WO2024092458A1 - 物料状态更新方法和装置、服务器、存储介质 - Google Patents

物料状态更新方法和装置、服务器、存储介质 Download PDF

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Publication number
WO2024092458A1
WO2024092458A1 PCT/CN2022/128772 CN2022128772W WO2024092458A1 WO 2024092458 A1 WO2024092458 A1 WO 2024092458A1 CN 2022128772 W CN2022128772 W CN 2022128772W WO 2024092458 A1 WO2024092458 A1 WO 2024092458A1
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Prior art keywords
specification information
response
detecting
state
module
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PCT/CN2022/128772
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English (en)
French (fr)
Inventor
许洋溢
温都日呼
李文娟
朴南植
王洪
刘莉
马兴华
段季芳
Original Assignee
京东方科技集团股份有限公司
北京中祥英科技有限公司
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Application filed by 京东方科技集团股份有限公司, 北京中祥英科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to CN202280003947.0A priority Critical patent/CN118284898A/zh
Priority to PCT/CN2022/128772 priority patent/WO2024092458A1/zh
Publication of WO2024092458A1 publication Critical patent/WO2024092458A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
    • G06Q10/00—Administration; Management
    • G06Q10/06—Resources, workflows, human or project management; Enterprise or organisation planning; Enterprise or organisation modelling

Definitions

  • the present disclosure relates to the field of data processing technology, and in particular to a material status updating method and device, a server, and a storage medium.
  • the present disclosure provides a material status updating method and device, a server, and a storage medium to address the deficiencies of related technologies.
  • a material status updating method comprising:
  • the next state of the material is updated according to the change state and the temperature recovery state.
  • the temperature recovery state of the material is obtained, including:
  • the start time and end time of the material being removed from the shelf and the preset temperature return time threshold are obtained;
  • the temperature recovery state of the material is determined to be temperature recovery completed and the change state of the material is adjusted to the off-shelf state.
  • the method further comprises:
  • the material is created according to a preset material model; the initial state of the material is a waiting state.
  • creating the material according to a preset material model includes:
  • the detection field includes a detection state
  • the preset material model is stored in a basic data module; the basic data module is used to create preset material models corresponding to various materials.
  • the specification information is stored in a bill of materials of the engineering management module, and the bill of materials is used by the process module, the engineering management module and the material module;
  • the process flow module is used to define the product and its corresponding process flow, including each process step type and related process control strategy;
  • the engineering management module is used to manage engineering business, and the engineering business includes BOM management;
  • the material module is used to manage raw materials, semi-finished products and product data.
  • the method further comprises:
  • the method further comprises:
  • the new version of the specification information is different in version from the original version of the specification information but has the same other contents as the original version;
  • the new version of the specification information is activated and the state of the original version of the specification information is updated to an inactivated state.
  • the method further comprises:
  • the specification information of the material In response to detecting an operation of cloning the specification information of the material, generating specification information of a new name of the material; the specification information of the new name is different from the specification information of the original name and has the same other contents;
  • the specification information of the new name is activated.
  • the method further comprises:
  • material data in XML format according to the TibcoRV message subscription method, wherein the material data includes the material change status and the temperature recovery status; the material data includes the BPEL name corresponding to the server;
  • Java file corresponding to the BPEL name is found; the Java file includes a releaseMaterial method;
  • Calling the releaseMaterial method enables the material module to process the business; wherein the processing business includes operating the database to update the change status and the temperature return status of the material;
  • a response message in XML format is generated and returned.
  • a material status updating method including:
  • the creation page includes a creation button and specification parameters
  • the material In response to detecting an operation of creating a material, the material is created according to the specification information and the material is managed.
  • the method further comprises:
  • the input specification information is acquired and updated.
  • the method further comprises:
  • the new version of the specification information is different in version from the original version of the specification information but has the same other contents as the original version;
  • the new version of the specification information is activated and the state of the original version of the specification information is updated to an inactivated state.
  • the method further comprises:
  • the specification information of the material In response to detecting an operation of cloning the specification information of the material, generating specification information of a new name of the material; the specification information of the new name is different from the specification information of the original name and has the same other contents;
  • the specification information of the new name is activated.
  • the method further comprises:
  • the detention status of the materials is adjusted to detained or not detained, respectively.
  • the method further comprises:
  • the use status of the material is adjusted to a scrap status.
  • the method further comprises:
  • binding the material to a target batch In response to detecting an operation of binding a material to a batch, binding the material to a target batch;
  • the target batch is unbundled from the material.
  • the method further comprises:
  • the position of the material is adjusted to a target position.
  • a material status updating device including:
  • the state acquisition module is used to obtain the change state and temperature recovery state of the material
  • a state updating module is used to update the next state of the material according to the change state and the temperature recovery state.
  • a material status updating device including:
  • a page display module for displaying a creation page in response to detecting an operation of configuring a material
  • the creation page includes a creation button and specification parameters
  • an information acquisition module for acquiring specification information corresponding to the specification parameters in response to an operation of configuring the specification parameters
  • a status update module used to create the material according to the specification information and manage the material in response to detecting the operation of creating the material
  • a server including:
  • the memory is used to store a computer program executable by the processor
  • the processor is used to execute the computer program in the memory to implement the method as described in the first aspect or the second aspect.
  • a non-transitory computer-readable storage medium is provided, and when an executable computer program in the storage medium is executed by a processor, the method described in the first aspect or the second aspect can be implemented.
  • the scheme provided by the embodiment of the present disclosure can obtain the change state and the temperature recovery state of the material; and update and manage the next state of the material according to the change state and the temperature recovery state.
  • the scheme of this embodiment performs standardized management of materials, can obtain the change state and temperature recovery state of the material during the production process, and update the next state of the material, so as to achieve the effect of managing the material throughout its life cycle, and can prevent the material specification information from being tampered with, thereby avoiding production safety problems caused by tampering with information, which is conducive to improving the yield and productivity of semiconductor products.
  • FIG. 1 is a block diagram showing a semiconductor manufacturing execution system according to an exemplary embodiment.
  • Fig. 2 is an application architecture diagram of a semiconductor manufacturing execution system according to an exemplary embodiment.
  • FIG. 3 is an operation flow chart of a semiconductor manufacturing execution system according to an exemplary embodiment.
  • Fig. 4 is a flow chart showing a material status updating method according to an exemplary embodiment.
  • Fig. 5 is a block diagram showing a method of acquiring a material state change according to an exemplary embodiment.
  • Fig. 6 is a schematic diagram showing a method of acquiring creation material information according to an exemplary embodiment.
  • Fig. 7 is a flow chart showing a method of adjusting the state of a material according to an exemplary embodiment.
  • Fig. 8 is a flow chart showing a method of obtaining a temperature recovery state according to an exemplary embodiment.
  • Fig. 9 is a schematic diagram showing BOM management of materials according to an exemplary embodiment.
  • Fig. 10 is a flowchart showing a BOM management according to an exemplary embodiment.
  • Fig. 11 is a flow chart showing a material management process according to an exemplary embodiment.
  • Fig. 12 is a flow chart showing a method of activating specification information of a material according to an exemplary embodiment.
  • Fig. 13 is a flow chart showing a method of editing specification information according to an exemplary embodiment.
  • Fig. 14 is a flow chart showing a method of obtaining material status according to an exemplary embodiment.
  • Fig. 15 is a block diagram showing a system architecture of a modeling tool according to an exemplary embodiment.
  • Fig. 16 is a block diagram showing a system architecture of a user operation platform according to an exemplary embodiment.
  • Fig. 17 is a flow chart of a material status updating method according to an exemplary embodiment.
  • Fig. 18 is a block diagram of a material status updating device according to an exemplary embodiment.
  • Fig. 19 is a block diagram of a material status updating device according to an exemplary embodiment.
  • Fig. 20 is a block diagram of a server according to an exemplary embodiment.
  • the embodiments of the present disclosure provide a material status update method and device, a server, and a non-transitory computer-readable storage medium.
  • the above material status update method can be applied to semiconductor packaging and testing systems.
  • the semiconductor manufacturing execution system is used for the whole process manufacturing management of semiconductor production, executing production orders, tracking the real-time status of equipment resources (such as carriers, materials, etc.) to complete semiconductor products, so as to achieve the effect of information sharing and process automation implementation of the factory.
  • equipment resources such as carriers, materials, etc.
  • the above semiconductor manufacturing execution system will respond and report the event in a timely manner, and use the current data to guide the user to handle the event, thereby maximizing production efficiency and yield, which is conducive to reducing production costs and improving production management.
  • the above semiconductor manufacturing execution system adopts a modular design, which can meet the production needs of different packaging and testing process technologies, and has excellent flexibility and scalability, thereby achieving the maximum input-output ratio and achieving the high flexibility and personalized production mode required by Industry 4.0.
  • FIG1 is a block diagram of a semiconductor manufacturing execution system according to an exemplary embodiment.
  • a semiconductor manufacturing execution system includes: a basic data module, a process flow module, a production plan module, a work-in-progress module, an engineering management module, a recipe module, an equipment module, a machine limit module, a carrier module, a material module, a fixture module, and a packaging module.
  • the basic data module can be a unified basic data model platform, providing basic data modeling functions for the semiconductor manufacturing execution system, including but not limited to: factory modeling, equipment modeling, system status modeling, packaging modeling, user authority modeling, recipe (different semiconductor devices require different programs, recipes or menus) basic data modeling, material basic data modeling, process step flow modeling, strategy modeling, data acquisition basic data modeling and alarm basic data modeling.
  • the basic data model as a standard framework, provides users with the required basic general functions and provides a series of customized extension settings, such as unified naming specifications, unified data enumeration types and unified business SQL management, which is conducive to the rapid construction of applications; the definition of objects in cross-multiple applications is standardized, supports multiple languages and multiple units, is more flexible, and has stronger scalability and flexibility.
  • the factory modeling function is used to support the maintenance of factory basic data, support multi-factory mode and support the creation of areas under the factory.
  • the device modeling function is used to support the creation of device master data and the maintenance of device commodity (port) data.
  • system status modeling function is used to support batch status maintenance, equipment status maintenance, material status maintenance, carrier status maintenance, fixture status maintenance, and the like.
  • packaging form modeling is used to maintain packaging-related attribute data and to uniformly maintain and manage packaging methods of different specifications.
  • user authority modeling is used to support the creation and maintenance of users, user groups and user roles, and to support the maintenance of password verification of user menus and user operation interfaces.
  • recipe basic data modeling is used to support the creation and maintenance of process menu data and the maintenance of recipe equipment data relationships.
  • material basic data modeling is used to support the creation and maintenance of material basic data.
  • materials may include but are not limited to plastic encapsulation glue (RCM), silver wire (REP), lead frame (RLF), wire (RWR), wafer type materials (Wafer), blue film type materials (BlueType), which can be selected according to specific scenarios, and the corresponding solutions fall within the scope of protection of this disclosure.
  • process step flow modeling is used to support the creation and maintenance of basic data of steps, processes, sections, and processes, support visual interface editing of processes, support the creation and maintenance of branch processes, and support the creation and maintenance of rework processes.
  • strategy modeling is used to support product-level, process-level, and step-level process modeling, so as to facilitate the semiconductor manufacturing execution system to select different equipment and recipes for business operations in the actual production process according to different strategy configurations.
  • the data collection basic data modeling is used to support the creation and maintenance of data collection details and the maintenance of data collection rules.
  • alarm basic data modeling is used to support alarm system information maintenance, alarm triggering conditions for maintenance management, and alarm triggering subsequent actions for maintenance management.
  • the process flow module can allow users to define products and their corresponding process flows, including each step type and related process control strategies, so as to provide process management specifications for the semiconductor manufacturing execution system.
  • the process flow module can provide a complete version control mechanism. All activated processes in the system must strictly comply with this version control system, which can avoid errors in production process data and thus avoid serious accidents.
  • the process flow module can support multi-path and rework, and can automatically select paths based on pre-set conditions during field operations.
  • the process flow module can also support various product process rule controls, and can perform different process controls according to the conditions of products and processes. The above conditions can be subdivided into process step level, process level, process level, product level and batch level.
  • the process step flow modeling function is used to support the creation and maintenance of basic data of steps, processes, sections and processes, support visual interface editing of processes, support the creation and maintenance of branch processes, and support the creation and maintenance of rework processes.
  • the product process configuration function is used to configure different process flows according to different products. Different recipes and equipment can be selected according to different strategies for the same product and process.
  • the project management module can manage project-related businesses, including but not limited to: work permit management, QTime management, BOM management, process card management, and batch reservation functions.
  • the material module is used for the management of raw materials, semi-finished products and product data, as well as the management of warehouses, cargo spaces and shelves.
  • the material module can be used alone or as an extension of the warehouse management module in Enterprise Resource Planning (ERP) to implement interface functions, and can also be managed and controlled independently.
  • ERP Enterprise Resource Planning
  • the warehouse management function is used for material maintenance, material acceptance, material loading, material unloading, finished product warehousing, finished product delivery, return and transfer, etc.
  • the semiconductor manufacturing execution system uses CS architecture design and is developed based on the Client-Server (C/S, client-server) architecture model to ensure system stability, smooth interface operation, and enhance user experience.
  • the server is responsible for data management
  • the client is responsible for completing interactive tasks with users.
  • the client module is divided into two parts: one part is for basic data modeling, named FactoryModeler (Modeler), and the other part is for the user's operation interaction interface, named Operator Interface Client (OIC).
  • the front end uses the C# language winform framework
  • the server side uses the Java language, and is developed using the sping boot 2.x framework.
  • the data of the front-end and back-end communications are interacted in XML format, and the corresponding message publishing and subscription processing uses Tibco Rendezvous (Tibco RV), and the database is selected as Oracle 19C.
  • the application architecture is shown in Figure 2.
  • the corresponding relationship between the system and the module in the semiconductor manufacturing execution system includes:
  • Functional modules for realizing record traceability during the manufacturing process production planning module, work-in-progress module, batch module, and packaging module in the OIC system.
  • Core data support module in the process basic data module in FactoryModeler system.
  • the working process of the carrier module is as follows:
  • Carrier creation fill in business data on the OIC front-end page.
  • the MES.MOdule.Views.Carrier code module in the front-end code module corresponds to the front-end carrier management module.
  • the corresponding code MES.MOdule.Views.Durable.CarrierCreate.cs under this module represents the carrier creation page.
  • the data is encapsulated in XML format on the page. Its core parameter is the BPEL name "DurableCCarrierCreatereate.bpel" corresponding to the server.
  • the server obtains the BPEL XML data named "CarrierCreate.bpel" according to the TibcoRV message subscription method.
  • the server automatically finds the corresponding BPEL according to the BPEL name transmitted by the front end, and then enters the com.zisemi.mes.solution.event.carrier.CarrierCreateEvent.Java file in siemi-mes-be-solution under the solution module of the BPEL configuration Java entry program, executes the event method, and the event method calls the com.zisemi.mes.core.carrier corresponding to the server in the Core code module to implement business processing (the underlying ORM framework is used, and JDBC technology is used to operate the database to complete data updates).
  • the corresponding message is returned, and the message is transmitted back to the front end for response via XML.
  • Material receiving fill in business data on the OIC front-end page.
  • the MES.MOdule.Views.Material code module in the front-end code module corresponds to the front-end status update module.
  • the corresponding code under this module, MES.MOdule.Views.Material.MaterialReleaseView.cs represents the material receiving page.
  • the data is encapsulated in XML format on the page. Its core parameter is the BPEL name "ConsumableMaterialRelease.bpel" corresponding to the server.
  • the server obtains the XML data named "ConsumableMaterialRelease.bpel" of BPEL according to the TibcoRV message subscription method.
  • the server automatically finds the corresponding BPEL according to the BPEL name transmitted by the front end, and then enters the com.zisemi.mes.solution.event.consumable.MaterialReleaseServiceImpl.Java file in ziemi-mes-be-solution under the Java entry program solution module of the BPEL configuration, executes the releaseMaterial method, and the releaseMaterial method calls the com.zisemi.mes.core.consumable corresponding to the server in the Core code module to implement business processing (using the ORM framework at the bottom layer and the JDBC technology to operate the database to complete the data update such as the material change status and the temperature return status).
  • the change status of the material can include but is not limited to the material status (i.e., the state of loading or unloading), the detention state and the clean state, etc., which can be set according to the specific scenario, and the corresponding scheme falls within the protection scope of this disclosure.
  • FIG. 3 is a flowchart showing the overall operation of a semiconductor manufacturing execution system according to an exemplary embodiment. Referring to FIG. 3 , the flowchart includes steps 31 to 36:
  • step 31 the FactoryModeler client in the system creates basic data through the basic data module in response to the interaction with the user.
  • step 32 the FactoryModeler client connects the basic information data into basic business underlying data through the basic data module.
  • Production strategy configuration the corresponding equipment and the associated equipment recipe for the process step under the product. Among them, the production strategy includes 3 modes: product + process + process step mode, process + process step mode and process step mode.
  • the product, process and work step can match the product + process + work step mode, use the equipment and recipe configured in this mode for processing.
  • the product, process or work step cannot match the product + process + work step mode, match the process + work step mode; when the process + work step mode is matched, use the equipment and recipe configured in the process + work step mode for processing; when the process + work step mode cannot be matched, continue to match the work step mode; if the work step model can be matched, use the equipment and recipe in the work step mode; if it cannot be matched, the process will be stuck and the appropriate equipment cannot be selected for processing.
  • the OIC client in the system may perform production plan creation and plan execution operations through the production plan module in response to the interaction with the user.
  • the system enters the production plan, such as the planned output of a product within a period of time, the planned start time, the planned end time, the priority and the person in charge.
  • the production plan such as the planned output of a product within a period of time, the planned start time, the planned end time, the priority and the person in charge.
  • Plan execution Create a work order and formulate work order information based on the actual inventory and production capacity of the workshop, such as the original planned order number, work order number, work order product from the planned order product, work order quantity less than the planned order data, priority and other related information.
  • step 34 the OIC client in the system performs the manufacturing process through the work-in-progress module and the batch management module.
  • batch-related businesses include the use of functional modules in the work-in-process module and the batch module, such as batch pause, batch cancel pause, batch scrap, batch cancel scrap, batch division, batch combination, batch in and batch out to support process business.
  • step 35 the OIC client in the system controls the batch outbound through the batch outbound function of the work-in-progress module or performs the carrier binding operation using the carrier binding function of the carrier module.
  • Batch outbound vehicle binding When the batch is outbound, select the vehicle information and bind the vehicle.
  • Vehicle binding function to bind the vehicle Enter the vehicle binding function interface, select the batch information, select the vehicle information to be bound, and click Bind to bind the vehicle.
  • Involving vehicle-related business Before binding the vehicle, the vehicle needs to be cleaned. The vehicle management process involves: vehicle suspension, vehicle unpause, vehicle scrapping, vehicle scrapping and other scenarios.
  • step 36 the OIC client in the system performs batch process management through batch entry and exit of the work-in-progress module.
  • the process includes the following process sections: cutting-chip bonding-packaging-testing.
  • the batch is in the process route of inbound and outbound operations, and processing and production are carried out strictly in accordance with the process flow nodes set by the process flow management module.
  • equipment is used for processing and the process menu management module is used: the equipment selects the recipe for processing and production based on the relationship between the configured basic data equipment and recipes and the production strategy.
  • Equipment needs regular inspection and maintenance. Therefore, when selecting equipment for processing, the equipment itself will also perform a series of management. If the equipment is not inspected and maintained when it is due, the equipment cannot process the batch for production. Therefore, the system needs to perform equipment inspection and equipment maintenance operations.
  • the machine limit can be accurately formulated according to the product, process, step, equipment, raw material type, and batch.
  • the machine limit system control conditions can be set positively (when the batch meets the condition in the process, the batch will be controlled and the equipment cannot be operated to enter or exit the station) and reversely (contrary to the forward setting, only batches that meet the conditions can use the equipment for entry and exit operations).
  • MES obtains data through sensors, or reads and collects equipment data and stores it in designated files or other databases.
  • MES collects equipment data, it needs to parse equipment data from other databases or other files and switch equipment status in the MES system.
  • the MES system interacts with corresponding related systems (EAP system, SCADA system) to accurately and real-timely obtain equipment status and some instructions for the completion of equipment tasks.
  • Manual mode When users correct and modify equipment, they need to manually enter the MES system to maintain data. At this time, the MES system will uniformly manage the equipment status and control the equipment status during the production process.
  • Involving equipment and material business using the relationship between the equipment port and the material in the basic data module, and using the material module: performing material loading and unloading operations.
  • Involving equipment and fixture business using the relationship between the equipment port and the fixture in the basic data module, using the fixture module: performing fixture on-machine and fixture off-machine operations.
  • Involving batch control business Use the corresponding functions of the engineering management module, such as the Qtime function, to set the maximum time limit from entry to exit.
  • the batch will trigger the Qtime timing after entering the station. If the exit operation is not performed within the maximum time, the subsequent exit will be controlled. The maximum limit time has been exceeded. Please contact the product engineer for processing.
  • Work permit function that is, the employee equipment operation authority management module. Only when the corresponding employee has the operation permit for the equipment and the permit is valid, can the employee operate the equipment for batch processing, and then strictly control the production and put it on the production order (Manufacture order, MO).
  • step 37 the OIC client in the system controls the annotation to enter the packaging stage after the batch process is completed.
  • FIG4 is a flow chart of a material status update method according to an exemplary embodiment.
  • a material status update method includes steps 41 to 42.
  • step 41 the change state and the temperature recovery state of the material are obtained.
  • the server stores different types of materials.
  • the server can create materials of different types and attributes according to the preset material model, where the initial state of the material is the waiting state (WaitIn). For example, in the interactive page (of the FactoryModeler client that appears later) in response to the user clicking the create button, the created material and the material specification information, such as model, size, production date, warming mark (WarmState), etc., will appear in the interactive page.
  • the material can be set according to the specific scenario, which is not limited here.
  • the preset material model is stored in the basic data module; the basic data module is used to create preset material models corresponding to various materials.
  • the above specification information is stored in the bill of materials of the engineering management module, and the bill of materials is used by the process flow module, engineering management module and material module; the process flow module is used to define the product and its corresponding process flow, including each step type and related process control strategy; the engineering management module is used to manage engineering business, and the engineering business includes BOM management; the material module is used to manage raw materials, semi-finished products and product data.
  • the server can also respond to the operation of editing the specification information of the material, such as clicking the modify button, to obtain the detection field (checkout) in the specification information of the material.
  • the above-mentioned checkout state is used to indicate that an account is editing the specification information.
  • the server can determine that the specification information of the material is in an uneditable state.
  • the above-mentioned detection field is in the checkout state, the current account is compared with the editing account that edits the specification information (that is, there is currently an account that edits the material specification information, referred to as the editing account) to see if they are the same account.
  • the server can determine to refuse the current account to edit the specification information of the material, that is, the current account cannot edit the specification information of the material; when the above-mentioned current account and the editing account are the same, the server can determine to allow the current account to edit the specification information of the material and freeze the specification information after the editing is completed.
  • the specification information of the material is frozen after the editing is completed, and the specification information can be solidified, that is, it cannot be edited or deleted again, thereby preventing the specification information that has been published from being tampered with.
  • the specification information after freezing can be released to the operator through an activation operation, so that the operator can create and use materials of the specification in the production system.
  • the operator can create multiple materials of the same specification.
  • the service end can generate information to be reviewed in response to detecting a request to activate the specification information of the material. Then, in response to detecting the approval information corresponding to the information to be reviewed, the service end can determine to put the material into use.
  • the above-mentioned information to be reviewed is usually confirmed by a designated person (such as the operator's leader, etc.) before it can be successfully activated. In this way, in this embodiment, by introducing a sign-off mechanism, it is ensured that the specification information released to the production environment is approved, and the approval information is recorded and traceable, thereby improving production efficiency and product yield.
  • the user can upgrade the specification information of the material.
  • the server can generate a new version of the specification information.
  • the new version of the specification information is different from the original version of the specification information and the other contents are the same.
  • the server can edit the new version of the specification information and freeze it.
  • the server in response to detecting an operation to activate the new version of the specification information, the server can activate the new version of the specification information and update the status of the original version of the specification information to an unactivated state.
  • the new version of the specification information can be edited and frozen without affecting the original specification information, thereby not affecting the management of the original material.
  • the user can clone the specification information of the material.
  • the server can generate specification information of a new name.
  • the specification information of the new name is different from the specification information of the original name and has the same other contents.
  • the server can edit the specification information of the new name and freeze it.
  • the server can activate the specification information of the new name of the material.
  • the specification information of the new name can be edited and frozen and used as a material of a specification after activation without affecting the specification information of the original name, thereby not affecting the management of the original material.
  • the server can obtain the change status of the material, as shown in Figure 5, including:
  • the material When the material is received, the material changes to the waiting state (waitin).
  • the materials required for this process can be put on the shelf (InShelf).
  • putting on the shelf means placing the material on the material shelf in the equipment coverage area of the process site, so that the equipment at the process site can easily access the material.
  • the equipment at the process site can take the above materials according to the process flow.
  • the material When the equipment picks up the material, the material changes to the machine (Kitting).
  • the equipment can place the material in the corresponding position and put it down.
  • the material changes to the unmachine (unkjitting), and the material data is deducted during use.
  • the above materials are no longer needed in this process, the above materials can be taken off the shelf (OutShelf).
  • the material can be returned to the line side shelf or placed in other warehouses, waiting to be put back on the shelf.
  • the material can be scrapped (Scrap), and when the material is needed again, the material can be unscrapped and put back on the shelf.
  • Temperature recovery refers to restoring the material from the current temperature to the target temperature, such as restoring the solder paste from the current temperature of 100 degrees Celsius to the room temperature of 25 degrees Celsius, to ensure the safety of materials and personnel.
  • the temperature recovery state refers to the distance between the temperature and the temperature threshold after entering the temperature recovery state, that is, the temperature recovery progress. Therefore, when creating the specification information of the material, referring to Figures 6 and 7, the creation item includes attribute values such as the temperature recovery mark (WarmState) and the preset temperature recovery time threshold.
  • the preset temperature recovery time threshold can include attributes such as FirstWareTime and SecondWareTime, which can be set according to the specific scenario and are not limited here.
  • the temperature recovery flag can be set to the first value, such as Y, and for materials that do not require temperature recovery control, the temperature recovery flag (WarmState) can be set to the second value, such as N.
  • the temperature recovery flag can be used as a non-mandatory item and can only be filled in when the material has a temperature recovery requirement, so as to facilitate the temperature recovery state detection of the material when it is taken off the shelf.
  • the server may obtain the temperature recovery state of the material, as shown in FIG8 , including:
  • the server can obtain the material's warming flag (WarmState).
  • the off-shelf start time t_start refers to the time when the binding material event occurs when the material is placed on the material shelf
  • the off-shelf end time t_end refers to the time when the unbinding material event occurs when the material is taken from the material shelf.
  • the server can determine that the material's warming-up status is incomplete; when the current usage time is less than the preset warming-up time threshold, the server can determine that the material's warming-up status is complete and adjust the material's change status (consumableState) to the out-of-shelf status (outShelf), and the server can return the material to the line cabinet.
  • step 43 the next state of the material is updated according to the change state and the temperature recovery state.
  • the server can update the next state of the material according to the above-mentioned material change state and temperature recovery state, such as material batches entering and leaving the station, material quantity deductions, etc., so as to manage the status of various materials in the production process and ensure that the materials can be used normally.
  • material change state and temperature recovery state such as material batches entering and leaving the station, material quantity deductions, etc.
  • the batches of materials entering the station need to strictly verify the deduction quantity bound to the materials in Bom management.
  • the deduction quantity set in the Bom and the specification information verification of the material meet the processing requirements of the corresponding process site in the production process, the server can correctly deduct the material quantity to avoid the impact of improper material production deduction on the overall material consumption.
  • BOM management you can set the material deduction quantity, strictly control the quantity, and control the actual material consumption.
  • the scheme provided by the embodiment of the present disclosure can obtain the change state and the temperature recovery state of the material; and manage the material according to the change state and the temperature recovery state.
  • the scheme of this embodiment performs standardized management of materials, which can prevent the material specification information from being tampered with, and further avoid production safety problems caused by tampering with information, which is conducive to improving the yield and productivity of semiconductor products.
  • the semiconductor manufacturing execution system can maintain and activate materials based on material specification information. Enter materials, where the entry methods include manual input and Excel import. Then, use the materials again, at this time, you can record the material use stage and perform life cycle management.
  • the material management process includes: material specification modeling, material specification freezing, material specification activation, and approval stages. Among them, after the material specification is frozen, it can also include material specification archiving, material specification cloning, and material specification upgrade.
  • Material specification modeling is to save the material specification information into the semiconductor manufacturing execution system through the modeling tool.
  • the user can perform modeling through Excel import or manual entry.
  • the detection field CheckState can be used to manage the editing status of the specification information.
  • the detection field value is the checkout status CheckOut
  • This account is called the editing account.
  • the material specifications can be frozen to solidify the material specification information, and cannot be edited or deleted again, which can prevent the published specification information from being tampered with.
  • the specification information can be activated after being frozen.
  • operators can create and use materials of this specification in the production system.
  • activation requires confirmation by designated personnel before activation can be successful.
  • the semiconductor manufacturing execution system can introduce a sign-off mechanism to ensure that the specification data released to the production environment has been approved, and the approval information is recorded and traceable. If the user modifies the published specification information according to business needs, the semiconductor packaging system can provide two editing methods, namely material specification upgrade and material specification cloning as shown in Figure 12.
  • Material specification upgrade requires upgrading the original material specification information.
  • the new version of the specification information is the same as the original version of the specification information except the version number.
  • the new version of the specification information can be edited.
  • the specification information of all materials of this specification in the production environment is updated, and the new version of the specification information is frozen and activated.
  • the freezing and activation process is shown in Figure 14.
  • the original version of the specification information is automatically changed to an inactive state.
  • the specifications of all materials in the semiconductor manufacturing execution system automatically inherit the new version of the specification information.
  • Material specification cloning is to create a material specification information with a new name.
  • the cloned specification information i.e. the specification information with the new name
  • the activated specification information with the new name can be managed as a new information material specification, which will not affect the management of the original material specifications.
  • the production operation platform creates materials of corresponding specifications in response to user operations, and manages (physical) materials in sequence, such as material name, material type, material storage time, production time, preset reheating time, reheating mark, creation time, creation user, material scrapping and cancellation of scrapping, etc.
  • the server can obtain the temperature recovery state of the material.
  • the content of obtaining the temperature recovery state of the material can be specifically referred to the content illustrated in FIG8 , which will not be repeated here. It can be understood that the content illustrated in FIG8 can determine the temperature recovery state by formula (1), as shown in formula (1):
  • the specification information is maintained in the modeling tool, and its data is finally persisted in the Oracle database.
  • the system architecture of the modeling tool is shown in FIG. 15 .
  • the modeling tool includes an Oracle database and a material tool.
  • the material tool includes material modeling, version management, freeze activation, and editing right control.
  • material modeling includes material type modeling and material specification modeling.
  • the Oracle database includes material type information, material specification information, and material information. The modeling tool and the Oracle database communicate using the TCP/IP protocol.
  • the Winform client enters and queries production information based on the user's operation on the page, and the results are sent to the server through tibco; after relevant logical processing, they are persisted in the Oracle database.
  • the system architecture of the user operation platform is shown in Figure 16. Referring to Figure 16, the system architecture of the user operation platform includes the user operation platform, server and Oracle database.
  • the user operation platform includes client interface, material creation, specification information review, material cleaning, batch binding, batch unbinding, material scrapping, and Winform+Infragistics modules.
  • the server includes QRY service, CNM service, CNX service and Spring boot+Spring MVC+Bpei.
  • the embodiment of the present disclosure also provides a material status update method, see FIG. 17 , which includes steps 171 to 173 .
  • step 171 in response to detecting an operation of configuring a material, a creation page is displayed; the creation page includes a creation button and specification parameters.
  • the user can perform configuration operations through the FactoryModeler client in the semiconductor packaging system.
  • the user operates the FactoryModeler client, and in response to detecting the operation of configuring materials, a maintenance page as shown in FIG6 is displayed.
  • a button (create) and specification parameters are created on the creation page.
  • step 172 in response to the operation of configuring the specification parameters, the specification information corresponding to the specification parameters is obtained.
  • TimeUserLimit is 2 hours
  • CleanTimeLimit is 2 hours, etc., which can be set according to specific scenarios and are not limited here.
  • step 173 in response to detecting an operation of creating a material, the material is created according to the specification information and the life cycle of the material is managed.
  • the semiconductor manufacturing execution system in response to detecting an operation of displaying material specification information, may display material specification information as shown in FIG6. Then, in response to detecting an operation of editing material specification information, the semiconductor manufacturing execution system may obtain the input specification information and update the specification information.
  • the semiconductor manufacturing execution system in response to detecting an operation of displaying material specification information, may display specification information of a material such as. Then, in response to detecting an operation of upgrading specification information, the semiconductor manufacturing execution system may generate a new version of specification information; the new version of specification information is different from the original version of specification information in version but has the same other contents. Thereafter, in response to detecting an operation of editing the new version of specification information, the semiconductor manufacturing execution system may edit the new version of specification information and freeze it. Finally, in response to detecting an operation of activating the new version of specification information, the semiconductor manufacturing execution system may activate the new version of specification information and update the status of the original version of specification information to an inactivated status.
  • the semiconductor manufacturing execution system in response to detecting an operation of displaying material specification information, may display specification information of the material; in response to detecting an operation of cloning specification information, the semiconductor manufacturing execution system may generate specification information with a new name; the specification information with the new name has a different name from the specification information with the original name but the other contents are the same; in response to detecting an operation of editing the specification information with the new name, the semiconductor manufacturing execution system may edit the specification information with the new name and freeze it; in response to detecting an operation of activating the specification information with the new name, the semiconductor manufacturing execution system may activate the specification information with the new name.
  • this embodiment further provides a material status updating device, see FIG. 18 , comprising:
  • the state acquisition module 181 is used to acquire the change state and the temperature recovery state of the material
  • the state updating module 182 is used to update the next state of the material according to the change state and the temperature recovery state.
  • this embodiment further provides a material status updating device, see FIG. 19 , comprising:
  • the page display module 191 is used to display a creation page in response to detecting an operation of configuring a material; the creation page includes a creation button and specification parameters; the information acquisition module is used to acquire specification information corresponding to the specification parameters in response to the operation of configuring the specification parameters;
  • the status update module 192 is used to create the material and manage the material according to the specification information in response to detecting the operation of creating the material.
  • the device embodiment shown in this embodiment matches the content of the above method embodiment, and the content of the above method embodiment can be referred to, which will not be repeated here.
  • a server is also provided, referring to FIG. 20 , including:
  • the memory 202 is used to store computer programs executable by the processor 201;
  • the processor 201 is used to execute the computer program in the memory 202 to implement the above method.

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Abstract

一种物料状态更新方法和装置、服务器、存储介质。方法包括：获取物料的变化状态和回温状态；根据变化状态和回温状态更新物料的下一状态。方案对物料进行标准化管理，可以获取在生产过程中物料的变化状态和回温状态，并更新物料的下一状态，达到对物料进行全生命周期进行管理的效果，并且可以避免物料规格信息被篡改，进而避免篡改信息造成的生产安全问题。

Description

物料状态更新方法和装置、服务器、存储介质 技术领域
本公开涉及数据处理技术领域，尤其涉及一种物料状态更新方法和装置、服务器、存储介质。
背景技术
目前，在生产半导体产品的过程中，不同工艺流程中可能用到不同物料。考虑到各个工艺流程所使用物料具有不同的属性和使用量，因此需要对物料进行精准管理，否则有可能影响到生产效率。
发明内容
本公开提供一种物料状态更新方法和装置、服务器、存储介质，以解决相关技术的不足。
根据本公开实施例的第一方面，提供一种物料状态更新方法，包括：
获取物料的变化状态和回温状态；
根据所述变化状态和所述回温状态更新所述物料的下一状态。
可选地，获取物料的回温状态，包括：
当所述物料的预设回温标识表示所述物料需要回温时，获取所述物料的下架开始时间、下架结束时间和预设回温时长阈值；
根据所述下架开始时间和所述下架结束时间计算本次使用时间；
当所述本次使用时间大于或等于所述预设回温时长阈值时，确定所述物料的回温状态为回温未完成；
当所述本次使用时间小于所述预设回温时长阈值时，确定所述物料的回温状态为回温完成并将所述物料的变化状态调整为下架状态。
可选地，所述方法还包括：
按照预设物料模型创建所述物料；所述物料的初始状态为等待状态。
可选地，按照预设物料模型创建所述物料包括：
响应于检测到编辑所述物料的规格信息的操作，获取所述物料的规格信息内的检测字段；所述检测字段包括检出状态；
当所述检测字段不是所述检出状态时，确定所述物料的规格信息处于不可编辑状态；
当所述检测字段为所述检出状态时，对比当前账户与编辑所述规格信息的编辑账户是否为同一账户；
当所述当前账户和所述编辑账户不同时，确定拒绝所述当前账户编辑所述物料的规格信息；当所述当前账户和所述编辑账户相同时，确定允许所述当前账户编辑所述物料的规格信息并在编辑完成后冻结所述规格信息。
可选地，所述预设物料模型存储到基础数据模块之内；所述基础数据模块用于创建各种物料对应的预设物料模型。
可选地，所述规格信息存储到工程管理模块的物料清单之内，所述物料清单供工艺流程模块、工程管理模块和物料模块使用；
所述工艺流程模块用于定义产品及其对应的工艺流程，包括每个工步类型及相关流程控制策略；
所述工程管理模块用于对工程业务进行管理，所述工程业务包括BOM管理；
所述物料模块用于管理原材料、半成品和产品数据。
可选地，所述方法还包括：
响应于检测到激活所述物料的规格信息的请求，生成待审核信息；
响应于检测到所述待审核信息对应的审批信息，确定将所述物料投入使用。
可选地，所述方法还包括：
响应于检测到升版所述物料的规格信息的操作，生成所述物料的新版本的规格信息；所述新版本的规格信息与原版本的规格信息的版本不同且其他内容相同；
响应于检测到编辑所述新版本的规格信息的操作，编辑所述新版本的规格信息并冻结；
响应于检测到激活所述新版本的规格信息的操作，激活所述新版本的规格信息并将所述原版本的规格信息的状态更新为未激活状态。
可选地，所述方法还包括：
响应于检测到克隆所述物料的规格信息的操作，生成所述物料的新名称的规格信息；所述新名称的规格信息与原名称的规格信息的名称不同且其他内容相同；
响应于检测到编辑所述新名称的规格信息的操作，编辑所述新名称的规格信息并冻结；
响应于检测到激活所述新名称的规格信息的操作，激活所述新名称的规格信息。
可选地，所述方法还包括：
根据TibcoRV消息订阅方式获取XML格式的物料数据，所述物料数据包括物料的变化状态和回温状态；所述物料数据包括服务端对应的BPEL名称；
查询到所述BPEL名称对应的Java文件；所述Java文件包括releaseMaterial方法；
调用所述releaseMaterial方法使物料模块处理业务；其中处理业务包括操作数据库以更新物料的变化状态和回温状态；
响应于业务处理完成，生成并返回XML格式的响应信息。
根据本公开实施例的第二方面，提供一种物料状态更新方法，包括：
响应于检测到配置物料的操作，显示创建页面；所述创建页面包括创建按键和规格参数；
响应于配置规格参数的操作，获取所述规格参数对应的规格信息；
响应于检测创建物料的操作，根据所述规格信息创建所述物料并管理所述物料。
可选地，所述方法还包括：
响应于检测到显示物料规格信息的操作，显示所述物料的规格信息；
响应于检测到编辑物料的规格信息的操作，获取所输入的规格信息并更新所述规格信息。
可选地，所述方法还包括：
响应于检测到显示物料规格信息的操作，显示所述物料的规格信息；
响应于检测到升版所述物料的规格信息的操作，生成所述物料的新版本的规格信息；所述新版本的规格信息与原版本的规格信息的版本不同且其他内容相同；
响应于检测到编辑所述新版本的规格信息的操作，编辑所述新版本的规格信息并冻结；
响应于检测到激活所述新版本的规格信息的操作，激活所述新版本的规格信息并将所述原版本的规格信息的状态更新为未激活状态。
可选地，所述方法还包括：
响应于检测到显示物料规格信息的操作，显示所述物料的规格信息；
响应于检测到克隆所述物料的规格信息的操作，生成所述物料的新名称的规格信息；所述新名称的规格信息与原名称的规格信息的名称不同且其他内容相同；
响应于检测到编辑所述新名称的规格信息的操作，编辑所述新名称的规格信息并冻结；
响应于检测到激活所述新名称的规格信息的操作，激活所述新名称的规格信息。
可选地，所述方法还包括：
响应于检测到显示物料规格信息的操作，显示所述物料的规格信息；
响应于检测到扣留物料或者放行物料的操作，分别将所述物料的扣留状态调整为扣留中或者未扣留。
可选地，所述方法还包括：
响应于检测到显示物料规格信息的操作，显示所述物料的规格信息；
响应于检测到报废物料的操作，将所述物料的使用状态调整为报废状态。
可选地，所述方法还包括：
响应于检测到对物料绑定批次的操作，绑定所述物料至目标批次；
响应于检测到对物料解绑批次的操作，将所述目标批次从所述物料解绑。
可选地，所述方法还包括：
响应于检测到显示物料规格信息的操作，显示所述物料的规格信息；
响应于检测到调整物料位置的操作，调整所述物料的位置至目标位置。
根据本公开实施例的第三方面，提供一种物料状态更新装置，包括：
状态获取模块，用于获取物料的变化状态和回温状态；
状态更新模块，用于根据所述变化状态和所述回温状态更新所述物料的下一状态。
根据本公开实施例的第四方面，提供一种物料状态更新装置，包括：
页面显示模块，用于响应于检测到配置物料的操作，显示创建页面；所述创建页面包括创建按键和规格参数；信息获取模块，用于响应于配置规格参数的操作，获取所述规格参数对应的规格信息；
状态更新模块，用于响应于检测创建物料的操作，根据所述规格信息创建所述物料并管理所述物料
根据本公开实施例的第五方面，提供一种服务器，包括：
存储器与处理器；
所述存储器用于存储所述处理器可执行的计算机程序；
所述处理器用于执行所述存储器中的计算机程序，以实现如第一方面或第二方面所述的方法。
根据本公开实施例的第六方面，提供一种非暂态计算机可读存储介质，当所述存储介质中的可执行的计算机程序由处理器执行时，能够实现如第一方面或第二方面所述的方法。
本公开的实施例提供的技术方案可以包括以下有益效果：
本公开实施例提供的方案中可以获取物料的变化状态和回温状态；根据所述变化状态和所述回温状态更新管理所述物料的下一状态。这样，本实施例的方案对物料进行标准化管理，可以获取在生产过程中物料的变化状态和回温状态，并更新物料的下一状态，达到对物料进行全生命周期进行管理的效果，并且可以避免物料规格信息被篡改，进而避免篡改信息造成的生产安全问题，有利于提高半导体产品的良率和生产率。
应当理解的是，以上的一般描述和后文的细节描述仅是示例性和解释性的，并不能限制本公开。
附图说明
此处的附图被并入说明书中并构成本说明书的一部分，示出了符合本公开的实施例，并与说明书一起用于解释本公开的原理。
图1是根据一示例性实施例示出的一种半导体制造执行系统的框图。
图2是根据一示例性实施例示出的一种半导体制造执行系统的应用架构图。
图3是根据一示例性实施例示出的一种半导体制造执行系统的操作流程图。
图4是根据一示例性实施例示出的一种物料状态更新方法的流程图。
图5是根据一示例性实施例示出的一种获取物料状态变化的框图。
图6是根据一示例性实施例示出的一种获取创建物料信息的示意图。
图7是根据一示例性实施例示出的一种调整物料的状态的流程图。
图8是根据一示例性实施例示出的一种获取回温状态的流程图。
图9是根据一示例性实施例示出的一种对物料进行BOM管理的示意图。
图10是根据一示例性实施例示出的一种BOM管理的流程图。
图11是根据一示例性实施例示出的一种物料的管理流程的流程图。
图12是根据一示例性实施例示出的一种激活物料的规格信息的流程图。
图13是根据一示例性实施例示出的一种编辑规格信息的流程图。
图14是根据一示例性实施例示出的一种获取物料状态的流程图。
图15是根据一示例性实施例示出的一种建模工具的系统架构的框图。
图16是根据一示例性实施例示出的一种户操作平台的系统架构的框图。
图17是根据一示例性实施例示出的一种物料状态更新方法的流程图。
图18是根据一示例性实施例示出的一种物料状态更新装置的框图。
图19是根据一示例性实施例示出的一种物料状态更新装置的框图。
图20是根据一示例性实施例示出的一种服务器的框图。
具体实施方式
这里将详细地对示例性实施例进行说明，其示例表示在附图中。下面的描述涉及附图时，除非另有表示，不同附图中的相同数字表示相同或相似的要素。以下示例性所描述的实施例并不代表与本公开相一致的所有实施例。相反，它们仅是与如所附权利要求书中所详述的、本公开的一些方面相一致的装置例子。需要说明的是，在不冲突的情况下，下述的实施例及实施方式中的特征可以相互组合。
为解决上述技术问题，本公开实施例提供了一种物料状态更新方法和装置、服务器、非暂态计算机可读存储介质。上述物料状态更新方法可以适用于半导体封测系统。该半导体制造执行系统用于半导体生产全流程制造管理，执行生产订单、跟踪设备资源(如载具、物料等)的实时状态至完成半导体产品，达到对工厂的信息共享与流程自动化实施的效果。当工厂发生实时事件时，上述半导体制造执行系统会对该事件及时作出反应、报告，并用当前数据指导用户处理该事件，从而最大限度地提高生产效率与良率，有利于降低生产成本以及改善生产管理。并且，上述半导体制造执行系统采用模块化设计，可满足不同封测工艺技术生产需求，具有极好的灵活性与扩展性，从而实现最大的投入产出比，达到工业4.0要求的高灵活性和个性化生产模式。
图1是根据一示例性实施例示出的一种半导体制造执行系统的框图。参见图1，一种半导体制造执行系统包括：基础数据模块、工艺流程模块、生产计划模块、在制品模块、工程管理模块、Recipe模块、设备模块、机限模块、载具模块、物料模块、治具模块、包装模块。
在一实施例中，基础数据模块可以是一个统一的基础数据模型平台，为半导体制造执行系统提供基础数据建模功能，包括但不限于：工厂建模、设备建模、系统状态建模、封装形式建模、用户权限建模、recipe(不同半导体器件需要不同的程式、配方或者菜单)基础数据建模、物料基础数据建模、工艺工步流程建模、策略建模、数据采集基础数据建模和警报基础数据建模。可理解的是，该基础数据模型作为一个标准框架，为用户提供了所需的基础通用功能，并提供了一系列的自定义扩展设置，如统一的命名规范、统一的数据枚举类型和统一的业务SQL管理，有利于应用程序的快速构建；交叉多应用程序中对象的定义标准化、支持多语种和多单位，更加灵活，扩展性更强和更灵活。
本实施例中，工厂建模功能用于支持工厂基础数据的维护、支持多工厂模式和支持工厂下区域的创建。
本实施例中，设备建模功能用于支持设备主数据的创建和设备商品(port口)数据维护。
本实施例中，系统状态建模功能用于支持批次状态维护、支持设备状态维护、支持物料状态维护、支持载具状态维护和支持治具状态维护等等。
本实施例中，封装形式建模用于用来维护封装相关属性数据，用于统一维护管 理不同规格的封装方式。
本实施例中，用户权限建模用于支持用户、用户组和用户角色的创建和维护，支持用户菜单和用户操作界面密码校验的维护。
本实施例中，recipe基础数据建模用于支持工艺菜单数据的创建和维护，支持recipe设备数据关系的维护。
本实施例中，物料基础数据建模用于支持物料基础数据的创建和维护。以制造半导体为例，物料可以包括但不限于塑封胶(RCM)、银线(REP)、引线框(RLF)、线材(RWR)、晶圆类物料(Wafer)、蓝膜类型物料(BlueType)，可以根据具体场景进行选择，相应方案落入本公开的保护范围。
本实施例中，工艺工步流程建模用于支持工步、工序、工段、流程的基础数据的创建和维护，支持流程的可视化界面编辑，支持分支流程的创建和维护，支持返工流程的创建和维护。
本实施例中，策略建模用于支持产品级、工艺级、工步级流程建模，以方便半导体制造执行系统根据不同的策略配置在实际生产过程中选择不同的设备和recipe进行业务操作。
本实施例中，数据采集基础数据建模用于支持数据采集明细项的创建和维护，支持数据采集规则的维护。
本实施例中，警报基础数据建模用于支持警报系统信息维护，支持警报触发条件进行维护管理，支持警报触发后续动作进行维护管理。
在一实施例中，工艺流程模块可以允许用户定义产品及其对应的工艺流程，包括每个工步类型及相关流程控制策略，从而为半导体制造执行系统提供流程管理规范。以版本控制为例，工艺流程模块可以提供一套完整的版本控制机制，系统内所有的激活在制的流程必须严格遵守这一版本控制系统，可以避免生产工艺数据出现错误，从而避严重事故。以流程定义为例，工艺流程模块可以支持多路径(Multi-path)和返工，并且现场作业时可基于预先设定条件自动进行路径选择。工艺流程模块还可以支持各种产品流程规则控制，可根据产品、流程的条件进行不同的流程控制，上述条件可以细分工步级、工序级、流程级、产品级和批次级等。
本实施例中，工艺工步流程建模功能用于支持工步、工序、工段和流程的基础数据的创建和维护，支持流程的可视化界面编辑，支持分支流程的创建和维护，支持返 工流程的创建和维护。
本实施例中，产品流程配置功能用于根据不同产品配置不同的工艺流程，同产品同流程下可根据不同的策略选择不同的recipe和设备。
在一实施例中，工程管理模块可以对工程相关业务进行管理，包括但不限于：上岗证管理、QTime管理、BOM管理、流程卡管理和批次预约等功能。
在一实施例中，物料模块用于原材料、半成品和产品数据的管理以及仓库、货位和货架的管理。该物料模块可以单独使用或者作为企业资源计划(Enterprise Resource Planning，ERP)中库房管理模块的扩展，实现接口功能，也可单独管理控制。库房管理功能用于物料维护、物料接受、物料上机、物料下机、成品入库、成品出库、退库和移库等。
在一实施例中，半导体制造执行系统选用CS架构设计，基于Client-Server(C/S，客户端-服务端)架构模式开发，以保证系统稳定性，界面操作流畅性，提升用户的体验度。其中，服务端负责数据的管理，客户端负责完成与用户的交互任务。客户端模块分为两部分：一部分为基础数据建模，命名为FactoryModeler(Modeler)，另外一部分用于用户的操作交互界面，命名为Operator Interface Client(OIC)。前端选用C#语言winform框架，服务器端采用Java语言，采用sping boot 2.x框架进行开发。前后端通信的数据使用XML格式交互，对应消息发布订阅的处理选用Tibco Rendezvous(Tibco RV)，数据库选取为Oracle 19C，应用架构如图2所示。
参见图1和图2，半导体制造执行系统中系统与模块的对应关系包括：
在制程过程中实现工艺制程卡控的功能模块：OIC系统中工程管理模块，机限管理模块。
在制程过程中实现记录追溯的功能模块：OIC系统中生产计划模块，在制品模块，批次模块，包装模块。
在制程过程中辅助的关键功能模块：OIC系统中设备模块，工艺菜单模块，工艺流程模块，物料模块，载具模块。
在制程过程中核心数据支撑模块：FactoryModeler系统中基础数据模块。
继续参见图1和图2，载具模块的工作过程为：
载具创建：OIC前端页面填写业务数据，前端代码模块中 MES.MOdule.Views.Carrier该代码模块对应前端载具管理模块，该模块下对应的代码MES.MOdule.Views.Durable.CarrierCreate.cs表示载具创建页面，在页面将数据封装为XML格式，其核心参数为服务端对应的BPEL名称“DurableCCarrierCreatereate.bpel”。
服务端根据TibcoRV消息订阅方式获取到BPEL名为“CarrierCreate.bpel”的xml数据，服务端自动根据前台传送的BPEL名称找到对应的BPEL，然后进入BPEL配置的java入口程序solution模块下zisemi-mes-be-solution中com.zisemi.mes.solution.event.carrier.CarrierCreateEvent.Java文件，执行event方法，event方法调用Core代码模块中的com.zisemi.mes.core.carrier对应服务端对应载具模块实现业务处理(底层使用ORM框架，JDBC技术操作数据库，完成数据更新)，处理完成业务后，返回对应的消息，消息通过XML在传回给前端响应。
需要说明的是，该载具模块下其他功能业务代码逻辑同上，唯一变动点：前端页面不同，前端传入服务端BPEL名称不同，传入xml数据格式不同，其余服务端代码逻辑流程全部保持一致。
继续参见图1和图2，物料模块的工作过程为：
物料接收：OIC前端页面填写业务数据，前端代码模块中MES.MOdule.Views.Material该代码模块对应前端状态更新模块，该模块下对应的代码MES.MOdule.Views.Material.MaterialReleaseView.cs即表示物料接收页面，在页面将数据封装为XML格式，其核心参数为服务端对应的BPEL名称“ConsumableMaterialRelease.bpel”。
服务端根据TibcoRV消息订阅方式获取到BPEL名为“ConsumableMaterialRelease.bpel”的xml数据，服务端自动根据前台传送的BPEL名称找到对应的BPEL，然后进入BPEL配置的java入口程序solution模块下zisemi-mes-be-solution中com.zisemi.mes.solution.event.consumable.MaterialReleaseServiceImpl.Java文件，执行releaseMaterial方法，releaseMaterial方法调用Core代码模块中的com.zisemi.mes.core.consumable对应服务端对应物料模块实现业务处理(底层使用ORM框架，JDBC技术操作数据库，完成物料变化状态和回温状态等数据更新)，处理完成业务后，返回对应的消息，消息通过XML在传回给前端响应。其中，物料的变化状态可以包括但不限于物料状态(即上机状态或者下机状态)、扣留状态和洁净状态等，可以根据具体场景进行设置，相应方案落入本公开的保护范围。
需要说明的是，该物料模块下其他功能业务代码逻辑同上，唯一变动点：前端页面不同，前端传入服务端BPEL名称不同，传入xml数据格式不同，其余服务端代码逻辑流程全部保持一致。
图3是根据一示例性实施例示出的一种半导体制造执行系统整体操作的流程图，参见图3，包括步骤31～步骤36：
在步骤31中，系统中FactoryModeler客户端响应于与用户的交互操作，通过基础数据模块创建基础数据。
1创建工厂信息；2创建用户信息；3创建用户组信息；4创建用户组菜单权限；5创建设备类型数据；6创建设备状态数据；7创建设备数据；8创建设备组信息；9创建设备port口信息；10创建治具类型信息；11创建治具状态信息；12创建治具信息；13创建载具类型信息；14创建载具状态信息；15创建载具信息；16创建原材料类型信息；17创建原材料状态信息；18创建批次类型信息；19创建批次状态信息；20创建仓库信息；21创建库位信息；22创建货架信息；23创建产品类型信息；24创建产品信息；25创建产品包装规格信息；26创建工步信息；27创建子流程信息(多个工步串联成子流程)；28创建主流程信息(多个子流程串联成主流程)；29创建Recipe信息。
在步骤32中，FactoryModeler客户端通过基础数据模块将基础信息数据串联成基础的业务底层数据。
1创建设备和recipe关系，以支撑工艺制程中使用设备加工时选择设备对于recipe加工。
2创建产品和流程的关系，以支撑制程中产品工艺流程流转。以下port说明：(1)如果涉及设备和物料关系的port，port指设备上的物料上料口；(2)如果涉及设备和治具关系的port，port指设备上的安装治具的设备位置，又称站位。
3创建设备port口和物料类型关系，以支撑后续物料上机业务，即通过对应的port口将物料上机。
4创建设备port口和治具类型关系，以支撑后续治具上机业务，即通过对应的port口将治具上机。
5创建物料类型和载具类型绑定，以支撑后续载具绑定批次时根据批次的原材料类型选择对于的载具。
6生产策略配置：产品下该流程下该工步设置对于的设备及关联出设备recipe。其中，生产策略包括3种模式：产品+工艺+工步模式，工艺+工步模式和工步模式。
在生产过程中，当产品、工艺和工步均能匹配产品+工艺+工步模式时，使用该模式下配置的设备和recipe加工。当产品、工艺或者工步不能匹配产品+工艺+工步模式时，匹配工艺+工步模式；当匹配上工艺+工步模式时，使用该工艺+工步模式下配置的设备和recipe加工；当不能匹配工艺+工步模式时，继续去匹配工步模式；如能匹配工步模型，使用该工步模式下的设备和recipe；如不能匹配则在制程中会进行卡控，不能选择合适的设备加工。
在步骤33中，系统中OIC客户端可以响应于与用户的交互操作，通过生产计划模块进行生产计划创建和计划执行操作。
(1)系统录入生产计划，例如一段时间内的某产品的计划产出量，计划开始时间，计划结束时间，优先级和负责人。
(2)计划执行：创建工单，根据车间的实际库存和产能进行制定工单信息，例如原计划订单号，工单号，工单产品来着计划订单产品，工单数量小于计划订单数据，优先级等相关信息的创建。
在步骤34中，系统中OIC客户端通过在制品模块和批次管理模块进行生产制造制程。
(1)创建批次：使用批次模块的批次创建，根据工单信息进行批次的生成(批次创建)，完成批次的创建。
(2)批次加工：使用在制品模块和批次模块的进站，出站操作进行批次操作
可理解的是，批次相关业务包括使用在制品模块和批次模块中的功能模块，如批次暂停，批次取消暂停，批次报废，批次取消报废，分批，合批，批次批量进站，批次批量出站进行工艺制程业务支持等。
在步骤35中，系统中OIC客户端通过在制品模块的批次出站功能控制批次出站或者使用载具模块的载具绑定功能进行载具绑定操作。
批次出站绑定载具：批次在进行出站操作的时候，选择载具信息，进行载具绑定。载具绑定功能进行载具绑定：进入在载具绑定功能界面，选择批次信息，选择需要绑定的载具信息，点击绑定进行载具绑定。涉及载具相关业务：载具绑定之前需要进行 载具清洗，载具管理过程中涉及到：载具暂停，载具取消暂停，载具报废，载具取消报废等场景的使用。
在步骤36中，系统中OIC客户端通过在制品模块的批次进出站进行批次制程管理。其中制程包括如下工艺段：切割-贴片-键合-封装-测试。
本步骤中，制程过程中：涉及到工艺相关的业务，使用工艺流程管理模块：批次在进行进站出站操作的工艺路线，严格按照工艺流程管理模块设置的工艺流程节点进行加工生产。
涉及到recipe相关的业务，使用设备进行加工，使用工艺菜单管理模块：设备根据配置的基础数据设备和recipe关系，及其结合生产策略进行选择对于的recipe进行加工生产。
涉及到设备模块的业务：设备需要定期点检和维护保养，因此批次在选择设备进行加工的同时，设备自身也会进行设备的一系列管理，如果设备到期未点检和未保养，该设备无法加工批次进行生产。因此系统需要进行设备点检和设备维保操作。
同时批次在进站操作的同时除对设备状态(IDEL，RUN状态才能加工批次)进行卡控外，还有许多设备的限制，以下机限管理模块：机限可以根据产品，流程，工步，设备，原材料类型，批次进行精确制定机限系统卡控条件，卡控条件可以正向设置(批次在制程中满足该条件后，会进行批次卡控无法操作设备进出站)，反向设置(与正向设置相反，只有满足条件的批次才能使用该设备进行进出站操作)。
本步骤中，设备在做维护和保养的同时，也需要监控设备状态，通常工厂分为手动和自动两种模式：
自动模块：MES通过传感器获取数据，或者会读取对设备数据进行收集存放在指定的文件内或其他数据库中，此时MES在做设备数据收集时，需要从其他数据库或者其他文件中解析设备数据并在MES系统中切换设备状态。或者MES系统和对应的相关性的系统(EAP系统，SCADA系统)进行数据交互，准确实时的获取设备状态，及其一些设备任务执行完成的指令。
手动模式：用户在修正和修改设备时，需要手动进入MES系统进行数据维护，此时MES系统会对设备状态进行统一管理，对于生产制程中进行设备状态的卡控。
涉及到设备物料业务：使用基础数据模块中的设备port口和物料的关系，使用物料模块：进行物料上机，物料下机操作业务。
涉及到设备治具业务：使用基础数据模块中的设备port口和治具的关系，使用治具模块：进行治具上机，治具下机操作业务。
涉及到批次控制业务：使用工程管理模块对应的功能，例如：Qtime功能，设置进站到出站的最大时间限制，批次在进站后触发Qtime计时，如果超过最大时间没有进行出站操作，后续出站会对批次进行卡控已超过最大限制时间，请联系产品工程师处理。
上岗证功能：即员工操作设备权限管理模块，只有对应员工有该设备的操作证，并且证件有效期未过期，员工才能操作该设备进行批次加工，进而严格卡控生产，放在生产工单(Manufacture order，MO)。
在步骤37中，系统中OIC客户端在批次制程结束后控制批注进入包装环节。
使用包装管理模块：进行批次盒码生成和对应箱码生成，生成后进行扫描箱号入库。
基于上述半导体制造执行系统，本公开实施例还提供的一种物料状态更新方法，图4是根据一示例性实施例示出的一种物料状态更新方法的流程图。参见图4，一种物料状态更新方法，包括步骤41～步骤42。
在步骤41中，获取物料的变化状态和回温状态。
本实施例中，服务端存储不同种类的物料。在一示例中，服务端可以按照预设物料模型创建不同种类和属性的物料，其中物料的初始状态为等待状态(WaitIn)。例如，(后续出现的FactoryModeler客户端的)交互页面内响应于用户点击创建按键，此时交互页面内会出现所创建的物料以及物料的规格信息，例如型号、尺寸、生产日期、回温标识(WarmState)等等，可以根据具体场景进行设置物料，在此不作限定。
其中，预设物料模型存储到基础数据模块之内；所述基础数据模块用于创建各种物料对应的预设物料模型。上述规格信息存储到工程管理模块的物料清单之内，所述物料清单供工艺流程模块、工程管理模块和物料模块使用；所述工艺流程模块用于定义产品及其对应的工艺流程，包括每个工步类型及相关流程控制策略；所述工程管理模块用于对工程业务进行管理，所述工程业务包括BOM管理；所述物料模块用于管理原材料、半成品和产品数据。
在一实施例中，服务端还可以响应于检测到编辑物料的规格信息的操作，例如点击修改(modify)按键，获取物料的规格信息内的检测字段(checkout)。上述检出状态用于表示有账户正在对该规格信息进行编辑。当物料的检测字段不是检出状态时， 服务端可以确定物料的规格信息处于不可编辑状态。当上述检测字段为检出状态时，对比当前账户与编辑所述规格信息的编辑账户(即当前存在一个编辑物料规格信息的账户，称之为编辑账户)是否为同一账户。当当前账户和编辑账户不同时，服务端可以确定拒绝当前账户编辑物料的规格信息，即当前账户无法编辑上述物料的规格信息；当上述当前账户和编辑账户相同时，服务端可以确定允许当前账户编辑物料的规格信息并在编辑完成后冻结(Frozen)规格信息。本实施例中，在编辑结束后将物料的规格信息冻结，可以将规格信息固化，即不能再次编辑或删除，从而避免已经发布的规格信息被篡改。
在一实施例中，冻结之后的规格信息可以通过激活操作，发布给操作人员，使操作人员在生产系统中可以创建并使用该规格的物料，例如操作人员可以创建多个同一规格的物料。在一示例中，服务端可以响应于检测到激活物料的规格信息的请求，生成待审核信息。然后，响应于检测到待审核信息对应的审批信息，服务端可以确定将物料投入使用。需要说明的是，上述待审核信息通常由指定人员(如操作人员的领导等)确认才能激活成功。这样，本实施例中通过引入签核机制，确保发布到生产环境中的规格信息经过审批，且审批信息有记录和可追溯，提高生产效率和产品良率。
在一实施例中，随着业务需要修改已经发布的规格信息，用户可以对物料的规格信息进行规格升版。服务端可以响应于检测到升版规格信息的操作，生成新版本的规格信息。上述新版本的规格信息与原版本的规格信息的版本不同且其他内容相同。然后，响应于检测到编辑所述新版本的规格信息的操作，服务端可以编辑所述新版本的规格信息并冻结。之后，响应于检测到激活所述新版本的规格信息的操作，服务端可以激活所述新版本的规格信息并将所述原版本的规格信息的状态更新为未激活状态。这样，本实施例中通过升版规格信息，可以对新版本的规格信息进行编辑和冻结操作，而不影响到原有规格信息，从而不影响到原有物料的管理。
在一实施例中，随着业务需要克隆已经发布的规格信息，用户可以克隆物料的规格信息。服务端可以响应于检测到克隆物料的规格信息的操作，生成新名称的规格信息。上述新名称的规格信息与原名称的规格信息的名称不同且其他内容相同。然后，响应于检测到编辑物料的新名称的规格信息的操作，服务端可以编辑新名称的规格信息并冻结。之后，响应于检测到激活新名称的规格信息的操作，服务端可以激活物料的新名称的规格信息。这样，本实施例中通过克隆物料的规格信息，可以对新名称的规格信息进行编辑和冻结操作并在激活后作为一种规格的物料使用，而不影响到原名称的规格信息，从而不影响到原有物料的管理。
本实施例中，服务端可以获取物料的变化状态，参见图5，包括：
在接收到物料时，物料的变化状态为等待状态(waitin)。在设备制造过程(Machine Process)过程中，可以将本工艺过程所需要的物料上架(InShelf)。其中，上架是指将物料置于工艺站点的设备覆盖区域的物料架之上，以使工艺站点的设备方便取用该物料。工艺站点的设备可以按照工艺流程取用上述物料，当设备拿起物料时物料的变化状态变为上机(Kitting)，设备可以将物料放置到相应的位置并放下，物料的变化状态变为下机(unkjitting)，并且在使用过程中对物料数据进行扣减。当本工艺过程不再需要上述物料时，可以将上述物料下架(OutShelf)。当后续过程还需要用该物料时可以将该物料退到线边架内或者置于其他仓库之内，等待重新上架。当后续过程不需要该物料时可以将该物料报废处理(Scrap)，当再次需要该物料时再将物料解除报废并重新上架。
在生产过程中，部分物料可能需要回温管控。其中回温是指将物料从当前温度恢复到目标温度，例如锡膏从当前温度100摄氏度恢复到室温25摄氏度，以保证物料和人员的安全。相应地的，回温状态是指进入回温状态后温度距离温度阈值的距离，即回温进度。因此，在创建物料的规格信息的时候，参见图6和图7，创建项中包括回温标识(WarmState)和预设回温时长阈值等属性值。在一示例中，预设回温时长阈值可以包括FirstWareTime和SecondWareTime等属性，可以根据具体场景进行设置，在此不作限定。
例如，对于需要回温管控的物料可以设定其回温标识(WarmState)为第一取值，例如Y，对于不需要回温管控的物料可以设定其回温标识(WarmState)为第二取值，例如N。或者说，上述回温标识可以作为一个非必填项，仅在物料有回温需求时才允许填写，以方便物料在下架时进行回温状态检测。
在一实施例中，服务器可以获取物料的回温状态，参见图8，包括：
当物料需要下架时，服务器可以获取该物料的回温标识(WarmState)。当物料的回温标识表示物料需要回温(即WarmState＝＝Y)时，服务器可以获取物料的(最近一次的)下架开始时间t_start、下架结束时间t_end和预设回温时长阈值T limit。其中，下架开始时间t_start是指将物料置于物料架上时绑定物料事件所发生的时间，下架结束时间t_end是指将从物料架上取入物料时解绑物料事件所发生的时间。然后，服务器可以根据下架开始时间t_start、下架结束时间t_end计算本次使用时间Tuse，即Tuse＝t_end-t_start。之后，服务器可以对比本次使用时间与预设回温时长阈值的大小，即 Tuse-T limit>＝0或者Tuse-T limit<0。当本次使用时间大于或等于所述预设回温时长阈值时，服务器可以确定物料的回温状态为回温未完成；当本次使用时间小于预设回温时长阈值时，服务器可以确定物料的回温状态为回温完成并将物料的变化状态(consumableState)调整为下架状态(outShelf)，并且服务器可以将物料退回到线边柜中。
在步骤43中，根据所述变化状态和所述回温状态更新所述物料的下一状态。
本实施例中，服务器可以根据上述物料变化状态和回温状态更新物料的下一个状态，例如物料批次进站与出站、物料数量扣减等，达到在生产过程中管理各种物料的状态，保证物料能够正常使用。
在生产半导体产品的过程中，物料进行入站操作的批次，需要严格校验Bom管理中对物料绑定的扣减数量，物料在Bom设定的扣减数量以及规格信息校验符合生产过程中对应工艺站点的加工需求时，服务器可以正确扣减物料数量，避免因物料生产扣减不当对总体物料消耗产生影响。在BOM管理中可以设定好的物料扣减数量，严格进行数量卡控，控制物料实际消耗。参见图9和图10，物料与Bom管理详细设计如下：
在OIC系统操作界面，BOM菜单下进行物料的Bom管理，选择产品规格类型，并根据对应的产品规格类型查找已经绑定的Bom信息，页面右侧可以为对应的物料规格创建扣减数量的记录数据，UseQty为实际物料扣减时限定的数量，创建好的数据会显示在ConsumableSpecList中，同时也为对应的产品规格数据绑定对应的Bom信息。准备好BOM管理数据，在TrackIn界面批次进站后，系统会根据该批次绑定的ProductSpecName产品规格信息查询到对应的Bom绑定关系，在TrackOut出站界面，系统在记录对应物料消耗，当物料消耗达到限定值，不在进行物料消耗。
至此，本公开实施例提供的方案中可以获取物料的变化状态和回温状态；根据所述变化状态和所述回温状态管理所述物料。这样，本实施例的方案对物料进行标准化管理，可以避免物料规格信息被篡改，进而避免篡改信息造成的生产安全问题，有利于提高半导体产品的良率和生产率。
结合图1～图3所示的半导体制造执行系统以及图4～图10所示的物料状态更新方法，下面结合各场景描述物料的生命周期的各阶段。
参见图11，半导体制造执行系统可以根据物料规格信息维护与激活物料。录入物料，其中录入方式包括手动输入和Excel导入。然后，再使用物料，此时可以记录物料使用阶段，进行生命周期管理。
参见图12，物料的管理流程，包括：物料规格建模、物料规格冻结、物料规格激活、签核阶段。其中，物料规格冻结之后还可以包括物料规格归档、物料规格克隆和物料规格升版。
物料规格建模即将物料规格信息通过建模工具保存到半导体制造执行系统之中。本步骤中，参见图13，用户可以通过Excel导入或手动录入两种方式进行建模，在物料规格冻结之前，用户可以对建模信息进行编辑；为了避免多个用户同时编辑，可以采用检测字段CheckState对规格信息的编辑状态进行管理，当检测字段取值为检出状态CheckOut时，可以确定有账户正在编辑规格信息，此账户称之为编辑账户。此时可以判断当前账户和编辑账户是否为同一账户，如果当前账户和编辑账户是同一账户，当前账户可以编辑规格信息；如果当前账户和编辑账户不是同一账户，当前账户无法编辑规格信息。
本步骤中，编辑结束之后可以冻结物料规格以固化物料的规格信息，并且不能再次编辑和被删除，可以避免已经发布的规格信息被篡改。
本步骤中，冻结之后的规格信息可以进行激活操作。参见图14，操作人员在生产系统中可以创建并使用该规格的物料。为了让生产线内数据更加可靠，激活时需要由指定人员确认方能激活成功。半导体制造执行系统可以引入签核机制，确保发布到生产环境中的规格数据经过审批，且审批信息有记录，可追溯。如果用户根据业务需要修改已经发布的规格信息，半导体封装系统可以提供两种编辑方式，即图12中所展示的物料规格升版和物料规格克隆。
物料规格升版需要对原有物料规格信息进行升版，新版本的规格信息除版本号之外，其他内容同原版本的规格信息相同；此时可以编辑新版本的规格信息。然后，更新生产环境中所有该规格物料的规格信息，并将新版本的规格信息冻结后激活，其中冻结和激活流程如图14所示。
新版本的规格信息激活后，将原版本的规格信息自动变更为未激活状态。此时半导体制造执行系统内所有物料的规格自动继承新版本的规格信息。物料规格克隆是创建一个新名称的物料规格信息，克隆后的规格信息(即新名称的规格信息)除名称外其他内容与原规格信息的内容保持一致，用户可以对克隆后的规格信息进行编辑、冻结和激活操作。激活后的新名称的规格信息可以作为一种新的信息物料规格进行管理，不会影响到原有物料规格的管理。
本实施例中，物料的录入和使用。参见图6和图13，完成维护物料规格信息之后，在生产操作平台响应于用户操作对相应规格的物料进行创建，依次实现对(实物)物料进行管理，例如，物料名称、物料类型、物料存储时间、生产时间、预设回温时长、回温标识、创建时间、创建用户、物料报废和取消报废等阶段。
本实施例中，服务器可以获取物料的回温状态，继续参见图8，获取物料的回温状态的内容具体可以参见图8所示例的内容，在此不再赘述。可理解的是，图8所示例的内容可以通过式(1)来确定回温状态，如式(1)所示：
Figure PCTCN2022128772-appb-000001
本实施例中，规格信息在建模工具中进行维护，其数据最终在Oracle数据库中进行持久化保存，建模工具的系统架构如图15所示。
参见图15，建模工具包括Oracle数据库和物料工具。物料工具包括物料建模、版本管理、冻结激活和编辑权控制。其中，物料建模包括物料类型建模和物料规格建模。Oracle数据库包括物料类型信息、物料规格信息和物料信息。建模工具与Oracle数据库之间采用TCP/IP协议进行通信。
Winform客户端根据用户在页面内的操作上进行生产信息的录入与查询作业，其结果通过tibco发送给服务端Server；经过相关逻辑处理后，在Oracle数据库中进行持久化保存，用户操作平台的系统架构如图16所示。参见图16，用户操作平台的系统架构包括用户操作平台、服务器和Oracle数据库。用户操作平台包括客户端界面、物料创建、规格信息审核、物料清洗、绑定批次、批次解绑、物料报废、Winform+Infragistics模块。服务器包括QRY服务，CNM服务、CNX服务和Spring boot+Spring MVC+Bpei。
本公开实施例还提供了一种物料状态更新方法，参见图17，包括步骤171～步骤173。
在步骤171，响应于检测到配置物料的操作，显示创建页面；所述创建页面包括创建按键和规格参数。
本实施例中，用户可以通过半导体封装系统中FactoryModeler客户端进行配置操作。用户操作FactoryModeler客户端，响应于检测到配置物料的操作，显示如图6所示的维护页面。参见图6，创建页面创建按键(create)和规格参数(如FactoryName、 carrierSpecVersion、carrierType、TimeUsedLimit等)。
在步骤172，响应于配置规格参数的操作，获取所述规格参数对应的规格信息。参见图6所示，TimeUserLimit为2小时、CleanTimeLimit为2小时等，可以根据具体场景进行设置，在此不作限定。
在步骤173，响应于检测创建物料的操作，根据所述规格信息创建所述物料并管理所述物料的生命周期。
在一实施例中，半导体制造执行系统可以响应于检测到显示物料规格信息的操作，显示如图6所示的物料的规格信息。然后，响应于检测到编辑物料的规格信息的操作，半导体制造执行系统可以获取所输入的规格信息并更新所述规格信息。
在一实施例中，半导体制造执行系统可以响应于检测到显示物料规格信息的操作，显示如的物料的规格信息。然后，响应于检测到升版规格信息的操作，半导体制造执行系统可以生成新版本的规格信息；所述新版本的规格信息与原版本的规格信息的版本不同且其他内容相同。之后，响应于检测到编辑所述新版本的规格信息的操作，半导体制造执行系统可以编辑所述新版本的规格信息并冻结。最后，响应于检测到激活所述新版本的规格信息的操作，半导体制造执行系统可以激活所述新版本的规格信息并将所述原版本的规格信息的状态更新为未激活状态。
在一实施例中，半导体制造执行系统可以响应于检测到显示物料规格信息的操作，显示所述物料的规格信息；响应于检测到克隆规格信息的操作，半导体制造执行系统可以生成新名称的规格信息；所述新名称的规格信息与原名称的规格信息的名称不同且其他内容相同；响应于检测到编辑所述新名称的规格信息的操作，半导体制造执行系统可以编辑所述新名称的规格信息并冻结；响应于检测到激活所述新名称的规格信息的操作，激活所述新名称的规格信息。
在本公开实施例提供的一种物料状态更新方法的基础上，本实施例还提供了一种物料状态更新装置，参见图18，包括：
状态获取模块181，用于获取物料的变化状态和回温状态；
状态更新模块182，用于根据所述变化状态和所述回温状态更新所述物料的下一状态。
在本公开实施例提供的一种物料状态更新方法的基础上，本实施例还提供了一种物料状态更新装置，参见图19，包括：
页面显示模块191，用于响应于检测到配置物料的操作，显示创建页面；所述创建页面包括创建按键和规格参数；信息获取模块，用于响应于配置规格参数的操作，获取所述规格参数对应的规格信息；
状态更新模块192，用于响应于检测创建物料的操作，根据所述规格信息创建所述物料并管理所述物料。
需要说明的是，本实施例中示出的装置实施例与上述方法实施例的内容相匹配，可以参考上述方法实施例的内容，在此不再赘述。
在示例性实施例中，还提供了一种服务器，参见图20，包括：
存储器202与处理器201；
所述存储器202用于存储所述处理器201可执行的计算机程序；
所述处理器201用于执行所述存储器202中的计算机程序，以实现如上述的方法。
本领域技术人员在考虑说明书及实践这里公开的公开后，将容易想到本公开的其它实施方案。本公开旨在涵盖任何变型、用途或者适应性变化，这些变型、用途或者适应性变化遵循本公开的一般性原理并包括本公开未公开的本技术领域中的公知常识或惯用技术手段。说明书和实施例仅被视为示例性的，本公开的真正范围和精神由下面的权利要求指出。
应当理解的是，本公开并不局限于上面已经描述并在附图中示出的精确结构，并且可以在不脱离其范围进行各种修改和改变。本公开的范围仅由所附的权利要求来限制。

Claims (22)

  1. 一种物料状态更新方法，其特征在于，包括：
    获取物料的变化状态和回温状态；
    根据所述变化状态和所述回温状态更新所述物料的下一状态。
  2. 根据权利要求1所述的方法，其特征在于，获取物料的回温状态，包括：
    当所述物料的预设回温标识表示所述物料需要回温时，获取所述物料的下架开始时间、下架结束时间和预设回温时长阈值；
    根据所述下架开始时间和所述下架结束时间计算本次使用时间；
    当所述本次使用时间大于或等于所述预设回温时长阈值时，确定所述物料的回温状态为回温未完成；
    当所述本次使用时间小于所述预设回温时长阈值时，确定所述物料的回温状态为回温完成并将所述物料的变化状态调整为下架状态。
  3. 根据权利要求1所述的方法，其特征在于，所述方法还包括：
    按照预设物料模型创建所述物料；所述物料的初始状态为等待状态。
  4. 根据权利要求3所述的方法，其特征在于，按照预设物料模型创建所述物料包括：
    响应于检测到编辑所述物料的规格信息的操作，获取所述物料的规格信息内的检测字段；所述检测字段包括检出状态；
    当所述检测字段不是所述检出状态时，确定所述物料的规格信息处于不可编辑状态；
    当所述检测字段为所述检出状态时，对比当前账户与编辑所述规格信息的编辑账户是否为同一账户；
    当所述当前账户和所述编辑账户不同时，确定拒绝所述当前账户编辑所述物料的规格信息；当所述当前账户和所述编辑账户相同时，确定允许所述当前账户编辑所述物料的规格信息并在编辑完成后冻结所述规格信息。
  5. 根据权利要求4所述的方法，其特征在于，所述预设物料模型存储到基础数据模块之内；所述基础数据模块用于创建各种物料对应的预设物料模型。
  6. 根据权利要求3所述的方法，其特征在于，所述规格信息存储到工程管理模块的物料清单之内，所述物料清单供工艺流程模块、工程管理模块和物料模块使用；
    所述工艺流程模块用于定义产品及其对应的工艺流程，包括每个工步类型及相关流程控制策略；
    所述工程管理模块用于对工程业务进行管理，所述工程业务包括BOM管理；
    所述物料模块用于管理原材料、半成品和产品数据。
  7. 根据权利要求3所述的方法，其特征在于，所述方法还包括：
    响应于检测到激活所述物料的规格信息的请求，生成待审核信息；
    响应于检测到所述待审核信息对应的审批信息，确定将所述物料投入使用。
  8. 根据权利要求3所述的方法，其特征在于，所述方法还包括：
    响应于检测到升版所述物料的规格信息的操作，生成所述物料的新版本的规格信息；所述新版本的规格信息与原版本的规格信息的版本不同且其他内容相同；
    响应于检测到编辑所述新版本的规格信息的操作，编辑所述新版本的规格信息并冻结；
    响应于检测到激活所述新版本的规格信息的操作，激活所述新版本的规格信息并将所述原版本的规格信息的状态更新为未激活状态。
  9. 根据权利要求3所述的方法，其特征在于，所述方法还包括：
    响应于检测到克隆所述物料的规格信息的操作，生成所述物料的新名称的规格信息；所述新名称的规格信息与原名称的规格信息的名称不同且其他内容相同；
    响应于检测到编辑所述新名称的规格信息的操作，编辑所述新名称的规格信息并冻结；
    响应于检测到激活所述新名称的规格信息的操作，激活所述新名称的规格信息。
  10. 根据权利要求1所述的方法，其特征在于，所述方法还包括：
    根据TibcoRV消息订阅方式获取XML格式的物料数据，所述物料数据包括物料的变化状态和回温状态；所述物料数据包括服务端对应的BPEL名称；
    查询到所述BPEL名称对应的Java文件；所述Java文件包括releaseMaterial方法；
    调用所述releaseMaterial方法使物料模块处理业务；其中处理业务包括操作数据库以更新物料的变化状态和回温状态；
    响应于业务处理完成，生成并返回XML格式的响应信息。
  11. 一种物料状态更新方法，其特征在于，包括：
    响应于检测到配置物料的操作，显示创建页面；所述创建页面包括创建按键和规格参数；
    响应于配置规格参数的操作，获取所述规格参数对应的规格信息；
    响应于检测创建物料的操作，根据所述规格信息创建所述物料并管理所述物料。
  12. 根据权利要求11所述的方法，其特征在于，所述方法还包括：
    响应于检测到显示物料规格信息的操作，显示所述物料的规格信息；
    响应于检测到编辑物料的规格信息的操作，获取所输入的规格信息并更新所述规格信息。
  13. 根据权利要求11所述的方法，其特征在于，所述方法还包括：
    响应于检测到显示物料规格信息的操作，显示所述物料的规格信息；
    响应于检测到升版所述物料的规格信息的操作，生成所述物料的新版本的规格信息；所述新版本的规格信息与原版本的规格信息的版本不同且其他内容相同；
    响应于检测到编辑所述新版本的规格信息的操作，编辑所述新版本的规格信息并冻结；
    响应于检测到激活所述新版本的规格信息的操作，激活所述新版本的规格信息并将所述原版本的规格信息的状态更新为未激活状态。
  14. 根据权利要求11所述的方法，其特征在于，所述方法还包括：
    响应于检测到显示物料规格信息的操作，显示所述物料的规格信息；
    响应于检测到克隆所述物料的规格信息的操作，生成所述物料的新名称的规格信息；所述新名称的规格信息与原名称的规格信息的名称不同且其他内容相同；
    响应于检测到编辑所述新名称的规格信息的操作，编辑所述新名称的规格信息并冻结；
    响应于检测到激活所述新名称的规格信息的操作，激活所述新名称的规格信息。
  15. 根据权利要求11所述的方法，其特征在于，所述方法还包括：
    响应于检测到显示物料规格信息的操作，显示所述物料的规格信息；
    响应于检测到扣留物料或者放行物料的操作，分别将所述物料的扣留状态调整为扣留中或者未扣留。
  16. 根据权利要求11所述的方法，其特征在于，所述方法还包括：
    响应于检测到显示物料规格信息的操作，显示所述物料的规格信息；
    响应于检测到报废物料的操作，将所述物料的使用状态调整为报废状态。
  17. 根据权利要求11所述的方法，其特征在于，所述方法还包括：
    响应于检测到对物料绑定批次的操作，绑定所述物料至目标批次；
    响应于检测到对物料解绑批次的操作，将所述目标批次从所述物料解绑。
  18. 根据权利要求11所述的方法，其特征在于，所述方法还包括：
    响应于检测到显示物料规格信息的操作，显示所述物料的规格信息；
    响应于检测到调整物料位置的操作，调整所述物料的位置至目标位置。
  19. 一种物料状态更新装置，其特征在于，包括：
    状态获取模块，用于获取物料的变化状态和回温状态；
    状态更新模块，用于根据所述变化状态和所述回温状态更新所述物料的下一状态。
  20. 一种物料状态更新装置，其特征在于，包括：
    页面显示模块，用于响应于检测到配置物料的操作，显示创建页面；所述创建页面包括创建按键和规格参数；信息获取模块，用于响应于配置规格参数的操作，获取所述规格参数对应的规格信息；
    状态更新模块，用于响应于检测创建物料的操作，根据所述规格信息创建所述物料并管理所述物料。
  21. 一种服务器，其特征在于，包括：
    存储器与处理器；
    所述存储器用于存储所述处理器可执行的计算机程序；
    所述处理器用于执行所述存储器中的计算机程序，以实现如权利要求1～10或者11～18任一项所述的方法。
  22. 一种非暂态计算机可读存储介质，其特征在于，当所述存储介质中的可执行的计算机程序由处理器执行时，能够实现如权利要求1～10或者11～18任一项所述的方法。
PCT/CN2022/128772 2022-10-31 2022-10-31 物料状态更新方法和装置、服务器、存储介质 WO2024092458A1 (zh)

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