WO2024055637A1 - Server - Google Patents

Abstract

Embodiments of the present application provide a server, comprising a chassis. A mainboard and power supply units are arranged in an inner cavity of the chassis; the power supply units are used for supplying power to the mainboard; the power supply units are arranged on one end of the chassis in the length direction; each power supply unit is provided with first end faces, second end faces, and third end faces which are intersected in pairs, wherein the area of each third end face and the area of each second end face are both larger than the area of each first end face, and the third end faces and the second end faces are all arranged in the length direction of the chassis; and short edges of the first end faces of the power supply units are arranged in the width direction of the chassis. According to the server provided by the present application, the width of the chassis occupied by the power supply units is reduced, the utilization rate of the inner cavity of the chassis is improved, more performance is released, and the space gain is increased.

Description

server

This application claims priority to the Chinese patent application filed with the China Patent Office on September 15, 2022, with the application number 202211120041.5 and the application name "Server", the entire content of which is incorporated into this application by reference.

Technical field

The embodiments of the present application relate to the field of server technology, and in particular, to a server.

Background technique

A server refers to a computer that manages resources and provides services to users. It is usually divided into file servers, database servers, application servers, etc.

In related technologies, a server includes a chassis, and a motherboard and a power supply unit (PSU, power supply unit) are provided in the inner cavity of the chassis. The motherboard can be equipped with processing chips, memory and other electronic components. The power module can convert the external 211V AC power into 12V DC and output it to the motherboard, and power the processing chip, memory and other electronic components through the motherboard to ensure the normal operation of the server system.

However, the number of electronic components in the inner cavity of the server is limited by the inner cavity space of the chassis, resulting in limited performance improvement of the server.

Contents of the invention

Embodiments of the present application provide a server to solve the problem that the number of electronic components in the inner cavity of the server is limited by the inner cavity space of the chassis, resulting in limited performance improvement of the server.

In order to achieve the above purpose, this application provides the following technical solutions:

One aspect of the embodiment of the present application provides a server, including a chassis. A motherboard and a power module are provided in an inner cavity of the chassis. The power module is used to supply power to the motherboard; the power module is disposed in the chassis. One end of the length direction;

The power module has a first end face, a second end face and a third end face that intersect each other, wherein the areas of the third end face and the second end face are both larger than the area of the first end face, and the third end face and the second end surface are arranged along the length direction of the chassis; the short side of the first end surface of the power module is arranged along the width direction of the chassis.

The server provided by this application includes a chassis. A power module is provided in the inner cavity of the chassis. The power module is arranged at the same end of the length direction of the chassis. The power module has a first end face, a second end face and a third end face that intersect in pairs. The areas of the third end face and the second end face are both larger than the area of the first end face. By arranging the third end face and the second end face along the length direction of the chassis, the short side of the first end face of the power module is along the width direction of the chassis. It is set to reduce the width of the chassis occupied by the power module, thereby increasing the number of card slots arranged in the width direction of the chassis, thereby improving the utilization of the inner cavity of the chassis, releasing more performance, and increasing space revenue.

In one possible implementation, there are a plurality of power modules, and at least two of the plurality of power modules are arranged at intervals along the height direction of the chassis.

Through the above solution, the height direction of the chassis is used to arrange the two power modules.

In one possible implementation, the power module has an input part and a fan part in the height direction of the chassis, the input part is configured to be electrically connected to an external power supply, and the fan part is configured to provide power. cooling fluid passes through;

The input portions of the two power modules spaced apart along the height direction of the chassis are oriented in the same direction.

Through the above solution, the connection with the input part is fixed in the same direction, which is convenient for the operator to process.

In one possible implementation, a card slot module is further provided in the inner cavity of the chassis, and the card slot module and the power module are disposed at the same end in the length direction of the chassis; the card slot module It includes a plurality of card slots, the plurality of card slots and the power module are spaced apart along the width direction of the chassis, and each of the card slots has a notch connected to the inner cavity of the chassis, so The long side of the notch is arranged along the length direction of the chassis, and the short side of the notch is arranged along the width direction of the chassis.

Through the above solution, the length of the chassis can be reduced and the number of card slots can be increased.

In one possible implementation, the motherboard is disposed on the inner bottom wall in the height direction of the chassis, and the motherboard is provided with a processing chip and a memory stick;

The power module is electrically connected to the motherboard, and supplies power to the processing chip and the memory module through the motherboard.

Through the above solution, the processing chip and memory module can be powered through the motherboard.

In one possible implementation, it also includes a power backplane and a first connector;

The power backplane is disposed in the inner cavity of the chassis and extends along the height direction of the chassis, and the power backplane is electrically connected to the power module and the motherboard;

The first connector is provided on the power backplane;

The power module has an output part at one end of the chassis in the length direction, and the output part of the power module is electrically connected to the first connector along the length direction of the chassis.

Through the above solution, the power backplane is used to realize that the power module can be disposed in the chassis in a pullable manner.

In one possible implementation, the second end surface of the power module and the board surface of the power backplane are both attached to the inner wall of the chassis on the same side, and the power module is located on the same side. The power backplane is on one side of the chassis in the length direction.

Through the above solution, the resistance of the power backplane to the cooling fluid is reduced to facilitate heat dissipation of the power module.

In one possible implementation, a second connector is further included. The second connector includes a first socket, a second socket and a communication cable. The first socket is provided on a board of the power backplane. The second socket is disposed on the surface of the motherboard and is plugged and electrically matched with the second end of the communication cable;

The power backplane and the motherboard are electrically connected through the second connector.

Through the above solution, the electrical connection between the power backplane and the motherboard is facilitated.

In one possible implementation manner, the chassis has an air inlet and an air outlet, the air inlet and the air outlet are arranged at both ends of the chassis in the length direction, and the air inlet and the air outlet are show off The ports are all connected with the inner cavity of the chassis;

There are multiple processing chips, and the memory bars are in multiple groups. At least two of the plurality of processing chips are arranged at intervals along the width direction of the chassis, and each processing chip is located in the width direction of the chassis. There is a set of memory modules on each side of the computer.

Through the above solution, the impact of cascade heating between multiple processing chips and the impact of cascading heating between the processing chip and the memory module are avoided.

In one possible implementation, the card slot module and the power module are both located on one side of the processing chip in the length direction of the chassis, and the card slot module and the power module are both smaller than each other. The processing chip is closer to the air outlet.

Through the above solution, the heat dissipation of the chip is facilitated.

In one possible implementation, the processing chip is spaced apart from the power module in the width direction of the chassis.

Through the above solution, the heat dissipation of the power module is facilitated.

In addition to the technical problems solved by the embodiments of the present application, the technical features constituting the technical solutions and the beneficial effects brought by the technical features of these technical solutions described above, there are other technical problems and technical solutions that can be solved by the embodiments of the present application. Other technical features included in the invention and the beneficial effects brought by these technical features will be further described in detail in the specific implementation modes.

Description of drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the application and together with the description, serve to explain the principles of the application.

Figure 1 is a partial top view of a server in the related art;

Figure 2 is a cross-sectional view at A-A of Figure 1;

Figure 3 is a rear view of the server shown in Figure 1;

Figure 4 is a top view of a server provided by an embodiment of the present application;

Figure 5 is a rear view of the server shown in Figure 4;

FIG. 6 is a schematic diagram of the connection between the power backplane and the power module shown in FIG. 4 .

Explanation of reference symbols:
100a, 100b-chassis;
110-air inlet; 120-air outlet;
130-front wall; 140-back wall;
150a, 150b-left wall; 160a, 160b-right wall;
170-top wall; 180-bottom wall;
200-card slot module; 210-card slot; 211-fourth end face; 212-fifth end face;
300a, 300b-power module; 310b-input part; 320b-fan part; 330b-output part; 340-first end face; 350-second end face; 360-third end face;
400-main control module; 410a, 410b-motherboard; 420, 420b-processing chip; 430a, 430b-memory module;
500a, 500b-power backplane;
600-first connector;
700-second connector; 710-first socket; 720-second socket; 730-communication cable;
810-interface.

Through the above-mentioned drawings, clear embodiments of the present application have been shown, which will be described in more detail below. These drawings and text descriptions are not intended to limit the scope of the present application's concepts in any way, but are intended to illustrate the application's concepts for those skilled in the art with reference to specific embodiments.

Detailed ways

As described in the background art, servers in the related art have a problem that the number of electronic components in the internal cavity of the server is limited by the internal cavity space of the chassis, resulting in limited performance improvement of the server. In the process of solving this problem, the inventor discovered the following situation:

In the server world, servers have standard sizes for height and width. For example, the height of the server can be 1U, 2U, 4U, 6U, etc. Among them, 1U=44.45mm. The width of the server is 482.6mm.

FIG. 1 is a partial top view of a server in the related art. Referring to FIG. 1 , the server includes a chassis 100a. The chassis 100a may have a length direction X and a width direction Y. The direction pointed by arrow X in Figure 1 is the front side of the chassis 100a, and the opposite direction is the rear side of the chassis 100a. The direction pointed by arrow Y is the right side of the chassis 100a, and the opposite direction is the left side of the chassis 100a. The chassis 100a has an inner cavity, and the motherboard 410a, the power module 300a and the power backplane 500a are housed in the inner cavity of the chassis 100a. The motherboard 410a may be provided with electronic components such as a processing chip 420a and a memory module 430a. Among them, the processing chip 420a can be a CPU (Central Processing Unit, central processing unit).

Figure 2 is a cross-sectional view along line A-A of Figure 1 . Referring to Figures 1 and 2, the chassis 100a also has a height direction Z. The power module 300a is in a long strip shape, and the power module 300a can extend along the length direction X of the chassis 100a, that is, the length direction of the power module 300a is arranged along the length direction X of the chassis 100a. In addition, the power backplane 500a can be disposed at one end of the power module 300a in the length direction and can electrically connect the power module 300a and the motherboard 410a to provide power to electronic components such as the processing chip 420a and the memory stick 430a on the motherboard 410a.

FIG. 3 is a rear view of the server shown in FIG. 1 . Referring to FIG. 3 , the end face of the power module 300 a in the length direction is in the shape of a rectangle, and the long side of the rectangle is disposed along the width direction Y of the chassis 100 a , and the short side of the rectangle is disposed along the height direction Z of the chassis 100 a . This results in a larger width of the chassis 100a occupied by the power module 300a. The rear area of the chassis 100a can accommodate a small number of electronic components such as GPU (Graphics Processing Unit, graphics processor) cards, which affects the performance improvement of the server. .

In response to the above technical problems, embodiments of the present application provide a server by arranging multiple card slots at intervals along the width direction of the chassis, and the card slots and power modules extend along the length direction of the chassis. The shorter sides of the card slots, The shorter sides of the power module extend along the width direction of the chassis to reduce the width of the chassis occupied by the power module, thereby increasing the number of card slots arranged in the width direction of the chassis, thereby improving the utilization of the inner cavity of the chassis. Unlock more performance and increase space gains.

In order to make the purpose, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments These are part of the embodiments of this application, but not all of them.

Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of this application. The following embodiments and features in the embodiments may be combined with each other without conflict.

Figure 4 is a top view of a server provided by an embodiment of the present application. Referring to Figure 4, the server provided by the embodiment of the present application includes a chassis 100b with an inner cavity. The main control module 400, the power module 300b and the card slot module 200 can be disposed in the inner cavity of the chassis 100b.

The chassis 100b may have a length direction X and a width direction Y. The chassis 100b may have a front wall 130 and a rear wall 140 that are oppositely arranged in the length direction X, and the chassis 100b may have a left wall 150b and a right wall 160b that are oppositely arranged in the width direction Y. When the server adopts air cooling, the front wall 130 of the chassis 100b may be provided with an air inlet 110 that penetrates the front wall 130, and the rear wall 140 of the chassis 100b may be provided with an air outlet 120 that penetrates the rear wall 140. Cooling fluid such as air can enter the inner cavity of the chassis 100b through the air inlet 110, flow in the inner cavity of the chassis 100b along the length direction of the chassis 100b, and flow out of the inner cavity of the chassis 100b through the air outlet 120.

Continuing to refer to FIG. 4 , the main control module 400 may include a motherboard 410b, a plurality of processing chips 420b, and a plurality of memory banks 430b. The motherboard 410b can be installed on the bottom wall 180 of the chassis 100b as shown in FIG. 5 , and the plurality of processing chips 420b and the plurality of memory banks 430b can be disposed on the surface of the motherboard 410b as shown in FIG. 4 .

Among them, the mainboard 410b may have one communication layer or multiple communication layers, and the communication layer may be laid with communication lines. When the motherboard 410b has multiple communication layers, the multiple communication layers can be stacked, and an insulation layer can be provided between two adjacent communication layers. The normal direction of the communication layer and the stacking direction of the multi-layer communication layer can be defined as the thickness direction of the main board 410b. The end surface of the main board 410b in the thickness direction is the board surface of the main board 410b. At least one communication layer can be a power layer or at least one communication layer can be laid with conductive lines. The power module 300b mentioned below may supply power to the processing chip 420b through a power layer or conductive wire. In addition, in order to achieve high-speed communication between the processing chip 420b and the memory bar 430b, the memory bar 430b can be DDR SDRAM (Double Data Rate Synchronous Dynamic Random Access Memory), DDR2, DDR3, DDR4, etc. The processing chip 420b may have a first DDR port, and at least one communication layer may be laid with a memory line, and the memory line may electrically connect the first DDR port of the processing chip 420b and the port of the memory bar 430b. In addition, each processing chip 420b may have a communication port, and the communication ports of two adjacent processing chips 420b may be connected to each other. Communication ports can include UPI (Ultra Path Interconnect) ports, PCIE (Peripheral Component Interconnect express) ports, clock ports, etc.

When the server adopts air cooling, referring to FIG. 4 , at least two of the multiple processing chips 420b can be spaced apart along the width direction Y of the chassis 100b to avoid the influence of cascade heating as much as possible, that is, to avoid the cooling fluid passing through one processing chip 420b passing through another processing chip 420b again as much as possible.

It should be noted that when the number of processing chips 420b is less than the maximum number of processing chips 420b that can be placed side by side, multiple processing chips 420b can be arranged in a row, and the multiple processing chips 420b in this row can be arranged along the edge of the chassis 100b. Y interval setting in width direction. When the number of processing chips 420b is greater than the maximum number of processing chips 420b that can be placed side by side, the multiple processing chips 420b can be divided into multiple rows, and the multiple processing chips 420b in each row can be spaced apart along the width direction Y of the chassis 100b, adjacent to each other. The two rows of processing chips 420b can be arranged in a staggered manner.

For example, when the maximum number of processing chips 420b placed side by side is two, if the number of processing chips 420b on the mainboard 410b is three, then two of the three processing chips 420b can be arranged in the first row. , and another one can be located in the second row. And at least part of the processing chips 420b located in the second row may correspond to the gap between the two processing chips 420b located in the first row.

In addition, in order to avoid the cascade heating effect between the memory bar 430b and the processing chip 420b, the memory bar 430b may be disposed on both sides of the processing chip 420b in the width direction Y of the chassis 100b. That is to say, each processing chip 420b is provided with a set of memory banks 430b on both sides of the chassis 100b in the width direction Y.

Continuing to refer to FIG. 4 , the card slot module 200 and the main control module 400 may be spaced apart along the length direction X of the chassis 100 b to facilitate layout using the length direction X of the chassis 100 b. The card slot module 200 may be disposed on the motherboard 410 , or the card slot module 200 may be disposed on a circuit board parallel to the motherboard 410 and communicating with the motherboard 410 . The card slot module 200 may include a plurality of oblong card slots 210, and each card slot 210 may have an accommodating space and a slot connected to the accommodating space. The end of an oblong electronic component (such as a GPU card, PCIe card, etc.) can be inserted into the accommodation space of the card slot 210 through the slot. The oblong electronic components inserted into the card slot 210 can communicate with electronic components on the motherboard 410 (such as the processing chip 420b, etc.) through the card slot 210. Of course, the oblong electronic components inserted into the card slot 210 can also be electrically connected to the power layer or conductive wires of the motherboard 410 through the card slot 210 . The card slot 210 may be a PCIe expansion slot or the like.

In addition, in order to facilitate heat dissipation of the processing chip 420b, the main control module 400 can be closer to the air inlet 110 than the card slot module 200; that is, the card slot module 200 is closer to the air outlet 120 than the main control module 400. In this way, the cooling fluid entering the inner cavity of the chassis 100b through the air inlet 110 can sequentially pass through the main control module 400 and the oblong electronic components inserted into the card slot 210, and then flow out of the inner cavity of the chassis 100b through the air outlet 120.

In addition, referring to Figure 4, the card slot 210 may have two opposite fourth end surfaces 211 in the length direction of the chassis 100b. The fourth end surfaces 211 may be parallel to the front wall 130 (or rear wall 140) of the chassis 100b; the card slot 210 may have two opposite fourth end surfaces 211. 210 may have two opposite fifth end surfaces 230 in the width direction of the chassis 100b. The fifth end surfaces 230 may be parallel to the left wall 150b (or right wall 140b) of the chassis 100b. That is to say, the fifth end surface of the card slot 210 The end surface 230 is arranged along the length direction of the chassis 100b. The length direction of the card slot 210 can be disposed along the length direction X of the chassis 100b. That is to say, the long side of the notch of the card slot 210 can be disposed along the length direction of the chassis 100b. In other words, the area of the fifth end surface is larger than the area of the fourth end surface, so as to facilitate the use of the length layout of the chassis 100b. In order to facilitate air cooling of the electronic components inserted into the card slots 210, multiple card slots 210 may be arranged at intervals along the width direction Y of the chassis 100b as shown in FIG. 4 . In order to arrange more card slots 210 in the width direction Y of the chassis 100b, the thickness direction of the card slots 210 can be arranged along the width direction Y of the chassis 100b. That is to say, the short side of the notch of the card slot 210 can be arranged along the chassis 100b. width direction settings.

Continuing to refer to FIG. 4 , the power module 300b is disposed in the inner cavity of the chassis 100b. The power module 300b may have two opposite first end faces 340 in the length direction of the chassis 100b. The first end faces 340 may be parallel to the front of the chassis 100b. Wall 130 (or rear wall 140); the power module 300b may have two opposite second end faces 350 in the width direction of the chassis 100b, and the second end faces 350 may be parallel to the left wall 150b (or the right wall 140b) of the chassis 100b. .

FIG. 5 is a rear view of the server shown in FIG. 4 . Referring to Figure 4 and Figure 5, the chassis 100b may also have height direction. And the chassis 100b may have a bottom wall 180 and a top wall 170 arranged oppositely in the height direction Z. When the server is operating, the wall of the chassis 100b facing the support surface may be the bottom wall 180 of the chassis 100b, and the wall of the chassis 100b facing away from the support surface may be the top wall 170 of the chassis 100b. The power module 300b may have two opposite third end surfaces 360 in the height direction of the chassis 100b, and the third end surfaces 360 may be parallel to the top wall 170 (or bottom wall 180) of the chassis 100b. In summary, the second end surface 350 and the third end surface 360 are both arranged along the length direction of the chassis 100b, that is, the second end surface 350 and the third end surface 360 are both parallel to the length direction of the chassis 100b.

Among them, the power module 300b is in a strip shape. In order to arrange more card slots 210 in the width direction Y of the chassis 100b, the power module 300b extends along the length direction X of the chassis 100b; that is, the length direction of the power module 300b is arranged along the length direction X of the chassis 100b. In other words, the areas of the third end surface 360 and the second end surface 350 of the power module 300b are both larger than the area of the first end surface 340, that is, the first end surface 340 is the smallest end surface of the power module 300b.

In addition, the end surface (first end surface 340 ) of the power module 300b in its length direction may be rectangular, and the shorter side of the rectangle may be disposed along the width direction Y of the chassis 100b, and the longer side of the rectangle may be along the height of the chassis 100b Direction Z setting. In this way, compared with related technologies, the arrangement of the power module 300b provided by the embodiment of the present application has the advantages of reducing the width of the chassis 100b occupied by the power module 300b and increasing the number of card slots 210 arranged in the width direction Y of the chassis 100b. , improve the utilization of the inner cavity of the chassis 100b, release more performance, improve the heat dissipation effect, and increase the space gain.

In addition, in order to reduce the length of the chassis 100b, the power module 300b and the card slot module 200 can be arranged at intervals along the width direction Y of the chassis 100b on the side of the main control module 400 close to the air outlet 120, that is, the power module 300b and the card slot module 200 They are all arranged on the rear side of the chassis 100b, and there is a certain distance between the power module 300b and the card slot module 200 in the width direction Y of the chassis 100b.

For example, the card slot 210 may be a full-size GPU card (11.15mm high × 312.00mm long × 40mm wide). The size of the first end surface 340 of the power module 300b is: 68mm×40mm. The width of the server is 482.6mm. If the power module 300b is arranged as shown in Figure 3 (that is, the shorter edge of the power module 300b is arranged along the height direction Z of the chassis 100b), it can accommodate 8 full-size GPU cards. If the power module 300b is arranged as shown in FIG. 5 (that is, the shorter edge of the power module 300b is arranged along the width direction Y of the chassis 100b), it can accommodate 9 full-size GPU cards.

Optionally, the power module 300b can be a redundant power supply (that is, there are multiple power modules 300b). If one of the power modules 300b is damaged, the other power module 300b can also provide the required power in an emergency to achieve power outage. The power module 300b can be replaced without any interruption, thereby reducing the cost of power failure and downtime, and achieving high availability of the server. In addition, at least two of the plurality of power modules 300b are arranged at intervals along the height direction Z of the chassis 100b, so as to reduce the width of the chassis 100b occupied by the plurality of power modules 300b.

It should be noted that when the number of power modules 300b is less than the maximum number of power modules 300b that can be placed in parallel, multiple power modules 300b can be arranged in a row, and the multiple power modules 300b in this row can be along the height direction of the chassis 100b Z interval setting. When the number of power modules 300b is greater than the maximum number of power modules 300b that can be placed in parallel, the multiple power modules 300b can be divided into multiple columns, and the multiple power modules 300b in each column can be spaced apart along the width direction Y of the chassis 100b. Alternatively, when the number of power modules 300b is greater than the maximum number of power modules 300b that can be placed in parallel, multiple power modules 300b can Divided into multiple rows, at least one row can be disposed on the rear wall 140 of the chassis 100b, and at least one row can be disposed on the front wall 130 of the chassis 100b.

For example, when the maximum number of power modules 300b placed in parallel is two, if the number of power modules 300b is four. Then two of the four power modules 300b may form the first column, and the other two of the four power modules 300b may form the second column. The two power modules 300b in each column may be spaced apart along the height direction of the chassis 100b. The first row and the second row may both be located at the rear side of the chassis 100b. Or the first row is located on the rear side of the chassis 100b, and the first row is located on the front side of the chassis 100b.

In addition, the power module 300b may have an input part 310b and a fan part 320b in the height direction Z of the chassis 100b. The input part 310b can be electrically connected to an external power supply, that is, the input part 310b is used to connect to alternating current. The fan part 320b is configured for cooling fluid to pass through, that is, the fan part 320b may have a channel, which may pass through the fan part 320b along the length direction of the power module 300b, and a fan may be provided inside the channel to facilitate cooling by guiding air. Fluid flows through the channels to reduce the temperature of power module 300b.

5, when two power modules 300b are spaced apart along the height direction Z of the chassis 100b, the input portions 310b of the two power modules 300b can be oriented in the same direction, so that the power lines connected to the input portions 310b can be fixed in the same direction.

Referring to FIG. 4 , the power module 300b can be electrically connected to the motherboard 410b and provide power to the processing chip 420b, the memory module 430b and the card slot 210 through the motherboard 410b. The power module 300b may have an output part 330b at one end in its length direction, and the output part 330b may be directly electrically connected to the motherboard 410b through a communication cable 730 such as a copper bar. Alternatively, the output part 330b of the power module 300b may be electrically connected to the motherboard 410b through the power backplane 500b and the first connector 600.

FIG. 6 is a schematic diagram of the connection between the power backplane 500b and the power module 300b shown in FIG. 4 . Referring to Figures 4 and 6, the power backplane 500b can be disposed in the inner cavity of the chassis 100b, and the power backplane 500b can extend along the height direction Z of the chassis 100b, and the power backplane 500b electrically connects the power module 300b and the motherboard 410b. The first connector 600 can be disposed on the power backplane 500b, and the first connector 600 and the output portion 330b of the power module 300b can be plugged and electrically connected along the length direction X of the chassis 100b, so that the power module 300b is along the length of the chassis 100b. The direction Of course, the rear wall 140 of the chassis 100b may be provided with an opening for the power module 300b to be extracted or inserted.

Referring to Figures 1 and 2, in the related art, the thickness direction of the power backplane 500a is arranged along the length direction of the power module 300a (the length direction The direction (longitudinal direction X of the chassis 100a) is vertical. At this time, the power backplane 500a may be provided with a plurality of through holes penetrating the power backplane 500a so that the cooling fluid flowing along the length direction X of the chassis 100a can pass through. However, the lack of through holes on the power backplane 500a will block the flow of cooling fluid and reduce the cooling effect of the power module 300a.

In view of this, in order to improve the cooling effect of the power module 300b in the embodiment of the present application, referring to FIG. 4, the power backplane 500b can be disposed on the inner box wall in the width direction Y of the chassis 100b, and the plate surface of the power backplane 500b can be connected with The inner walls of the chassis 100b in the width direction Y are parallel. The power module 300b may be located on one side of the power backplane 500b in the length direction X of the chassis 100b, and is attached to the inner wall of the chassis 100b (the left wall 150b or the right wall 160b). In this way, the power backplane 500b has less resistance to the cooling fluid and has less impact on the power module. The heat dissipation effect of 300b is small, which improves the heat dissipation performance of the power module 300b.

In addition, the server provided by the embodiment of the present application may also include a second connector 700 that electrically connects the power backplane 500b and the mainboard 410b. The second connector 700 may include a first socket 710 , a second socket 720 and a communication cable 730 . The first socket 710 can be disposed on the board surface of the power backplane 500b and can be plugged and electrically matched with the first end of the communication cable 730 . The second socket 720 can be disposed on the surface of the motherboard 410b and can be electrically connected to the second end of the communication cable 730 . In this way, the electrical connection between the mainboard 410b and the power backplane 500b is facilitated.

It should be noted that the power backplane 500b may have one communication layer or multiple communication layers, and communication lines may be laid on the communication layer. When the power backplane 500b has multiple communication layers, the multiple communication layers can be stacked, and an insulation layer can be provided between two adjacent communication layers. The normal direction of the communication layer and the stacking direction of the multi-layer communication layer can be defined as the thickness direction of the power backplane 500b. The end surface of the power backplane 500b in the thickness direction is the board surface of the power backplane 500b. At least one communication layer can be a power layer or at least one communication layer can be laid with conductive lines. The current flowing out of the output part 330b of the power module 300b can pass through the first connector 600, the power layer or conductive wire of the power backplane 500b, the first socket 710, the communication cable 730, the second socket 720, the power layer or conductive wire of the motherboard 410b. The wire supplies power to the processing chip 420b on the motherboard 410b.

Continuing to refer to Figure 4, when the server uses air cooling, since the main control module 400 is closer to the air inlet 110 of the chassis 100b than the power module 300b, in order to improve the cooling effect of the power module 300b, in the width direction Y of the chassis 100b, process The chip 420b is spaced apart from the power module 300b.

Specifically, the chassis 100b has a left wall 150b and a right wall 160b in the width direction Y of the chassis 100b. The power module 300b and the power backplane 500b are disposed on the right wall 160 of the chassis 100b. The projection of the main control module 400 (or the processing chip 420b located on the far right) along the length direction The projection interval settings may not overlap.

Optionally, in order to guide the cooling medium, the server provided by the embodiment of the present application may further include a fan module, and the fan module may be disposed in the inner cavity of the chassis 100b. The fan module may include a fan adapter board and a fan. When the fan module is located on the side of the main control module 400 close to the air inlet 110, in order to avoid obstructing the flow of cooling fluid, the fan adapter board can be disposed at one end of the fan along the height direction Z of the chassis 100b, and can electrically connect the fan and the main unit. control module 400. Alternatively, the fan adapter board and the mainboard 410b can be integrated on the same circuit board to facilitate single-board configuration and maintenance. In addition, the large-size circuit board can more flexibly adjust various configuration requirements.

In addition, there may be a plurality of fans, and at least two of the plurality of fans may be spaced apart along the width direction Y of the chassis 100b. When the height of the chassis 100b is greater than twice or more than the height of a single fan, at least two of the plurality of fans may be spaced apart along the height direction Z of the chassis 100b.

Optionally, the server provided by the embodiment of the present application may also include a storage module, and the storage module may be disposed in the inner cavity of the chassis 100b. The storage module may include storage support racks, storage adapter boards, and storage. The storage support frame may have one or more accommodation spaces, and the memories may be placed in the accommodation spaces in one-to-one correspondence. The end of the storage support rack away from the main control module 400 may have one or more hot swap ports. The wall of the chassis 100b may be provided with an opening corresponding to the hot plug port, so that the corresponding hot plug port may be exposed through the opening of the wall of the chassis 100b. The storage adapter board can be electrically connected between the memory and the main control module 400, and can have a memory bay. The memory bay may have a memory interface that accommodates electrical connections SAS (Serial Attached SCSI, serial connection SCSI) interface, SCSI (Small Computer System Interface, small computer system interface), or SATA (Serial Advanced Technology Attachment, serial port memory) interface to connect to the memory. Furthermore, the above-mentioned storage adapter board can use a CPLD (Complex Programmable Logic Device) chip to analyze the storage signal light, and can implement prompt functions such as storage error reporting, storage positioning, and storage activity signals.

In addition, when the storage module is located on the side of the main control module 400 close to the air inlet 110, in order to avoid obstructing the flow of cooling fluid, the storage adapter board can be disposed at one end of the storage along the height direction Z of the chassis 100b, and can be electrically connected to the storage. and main control module 400. Alternatively, the storage adapter board and the mainboard 410b can be integrated on the same circuit board to facilitate single-board configuration and maintenance. In addition, the large-size circuit board can more flexibly adjust various configuration requirements.

In addition, there may be a plurality of memories, and at least two of the plurality of memories may be spaced apart along the width direction Y of the chassis 100b. When the height of the chassis 100b is greater than twice or more than the height of a single storage, at least two of the plurality of storages may be spaced apart along the height direction Z of the chassis 100b. In addition, the memory can be a hard disk, and the hard disk type can be 2.5-inch HDD, 3.5-inch HDD, 2.5-inch SATA/SAS solid-state drive, NVMe hard drive, etc.

Optionally, in order to organize the cables in the inner cavity of the chassis 100b, at least one cable bundler may be provided on the inner wall of the chassis 100b. Cable ties can have elastic picks into which cables can be clipped for easy organization. By installing a cable bundler on the side wall inside the chassis 100b, it is possible to avoid cable clutter in the inner cavity of the server, making the inner cavity of the server clean and beautiful, and reducing hidden dangers caused by cluttered cables.

In summary, the server provided by this application includes a chassis 100b. The inner cavity of the chassis 100b is provided with a card slot module 200 and a power module 300b. The card slot module 200 and the power module 300b are both disposed at the same end of the chassis 100b in the length direction X. , and the card slot module 200 and the power module 300b are spaced apart along the width direction Y of the chassis 100b, and the card slot module 200 includes a plurality of card slots 210. By arranging multiple card slots 210 at intervals along the width direction Y of the chassis 100b, and the card slots 210 and the power module 300b both extend along the length direction X of the chassis 100b, the shorter sides of the card slots 210 and the shorter sides of the power module 300b They all extend along the width direction Y of the chassis 100b to reduce the width of the chassis 100b occupied by the power module 300b, thereby increasing the number of card slots 210 arranged in the width direction Y of the chassis 100b, thereby improving the utilization of the inner cavity of the chassis 100b. efficiency, release more performance and increase space benefits.

Among them, terms such as "upper" and "lower" are used to describe the relative position of each structure in the drawings. They are only used to facilitate the description and are not used to limit the scope of the application. The relative relationship Changes or adjustments shall also be deemed to be within the implementable scope of this application as long as there is no substantial change in the technical content.

It should be noted that in this application, unless otherwise clearly stated and limited, the first feature "on" or "below" the second feature may be the first and second features in direct contact, or the first and second features may be in direct contact with each other. Features are indirectly contacted through intermediaries. Furthermore, the terms "above", "above" and "above" the first feature is above the second feature may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is higher in level than the second feature. "Below", "below" and "beneath" the first feature to the second feature may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature has a smaller horizontal height than the second feature.

In addition, in this application, unless otherwise clearly stated and limited, the terms "installation", "connection", "connection", "fixing" and other terms should be understood in a broad sense. For example, it can be a fixed connection or a removable connection. Disassembly and connection, or integration; it can be directly connected, or it can be indirectly connected through an intermediary, it can be the internal connection of two elements or the interaction between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

In the description of this specification, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" or the like is intended to be incorporated into the description of the implementation. An example or example describes a specific feature, structure, material, or characteristic that is included in at least one embodiment or example of the present disclosure. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present application, but not to limit it; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: The technical solutions described in the foregoing embodiments can still be modified, or some or all of the technical features can be equivalently replaced; and these modifications or substitutions do not deviate from the essence of the corresponding technical solutions from the technical solutions of the embodiments of the present application. scope.

Claims (11)

1. A server, which is characterized in that it includes a chassis. A mainboard and a power module are provided in the inner cavity of the chassis. The power module is used to supply power to the mainboard; the power module is arranged in the length direction of the chassis. one end;

   The power module has a first end face, a second end face and a third end face that intersect each other, wherein the areas of the third end face and the second end face are both larger than the area of the first end face, and the third end face and the second end surface are arranged along the length direction of the chassis; the short side of the first end surface of the power module is arranged along the width direction of the chassis.
2. The server according to claim 1, wherein there are a plurality of power modules, and at least two of the plurality of power modules are arranged at intervals along the height direction of the chassis.
3. The server according to claim 2, wherein the power module has an input part and a fan part in the height direction of the chassis, the input part is configured to be electrically connected to an external power supply, and the fan part is configured for cooling fluid to pass therethrough;

   The input portions of the two power modules spaced apart along the height direction of the chassis are oriented in the same direction.
4. The server according to any one of claims 1 to 3, characterized in that a card slot module is further provided in the inner cavity of the chassis, and the card slot module and the power module are arranged in the length direction of the chassis. The same end; the card slot module includes a plurality of card slots, the plurality of card slots and the power module are spaced apart along the width direction of the chassis, and each of the card slots has a connection with the chassis. The notches are connected to the inner cavities. The long sides of the notches are arranged along the length direction of the chassis, and the short sides of the notches are arranged along the width direction of the chassis.
5. The server according to claim 4, wherein the motherboard is disposed on the inner bottom wall in the height direction of the chassis, and the motherboard is provided with a processing chip and a memory stick;

   The power module is electrically connected to the motherboard, and supplies power to the processing chip and the memory module through the motherboard.
6. The server according to claim 5, further comprising a power backplane and a first connector;

   The power backplane is disposed in the inner cavity of the chassis and extends along the height direction of the chassis, and the power backplane is electrically connected to the power module and the motherboard;

   The first connector is provided on the power backplane;

   The power module has an output part at one end of the chassis in the length direction, and the output part of the power module is electrically connected to the first connector along the length direction of the chassis.
7. The server according to claim 6, wherein the second end surface of the power module and the board surface of the power backplane are both attached to the inner wall of the chassis on the same side, and the power supply module The module is located on one side of the power backplane in the length direction of the chassis.
8. The server according to claim 7, further comprising a second connector, the second connector includes a first socket, a second socket and a communication cable, the first socket is provided on the back of the power supply. The surface of the board is plugged and electrically matched with the first end of the communication cable, and the second socket is provided on the surface of the mainboard and is plugged and electrically matched with the second end of the communication cable;

   The power backplane and the motherboard are electrically connected through the second connector.
9. The server according to any one of claims 6 to 8, characterized in that the chassis has an air inlet and an air outlet, and the air inlet and the air outlet are arranged at both ends of the length direction of the chassis, And the air inlet and the air outlet are both connected with the inner cavity of the chassis;

   There are multiple processing chips, and the memory bars are in multiple groups. At least two of the plurality of processing chips are arranged at intervals along the width direction of the chassis, and each processing chip is located in the width direction of the chassis. There is a set of memory modules on each side of the computer.
10. The server according to claim 9, wherein the card slot module and the power supply module are both located on one side of the processing chip in the length direction of the chassis, and the card slot module and the power supply module The modules are closer to the air outlet than the processing chip.
11. The server according to claim 10, wherein the processing chip is spaced apart from the power module in the width direction of the chassis.