 122.
- the tenth grounding sub-branch 2226 extends from the second boundary 1224 of the second clearance area 122 to the inner side of the second clearance area 122.
- the twelfth grounding sub-branch 2228 contacts the second boundary 1224.
- the return losses of the four antenna units are S11, S22, S33 and S44 respectively.
- the isolation between the two antenna units in the clearance area is S21
- the isolation between the two antenna units in the second clearance area is S34
- the isolation of the same frequency 5GHZ in the two clearance areas is S13 and S23.
- the first antenna module also includes an isolation ground branch 1210.
- the isolation ground branch 1210 is arranged between the first antenna unit and the second antenna unit to improve the isolation between the first antenna unit and the second antenna unit.
- one end of the isolation ground branch can be in contact with the intersection of the first side and the second side, and the central axis of the isolation ground branch is the bisector of the angle between the first side and the second side, that is, the central axis of the isolation ground branch is 45° with the first side, and the angle with the second side is also 45°.
- the length of the isolation ground branch is one quarter of the wavelength of the operating frequency, which can improve the isolation of the antenna;
- Figure 13 is a schematic diagram of loading the isolation ground branch, the dotted line is the isolation without the branch, and the solid line is the isolation after adding the isolation ground branch. It can be seen that the isolation is improved by about 2dB in the 5GHZ frequency band.
- the isolation ground branch 1210 in Figure 12 increases the isolation between the first antenna unit and the second antenna unit by 2dB compared with the isolation in Figure 7.
- the first clearance area 121 and the second clearance area 122 are located on the same side of the RF chip 4.
- the difference between the structure of the example shown in Figure 14 and the structure of the example shown in Figure 7 is that the grounding sub-branch 2231 in Figure 14 replaces the second feeding branch 221 in Figure 7, and the feeding branch 2232 in Figure 14 replaces the fourteenth grounding sub-branch 2230 in Figure 7, and the feeding branch 2232 is connected to the RF chip 4 via the coplanar waveguide transmission line 16.
- each antenna module includes two antenna units, and the transmission line is a coplanar waveguide transmission line as an example to illustrate the structure of the antenna module, the structure and routing of the transmission line.
- the transmission line is a coplanar waveguide transmission line as an example to illustrate the structure of the antenna module, the structure and routing of the transmission line.
- those skilled in the art can set the number of antenna modules, design antenna modules with different structures, and layout different transmission lines according to actual needs.
- the embodiment of the present application does not limit the number and structure of the antenna modules, nor does it limit the structure and routing of the transmission lines.
- the antenna assembly of the embodiment of the present application can transform a single-module dual antenna into a dual-module four antenna without changing the area of the clearance area and ensuring the antenna radiation efficiency, thereby realizing WiFi function, AP function and Bluetooth communication function on the same antenna board without increasing the area of the clearance area, thereby greatly reducing the product production cost.
- FIG. 15 another embodiment of the present application provides an interactive tablet 100 , including a display screen 101 and the antenna assembly of any of the above embodiments, wherein the antenna assembly is located on the back of the display screen 101 .
- the antenna assembly further includes a metal resonant cavity, which is disposed on the second surface of the dielectric substrate 1. In a direction perpendicular to the second surface, at least a portion of a projection of the first clearance area on the metal resonant cavity is located within an outer contour of the metal resonant cavity, and at least a portion of a projection of the second clearance area on the metal resonant cavity is located within an outer contour of the metal resonant cavity.
- the interactive tablet 100 includes a display screen 101, a metal back plate, an antenna assembly, and a main board, wherein:
- the metal back plate is located behind the display screen and is provided with a through hole.
- the antenna assembly is arranged on the side of the metal back plate facing away from the display screen and is located within the display area of the display screen.
- the antenna assembly is arranged opposite to the through hole.
- the main board is arranged on the side of the metal back plate facing away from the display screen, and the antenna assembly is electrically connected to the main board.
- the interactive tablet provided in the embodiment of the present application and the antenna assembly provided in the embodiment of the present application are based on the same application concept and have the same beneficial effects as the methods adopted, operated or implemented therein.
- FIG. 16 another embodiment of the present application provides an electronic device, including a processor and an antenna assembly of any of the above embodiments, wherein the processor is connected to a radio frequency chip.
- the processor can be an integrated circuit chip with signal processing capabilities.
- the above-mentioned processor can be a general-purpose processor, including a central processing unit (CPU), a network processor (NP), etc.; it can also be a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA) or other programmable logic devices, discrete gate or transistor logic devices, and discrete hardware components.
- CPU central processing unit
- NP network processor
- DSP digital signal processor
- ASIC application-specific integrated circuit
- FPGA field-programmable gate array
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Abstract
Provided in the embodiments of the present application are an antenna assembly, an interactive tablet and an electronic device. The antenna assembly comprises: a dielectric substrate, wherein a first face of the dielectric substrate is provided with a ground plane, and a first clearance region and a second clearance region, which are located in the ground plane; a radio frequency chip, which is arranged on the dielectric substrate; a first antenna module, which is connected to the radio frequency chip, wherein the first antenna module comprises a first antenna unit and a second antenna unit; and a second antenna module, which is connected to the radio frequency chip, wherein the second antenna module comprises a third antenna unit and a fourth antenna unit. By means of the antenna assembly of the embodiments of the present application, a single-module dual-antenna form can be changed to a dual-module four-antenna form while the area of a clearance region is not changed and the antenna radiation efficiency is ensured, such that a WiFi function, an AP function and a Bluetooth communication function can be implemented on the same antenna board, thereby greatly reducing the product production costs.
Description
本申请要求于2022年11月16日提交国家知识产权局、申请号为202211458049.2、发明名称为“一种天线组件、交互平板及电子设备”的中国专利申请的优先权,其全部内容通过引用结合在本申请中。This application claims priority to the Chinese patent application filed with the State Intellectual Property Office on November 16, 2022, with application number 202211458049.2 and invention name “An antenna assembly, interactive tablet and electronic device”, the entire contents of which are incorporated by reference in this application.
本申请涉及天线技术领域,例如涉及一种天线组件、交互平板及电子设备。The present application relates to the field of antenna technology, for example, to an antenna assembly, an interactive tablet and an electronic device.
随着无线通信技术的进步,无线通信技术被应用在例如交互平板等的多个领域中,无线通信技术的实现需要天线的支持。同时,交互平板的屏幕占比要求越来越高,发展趋势也逐渐向全面屏靠拢。With the advancement of wireless communication technology, wireless communication technology is applied in many fields such as interactive tablets. The realization of wireless communication technology requires the support of antennas. At the same time, the screen ratio of interactive tablets is required to be higher and higher, and the development trend is gradually moving towards full screen.
发明内容Summary of the invention
本申请实施例的目的在于提供一种天线组件、交互平板及电子设备,以解决相关技术中同一块天线板无法同时实现WiFi功能、蓝牙通信功能和AP功能的问题。The purpose of the embodiments of the present application is to provide an antenna assembly, an interactive tablet and an electronic device to solve the problem in the related art that the same antenna board cannot simultaneously realize WiFi function, Bluetooth communication function and AP function.
为达此目的,本申请实施例采用以下技术方案:To achieve this purpose, the present application embodiment adopts the following technical solutions:
第一方面,提供一种天线组件,包括:In a first aspect, an antenna assembly is provided, comprising:
介质基板,所述介质基板的第一面设置有接地面、以及位于所述接地面中的第一净空区域和第二净空区域;A dielectric substrate, wherein a first surface of the dielectric substrate is provided with a ground plane, and a first clearance area and a second clearance area located in the ground plane;
射频芯片,所述射频芯片设置在所述介质基板上;A radio frequency chip, wherein the radio frequency chip is arranged on the dielectric substrate;
第一天线模块,与所述射频芯片相连接,所述第一天线模块包括第一天线单元和第二天线单元;以及,a first antenna module connected to the radio frequency chip, wherein the first antenna module includes a first antenna unit and a second antenna unit; and
第二天线模块,与所述射频芯片相连接,所述第二天线模块包括第三天线单元和第四天线单元。The second antenna module is connected to the radio frequency chip, and the second antenna module includes a third antenna unit and a fourth antenna unit.
相比于相关技术,本申请实施例的天线组件,能够在不改变净空区面积且保证天线辐射效率的情况下,将单模组双天线变为双模组四天线,从而能够在同一块天线板上实现WiFi功能、AP功能和蓝牙通信功能,大幅降低了产品生产成本。Compared with the related art, the antenna assembly of the embodiment of the present application can transform a single-module dual antenna into a dual-module four antenna without changing the area of the clearance zone and ensuring the antenna radiation efficiency, thereby realizing WiFi function, AP function and Bluetooth communication function on the same antenna board, greatly reducing the product production cost.
在一些实施例中,所述第一天线模块设置在所述第一净空区域中,用于实现WiFi通信功能和蓝牙通信功能。In some embodiments, the first antenna module is disposed in the first clearance area to implement WiFi communication functions and Bluetooth communication functions.
在一些实施例中,所述第二天线模块设置在所述第二净空区域中,用于实现无线AP功
能。In some embodiments, the second antenna module is disposed in the second clearance area to implement wireless AP function. able.
在一些实施例中,所述天线组件还包括:In some embodiments, the antenna assembly further comprises:
金属谐振腔,所述金属谐振腔设置在所述介质基板的第二面,在垂直于所述第二面的方向上,所述第一净空区和/或所述第二净空区位于所述金属谐振腔内。A metal resonant cavity is provided on the second surface of the dielectric substrate, and in a direction perpendicular to the second surface, the first clearance area and/or the second clearance area is located in the metal resonant cavity.
在一些实施例中,所述第一净空区域和所述第二净空区域在所述金属谐振腔上的投影均位于所述金属谐振腔的外轮廓之内。In some embodiments, projections of the first clearance region and the second clearance region on the metal resonant cavity are both located within the outer contour of the metal resonant cavity.
在一些实施例中,所述第一天线模块包括设置于所述第一净空区域中的第一天线单元和第二天线单元。In some embodiments, the first antenna module includes a first antenna unit and a second antenna unit disposed in the first clearance area.
在一些实施例中,所述第一天线模块还包括隔离地枝节,所述隔离地枝节设置于所述第一天线单元和所述第二天线单元之间,用于提高所述第一天线单元和所述第二天线单元之间的隔离度。In some embodiments, the first antenna module further includes an isolation ground branch, and the isolation ground branch is arranged between the first antenna unit and the second antenna unit to improve the isolation between the first antenna unit and the second antenna unit.
在一些实施例中,所述第一净空区域为矩形,所述第一天线单元与所述矩形的第一边相接触,所述第二天线单元与所述矩形的第二边相接触,所述第二边与所述第一边互相垂直。In some embodiments, the first clearance area is a rectangle, the first antenna unit is in contact with a first side of the rectangle, the second antenna unit is in contact with a second side of the rectangle, and the second side is perpendicular to the first side.
在一些实施例中,所述隔离地枝节的一端与所述第一边和所述第二边的交点相接触。In some embodiments, one end of the isolated ground branch contacts an intersection of the first side and the second side.
在一些实施例中,所述第一天线单元通过第一共面波导传输线与所述射频芯片连接,所述第二天线单元通过第二共面波导传输线与所述射频芯片连接。In some embodiments, the first antenna unit is connected to the RF chip via a first coplanar waveguide transmission line, and the second antenna unit is connected to the RF chip via a second coplanar waveguide transmission line.
在一些实施例中,所述第一共面波导传输线和所述第二共面波导传输线上均设置有阻抗匹配电路。In some embodiments, impedance matching circuits are provided on both the first coplanar waveguide transmission line and the second coplanar waveguide transmission line.
在一些实施例中,所述第二天线模块包括设置于所述第二净空区域中的第三天线单元和第四天线单元。In some embodiments, the second antenna module includes a third antenna unit and a fourth antenna unit disposed in the second clearance area.
在一些实施例中,所述第三天线单元通过第三共面波导传输线与所述射频芯片连接,所述第四天线单元通过第四共面波导传输线与所述射频芯片连接。In some embodiments, the third antenna unit is connected to the RF chip via a third coplanar waveguide transmission line, and the fourth antenna unit is connected to the RF chip via a fourth coplanar waveguide transmission line.
在一些实施例中,所述第三共面波导传输线和所述第四共面波导传输线上均设置有阻抗匹配电路。In some embodiments, impedance matching circuits are provided on the third coplanar waveguide transmission line and the fourth coplanar waveguide transmission line.
在一些实施例中,所述第三天线单元为双频2.4GHz+5GHz天线。In some embodiments, the third antenna unit is a dual-band 2.4 GHz + 5 GHz antenna.
在一些实施例中,所述第四天线单元为单频2.4GHz天线。In some embodiments, the fourth antenna unit is a single-frequency 2.4 GHz antenna.
在一些实施例中,所述射频芯片设置在所述介质基板的第一面或第二面上。In some embodiments, the radio frequency chip is disposed on the first surface or the second surface of the dielectric substrate.
第二方面,本申请实施例提供了一种交互平板,所述交互平板包括显示屏以及第一方面的天线组件,所述天线组件位于所述显示屏的背面。In a second aspect, an embodiment of the present application provides an interactive tablet, which includes a display screen and the antenna assembly of the first aspect, wherein the antenna assembly is located on the back of the display screen.
在本申请实施例中,天线组件设置在显示屏的显示区域内,可透过金属背板上的通孔、显示屏向前辐射信号,提高了交互平板的屏占比甚至实现全面屏设计。
In the embodiment of the present application, the antenna assembly is arranged in the display area of the display screen, and can radiate signals forward through the through holes on the metal back plate and the display screen, thereby increasing the screen-to-body ratio of the interactive tablet and even realizing a full-screen design.
在一些实施例中,所述天线组件还包括金属谐振腔,所述金属谐振腔设置在所述介质基板的第二面,在垂直于所述第二面的方向上,所述第一净空区域在所述金属谐振腔上的投影的至少一部分位于所述金属谐振腔的外轮廓之内,所述第二净空区域在所述金属谐振腔上的投影的至少一部分位于所述金属谐振腔的外轮廓之内。In some embodiments, the antenna assembly further includes a metal resonant cavity, which is disposed on the second surface of the dielectric substrate. In a direction perpendicular to the second surface, at least a portion of a projection of the first clearance area on the metal resonant cavity is located within an outer contour of the metal resonant cavity, and at least a portion of a projection of the second clearance area on the metal resonant cavity is located within an outer contour of the metal resonant cavity.
第三方面,本申请实施例提供了一种电子设备,包括处理器以及第一方面的天线组件,所述处理器与所述射频芯片相连接。In a third aspect, an embodiment of the present application provides an electronic device, comprising a processor and the antenna assembly of the first aspect, wherein the processor is connected to the radio frequency chip.
为了更清楚地说明本申请实施例或相关技术中的技术方案,下面将对实施例或相关技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本申请中记载的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。In order to more clearly illustrate the technical solutions in the embodiments of the present application or the related technologies, the drawings required for use in the embodiments or the related technical descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
图1为本申请一些实施方式的天线组件的结构示意图;FIG1 is a schematic diagram of the structure of an antenna assembly according to some embodiments of the present application;
图2为本申请另一些实施方式的天线组件的结构示意图;FIG2 is a schematic structural diagram of antenna assemblies according to other embodiments of the present application;
图3为本申请另一些实施方式的天线组件的分解结构示意图;FIG3 is a schematic diagram of the exploded structure of antenna assemblies according to other embodiments of the present application;
图4为图3所示实施方式的天线组件的整体结构示意图;FIG4 is a schematic diagram of the overall structure of the antenna assembly of the embodiment shown in FIG3 ;
图5为本申请另一些实施方式的天线组件的分解结构示意图;FIG5 is a schematic diagram of an exploded structure of an antenna assembly according to some other embodiments of the present application;
图6为图5所示实施方式的天线组件的整体结构示意图;FIG6 is a schematic diagram of the overall structure of the antenna assembly of the embodiment shown in FIG5 ;
图7为本申请一种实施方式的天线组件的布局示意图;FIG7 is a schematic diagram of the layout of an antenna assembly according to an embodiment of the present application;
图8为本申请另一种实施方式的天线组件的布局示意图;FIG8 is a schematic diagram of the layout of an antenna assembly according to another embodiment of the present application;
图9为本申请另一些实施方式的天线组件的布局示意图;FIG9 is a schematic diagram of the layout of antenna assemblies according to other embodiments of the present application;
图10为图7所示天线组件的第一天线单元和第二天线单元的回波损耗和隔离度示意图;FIG10 is a schematic diagram of return loss and isolation of the first antenna unit and the second antenna unit of the antenna assembly shown in FIG7 ;
图11为图7所示天线组件的第三天线单元和第四天线单元的回波损耗和隔离度示意图;FIG11 is a schematic diagram of return loss and isolation of the third antenna unit and the fourth antenna unit of the antenna assembly shown in FIG7 ;
图12为图7所示天线组件的第一净空区域和第二净空区域的天线隔离度示意图;FIG12 is a schematic diagram of antenna isolation between a first clearance area and a second clearance area of the antenna assembly shown in FIG7 ;
图13为加载隔离地枝节的天线组件布局示意图;FIG13 is a schematic diagram of the layout of an antenna assembly loaded with an isolated ground branch;
图14为本申请另一些实施方式的天线组件的布局示意图;FIG14 is a schematic diagram of the layout of antenna assemblies according to other embodiments of the present application;
图15为本申请一些实施方式的交互平板的结构示意图;FIG15 is a schematic diagram of the structure of an interactive tablet in some embodiments of the present application;
图16为本申请一些实施方式的电子设备的结构示意图;FIG16 is a schematic diagram of the structure of an electronic device according to some embodiments of the present application;
图中:In the figure:
1、介质基板;11、接地面;121、第一净空区域;1211、第一边界;1212、第二边界;122、第二净空区域;1221、第三边界;1222、第四边界;14、第一共面波导传输线;15、
第二共面波导传输线;2、天线单元;211、第一馈电枝节;2121、第一接地子枝节;2122、第二接地子枝节;2123、第三接地子枝节;2124、第四接地子枝节;221、第二馈电枝节;222、第三接地枝节;2221、第五接地子枝节;2222、第六接地子枝节;2223、第七接地子枝节;2124、第八接地子枝节;223、第二接地枝节;3、金属谐振腔;4、射频芯片;100、交互平板;101、显示屏。1. dielectric substrate; 11. ground plane; 121. first clearance area; 1211. first boundary; 1212. second boundary; 122. second clearance area; 1221. third boundary; 1222. fourth boundary; 14. first coplanar waveguide transmission line; 15. The second coplanar waveguide transmission line; 2. Antenna unit; 211. The first feeding branch; 2121. The first grounding sub-branch; 2122. The second grounding sub-branch; 2123. The third grounding sub-branch; 2124. The fourth grounding sub-branch; 221. The second feeding branch; 222. The third grounding branch; 2221. The fifth grounding sub-branch; 2222. The sixth grounding sub-branch; 2223. The seventh grounding sub-branch; 2124. The eighth grounding sub-branch; 223. The second grounding branch; 3. Metal resonant cavity; 4. RF chip; 100. Interactive tablet; 101. Display screen.
本申请的目的的实现、功能特点及优点将结合实施例,参照附图做进一步说明。The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with embodiments and with reference to the accompanying drawings.
为使本申请解决的技术问题、采用的技术方案和达到的技术效果更加清楚,下面将结合附图对本申请实施例的技术方案作进一步的详细描述,显然,所描述的实施例仅仅是本申请一部分实施例,而不是全部的实施例。基于本申请中的实施例,本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例,都属于本申请保护的范围。In order to make the technical problems solved by this application, the technical solutions adopted, and the technical effects achieved more clearly, the technical solutions of the embodiments of this application will be further described in detail below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of this application.
在本申请的描述中,除非另有明确的规定和限定,术语“相连”、“连接”、“固定”应做广义理解,例如,可以是固定连接,也可以是可拆卸连接,或成一体;可以是机械连接,也可以是电连接;可以是直接相连,也可以通过中间媒介间接相连,可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言,可以具体情况理解上述术语在本申请中的具体含义。In the description of this application, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.
在本申请中,除非另有明确的规定和限定,第一特征在第二特征之“上”或之“下”可以包括第一和第二特征直接接触,也可以包括第一和第二特征不是直接接触而是通过它们之间的另外的特征接触。而且,第一特征在第二特征“之上”、“上方”和“上面”包括第一特征在第二特征正上方和斜上方,或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”包括第一特征在第二特征正下方和斜下方,或仅仅表示第一特征水平高度小于第二特征。In the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.
相关技术存在的问题是一块天线板只能用于实现AP功能,或者只能同时实现WiFi功能和蓝牙通信功能;而天线板产品通常是需要同时具备WiFi功能、蓝牙通信功能和AP功能的,因此至少需要配置四根天线,因此整机的天线设计除了屏下天线还需要另外的天线板来实现AP功能,造成了物料及成本的浪费,以及将整机背板再开洞增添重新开模的费用。The problem with the related technology is that one antenna board can only be used to realize the AP function, or can only realize the WiFi function and the Bluetooth communication function at the same time; and the antenna board product usually needs to have the WiFi function, Bluetooth communication function and AP function at the same time, so at least four antennas need to be configured. Therefore, the antenna design of the whole machine requires another antenna board in addition to the under-screen antenna to realize the AP function, resulting in a waste of materials and costs, and the cost of re-opening the back panel of the whole machine to increase the cost of re-opening the mold.
参考图1至图8所示,本申请一个实施例提供了一种天线组件,包括介质基板1、射频芯片4和天线模块2。天线模块2包括第一天线模块和第二天线模块。1 to 8 , an embodiment of the present application provides an antenna assembly, including a dielectric substrate 1, a radio frequency chip 4, and an antenna module 2. The antenna module 2 includes a first antenna module and a second antenna module.
介质基板1可以是具有各种介电常数的PCB板。PCB板又称印制电路板,是电子设备
中电子元器件电气相互连接的载体。该介质基板1可以是单层板或多层板,介质基板1可以用于承载天线组件的各种电子元件,以及布置用于使各种电子元件电连接的走线层。介质基板1例如可以采用玻璃纤维环氧树脂、聚四氟乙烯玻璃布或陶瓷等材料制成。介质基板1的厚度也可以根据实际应用需要进行调整,本实施例对介质基板1的材料及厚度不作限定。The dielectric substrate 1 can be a PCB board with various dielectric constants. PCB board, also known as printed circuit board, is an electronic device. The dielectric substrate 1 is a carrier for electrically connecting the electronic components in the antenna assembly. The dielectric substrate 1 can be a single-layer board or a multi-layer board. The dielectric substrate 1 can be used to carry various electronic components of the antenna assembly and arrange a wiring layer for electrically connecting various electronic components. The dielectric substrate 1 can be made of materials such as glass fiber epoxy resin, polytetrafluoroethylene glass cloth or ceramic. The thickness of the dielectric substrate 1 can also be adjusted according to actual application needs. This embodiment does not limit the material and thickness of the dielectric substrate 1.
介质基板1的第一面设置有接地面11、以及位于接地面中的第一净空区域121和第二净空区域122。接地面11可以是设置在介质基板1第一面的敷铜面。第一净空区域121和第二净空区域122可以设置为矩形,例如可以为正方形。第一净空区域121和第二净空区域122还可以根据实际需要设置为其他形状,此处不作限制。The first surface of the dielectric substrate 1 is provided with a ground plane 11, and a first clearance area 121 and a second clearance area 122 located in the ground plane. The ground plane 11 may be a copper-clad surface provided on the first surface of the dielectric substrate 1. The first clearance area 121 and the second clearance area 122 may be provided in a rectangular shape, for example, a square shape. The first clearance area 121 and the second clearance area 122 may also be provided in other shapes according to actual needs, which are not limited here.
射频芯片4设置在介质基板1上,在一实施例中,射频芯片4设置在介质基板1的第一面或第二面上。射频芯片4用于将原始无线电信号转换成特定波形的无线电信号,并将该特定波形的无线电信号通过天线模块发送出去。射频芯片4可以设置于第一净空区域121和第二净空区域122之间的位置,从而使两个净空区域分别位于射频芯片4的两侧,参考图1所示;射频芯片4也可以设置于第一净空区域121或第二净空区域122与介质基板1边缘之间的位置,从而使两个净空区域位于射频芯片4的同一侧,参考图2所示。The RF chip 4 is disposed on the dielectric substrate 1. In one embodiment, the RF chip 4 is disposed on the first surface or the second surface of the dielectric substrate 1. The RF chip 4 is used to convert the original radio signal into a radio signal of a specific waveform, and transmit the radio signal of the specific waveform through the antenna module. The RF chip 4 can be disposed at a position between the first clearance area 121 and the second clearance area 122, so that the two clearance areas are respectively located on both sides of the RF chip 4, as shown in reference to FIG1; the RF chip 4 can also be disposed at a position between the first clearance area 121 or the second clearance area 122 and the edge of the dielectric substrate 1, so that the two clearance areas are located on the same side of the RF chip 4, as shown in reference to FIG2.
第一天线模块设置在第一净空区域121中,与射频芯片4相连接,用于实现WiFi通信功能和蓝牙通信功能。第一天线模块用于配合射频芯片4实现WiFi station模式功能和蓝牙通信功能。The first antenna module is arranged in the first clearance area 121 and connected to the radio frequency chip 4 to realize the WiFi communication function and the Bluetooth communication function. The first antenna module is used to cooperate with the radio frequency chip 4 to realize the WiFi station mode function and the Bluetooth communication function.
第二天线模块设置在第二净空区域122中,与射频芯片4相连接,用于实现无线AP功能。AP为access point的缩写,即访问接入点,无线AP功能用于提供无线工作站对有线局域网和从有线局域网对无线工作站的访问。The second antenna module is arranged in the second clearance area 122 and connected to the radio frequency chip 4 to realize the wireless AP function. AP is the abbreviation of access point, i.e., access point. The wireless AP function is used to provide wireless workstations with access to the wired LAN and from the wired LAN to the wireless workstations.
第一净空区域121可以在射频芯片4与第一天线模块之间实现金属屏蔽,第二净空区域122可以在射频芯片4与第二天线模块之间实现金属屏蔽,也可以通过调整第一净空区域121以及第二净空区域122的面积大小来调整谐振频率。The first clearance area 121 can realize metal shielding between the RF chip 4 and the first antenna module, and the second clearance area 122 can realize metal shielding between the RF chip 4 and the second antenna module. The resonant frequency can also be adjusted by adjusting the area size of the first clearance area 121 and the second clearance area 122.
介质基板1可以是天线组件的PCB板,第一天线模块和第二天线模块可以是用于辐射电磁波的模块,第一天线模块和第二天线模块可以是印刷在介质基板1的表面上的、具有特定形状的金属片,例如可以是印刷在介质基板1的表面上的各种形状和各种尺寸的铜片。The dielectric substrate 1 may be a PCB board of an antenna assembly, the first antenna module and the second antenna module may be modules for radiating electromagnetic waves, and the first antenna module and the second antenna module may be metal sheets having a specific shape printed on the surface of the dielectric substrate 1, for example, they may be copper sheets of various shapes and sizes printed on the surface of the dielectric substrate 1.
在某些实施方式中,如图3所示,该天线组件还包括金属谐振腔。该金属谐振腔设置在介质基板1的第二面,在垂直于第二面的方向上,第一净空区和/或第二净空区位于金属谐振腔内。在一实施例中,可以通过焊接、卡扣、锁螺丝等方式将金属谐振腔3设置在介质基板1的第二面A上。In some embodiments, as shown in FIG3 , the antenna assembly further includes a metal resonant cavity. The metal resonant cavity is disposed on the second surface of the dielectric substrate 1, and in a direction perpendicular to the second surface, the first clearance area and/or the second clearance area are located in the metal resonant cavity. In one embodiment, the metal resonant cavity 3 can be disposed on the second surface A of the dielectric substrate 1 by welding, snapping, screwing, etc.
金属谐振腔3可以是对金属材质(例如不锈钢、镀锌钢板等)进行冲压而制成的罩体,
该金属谐振腔3设置有开口。在一实施例中,金属谐振腔3可以是罩体结构,该罩体结构包括一个底面以及与底面连接的侧面,通过底面和侧面形成具有一开口的罩体。例如,金属谐振腔3可以为便于生产制造的长方体形状金属谐振腔,该长方体形状金属谐振腔具有五个侧面和一个开口,金属谐振腔3设置于介质基板1上时,该开口与介质基板1相接触。在某些实施方式中,金属谐振腔3和介质基板1的接触面还可以设置有导电布,导电布能够提高金属谐振腔3的电磁屏蔽性能。The metal resonant cavity 3 may be a housing made by stamping a metal material (such as stainless steel, galvanized steel plate, etc.). The metal resonant cavity 3 is provided with an opening. In one embodiment, the metal resonant cavity 3 may be a cover structure, which includes a bottom surface and a side surface connected to the bottom surface, and a cover with an opening is formed by the bottom surface and the side surface. For example, the metal resonant cavity 3 may be a rectangular metal resonant cavity that is easy to produce and manufacture, and the rectangular metal resonant cavity has five side surfaces and an opening. When the metal resonant cavity 3 is disposed on the dielectric substrate 1, the opening is in contact with the dielectric substrate 1. In some embodiments, the contact surface between the metal resonant cavity 3 and the dielectric substrate 1 may also be provided with a conductive cloth, and the conductive cloth can improve the electromagnetic shielding performance of the metal resonant cavity 3.
在某些实施方式中,第一净空区域121和第二净空区域122在金属谐振腔上的投影均位于金属谐振腔的外轮廓之内。当金属谐振腔设置在介质基板1上之后,能够完全覆盖第一净空区域121和第二净空区域122,第一净空区域121和第二净空区域122位于金属谐振腔的侧面的内侧。例如,当金属谐振腔为具有五个侧面和一个开口的长方体形状金属谐振腔时,第一净空区域121和第二净空区域122位于该开口的内侧。In some embodiments, the projections of the first clearance area 121 and the second clearance area 122 on the metal resonant cavity are both located within the outer contour of the metal resonant cavity. After the metal resonant cavity is disposed on the dielectric substrate 1, the first clearance area 121 and the second clearance area 122 can be completely covered, and the first clearance area 121 and the second clearance area 122 are located on the inner side of the side of the metal resonant cavity. For example, when the metal resonant cavity is a rectangular parallelepiped metal resonant cavity with five sides and one opening, the first clearance area 121 and the second clearance area 122 are located on the inner side of the opening.
在某些实施方式中,第一天线模块包括设置于第一净空区域121中的第一天线单元和第二天线单元。例如,第一天线单元和第二天线单元可以分别设置为类似于的形状(形状参考图所示),第一净空区域121为矩形,第一天线单元与矩形的第一边相接触,第二天线单元与矩形的第二边相接触,第二边与第一边互相垂直。第一天线单元和第二天线单元的形状和尺寸可以分别根据实际需要进行设置,本申请实施例对天线单元的形状和尺寸不加以限制。In some embodiments, the first antenna module includes a first antenna unit and a second antenna unit disposed in the first clearance area 121. For example, the first antenna unit and the second antenna unit may be respectively disposed similar to The shape of the antenna 120 is shown in the figure (the shape is shown in the reference figure), the first clearance area 121 is a rectangle, the first antenna unit is in contact with the first side of the rectangle, the second antenna unit is in contact with the second side of the rectangle, and the second side is perpendicular to the first side. The shape and size of the first antenna unit and the second antenna unit can be set according to actual needs, and the embodiment of the present application does not limit the shape and size of the antenna unit.
第一天线单元和第二天线单元共同设置在第一净空区域121内,可以提高天线单元的辐射效率,可以减小天线单元占用介质基板1的面积,可以使整个天线组件尺寸做得更小。The first antenna unit and the second antenna unit are disposed together in the first clearance area 121, which can improve the radiation efficiency of the antenna unit, reduce the area of the dielectric substrate 1 occupied by the antenna unit, and make the size of the entire antenna assembly smaller.
在某些实施方式中,第一天线单元通过第一共面波导传输线与射频芯片4连接,第二天线单元通过第二共面波导传输线与射频芯片4连接。第一共面波导传输线和第二共面波导传输线均包括中心导体带以及位于该中心导体带两侧的导体平面。在介质基板1的一个面上制作出中心导体带,并在紧邻中心导体带的两侧制作出导体平面,这样就形成了共面波导传输线。In some embodiments, the first antenna unit is connected to the RF chip 4 via a first coplanar waveguide transmission line, and the second antenna unit is connected to the RF chip 4 via a second coplanar waveguide transmission line. Both the first coplanar waveguide transmission line and the second coplanar waveguide transmission line include a central conductor strip and conductor planes located on both sides of the central conductor strip. A central conductor strip is made on one surface of the dielectric substrate 1, and conductor planes are made on both sides adjacent to the central conductor strip, thereby forming a coplanar waveguide transmission line.
在一实施例中,第一共面波导传输线和第二共面波导传输线上均可以设置有阻抗匹配电路。阻抗匹配电路用于调整负载功率和抑制信号反射。设置于第一共面波导传输线上的阻抗匹配电路能够确保通过第一共面波导传输线将来自射频芯片4的所有高频微波信号全部传输到第一天线单元,并能够确保第一天线单元几乎不产生反射信号,提高了信号传输效率。同理,设置于第二共面波导传输线上的阻抗匹配电路能够确保通过第二共面波导传输线将来自射频芯片4的所有高频微波信号全部传输到第二天线单元,并能够确保第二天线单元几乎不产生反射信号,提高了信号传输效率。
In one embodiment, an impedance matching circuit may be provided on both the first coplanar waveguide transmission line and the second coplanar waveguide transmission line. The impedance matching circuit is used to adjust the load power and suppress signal reflection. The impedance matching circuit provided on the first coplanar waveguide transmission line can ensure that all high-frequency microwave signals from the RF chip 4 are transmitted to the first antenna unit through the first coplanar waveguide transmission line, and can ensure that the first antenna unit generates almost no reflected signals, thereby improving the signal transmission efficiency. Similarly, the impedance matching circuit provided on the second coplanar waveguide transmission line can ensure that all high-frequency microwave signals from the RF chip 4 are transmitted to the second antenna unit through the second coplanar waveguide transmission line, and can ensure that the second antenna unit generates almost no reflected signals, thereby improving the signal transmission efficiency.
在某些实施方式中,第二天线模块包括设置于第二净空区域122中的第三天线单元和第四天线单元。在一实施例中,第三天线单元可以设置为双频2.4GHz+5GHz天线,第四天线单元可以设置为单频2.4GHz天线。In some embodiments, the second antenna module includes a third antenna unit and a fourth antenna unit disposed in the second clearance area 122. In one embodiment, the third antenna unit can be configured as a dual-band 2.4 GHz + 5 GHz antenna, and the fourth antenna unit can be configured as a single-band 2.4 GHz antenna.
在某些实施方式中,第三天线单元通过第三共面波导传输线与射频芯片4连接,第四天线单元通过第四共面波导传输线与射频芯片4连接。第三共面波导传输线和第四共面波导传输线均包括中心导体带以及位于该中心导体带两侧的导体平面。In some embodiments, the third antenna unit is connected to the RF chip 4 via a third coplanar waveguide transmission line, and the fourth antenna unit is connected to the RF chip 4 via a fourth coplanar waveguide transmission line. The third coplanar waveguide transmission line and the fourth coplanar waveguide transmission line both include a central conductor strip and conductor planes located on both sides of the central conductor strip.
在某些实施方式中,第三共面波导传输线和第四共面波导传输线上均设置有阻抗匹配电路。设置于第三共面波导传输线上的阻抗匹配电路能够确保通过第三共面波导传输线将来自射频芯片4的所有高频微波信号全部传输到第三天线单元,并能够确保第三天线单元几乎不产生反射信号,提高了信号传输效率。同理,设置于第四共面波导传输线上的阻抗匹配电路能够确保通过第四共面波导传输线将来自射频芯片4的所有高频微波信号全部传输到第四天线单元,并能够确保第四天线单元几乎不产生反射信号,提高了信号传输效率。In some embodiments, impedance matching circuits are provided on both the third coplanar waveguide transmission line and the fourth coplanar waveguide transmission line. The impedance matching circuit provided on the third coplanar waveguide transmission line can ensure that all high-frequency microwave signals from the RF chip 4 are transmitted to the third antenna unit through the third coplanar waveguide transmission line, and can ensure that the third antenna unit generates almost no reflected signals, thereby improving signal transmission efficiency. Similarly, the impedance matching circuit provided on the fourth coplanar waveguide transmission line can ensure that all high-frequency microwave signals from the RF chip 4 are transmitted to the fourth antenna unit through the fourth coplanar waveguide transmission line, and can ensure that the fourth antenna unit generates almost no reflected signals, thereby improving signal transmission efficiency.
阻抗匹配电路例如可以是π形阻抗匹配电路、T型阻抗匹配电路等,本实施例对阻抗匹配电路的类型不作限制。通过设置阻抗匹配电路,还可以在天线组件出现频偏后调正频率,还可以使天线组件与有源器件匹配以提升天线组件的整体辐射性能。The impedance matching circuit may be, for example, a π-shaped impedance matching circuit, a T-shaped impedance matching circuit, etc., and this embodiment does not limit the type of the impedance matching circuit. By setting the impedance matching circuit, the frequency can be adjusted after the antenna component has a frequency deviation, and the antenna component can be matched with an active device to improve the overall radiation performance of the antenna component.
在某些实施方式中,金属谐振腔3的底部到天线模块的距离等于天线模块辐射的电磁波的四分之一波长。如图3所示,L=λ/4,其中,L为金属谐振腔3的底部到天线模块的距离,λ为电磁波的波长,通过设置金属谐振腔3的底部到天线模块的距离等于天线模块辐射的电磁波的四分之一波长,天线模块向金属谐振腔3底部所辐射的电磁波经反射到达天线模块时,被反射的电磁波与天线模块所辐射的电磁波的相位相同,电磁波同相叠加可以提高电磁波的信号强度,提高了整个天线组件的前向辐射性能。In some embodiments, the distance from the bottom of the metal resonant cavity 3 to the antenna module is equal to one quarter wavelength of the electromagnetic wave radiated by the antenna module. As shown in FIG3 , L=λ/4, where L is the distance from the bottom of the metal resonant cavity 3 to the antenna module, and λ is the wavelength of the electromagnetic wave. By setting the distance from the bottom of the metal resonant cavity 3 to the antenna module equal to one quarter wavelength of the electromagnetic wave radiated by the antenna module, when the electromagnetic wave radiated by the antenna module to the bottom of the metal resonant cavity 3 is reflected and reaches the antenna module, the reflected electromagnetic wave has the same phase as the electromagnetic wave radiated by the antenna module, and the in-phase superposition of the electromagnetic waves can improve the signal strength of the electromagnetic wave, thereby improving the forward radiation performance of the entire antenna assembly.
在实际应用中,本领域技术人员还可以设置任意结构的第一天线单元、第二天线单元、第三天线单元和第四天线单元,以下结合图7所示说明本申请其他示例的天线单元。In practical applications, those skilled in the art may also set a first antenna unit, a second antenna unit, a third antenna unit and a fourth antenna unit of any structure. The antenna units of other examples of the present application are described below in conjunction with FIG. 7 .
如图7所示,第一净空区域121为矩形净空区域,第一天线单元包括第一馈电枝节211和第一接地枝节,第二天线单元包括第二接地枝节。第一馈电枝节211自第一净空区域121的第一边界1211向第一净空区域121内延伸,第一馈电枝节211的馈电点通过第一共面波导传输线14与射频芯片4连接。As shown in Fig. 7, the first clearance area 121 is a rectangular clearance area, the first antenna unit includes a first feeding branch 211 and a first grounding branch, and the second antenna unit includes a second grounding branch. The first feeding branch 211 extends from the first boundary 1211 of the first clearance area 121 into the first clearance area 121, and the feeding point of the first feeding branch 211 is connected to the RF chip 4 through the first coplanar waveguide transmission line 14.
第一接地枝节包括依次连接的第一接地子枝节2121、第二接地子枝节2122、第三接地子枝节2123以及第四接地子枝节2124。第四接地子枝节2124与第一馈电枝节211相连接。第一接地子枝节2121与第一馈电枝节211平行,并且自第一净空区域121的第一边界1211向第一净空区域121内部延伸。第二接地子枝节2122与第一接地子枝节2121垂直,第四接
地子枝节2124与第一馈电枝节211相连接,第一接地子枝节2121、第二接地子枝节2122、第三接地子枝节2123以及第四接地子枝节2124均位于第一馈电枝节211的同一侧。第三接地子枝节2123与第一边界1211相接触。The first grounding branch node includes a first grounding sub-branch node 2121, a second grounding sub-branch node 2122, a third grounding sub-branch node 2123, and a fourth grounding sub-branch node 2124 connected in sequence. The fourth grounding sub-branch node 2124 is connected to the first feeding branch node 211. The first grounding sub-branch node 2121 is parallel to the first feeding branch node 211, and extends from the first boundary 1211 of the first clearance area 121 to the inside of the first clearance area 121. The second grounding sub-branch node 2122 is perpendicular to the first grounding sub-branch node 2121, and the fourth grounding sub-branch node 2124 is connected to the first feeding branch node 211. The ground sub-branch 2124 is connected to the first feeding branch 211. The first ground sub-branch 2121, the second ground sub-branch 2122, the third ground sub-branch 2123 and the fourth ground sub-branch 2124 are all located on the same side of the first feeding branch 211. The third ground sub-branch 2123 contacts the first boundary 1211.
第二接地枝节包括依次连接的第十五耦合子枝节2131、第十六耦合子枝节2132、第十七接地子枝节2133、第十八接地子枝节2134和第十九接地子枝节2135,并且互相连接的两个接地子枝节互相垂直。第十五耦合子枝节2131、第十七接地子枝节2133和第十九接地子枝节2135互相平行,第十六耦合子枝节2132与第十八接地子枝节2134互相平行。第十九接地子枝节2135从第二边界1212向第一净空区域121内延伸。第二边界1212与第一边界1211互相垂直。第十七接地子枝节2133与第二边界1212相接触。The second grounding branch node includes a fifteenth coupling sub-branch node 2131, a sixteenth coupling sub-branch node 2132, a seventeenth grounding sub-branch node 2133, an eighteenth grounding sub-branch node 2134 and a nineteenth grounding sub-branch node 2135 connected in sequence, and the two grounding sub-branches connected to each other are perpendicular to each other. The fifteenth coupling sub-branch node 2131, the seventeenth grounding sub-branch node 2133 and the nineteenth grounding sub-branch node 2135 are parallel to each other, and the sixteenth coupling sub-branch node 2132 and the eighteenth grounding sub-branch node 2134 are parallel to each other. The nineteenth grounding sub-branch node 2135 extends from the second boundary 1212 into the first clearance area 121. The second boundary 1212 is perpendicular to the first boundary 1211. The seventeenth grounding sub-branch node 2133 is in contact with the second boundary 1212.
如图7所示,第二净空区域122为矩形净空区域,第三天线单元包括第二馈电枝节221和第三接地枝节,第四天线单元包括第四接地枝节。第二馈电枝节221自第二净空区域122的第三边界1221向第二净空区域122内部延伸,第二馈电枝节221的馈电点通过第二共面波导传输线15与射频芯片4相连接。As shown in Fig. 7, the second clearance area 122 is a rectangular clearance area, the third antenna unit includes a second feed branch 221 and a third ground branch, and the fourth antenna unit includes a fourth ground branch. The second feed branch 221 extends from the third boundary 1221 of the second clearance area 122 to the inside of the second clearance area 122, and the feeding point of the second feed branch 221 is connected to the RF chip 4 through the second coplanar waveguide transmission line 15.
第三接地枝节包括第九接地子枝节2225以及依次连接的第五接地子枝节2221、第六接地子枝节2222、第七接地子枝节2223和第八接地子枝节2224。第五接地子枝节2221与第二馈电枝节221相连接。互相连接的两个接地子枝节相互垂直。第五接地子枝节2221与第七接地子枝节2223互相平行。第六接地子枝节2222与第八接地子枝节2224互相平行。第九接地子枝节2225自第二净空区域122的第四边界1222向第二净空区域122内部延伸。第九接地子枝节2225与第五接地子枝节2221、第六接地子枝节2222、第七接地子枝节2223、第八接地子枝节2224以及第二馈电枝节221均无接触。第六接地子枝节2222与第三边界1221相接触。The third grounding branch node includes a ninth grounding sub-branch node 2225 and a fifth grounding sub-branch node 2221, a sixth grounding sub-branch node 2222, a seventh grounding sub-branch node 2223 and an eighth grounding sub-branch node 2224 connected in sequence. The fifth grounding sub-branch node 2221 is connected to the second feeding branch node 221. The two grounding sub-branches connected to each other are perpendicular to each other. The fifth grounding sub-branch node 2221 and the seventh grounding sub-branch node 2223 are parallel to each other. The sixth grounding sub-branch node 2222 and the eighth grounding sub-branch node 2224 are parallel to each other. The ninth grounding sub-branch node 2225 extends from the fourth boundary 1222 of the second clearance area 122 to the inside of the second clearance area 122. The ninth grounding sub-branch node 2225 has no contact with the fifth grounding sub-branch node 2221, the sixth grounding sub-branch node 2222, the seventh grounding sub-branch node 2223, the eighth grounding sub-branch node 2224 and the second feeding branch node 221. The sixth grounding sub-branch 2222 contacts the third boundary 1221 .
第四接地枝节包括第十四接地子枝节2230以及依次连接的第十接地子枝节2226、第十一接地子枝节2227、第十二接地子枝节2228和第十三接地子枝节2229。第十四接地子枝节2230与第十接地子枝节2226、第十一接地子枝节2227、第十二接地子枝节2228、第十三接地子枝节2229以及第二馈电枝节221均无接触。互相连接的两个接地子枝节相互垂直。第十接地子枝节2226与第十二接地子枝节2228互相平行。第十一接地子枝节2227与第十三接地子枝节2229互相平行。第十四接地子枝节2230与第十一接地子枝节2227互相平行。第十四接地子枝节2230由第二净空区域122的第一边界1223向第二净空区域122的内侧延伸。第十接地子枝节2226由第二净空区域122的第二边界1224向第二净空区域122的内侧延伸。第十二接地子枝节2228与第二边界1224相接触。The fourth grounding branch node includes a fourteenth grounding sub-branch node 2230 and a tenth grounding sub-branch node 2226, an eleventh grounding sub-branch node 2227, a twelfth grounding sub-branch node 2228 and a thirteenth grounding sub-branch node 2229 connected in sequence. The fourteenth grounding sub-branch node 2230 has no contact with the tenth grounding sub-branch node 2226, the eleventh grounding sub-branch node 2227, the twelfth grounding sub-branch node 2228, the thirteenth grounding sub-branch node 2229 and the second feeding branch node 221. The two grounding sub-branches connected to each other are perpendicular to each other. The tenth grounding sub-branch node 2226 and the twelfth grounding sub-branch node 2228 are parallel to each other. The eleventh grounding sub-branch node 2227 and the thirteenth grounding sub-branch node 2229 are parallel to each other. The fourteenth grounding sub-branch node 2230 and the eleventh grounding sub-branch node 2227 are parallel to each other. The fourteenth grounding sub-branch node 2230 extends from the first boundary 1223 of the second clearance area 122 to the inner side of the second clearance area 122. The tenth grounding sub-branch 2226 extends from the second boundary 1224 of the second clearance area 122 to the inner side of the second clearance area 122. The twelfth grounding sub-branch 2228 contacts the second boundary 1224.
参考图10至图12所示,四个天线单元的回波损耗分别为S11、S22、S33和S44,第一
净空区域内两天线单元之间的隔离度为S21,第二净空区域内两天线单元之间的隔离度为S34,两个净空区域中同频的5GHZ的隔离度为S13、S23。Referring to FIG. 10 to FIG. 12 , the return losses of the four antenna units are S11, S22, S33 and S44 respectively. The isolation between the two antenna units in the clearance area is S21, the isolation between the two antenna units in the second clearance area is S34, and the isolation of the same frequency 5GHZ in the two clearance areas is S13 and S23.
在实际应用中,要确保每个净空区域内天线之间的隔离度以及两个净空区域的天线之间的隔离度,若隔离度太差则会导致两根天线之间的互相干扰,从而影响辐射效果(一般要求隔离度要低于-10dB)。为了提高隔离度,在某些实施方式中,如图9所示,第一天线模块还包括隔离地枝节1210。隔离地枝节1210设置于第一天线单元和第二天线单元之间,用于提高第一天线单元和第二天线单元之间的隔离度。例如,隔离地枝节的一端可以与第一边和第二边的交点相接触,隔离地枝节的中轴线为第一边和第二边的夹角的角平分线,即隔离地枝节的中轴线与第一边的夹角为45°,与第二边的夹角也是45°。在一实施例中,隔离地枝节的长度为工作频率的四分之一波长,能够提高天线的隔离度;图13为加载隔离地枝节的示意图,虚线为未加枝节的隔离度,实线是加隔离地枝节后的隔离度,可见在5GHZ频段内隔离度提升了2dB左右,图12中的隔离地枝节1210使第一天线单元和第二天线单元间的隔离度比图7的隔离度提升了2dB。In practical applications, it is necessary to ensure the isolation between the antennas in each clearance area and the isolation between the antennas in two clearance areas. If the isolation is too poor, it will cause mutual interference between the two antennas, thereby affecting the radiation effect (generally, the isolation is required to be lower than -10dB). In order to improve the isolation, in some embodiments, as shown in Figure 9, the first antenna module also includes an isolation ground branch 1210. The isolation ground branch 1210 is arranged between the first antenna unit and the second antenna unit to improve the isolation between the first antenna unit and the second antenna unit. For example, one end of the isolation ground branch can be in contact with the intersection of the first side and the second side, and the central axis of the isolation ground branch is the bisector of the angle between the first side and the second side, that is, the central axis of the isolation ground branch is 45° with the first side, and the angle with the second side is also 45°. In one embodiment, the length of the isolation ground branch is one quarter of the wavelength of the operating frequency, which can improve the isolation of the antenna; Figure 13 is a schematic diagram of loading the isolation ground branch, the dotted line is the isolation without the branch, and the solid line is the isolation after adding the isolation ground branch. It can be seen that the isolation is improved by about 2dB in the 5GHZ frequency band. The isolation ground branch 1210 in Figure 12 increases the isolation between the first antenna unit and the second antenna unit by 2dB compared with the isolation in Figure 7.
如图14所示的示例,第一净空区域121和第二净空区域122位于射频芯片4的同一侧,图14所示示例的结构与图7所示示例的结构的差别在于图14中的接地子枝节2231替换了图7中的第二馈电枝节221,图14中的馈电枝节2232替换了图7中的第十四接地子枝节2230,并且馈电枝节2232通过共面波导传输线16与射频芯片4连接。As shown in the example of Figure 14, the first clearance area 121 and the second clearance area 122 are located on the same side of the RF chip 4. The difference between the structure of the example shown in Figure 14 and the structure of the example shown in Figure 7 is that the grounding sub-branch 2231 in Figure 14 replaces the second feeding branch 221 in Figure 7, and the feeding branch 2232 in Figure 14 replaces the fourteenth grounding sub-branch 2230 in Figure 7, and the feeding branch 2232 is connected to the RF chip 4 via the coplanar waveguide transmission line 16.
以上实施方式中以每个天线模块包含两个天线单元、传输线为共面波导传输线为示例说明了天线模块的结构、传输线的结构和走线,在实际应用中,本领域技术人员可以根据实际需要设置天线模块的数量、设计不同结构的天线模块以及布局不同的传输线,本申请实施例对天线模块的数量、结构不加以限制,对传输线的结构和走线方式也不加以限制。In the above implementation manner, each antenna module includes two antenna units, and the transmission line is a coplanar waveguide transmission line as an example to illustrate the structure of the antenna module, the structure and routing of the transmission line. In practical applications, those skilled in the art can set the number of antenna modules, design antenna modules with different structures, and layout different transmission lines according to actual needs. The embodiment of the present application does not limit the number and structure of the antenna modules, nor does it limit the structure and routing of the transmission lines.
相比于相关技术,本申请实施例的天线组件,能够在不改变净空区面积且保证天线辐射效率的情况下,将单模组双天线变为双模组四天线,从而能够在同一块天线板上实现WiFi功能、AP功能和蓝牙通信功能,而且不会增加净空区域面积,大幅降低了产品生产成本。Compared with the related art, the antenna assembly of the embodiment of the present application can transform a single-module dual antenna into a dual-module four antenna without changing the area of the clearance area and ensuring the antenna radiation efficiency, thereby realizing WiFi function, AP function and Bluetooth communication function on the same antenna board without increasing the area of the clearance area, thereby greatly reducing the product production cost.
如图15所示,本申请另一个实施例提供了一种交互平板100,包括显示屏101以及上述任一实施方式的天线组件,天线组件位于显示屏101的背面。As shown in FIG. 15 , another embodiment of the present application provides an interactive tablet 100 , including a display screen 101 and the antenna assembly of any of the above embodiments, wherein the antenna assembly is located on the back of the display screen 101 .
在某些实施方式中,天线组件还包括金属谐振腔,金属谐振腔设置在介质基板1的第二面,在垂直于第二面的方向上,第一净空区域在金属谐振腔上的投影的至少一部分位于金属谐振腔的外轮廓之内,第二净空区域在金属谐振腔上的投影的至少一部分位于金属谐振腔的外轮廓之内。In some embodiments, the antenna assembly further includes a metal resonant cavity, which is disposed on the second surface of the dielectric substrate 1. In a direction perpendicular to the second surface, at least a portion of a projection of the first clearance area on the metal resonant cavity is located within an outer contour of the metal resonant cavity, and at least a portion of a projection of the second clearance area on the metal resonant cavity is located within an outer contour of the metal resonant cavity.
在某些实施方式中,交互平板100包括显示屏101、金属背板、天线组件和主板,其中,
金属背板位于显示屏后方并且金属背板上设置有通孔,天线组件设置在金属背板背向显示屏的一面,并且位于显示屏的显示区域内,天线组件与通孔正对设置,主板设置于金属背板背向显示屏的一面,天线组件与主板电连接。In some embodiments, the interactive tablet 100 includes a display screen 101, a metal back plate, an antenna assembly, and a main board, wherein: The metal back plate is located behind the display screen and is provided with a through hole. The antenna assembly is arranged on the side of the metal back plate facing away from the display screen and is located within the display area of the display screen. The antenna assembly is arranged opposite to the through hole. The main board is arranged on the side of the metal back plate facing away from the display screen, and the antenna assembly is electrically connected to the main board.
本申请实施例提供的交互平板与本申请实施例提供的天线组件出于相同的申请构思,具有与其采用、运行或实现的方法相同的有益效果。The interactive tablet provided in the embodiment of the present application and the antenna assembly provided in the embodiment of the present application are based on the same application concept and have the same beneficial effects as the methods adopted, operated or implemented therein.
如图16所示,本申请的另一个实施例提供了一种电子设备,包括处理器以及上述任一实施方式的天线组件,处理器与射频芯片相连接。As shown in FIG. 16 , another embodiment of the present application provides an electronic device, including a processor and an antenna assembly of any of the above embodiments, wherein the processor is connected to a radio frequency chip.
处理器可以是一种集成电路芯片,具有信号的处理能力。上述的处理器可以是通用处理器,可以包括中央处理器(Central Processing Unit,简称CPU)、网络处理器(NetworkProcessor,简称NP)等;还可以是数字信号处理器(DSP)、专用集成电路(ASIC)、现成可编程门阵列(FPGA)或者其他可编程逻辑器件、分立门或者晶体管逻辑器件、分立硬件组件。The processor can be an integrated circuit chip with signal processing capabilities. The above-mentioned processor can be a general-purpose processor, including a central processing unit (CPU), a network processor (NP), etc.; it can also be a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA) or other programmable logic devices, discrete gate or transistor logic devices, and discrete hardware components.
本申请实施例提供的电子设备与本申请实施例提供的天线组件出于相同的申请构思,具有与其采用、运行或实现的方法相同的有益效果。The electronic device provided in the embodiment of the present application and the antenna assembly provided in the embodiment of the present application are based on the same application concept and have the same beneficial effects as the methods adopted, operated or implemented therein.
在本说明书的描述中,参考术语“一实施例”、“示例”等的描述意指结合该实施例或示例描述的特征、结构、材料或者特点包含于本申请的至少一个实施例或示例中。在本说明书中,对上述术语的示意性表述不一定指的是相同的实施例或示例。In the description of this specification, the description with reference to the terms "an embodiment", "example", etc. means that the features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example.
此外,应当理解,虽然本说明书按照实施方式加以描述,但并非每个实施方式仅包含一个独立的技术方案,说明书的这种叙述方式仅仅是为清楚器件,本领域技术人员应当将说明书作为一个整体,各实施例中的技术方案也可以适当组合,形成本领域技术人员可以理解的其他实施方式。In addition, it should be understood that although this specification is described according to implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the purpose of clarifying the device. Those skilled in the art should take the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.
以上结合实施例描述了本申请的技术原理。这些描述只是为了解释本申请的原理,而不能以任何方式解释为对本申请保护范围的限制。基于此处的解释,本领域的技术人员不需要付出创造性的劳动即可联想到本申请的其它实施方式,这些方式都将落入本申请的保护范围之内。
The technical principles of the present application are described above in conjunction with the embodiments. These descriptions are only for explaining the principles of the present application and cannot be interpreted as limiting the scope of protection of the present application in any way. Based on the explanations herein, those skilled in the art can think of other implementation methods of the present application without paying creative work, and these methods will fall within the scope of protection of the present application.
Claims (19)
- 一种天线组件,其中,包括:An antenna assembly, comprising:介质基板,所述介质基板的第一面设置有接地面、以及位于所述接地面中的第一净空区域和第二净空区域;A dielectric substrate, wherein a first surface of the dielectric substrate is provided with a ground plane, and a first clearance area and a second clearance area located in the ground plane;射频芯片,所述射频芯片设置在所述介质基板上;A radio frequency chip, wherein the radio frequency chip is arranged on the dielectric substrate;第一天线模块,与所述射频芯片相连接,所述第一天线模块包括第一天线单元和第二天线单元;以及,a first antenna module connected to the radio frequency chip, wherein the first antenna module includes a first antenna unit and a second antenna unit; and第二天线模块,与所述射频芯片相连接,所述第二天线模块包括第三天线单元和第四天线单元。The second antenna module is connected to the radio frequency chip, and the second antenna module includes a third antenna unit and a fourth antenna unit.
- 根据权利要求1所述的天线组件,其中,所述第一天线模块设置在所述第一净空区域中,用于实现WiFi通信功能和蓝牙通信功能。The antenna assembly according to claim 1, wherein the first antenna module is arranged in the first clearance area to implement WiFi communication function and Bluetooth communication function.
- 根据权利要求1或2所述的天线组件,其中,所述第二天线模块设置在所述第二净空区域中,用于实现无线AP功能。The antenna assembly according to claim 1 or 2, wherein the second antenna module is arranged in the second clearance area to implement a wireless AP function.
- 根据权利要求1所述的天线组件,其中,所述天线组件还包括:The antenna assembly according to claim 1, wherein the antenna assembly further comprises:金属谐振腔,所述金属谐振腔设置在所述介质基板的第二面,在垂直于所述第二面的方向上,所述第一净空区和/或所述第二净空区位于所述金属谐振腔内。A metal resonant cavity is provided on the second surface of the dielectric substrate, and in a direction perpendicular to the second surface, the first clearance area and/or the second clearance area is located in the metal resonant cavity.
- 根据权利要求4所述的天线组件,其中,所述第一净空区域和所述第二净空区域在所述金属谐振腔上的投影均位于所述金属谐振腔的外轮廓之内。The antenna assembly according to claim 4, wherein projections of the first clearance area and the second clearance area on the metal resonant cavity are both located within an outer contour of the metal resonant cavity.
- 根据权利要求1所述的天线组件,其中,所述第一天线模块包括设置于所述第一净空区域中的第一天线单元和第二天线单元。The antenna assembly of claim 1, wherein the first antenna module comprises a first antenna unit and a second antenna unit disposed in the first clearance area.
- 根据权利要求6所述的天线组件,其中,所述第一天线模块还包括隔离地枝节,所述隔离地枝节设置于所述第一天线单元和所述第二天线单元之间,用于提高所述第一天线单元和所述第二天线单元之间的隔离度。The antenna assembly according to claim 6, wherein the first antenna module further comprises an isolation ground branch, wherein the isolation ground branch is arranged between the first antenna unit and the second antenna unit to improve the isolation between the first antenna unit and the second antenna unit.
- 根据权利要求7所述的天线组件,其中,所述第一净空区域为矩形,所述第一天线单元与所述矩形的第一边相接触,所述第二天线单元与所述矩形的第二边相接触,所述第二边与所述第一边互相垂直。The antenna assembly according to claim 7, wherein the first clearance area is a rectangle, the first antenna unit is in contact with a first side of the rectangle, the second antenna unit is in contact with a second side of the rectangle, and the second side is perpendicular to the first side.
- 根据权利要求8所述的天线组件,其中,所述隔离地枝节的一端与所述第一边和所述第二边的交点相接触。The antenna assembly according to claim 8, wherein one end of the isolated ground branch contacts an intersection of the first side and the second side.
- 根据权利要求6所述的天线组件,其中,所述第一天线单元通过第一共面波导传输线与所述射频芯片连接,所述第二天线单元通过第二共面波导传输线与所述射频芯片连接。 The antenna assembly according to claim 6, wherein the first antenna unit is connected to the RF chip through a first coplanar waveguide transmission line, and the second antenna unit is connected to the RF chip through a second coplanar waveguide transmission line.
- 根据权利要求10所述的天线组件,其中,所述第一共面波导传输线和所述第二共面波导传输线上均设置有阻抗匹配电路。The antenna assembly according to claim 10, wherein the first coplanar waveguide transmission line and the second coplanar waveguide transmission line are both provided with an impedance matching circuit.
- 根据权利要求1所述的天线组件,其中,所述第三天线单元通过第三共面波导传输线与所述射频芯片连接,所述第四天线单元通过第四共面波导传输线与所述射频芯片连接。The antenna assembly according to claim 1, wherein the third antenna unit is connected to the RF chip through a third coplanar waveguide transmission line, and the fourth antenna unit is connected to the RF chip through a fourth coplanar waveguide transmission line.
- 根据权利要求12所述的天线组件,其中,所述第三共面波导传输线和所述第四共面波导传输线上均设置有阻抗匹配电路。The antenna assembly according to claim 12, wherein the third coplanar waveguide transmission line and the fourth coplanar waveguide transmission line are both provided with impedance matching circuits.
- 根据权利要求12所述的天线组件,其中,所述第三天线单元为双频2.4GHz+5GHz天线。The antenna assembly according to claim 12, wherein the third antenna unit is a dual-band 2.4 GHz + 5 GHz antenna.
- 根据权利要求12所述的天线组件,其中,所述第四天线单元为单频2.4GHz天线。The antenna assembly according to claim 12, wherein the fourth antenna unit is a single-frequency 2.4 GHz antenna.
- 根据权利要求1-15任一项所述的天线组件,其中,所述射频芯片设置在所述介质基板的第一面或第二面上。The antenna assembly according to any one of claims 1 to 15, wherein the radio frequency chip is arranged on the first surface or the second surface of the dielectric substrate.
- 一种交互平板,其中,所述交互平板包括显示屏以及权利要求1-16任一项所述的天线组件,所述天线组件位于所述显示屏的背面。An interactive tablet, wherein the interactive tablet comprises a display screen and the antenna assembly according to any one of claims 1 to 16, and the antenna assembly is located on the back of the display screen.
- 根据权利要求17所述的交互平板,其中,所述天线组件还包括金属谐振腔,所述金属谐振腔设置在所述介质基板的第二面,在垂直于所述第二面的方向上,所述第一净空区域在所述金属谐振腔上的投影的至少一部分位于所述金属谐振腔的外轮廓之内,所述第二净空区域在所述金属谐振腔上的投影的至少一部分位于所述金属谐振腔的外轮廓之内。The interactive tablet according to claim 17, wherein the antenna assembly further comprises a metal resonant cavity, the metal resonant cavity is arranged on the second surface of the dielectric substrate, and in a direction perpendicular to the second surface, at least a portion of a projection of the first clearance area on the metal resonant cavity is located within an outer contour of the metal resonant cavity, and at least a portion of a projection of the second clearance area on the metal resonant cavity is located within an outer contour of the metal resonant cavity.
- 一种电子设备,其中,包括处理器以及权利要求1-16任一项所述的天线组件,所述处理器与所述射频芯片相连接。 An electronic device, comprising a processor and the antenna assembly according to any one of claims 1 to 16, wherein the processor is connected to the radio frequency chip.
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CN202211458049.2 | 2022-11-16 | ||
CN202211458049.2A CN118054211A (en) | 2022-11-16 | 2022-11-16 | Antenna assembly, interactive flat board and electronic equipment |
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WO2024104285A1 true WO2024104285A1 (en) | 2024-05-23 |
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Citations (6)
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KR20040004217A (en) * | 2003-11-20 | 2004-01-13 | 주식회사 선우커뮤니케이션 | Dual band chip antenna for wireless LAN |
CN106935971A (en) * | 2015-12-29 | 2017-07-07 | 华为技术有限公司 | Antenna and communication equipment |
CN207069057U (en) * | 2017-08-15 | 2018-03-02 | 深圳市信维通信股份有限公司 | A kind of small size double frequency WIFI antenna MIMO systems |
CN207517873U (en) * | 2017-11-06 | 2018-06-19 | 珠海市魅族科技有限公司 | A kind of antenna assembly and terminal device |
TWI734488B (en) * | 2020-05-21 | 2021-07-21 | 啟碁科技股份有限公司 | Electronic device and antenna module thereof |
CN114766071A (en) * | 2020-11-12 | 2022-07-19 | 广州视源电子科技股份有限公司 | Antenna assembly and electronic equipment |
-
2022
- 2022-11-16 CN CN202211458049.2A patent/CN118054211A/en active Pending
-
2023
- 2023-11-13 WO PCT/CN2023/131197 patent/WO2024104285A1/en unknown
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
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KR20040004217A (en) * | 2003-11-20 | 2004-01-13 | 주식회사 선우커뮤니케이션 | Dual band chip antenna for wireless LAN |
CN106935971A (en) * | 2015-12-29 | 2017-07-07 | 华为技术有限公司 | Antenna and communication equipment |
CN207069057U (en) * | 2017-08-15 | 2018-03-02 | 深圳市信维通信股份有限公司 | A kind of small size double frequency WIFI antenna MIMO systems |
CN207517873U (en) * | 2017-11-06 | 2018-06-19 | 珠海市魅族科技有限公司 | A kind of antenna assembly and terminal device |
TWI734488B (en) * | 2020-05-21 | 2021-07-21 | 啟碁科技股份有限公司 | Electronic device and antenna module thereof |
CN114766071A (en) * | 2020-11-12 | 2022-07-19 | 广州视源电子科技股份有限公司 | Antenna assembly and electronic equipment |
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