WO2024084757A1

WO2024084757A1 - Fluid supply system, substrate processing apparatus, and substrate processing method

Info

Publication number: WO2024084757A1
Application number: PCT/JP2023/026064
Authority: WO
Inventors: 貴大林田; 翔太梅▲崎▼; 幹雄中島
Original assignee: 東京エレクトロン株式会社
Priority date: 2022-10-20
Filing date: 2023-07-14
Publication date: 2024-04-25

Abstract

A fluid supply system according to one aspect of the present disclosure supplies a fluid into a processing container in which a substrate is to be processed, said fluid supply system comprising: a processing fluid supply unit that supplies a processing fluid; a fluid supply path that is connected to the processing fluid supply unit and the processing container and that causes the processing fluid the temperature of which has been adjusted to flow into the processing container; a first heating mechanism that is provided to the fluid supply path and that heats the processing fluid to a first temperature; and a second heating mechanism that is provided to the fluid supply path and that heats the processing fluid to a second temperature which is lower than the first temperature, wherein the processing fluid supply unit has a flow rate adjustment mechanism that adjusts the flow rate of the processing fluid, and the fluid supply path has a first branch flow path that causes the processing fluid to pass through the first heating mechanism and flow into the processing container, and a second branch flow path that causes the processing fluid to pass through the second heating mechanism and flow into the processing container.

Description

FLUID SUPPLY SYSTEM, SUBSTRATE PROCESSING APPARATUS, AND SUBSTRATE PROCESSING METHOD

The present disclosure relates to a fluid supply system, a substrate processing apparatus, and a substrate processing method.

Technology is known for drying substrates using supercritical fluids. Patent Document 1 discloses a configuration for switching the temperature of the supercritical fluid supplied to the substrate.

JP 2021-086857 A

The present disclosure provides technology that can provide a process fluid at a controlled flow rate and temperature.

A fluid supply system according to one aspect of the present disclosure is a fluid supply system that supplies a fluid into a processing vessel in which a substrate is processed, and includes a processing fluid supply unit that supplies a processing fluid, a fluid supply path that is connected to the processing fluid supply unit and the processing vessel and that flows a temperature-adjusted processing fluid into the processing vessel, a first heating mechanism that is provided in the fluid supply path and that heats the processing fluid to a first temperature, and a second heating mechanism that is provided in the fluid supply path and that heats the processing fluid to a second temperature that is lower than the first temperature, the processing fluid supply unit has a flow rate adjustment mechanism that adjusts the flow rate of the processing fluid, and the fluid supply path has a first branch flow path that flows the processing fluid into the processing vessel through the first heating mechanism, and a second branch flow path that flows the processing fluid into the processing vessel through the second heating mechanism.

The present disclosure allows for the supply of treatment fluid at a controlled flow rate and temperature.

FIG. 1 is a diagram showing a substrate processing apparatus according to a first embodiment. FIG. 2 is a timing chart showing the substrate processing method according to the first embodiment. FIG. 3 is a diagram (1) showing the substrate processing method according to the first embodiment. FIG. 4 is a diagram (2) showing the substrate processing method according to the first embodiment. FIG. 5 is a view (3) showing the substrate processing method according to the first embodiment. FIG. 6 is a diagram (4) showing the substrate processing method according to the first embodiment. FIG. 7 is a diagram (5) showing the substrate processing method according to the first embodiment. FIG. 8 is a diagram (6) showing the substrate processing method according to the first embodiment. FIG. 9 is a diagram (7) showing the substrate processing method according to the first embodiment. FIG. 10 is a diagram showing a substrate processing apparatus according to the second embodiment. FIG. 11 is a timing chart showing the substrate processing method according to the second embodiment. FIG. 12 is a diagram (1) showing a substrate processing method according to the second embodiment. FIG. 13 is a diagram showing a substrate processing method according to the second embodiment. FIG. 14 is a view (3) showing the substrate processing method according to the second embodiment. FIG. 15 is a diagram (4) showing the substrate processing method according to the second embodiment. FIG. 16 is a diagram (5) showing the substrate processing method according to the second embodiment. FIG. 17 is a diagram (6) showing the substrate processing method according to the second embodiment. FIG. 18 is a diagram (7) showing the substrate processing method according to the second embodiment. FIG. 19 is a diagram showing a substrate processing apparatus according to a first modified example of the second embodiment. FIG. 20 is a diagram showing a substrate processing apparatus according to a second modified example of the second embodiment. FIG. 21 is a diagram showing a substrate processing apparatus according to the third embodiment. FIG. 22 is a view showing a substrate processing apparatus according to the fourth embodiment. FIG. 23 is a view showing a substrate processing apparatus according to the fifth embodiment. FIG. 24 is a diagram showing a substrate processing apparatus according to the sixth embodiment.

Below, non-limiting exemplary embodiments of the present disclosure will be described with reference to the attached drawings. In all of the attached drawings, the same or corresponding members or parts are designated by the same or corresponding reference symbols, and duplicate descriptions will be omitted.

First Embodiment
(Substrate Processing Apparatus)
A substrate processing apparatus 10 according to a first embodiment will be described with reference to Fig. 1. Fig. 1 is a diagram showing the substrate processing apparatus 10 according to the first embodiment.

The substrate processing apparatus 10 has a processing section 11, a fluid supply system 12, a discharge section 13, and a control section 14.

The processing section 11 has a processing vessel 111 and a holding plate 112. The processing vessel 111 is a vessel in which a processing space capable of accommodating a substrate W having a diameter of, for example, 300 mm is formed. The substrate W may be, for example, a semiconductor wafer. The holding plate 112 is provided inside the processing vessel 111. The holding plate 112 holds the substrate W horizontally. The processing section 11 may have a pressure sensor that detects the pressure inside the processing vessel 111 and a temperature sensor that detects the temperature inside the processing vessel 111.

The fluid supply system 12 has a treatment fluid supply section 121 and a temperature adjustment section 122.

The treatment fluid supply unit 121 has a treatment fluid supply source S11, a first supply flow path L11, an on-off valve V11, an orifice OR11, a second supply flow path L12, an on-off valve V12, an orifice OR12, an inert gas supply source S12, a third supply flow path L13, and an on-off valve V13.

The process fluid supply source S11 is a supply source of a process fluid, which may be, for example, carbon dioxide (CO ₂ ) in a liquid state.

The first supply flow path L11 is connected to the treatment fluid supply source S11 at its upstream side and to the temperature adjustment unit 122 at its downstream side. An on-off valve V11 and an orifice OR11 are provided in the first supply flow path L11 in this order from upstream.

The on-off valve V11 is a valve that switches the flow of the processing fluid on and off. When the on-off valve V11 is open, it allows the processing fluid to flow to the downstream temperature adjustment unit 122, and when it is closed, it does not allow the processing fluid to flow to the downstream temperature adjustment unit 122.

The orifice OR11 has the function of reducing the flow rate of the liquid processing fluid and adjusting the pressure. The orifice OR11 passes the pressure-adjusted processing fluid through the downstream temperature adjustment section 122.

The second supply flow path L12 is provided in parallel with the first supply flow path L11. The second supply flow path L12 branches off from the first supply flow path L11 upstream of the on-off valve V11 and merges with the first supply flow path L11 downstream of the orifice OR11. The on-off valve V12 and the orifice OR12 are provided in the second supply flow path L12 in this order from upstream.

The on-off valve V12 is a valve that switches the flow of the processing fluid on and off. When the on-off valve V12 is open, it allows the processing fluid to flow to the downstream temperature adjustment unit 122, and when it is closed, it does not allow the processing fluid to flow to the downstream temperature adjustment unit 122.

The orifice OR12 has the function of reducing the flow rate of the liquid processing fluid and adjusting the pressure. The orifice OR12 passes the pressure-adjusted processing fluid through the downstream temperature adjustment section 122.

The inert gas supply source S12 is a supply source of an inert gas, which may be, for example, nitrogen (N ₂ ) gas.

The third supply flow path L13 is connected to the inert gas supply source S12 at its upstream end, and merges with the first supply flow path L11 downstream of the orifice OR11 at its downstream end. An on-off valve V13 is provided in the third supply flow path L13. A check valve, a filter, etc. may also be provided in the third supply flow path L13.

The on-off valve V13 is a valve that switches the flow of inert gas on and off. When open, the on-off valve V13 allows inert gas to flow to the downstream temperature adjustment unit 122, and when closed, the on-off valve V13 does not allow inert gas to flow to the downstream temperature adjustment unit 122.

The temperature adjustment unit 122 is connected to the processing fluid supply unit 121 and the processing vessel 111. The temperature adjustment unit 122 passes a temperature-adjusted fluid through the inside of the processing vessel 111. The fluid includes a processing fluid and an inert gas. The temperature adjustment unit 122 has a first branch flow path L14, a second branch flow path L15, a bypass flow path L16, and a first discharge flow path L17.

In the first branch flow path L14, a heating mechanism HE11, an on-off valve V15, a filter F11, and a temperature sensor T11 are provided in this order from upstream to downstream. A line heater LH11 is provided downstream of the heating mechanism HE11 in the first branch flow path L14. Sensors such as a temperature sensor and a pressure sensor may be provided at various positions in the first branch flow path L14.

In the second branch flow path L15, a heating mechanism HE12, an on-off valve V16, and a filter F12 are provided in this order from upstream to downstream. A line heater LH12 is provided downstream of the heating mechanism HE12 in the second branch flow path L15. Sensors such as a temperature sensor and a pressure sensor may be provided at various positions in the second branch flow path L15.

The first branch flow path L14 branches off from the second branch flow path L15 between the heating mechanism HE12 and the on-off valve V16. The second branch flow path L15 merges with the first branch flow path L14 immediately before the processing vessel 111.

The heating mechanism HE11 is provided in series with the heating mechanism HE12. The heating mechanism HE11 heats the fluid supplied from the treatment fluid supply unit 121 to a first temperature and supplies the fluid at the first temperature downstream. The first temperature may be, for example, 100°C or higher and 120°C or lower.

The on-off valve V15 is a valve that switches the flow of fluid on and off. When open, the on-off valve V15 allows fluid to flow to the downstream processing vessel 111, and when closed, it does not allow fluid to flow to the downstream processing vessel 111.

The filter F11 filters the fluid flowing through the first branch flow path L14 and removes foreign matter contained in the fluid. This makes it possible to prevent particles from being generated on the surface of the substrate W during substrate processing using the fluid.

The temperature sensor T11 is provided downstream of the junction of the first branch flow path L14 with the second branch flow path L15. The temperature sensor T11 is provided, for example, immediately before the processing vessel 111. The temperature sensor T11 detects the temperature of the fluid flowing in the first branch flow path L14.

The line heater LH11 heats the first branch flow path L14 downstream of the heating mechanism HE11. The line heater LH11 prevents the temperature of the fluid heated to the first temperature by the heating mechanism HE11 from decreasing as it flows through the first branch flow path L14.

The heating mechanism HE12 heats the fluid supplied from the treatment fluid supply unit 121 to a second temperature and supplies the fluid at the second temperature downstream. The second temperature is lower than the first temperature. The second temperature may be, for example, 80°C or higher and 90°C or lower.

The on-off valve V16 is a valve that switches the flow of fluid on and off. When open, the on-off valve V16 allows fluid to flow to the downstream processing vessel 111, and when closed, the on-off valve V16 does not allow fluid to flow to the downstream processing vessel 111.

The filter F12 filters the fluid flowing through the second branch flow path L15 and removes foreign matter contained in the fluid. This makes it possible to prevent particles from being generated on the surface of the substrate W during substrate processing using the fluid.

The line heater LH12 heats the second branch flow path L15 downstream of the heating mechanism HE12. The line heater LH12 prevents the temperature of the fluid heated to the second temperature by the heating mechanism HE12 from decreasing as it flows through the second branch flow path L15.

In the temperature adjustment unit 122, when the on-off valve V15 is closed and the on-off valve V16 is opened, the fluid heated to the second temperature by the heating mechanism HE12 is supplied into the processing vessel 111 through the second branch flow path L15. When the on-off valve V16 is closed and the on-off valve V15 is opened, the fluid heated to the second temperature by the heating mechanism HE12 and then heated to the first temperature by the heating mechanism HE11 is supplied into the processing vessel 111 through the first branch flow path L14. In this way, the on-off valve V15 and the on-off valve V16 are exclusively opened and closed to change the temperature of the fluid flowing through the processing vessel 111. When both the on-off valve V15 and the on-off valve V16 are opened, the fluid heated to the first temperature by the heating mechanism HE11 and the fluid heated to the second temperature by the heating mechanism HE12 are mixed and supplied into the processing vessel 111. In this case, a fluid at an intermediate temperature between the first temperature and the second temperature can be supplied into the processing vessel 111. In this way, by controlling the opening and closing of on-off valves V15 and V16, the temperature of the fluid flowing through the processing vessel 111 can be changed in three stages.

The bypass flow path L16 connects a position between the on-off valve V15 and the filter F11 in the first branch flow path L14 and a position between the on-off valve V16 and the filter F12 in the second branch flow path L15. An orifice OR13 is provided in the bypass flow path L16. A line heater LH13 is provided in the bypass flow path L16. The bypass flow path L16, the orifice OR13, and the line heater LH13 do not necessarily have to be provided.

The orifice OR13 has the function of reducing the flow rate of the fluid passing through the bypass flow path L16 and adjusting the pressure.

The line heater LH13 heats the bypass flow path L16.

The first discharge flow path L17 discharges the fluid in the first branch flow path L14. The first discharge flow path L17 branches off from the first branch flow path L14 between the heating mechanism HE11 and the on-off valve V15. The first discharge flow path L17 is provided with an on-off valve V14. The first discharge flow path L17 is provided with a line heater LH14. An orifice may be provided in the first discharge flow path L17.

The on-off valve V14 is a valve that switches the flow of fluid on and off. When open, the on-off valve V14 allows fluid to flow to the downstream first discharge flow path L17, and when closed, the on-off valve V14 does not allow fluid to flow to the downstream first discharge flow path L17.

The line heater LH14 heats the first exhaust flow path L17.

The discharge section 13 has a discharge flow path L18. The discharge flow path L18 is connected to the processing vessel 111. A pressure sensor P11, a back pressure valve BV11, and an on-off valve V17 are provided in the discharge flow path L18, in that order from upstream. A line heater LH15 is provided in the discharge flow path L18. Sensors such as a temperature sensor and a pressure sensor may be provided at various positions in the discharge flow path L18.

The pressure sensor P11 detects the pressure of the fluid flowing through the discharge flow path L18 immediately after the processing vessel 111. This allows the pressure inside the processing vessel 111 to be detected.

When the primary pressure of the exhaust flow path L18 exceeds the set pressure, the back pressure valve BV11 adjusts the valve opening to allow fluid to flow to the secondary side, thereby maintaining the primary pressure at the set pressure. For example, the set pressure of the back pressure valve BV11 is adjusted by the control unit 14.

The on-off valve V17 is a valve that switches the flow of fluid on and off. When open, the on-off valve V17 allows fluid to flow to the downstream discharge flow path L18, and when closed, it does not allow fluid to flow to the downstream discharge flow path L18.

The line heater LH15 heats the exhaust flow path L18.

The control unit 14 receives measurement signals from various sensors (such as temperature sensor T11 and pressure sensor P11) and transmits control signals to various functional elements. The control signals include, for example, opening and closing signals of the on-off valves V11 to V17, a set pressure signal of the back pressure valve BV11, and temperature signals of the line heaters LH11 to LH15. For example, the control unit 14 is configured to change the flow rate of the fluid flowing through the processing vessel 111 by controlling the opening and closing of the on-off valves V11 and V12 in accordance with the processing state of the substrate W in the processing vessel 111. For example, the control unit 14 is configured to change the temperature of the fluid flowing through the processing vessel 111 by controlling the opening and closing of the on-off valves V15 and V16 in accordance with the processing state of the substrate W in the processing vessel 111.

The control unit 14 is, for example, a computer, and includes an arithmetic unit 141 and a memory unit 142. The memory unit 142 stores programs that control various processes executed in the substrate processing apparatus 10. The arithmetic unit 141 controls the operation of the substrate processing apparatus 10 by reading and executing the programs stored in the memory unit 142. The programs may be recorded in a computer-readable storage medium and installed from the storage medium into the storage unit 142 of the control unit 14. Examples of computer-readable storage media include a hard disk (HD), a flexible disk (FD), a compact disk (CD), a magnetic optical disk (MO), and a memory card.

(Substrate Processing Method)
2 to 9, a substrate processing method executed by the substrate processing apparatus 10 will be described. The substrate processing method described below is automatically executed under the control of the controller 14 based on a processing recipe and a control program stored in the storage unit 142.

FIG. 2 is a timing chart showing the substrate processing method according to the first embodiment. In FIG. 2, the lower diagram shows the opening and closing timing of on-off valves V11, V12, V13, V14, V15, V16, and V17, and the upper diagram shows the change in the detection value (pressure) of pressure sensor P11 corresponding to the opening and closing timing.

FIGS. 3 to 9 are diagrams illustrating the substrate processing method according to the first embodiment. In FIG. 3 to FIG. 9, open valves are shown in black, and closed valves are shown in white. In FIG. 3 to FIG. 9, the flow paths through which the fluid flows are shown by thick solid lines.

<Waiting process>
In the standby step, an inert gas is supplied to the processing section 11, the fluid supply system 12, and the exhaust section 13. The inert gas may be, for example, _N2 gas. Specifically, as shown in FIG. 3, the on-off valves V13, V15, V16, and V17 are opened, and the on-off valves V11, V12, and V14 are closed. As a result, the inert gas guided from the inert gas supply source S12 to the first branch flow path L14 is heated to a first temperature by the heating mechanism HE11 and supplied into the processing vessel 111. Also, the inert gas guided from the inert gas supply source S12 to the second branch flow path L15 is heated to a second temperature by the heating mechanism HE12 and supplied into the processing vessel 111. Therefore, the first branch flow path L14 and the second branch flow path L15 are purged and heated by the inert gas, so that the processing temperature of the first substrate W after the standby step becomes almost the same as the processing temperature of the second and subsequent substrates W. As a result, the variation in processing temperature between the substrates W is suppressed. In the standby process, the inert gas is discharged from the processing vessel 111 through the discharge flow path L18.

In the standby step, the substrate W is loaded into the processing vessel 111. Specifically, as shown in FIG. 4, the on-off valve V16 is opened, and the on-off valves V11, V12, V13, V14, V15, and V17 are closed, and then the substrate W is loaded into the processing vessel 111. That is, the substrate W is loaded into the processing vessel 111 without inert gas being supplied into the processing vessel 111. However, the substrate W may be loaded into the processing vessel 111 while inert gas is being supplied into the processing vessel 111. The substrate W is subjected to a cleaning process, and is placed on the holding plate 112 with the recesses of the pattern on the surface filled with isopropyl alcohol (IPA).

<First pressure increase step>
The first pressurization step is performed after the standby step. In the first pressurization step, the pressure in the processing vessel 111 is first increased by supplying a processing fluid at a first flow rate and a second temperature, and then the pressure in the processing vessel 111 is increased by supplying a processing fluid at a second flow rate and a second temperature. That is, in the first pressurization step, the pressure is increased in two stages. The second flow rate may be greater than the first flow rate.

When the pressure is increased at the first flow rate, as shown in FIG. 5, the on-off valves V11 and V16 are opened, and the on-off valves V12, V13, V14, V15, and V17 are closed. As a result, the processing fluid from the processing fluid supply source S11 flows into the temperature adjustment section 122 via the first supply flow path L11, and is supplied into the processing vessel 111 via the second branch flow path L15. As a result, the processing fluid at the first flow rate and the second temperature is supplied into the processing vessel 111. As a result, the temperature of the substrate W changes to the second temperature. When the pressure is increased at the first flow rate, the on-off valve V17 is closed, so the processing fluid does not flow out of the processing vessel 111. As a result, the pressure in the processing vessel 111 gradually increases.

When pressurizing at the first flow rate, the processing fluid, whose flow rate has been reduced by the orifice OR13, flows from the second branch flow path L15 through the bypass flow path L16 into the first branch flow path L14. This prevents the processing fluid from flowing back from the junction of the first branch flow path L14 and the second branch flow path L15 immediately before the processing vessel 111 toward the upstream of the first branch flow path L14. This makes it possible to suppress contamination downstream of the filter F11 due to IPA residue, etc.

During the pressurization at the first flow rate, the pressure inside the processing vessel 111 is detected by the pressure sensor P11, and the pressurization at the first flow rate continues until the pressure inside the processing vessel 111 reaches the first pressure Y1. When the pressure inside the processing vessel 111 reaches the first pressure Y1, the pressurization at the first flow rate ends and transitions to the pressurization at the second flow rate.

When the pressure is increased at the second flow rate, as shown in FIG. 6, the on-off valve V12 is opened. The states of the other on-off valves are the same as those shown in FIG. 5. As a result, the processing fluid from the processing fluid supply source S11 flows into the temperature adjustment section 122 via the second supply flow path L12 in addition to the first supply flow path L11, and is supplied into the processing vessel 111 via the second branch flow path L15. As a result, the flow rate of the processing fluid supplied into the processing vessel 111 increases to the second flow rate. When the pressure is increased at the second flow rate, the on-off valve V17 is closed, so the processing fluid does not flow out of the processing vessel 111. As a result, the pressure inside the processing vessel 111 gradually increases.

When pressurizing at the second flow rate, the pressure of the processing fluid supplied into the processing vessel 111 is lower than the critical pressure. Therefore, the processing fluid is supplied into the processing vessel 111 in a gaseous state. Thereafter, as the processing vessel 111 is filled with the processing fluid, the pressure inside the processing vessel 111 increases, and when the pressure inside the processing vessel 111 exceeds the critical pressure, the processing fluid present in the processing vessel 111 becomes supercritical.

When pressurizing at the second flow rate, the processing fluid, whose flow rate has been reduced by the orifice OR13, flows from the second branch flow path L15 through the bypass flow path L16 into the first branch flow path L14. This prevents the processing fluid from flowing back from the junction of the first branch flow path L14 and the second branch flow path L15 immediately before the processing vessel 111 toward the upstream of the first branch flow path L14. This makes it possible to suppress contamination downstream of the filter F11 due to IPA residue, etc.

During the pressurization at the second flow rate, the pressure inside the processing vessel 111 is detected by the pressure sensor P11, and the pressurization at the second flow rate continues until the pressure inside the processing vessel 111 reaches the second pressure Y2. When the pressure inside the processing vessel 111 reaches the second pressure Y2, the first pressurization process ends and the process moves to the second pressurization process.

<Second pressure increase step>
The second pressurization step is performed after the first pressurization step. In the second pressurization step, the pressure in the processing vessel 111 is increased by supplying the processing fluid at the second flow rate and the first temperature. Specifically, as shown in FIG. 7, the on-off valves V11, V12, and V15 are opened, and the on-off valves V13, V14, V16, and V17 are closed. As a result, the processing fluid from the processing fluid supply source S11 flows into the temperature adjustment unit 122 via the first supply flow path L11 and the second supply flow path L12, and is supplied into the processing vessel 111 via the first branch flow path L14. Therefore, the processing fluid at the second flow rate and the first temperature is supplied into the processing vessel 111. As a result, the temperature of the substrate W is quickly changed to the first temperature.

In the second pressurization step, the processing fluid, whose flow rate has been reduced by the orifice OR13, flows from the first branch flow path L14 through the bypass flow path L16 into the second branch flow path L15. This prevents the processing fluid from flowing back from the junction of the first branch flow path L14 and the second branch flow path L15 immediately before the processing vessel 111 toward the upstream of the second branch flow path L15. This makes it possible to suppress contamination downstream of the filter F12 due to IPA residue, etc.

During the second pressurization process, the pressure inside the processing vessel 111 is detected by the pressure sensor P11, and the second pressurization process continues until the pressure inside the processing vessel 111 reaches the third pressure Y3. When the pressure inside the processing vessel 111 reaches the third pressure Y3, the second pressurization process ends and the process moves to the circulation process.

<Distribution process>
The circulation process is performed after the second pressure increase process. In the circulation process, the processing fluid at the second flow rate and the first temperature is supplied from the processing fluid supply source S11 into the processing vessel 111, and the IPA is replaced with the processing fluid in the recess of the pattern on the substrate W in the processing vessel 111. Specifically, as shown in FIG. 8, the on-off valves V11, V12, V15, and V17 are opened, and the on-off valves V13, V14, and V16 are closed. As a result, the processing fluid of the processing fluid supply source S11 flows into the temperature adjustment unit 122 via the first supply flow path L11 and the second supply flow path L12, and is supplied into the processing vessel 111 via the first branch flow path L14. The processing fluid supplied into the processing vessel 111 is discharged from the processing vessel 111 via the discharge flow path L18. By performing the circulation process, the replacement of the IPA with the processing fluid in the recess of the pattern on the substrate W is promoted.

In the circulation process, the processing fluid, whose flow rate has been reduced by the orifice OR13, flows from the first branch flow path L14 through the bypass flow path L16 into the second branch flow path L15. This prevents the processing fluid from flowing back from the junction of the first branch flow path L14 and the second branch flow path L15 immediately before the processing vessel 111 toward the upstream of the second branch flow path L15. This makes it possible to suppress contamination downstream of the filter F12 due to IPA residue, etc.

Once the replacement of IPA with processing fluid is complete within the recesses of the pattern, the circulation process ends and the pressure reduction process begins.

<Decompression step>
The depressurization process is performed after the circulation process. In the depressurization process, the processing fluid is discharged from the processing vessel 111. Specifically, as shown in Fig. 9, the on-off valves V14 and V17 are opened, and the on-off valves V11, V12, V13, V15, and V16 are closed. When the pressure in the processing vessel 111 becomes lower than the critical pressure of the processing fluid by the depressurization process, the processing fluid in the supercritical state is vaporized and leaves the recesses of the pattern. This completes the drying process for one substrate W.

After the depressurization step, the process proceeds to a standby step. The processed substrate W is removed from the processing vessel 111 after the process proceeds to the standby step, for example. Specifically, after the depressurization step, the supply of inert gas into the processing vessel 111 is started via the first branch flow path L14 and the second branch flow path L15. Next, the substrate W is removed from the processing vessel 111 while the inert gas is being supplied into the processing vessel 111. The supply of inert gas into the processing vessel 111 continues even after the substrate W is removed from the processing vessel 111. In this way, when the substrate W is removed from the processing vessel 111 while the inert gas is being supplied into the processing vessel 111, the inside of the processing vessel 111 becomes positive pressure, so that when the inside of the processing vessel 111 is opened, a gas flow is formed from the inside to the outside of the processing vessel 111. Therefore, the residue in the processing vessel 111 can be discharged to the outside of the processing vessel 111 and removed. However, when the substrate W is removed from the processing vessel 111, the supply of inert gas into the processing vessel 111 may be stopped.

According to the first embodiment described above, the fluid supply system 12 has a processing fluid supply unit 121 and a temperature adjustment unit 122. The processing fluid supply unit 121 has a flow rate adjustment mechanism (on-off valves V11, V12, orifices OR11, OR12) that adjusts the flow rate of the processing fluid. The temperature adjustment unit 122 has a first branch flow path L14 that passes a processing fluid at a first temperature through the processing vessel 111, and a second branch flow path L15 that passes a processing fluid at a second temperature through the processing vessel 111. This makes it possible to individually control the flow rate and temperature of the processing fluid supplied into the processing vessel 111, and to supply the processing fluid at a controlled flow rate and temperature into the processing vessel 111. As a result, the process margin in the substrate processing method performed using the substrate processing apparatus 10 can be expanded.

Furthermore, according to the first embodiment, the temperature adjustment unit 122 (heating mechanisms HE11, HE12) is provided downstream of the junction of the first supply flow path L11, the second supply flow path L12, and the third supply flow path L13. In this case, the inert gas of the inert gas supply source S12 is heated to a first temperature by the heating mechanism HE11 and flows through the first branch flow path L14. Therefore, in the first branch flow path L14 downstream of the heating mechanism HE11, the temperature uniformity along the fluid flow direction is improved. In contrast, when inert gas at room temperature flows through the first branch flow path L14, even if the first branch flow path L14 is heated by the line heater LH11, a temperature distribution along the fluid flow direction is likely to occur in the first branch flow path L14.

In addition, the inert gas from the inert gas supply source S12 is heated to a second temperature by the heating mechanism HE12 and flows through the second branch flow path L15. This improves the temperature uniformity along the fluid flow direction in the second branch flow path L15 downstream of the heating mechanism HE12. In contrast, when inert gas at room temperature flows through the second branch flow path L15, even if the second branch flow path L15 is heated by the line heater LH12, a temperature distribution along the fluid flow direction is likely to occur in the second branch flow path L15.

Furthermore, according to the first embodiment, a large flow rate of heated inert gas is supplied into the processing vessel 111 via the first branch flow path L14 and the second branch flow path L15, accelerating the drying of the IPA remaining in the first branch flow path L14, the second branch flow path L15, and the processing vessel 111.

Furthermore, according to the first embodiment, in the standby step before the processing fluid from the processing fluid supply source S11 is supplied into the processing vessel 111 via the first branch flow path L14 and the second branch flow path L15, heated inert gas flows through the first branch flow path L14 and the second branch flow path L15. In this case, the first branch flow path L14 and the second branch flow path L15 are heated by the inert gas, so that the processing temperature of the first substrate W performed after the standby step becomes substantially the same as the processing temperature of the second and subsequent substrates W. As a result, variation in processing temperature between substrates W is suppressed.

Second Embodiment
(Substrate Processing Apparatus)
A substrate processing apparatus 20 according to a second embodiment will be described with reference to Fig. 10. Fig. 10 is a diagram showing the substrate processing apparatus 20 according to the second embodiment.

The substrate processing apparatus 20 has a processing section 21, a fluid supply system 22, a discharge section 23, and a control section 24.

The processing section 21 may be the same as the processing section 11. The processing section 21 has a processing vessel 211 and a holding plate 212.

The fluid supply system 22 has a treatment fluid supply section 221 and a temperature adjustment section 222.

The treatment fluid supply unit 221 may be the same as the treatment fluid supply unit 121. The treatment fluid supply unit 221 has a treatment fluid supply source S21, a first supply flow path L21, an on-off valve V21, an orifice OR21, a second supply flow path L22, an on-off valve V22, an orifice OR22, an inert gas supply source S22, a third supply flow path L23, and an on-off valve V23.

The temperature adjustment unit 222 is connected to the treatment fluid supply unit 221 and the treatment vessel 211. The temperature adjustment unit 222 passes a temperature-adjusted fluid through the inside of the treatment vessel 211. The fluid includes a treatment fluid and an inert gas. The temperature adjustment unit 222 has a first branch flow path L24, a second branch flow path L25, a bypass flow path L26, a first discharge flow path L27, and a second discharge flow path L28.

In the first branch flow path L24, a heating mechanism HE21, an on-off valve V25, a filter F21, and a temperature sensor T21 are provided in this order from upstream. A line heater LH21 is provided downstream of the heating mechanism HE21 in the first branch flow path L24. Sensors such as a temperature sensor and a pressure sensor may be provided at various positions in the first branch flow path L24.

In the second branch flow path L25, an on-off valve V24, a heating mechanism HE22, an on-off valve V26, and a filter F22 are provided in this order from upstream. A line heater LH22 is provided downstream of the heating mechanism HE22 in the second branch flow path L25. Sensors such as a temperature sensor and a pressure sensor may be provided at various positions in the second branch flow path L25.

The second branch flow path L25 branches off from the first branch flow path L24 between the processing fluid supply unit 221 and the heating mechanism HE21. The second branch flow path L25 merges with the first branch flow path L24 immediately before the processing vessel 211.

The heating mechanism HE21 is provided in parallel with the heating mechanism HE22. The heating mechanism HE21 heats the fluid supplied from the treatment fluid supply unit 221 to a first temperature and supplies the fluid at the first temperature downstream. The first temperature may be, for example, 100°C or higher and 120°C or lower.

The on-off valve V25 is a valve that switches the flow of fluid on and off. When open, the on-off valve V25 allows fluid to flow to the downstream processing vessel 211, and when closed, it does not allow fluid to flow to the downstream processing vessel 211.

The filter F21 filters the fluid flowing through the first branch flow path L24 and removes foreign matter contained in the fluid. This makes it possible to prevent particles from being generated on the surface of the substrate W during the drying process of the substrate W using the fluid.

The temperature sensor T21 is provided downstream of the junction of the first branch flow path L24 with the second branch flow path L25. The temperature sensor T21 is provided, for example, immediately before the processing vessel 211. The temperature sensor T21 detects the temperature of the fluid flowing in the first branch flow path L24.

The line heater LH21 heats the first branch flow path L24 downstream of the heating mechanism HE21. The line heater LH21 prevents the temperature of the fluid heated to the first temperature by the heating mechanism HE21 from decreasing as it flows through the first branch flow path L24.

The on-off valve V24 is a valve that switches the flow of fluid on and off. When open, the on-off valve V24 allows fluid to flow to the downstream heating mechanism HE22, and when closed, it does not allow fluid to flow to the downstream heating mechanism HE22.

The heating mechanism HE22 heats the fluid supplied from the treatment fluid supply unit 221 to a second temperature and supplies the fluid at the second temperature downstream. The second temperature is lower than the first temperature. The second temperature may be, for example, 80°C or higher and 90°C or lower.

The on-off valve V26 is a valve that switches the flow of fluid on and off. When the on-off valve V26 is open, it allows fluid to flow to the downstream processing vessel 211, and when it is closed, it does not allow fluid to flow to the downstream processing vessel 211.

The filter F22 filters the fluid flowing through the second branch flow path L25 and removes foreign matter contained in the fluid. This makes it possible to prevent particles from being generated on the surface of the substrate W during the drying process of the substrate W using the fluid.

The line heater LH22 heats the second branch flow path L25 downstream of the heating mechanism HE22. The line heater LH22 prevents the temperature of the fluid heated to the second temperature by the heating mechanism HE22 from decreasing as it flows through the second branch flow path L25.

In the temperature adjustment unit 222, when the on-off valve V25 is closed and the on-off valve V26 is opened, the fluid heated to the second temperature by the heating mechanism HE22 is supplied into the processing vessel 211 through the second branch flow path L25. When the on-off valve V26 is closed and the on-off valve V25 is opened, the fluid heated to the first temperature by the heating mechanism HE21 is supplied into the processing vessel 211 through the first branch flow path L24. In this way, the temperature of the fluid flowing through the processing vessel 211 can be changed by exclusively opening and closing the on-off valve V25 and the on-off valve V26. When both the on-off valve V25 and the on-off valve V26 are opened, the fluid heated to the first temperature by the heating mechanism HE21 and the fluid heated to the second temperature by the heating mechanism HE22 are mixed and supplied into the processing vessel 211. In this case, a fluid at an intermediate temperature between the first temperature and the second temperature can be supplied into the processing vessel 211. In this way, by controlling the opening and closing of on-off valves V25 and V26, the temperature of the fluid flowing through the processing vessel 211 can be changed in three stages.

The bypass flow path L26 connects a position between the on-off valve V25 and the filter F21 in the first branch flow path L24 and a position between the on-off valve V26 and the filter F22 in the second branch flow path L25. An orifice OR23 is provided in the bypass flow path L26. A line heater LH23 is provided in the bypass flow path L26. The bypass flow path L26, the orifice OR23, and the line heater LH23 do not necessarily have to be provided.

The orifice OR23 has the function of reducing the flow rate of the fluid passing through the bypass flow path L26 and adjusting the pressure.

The line heater LH23 heats the bypass flow path L26.

The first discharge flow path L27 discharges the fluid in the first branch flow path L24. The first discharge flow path L27 branches off from the first branch flow path L24 between the heating mechanism HE21 and the on-off valve V25. The first discharge flow path L27 is provided with an on-off valve V27. The first discharge flow path L27 is provided with a line heater LH24. An orifice may be provided in the first discharge flow path L27.

The on-off valve V27 is a valve that switches the flow of fluid on and off. When open, the on-off valve V27 allows fluid to flow to the downstream first discharge flow path L27, and when closed, it does not allow fluid to flow to the downstream first discharge flow path L27.

The line heater LH24 heats the first exhaust flow path L27.

The second discharge flow path L28 discharges the fluid in the second branch flow path L25. The second discharge flow path L28 branches off from the second branch flow path L25 between the heating mechanism HE22 and the on-off valve V26. The second discharge flow path L28 is provided with an on-off valve V28. The second discharge flow path L28 is provided with a line heater LH25. An orifice may be provided in the second discharge flow path L28.

The on-off valve V28 is a valve that switches the flow of fluid on and off. When open, the on-off valve V28 allows fluid to flow to the downstream second discharge flow path L28, and when closed, the on-off valve V28 does not allow fluid to flow to the downstream second discharge flow path L28.

The line heater LH25 heats the second exhaust flow path L28.

The discharge section 23 has a discharge flow path L29. The discharge flow path L29 is connected to the processing vessel 211. A pressure sensor P21, a back pressure valve BV21, and an on-off valve V29 are provided in the discharge flow path L29, in that order from upstream. A line heater LH26 is provided in the discharge flow path L29. Sensors such as a temperature sensor and a pressure sensor may be provided at various positions in the discharge flow path L29.

The pressure sensor P21 detects the pressure of the fluid flowing through the discharge flow path L29 immediately after the processing vessel 211. This allows the pressure inside the processing vessel 211 to be detected.

When the primary pressure of the exhaust flow path L29 exceeds the set pressure, the back pressure valve BV21 adjusts the valve opening to allow fluid to flow to the secondary side, thereby maintaining the primary pressure at the set pressure. For example, the set pressure of the back pressure valve BV21 is adjusted by the control unit 24.

The on-off valve V29 is a valve that switches the flow of fluid on and off. When open, the on-off valve V29 allows fluid to flow to the downstream discharge flow path L29, and when closed, the on-off valve V29 does not allow fluid to flow to the downstream discharge flow path L29.

The line heater LH26 heats the exhaust flow path L29.

The control unit 24 receives measurement signals from various sensors (such as temperature sensor T21 and pressure sensor P21) and transmits control signals to various functional elements. The control signals include, for example, opening and closing signals of the on-off valves V21 to V29, a set pressure signal of the back pressure valve BV21, and a temperature signal of the line heater LH21 to LH26. For example, the control unit 24 is configured to change the flow rate of the fluid flowing through the processing vessel 211 by controlling the opening and closing of the on-off valves V21 and V22 in accordance with the processing state of the substrate W in the processing vessel 211. For example, the control unit 24 is configured to change the temperature of the fluid flowing through the processing vessel 211 by controlling the opening and closing of the on-off valves V25 and V26 in accordance with the processing state of the substrate W in the processing vessel 211.

The control unit 24 is, for example, a computer, and includes an arithmetic unit 241 and a memory unit 242. The memory unit 242 stores programs that control various processes executed in the substrate processing apparatus 20. The arithmetic unit 241 controls the operation of the substrate processing apparatus 20 by reading and executing the programs stored in the memory unit 242. The programs may be recorded in a computer-readable storage medium and installed from the storage medium into the storage unit 242 of the control unit 24. Examples of computer-readable storage media include a hard disk (HD), a flexible disk (FD), a compact disk (CD), a magnetic optical disk (MO), and a memory card.

(Substrate Processing Method)
11 to 18, a substrate processing method executed by the substrate processing apparatus 20 will be described. The substrate processing method described below is automatically executed under the control of the controller 24 based on the processing recipe and the control program stored in the storage unit 242.

FIG. 11 is a timing chart showing the substrate processing method according to the second embodiment. In FIG. 11, the lower diagram shows the opening and closing timing of on-off valves V21, V22, V23, V24, V25, V26, V27, V28, and V29, and the upper diagram shows the change in the detection value (pressure) of pressure sensor P21 corresponding to the opening and closing timing.

FIGS. 12 to 18 are diagrams illustrating a substrate processing method according to the second embodiment. In FIG. 12 to FIG. 18, an open valve is shown filled in black, and a closed valve is shown filled in white. In FIG. 12 to FIG. 18, a flow path through which a fluid flows is shown by a thick solid line.

<Waiting process>
In the standby step, an inert gas is supplied to the processing section 21, the fluid supply system 22, and the exhaust section 23. The inert gas may be, for example, _N2 gas. Specifically, as shown in FIG. 12, the on-off valves V23, V24, V25, V26, and V29 are opened, and the on-off valves V21, V22, V27, and V28 are closed. As a result, the inert gas guided from the inert gas supply source S22 to the first branch flow path L24 is heated to a first temperature by the heating mechanism HE21 and supplied into the processing vessel 211. Also, the inert gas guided from the inert gas supply source S22 to the second branch flow path L25 is heated to a second temperature by the heating mechanism HE22 and supplied into the processing vessel 211. Therefore, the first branch flow path L24 and the second branch flow path L25 are purged and heated by the inert gas, so that the processing temperature of the first substrate W after the standby step becomes substantially the same as the processing temperature of the second and subsequent substrates W. This results in suppression of variation in processing temperature among the substrates W. In the standby step, the inert gas is exhausted from the processing vessel 211 through the exhaust passage L29.

In the standby step, the substrate W is loaded into the processing vessel 211. Specifically, as shown in FIG. 13, the on-off valves V24 and V26 are opened, and the on-off valves V21, V22, V23, V25, V27, V28, and V29 are closed, and then the substrate W is loaded into the processing vessel 211. That is, the substrate W is loaded into the processing vessel 211 without inert gas being supplied into the processing vessel 211. However, the substrate W may be loaded into the processing vessel 211 while inert gas is being supplied into the processing vessel 211. The substrate W is subjected to a cleaning process, and is placed on the holding plate 212 with the recesses of the pattern on the surface filled with IPA.

<First pressure increase step>
The first pressurization step is performed after the standby step. In the first pressurization step, the pressure in the processing vessel 211 is first increased by supplying the processing fluid at a first flow rate and a second temperature, and then the pressure in the processing vessel 211 is increased by supplying the processing fluid at a second flow rate and a second temperature. That is, in the first pressurization step, the pressure is increased in two stages. The second flow rate may be larger than the first flow rate.

When the pressure is increased at the first flow rate, as shown in FIG. 14, the on-off valves V21, V24, and V26 are opened, and the on-off valves V22, V23, V25, V27, V28, and V29 are closed. As a result, the processing fluid from the processing fluid supply source S21 flows into the temperature adjustment section 222 via the first supply flow path L21, and is supplied into the processing vessel 211 via the second branch flow path L25. Therefore, the processing fluid at the first flow rate and the second temperature is supplied into the processing vessel 211. As a result, the temperature of the substrate W changes to the second temperature. When the pressure is increased at the first flow rate, the on-off valve V29 is closed, so the processing fluid does not flow out of the processing vessel 211. Therefore, the pressure in the processing vessel 211 gradually increases.

When pressurizing at the first flow rate, the processing fluid, whose flow rate has been reduced by the orifice OR23, flows from the second branch flow path L25 through the bypass flow path L26 into the first branch flow path L24. This prevents the processing fluid from flowing back from the junction of the first branch flow path L24 and the second branch flow path L25 immediately before the processing vessel 211 toward the upstream of the first branch flow path L24. This makes it possible to suppress contamination downstream of the filter F21 due to IPA residue, etc.

During the pressurization at the first flow rate, the pressure inside the processing vessel 211 is detected by the pressure sensor P21, and the pressurization at the first flow rate continues until the pressure inside the processing vessel 211 reaches the first pressure Y1. When the pressure inside the processing vessel 211 reaches the first pressure Y1, the pressurization at the first flow rate ends and transitions to the pressurization at the second flow rate.

When the pressure is increased at the second flow rate, as shown in FIG. 15, the on-off valve V22 is opened. The states of the other on-off valves are the same as those shown in FIG. 14. As a result, the processing fluid from the processing fluid supply source S21 flows into the temperature adjustment section 222 via the second supply flow path L22 in addition to the first supply flow path L21, and is supplied into the processing vessel 211 via the second branch flow path L25. As a result, the flow rate of the processing fluid supplied into the processing vessel 211 increases to the second flow rate. When the pressure is increased at the second flow rate, the on-off valve V29 is closed, so the processing fluid does not flow out of the processing vessel 211. As a result, the pressure inside the processing vessel 211 gradually increases.

When pressurizing at the second flow rate, the pressure of the processing fluid supplied into the processing vessel 211 is lower than the critical pressure. Therefore, the processing fluid is supplied into the processing vessel 211 in a gaseous state. Thereafter, as the processing vessel 211 is filled with the processing fluid, the pressure inside the processing vessel 211 increases, and when the pressure inside the processing vessel 211 exceeds the critical pressure, the processing fluid present in the processing vessel 211 becomes supercritical.

When pressurizing at the second flow rate, the processing fluid, whose flow rate has been reduced by the orifice OR23, flows from the second branch flow path L25 through the bypass flow path L26 into the first branch flow path L24. This prevents the processing fluid from flowing back from the junction of the first branch flow path L24 and the second branch flow path L25 immediately before the processing vessel 211 toward the upstream of the first branch flow path L24. This makes it possible to suppress contamination downstream of the filter F21 due to IPA residue, etc.

During the pressurization at the second flow rate, the pressure inside the processing vessel 211 is detected by the pressure sensor P21, and the pressurization at the second flow rate continues until the pressure inside the processing vessel 211 reaches the second pressure Y2. When the pressure inside the processing vessel 211 reaches the second pressure Y2, the first pressurization process ends and the process moves to the second pressurization process.

<Second pressure increase step>
The second pressurization step is performed after the first pressurization step. In the second pressurization step, the pressure in the processing vessel 211 is increased by supplying the processing fluid at the second flow rate and the first temperature. Specifically, as shown in FIG. 16, the on-off valves V21, V22, V25, and V28 are opened, and the on-off valves V23, V24, V26, V27, and V29 are closed. As a result, the processing fluid from the processing fluid supply source S21 flows into the temperature adjustment unit 222 via the first supply flow path L21 and the second supply flow path L22, and is supplied into the processing vessel 211 via the first branch flow path L24. Therefore, the processing fluid at the second flow rate and the first temperature is supplied into the processing vessel 211. As a result, the temperature of the substrate W is quickly changed to the first temperature.

In the second pressurization step, the processing fluid, whose flow rate has been reduced by the orifice OR23, flows from the first branch flow path L24 through the bypass flow path L26 into the second branch flow path L25. This prevents the processing fluid from flowing back from the junction of the first branch flow path L24 and the second branch flow path L25 immediately before the processing vessel 211 toward the upstream of the second branch flow path L25. This makes it possible to suppress contamination downstream of the filter F22 due to IPA residue, etc.

In the second pressure increase step, the processing fluid in the second branch flow path L25 is discharged and the pressure in the second branch flow path L25 is reduced. Since the heat storage amount of the heating mechanism HE22 set to the second temperature lower than the first temperature is small, when the pressure in the second branch flow path L25 is reduced, the temperature of the heating mechanism HE22 drops significantly due to the pressure drop, and it takes time for the temperature of the heating mechanism HE22 to return to the second temperature. Therefore, while the processing fluid is flowing through the first branch flow path L24 in the second pressure increase step, the on-off valves V24 and V26 are closed and the on-off valve V28 is opened, thereby reducing the pressure in the second branch flow path L25 and returning the temperature of the heating mechanism HE22 to the second temperature. In this way, since the second exhaust flow path L28 and the on-off valve V28 are provided, the heating mechanism HE2 can be prepared for the next substrate W in parallel with the processing of the substrate W in the processing vessel 211.

During the second pressurization process, the pressure inside the processing vessel 211 is detected by the pressure sensor P21, and the second pressurization process continues until the pressure inside the processing vessel 211 reaches the third pressure Y3. When the pressure inside the processing vessel 211 reaches the third pressure Y3, the second pressurization process ends and the process moves to the circulation process.

<Distribution process>
The circulation process is performed after the second pressure increase process. In the circulation process, the processing fluid at the second flow rate and the first temperature is supplied from the processing fluid supply source S21 into the processing vessel 211, and the IPA is replaced with the processing fluid in the recess of the pattern on the substrate W in the processing vessel 211. Specifically, as shown in FIG. 17, the on-off valves V21, V22, V25, V28, and V29 are opened, and the on-off valves V23, V24, V26, and V27 are closed. As a result, the processing fluid of the processing fluid supply source S21 flows into the temperature adjustment unit 222 via the first supply flow path L21 and the second supply flow path L22, and is supplied into the processing vessel 211 via the first branch flow path L24. The processing fluid supplied into the processing vessel 211 is discharged from the processing vessel 211 via the discharge flow path L29. By performing the circulation process, the replacement of the IPA with the processing fluid in the recess of the pattern on the substrate W is promoted.

In the circulation process, the processing fluid, whose flow rate has been reduced by the orifice OR23, flows from the first branch flow path L24 through the bypass flow path L26 into the second branch flow path L25. This prevents the processing fluid from flowing back from the junction of the first branch flow path L24 and the second branch flow path L25 immediately before the processing vessel 211 toward the upstream of the second branch flow path L25. This makes it possible to suppress contamination downstream of the filter F22 due to IPA residue, etc. The pressure reduction in the second branch flow path L25 continues even in the circulation process.

<Decompression step>
The depressurization process is performed after the circulation process. In the depressurization process, the processing fluid is discharged from the processing vessel 211. Specifically, as shown in Fig. 18, the on-off valves V27, V28, and V29 are opened, and the on-off valves V21, V22, V23, V24, V25, and V26 are closed. When the pressure in the processing vessel 211 becomes lower than the critical pressure of the processing fluid by the depressurization process, the processing fluid in the supercritical state is vaporized and leaves the recesses of the pattern. This completes the drying process for one substrate W.

In the depressurization process, the processing fluid in the first branch flow path L24 is discharged via the first discharge flow path L27, and the processing fluid in the second branch flow path L25 is discharged via the second discharge flow path L28. That is, the processing fluid in the first branch flow path L24 and the processing fluid in the second branch flow path L25 are discharged from different discharge flow paths. This prevents mixing of the processing fluid at the first temperature and the processing fluid at the second temperature.

After the depressurization step, the process proceeds to a standby step. The processed substrate W is removed from the processing vessel 211 after the process proceeds to the standby step, for example. Specifically, after the depressurization step, the supply of inert gas into the processing vessel 211 is started via the first branch flow path L24 and the second branch flow path L25. Next, the substrate W is removed from the processing vessel 211 while the inert gas is being supplied into the processing vessel 211. The supply of inert gas into the processing vessel 211 continues even after the substrate W is removed from the processing vessel 211. In this way, when the substrate W is removed from the processing vessel 211 while the inert gas is being supplied into the processing vessel 211, the inside of the processing vessel 211 becomes positive pressure, so that when the inside of the processing vessel 211 is opened, a gas flow is formed from the inside to the outside of the processing vessel 211. Therefore, the residue in the processing vessel 211 can be discharged to the outside of the processing vessel 211 and removed. However, when the substrate W is removed from the processing vessel 211, the supply of inert gas into the processing vessel 211 may be stopped.

According to the second embodiment described above, the fluid supply system 22 has a processing fluid supply unit 221 and a temperature adjustment unit 222. The processing fluid supply unit 221 has a flow rate adjustment mechanism (on-off valves V21, V22, orifices OR21, OR22) that adjusts the flow rate of the processing fluid. The temperature adjustment unit 222 has a first branch flow path L24 that passes a processing fluid at a first temperature into the processing vessel 211, and a second branch flow path L25 that passes a processing fluid at a second temperature into the processing vessel 211. This makes it possible to individually control the flow rate and temperature of the processing fluid supplied into the processing vessel 211, and to supply the processing fluid at a controlled flow rate and temperature into the processing vessel 211. As a result, the process margin in the substrate processing method performed using the substrate processing apparatus 10 can be expanded.

Furthermore, according to the second embodiment, the temperature adjustment unit 222 (heating mechanisms HE21, HE22) is provided downstream of the junction of the first supply flow path L21, the second supply flow path L22, and the third supply flow path L23. In this case, the inert gas of the inert gas supply source S22 is heated to a first temperature by the heating mechanism HE21 and flows through the first branch flow path L24. Therefore, in the first branch flow path L24 downstream of the heating mechanism HE21, the temperature uniformity along the fluid flow direction is improved. In contrast, when inert gas at room temperature flows through the first branch flow path L24, even if the first branch flow path L24 is heated by the line heater LH21, a temperature distribution along the fluid flow direction is likely to occur in the first branch flow path L24.

In addition, the inert gas from the inert gas supply source S22 is heated to a second temperature by the heating mechanism HE22 and flows through the second branch flow path L25. This improves the temperature uniformity along the fluid flow direction in the second branch flow path L25 downstream of the heating mechanism HE22. In contrast, when inert gas at room temperature flows through the second branch flow path L25, even if the second branch flow path L25 is heated by the line heater LH22, a temperature distribution along the fluid flow direction is likely to occur in the second branch flow path L25.

Furthermore, according to the second embodiment, a large flow rate of heated inert gas is supplied into the processing vessel 211 via the first branch flow path L24 and the second branch flow path L25, accelerating the drying of the IPA remaining in the first branch flow path L24, the second branch flow path L25, and the processing vessel 211.

Furthermore, according to the second embodiment, in a standby step before the processing fluid from the processing fluid supply source S21 is supplied into the processing vessel 211 via the first branch flow path L24 and the second branch flow path L25, a heated inert gas flows through the first branch flow path L24 and the second branch flow path L25. In this case, the first branch flow path L24 and the second branch flow path L25 are heated by the inert gas, so that the processing temperature of the first substrate W performed after the standby step becomes substantially the same as the processing temperature of the second and subsequent substrates W. As a result, variation in processing temperature between substrates W is suppressed.

[First Modification of the Second Embodiment]
A substrate processing apparatus 20A according to a first modified example of the second embodiment will be described with reference to Fig. 19. Fig. 19 is a diagram showing a substrate processing apparatus 20A according to a first modified example of the second embodiment.

Substrate processing apparatus 20A differs from substrate processing apparatus 20 in that heating mechanism HE21 and heating mechanism HE22 are each connected to a processing fluid supply unit, and in that there is no bypass flow path L26. The rest of the configuration of substrate processing apparatus 20A may be the same as that of substrate processing apparatus 20. The following will focus on the differences from substrate processing apparatus 20.

The substrate processing apparatus 20A has a processing section 21, a fluid supply system 22A, a discharge section 23, and a control section 24.

The fluid supply system 22A has a treatment fluid supply unit 221A, a treatment fluid supply unit 221B, and a temperature adjustment unit 222A.

The treatment fluid supply unit 221A has a treatment fluid supply source S21A, a first supply flow path L21A, an on-off valve V21A, an orifice OR21A, an inert gas supply source S22A, a third supply flow path L23A, and an on-off valve V23A. The treatment fluid supply source S21A, the first supply flow path L21A, the on-off valve V21A, the orifice OR21A, the inert gas supply source S22A, the third supply flow path L23A, and the on-off valve V23A may be the same as the treatment fluid supply source S21, the first supply flow path L21, the on-off valve V21, the orifice OR21, the inert gas supply source S22, the third supply flow path L23, and the on-off valve V23, respectively.

The treatment fluid supply section 221B has a treatment fluid supply source S21B, a first supply flow path L21B, an on-off valve V21B, an orifice OR21B, a second supply flow path L22B, an on-off valve V22B, an orifice OR22B, an inert gas supply source S22B, a third supply flow path L23B, and an on-off valve V23B. The processing fluid supply source S21B, the first supply flow path L21B, the on-off valve V21B, the orifice OR21B, the second supply flow path L22B, the on-off valve V22B, the orifice OR22B, the inert gas supply source S22B, the third supply flow path L23B, and the on-off valve V23B may be the same as the processing fluid supply source S21, the first supply flow path L21, the on-off valve V21, the orifice OR21, the second supply flow path L22, the on-off valve V22, the orifice OR22, the inert gas supply source S22, the third supply flow path L23, and the on-off valve V23, respectively.

The temperature adjustment unit 222A differs from the temperature adjustment unit 222 in that the heating mechanism HE21 is connected to the treatment fluid supply unit 221A, and the heating mechanism HE22 is connected to the treatment fluid supply unit 221B.

In the substrate processing apparatus 20A, the process

fluid supply units

221A and 221B that supply fluid to the temperature adjustment unit 222A are switched by controlling the opening and closing of the on-off valves V21A, V23A, V21B, V22B, and V23B. For example, when the on-off valve V21A is opened, a process fluid is supplied from the process fluid supply unit 221A to the first branch flow path L24. For example, when the on-off valve V23A is opened, an inert gas is supplied from the process fluid supply unit 221A to the first branch flow path L24. For example, when at least one of the on-off valves V21B and V22B is opened, a process fluid is supplied from the process fluid supply unit 221B to the second branch flow path L25. For example, when the on-off valve V23B is opened, an inert gas is supplied from the process fluid supply unit 221B to the second branch flow path L25. In the substrate processing apparatus 20A, the processing

fluid supply units

221A and 221B that supply fluid to the temperature adjustment unit 222A are switched depending on the process being performed, for example.

[Second Modification of Second Embodiment]
A substrate processing apparatus 20B according to a second modified example of the second embodiment will be described with reference to Fig. 20. Fig. 20 is a diagram showing a substrate processing apparatus 20B according to a second modified example of the second embodiment.

Substrate processing apparatus 20B differs from substrate processing apparatus 20 in that it is provided with orifices OR24 and OR25.

The orifice OR24 is provided in the first branch flow path L24 downstream of the filter F21 and upstream of the junction of the first branch flow path L24 and the second branch flow path L25. The orifice OR24 has a larger pressure loss than the orifice OR23. In other words, the orifice OR24 has a smaller flow path area than the orifice OR23.

The orifice OR25 is provided in the second branch flow passage L25 downstream of the filter F22 and upstream of the junction of the first branch flow passage L24 and the second branch flow passage L25. The orifice OR25 has a larger pressure loss than the orifice OR23. In other words, the orifice OR25 has a smaller flow passage area than the orifice OR23.

In the substrate processing apparatus 20B, when the on-off valve V25 is closed and the on-off valve V26 is opened, the fluid heated to the second temperature by the heating mechanism HE22 is supplied into the processing vessel 211 through the second branch flow path L25. At this time, the fluid whose flow rate has been reduced by the orifice OR23 flows from the second branch flow path L25 through the bypass flow path L26 into the first branch flow path L24. This prevents backflow of the fluid from the processing vessel 211 toward the first branch flow path L24. This makes it possible to suppress contamination of the first branch flow path L24 by IPA residues and the like. Furthermore, an orifice OR24 having a larger pressure loss than the orifice OR23 is provided in the first branch flow path L24 downstream of the filter F21. In this case, the pressure in the second branch flow path L25 between the on-off valve V26 and the filter F22, the pressure in the first branch flow path L24 upstream of the orifice OR24, and the pressure in the first branch flow path L24 downstream of the orifice OR24 decrease in that order. This further prevents backflow of the fluid from the processing vessel 211 toward the first branch flow path L24.

Also, when the on-off valve V26 is closed and the on-off valve V25 is opened, the fluid heated to the first temperature by the heating mechanism HE21 is supplied into the processing vessel 211 through the first branch flow path L24. At this time, the fluid whose flow rate has been reduced by the orifice OR23 flows from the first branch flow path L24 through the bypass flow path L26 into the second branch flow path L25. This prevents the backflow of the fluid from the processing vessel 211 toward the second branch flow path L25. Therefore, contamination of the second branch flow path L25 by IPA residue or the like can be suppressed. Furthermore, the second branch flow path L25 downstream of the filter F22 is provided with an orifice OR25 with a larger pressure loss than the orifice OR23. In this case, the pressure of the first branch flow path L24 between the on-off valve V25 and the filter F21, the pressure of the second branch flow path L25 upstream of the orifice OR25, and the pressure of the second branch flow path L25 downstream of the orifice OR25 decrease in this order. This further prevents backflow of fluid from the processing vessel 211 toward the second branch flow path L25.

Third Embodiment
A substrate processing apparatus 30 according to a third embodiment will be described with reference to Fig. 21. Fig. 21 is a diagram showing the substrate processing apparatus 30 according to the third embodiment.

The substrate processing apparatus 30 has a processing section 31, a fluid supply system 32, a discharge section 33, and a control section 34.

The processing section 31 may be the same as the processing section 11. The processing section 31 has a processing vessel 311 and a holding plate 312.

The fluid supply system 32 has a treatment fluid supply section 321 and a temperature adjustment section 322.

The treatment fluid supply unit 321 may be the same as the treatment fluid supply unit 121. The treatment fluid supply unit 321 has a treatment fluid supply source S31, a first supply flow path L31, an on-off valve V31, an orifice OR31, a second supply flow path L32, an on-off valve V32, an orifice OR32, an inert gas supply source S32, a third supply flow path L33, and an on-off valve V33.

The temperature adjustment unit 322 is connected to the treatment fluid supply unit 321 and the treatment vessel 311. The temperature adjustment unit 322 passes a temperature-adjusted fluid through the inside of the treatment vessel 311. The fluid includes a treatment fluid and an inert gas. The temperature adjustment unit 322 has a first flow path L34, a second flow path L35, a bypass flow path L36, and a first discharge flow path L37.

The first flow path L34 is connected to the side of the processing vessel 311. The first flow path L34 supplies fluid from the side of the processing vessel 311 toward the substrate W. A heating mechanism HE31, an orifice OR33, a filter F31, and an on-off valve V34 are provided in the first flow path L34, in that order from upstream. A line heater LH31 is provided downstream of the heating mechanism HE31 in the first flow path L34. Sensors such as a temperature sensor and a pressure sensor may be provided at various positions in the first flow path L34.

The heating mechanism HE31 heats the fluid supplied from the treatment fluid supply unit 321 to a predetermined temperature and supplies the fluid at the predetermined temperature downstream.

The orifice OR33 has the function of reducing the flow rate of the fluid passing through the first flow path L34 and adjusting the pressure.

The filter F31 filters the fluid flowing through the first flow path L34 and removes foreign matter contained in the fluid. This makes it possible to prevent particles from being generated on the surface of the substrate W during the drying process of the substrate W using the fluid.

The on-off valve V34 is a valve that switches the flow of fluid on and off. When open, the on-off valve V34 allows fluid to flow to the downstream processing vessel 311, and when closed, it does not allow fluid to flow to the downstream processing vessel 311.

The line heater LH31 heats the first flow path L34 downstream of the heating mechanism HE31. The line heater LH31 prevents the temperature of the fluid heated to a predetermined temperature by the heating mechanism HE31 from decreasing as it flows through the first flow path L34.

The second flow path L35 branches off from the first flow path L34 between the filter F31 and the on-off valve V34. The second flow path L35 is connected to the bottom of the processing vessel 311. The second flow path L35 supplies fluid from below the processing vessel 311 toward the substrate W. An on-off valve V35 is provided in the second flow path L35. A line heater LH32 is provided in the second flow path L35. Sensors such as a temperature sensor and a pressure sensor may be provided at various positions in the second flow path L35.

The on-off valve V35 is a valve that switches the flow of fluid on and off. When open, the on-off valve V35 allows fluid to flow to the downstream processing vessel 311, and when closed, it does not allow fluid to flow to the downstream processing vessel 311.

The line heater LH32 heats the second flow path L35. The line heater LH32 prevents the temperature of the fluid heated to a predetermined temperature by the heating mechanism HE31 from decreasing as it flows through the second flow path L35.

The bypass flow path L36 connects a position downstream of the on-off valve V34 in the first flow path L34 to a position downstream of the on-off valve V35 in the second flow path L35. An orifice OR34 is provided in the bypass flow path L36. A line heater LH33 is provided in the bypass flow path L36.

The orifice OR34 has the function of reducing the flow rate of the fluid passing through the bypass flow path L36 and adjusting the pressure.

The line heater LH33 heats the bypass flow path L36.

In the temperature adjustment unit 322, when the on-off valve V34 is closed and the on-off valve V35 is opened, the fluid heated to a predetermined temperature by the heating mechanism HE31 is supplied into the processing vessel 311 from below the processing vessel 311 through the second flow path L35. At this time, the fluid, whose flow rate has been reduced by the orifice OR34, flows from the second flow path L35 through the bypass flow path L36 into the first flow path L34. This prevents the backflow of the fluid from the processing vessel 311 toward the first flow path L34. This makes it possible to suppress contamination of the first flow path L34 by IPA residue, etc.

Furthermore, when on-off valve V35 is closed and on-off valve V34 is opened, fluid heated to a predetermined temperature by heating mechanism HE31 is supplied into processing vessel 311 from the side of processing vessel 311 through first flow path L34. At this time, the fluid, whose flow rate has been reduced by orifice OR34, flows from first flow path L34 through bypass flow path L36 into second flow path L35. This prevents backflow of fluid from processing vessel 311 toward second flow path L35. This makes it possible to suppress contamination of second flow path L35 by IPA residue, etc.

The first discharge flow path L37 discharges the fluid in the first flow path L34. The first discharge flow path L37 branches off from the first flow path L34 between the filter F31 and the on-off valve V34. The first discharge flow path L37 is provided with an on-off valve V36 and an orifice OR35, in that order from upstream. The first discharge flow path L37 is provided with a line heater LH34. The orifice OR35 does not necessarily have to be provided.

The on-off valve V36 is a valve that switches the flow of fluid on and off. When open, the on-off valve V36 allows fluid to flow to the downstream first discharge flow path L37, and when closed, does not allow fluid to flow to the downstream first discharge flow path L37.

The orifice OR35 has the function of reducing the flow rate of the fluid passing through the first discharge flow path L37 and adjusting the pressure.

The line heater LH34 heats the first exhaust flow path L37.

The discharge section 33 has a discharge flow path L38. The discharge flow path L38 is connected to the processing vessel 311. A back pressure valve BV31 and an on-off valve V37 are provided in the discharge flow path L38, in that order from upstream. A line heater LH35 is provided in the discharge flow path L38. Sensors such as a temperature sensor and a pressure sensor may be provided at various positions in the discharge flow path L38.

The back pressure valve BV31, the on-off valve V37, and the line heater LH35 may be the same as the back pressure valve BV11, the on-off valve V17, and the line heater LH15, respectively.

Similar to the control unit 14, the control unit 34 receives measurement signals from various sensors and transmits control signals to various functional elements. The control unit 34 is, for example, a computer, and includes a calculation unit 341 and a memory unit 342. The calculation unit 341 and the memory unit 342 may be the same as the calculation unit 141 and the memory unit 142, respectively.

Fourth Embodiment
A substrate processing apparatus 40 according to a fourth embodiment will be described with reference to Fig. 22. Fig. 22 is a view showing the substrate processing apparatus 40 according to the fourth embodiment.

The substrate processing apparatus 40 has a processing section 41, a fluid supply system 42, a discharge section 43, and a control section 44.

The processing section 41 may be the same as the processing section 11. The processing section 41 has a processing vessel 411 and a holding plate 412.

The fluid supply system 42 has a treatment fluid supply section 421 and a temperature adjustment section 422.

The treatment fluid supply unit 421 may be the same as the treatment fluid supply unit 121. The treatment fluid supply unit 421 has a treatment fluid supply source S41, a first supply flow path L41, an on-off valve V41, an orifice OR41, a second supply flow path L42, an on-off valve V42, an orifice OR42, an inert gas supply source S42, a third supply flow path L43, and an on-off valve V43.

The temperature adjustment unit 422 is connected to the treatment fluid supply unit 421 and the treatment vessel 411. The temperature adjustment unit 422 passes a temperature-adjusted fluid through the inside of the treatment vessel 411. The fluid includes a treatment fluid and an inert gas. The temperature adjustment unit 422 has a first branch flow path L44, a second branch flow path L45, a first bypass flow path L46, a first exhaust flow path L47, a second exhaust flow path L48, a third branch flow path L421, and a second bypass flow path L422.

The first branch flow path L44 is connected to the side of the processing vessel 411. The first branch flow path L44 supplies fluid from the side of the processing vessel 411 toward the substrate W. A heating mechanism HE41, an on-off valve V45, a filter F41, and an on-off valve V50 are provided in the first branch flow path L44, in that order from upstream. A line heater LH41 is provided downstream of the heating mechanism HE41 in the first branch flow path L44. Sensors such as a temperature sensor and a pressure sensor may be provided at various positions in the first branch flow path L44.

The heating mechanism HE41 is provided in parallel with the heating mechanism HE42. The heating mechanism HE41 heats the fluid supplied from the treatment fluid supply unit 421 to a first temperature and supplies the fluid at the first temperature downstream. The first temperature may be, for example, 100°C or higher and 120°C or lower.

The on-off valve V45 is a valve that switches the flow of fluid on and off. When the on-off valve V45 is open, it allows fluid to flow to the downstream filter F41, and when it is closed, it does not allow fluid to flow to the downstream filter F41.

The filter F41 filters the fluid flowing through the first branch flow path L44 and removes foreign matter contained in the fluid. This makes it possible to prevent particles from being generated on the surface of the substrate W during the drying process of the substrate W using the fluid.

The on-off valve V50 is a valve that switches the flow of fluid on and off. When open, the on-off valve V50 allows fluid to flow to the downstream processing vessel 411, and when closed, it does not allow fluid to flow to the downstream processing vessel 411.

The line heater LH41 heats the first branch flow path L44 downstream of the heating mechanism HE41. The line heater LH41 prevents the temperature of the fluid heated to the first temperature by the heating mechanism HE41 from decreasing as it flows through the first branch flow path L44.

The second branch flow path L45 branches off from the first branch flow path L44 between the treatment fluid supply unit 421 and the heating mechanism HE41. The second branch flow path L45 merges with the first branch flow path L44 between the filter F41 and the on-off valve V50.

In the second branch flow path L45, an on-off valve V44, a heating mechanism HE42, an on-off valve V46, and a filter F42 are provided in this order from upstream. Downstream of the heating mechanism HE42 in the second branch flow path L45, a line heater LH42 is provided. Sensors such as a temperature sensor and a pressure sensor may be provided at various positions in the second branch flow path L45.

The on-off valve V44 is a valve that switches the flow of fluid on and off. When open, the on-off valve V44 allows fluid to flow to the downstream heating mechanism HE42, and when closed, it does not allow fluid to flow to the downstream heating mechanism HE42.

The heating mechanism HE42 heats the fluid supplied from the treatment fluid supply unit 421 to a second temperature and supplies the fluid at the second temperature downstream. The second temperature is lower than the first temperature. The second temperature may be, for example, 80°C or higher and 90°C or lower.

The on-off valve V46 is a valve that switches the flow of fluid on and off. When the on-off valve V46 is open, it allows fluid to flow to the downstream filter F42, and when it is closed, it does not allow fluid to flow to the downstream filter F42.

The filter F42 filters the fluid flowing through the second branch flow path L45 and removes foreign matter contained in the fluid. This makes it possible to prevent particles from being generated on the surface of the substrate W during the drying process of the substrate W using the fluid.

The line heater LH42 heats the second branch flow path L45 downstream of the heating mechanism HE42. The line heater LH42 prevents the temperature of the fluid heated to the second temperature by the heating mechanism HE42 from decreasing when it flows through the second branch flow path L45.

The first bypass flow path L46 connects a position between the on-off valve V45 and the filter F41 in the first branch flow path L44 and a position between the on-off valve V46 and the filter F42 in the second branch flow path L45. An orifice OR43 is provided in the first bypass flow path L46. A line heater LH43 is provided in the first bypass flow path L46. The first bypass flow path L46, the orifice OR43, and the line heater LH43 do not necessarily have to be provided.

The orifice OR43 has the function of reducing the flow rate of the fluid passing through the first bypass flow path L46 and adjusting the pressure.

The line heater LH43 heats the first bypass flow path L46.

In the temperature adjustment unit 422, when the on-off valve V45 is closed and the on-off valve V46 is opened, the fluid heated to the second temperature by the heating mechanism HE42 is supplied into the processing vessel 411 through the second branch flow path L45. At this time, the fluid whose flow rate has been reduced by the orifice OR43 flows from the second branch flow path L45 through the first bypass flow path L46 into the first branch flow path L44. This prevents backflow of the fluid from the junction of the first branch flow path L44 and the second branch flow path L45 toward the upstream of the first branch flow path L44. This makes it possible to suppress contamination of the first branch flow path L44, the filter F41, etc.

Further, when the on-off valve V46 is closed and the on-off valve V45 is opened, the fluid heated to the first temperature by the heating mechanism HE41 is supplied into the processing vessel 411 through the first branch flow path L44. At this time, the fluid, whose flow rate has been reduced by the orifice OR43, flows from the first branch flow path L44 through the first bypass flow path L46 into the second branch flow path L45. This prevents backflow of the fluid from the junction of the first branch flow path L44 and the second branch flow path L45 toward the upstream of the second branch flow path L45. This makes it possible to suppress contamination of the second branch flow path L45, the filter F42, etc.

In this way, by exclusively opening and closing the on-off valves V45 and V46, the temperature of the fluid flowing through the processing vessel 411 can be changed. Furthermore, when both the on-off valves V45 and V46 are opened, the fluid heated to the first temperature by the heating mechanism HE41 and the fluid heated to the second temperature by the heating mechanism HE42 are mixed and supplied into the processing vessel 411. In this case, a fluid at an intermediate temperature between the first and second temperatures can be supplied into the processing vessel 411. In this way, by controlling the opening and closing of the on-off valves V45 and V46, the temperature of the fluid flowing through the processing vessel 411 can be changed in three stages.

The first discharge flow path L47 discharges the fluid in the first branch flow path L44. The first discharge flow path L47 branches off from the first branch flow path L44 between the heating mechanism HE41 and the on-off valve V45. The first discharge flow path L47 is provided with an on-off valve V47. The first discharge flow path L47 is provided with a line heater LH44. An orifice may be provided in the first discharge flow path L47.

The on-off valve V47 is a valve that switches the flow of fluid on and off. When open, the on-off valve V47 allows fluid to flow to the downstream first discharge flow path L47, and when closed, does not allow fluid to flow to the downstream first discharge flow path L47.

The line heater LH44 heats the first exhaust flow path L47.

The second discharge flow path L48 discharges the fluid in the second branch flow path L45. The second discharge flow path L48 branches off from the second branch flow path L45 between the heating mechanism HE42 and the on-off valve V46. The second discharge flow path L48 is provided with an on-off valve V48. The second discharge flow path L48 is provided with a line heater LH45. An orifice may be provided in the second discharge flow path L48.

The on-off valve V48 is a valve that switches the flow of fluid on and off. When open, the on-off valve V48 allows fluid to flow to the downstream second discharge flow path L48, and when closed, the on-off valve V48 does not allow fluid to flow to the downstream second discharge flow path L48.

The line heater LH45 heats the second exhaust flow path L48.

The third branch flow path L421 branches off from the first branch flow path L44 between the filter F41 and the on-off valve V50. The third branch flow path L421 is connected to the bottom of the processing vessel 411. The third branch flow path L421 supplies fluid from the bottom of the processing vessel 411 toward the substrate W.

An on-off valve V421 is provided in the third branch flow path L421. A line heater LH421 is provided in the third branch flow path L421. Sensors such as a temperature sensor and a pressure sensor may be provided at various positions in the third branch flow path L421.

The on-off valve V421 is a valve that switches the flow of fluid on and off. When open, the on-off valve V421 allows fluid to flow to the downstream processing vessel 411, and when closed, it does not allow fluid to flow to the downstream processing vessel 411.

The line heater LH421 heats the third branch flow path L421. The line heater LH421 prevents the temperature of the fluid heated to the first temperature by the heating mechanism HE41 and the fluid heated to the second temperature by the heating mechanism HE42 from decreasing when they flow through the third branch flow path L421.

The second bypass flow path L422 connects a position downstream of the on-off valve V50 in the first branch flow path L44 to a position downstream of the on-off valve V421 in the third branch flow path L421. An orifice OR422 is provided in the second bypass flow path L422. A line heater LH422 is provided in the second bypass flow path L422.

The orifice OR422 has the function of reducing the flow rate of the fluid passing through the second bypass flow path L422 and adjusting the pressure.

The line heater LH422 heats the second bypass flow path L422.

In the temperature adjustment unit 422, when the on-off valve V50 is closed and the on-off valve V421 is opened, the fluid is supplied into the processing vessel 411 through the third branch flow path L421. At this time, the fluid, whose flow rate has been reduced by the orifice OR422, flows from the third branch flow path L421 through the second bypass flow path L422 into the first branch flow path L44. This prevents backflow of the fluid from the processing vessel 411 toward the upstream of the first branch flow path L44. This makes it possible to suppress contamination of the first branch flow path L44 by IPA residue, etc.

Furthermore, when the on-off valve V421 is closed and the on-off valve V50 is opened, the fluid is supplied into the processing vessel 411 through the first branch flow path L44. At this time, the fluid, whose flow rate has been reduced by the orifice OR422, flows from the first branch flow path L44 through the second bypass flow path L422 into the third branch flow path L421. This prevents backflow of the fluid from the processing vessel 411 toward the upstream of the third branch flow path L421. This makes it possible to suppress contamination of the third branch flow path L421 by IPA residue, etc.

The discharge section 43 has a discharge flow path L49. The discharge flow path L49 is connected to the processing vessel 411. A back pressure valve BV41 and an on-off valve V49 are provided in the discharge flow path L49, in that order from upstream. A line heater LH46 is provided in the discharge flow path L49. Sensors such as a temperature sensor and a pressure sensor may be provided at various positions in the discharge flow path L49.

The back pressure valve BV41, the on-off valve V49, and the line heater LH46 may be the same as the back pressure valve BV11, the on-off valve V17, and the line heater LH15, respectively.

Similar to the control unit 14, the control unit 44 receives measurement signals from various sensors and transmits control signals to various functional elements. The control unit 44 is, for example, a computer, and includes a calculation unit 441 and a memory unit 442. The calculation unit 441 and the memory unit 442 may be the same as the calculation unit 141 and the memory unit 142, respectively.

Fifth Embodiment
A substrate processing apparatus 50 according to a fifth embodiment will be described with reference to Fig. 23. Fig. 23 is a view showing the substrate processing apparatus 50 according to the fifth embodiment.

The substrate processing apparatus 50 has a processing section 51, a fluid supply system 52, a discharge section 53, and a control section 54.

The processing section 51 may be the same as the processing section 11. The processing section 51 has a processing vessel 511 and a holding plate 512.

The fluid supply system 52 has a processing fluid supply section 521 and a temperature adjustment section 522.

The treatment fluid supply unit 521 may be the same as the treatment fluid supply unit 121. The treatment fluid supply unit 521 has a treatment fluid supply source S51, a first supply flow path L51, an on-off valve V51, an orifice OR51, a second supply flow path L52, an on-off valve V52, an orifice OR52, an inert gas supply source S52, a third supply flow path L53, and an on-off valve V53.

The temperature adjustment unit 522 is connected to the processing fluid supply unit 521 and the processing vessel 511. The temperature adjustment unit 522 passes a temperature-adjusted fluid through the inside of the processing vessel 511. The fluid includes a processing fluid and an inert gas. The temperature adjustment unit 522 has a first branch flow path L54, a second branch flow path L55, a first bypass flow path L56, a first discharge flow path L57, a third branch flow path L521, and a second bypass flow path L522.

The first branch flow path L54 is connected to the side of the processing vessel 511. The first branch flow path L54 supplies fluid from the side of the processing vessel 511 toward the substrate W. A heating mechanism HE51, an on-off valve V55, a filter F51, and an on-off valve V60 are provided in the first branch flow path L54, in that order from upstream. A line heater LH51 is provided downstream of the heating mechanism HE51 in the first branch flow path L54. Sensors such as a temperature sensor and a pressure sensor may be provided at various positions in the first branch flow path L54.

In the second branch flow path L55, a heating mechanism HE52, an on-off valve V56, and a filter F52 are provided in this order from upstream to downstream. A line heater LH52 is provided downstream of the heating mechanism HE52 in the second branch flow path L55. Sensors such as a temperature sensor and a pressure sensor may be provided at various positions in the second branch flow path L55.

The first branch flow path L54 branches off from the second branch flow path L55 between the heating mechanism HE52 and the on-off valve V56. The second branch flow path L55 merges with the first branch flow path L54 between the filter F51 and the on-off valve V60.

The heating mechanism HE51 is provided in series with the heating mechanism HE52. The heating mechanism HE51 heats the fluid supplied from the treatment fluid supply unit 521 to a first temperature and supplies the fluid at the first temperature downstream. The first temperature may be, for example, 100°C or higher and 120°C or lower.

The on-off valve V55 is a valve that switches the flow of fluid on and off. When the on-off valve V55 is open, it allows fluid to flow to the downstream filter F51, and when it is closed, it does not allow fluid to flow to the downstream filter F51.

The filter F51 filters the fluid flowing through the first branch flow path L54 and removes foreign matter contained in the fluid. This makes it possible to prevent particles from being generated on the surface of the substrate W during the drying process of the substrate W using the fluid.

The on-off valve V60 is a valve that switches the flow of fluid on and off. When open, the on-off valve V60 allows fluid to flow to the downstream processing vessel 511, and when closed, it does not allow fluid to flow to the downstream processing vessel 511.

The line heater LH51 heats the first branch flow path L54 downstream of the heating mechanism HE51. The line heater LH51 prevents the temperature of the fluid heated to the first temperature by the heating mechanism HE51 from decreasing as it flows through the first branch flow path L54.

The heating mechanism HE52 heats the fluid supplied from the treatment fluid supply unit 521 to a second temperature and supplies the fluid at the second temperature downstream. The second temperature is lower than the first temperature. The second temperature may be, for example, 80°C or higher and 90°C or lower.

The on-off valve V56 is a valve that switches the flow of fluid on and off. When the on-off valve V56 is open, it allows fluid to flow to the downstream filter F52, and when it is closed, it does not allow fluid to flow to the downstream filter F52.

The filter F52 filters the fluid flowing through the second branch flow path L55 and removes foreign matter contained in the fluid. This makes it possible to prevent particles from being generated on the surface of the substrate W during the drying process of the substrate W using the fluid.

The line heater LH52 heats the second branch flow path L55 downstream of the heating mechanism HE52. The line heater LH52 prevents the temperature of the fluid heated to the second temperature by the heating mechanism HE52 from decreasing as it flows through the second branch flow path L55.

The first bypass flow path L56 connects a position between the on-off valve V55 and the filter F51 in the first branch flow path L54 and a position between the on-off valve V56 and the filter F52 in the second branch flow path L55. An orifice OR53 is provided in the first bypass flow path L56. A line heater LH53 is provided in the first bypass flow path L56.

The orifice OR53 has the function of reducing the flow rate of the fluid passing through the first bypass flow path L56 and adjusting the pressure.

The line heater LH53 heats the first bypass flow path L56.

In the temperature adjustment unit 522, when the on-off valve V55 is closed and the on-off valve V56 is opened, the fluid heated to the second temperature by the heating mechanism HE52 is supplied into the processing vessel 511 through the second branch flow path L55. At this time, the fluid whose flow rate has been reduced by the orifice OR53 flows from the second branch flow path L55 through the first bypass flow path L56 into the first branch flow path L54. This prevents backflow of the fluid from the junction of the first branch flow path L54 and the second branch flow path L55 toward the upstream of the first branch flow path L54. This makes it possible to suppress contamination of the first branch flow path L54, the filter F51, etc.

Furthermore, when the on-off valve V56 is closed and the on-off valve V55 is opened, the fluid heated to the first temperature by the heating mechanism HE51 is supplied into the processing vessel 511 through the first branch flow path L54. At this time, the fluid, whose flow rate has been reduced by the orifice OR53, flows from the first branch flow path L54 through the first bypass flow path L56 into the second branch flow path L55. This prevents backflow of the fluid from the junction of the first branch flow path L54 and the second branch flow path L55 toward the upstream of the second branch flow path L55. This makes it possible to suppress contamination of the second branch flow path L55, the filter F52, etc.

In this way, by exclusively opening and closing the on-off valves V55 and V56, the temperature of the fluid flowing through the processing vessel 511 can be changed. Furthermore, when both the on-off valves V55 and V56 are opened, the fluid heated to the first temperature by the heating mechanism HE51 and the fluid heated to the second temperature by the heating mechanism HE52 are mixed and supplied into the processing vessel 511. In this case, a fluid at an intermediate temperature between the first and second temperatures can be supplied into the processing vessel 511. In this way, by controlling the opening and closing of the on-off valves V55 and V56, the temperature of the fluid flowing through the processing vessel 511 can be changed in three stages.

The first discharge flow path L57 discharges the fluid in the first branch flow path L54. The first discharge flow path L57 branches off from the first branch flow path L54 between the heating mechanism HE51 and the on-off valve V55. The first discharge flow path L57 is provided with an on-off valve V54. The first discharge flow path L57 is provided with a line heater LH54. An orifice may be provided in the first discharge flow path L57.

The on-off valve V54 is a valve that switches the flow of fluid on and off. When open, the on-off valve V54 allows fluid to flow to the downstream first discharge flow path L57, and when closed, the on-off valve V54 does not allow fluid to flow to the downstream first discharge flow path L57.

The line heater LH54 heats the first exhaust flow path L57.

The third branch flow path L521 branches off from the first branch flow path L54 between the filter F51 and the on-off valve V60. The third branch flow path L521 is connected to the bottom of the processing vessel 511. The third branch flow path L521 supplies fluid from the bottom of the processing vessel 511 toward the substrate W.

An on-off valve V521 is provided in the third branch flow path L521. A line heater LH521 is provided in the third branch flow path L521. Sensors such as a temperature sensor and a pressure sensor may be provided at various positions in the third branch flow path L521.

The on-off valve V521 is a valve that switches the flow of fluid on and off. When open, the on-off valve V521 allows fluid to flow to the downstream processing vessel 511, and when closed, it does not allow fluid to flow to the downstream processing vessel 511.

The line heater LH521 heats the third branch flow path L521. The line heater LH521 prevents the temperature of the fluid heated to the first temperature by the heating mechanism HE51 and the fluid heated to the second temperature by the heating mechanism HE52 from decreasing when they flow through the third branch flow path L521.

The second bypass flow path L522 connects a position downstream of the on-off valve V60 in the first branch flow path L54 to a position downstream of the on-off valve V521 in the third branch flow path L521. An orifice OR522 is provided in the second bypass flow path L522. A line heater LH522 is provided in the second bypass flow path L522.

The orifice OR522 has the function of reducing the flow rate of the fluid passing through the second bypass flow path L522 and adjusting the pressure.

The line heater LH522 heats the second bypass flow path L522.

In the temperature adjustment unit 522, when the on-off valve V60 is closed and the on-off valve V521 is opened, the fluid is supplied into the processing vessel 511 through the third branch flow path L521. At this time, the fluid, whose flow rate has been reduced by the orifice OR522, flows from the third branch flow path L521 through the second bypass flow path L522 into the first branch flow path L54. This prevents backflow of the fluid from the processing vessel 511 toward the upstream of the first branch flow path L54. This makes it possible to suppress contamination of the first branch flow path L54 by IPA residue, etc.

Furthermore, when the on-off valve V521 is closed and the on-off valve V60 is opened, the fluid is supplied into the processing vessel 511 through the first branch flow path L54. At this time, the fluid, whose flow rate has been reduced by the orifice OR522, flows from the first branch flow path L54 through the second bypass flow path L522 into the third branch flow path L521. This prevents backflow of the fluid from the processing vessel 511 toward the upstream of the third branch flow path L521. This makes it possible to suppress contamination of the third branch flow path L521 by IPA residue, etc.

The discharge section 53 has a discharge flow path L58. The discharge flow path L58 is connected to the processing vessel 511. A back pressure valve BV51 and an on-off valve V57 are provided in the discharge flow path L58, in that order from upstream. A line heater LH55 is provided in the discharge flow path L58. Sensors such as a temperature sensor and a pressure sensor may be provided at various positions in the discharge flow path L58.

The back pressure valve BV51, the on-off valve V57, and the line heater LH55 may be the same as the back pressure valve BV11, the on-off valve V17, and the line heater LH15, respectively.

Similar to the control unit 14, the control unit 54 receives measurement signals from various sensors and transmits control signals to various functional elements. The control unit 54 is, for example, a computer, and includes a calculation unit 541 and a memory unit 542. The calculation unit 541 and the memory unit 542 may be the same as the calculation unit 141 and the memory unit 142, respectively.

Sixth Embodiment
A substrate processing apparatus 60 according to a sixth embodiment will be described with reference to Fig. 24. Fig. 24 is a view showing the substrate processing apparatus 60 according to the sixth embodiment.

The substrate processing apparatus 60 has a processing section 61, a fluid supply system 62, a discharge section 63, and a control section 64.

The processing section 61 may be the same as the processing section 11. The processing section 61 has a processing vessel 611 and a holding plate 612.

The fluid supply system 62 has a treatment fluid supply unit 621A, a treatment fluid supply unit 621B, and a temperature adjustment unit 622.

The treatment fluid supply unit 621A and the treatment fluid supply unit 621B may be the same as the treatment fluid supply unit 221A and the treatment fluid supply unit 221B, respectively. The treatment fluid supply unit 621A has a treatment fluid supply source S61A, a first supply flow path L61A, an on-off valve V61A, an orifice OR61A, an inert gas supply source S62A, a third supply flow path L63A, and an on-off valve V63A. The treatment fluid supply unit 621B has a treatment fluid supply source S61B, a first supply flow path L61B, an on-off valve V61B, an orifice OR61B, a second supply flow path L62B, an on-off valve V62B, an orifice OR62B, an inert gas supply source S62B, a third supply flow path L63B, and an on-off valve V63B.

The temperature adjustment unit 622 is connected to the treatment fluid supply unit 621A, the treatment fluid supply unit 621B, and the treatment vessel 611. The temperature adjustment unit 622 passes a temperature-adjusted fluid through the inside of the treatment vessel 611. The fluid includes a treatment fluid and an inert gas. The temperature adjustment unit 622 has a first branch flow path L64, a second branch flow path L65, a bypass flow path L66, a first exhaust flow path L67, a second exhaust flow path L68, and a third branch flow path L621.

The first branch flow path L64 is connected to the processing fluid supply unit 621A. Fluid is supplied to the first branch flow path L64 from the processing fluid supply unit 621A. The first branch flow path L64 is connected to the side of the processing vessel 611. The first branch flow path L64 supplies fluid from the side of the processing vessel 611 toward the substrate W. The first branch flow path L64 is provided with a heating mechanism HE61, an on-off valve V65, a filter F61, and an on-off valve V70, in that order from upstream. A line heater LH61 is provided downstream of the heating mechanism HE61 in the first branch flow path L64. Sensors such as temperature sensors and pressure sensors may be provided at various positions in the first branch flow path L64.

The heating mechanism HE61 is provided in parallel with the heating mechanism HE62. The heating mechanism HE61 heats the fluid supplied from the treatment fluid supply unit 621A to a first temperature and supplies the fluid at the first temperature downstream. The first temperature may be, for example, 100°C or higher and 120°C or lower.

The on-off valve V65 is a valve that switches the flow of fluid on and off. When the on-off valve V65 is open, it allows fluid to flow to the downstream filter F61, and when it is closed, it does not allow fluid to flow to the downstream filter F61.

The filter F61 filters the fluid flowing through the first branch flow path L64 and removes foreign matter contained in the fluid. This makes it possible to prevent particles from being generated on the surface of the substrate W during the drying process of the substrate W using the fluid.

The on-off valve V70 is a valve that switches the flow of fluid on and off. When open, the on-off valve V70 allows fluid to flow to the downstream processing vessel 611, and when closed, it does not allow fluid to flow to the downstream processing vessel 611.

The line heater LH61 heats the first branch flow path L64 downstream of the heating mechanism HE61. The line heater LH61 prevents the temperature of the fluid heated to the first temperature by the heating mechanism HE61 from decreasing as it flows through the first branch flow path L64.

The second branch flow path L65 is connected to the treatment fluid supply unit 621B. Fluid is supplied to the second branch flow path L65 from the treatment fluid supply unit 621B. The second branch flow path L65 merges with the first branch flow path L64 between the filter F61 and the on-off valve V70. The second branch flow path L65 is provided with a heating mechanism HE62, an on-off valve V66, and a filter F62, in that order from upstream. A line heater LH62 is provided downstream of the heating mechanism HE62 in the second branch flow path L65. Sensors such as temperature sensors and pressure sensors may be provided at various positions in the second branch flow path L65.

The heating mechanism HE62 heats the fluid supplied from the treatment fluid supply unit 621B to a second temperature and supplies the fluid at the second temperature downstream. The second temperature is lower than the first temperature. The second temperature may be, for example, 80°C or higher and 90°C or lower.

The on-off valve V66 is a valve that switches the flow of fluid on and off. When the on-off valve V66 is open, it allows fluid to flow to the downstream filter F62, and when it is closed, it does not allow fluid to flow to the downstream filter F62.

The filter F62 filters the fluid flowing through the second branch flow path L65 and removes foreign matter contained in the fluid. This makes it possible to prevent particles from being generated on the surface of the substrate W during the drying process of the substrate W using the fluid.

The line heater LH62 heats the second branch flow path L65 downstream of the heating mechanism HE62. The line heater LH62 prevents the temperature of the fluid heated to the second temperature by the heating mechanism HE62 from decreasing when it flows through the second branch flow path L65.

The bypass flow path L66 connects a position between the on-off valve V65 and the filter F61 in the first branch flow path L64 and a position between the on-off valve V66 and the filter F62 in the second branch flow path L65. An orifice OR63 is provided in the bypass flow path L66. A line heater LH63 is provided in the bypass flow path L66.

The orifice OR63 has the function of reducing the flow rate of the fluid passing through the bypass flow path L66 and adjusting the pressure.

The line heater LH63 heats the bypass flow path L66.

In the temperature adjustment unit 622, when the on-off valve V65 is closed and the on-off valve V66 is opened, the fluid heated to the second temperature by the heating mechanism HE62 is supplied into the processing vessel 611 through the second branch flow path L65. At this time, the fluid whose flow rate has been reduced by the orifice OR63 flows from the second branch flow path L65 through the bypass flow path L66 into the first branch flow path L64. This prevents backflow of the fluid from the junction of the first branch flow path L64 and the second branch flow path L65 toward the upstream of the first branch flow path L64. This makes it possible to suppress contamination of the first branch flow path L64, the filter F61, etc.

Furthermore, when the on-off valve V66 is closed and the on-off valve V65 is opened, the fluid heated to the first temperature by the heating mechanism HE61 is supplied into the processing vessel 611 through the first branch flow path L64. At this time, the fluid, whose flow rate has been reduced by the orifice OR63, flows from the first branch flow path L64 through the bypass flow path L66 into the second branch flow path L65. This prevents backflow of the fluid from the junction of the first branch flow path L64 and the second branch flow path L65 toward the upstream of the second branch flow path L65. This makes it possible to suppress contamination of the second branch flow path L65, the filter F62, etc.

In this way, by exclusively opening and closing the on-off valves V65 and V66, the temperature of the fluid flowing through the processing vessel 611 can be changed. Furthermore, when both the on-off valves V65 and V66 are opened, the fluid heated to a first temperature by the heating mechanism HE61 and the fluid heated to a second temperature by the heating mechanism HE62 are mixed and supplied into the processing vessel 611. In this case, a fluid at an intermediate temperature between the first and second temperatures can be supplied into the processing vessel 611. In this way, by controlling the opening and closing of the on-off valves V65 and V66, the temperature of the fluid flowing through the processing vessel 611 can be changed in three stages.

The first discharge flow path L67 discharges the fluid in the first branch flow path L64. The first discharge flow path L67 branches off from the first branch flow path L64 between the heating mechanism HE61 and the on-off valve V65. The first discharge flow path L67 is provided with an on-off valve V67. The first discharge flow path L67 is provided with a line heater LH64. An orifice may be provided in the first discharge flow path L67.

The on-off valve V67 is a valve that switches the flow of fluid on and off. When open, the on-off valve V67 allows fluid to flow to the downstream first discharge flow path L67, and when closed, does not allow fluid to flow to the downstream first discharge flow path L67.

The line heater LH64 heats the first exhaust flow path L67.

The second discharge flow path L68 discharges the fluid in the second branch flow path L65. The second discharge flow path L68 branches off from the second branch flow path L65 between the heating mechanism HE62 and the on-off valve V66. The second discharge flow path L68 is provided with an on-off valve V68. The second discharge flow path L68 is provided with a line heater LH65. An orifice may be provided in the second discharge flow path L68.

The on-off valve V68 is a valve that switches the flow of fluid on and off. When open, the on-off valve V68 allows fluid to flow to the downstream second discharge flow path L68, and when closed, the on-off valve V68 does not allow fluid to flow to the downstream second discharge flow path L68.

The line heater LH65 heats the second exhaust flow path L68.

The third branch flow path L621 branches off from the first branch flow path L64 between the filter F61 and the on-off valve V70. The third branch flow path L621 is connected to the bottom of the processing vessel 611. The third branch flow path L621 supplies fluid from the bottom of the processing vessel 611 toward the substrate W.

An on-off valve V621 is provided in the third branch flow path L621. A line heater LH621 is provided in the third branch flow path L621. Sensors such as a temperature sensor and a pressure sensor may be provided at various positions in the third branch flow path L621.

The on-off valve V621 is a valve that switches the flow of fluid on and off. When open, the on-off valve V621 allows fluid to flow to the downstream processing vessel 611, and when closed, it does not allow fluid to flow to the downstream processing vessel 611.

The line heater LH621 heats the third branch flow path L621. The line heater LH621 prevents the temperature of the fluid heated to the first temperature by the heating mechanism HE61 and the fluid heated to the second temperature by the heating mechanism HE62 from decreasing when they flow through the third branch flow path L621.

In the temperature adjustment unit 622, when the on-off valve V70 is closed and the on-off valve V621 is opened, the fluid is supplied into the processing vessel 611 through the third branch flow path L621. When the on-off valve V621 is closed and the on-off valve V70 is opened, the fluid is supplied into the processing vessel 611 through the first branch flow path L64.

The discharge section 63 has a discharge flow path L69. The discharge flow path L69 is connected to the processing vessel 611. A back pressure valve BV61 and an on-off valve V69 are provided in the discharge flow path L69, in that order from upstream. A line heater LH66 is provided in the discharge flow path L69. Sensors such as a temperature sensor and a pressure sensor may be provided at various positions in the discharge flow path L69.

The back pressure valve BV61, the on-off valve V69, and the line heater LH66 may be the same as the back pressure valve BV11, the on-off valve V17, and the line heater LH15, respectively.

Similar to the control unit 14, the control unit 64 receives measurement signals from various sensors and transmits control signals to various functional elements. The control unit 64 is, for example, a computer, and includes a calculation unit 641 and a memory unit 642. The calculation unit 641 and the memory unit 642 may be the same as the calculation unit 141 and the memory unit 142, respectively.

In the above embodiment, the on-off valves V11 and V21 are an example of a first supply valve, and the on-off valves V12 and V22 are an example of a second supply valve. The on-off valves V15 and V25 are an example of a first on-off valve, the on-off valves V16 and V26 are an example of a second on-off valve, and the on-off valve V24 is an example of a third on-off valve. The on-off valve V27 is an example of a first exhaust valve, the on-off valve V28 is an example of a second exhaust valve, and the on-off valve V29 is an example of a third exhaust valve. The heating mechanisms HE11 and HE21 are an example of a first heating mechanism, and the heating mechanisms HE12 and HE22 are an example of a second heating mechanism. The orifices OR13 and OR23 are an example of a first throttle. The first branch flow paths L14 and L24 and the second branch flow paths L15 and L25 are an example of a fluid supply path.

The embodiments disclosed herein should be considered in all respects as illustrative and not restrictive. The above-described embodiments may be omitted, substituted, or modified in various ways without departing from the scope and spirit of the appended claims.

This international application claims priority to Japanese Patent Application No. 2022-168324, filed on October 20, 2022, the entire contents of which are incorporated herein by reference.

REFERENCE SIGNS

LIST

10, 20

Substrate processing apparatus

11, 21

Processing section

111, 211

Processing vessel

12, 22

Fluid supply system

121, 221 Processing

fluid supply section

122, 222 Temperature adjustment section HE11, HE21 Heating mechanism HE12, HE22 Heating mechanism L14, L24 First branch flow path L15, L25 Second branch flow path V11, V21 Opening/closing valve V12, V22 Opening/closing valve

Claims

1. A fluid delivery system for delivering a fluid into a process vessel in which a substrate is processed, comprising:
a processing fluid supply unit that supplies a processing fluid;
a fluid supply line connected to the processing fluid supply unit and the processing vessel, for allowing a temperature-adjusted processing fluid to flow through the processing vessel;
a first heating mechanism provided in the fluid supply path and configured to heat the treatment fluid to a first temperature;
a second heating mechanism provided in the fluid supply path and configured to heat the treatment fluid to a second temperature lower than the first temperature;
having
the processing fluid supply unit has a flow rate adjustment mechanism that adjusts a flow rate of the processing fluid,
The fluid supply path includes:
a first branch flow path for causing the processing fluid to flow through the first heating mechanism into the processing vessel;
a second branch flow path for causing the processing fluid to flow through the second heating mechanism into the processing vessel;
having
Fluid supply system.
a first opening/closing valve is provided in the first branch flow path downstream of the first heating mechanism;
a second opening/closing valve is provided in the second branch passage downstream of the second heating mechanism,
the fluid supply passage has a bypass passage downstream of the first on-off valve and the second on-off valve, the bypass passage connecting the first branch passage and the second branch passage;
The bypass flow path is provided with a first throttle.
The fluid delivery system of claim 1 .
A control unit that controls each part of the fluid supply system,
a first opening/closing valve is provided in the first branch flow path downstream of the first heating mechanism;
a second opening/closing valve is provided in the second branch passage downstream of the second heating mechanism,
the control unit is configured to change a temperature of the processing fluid flowing through the processing vessel by exclusively opening and closing the first on-off valve and the second on-off valve.
The fluid delivery system of claim 1 .
the first heating mechanism is provided in series with the second heating mechanism;
a first discharge flow path that discharges the treatment fluid in the first branch flow path is connected to the first branch flow path;
A fluid supply system according to any one of claims 1 to 3.
the first heating mechanism is provided in parallel with the second heating mechanism,
a first discharge flow path having a first discharge valve and configured to discharge the treatment fluid in the first branch flow path is connected to the first branch flow path;
a second discharge flow path having a second discharge valve and configured to discharge the treatment fluid in the second branch flow path is connected to the second branch flow path;
A third on-off valve is provided in the second branch flow path upstream of the second heating mechanism.
A fluid supply system according to claim 2 or 3.
A control unit that controls each part of the fluid supply system,
The control unit is
loading the substrate into the processing chamber;
a step of opening the second on-off valve and the third on-off valve after the step of carrying in the processing fluid, and supplying the processing fluid at the second temperature into the processing vessel;
after the step of supplying the processing fluid at the second temperature, closing the second on-off valve and the third on-off valve and opening the first on-off valve to supply the processing fluid at the first temperature into the processing vessel;
opening the second discharge valve to reduce pressure in the second branch flow path;
Run
The step of reducing the pressure in the second branch flow path is performed in parallel with the step of supplying the processing fluid at the first temperature into the processing vessel.
The fluid delivery system of claim 5 .
A control unit that controls each part of the fluid supply system,
the control unit changes a temperature of the processing fluid flowing through the processing vessel by controlling opening and closing of the first on-off valve and the second on-off valve in accordance with a processing state of the substrate in the processing vessel.
A fluid supply system according to claim 2 or 3.
A control unit that controls each part of the fluid supply system,
the processing fluid supply unit includes a first supply flow path and a second supply flow path that are provided in parallel,
the flow rate adjustment mechanism includes a first supply valve provided in the first supply flow path and a second supply valve provided in the second supply flow path,
the control unit changes a flow rate of the processing fluid flowing through the processing vessel by controlling opening and closing of the first supply valve and the second supply valve in accordance with a processing state of the substrate in the processing vessel.
A fluid supply system according to any one of claims 1 to 3.
A control unit that controls each part of the fluid supply system,
The control unit is
loading the substrate into the processing chamber;
controlling the flow rate adjustment mechanism to supply the processing fluid to the fluid supply path at a first flow rate, and opening the second on-off valve to supply the processing fluid at the second temperature and the first flow rate into the processing vessel;
after the step of supplying the processing fluid at the first flow rate and the second temperature into the processing vessel, controlling the flow rate adjustment mechanism to supply the processing fluid at the second flow rate to the fluid supply path, and opening the first on-off valve to supply the processing fluid at the first temperature and the second flow rate into the processing vessel;
Execute
A fluid supply system according to claim 2 or 3.
A fluid supply system according to claim 7;
a discharge part having a third discharge valve and discharging the processing fluid in the processing container;
having
The control unit is
loading the substrate into the processing chamber;
controlling the flow rate adjustment mechanism to supply the processing fluid to the fluid supply path at a first flow rate, and opening the second on-off valve and closing the third exhaust valve to supply the processing fluid at the second temperature and the first flow rate into the processing vessel, thereby increasing a pressure in the processing vessel;
after the step of increasing the pressure in the processing vessel, controlling the flow rate control mechanism to supply the processing fluid to the fluid supply path at a second flow rate, and closing the second on-off valve and opening the first on-off valve to supply the processing fluid at the first temperature and the second flow rate into the processing vessel, thereby increasing the pressure in the processing vessel;
Execute
Substrate processing equipment.
1. A method for processing a substrate using a fluid supply system for supplying a fluid into a processing vessel in which a substrate is processed, comprising:
The fluid supply system comprises:
a processing fluid supply unit that supplies a processing fluid;
a fluid supply line connected to the processing fluid supply unit and the processing vessel, for allowing a temperature-adjusted processing fluid to flow through the processing vessel;
a first heating mechanism provided in the fluid supply path and configured to heat the treatment fluid to a first temperature;
a second heating mechanism provided in the fluid supply path and configured to heat the treatment fluid to a second temperature lower than the first temperature;
having
the processing fluid supply unit has a flow rate adjustment mechanism that adjusts a flow rate of the processing fluid,
The fluid supply path is
a first branch flow path for causing the processing fluid to flow through the first heating mechanism into the processing vessel;
a second branch flow path for causing the processing fluid to flow through the second heating mechanism into the processing vessel;
having
providing a fluid into a processing vessel in which the substrate is processed to process the substrate;
A method for processing a substrate.
a first opening/closing valve is provided in the first branch flow path downstream of the first heating mechanism;
a second opening/closing valve is provided in the second branch passage downstream of the second heating mechanism,
the fluid supply passage has a bypass passage downstream of the first on-off valve and the second on-off valve, the bypass passage connecting the first branch passage and the second branch passage;
The bypass flow path is provided with a first throttle.
The method of claim 11.
a first opening/closing valve is provided in the first branch flow path downstream of the first heating mechanism;
a second opening/closing valve is provided in the second branch passage downstream of the second heating mechanism,
and changing a temperature of the processing fluid caused to flow through the processing vessel by exclusively opening and closing the first on-off valve and the second on-off valve.
The method of claim 11.
the first heating mechanism is provided in series with the second heating mechanism;
a first discharge flow path that discharges the treatment fluid in the first branch flow path is connected to the first branch flow path;
The substrate processing method according to any one of claims 11 to 13.
the first heating mechanism is provided in parallel with the second heating mechanism,
a first discharge flow path having a first discharge valve and configured to discharge the treatment fluid in the first branch flow path is connected to the first branch flow path;
a second discharge flow path having a second discharge valve and configured to discharge the processing fluid in the second branch flow path is connected to the second branch flow path;
A third on-off valve is provided in the second branch flow path upstream of the second heating mechanism.
The substrate processing method according to claim 12 or 13.
loading the substrate into the processing chamber;
a step of opening the second on-off valve and the third on-off valve after the step of carrying in the processing fluid, and supplying the processing fluid at the second temperature into the processing vessel;
after the step of supplying the processing fluid at the second temperature, closing the second on-off valve and the third on-off valve and opening the first on-off valve to supply the processing fluid at the first temperature into the processing vessel;
opening the second discharge valve to reduce pressure in the second branch flow path;
having
The step of reducing the pressure in the second branch flow path is performed in parallel with the step of supplying the processing fluid at the first temperature into the processing vessel.
The method of claim 15.
a step of controlling opening and closing of the first on-off valve and the second on-off valve in response to a processing state of the substrate in the processing vessel, thereby changing a temperature of the processing fluid caused to flow through the processing vessel.
The substrate processing method according to claim 12 or 13.
the processing fluid supply unit includes a first supply flow path and a second supply flow path provided in parallel,
the flow rate adjustment mechanism includes a first supply valve provided in the first supply flow path and a second supply valve provided in the second supply flow path,
changing a flow rate of the processing fluid flowing through the processing vessel by controlling opening and closing of the first supply valve and the second supply valve in accordance with a processing state of the substrate in the processing vessel;
The substrate processing method according to any one of claims 11 to 13.
loading the substrate into the processing chamber;
controlling the flow rate adjustment mechanism to supply the processing fluid to the fluid supply path at a first flow rate, and opening the second on-off valve to supply the processing fluid at the second temperature and the first flow rate into the processing vessel;
after the step of supplying the processing fluid at the first flow rate and the second temperature into the processing vessel, controlling the flow rate adjustment mechanism to supply the processing fluid at the second flow rate to the fluid supply path, and opening the first on-off valve to supply the processing fluid at the first temperature and the second flow rate into the processing vessel;
having
The substrate processing method according to claim 12 or 13.
a third discharge valve and a discharge part for discharging the processing fluid in the processing vessel;
loading the substrate into the processing chamber;
controlling the flow rate adjustment mechanism to supply the processing fluid to the fluid supply path at a first flow rate, and opening the second on-off valve and closing the third exhaust valve to supply the processing fluid at the second temperature and the first flow rate into the processing vessel, thereby increasing a pressure in the processing vessel;
after the step of increasing the pressure in the processing vessel, controlling the flow rate control mechanism to supply the processing fluid to the fluid supply path at a second flow rate, and closing the second on-off valve and opening the first on-off valve to supply the processing fluid at the first temperature and the second flow rate into the processing vessel, thereby increasing the pressure in the processing vessel;
having
The method of claim 17.