WO2024061102A1 - 复合材料、组合物及发光二极管 - Google Patents

复合材料、组合物及发光二极管 Download PDF

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WO2024061102A1
WO2024061102A1 PCT/CN2023/118855 CN2023118855W WO2024061102A1 WO 2024061102 A1 WO2024061102 A1 WO 2024061102A1 CN 2023118855 W CN2023118855 W CN 2023118855W WO 2024061102 A1 WO2024061102 A1 WO 2024061102A1
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mxene
quantum dots
light
doped
emitting diode
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French (fr)
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林雄风
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TCL Technology Group Co Ltd
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y20/00Nanooptics, e.g. quantum optics or photonic crystals
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00Nanotechnology for materials or surface science, e.g. nanocomposites
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
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    • C09K11/00Luminescent materials, e.g. electroluminescent or chemiluminescent
    • C09K11/08Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials
    • C09K11/67Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing refractory metals
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    • C09K11/00Luminescent materials, e.g. electroluminescent or chemiluminescent
    • C09K11/08Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials
    • C09K11/67Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing refractory metals
    • C09K11/68Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing refractory metals containing chromium, molybdenum or tungsten
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    • C09K11/00Luminescent materials, e.g. electroluminescent or chemiluminescent
    • C09K11/08Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials
    • C09K11/67Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing refractory metals
    • C09K11/69Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing refractory metals containing vanadium
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    • C09K11/00Luminescent materials, e.g. electroluminescent or chemiluminescent
    • C09K11/08Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials
    • C09K11/88Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing selenium, tellurium or unspecified chalcogen elements
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    • C09K11/00Luminescent materials, e.g. electroluminescent or chemiluminescent
    • C09K11/08Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials
    • C09K11/88Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing selenium, tellurium or unspecified chalcogen elements
    • C09K11/881Chalcogenides
    • C09K11/883Chalcogenides with zinc or cadmium
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/10OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/11OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
    • H10K50/115OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers comprising active inorganic nanostructures, e.g. luminescent quantum dots
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays

Definitions

  • the present application relates to the field of semiconductor materials, and in particular to a composite material, composition and light-emitting diode.
  • a light-emitting diode includes a cathode, an anode and a light-emitting layer between the anode and cathode. Driven by an external electric field, electrons and holes are injected from the cathode and anode respectively. The electrons and holes combine to form excitons, which radiate and emit light. The balance between electron injection and hole injection has an impact on the luminous efficiency of quantum dot light-emitting diodes (QLED). The balance between electron injection and hole injection is related to the material of the light-emitting layer.
  • QLED quantum dot light-emitting diodes
  • the present application provides a composite material, composition and light-emitting diode.
  • the present application provides a composite material, including quantum dots and Mxene material.
  • the Mxene material is in a sheet shape, and the quantum dots are embedded in the gaps between adjacent Mxene materials.
  • adjacent Mxene materials are stacked and spaced apart from each other to form a gap space, and at least part of the quantum dots are embedded in the gap space.
  • the composite material consists of quantum dots and Mxene materials.
  • the general chemical formula of the Mxene material is M n +1 x includes at least one of O 2- , OH - and F - .
  • the Mxene materials include Ti 2 CT x , TiNbCT x , Ti 3 CN x T x , Ta 4 C 3 T x , Nb 2 CT x , V 2 CT x , Nb 4 C 3 T x , At least one of Mo 2 CT x and Ti 4 N 3 T x , wherein, T x includes at least one of O 2- , OH - and F - .
  • the weight ratio of the Mxene material and the quantum dots is (0.5-5): (10-60).
  • the quantum dots are selected from at least one of single structure quantum dots and core-shell structure quantum dots
  • the single structure quantum dots are selected from II-VI compounds, IV-VI compounds, III- At least one of Group V compounds, Group I-III-VI compounds and perovskite-type semiconductor materials
  • the Group II-VI compound is selected from the group consisting of CdS, CdSe, CdTe, ZnS, ZnSe, ZnTe, ZnO, HgS, HgSe , HgTe, CdSeS, CdSeTe, CdSTe, ZnSeS, ZnSeTe, ZnSTe, HgSeS, HgSeTe, HgSTe, CdZnS, CdZnSe, CdZnTe, CdHgS, CdHgSe, CdHgTe, HgZnS, HgZnSe, HgZnTe, CdZnSe
  • the IV-VI group compound is selected from SnS, SnSe, SnTe, PbS, PbSe, PbTe, SnSeS, SnSeTe, SnSTe, PbSeS, PbSeTe, PbSTe, SnPbS, SnPbSe, SnPbTe , at least one of SnPbSSe, SnPbSeTe, SnPbSTe, the III-V group compound is selected from GaN, GaP, GaAs, GaSb, AlN, AlP, AlAs, AlSb, InN, InP, InAs, InSb, GaNP, GaNAs, GaNSb , GaPAs, GaPSb, AlNP, AlNAs, AlNSb
  • This application also proposes a composition, including a solvent, quantum dots and Mxene materials, with the quantum dots embedded in the gaps between adjacent Mxene materials.
  • adjacent Mxene materials are stacked and spaced apart from each other to form a gap space, and at least part of the quantum dots are embedded in the gap space.
  • the weight ratio of the Mxene material to the quantum dots is (0.5-5):(10-60).
  • the concentration of the Mxene material in the composition is 0.5-5 mg/mL.
  • the concentration of the quantum dots in the composition is 10-60 mg/mL.
  • the solvent includes at least one of octane, toluene, carbon tetrachloride, n-hexane, cyclohexane, heptane, and liquid paraffin.
  • the general chemical formula of the Mxene material is M n +1 x includes at least one of O 2- , OH - and F - .
  • the Mxene materials include Ti 2 CT x , TiNbCT x , Ti 3 CN x T x , Ta 4 C 3 T x , Nb 2 CT x , V 2 CT x , Nb 4 C 3 T x , At least one of Mo 2 CT x and Ti 4 N 3 T x , where T x includes at least one of O 2- , OH - and F - .
  • This application also proposes a light-emitting diode, including a stacked anode, a light-emitting layer and a cathode.
  • the material of the light-emitting layer includes the composite material as described above, or the light-emitting layer is made of a composition, and the composition Included are compositions as described above.
  • the anode and the cathode are independently selected from metal electrodes, carbon-silicon material electrodes, metal oxide electrodes or composite electrodes, and the material of the metal electrode is selected from Ag, Al, Mg, Au, At least one of Cu, Mo, Pt, Ca and Ba, the material of the carbon-silicon material electrode is selected from at least one of silicon, graphite, carbon nanotubes, graphene and carbon fiber, the metal oxide electrode is The material is selected from the group consisting of indium-doped tin oxide, fluorine-doped tin oxide, antimony-doped tin oxide, aluminum-doped zinc oxide, gallium-doped zinc oxide, indium-doped zinc oxide, magnesium-doped zinc oxide, and aluminum-doped magnesium oxide.
  • the composite electrode is selected from AZO/Ag/AZO, AZO/Al/AZO, ITO/Ag/ITO, ITO/Al/ITO, ZnO/Ag/ZnO, ZnO/Al/ZnO, TiO 2 /Ag/TiO 2 , TiO 2 /Al/TiO 2 , ZnS/Ag/ZnS or ZnS/Al/ZnS.
  • the light-emitting diode further includes a hole transport layer disposed between the anode and the light-emitting layer, and the material of the hole transport layer includes poly[bis(4-phenyl)(2) ,4,6-trimethylphenyl)amine], 2,2',7,7'-tetrakis[N,N-bis(4-methoxyphenyl)amino]-9,9'-spirobis Fluorene, 4,4'-cyclohexylbis[N,N- Bis(4-methylphenyl)aniline], N,N′-bis(1-naphthyl)-N,N′-diphenyl-1,1′-diphenyl-4,4′-diamine , 4,4'-bis(N-carbazole)-1,1'-biphenyl, poly[(9,9-dioctylfluorenyl-2,7-diyl)-co-(4,4' -(N
  • the light-emitting diode further comprises a hole injection layer disposed between the anode and the light-emitting layer, wherein the material of the hole injection layer comprises poly(ethylenedioxythiophene): polystyrene sulfonate, poly(9,9-dioctyl-fluorene-co-N-(4-butylphenyl)-diphenylamine), polyarylamine, poly(N-vinylcarbazole), polyaniline, polypyrrole, N,N,N',N'-tetrakis(4-methoxyphenyl)-benzidine, 4-bis[N-(1-naphthyl)-N-phenyl-amino]biphenyl, 4,4',4"-tri[phenyl(m-methoxyphenyl)- One or more of: triphenylamine, 4,4',4"-tri(N-carbazolyl)-triphenylamine
  • the light-emitting diode further includes an electron transport layer disposed between the cathode and the light-emitting layer.
  • the material of the electron transport layer includes metal oxide, doped metal oxide, II-VI At least one of group III-V semiconductor materials, group III-V semiconductor materials and group I-III-VI semiconductor materials;
  • the metal oxide includes at least one of ZnO, TiO 2 , SnO 2 and Al 2 O 3 ;
  • the metal oxide in the doped metal oxide includes at least one of ZnO, TiO 2 and SnO 2 , and the doping element includes at least one of Al, Mg, Li, In and Ga;
  • the II-VI group The semiconductor material includes at least one of ZnS, ZnSe, and CdS;
  • the III-V group semiconductor material includes at least one of InP and GaP;
  • the I-III-VI group semiconductor material includes at least one of CuInS and CuGaS kind.
  • Figure 1 is a schematic structural diagram of a light-emitting diode according to an embodiment of the present application
  • Figure 2 is a schematic structural diagram of a light-emitting diode according to another embodiment of the present application.
  • Figure 3 is a schematic flow chart of a method for preparing a composition according to an embodiment of the present application.
  • At least one means one or more, and “plurality” means two or more.
  • At least one means one or more, and “plurality” means two or more.
  • At least one means one of the following” or similar expressions thereof refers to any combination of these items, including any combination of a single item (items) or a plurality of items (items).
  • at least one of a, b, or c or “at least one of a, b, and c” can mean: a, b, c, ab ( That is, a and b), ac, bc, or abc, where a, b, and c can be single or multiple respectively.
  • this application proposes a composite material.
  • the composite material includes quantum dots 1 and Mxene material 2.
  • the Mxene material 2 is in a sheet shape, and the quantum dot 1 is embedded in the adjacent Mxene material 2. in the gap between.
  • the technical solution of this application provides a composite material.
  • the composite material includes quantum dots 1 and Mxene material 2. Since the Mxene material 2 exhibits a sheet-like morphology, as shown in Figures 1 and 2, during the mixing and stacking process, the Mxene material 2 form a layer-like structure, and at least a part of the quantum dots 1 will be embedded into the gaps between adjacent Mxene materials 2 . Moreover, since the surface of the Mxene material 2 itself is negatively charged, the quantum dots 1 embedded in the gaps between the adjacent Mxene materials 2 are in contact with the surface of the Mxene material 2, so that the surface of the quantum dot 1 is negatively charged, so that The composite material has electron-repelling properties.
  • the composite material When the composite material is used to make the light-emitting layer 20 of the light-emitting diode 100, under the action of Coulomb force, the negatively charged light-emitting layer 20 on the surface attracts the positively charged holes, lowers the hole injection barrier, and promotes hole injection. At the same time, due to the repulsion of electrons by the negative charge on the surface of quantum dot 1, the potential barrier for electron injection is increased and the injection of electrons is reduced, thereby achieving the control of device charge balance.
  • two adjacent Mxene materials 2 are stacked, facing each other and spaced apart from each other, thereby defining a gap space between them, and at least a portion of the quantum dots 1 are embedded in the gap space and abut against the surfaces of the two Mxene materials 2.
  • the composite material consists of quantum dots 1 and Mxene material 2.
  • the general chemical formula of the Mxene material 2 is M n+1 T x includes any one or more of O 2- , OH - , F - .
  • the transition metal can be selected from one or more of any transition metal elements known in the art, for example, Ti, Zr, Hf, V, Nb, Ta, Cr, Sc, etc.; T x refers to a two-dimensional material surface groups. Any two-dimensional material that conforms to the above general chemical formula can be combined with the quantum dots 1 to form the composite material described in this application, and when the composite material is used to make the light-emitting layer 20 of the light-emitting diode 100, it will reduce the charge of the device. The improvement effect of balance is better, which can greatly improve the luminous efficiency and life of the device.
  • the Mxene material 2 can be selected from, but is not limited to, Ti 2 CT x , TiNbCT x , Ti 3 CN x T x , Ta 4 C 3 T x , Nb 2 CT x , V 2 CT x , Nb 4 C 3 T x , Mo 2 CT, Ti 4 N 3 T x At least one of them, wherein T x includes at least one of O 2- , OH - and F - .
  • these Mxene materials 2 are used to make the light-emitting layer 20 of the light-emitting diode 100, they have a better effect on improving the charge balance of the device, and can greatly improve the luminous efficiency and life of the device.
  • the quantum dots 1 may be selected from, but are not limited to, at least one of single structure quantum dots and core-shell structure quantum dots.
  • the single structure quantum dot is selected from at least one of II-VI compounds, IV-VI compounds, III-V compounds, I-III-VI compounds and perovskite semiconductor materials, and Group II-VI compounds are selected from CdS, CdSe, CdTe, ZnS, ZnSe, ZnTe, ZnO, HgS, HgSe, HgTe, CdSeS, CdSeTe, CdSTe, ZnSeS, ZnSeTe, ZnSTe, HgSeS, HgSeTe, HgSTe, CdZnS, CdZnSe, CdZnTe , CDHGS, CDHGSE, CDHGTE, HGZNS, HGZNSE, HGZNTE, CDZNSES, CDZNSETE, CDZNSTE, CDHGS
  • the weight ratio of the Mxene material 2 and the quantum dots 1 is (0.5 ⁇ 5):(10 ⁇ 60), for example, the Mxene material 2 and the quantum dots
  • the weight ratio of 1 can be (0.5 ⁇ 1):(10 ⁇ 20), (0.5 ⁇ 1):(15 ⁇ 30), (0.5 ⁇ 5):(20 ⁇ 35), (0.5 ⁇ 5):(32 ⁇ 45), (0.5 ⁇ 5): (40 ⁇ 60), (1 ⁇ 3): (50 ⁇ 60), (2 ⁇ 4): (20 ⁇ 40), (3 ⁇ 5): (30 ⁇ 50 ), etc., within this range, it can not only maximize the concentration of Mxene material 2, improve hole injection, and reduce electron injection, but also avoid agglomeration and ensure that quantum dots 1 are smoothly embedded into two adjacent layers of Mxene material 2 at the same time, sufficient content of quantum dots 1 can be ensured, so that the manufactured light-emitting diode 100 has higher luminous efficiency.
  • the present application also proposes a composition, which includes a solvent and a composite material as described above.
  • the light-emitting layer 20 of the light-emitting diode 100 can be prepared using the composition.
  • the solvent may be any common solvent capable of dissolving the quantum dots 1 and the Mxene material 2, for example, at least one of non-polar alkyl solvents.
  • the solvent can be selected from, but is not limited to, at least one of octane, toluene, carbon tetrachloride, n-hexane, cyclohexane, heptane and liquid paraffin.
  • the above solvents can be used very well.
  • the quantum dots 1 and the Mxene material 2 are dispersed effectively to form a liquid composition, which not only has good material dispersion, but also facilitates the production of the luminescent layer 20 through a solution method.
  • the concentration of the Mxene material 2 is 0.5-5 mg/mL.
  • the concentration of the Mxene material 2 can be 0.5 mg/mL, 0.6 mg/mL, 0.8 mg/mL, 1 mg/mL, 2mg/mL, 2.5mg/mL, 3mg/mL, 3.5mg/mL, 4mg/mL, 4.5mg/mL, 5mg/mL and values within the range between any two of the above values, etc. Within this range, it can not only maximize the concentration of Mxene material 2, improve hole injection, and reduce electron injection, but also avoid agglomeration and ensure that quantum dots 1 are successfully embedded between two adjacent layers of Mxene material 2.
  • the concentration of the quantum dots 1 in the composite material is 10 to 60 mg/ml.
  • the concentration of the quantum dots 1 can be 10 mg/ml, 15 mg/ml, or 20 mg/ml. ml, 25mg/ml, 30mg/ml, 35mg/ml, 40mg/ml, 45mg/ml, 50mg/ml, 55mg/ml, 60mg/ml and values within the range between any two of the above values, etc., within this range
  • the composite material is used to prepare the light-emitting diode 100, it helps to improve the luminous efficiency of the light-emitting diode 100.
  • this application also proposes a preparation method of the composition.
  • the preparation method includes the following steps:
  • Step S10 provide quantum dots 1, Mxene material 2 and solvent
  • Step S20 Disperse the quantum dots 1 and the Mxene material 2 in the solvent to obtain a composition.
  • step S20 during specific implementation, the quantum dots 1 and Mxene materials 2 can be added to the solvent together, and then stirred and mixed; the solvent can also be divided into two parts first, and the quantum dots 1, Mxene materials 2 can be added into the solvent together. Material 2 is dispersed in two parts of solvent respectively to prepare two mixed solutions, and then the two mixed solutions are mixed.
  • the mixing methods include but are not limited to mechanical stirring, magnetic stirring, ultrasonic and other means.
  • the step of dispersing the quantum dots 1 and the Mxene material 2 in the solvent is performed under ultrasonic conditions.
  • the power of ultrasound is 1-3W/cm 2 , for example, 1W/cm 2 , 1.2W/cm 2 , 1.5W/cm 2 , 1.8W/cm 2 , 2W/cm 2 , 2.3W/cm 2 , 2.5W/cm 2 , 2.8W/cm 2 , 3W/cm 2 and values within the range between any two of the above values, etc.
  • the time is 5 ⁇ 30min, for example, 5min, 6min, 8min, 9min, 10min, 15min, 18min, 20min, 23min, 25min, 26min, 28min, 30min and values within the range between any two of the above values, etc., so that it can
  • the quantum dot 1 and the Mxene material 2 are fully dispersed in the solvent, so that the quantum dot 1 can be inserted into the gap between adjacent two-dimensional material sheets.
  • the step of dispersing the quantum dots 1 and the Mxene material 2 in the solvent is performed under stirring conditions.
  • the stirring speed is 200 to 1000rpm, for example, 200rpm, 300rpm, 400rpm, 500rpm, 600rpm, 700rpm, 800rpm, 900rpm, 1000rpm, and values within the range between any two of the above values, etc.
  • the stirring time is 5 ⁇ 8h, for example, 5h, 5.5h, 6h, 6.5h, 7h, 7.5h, 8h and values within the range between any two of the above values, etc.
  • the Mxene material 2 can be fully dispersed in the solvent, thereby promoting the insertion of the quantum dots 1 into the gaps between adjacent Mxene material 2 sheets.
  • this application also proposes a light-emitting diode 100.
  • the light-emitting diode 100 includes a stacked anode 10, a light-emitting layer 20 and a cathode 30.
  • the material of the luminescent layer 20 includes the composite material as described above, or the luminescent layer 20 is made of a composition, the composition includes the composition as described above, or the composition is made of Prepared by the preparation method described above.
  • the anode 10 and the cathode 30 are the anode 10 and the cathode 30 known in the art for the light-emitting diode 100.
  • they can be independently selected from, but are not limited to, metal electrodes, carbon-silicon material electrodes, and metal oxide electrodes.
  • the material of the metal electrode is selected from at least one of Ag, Al, Mg, Au, Cu, Mo, Pt, Ca and Ba
  • the material of the carbon-silicon material electrode is selected from silicon, graphite , at least one of carbon nanotubes, graphene and carbon fiber
  • the material of the metal oxide electrode is selected from the group consisting of indium doped tin oxide, fluorine doped tin oxide, antimony doped tin oxide, aluminum doped zinc oxide, gallium At least one of doped zinc oxide, indium doped zinc oxide, magnesium doped zinc oxide and aluminum doped magnesium oxide
  • the composite electrode is selected from AZO/Ag/AZO, AZO/Al/AZO, ITO/Ag/ ITO, ITO/Al/ITO, ZnO/Ag/ZnO, ZnO/Al/ZnO, TiO 2 /Ag/TiO 2 , TiO 2 /Al/TiO 2 , ZnS/Ag/
  • the light-emitting diode 100 may also be provided with some functional layers for the light-emitting diode 100 that help improve the diode performance, such as a hole transport layer 50 , a hole injection layer 40 , etc.
  • the material of the hole transport layer 50 can be a material known in the art for the hole transport layer 50 , for example, it can be selected from but not limited to poly[bis(4-phenyl)(2,4,6-tris)].
  • Methylphenyl)amine] PTAA
  • 2,2',7,7'-tetrakis[N,N-bis(4-methoxyphenyl)amino]-9,9'-spirobifluorene (spiro -omeTAD)
  • N,N'-bis(1-naphthyl)-N,N'- Diphenyl-1,1′-diphenyl-4,4′-diamine NPB
  • 4,4′-bis(N-carbazole)-1,1′-biphenyl CBP
  • the material of the hole injection layer 40 can be a material known in the art for the hole injection layer 40, such as, but not limited to, poly(ethylenedioxythiophene):polystyrene sulfonate (PEDOT:PSS), poly(9,9-dioctyl-fluorene-co-N-(4-butylphenyl)-diphenylamine) (TFB), polyarylamine, poly(N-vinylcarbazole), polyaniline, polypyrrole, N,N,N',N'-tetrakis(4-methoxyphenyl)-benzidine (TPD), 4-bis[N-(1-naphthyl)-N-phenyl-amino]biphenyl ( ⁇ -NPD), 4,4',4"-tris[phenyl(m-tolyl)amino]triphenylamine (m-MTDATA), 4,4',4"-tris(N-carbazolyl
  • the material of the electron transport layer 60 may be selected from, but is not limited to, at least one of metal oxides, doped metal oxides, II-VI semiconductor materials, III-V semiconductor materials, and I-III-VI semiconductor materials. kind.
  • the metal oxide can be selected from, but is not limited to, at least one of ZnO, TiO 2 , SnO 2 , and Al 2 O 3 ;
  • the metal oxide in the doped metal oxide can be selected from, but is not limited to At least one of ZnO, TiO 2 and SnO 2
  • the doping element can be selected from but not limited to at least one of Al, Mg, Li, In and Ga;
  • the II-VI semiconductor group material can be selected from but not limited to Limited to at least one of ZnS, ZnSe and CdS;
  • the III-V semiconductor group material can be selected from but not limited to at least one of InP and GaP;
  • the I-III-VI group semiconductor material can be selected from but not limited to Limited to at least one of CuIn
  • each layer of the light-emitting diode 100 can be adjusted according to the lighting requirements of the light-emitting diode 100 .
  • the light-emitting diode 100 can be a positive light-emitting diode or an inverted light-emitting diode.
  • this application also proposes a method for manufacturing the light-emitting diode 100.
  • the preparation method of the light-emitting diode 100 includes the following steps:
  • Step S10a providing an anode 10
  • Step S20a provide a composition, and place the composition on a surface of the anode 10 to obtain the luminescent layer 20;
  • step S30a a cathode 30 is formed on the side of the light-emitting layer 20 away from the anode 10.
  • the preparation method of the light-emitting diode 100 includes the following steps:
  • the preparation method includes the following steps:
  • Step S10b provide cathode 30
  • Step S20b provide a composition, and place the composition on a surface of the cathode 30 to obtain the luminescent layer 20;
  • Step S30b forming an anode 10 on the side of the light-emitting layer 20 facing away from the cathode 30;
  • the composition includes a composite material and a solvent, the composite material includes quantum dots 1 and Mxene material 2, the Mxene material 2 is in a sheet shape, and the quantum dots 1 are embedded in the gaps between adjacent Mxene materials 2.
  • the light-emitting diode 100 further includes a hole transport layer 50 , a hole injection layer 40 and an electron transport layer 60 .
  • the light-emitting diode 100 is a positive-type light-emitting diode, and the preparation method of the light-emitting diode 100 includes the following steps:
  • Step S100 providing an anode 10
  • Step S200 provide a hole injection material, and arrange the hole injection material on the anode 10 to obtain the hole injection layer 40;
  • Step S300 provide a hole transport material, and arrange the hole transport material on the hole injection layer 40 to obtain the hole transport layer 50;
  • Step S400 provide a composition, and place the composition on the hole transport layer 50 to obtain the light-emitting layer 20;
  • Step S500 forming a cathode 30 on the light-emitting layer 20.
  • the preparation method of the anode 10 can be implemented using conventional techniques in the art, such as chemical law or physical law.
  • chemical methods include chemical vapor deposition method, continuous ion layer adsorption and reaction method, anodizing method, electrolytic deposition method, and co-precipitation method.
  • Physical methods include physical coating methods and solution methods.
  • physical coating methods include: thermal evaporation coating method, electron beam evaporation coating method, magnetron sputtering method, multi-arc ion coating method, physical vapor deposition method, atomic layer deposition method, Pulse laser deposition method, etc.; solution method can be spin coating method, printing method, inkjet printing method, scraping method, printing method, dip pulling method, soaking method, spray coating method, roller coating method, casting method, slit method Coating method and strip coating method, etc.
  • an embodiment of the present application further provides a display device, which includes the light emitting diode 100 .
  • composition is prepared as follows:
  • the preparation method of QLED devices is as follows:
  • a glass substrate having an ITO anode is provided, wherein the thickness of the anode 10 is 50 nm.
  • step (3) After the semi-finished product obtained in step (3) is cooled, spin-coat the composition prepared by the above method on the surface of the hole transport layer 50 in a nitrogen atmosphere to form a luminescent layer 20 with a thickness of 25 nm.
  • step (6) Put the semi-finished product obtained in step (5) into a vacuum chamber, evaporate a layer of silver with a thickness of 100 nm on the surface of the electron transport layer 60 as the cathode 30, and package it to obtain a QLED device.
  • the concentration of the Mxene material is 0.5 mg/mL.
  • the concentration of the Mxene material is 5 mg/mL.
  • the concentration of the Mxene material is 0.4 mg/mL.
  • the concentration of the Mxene material is 5.5 mg/mL.
  • the Mxene material is Nb 2 CT x .
  • the Mxene material is V 2 CT x .
  • the Mxene material is a mixture of Ti 3 C 2 T x and Nb 2 CT x , and the weight ratio of the two is 1:1.
  • This comparative example is basically the same as Example 1, except that:
  • Two-dimensional materials are removed from the composition.
  • step (2) of the preparation method of the composition is:
  • the mass ratio of Mxene to GO is 1:20. After ultrasonic for 5 minutes, stir for 5 hours so that the single-layer Mxene nanosheets are completely embedded in two adjacent single-layer GO. between nanosheets.
  • the mixture was vacuum filtered, and the precipitate was dried at 100°C for 10 h to obtain a dry product.
  • the dry product was added to the hydroiodic acid solution and reacted for 6 hours for reduction treatment to obtain Mxene functionalized rGO.
  • Mxene functionalized rGO was dispersed in a DMF solution containing 1-aminopyrene-disuccinic acid diester (AD), stirred continuously, and cross-linked for 1 hour. The precipitate was collected and washed 6 times with DMF and ethanol each to obtain MrGO.
  • -AD composite nanosheets disperse MrGO-AD composite nanosheets in octane to prepare a MrGO-AD composite nanosheet solution, in which the concentration of MrGO-AD composite nanosheets is 1 mg/mL.
  • the quantum dots CdZnSe/CdS are dispersed in octane, and then uniformly mixed with the MrGO-AD composite nanosheet solution to obtain a composite material.
  • the concentration of the MrGO-AD composite nanosheet is 1 mg/mL
  • the quantum dots are The concentration of CdZnSe/CdS is 20 mg/mL.
  • This comparative example is basically the same as Example 1, the only difference is that in this comparative example:
  • the Mxene material is MoS 2 .
  • This comparative example is basically the same as Example 1, the only difference is that in this comparative example:
  • the Mxene material is graphene oxide.
  • the detection method of external quantum efficiency EQE is: logarithmic conversion of electrons-holes injected into quantum dots It is the ratio of the number of emitted photons, and the unit is %. It is an important parameter to measure the quality of electroluminescent devices. It can be obtained by measuring it with EQE optical testing instrument.
  • the specific calculation formula is as follows:
  • etae is the optical output coupling efficiency
  • eta ⁇ is the ratio of the number of recombinated carriers to the number of injected carriers
  • x is the ratio of the number of excitons that generate photons to the total number of excitons
  • KR is the radiation process rate
  • KNR is Nonradiative process rate.
  • Test conditions Carry out at room temperature, air humidity is 30 ⁇ 60%.
  • the time for the brightness to drop to 95% of the maximum brightness is defined as T95.
  • This life is the measured life.
  • the device life test is usually performed under high brightness by accelerating device aging, and the life under high brightness is obtained by fitting the extended exponential decay brightness attenuation fitting formula. For example: the life under 1000nit is calculated as T95@ 1000nit.
  • the specific calculation formula is as follows:
  • T95 L is the life at low brightness
  • T95 H is the measured life at high brightness
  • L H is the device accelerated to the highest brightness
  • L L is 1000nit
  • A is the acceleration factor.
  • several groups of green QLED devices were measured Lifetime at rated brightness yields an A value of 1.7.
  • the preparation method of an EOD is basically the same as that of its corresponding complete QLED device. The only difference is that the hole injection layer and the hole transport layer are subtracted.
  • the preparation method of a single-hole device is basically the same as that of its corresponding complete QLED device, the only difference is that the electron transport layer is subtracted.
  • the devices used in the external quantum efficiency test and the device life test are the QLED devices with complete structures in the above embodiments and comparative examples; the devices used in test item (3) are corresponding to the QLED devices in the above embodiments and comparative examples. single carrier devices.
  • Each example shows high external quantum efficiency and long life, indicating that the light-emitting diode produced by the solution of this application has excellent luminous efficiency and life;

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Abstract

本申请公开了一种复合材料、组合物及发光二极管,本申请公开的复合材料包括量子点和呈片状结构的Mxene材料,由于Mxene材料自身表面带负电,嵌设在相邻的所述Mxene材料之间的间隙中的部分量子点与Mxene材料的表面接触,使得这一部分量子点的表面带负电,从而使得所述复合材料具有斥电子的特性。

Description

复合材料、组合物及发光二极管
本申请要求于2022年09月21日在中国专利局提交的、申请号为202211152919.3、申请名称为“复合材料、组合物及其制备方法、发光二极管及显示装置”的中国专利申请的优先权,其全部内容通过引用结合在本申请中。
技术领域
本申请涉及半导体材料领域,尤其涉及一种复合材料、组合物及发光二极管。
背景技术
发光二极管包括阴极、阳极和位于阳极和阴极之间的发光层,在外加电场的驱动下,电子和空穴分别从阴极和阳极注入,电子和空穴结合形成激子,激子辐射发光。电子注入和空穴注入的平衡性,对量子点发光二极管(QLED)的发光效率存在影响。而电子注入和空穴注入的平衡性与发光层的制成材料有关。
技术解决方案
因此,本申请提供一种复合材料、组合物及发光二极管。
本申请提供一种复合材料,包括量子点和Mxene材料,所述Mxene材料呈片状,所述量子点嵌设在相邻的所述Mxene材料之间的间隙中。
在一些实施例中,相邻的所述Mxene材料层叠且相互间隔形成间隙空间,至少部分所述量子点嵌设在所述间隙空间中。
在一些实施例中,所述复合材料由量子点和Mxene材料组成。
在一些实施例中,所述Mxene材料的化学通式为Mn+1XnTx,M选自过渡金属中的至少一种,X选自C或N,n值为1~3,Tx包括O2-、OH-、F-中的至少一种。
在一些实施例中,所述Mxene材料包括Ti2CTx、TiNbCTx、Ti3CNxTx、Ta4C3Tx、Nb2CTx、V2CTx、Nb4C3Tx、Mo2CTx、Ti4N3Tx中的至少一种,其中, Tx包括O2-、OH-、F-中的至少一种。
在一些实施例中,所述复合材料中,所述Mxene材料和所述量子点的重量比为(0.5~5):(10~60)。
在一些实施例中,所述量子点选自单一结构量子点及核壳结构量子点中的至少一种,所述单一结构量子点选自II-VI族化合物、IV-VI族化合物、III-V族化合物、I-III-VI族化合物和钙钛矿型半导体材料中的至少一种,所述II-VI族化合物选自CdS、CdSe、CdTe、ZnS、ZnSe、ZnTe、ZnO、HgS、HgSe、HgTe、CdSeS、CdSeTe、CdSTe、ZnSeS、ZnSeTe、ZnSTe、HgSeS、HgSeTe、HgSTe、CdZnS、CdZnSe、CdZnTe、CdHgS、CdHgSe、CdHgTe、HgZnS、HgZnSe、HgZnTe、CdZnSeS、CdZnSeTe、CdZnSTe、CdHgSeS、CdHgSeTe、CdHgSTe、HgZnSeS、HgZnSeTe及HgZnSTe中的至少一种,所述IV-VI族化合物选自SnS、SnSe、SnTe、PbS、PbSe、PbTe、SnSeS、SnSeTe、SnSTe、PbSeS、PbSeTe、PbSTe、SnPbS、SnPbSe、SnPbTe、SnPbSSe、SnPbSeTe、SnPbSTe中的至少一种,所述III-V族化合物选自GaN、GaP、GaAs、GaSb、AlN、AlP、AlAs、AlSb、InN、InP、InAs、InSb、GaNP、GaNAs、GaNSb、GaPAs、GaPSb、AlNP、AlNAs、AlNSb、AlPAs、AlPSb、InNP、InNAs、InNSb、InPAs、InPSb、GaAlNP、GaAlNAs、GaAlNSb、GaAlPAs、GaAlPSb、GaInNP、GaInNAs、GaInNSb、GaInPAs、GaInPSb、InAlNP、InAlNAs、InAlNSb、InAlPAs及InAlPSb中的至少一种,所述I-III-VI族化合物选自CuInS2、CuInSe2及AgInS2中的至少一种,所述钙钛矿型半导体材料包括掺杂或非掺杂的无机钙钛矿型半导体、及掺杂或非掺杂的有机-无机杂化钙钛矿型半导体中的至少一种,所述无机钙钛矿型半导体的结构通式为AMX3,所述有机-无机杂化钙钛矿型半导体的结构通式为BMX3,其中,A为Cs+,M为二价金属阳离子,X为卤素阴离子,B为有机胺阳离子,所述有机胺阳离子包括CH3(CH2)n-2NH3 +(n≥2)或NH3(CH2)nNH3 2+(n≥2);所述核壳结构的量子点的核选自所述单一结构量子点中的任意一种,所述核壳结构的量子点的壳层材料选自CdS、CdTe、CdSeTe、CdZnSe、CdZnS、CdSeS、ZnSe、ZnSeS和ZnS中的至少一种。
本申请还提出一种组合物,包括溶剂、量子点和Mxene材料,相邻的所述Mxene材料之间的间隙中嵌设有所述量子点。
在一些实施例中,相邻的所述Mxene材料层叠且相互间隔形成间隙空间,至少部分所述量子点嵌设在所述间隙空间中。
在一些实施例中,所述组合物中,所述Mxene材料和所述量子点的重量比为(0.5~5):(10~60)。
在一些实施例中,所述组合物中,所述Mxene材料的浓度为0.5~5mg/mL。
在一些实施例中,所述组合物中,所述量子点的浓度为10~60mg/mL。
在一些实施例中,所述溶剂包括辛烷、甲苯、四氯化碳、正己烷、环己烷、庚烷及液体石蜡中的至少一种。
在一些实施例中,所述Mxene材料的化学通式为Mn+1XnTx,M选自过渡金属中的至少一种,X选自C或N,n值为1~3,Tx包括O2-、OH-、F-中的至少一种。
在一些实施例中,所述Mxene材料包括Ti2CTx、TiNbCTx、Ti3CNxTx、Ta4C3Tx、Nb2CTx、V2CTx、Nb4C3Tx、Mo2CTx、Ti4N3Tx中的至少一种,其中,Tx包括O2-、OH-、F-中的至少一种。
本申请还提出一种发光二极管,包括层叠的阳极、发光层和阴极,所述发光层的材料包括如上文所述的复合材料,或者,所述发光层由组合物制成,所述组合物包括如上文所述的组合物。
在一些实施例中,所述阳极和所述阴极分别独立地选自金属电极、碳硅材料电极、金属氧化物电极或复合电极,所述金属电极的材料选自Ag、Al、Mg、Au、Cu、Mo、Pt、Ca及Ba中的至少一种,所述碳硅材料电极的材料选自硅、石墨、碳纳米管、石墨烯以及碳纤维中的至少一种,所述金属氧化物电极的材料选自铟掺杂氧化锡、氟掺杂氧化锡、锑掺杂氧化锡、铝掺杂氧化锌、镓掺杂氧化锌、铟掺杂氧化锌、镁掺杂氧化锌及铝掺杂氧化镁中的至少一种,所述复合电极选自AZO/Ag/AZO、AZO/Al/AZO、ITO/Ag/ITO、ITO/Al/ITO、ZnO/Ag/ZnO、ZnO/Al/ZnO、TiO2/Ag/TiO2、TiO2/Al/TiO2、ZnS/Ag/ZnS或ZnS/Al/ZnS。
在一些实施例中,所述发光二极管还包括设于所述阳极和所述发光层之间的空穴传输层,所述空穴传输层的材料包括聚[双(4-苯基)(2,4,6-三甲基苯基)胺]、2,2',7,7'-四[N,N-二(4-甲氧基苯基)氨基]-9,9'-螺二芴、4,4'-环己基二[N,N- 二(4-甲基苯基)苯胺]、N,N′-双(1-奈基)-N,N′-二苯基-1,1′-二苯基-4,4′-二胺、4,4'-双(N-咔唑)-1,1'-联苯、聚[(9,9-二辛基芴基-2,7-二基)-co-(4,4'-(N-(对丁基苯基))二苯胺)]、聚(9-乙烯基咔唑)、聚三苯胺、4,4',4”-三(咔唑-9-基)三苯胺、N,N'-二苯基-N,N'-二(3-甲基苯基)-1,1'-联苯-4,4'-二胺、N,N'-双(3-甲基苯基)-N,N'-二苯基-9,9-螺二芴-2,7-二胺、N,N'-二-1-萘基-N,N'-二苯基-9,9'-螺二[9H-芴]-2,7-二胺、MoO3、WO3、NiO、V2O5、CuO、P型氮化镓和CrO3中的一种或多种。
在一些实施例中,所述发光二极管还包括设于所述阳极和所述发光层之间的空穴注入层,所述空穴注入层的材料包括聚(亚乙基二氧噻吩):聚苯乙烯磺酸盐、聚(9,9-二辛基-芴-共-N-(4-丁基苯基)-二苯基胺)、多芳基胺、聚(N-乙烯基咔唑)、聚苯胺、聚吡咯、N,N,N',N'-四(4-甲氧基苯基)-联苯胺、4-双[N-(1-萘基)-N-苯基-氨基]联苯、4,4',4”-三[苯基(间-甲苯基)氨基]三苯基胺、4,4',4”-三(N-咔唑基)-三苯基胺、1,1-双[(二-4-甲苯基氨基)苯基环己烷、掺杂有四氟-四氰基-醌二甲烷的4,4',4”-三(二苯基氨基)三苯胺、p-掺杂酞菁、F4-TCNQ掺杂的N,N'-二苯基-N,N'-二(1-萘基)-1,1'-联苯-4,4”-二胺、六氮杂苯并菲-己腈、氧化镍、氧化钼、氧化钨、氧化钒、硫化钼、硫化钨及氧化铜中的一种或多种。
在一些实施例中,所述发光二极管还包括设于所述阴极和所述发光层之间的电子传输层,所述电子传输层的材料包括金属氧化物、掺杂金属氧化物、Ⅱ-Ⅵ族半导体材料、Ⅲ-Ⅴ族半导体材料及Ⅰ-Ⅲ-Ⅵ族半导体材料中的至少一种;所述金属氧化物包括ZnO、TiO2、SnO2、Al2O3中的至少一种;所述掺杂金属氧化物中的金属氧化物包括ZnO、TiO2、SnO2中的至少一种,掺杂元素包括Al、Mg、Li、In、Ga中的至少一种;所述Ⅱ-Ⅵ族半导体材料包括ZnS、ZnSe、CdS中的至少一种;所述Ⅲ-Ⅴ族半导体材料包括InP、GaP中的至少一种;所述Ⅰ-Ⅲ-Ⅵ族半导体材料包括CuInS、CuGaS中的至少一种。
附图说明
为了更清楚地说明本申请实施例中的技术方案,下面将对实施例描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本申请的一些实施例,对于本领域技术人员来讲,在不付出创造性劳动的前提下,还 可以根据这些附图获得其他的附图。
图1是本申请实施例的一种发光二极管的结构示意图;
图2是本申请另一实施例的一种发光二极管的结构示意图;
图3是本申请实施例的一种组合物的制备方法的流程示意图。
本申请的实施方式
下面将结合本申请实施例中的附图,对本申请实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本申请一部分实施例,而不是全部的实施例。基于本申请中的实施例,本领域技术人员在没有作出创造性劳动的前提下所获得的所有其它实施例,都属于本申请保护的范围。此外,应当理解的是,此处所描述的具体实施方式仅用于说明和解释本申请,并不用于限制本申请。在本申请中,在未作相反说明的情况下,使用的方位词如“上”和“下”具体为附图中的图面方向。另外,在本申请说明书的描述中,术语“包括”是指“包括但不限于”。本申请的各种实施例可以以一个范围的形式存在;应当理解,以一范围形式的描述仅仅是因为方便及简洁,不应理解为对本申请范围的硬性限制;因此,应当认为所述的范围描述已经具体公开所有可能的子范围以及该范围内的单一数值。例如,应当认为从1到6的范围描述已经具体公开子范围,例如从1到3,从1到4,从1到5,从2到4,从2到6,从3到6等,以及所述范围内的单一数字,例如1、2、3、4、5及6,此不管范围为何皆适用。另外,每当在本文中指出数值范围,是指包括所指范围内的任何引用的数字(分数或整数)。
在本申请中,“和/或”,描述关联对象的关联关系,表示可以存在三种关系,例如,A和/或B,可以表示:单独存在A,同时存在A和B,单独存在B的情况。其中A,B可以是单数或者复数。
在本申请中,“至少一个”是指一个或者多个,“多个”是指两个或两个以上。“至少一种”、“以下至少一项(个)”或其类似表达,是指的这些项中的任意组合,包括单项(个)或复数项(个)的任意组合。例如,“a,b,或c中的至少一项(个)”,或,“a,b,和c中的至少一项(个)”,均可以表示:a,b,c,a-b(即a和b),a-c,b-c,或a-b-c,其中a,b,c分别可以是单个,也可以是多个。
本申请的技术方案是这样实施的:
第一方面,本申请提出一种复合材料,所述复合材料包括量子点1和Mxene材料2,所述Mxene材料2呈片状,所述量子点1嵌设在相邻的所述Mxene材料2之间的间隙中。
本申请技术方案提供一种复合材料,所述复合材料包括量子点1和Mxene材料2,由于Mxene材料2呈现片状的形貌,如图1和2所示,在混合堆叠过程中,Mxene材料2形成类似层状的结构,而至少一部分的量子点1将嵌入至相邻的所述Mxene材料2之间的间隙中。且,由于Mxene材料2自身表面带负电,嵌设在相邻的所述Mxene材料2之间的间隙中的量子点1与Mxene材料2的表面接触,从而使得量子点1表面带负电,从而使得所述复合材料具有斥电子的特性。在利用本复合材料制成发光二极管100的发光层20时,在库伦力的作用下,表面带负电的发光层20对带正电的空穴产生吸引力,降低空穴注入势垒,促进空穴的注入,同时,由于量子点1表面负电对电子的排斥,增加了电子注入的势垒,减少了电子的注入,从而实现了对器件电荷平衡的调控。
在一些实施例中,相邻的两个Mxene材料2层叠设置,两个Mxene材料2面对面且相互间隔,从而在二者之间限定出间隙空间,至少一部分的量子点1嵌入至间隙空间中,并与两个Mxene材料2的面抵接。
在一具体实施例中,所述复合材料由量子点1和Mxene材料2组成。
在一些实施例中,所述Mxene材料2的化学通式为Mn+1XnTx,M选自过渡金属中的至少一种,X选自C或N,n值为1~3,Tx包括O2-、OH-、F-、中的任意一种或几种。其中,过渡金属可以选自本领域已知的任意过渡金属元素中的一种或多种,例如,Ti、Zr、Hf、V、Nb、Ta、Cr、Sc等;Tx是指二维材料表面的基团。凡是符合上述化学通式的二维材料均可和量子点1组合形成本申请所述的复合材料,且形成的所述复合材料在用于制作发光二极管100的发光层20时,对器件的电荷平衡的改善效果较好,能够极大地提升器件的发光效率和寿命。
在另一些实施例中,所述Mxene材料2可以选自但不限于Ti2CTx、TiNbCTx、Ti3CNxTx、Ta4C3Tx、Nb2CTx、V2CTx、Nb4C3Tx、Mo2CT、Ti4N3Tx 中的至少一种,其中,Tx包括O2-、OH-、F-中的至少一种。这些Mxene材料2在用于制作发光二极管100的发光层20时,对器件的电荷平衡的改善效果较好,能够极大地提升器件的发光效率和寿命。
所述量子点1可以选自但不限于单一结构量子点及核壳结构量子点中的至少一种。例如,所述单一结构量子点选自II-VI族化合物、IV-VI族化合物、III-V族化合物、I-III-VI族化合物和钙钛矿型半导体材料中的至少一种,所述II-VI族化合物选自CdS、CdSe、CdTe、ZnS、ZnSe、ZnTe、ZnO、HgS、HgSe、HgTe、CdSeS、CdSeTe、CdSTe、ZnSeS、ZnSeTe、ZnSTe、HgSeS、HgSeTe、HgSTe、CdZnS、CdZnSe、CdZnTe、CdHgS、CdHgSe、CdHgTe、HgZnS、HgZnSe、HgZnTe、CdZnSeS、CdZnSeTe、CdZnSTe、CdHgSeS、CdHgSeTe、CdHgSTe、HgZnSeS、HgZnSeTe及HgZnSTe中的至少一种,所述IV-VI族化合物选自SnS、SnSe、SnTe、PbS、PbSe、PbTe、SnSeS、SnSeTe、SnSTe、PbSeS、PbSeTe、PbSTe、SnPbS、SnPbSe、SnPbTe、SnPbSSe、SnPbSeTe、SnPbSTe中的至少一种,所述III-V族化合物选自GaN、GaP、GaAs、GaSb、AlN、AlP、AlAs、AlSb、InN、InP、InAs、InSb、GaNP、GaNAs、GaNSb、GaPAs、GaPSb、AlNP、AlNAs、AlNSb、AlPAs、AlPSb、InNP、InNAs、InNSb、InPAs、InPSb、GaAlNP、GaAlNAs、GaAlNSb、GaAlPAs、GaAlPSb、GaInNP、GaInNAs、GaInNSb、GaInPAs、GaInPSb、InAlNP、InAlNAs、InAlNSb、InAlPAs及InAlPSb中的至少一种,所述I-III-VI族化合物选自CuInS2、CuInSe2及AgInS2中的至少一种,所述钙钛矿型半导体材料包括掺杂或非掺杂的无机钙钛矿型半导体、及掺杂或非掺杂的有机-无机杂化钙钛矿型半导体中的至少一种,所述无机钙钛矿型半导体的结构通式为AMX3,所述有机-无机杂化钙钛矿型半导体的结构通式为BMX3,其中,A为Cs+,M为二价金属阳离子,二价金属阳离子包括但不限于Pb2+、Sn2+、Cu2+、Ni2+、Cd2+、Cr2+、Mn2+、Co2+、Fe2+、Ge2+、Yb2+、Eu2+,X为卤素阴离子,包括但不限于Cl-、Br-、I-,B为有机胺阳离子,所述有机胺阳离子包括CH3(CH2)n-2NH3 +(n≥2)或NH3(CH2)nNH3 2+(n≥2);所述核壳结构的量子点的核选自上述单一结构量子点中的任意一种,所述核壳结构的量子点的壳层材料选自CdS、CdTe、CdSeTe、CdZnSe、CdZnS、CdSeS、ZnSe、ZnSeS和ZnS中的至少一种。
在本申请的一些实施例中,所述复合材料中,所述Mxene材料2和所述量子点1的重量比为(0.5~5):(10~60),例如,Mxene材料2和量子点1的重量比可以为(0.5~1):(10~20)、(0.5~1):(15~30)、(0.5~5):(20~35)、(0.5~5):(32~45)、(0.5~5):(40~60)、(1~3):(50~60)、(2~4):(20~40)、(3~5):(30~50)等等,在此范围内,不仅能够最大程度地提高Mxene材料2的浓度,提高空穴注入,减少电子注入,而且能够避免发生团聚,确保量子点1顺利嵌入到相邻两层Mxene材料2之间;同时,能够确保足够的量子点1含量,使得制成的发光二极管100具有较高的发光效率。
第二方面,本申请还提出一种组合物,所述组合物包括溶剂和如上文所述的复合材料。使用所述组合物可以制备出发光二极管100的发光层20。
其中,所述溶剂可以是任意能够溶解所述量子点1和所述Mxene材料2的常见溶剂,例如,非极性烷基溶剂中的至少一种。在一具体实施例中,所述溶剂可以选自但不限于辛烷、甲苯、四氯化碳、正己烷、环己烷、庚烷及液体石蜡中的至少一种,使用上述溶剂能够很好地分散量子点1和Mxene材料2,形成液体组合物,不仅材料分散性好,而且便于通过溶液法制成发光层20。
在一些实施例中,所述Mxene材料2的浓度为0.5~5mg/mL,例如,所述Mxene材料2的浓度可以为0.5mg/mL、0.6mg/mL、0.8mg/mL、1mg/mL、2mg/mL、2.5mg/mL、3mg/mL、3.5mg/mL、4mg/mL、4.5mg/mL、5mg/mL以及上述任意两个数值之间的范围内的数值等。在此范围内,不仅能够最大程度地提高Mxene材料2的浓度,提高空穴注入,减少电子注入,而且能够避免发生团聚,确保量子点1顺利嵌入到相邻两层Mxene材料2之间。
在本申请的一些实施例中,所述复合材料中,所述量子点1的浓度为10~60mg/ml,例如,所述量子点1的浓度可以为10mg/ml、15mg/ml、20mg/ml、25mg/ml、30mg/ml、35mg/ml、40mg/ml、45mg/ml、50mg/ml、55mg/ml、60mg/ml以及上述任意两个数值之间范围内的数值等,在此范围内,将所述复合材料用于制备发光二极管100,有助于提高发光二极管100的发光效率。
第三方面,本申请还提出一种组合物的制备方法。参阅图3,所述制备方法包括以下步骤:
步骤S10,提供量子点1、Mxene材料2和溶剂;
步骤S20,将所述量子点1、所述Mxene材料2分散在所述溶剂中,得到组合物。
步骤S20中,具体实施时,可以将所述量子点1、Mxene材料2一起加入到所述溶剂中,然后搅拌混匀;也可以先将溶剂分为两部分,将所述量子点1、Mxene材料2分别分散在两份溶剂中,制成两种混合溶液后,再将两种混合溶液混合。
其中,混匀的方式包括但不限于机械搅拌、磁力搅拌、超声等手段。
在一些实施例中,将所述量子点1、Mxene材料2分散在所述溶剂中的步骤在超声条件下进行。具体实施时,超声的功率为1~3W/cm2,例如,1W/cm2、1.2W/cm2、1.5W/cm2、1.8W/cm2、2W/cm2、2.3W/cm2、2.5W/cm2、2.8W/cm2、3W/cm2以及上述任意两个数值之间范围内的数值等,如此,有助于提高量子点1和Mxene材料2的分散效果;超声的时间为5~30min,例如,5min、6min、8min、9min、10min、15min、18min、20min、23min、25min、26min、28min、30min以及上述任意两个数值之间范围内的数值等,如此,能够使得量子点1和Mxene材料2充分分散在溶剂中,便于量子点1插入到相邻二维材料片层之间的间隙中。
在一些实施例中,将所述量子点1、Mxene材料2分散在所述溶剂中的步骤在搅拌条件下进行。具体实施时,搅拌的转速为200~1000rpm,例如,200rpm、300rpm、400rpm、500rpm、600rpm、700rpm、800rpm、900rpm、1000rpm以及上述任意两个数值之间范围内的数值等;搅拌的时间为5~8h,例如,5h、5.5h、6h、6.5h、7h、7.5h、8h以及上述任意两个数值之间范围内的数值等。如此,能够使得Mxene材料2充分分散在溶剂中,从而促进量子点1插入到相邻Mxene材料2片层之间的间隙中。
第四方面,本申请还提出一种发光二极管100,参阅图1,所述发光二极管100包括层叠的阳极10、发光层20和阴极30。其中,所述发光层20的材料包括如上文所述的复合材料,或者,所述发光层20由组合物制成,所述组合物包括如上文所述的组合物,或者所述组合物由如上文所述的制备方法制得。
所述阳极10和所述阴极30为本领域已知用于发光二极管100的阳极10及阴极30,例如,可以分别独立选自但不限于金属电极、碳硅材料电极、金属氧化 物电极或复合电极,所述金属电极的材料选自Ag、Al、Mg、Au、Cu、Mo、Pt、Ca及Ba中的至少一种,所述碳硅材料电极的材料选自硅、石墨、碳纳米管、石墨烯以及碳纤维中的至少一种,所述金属氧化物电极的材料选自铟掺杂氧化锡、氟掺杂氧化锡、锑掺杂氧化锡、铝掺杂氧化锌、镓掺杂氧化锌、铟掺杂氧化锌、镁掺杂氧化锌及铝掺杂氧化镁中的至少一种,所述复合电极选自AZO/Ag/AZO、AZO/Al/AZO、ITO/Ag/ITO、ITO/Al/ITO、ZnO/Ag/ZnO、ZnO/Al/ZnO、TiO2/Ag/TiO2、TiO2/Al/TiO2、ZnS/Ag/ZnS或ZnS/Al/ZnS。其中,“/”表示叠层结构,例如,AZO/Ag/AZO表示由AZO层、Ag层和AZO层依次层叠形成的具有层叠结构的复合电极。
请进一步参阅图2,可以理解,所述发光二极管100还可以增设一些用于发光二极管100的有助于提升二极管性能的功能层,例如空穴传输层50、空穴注入层40等。
所述空穴传输层50的材料可以为本领域已知用于空穴传输层50的材料,例如,可以选自但不限于聚[双(4-苯基)(2,4,6-三甲基苯基)胺](PTAA)、2,2',7,7'-四[N,N-二(4-甲氧基苯基)氨基]-9,9'-螺二芴(spiro-omeTAD)、4,4'-环己基二[N,N-二(4-甲基苯基)苯胺](TAPC)、N,N′-双(1-奈基)-N,N′-二苯基-1,1′-二苯基-4,4′-二胺(NPB)、4,4'-双(N-咔唑)-1,1'-联苯(CBP)、聚[(9,9-二辛基芴基-2,7-二基)-co-(4,4'-(N-(对丁基苯基))二苯胺)](TFB)、聚(9-乙烯基咔唑)(PVK)、聚三苯胺(Poly-TPD)、4,4',4”-三(咔唑-9-基)三苯胺(TCTA)、N,N'-二苯基-N,N'-二(3-甲基苯基)-1,1'-联苯-4,4'-二胺(TPD)、N,N'-双(3-甲基苯基)-N,N'-二苯基-9,9-螺二芴-2,7-二胺(Spiro-TPD)、N,N'-二-1-萘基-N,N'-二苯基-9,9'-螺二[9H-芴]-2,7-二胺(Spiro-NPB)、MoO3、WO3、NiO、V2O5、CuO、P型氮化镓和CrO3中的至少一种。
所述空穴注入层40的材料可以为本领域已知用于空穴注入层40的材料,如可以选自但不限于聚(亚乙基二氧噻吩):聚苯乙烯磺酸盐(PEDOT:PSS)、聚(9,9-二辛基-芴-共-N-(4-丁基苯基)-二苯基胺)(TFB)、多芳基胺、聚(N-乙烯基咔唑)、聚苯胺、聚吡咯、N,N,N',N'-四(4-甲氧基苯基)-联苯胺(TPD)、4-双[N-(1-萘基)-N-苯基-氨基]联苯(α-NPD)、4,4',4”-三[苯基(间-甲苯基)氨基]三苯基胺(m-MTDATA)、4,4',4”-三(N-咔唑基)-三苯基胺(TCTA)、1,1-双[(二-4-甲苯基氨 基)苯基环己烷(TAPC)、掺杂有四氟-四氰基-醌二甲烷(F4-TCNQ)的4,4',4”-三(二苯基氨基)三苯胺(TDATA)、p-掺杂酞菁(例如,F4-TCNQ-掺杂的锌酞菁(ZnPc))、F4-TCNQ掺杂的N,N'-二苯基-N,N'-二(1-萘基)-1,1'-联苯-4,4”-二胺(α-NPD)、六氮杂苯并菲-己腈(HAT-CN)、氧化镍、氧化钼、氧化钨、氧化钒、硫化钼、硫化钨及氧化铜中的一种或几种。
所述电子传输层60的材料可以选自但不限于金属氧化物、掺杂金属氧化物、Ⅱ-Ⅵ族半导体材料、Ⅲ-Ⅴ族半导体材料及Ⅰ-Ⅲ-Ⅵ族半导体材料中的至少一种。具体的,所述金属氧化物可以选自但不限于ZnO、TiO2、SnO2、Al2O3中的至少一种;所述掺杂金属氧化物中的金属氧化物可以选自但不限于ZnO、TiO2、SnO2中的至少一种,掺杂元素可以选自但不限于Al、Mg、Li、In、Ga中的至少一种;所述Ⅱ-Ⅵ半导体族材料可以选自但不限于ZnS、ZnSe、CdS中的至少一种;所述Ⅲ-Ⅴ半导体族材料可以选自但不限于InP、GaP中的至少一种;所述Ⅰ-Ⅲ-Ⅵ族半导体材料可以选自但不限于CuInS、CuGaS中的至少一种。作为列举,所述电子传输材料可以为ZnO、ZnMgO、ZnAlO、ZnLiO、ZnAlLiO及TiO2中的至少一种等。
可以理解,所述发光二极管100的各层的材料可以依据发光二极管100的发光需求进行调整。
可以理解,所述发光二极管100可以为正置型发光二极管或倒置型发光二极管。
进一步地,本申请还提出一种发光二极管100的制备方法。
在本申请的一些实施例中,所述发光二极管100为正置型发光二极管时,所述发光二极管100的制备方法包括以下步骤:
步骤S10a,提供阳极10;
步骤S20a,提供组合物,将所述组合物设置在所述阳极10的一表面,得到发光层20;
步骤S30a,在所述发光层20背离所述阳极10的一侧形成阴极30。
在本申请的另一些实施例中,所述发光二极管100为倒置型发光二极管时,所述发光二极管100的制备方法包括以下步骤:
所述制备方法包括以下步骤:
步骤S10b,提供阴极30;
步骤S20b,提供组合物,将所述组合物设置在所述阴极30的一表面,得到发光层20;
步骤S30b,在所述发光层20背离所述阴极30的一侧形成阳极10;
步骤S20a和步骤S20b中,所述组合物包括复合材料和溶剂,所述复合材料包括量子点1和Mxene材料2,所述Mxene材料2呈片状,所述量子点1嵌设在相邻的所述Mxene材料2之间的间隙中。
进一步地,在一些实施例中,所述发光二极管100还包括空穴传输层50、空穴注入层40以及电子传输层60。在一具体实施例中,所述发光二极管100为正置型发光二极管,所述发光二极管100的制备方法包括以下步骤:
步骤S100,提供阳极10;
步骤S200,提供空穴注入材料,将所述空穴注入材料设置在所述阳极10上,得到空穴注入层40;
步骤S300,提供空穴传输材料,将所述空穴传输材料设置在所述空穴注入层40上,得到空穴传输层50;
步骤S400,提供组合物,将所述组合物设置在所述空穴传输层50上,得到发光层20;
步骤S500,在所述发光层20上形成阴极30。
上述发光二极管100的制备方法中,所述阳极10、空穴传输层50、发光层20、电子传输层60、阴极30及空穴注入层40的制备方法可采用本领域常规技术实现,例如化学法或物理法。其中,化学法包括化学气相沉积法、连续离子层吸附与反应法、阳极氧化法、电解沉积法、共沉淀法。物理法包括物理镀膜法和溶液法,其中,物理镀膜法包括:热蒸发镀膜法、电子束蒸发镀膜法、磁控溅射法、多弧离子镀膜法、物理气相沉积法、原子层沉积法、脉冲激光沉积法等;溶液法可以为旋涂法、印刷法、喷墨打印法、刮涂法、打印法、浸渍提拉法、浸泡法、喷涂法、滚涂法、浇铸法、狭缝式涂布法及条状涂布法等。
第五方面,本申请实施例还提供一种显示装置,所述显示装置包括所述发光二极管100。
下面通过具体实施例、对比例对本申请的技术方案及技术效果进行详细说 明,以下实施例仅仅是本申请的部分实施例,并非对本申请作出具体限定。
实施例1
组合物的制备方法如下:
1)量子点的制备:
将6mmol醋酸锌、7mL油酸以及15mL的1-十八烯添加至50ml的三口烧瓶中,得到第一混合溶液,在氩气鼓泡条件下,将第一混合溶液升温至170℃,恒温1h后,将第一混合溶液的温度升至300℃;
将0.8mmol的硒粉溶解在0.4mL的三正辛基膦中,制成硒溶液,备用;将0.1mmol的氧化镉溶解在0.6mL的油酸中,在250℃反应0.5h,制成第一镉溶液,备用;将所述硒溶液和所述第一镉溶液混合,然后注入至300℃的第一混合溶液中,反应10min,得到第二混合溶液;
将0.8mmol的硒粉溶解在0.4mL的三正辛基膦中,然后,注入到第二混合溶液中,在300℃下反应30min,得到第三混合溶液;
将0.8mmol的硫粉溶解在0.4mL的三正辛基膦中,制成第一硫溶液,备用;将0.4mmol的氧化镉溶解在2mL的油酸中,制成第二镉溶液,备用;将所述第一硫溶液和所述第二镉溶液注入到所述第三混合溶液中,在300℃下反应30min,得到第四混合溶液;
将0.8mmol的硫粉溶解在0.4mL的三正辛基膦中,然后,注入到第四混合溶液中,在300℃下反应30min,再将溶液冷却至室温,用己烷和乙醇分别作为溶剂跟反溶剂进行多次清洗沉淀,得到量子点CdZnSe/ZnSe/CdZnS/ZnS。
2)取量子点,分散在辛烷中,然后,向其中加入Mxene材料2,超声处理10min,超声功率为2W/cm2,得到组合物,其中,Mxene材料2为Ti3C2Tx,且所述组合物中,所述二维材料的浓度为1.5mg/mL,所述量子点1的浓度为20mg/mL。
QLED器件的制备方法如下:
(1)提供具有ITO阳极的玻璃衬底,其中,阳极10的厚度为50nm。
(2)在空气中,在阳极10表面旋涂一层PEDOT:PSS,制成厚度为25nm的空穴注入层40。
(3)在氮气气氛中,在空穴注入层40的表面旋涂TFB材料,制成厚度为30nm 的空穴传输层50。
(4)待步骤(3)制得的半成品冷却后,在氮气气氛中,在空穴传输层50表面,旋涂上述方法制得的组合物,制成厚度为25nm的发光层20。
(5)在氮气气氛中,在发光层20表面旋涂ZnO,得到厚度为30nm的电子传输层60。
(6)将步骤(5)制得的半成品放入真空腔体中,在电子传输层60表面蒸镀一层厚度为100nm的银作为阴极30,封装,得到QLED器件。
实施例2
本实施例方案与实施例1基本相同,区别仅在于,本实施例中:
复合材料中,所述Mxene材料的浓度为0.5mg/mL。
实施例3
本实施例方案与实施例1基本相同,区别仅在于,本实施例中:
复合材料中,所述Mxene材料的浓度为5mg/mL。
实施例4
本实施例方案与实施例1基本相同,区别仅在于,本实施例中:
复合材料中,所述Mxene材料的浓度为0.4mg/mL。
实施例5
本实施例方案与实施例1基本相同,区别仅在于,本实施例中:
复合材料中,所述Mxene材料的浓度为5.5mg/mL。
实施例6
本实施例方案与实施例1基本相同,区别仅在于,本实施例中:
Mxene材料为Nb2CTx
实施例7
本实施例方案与实施例1基本相同,区别仅在于,本实施例中:
Mxene材料为V2CTx
实施例8
本实施例方案与实施例1基本相同,区别仅在于,本实施例中:
Mxene材料为Ti3C2Tx和Nb2CTx的混合物,且二者的重量比为1:1。
对比例1
本对比例方案与实施例1基本相同,区别仅在于,本对比例中:
组合物中去掉二维材料。
对比例2
本对比例中量子点的制备步骤和器件的制备步骤均与实施例1基本相同,区别仅在于,本对比例中,组合物的制备方法的步骤(2)为:
取化学式为Ti3C2Tx的Mxene材料,分散在二甲基甲酰胺中,制成5mg/mL的单层Mxene纳米片溶液,备用;取氧化石墨烯纳米片(GO),分散在二甲基甲酰胺中,制成GO溶液,备用。
将单层Mxene纳米片溶液与GO溶液进行混合,混合液中,Mxene与GO的质量比为1:20,超声5min后,搅拌5h,使得单层的Mxene纳米片完全嵌入两相邻单层GO纳米片之间。
将混合液真空过滤,取沉淀在100℃下干燥10h,得到干品。将干品加入到氢碘酸溶液中,反应6h进行还原处理,得到Mxene功能化的rGO。
将Mxene功能化的rGO分散在含有1-氨基芘-二琥珀酸二酯(AD)的DMF溶液中,持续搅拌,交联反应1h,收集沉淀物,并用DMF和乙醇各清洗6次,得到MrGO-AD复合纳米片,将MrGO-AD复合纳米片分散在辛烷中,制成MrGO-AD复合纳米片溶液,其中,MrGO-AD复合纳米片的浓度为1mg/mL。
将量子点CdZnSe/CdS分散在辛烷中,然后,与MrGO-AD复合纳米片溶液均匀混合,得到复合材料,所述复合材料中,MrGO-AD复合纳米片的浓度为1mg/mL,量子点CdZnSe/CdS的浓度为20mg/mL。
对比例3
本对比例方案与实施例1基本相同,区别仅在于,本对比例中:
Mxene材料为MoS2
对比例4
本对比例方案与实施例1基本相同,区别仅在于,本对比例中:
Mxene材料为氧化石墨烯。
对实施例1-8及对比例1-4的量子点发光二极管进行性能测试,测试结果参表一。测试方法如下:
(1)外量子效率EQE的检测方法为:注入到量子点中的电子-空穴对数转化 为出射的光子数的比值,单位是%,是衡量电致发光器件优劣的一个重要参数,采用EQE光学测试仪器测定即可得到。具体计算公式如下:
其中,ηe为光输出耦合效率,ηγ为复合的载流子数与注入载流子数的比值,x为产生光子的激子数与总激子数的比值,KR为辐射过程速率,KNR为非辐射过程速率。
测试条件:在室温下进行,空气湿度为30~60%。
(2)寿命T95@1000nit的测试方法为:
器件在恒定电流或电压驱动下,亮度减少至最高亮度的一定比例时所需的时间,亮度下降至最高亮度的95%的时间定义为T95,该寿命为实测寿命。为缩短测试周期,器件寿命测试通常是在高亮度下通过加速器件老化进行,并通过延伸型指数衰减亮度衰减拟合公式拟合得到高亮度下的寿命,比如:1000nit下的寿命计为T95@1000nit。具体计算公式如下:
其中,T95L为低亮度下的寿命,T95H为高亮度下的实测寿命,LH为器件加速至最高亮度,LL为1000nit,A为加速因子,本实验通过测得若干组绿色QLED器件在额定亮度下的寿命得出A值为1.7。
(3)测试单载流子传输薄膜器件(HOD/EOD)的电流密度-电压曲线。取器件在2mA恒定电流下的电压进行比较。其中:
单单子器件(EOD)的制备方法与其对应的完整的QLED器件的制备方法基本相同,区别仅在于,减去空穴注入层和空穴传输层。
单空穴器件(HOD)的制备方法与其对应的完整的QLED器件的制备方法基本相同,区别仅在于,减去电子传输层。
上述测试中,外量子效率测试和器件寿命测试所使用的器件为上述实施例和对比例中完整结构的QLED器件;测试项目(3)所使用的器件为上述实施例和对比例中QLED器件对应的单载流子器件。
表一:
由表一可知:
各实施例均表现出较高的外量子效率和较长的寿命,说明本申请方案制得的发光二极管具有优异的发光效率和寿命;
相较于对比例1,各实施例尤其是实施例1的EOD器件和HOD器件在2mA恒流下电压相差较小,说明本申请方案制得的发光二极管的载流子平衡性更好;此外,各实施例器件的外量子效率和寿命均高于对比例1。综上,可见,添加表面带负电的二维材料后,发光二极管的电荷平衡性得到了改善,使得器件具有更高的发光效率,更长的寿命;
相较于对比例2,实施例1的EOD器件和HOD器件在2mA恒流下电压相差较小,且外量子效率和寿命均更高,说明额外添加氧化石墨烯纳米片和1-氨基芘-二琥珀酸二酯,对发光二极管的电荷平衡性的改善效果较差,难以提升器件的发光效率和寿命;
相较于对比例3和4,实施例1、实施例6-8的EOD器件和HOD器件在2mA 恒流下电压相差较小,且外量子效率和寿命均更高,说明相较其它二维材料,添加Mxene材料对发光二极管的性能提升效果更佳。
以上对本申请实施例所提供的复合材料、组合物及发光二极管进行了详细介绍,本文中应用了具体个例对本申请的原理及实施方式进行了阐述,以上实施例的说明只是用于帮助理解本申请的方法及其核心思想;同时,对于本领域的技术人员,依据本申请的思想,在具体实施方式及应用范围上均会有改变之处,综上所述,本说明书内容不应理解为对本申请的限制。

Claims (20)

  1. 一种复合材料,其中,包括量子点和Mxene材料,相邻的所述Mxene材料之间的间隙中嵌设有所述量子点。
  2. 根据权利要求1所述的复合材料,其中,所述复合材料由所述量子点和所述Mxene材料组成。
  3. 根据权利要求1或2所述的复合材料,其中,相邻的所述Mxene材料层叠且相互间隔形成间隙空间,至少部分所述量子点嵌设在所述间隙空间中。
  4. 根据权利要求1至3任一项所述的复合材料,其中,所述复合材料中,所述Mxene材料和所述量子点的重量比为(0.5~5):(10~60)。
  5. 根据权利要求1至4任一项所述的复合材料,其中,所述Mxene材料的化学通式为Mn+1XnTx,M选自过渡金属中的至少一种,X选自C或N,n值为1~3,Tx包括O2-、OH-、F-中的至少一种。
  6. 根据权利要求1至4任一项所述的复合材料,其中,所述Mxene材料包括Ti2CTx、TiNbCTx、Ti3CNxTx、Ta4C3Tx、Nb2CTx、V2CTx、Nb4C3Tx、Mo2CTx、Ti4N3Tx中的至少一种,其中,Tx包括O2-、OH-、F-中的至少一种。
  7. 根据权利要求1至6任一项所述的复合材料,其中,所述量子点选自单一结构量子点及核壳结构量子点中的至少一种,所述单一结构量子点选自II-VI族化合物、IV-VI族化合物、III-V族化合物、I-III-VI族化合物和钙钛矿型半导体材料中的至少一种,所述II-VI族化合物选自CdS、CdSe、CdTe、ZnS、ZnSe、ZnTe、ZnO、HgS、HgSe、HgTe、CdSeS、CdSeTe、CdSTe、ZnSeS、ZnSeTe、ZnSTe、HgSeS、HgSeTe、HgSTe、CdZnS、CdZnSe、CdZnTe、CdHgS、CdHgSe、CdHgTe、HgZnS、HgZnSe、HgZnTe、CdZnSeS、CdZnSeTe、CdZnSTe、CdHgSeS、CdHgSeTe、CdHgSTe、HgZnSeS、HgZnSeTe及HgZnSTe中的至少一种,所述IV-VI族化合物选自SnS、SnSe、SnTe、PbS、PbSe、PbTe、SnSeS、SnSeTe、SnSTe、PbSeS、PbSeTe、PbSTe、SnPbS、SnPbSe、SnPbTe、SnPbSSe、SnPbSeTe、SnPbSTe中的至少一种,所述III-V族化合物选自GaN、GaP、GaAs、GaSb、AlN、AlP、AlAs、AlSb、InN、InP、InAs、InSb、GaNP、GaNAs、GaNSb、 GaPAs、GaPSb、AlNP、AlNAs、AlNSb、AlPAs、AlPSb、InNP、InNAs、InNSb、InPAs、InPSb、GaAlNP、GaAlNAs、GaAlNSb、GaAlPAs、GaAlPSb、GaInNP、GaInNAs、GaInNSb、GaInPAs、GaInPSb、InAlNP、InAlNAs、InAlNSb、InAlPAs及InAlPSb中的至少一种,所述I-III-VI族化合物选自CuInS2、CuInSe2及AgInS2中的至少一种,所述钙钛矿型半导体材料包括掺杂或非掺杂的无机钙钛矿型半导体、及掺杂或非掺杂的有机-无机杂化钙钛矿型半导体中的至少一种,所述无机钙钛矿型半导体的结构通式为AMX3,所述有机-无机杂化钙钛矿型半导体的结构通式为BMX3,其中,A为Cs+,M为二价金属阳离子,X为卤素阴离子,B为有机胺阳离子,所述有机胺阳离子包括CH3(CH2)n-2NH3 +(n≥2)或NH3(CH2)nNH3 2+(n≥2);所述核壳结构的量子点的核选自所述单一结构量子点中的任意一种,所述核壳结构的量子点的壳层材料选自CdS、CdTe、CdSeTe、CdZnSe、CdZnS、CdSeS、ZnSe、ZnSeS和ZnS中的至少一种。
  8. 一种组合物,其中,包括溶剂、量子点和Mxene材料,相邻的所述Mxene材料之间的间隙中嵌设有所述量子点。
  9. 根据权利要求8所述的组合物,其中,相邻的所述Mxene材料层叠且相互间隔形成间隙空间,至少部分所述量子点嵌设在所述间隙空间中。
  10. 根据权利要求8或9所述的组合物,其中,所述组合物中,所述Mxene材料和所述量子点的重量比为(0.5~5):(10~60)。
  11. 根据权利要求8至10任一项所述的组合物,其中,所述组合物中,所述Mxene材料的浓度为0.5~5mg/mL。
  12. 根据权利要求8至11任一项所述的组合物,其中,所述组合物中,所述量子点的浓度为10~60mg/mL。
  13. 根据权利要求8至12任一项所述的组合物,其中,所述溶剂包括辛烷、甲苯、四氯化碳、正己烷、环己烷、庚烷及液体石蜡中的至少一种。
  14. 根据权利要求8至13任一项所述的组合物,其中,所述Mxene材料的化学通式为Mn+1XnTx,M选自过渡金属中的至少一种,X选自C或N,n值为1~3,Tx包括O2-、OH-、F-中的至少一种。
  15. 根据权利要求8至13任一项所述的组合物,其中,所述Mxene材料包括Ti2CTx、TiNbCTx、Ti3CNxTx、Ta4C3Tx、Nb2CTx、V2CTx、Nb4C3Tx、Mo2CTx、 Ti4N3Tx中的至少一种,其中,Tx包括O2-、OH-、F-中的至少一种。
  16. 一种发光二极管,包括层叠的阳极、发光层和阴极,其中,所述发光层的材料包括权利要求1至7任一项所述的复合材料,或者,所述发光层由组合物制成,所述组合物包括权利要求8至15任一项所述的组合物。
  17. 根据权利要求16所述的发光二极管,其中,所述阳极和所述阴极分别独立地选自金属电极、碳硅材料电极、金属氧化物电极或复合电极,所述金属电极的材料选自Ag、Al、Mg、Au、Cu、Mo、Pt、Ca及Ba中的至少一种,所述碳硅材料电极的材料选自硅、石墨、碳纳米管、石墨烯以及碳纤维中的至少一种,所述金属氧化物电极的材料选自铟掺杂氧化锡、氟掺杂氧化锡、锑掺杂氧化锡、铝掺杂氧化锌、镓掺杂氧化锌、铟掺杂氧化锌、镁掺杂氧化锌及铝掺杂氧化镁中的至少一种,所述复合电极选自AZO/Ag/AZO、AZO/Al/AZO、ITO/Ag/ITO、ITO/Al/ITO、ZnO/Ag/ZnO、ZnO/Al/ZnO、TiO2/Ag/TiO2、TiO2/Al/TiO2、ZnS/Ag/ZnS或ZnS/Al/ZnS。
  18. 根据权利要求16或17所述的发光二极管,其中,所述发光二极管还包括设于所述阳极和所述发光层之间的空穴传输层,所述空穴传输层的材料包括聚[双(4-苯基)(2,4,6-三甲基苯基)胺]、2,2',7,7'-四[N,N-二(4-甲氧基苯基)氨基]-9,9'-螺二芴、4,4'-环己基二[N,N-二(4-甲基苯基)苯胺]、N,N′-双(1-奈基)-N,N′-二苯基-1,1′-二苯基-4,4′-二胺、4,4'-双(N-咔唑)-1,1'-联苯、聚[(9,9-二辛基芴基-2,7-二基)-co-(4,4'-(N-(对丁基苯基))二苯胺)]、聚(9-乙烯基咔唑)、聚三苯胺、4,4',4”-三(咔唑-9-基)三苯胺、N,N'-二苯基-N,N'-二(3-甲基苯基)-1,1'-联苯-4,4'-二胺、N,N'-双(3-甲基苯基)-N,N'-二苯基-9,9-螺二芴-2,7-二胺、N,N'-二-1-萘基-N,N'-二苯基-9,9'-螺二[9H-芴]-2,7-二胺、MoO3、WO3、NiO、V2O5、CuO、P型氮化镓和CrO3中的一种或多种。
  19. 根据权利要求16至18任一项所述的发光二极管,其中,所述发光二极管还包括设于所述阳极和所述发光层之间的空穴注入层,所述空穴注入层的材料包括聚(亚乙基二氧噻吩):聚苯乙烯磺酸盐、聚(9,9-二辛基-芴-共-N-(4-丁基苯基)-二苯基胺)、多芳基胺、聚(N-乙烯基咔唑)、聚苯胺、聚吡咯、N,N,N',N'-四(4-甲氧基苯基)-联苯胺、4-双[N-(1-萘基)-N-苯基-氨基]联苯、4,4',4”-三[苯基(间-甲苯基)氨基]三苯基胺、4,4',4”-三(N-咔唑基)-三苯基胺、1,1-双[(二-4-甲苯 基氨基)苯基环己烷、掺杂有四氟-四氰基-醌二甲烷的4,4',4”-三(二苯基氨基)三苯胺、p-掺杂酞菁、F4-TCNQ掺杂的N,N'-二苯基-N,N'-二(1-萘基)-1,1'-联苯-4,4”-二胺、六氮杂苯并菲-己腈、氧化镍、氧化钼、氧化钨、氧化钒、硫化钼、硫化钨及氧化铜中的一种或多种。
  20. 根据权利要求16至19任一项所述的发光二极管,其中,所述发光二极管还包括设于所述阴极和所述发光层之间的电子传输层,所述电子传输层的材料包括金属氧化物、掺杂金属氧化物、Ⅱ-Ⅵ族半导体材料、Ⅲ-Ⅴ族半导体材料及Ⅰ-Ⅲ-Ⅵ族半导体材料中的至少一种;所述金属氧化物包括ZnO、TiO2、SnO2、Al2O3中的至少一种;所述掺杂金属氧化物中的金属氧化物包括ZnO、TiO2、SnO2中的至少一种,掺杂元素包括Al、Mg、Li、In、Ga中的至少一种;所述Ⅱ-Ⅵ族半导体材料包括ZnS、ZnSe、CdS中的至少一种;所述Ⅲ-Ⅴ族半导体材料包括InP、GaP中的至少一种;所述Ⅰ-Ⅲ-Ⅵ族半导体材料包括CuInS、CuGaS中的至少一种。
PCT/CN2023/118855 2022-09-21 2023-09-14 复合材料、组合物及发光二极管 Ceased WO2024061102A1 (zh)

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