WO2024066556A1 - 天线装置及电子设备 - Google Patents

天线装置及电子设备 Download PDF

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Publication number
WO2024066556A1
WO2024066556A1 PCT/CN2023/103174 CN2023103174W WO2024066556A1 WO 2024066556 A1 WO2024066556 A1 WO 2024066556A1 CN 2023103174 W CN2023103174 W CN 2023103174W WO 2024066556 A1 WO2024066556 A1 WO 2024066556A1
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WO
WIPO (PCT)
Prior art keywords
conductor
field communication
near field
conductor structure
antenna device
Prior art date
Application number
PCT/CN2023/103174
Other languages
English (en)
French (fr)
Inventor
黄武鑫
廖巧亮
袁曲
Original Assignee
Oppo广东移动通信有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oppo广东移动通信有限公司 filed Critical Oppo广东移动通信有限公司
Publication of WO2024066556A1 publication Critical patent/WO2024066556A1/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/48—Earthing means; Earth screens; Counterpoises

Definitions

  • the present application relates to the field of communication technology, and in particular to an antenna device and an electronic device.
  • each communication mode of the electronic device requires a corresponding antenna to support it.
  • the present application provides an antenna device and an electronic device, wherein the antenna device has better performance.
  • an antenna device including:
  • first conductor structure stacked with the first conductor member along a first direction, the first conductor structure comprising a first portion and a second portion, the projection of the first portion along the first direction being located on the first conductor member, and the projection of the second portion along the first direction being located outside the first conductor member; the first conductor structure is used to support transmission of wireless signals;
  • the second conductor is disposed between the first conductor and the first conductor structure, and a projection of the second conductor along the first direction covers the first portion and does not cover or does not completely cover the second portion.
  • the present application further provides an electronic device, including an antenna device, wherein the antenna device includes:
  • first conductor structure stacked with the first conductor member along a first direction, the first conductor structure comprising a first portion and a second portion, the projection of the first portion along the first direction being located on the first conductor member, and the projection of the second portion along the first direction being located outside the first conductor member; the first conductor structure is used to support transmission of wireless signals;
  • the second conductor is disposed between the first conductor and the first conductor structure, and a projection of the second conductor along the first direction covers the first portion and does not cover or does not completely cover the second portion.
  • FIG. 1 is a schematic diagram of a first structure of an antenna device provided in an embodiment of the present application.
  • FIG. 2 is a schematic structural diagram of the antenna device shown in FIG. 1 in another direction.
  • FIG. 3 is a schematic diagram of a first electrical connection of the first conductor structure of the antenna device shown in FIG. 1 .
  • FIG. 4 is a first network analysis measurement diagram of the antenna device shown in FIG. 1 .
  • FIG. 5 is a second network analysis measurement diagram of the antenna device shown in FIG. 1 .
  • FIG. 6 is a schematic diagram of a second structure of an antenna device provided in an embodiment of the present application.
  • FIG. 7 is a schematic diagram of a third structure of an antenna device provided in an embodiment of the present application.
  • FIG. 8 is a schematic diagram of an electrical connection of the antenna device shown in FIG. 6 .
  • FIG. 9 is a schematic diagram of a second electrical connection of the first conductor structure of the antenna device shown in FIG. 1 .
  • FIG. 10 is a schematic diagram of a third electrical connection of the first conductor structure of the antenna device shown in FIG. 1 .
  • FIG. 11 is a schematic diagram of a fourth electrical connection of the first conductor structure of the antenna device shown in FIG. 1 .
  • FIG. 12 is a schematic diagram of the first structure of an electronic device provided in an embodiment of the present application.
  • FIG. 13 is a schematic diagram of a second structure of an electronic device provided in an embodiment of the present application.
  • the embodiment of the present application provides an antenna device 100 and an electronic device.
  • the antenna device 100 can realize a wireless communication function.
  • the antenna device 100 can transmit wireless fidelity (Wireless Fidelity, referred to as Wi-Fi) signals, global positioning system (Global Positioning System, referred to as GPS) signals, third-generation mobile communication technology (3rd-Generation, referred to as 3G), fourth-generation mobile communication technology (4th-Generation, referred to as 4G), fifth-generation mobile communication technology (5th-Generation, referred to as 5G), near field communication (Near field communication, referred to as NFC) signals, Bluetooth (Bluetooth, referred to as BT) signals, ultra-wideband communication (Ultra Wide Band, referred to as UWB) signals, etc.
  • Wi-Fi Wireless Fidelity
  • GPS Global Positioning System
  • 3G third-generation mobile communication technology
  • 4th-Generation 4th-Generation, referred to as 4G
  • 5G fifth-generation mobile communication technology
  • Figure 1 is a schematic diagram of the first structure of the antenna device 100 provided in an embodiment of the present application
  • Figure 2 is a schematic diagram of the structure of the antenna device 100 shown in Figure 1 in another direction.
  • the antenna device 100 may include a first conductor 110, a first conductor structure 120 and a second conductor 130.
  • the first conductor 110, the second conductor 130 and the first conductor structure 120 may be stacked in sequence along the first direction H1, and the second conductor 130 may be disposed between the first conductor structure 120 and the first conductor 110.
  • the first conductor structure 120 may include a first portion 121 and a second portion 122.
  • the first portion 121 may be disposed relative to the first conductor 110 and the second conductor 130, and the projection of the first portion 121 along the first direction H1 may be located on the first conductor 110 and the second conductor 130.
  • the projection of the second portion 122 along the first direction H1 may be located outside the first conductor 110, and at least a portion of the projection of the second portion 122 along the first direction H1 may also be located outside the second conductor 130, for example, the projection of the second portion 122 along the first direction H1 may be entirely located outside the second conductor 130, so that the first conductor 110 may cover the first portion 121 but not the second portion 122, and the projection of the second conductor 130 along the first direction H1 may cover the first portion 121 but not the second portion 122.
  • the first portion 121 does not cover or does not completely cover the second portion 122 .
  • the first conductor structure 120 can support the transmission of wireless signals.
  • the first conductor structure 120 can support but is not limited to supporting the transmission of wireless signals such as Wi-Fi signals, GPS signals, 3G signals, 4G signals, 5G signals, BT signals or NFC signals.
  • FIG. 3 is a schematic diagram of a first electrical connection of the first conductor structure 120 of the antenna device 100 shown in FIG. 1.
  • the antenna device 100 may further include a near field communication chip 140.
  • the near field communication chip 140 may be directly or indirectly electrically connected to the first conductor structure 120, and the near field communication chip 140 may provide a near field communication excitation signal, which may excite the first conductor structure 120 to support the transmission of a near field communication signal (NFC signal).
  • NFC signal near field communication signal
  • the near field communication excitation signal can be a balanced signal to be fed to both ends of the first conductor structure 120 respectively; the near field communication excitation signal can also be an unbalanced signal, and the unbalanced signal can be but is not limited to being converted from a balanced signal through a balun.
  • the near field communication chip 140 can provide a differential excitation current, which can excite the first conductor structure 120 to support the transmission of a near field communication signal (NFC signal).
  • NFC signal near field communication signal
  • the differential excitation current can include two current signals, the amplitudes of the two current signals are the same, and the phases are opposite, or it can be understood that the phases of the two current signals differ by 180 degrees.
  • the differential excitation current can be a balanced signal; if the analog signal is directly transmitted during the transmission process, it is an unbalanced signal; if the original analog signal is inverted, and then the inverted analog signal and the original analog signal are transmitted at the same time, the inverted analog signal and the original analog signal are called balanced signals.
  • the balanced signal passes through a differential amplifier, and the original analog signal and the inverted analog signal are subtracted to obtain an enhanced original analog signal. Since the two transmission lines are subject to the same interference during the transmission process, the same interference signal is subtracted during the subtraction process, so the balanced signal has better anti-interference performance.
  • the near field communication chip 140 may include two signal terminals, such as a first signal terminal 141 and a second signal terminal 142.
  • the first signal terminal 141 and the second signal terminal 142 may transmit a near field communication excitation signal such as a differential excitation current.
  • the first conductor structure 120 may include two electrical connection terminals such as a first electrical connection terminal 123 and a second electrical connection terminal 124, the first electrical connection terminal 123 may be directly or indirectly electrically connected to a signal terminal of the near field communication chip 140 such as the first signal terminal 141, and the second electrical connection terminal 124 may be directly or indirectly electrically connected to another signal terminal of the near field communication chip 140 such as the second signal terminal 142, so that the first conductor structure 120 can transmit a near field communication excitation signal such as a differential excitation current and support the transmission of an NFC signal.
  • a near field communication excitation signal such as a differential excitation current
  • the second portion 122 of the first conductor structure 120 can support the outward radiation of wireless signals such as NFC signals.
  • an NFC sensing tag within a preset distance range from the first conductor structure 120 in the first direction H1 can receive the NFC signal and perform NFC interaction with the antenna device 100 of the embodiment of the present application.
  • the wireless signal supported by the second conductor 130 can be transmitted outwardly, and the projection of the second conductor 130 along the first direction H1 may not cover the second portion 122 at all, so that the entire second portion 122 can support the transmission of the NFC signal outwardly.
  • the first conductor structure 120 when the first conductor structure 120 supports the transmission of wireless signals such as NFC signals, since the first portion 121 of the first conductor structure 120 is blocked by the second conductor member 130 and the first conductor member 110, the wireless signals such as NFC signals supported by the first portion 121 of the first conductor structure 120 are not easy to penetrate the second conductor member 130 and the first conductor member 110 and radiate outward. Therefore, the first portion 121 of the first conductor structure 120 basically does not support the outward radiation of wireless signals such as NFC signals, and the first conductor structure 120 mainly uses the second portion 122 to support the transmission of wireless signals such as NFC signals.
  • the metal or other conductor objects around the first conductor structure 120 will affect the parameters such as the resonant frequency of the first conductor structure 120.
  • the metal or other conductor objects when the distance between the metal or other conductor objects around the first conductor structure 120 and the first conductor structure 120 is not balanced, the metal or other conductor objects have different effects on the resonant frequencies of different regions on the first conductor structure 120, so that different regions of the first conductor structure 120 have different detuning degrees, and different regions of the first conductor structure 120 support different performance attenuation degrees when transmitting wireless signals such as NFC signals, so that the consistency of the antenna performance of the first conductor structure 120 is poor.
  • FIG4 is a first network analysis measured diagram of the antenna device 100 shown in FIG1.
  • Curve S1 in FIG4 is a Smith chart curve when the first conductor structure 120 supports NFC signal transmission when the antenna device 100 is not provided with the first conductor 110 and the second conductor 130 and the first part 121 of the first conductor structure 120 is covered by an ideal conductor (the spacing between different regions on the ideal conductor and the first conductor structure 120 is equal);
  • Curve S2 in FIG4 is a Smith chart curve when the first conductor structure 120 supports NFC signal transmission when the antenna device 100 is not provided with the second conductor 130 but with the first conductor 110.
  • the antenna device 100 can establish NFC communication with the NFC sensing tag at a certain distance, but cannot establish NFC communication with the NFC sensing tag at another distance, resulting in a poor user experience.
  • Table 1 is a distance test table for establishing NFC communication between the antenna device 100 and the NFC sensing tag when the first conductor 110 is provided but the second conductor 130 is not provided.
  • Table 1 the distance difference between the maximum sensing distance 28mm and the minimum sensing distance 15mm between the antenna device 100 and the NFC sensing tag is 12mm, which is very large and far exceeds the preset distance difference of 2mm.
  • the user's experience of the NFC communication function of the antenna device 100 of the embodiment of the present application is poor.
  • Table 1 Distance test table for establishing NFC communication between antenna device and NFC sensing tag
  • the second conductor 130 has basically the same effect on the resonant frequency of different regions of the first conductor structure 120, the degree of detuning of different regions on the first conductor structure 120 is basically the same, the degree of performance attenuation of different regions on the first conductor structure 120 when supporting wireless signals is basically the same, and the antenna performance of the first conductor structure 120 has better consistency.
  • FIG. 4 and FIG. 5 is a second network analysis measured diagram of the antenna device 100 shown in FIG. 1.
  • Curve S3 in FIG. 5 is a Smith chart curve when the first conductor structure 120 supports NFC signal transmission when the antenna device 100 does not have the first conductor 110 and the second conductor 130 and the first portion 121 of the first conductor structure 120 is covered by an ideal conductor.
  • Curve S3 is the curve S1 in FIG. 4 above;
  • Curve S4 in FIG. 5 is a Smith chart curve when the first conductor structure 120 supports NFC signal transmission when the antenna device 100 is provided with both the second conductor 130 and the first conductor 110.
  • the antenna device 100 can establish NFC communication with the NFC sensing tag within a certain distance range, thereby providing a better user experience.
  • the second conductor 130 is disposed between the first conductor 110 and the first conductor structure 120, the tolerance consistency of the second conductor 130 is easier to control, the tolerance consistency between the second conductor 130 and the first conductor structure 120 is good, the detuning degree of different regions on the first conductor structure 120 is basically the same, the performance attenuation degree of different regions on the first conductor structure 120 when supporting wireless signals is basically the same, and the antenna performance consistency of the first conductor structure 120 is good.
  • the antenna device 100 can establish NFC communication with the NFC sensing tag within a preset distance range, and the user experience is good.
  • a first tolerance of the spacing between different regions on the second conductor 130 and the first portion 121 may be smaller than a preset tolerance value.
  • the first tolerance can be determined by the limit value method.
  • the first tolerance can be the difference ⁇ 1 (the absolute value of the difference) between the distance D1 between the area on the second conductor 130 farthest from the first part 121 and the first part 121 and the distance D2 between the area on the second conductor 130 closest to the first part 121 and the first part 121.
  • the first tolerance may also be determined in other ways, for example, by using a root mean square method.
  • the root mean square method may obtain a spacing sequence between different regions on the second conductor 130 (a plurality of measurement points may be set on the second conductor 130) and the first portion 121, and then calculate a plurality of tolerances in the spacing sequence, and finally obtain a first tolerance ⁇ 1 of the spacing between different regions on the second conductor 130 and the first portion 121 by taking the root of the sum of the squares of the plurality of tolerances.
  • a surface on the second conductor 130 that is parallel or approximately parallel to the first part 121 of the first conductor structure 120 and closest to the first part 121 can be determined first, and then the first tolerance can be determined based on the spacing between different areas on the surface and the first part 121.
  • the size of the first tolerance can indicate whether the spacing between different regions of the second conductor 130 and the first conductor structure 120 (or reference plane) is consistent; the smaller the first tolerance, the more it indicates that the different regions of the second conductor 130 tend to be located in the same plane and tend to be parallel to the first conductor structure 120 (or reference plane); the larger the first tolerance, the more it indicates that the different regions of the second conductor 130 tend to be located in different planes, and the different regions of the second conductor 130 tend not to be parallel to the first conductor structure 120 (or reference plane).
  • the preset tolerance value of the present application can be preset, and the preset tolerance value can be a tolerance value range that has a small impact on the consistency of the first conductor structure 120.
  • the preset tolerance value can be a tolerance value at the micron level.
  • the embodiment of the present application does not limit the specific value of the preset tolerance value.
  • the spacing between different areas on the second conductor 130 and the first conductor structure 120 is more balanced, more consistent, and less different; the effects of different areas of the second conductor 130 on the first conductor structure 120 are more balanced, more consistent, and less different, so that the degree of detuning in different areas on the first conductor structure 120 is basically the same, the degree of performance attenuation in different areas on the first conductor structure 120 when supporting wireless signals is basically the same, and the antenna performance of the first conductor structure 120 has better consistency.
  • a first tolerance of the spacing between different regions on the second conductor 130 and the first portion 121 is smaller than a second tolerance of the spacing between different regions on the first conductor 110 and the first portion 121 .
  • the second tolerance may also be determined by the limit value method.
  • the second difference may be a difference ⁇ 2 (absolute value of the difference) between a distance D3 between the area on the first conductor 110 farthest from the first portion 121 and the first portion 121 and a distance D4 between the area on the first conductor 110 closest to the first portion 121 and the first portion 121, and the first tolerance ⁇ 1 may be smaller than the second tolerance ⁇ 2.
  • the first tolerance and the second tolerance may also be determined in other ways.
  • the second tolerance may also be determined by the root mean square method.
  • the root mean square method may obtain a spacing sequence between different regions on the first conductor 110 (a plurality of measurement points may be set on the first conductor 110) and the first portion 121, and then calculate a plurality of tolerances in the spacing sequence, and finally take the root of the sum of the squares of the plurality of tolerances.
  • a second tolerance ⁇ 2 of the distances between different regions on the first conductive member 110 and the first portion 121 is obtained.
  • another surface on the first conductor 110 that is parallel or approximately parallel to the first conductor structure 120 and closest to the first conductor structure 120 can be determined first, and then the second tolerance can be determined based on the spacing between different areas on the surface and the first part 121.
  • the thickness of the first conductor structure 120 along the first direction H1 can be ignored and the distance from the second conductor 130, the first conductor 110 to the surface of the first conductor structure 120 can be directly calculated; of course, when calculating the first tolerance and the second tolerance, a preset surface on the first conductor structure 120 that is parallel or approximately parallel to the first conductor 110 and the second conductor 130 can also be selected, and then the distance between the first conductor 110, the second conductor 130 and the preset surface can be calculated.
  • the error caused by the preparation process of the first conductor structure 120 can be ignored, and the surface, the preset surface, or the entire first conductor structure 120 can be considered to be parallel to a preset reference plane, and then the first tolerance of the distance from different regions on the second conductor 130 to the reference plane is calculated, and the second tolerance of the distance from different regions on the first conductor 110 to the reference plane is calculated.
  • the method of determining the first tolerance and the second tolerance or the method of selecting the reference plane can be the same, for example but not limited to both using the limit value method or the root mean square method, and both ignoring the thickness of the first conductor structure 120 along the first direction H1 and directly calculating the first tolerance and the second tolerance.
  • the size of the second tolerance can indicate whether the spacing between different areas of the first conductor 110 and the first conductor structure 120 is consistent; the smaller the second tolerance, the different areas of the surface of the first conductor 110 tend to be located in the same plane and tend to be parallel to the first conductor structure 120 (or the reference plane); the larger the second tolerance, the different areas of the first conductor 110 tend to be located in different planes, and the different areas of the first conductor 110 tend not to be parallel to the first conductor structure 120 (or the reference plane).
  • the spacing between different regions on the second conductor 130 and the first conductor structure 120 is more balanced, more consistent, and less different; the spacing between different regions on the first conductor 110 and the first conductor structure 120 is more unbalanced, more different, and less consistent.
  • the second conductor 130 is more parallel to the first conductor structure 120 (or the reference plane).
  • the effects of different regions on the second conductor 130 on the resonant frequency of different regions of the first conductor structure 120 are basically the same, the detuning degree of different regions of the first conductor structure 120 is basically the same, and the performance attenuation degree of the first conductor structure 120 when supporting wireless signals such as NFC signal transmission is basically the same, so that the antenna performance of the first conductor structure 120 is more consistent.
  • the antenna device 100 can establish NFC communication with the NFC sensing tag within a certain distance range, thereby providing a better user experience.
  • the second conductor 130 will affect the performance of the first conductor structure 120 in supporting wireless signals such as NFC signals, since the impact of the second conductor 130 on the antenna performance of the first conductor structure 120 is basically the same, this impact can be considered in actual debugging and the performance of the wireless signal transmission supported by the first conductor structure 120 can be made to meet relevant requirements through tuning impedance, matching, etc.
  • the second conductor 130 is located between the first conductor structure 120 and the first conductor 110, and the tolerance of the spacing between different regions on the second conductor 130 and the first part 121 of the first conductor structure 120 is smaller than the tolerance of the spacing between different regions on the first conductor 110 and the first part 121, so that the influence of different regions on the second conductor 130 on the resonance of the first conductor structure 120 when supporting wireless signals is basically the same, the detuning degree of different regions of the first conductor structure 120 is basically the same, and the performance attenuation degree of different regions of the first conductor structure 120 when supporting wireless signals is basically the same, and the antenna performance consistency of the first conductor structure 120 is good.
  • the antenna device 100 can establish NFC communication with the NFC sensing tag within a preset distance range, and the user experience is good.
  • the first conductor structure 120 can be, but is not limited to, a straight strip structure, a sheet structure, or a coil structure.
  • the first conductor structure 120 can be a metal coil structure.
  • the first conductor structure 120 supports the transmission of NFC signals, since the frequency of the NFC signal is about 13.56 MHz, the frequency of the NFC signal is low, and the length of the first conductor structure 120 supporting the transmission of the NFC signal is long.
  • the first conductor structure 120 of the embodiment of the present application is a metal coil structure, it can support the transmission of NFC signals and save the space occupied by the first conductor structure 120.
  • first conductor structure 120 may also be in other shapes and structures. Any conductor structure that can support wireless signal transmission can be used as the first conductor structure 120 of the embodiment of the present application, and the embodiment of the present application is not limited to this.
  • first conductor 110 and the second conductor 130 can be, but are not limited to, sheet-shaped or block-shaped structures, so that the first conductor 110 and the second conductor 130 can be stacked with the first conductor structure 120 and cover the first portion 121 of the first conductor structure 120.
  • first conductor 110 and the second conductor 130 can also be in other shapes, which is not limited in the embodiment of the present application.
  • Fig. 6 is a schematic diagram of a second structure of the antenna device 100 provided in the embodiment of the present application.
  • the antenna device 100 in the embodiment of the present application may further include a substrate 150.
  • the substrate 150 may be, but is not limited to, a dielectric substrate.
  • the substrate 150 may include a first surface 151 and a second surface 152 that are disposed opposite to each other.
  • the first surface 151 and the second surface 152 may be stacked along a first direction H1.
  • the first conductor structure 120 may be formed on the second surface 152 by, for example, but not limited to, etching, electroplating, spraying, etc.
  • the second conductor 130 may be formed on the first surface 151 by, for example, but not limited to, etching, electroplating, spraying, etc.
  • the first surface 151 may be located between the second surface 152 and the first conductor 110, and the first conductor 110 may be located on a side of the first surface 151 away from the second surface 152, so that the first conductor 110, the second conductor 130, and the first conductor structure 120 may be stacked.
  • the second conductor 130 may be disposed relative to the first portion 121 of the first conductor structure 120 , so that the second conductor 130 may cover the first portion 121 but not cover or not completely cover the second portion 122 .
  • the substrate 150 may include a bottom plate layer (for example, 12.5 mm), and a first glue layer (for example, 13 mm) and a first rolled copper layer (for example, 18 mm) may be sequentially arranged in the direction from the bottom plate layer to the first surface 151, and a second glue layer (for example, 13 mm) and a second rolled copper layer (for example, 18 mm) may be sequentially arranged in the direction from the bottom plate layer to the second surface 152, and the second conductor member 130 may be formed on the first rolled copper layer by, but not limited to, etching, electroplating, spraying, etc., and the first conductor structure 120 may be formed on the second rolled copper layer by, but not limited to, etching, electroplating, spraying, etc., so that the distance between the first conductor structure 120 and the second conductor structure 160 may be the distance between the first rolled copper layer and the second rolled copper layer (for example, 38.5 mm).
  • the second conductor 130 and the first conductor structure 120 are respectively formed on two surfaces of the substrate 150. Since the thickness of the substrate 150 can be controlled based on the processing technology of the substrate 150, the tolerance of the spacing between the second conductor 130 and the first part 121 of the first conductor structure 120 is also in a controllable state. Therefore, the antenna device 100 of the embodiment of the present application can further ensure the consistency of the tolerance of the spacing between the second conductor 130 and the first part 121 of the first conductor structure 120, thereby further improving the consistency of the antenna performance of the antenna device 100.
  • FIG. 7 is a schematic diagram of a third structure of the antenna device 100 provided in an embodiment of the present application.
  • the first conductor structure 120 can be formed on the second surface 152 of the substrate 150, for example, but not limited to etching, electroplating, spraying, etc.; the first conductor structure 120 can also be directly or indirectly connected to the second surface 152 of the substrate 150, for example, but not limited to, the first conductor structure 120 can be attached or bonded to the second surface 152, so that the substrate 150 can serve as a carrier of the first conductor structure 120 and carry the first conductor structure 120.
  • the first conductor 110 may be located on a side of the first surface 151 of the substrate 150 away from the second surface 152 , and the first conductor 110 may be spaced apart from the substrate 150 .
  • the second conductor 130 may be formed on the first surface 151, and may be formed on the first surface 151 by, but not limited to, etching, electroplating, spraying, etc.; the second conductor 130 may also be directly or indirectly connected to the first surface 151 of the substrate 150, for example, but not limited to, the second conductor 130 may be attached or bonded to the first surface 151 of the substrate 150.
  • the second conductor 130 may also be arranged on the side of the first surface 151 of the substrate 150 away from the second surface 152, so that in the first direction H1, the first conductor structure 120, the second surface 152, the first surface 151, the second conductor 130 and the first conductor 110 may be stacked in sequence.
  • the first conductor structure 120 can be carried on the substrate 150, and the second conductor 130 and the first conductor 110 can be arranged in sequence on the side of the first surface 151 of the first conductor structure 120 away from the second surface 152. Since the second conductor 130 is located between the first conductor structure 120 and the first conductor 110, the tolerance of the spacing between the second conductor 130 and the first part 121 of the first conductor structure 120 is also in a controllable state. Therefore, the antenna device 100 of the embodiment of the present application can ensure the consistency of the tolerance of the spacing between the second conductor 130 and the first part 121 of the first conductor structure 120, and can improve the consistency of the antenna performance of the antenna device 100.
  • FIG. 8 is a schematic diagram of electrical connection of the antenna device 100 shown in FIG. 6 .
  • the first electrical connection end 123 and the second electrical connection end 124 of the first conductor structure 120 may be disposed on (formed on or connected to) the second surface 152 of the substrate 150 along with the first conductor structure 120.
  • the second electrical connection end 124 may be directly or indirectly electrically connected to the second signal end 142 of the near field communication chip 140.
  • the substrate 150 may also be provided with a first metal via 153 and a second metal via 154 that penetrates the thickness direction (first direction H1) of the substrate 150.
  • the first metal via 153 and the second metal via 154 may penetrate the first surface 151 and the second surface 152 of the substrate 150.
  • the two ends of the first metal via 153 may be directly or indirectly electrically connected to the first conductor structure 120 and the second conductor 130, respectively.
  • one end of the first metal via 153 may be electrically connected to the first electrical connection end 123 of the first conductor structure 120, and the other end of the first metal via 153 may be electrically connected to the second conductor 130 (when the second conductor 130 is formed or connected to the first surface 151 of the substrate 150, the first metal via 153 may be electrically connected to the second conductor 130 on the first surface 151 of the substrate 150; when the second conductor 130 is disposed on the side of the first surface 151 away from the second surface 152, the first metal via 153 may be electrically connected to the second conductor 130 through other electrical connectors).
  • the two ends of the second metal via 154 can be directly or indirectly electrically connected to the second conductor 130 and the first signal end 141 of the near field communication chip 140, respectively.
  • one end of the second metal via 154 can be electrically connected to the second conductor 130
  • the other end of the second metal via 154 can be electrically connected to the first signal end 141 (the electrical connection method of the second metal via 154 and the second conductor 130 can refer to the electrical connection method of the first metal via 153 and the second conductor 130, which will not be repeated here), so that
  • the first electrical connection end 123 of the first conductor structure 120 can be electrically connected to the first signal end 141 through the first metal via 153, the second conductor part 130 and the second metal via 154 in sequence.
  • the first conductor structure 120, the first metal via 153, the second conductor part 130, the second metal via 154 and the near-field communication chip 140 can jointly transmit a near-field communication excitation signal such as a differential excitation current.
  • the second conductor part 130 can serve as an electrical connector electrically connecting the first conductor structure 120 and the near-field communication chip 140.
  • the first electrical connection end 123 of the first conductor structure 120 can be located within the range surrounded by the first conductor structure 120.
  • the first metal via 153 can be arranged relative to the first portion 121 of the first conductor structure 120, so that the projection of the first metal via 153 on the first surface 151 can be located within the range where the first portion 121 is located, and the projection of the first metal via 153 on the second surface 152 can be located on the second conductor member 130, so that the two ends of the first metal via 153 are electrically connected to the first conductor structure 120 and the second conductor member 130 respectively.
  • the second metal via 154 can be arranged relative to the outside of the first conductor structure 120.
  • the projection of the second metal via 154 on the first surface 151 can be located outside the entire first conductor structure 120, and the projection of the second metal via 154 on the second surface 152 can be located on the second conductor 130.
  • the projection of the second conductor 130 on the first surface 151 can cover the first portion 121 and can cover the projection of the first metal via 153 on the first surface 151
  • the area of the second conductor 130 on the second surface 152 can include the projection area of the first portion 121 of the first conductor structure 120 on the second surface 152 and the partial area outside the projection area of the first conductor structure 120 on the second surface 152.
  • the first conductor structure 120 can electrically connect the first electrical connection terminal 123 located within the range of the first conductor structure 120 with the first signal terminal 141 located outside the range of the first conductor structure 120 through two metal vias.
  • the second conductor 130 can not only ensure the consistency of the tolerance of the spacing between the first part 121 of the first conductor structure 120, but also serve as an electrical connector between the first conductor structure 120 and the first signal end 141 of the near-field communication chip 140.
  • the second conductor 130 can be reused, and the antenna device 100 can be miniaturized.
  • the first conductor structure 120 may only be provided with the first metal via 153, and the first conductor structure 120 may be electrically connected to the first signal terminal 141 on the first surface 151 through the first metal via 153.
  • the specific electrical connection method of the first conductor structure 120 is not limited in the embodiment of the present application.
  • FIG. 9 is a second electrical connection schematic diagram of the first conductor structure 120 of the antenna device 100 shown in FIG. 1
  • FIG. 10 is a third electrical connection schematic diagram of the first conductor structure 120 of the antenna device 100 shown in FIG. 1.
  • the antenna device 100 may further include one or more (two or more) second conductor structures 160.
  • Each second conductor structure 160 may be electrically connected to the near field communication chip 140, and a near field communication excitation signal, such as a differential excitation current, may excite the first conductor structure 120 and each second conductor structure 160 to jointly support the transmission of the near field communication signal.
  • a near field communication excitation signal such as a differential excitation current
  • a first electrical connection point 161 and a second electrical connection point 162 may be provided on the second conductor structure 160, and the first signal end 141 of the near field communication chip 140 may be directly or indirectly electrically connected to an electrical connection point on the second conductor structure 160, such as the first electrical connection point 161, and another electrical connection point on the second conductor structure 160, such as the second electrical connection point 162, may be directly or indirectly electrically connected to an electrical connection end of the first conductor structure 120, such as the first electrical connection end 123, and another electrical connection end of the first conductor structure 120, such as the second electrical connection end 124, may be directly or indirectly electrically connected to the second signal end 142 of the near field communication chip 140, so that the second conductor structure 160, the first conductor structure 120 and the near field communication chip 140 may form a conductive loop to transmit NFC signals.
  • the antenna device 100 when the antenna device 100 includes two second conductor structures 160 , such as a second conductor structure 160 a and a second conductor structure 160 b , the first conductor structure 120 , the two second conductor structures 160 , and the near field communication chip 140 may be connected in series to form a conductive loop to transmit NFC signals.
  • two second conductor structures 160 such as a second conductor structure 160 a and a second conductor structure 160 b
  • the first conductor structure 120 , the two second conductor structures 160 , and the near field communication chip 140 may be connected in series to form a conductive loop to transmit NFC signals.
  • the second conductor structure 160 can be spaced apart from the first conductor structure 120 so that the NFC signal supported by the first conductor structure 120 and the second conductor structure 160 can be transmitted to the antenna device 100.
  • the antenna device 100 includes a plurality of second conductor structures 160
  • the plurality of second conductor structures 160 may be spaced apart, and each second conductor structure 160 may also be spaced apart from the first conductor structure 120, so that the NFC signal supported by the first conductor structure 120 and the plurality of second conductor structures 160 has a wider coverage range.
  • the radiation field formed by the wireless signal supported by the first conductor structure 120 can enhance the radiation field formed by the wireless signal supported by each second conductor structure 160.
  • the antenna device 100 of the embodiment of the present application is provided with one or more second conductor structures 160 which together with the first conductor structure 120 support the transmission of NFC signals, which can improve the coverage of NFC signals and improve the sensing range of the antenna device 100 and the NFC sensing tag.
  • the antenna device 100 may further include a non-near field communication chip 170, which may be electrically connected to a second conductor structure 160, and the non-near field communication chip 170 may provide a non-near field communication excitation signal, and the non-near field communication excitation signal may excite the second conductor structure 160 to support the transmission of the non-near field communication signal.
  • a non-near field communication chip 170 which may be electrically connected to a second conductor structure 160, and the non-near field communication chip 170 may provide a non-near field communication excitation signal, and the non-near field communication excitation signal may excite the second conductor structure 160 to support the transmission of the non-near field communication signal.
  • the non-near field communication signal may be an unbalanced signal, including but not limited to a cellular network signal, a Wi-Fi signal, a GPS signal, and a BT signal.
  • the non-near field communication chip 170 may be a cellular communication chip for providing a cellular network signal; the non-near field communication chip 170 may be a Wi-Fi chip for providing a Wi-Fi signal; the non-near field communication chip 170 may be a GPS chip for providing a GPS signal; and the non-near field communication chip 170 may also be a BT chip for providing the BT signal.
  • the antenna device 100 may further include a ground system 180, which may be a region or structure with zero potential.
  • the ground system 180 may include a first ground point 181 and a second ground point 182 arranged at intervals, and the ground system 180 forms a conductive path between the first ground point 181 and the second ground point 182.
  • the first signal terminal 141 of the near field communication chip 140 may be directly or indirectly electrically connected to an electrical connection point on the second conductor structure 160, such as the first electrical connection point 161, another electrical connection point on the second conductor structure 160, such as the second electrical connection point 162, may be directly or indirectly electrically connected to the first ground point 181, the second ground point 182 may be directly or indirectly electrically connected to an electrical connection end of the first conductor structure 120, such as the first electrical connection end 123, and another electrical connection end of the first conductor structure 120, such as the second electrical connection end 124, may be directly or indirectly electrically connected to the second signal terminal 142 of the near field communication chip 140.
  • the second conductor structure 160 , the conductive path, the first conductor structure 120 , and the near field communication chip 140 may form a conductive loop to transmit an NFC signal.
  • the second conductor structure 160 can be used to support the transmission of NFC signals and non-NFC signals, so that the second conductor structure 160 can be reused, the number of conductor structures used to transmit wireless signals in the antenna device 100 can be reduced, and a miniaturized design of the antenna device 100 can be achieved.
  • an embodiment of the present application further provides an electronic device 10 .
  • the electronic device 10 may be a device such as a smart phone, a tablet computer, or a gaming device, an augmented reality (AR) device, an automotive device, a data storage device, an audio playback device, a video playback device, a laptop computer, a desktop computing device, etc.
  • AR augmented reality
  • FIG. 12 is a schematic diagram of the first structure of the electronic device 10 provided in an embodiment of the present application.
  • the electronic device 10 may include the antenna device 100 in the above-mentioned embodiment.
  • the electronic device 10 may further include a display screen 200 , a middle frame 300 , a circuit board 400 , a battery 500 , and a rear cover 600 .
  • the display screen 200 is disposed on the middle frame 300 to form a display surface of the electronic device 10 for displaying information such as images and texts.
  • the display screen 200 may include a display screen 200 of a type such as a liquid crystal display (LCD) or an organic light-emitting diode (OLED) display screen.
  • LCD liquid crystal display
  • OLED organic light-emitting diode
  • the middle frame 300 may be a thin plate or sheet structure, or a hollow frame structure.
  • the middle frame 300 may provide support for the electronic devices or functional components in the electronic device 10, so as to install the electronic devices and functional components of the electronic device 10 together.
  • the middle frame 300 may be provided with structures such as grooves, protrusions, and through holes to facilitate the installation of the electronic devices or functional components of the electronic device 10.
  • the material of the middle frame 300 may include metal or plastic.
  • the circuit board 400 is arranged on the middle frame 300 for fixing, and the circuit board 400 is sealed inside the electronic device 10 through the rear shell 600.
  • the circuit board 400 may be integrated with a processor, and may also be integrated with one or more functional components such as an earphone interface, an acceleration sensor, a gyroscope, and a motor.
  • the display screen 200 may be electrically connected to the circuit board 400 so that the display of the display screen 200 is controlled by the processor on the circuit board 400.
  • the battery 500 is disposed on the middle frame 300, and the battery 500 is sealed inside the electronic device 10 through the rear shell 600. At the same time, the battery 500 is electrically connected to the circuit board 400 so that the battery 500 can power the electronic device 10.
  • a power management circuit may be disposed on the circuit board 400. The power management circuit is used to distribute the voltage provided by the battery 500 to various electronic devices in the electronic device 10.
  • the rear shell 600 is connected to the middle frame 300.
  • the rear shell 600 can be attached to the middle frame 300 by an adhesive such as a double-sided adhesive to achieve connection with the middle frame 300.
  • the rear shell 600 is used to seal the electronic devices and functional components of the electronic device 10 inside the electronic device 10 together with the middle frame 300 and the display screen 200 to protect the electronic devices and functional components of the electronic device 10.
  • FIG. 13 is a second structural schematic diagram of the electronic device 10 provided in an embodiment of the present application.
  • the front side in FIG. 12 is the display screen 200 and the back side is the rear shell 600; the front side in FIG. 13 is the rear shell 600 and the back side is the display screen 200.
  • FIG. 13 is a back view of the electronic device 10 in FIG. 12.
  • the electronic device 10 may further include a metal decorative part 700.
  • the metal decorative part 700 can be disposed inside the electronic device 10, and a part of the metal device can also be exposed outside the electronic device 10.
  • the metal decorative part 700 can be, but is not limited to, a decorative part of a camera module, a decorative part of an earpiece module, or a decorative part of a microphone module, and accordingly, the metal decorative part 700 can carry or fix the camera module, the earpiece, or the microphone.
  • the metal decorative member 700 can be reused as the first conductor member 110 of the antenna device 100. Specifically, the metal decorative member 700 may cover the first portion 121 of the first conductor structure 120 but not the second portion 122 of the first conductor structure 120 . In this case, the second conductor 130 may be located between the first conductor structure 120 and the metal decorative member 700 and cover the first portion 121 but not or not completely cover the second portion 122 .
  • the tolerance of the distance between different regions on the metal decorative part 700 and the first part 121 of the first conductor structure 120 is relatively large, so that when the metal decorative part 700 covers the first part 121 of the first conductor structure 120, the metal decorative part 700 makes different regions of the first conductor structure 120 support wireless signals and different performance attenuation.
  • the second conductor 130 is arranged between the metal decorative part 700 and the first conductor structure 120.
  • the poor consistency of the second conductor 130 is easier to control.
  • the tolerance of the distance between different regions of the second conductor 130 and the first part 121 is often smaller than the tolerance of the distance between different regions on the metal decorative part 700 and the first part 121. Therefore, the second conductor 130 can make different regions of the first conductor structure 120 support wireless signals with basically the same degree of detuning and basically the same degree of performance attenuation, and the radiation performance of the antenna device 100 is better.
  • the metal decorative part 700 is at a fifth distance D5 from the top edge of the electronic device 10, and the metal decorative part 700 is at a sixth distance D6 from the bottom edge of the electronic device 10.
  • the ratio of the fifth distance D5 to the sixth distance D6 may be between one quarter and two fifths, for example, the ratio of the fifth distance D5 to the sixth distance D6 may be one third.
  • the antenna device 100 may be disposed in an upper region when the electronic device 10 is held forward, and the magnetic field lines of the wireless signal supported by the antenna device 100 may be distributed in the upper 1/3 region of the electronic device 10, which is in line with user habits.
  • a non-conductor area 610 may be provided on the back shell 600 of the electronic device 10, and the projection of the non-conductor area 610 along the first direction may cover the second part 122 of the first conductor structure 120, so that the wireless signal supported by the second part 122 of the first conductor structure 120 may be radiated into the free space through the non-conductor area 610.
  • the back cover 600 may be provided with through holes and gaps to form the non-conductor region 610; the back cover 600 may also be filled with non-conductor materials in the non-conductor region 610 to form the non-conductor region 610; of course, the entire back cover 600 may also be made of non-conductor materials such as ceramics, plastics, etc., so that the back cover 600 may have the non-conductor region 610.
  • the specific formation method of the non-conductor region 610 is not limited in the embodiment of the present application.
  • the wireless signal supported by the second part 122 of the first conductor structure 120 can also be radiated to the free space in other ways, such as but not limited to through the gaps on the middle frame 300 (which can be filled with non-conductor materials) and the gaps between the middle frame 300 and the back shell 600 (which can be filled with non-conductor materials).
  • a non-conductor region 610 is disposed on the rear shell 600 of the electronic device 10 in the embodiment of the present application, and the wireless signal supported by the second portion 122 of the first conductor structure 120 can be transmitted to the free space, and the antenna device 100 can realize the wireless communication function.
  • the electronic device 10 of the embodiment of the present application may also include components such as a camera, a sensor, an acoustic-to-electric conversion device, etc. These components can be found in the description of the relevant technology and will not be repeated here.

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Abstract

一种天线装置及电子设备，天线装置包括沿第一方向依次层叠设置的第一导体件、第二导体件和第一导体结构，第一导体结构包括第一部分和第二部分，第一部分沿第一方向的投影位于第一导体件上、第二部分沿第一方向的投影位于第一导体件外，第二导体件沿第一方向的投影覆盖第一部分而不覆盖或不完全覆盖第二部分。

Description

天线装置及电子设备
本申请要求于2022年09月30日提交中国专利局、申请号为202211215864.6、发明名称为“天线装置及电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及通信技术领域，特别涉及一种天线装置及电子设备。
背景技术
随着通信技术的发展，诸如智能手机等电子设备能够实现的功能越来越多，电子设备的通信模式也更加多样化。可以理解的是，电子设备的每一种通信模式都需要相应的天线来支持。
发明内容
本申请提供一种天线装置及电子设备，天线装置具有较优的性能。
第一方面，本申请提供了一种天线装置，包括：
第一导体件；
第一导体结构，沿第一方向与所述第一导体件层叠设置，所述第一导体结构包括第一部分和第二部分，所述第一部分沿所述第一方向的投影位于所述第一导体件上、所述第二部分沿所述第一方向的投影位于所述第一导体件外；所述第一导体结构用于支持无线信号的传输；及
第二导体件，设置于所述第一导体件和所述第一导体结构之间，所述第二导体件沿所述第一方向的投影覆盖所述第一部分、且不覆盖或不完全覆盖所述第二部分。
第二方面，本申请还提供了一种电子设备，包括天线装置，所述天线装置包括：
第一导体件；
第一导体结构，沿第一方向与所述第一导体件层叠设置，所述第一导体结构包括第一部分和第二部分，所述第一部分沿所述第一方向的投影位于所述第一导体件上、所述第二部分沿所述第一方向的投影位于所述第一导体件外；所述第一导体结构用于支持无线信号的传输；及
第二导体件，设置于所述第一导体件和所述第一导体结构之间，所述第二导体件沿所述第一方向的投影覆盖所述第一部分、且不覆盖或不完全覆盖所述第二部分。
附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍。显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本申请实施例提供的天线装置的第一种结构示意图。
图2为图1所示的天线装置的另一方向的结构示意图。
图3为图1所示的天线装置的第一导体结构的第一种电连接示意图。
图4为图1所示的天线装置的第一种网络分析实测图。
图5为图1所示的天线装置的第二种网络分析实测图。
图6为本申请实施例提供的天线装置的第二种结构示意图。
图7为本申请实施例提供的天线装置的第三种结构示意图。
图8为图6所示的天线装置的一种电连接示意图。
图9为图1所示的天线装置的第一导体结构的第二种电连接示意图。
图10为图1所示的天线装置的第一导体结构的第三种电连接示意图。
图11为图1所示的天线装置的第一导体结构的第四种电连接示意图。
图12为本申请实施例提供的电子设备的第一种结构示意图。
图13为本申请实施例提供的电子设备的第二种结构示意图。
具体实施方式
下面将结合本申请实施例中的附图1至附图13，对本申请实施例中的技术方案进行清楚、完整地描述。显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
本申请实施例提供一种天线装置100及电子设备。天线装置100可以实现无线通信功能。例如天线装置100可以传输无线保真(Wireless Fidelity，简称Wi-Fi)信号、全球定位系统(Global Positioning System，简称GPS)信号、第三代移动通信技术(3rd-Generation，简称3G)、第四代移动通信技术(4th-Generation，简称4G)、第五代移动通信技术(5th-Generation，简称5G)、近场通信(Near field communication，简称NFC)信号、蓝牙(Blue tooth，简称BT)信号、超宽带通信(Ultra Wide Band，简称UWB)信号等。
请参考图1和图2，图1为本申请实施例提供的天线装置100的第一种结构示意图，图2为图1所示的天线装置100的另一方向的结构示意图。天线装置100可以包括第一导体件110、第一导体结构120和第二导体件130。
第一导体件110、第二导体件130和第一导体结构120可以沿第一方向H1依次层叠设置，第二导体件130可以设置于第一导体结构120和第一导体件110之间。第一导体结构120可以包括第一部分121和第二部分122，该第一部分121可以相对第一导体件110和第二导体件130设置，第一部分121沿第一方向H1的投影可以位于第一导体件110和第二导体件130上。第二部分122沿第一方向H1的投影可以位于第一导体件110外，第二部分122沿第一方向H1的投影的至少一部分也可以位于第二导体件130外，例如第二部分122沿第一方向H1的投影可以全部位于第二导体件130外，从而，第一导体件110可以覆盖第一部分121而不覆盖第二部分122，第二导体件130沿第一方向H1的投影可以覆盖第一部 分121而不覆盖或者不完全覆盖第二部分122。
其中，第一导体结构120可以支持无线信号的传输，例如第一导体结构120可以但不限于支持Wi-Fi信号、GPS信号、3G信号、4G信号、5G信号、BT信号或NFC信号等无线信号的传输。
例如，请结合图1并请参考图3，图3为图1所示的天线装置100的第一导体结构120的第一种电连接示意图。天线装置100还可以包括近场通信芯片140。近场通信芯片140可以与第一导体结构120直接或间接电连接，近场通信芯片140可以提供近场通信激励信号，该近场通信激励信号可以激励第一导体结构120支持近场通信信号(NFC信号)的传输。
可以理解的是，该近场通信激励信号可以是平衡信号以分别馈至第一导体结构120的两端；该近场通信激励信号也可以是非平衡信号，该非平衡信号可以但不限于由平衡信号通过巴伦转换为非平衡信号。
示例性的，近场通信芯片140可以提供差分激励电流，该差分激励电流可以激励第一导体结构120支持近场通信信号(NFC信号)的传输。可以理解的是，差分激励电流可以包括两个电流信号，这两个电流信号的振幅相同，并且相位相反，或者理解为这两个电流信号的相位相差180度。此外，差分激励电流可以为平衡信号；模拟信号在传输过程中，如果被直接传送就是非平衡信号；如果把原始的模拟信号反相，然后同时传送反相的模拟信号和原始的模拟信号，反相的模拟信号和原始的模拟信号就叫做平衡信号。平衡信号在传送过程中经过差动放大器，原始的模拟信号和反相的模拟信号相减，得到加强的原始模拟信号，由于在传送过程中，两条传送线路受到相同的干扰，在相减的过程中，减掉了相同的干扰信号，因此平衡信号的抗干扰性能更好。
可以理解的是，近场通信芯片140可以包括两个信号端，例如第一信号端141和第二信号端142。该第一信号端141和第二信号端142可以传输近场通信激励信号例如差分激励电流。第一导体结构120可以包括两个电连接端例如第一电连接端123和第二电连接端124，该第一电连接端123可以与近场通信芯片140的一个信号端例如第一信号端141直接或间接电连接，该第二电连接端124可以与近场通信芯片140的另一个信号端例如第二信号端142直接或间接电连接，以使得第一导体结构120可以传输近场通信激励信号例如差分激励电流并可支持NFC信号的传输。
可以理解的是，当第一导体结构120支持无线信号例如NFC信号的传输时，由于第一导体结构120的第二部分122没有被第一导体件110遮挡，也没有被第二导体件130遮挡或没有完全被第二导体件130遮挡，因此，第一导体结构120的第二部分122可以支持无线信号例如NFC信号向外辐射。当第二部分122支持NFC信号向外辐射时，在第一方向H1上与第一导体结构120处于预设距离范围内的NFC感应标签可以接收该NFC信号并与本申请实施例的天线装置100进行NFC交互。其中，为了进一步使得第一导体结构120支 持的无线信号例如NFC信号可以向外传输，第二导体件130沿第一方向H1的投影可以完全不覆盖第二部分122，以使得整个第二部分122可以支持NFC信号向外传输。
可以理解的是，当第一导体结构120支持无线信号例如NFC信号的传输时，由于第一导体结构120的第一部分121被第二导体件130和第一导体件110遮挡，第一导体结构120的第一部分121支持的无线信号例如NFC信号不易穿透第二导体件130和第一导体件110而向外辐射，因此，第一导体结构120的第一部分121基本不支持无线信号例如NFC信号向外辐射，第一导体结构120主要利用第二部分122支持无线信号例如NFC信号的传输。
其中，当第一导体结构120支持NFC信号的传输时，第一导体结构120周围的金属等导体物体会影响第一导体结构120的谐振频率等参数。并且，当第一导体结构120周围的金属等导体物体与第一导体结构120之间的间距不均衡时，该金属等导体物体对第一导体结构120上的不同区域的谐振频率的影响不同，使得第一导体结构120的不同区域的失谐程度不同，第一导体结构120的不同区域支持无线信号例如NFC信号传输时的性能衰减程度不同，从而第一导体结构120的天线性能的一致性较差。
示例性的，以第一导体结构120支持NFC信号为例，请参考图4，图4为图1所示的天线装置100的第一种网络分析实测图。图4中曲线S1为天线装置100不设置第一导体件110和第二导体件130且第一导体结构120的第一部分121被理想导体(理想导体上的不同区域与第一导体结构120之间的间距相等)覆盖时，第一导体结构120支持NFC信号传输时的史密斯圆图曲线；图4中曲线S2为天线装置100不设置第二导体件130而设置第一导体件110时的第一导体结构120支持NFC信号传输时的史密斯圆图曲线。由曲线S1和S2可知，与理想导体覆盖第一部分121相比，当与第一导体结构120之间的间距不均衡、差异更大、一致性较差的第一导体件110覆盖第一导体结构120的第一部分121时，第一导体件110会使得第一导体结构120工作的谐振的频率发生偏移，第一导体件110会使得第一导体结构120上的不同区域的失谐程度不同，第一导体结构120的天线性能的一致性较差。当用户利用NFC感应标签与本申请实施例的天线装置100进行NFC信号交互时，会使得天线装置100在某一距离下能与NFC感应标签建立NFC通信、而在另一距离下不能与NFC感应标签建立NFC通信，从而导致用户的体验感较差。
例如，请参考下表1，表1为设置第一导体件110而不设置第二导体件130时的天线装置100与NFC感应标签建立NFC通信的距离测试表。由表1可以看出，天线装置100与NFC感应标签的最大感应距离28mm与最小感应距离15mm之间的距离差值为12mm，差距非常大，远超预设距离差值2mm，用户对本申请实施例的天线装置100的NFC通信功能的体验感较差。
表1：天线装置与NFC感应标签建立NFC通信的距离测试表
当本申请实施例的天线装置100将第二导体件130设置于第一导体件110和第一导体结构120之间时，由于第二导体件130的公差一致性较容易控制，第一导体结构120与第二导体件130之间的公差一致性较好，第二导体件130对第一导体结构120的不同区域的谐振频率的影响基本相同，第一导体结构120上的不同区域的失谐程度基本相同，第一导体结构120上的不同区域支持无线信号时的性能衰减程度基本相同，第一导体结构120的天线性能的一致性较好。
示例性的，请结合图4并请参考图5，图5为图1所示的天线装置100的第二种网络分析实测图。图5中曲线S3为天线装置100不设置第一导体件110和第二导体件130且第一导体结构120的第一部分121被理想导体覆盖时，第一导体结构120支持NFC信号传输时的史密斯圆图曲线，曲线S3即为前述图4中的曲线S1；图5中曲线S4为天线装置100同时设置第二导体件130和第一导体件110时的第一导体结构120支持NFC信号传输时的史密斯圆图曲线。由曲线S3和S4可知，当第二导体件130设置于第一导体件110和第一导体结构120之间时，第二导体件130的公差一致性较容易控制，第二导体件130上不同区域对第一导体结构120的不同区域的谐振频率的影响基本相同，第一导体结构120的不同区域的失谐程度基本相同，第一导体结构120支持无线信号例如NFC信号传输时的性能衰减程度基本相同，从而第一导体结构120的天线性能的一致性较优。
此时，如果当第一导体结构120支持NFC信号的传输时，当用户利用本申请实施例的天线装置100与NFC感应标签进行NFC信号交互时，会使得天线装置100在某一距离范围内均能与NFC感应标签建立NFC通信，从而用户的体验感较优。
本申请实施例的天线装置，将第二导体件130设置于第一导体件110和第一导体结构120之间，第二导体件130的公差一致性较容易控制，第二导体件130与第一导体结构120之间的公差一致性较好，第一导体结构120上的不同区域的失谐程度基本相同，第一导体结构120上的不同区域支持无线信号时的性能衰减程度基本相同，第一导体结构120的天线性能的一致性较好。并且，当第一导体结构120支持NFC信号的传输时，天线装置100可以在预设的距离范围内与NFC感应标签建立NFC通信，用户的体验感较好。
其中，在第一方向H1上，第二导体件130上的不同区域与第一部分121之间的间距的第一公差可以小于预设公差值。
可以理解的是，该第一公差可以采用极限值法来确定。例如，第一公差可以是第二导体件130上距离第一部分121最远的区域与第一部分121的间距D1与第二导体件130上距离第一部分121最近的区域与第一部分121的间距D2的差值δ1(差值的绝对值)。
当然，第一公差也可以采用其他的方式确定，例如可以采用均方根法确定。该均方根法可以获取第二导体件130上的不同区域(可以在第二导体件130上设定多个测量点)与第一部分121之间的间距序列，然后计算该间距序列中的多个公差，最后将该多个公差的平方之和再开根可以得到第二导体件130上的不同区域与第一部分121之间的间距的第一公差δ1。
可以理解的是，在计算第一公差时，可以先确定第二导体件130上与第一导体结构120的第一部分121平行或近似平行的、最靠近第一部分121的一表面，然后根据该表面上的不同区域与第一部分121之间的间距确定第一公差。
需要说明的是，以上仅为本申请实施例确定第一公差的示例性举例，其他可以确定第二导体件130上的不同区域与第一部分121之间的间距的第一公差的方式均在本申请实施例的保护范围内。
可以理解的是，第一公差的大小可以表明第二导体件130的不同区域与第一导体结构120(或基准面)之间的间距是否一致；第一公差越小，则表明第二导体件130的不同区域趋向于位于同一平面并趋向于平行第一导体结构120(或基准面)；第一公差越大，则表明第二导体件130的不同区域趋向于位于不同的平面，第二导体件130的不同区域趋向于不平行第一导体结构120(或基准面)。
可以理解的是，本申请的预设公差值可以预先设定，该预设公差值可以为对第一导体结构120一致性影响较小的公差值范围，例如但不限于该预设公差值可以为微米级别的公差值。本申请实施例对预设公差值的具体数值不进行限定。
当第一公差小于预设公差值时，第二导体件130上不同的区域与第一导体结构120之间的间距更均衡、更一致性、差异更小；第二导体件130的不同区域对第一导体结构120的影响较均衡、较一致、差异较小，从而第一导体结构120上的不同区域的失谐程度基本相同，第一导体结构120上的不同区域支持无线信号时的性能衰减程度基本相同，第一导体结构120的天线性能的一致性较好。
其中，在第一方向H1上，第二导体件130上的不同区域与第一部分121之间的间距的第一公差小于第一导体件110上的不同区域与第一部分121之间的间距的第二公差。
可以理解的是，当第一公差采用极限值法确定时，该第二公差也可以采用极限值法确定。例如，第二差值可以是第一导体件110上距离第一部分121最远的区域与第一部分121的间距D3与第一导体件110上距离第一部分121最近的区域与第一部分121的间距D4的差值δ2(差值的绝对值)，第一公差δ1可以小于第二公差δ2。
当然，第一公差、第二公差也可以采用其他的方式确定，例如当第一公差采用采用均方根法确定时，第二公差也可以采用均方根法确定。例如，该均方根法可以获取第一导体件110上的不同区域(可以在第一导体件110上设定多个测量点)与第一部分121之间的间距序列，然后计算该间距序列中的多个公差，最后将该多个公差的平方之和再开根可以 得到第一导体件110上的不同区域与第一部分121之间的间距的第二公差δ2。
可以理解的是，在计算第二公差时，可以先确定第一导体件110上与第一导体结构120平行或近似平行的、最靠近第一导体结构120的另一表面，然后根据该表面上的不同区域与第一部分121之间的间距确定第二公差。
可以理解的是，在计算第一公差和第二公差时，可以忽略第一导体结构120沿第一方向H1的厚度直接计算第二导体件130、第一导体件110到第一导体结构120的表面的距离；当然，在计算第一公差和第二公差时，也可以选择第一导体结构120上的平行或近似平行第一导体件110、第二导体件130的预设表面，然后计算第一导体件110、第二导体件130与该预设表面之间的间距。或者，在计算第一公差、第二公差时，可以忽略第一导体结构120制备工艺引起误差，可以认为上述第一导体结构120的表面、预设表面、或者认为整个第一导体结构120平行于预设的基准面，然后再计算该第二导体件130上不同区域到该基准面的间距的第一公差、计算该第一导体件110上不同区域到该基准面的间距的第二公差。
可以理解的是，为了提高第一公差和第二公差比较的准确性，该第一公差和第二公差的确定方式或者基准面的选择方式可以相同，例如但不限于二者均采用极限值法或者均方根法、二者均忽略第一导体结构120沿第一方向H1的厚度而直接计算第一公差和第二公差。
需要说明的是，以上仅为本申请实施例确定第一公差、第二公差的示例性举例，其他可以确定第二导体件130上的不同区域与第一部分121之间的间距的第一公差、第一导体件110上的不同区域与第一部分121之间的间距的第二公差的方式均在本申请实施例的保护范围内。
可以理解的是，与第一公差一样，第二公差的大小可以表明第一导体件110的不同区域与第一导体结构120之间的间距是否一致性；第二公差越小，则表面第一导体件110的不同区域趋向于位于同一平面并趋向于平行第一导体结构120(或基准面)；第二公差越大，则表明第一导体件110的不同区域趋向于位于不同的平面，第一导体件110的不同区域趋向于不平行第一导体结构120(或基准面)。
当第一公差小于第二公差时，第二导体件130上不同的区域与第一导体结构120之间的间距更均衡、更一致性、差异更小；第一导体件110上的不同的区域与第一导体结构120之间的间距更不均衡、差异更大、一致性较差。相较于第一导体件110而言，第二导体件130更平行于第一导体结构120(或基准面)。第二导体件130上不同区域对第一导体结构120的不同区域的谐振频率的影响基本相同，第一导体结构120的不同区域的失谐程度基本相同，第一导体结构120支持无线信号例如NFC信号传输时的性能衰减程度基本相同，从而第一导体结构120的天线性能的一致性较优。
此时，如果当第一导体结构120支持NFC信号的传输时，当用户利用本申请实施例的 天线装置100与NFC感应标签进行NFC信号交互时，会使得天线装置100在某一距离范围内均能与NFC感应标签建立NFC通信，从而用户的体验感较优。
需要说明的是，虽然第二导体件130会对第一导体结构120支持无线信号例如NFC信号的性能产生影响，但是，由于第二导体件130对第一导体结构120的天线性能的影响基本相同，因此，实际调试中可以考虑该影响并通过调谐阻抗、匹配等方式使得第一导体结构120支持的无线信号传输时的性能符合相关需求。
本申请实施例的天线装置100，第二导体件130位于第一导体结构120和第一导体件110之间，第二导体件130上的不同区域与第一导体结构120的第一部分121之间的间距的公差小于第一导体件110上不同区域与第一部分121之间的间距的公差，从而，第二导体件130上不同区域对第一导体结构120支持无线信号时的谐振的影响基本相同，第一导体结构120的不同区域失谐程度基本相同、第一导体结构120的不同区域支持无线信号时的性能衰减程度基本相同，第一导体结构120的天线性能的一致性较好。当第一导体结构120支持NFC信号的传输时，天线装置100可以在预设的距离范围内与NFC感应标签建立NFC通信，用户的体验感较好。
需要说明的是，本申请实施例的附图仅为示意性说明本申请实施例的方案，其并不能作为对本申请实施例的限定。例如在图1至图3中，第一导体件110与第二导体件130之间、第二导体件130与第一导体结构120之间存在间隔，实际生产中，第一导体件110与第二导体件130之间可以不存在间隔，第二导体件130与第一导体结构120之间也可以不存在间隔。本申请实施例对此不进行限定。
其中，第一导体结构120可以但不限于为直条结构、片状结构、或者线圈结构。例如图1和图3所示，第一导体结构120可以为金属线圈结构。当第一导体结构120支持NFC信号的传输时，由于NFC信号的频率约为13.56MHz，NFC信号的频率较低，支持NFC信号传输的第一导体结构120的长度较长，本申请实施例的第一导体结构120为金属线圈结构时，既可以支持NFC信号的传输，也可以节省第一导体结构120占据的空间。
当然，第一导体结构120也可以为其他的形状和结构，凡是可支持无线信号传输的导体结构进行为本申请实施例的第一导体结构120，本申请实施例对此不进行限定。
可以理解的是，第一导体件110、第二导体件130可以但不限于为片状、块状结构，以使得第一导体件110、第二导体件130可与第一导体结构120层叠设置且覆盖第一导体结构120的第一部分121。当然，第一导体件110、第二导体件130也可以为其他形状，本申请实施例对此也不进行限定。
其中，请参考图6，图6为本申请实施例提供的天线装置100的第二种结构示意图。本申请实施例的天线装置100还可以包括基板150。
基板150可以但不限于是介质基板。基板150可以包括相对设置的第一面151和第二面152，该第一面151和第二面152可以沿第一方向H1层叠设置。第一导体结构120可以 形成于第二面152，例如但不限于第一导体结构120可以蚀刻、电镀、喷涂等方式形成于第二面152。第二导体件130可以形成于第一面151，第二导体件130可以但不限于蚀刻、电镀、喷涂等方式形成于第一面151。其中，第一面151可以位于第二面152和第一导体件110之间，第一导体件110可以位于第一面151远离第二面152的一侧，从而第一导体件110、第二导体件130和第一导体结构120可以层叠设置。
可以理解的是，第二导体件130可以相对第一导体结构120的第一部分121设置，以使得第二导体件130可以覆盖第一部分121而不覆盖或不完全覆盖第二部分122。
可以理解的是，基板150可以包括底板层(例如12.5mm)，在该底板层到第一面151的方向上可以依次设置有第一胶水层(例如13mm)和第一压延铜层(例如18mm)，在该底板层到第二面152的方向上可以依次设置有第二胶水层(例如13mm)和第二压延铜层(例如18mm)，第二导体件130可以但不限于通过蚀刻、电镀、喷涂等方式形成于第一压延铜层，第一导体结构120可以但不限于通过蚀刻、电镀、喷涂、等方式形成于第二压延铜层，从而，第一导体结构120与第二导体结构160之间的距离可以是第一压延铜层至第二压延铜层之间的距离(例如38.5mm)。
本申请实施例的天线装置100，第二导体件130和第一导体结构120分别形成于基板150的两个面上，由于基板150的厚度可基于基板150的加工工艺而受到控制，因此，第二导体件130与第一导体结构120的第一部分121之间的间距的公差也处于可控状态，从而，本申请实施例的天线装置100可以进一步保证第二导体件130与第一导体结构120的第一部分121之间的间距的公差的一致性，进一步提升天线装置100的天线性能的一致性。
其中，请结合图6并请参考图7，图7为本申请实施例提供的天线装置100的第三种结构示意图。
如图6和图7所示，第一导体结构120可以形成于基板150的第二面152，例如但不限于蚀刻、电镀、喷涂等方式形成于第二面152；第一导体结构120也可以直接或间接连接于基板150的第二面152，例如但不限于第一导体结构120可以贴附或粘接于第二面152，从而，基板150可以作为第一导体结构120的载体而承载第一导体结构120。
如图6和图7所示，第一导体件110可以位于基板150的第一面151远离第二面152的一侧，第一导体件110可以与基板150相间隔。
如图6所示，第二导体件130可以形成于第一面151，可以但不限于蚀刻、电镀、喷涂等方式形成于第一面151；第二导体件130也可以直接或间接连接于基板150的第一面151，例如但不限于第二导体件130可以贴附或粘接于基板150的第一面151。如图7所示，当第一导体结构120形成于或连接于基板150的第二面152、第一导体件110位于基板150的第一面151远离第二面152的一侧时，第二导体件130也可以设置于基板150的第一面151远离第二面152的一侧，从而，在第一方向H1上，第一导体结构120、第二面152、第一面151、第二导体件130和第一导体件110可以依次层叠设置。
本申请实施例的天线装置100，第一导体结构120可以承载于基板150上，第二导体件130和第一导体件110可以依次设置于第一导体结构120的第一面151远离第二面152的一侧，由于第二导体件130位于第一导体结构120和第一导体件110之间，因此，第二导体件130与第一导体结构120的第一部分121之间的间距的公差也处于可控状态，从而，本申请实施例的天线装置100可以保证第二导体件130与第一导体结构120的第一部分121之间的间距的公差的一致性，可以提升天线装置100的天线性能的一致性。
其中，请再次参考图6和图7并请参考图8，图8为图6所示的天线装置100的一种电连接示意图。
当第一导体结构120形成或连接于基板150的第二面152时，第一导体结构120的第一电连接端123和第二电连接端124可以随第一导体结构120设置于(形成于或者连接于)基板150的第二面152。第二电连接端124可以与近场通信芯片140的第二信号端142直接或间接电连接。
基板150上还可以设有贯穿基板150厚度方向(第一方向H1)的第一金属过孔153和第二金属过孔154，该第一金属过孔153和第二金属过孔154可以贯穿基板150的第一面151和第二面152。其中，第一金属过孔153的两端可以分别直接或间接电连接于第一导体结构120和第二导体件130，例如第一金属过孔153的一端可以与第一导体结构120的第一电连接端123电连接，第一金属过孔153的另一端可以与第二导体件130电连接(当第二导体件130形成或连接于基板150的第一面151时，第一金属过孔153可以在基板150的第一面151与第二导体件130电连接；当第二导体件130设置于第一面151远离第二面152的一侧时，第一金属过孔153可以通过其他的电连接件与第二导体件130电连接)。第二金属过孔154的两端可以分别直接或间接电连接于第二导体件130和近场通信芯片140的第一信号端141，例如，第二金属过孔154的一端可以与第二导体件130电连接，第二金属过孔154的另一端可以与第一信号端141电连接(第二金属过孔154与第二导体件130的电连接方式可以参见前述第一金属过孔153与第二导体件130的电连接方式，在此不进行赘述)，从而，第一导体结构120的第一电连接端123可以顺次通过第一金属过孔153、第二导体件130和第二金属过孔154与第一信号端141电连接，第一导体结构120、第一金属过孔153、第二导体件130、第二金属过孔154和近场通信芯片140可以共同传输近场通信激励信号例如差分激励电流，第二导体件130可以作为第一导体结构120与近场通信芯片140电连接的电连接件。
可以理解的是，第一导体结构120的第一电连接端123可以位于第一导体结构120所围绕的范围内。此时，第一金属过孔153可以相对第一导体结构120的第一部分121设置，以使得第一金属过孔153在第一面151的投影可以位于第一部分121所在的范围、在第二面152的投影可以位于第二导体件130上，以便于第一金属过孔153的两端分别电连接于第一导体结构120和第二导体件130。第二金属过孔154可以相对第一导体结构120之外 的区域设置，以使得第二金属过孔154在第一面151上的投影可以位于整个第一导体结构120之外，第二金属过孔154在第二面152的投影可以位于第二导体件130上。此时，第二导体件130在第一面151上的投影可以覆盖第一部分121并可以覆盖第一金属过孔153在第一面151的投影，第二导体件130在第二面152上的区域可以包含第一导体结构120的第一部分121在第二面152上的投影区域以及第一导体结构120在第二面152上的投影区域之外的部分区域。从而，第一导体结构120可以通过两个金属过孔，将位于第一导体结构120范围内的第一电连接端123与位于第一导体结构120范围外的第一信号端141电连接。
本申请实施例的天线装置100，第二导体件130既可以保证与第一导体结构120的第一部分121之间的间距的公差的一致性，也可以作为第一导体结构120与近场通信芯片140的第一信号端141之间的电连接件，第二导体件130可以实现复用，天线装置100可以实现小型化设计。
需要说明的是，以上仅为第一导体结构120电连接方式的示例性举例，例如第一导体结构120可以仅设置第一金属过孔153，第一导体结构120通过该第一金属过孔153可以在第一面151上与第一信号端141电连接。本申请实施例对第一导体结构120的具体电连接方式不进行限定。
基于上述天线装置100的结构，其中，请参考图9和图10，图9为图1所示的天线装置100的第一导体结构120的第二种电连接示意图，图10为图1所示的天线装置100的第一导体结构120的第三种电连接示意图。天线装置100还可以包括一个或多个(两个及两个以上)第二导体结构160。每一第二导体结构160可以与近场通信芯片140电连接，近场通信激励信号例如差分激励电流可以激励第一导体结构120和每一第二导体结构160共同支持近场通信信号的传输。
例如，如图9所示，当天线装置100包括一个第二导体结构160时，第二导体结构160上可以设有第一电连接点161和第二电连接点162，近场通信芯片140的第一信号端141可以与第二导体结构160上的一个电连接点例如第一电连接点161直接或间接电连接，第二导体结构160上的另一个电连接点例如第二电连接点162可以与第一导体结构120的一个电连接端例如第一电连接端123直接或间接电连接，第一导体结构120的另一个电连接端例如第二电连接端124可以与近场通信芯片140的第二信号端142直接或间接电连接，从而，第二导体结构160、第一导体结构120和近场通信芯片140可以形成导电回路，以传输NFC信号。再例如，如图10所示，当天线装置100包括两个第二导体结构160例如第二导体结构160a、第二导体结构160b时，第一导体结构120、两个第二导体结构160和近场通信芯片140可以相互串联并形成导电回路，以传输NFC信号。
可以理解的是，当天线装置100包括一个第二导体结构160时，第二导体结构160可以与第一导体结构120间隔设置，以使得第一导体结构120、第二导体结构160支持的NFC 信号覆盖的范围较广。当天线装置100包括多个第二导体结构160时，多个第二导体结构160之间可以间隔设置，每一第二导体结构160也可以与第一导体结构120间隔设置，以使得第一导体结构120、多个第二导体结构160支持的NFC信号覆盖的范围更广。
可以理解的是，当第一导体结构120与一个或多个第二导体结构160共同支持无线信号的传输时，第一导体结构120支持的无线信号形成的辐射场可与每一第二导体结构160支持的无线信号形成的辐射场相互增强。
本申请实施例的天线装置100设置一个或多个第二导体结构160与第一导体结构120共同支持NFC信号的传输，可以提高NFC信号的覆盖范围，提高天线装置100及NFC感应标签的感应范围。
其中，请参考图11，图11为图1所示的天线装置100的第一导体结构120的第四种电连接示意图。天线装置100还可以包括非近场通信芯片170，该非近场通信芯片170可以与一个第二导体结构160电连接，非近场通信芯片170可以提供非近场通信激励信号，非近场通信激励信号可以激励第二导体结构160支持非近场通信信号的传输。
可以理解的是，非近场通信信号可以是非平衡信号，包括但不限于蜂窝网络信号、Wi-Fi信号、GPS信号、BT信号。相应的，非近场通信芯片170可以为蜂窝通信芯片，用于提供蜂窝网络信号；非近场通信芯片170可以为Wi-Fi芯片，用于提供Wi-Fi信号；非近场通信芯片170可以为GPS芯片，用于提供GPS信号；非近场通信芯片170还可以为BT芯片，用于提供所述BT信号。
当第二导体结构160接地时，第一导体结构120也可以接地。例如，天线装置100还可以包括地系统180，地系统180可以是电势为零的区域或者结构。地系统180上可以包括间隔设置的第一接地点181和第二接地点182，地系统180在第一接地点181和第二接地点182之间形成导电路径。近场通信芯片140的第一信号端141可以与第二导体结构160上的一个电连接点例如第一电连接点161直接或间接电连接，第二导体结构160上的另一个电连接点例如第二电连接点162可以与第一接地点181直接或间接电连接，第二接地点182可以与第一导体结构120的一个电连接端例如第一电连接端123直接或间接电连接，第一导体结构120的另一个电连接端例如第二电连接端124可以与近场通信芯片140的第二信号端142直接或间接。从而，第二导体结构160、导电路径、第一导体结构120和近场通信芯片140可以形成导电回路，以传输NFC信号。
当然，以上仅为第二导体结构160接地后形成导电回路的示例性举例，其他可形成导电回路的电连接方式均在本申请实施例的保护范围内。本申请实施例对此不进行限定。
本申请实施例的天线装置100，第二导体结构160既可以用于支持NFC信号的传输，又可以支持非NFC信号的传输，从而可以实现第二导体结构160的复用，能够减少天线装置100中用于传输无线信号的导体结构的数量，可以实现天线装置100的小型化设计。
基于上述天线装置100的结构，本申请实施例还提供一种电子设备10。
电子设备10可以是智能手机、平板电脑等设备，还可以是游戏设备、增强现实(Augmented Reality，简称AR)设备、汽车装置、数据存储装置、音频播放装置、视频播放装置、笔记本电脑、桌面计算设备等。请参考图12，图12为本申请实施例提供的电子设备10的第一种结构示意图。电子设备10可以包括上述实施例中的天线装置100。
如图12所示，电子设备10还可以包括显示屏200、中框300、电路板400、电池500和后壳600。
显示屏200设置在中框300上，以形成电子设备10的显示面，用于显示图像、文本等信息。其中，显示屏200可以包括液晶显示屏(Liquid Crystal Display，LCD)或有机发光二极管(Organic Light-Emitting Diode，OLED)显示屏等类型的显示屏200。
中框300可为薄板状或薄片状的结构，也可以为中空的框体结构。中框300可为电子设备10中的电子器件或功能组件提供支撑作用，以将电子设备10的电子器件、功能组件安装到一起。例如，中框300上可以设置凹槽、凸起、通孔等结构，以便于安装电子设备10的电子器件或功能组件。可以理解的，中框300的材质可以包括金属或塑胶等。
电路板400设置在中框300上以进行固定，并通过后壳600将电路板400密封在电子设备10的内部。电路板400上可以集成有处理器，此外还可以集成耳机接口、加速度传感器、陀螺仪、马达等功能组件中的一个或多个。同时，显示屏200可以电连接至电路板400，以通过电路板400上的处理器对显示屏200的显示进行控制。
电池500设置在中框300上，并通过后壳600将电池500密封在电子设备10的内部。同时，电池500电连接至电路板400，以实现电池500为电子设备10供电。其中，电路板400上可以设置有电源管理电路。电源管理电路用于将电池500提供的电压分配到电子设备10中的各个电子器件。
后壳600与中框300连接。例如，后壳600可以通过诸如双面胶等粘接剂贴合到中框300上以实现与中框300的连接。其中，后壳600用于与中框300、显示屏200共同将电子设备10的电子器件和功能组件密封在电子设备10内部，以对电子设备10的电子器件和功能组件形成保护作用。
其中，请结合图12并请参考图13，图13为本申请实施例提供的电子设备10的第二种结构示意图。需要说明的是，图12中的正面为显示屏200、背面为后壳600；图13中的正面为后壳600、背面为显示屏200。图13为图12中的电子设备10的背视图。电子设备10还可以包括金属装饰件700。
可以理解的是，金属装饰件700可以设置于电子设备10内部，该金属装置的部分区域也可以裸露在电子设备10外部。金属装饰件700可以但不限为摄像头模组的装饰件、听筒模组的装饰件、话筒模组的装饰件，相应的，该金属装饰件700可以承载或者固定摄像头模组、听筒或者话筒。
可以理解的是，该金属装饰件700可以复用为天线装置100的第一导体件110。也就是 说，金属装饰件700可以覆盖第一导体结构120的第一部分121而不覆盖第一导体结构120的第二部分122，此时，第二导体件130可以位于第一导体结构120和金属装饰件700之间并覆盖第一部分121而不覆盖或者不完全覆盖第二部分122。
可以理解的是，实际生产加工中，金属装饰件700上的不同区域与第一导体结构120的第一部分121之间的距离的公差较大，使得当金属装饰件700覆盖第一导体结构120的第一部分121时，金属装饰件700使得第一导体结构120的不同区域支持无线信号时容易发生失谐程度不同、性能衰减程度不同的现象。而本申请实施例在金属装饰件700和第一导体结构120之间设置第二导体件130，一方面，该第二导体件130的差一致性较容易控制，另一方面，该第二导体件130的不同区域与第一部分121之间的间距的公差往往小于金属装饰件700上的不同区域与第一部分121之间的间距的公差，从而，第二导体件130可使第一导体结构120的不同区域支持无线信号时发生失谐程度基本相同、性能衰减程度也基本相同，天线装置100的辐射性能更优。
其中，如图13所示，当用户正向握持电子设备10时，该金属装饰件700与电子设备10顶部边缘之间位第五距离D5，金属装饰件700与电子设备10底部边缘之间为第六距离D6，该第五距离D5和第六距离D6的比值可在四分之一至五分之二之间，例如第五距离D5和第六距离D6的比值可为三分之一。此时，天线装置100可以设置于电子设备10正向握持时偏上的区域，天线装置100支持的无线信号的磁力线可分布于电子设备10的上1/3区域，符合用户习惯。
其中，电子设备10的后壳600上可以设有非导体区域610，该非导体区域610沿第一方向的投影可以覆盖第一导体结构120的第二部分122，以使得第一导体结构120的第二部分122支持的无线信号可以穿过该非导体区域610辐射至自由空间内。
可以理解的是，后壳600可以上设置有通孔、缝隙以形成该非导体区域610；后壳600也可以在该非导体区域610填充非导体材料以形成该非导体区域610；当然，整个后壳600也可以采用非导体材料例如陶瓷、塑胶等材质，以使得后壳600可以具有该非导体区域610。本申请实施例对非导体区域610的具体形成方式不进行限定。
需要说明的是，除了在后壳600上开设非导体区域610外，第一导体结构120的第二部分122支持的无线信号还可以通过其他的方式辐射至自由空间，例如但不限于通过中框300上的缝隙(可填充非导体材料)、中框300与后壳600之间的缝隙(可填充非导体材料)。
本申请实施例的电子设备10的后壳600上设置非导体区域610，第一导体结构120的第二部分122支持的无线信号可以传输至自由空间，天线装置100可以实现无线通信功能。
需要说明的是，以上仅为电子设备10的示例性举例，本申请实施例的电子设备10还可以包括摄像头、传感器、声电转换装置等等部件，这些部件可以参见相关技术中的描述，在此不再赘述。
需要理解的是，在本申请的描述中，诸如“第一”、“第二”等术语仅用于区分类似的 对象，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。
以上对本申请实施例提供的天线装置及电子设备进行了详细介绍。本文中应用了具体个例对本申请的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本申请。同时，对于本领域的技术人员，依据本申请的思想，在具体实施方式及应用范围上均会有改变之处，综上所述，本说明书内容不应理解为对本申请的限制。

Claims (20)

  1. 一种天线装置，包括：
    第一导体件；
    第一导体结构，沿第一方向与所述第一导体件层叠设置，所述第一导体结构包括第一部分和第二部分，所述第一部分沿所述第一方向的投影位于所述第一导体件上、所述第二部分沿所述第一方向的投影位于所述第一导体件外；所述第一导体结构用于支持无线信号的传输；
    第二导体件，设置于所述第一导体件和所述第一导体结构之间，所述第二导体件沿所述第一方向的投影覆盖所述第一部分、且不覆盖或不完全覆盖所述第二部分。
  2. 根据权利要求1所述的天线装置，其中，在所述第一方向上，所述第二导体件上的不同区域与所述第一部分之间的间距的公差小于预设公差值。
  3. 根据权利要求1所述的天线装置，其中，在所述第一方向上，所述第二导体件上的不同区域与所述第一部分之间的间距的公差、小于所述第一导体件上的不同区域与所述第一部分之间的间距的公差。
  4. 根据权利要求1所述的天线装置，其中，还包括：
    基板，包括相对设置的第一面和第二面，所述第一导体结构形成于所述第二面，所述第二导体件形成于所述第一面，所述第一导体件位于所述第一面远离所述第二面的一侧。
  5. 根据权利要求1所述的天线装置，其中，还包括：
    基板，包括相对设置的第一面和第二面，所述第一导体结构形成于或连接于所述第二面，所述第二导体件连接于所述第一面或者设置于所述第一面远离所述第二面的一侧，所述第一导体件位于所述第一面远离所述第二面的一侧。
  6. 根据权利要求4所述的天线装置，其中，所述第一导体结构包括第一电连接端和第二电连接端；所述天线装置还包括：
    近场通信芯片，用于提供近场通信激励信号，所述近场通信芯片包括第一信号端和第二信号端，所述第二信号端与所述第二电连接端电连接；
    所述基板上还设有贯穿所述第一面和所述第二面的第一金属过孔和第二金属过孔，所述第一金属过孔的两端分别电连接于所述第一电连接端和所述第二导体件，所述第二金属过孔的两端分别电连接于所述第二导体件和所述第一信号端，所述第一导体结构、第一金属过孔、所述第二导体件、所述第二金属过孔和所述近场通信芯片用于共同传输所述近场通信激励信号。
  7. 根据权利要求6所述的天线装置，其中，所述第一导体结构为金属线圈结构。
  8. 根据权利要求6所述的天线装置，其中，还包括：
    一个或多个第二导体结构，每一所述第二导体结构与所述近场通信芯片电连接；
    所述近场通信激励信号用于激励所述第一导体结构以及每一所述第二导体结构共同支 持近场通信信号的传输。
  9. 根据权利要求8所述的天线装置，其中，还包括：
    非近场通信芯片，与其中一个第二导体结构电连接，所述其中一个第二导体结构接地，所述非近场通信芯片用于提供非近场通信激励信号，所述非近场通信激励信号用于激励所述其中一个第二导体结构支持非近场通信信号的传输。
  10. 一种电子设备，包括天线装置，所述天线装置包括：
    第一导体件；
    第一导体结构，沿第一方向与所述第一导体件层叠设置，所述第一导体结构包括第一部分和第二部分，所述第一部分沿所述第一方向的投影位于所述第一导体件上、所述第二部分沿所述第一方向的投影位于所述第一导体件外；所述第一导体结构用于支持无线信号的传输；
    第二导体件，设置于所述第一导体件和所述第一导体结构之间，所述第二导体件沿所述第一方向的投影覆盖所述第一部分、且不覆盖或不完全覆盖所述第二部分。
  11. 根据权利要求10所述的电子设备，其中，所述电子设备还包括金属装饰件，所述金属装饰件为所述第一导体件。
  12. 根据权利要求11所述的电子设备，其中，当用户正向握持所述电子设备时，所述金属装饰件与所述电子设备顶部边缘之间的距离、与所述金属装饰件与所述电子设备底部边缘之间的距离的比值在四分之一至五分之二之间。
  13. 根据权利要求10所述的电子设备，其中，所述电子设备还包括后壳，所述后壳上设有非导体区域，所述非导体区域在所述第一导体结构上的投影覆盖所述第二部分。
  14. 根据权利要求10所述的电子设备，其中，在所述第一方向上，所述第二导体件上的不同区域与所述第一部分之间的间距的公差小于预设公差值。
  15. 根据权利要求10所述的电子设备，其中，在所述第一方向上，所述第二导体件上的不同区域与所述第一部分之间的间距的公差、小于所述第一导体件上的不同区域与所述第一部分之间的间距的公差。
  16. 根据权利要求10所述的电子设备，其中，所述天线装置还包括：
    基板，包括相对设置的第一面和第二面，所述第一导体结构形成于所述第二面，所述第二导体件形成于所述第一面，所述第一导体件位于所述第一面远离所述第二面的一侧。
  17. 根据权利要求16所述的电子设备，其中，所述第一导体结构包括第一电连接端和第二电连接端；所述天线装置还包括：
    近场通信芯片，用于提供近场通信激励信号，所述近场通信芯片包括第一信号端和第二信号端，所述第二信号端与所述第二电连接端电连接；
    所述基板上还设有贯穿所述第一面和所述第二面的第一金属过孔和第二金属过孔，所述第一金属过孔的两端分别电连接于所述第一电连接端和所述第二导体件，所述第二金属 过孔的两端分别电连接于所述第二导体件和所述第一信号端，所述第一导体结构、第一金属过孔、所述第二导体件、所述第二金属过孔和所述近场通信芯片用于共同传输所述近场通信激励信号。
  18. 根据权利要求17所述的电子设备，其中，所述第一导体结构为金属线圈结构。
  19. 根据权利要求17所述的电子设备，其中，所述天线装置还包括：
    一个或多个第二导体结构，每一所述第二导体结构与所述近场通信芯片电连接；
    所述近场通信激励信号用于激励所述第一导体结构以及每一所述第二导体结构共同支持近场通信信号的传输。
  20. 根据权利要求19所述的电子设备，其中，所述天线装置还包括：
    非近场通信芯片，与其中一个第二导体结构电连接，所述其中一个第二导体结构接地，所述非近场通信芯片用于提供非近场通信激励信号，所述非近场通信激励信号用于激励所述其中一个第二导体结构支持非近场通信信号的传输。
PCT/CN2023/103174 2022-09-30 2023-06-28 天线装置及电子设备 WO2024066556A1 (zh)

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Citations (5)

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Publication number Priority date Publication date Assignee Title
CN104813564A (zh) * 2012-12-10 2015-07-29 英特尔公司 用于在近场通信中多表面覆盖的级联线圈
US20180205133A1 (en) * 2017-01-17 2018-07-19 Kabushiki Kaisha Toshiba Wireless device
CN111342228A (zh) * 2020-04-24 2020-06-26 Oppo广东移动通信有限公司 天线装置及电子设备
CN111969303A (zh) * 2020-08-14 2020-11-20 Oppo广东移动通信有限公司 天线组件以及电子设备
CN113131196A (zh) * 2019-12-31 2021-07-16 Oppo广东移动通信有限公司 天线装置及电子设备

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Publication number Priority date Publication date Assignee Title
CN104813564A (zh) * 2012-12-10 2015-07-29 英特尔公司 用于在近场通信中多表面覆盖的级联线圈
US20180205133A1 (en) * 2017-01-17 2018-07-19 Kabushiki Kaisha Toshiba Wireless device
CN113131196A (zh) * 2019-12-31 2021-07-16 Oppo广东移动通信有限公司 天线装置及电子设备
CN111342228A (zh) * 2020-04-24 2020-06-26 Oppo广东移动通信有限公司 天线装置及电子设备
CN111969303A (zh) * 2020-08-14 2020-11-20 Oppo广东移动通信有限公司 天线组件以及电子设备

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