WO2024095375A1 - Substrate conveying device - Google Patents

Substrate conveying device Download PDF

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Publication number
WO2024095375A1
WO2024095375A1 PCT/JP2022/040918 JP2022040918W WO2024095375A1 WO 2024095375 A1 WO2024095375 A1 WO 2024095375A1 JP 2022040918 W JP2022040918 W JP 2022040918W WO 2024095375 A1 WO2024095375 A1 WO 2024095375A1
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WO
WIPO (PCT)
Prior art keywords
substrate
pair
rollers
transport device
roller
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Application number
PCT/JP2022/040918
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French (fr)
Japanese (ja)
Inventor
貴規 ▲高▼木
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株式会社Fuji
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Publication date
Application filed by 株式会社Fuji filed Critical 株式会社Fuji
Priority to PCT/JP2022/040918 priority Critical patent/WO2024095375A1/en
Publication of WO2024095375A1 publication Critical patent/WO2024095375A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components

Definitions

  • the present invention relates to a substrate transport device.
  • Patent Document 1 discloses a configuration in which a pair of guide rails guides both widthwise ends of the board to be transported, and the board is moved in the transport direction by the rotation of a conveyor belt arranged below the pair of guide rails.
  • the purpose of this specification is to provide a substrate transport device that reduces the impact applied to the substrate when the substrate is loaded and prevents deformation of the substrate during transport.
  • a substrate transport device that includes a pair of guide rails that guide both widthwise ends of a substrate transported in a transport direction, the pair of guide rails are rotatably arranged around a vertical central axis at a loading position where the substrate is loaded, a number of rollers that introduce the substrate being transported between the pair of guide rails, and a buffer section that absorbs impact when the substrate comes into contact with the outer circumferential surfaces of the rollers.
  • This configuration reduces the impact when the substrate comes into contact with the outer circumferential surface of the roller, preventing deformation of the substrate when it is being transported.
  • FIG. 1 is a schematic diagram showing a configuration of a component mounting machine to which a board transport device is applied;
  • FIG. 2 is a perspective view of a main part of the substrate transport device.
  • FIG. 4 is a plan view of the buffer section as viewed from the direction IV in FIG. 3 .
  • 5 is a side view seen from the V direction in FIG. 4.
  • FIG. 13 is a perspective view showing a buffer portion in a modified embodiment.
  • the board transport device will be described with reference to the drawings.
  • a component mounting machine which is a board-related operation machine.
  • the board-related operation machine to which the board transport device can be applied is not limited to a component mounting machine, and various other operation machines that perform predetermined board-related operations on boards, such as solder printers and board inspection machines, can be used.
  • the component mounting machine 10 constitutes a production line for producing board products together with a plurality of types of board-related operation machines including, for example, other component mounting machines 10.
  • the board-related operation machines constituting the production line may include a solder printer, a board inspection machine, a reflow oven, and the like.
  • Substrate transport device 11 1 the component mounting machine 10 includes a board transport device 11.
  • the board transport device 11 sequentially transports boards 91 in a transport direction and positions the boards 91 at predetermined positions within the machine. The detailed configuration of the board transport device 11 will be described later.
  • the component mounting machine 10 includes a component supplying device 12.
  • the component supplying device 12 supplies components to be mounted on the board 91.
  • the component supplying device 12 has feeders 122 set in a plurality of slots 121.
  • the feeders 122 may be, for example, a tape feeder that feeds and moves a carrier tape containing a large number of components, thereby supplying the components so that they can be picked.
  • the component mounting machine 10 includes a component transfer device 13.
  • the component transfer device 13 transfers the components supplied by the component supply device 12 to a predetermined mounting position on the board 91.
  • the component transfer device 13 includes a head drive device 131, a movable table 132, a mounting head 133, and a suction nozzle 134.
  • the head drive device 131 moves the movable table 132 in the horizontal direction (X direction and Y direction) by a linear motion mechanism.
  • the mounting head 133 is detachably fixed to the movable table 132 by a clamp member (not shown) and is provided so as to be movable horizontally within the machine.
  • the mounting head 133 supports multiple suction nozzles 134 that are rotatable and movable up and down.
  • the suction nozzles 134 are holding members that pick up and hold the parts supplied by the feeder 122.
  • the suction nozzles 134 use the supplied negative pressure air to pick up the parts supplied by the feeder 122.
  • a chuck that holds the parts by gripping them can be used as the holding member attached to the mounting head 133.
  • the component mounting machine 10 includes a component camera 14 and a board camera 15.
  • the component camera 14 and the board camera 15 are digital imaging devices having imaging elements such as CMOS.
  • the component camera 14 and the board camera 15 capture images based on a control signal and send image data acquired by the imaging.
  • the component camera 14 is configured to be able to capture images of the components held by the suction nozzle 134 from below.
  • the board camera 15 is provided on a moving stage 132 so as to be movable in the horizontal direction integrally with the mounting head 133.
  • the board camera 15 is configured to be able to capture images of the board 91 from above.
  • Control device 16 The component mounting machine 10 includes a control device 16.
  • the control device 16 is mainly composed of a CPU, various memories, and a control circuit.
  • the control device 16 stores various data, such as a control program used to control the mounting process.
  • the control program is data that indicates the mounting positions, mounting angles, and component types of components to be mounted on the board 91 in the mounting process in a scheduled mounting order.
  • the control device 16 controls the operation of the mounting head 133 based on information output from various sensors, the results of image processing, a control program, etc. This controls the positions and angles of the multiple suction nozzles 134 supported by the mounting head 133. As a result, the components held by the suction nozzles 134 are mounted at a specified mounting position and at a specified mounting angle as instructed by the control program.
  • the board transport device 11 transports the board 91, which has been carried into the upstream end of the transport path by the board carry-in device or the external transport device, along the transport path to a predetermined stop position.
  • the predetermined stop position of the board 91 is set, for example, to the center of the transport path in the transport direction.
  • the component transfer device 13 performs a component mounting process on the board 91 positioned at the stop position. After the mounting process is completed, the board transport device 11 transports the board 91 from the stop position to the downstream end (the right end in FIG. 1 ) and takes it out of the machine.
  • the substrate transport device 11 includes a pair of guide rails 20 that form a transport path for the substrate 91.
  • the pair of guide rails 20 guide both ends in the width direction (direction perpendicular to the transport direction, vertical direction in FIG. 1, front-rear direction in FIG. 3) of the substrate 91 transported in the transport direction (direction from lower left to upper right in FIG. 2, horizontal direction in FIG. 3).
  • the pair of guide rails 20 are installed on the upper side of a pair of support plates 25 that stand up from the upper surface of the base 19 and are arranged in parallel at a distance from each other.
  • the pair of guide rails 20 are set to have a mutual separation distance corresponding to the width dimension of the substrate 91. This separation distance is variable when one of the support plates 25 slides along the upper surface of the base 19.
  • the substrate transport device 11 includes a drive unit 30 that transports the substrate 91 in the transport direction.
  • the drive unit 30 has a pair of conveyor belts 31, a plurality of pulleys, and a drive motor 37.
  • the conveyor belt 31 is formed in an endless loop shape and is disposed along the guide rails 20.
  • the conveyor belt 31 is guided by the upper surface of a belt guide 21 that extends in the transport direction on the inner side where the pair of guide rails 20 face each other. Two sides of the substrate 91 along the transport direction are placed on the upper surfaces of the pair of conveyor belts 31.
  • the conveyor belt 31 engages with a pair of front and rear conveying guide pulleys 32, multiple auxiliary pulleys 33, a drive pulley 34, and a tensioner pulley 35.
  • the tensioner pulley 35 applies tension to the conveyor belt 31 to prevent it from slackening.
  • the drive pulley 34 is supported so as to rotate integrally with the drive shaft 36.
  • the drive shaft 36 extends perpendicular to the conveying direction and is fixed to the center of each of the pair of drive pulleys 34.
  • the drive shaft 36 is rotated by a drive motor 37 via a gear mechanism.
  • the drive motor 37 is, for example, a pulse motor that is controlled by inputting a drive pulse.
  • the drive motor 37 rotates the drive shaft 36 and rotates the pair of conveyor belts 31 via the pair of drive pulleys 34.
  • the pair of conveyor belts 31 rotate in sync, holding and transporting the substrate 91 placed on their upper surfaces.
  • the drive motor 37 rotates forward by a predetermined angle when a positive pulse (positive drive pulse) is input, and rotates reversely by a predetermined angle when a negative pulse (negative drive pulse) is input.
  • the forward or reverse rotation of the drive motor 37 by a predetermined angle causes the conveyor belt 31 to rotate in the forward or reverse direction a predetermined unit distance.
  • the substrate transport device 11 includes a backup device 40.
  • the backup device 40 is disposed below the stopping position of the substrate 91, and supports the substrate 91 from below with a plurality of backup pins 41.
  • the plurality of backup pins 41 are provided upright on the upper surface of a rectangular backup plate 42.
  • the type, number of backup pins used, and arrangement positions of the plurality of backup pins 41 are appropriately adjusted in accordance with the type of substrate 91 to be transported.
  • the backup plate 42 is configured to be movable up and down relative to the base 19.
  • the backup plate 42 is driven to move up and down by an actuator 43 such as a fluid pressure cylinder.
  • the backup device 40 operates after the substrate 91 has been transported to the stop position and stopped. Specifically, the backup device 40 raises the backup plate 42 by the operation of the actuator 43. As the backup plate 42 rises, the backup pins 41 push the substrate 91 upward. As a result, the substrate 91 is clamped and positioned between the upper part of the guide rail 20 and the backup pins 41. In this way, the backup device 40 functions as a clamping device in the substrate transport device 11.
  • the backup device 40 lowers the backup plate 42 by operating the actuator 43. As the backup plate 42 lowers, the backup pins 41 move downward away from the substrate 91. This releases the substrate 91 from the clamped state and places it back on the conveyor belt 31. The substrate 91 can now be transported to the downstream end of the transport path and removed from the machine.
  • the board transport device 11 includes a plurality of board sensors 381-383 that are arranged at different positions in the transport direction and detect the presence or absence of a board 91 on the transport path.
  • the first board sensor 381 is arranged so that the upstream end of the transport path where the conveyor belt 31 performs its transport function is its detection position.
  • the second board sensor 382 is arranged so that the detection position is a stop position set in the center of the transport path.
  • the third board sensor 383 is arranged so that the detection position is the downstream end of the transport path.
  • the board sensors 381-383 have the same configuration, and for example, photoelectric sensors composed of a light projecting unit and a light receiving unit can be used.
  • the board transport device 11 forms a transport path for the board 91 constituting the production line with the above-mentioned configuration, and transports and positions the board 91 along the transport path.
  • the board transport device 11 transports the board 91 in cooperation with an external transport device adjacent to the upstream side.
  • the front end of the board 91 may collide with the guide rail 20 due to misalignment in the width direction of the board 91.
  • a board 91 with low strength is used in the mounting process, there is a concern that the board may be deformed due to the collision with the guide rail 20.
  • the substrate 91 may be a glass substrate having a thickness Ns of 1 mm or less.
  • transport control is required so that the outer edge of the substrate 91 is not damaged by impacts applied to the substrate 91.
  • One way to address this is to sufficiently reduce the transport speed, but such transport control would result in a decrease in overall production efficiency.
  • the substrate transport device 11 of this embodiment therefore employs a configuration capable of mitigating the impact applied to the substrate 91 when the substrate 91 is loaded.
  • the substrate transport device 11 is equipped with a buffer unit 50 disposed at the upstream end of the guide rail 20. This allows the substrate transport device 11 to prevent deformation or damage to the substrate 91 caused by transport.
  • the buffer unit 50 is composed of members that are symmetrical in a direction perpendicular to the transport direction when viewed from above, and therefore only one of the members is shown enlarged in Figures 4 to 6.
  • the buffer unit 50 includes a plurality of rollers 51, as shown in Fig. 2.
  • the rollers 51 are provided rotatably about a vertical central axis Ar at a loading position P1 where the pair of guide rails 20 load the substrate 91, as shown in Fig. 4 and Fig. 5.
  • the rollers 51 come into contact with the substrate 91 being transported, they receive an external force from the substrate 91 and rotate about the central axis Ar. Then, as shown by the thick arrow in Fig. 4, the rollers 51 move the substrate 91 along the outer peripheral surface 511 of the rollers 51 toward the widthwise center of the transport path (the lower side in Fig. 4), and introduce the substrate 91 between the pair of guide rails 20.
  • the roller 51 has an outer ring 52 and an inner ring 53.
  • the outer ring 52 is formed with an outer peripheral surface 511 that contacts the substrate 91.
  • the outer ring 52 constitutes a buffer section that absorbs the impact when the substrate 91 contacts the outer peripheral surface 511 of the roller 51.
  • the outer ring 52 as a buffer section is formed from a material with a lower hardness than the substrate 91.
  • the outer ring 52 is formed from a material such as resin or rubber.
  • the inner ring 53 is concentric with the outer ring 52 and is fitted to the inner peripheral surface of the outer ring 52 so as to be able to rotate integrally.
  • the inner ring 53 is formed in a cylindrical shape and is formed from a material such as a metal that is harder than the outer ring 52.
  • the buffer unit 50 includes a pair of arms 54.
  • the arms 54 are fixed to the loading position P1 of the guide rail 20, and are formed to extend upstream in the conveying direction of the substrate 91 (left and right direction in FIG. 4 and FIG. 5).
  • the arms 54 support the roller 51 configured as described above so as to be rotatable around the central axis Ar.
  • the arm 54 has a shaft support portion 541 that supports the roller 51 by fastening a mounting bolt penetrating the inner ring 53 of the roller 51 to the arm body. With this configuration, the roller 51 can be replaced depending on the type of the substrate 91, etc.
  • the arm 54 is detachably fixed to the upper surface of the guide rail 20 by two fixing bolts 55.
  • roller 51 having outer ring 52 as a cushioning portion is positioned as follows by installing arm 54 at a predetermined position on guide rail 20. Specifically, roller 51 is positioned in the vertical direction such that the entire area of thickness Ns of substrate 91 being transported falls within the vertical width of roller 51, as shown in Fig. 5. With this configuration, the contact area between roller 51 and substrate 91 can be increased, and as a result, the impact applied to substrate 91 can be further mitigated.
  • the rollers 51 are positioned upstream of the upstream end Eb of the conveyor belt 31 in the transport direction of the substrate 91. This allows the buffer unit 50 to correct the posture of the substrate 91 (correct misalignment in the width direction) before the substrate 91 is placed on the conveyor belt 31. Also, by positioning the rollers 51 upstream of the upstream end Eb, it is possible to set the installation height of the rollers 51 while preventing buffering with the conveyor belt 31, improving the degree of freedom in installation.
  • the roller 51 is positioned in the vertical direction such that the portion 31A of the conveyor belt 31 that supports the substrate 91 fits within the vertical width of the roller 51.
  • the "portion 31A that supports the substrate 91" above corresponds to the section of the rotating conveyor belt 31 that supports the substrate 91, i.e., the portion that is located in the section that extends in the transport direction supported by the pair of transport guide pulleys 32.
  • the roller 51 is positioned such that the entire thickness Nb of this portion 31A fits within the vertical width of the roller 51.
  • the lower end of the roller 51 is positioned below the upper surface of the portion 31A of the conveyor belt 31 that supports the substrate 91. This makes it possible to prevent the substrate 91 from getting caught between the roller 51 and the conveyor belt 31, and makes the transport process of the substrate 91 more stable, compared to a configuration in which, for example, the lower end of the roller 51 is positioned above the upper surface of the conveyor belt 31 in the vertical direction, leaving a gap between the roller 51 and the conveyor belt 31.
  • the buffer unit 50 includes a roller 51 and an arm 54, and the roller 51 has a soft outer ring 52 as a buffer.
  • the substrate transport device 11 may adopt a configuration in which the roller 51 is movable to reduce the impact applied to the substrate 91.
  • the buffer unit 150 includes a roller 51 and an arm 54, as well as a swivel mechanism 60 disposed between the arm 54 and the guide rail 20.
  • the swivel mechanism 60 includes a bracket 61 fixed to the guide rail 20.
  • the bracket 61 supports the arm 54 so that it can rotate around a swivel axis At, which is the vertical axis.
  • the bracket 61 restricts the rotation of the arm 54 by a stopper (not shown) so that the arm 54 rotates within a predetermined angle range Ra.
  • the swivel mechanism 60 also uses a spring (not shown) to return the arm 54 to its initial angle in an unloaded state.
  • the elastic force that this spring imparts to the arm 54 is set to the extent that the arm 54 rotates when the substrate 91 comes into contact with the roller 51.
  • the swivel mechanism 60 constitutes a buffer that absorbs the impact applied to the substrate 91 by retracting the roller 51 due to the impact when the substrate 91 comes into contact with the outer circumferential surface 511 of the roller 51.
  • the external force received by the roller 51 causes the arm 54 to rotate against the elastic force of the spring, causing the roller 51 to temporarily rotate. This reduces the impact on the substrate 91.
  • the external force received by the roller 51 from the substrate 91 decreases, and the roller 51 gradually returns to its initial angle. As a result, the posture of the substrate 91 can be corrected (the deviation in the width direction can be corrected), and the substrate 91 can be introduced to the upstream end of the guide rail 20.
  • a soft outer ring 52 may be used for the outer ring 52 of the roller 51 to provide further buffering.
  • the arm 54 is rotated about the pivot axis At to retract the roller 51 to the outside of the guide rail 20 (to the outside of the width direction of the substrate 91).
  • the buffer section may mitigate the impact by retracting the roller 51 in a direction intersecting the central axis Ar, and may be configured to temporarily retract the roller 51 that has come into contact with the substrate 91 downstream in the transport direction.
  • one roller 51 is arranged on the arm 54.
  • multiple rollers 51 may be arranged on each of the pair of arms 54 along the extension direction of the arm 54. In this way, the multiple rollers come into contact with the outer edge of the substrate 91 during the period in which the attitude of the substrate 91 is corrected, and the individual external forces applied to the substrate 91 by the multiple rollers 51 can be reduced.
  • the substrate 91 is exemplified as a glass substrate.
  • the substrate 91 may be harder than a glass substrate and have a thickness of 1 mm or more.
  • the substrate transport device 11 is provided with the rollers 51, the arms 54, and the buffer section (the outer wheel 52, the swivel mechanism 60), which protects the substrate 91 and allows the posture of the substrate 91 to be corrected without reducing the transport speed. Therefore, it is useful to use the buffer units 50, 150 when transporting various substrates 91.
  • the substrate-related operation machine to which the substrate transport device 11 is applied is a component mounting machine.
  • the substrate transport device 11 can be applied to various substrate-related operation machines. The same effect is achieved with such a configuration.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

This substrate conveying device comprises: a pair of guide rails that guide both ends in the lateral direction of a substrate conveyed in a conveyance direction; a plurality of rollers provided so as to be able to rotate about the center axis thereof in the vertical direction at a carry-in position where the pair of guide rails carry in the substrate, the plurality of rollers introducing the conveyed substrate between the pair of guide rails; and a shock dampening section that dampens a shock when the substrate comes into contact with the outer circumferential surfaces of the rollers.

Description

基板搬送装置Substrate Transport Device
　本発明は、基板搬送装置に関するものである。 The present invention relates to a substrate transport device.
　基板搬送装置は、対基板作業機に適用され、生産ラインにおける基板の搬送に用いられる。特許文献１には、一対のガイドレールにより搬送対象の基板の幅方向の両端をガイドし、一対のガイドレールの下方に配置されたコンベアベルトの輪転により基板を搬送方向に移動させる構成が開示されている。 The board transport device is applied to a substrate-related work machine and is used to transport boards on a production line. Patent Document 1 discloses a configuration in which a pair of guide rails guides both widthwise ends of the board to be transported, and the board is moved in the transport direction by the rotation of a conveyor belt arranged below the pair of guide rails.
特開２０１４－１２３５９７号公報JP 2014-123597 A
　このような基板搬送装置では、基板の搬送方向の上流側から基板を搬入する際に、基板の幅方向の位置ずれにより基板の前端部とガイドレールが衝突し得る。対基板作業に強度の低い基板が適用される場合には、ガイドレールとの衝突により基板に変形等が生じることが懸念される。 In such a board transport device, when a board is transported from the upstream side in the board transport direction, the front end of the board may collide with the guide rail due to misalignment of the board in the width direction. When low-strength boards are used for substrate handling operations, there is a concern that deformation of the board may occur due to the collision with the guide rail.
　本明細書は、基板の搬入時において基板に加えられる衝撃を緩和し、搬送による基板の変形等を防止する基板搬送装置を提供することを目的とする。 The purpose of this specification is to provide a substrate transport device that reduces the impact applied to the substrate when the substrate is loaded and prevents deformation of the substrate during transport.
　本明細書は、搬送方向に搬送される基板の幅方向の両端をガイドする一対のガイドレールと、前記一対のガイドレールが前記基板を搬入する搬入位置に上下方向の中心軸回りに回転可能に設けられ、搬送される前記基板を前記一対のガイドレールの間に導入する複数のローラと、前記ローラの外周面に前記基板が接触した際の衝撃を緩和する緩衝部と、を備える基板搬送装置を開示する。 This specification discloses a substrate transport device that includes a pair of guide rails that guide both widthwise ends of a substrate transported in a transport direction, the pair of guide rails are rotatably arranged around a vertical central axis at a loading position where the substrate is loaded, a number of rollers that introduce the substrate being transported between the pair of guide rails, and a buffer section that absorbs impact when the substrate comes into contact with the outer circumferential surfaces of the rollers.
　本明細書では、出願当初の請求項６において「請求項１－４の何れか一項に記載の基板搬送装置」を「請求項１－５の何れか一項に記載の基板搬送装置」に変更した技術的思想や、出願当初の請求項８において「請求項１－４の何れか一項に記載の基板搬送装置」を「請求項１－７の何れか一項に記載の基板搬送装置」に変更した技術的思想、出願当初の請求項１０において「請求項１－４の何れか一項に記載の基板搬送装置」を「請求項１－９の何れか一項に記載の基板搬送装置」に変更した技術的思想も開示されている。 　This specification also discloses the technical idea of changing "the substrate transport device according to any one of claims 1-4" in claim 6 at the time of application to "the substrate transport device according to any one of claims 1-5," the technical idea of changing "the substrate transport device according to any one of claims 1-4" in claim 8 at the time of application to "the substrate transport device according to any one of claims 1-7," and the technical idea of changing "the substrate transport device according to any one of claims 1-4" in claim 10 at the time of application to "the substrate transport device according to any one of claims 1-9."
　このような構成によると、ローラの外周面に基板が接触した際の衝撃が緩和されるので、基板の搬入時における基板の変形等を防止することができる。 This configuration reduces the impact when the substrate comes into contact with the outer circumferential surface of the roller, preventing deformation of the substrate when it is being transported.
基板搬送装置を適用された部品装着機の構成を示す模式図である。1 is a schematic diagram showing a configuration of a component mounting machine to which a board transport device is applied; 基板搬送装置の主要部の斜視図である。FIG. 2 is a perspective view of a main part of the substrate transport device. 基板搬送装置の側面図である。FIG. 図３のＩＶ方向から緩衝部を見た平面図である。4 is a plan view of the buffer section as viewed from the direction IV in FIG. 3 . 図４にＶ方向から見た側面図である。5 is a side view seen from the V direction in FIG. 4. 変形態様における緩衝部を示す斜視図である。FIG. 13 is a perspective view showing a buffer portion in a modified embodiment.
　基板搬送装置について、図面を参照しながら説明する。本実施形態においては、基板搬送装置が対基板作業機である部品装着機に適用された態様を例示する。なお、基板搬送装置を適用可能な対基板作業機としては、部品装着機に限られず、基板に対して所定の耐基板作業を実行する対基板作業機であれば種々の作業機、例えば、はんだ印刷機や基板検査機等を採用することができる。 The board transport device will be described with reference to the drawings. In this embodiment, an example is shown in which the board transport device is applied to a component mounting machine, which is a board-related operation machine. Note that the board-related operation machine to which the board transport device can be applied is not limited to a component mounting machine, and various other operation machines that perform predetermined board-related operations on boards, such as solder printers and board inspection machines, can be used.
　１．部品装着機１０の構成
　部品装着機１０は、例えば他の部品装着機１０を含む複数種類の対基板作業機とともに、基板製品を生産する生産ラインを構成する。上記の生産ラインを構成する対基板作業機には、はんだ印刷機や基板検査機、リフロー炉などが含まれ得る。 1. Configuration of the component mounting machine 10 The component mounting machine 10 constitutes a production line for producing board products together with a plurality of types of board-related operation machines including, for example, other component mounting machines 10. The board-related operation machines constituting the production line may include a solder printer, a board inspection machine, a reflow oven, and the like.
　１－１．基板搬送装置１１
　部品装着機１０は、図１に示すように、基板搬送装置１１を備える。基板搬送装置１１は、基板９１を搬送方向へと順次搬送するとともに、基板９１を機内の所定位置に位置決めする。基板搬送装置１１の詳細構成については後述する。 1-1. Substrate transport device 11
1, the component mounting machine 10 includes a board transport device 11. The board transport device 11 sequentially transports boards 91 in a transport direction and positions the boards 91 at predetermined positions within the machine. The detailed configuration of the board transport device 11 will be described later.
　１－２．部品供給装置１２
　部品装着機１０は、部品供給装置１２を備える。部品供給装置１２は、基板９１に装着される部品を供給する。部品供給装置１２は、複数のスロット１２１にフィーダ１２２をそれぞれセットされる。フィーダ１２２には、例えば多数の部品が収納されたキャリアテープを送り移動させて、部品を採取可能に供給するテープフィーダが適用される。 1-2. Part supply device 12
The component mounting machine 10 includes a component supplying device 12. The component supplying device 12 supplies components to be mounted on the board 91. The component supplying device 12 has feeders 122 set in a plurality of slots 121. The feeders 122 may be, for example, a tape feeder that feeds and moves a carrier tape containing a large number of components, thereby supplying the components so that they can be picked.
　１－３．部品移載装置１３
　部品装着機１０は、部品移載装置１３を備える。部品移載装置１３は、部品供給装置１２により供給された部品を基板９１上の所定の装着位置に移載する。部品移載装置１３は、ヘッド駆動装置１３１、移動台１３２、装着ヘッド１３３、および吸着ノズル１３４を備える。ヘッド駆動装置１３１は、直動機構により移動台１３２を水平方向（Ｘ方向およびＹ方向）に移動させる。装着ヘッド１３３は、図示しないクランプ部材により移動台１３２に着脱可能に固定され、機内を水平方向に移動可能に設けられる。 1-3. Parts transfer device 13
The component mounting machine 10 includes a component transfer device 13. The component transfer device 13 transfers the components supplied by the component supply device 12 to a predetermined mounting position on the board 91. The component transfer device 13 includes a head drive device 131, a movable table 132, a mounting head 133, and a suction nozzle 134. The head drive device 131 moves the movable table 132 in the horizontal direction (X direction and Y direction) by a linear motion mechanism. The mounting head 133 is detachably fixed to the movable table 132 by a clamp member (not shown) and is provided so as to be movable horizontally within the machine.
　装着ヘッド１３３は、回転可能に且つ昇降可能に複数の吸着ノズル１３４を支持する。吸着ノズル１３４は、フィーダ１２２により供給される部品を採取して保持する保持部材である。吸着ノズル１３４は、供給される負圧エアにより、フィーダ１２２により供給される部品を吸着する。装着ヘッド１３３に取り付けられる保持部材としては、部品を把持することにより保持するチャックなどが採用され得る。 The mounting head 133 supports multiple suction nozzles 134 that are rotatable and movable up and down. The suction nozzles 134 are holding members that pick up and hold the parts supplied by the feeder 122. The suction nozzles 134 use the supplied negative pressure air to pick up the parts supplied by the feeder 122. As the holding member attached to the mounting head 133, a chuck that holds the parts by gripping them can be used.
　１－４．部品カメラ１４、基板カメラ１５
　部品装着機１０は、部品カメラ１４、および基板カメラ１５を備える。部品カメラ１４、および基板カメラ１５は、ＣＭＯＳなどの撮像素子を有するデジタル式の撮像装置である。部品カメラ１４、および基板カメラ１５は、制御信号に基づいて撮像を行い、当該撮像により取得した画像データを送出する。部品カメラ１４は、吸着ノズル１３４に保持された部品を下方から撮像可能に構成される。基板カメラ１５は、装着ヘッド１３３と一体的に水平方向に移動可能に移動台１３２に設けられる。基板カメラ１５は、基板９１を上方から撮像可能に構成される。 1-4. Component camera 14, board camera 15
The component mounting machine 10 includes a component camera 14 and a board camera 15. The component camera 14 and the board camera 15 are digital imaging devices having imaging elements such as CMOS. The component camera 14 and the board camera 15 capture images based on a control signal and send image data acquired by the imaging. The component camera 14 is configured to be able to capture images of the components held by the suction nozzle 134 from below. The board camera 15 is provided on a moving stage 132 so as to be movable in the horizontal direction integrally with the mounting head 133. The board camera 15 is configured to be able to capture images of the board 91 from above.
　１－５．制御装置１６
　部品装着機１０は、制御装置１６を備える。制御装置１６は、主として、ＣＰＵや各種メモリ、制御回路により構成される。制御装置１６には、装着処理の制御に用いられる制御プログラムなどの各種データが記憶される。制御プログラムは、装着処理において基板９１に装着される部品の装着位置、装着角度、および部品種類を予定される装着順で示すデータである。 1-5. Control device 16
The component mounting machine 10 includes a control device 16. The control device 16 is mainly composed of a CPU, various memories, and a control circuit. The control device 16 stores various data, such as a control program used to control the mounting process. The control program is data that indicates the mounting positions, mounting angles, and component types of components to be mounted on the board 91 in the mounting process in a scheduled mounting order.
　制御装置１６は、装着処理において、各種センサから出力される情報や画像処理の結果、制御プログラムなどに基づき、装着ヘッド１３３の動作を制御する。これにより、装着ヘッド１３３に支持された複数の吸着ノズル１３４の位置および角度が制御される。結果として、吸着ノズル１３４に保持された部品が制御プログラムにより指示される所定の装着位置に所定の装着角度で装着される。 During the mounting process, the control device 16 controls the operation of the mounting head 133 based on information output from various sensors, the results of image processing, a control program, etc. This controls the positions and angles of the multiple suction nozzles 134 supported by the mounting head 133. As a result, the components held by the suction nozzles 134 are mounted at a specified mounting position and at a specified mounting angle as instructed by the control program.
　２．基板搬送装置１１の構成
　基板搬送装置１１は、基板搬入装置や外部搬送装置によって搬送経路の上流端に搬入された基板９１を搬送経路に沿って搬送し、所定の停止位置まで搬送する。基板９１の所定の停止位置は、例えば搬送経路の搬送方向の中央に設定される。停止位置に位置決めされた基板９１に対して、部品移載装置１３による部品の装着処理が実施される。装着処理が終了した後、基板搬送装置１１は、当該の基板９１を停止位置から下流端（図１の右端）まで搬送し、機外に搬出する。 2. Configuration of the board transport device 11 The board transport device 11 transports the board 91, which has been carried into the upstream end of the transport path by the board carry-in device or the external transport device, along the transport path to a predetermined stop position. The predetermined stop position of the board 91 is set, for example, to the center of the transport path in the transport direction. The component transfer device 13 performs a component mounting process on the board 91 positioned at the stop position. After the mounting process is completed, the board transport device 11 transports the board 91 from the stop position to the downstream end (the right end in FIG. 1 ) and takes it out of the machine.
　２－１．ガイドレール２０
　基板搬送装置１１は、基板９１の搬送経路を形成する一対のガイドレール２０を備える。一対のガイドレール２０は、搬送方向（図２左下から右上の方向、図３の左右方向）に搬送される基板９１の幅方向（搬送方向に直交する方向、図１の上下方向、図３の前後方向）の両端をガイドする。一対のガイドレール２０は、基台１９の上面から起立し互いに離隔して平行に配置された一対の支持板２５の各々の上側に設置される。一対のガイドレール２０は、相互の離間距離が基板９１の幅寸法に対応して設定される。この離間距離は、一方の支持板２５が基台１９の上面をスライド移動することで、可変に構成されている。 2-1. Guide rail 20
The substrate transport device 11 includes a pair of guide rails 20 that form a transport path for the substrate 91. The pair of guide rails 20 guide both ends in the width direction (direction perpendicular to the transport direction, vertical direction in FIG. 1, front-rear direction in FIG. 3) of the substrate 91 transported in the transport direction (direction from lower left to upper right in FIG. 2, horizontal direction in FIG. 3). The pair of guide rails 20 are installed on the upper side of a pair of support plates 25 that stand up from the upper surface of the base 19 and are arranged in parallel at a distance from each other. The pair of guide rails 20 are set to have a mutual separation distance corresponding to the width dimension of the substrate 91. This separation distance is variable when one of the support plates 25 slides along the upper surface of the base 19.
　２－２．駆動部３０
　基板搬送装置１１は、基板９１を搬送方向に搬送する駆動部３０を備える。駆動部３０は、一対のコンベアベルト３１、複数のプーリ、および駆動モータ３７を有する。コンベアベルト３１は、無端環状に形成され、ガイドレール２０に沿って配置される。コンベアベルト３１は、一対のガイドレール２０が互いに対向する内側において搬送方向に延びるベルトガイド２１の上面に案内される。一対のコンベアベルト３１の上面には、基板９１の搬送方向に沿った二辺が載置される。 2-2. Driving unit 30
The substrate transport device 11 includes a drive unit 30 that transports the substrate 91 in the transport direction. The drive unit 30 has a pair of conveyor belts 31, a plurality of pulleys, and a drive motor 37. The conveyor belt 31 is formed in an endless loop shape and is disposed along the guide rails 20. The conveyor belt 31 is guided by the upper surface of a belt guide 21 that extends in the transport direction on the inner side where the pair of guide rails 20 face each other. Two sides of the substrate 91 along the transport direction are placed on the upper surfaces of the pair of conveyor belts 31.
　コンベアベルト３１は、図３に示すように、前後一対の搬送ガイドプーリ３２、複数の補助プーリ３３、駆動プーリ３４、およびテンショナープーリ３５に係合している。テンショナープーリ３５は、コンベアベルト３１に張力を付与して弛緩を防止する。駆動プーリ３４は、駆動軸３６と一体回転されるように支持される。駆動軸３６は、搬送方向に直交して延在し、一対の駆動プーリ３４の中心にそれぞれ固定される。駆動軸３６は、駆動モータ３７からギア機構を介して回転駆動される。 As shown in FIG. 3, the conveyor belt 31 engages with a pair of front and rear conveying guide pulleys 32, multiple auxiliary pulleys 33, a drive pulley 34, and a tensioner pulley 35. The tensioner pulley 35 applies tension to the conveyor belt 31 to prevent it from slackening. The drive pulley 34 is supported so as to rotate integrally with the drive shaft 36. The drive shaft 36 extends perpendicular to the conveying direction and is fixed to the center of each of the pair of drive pulleys 34. The drive shaft 36 is rotated by a drive motor 37 via a gear mechanism.
　駆動モータ３７は、例えば、駆動パルスが入力されて制御されるパルスモータである。駆動モータ３７は、駆動軸３６を回転させ、一対の駆動プーリ３４を介して一対のコンベアベルト３１を輪転させる。これにより、一対のコンベアベルト３１は、同期して輪転し、その上面に載置された基板９１を保持して搬送する。駆動モータ３７は、正パルス（正極性の駆動パルス）の入力により所定角度だけ正転し、負パルス（負極性の駆動パルス）の入力により所定角度だけ逆転する。駆動モータ３７の所定角度の正転または逆転により、コンベアベルト３１は、所定の単位距離だけ順方向または逆方向に輪転する。 The drive motor 37 is, for example, a pulse motor that is controlled by inputting a drive pulse. The drive motor 37 rotates the drive shaft 36 and rotates the pair of conveyor belts 31 via the pair of drive pulleys 34. As a result, the pair of conveyor belts 31 rotate in sync, holding and transporting the substrate 91 placed on their upper surfaces. The drive motor 37 rotates forward by a predetermined angle when a positive pulse (positive drive pulse) is input, and rotates reversely by a predetermined angle when a negative pulse (negative drive pulse) is input. The forward or reverse rotation of the drive motor 37 by a predetermined angle causes the conveyor belt 31 to rotate in the forward or reverse direction a predetermined unit distance.
　２－３．バックアップ装置４０
　基板搬送装置１１は、バックアップ装置４０を備える。バックアップ装置４０は、基板９１の停止位置の下側に配置される、バックアップ装置４０は、複数のバックアップピン４１により基板９１を下方から支持する。複数のバックアップピン４１は、矩形板状のバックアッププレート４２の上面に起立して設けられる。複数のバックアップピン４１は、搬送する基板９１の種類に対応して、種類、使用数および配置位置が適宜調整される。バックアッププレート４２は、基台１９に対して上下動可能に構成される。バックアッププレート４２は、流体圧シリンダなどのアクチュエータ４３によって、昇降駆動される。 2-3. Backup device 40
The substrate transport device 11 includes a backup device 40. The backup device 40 is disposed below the stopping position of the substrate 91, and supports the substrate 91 from below with a plurality of backup pins 41. The plurality of backup pins 41 are provided upright on the upper surface of a rectangular backup plate 42. The type, number of backup pins used, and arrangement positions of the plurality of backup pins 41 are appropriately adjusted in accordance with the type of substrate 91 to be transported. The backup plate 42 is configured to be movable up and down relative to the base 19. The backup plate 42 is driven to move up and down by an actuator 43 such as a fluid pressure cylinder.
　バックアップ装置４０は、基板９１が停止位置まで搬送されて停止した後に動作する。具体的には、バックアップ装置４０は、アクチュエータ４３の動作によりバックアッププレート４２を上昇させる。バックアッププレート４２の上昇に伴って、バックアップピン４１は、基板９１を上方に押し上げる。これにより、基板９１は、ガイドレール２０の上部とバックアップピン４１の間にクランプされて位置決めされる。このように、バックアップ装置４０は、基板搬送装置１１におけるクランプ装置として機能する。 The backup device 40 operates after the substrate 91 has been transported to the stop position and stopped. Specifically, the backup device 40 raises the backup plate 42 by the operation of the actuator 43. As the backup plate 42 rises, the backup pins 41 push the substrate 91 upward. As a result, the substrate 91 is clamped and positioned between the upper part of the guide rail 20 and the backup pins 41. In this way, the backup device 40 functions as a clamping device in the substrate transport device 11.
　バックアップ装置４０は、部品の装着処理が終了した後に、アクチュエータ４３の動作によりバックアッププレート４２を下降させる。バックアッププレート４２の下降に伴って、バックアップピン４１は、基板９１から下方に離間する。これにより、基板９１は、クランプ状態を解除され、再びコンベアベルト３１に載置される。基板９１は、搬送経路の下流端までの搬送および機外への搬出が可能な状態となる。 After the component mounting process is completed, the backup device 40 lowers the backup plate 42 by operating the actuator 43. As the backup plate 42 lowers, the backup pins 41 move downward away from the substrate 91. This releases the substrate 91 from the clamped state and places it back on the conveyor belt 31. The substrate 91 can now be transported to the downstream end of the transport path and removed from the machine.
　２－４．基板センサ３８１－３８３
　基板搬送装置１１は、搬送方向において互いに異なる位置に配置され、搬送経路における基板９１の有無を検知する複数の基板センサ３８１－３８３を備える。第一の基板センサ３８１は、コンベアベルト３１が搬送機能を発揮する搬送経路の上流端を検出位置とするように配置される。第二の基板センサ３８２は、搬送経路の中央に設定された停止位置を検出位置とするように配置される。第三の基板センサ３８３は、搬送経路の下流端を検出位置とするように配置される。基板センサ３８１－３８３は、互いに同一構成であり、例えば投光部および受光部などで構成される光電センサを採用することができる。 2-4. Substrate sensors 381-383
The board transport device 11 includes a plurality of board sensors 381-383 that are arranged at different positions in the transport direction and detect the presence or absence of a board 91 on the transport path. The first board sensor 381 is arranged so that the upstream end of the transport path where the conveyor belt 31 performs its transport function is its detection position. The second board sensor 382 is arranged so that the detection position is a stop position set in the center of the transport path. The third board sensor 383 is arranged so that the detection position is the downstream end of the transport path. The board sensors 381-383 have the same configuration, and for example, photoelectric sensors composed of a light projecting unit and a light receiving unit can be used.
　２－５．緩衝ユニット５０
　基板搬送装置１１は、上記のような構成により生産ラインを構成する基板９１の搬送経路を形成し、搬送経路に沿った基板９１の搬送および位置決めを行う。基板搬送装置１１は、上流側に隣接される外部搬送装置などと連携して基板９１を搬送する。このとき、上流側から基板９１を搬入する際に、基板９１の幅方向の位置ずれにより基板９１の前端部とガイドレール２０が衝突し得る。装着処理に強度の低い基板９１が適用される場合には、ガイドレール２０との衝突により基板に変形等が生じることが懸念される。 2-5. Buffer unit 50
The board transport device 11 forms a transport path for the board 91 constituting the production line with the above-mentioned configuration, and transports and positions the board 91 along the transport path. The board transport device 11 transports the board 91 in cooperation with an external transport device adjacent to the upstream side. At this time, when the board 91 is carried in from the upstream side, the front end of the board 91 may collide with the guide rail 20 due to misalignment in the width direction of the board 91. When a board 91 with low strength is used in the mounting process, there is a concern that the board may be deformed due to the collision with the guide rail 20.
　ここで、装着処理の種類によっては、基板９１は、厚みＮｓが１ｍｍ以下のガラス基板を採用されることがある。このような基板９１を搬送する場合には、基板９１に加えられる衝撃により外縁が破損しないように、搬送制御を行う必要がある。これに対して、例えば搬送速度を十分に低下させることが考えられるが、このような搬送制御では、全体の生産効率を低下させる要因となる。 Depending on the type of mounting process, the substrate 91 may be a glass substrate having a thickness Ns of 1 mm or less. When transporting such a substrate 91, transport control is required so that the outer edge of the substrate 91 is not damaged by impacts applied to the substrate 91. One way to address this is to sufficiently reduce the transport speed, but such transport control would result in a decrease in overall production efficiency.
　そこで、本実施形態の基板搬送装置１１は、基板９１の搬入時において基板９１に加えられる衝撃を緩和することが可能な構成を採用する。具体的には、基板搬送装置１１は、ガイドレール２０の上流端に配置された緩衝ユニット５０を備える。これにより、基板搬送装置１１は、搬送による基板９１の変形や破損を防止する。なお、本実施形態において、緩衝ユニット５０は、上方視において搬送方向に直交する方向に対称な部材により構成されるため、図４－図６では、一方の部材のみを拡大して示している。 The substrate transport device 11 of this embodiment therefore employs a configuration capable of mitigating the impact applied to the substrate 91 when the substrate 91 is loaded. Specifically, the substrate transport device 11 is equipped with a buffer unit 50 disposed at the upstream end of the guide rail 20. This allows the substrate transport device 11 to prevent deformation or damage to the substrate 91 caused by transport. Note that in this embodiment, the buffer unit 50 is composed of members that are symmetrical in a direction perpendicular to the transport direction when viewed from above, and therefore only one of the members is shown enlarged in Figures 4 to 6.
　３．緩衝ユニット５０の詳細構成
　３－１．複数のローラ５１
　緩衝ユニット５０は、図２に示すように、複数のローラ５１を備える。ローラ５１は、図４および図５に示すように、一対のガイドレール２０が基板９１を搬入する搬入位置Ｐ１に上下方向の中心軸Ａｒ回りに回転可能に設けられる。ローラ５１は、搬送される基板９１に接触すると、基板９１から外力を受けて中心軸Ａｒ回りに回転する。そして、ローラ５１は、図４の太矢印に示すように、基板９１をローラ５１の外周面５１１に沿って搬送経路の幅方向中央側（図４の下側）に移動させ、基板９１を一対のガイドレール２０の間に導入する。 3. Detailed configuration of the buffer unit 50 3-1. Multiple rollers 51
The buffer unit 50 includes a plurality of rollers 51, as shown in Fig. 2. The rollers 51 are provided rotatably about a vertical central axis Ar at a loading position P1 where the pair of guide rails 20 load the substrate 91, as shown in Fig. 4 and Fig. 5. When the rollers 51 come into contact with the substrate 91 being transported, they receive an external force from the substrate 91 and rotate about the central axis Ar. Then, as shown by the thick arrow in Fig. 4, the rollers 51 move the substrate 91 along the outer peripheral surface 511 of the rollers 51 toward the widthwise center of the transport path (the lower side in Fig. 4), and introduce the substrate 91 between the pair of guide rails 20.
　ローラ５１は、外輪５２と内輪５３とを有する。外輪５２は、基板９１に接触する外周面５１１を形成される。本実施形態において、外輪５２は、ローラ５１の外周面５１１に基板９１が接触した際の衝撃を緩和する緩衝部を構成する。緩衝部としての外輪５２は、基板９１より低硬度の材料により形成される。外輪５２は、上記のように基板９１がガラス基板である場合に、樹脂またはゴムを材料として形成される。内輪５３は、外輪５２と同心であり、外輪５２の内周面に嵌合されて一体的に回転可能に構成される。内輪５３は、円筒状に形成され、外輪５２より高硬度の金属などの材料により形成される。 The roller 51 has an outer ring 52 and an inner ring 53. The outer ring 52 is formed with an outer peripheral surface 511 that contacts the substrate 91. In this embodiment, the outer ring 52 constitutes a buffer section that absorbs the impact when the substrate 91 contacts the outer peripheral surface 511 of the roller 51. The outer ring 52 as a buffer section is formed from a material with a lower hardness than the substrate 91. When the substrate 91 is a glass substrate as described above, the outer ring 52 is formed from a material such as resin or rubber. The inner ring 53 is concentric with the outer ring 52 and is fitted to the inner peripheral surface of the outer ring 52 so as to be able to rotate integrally. The inner ring 53 is formed in a cylindrical shape and is formed from a material such as a metal that is harder than the outer ring 52.
　３－２．一対のアーム５４
　緩衝ユニット５０は、図２に示すように、一対のアーム５４を備える。アーム５４は、ガイドレール２０の搬入位置Ｐ１にそれぞれ固定され、且つ基板９１の搬送方向の上流側（図４および図５の左右方向）に延伸するように形成される。アーム５４は、上記のような構成からなるローラ５１を中心軸Ａｒ回りに回転可能に支持する。詳細には、アーム５４は、ローラ５１の内輪５３を貫通する取り付けボルトをアーム本体に締結することによりローラ５１を支持する軸支部５４１を有する。このような構成により、基板９１の種類などに応じてローラ５１を交換することができる。アーム５４は、ガイドレール２０の上面に２つの固定ボルト５５により着脱可能に固定される。 3-2. Pair of arms 54
As shown in FIG. 2, the buffer unit 50 includes a pair of arms 54. The arms 54 are fixed to the loading position P1 of the guide rail 20, and are formed to extend upstream in the conveying direction of the substrate 91 (left and right direction in FIG. 4 and FIG. 5). The arms 54 support the roller 51 configured as described above so as to be rotatable around the central axis Ar. In detail, the arm 54 has a shaft support portion 541 that supports the roller 51 by fastening a mounting bolt penetrating the inner ring 53 of the roller 51 to the arm body. With this configuration, the roller 51 can be replaced depending on the type of the substrate 91, etc. The arm 54 is detachably fixed to the upper surface of the guide rail 20 by two fixing bolts 55.
　３－３．ローラ５１の位置および緩衝作用
　上記のように緩衝部としての外輪５２を有するローラ５１は、アーム５４がガイドレール２０の所定位置に設置されることにより、以下のような位置に配置される。具体的には、ローラ５１は、図５に示すように、上下方向において、搬送される基板９１の厚みＮｓの全域がローラ５１の上下方向幅に収まるように配置される。このような構成によると、ローラ５１と基板９１の接触面積を増加させることができ、結果として基板９１に加えられる衝撃をより緩和することができる。 3-3. Position of Roller 51 and Cushioning Action As described above, roller 51 having outer ring 52 as a cushioning portion is positioned as follows by installing arm 54 at a predetermined position on guide rail 20. Specifically, roller 51 is positioned in the vertical direction such that the entire area of thickness Ns of substrate 91 being transported falls within the vertical width of roller 51, as shown in Fig. 5. With this configuration, the contact area between roller 51 and substrate 91 can be increased, and as a result, the impact applied to substrate 91 can be further mitigated.
　また、ローラ５１は、図５に示すように、基板９１の搬送方向において、コンベアベルト３１の上流端Ｅｂよりも上流側に配置される。これにより、緩衝ユニット５０は、基板９１がコンベアベルト３１に載置される前に、基板９１の姿勢を補正（幅方向のずれを補正）することができる。また、ローラ５１を上流端Ｅｂより上流側にすることで、コンベアベルト３１との緩衝を防止しつつ、ローラ５１の設置高さを設定することができ、設置自由度を向上できる。 Also, as shown in FIG. 5, the rollers 51 are positioned upstream of the upstream end Eb of the conveyor belt 31 in the transport direction of the substrate 91. This allows the buffer unit 50 to correct the posture of the substrate 91 (correct misalignment in the width direction) before the substrate 91 is placed on the conveyor belt 31. Also, by positioning the rollers 51 upstream of the upstream end Eb, it is possible to set the installation height of the rollers 51 while preventing buffering with the conveyor belt 31, improving the degree of freedom in installation.
　そして、ローラ５１は、図５に示すように、上下方向において、コンベアベルト３１のうち基板９１を支持する部位３１Ａがローラ５１の上下方向幅に収まるように配置される。上記の「基板９１を支持する部位３１Ａ」とは、輪転するコンベアベルト３１のうち基板９１を支持する区間、即ち一対の搬送ガイドプーリ３２により支持された搬送方向に延伸する区間に位置する部位に相当する。そして、ローラ５１は、この部位３１Ａの厚みＮｂの全域がローラ５１の上下方向幅に収まるように配置される。 As shown in FIG. 5, the roller 51 is positioned in the vertical direction such that the portion 31A of the conveyor belt 31 that supports the substrate 91 fits within the vertical width of the roller 51. The "portion 31A that supports the substrate 91" above corresponds to the section of the rotating conveyor belt 31 that supports the substrate 91, i.e., the portion that is located in the section that extends in the transport direction supported by the pair of transport guide pulleys 32. The roller 51 is positioned such that the entire thickness Nb of this portion 31A fits within the vertical width of the roller 51.
　このような構成によると、ローラ５１の下端がコンベアベルト３１のうち基板９１を支持する部位３１Ａの上面よりも下側に位置する。これにより、上下方向において、例えばローラ５１の下端がコンベアベルト３１の上面より上方に位置して、ローラ５１とコンベアベルト３１の間に隙間がある構成と比較して、ローラ５１とコンベアベルト３１との間に基板９１が噛み込むことを防止することができ、基板９１の搬送処理をより安定させることができる。 With this configuration, the lower end of the roller 51 is positioned below the upper surface of the portion 31A of the conveyor belt 31 that supports the substrate 91. This makes it possible to prevent the substrate 91 from getting caught between the roller 51 and the conveyor belt 31, and makes the transport process of the substrate 91 more stable, compared to a configuration in which, for example, the lower end of the roller 51 is positioned above the upper surface of the conveyor belt 31 in the vertical direction, leaving a gap between the roller 51 and the conveyor belt 31.
　４．実施形態の変形態様
　４－１．緩衝ユニット５０について
　実施形態において、緩衝ユニット５０は、ローラ５１とアーム５４を備え、緩衝部としてローラ５１が軟質の外輪５２を有する構成とした。これに対して、基板搬送装置１１は、ローラ５１を可動式にすることにより基板９１に加えられる衝撃を緩和する構成を採用してもよい。 4. Modifications of the embodiment 4-1. Regarding the buffer unit 50 In the embodiment, the buffer unit 50 includes a roller 51 and an arm 54, and the roller 51 has a soft outer ring 52 as a buffer. In contrast, the substrate transport device 11 may adopt a configuration in which the roller 51 is movable to reduce the impact applied to the substrate 91.
　具体的には、緩衝ユニット１５０は、図６に示すように、ローラ５１とアーム５４に加えて、アーム５４とガイドレール２０との間に配置される旋回機構６０を備える。旋回機構６０は、ガイドレール２０に固定されるブラケット６１を備える。ブラケット６１は、アーム５４を上下軸である旋回軸Ａｔ回りに回転可能に支持する。ブラケット６１は、アーム５４が所定の角度範囲Ｒａにおいて旋回するように図略のストッパによりアーム５４の旋回を規制している。 Specifically, as shown in FIG. 6, the buffer unit 150 includes a roller 51 and an arm 54, as well as a swivel mechanism 60 disposed between the arm 54 and the guide rail 20. The swivel mechanism 60 includes a bracket 61 fixed to the guide rail 20. The bracket 61 supports the arm 54 so that it can rotate around a swivel axis At, which is the vertical axis. The bracket 61 restricts the rotation of the arm 54 by a stopper (not shown) so that the arm 54 rotates within a predetermined angle range Ra.
　また、旋回機構６０は、無負荷の状態でアーム５４が初期角度に位置するように、図略のスプリングによりアーム５４を復帰させている。このスプリングがアーム５４に付与する弾性力は、基板９１がローラ５１に接触した際にアーム５４が旋回する程度に設定されている。このように、旋回機構６０は、ローラ５１の外周面５１１に基板９１が接触した際の衝撃によりローラ５１を退避させることにより、基板９１に加えられる衝撃を緩和する緩衝部を構成する。 The swivel mechanism 60 also uses a spring (not shown) to return the arm 54 to its initial angle in an unloaded state. The elastic force that this spring imparts to the arm 54 is set to the extent that the arm 54 rotates when the substrate 91 comes into contact with the roller 51. In this way, the swivel mechanism 60 constitutes a buffer that absorbs the impact applied to the substrate 91 by retracting the roller 51 due to the impact when the substrate 91 comes into contact with the outer circumferential surface 511 of the roller 51.
　このような構成によると、基板９１がローラ５１に接触すると、ローラ５１が受けた外力によりアーム５４がスプリングの弾性力に抗して旋回し、ローラ５１が一時的に対比する。これにより、基板９１に加えられる衝撃が緩和される。その後に、基板９１が搬送方向の下流側に搬送されると、ローラ５１が基板９１から受ける外力が低下して、初期角度へと徐々に復帰する。これに伴い、基板９１の姿勢を補正（幅方向のずれを補正）することができ、基板９１をガイドレール２０の上流端に導入することができる。 With this configuration, when the substrate 91 comes into contact with the roller 51, the external force received by the roller 51 causes the arm 54 to rotate against the elastic force of the spring, causing the roller 51 to temporarily rotate. This reduces the impact on the substrate 91. When the substrate 91 is then transported downstream in the transport direction, the external force received by the roller 51 from the substrate 91 decreases, and the roller 51 gradually returns to its initial angle. As a result, the posture of the substrate 91 can be corrected (the deviation in the width direction can be corrected), and the substrate 91 can be introduced to the upstream end of the guide rail 20.
　なお、このような旋回機構６０を備える緩衝ユニット１５０において、ローラ５１の外輪５２に軟質の外輪５２を採用して、さらなる緩衝を図ってもよい。また、上記の態様では、アーム５４を旋回軸Ａｔ回りに旋回させてローラ５１をガイドレール２０の外側（基板９１の幅方向外側）に退避させる構成とした。これに対して、緩衝部としては、ローラ５１を中心軸Ａｒに交差する方向に退避させることにより衝撃を緩和すればよく、例えば、基板９１と接触したローラ５１を搬送方向の下流側に一時的に退避させる構成としてもよい。 In addition, in a buffer unit 150 equipped with such a swivel mechanism 60, a soft outer ring 52 may be used for the outer ring 52 of the roller 51 to provide further buffering. In addition, in the above embodiment, the arm 54 is rotated about the pivot axis At to retract the roller 51 to the outside of the guide rail 20 (to the outside of the width direction of the substrate 91). In contrast, the buffer section may mitigate the impact by retracting the roller 51 in a direction intersecting the central axis Ar, and may be configured to temporarily retract the roller 51 that has come into contact with the substrate 91 downstream in the transport direction.
　４－２．その他
　実施形態において、アーム５４には、１つのローラ５１が配置されるものとした。これに対して、一対のアーム５４のそれぞれには、複数のローラ５１がアーム５４の延伸方向に沿って配置されるようにしてもよい。これにより、基板９１の姿勢が補正される期間において、複数のローラが基板９１の外縁に接触することになり、複数のローラ５１により基板９１に加えられる個々の外力を低下させることができる。 4-2. Others In the embodiment, one roller 51 is arranged on the arm 54. Alternatively, multiple rollers 51 may be arranged on each of the pair of arms 54 along the extension direction of the arm 54. In this way, the multiple rollers come into contact with the outer edge of the substrate 91 during the period in which the attitude of the substrate 91 is corrected, and the individual external forces applied to the substrate 91 by the multiple rollers 51 can be reduced.
　また、実施形態において、基板９１は、ガラス基板を例示した。これに対して、基板９１は、ガラス基板よりも硬質であり、１ｍｍ以上の厚みを有していてもよい。基板搬送装置１１がローラ５１、アーム５４、および緩衝部（外輪５２、旋回機構６０）を備えることにより、基板９１を保護することができるとともに、搬送速度を低下させることなく基板９１の姿勢を補正できるという効果を奏することから、種々の基板９１を搬送する際に緩衝ユニット５０，１５０を適用することは有用である。 In the embodiment, the substrate 91 is exemplified as a glass substrate. In contrast, the substrate 91 may be harder than a glass substrate and have a thickness of 1 mm or more. The substrate transport device 11 is provided with the rollers 51, the arms 54, and the buffer section (the outer wheel 52, the swivel mechanism 60), which protects the substrate 91 and allows the posture of the substrate 91 to be corrected without reducing the transport speed. Therefore, it is useful to use the buffer units 50, 150 when transporting various substrates 91.
　実施形態において、基板搬送装置１１が適用される対基板作業機は、部品装着機であるものとした。これに対して、基板搬送装置１１は、種々の対基板作業機に適用することができる。このような構成においても同様の効果を奏する。 In the embodiment, the substrate-related operation machine to which the substrate transport device 11 is applied is a component mounting machine. However, the substrate transport device 11 can be applied to various substrate-related operation machines. The same effect is achieved with such a configuration.
　１０：部品装着機、　１１：基板搬送装置、　２０：ガイドレール、　２１：ベルトガイド、　３０：駆動部、　３１：コンベアベルト、　５０，１５０：緩衝ユニット、　５１：ローラ、　５１１：外周面、　５２：外輪（緩衝部）、　５３：内輪、　５４：アーム、　６０：旋回機構（緩衝部）、　６１：ブラケット、　９１：基板、　Ａｒ：中心軸、　Ａｔ：旋回軸、　Ｅｂ：上流端、　Ｎｂ：（コンベアベルトの）厚み、　Ｎｓ：（基板の）厚み、　Ｐ１：搬入位置 10: component mounting machine, 11: board transport device, 20: guide rail, 21: belt guide, 30: drive unit, 31: conveyor belt, 50, 150: buffer unit, 51: roller, 511: outer periphery, 52: outer ring (buffer unit), 53: inner ring, 54: arm, 60: swivel mechanism (buffer unit), 61: bracket, 91: board, Ar: central axis, At: swivel axis, Eb: upstream end, Nb: thickness (of conveyor belt), Ns: thickness (of board), P1: loading position

Claims (10)

  1. 　搬送方向に搬送される基板の幅方向の両端をガイドする一対のガイドレールと、
    　前記一対のガイドレールが前記基板を搬入する搬入位置に上下方向の中心軸回りに回転可能に設けられ、搬送される前記基板を前記一対のガイドレールの間に導入する複数のローラと、
    　前記ローラの外周面に前記基板が接触した際の衝撃を緩和する緩衝部と、
    　を備える基板搬送装置。     a pair of guide rails for guiding both ends in a width direction of the substrate transported in the transport direction;
    a plurality of rollers that are rotatably provided around a central axis in a vertical direction at a loading position where the pair of guide rails load the substrate, and that introduce the substrate to be transported between the pair of guide rails;
    a buffer portion that buffers an impact when the substrate comes into contact with an outer peripheral surface of the roller;
    A substrate transport apparatus comprising:
  2. 　前記緩衝部は、前記ローラの前記外周面をそれぞれ構成し、前記基板より低硬度の材料により形成される、請求項１に記載の基板搬送装置。 The substrate transport device according to claim 1, wherein the buffer parts form the outer circumferential surfaces of the rollers and are made of a material having a lower hardness than the substrate.
  3. 　前記緩衝部は、樹脂またはゴムを材料として形成される、請求項２に記載の基板搬送装置。 The substrate transport device according to claim 2, wherein the buffer section is made of resin or rubber.
  4. 　前記緩衝部は、前記ローラの前記外周面に前記基板が接触した際の衝撃により前記ローラを前記中心軸に交差する方向に退避させることにより衝撃を緩和する、請求項１に記載の基板搬送装置。 The substrate transport device according to claim 1, wherein the buffer section reduces the impact caused when the substrate comes into contact with the outer peripheral surface of the roller by retracting the roller in a direction intersecting the central axis.
  5. 　前記ローラは、上下方向において、搬送される前記基板の厚みの全域が前記ローラの上下方向幅に収まるように配置される、請求項１－４の何れか一項に記載の基板搬送装置。 The substrate transport device according to any one of claims 1 to 4, wherein the rollers are arranged in the vertical direction so that the entire thickness of the substrate being transported fits within the vertical width of the rollers.
  6. 　前記基板を載置した状態で前記一対のガイドレールに沿って輪転することにより前記基板を搬送方向に搬送するコンベアベルトをさらに備え、
    　前記ローラは、前記基板の搬送方向において、前記コンベアベルトの上流端よりも上流側に配置される、請求項１－４の何れか一項に記載の基板搬送装置。     a conveyor belt that conveys the substrate in a conveying direction by rotating along the pair of guide rails with the substrate placed thereon;
    The substrate transport device according to claim 1 , wherein the roller is disposed upstream of an upstream end of the conveyor belt in a transport direction of the substrate.
  7. 　前記ローラは、上下方向において、前記コンベアベルトのうち前記基板を支持する部位が前記ローラの上下方向幅に収まるように配置される、請求項６に記載の基板搬送装置。 The substrate transport device according to claim 6, wherein the rollers are arranged in a vertical direction such that the portion of the conveyor belt that supports the substrate fits within the vertical width of the rollers.
  8. 　前記一対のガイドレールの前記搬入位置にそれぞれ固定され、且つ前記基板の搬送方向の上流側に延伸する一対のアームをさらに備え、
    　複数の前記ローラは、前記一対のアームにそれぞれ回転可能に支持される、請求項１－４の何れか一項に記載の基板搬送装置。     a pair of arms fixed to the loading positions of the pair of guide rails and extending upstream in a transport direction of the substrate;
    The substrate transport apparatus according to claim 1 , wherein the rollers are rotatably supported by the pair of arms, respectively.
  9. 　前記一対のアームのそれぞれには、複数の前記ローラが前記アームの延伸方向に沿って配置される、請求項８に記載の基板搬送装置。 The substrate transport device according to claim 8, wherein each of the pair of arms has a plurality of rollers arranged along the extension direction of the arms.
  10. 　前記基板は、厚みが１ｍｍ以下のガラス基板である、請求項１－４の何れか一項に記載の基板搬送装置。 The substrate transport device according to any one of claims 1 to 4, wherein the substrate is a glass substrate having a thickness of 1 mm or less.
PCT/JP2022/040918 2022-11-01 2022-11-01 Substrate conveying device WO2024095375A1 (en)

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