WO2024080733A1 - Plateau de carte, socle de plateau et dispositif électronique le comprenant - Google Patents

Plateau de carte, socle de plateau et dispositif électronique le comprenant Download PDF

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Publication number
WO2024080733A1
WO2024080733A1 PCT/KR2023/015611 KR2023015611W WO2024080733A1 WO 2024080733 A1 WO2024080733 A1 WO 2024080733A1 KR 2023015611 W KR2023015611 W KR 2023015611W WO 2024080733 A1 WO2024080733 A1 WO 2024080733A1
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WO
WIPO (PCT)
Prior art keywords
tray
contact
socket
electronic device
card
Prior art date
Application number
PCT/KR2023/015611
Other languages
English (en)
Korean (ko)
Inventor
현용환
Original Assignee
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020220143972A external-priority patent/KR20240050953A/ko
Application filed by 삼성전자 주식회사 filed Critical 삼성전자 주식회사
Publication of WO2024080733A1 publication Critical patent/WO2024080733A1/fr

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K7/00—Methods or arrangements for sensing record carriers, e.g. for reading patterns
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H04B1/3816—Mechanical arrangements for accommodating identification devices, e.g. cards or chips; with connectors for programming identification devices

Definitions

  • Embodiments of the present disclosure relate to a card tray, a tray socket, and an electronic device including the same.
  • Electronic devices While portable electronic devices are becoming more diverse in their functions, devices that are more portable can have a higher competitiveness. For example, even if electronic devices have the same functions, electronic devices that are slimmer, lighter, and more compact may be preferred. Accordingly, electronic device manufacturers are developing electronic devices that are slimmer, lighter, and more compact than other products while having the same or better functions.
  • Electronic devices may include removable external components (e.g., external cards) that are optionally or essentially applied to the interior, and these external components may be increasingly miniaturized.
  • such external components may include card-type external components such as a memory card, a subscriber identification module card (SIM card), or a user information module card (UIM card).
  • SIM card subscriber identification module card
  • UIM card user information module card
  • the electronic device may include a card tray and tray socket for placing these external components.
  • the electronic device may include a plurality of antennas, and the radiation performance of the antenna is affected by the ground (GND) of the tray socket and the location where the ground is located.
  • the radiation performance of the antenna may vary depending on the ground (GND) location of the tray socket.
  • To ground the tray socket (GND), the tray socket and the front metal can be electrically connected using a conductive member. Due to the use of a conductive member, problems may arise where foreign substances are generated or foreign substances come in from the outside and stick to the conductive member. When attempting to form a ground (GND) at multiple locations, conductive members must be attached at multiple locations, but there is a limit to forming multiple ground (GND) locations due to space constraints.
  • a card tray that can ground the tray socket to ground (GND) without a conductive member, a tray socket, and an electronic device including the same can be provided.
  • GND tray socket to ground
  • a card tray that can improve antenna radiation and noise shielding performance by improving the contact structure of the tray socket and the front metal, a tray socket, and an electronic device including the same can be provided.
  • a card tray that can improve antenna radiation and noise shielding performance by forming a ground (GND) at a plurality of positions in the tray socket according to the characteristics of frequency bands used in electronic devices.
  • a tray socket and an electronic device including the same can be provided.
  • An electronic device includes a printed circuit board on which a plurality of antenna feeders and a tray socket are disposed.
  • the tray socket includes a plurality of contact parts formed at least in part to flow upward and downward.
  • the electronic device includes a card tray including a plurality of grooves formed in at least a portion of the tray body to have a predetermined area and depth.
  • the electronic device includes a conductive member electrically connected to at least one of the plurality of contact parts to form a ground.
  • a card tray, a tray socket, and an electronic device including the same can ground the tray socket to ground (GND) without a conductive member.
  • a card tray, a tray socket, and an electronic device including the same can electrically connect the tray socket and the front metal to achieve ground (GND) grounding, the location of the ground (GND) grounding point, and The number can be adjusted.
  • GND ground
  • the number can be adjusted.
  • a card tray, a tray socket, and an electronic device including the same can improve antenna radiation and noise shielding performance by improving the contact structure of the tray socket and the front metal.
  • a card tray, a tray socket, and an electronic device including the same can form a ground (GND) ground at a plurality of positions of the tray socket in accordance with the characteristics of the frequency bands used in the electronic device, so that the antenna A card tray, a tray socket, and an electronic device including the same that can improve radiation and noise shielding performance can be provided.
  • GND ground
  • FIG. 1 is a block diagram of an electronic device in a network environment according to an embodiment of the present disclosure.
  • Figure 2A is a perspective view of the front of an electronic device according to an embodiment of the present invention.
  • Figure 2b is a perspective view of the rear of an electronic device according to an embodiment of the present invention.
  • Figure 3 is an exploded perspective view of an electronic device according to an embodiment of the present invention.
  • FIG. 4 is a diagram illustrating a tray socket according to an embodiment of the present disclosure.
  • Figure 5 is a diagram showing a printed circuit board on which a tray socket of an electronic device of a comparative example is disposed.
  • FIG. 6 is a diagram illustrating a seating portion (eg, front metal) on which a tray socket of an electronic device of a comparative example is mounted (eg, supported).
  • a seating portion eg, front metal
  • FIG. 7 is a diagram illustrating a seating portion (e.g., front metal) on which a tray socket of an electronic device is seated (e.g., supported) according to an embodiment of the present disclosure.
  • a seating portion e.g., front metal
  • FIG. 8 is a diagram illustrating a card tray and a tray socket of an electronic device according to an embodiment of the present disclosure.
  • FIG. 9 is a diagram illustrating a plurality of grooves formed in a card tray and a plurality of contact portions formed in a tray socket of an electronic device according to an embodiment of the present disclosure.
  • FIG. 10 is a diagram showing a cross section of the tray socket taken along line II' of FIG. 9.
  • FIG. 11 is a diagram illustrating a state before the card tray of an electronic device is inserted into a tray socket according to an embodiment of the present disclosure.
  • FIG. 12 is a diagram showing a state after the card tray of an electronic device is inserted into a tray socket according to an embodiment of the present disclosure.
  • Figure 13 is a diagram showing positions where a plurality of grooves can be formed in the card tray and positions where a plurality of contact parts can be formed in the tray socket.
  • FIG. 14 is a diagram illustrating an example of changing the location of the grounding to improve the radiation performance of the antennas.
  • Figure 15 is a diagram showing positions where a plurality of grooves can be formed in the card tray and positions where a plurality of contact parts can be formed in the tray socket.
  • Figure 16 is a diagram showing positions where a plurality of grooves can be formed in the card tray and positions where a plurality of contact parts can be formed in the tray socket.
  • Figure 17 is a diagram showing positions where a plurality of grooves can be formed in the card tray and positions where a plurality of contact parts can be formed in the tray socket.
  • Figure 18 is a diagram showing an example of the shape of a plurality of grooves formed in a card tray.
  • FIG. 1 is a block diagram of an electronic device 101 in a network environment 100, according to one embodiment.
  • the electronic device 101 communicates with the electronic device 102 through a first network 198 (e.g., a short-range wireless communication network) or a second network 199. It is possible to communicate with the electronic device 104 or the server 108 through (e.g., a long-distance wireless communication network). According to one embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108.
  • a first network 198 e.g., a short-range wireless communication network
  • a second network 199 e.g., a long-distance wireless communication network.
  • the electronic device 101 may communicate with the electronic device 104 through the server 108.
  • the electronic device 101 includes a processor 120, a memory 130, an input module 150, an audio output module 155, a display module 160, an audio module 170, and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or may include an antenna module 197.
  • at least one of these components eg, the connection terminal 178) may be omitted, or one or more other components may be added to the electronic device 101.
  • some of these components e.g., sensor module 176, camera module 180, or antenna module 197) are integrated into one component (e.g., display module 160). It can be.
  • the processor 120 for example, executes software (e.g., program 140) to operate at least one other component (e.g., hardware or software component) of the electronic device 101 connected to the processor 120. It can be controlled and various data processing or operations can be performed. According to one embodiment, as at least part of data processing or computation, processor 120 stores commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132. The commands or data stored in the volatile memory 132 can be processed, and the resulting data can be stored in the non-volatile memory 134.
  • software e.g., program 140
  • processor 120 stores commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132.
  • the commands or data stored in the volatile memory 132 can be processed, and the resulting data can be stored in the non-volatile memory 134.
  • the processor 120 includes the main processor 121 (e.g., a central processing unit or an application processor) or an auxiliary processor 123 that can operate independently or together (e.g., a graphics processing unit, a neural network processing unit ( It may include a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor).
  • the main processor 121 e.g., a central processing unit or an application processor
  • an auxiliary processor 123 e.g., a graphics processing unit, a neural network processing unit ( It may include a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor.
  • the auxiliary processor 123 may be set to use lower power than the main processor 121 or be specialized for a designated function. You can.
  • the auxiliary processor 123 may be implemented separately from the main processor 121 or as part of it.
  • the auxiliary processor 123 may, for example, act on behalf of the main processor 121 while the main processor 121 is in an inactive (e.g., sleep) state, or while the main processor 121 is in an active (e.g., application execution) state. ), together with the main processor 121, at least one of the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) At least some of the functions or states related to can be controlled.
  • the co-processor 123 e.g., image signal processor or communication processor
  • may be implemented as part of another functionally related component e.g., camera module 180 or communication module 190. there is.
  • the auxiliary processor 123 may include a hardware structure specialized for processing artificial intelligence models.
  • Artificial intelligence models can be created through machine learning. For example, such learning may be performed in the electronic device 101 itself, where artificial intelligence is performed, or may be performed through a separate server (e.g., server 108).
  • Learning algorithms may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but It is not limited.
  • An artificial intelligence model may include multiple artificial neural network layers.
  • Artificial neural networks include deep neural network (DNN), convolutional neural network (CNN), recurrent neural network (RNN), restricted boltzmann machine (RBM), belief deep network (DBN), bidirectional recurrent deep neural network (BRDNN), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the examples described above.
  • artificial intelligence models may additionally or alternatively include software structures.
  • the memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176) of the electronic device 101. Data may include, for example, input data or output data for software (e.g., program 140) and instructions related thereto.
  • Memory 130 may include volatile memory 132 or non-volatile memory 134.
  • the program 140 may be stored as software in the memory 130 and may include, for example, an operating system 142, middleware 144, or application 146.
  • the input module 150 may receive commands or data to be used in a component of the electronic device 101 (e.g., the processor 120) from outside the electronic device 101 (e.g., a user).
  • the input module 150 may include, for example, a microphone, mouse, keyboard, keys (eg, buttons), or digital pen (eg, stylus pen).
  • the sound output module 155 may output sound signals to the outside of the electronic device 101.
  • the sound output module 155 may include, for example, a speaker or a receiver. Speakers can be used for general purposes such as multimedia playback or recording playback.
  • the receiver can be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.
  • the display module 160 can visually provide information to the outside of the electronic device 101 (eg, a user).
  • the display module 160 may include, for example, a display, a hologram device, or a projector, and a control circuit for controlling the device.
  • the display module 160 may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of force generated by the touch.
  • the audio module 170 can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module 170 acquires sound through the input module 150, the sound output module 155, or an external electronic device (e.g., directly or wirelessly connected to the electronic device 101). Sound may be output through the electronic device 102 (e.g., speaker or headphone).
  • the electronic device 102 e.g., speaker or headphone
  • the sensor module 176 detects the operating state (e.g., power or temperature) of the electronic device 101 or the external environmental state (e.g., user state) and generates an electrical signal or data value corresponding to the detected state. can do.
  • the sensor module 176 includes, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, humidity sensor, or light sensor.
  • the interface 177 may support one or more designated protocols that can be used to connect the electronic device 101 directly or wirelessly with an external electronic device (eg, the electronic device 102).
  • the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • SD card interface Secure Digital Card interface
  • audio interface audio interface
  • connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102).
  • the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).
  • the haptic module 179 can convert electrical signals into mechanical stimulation (e.g., vibration or movement) or electrical stimulation that the user can perceive through tactile or kinesthetic senses.
  • the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.
  • the camera module 180 can capture still images and moving images.
  • the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.
  • the power management module 188 can manage power supplied to the electronic device 101.
  • the power management module 188 may be implemented as at least a part of, for example, a power management integrated circuit (PMIC).
  • PMIC power management integrated circuit
  • the battery 189 may supply power to at least one component of the electronic device 101.
  • the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.
  • Communication module 190 is configured to provide a direct (e.g., wired) communication channel or wireless communication channel between electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108). It can support establishment and communication through established communication channels. Communication module 190 operates independently of processor 120 (e.g., an application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication.
  • processor 120 e.g., an application processor
  • the communication module 190 is a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., : LAN (local area network) communication module, or power line communication module) may be included.
  • a wireless communication module 192 e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module
  • GNSS global navigation satellite system
  • wired communication module 194 e.g., : LAN (local area network) communication module, or power line communication module
  • the corresponding communication module is a first network 198 (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (e.g., legacy It may communicate with an external electronic device 104 through a telecommunication network such as a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN).
  • a telecommunication network such as a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN).
  • a telecommunication network such as a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN).
  • a telecommunication network such as a cellular network, a 5G network, a next-generation communication network
  • the wireless communication module 192 uses subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 to communicate within a communication network such as the first network 198 or the second network 199.
  • subscriber information e.g., International Mobile Subscriber Identifier (IMSI)
  • IMSI International Mobile Subscriber Identifier
  • the wireless communication module 192 may support 5G networks after 4G networks and next-generation communication technologies, for example, NR access technology (new radio access technology).
  • NR access technology provides high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low latency). -latency communications)) can be supported.
  • the wireless communication module 192 may support a high frequency band (eg, mmWave band), for example, to achieve a high data rate.
  • a high frequency band eg, mmWave band
  • the wireless communication module 192 uses various technologies to secure performance in high frequency bands, for example, beamforming, massive array multiple-input and multiple-output (MIMO), and full-dimensional multiplexing. It can support technologies such as input/output (FD-MIMO: full dimensional MIMO), array antenna, analog beam-forming, or large scale antenna.
  • the wireless communication module 192 may support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., second network 199).
  • the wireless communication module 192 supports Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mmTC, or U-plane latency (e.g., 164 dB or less) for realizing URLLC.
  • Peak data rate e.g., 20 Gbps or more
  • loss coverage e.g., 164 dB or less
  • U-plane latency e.g., 164 dB or less
  • the antenna module 197 may transmit or receive signals or power to or from the outside (eg, an external electronic device).
  • the antenna module 197 may include an antenna including a radiator made of a conductor or a conductive pattern formed on a substrate (eg, PCB).
  • the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is, for example, connected to the plurality of antennas by the communication module 190. can be selected. Signals or power may be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna.
  • other components eg, radio frequency integrated circuit (RFIC) may be additionally formed as part of the antenna module 197.
  • RFIC radio frequency integrated circuit
  • the antenna module 197 may form a mmWave antenna module.
  • a mmWave antenna module includes a printed circuit board, an RFIC disposed on or adjacent to a first side (e.g., bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., mmWave band), And a plurality of antennas (e.g., array antennas) disposed on or adjacent to the second surface (e.g., top or side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band. can do.
  • a mmWave antenna module includes a printed circuit board, an RFIC disposed on or adjacent to a first side (e.g., bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., mmWave band), And a plurality of antennas (e.g., array antennas) disposed on or adjacent to the second surface (e.g., top or side) of the
  • peripheral devices e.g., bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)
  • signal e.g. commands or data
  • commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199.
  • Each of the external electronic devices 102 or 104 may be of the same or different type as the electronic device 101.
  • all or part of the operations performed in the electronic device 101 may be executed in one or more of the external electronic devices 102, 104, or 108. For example, when the electronic device 101 needs to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device 101 does not execute the function or service on its own. Alternatively, or additionally, one or more external electronic devices may be requested to perform at least part of the function or service.
  • One or more external electronic devices that have received the request may execute at least part of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device 101.
  • the electronic device 101 may process the result as is or additionally and provide it as at least part of a response to the request.
  • cloud computing distributed computing, mobile edge computing (MEC), or client-server computing technology can be used.
  • the electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing.
  • the external electronic device 104 may include an Internet of Things (IoT) device.
  • Server 108 may be an intelligent server using machine learning and/or neural networks.
  • the external electronic device 104 or server 108 may be included in the second network 199.
  • the electronic device 101 may be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.
  • Electronic devices may be of various types. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to embodiments of this document are not limited to the above-described devices.
  • first, second, or first or second may be used simply to distinguish one element from another, and may be used to distinguish such elements in other respects, such as importance or order) is not limited.
  • One (e.g. first) component is said to be “coupled” or “connected” to another (e.g. second) component, with or without the terms “functionally” or “communicatively”.
  • any of the components can be connected to the other components directly (e.g. wired), wirelessly, or through a third component.
  • module used in embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeable with terms such as logic, logic block, component, or circuit, for example. can be used
  • a module may be an integrated part or a minimum unit of the parts or a part thereof that performs one or more functions.
  • the module may be implemented in the form of an application-specific integrated circuit (ASIC).
  • ASIC application-specific integrated circuit
  • One embodiment of this document is one or more instructions stored in a storage medium (e.g., built-in memory 136 or external memory 138) that can be read by a machine (e.g., electronic device 101). It may be implemented as software (e.g., program 140) including these.
  • a processor e.g., processor 120
  • the one or more instructions may include code generated by a compiler or code that can be executed by an interpreter.
  • a storage medium that can be read by a device may be provided in the form of a non-transitory storage medium.
  • 'non-transitory' only means that the storage medium is a tangible device and does not contain signals (e.g. electromagnetic waves). This term refers to cases where data is stored semi-permanently in the storage medium. There is no distinction between temporary storage cases.
  • the method according to the embodiments disclosed in this document may be provided and included in a computer program product.
  • Computer program products are commodities and can be traded between sellers and buyers.
  • the computer program product may be distributed in the form of a machine-readable storage medium (e.g. compact disc read only memory (CD-ROM)) or via an application store (e.g. Play Store TM ) or on two user devices (e.g. It can be distributed (e.g. downloaded or uploaded) directly between smart phones) or online.
  • a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.
  • each component (e.g., module or program) of the above-described components may include a single or multiple entities, and some of the multiple entities may be separately placed in other components.
  • one or more of the above-mentioned components or operations may be omitted, or one or more other components or operations may be added.
  • multiple components eg, modules or programs
  • the integrated component may perform one or more functions of each component of the plurality of components identically or similarly to those performed by the corresponding component of the plurality of components prior to the integration. .
  • operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or , or one or more other operations may be added.
  • the display module 160 includes a bar type or plate type display (e.g., a liquid crystal display (LCD) display, an organic light emitting diode (OLED) display). You may.
  • a bar type or plate type display e.g., a liquid crystal display (LCD) display, an organic light emitting diode (OLED) display. You may.
  • LCD liquid crystal display
  • OLED organic light emitting diode
  • the display module 160 shown in FIG. 1 may include a flexible display (eg, flexible OLED display) configured to fold or unfold a screen (eg, display screen).
  • a flexible display eg, flexible OLED display
  • a screen eg, display screen
  • the display module 160 shown in FIG. 1 may include a flexible display (eg, flexible OLED display) that is slidably disposed to provide a screen (eg, display screen).
  • a flexible display eg, flexible OLED display
  • a screen eg, display screen
  • Figure 2A is a perspective view of the front of an electronic device according to an embodiment of the present invention.
  • Figure 2b is a perspective view of the rear of an electronic device according to an embodiment of the present invention.
  • the electronic device 200 (e.g., the electronic device 101 of FIG. 1 and the electronic device 300 of FIG. 3) according to an embodiment has a first side (or front) ( 210A), a second side (or back) 210B, and a side 210C surrounding the space between the first side 210A and the second side 210B.
  • the housing 210 may refer to a structure that forms part of the first surface 210A, the second surface 210B, and the side surface 210C of FIG. 1 .
  • the first surface 210A may be formed at least in part by a substantially transparent front plate 202 (eg, a glass plate including various coating layers, or a polymer plate).
  • the second surface 210B may be formed by a substantially opaque rear plate 211.
  • the back plate 211 is formed, for example, by coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of these materials. It can be.
  • the side 210C combines with the front plate 202 and the back plate 211 and may be formed by a side bezel structure (or “side member”) 218 comprising metal and/or polymer.
  • the back plate 211 and the side bezel structure 218 may be integrally formed and include the same material (eg, a metallic material such as aluminum).
  • the front plate 202 has a first region 210D that is curved from the first surface 210A toward the rear plate and extends seamlessly, the front plate 202 It can be included at both ends of the long edge of .
  • the rear plate 211 may include second regions 210E at both ends of long edges that are curved and seamlessly extended from the second surface 210B toward the front plate. there is.
  • the front plate 202 or the rear plate 211 may include only one of the first area 210D or the second area 210E.
  • the front plate 202 may not include the first area 210D and the second area 210E, but may only include a flat plane disposed parallel to the second surface 210B.
  • the side bezel structure 218 when viewed from the side of the electronic device, has a first thickness (or width), and may have a second thickness thinner than the first thickness on a side surface including the first or second area.
  • the electronic device 200 includes a display 201, an input device 203, an audio output device 207 and 214, a sensor module 204 and 219, and a camera module 205, 212, and 213. , it may include at least one of a key input device 217, an indicator (not shown), and connectors 208 and 209. In some embodiments, the electronic device 200 may omit at least one of the components (eg, the key input device 217 or an indicator) or may additionally include another component.
  • Display 201 may be visually exposed, for example, through a significant portion of front plate 202 . In some embodiments, at least a portion of the display 201 may be visually exposed through the front plate 202 forming the first surface 210A and the first area 210D of the side surface 210C. there is.
  • the display 201 may be combined with or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of touch, and/or a digitizer that detects a magnetic field-type stylus pen.
  • at least a portion of the sensor modules 204, 219, and/or at least a portion of the key input device 217 are located in the first area 210D and/or the second area 210E. can be placed.
  • the input device 203 may include a microphone 203.
  • the input device 203 may include a plurality of microphones 203 arranged to detect the direction of sound.
  • the sound output devices 207 and 214 may include speakers 207 and 214.
  • the speakers 207 and 214 may include an external speaker 207 and a receiver 214 for a call.
  • the microphone 203, speakers 207, 214, and connectors 208, 209 are disposed in the space of the electronic device 200 and are exposed to the outside through at least one hole formed in the housing 210. May be exposed to the environment.
  • the hole formed in the housing 210 may be commonly used for the microphone 203 and speakers 207 and 214.
  • the sound output devices 207 and 214 may include speakers (eg, piezo speakers) that operate without the holes formed in the housing 210.
  • the sensor modules 204 and 219 may generate electrical signals or data values corresponding to the internal operating state of the electronic device 200 or the external environmental state.
  • the sensor modules 204, 219 may include, for example, a first sensor module 204 (e.g., a proximity sensor) and/or a second sensor module (not shown) disposed on the first side 210A of the housing 210. ) (eg, fingerprint sensor), and/or a third sensor module 219 (eg, HRM sensor) disposed on the second surface 210B of the housing 210.
  • the fingerprint sensor may be disposed on the first side 210A (eg, home key button) of the housing 210, a portion of the second side 210B, or under the display 201.
  • the electronic device 200 may include sensor modules not shown, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, It may further include at least one of a humidity sensor or an illuminance sensor 204.
  • sensor modules not shown, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, It may further include at least one of a humidity sensor or an illuminance sensor 204.
  • the camera modules 205, 212, and 213 include a first camera device 105 disposed on the first side 210A of the electronic device 200, and a second camera device 112 disposed on the second side 210B. ), and/or a flash 113.
  • the camera modules 205 and 212 may include one or more lenses, an image sensor, and/or an image signal processor.
  • the flash 113 may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (eg, wide-angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device 200.
  • the key input device 217 may be disposed on the side 210C of the housing 210.
  • the electronic device 200 may not include some or all of the key input devices 217 mentioned above, and the key input devices 217 not included may include soft keys, etc. on the display 201. It can be implemented in different forms.
  • the key input device 217 may be implemented using a pressure sensor included in the display 201.
  • the indicator may be placed, for example, on the first side 210A of the housing 210.
  • the indicator may provide status information of the electronic device 200 in the form of light.
  • the light emitting device may provide, for example, a light source linked to the operation of the camera module 205.
  • Indicators may include, for example, LEDs, IR LEDs, and xenon lamps.
  • the connector holes 208 and 209 are a first connector hole 208 that can accommodate a connector (for example, a USB connector) for transmitting and receiving power and/or data with an external electronic device, and/or an external electronic device. and a second connector hole (or earphone jack) 209 that can accommodate a connector for transmitting and receiving audio signals.
  • a connector for example, a USB connector
  • a second connector hole or earphone jack
  • Some camera modules 205 among the camera modules 205 and 212, some sensor modules 204 among the sensor modules 204 and 219, or indicators may be arranged to be visually exposed through the display 201.
  • the camera module 205, the sensor module 204, or the indicator are disposed in the internal space of the electronic device 200 to come into contact with the external environment through a perforated opening up to the front plate 202 of the display 201. It can be.
  • some sensor modules 204 may be arranged to perform their functions without being visually exposed through the front plate 202 and/or display 201 in the internal space of the electronic device.
  • the area of the display 201 facing the sensor module may not need a perforated opening.
  • the side bezel structure 218 (eg, side member) may be formed of a conductive member.
  • the side bezel structure 218 may include a conductive portion 2180 segmented through a pair of non-conductive portions 2181 and 2182 spaced apart at regular intervals.
  • the conductive portion 2180 is electrically connected to a wireless communication circuit disposed inside the electronic device 200, so that it can be used as an antenna (eg, legacy antenna) operating in a designated frequency band.
  • a wireless communication circuit eg, legacy antenna
  • the electronic device 200 includes a card tray 420 (e.g., a SIM card tray) (e.g., a SIM card tray) that is detachably disposed through an opening 2101 formed through at least a portion of the side bezel structure 218. It may include the card tray 420 of FIGS. 3 and 4).
  • a card tray 420 e.g., a SIM card tray
  • a SIM card tray e.g., a SIM card tray
  • a tray socket (eg, tray socket 410 in FIGS. 3 and 4) into which the card tray 420 can be inserted may be disposed inside the opening 2101.
  • the card tray 420 may be inserted into a tray socket (eg, the tray socket 410 in FIGS. 3 and 4) through the opening 2101.
  • the card tray 420 includes a tray body 421 including a space for receiving at least one external part C1, C2, C3 (e.g., a card-type external part), and is disposed at an end of the tray body 421. It may include a tray cover 422.
  • the tray cover 422 may include a pin insertion hole 4221 formed so that at least a portion of the tray extraction pin 460 can pass through the opening 2101.
  • the tray body 421 and the tray cover 422 may be formed as one body or may be composed of a combination of different members.
  • the card tray 420 may include an insulating material and/or a metal material.
  • the card tray 420 may be made of polymer or composite material.
  • the tray body 421 and the tray cover 422 may be formed individually and assembled together.
  • different types of members may be used for the tray body 421 and the tray cover 422.
  • the tray cover 422 is a part exposed to the outside of the electronic device 200 when the card tray 420 is mounted on the electronic device 200, and is a portion of the outer surface (e.g. : Can be arranged in a manner that matches or does not match the side bezel structure (218).
  • At least one external component C2 may include a memory card.
  • the at least one external component may include a subscriber identification module card (SIM card) or a user information module card (UIM card).
  • SIM card subscriber identification module card
  • UIM card user information module card
  • at least one external component C1, C2, and C3 may be formed in different sizes.
  • the at least one external component C1, C2, and C3 may be disposed on the same side of the tray body 421 or on sides facing opposite directions in a manner that overlaps them.
  • the tray body 421 on which the at least one external component (C1, C2, C3) is mounted is mounted in the opening 2101 of the electronic device 200
  • the at least one external component (C1, C2, C3) may be electrically connected to the electronic device 200 inside the electronic device 200.
  • At least one conductive pad exposed through the card tray 420 is used for printing of the electronic device 200. It may be electrically connected by contacting at least one conductive terminal disposed on the circuit board.
  • the tray body 421 is inserted into a tray socket (e.g., the tray socket 410 of FIG. 3) disposed inside the electronic device 200, thereby A contact portion (e.g., conductive clip, C-type clip shape) disposed on at least a portion of (410)) is electrically connected in such a way that it contacts a conductive member (e.g., front metal, conductive metal, conductive part) of the electronic device 200. can be contacted.
  • a tray socket e.g., the tray socket 410 of FIG. 3
  • a contact portion e.g., conductive clip, C-type clip shape
  • a conductive member e.g., front metal, conductive metal, conductive part
  • Figure 3 is an exploded perspective view of an electronic device according to an embodiment of the present invention.
  • an electronic device 300 (e.g., the electronic device 101 of FIG. 1, the electronic device 200 of FIGS. 2A and 2B, the electronic device 700 of FIG. 7, the electronic device of FIG. 8 ( 800)) may be at least partially similar to the electronic device 200 of FIGS. 2A and 2B, or may further include other embodiments of the electronic device.
  • the electronic device 300 (e.g., the electronic device 200 of FIG. 1 or FIGS. 2A and 2B) includes a side member 310 (e.g., a side bezel structure), a first support member ( 3111) (e.g. bracket) (e.g. front metal), front plate 320 (e.g. front cover), display 330, printed circuit board 340, battery 350, second support member 360 , an antenna unit 370, and a rear plate 380 (eg, a rear cover).
  • the electronic device 300 may omit at least one of the components (e.g., the first support member 3111 or the second support member 360) or may additionally include other components.
  • an antenna may be formed with at least a portion of the side member 310 (eg, side bezel structure) in addition to the antenna unit 370.
  • At least one of the components of the electronic device 300 may be the same as, or similar to, the electronic device 101 of FIG. 1 or at least one of the components of the electronic device 200 of FIGS. 2A and 2B, , overlapping descriptions are omitted below.
  • the first support member 3111 may be disposed inside the electronic device 300 and connected to the side member 310, or may be formed integrally with the side member 310.
  • the first support member 3111 may be formed of, for example, a conductive material and/or a non-metallic (eg, polymer) material.
  • the first support member 3111 may have a display 330 coupled to one side (e.g., first side 3101) and a printed circuit board 340 coupled to the other side (e.g., second side 3102). there is.
  • the printed circuit board 340 includes a processor (e.g., processor 120 of FIG. 1), a memory (e.g., memory 130 of FIG. 1), and/or an interface (e.g., An interface 177 and a connection terminal 178) may be installed.
  • a tray socket 410 may be disposed on the printed circuit board 340.
  • the processor may include one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.
  • the memory eg. memory 130 in FIG. 1 may include, for example, volatile memory or non-volatile memory.
  • the interface e.g., interface 177 and connection terminal 178 in FIG. 1 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface. It can be included.
  • the interface may electrically or physically connect the electronic device 300 to an external electronic device and may include a USB connector, SD card/MMC connector, or audio connector.
  • the battery 350 is a device for supplying power to at least one component of the electronic device 300, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. It can be included. At least a portion of the battery 350 may be disposed on substantially the same plane as the printed circuit board 340, for example. The battery 350 may be placed integrally within the electronic device 300, or may be placed to be detachable from the electronic device 300.
  • the antenna unit 370 may be disposed between the rear plate 380 and the battery 350.
  • the antenna unit 370 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna.
  • NFC near field communication
  • MST magnetic secure transmission
  • the antenna unit 370 may perform short-distance communication with an external device or wirelessly transmit and receive power required for charging.
  • an antenna structure may be formed by a portion or a combination of the side member 310 and/or the first support member 3111.
  • the electronic device 300 may include an opening 3101 (eg, the opening 2101 in FIG. 2A) connected to the internal space through the side member 310.
  • the opening 3101 may be disposed at a position facing the tray socket 410 disposed on the printed circuit board 340 disposed in the internal space of the electronic device 300.
  • FIG. 4 is a diagram illustrating a tray socket according to an embodiment of the present disclosure.
  • a tray socket 410 may be disposed on a printed circuit board 340 (eg, printed circuit board 340 of FIG. 3 ) according to an embodiment of the present disclosure.
  • the tray socket 410 includes an upper surface 411, a lower surface 412, a side portion 413 formed between the upper surface 411 and the lower surface 412 to surround three sides, and a card tray 420 (example) : It may include an opening 414 that is open so that a SIM card tray (e.g., the card tray 420 in FIGS. 2A and 3) can be inserted.
  • the side portion 413 may include a first side portion 413a formed in the x-axis direction, a second side portion 413b formed in the -x-axis direction, and a third side portion 413c formed in the -y-axis direction. there is.
  • the opening 414 may be formed in the y-axis direction.
  • the upper surface 411 constituting the housing of the tray socket 410 may be formed of a conductive member. According to one embodiment, at least a portion of the lower surface 412, the upper surface 411, and the side portion 413 that constitute the housing of the tray socket 410 may be formed of a conductive member.
  • the tray socket 410 may secure the card tray 420 (eg, the SIM card tray) when the SIM tray (eg, the card tray 420 of FIG. 2A) is inserted.
  • a plurality of fixing parts may be formed in the tray socket 410, and the card tray 420 may be moved in a first direction (e.g., Z-axis direction) or in a direction opposite to the first direction through the plurality of fixing parts.
  • a first direction e.g., Z-axis direction
  • It can be fixed in the -z-axis direction.
  • a plurality of contact parts 922 may be disposed on the upper surface 411 of the tray socket 410.
  • the plurality of contact portions 922 e.g., conductive clip, C-type clip shape
  • the plurality of contact portions 922 may be formed to flow upward and downward with respect to the z-axis (e.g., the z-axis of FIG. 9).
  • the z-axis e.g., the z-axis of FIG. 9.
  • a no-ground structure without a ground can be implemented.
  • the electronic device e.g., of FIG. 1
  • a conductive member e.g., a first support member 3111 formed of a metal material in FIG. 3, FIG. 11
  • the front metal 1110 e.g., conductive metal
  • at least one of the plurality of contact portions 922 may be electrically connected to ground (GND).
  • Figure 5 is a diagram showing a printed circuit board on which a tray socket of an electronic device of a comparative example is disposed.
  • FIG. 6 is a diagram illustrating a seating portion (eg, front metal) on which a tray socket of an electronic device of a comparative example is mounted (eg, supported).
  • a seating portion eg, front metal
  • the electronic device 500 includes a plurality of antenna feeders 512 and 514, a printed circuit board 510 on which a tray socket 516 is disposed, and a tray socket 516. It may include a corresponding seating portion 610 (e.g., front metal) (e.g., conductive metal) (e.g., conductive part) (e.g., conductive member). For example, a conductive member 620 (eg, conductive tape, conductive pad) may be disposed on the seating portion 610.
  • the power feeder 512 may be disposed on the first side (eg, the front, the side where the tray socket 516 is disposed) of the printed circuit board 510.
  • the power feeder 514 may be disposed on the second side (eg, the back side, the side opposite to the first side) of the printed circuit board 510.
  • the radiation performance of antennas of electronic devices may be affected by the ground (GND) of the tray socket and the location where the ground is located.
  • the radiation performance of the antenna can be improved by 1dB to 2dB.
  • the tray socket and the front metal can be electrically connected using the conductive member 620.
  • the upper surface of the tray socket 516 is disposed to contact the seating portion 610, and a portion 516A of the upper surface of the tray socket 516 is in contact with the conductive member 620 to achieve grounding.
  • a card tray e.g., the card tray 420 in FIGS.
  • the conductive member 620 can be used to remove noise generated from the printed circuit board 340. Due to the use of the conductive member 620, problems may arise where foreign substances are generated or foreign substances come in from the outside and stick to the conductive member 620. When attempting to form a ground (GND) at multiple locations in the tray socket 516, conductive members 620 must be attached at multiple locations. However, due to space constraints, it is difficult to form multiple ground (GND) locations. There are limits.
  • FIG. 7 is a diagram illustrating a seating portion (e.g., front metal) on which a tray socket of an electronic device is seated (e.g., supported) according to an embodiment of the present disclosure.
  • FIG. 8 is a diagram illustrating a card tray and a tray socket of an electronic device according to an embodiment of the present disclosure.
  • the electronic device 700 includes a printed circuit board 810, a tray socket 820, a card tray 830, and a tray socket 820. It may include a corresponding seating portion 710 (e.g., front metal).
  • a plurality of antenna feeders 840 e.g., a plurality of antenna feeders 512 and 514 in FIG. 5
  • a tray socket 820 may be disposed on the printed circuit board 810 .
  • Electronic components eg, processor 120, memory 130, interface 177, and connection terminal 178 of FIG. 1
  • the conductive member 620 eg, conductive tape, conductive pad shown in FIG.
  • the card tray 830 includes a tray body (eg, the tray body 421 in FIG. 2A), and a card-shaped external component may be disposed on the tray body 421.
  • the card-type external component may include a memory card, a subscriber identification module card (SIM card), and/or a user information module card (UIM card).
  • the plurality of first parts 822 of the tray socket 820 and the plurality of second parts 832 of the card tray 830 may be arranged to correspond to each other.
  • contact portions eg, contact portions 922 of FIG. 9
  • grooves may be formed in at least some of the plurality of second portions 832 of the card tray 830 .
  • the card tray 830 when the card tray 830 is inserted into the tray socket 820, among the contact parts (eg, contact parts 922 of FIG. 9), those that are not inserted into the grooves (eg, grooves 932 of FIG. 9) Contact parts (eg, contact parts 922 in FIG. 9) are mechanically lifted. All or part of the contact portions (e.g., contact portions 922 of FIG. 9) formed in the tray socket 820 are conductive members (e.g., seating portion 710) of the electronic device 700 (e.g., the front portion of FIG. 11). The metal 1110 may be in contact with (e.g., conductive metal) (e.g., conductive part) (e.g., conductive member) and be electrically connected. All or part of the contact parts (e.g., contact parts 922 in FIG. 9) formed in the tray socket 820 may be in contact with the seating part 710 of the electronic device 700, thereby establishing ground (GND) grounding. .
  • ground ground
  • FIG. 9 is a diagram illustrating a plurality of grooves formed in a card tray and a plurality of contact portions formed in a tray socket of an electronic device according to an embodiment of the present disclosure.
  • FIG. 10 is a diagram showing a cross section of the tray socket taken along line II' of FIG. 9.
  • an electronic device e.g., the electronic device 700 of FIGS. 7 and 8
  • an electronic device may include a tray socket 920 and a card tray 930. there is.
  • an open opening 9201 (eg, opening 414 in FIG. 4) may be formed in the tray socket 920 so that the card tray 930 can be inserted.
  • a space 9202 capable of accommodating the card tray 930 may be formed inside the tray socket 920.
  • a plurality of first portions e.g., a plurality of first portions 822 in FIG. 8 are cut to form a plurality of cut portions 921.
  • a plurality of contact parts 922 e.g, a conductive clip, a C-type clip shape
  • a first cutout 921A and a second cutout 921B are formed in a plurality of areas 1, 2, 3, 4 (e.g., four corners) of the upper surface 923 of the tray socket 920. ), a third cutout 921C, and a fourth cutout 921D may be formed.
  • the portion where the first cut portion 921A is formed is integrally connected (e.g., electrically connected) with the upper surface 923 of the tray socket 920, or mechanically connected to the upper surface 923 (e.g. : electrically connected) may be formed as a first contact portion 922A (e.g., conductive clip, C-type clip shape).
  • the portion where the second cut portion 921B is formed is integrally connected (e.g., electrically connected) with the upper surface 923 of the tray socket 920, or mechanically connected to the upper surface 923 (e.g. : electrically connected) may be formed as a second contact portion 922B (e.g., conductive clip, C-type clip shape).
  • the portion where the third cutout 921C is formed is integrally connected (e.g., electrically connected) with the upper surface 923 of the tray socket 920, or mechanically connected to the upper surface 923 (e.g.
  • a third contact portion 922C e.g., electrically connected
  • conductive clip, C-type clip shape may be formed.
  • the portion where the fourth cutout 921D is formed is integrally connected (e.g., electrically connected) with the upper surface 923 of the tray socket 920, or mechanically connected to the upper surface 923 (e.g. : electrically connected) may be formed as a fourth contact portion 922D (e.g., conductive clip, C-type clip shape).
  • a fourth contact portion 922D e.g., conductive clip, C-type clip shape
  • a plurality of grooves 932 may be formed in a plurality of second parts (e.g., a plurality of second parts 832 in FIG. 8) of the upper surface 933 of the card tray 930.
  • the plurality of grooves 932 may be formed to have a constant area and a certain depth so that the plurality of contact parts 922 can be inserted.
  • a plurality of grooves 932 may be formed in at least one of the four corners of the tray socket 920.
  • a plurality of card trays 933 are provided on the upper surface 933 of the card tray 930 corresponding to the second area 2 and the third area 3 of the tray socket 920.
  • Grooves 932 may be formed.
  • a first groove 932A may be formed on the upper surface 933 of the card tray 930 corresponding to the second area 2 among the four corner portions of the tray socket 920.
  • a second groove 932B may be formed on the upper surface 933 of the card tray 930 corresponding to the third area 3 among the four corner portions of the tray socket 920.
  • grooves 932 are formed on the upper surface 933 of the card tray 930 corresponding to the first area (1) and the fourth area (4) among the four corner portions of the tray socket 920. It doesn't work.
  • the upper surface 933 of the card tray 930 corresponding to the first area 1 and the fourth area 4 among the four corner portions of the tray socket 920 may be formed to be flat.
  • the number of contact portions 922 (e.g., conductive clip, C-type clip shape) and the number of grooves 932 may be the same or different.
  • FIG. 9 shows an example in which four contact portions 922 are formed in the tray socket 920 and two grooves 932 are formed in the card tray 930.
  • the first contact part 922A, the second contact part 922B, and the third contact part 922C are formed in the tray socket 920.
  • the second contact portion 922B may be fitted (e.g., inserted) into the first groove 932A formed in the tray socket 920
  • the third contact portion ( 922C) may be fitted (eg, inserted) into the second groove 932B formed in the tray socket 920.
  • grooves 932 are not formed in the portion of the card tray 930 corresponding to the first contact portion 922A and the fourth contact portion 922D of the tray socket 920, so that the grooves 932 are formed flat. You can.
  • the first contact portion 922A and the fourth contact portion 922D of the tray socket 920 are directed upward by the flat upper surface of the card tray 930. It can be lifted (e.g., pushed, protruded, raised) in a direction (e.g., z-axis direction, upward).
  • the first contact portion 922A and the fourth contact portion 922D of the tray socket 920 are lifted (e.g., pushed, protruded, raised) in an upward direction (e.g., z-axis direction, upward direction).
  • the first contact portion 922A and the fourth contact portion 922D of the tray socket 920 are connected to a conductive member (e.g., the seating portion 710 of FIG. 7) of an electronic device (e.g., the electronic device 700 of FIG. 7). )), and grounding (GND) can be achieved.
  • FIG. 11 is a diagram 1100 showing a state before the card tray of an electronic device is inserted into a tray socket according to an embodiment of the present disclosure.
  • FIG. 12 is a diagram 1200 showing a state after the card tray of an electronic device is inserted into a tray socket according to an embodiment of the present disclosure.
  • FIG. 11 is a diagram showing a cross section taken along line II' of FIG. 9.
  • the tray socket 920 has an opening 9201 (e.g., opening 414 in FIG. 4) so that the card tray 930 can be inserted. )) can be formed.
  • a space 9202 capable of accommodating the card tray 930 may be formed inside the tray socket 920.
  • the first contact portion 922A (e.g., conductive clip, C type) formed in the first area 1 of the tray socket 920 clip shape) may be lifted (e.g., pushed, protruded, raised) in an upward direction (e.g., z-axis direction, upward direction).
  • the first contact portion 922A (e.g., conductive clip, C-type clip shape) formed in the first area (1) of the tray socket 920 is connected to the front metal 1110 (e.g., the seating portion 710 of FIG. 7). It can be electrically connected by contacting a conductive part (e.g. a conductive part, a conductive metal).
  • grooves 932 are not formed in the upper surface 933 of the card tray 930 corresponding to the first area 1 of the tray socket 920, and the first contact portion 922A (e.g., conductive Clip, C-type clip shape) may be lifted (e.g., pushed, protruded, raised) in an upward direction (e.g., z-axis direction, upward direction).
  • first contact portion 922A e.g., conductive Clip, C-type clip shape
  • the first contact portion 922A (e.g., conductive clip, C-type clip shape) comes into contact with the upper surface of the card tray 930, the first contact portion 922A (e.g., conductive clip, C-type clip shape) It can be lifted (e.g., pushed, protruded, raised) in an upward direction (e.g., z-axis direction, upward direction).
  • the first contact portion 922A (e.g., conductive clip, C-type clip shape) formed in the first area (1) of the tray socket 920 is lifted upward (e.g., in the z-axis direction) (e.g., pushed upward).
  • the front metal 1110 e.g., the seating portion 710 of FIG. 7 of the electronic device (e.g., the electronic device 700 of FIGS. 7 and 9) (e.g., a conductive portion, It may be electrically connected (1220) by contacting a conductive metal.
  • the first contact portion 922A e.g., conductive clip, C-type clip shape
  • ground ground
  • the first contact portion 922A (e.g., conductive clip, C-type clip shape) formed in the first area (1) of the tray socket 920 is connected to the front metal 1110 (e.g., the seating portion 710 of FIG. 7). )) (e.g., conductive part, conductive metal, conductive member) may be electrically connected to create a ground (GND) grounding point.
  • the front metal 1110 e.g., the seating portion 710 of FIG. 7).
  • the fourth contact portion 922D (e.g., conductive clip, C type) formed in the fourth region 4 of the tray socket 920 clip shape) may be lifted (e.g., pushed, protruded, raised) in an upward direction (e.g., z-axis direction, upward direction).
  • the fourth contact portion 922D (e.g., conductive clip, C-type clip shape) formed in the fourth region (4) of the tray socket 920 is connected to the front metal 1110 (e.g., the seating portion 710 of FIG. 7). It can be electrically connected by contacting a conductive part (e.g. a conductive part, a conductive metal).
  • grooves 932 are not formed in the upper surface 933 of the card tray 930 corresponding to the fourth area 4 of the tray socket 920, and the fourth contact portion 922D (e.g., conductive Clip, C-shaped clip shape) may be lifted (e.g., pushed, protruded, raised) in an upward direction (e.g., z-axis direction, upward direction).
  • the fourth contact portion 922D e.g., conductive Clip, C-shaped clip shape
  • the fourth contact portion 922D (e.g., conductive clip, C-type clip shape) comes into contact with the upper surface of the card tray 930, the fourth contact portion 922D (e.g., conductive clip, C-type clip shape) It can be lifted (e.g., pushed, protruded, raised) in an upward direction (e.g., z-axis direction, upward direction).
  • the fourth contact portion 922D (e.g., conductive clip, C-type clip shape) formed in the fourth region (4) of the tray socket 920 is lifted upward (e.g., in the z-axis direction) (e.g., pushed upward).
  • the fourth contact portion 922D e.g., conductive clip, C-type clip shape
  • the front metal 1110 e.g., seating portion 710 of FIG. 7
  • the front metal 1110 e.g., seating portion 710 of FIG. 7
  • ground e.g., ground
  • the fourth contact portion 922D (e.g., conductive clip, C-type clip shape) formed in the fourth region 4 of the tray socket 920 is connected to the front metal 1110 (e.g., the seating portion 710 of FIG. 7). )) (e.g., conductive part, conductive metal, conductive member) may be electrically connected to create a ground (GND) grounding point.
  • the upper surface 933 of the card tray 930 corresponds to the second contact portion 922B (e.g., conductive clip, C-type clip shape) formed in the second area 2 of the tray socket 920.
  • a first groove 932A may be formed.
  • the second contact portion 922B e.g., conductive clip, C-type clip shape
  • the second contact portion 922B e.g., conductive clip, C-type clip shape
  • the second contact portion 922B e.g., conductive clip, C-type clip shape
  • the portion 922B e.g., conductive clip, C-type clip shape
  • the front metal 1110 e.g., conductive part, conductive metal, conductive member
  • non-contact 1230 e.g., electrically insulated
  • the card tray 930 can be fixed so that it does not come off the tray socket 920.
  • the upper surface 933 of the card tray 930 corresponds to the third contact portion 922C (e.g., conductive clip, C-type clip shape) formed in the third area 3 of the tray socket 920.
  • a second groove 932B may be formed.
  • the third contact portion 922C e.g., conductive clip, C-type clip shape
  • the third contact portion 922C e.g., conductive clip, C-type clip shape
  • the third contact portion 922C e.g., conductive clip, C-type clip shape
  • the portion 922C e.g., conductive clip, C-type clip shape
  • the front metal 1110 e.g., conductive part, conductive metal, conductive member
  • NND ground
  • the card tray 930 can be fixed so that it does not come off the tray socket 920.
  • Figure 13 is a diagram showing positions where a plurality of grooves can be formed in the card tray and positions where a plurality of contact parts can be formed in the tray socket.
  • a plurality of contact portions 1322 (e.g., the tray socket 920 of FIGS. 9 to 12) formed in the tray socket 1320 (e.g., the tray socket 920 of FIGS. 9 to 12).
  • the number and location of the plurality of contact portions 922 and the plurality of grooves 1332 (e.g., the plurality of grooves in FIG. 9) formed in the card tray 1330 (e.g., the card tray 930 in FIGS. 9 and 12)
  • the number and location of (932)) can be adjusted.
  • contact portions 1322A to 1322F may be formed in the tray socket 1320. It is not limited to this, and 5 or less contact parts may be formed in the tray socket 1320, and 7 or more contact parts may be formed in the tray socket 1320.
  • the tray socket 1320 includes a first contact part 1322A, a second contact part 1322B, a third contact part 1322C, a fourth contact part 1322D, a fifth contact part 1322E, and the sixth contact portion 1322F may all be formed, including the first contact portion 1322A, the second contact portion 1322B, the third contact portion 1322C, the fourth contact portion 1322D, and the fifth contact portion 1322A.
  • One to five of the contact portion 1322E and the sixth contact portion 1322F may be formed. It is not limited to this, and a contact portion may not be formed in the tray socket 1320.
  • six grooves 1332A to 1332F may be formed in the card tray 1330. Not limited to this, 5 or less grooves may be formed in the card tray 1330, and 7 or more grooves may be formed.
  • the card tray 1330 has a first groove (1332A), a second groove (1332B), a third groove (1332C), a fourth groove (1332D), a fifth groove (1332E), and a sixth groove (1332E). 1332F) may all be formed, and the first groove 1332A, the second groove 1332B, the third groove 1332C, the fourth groove 1332D, the fifth groove 1332E, and the sixth groove (1332E) 1332F), 1 to 5 may be formed. It is not limited to this, and the card tray 1330 may not have a groove formed therein.
  • the plurality of contact parts 1322 and the front metal e.g. :
  • the position and number of contacts where the front metal 1110 of FIGS. 11 and 12 (e.g., the seating portion 710 of FIG. 7) (e.g., conductive part, conductive metal, and conductive member) are contacted can be adjusted.
  • the tray socket 1320 and the front metal 1110 e.g., the seating portion 710 in FIG. 7 can be electrically connected to achieve ground (GND) grounding, and the location of the ground (GND) grounding point and number can be adjusted.
  • the tray socket 1320 and the front metal 1110 e.g. Since there is no part in electrical contact with the seating portion 710 of FIG. 7, a groundless structure can be implemented.
  • the position and number of the plurality of contact parts 1322 of the tray socket 1320 can be adjusted within the allowable area of the tray socket 1320.
  • the number and position of the plurality of grooves 1332 of the card tray 1330 can be adjusted within the allowable area of the card tray 1330.
  • the radiation performance of the antenna can be improved by 1dB to 2dB.
  • the effect of static electricity generated when the card tray 1330 is inserted into the tray socket 1320 can be substantially offset (or reduced), and noise generated from the printed circuit board can be removed (or reduced).
  • FIG. 14 is a diagram illustrating an example of changing the location of the grounding to improve the radiation performance of the antennas.
  • the electronic device 1400 includes a plurality of antenna feeders 1440 and 1450 (e.g., a plurality of antenna feeders 512 and 514 of FIG. 5 ). , a tray socket 1420 (e.g., the tray socket 920 of FIG. 9), and a printed circuit board 1410 on which electronic components are disposed.
  • the radiation performance of the antennas of the electronic device 1400 may be affected by the ground (GND) of the tray socket 1420 and the location where the ground is located.
  • the radiation performance of the antenna can be improved by adjusting the number and location of the ground (GND) of the tray socket 1420.
  • WIFI 2.4G TRP total radiated power
  • TIS total isotropic sensitivity
  • RSE radiated spurious emissions
  • a plurality of contact parts 1422 can be formed in four areas of the tray socket 1420, including a first contact part 1422A, a second contact part 1422B, and a third contact part 1422C. , and the fourth contact portion 1422D may be all formed, or one to three may be selectively formed.
  • the number and location of the ground (GND) applicable to the tray socket 1420 can be adjusted. It is not limited to this, and five or more contact units may be formed.
  • a first contact portion 1422A may be formed corresponding to the first position of the tray socket 1420
  • a fourth contact portion 1422D may be formed corresponding to the fourth position of the tray socket 1420.
  • the second contact part 1422B corresponding to the 2nd position of the tray socket 1420
  • the third contact part 1422C corresponding to the 3rd position of the tray socket 1420.
  • a groove is not formed at the position of the first contact portion 1422A of the tray socket 1420 and the corresponding card tray (e.g., the card tray 920 in FIG. 9 and the card tray 1330 in FIG. 13). It may not be possible. A groove may not be formed at the position of the fourth contact portion 1422B of the tray socket 1420 and the corresponding card tray (e.g., the card tray 920 in FIG. 9 and the card tray 1330 in FIG. 13). For example, a groove may be formed at the position of the second contact portion 1422B of the tray socket 1420 and the corresponding card tray (eg, card tray 920 in FIG. 9). A groove may be formed at the position of the fourth contact portion 1422D of the tray socket 1420 and the corresponding card tray (eg, card tray 920 in FIG. 9).
  • the first contact portion 1422A and the fourth contact portion 1422B of the tray socket 1420 are connected to the front metal (e.g., the front metal 1110 of FIG. 12) (e.g., the seating portion 710 of FIG. 7). )) is electrically contacted, and grounding can be achieved.
  • the first contact portion 1422A and the fourth contact portion 1422B of the tray socket 1420 are electrically connected to the front metal (e.g., the front metal 1110 in FIG. 12) (e.g., the seating portion 710 in FIG. 7).
  • a grounding point can be created in two places by contacting the contact point.
  • the second contact portion 1422B and the third contact portion 1422C of the tray socket 1420 are not in contact (e.g., electrically insulated) with the front metal (e.g., the front metal 1110 of FIG. 12) and are grounded. may not be formed.
  • Figure 15 is a diagram showing positions where a plurality of grooves can be formed in the card tray and positions where a plurality of contact parts can be formed in the tray socket.
  • an electronic device (e.g., the electronic device 700 of FIGS. 7 and 8 ) according to an embodiment of the present disclosure may include a tray socket 1520 and a card tray 1530.
  • an open opening (e.g., opening 414 in FIG. 4 and opening 9201 in FIG. 9) may be formed in the tray socket 1520 so that the card tray 1530 can be inserted.
  • a space (eg, space 9202 in FIGS. 10 and 11) may be formed inside the tray socket 1520 to accommodate the card tray 1530.
  • a plurality of portions of the upper surface of the tray socket 1520 may be cut to form a plurality of cut portions (eg, a plurality of cut portions 921 in FIG. 9 ).
  • a plurality of contact parts 1522 e.g., conductive clip, C-type clip shape
  • a plurality of regions (1, 2, 3, 4) of the upper surface of the tray socket 1520 e.g., four corner portions
  • a plurality of contact portions 1522 may be formed in the area 5 and the sixth area 6 between the third area 3 and the fourth area 4.
  • a first contact part 1522A, a second contact part 1522B, a third contact part 1522C, and a fourth contact part 1522D may be formed at the four corners of the tray socket 1520. You can.
  • the fifth contact portion 1522E may be formed in the middle area (e.g., the fifth area 5) between the corners of the upper part of the tray socket 1520.
  • the sixth contact portion 1522F may be formed in the middle area (e.g., sixth area 6) between the corners of the lower end of the tray socket 1520.
  • first contact part 1522A, the second contact part 1522B, the third contact part 1522C, the fourth contact part 1522D, the fifth contact part 1522E, and the sixth contact part ( 1522F) All can be formed.
  • first contact part 1522A, the second contact part 1522B, the third contact part 1522C, the fourth contact part 1522D, the fifth contact part 1522E, and the sixth contact part may be optionally formed.
  • a contact portion may not be formed in the tray socket 1520. If a contact part is not formed in the tray socket 1520, a no-ground structure without a ground (GND) can be implemented.
  • GND ground
  • a plurality of grooves 1532 may be formed in a plurality of portions of the upper surface of the card tray 1530.
  • the card tray 1530 corresponding to the first contact part 1522A, the second contact part 1522B, the third contact part 1522C, and the fourth contact part 1522D of the tray socket 1520.
  • a first groove 1532A, a second groove 1532B, a third groove 1532C, and a fourth groove 1532D may be formed in the areas.
  • No grooves are formed in the areas 1543 and 1536 of the card tray 1530 corresponding to the fifth contact portion 1522E and the sixth contact portion 1522F of the tray socket 1520.
  • six grooves may be formed in portions corresponding to the first to sixth regions (1, 2, 3, 4, 5, 6) of the tray socket 1520.
  • no ground without ground (GND) The structure can be implemented.
  • the card tray 1530 when the card tray 1530 is inserted into the tray socket 1520, the card tray 1530 corresponding to the fifth contact part 1522E and the sixth contact part 1522F of the tray socket 1520 Since grooves are not formed in the portion of the tray socket 1520, the fifth contact portion 1522E and the sixth contact portion 1522f are lifted upward (e.g., z-axis direction, upward direction) (e.g., millimeter). It can be (er, protruding, raised).
  • the fifth contact portion 1522E and the sixth contact portion 1522f of the tray socket 1520 are lifted (e.g., pushed, protruded, raised) in an upward direction (e.g., z-axis direction, upward direction) and ground.
  • the front metal e.g., the front metal 1110 of FIG. 12
  • the front metal e.g., the seating portion 710 of FIG. 7
  • grounding can be achieved.
  • the fifth contact portion 1522E and the sixth contact portion 1522F of the tray socket 1520 are electrically connected to the front metal (e.g., the front metal 1110 in FIG. 12) (e.g., the seating portion 710 in FIG. 7).
  • a grounding point can be created in two places by contacting the contact point.
  • FIG. 15 six contact portions 1522 are formed in the tray socket 1520 and four grooves 1532 are formed in the card tray 1530, but the present invention is not limited thereto, and the tray socket 1520
  • the number and location of contact portions formed in the card tray 1530 and the number and location of grooves formed in the card tray 1530 may be adjusted according to the radiation performance of antennas disposed in the electronic device.
  • Figure 16 is a diagram showing positions where a plurality of grooves can be formed in the card tray and positions where a plurality of contact parts can be formed in the tray socket.
  • an electronic device (e.g., the electronic device 700 of FIGS. 7 and 8) according to an embodiment of the present disclosure may include a tray socket 1620 and a card tray 1630.
  • an open opening (e.g., opening 414 in FIG. 4 and opening 9201 in FIG. 9) may be formed in the tray socket 1620 so that the card tray 1630 can be inserted.
  • a space (eg, space 9202 in FIGS. 10 and 11 ) may be formed inside the tray socket 1620 to accommodate the card tray 1630.
  • a plurality of portions of the upper surface of the tray socket 1620 may be cut to form a plurality of cut portions (eg, a plurality of cut portions 921 in FIG. 9 ).
  • a plurality of contact parts 1622 e.g., a conductive clip, C-type clip shape
  • a plurality of contact parts 1622 may be formed in a plurality of areas 1, 2, 3, 4 (eg, four corners) of the upper surface of the tray socket 1620.
  • a first contact part 1622A, a second contact part 1622B, a third contact part 1622C, and a fourth contact part 1622D may be formed at the four corners of the tray socket 1620. You can.
  • first contact part 1622A, the second contact part 1622B, the third contact part 1622C, and the fourth contact part 1622D may be formed.
  • one to three of the first contact part 1622A, the second contact part 1622B, the third contact part 1622C, and the fourth contact part 1622D may be formed selectively.
  • a contact portion may not be formed in the tray socket 1620. If a contact part is not formed in the tray socket 1620, a no-ground structure without a ground (GND) can be implemented.
  • GND ground
  • a plurality of grooves 1632 may be formed in a plurality of portions of the upper surface of the card tray 1630.
  • the card tray 1630 corresponding to the first contact portion 1622A, second contact portion 1622B, third contact portion 1622C, and fourth contact portion 1622D of the tray socket 1620.
  • a first groove 1632A, a second groove 1632B, and a third groove 1632C may be formed in the areas.
  • a fourth groove 1632D is formed in the area of the card tray 1630 corresponding to the middle portion 5 between the first contact portion 1622A and the second contact portion 1622B of the tray socket 1620. can be formed.
  • a fifth groove 1632D is formed in the area of the card tray 1630 corresponding to the middle portion 6 between the third contact portion 1622C and the fourth contact portion 1622D of the tray socket 1620. can be formed.
  • no groove is formed in the area 1634 of the card tray 1630 corresponding to the fourth contact portion 1622D of the tray socket 1620.
  • six grooves may be formed in portions corresponding to the first to sixth regions (1, 2, 3, 4, 5, 6) of the tray socket 1560.
  • no ground without ground (GND) The structure can be implemented.
  • a groove is formed in the area 1634 of the card tray 1630 corresponding to the fourth contact portion 1622D of the tray socket 1620. If not formed, the fourth contact portion 1622D of the tray socket 1620 may be lifted (e.g., pushed, protruded, raised) in an upward direction (e.g., z-axis direction, upward direction).
  • the front metal e.g., FIG. 12
  • the front metal 1110 of FIG. 7 may be electrically contacted with the seating portion 710 of FIG. 7 to achieve grounding.
  • the fourth contact portion 1622D of the tray socket 1620 is electrically contacted with the front metal (e.g., the front metal 1110 in FIG. 12 and the seating portion 710 in FIG. 7) to create a ground ground point at one location. You can.
  • FIG. 16 it is shown and explained that four contact portions 1622 are formed in the tray socket 1620 and five grooves 1632 are formed in the card tray 1630, but the present invention is not limited thereto, and the tray socket 1620
  • the number and location of contact portions formed in the card tray 1630 and the number and location of grooves formed in the card tray 1630 may be adjusted according to the radiation performance of antennas disposed in the electronic device.
  • Figure 17 is a diagram showing positions where a plurality of grooves can be formed in the card tray and positions where a plurality of contact parts can be formed in the tray socket.
  • an electronic device (e.g., the electronic device 700 of FIGS. 7 and 8 ) according to an embodiment of the present disclosure may include a tray socket 1720 and a card tray 1730.
  • an open opening (e.g., opening 414 in FIG. 4 and opening 9201 in FIG. 9) may be formed in the tray socket 1720 so that the card tray 1730 can be inserted.
  • a space (eg, space 2902 in FIGS. 10 and 11) may be formed inside the tray socket 1720 to accommodate the card tray 1730.
  • a plurality of portions of the upper surface of the tray socket 1720 may be cut to form a plurality of cut portions (eg, a plurality of cut portions 921 in FIG. 9 ).
  • a plurality of contact parts 1722 e.g., a conductive clip, C-type clip shape
  • a plurality of contact portions 1722 may be formed.
  • a first contact part (1722A), a second contact part (1722B), a third contact part (1722C), and a third contact part (1722C) are attached to the four corner portions (1, 2, 3, 4) of the tray socket 1720.
  • 4 contact portions 1722D may be formed.
  • the fifth contact part 1722F may be formed in the area 6 between the third contact part 1722C and the fourth contact part 1722D.
  • first contact part (1722A), the second contact part (1722B), the third contact part (1722C), the fourth contact part (1722D), and the fifth contact part (1722F) Dogs can also be formed selectively.
  • a plurality of grooves 1732 may be formed in a plurality of portions of the upper surface of the card tray 1730.
  • a first groove 1732A may be formed in an area of the card tray 1730 corresponding to the second contact portion 1722B of the tray socket 1720.
  • a second groove 1732B may be formed in an area of the card tray 1730 corresponding to the third contact portion 1722C and the fifth contact portion 1722F of the tray socket 1720.
  • the first groove 1732A may have a larger area than the second contact portion 1722B of the tray socket 1720 and may be formed to be long in the first direction (eg, x-axis direction).
  • the first groove 1732A may be formed in an area into which one or two or more contact parts formed in the tray socket 1720 can be inserted.
  • the second groove 1732B has a larger area than the third contact portion 1722C and the fifth contact portion 1722F of the tray socket 1720 and is long in the first direction (e.g., x-axis direction). It can be formed into a shape.
  • the second groove 1732B may be formed in an area into which one or two or more contact parts formed in the tray socket 1720 can be inserted.
  • first groove 1732A and the second groove 1732B may be formed to have different areas.
  • first groove 1732A and the second groove 1732B may be formed to have the same area.
  • a groove may not be formed in the area 1734 of the card tray 1730 corresponding to the first contact portion 1722A of the tray socket 1720.
  • a groove may not be formed in the area 1736 of the card tray 1730 corresponding to the fourth contact portion 1722D of the tray socket 1720.
  • a groove is formed in the area 1734 of the card tray 1730 corresponding to the first contact portion 1722A of the tray socket 1720. If not formed, the first contact portion 1722A of the tray socket 1720 may be lifted (e.g., pushed, protruded, raised) in an upward direction (e.g., z-axis direction, upward direction).
  • a groove is not formed in the area 1736 of the card tray 1730 corresponding to the fourth contact portion 1722D of the tray socket 1720, so that the tray socket 1720 does not have a groove.
  • the fourth contact portion 1722D of 1720 may be lifted (e.g., pushed, protruded, raised) in an upward direction (e.g., z-axis direction, upward direction).
  • the first contact portion 1722A and the fourth contact portion 1722D of the tray socket 1720 are lifted (e.g., pushed, protruded, raised) in an upward direction (e.g., z-axis direction, upward direction) and ground.
  • the front metal e.g., the front metal 1110 of FIG. 12
  • the front metal e.g., the seating portion 710 of FIG. 7
  • grounding can be achieved.
  • the first contact portion 1722A and the fourth contact portion 1722D of the tray socket 1720 are electrically connected to the front metal (e.g., the front metal 1110 in FIG. 12) (e.g., the seating portion 710 in FIG. 7).
  • a grounding point can be created in two places by contacting the contact point.
  • FIG. 17 it is shown and explained that five contact portions 1722 are formed in the tray socket 1720 and two grooves 1732 are formed in the card tray 1730, but the present invention is not limited thereto, and the tray socket 1720
  • the number and location of contact portions formed in the card tray 1730 and the number and location of grooves formed in the card tray 1730 may be adjusted according to the radiation performance of antennas disposed in the electronic device.
  • Figure 18 is a diagram showing an example of the shape of a plurality of grooves formed in a card tray.
  • a tray socket 1830 (e.g., tray socket 930 of Figure 9, tray socket 1530 of Figure 15, tray socket 1630 of Figure 16, Figure 17)
  • One or more grooves 1832 formed in the tray socket 1730 may include an inclined surface 1832A at a certain angle.
  • a tray socket 1830 (e.g., tray socket 930 in FIG. 9, tray socket 1530 in FIG. 15, tray socket 1630 in FIG. 16, tray socket 1730 in FIG. 17)
  • One or more grooves 1832 formed in may include a curved surface 1834A of a certain curvature.
  • An inclined surface 1832A or a curved surface 1834A is formed in the plurality of grooves 1832 to form contact parts (e.g., conductive clip, C-type clip shape) (e.g., contact parts 922 in FIG. 9, contact parts in FIG. 15). (1522), the contact parts 1622 of FIG. 16, and the contact parts 1722 of FIG. 17) are inserted (e.g., inserted) and detached to reduce friction and prevent the generation of foreign substances due to grinding of the devices. You can.
  • contact parts e.g., conductive clip, C-type clip shape
  • the main (mail) RF support bands of electronic devices have different frequency bands depending on the region, so the antenna radiation specifications may vary.
  • Table 2 among the frequency bands used in the global and American regions in MB 4rx, the underlined frequency bands have different main (mail) RF support bands.
  • the antenna radiation specifications also vary.
  • Card tray (e.g., card tray 930 in FIG. 9, card tray 1530 in FIG. 15, card tray 1630 in FIG. 16, card tray 1730 in FIG. 17) according to an embodiment of the present disclosure
  • An electronic device (e.g., tray socket 1720 of FIG. 17) including a tray socket (e.g., tray socket 920 of FIG. 9, tray socket 1520 of FIG. 15, tray socket 1620 of FIG. 16, tray socket 1720 of FIG. 17).
  • the electronic device 700 of FIGS. 7 and 8) adjusts the number and position of the contact portion of the tray socket and the number and position of the grooves of the card tray, thereby controlling the area in which the electronic device is used (e.g., Global, Europe, North America, Central America). , South America, Asia, Africa, and Oceania), the tray socket can be grounded.
  • An electronic device (e.g., the electronic device 101 of FIG. 1, the electronic device 200 of FIGS. 2A and 2B, the electronic device 300 of FIG. 3, the electronic device of FIGS. 7 and 8
  • the device 700 includes a plurality of antenna feeders (e.g., a plurality of antenna feeders 512 and 514 in FIG. 5 and a plurality of antenna feeders 1440 and 1450 in FIG. 14) and a tray socket ( Example: Tray socket 920 in FIG. 9, tray socket 1420 in FIG. 14, tray socket 1520 in FIG. 15, tray socket 1620 in FIG. 16, tray socket 1720 in FIG. 17) are disposed. It includes a printed circuit board (e.g., the printed circuit board 340 of FIG.
  • the tray sockets 920, 1420, 1520, 1620, and 1720 have a plurality of contact parts formed at least in part to flow upward and downward (e.g., a plurality of contact parts 922 in FIG. 9, a plurality of contacts in FIG. 15). It includes parts 1522, a plurality of contact parts 1622 in FIG. 16, and a plurality of contact parts 1722 in FIG. 17).
  • the electronic devices 101, 200, 300, and 700 include a plurality of grooves (e.g., a plurality of grooves in FIG. 9) formed in at least a portion of a tray body (e.g., the tray body 421 in FIG. 2A) to have a predetermined area and depth.
  • a card tray (e.g., card tray 930 of FIG. 9) including grooves 932, a plurality of grooves 1532 of FIG. 15, a plurality of grooves 1632 of FIG. 16, and a plurality of grooves 1732 of FIG. 17. ), card tray 1530 in FIG. 15, card tray 1630 in FIG. 16, and card tray 1730 in FIG. 17).
  • the electronic devices 101, 200, 300, and 700 are electrically connected to at least one of the plurality of contact parts 922, 1522, 1622, and 1722 and form a ground ground (e.g., a conductive member in FIGS. 11 and 12). Includes front metal (1110).
  • a first contact part among the plurality of contact parts (922, 1522, 1622, and 1722) may be formed in a position that does not correspond to the plurality of grooves (932, 1532, 1632, and 1732).
  • a second contact part among the plurality of contact parts 922, 1522, 1622, and 1722 may be formed at a position corresponding to one of the plurality of grooves 932, 1532, 1632, and 1732.
  • the first contact part is connected to the card tray (930, 1530, It may be lifted by 1630 and 1730 and make electrical contact with the conductive member 1110.
  • the second contact part is connected to the card tray (930, 1530, 1630). , 1730) and is inserted into one of the plurality of grooves 932, 1532, 1632, and 1732 formed in the groove 1730 and does not contact the conductive member 1110.
  • a third contact part among the plurality of contact parts (922, 1522, 1622, and 1722) may be formed in a position that does not correspond to the plurality of grooves (932, 1532, 1632, and 1732).
  • a fourth contact part may be formed at a position corresponding to one of the plurality of grooves (932, 1532, 1632, and 1732).
  • the first contact part and the conductive member 1110 may be electrically contacted to form one ground contact point.
  • the third contact part is connected to the card tray (930, 1530, It may be lifted by 1630 and 1730 and make electrical contact with the conductive member 1110.
  • the fourth contact part is connected to the card tray (930, 1530, It is inserted into one of the plurality of grooves 932, 1532, 1632, and 1732 formed in 1630 and 1730 and does not contact the conductive member 1110.
  • the first contact part and the third contact part may be in electrical contact with the conductive member 1110 to form two ground points.
  • the number of the plurality of contact portions 922, 1522, 1622, and 1722 and the number of the plurality of grooves 932, 1532, 1632, and 1732 may be formed to be the same.
  • the number of the plurality of contact portions 922, 1522, 1622, and 1722 and the number of the plurality of grooves 932, 1532, 1632, and 1732 may be formed differently.
  • the plurality of contact parts 922, 1522, 1622, and 1722 include first to fourth contact parts formed at corner portions of the tray sockets 920, 1420, 1520, 1620, and 1720. It can be included.
  • the plurality of contact parts (922, 1522, 1622, 1722) are formed in the middle between the upper edge portions of the tray sockets (920, 1420, 1520, 1620, 1720). It may include a contact part, and a sixth contact part formed in the middle between lower edge portions of the tray sockets 920, 1420, 1520, 1620, and 1720.
  • the plurality of grooves 932, 1532, 1632, and 1732 may be formed at positions corresponding to one to five of the first to sixth contact parts.
  • the plurality of grooves 932, 1532, 1632, and 1732 may be formed at positions corresponding to all of the first to sixth contact parts.
  • the plurality of grooves 932, 1532, 1632, and 1732 may include inclined surfaces of a certain angle.
  • the plurality of grooves 932, 1532, 1632, and 1732 may include a curved surface with a certain curvature.
  • one groove and one contact part are formed to correspond, so that one contact part can be inserted into one groove.
  • one groove and a plurality of contact parts (922, 1522, 1622, 1722) are formed to correspond, so that a plurality of contact parts (922, 1522, 1622, 1722) can be inserted into one groove. there is.
  • the conductive member 1110 may include the front metal of the electronic devices 101, 200, 300, and 700.
  • a card tray, a tray socket, and an electronic device including the same can ground the tray socket to the ground (GND) without a conductive member.
  • a card tray, a tray socket, and an electronic device including the same can electrically connect the tray socket and the front metal to achieve ground (GND) grounding, the location of the ground (GND) grounding point, and The number can be adjusted.
  • GND ground
  • the number can be adjusted.
  • a card tray, a tray socket, and an electronic device including the same can improve antenna radiation and noise shielding performance by improving the contact structure of the tray socket and the front metal.
  • a card tray, a tray socket, and an electronic device including the same can form a ground (GND) ground at a plurality of positions of the tray socket in accordance with the characteristics of the frequency bands used in the electronic device, so that the antenna A card tray, a tray socket, and an electronic device including the same that can improve radiation and noise shielding performance can be provided.
  • GND ground

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  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

Selon un mode de réalisation, la présente divulgation concerne un dispositif électronique qui comprend une carte de circuit imprimé sur laquelle une pluralité de dispositifs d'alimentation d'antenne et un socle de plateau sont disposés. Le socle de plateau comprend une pluralité de parties de contact formées sur au moins une partie de celle-ci de façon à se déplacer vers le haut et vers le bas. Le dispositif électronique comprend un plateau de carte comprenant une pluralité de rainures formées dans au moins une partie d'un corps de plateau de façon à avoir une zone et une profondeur prédéterminées. Le dispositif électronique comprend un élément conducteur connecté électriquement à au moins l'une de la pluralité de parties de contact et formant une connexion à la terre. En outre, l'invention comprend également d'autres modes de réalisation.
PCT/KR2023/015611 2022-10-12 2023-10-11 Plateau de carte, socle de plateau et dispositif électronique le comprenant WO2024080733A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR20220130213 2022-10-12
KR10-2022-0130213 2022-10-12
KR10-2022-0143972 2022-11-01
KR1020220143972A KR20240050953A (ko) 2022-10-12 2022-11-01 카드 트레이, 트레이 소켓 및 이를 포함하는 전자 장치

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WO2024080733A1 true WO2024080733A1 (fr) 2024-04-18

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WO (1) WO2024080733A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190109889A (ko) * 2018-03-19 2019-09-27 엘에스엠트론 주식회사 카드 커넥터용 트레이 및 이를 포함하는 카드 커넥터
KR20190125767A (ko) * 2018-04-30 2019-11-07 몰렉스 엘엘씨 카드 커넥터 및 이의 제조 방법
KR20220015758A (ko) * 2020-07-31 2022-02-08 삼성전자주식회사 안테나 및 그것을 포함하는 전자 장치
KR20220090140A (ko) * 2020-12-22 2022-06-29 삼성전자주식회사 카드 트레이의 혼입을 방지하기 위한 방법 및 이를 지원하는 전자 장치
KR20220129941A (ko) * 2021-03-17 2022-09-26 삼성전자주식회사 트레이 소켓 및 이를 포함하는 전자 장치

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190109889A (ko) * 2018-03-19 2019-09-27 엘에스엠트론 주식회사 카드 커넥터용 트레이 및 이를 포함하는 카드 커넥터
KR20190125767A (ko) * 2018-04-30 2019-11-07 몰렉스 엘엘씨 카드 커넥터 및 이의 제조 방법
KR20220015758A (ko) * 2020-07-31 2022-02-08 삼성전자주식회사 안테나 및 그것을 포함하는 전자 장치
KR20220090140A (ko) * 2020-12-22 2022-06-29 삼성전자주식회사 카드 트레이의 혼입을 방지하기 위한 방법 및 이를 지원하는 전자 장치
KR20220129941A (ko) * 2021-03-17 2022-09-26 삼성전자주식회사 트레이 소켓 및 이를 포함하는 전자 장치

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