WO2024060434A1

WO2024060434A1 - Semiconductor device and manufacturing method therefor, and electronic device

Info

Publication number: WO2024060434A1
Application number: PCT/CN2022/140173
Authority: WO
Inventors: 王祥升; 王桂磊; 赵超
Original assignee: 北京超弦存储器研究院
Priority date: 2022-09-22
Filing date: 2022-12-19
Publication date: 2024-03-28
Also published as: CN116209250A; CN116209250B

Abstract

A semiconductor device and a manufacturing method therefor, and an electronic device. The semiconductor device comprises a first chip (1000). The first chip (1000) comprises: a plurality of memory cell columns (200), arranged on a first substrate (100), wherein each memory cell column (200) is perpendicular to the first substrate (100) and is formed by a plurality of memory cells (1) arranged in a stacked mode, each memory cell (1) comprises a transistor (10) and a capacitor (20), the transistor (10) comprises a semiconductor layer (11) and a gate (12), the semiconductor layer (11) extends in a direction parallel to the first substrate (100) and sequentially comprises a source region (111), a channel region (112) and a drain region (113), the drain region (113) comprises a capacitor region, the gate (12) surrounds the side wall of the channel region (112), and the capacitor (20) is provided on a side wall of the capacitor region of the drain region (113); and a first internal support layer 501, provided between the capacitor regions of the drain regions (113) of any two semiconductor layers (11) adjacent in the direction perpendicular to the first substrate (100), the capacitor (20) being a grid capacitor (20).

Description

Semiconductor devices and manufacturing methods thereof, electronic equipment

This application claims priority to the Chinese patent application filed with the China Patent Office on September 22, 2022, with the application number 2022111604993 and the invention title "Semiconductor Devices and Manufacturing Methods and Electronic Equipment", and its content should be understood as being incorporated by reference. are incorporated into this application.

Technical field

The present application relates to but is not limited to the field of semiconductor devices, and in particular, to a semiconductor device, a manufacturing method thereof, and electronic equipment.

Background technique

Dynamic Random Access Memory (DRAM) is a common system memory that is widely used in personal computers, notebooks and consumer electronics products. Its annual output value accounts for about 30% of the entire semiconductor industry. Now the world's top three DRAM companies are entering the 1a technology node, and their gate length has reached 15nm (close to logic's 7nm), making it difficult to shrink further.

As DRAM technology develops toward higher density and higher capacity, the shrinkage of semiconductor structures has encountered a bottleneck, making it difficult to shrink further. Moreover, the number of capacitors has increased and their size has decreased, resulting in longer process times and more complex process flows required for the manufacturing of capacitors.

Summary of the invention

The following is an overview of the topics described in detail in this article. This summary is not intended to limit the scope of the application.

An embodiment of the present application provides a semiconductor device, including a first chip, where the first chip includes:

first substrate;

A plurality of memory cell columns arranged on the first substrate, each of the memory cell columns being perpendicular to the first substrate and consisting of a plurality of memory cells stacked on one side of the first substrate form;

Each of the memory cells includes a transistor and a capacitor. The transistor includes a semiconductor layer and a gate electrode. The semiconductor layer extends in a direction parallel to the first substrate into a strip-shaped structure. The strip-shaped structure has side surfaces. The wall and both ends, and the sidewalls in a direction parallel to the first substrate include a source region, a channel region and a drain region in sequence, the drain region includes a capacitor region; the gate surrounds The sidewalls of the channel region, and a gate insulation layer is provided between the gate electrode and the channel region;

The capacitor is disposed on a side wall of the capacitance region of the drain region;

A first internal supporting layer, wherein the first internal supporting layer is disposed between capacitor regions of drain regions of two adjacent semiconductor layers in a direction perpendicular to the first substrate, the first internal supporting layer being configured to provide support for the capacitor and the two adjacent semiconductor layers, and the capacitor is separated into a grid-type capacitor by the first internal supporting layer.

In this embodiment of the present application, the first chip further includes: a plurality of word lines, each of which extends on a plane parallel to the first substrate and perpendicular to the extension direction of the semiconductor layer. , wherein a memory cell column is provided in the extending direction of the word line, and each of the word lines is formed by a gate of a transistor of a memory cell in the memory cell column; or, in the word line A plurality of memory cell columns are provided in an extending direction, and each word line is formed by connecting together the gates of transistors of a plurality of memory cells of the plurality of memory cell columns arranged along the extending direction of the word line. In this embodiment of the present application, the first internal support layer may also be disposed between the capacitance regions of the drain regions of two adjacent semiconductor layers along the extension direction of the word line and along a direction perpendicular to the first extends in the direction of a substrate.

In this embodiment of the present application, the first chip further includes: a plurality of bit lines, each of the bit lines extending in a direction perpendicular to the first substrate and parallel to the extending direction of the semiconductor layer. In the direction, the source regions of the transistors of multiple memory cells in two adjacent memory cell columns are connected to a common bit line.

In this embodiment of the present application, the capacitor may surround the sidewall of the capacitance region of the drain region. In this embodiment of the present application, the capacitor may include a first electrode plate, a second electrode plate, and a dielectric layer disposed between the first electrode plate and the second electrode plate. The first electrode The plate, the dielectric layer and the second electrode plate are sequentially surrounding the sidewalls of the capacitive region of the drain region. In this embodiment of the present application, the semiconductor device may further include a second chip, the second chip and the first chip are stacked together, and the second chip and the memory cell column are respectively located on the first chip. On both sides of a substrate, the circuit of the second chip is electrically connected to the circuit of the first chip;

The second chip includes a peripheral circuit, a metal contact layer and a metal interconnection layer which are arranged on the second substrate in sequence, and the metal contact layer is arranged on a side of the peripheral circuit away from the second substrate, so The metal interconnection layer is provided on a side of the metal contact layer away from the second substrate and on a side of the first substrate away from the memory cell column, and a metal contact is provided in the metal contact layer. Pillar, a metal line is provided in the metal interconnection layer, one end of the metal line is electrically connected to the bit line, word line or capacitor of the first chip, and the other end of the metal line passes through the metal contact pillar electrically connected to the peripheral circuit.

In this embodiment of the present application, a plurality of word lines at different layers arranged at intervals along a direction perpendicular to the first substrate may be in a stepped shape.

In this embodiment of the present application, the material of the semiconductor layer may be selected from any one or more semiconductor materials formed of Group IVA elements, and the material of the word line may be selected from conductor materials formed of Group IVA elements. any one or more.

In this embodiment of the present application, the material of the semiconductor layer may be single crystal silicon; the material of the word line may be selected from any one or more of polycrystalline silicon and polycrystalline silicon germanium.

In this embodiment of the present application, the memory cell column may further include an interlayer isolation layer, and the interlayer isolation layer is disposed between the gates of the transistors of two adjacent memory cells in the memory cell column, so The interlayer isolation layer is configured to isolate the gates of the transistors of two adjacent memory cells.

In this embodiment of the present application, the semiconductor device may further include one or more memory cell isolation pillars extending in a direction perpendicular to the first substrate, with every two memory cell isolation pillars being spaced in the extending direction of the semiconductor layer. The unit column is provided with one of the storage unit isolation columns.

In this embodiment of the present application, the semiconductor device may further include a second internal support layer, the second internal support layer being disposed between two adjacent semiconductor layers in a direction perpendicular to the first substrate. And located in the non-capacitive region, the second inner support layer is configured to provide support for the semiconductor layer.

In this embodiment of the present application, the first electrode plate may be an internal electrode plate, and the second electrode plate may be an external electrode plate; the drain region may be connected to the first electrode plate. An embodiment of the present application also provides a method for manufacturing a semiconductor device, including:

A plurality of composite layers composed of the first sacrificial layer and the semiconductor layer are stacked on one side of the first substrate in the order of the first sacrificial layer and the semiconductor layer in a direction perpendicular to the first substrate;

Etch trenches in a plurality of composite layers in a direction perpendicular to the first substrate, and perform side etching on the trenches to form a plurality of intervals perpendicular to the first substrate. grooves and forming first internal support grooves in the first sacrificial layer of each composite layer, the spacing grooves spacing a plurality of the composite layers into a plurality of composite walls perpendicular to the first substrate, so The first internal support groove separates the first sacrificial layer into a grid structure, and the first internal support groove is filled with support material to form a first internal support layer;

Remove the remaining first sacrificial layer, the remaining semiconductor layer extends in a direction parallel to the first substrate and sequentially includes a source region, a channel region and a drain region, the drain region includes a capacitor region;

forming a second sacrificial layer on the first substrate so that the second sacrificial layer covers the semiconductor layer;

removing the second sacrificial layer on the sidewalls of the channel region of the semiconductor layer, and sequentially forming a gate insulating layer and a gate electrode surrounding the channel region on the sidewalls of the channel region of the semiconductor layer, The semiconductor layer and the gate electrode constitute a transistor;

The second sacrificial layer on the sidewall of the capacitor region of the drain region of the semiconductor layer is removed, and capacitors are sequentially formed on the sidewalls of the capacitor region of the drain region of the semiconductor layer to obtain the first chip.

In this embodiment of the present application, the manufacturing method of the semiconductor device may further include: forming a plurality of word lines extending on a plane parallel to the first substrate and perpendicular to the extension direction of the semiconductor layer;

Wherein, a semiconductor layer is provided on a plane parallel to the first substrate and along an extension direction perpendicular to the semiconductor layer, so that the gate electrode on the semiconductor layer serves as a word line; or, on a plane parallel to the A plurality of semiconductor layers are disposed on the plane of the first substrate and along an extending direction perpendicular to the semiconductor layer, so that gate electrodes on the plurality of semiconductor layers are connected together to form a word line.

In this embodiment of the present application, the manufacturing method of the semiconductor device may further include: forming a plurality of bit lines extending in a direction perpendicular to the first substrate;

Wherein, forming the bit lines includes:

When etching the grooves in the plurality of composite layers, a bit line groove is etched in the plurality of composite layers along a direction perpendicular to the first substrate, and an isolation material is filled in the bit line groove;

After the capacitor is formed, the isolation material in the bit line trench is removed, the bit line trench is filled with bit line material to form a bit line, and the bit line and a plurality of semiconductors in contact with the bit line are The source regions of the plurality of semiconductor layers are connected such that the source regions of the plurality of semiconductor layers share a bit line.

In this embodiment of the present application, the manufacturing method of the semiconductor device may further include:

A peripheral circuit, a metal contact layer with metal contact posts, and a metal interconnection layer with metal lines are sequentially arranged on one side of the second substrate, and one end of the metal line is connected to the metal contact post through the metal contact post. The peripheral circuits are electrically connected to obtain a second chip;

The first chip and the second chip are stacked together, and the circuit of the second chip is electrically connected to the circuit of the first chip.

In the embodiment of the present application, side etching is performed on the trench, a first internal support groove is formed in the first sacrificial layer of each composite layer, and the first internal support groove is filled with support material. Forming the first inner support layer may include:

The trenches are etched sideways, and first internal support grooves are formed in the first sacrificial layer of each composite layer. The first internal support grooves are filled with support material to form a vertical axis along the The first internal support layer between the capacitance regions of the drain regions of two adjacent semiconductor layers in the direction of the first substrate; or,

Filling the trench with a support material to form a capacitor region between the drain regions of two adjacent semiconductor layers along the extension direction of the word line and in a direction perpendicular to the first substrate Extended first internal support layer; perform side etching on the trenches, form first internal support grooves in the first sacrificial layer of each composite layer, and fill support in the first internal support grooves material to form a first inner support layer disposed between the capacitance regions of the drain regions of two adjacent semiconductor layers in a direction perpendicular to the first substrate.

In this embodiment of the present application, sequentially forming capacitors on the sidewalls of the capacitive region of the drain region of the semiconductor layer may include: sequentially forming capacitors on the sidewalls of the capacitive region of the drain region of the semiconductor layer. The first electrode plate, the dielectric layer and the second electrode plate surrounding the side walls of the capacitor region constitute the capacitor.

An embodiment of the present application also provides an electronic device, including the semiconductor device provided in the above embodiment of the present application.

Additional features and advantages of the application will be set forth in the description which follows, and in part will be apparent from the description, or may be learned by practice of the application. Other advantages of the application can be realized and obtained by the solutions described in the specification and drawings.

Figure overview

The drawings are used to provide an understanding of the technical solution of the present application and constitute a part of the specification. They are used to explain the technical solution of the present application together with the embodiments of the present application and do not constitute a limitation of the technical solution of the present application.

1A is a schematic front cross-sectional structural diagram of a semiconductor device according to an exemplary embodiment of the present application;

FIG. 1B is a schematic cross-sectional structural view of the semiconductor device shown in FIG. 1A;

FIG. 1C is an enlarged view of the transistor of the semiconductor device shown in FIG. 1A;

1D is an enlarged view of the capacitor of the semiconductor device shown in FIG. 1A;

2A is a schematic front cross-sectional structural diagram of another semiconductor device according to an exemplary embodiment of the present application;

Figure 2B is a schematic top view structural diagram of the conductor device shown in Figure 2A;

3 is a distribution state diagram in a side view direction of a plurality of word lines spaced apart in a direction perpendicular to the first substrate of the semiconductor device according to an exemplary embodiment of the present application;

4A is a schematic front cross-sectional structural view of the second chip of the semiconductor device according to an exemplary embodiment of the present application;

FIG. 4B is a schematic top structural view of the second chip of the semiconductor device shown in FIG. 3A;

Figure 5 is a process flow diagram of a manufacturing method of a semiconductor device according to an exemplary embodiment of the present application;

6A is a schematic front cross-sectional structural view of an intermediate product obtained in an intermediate step of the manufacturing method of a semiconductor device according to an exemplary embodiment of the present application;

Figure 6B is a schematic top structural view of the intermediate product shown in Figure 6A;

7A is a schematic front cross-sectional structural view of an intermediate product obtained in an intermediate step of the manufacturing method of a semiconductor device according to an exemplary embodiment of the present application;

Figure 7B is a schematic top structural view of the intermediate product shown in Figure 7A;

8A is a schematic front cross-sectional structural view of an intermediate product obtained in an intermediate step of the manufacturing method of a semiconductor device according to an exemplary embodiment of the present application;

Figure 8B is a schematic top structural view of the intermediate product shown in Figure 8A;

9A is a schematic front cross-sectional structural view of an intermediate product obtained in an intermediate step of the manufacturing method of a semiconductor device according to an exemplary embodiment of the present application;

Figure 9B is a schematic top structural view of the intermediate product shown in Figure 9A;

10A is a schematic front cross-sectional structural view of an intermediate product obtained in an intermediate step of the manufacturing method of a semiconductor device according to an exemplary embodiment of the present application;

Figure 10B is a schematic top structural view of the intermediate product shown in Figure 10A;

11A is a schematic front cross-sectional structural view of an intermediate product obtained in an intermediate step of the manufacturing method of a semiconductor device according to an exemplary embodiment of the present application;

FIG. 11B is a schematic top structural view of the intermediate product shown in FIG. 11A.

The meanings of the marking symbols in the drawings are:

1000-first chip; 2000-second chip; 3000-second substrate; 100-first substrate; 200-memory cell column; 300-bit line; 300'-bit line slot; 400-word line; 501 -First internal support layer; 501'-first internal support groove; 502-second internal support layer; 502'-second internal support groove; 600-peripheral circuit; 601-first transistor; 6011-first source ; 6012-first drain; 6013-first channel; 6014-first gate; 602-second transistor; 6021-second source; 6022-second drain; 6023-second channel; 6024 -Second gate; 603-first type well; 604-second type well; 700-metal contact layer; 701-metal contact pillar; 800-metal interconnection layer; 801-metal line; 901-first sacrificial layer ; 902-second sacrificial layer; 1-memory unit; 10-transistor; 11-semiconductor layer 111-source region; 112-channel region; 113-drain region; 12-gate; 20-capacitor; 21- First electrode plate; 22-second electrode plate; 23-dielectric layer; 2-interlayer isolation layer; 3-memory cell isolation pillar; 3'-memory cell isolation groove; 4-trench; 5-isolation material ;6-spacing slot.

Details

In order to make the purpose, technical solutions and advantages of the present application more clear, the embodiments of the present application will be described in detail below with reference to the accompanying drawings. It should be noted that, as long as there is no conflict, the embodiments and features in the embodiments of this application can be arbitrarily combined with each other.

The embodiments herein may be implemented in a number of different forms. Those of ordinary skill in the art can easily understand the fact that the implementation manner and content can be transformed into various forms without departing from the spirit and scope of the present application. Therefore, this application should not be construed as being limited only to the contents described in the following embodiments. If there is no conflict, the embodiments and features in the embodiments in this application can be combined with each other arbitrarily.

The scale of the drawings in this application can be used as a reference in actual processes, but is not limited thereto. For example, the width-to-length ratio of the semiconductor layer, the thickness and spacing of each film layer can be adjusted according to actual needs. The drawings described in this application are only structural schematic diagrams, and one aspect of this application is not limited to the shapes or numerical values shown in the drawings.

In this manual, for convenience, "middle", "upper", "lower", "front", "back", "vertical", "horizontal", "top", "bottom", "inside", Words such as "outside" indicating the orientation or positional relationship are used to describe the positional relationship of the constituent elements with reference to the drawings, which are only for the convenience of describing this specification and simplifying the description, and do not indicate or imply that the device or component referred to must have a specific orientation, Constructed and operated in a specific orientation and therefore should not be construed as limiting this application. The positional relationship of the constituent elements is appropriately changed depending on the direction in which each constituent element is described. Therefore, they are not limited to the words and phrases described in the specification, and may be appropriately replaced according to circumstances.

In this specification, unless otherwise explicitly stated or limited, the terms "set" and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, or an electrical connection; it can be a direct connection, an indirect connection through an intermediate piece, or an internal connection between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood on a case-by-case basis.

In the description of the present application, ordinal numbers such as "first" and "second" are provided to avoid confusion of constituent elements and are not intended to limit the quantity.

In this specification, "film" and "layer" may be interchanged. For example, "dielectric layer" may sometimes be replaced by "dielectric film".

An embodiment of the present application provides a semiconductor device. The semiconductor device includes a first chip. The first chip includes:

first substrate;

Each of the memory cells includes a transistor and a capacitor. The transistor includes a semiconductor layer and a gate electrode. The semiconductor layer extends in a direction parallel to the first substrate into a strip-shaped structure. The strip-shaped structure has side surfaces. The wall and both ends, and the sidewalls in a direction parallel to the first substrate include a source region, a channel region and a drain region in sequence, the drain region includes a capacitor region; the gate surrounds The sidewalls of the channel region, and a gate insulating layer is provided between the gate and the channel region; the capacitor is provided on the sidewalls of the capacitance region of the drain region;

A first internal support layer, the first internal support layer is disposed between the capacitor regions of the drain regions of two adjacent semiconductor layers in a direction perpendicular to the first substrate, the first internal support layer A layer is configured to provide support for the capacitor and two adjacent semiconductor layers, the capacitor being spaced by the first inner support layer as a grid of capacitors.

In this embodiment of the present application, the first chip may further include: a plurality of word lines, each of which extends on a plane parallel to the first substrate and perpendicular to the extension of the semiconductor layer. direction, wherein a memory cell column is provided in the extending direction of the word line, and each of the word lines is formed by a gate of a transistor of a memory cell in the memory cell column; or, in the word line A plurality of memory cell columns are provided in the extending direction, and each word line is formed by connecting together the gates of the transistors of a plurality of memory cells of the plurality of memory cell columns arranged along the extending direction of the word line.

In this embodiment of the present application, the first internal support layer may also be disposed between the capacitance regions of the drain regions of two adjacent semiconductor layers along the extension direction of the word line and along a direction perpendicular to the first extends in the direction of a substrate.

In this embodiment of the present application, the first chip may further include: a plurality of bit lines, each of the bit lines extending in a direction perpendicular to the first substrate and in the extending direction of the semiconductor layer. In a parallel direction, the source regions of the transistors of multiple memory cells in two adjacent memory cell columns are connected to a common bit line.

In this embodiment of the present application, the capacitor may surround the sidewall of the capacitance region of the drain region. The semiconductor device provided by the embodiment of the present application can be applied in the field of DRAM, for example, can be applied to DRAM with 3D memory cells formed by a superlattice structure.

For example, a multi-layer superlattice on a substrate can be used to form multi-layer memory cells. Each layer of memory cells can be array-distributed memory cells. The memory cells at the same position in each layer in the two-dimensional plane form a vertical direction. A column of storage units is referred to as a storage unit column.

Figure 1A is a schematic front cross-sectional structural view of a semiconductor device according to an exemplary embodiment of the present application; Figure 1B is a schematic top cross-sectional structural view of the semiconductor device shown in Figure 1A; Figure 1C is a schematic diagram of a transistor of the semiconductor device shown in Figure 1A Magnified view; FIG. 1D is an enlarged view of the capacitor of the semiconductor device shown in FIG. 1A. As shown in FIGS. 1A to 1D , the semiconductor device may include: a first chip 1000. The first chip 1000 includes: a first substrate 100, a plurality of memory cell columns 200, and a plurality of bit lines 300. , BL), a plurality of word lines 400 (Word Line, WL) and a first internal support layer 501.

Each memory cell column 200 is perpendicular to the first substrate 100 and is formed by a plurality of memory cells 1 stacked on one side of the first substrate 100 .

Each memory cell 1 includes a transistor 10 and a capacitor 20. The transistor 10 includes a semiconductor layer 11 and a gate electrode 12. The semiconductor layer 11 extends in a direction parallel to the first substrate 100 into a strip-shaped structure having side surfaces. Walls and both ends, the cross-section of the strip structure can be rectangular, circular, elliptical, etc., and the sidewalls in the direction parallel to the first substrate include a source region 111 and a channel region in sequence 112 and the drain region 113, the drain region 113 includes a capacitor region; the gate 12 surrounds the sidewall of the channel region 112, and a gate insulating layer is provided between the gate 12 and the channel region 112 (not shown in the figure) ).

The capacitor 20 is disposed on the sidewall of the capacitance region of the drain region 113 , that is, the capacitor 20 is disposed between two adjacent semiconductor layers. For example, as shown in FIG. 1A , the capacitor 20 is surrounded by the sidewalls of the capacitive region of the drain region 113 , that is, the capacitor 20 is set on the sidewalls around the capacitive region of the drain region 113 . superior. In other embodiments, the capacitor 20 may be disposed on sidewalls on opposite sides of the capacitance region of the drain region 113 .

In the embodiment of the present application, as shown in Figure 1D, the capacitor 20 includes a first electrode plate 21, a second electrode plate 22, and a dielectric layer 23 disposed between the first electrode plate 21 and the second electrode plate 22, The first electrode plate 21 , the dielectric layer 23 and the second electrode plate 22 are sequentially surrounding the sidewalls of the capacitor region of the drain region 113 .

Each bit line 300 extends in a direction perpendicular to the first substrate 100, and in a direction parallel to the extension direction of the semiconductor layer 11, the source regions 111 of the transistors 10 of the multiple memory cells 1 of two adjacent memory cell columns 200 are connected to a common bit line 300. For example, two adjacent memory cells 1 along the extension direction of the semiconductor layer are distributed in a mirror image, and the source regions 111 of the transistors 10 of the two adjacent memory cells 1 are connected to a common bit line 300.

Every two adjacent memory cells along the extension direction of the semiconductor layer are regarded as a repeating unit as a whole. When there are 2n memory cells along the extension direction of the semiconductor layer, there are n repeating units, and each repeating unit includes two memory cells that are mirror-symmetrical in structure. In a repeating unit, two transistors are arranged adjacent to each other, and capacitors located on a semiconductor layer are located at both ends. A bit line 300 distributed along a direction perpendicular to the substrate is arranged between the two adjacent transistors, and the transistors and capacitors in the two memory cells are distributed mirror-symmetrically about the bit line 300.

Each word line 400 extends on a plane parallel to the first substrate 100 and perpendicular to the extension direction of the semiconductor layer 11 , wherein a memory cell column 200 is provided in the extension direction of the word line 400 , and each word line 400 is formed by the gate electrode 12 of the transistor 10 of one memory cell 1 in each layer of the one memory cell column 200; alternatively, multiple memory cell columns 200 are provided in the extending direction of the word line 400, and each word line 400 is formed by The gate electrodes 12 of the transistors 10 of the plurality of memory cells 1 arranged along the extending direction of the word line 400 in the plurality of memory cell columns 200 and located in the same layer are connected together to form.

The first inner support layer 501 is disposed between the capacitor regions of the drain regions 113 of two adjacent semiconductor layers 11 in a direction perpendicular to the first substrate 100 , and is configured to provide support to the capacitor 20 and Two adjacent semiconductor layers 11 provide support, and the capacitor 20 is separated by the first inner support layer 501 to form a mesh capacitor.

In Figure 1A, two memory cell columns 200 share a bit line 300. There are three bit lines 300 in the semiconductor device shown in Figures 1A and 1B; the semiconductor device shown in Figures 1A and 1B is a three-layer supercrystalline There are three layers of memory cells formed by a grid, and each layer of memory cells corresponds to two word lines 400. There are a total of six word lines 400 in the semiconductor device shown in FIG. 1A and FIG. 1B.

In the description of this application, each memory cell column is formed by a plurality of memory cells arranged on one side of the first substrate along a stack perpendicular to the first substrate; this application refers to one or more memory cells belonging to the same layer. As a group, the group of memory cells are stacked in a direction perpendicular to the first substrate, and memory cell groups of different stacks form columns extending in a direction perpendicular to the first substrate. The plurality of groups form an array, that is to say, the memory cell groups of each layer form an array, or multiple columns of stacked memory cell groups form an array, for example, different memory cell columns 200 are arranged on the first substrate 100 along the extending direction of the semiconductor layer and the extending direction of the word lines to form an array.

The semiconductor device of the embodiment of the present application adopts a lateral semiconductor layer (that is, a semiconductor layer extending in a direction parallel to the first substrate) and a lateral capacitor (that is, the capacitor is arranged between the semiconductor layers of the transistor instead of being arranged between The left and right sides of the transistor), so that the transistors and capacitors can form a three-dimensional stacked structure, and the memory cells formed by the transistors and capacitors can be stacked together in a direction perpendicular to the first substrate, increasing the storage density of the semiconductor device; in addition, the third The design of an internal support layer enables the capacitor to have a grid capacitance structure, which can support the longer lateral capacitor and prevent the longer lateral capacitor from collapsing during selective etching.

For example, in a direction parallel to the extension direction of the semiconductor layer, the sources of the transistors of multiple memory cells in two adjacent memory cell columns can share a bit line, which can reduce the size of the semiconductor device, Further increasing the storage density of semiconductor devices, thereby reducing the production cost per Gb, provides a new technology research and development direction under the shrinkage bottleneck of DRAM.

In the embodiment of the present application, as shown in FIG. 1B , the first internal support layer 501 may also be disposed between the capacitive regions of the drain regions of two adjacent semiconductor layers 11 along the extension direction of the word line 400 and along the extension direction of the word line 400 . Extends perpendicular to the direction of the first substrate 100 .

In this embodiment of the present application, a memory cell column may be formed by 2 to 100 memory cells stacked in a direction perpendicular to the first substrate. For example, it may be formed by 2, 3, 4, or 5 memory cells. 10, 13, 15, 18, 20, 30, 40, 50, 60, 70, 80, 90, 100 storage units are formed.

In this embodiment of the present application, the plurality of memory cell columns are arranged on the first substrate along the extension direction of the semiconductor layer and the extension direction of the word line to form an array; here, it can be understood that each layer A group of memory cells forms an array, or multiple columns formed by multiple stacked memory cell groups form an array.

In this embodiment of the present application, 2 to 1000 memory cell columns may be provided along the extending direction of the semiconductor layer. For example, 2, 4, 6, 8, 10, or 12 memory cell columns may be provided. 14, 16, 18, 20, 30, 40, 50, 60, 70, 80, 90, 100, 200, 300, 400, 500, 600, 700, 800, 900, 1000 memory cell columns; 1 to 100 memory cell columns can be provided along the extending direction of the word line, for example, 1 or 2 can be provided , 3, 4, 5, 12, 14, 16, 18, 20, 30, 40, 50, 60, 70, 80, 90, 100 storage units List.

In this embodiment of the present application, the structure of the mesh capacitor may refer to the structure of the mesh capacitor of the 1z technology node.

In the embodiment of the present application, the number of the first internal support layers can be set according to the length of the capacitor, so that the capacitor has a grid structure. For example, a first inner support layer can be provided every 200nm to 300nm; the length of the capacitor at the current 1z technology node is approximately 1000nm, in which two first inner support layers can be provided.

FIG. 2A is a schematic front cross-sectional structural view of another semiconductor device according to an exemplary embodiment of the present application; FIG. 2B is a schematic top structural view of the semiconductor device shown in FIG. 2A . As shown in FIG. 2A and FIG. 2B, in the exemplary embodiment of the present application, the semiconductor device may further include a second chip 2000. The second chip 2000 and the first chip 1000 are stacked together and the second chip 2000 and the storage device 1000 are stacked together. The unit columns 200 are respectively located on both sides of the first substrate 100, and the circuit of the second chip 2000 is electrically connected to the circuit of the first chip 1000;

The second chip 2000 includes a peripheral circuit 600, a metal contact layer 700 and a metal interconnection layer 800 which are arranged in sequence on the second substrate 3000. The metal contact layer 700 is arranged on the side of the peripheral circuit 600 away from the second substrate 3000. The interconnection layer 800 is disposed on a side of the metal contact layer 700 away from the second substrate 3000 and on a side of the first substrate 100 away from the memory cell column 200. The metal contact layer 700 includes a metal contact pillar 701 and an insulating dielectric. The connecting layer 800 includes a metal wire 801 and an insulating medium. One end of the metal wire 801 is electrically connected to the bit line 300, the word line 400 of the first chip 1000, or the second electrode plate of the capacitor 20 (which can be determined according to the specific circuit). The other end of 801 is electrically connected to the peripheral circuit 600 through the metal contact post 701 .

In the semiconductor device structure of the embodiment of the present application, the memory units and peripheral circuits are respectively arranged on the substrates of different chips, and the CuA (CMOS under Array) structure is used to set the peripheral circuits below the memory unit columns, so the peripheral circuits do not occupy The area of the first substrate of the first chip where the memory unit is located can be provided with memory units on the entire first substrate, so that more memory units can be provided on the limited first substrate area, thereby improving the semiconductor memory storage density.

In this embodiment of the present application, the first substrate may be a semiconductor substrate, for example, a single crystal silicon substrate, or a semiconductor on insulator (SOI) substrate, for example, silicon on sapphire. (Silicon On Sapphire, SOS) substrate, Silicon On Glass (SOG) substrate, silicon epitaxial layer based on the base semiconductor or other semiconductor or optoelectronic materials, such as silicon-germanium (Si _1-x Ge _x , where x can be, for example, a mole fraction between 0.2 and 0.8), germanium (Ge), gallium arsenide (GaAs), gallium nitride (GaN) or indium phosphide (InP). The first substrate may be doped or undoped; the second substrate may be a doped or undoped single crystal silicon substrate.

In this embodiment of the present application, the material of the bit line may be selected from any one or more of tungsten, molybdenum, cobalt and other metal materials with similar properties.

3 is a distribution state diagram in a side view direction of a plurality of word lines spaced apart in a direction perpendicular to the first substrate of the semiconductor device according to an exemplary embodiment of the present application. As shown in FIG. 3 , in the embodiment of the present application, the lengths of the multiple word lines 400 located at different layers and spaced apart along the direction perpendicular to the first substrate 100 may be different, so that the lengths of the word lines 400 arranged along the direction perpendicular to the first substrate 100 may be different. The plurality of word lines 400 located at different layers arranged in the direction of the substrate 100 may be in a ladder shape.

In this embodiment of the present application, the material of the semiconductor layer may be selected from any one or more types of semiconductor materials formed of Group IVA elements. For example, the material of the semiconductor layer may be single crystal silicon.

In this embodiment of the present application, the material of the word line may be a material compatible with the semiconductor layer. For example, the material of the word line may be selected from any one or more conductor materials formed of Group IVA elements. For another example, the material of the word line may be selected from any one or more of polysilicon, polysilicon germanium, and the like. Semiconductor materials formed of Group IVA elements and conductor materials formed of Group IVA elements are both formed of Group IVA elements, and they can be better compatible with each other.

In this embodiment of the present application, the height of the semiconductor layer in the direction perpendicular to the first substrate can be set according to actual electrical requirements, for example, it can be 10 nm to 50 nm.

In this embodiment of the present application, the first electrode plate may be an inner electrode plate, and the second electrode plate may be an outer electrode plate. As shown in FIGS. 1A and 2A , the drain region 113 may be connected to the first electrode plate 21 (ie, the internal electrode plate). As shown in Figures 1B and 2B, the second electrode plates 22 of a plurality of capacitors 20 arranged in a direction parallel to the extending direction of the word line can be connected together, but their first electrode plates 21 are separated.

In the embodiment of the present application, as shown in FIG. 1A and FIG. 2A , one transistor 10 may correspond to one capacitor 20 , that is, the storage unit 1 may be a 1T1C structure.

In the embodiment of the present application, two adjacent capacitors in a direction perpendicular to the first substrate may share an external electrode plate.

In the embodiment of the present application, the materials of the first electrode plate and the second electrode plate can be independently selected from titanium nitride (for example, TiN), aluminum-titanium-based alloy (for example, TiAl), tantalum nitride (For example, TaN) and other other metallic materials with similar properties. The thickness of the first electrode plate may be 5 nm to 15 nm, and the thickness of the second electrode plate may be 5 nm to 15 nm.

In the embodiment of the present application, the material of the dielectric layer may be a high dielectric constant (K) material, for example, may be selected from any one or more of hafnium oxide (e.g., HfO ₂ ), aluminum oxide (e.g., Al ₂ O ₃ ), zirconium oxide (e.g., ZrO) and strontium titanate (e.g., SrTiO ₃ , STO). The thickness of the dielectric layer may be 5 nm to 15 nm.

In the embodiment of the present application, as shown in FIG. 1A and FIG. 2A , the memory cell column 200 may also include an interlayer isolation layer 2 , and the interlayer isolation layer 2 is provided between two adjacent memory cells 1 in the memory cell column 200 . Between the gate electrodes 12 of the transistors 10, the gate electrodes 12 of the transistors 10 of two adjacent memory cells 1 are isolated.

In this embodiment of the present application, the material of the interlayer isolation layer may be silicon oxide, for example, SiO ₂ .

In the embodiment of the present application, as shown in FIG. 1A and FIG. 2A , the semiconductor device may further include one or more memory cell isolation pillars 3 extending in a direction perpendicular to the first substrate. For example, one memory cell isolation pillar 3 may be provided every two memory cell columns 200 in the extending direction of the semiconductor layer.

In this embodiment of the present application, the material of the memory cell isolation pillar may be silicon oxide, for example, it may be selected from spin-on deposition (SOD) silicon oxide film, high density plasma (HDP) ) silicon oxide film and high aspect ratio process (High Aspect Ratio Process, HARP) silicon oxide film any one or more.

In embodiments of the present application, the material of the gate insulating layer may be selected from silicon oxide (for example, SiO ₂ ), hafnium oxide (for example, HfO ₂ ), zirconium oxide (for example, ZrO) and aluminum oxide (for example, Al ₂ O ₃ ) any one or more.

In this embodiment of the present application, the gate insulating layer may be a single layer or multiple layers. For example, it may include a two-layer structure formed of silicon oxide and hafnium oxide, where the silicon oxide layer is in contact with the channel region and the hafnium oxide layer is in contact with the channel region. layer in contact with the gate.

In this embodiment of the present application, the thickness of the gate insulating layer can be set according to actual electrical requirements, for example, it can be 2 nm to 5 nm.

In the embodiment of the present application, as shown in FIG. 1A and FIG. 2A , the semiconductor device may further include a second inner support layer 502 , and the second inner support layer 502 is disposed adjacent to the first substrate in a direction perpendicular to the first substrate. Between the two semiconductor layers 11 and located in the non-capacitive region, the second inner support layer 502 is configured to provide support to the semiconductor layer 11 .

In the embodiment of the present application, as shown in FIG. 1A and FIG. 2A , the second inner support layer 502 may be located on both sides of the bit line 300 , or may be located on both sides of the bit line 300 and both sides of the memory cell isolation pillar 3 . When the second inner support layer 502 is provided on both sides of the bit line 300 and the memory cell isolation pillar 3 , a stronger support can be provided to the semiconductor layer 11 .

In this embodiment of the present application, the material of the first inner support layer and the second inner support layer may be a thin film material with a supporting function, for example, it may be silicon nitride (eg, SiN).

In an exemplary embodiment of the present application, as shown in FIGS. 1A and 2A , the semiconductor device may further include a second sacrificial layer 902 , which is disposed in the blank space of the first chip 1000 and covers the semiconductor layer. 11.

In this embodiment of the present application, the material of the second sacrificial layer may be a dielectric material, for example, it may be any one or more of other materials with similar properties such as silicon oxide (eg, SiO ₂ ).

In this embodiment of the present application, the second chip may adopt a commonly used peripheral circuit chip structure. For example, the peripheral circuit may be a CMOS transistor.

FIG. 4A is a schematic front cross-sectional structural view of the second chip of the semiconductor device according to an exemplary embodiment of the present application; FIG. 4B is a schematic top structural view of the second chip of the semiconductor device shown in FIG. 3A . As shown in FIG. 4A and FIG. 4B, in the embodiment of the present application, the peripheral circuit 600 may include a first transistor 601 and a second transistor 602. The first transistor 601 and the second transistor 602 may be arranged side by side on the second substrate 3000. On the first side, a first type well 603 may be disposed between the first transistor 601 and the second substrate 3000, and a second type well 604 may be disposed between the second transistor 602 and the second substrate 3000; A transistor 601 may include a first source electrode 6011, a first drain electrode 6012, a first channel 6013 disposed between the first source electrode 6011 and the first drain electrode 6012, and a first channel 6013 disposed on one side of the first channel 6013. The materials of a gate 6014, the first source 6011 and the first drain 6012 can be the same, for example, they can all be N-type semiconductor material or P-type semiconductor material, the material of the first channel 6013 and the first type well 603 The materials are the same, which can be P-type semiconductor materials or N-type semiconductor materials, but the materials of the first source electrode 6011, the first drain electrode 6012, the first channel 6013, and the first type well 603 are different; the materials of the first channel 6013 and A first gate insulation layer (or gate oxide layer, not shown in the figure) may also be provided between the first gate electrodes 6014; the second transistor 602 includes a second source electrode 6021, a second drain electrode 6022, and is disposed on The second channel 6023 between the second source electrode 6021 and the second drain electrode 6022, the second gate electrode 6024 provided on one side of the second channel 6023, the second source electrode 6021 and the second drain electrode 6022 are made of the same material , both can be P-type semiconductor material or N-type semiconductor material, the second channel 6023 and the second-type well 604 are made of the same material, and can both be N-type semiconductor material or P-type semiconductor material, but the second source electrode 6021 and the second well 604 are made of the same material. The second drain electrode 6022 is made of different materials from the second channel 6023 and the second type well 604; a second gate insulating layer (or gate oxide layer) can also be provided between the second channel 6023 and the second gate electrode 6024. , not shown in the figure).

In this embodiment of the present application, as shown in FIG. 4A , the first transistor 601 and the second transistor 602 may be arranged side by side on the same plane.

In this embodiment of the present application, the first transistor and the second transistor may be connected to different metal contact pillars, and the other end of the metal contact pillar is connected to the bit line and word line of the first chip through the metal line. or capacitor electrical connection.

In this embodiment of the present application, the first transistor and the second transistor may be gate transistors.

In this embodiment of the present application, the peripheral circuit may further include a third transistor, and the third transistor may be disposed on the same plane as the first transistor and the second transistor.

In an embodiment of the present application, the material of the metal wire can be selected from any one or more of copper and aluminum, for example, it can be copper; the material of the metal contact column can be selected from any one or more of tungsten and molybdenum, for example, it can be tungsten.

In this embodiment of the present application, the semiconductor device may be a dynamic random access memory (DRAM).

An embodiment of the present application also provides a method for manufacturing a semiconductor device. As described above, the semiconductor device provided by the embodiment of the present application can be obtained by this manufacturing method.

FIG. 5 is a process flow diagram of a method for manufacturing a semiconductor device according to an exemplary embodiment of the present application. As shown in Figure 5, the manufacturing method may include:

S10: Stack a first sacrificial layer and a semiconductor layer in order on one side of the first substrate in a direction perpendicular to the first substrate to form a plurality of composites composed of the first sacrificial layer and the semiconductor layer. layer;

S20: Etch trenches in a plurality of composite layers in a direction perpendicular to the first substrate, and perform side etching on the trenches to form a plurality of trenches perpendicular to the first substrate. spacing grooves and forming first internal support grooves in the first sacrificial layer of each composite layer, the spacing grooves spacing a plurality of the composite layers into a plurality of composite walls perpendicular to the first substrate , the first internal support groove separates the first sacrificial layer into a grid structure, and the first internal support groove is filled with support material to form a first internal support layer;

S30: removing the remaining first sacrificial layer, the remaining semiconductor layer extending in a direction parallel to the first substrate and sequentially including a source region, a channel region and a drain region, the drain region including a capacitor region;

S40: Form a second sacrificial layer on the first substrate so that the second sacrificial layer covers the semiconductor layer;

S50: Remove the second sacrificial layer on the sidewalls of the channel region of the semiconductor layer, and sequentially form a gate insulating layer and a gate electrode surrounding the channel region on the sidewalls of the channel region of the semiconductor layer, The semiconductor layer and the gate electrode constitute a transistor;

S60: removing the second sacrificial layer on the sidewalls of the capacitor region in the drain region of the semiconductor layer, and sequentially forming capacitors on the sidewalls of the capacitor region in the drain region of the semiconductor layer to obtain a first chip.

In this embodiment of the present application, the manufacturing method of a semiconductor device may further include: forming a plurality of bit lines extending in a direction perpendicular to the first substrate;

Wherein, forming the bit lines includes:

Step S20: When etching the trenches in the plurality of composite layers, etching bit line trenches in the plurality of composite layers in a direction perpendicular to the first substrate, and etching the bit line grooves in the plurality of composite layers. Fill the groove with isolation material;

After forming the capacitor in step S60, S70: remove the isolation material in the bit line slot, fill the bit line slot with bit line material to form a bit line, and contact the bit line with the bit line The source regions of the plurality of semiconductor layers are connected such that the source regions of the plurality of semiconductor layers share a bit line.

In the embodiment of the present application, step S50 may further include forming a plurality of word lines extending on a plane parallel to the first substrate and perpendicular to the extension direction of the semiconductor layer;

In this embodiment of the present application, the manufacturing method of the semiconductor device may include:

S20: etching a bit line groove and a trench in the plurality of composite layers along a direction perpendicular to the first substrate, and performing side etching on the trench to form a plurality of spacing grooves perpendicular to the first substrate and forming a first internal supporting groove in the first sacrificial layer of each composite layer, wherein the spacing grooves separate the plurality of composite layers into a plurality of composite walls perpendicular to the first substrate, and the first internal supporting grooves separate the first sacrificial layers into a grid structure, filling the first internal supporting grooves with a supporting material to form a first internal supporting layer, and filling the bit line grooves with an isolation material;

S30: Remove the remaining first sacrificial layer. The remaining semiconductor layer extends in a direction parallel to the first substrate and sequentially includes a source region, a channel region and a drain region, and the drain region includes a capacitor region;

S50: Remove the second sacrificial layer on the sidewalls of the channel region of the semiconductor layer, and sequentially form a gate insulating layer and a gate electrode surrounding the channel region on the sidewalls of the channel region of the semiconductor layer, The semiconductor layer and the gate constitute a transistor; and, a semiconductor layer is provided on a plane parallel to the first substrate and along an extension direction perpendicular to the semiconductor layer, such that the one semiconductor layer The gate electrode serves as a word line; or, a plurality of semiconductor layers are provided on a plane parallel to the first substrate and along an extension direction perpendicular to the semiconductor layer, so that the gate electrodes on the plurality of semiconductor layers connected together to form word lines;

S60: Remove the second sacrificial layer on the sidewalls of the capacitive region of the drain region of the semiconductor layer, and sequentially form a first electrode surrounding the capacitive region on the sidewalls of the capacitive region of the drain region of the semiconductor layer. plate, a dielectric layer and a second electrode plate, the first electrode plate, the dielectric layer and the second electrode plate forming a capacitor;

S70: removing the isolation material in the bit line groove, filling the bit line groove with bit line material to form a bit line, connecting the bit line and the source regions of the multiple semiconductor layers in contact with the bit line, so that the source regions of the multiple semiconductor layers share one bit line, and obtaining a first chip.

In this embodiment of the present application, step S20 may include:

Bit line grooves and trenches are etched in the multiple composite layers in a direction perpendicular to the first substrate, and side etching is performed on the trenches to form a plurality of bit line trenches perpendicular to the first substrate. spacing grooves of the substrate and forming first internal support grooves in the first sacrificial layer of each composite layer, the spacing grooves spacing a plurality of the composite layers into a plurality of perpendicular to the first substrate A composite wall, the first internal support grooves space the first sacrificial layer into a grid structure, the first internal support grooves are filled with support material, and are formed in a direction perpendicular to the first substrate. a first internal support layer between the capacitance regions of the drain regions of two adjacent semiconductor layers, and filling the bit line trench with an isolation material; or,

Bit line grooves and trenches are etched in the plurality of composite layers in a direction perpendicular to the first substrate, and support materials are filled in the trenches to form a groove arranged along the extending direction of the word line. a first internal support layer between the capacitance regions of the drain regions of two adjacent semiconductor layers and extending in a direction perpendicular to the first substrate; perform side etching on the trench to form multiple a spacing groove perpendicular to the first substrate and forming a first internal support groove in the first sacrificial layer of each composite wall, the spacing groove spacing a plurality of the composite layers into a plurality of composite layers perpendicular to The composite wall of the first substrate, the first internal support grooves space the first sacrificial layer into a grid structure, the first internal support grooves are filled with support material, and are formed along the edge perpendicular to the a first internal support layer between the capacitance region of the drain region of two adjacent semiconductor layers in the direction of the first substrate, and an isolation material is filled in the bit line trench.

In this embodiment of the present application, step S20 may include:

S21: Etch memory cell isolation trenches, bit line trenches and trenches in the plurality of composite layers in a direction perpendicular to the first substrate;

S22: Fill the trench with a support material to form a capacitor region between the drain regions of two adjacent semiconductor layers along the extension direction of the word line and perpendicular to the first substrate. a first internal support layer extending in the direction; performing side etching on the trench to form a plurality of spaced trenches perpendicular to the first substrate and forming a first sacrificial layer in each composite layer First internal support grooves, the spacing grooves space the plurality of composite layers into a plurality of composite walls perpendicular to the first substrate, the first internal support grooves space the first sacrificial layer into meshes A lattice structure is filled with support material in the first internal support groove to form a first capacitor region disposed between the drain regions of two adjacent semiconductor layers in a direction perpendicular to the first substrate. internal support layer;

Optionally, S23: Perform side etching on the memory cell isolation trench, so that a second internal support trench is formed in the first sacrificial layer of each composite wall, where the second internal support trench is located in the first sacrificial layer of each composite wall. On both sides of the storage unit isolation groove, fill the second internal support groove with support material, and the support material in the second internal support groove forms a second internal support layer;

Optionally, S24: Perform side etching on the bit line trenches to form a second internal support trench in the first sacrificial layer of each composite wall, where the second internal support trench is located on the bit line. On both sides of the groove, support material is filled in the second internal support groove, and the support material in the second internal support groove forms a second internal support layer;

S25: Fill the memory cell isolation trench with memory cell isolation pillars and fill the bit line trench with isolation material.

For example, in the exemplary embodiment of the present application,

i) Step S20 may include:

S23: Perform side etching on the memory cell isolation trench to form a second internal support trench in the first sacrificial layer of each composite wall, where the second internal support trench is located in the memory cell isolation trench. On both sides, the second inner support groove is filled with support material, and the support material in the second inner support groove forms a second inner support layer;

Alternatively, ii) step S20 may include:

S24: Perform side etching on the bit line trench, and form a second internal support trench in the first sacrificial layer of each composite wall, where the second internal support trench is located on both sides of the bit line trench, filling the second inner support groove with support material, the support material in the second inner support groove forming a second inner support layer;

Alternatively, iii) step S20 may include:

S24: performing side etching on the bit line groove to form a second internal supporting groove in the first sacrificial layer of each of the composite walls, wherein the second internal supporting groove is located on both sides of the bit line groove, and a supporting material is filled in the second internal supporting groove, and the supporting material in the second internal supporting groove forms a second internal supporting layer;

S25: filling the memory cell isolation trench with a memory cell isolation column and filling the bit line trench with an isolation material.

In the embodiment of the present application, step S30 may include: removing the remaining first sacrificial layer. The remaining semiconductor layer extends in a direction parallel to the first substrate and sequentially includes a source region, a channel region and a drain region. , the drain region includes a capacitor region.

In the embodiment of the present application, step S50 may include:

S51: Remove the second sacrificial layer around the channel region of the semiconductor layer, and sequentially form a gate insulating layer and a gate electrode surrounding the channel region around the channel region of the semiconductor layer. The semiconductor layer and The gate electrode constitutes a transistor; and, a semiconductor layer is provided on a plane parallel to the first substrate and along an extension direction perpendicular to the semiconductor layer, so that the gate electrode on the one semiconductor layer serves as a word lines; alternatively, a plurality of semiconductor layers are provided on a plane parallel to the first substrate and along an extension direction perpendicular to the semiconductor layer, so that gate electrodes on the plurality of semiconductor layers are connected together to form a word Wire;

Optionally, S52: Set multiple word lines arranged in a direction perpendicular to the first substrate and located on different layers to different lengths, so that the word lines arranged in a direction perpendicular to the first substrate are located on different layers. The multiple word lines of the layer appear in a ladder shape;

Optionally, S53: Set an interlayer isolation layer between the gates of the transistors of the two adjacent memory cells in each memory cell column, so as to separate the transistors of the two adjacent memory cells in each memory cell column. gate isolating.

For example, in the exemplary embodiment of the present application,

i) Step S50 may include:

S51: Remove the second sacrificial layer around the channel region of the semiconductor layer, and sequentially form a gate insulating layer and a gate electrode surrounding the channel region around the channel region of the semiconductor layer. The semiconductor layer and The gate electrode constitutes a transistor; and, a semiconductor layer is provided on a plane parallel to the first substrate and along an extension direction perpendicular to the semiconductor layer, so that the gate electrode on the one semiconductor layer serves as a word lines; alternatively, multiple semiconductor layers are provided on a plane parallel to the first substrate and along an extension direction perpendicular to the semiconductor layer, so that gate electrodes on the multiple semiconductor layers are connected together to form a word Wire;

S52: Set multiple word lines located in different layers arranged in a direction perpendicular to the first substrate to different lengths, so that multiple word lines located in different layers arranged in a direction perpendicular to the first substrate The word lines show a staircase shape;

Alternatively, ii) step S50 may include:

S53: An interlayer isolation layer is provided between the gates of the transistors of the two adjacent memory cells in each memory cell column, thereby isolating the gates of the transistors of the two adjacent memory cells in each memory cell column. open;

Alternatively, iii) step S50 may include:

S53: An interlayer isolation layer is provided between the gates of the transistors of the two adjacent memory cells in each memory cell column, thereby isolating the gates of the transistors of the two adjacent memory cells in each memory cell column. open.

In this embodiment of the present application, the manufacturing method may further include:

S80: Arrange peripheral circuits, metal contact layers with metal contact posts, and metal interconnection layers with metal lines in sequence on one side of the second substrate, connect one end of the metal line to the metal contact post through the metal contact posts. The peripheral circuits are electrically connected to obtain a second chip;

S90: Stack the first chip and the second chip together, and electrically connect the circuit of the second chip to the circuit of the first chip.

In this embodiment of the present application, step S80 may include:

S81: sequentially arranging a peripheral circuit, a metal contact layer with a metal contact column, and a metal interconnect layer with a metal wire on one side of the second substrate, wherein the peripheral circuit includes a first transistor and a second transistor.

S82: Connect the first transistor and the second transistor to the metal contact pillar respectively.

In the embodiment of the present application, step S90 may include: using X-Tracking technology to stack together the first substrate of the first chip and the metal interconnection layer of the second chip, and The connected metal lines are electrically connected to the bit lines, word lines or capacitors of the first chip.

Figure 6A is a schematic front cross-sectional structural view of an intermediate product obtained in an intermediate step of the manufacturing method of a semiconductor device according to an exemplary embodiment of the present application; Figure 6B is a schematic top view structural view of the intermediate product shown in Figure 6A; Figure 7A is an example of the present application FIG. 7B is a schematic top view structural view of the intermediate product shown in FIG. 7A ; FIG. 8A is a semiconductor device according to an exemplary embodiment of the present application. Figure 8B is a schematic top structural view of the intermediate product shown in Figure 8A; Figure 9A is an intermediate step of the manufacturing method of a semiconductor device according to an exemplary embodiment of the present application. A schematic front cross-sectional structural view of the obtained intermediate product; Figure 9B is a schematic top structural view of the intermediate product shown in Figure 9A; Figure 10A is a main schematic view of the intermediate product obtained in the intermediate steps of the manufacturing method of the semiconductor device according to the exemplary embodiment of the present application. Figure 10B is a schematic top view of the structure of the intermediate product shown in Figure 10A; Figure 11A is a schematic cross-sectional view of the intermediate product obtained in the intermediate steps of the manufacturing method of a semiconductor device according to an exemplary embodiment of the present application; Figure 11B is a schematic top structural view of the intermediate product shown in FIG. 11A. As shown in FIGS. 6A to 11B , in an exemplary embodiment, the manufacturing method of the semiconductor device may include:

S10: On the first substrate 100 side, the first sacrificial layer 901 and the semiconductor layer 11 are stacked in order in a direction perpendicular to the first substrate 100 to form a plurality of composite layers composed of the first sacrificial layer 901 and the semiconductor layer 11. , the intermediate product shown in Figure 6A and Figure 6B is obtained;

S21: Etch the memory cell isolation trench 3', the bit line trench 300' and the trench 4 in multiple composite layers in a direction perpendicular to the first substrate 100 to obtain the intermediate product as shown in Figure 7A and Figure 7B ;

S22: Fill the trench 4 with support material to form a first internal support layer 501 extending in a direction perpendicular to the first substrate 100 (as shown in FIG. 8B ); perform side etching on the trench 4 to form multiple layers. A spacing groove 6 perpendicular to the first substrate 100 and a first internal support groove 501' is formed in the first sacrificial layer 901 of each composite layer. The spacing groove 6 separates the plurality of composite layers into a plurality of composite layers perpendicular to the first sacrificial layer 901. In the composite wall of the substrate 100, the first internal support grooves 501' space the first sacrificial layer 901 into a grid structure, and the first internal support grooves 501' are filled with support material to form a structure arranged along a direction perpendicular to the first substrate 100. The first inner support layer 501 between two adjacent semiconductor layers 11 in the direction (as shown in FIG. 8A);

S23: Perform side etching on the memory cell isolation trench 3', so that a second internal support trench 502' is formed in the first sacrificial layer 901 of each composite wall, where the second internal support trench 502' is located in the memory cell isolation On both sides of the groove 3', support material is filled in the second inner support groove 502', and the support material in the second inner support groove 502' forms the second inner support layer 502;

S24: Perform side etching on the bit line trench 300', and form a second internal support trench 502' in the first sacrificial layer 901 of each composite wall. The second internal support trench 502' here is located in the bit line trench 300'. On both sides, the second inner support groove 502' is filled with support material, and the support material in the second inner support groove 502' forms the second inner support layer 502;

S25: Fill the memory cell isolation trench 3' with the memory cell isolation pillar 3 and the bit line trench 300' with the isolation material 5 to obtain the intermediate product as shown in Figure 8A and Figure 8B;

S30: Remove the remaining first sacrificial layer 901, and the remaining semiconductor layer 11 extends in a direction parallel to the first substrate 100 into a strip-shaped structure. The strip-shaped structure has side walls and two ends, and is perpendicular to the first substrate 100. The sidewall in the direction of the substrate 1000 includes the source region 111, the channel region 112 and the drain region 113 in sequence. The drain region 113 includes the capacitor region, resulting in the intermediate product as shown in Figure 9A and Figure 9B;

S40: Form a second sacrificial layer 902 on the first substrate 100, so that the second sacrificial layer 902 covers the surface of the intermediate product obtained in step S30 (covers the semiconductor layer 11), and obtains the intermediate product as shown in Figure 10A and Figure 10B ;

S51: Remove the second sacrificial layer 902 on the sidewalls of the channel region 112 of the semiconductor layer 11, and sequentially form a gate insulating layer surrounding the channel region 112 and the gate electrode 12 on the sidewalls of the channel region 112 of the semiconductor layer 11. The semiconductor layer 11 and the gate electrode 12 constitute the transistor 10; and, one semiconductor layer 11 is provided on a plane parallel to the first substrate 100 and along an extension direction perpendicular to the semiconductor layer 11, so that The gate 12 serves as the word line 400; alternatively, a plurality of semiconductor layers 11 are provided on a plane parallel to the first substrate 100 and along an extension direction perpendicular to the semiconductor layer 11, so that the gates on the plurality of semiconductor layers 11 poles 12 are connected together to form word line 400;

S52: Set multiple word lines 400 located in different layers arranged in a direction perpendicular to the first substrate 100 to different lengths, so that multiple word lines 400 located in different layers arranged in a direction perpendicular to the first substrate 100 Line 400 presents a staircase shape;

S53: Set the interlayer isolation layer 2 between the gate electrodes 12 of the transistors 10 of the two adjacent memory cells in each memory cell column, so as to separate the transistors 10 of the two adjacent memory cells in each memory cell column. The gate 12 is isolated, and the intermediate product shown in Figure 11A and Figure 11B is obtained;

S60: Remove the second sacrificial layer 902 on the sidewalls of the capacitor region of the drain region 113 of the semiconductor layer 11, and sequentially form the first electrode plate 21 surrounding the capacitor region on the sidewalls of the capacitor region of the drain region 113 of the semiconductor layer 11. , dielectric layer 23 and second electrode plate 22, the first electrode plate 21, dielectric layer 23 and second electrode plate 22 form the capacitor 20;

S70: Remove the isolation material 5 in the bit line trench 300', fill the bit line trench 300' with bit line material to form a bit line, and connect the bit line and the source regions of the plurality of semiconductor layers 11 in contact with the bit line. 111 connection, so that the source regions 111 of the plurality of semiconductor layers 11 share a bit line to obtain the first chip 1000 and the intermediate product as shown in Figure 1A and Figure 1B;

S81: A peripheral circuit, a metal contact layer with metal contact pillars, and a metal interconnection layer with metal lines are sequentially provided on one side of the second substrate. The peripheral circuit includes the first transistor 10 and the second transistor 10.

S82: Connect the first transistor 10 and the second transistor 10 to the metal contact posts respectively;

S90: Use X-Tracking technology to stack together the first substrate 100 of the first chip 1000 and the metal interconnection layer of the second chip, and connect the metal lines of the metal interconnection layer to the bit lines of the first chip 1000. The word lines 400 or capacitors are electrically connected to obtain an intermediate product as shown in Figures 2A and 2B.

In the embodiment of the present application, the steps S10 to S70 of forming the first chip and the step S80 of forming the second chip can be performed at the same time; or, steps S10 to S60 are performed first, and then step S80 is performed; or, step S80 is performed first, and then step S80 is performed. Proceed to steps S10 to S60.

In this embodiment of the present application, the material of the first sacrificial layer may be a material with a greater etching selectivity than the material of the semiconductor layer. For example, the material of the first sacrificial layer may be a material with a greater etching selectivity than the material of the semiconductor layer. The etching selectivity ratio between the materials can be ≥50:1. For another example, the material of the semiconductor layer can be single crystal silicon, and the material of the first sacrificial layer can be selected from other materials with similar properties such as SiGe. any one or more. The thickness of the first sacrificial layer may be 30 nm to 50 nm, for example, it may be 30 nm, 35 nm, 40 nm, 45 nm, or 50 nm.

In this embodiment of the present application, the material of the second sacrificial layer may be a material with a greater etching selectivity than the material of the semiconductor layer. For example, the material of the second sacrificial layer may be a material with a greater etching selectivity than the material of the semiconductor layer. The etching selectivity ratio between materials can be ≥50:1. For another example, the material of the semiconductor layer may be single crystal silicon, and the material of the second sacrificial layer may be any one or more of SiO ₂ and other materials with similar properties; the difference between SiO ₂ and single crystal silicon The etching selectivity is relatively high, and the SiO ₂ etching process is mature and the required etching time is short.

In the embodiment of the present application, in step S10, a super lattice thin film stack composed of a first sacrificial layer and a semiconductor layer can be grown on the first side of the first substrate through epitaxial equipment to obtain multiple layers. A composite epitaxial layer composed of a first sacrificial layer and a semiconductor layer.

In an embodiment of the present application, in step S21, the same layer of patterned photomask (Photo mask) can be used to perform patterned etching through light exposure to form storage unit isolation grooves, bit line grooves and trenches.

In the embodiment of the present application, in steps S22 to S24, the trench, the memory cell isolation trench or the bit line trench may be side etched by wet etching.

In an embodiment of the present application, in steps S22 to S24, supporting materials can be filled in the first internal supporting layer groove, the second internal supporting groove and the groove by an ALD process. For example, SiN can be filled in the first internal supporting layer groove, the second internal supporting groove and the groove by an ALD process.

In the embodiment of the present application, in step S25, the memory cell isolation pillars can be filled in the memory cell isolation trenches and the bit line trenches can be filled with isolation materials through SOD, HDP or HARP processes. For example, SOD, HDP or HARP processes can be used. Or the HARP process forms a silicon oxide film in the memory cell isolation trench and the bit line trench.

In the embodiment of the present application, in step S30, the first sacrificial layer can be etched away while retaining the semiconductor layer by selecting an ultra-high first sacrificial layer/semiconductor layer etching ratio. The etching method can be dry. Method etching or wet etching.

In the embodiment of the present application, the second sacrificial layer can be formed through SOD, HDP or HARP process in step S40. For example, the SOD silicon oxide film, HDP silicon oxide film and HARP silicon oxide film can be formed through SOD, HDP or HARP process. Any one or more of them, as the second sacrificial layer.

In the embodiment of the present application, in step S50, the second sacrificial layer can be etched away while retaining the semiconductor layer by using an etching method and selecting an ultra-high second sacrificial layer/semiconductor layer etching ratio. The etching method can be dry etching or wet etching.

In the embodiment of the present application, in step S52, a staircase word line (staircase WL) can be obtained by trim etch.

In the embodiment of the present application, in step S53 , the interlayer isolation layer may be provided by an ALD or chemical vapor deposition (CVD) process. For example, SiO ₂ may be filled by an ALD or CVD process to form the interlayer isolation layer.

In this embodiment of the present application, in step S80, the peripheral circuit may be formed through a traditional CMOS process, and then a metal contact layer and a metal interconnection layer may be formed on the peripheral circuit. The metal contact layer may be formed of a metal contact post and an insulating medium. A whole layer of insulating dielectric may be provided first, and then through holes are opened in the insulating medium and filled with metal to form the metal contact post. The metal interconnection layer may be formed of a metal line and an insulating medium. A whole layer of insulating medium may be provided first, and then through holes are opened in the insulating medium and filled with metal to form the metal line.

In the embodiment of the present application, X-Tracking technology can be used in step S90 to realize the combination and precise electrical connection of the first chip and the second chip. For example, it can include combining the first chip and the second chip together. Select as needed. Electrically connect the metal line to the bit line, word line or capacitor. For example, if you want the metal line to be electrically connected to the bit line, align the metal line to the bit line, and open a connection between the metal line and the bit line in the first substrate. The through hole is filled with conductive metal to achieve precise electrical connection between the metal line and the bit line.

In an embodiment of the present application, the electronic device may include a storage device, a smart phone, a computer, a tablet computer, an artificial intelligence device, a wearable device, or a mobile power supply.

Although the embodiments disclosed in the present application are as above, the described contents are only used to facilitate the understanding of the present application and are not intended to limit the present application. Any skilled person in the field to which this application belongs can make any modifications and changes in the form and details of the implementation without departing from the spirit and scope disclosed in this application. However, the protection scope of this application must still be based on The scope is defined by the appended claims.

Claims

A semiconductor device includes a first chip, the first chip includes:

first substrate;

A plurality of memory cell columns arranged on the first substrate, each of the memory cell columns being perpendicular to the first substrate and consisting of a plurality of memory cells stacked on one side of the first substrate form;

Each of the memory cells includes a transistor and a capacitor. The transistor includes a semiconductor layer and a gate electrode. The semiconductor layer extends in a direction parallel to the first substrate into a strip-shaped structure. The strip-shaped structure has side surfaces. The wall and both ends, and the sidewalls in a direction parallel to the first substrate include a source region, a channel region and a drain region in sequence, the drain region includes a capacitor region; the gate surrounds The sidewalls of the channel region, and a gate insulation layer is provided between the gate electrode and the channel region;

The capacitor is disposed on a side wall of the capacitance region of the drain region;

A first internal support layer, the first internal support layer is disposed between the capacitor regions of the drain regions of two adjacent semiconductor layers in a direction perpendicular to the first substrate, the first internal support layer A layer is configured to provide support for the capacitor and two adjacent semiconductor layers, the capacitor being spaced by the first inner support layer as a grid of capacitors.
The semiconductor device according to claim 1, wherein the first chip further includes: a plurality of word lines, each of the word lines extends on a plane parallel to the first substrate and perpendicular to the The extending direction of the semiconductor layer, wherein a memory cell column is provided in the extending direction of the word line, and each of the word lines is formed by a gate of a transistor of a memory cell in the memory cell column; or, in A plurality of memory cell columns are provided in the extending direction of the word line, and each of the word lines is connected by the gate electrodes of the transistors of a plurality of memory cells of the plurality of memory cell columns arranged along the extending direction of the word line. formed together.
The semiconductor device according to claim 2, wherein the first internal supporting layer is further disposed between capacitive regions of drain regions of two adjacent semiconductor layers in an extending direction of the word line and in a vertical direction. extending in the direction of the first substrate.
The semiconductor device according to any one of claims 1 to 3, wherein the first chip further includes: a plurality of bit lines, each of the bit lines extending in a direction perpendicular to the first substrate , in a direction parallel to the extension direction of the semiconductor layer, the source regions of the transistors of the plurality of memory cells in two adjacent memory cell columns are connected to a common bit line.
The semiconductor device according to any one of claims 1 to 4, wherein the capacitor surrounds a side wall of the capacitance region of the drain region.
The semiconductor device according to any one of claims 1 to 4, wherein the capacitor includes a first electrode plate, a second electrode plate, and an electrode disposed between the first electrode plate and the second electrode plate. A dielectric layer, the first electrode plate, the dielectric layer and the second electrode plate are sequentially surrounding the sidewalls of the capacitance region of the drain region.
The semiconductor device according to any one of claims 1 to 6, further comprising a second chip, the second chip and the first chip are stacked together and the second chip and the memory cell column are respectively Located on both sides of the first substrate, the circuit of the second chip is electrically connected to the circuit of the first chip;

The second chip includes a peripheral circuit, a metal contact layer and a metal interconnection layer which are arranged on the second substrate in sequence, and the metal contact layer is arranged on a side of the peripheral circuit away from the second substrate, so The metal interconnection layer is provided on a side of the metal contact layer away from the second substrate and on a side of the first substrate away from the memory cell column, and a metal contact is provided in the metal contact layer. Pillar, a metal line is provided in the metal interconnection layer, one end of the metal line is electrically connected to the bit line, word line or capacitor of the first chip, and the other end of the metal line passes through the metal contact pillar electrically connected to the peripheral circuit.
The semiconductor device according to any one of claims 1 to 6, wherein a plurality of word lines at different layers arranged at intervals along a direction perpendicular to the first substrate are in a stepped shape.
The semiconductor device according to claim 2 or 3, wherein the material of the semiconductor layer is selected from any one or more semiconductor materials formed of Group IVA elements, and the material of the word line is selected from Group IVA. Any one or more conductive materials formed from elements.
The semiconductor device according to claim 9, wherein the material of the semiconductor layer is single crystal silicon; the material of the word line is selected from any one or more of polycrystalline silicon and polycrystalline silicon germanium.
The semiconductor device according to any one of claims 1 to 10, wherein the memory cell column further includes an interlayer isolation layer, the interlayer isolation layer is provided on two adjacent memory cells in the memory cell column. Between the gates of the transistors of the cells, the interlayer isolation layer is configured to isolate the gates of the transistors of two adjacent memory cells.
The semiconductor device according to any one of claims 1 to 10, further comprising one or more memory cell isolation pillars extending in a direction perpendicular to the first substrate, each in the extending direction of the semiconductor layer One of the storage unit isolation columns is provided at intervals between two storage unit columns.
The semiconductor device according to any one of claims 1 to 12, further comprising a second inner support layer disposed on two adjacent ones in a direction perpendicular to the first substrate. Between the semiconductor layers and in the non-capacitive region, the second inner support layer is configured to provide support for the semiconductor layers.
The semiconductor device according to claim 6, wherein the first electrode plate is an internal electrode plate, the second electrode plate is an external electrode plate, and the drain region is connected to the first electrode plate.
A method for manufacturing a semiconductor device, including:

A plurality of composite layers composed of the first sacrificial layer and the semiconductor layer are stacked on one side of the first substrate in the order of the first sacrificial layer and the semiconductor layer in a direction perpendicular to the first substrate;

Etch trenches in a plurality of composite layers in a direction perpendicular to the first substrate, and perform side etching on the trenches to form a plurality of intervals perpendicular to the first substrate. grooves and forming first internal support grooves in the first sacrificial layer of each composite layer, the spacing grooves spacing a plurality of the composite layers into a plurality of composite walls perpendicular to the first substrate, so The first internal support groove separates the first sacrificial layer into a grid structure, and the first internal support groove is filled with support material to form a first internal support layer;

Remove the remaining first sacrificial layer, the remaining semiconductor layer extends in a direction parallel to the first substrate and sequentially includes a source region, a channel region and a drain region, the drain region includes a capacitor region;

forming a second sacrificial layer on the first substrate so that the second sacrificial layer covers the semiconductor layer;

removing the second sacrificial layer on the sidewalls of the channel region of the semiconductor layer, and sequentially forming a gate insulating layer and a gate electrode surrounding the channel region on the sidewalls of the channel region of the semiconductor layer, The semiconductor layer and the gate electrode constitute a transistor;

The second sacrificial layer on the sidewall of the capacitor region of the drain region of the semiconductor layer is removed, and capacitors are sequentially formed on the sidewalls of the capacitor region of the drain region of the semiconductor layer to obtain the first chip.
The method of manufacturing a semiconductor device according to claim 15, further comprising: forming a plurality of word lines extending on a plane parallel to the first substrate and perpendicular to an extension direction of the semiconductor layer;

Wherein, a semiconductor layer is provided on a plane parallel to the first substrate and along an extension direction perpendicular to the semiconductor layer, so that the gate electrode on the semiconductor layer serves as a word line; or, on a plane parallel to the A plurality of semiconductor layers are disposed on the plane of the first substrate and along an extending direction perpendicular to the semiconductor layer, so that gate electrodes on the plurality of semiconductor layers are connected together to form a word line.
The method of manufacturing a semiconductor device according to claim 16, further comprising: forming a plurality of bit lines extending in a direction perpendicular to the first substrate;

Wherein, forming the bit lines includes:

When etching the trenches in a plurality of the composite layers, etching bit line trenches in a direction perpendicular to the first substrate in the plurality of composite layers, and in the bit line trenches Filling isolation material;

After the capacitor is formed, the isolation material in the bit line trench is removed, the bit line trench is filled with bit line material to form a bit line, and the bit line and a plurality of semiconductors in contact with the bit line are The source regions of the plurality of semiconductor layers are connected such that the source regions of the plurality of semiconductor layers share a bit line.
The method of manufacturing a semiconductor device according to claim 17, further comprising:

A peripheral circuit, a metal contact layer with metal contact posts, and a metal interconnection layer with metal lines are sequentially arranged on one side of the second substrate, and one end of the metal line is connected to the metal contact post through the metal contact post. The peripheral circuits are electrically connected to obtain a second chip;

The first chip and the second chip are stacked together, and the circuit of the second chip is electrically connected to the circuit of the first chip.
The manufacturing method of a semiconductor device according to any one of claims 16 to 18, wherein side etching is performed on the trench to form a first internal support in the first sacrificial layer of each composite layer. A groove, filling the first internal support groove with support material to form a first internal support layer, including:

The trenches are etched sideways, and first internal support grooves are formed in the first sacrificial layer of each composite layer. The first internal support grooves are filled with support material to form a vertical axis along the The first internal support layer between the capacitance regions of the drain regions of two adjacent semiconductor layers in the direction of the first substrate; or,

Filling the trench with a support material to form a capacitive region between the drain regions of two adjacent semiconductor layers along the extending direction of the word line and in a direction perpendicular to the first substrate Extended first internal support layer; perform side etching on the trenches, form first internal support grooves in the first sacrificial layer of each composite layer, and fill support in the first internal support grooves material to form a first inner support layer disposed between the capacitance regions of the drain regions of two adjacent semiconductor layers in a direction perpendicular to the first substrate.
The manufacturing method of a semiconductor device according to any one of claims 15 to 19, wherein said sequentially forming capacitors on the side walls of the capacitance region of the drain region of the semiconductor layer includes: A first electrode plate, a dielectric layer and a second electrode plate surrounding the side walls of the capacitor region are sequentially formed on the side walls of the capacitor region of the drain region. The first electrode plate, the dielectric layer and the second electrode plate form the capacitor.
An electronic device including the semiconductor device according to any one of claims 1 to 14.