WO2024098519A1 - 一种mems麦克风 - Google Patents

一种mems麦克风 Download PDF

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Publication number
WO2024098519A1
WO2024098519A1 PCT/CN2022/140833 CN2022140833W WO2024098519A1 WO 2024098519 A1 WO2024098519 A1 WO 2024098519A1 CN 2022140833 W CN2022140833 W CN 2022140833W WO 2024098519 A1 WO2024098519 A1 WO 2024098519A1
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WIPO (PCT)
Prior art keywords
diaphragm
electrode
mems microphone
fixed
back plate
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PCT/CN2022/140833
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English (en)
French (fr)
Inventor
赵转转
王琳琳
王凯杰
张睿
Original Assignee
瑞声声学科技(深圳)有限公司
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Application filed by 瑞声声学科技(深圳)有限公司 filed Critical 瑞声声学科技(深圳)有限公司
Priority to US18/454,042 priority Critical patent/US20240155296A1/en
Publication of WO2024098519A1 publication Critical patent/WO2024098519A1/zh

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  • the utility model belongs to the technical field of microphones, and in particular relates to a MEMS microphone.
  • Capacitive MEMS (Micro-Electro-Mechanical System) microphone chips are mainly composed of a capacitor part and a substrate part.
  • the chip structure mainly includes a substrate structure with a back cavity, and a diaphragm and a fixed back plate structure located on the upper part of the substrate.
  • the diaphragm and the fixed back plate form a capacitor system.
  • the diaphragm in the microphone There are many ways to fix the diaphragm in the microphone: the fully fixed structure represented by Infineon, the cantilever beam structure with a fixed edge point represented by Knowles, and the partially fixed structure represented by AAC. Their diaphragms are connected to Asic (Application Specific Integrated Circuit) through a certain extended part as the lead-out electrode.
  • Asic Application Specific Integrated Circuit
  • the diaphragm with a cantilever beam structure fixed in the middle if the electrode is led out by conventional means, the purpose of improving sensitivity by fully releasing the residual stress of the diaphragm proposed in the original design of this structure is lost.
  • the purpose of the utility model is to provide a MEMS microphone, which can solve the problem in the related art that the sensitivity of the microphone is reduced due to the lead-out method of the electrode.
  • a MEMS microphone comprises a substrate having a back cavity, a support plate arranged on one side of the substrate and having a receiving cavity, and a capacitor system arranged on the support plate, wherein the capacitor system comprises a back plate fixed to the support plate, a fixing member fixed to a side of the back plate close to the substrate, and a diaphragm fixed to a side of the fixing member away from the back plate and received in the receiving cavity, wherein the fixing member is located in a central area of the diaphragm, and the diaphragm is arranged opposite to the back plate.
  • the MEMS microphone further comprises a first soldering pad fixed to a side of the support plate away from the substrate, and a first electrode fixedly connected to the central area of the diaphragm and electrically connected to the first soldering pad, wherein the first electrode is connected only to the central area of the diaphragm.
  • the diaphragm has a first notch extending from the edge of the diaphragm to the central area of the diaphragm, the first notch is provided with a bottom wall arranged opposite to the opening of the first notch, and two side walls respectively connected to the two ends of the bottom wall, the first electrode is fixedly connected to the bottom wall, and there is a gap between the first electrode and the side walls.
  • an end of the first electrode away from the bottom wall is flush with the edge of the diaphragm.
  • the MEMS microphone further includes a conductive member penetrating through the back plate and having two ends respectively fixedly connected to the first electrode and the first pad, the conductive member being connected to one end of the first electrode away from the bottom wall, and the first electrode and the first pad being electrically connected via the conductive member.
  • the MEMS microphone further includes a resisting member having one end fixed to the substrate and the other end abutting against the first electrode, wherein the resisting member is located between the two side walls of the first notch.
  • the MEMS microphone also includes a first support ring embedded and fixed in the accommodating cavity, two sides of the first support ring respectively abut against the diaphragm and the substrate, the first support ring has a second notch, a projection of the first notch along the thickness direction of the diaphragm projected onto the first support ring coincides with the second notch, and the abutting member is located in the second notch.
  • the MEMS microphone further includes a second supporting ring embedded and fixed in the accommodating cavity, the second supporting ring is located between the diaphragm and the back plate, and the conductive member passes through the second supporting ring.
  • the thickness of the second supporting ring is equal to the thickness of the fixing member.
  • the side of the back plate away from the substrate protrudes from the surface of the support plate away from the substrate
  • the first soldering pad includes a main body fixed to the support plate, a bending portion connected to the main body, and a connecting portion connected to an end of the bending portion away from the main body, and the conductive member passes through and is fixed to the connecting portion.
  • the MEMS microphone further includes a second pad fixed to the support plate, and a second electrode having two ends fixedly connected to the back plate and the second pad, respectively, and the first pad and the second pad are spaced apart.
  • the beneficial effects of the present invention are that the two sides of the fixing part are respectively fixedly connected to the back plate and the diaphragm, and the fixing part is located in the central area of the diaphragm, so that the diaphragm forms a cantilever beam structure with a middle fixation. Since the first electrode is only connected to the central area of the diaphragm, the first electrode will not interfere with the deformation of the edge area of the diaphragm, and the sensitivity of the microphone can be improved by fully releasing the residual stress of the diaphragm.
  • FIG1 is a top view of a MEMS microphone according to an embodiment of the present invention.
  • Fig. 2 is a cross-sectional view taken along the line A-A in Fig. 1;
  • FIG3 is a schematic diagram of the assembly of a diaphragm, a first electrode and a first pad in a MEMS microphone according to an embodiment of the present invention
  • FIG. 4 is an exploded view of a MEMS microphone according to an embodiment of the present invention.
  • An embodiment of the utility model provides a MEMS microphone, including a substrate 1 with a back cavity 11, a support plate 2 arranged on one side of the substrate 1 and having a receiving cavity 21, and a capacitor system 3 arranged on the support plate 2, the capacitor system 3 includes a back plate 31 fixed to the support plate 2, a fixing member 32 fixed to a side of the back plate 31 close to the substrate 1, and a diaphragm 33 fixed to a side of the fixing member 32 away from the back plate 31 and received in the receiving cavity 21, the fixing member 32 is located in the central area of the diaphragm 33, and the diaphragm 33 is arranged opposite to the back plate 31.
  • the MEMS microphone also includes a first soldering pad 4 fixed to a side of the support plate 2 away from the substrate 1, and a first electrode 5 fixedly connected to the central area of the diaphragm 33 and electrically connected to the first soldering pad 4, and the first electrode 5 is only connected to the central area of the diaphragm 33.
  • the first electrode 5 is a lead-out electrode corresponding to the diaphragm 33, and the two sides of the fixing member 32 are fixedly connected to the back plate 31 and the diaphragm 33 respectively, and the fixing member 32 is located in the central area of the diaphragm 33, so that the diaphragm 33 forms a cantilever beam structure with a middle fixation. Since the first electrode 5 is only connected to the central area of the diaphragm 33, the first electrode 5 will not interfere with the deformation of the edge area of the diaphragm 33, and the sensitivity of the microphone can be improved by fully releasing the residual stress of the diaphragm 33.
  • the fixing member 32 can be a fixing plate.
  • the size of the fixing member 32 is moderate, which can ensure that the diaphragm 33 and the back plate 31 have sufficient connection strength and can also enable the diaphragm 33 to maintain sufficient vibration deformation strength;
  • the base 1 and the support plate 2 can both be rectangular plates, the longitudinal cross-sectional area of the back cavity 11 is smaller than the longitudinal cross-sectional area of the receiving cavity 21, and the capacitor system 3 is received in the receiving cavity 21, that is, the back plate 31, the fixing member 32 and the diaphragm 33 are all located in the receiving cavity 21; wherein the receiving cavity 21 is connected to the back cavity 11, and the back plate 31 is embedded and fixed in the receiving cavity 21, a plurality of sound holes are opened on the surface of the back plate 31, and the diaphragm 33 is arranged opposite to the back plate 31.
  • the diaphragm 33, the cavity wall of the receiving cavity 21 and the base 1 together form a first oscillation sound cavity
  • the diaphragm 33, the cavity wall of the receiving cavity 21 and the back plate 31 together form a second oscillation sound cavity.
  • the size of the first notch 331 is moderate.
  • the area of the diaphragm 33 is small, which is not conducive to the pressure difference between the first oscillation sound cavity and the second oscillation sound cavity.
  • the first notch 331 is too small, it is not conducive to fixing the first electrode 5 on the diaphragm 33 .
  • the first electrode 5 can be a rectangular plate, and the first notch 331 corresponds to a rectangular notch.
  • the MEMS microphone further includes a conductive member 6 that passes through the back plate 31 and has two ends fixedly connected to the first electrode 5 and the first pad 4, respectively.
  • the conductive member 6 is connected to one end of the first electrode 5 away from the bottom wall 3311.
  • the first electrode 5 and the first pad 4 are electrically connected through the conductive member 6.
  • the conductive member 6 can be a cylinder, and the conductive member 6 is hollowed out to reduce the mass of the conductive member 6.
  • the conductive member 6 is used to realize the electrical connection between the first electrode 5 and the first pad 4.
  • the MEMS microphone further includes a stopper 7 having one end fixed to the substrate 1 and the other end abutting against the first electrode 5 .
  • the stopper 7 is located between the two side walls 3312 of the first notch 331 .
  • the stopper 7 can clamp and fix the first electrode 5 together with the conductive member 6 , so that the first electrode 5 does not shake up and down when the diaphragm 33 vibrates, so as to avoid the first electrode 5 from breaking due to shaking.
  • the first stopper 7 can be an insulator, which is used to place the first electrode 5 in electrical connection with the substrate 1 .
  • the stopper 7 can be a circular plate, and the longitudinal cross-sectional area of the stopper 7 is smaller than the plate area of the first electrode 5 .
  • the MEMS microphone further includes a first support ring 8 embedded and fixed in the receiving cavity 21.
  • the two sides of the first support ring 8 are respectively in contact with the diaphragm 33 and the substrate 1, so that the first support ring 8 can support the diaphragm 33.
  • the first support ring 8 is conducive to the formation of the first oscillation sound cavity.
  • the first support ring 8 is provided with a second notch 81. The projection of the first notch 331 on the first support ring 8 along the thickness direction of the diaphragm 33 coincides with the second notch 81, so that the first electrode 5 will not contact the first support ring 8.
  • the first support ring 8 is a circular ring, and the first circular ring is an insulator to further prevent the first electrode 5 from being connected to the substrate 1.
  • the MEMS microphone also includes a second support ring 9 embedded and fixed in the receiving cavity 21.
  • the second support ring 9 is located between the diaphragm 33 and the back plate 31, and the conductive member 6 passes through the second support ring 9.
  • the second support ring 9 can support the back plate 31.
  • the second support ring 9 is an insulator to prevent the back plate 31 from being connected to the first electrode 5.
  • the second support ring 9 is conducive to the formation of the second sound cavity. Since the conductive member 6 passes through the second support ring 9, the second support ring 9 can play a positioning role for the conductive member 6, so as to achieve rapid positioning of the conductive member 6 and the first electrode 5 during the assembly process.
  • the thickness of the second support ring 9 is equal to the thickness of the fixing member 32 to ensure that the distance between the diaphragm 33 and the back plate 31 is equal when the diaphragm 33 is stationary.
  • the thickness of the second support ring 9 can also be set to be less than the thickness of the fixing member 32.
  • the first support ring 8 can be fixed to the back plate 31 or to the cavity wall of the receiving cavity 21.
  • the side of the back plate 31 away from the substrate 1 protrudes from the surface of the side of the support plate 2 away from the substrate 1.
  • the first pad 4 includes a main body 41 fixed to the support plate 2, a bent portion 42 connected to the main body 41, and a connecting portion 43 connected to one end of the bent portion 42 away from the main body 41.
  • the conductive member 6 passes through and is fixed to the connecting portion 43.
  • the main body 41 can be a circular plate
  • the bent portion 42 and the connecting portion 43 can be rectangular plates
  • the area of the main body 41 is larger than the area of the bent portion 42 and the connecting portion 43, which is conducive to the first pad 4 being connected to the Asic circuit
  • the bent portion 42 is vertically fixed to the board surface of the main body 41 and the board surface of the connecting portion 43, that is, the connecting portion 43 and the main body 41 are arranged in parallel, which is conducive to the first pad 4 being closely attached to the support plate 2 and the back plate 31.
  • the MEMS microphone also includes a second pad fixed to the support plate 2, and a second electrode whose two ends are respectively fixedly connected to the back plate 31 and the second pad.
  • the first pad 4 and the second pad are spaced apart, which is conducive to non-conduction between the first pad 4 and the second pad.

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  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)

Abstract

本实用新型提供了一种MEMS麦克风，包括具有基底、设置于基底的一侧的支撑板、以及设置于支撑板的电容系统，电容系统包括固定于支撑板的背板、固定于背板靠近基底的一侧的固定件、以及固定于固定件远离背板的一侧的振膜，固定件位于振膜的中心区域，振膜与背板相对设置，MEMS麦克风还包括固定于支撑板远离基底的一侧的第一焊盘、以及固定连接于振膜的中心区域并与第一焊盘电连接的第一电极，第一电极仅与振膜的中心区域相连。本实用新型的振膜形成中间固定的悬臂梁结构，且第一电极仅与振膜的中心区域相连，使得第一电极不会对振膜的边缘区域的形变产生干扰，可以实现通过充分释放振膜残余应力的方式，提高麦克风的灵敏度。

Description

一种MEMS麦克风 技术领域
本实用新型属于麦克风技术领域，尤其涉及一种MEMS麦克风。
 背景技术
电容式MEMS（Micro-Electro-Mechanical System 微电机系统）麦克风芯片主要由电容部分和基底部分构成。芯片结构主要包括具有背腔的基底结构，以及位于基底上部的振膜与固定背板结构，振膜与固定背板组成了电容系统。当声压作用于振膜时，正对背板与背对背板的振膜两面存在压强差，使得振膜做靠近背板或远离背板的运动，从而引起振膜与背板间电容的变化，实现声音信号到电信号的转换。
麦克风中振膜的固定方式具有多种：以英飞凌为代表的全固定结构，以楼氏为代表的边缘一点固定的悬臂梁结构，以及以AAC为代表的部分固定结构，他们的振膜通过某一段伸出部分来作为引出电极，从而与Asic(Application Specific Integrated Circuit 专用集成电路电路)接通。然而，在相关技术中，对于中间固定的悬臂梁结构的振膜，如果电极通过常规方式来引出，则失去了此结构原有设计中提出的通过充分释放振膜残余应力，提高灵敏度的目的。
因此，有必要提供一种新的电极引出方式。
 技术问题
本实用新型的目的在于提供一种MEMS麦克风，能够解决相关技术中因电极的引出方式导致麦克风的灵敏度降低的问题。
 技术解决方案
本实用新型的技术方案如下：
一种MEMS麦克风，包括具有背腔的基底、设置于所述基底的一侧且具有收容腔的支撑板、以及设置于所述支撑板的电容系统，所述电容系统包括固定于所述支撑板的背板、固定于所述背板靠近所述基底的一侧的固定件、以及固定于所述固定件远离所述背板的一侧且收容于所述收容腔内的振膜，所述固定件位于所述振膜的中心区域，所述振膜与所述背板相对设置，所述MEMS麦克风还包括固定于所述支撑板远离所述基底的一侧的第一焊盘、以及固定连接于所述振膜的中心区域并与所述第一焊盘电连接的第一电极，所述第一电极仅与所述振膜的中心区域相连。
可选地，所述振膜开设自所述振膜的边缘延伸至所述振膜的中心区域的第一缺口，所述第一缺口设有与所述第一缺口的开口相对设置的底壁、以及分别连接于所述底壁的两端的两侧壁，所述第一电极的固定连接于所述底壁，且所述第一电极与所述侧壁之间具有间隙。
可选地，所述第一电极远离所述底壁的一端与所述振膜的边缘相齐平。
可选地，所述MEMS麦克风还包括贯穿通过所述背板且两端分别固定连接于所述第一电极和所述第一焊盘的导电件，所述导电件连接于所述第一电极远离所述底壁的一端，所述第一电极与所述第一焊盘通过所述导电件电连接。
可选地，所述MEMS麦克风还包括一端固定于所述基底且另一端抵接于所述第一电极的抵顶件，所述抵顶件位于所述第一缺口的两所述侧壁之间。
可选地，所述MEMS麦克风还包括嵌入固定于所述收容腔内的第一支撑环，所述第一支撑环的两侧分别抵接于所述振膜和所述基底，所述第一支撑环开设第二缺口，所述第一缺口沿所述振膜的厚度方向投射于所述第一支撑环上的投影与所述第二缺口相重合，所述抵顶件位于所述第二缺口内。
可选地，所述MEMS麦克风还包括嵌入固定于所述收容腔内的第二支撑环，所述第二支撑环位于所述振膜和所述背板之间，所述导电件贯穿通过所述第二支撑环。
可选地，所述第二支撑环的厚度与所述固定件的厚度相等。
可选地，所述背板远离所述基底的一侧突出于所述支撑板远离所述基底的一侧的表面，所述第一焊盘包括固定于所述支撑板的主体部、连接于所述主体部的弯折部、以及连接于所述弯折部远离所述主体部的一端的连接部，所述导电件贯穿通过并固定于所述连接部。
可选地，所述MEMS麦克风还包括固定于所述支撑板的第二焊盘、以及两端分别固定连接于所述背板和所述第二焊盘的第二电极，所述第一焊盘和所述第二焊盘间隔设置。
 有益效果
本实用新型的有益效果在于：固定件的两侧分别固定连接于背板和振膜，且固定件位于振膜的中心区域，使得振膜形成中间固定的悬臂梁结构，而由于第一电极仅与振膜的中心区域相连，使得第一电极不会对振膜的边缘区域的形变产生干扰，可以实现通过充分释放振膜残余应力的方式，提高麦克风的灵敏度。
 附图说明
图1为本实用新型实施例MEMS麦克风的俯视图；
图2是图1中A-A向的剖视图；
图3为本实用新型实施例MEMS麦克风中振膜、第一电极以及第一焊盘的装配示意图；
图4为本实用新型实施例MEMS麦克风的爆炸图。
 本发明的实施方式
下面结合附图和实施方式对本实用新型作进一步说明。
请参阅图1至图4，本实用新型实施例提供了一种MEMS麦克风，包括具有背腔11的基底1、设置于基底1的一侧且具有收容腔21的支撑板2、以及设置于支撑板2的电容系统3，电容系统3包括固定于支撑板2的背板31、固定于背板31靠近基底1的一侧的固定件32、以及固定于固定件32远离背板31的一侧且收容于收容腔21内的振膜33，固定件32位于振膜33的中心区域，振膜33与背板31相对设置，MEMS麦克风还包括固定于支撑板2远离基底1的一侧的第一焊盘4、以及固定连接于振膜33的中心区域并与第一焊盘4电连接的第一电极5，第一电极5仅与振膜33的中心区域相连。
应当理解，第一电极5为对应于振膜33的引出电极，固定件32的两侧分别固定连接于背板31和振膜33，且固定件32位于振膜33的中心区域，使得振膜33形成中间固定的悬臂梁结构，而由于第一电极5仅与振膜33的中心区域相连，使得第一电极5不会对振膜33的边缘区域的形变产生干扰，可以实现通过充分释放振膜33残余应力的方式，提高麦克风的灵敏度。
请参阅图2、图3以及图4，在一些实施例中，固定件32可以为固定板，固定件32的大小适中，既能保证振膜33与背板31之间具有足够的连接强度，也能使振膜33保持足够的振动形变强度；基底1和支撑板2均可以为矩形板，背腔11的纵截面面积小于收容腔21的纵截面面积，电容系统3收容于收容腔21内，即背板31、固定件32以及振膜33均位于收容腔21内；其中，收容腔21连通背腔11，背板31嵌入固定于收容腔21内，背板31的板面开设有若干个声孔，振膜33与背板31正对设置，振膜33、收容腔21的腔壁以及基底1共同围合形成第一振荡声腔，振膜33、收容腔21的腔壁以及背板31共同围合形成第二振荡声腔，当声压穿过背板31的声孔作用于振膜33时，第一振荡声腔和第二振荡声腔之间存在压强差，使得振膜33做靠近背板31或远离背板31的运动，从而引起振膜33与背板31间电容的变化，实现声音信号到电信号的转换。
请参阅图2、图3以及图4，在一个实施例中，振膜33开设自振膜33的边缘延伸至振膜33的中心区域的第一缺口331，第一缺口331设有与第一缺口331的开口相对设置的底壁3311、以及分别连接于底壁3311的两端的两侧壁3312，第一电极5的固定连接于底壁3311，且第一电极5与侧壁3312之间具有间隙。具体的，第一缺口331的底壁3311与固定件32之间具有一定距离，以保证固定件32与振膜33之间的连接强度；第一缺口331的大小适中，当第一缺口331过大时，振膜33的面积较小，不利于第一振荡声腔和第二振荡声腔之间产生压强差，当第一缺口331过小时，不利于将第一电极5固定在振膜33上。第一电极5与侧壁3312之间具有间隙，使得第一电极5不会干扰振膜33的边缘区域的形变，从而可以通过充分释放振膜33残余应力的方式，提高麦克风的灵敏度。优选地，第一电极5远离底壁3311的一端与振膜33的边缘相齐平，有利于在振膜33上设置第一电极5。根据实际需要，第一电极5可以为矩形板，则第一缺口331对应为矩形缺口。
请参阅图2、图3以及图4，在一个实施例中，MEMS麦克风还包括贯穿通过背板31且两端分别固定连接于第一电极5和第一焊盘4的导电件6，导电件6连接于第一电极5远离底壁3311的一端，第一电极5与第一焊盘4通过导电件6电连接。具体的，导电件6可以为圆柱体，导电件6挖空设置，以降低导电件6的质量，导电件6用于实现第一电极5与第一焊盘4之间电连接。
请参阅图2、图3以及图4，较佳地，MEMS麦克风还包括一端固定于基底1且另一端抵接于第一电极5的抵顶件7，抵顶件7位于第一缺口331的两侧壁3312之间，抵顶件7可以与导电件6共同夹持固定第一电极5，使得第一电极5在振膜33振动时不会上下晃动，以避免第一电极5因晃动而断裂；第一抵顶件7可以为绝缘体，放置第一电极5与基底1导通。根据实际需要，抵顶件7可以为圆板，且抵顶件7的纵截面面积小于第一电极5的板面面积。
请参阅图2、图3以及图4，在一个实施例中，MEMS麦克风还包括嵌入固定于收容腔21内的第一支撑环8，第一支撑环8的两侧分别抵接于振膜33和基底1，使得第一支撑环8可以支撑振膜33，同时，第一支撑环8有利于第一振荡声腔的形成；第一支撑环8开设第二缺口81，第一缺口331沿振膜33的厚度方向投射于第一支撑环8上的投影与第二缺口81相重合，使得第一电极5不会与第一支撑环8相接触，同时有利于给抵顶件7提供让位空间，以使抵顶件7位于第二缺口81内，保证第一支撑环8水平设置，从而使得振膜33水平设置。根据实际需要，第一支撑环8为圆环，第一圆环为绝缘体，以进一步避免第一电极5与基底1导通。
请参阅图2、图3以及图4，进一步地，MEMS麦克风还包括嵌入固定于收容腔21内的第二支撑环9，第二支撑环9位于振膜33和背板31之间，导电件6贯穿通过第二支撑环9。具体的，第二支撑环9可以支撑背板31，第二支撑环9为绝缘体，以避免背板31与第一电极5导通，同时，第二支撑环9有利于第二声腔的形成；由于导电件6贯穿通过第二支撑环9，使得第二支撑环9可以对导电件6起到定位作用，以实现在装配过程中导电件6与第一电极5快速定位。优选地，第二支撑环9的厚度与固定件32的厚度相等，以保证在振膜33静止时振膜33各处与背板31之间的距离相等。在其他实施例中，也可以设置第二支撑环9的厚度小于固定件32的厚度，此时第一支撑环8既可以固定在背板31，也可以固定在收容腔21的腔壁。
请参阅图2、图3以及图4，在一个实施例中，背板31远离基底1的一侧突出于支撑板2远离基底1的一侧的表面，第一焊盘4包括固定于支撑板2的主体部41、连接于主体部41的弯折部42、以及连接于弯折部42远离主体部41的一端的连接部43，导电件6贯穿通过并固定于连接部43。具体的，主体部41可以为圆板，弯折部42和连接部43可以为矩形板，且主体部41的面积大于弯折部42和连接部43的面积，有利于第一焊盘4与Asic电路接通；弯折部42垂直固定于主体部41的板面和连接部43的板面，即连接部43和主体部41平行设置，有利于第一焊盘4紧密贴合在支撑板2和背板31上。
在一个实施例中，MEMS麦克风还包括固定于支撑板2的第二焊盘、以及两端分别固定连接于背板31和第二焊盘的第二电极，第一焊盘4和第二焊盘间隔设置，有利于第一焊盘4和第二焊盘之间不导通。
以上所述的仅是本实用新型的实施方式，在此应当指出，对于本领域的普通技术人员来说，在不脱离本实用新型创造构思的前提下，还可以做出改进，但这些均属于本实用新型的保护范围。

Claims (10)

  1. 一种MEMS麦克风，包括具有背腔的基底、设置于所述基底的一侧且具有收容腔的支撑板、以及设置于所述支撑板的电容系统，所述电容系统包括固定于所述支撑板的背板、固定于所述背板靠近所述基底的一侧的固定件、以及固定于所述固定件远离所述背板的一侧且收容于所述收容腔内的振膜，所述固定件位于所述振膜的中心区域，所述振膜与所述背板相对设置，其特征在于，所述MEMS麦克风还包括固定于所述支撑板远离所述基底的一侧的第一焊盘、以及固定连接于所述振膜的中心区域并与所述第一焊盘电连接的第一电极，所述第一电极仅与所述振膜的中心区域相连。
  2. 根据权利要求1所述的MEMS麦克风，其特征在于，所述振膜开设自所述振膜的边缘延伸至所述振膜的中心区域的第一缺口，所述第一缺口设有与所述第一缺口的开口相对设置的底壁、以及分别连接于所述底壁的两端的两侧壁，所述第一电极的固定连接于所述底壁，且所述第一电极与所述侧壁之间具有间隙。
  3. 根据权利要求2所述的MEMS麦克风，其特征在于，所述第一电极远离所述底壁的一端与所述振膜的边缘相齐平。
  4. 根据权利要求2所述的MEMS麦克风，其特征在于，所述MEMS麦克风还包括贯穿通过所述背板且两端分别固定连接于所述第一电极和所述第一焊盘的导电件，所述导电件连接于所述第一电极远离所述底壁的一端，所述第一电极与所述第一焊盘通过所述导电件电连接。
  5. 根据权利要求4所述的MEMS麦克风，其特征在于，所述MEMS麦克风还包括一端固定于所述基底且另一端抵接于所述第一电极的抵顶件，所述抵顶件位于所述第一缺口的两所述侧壁之间。
  6. 根据权利要求5所述的MEMS麦克风，其特征在于，所述MEMS麦克风还包括嵌入固定于所述收容腔内的第一支撑环，所述第一支撑环的两侧分别抵接于所述振膜和所述基底，所述第一支撑环开设第二缺口，所述第一缺口沿所述振膜的厚度方向投射于所述第一支撑环上的投影与所述第二缺口相重合，所述抵顶件位于所述第二缺口内。
  7. 根据权利要求4所述的MEMS麦克风，其特征在于，所述MEMS麦克风还包括嵌入固定于所述收容腔内的第二支撑环，所述第二支撑环位于所述振膜和所述背板之间，所述导电件贯穿通过所述第二支撑环。
  8. 根据权利要求7所述的MEMS麦克风，其特征在于，所述第二支撑环的厚度与所述固定件的厚度相等。
  9. 根据权利要求4所述的MEMS麦克风，其特征在于，所述背板远离所述基底的一侧突出于所述支撑板远离所述基底的一侧的表面，所述第一焊盘包括固定于所述支撑板的主体部、连接于所述主体部的弯折部、以及连接于所述弯折部远离所述主体部的一端的连接部，所述导电件贯穿通过并固定于所述连接部。
  10. 根据权利要求1所述的MEMS麦克风，其特征在于，所述MEMS麦克风还包括固定于所述支撑板的第二焊盘、以及两端分别固定连接于所述背板和所述第二焊盘的第二电极，所述第一焊盘和所述第二焊盘间隔设置。
PCT/CN2022/140833 2022-11-08 2022-12-21 一种mems麦克风 WO2024098519A1 (zh)

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CN206061136U (zh) * 2016-08-26 2017-03-29 上海微联传感科技有限公司 硅麦克风
CN115002633A (zh) * 2022-08-02 2022-09-02 苏州敏芯微电子技术股份有限公司 麦克风组件及电子设备
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