TWI542976B - Server - Google Patents

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Publication number
TWI542976B
TWI542976B TW103128673A TW103128673A TWI542976B TW I542976 B TWI542976 B TW I542976B TW 103128673 A TW103128673 A TW 103128673A TW 103128673 A TW103128673 A TW 103128673A TW I542976 B TWI542976 B TW I542976B
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Taiwan
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expansion board
motherboard
module
board
expansion
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TW103128673A
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Chinese (zh)
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TW201608357A (en
Inventor
徐繼彭
沈玉龍
李明剛
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英業達股份有限公司
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Description

服務器 server

本發明關於一種服務器,特別是關於一種具有多個可插拔的擴展板以及主機板的服務器。 The present invention relates to a server, and more particularly to a server having a plurality of pluggable expansion boards and a motherboard.

近年來,網際網路(Internet)的快速進步加速了資訊的傳遞。其中,雲端技術(Cloud Technology)是一種現今主流的資訊技術,它改變了資訊儲存以及傳遞的方式和格局,更豐富了資訊的種類。 In recent years, the rapid advancement of the Internet has accelerated the delivery of information. Among them, Cloud Technology is a mainstream information technology, which changes the way and structure of information storage and delivery, and enriches the types of information.

一般來說,雲端技術中的雲端即代表存在於網際網路中服務器(Server)群集的資源點。當一台本地電腦通過網際網路發出一個需求資訊,遠端就會有服務器群集的龐大數量的電腦處理此需求,以提供本地電腦所需的資訊。同時,所有的處理資訊皆是由上述服務器群集的電腦所完成。 In general, the cloud in cloud technology represents the resource points that exist in the server cluster in the Internet. When a local computer sends out a demand message over the Internet, the remote will have a large number of computers in the server cluster to handle this demand to provide the information needed by the local computer. At the same time, all processing information is done by the computer clustered by the above server.

然而,隨著智慧型手機、平板電腦以及智慧型電視的興起,資訊的需求、處理以及傳遞快速成長。因此,對於服務器的存儲、處理以及其他功能的需求也隨之增加,以面對日益增加的需求。 However, with the rise of smart phones, tablets and smart TVs, the demand for information, processing and delivery has grown rapidly. As a result, the need for server storage, processing, and other functions has increased to accommodate increasing demands.

目前的技術來說,服務器可包含多個主機板,各主機板上可插設中央處理器以及其他擴充元件。擴充元件例如PCIe 卡(Peripheral Component Interface Express)記憶體或硬碟等。或著,各主機板可分別固定連接一設有擴充元件的擴展板(或稱擴充板)。藉由擴充元件的插設,可提升或增加服務器的功能。然而,於習知技術中,各主機板係各分別獨立地連接一擴展板,當一主機板或擴展板需要更換時(例如有主機板或擴展板故障),必須同時將主機板以及其上的擴展板一起拆卸下來而共同維護,且習知技術中主機板組裝於服務器的方式過於繁瑣。如此的拆卸方式,會增加更換以及組裝的時間。 In the current technology, the server can include multiple motherboards, and a central processing unit and other expansion components can be inserted on each motherboard. Expansion components such as PCIe Peripheral Component Interface Express memory or hard disk. Alternatively, each motherboard can be fixedly connected to an expansion board (or expansion board) provided with an expansion component. By expanding the insertion of components, you can increase or increase the functionality of the server. However, in the prior art, each motherboard board is independently connected to an expansion board. When a motherboard or an expansion board needs to be replaced (for example, a motherboard or an expansion board fails), the motherboard must be simultaneously mounted thereon. The expansion boards are disassembled together for maintenance, and the way in which the motherboard is assembled to the server in the prior art is too cumbersome. Such a disassembly method will increase the time for replacement and assembly.

再者,當需要更換一主機板或其上的擴展板時,往往需要將整體的服務器關機,主機板方能更換。如此多次的關閉和開啟服務器,會影響對於服務器系統整體的穩定性和可靠性,嚴重影響使用者的操作。再者,多次的關閉和開啟服務器,亦大幅增加更換時間。 Furthermore, when it is necessary to replace a motherboard or an expansion board thereon, it is often necessary to shut down the entire server and the motherboard can be replaced. Shutting down and turning on the server as many times will affect the stability and reliability of the server system as a whole and seriously affect the user's operation. Furthermore, closing and opening the server multiple times also significantly increases replacement time.

鑒於以上的問題,本發明揭露一種服務器,其可分別快速熱插拔多個主機板以及多個擴展板,進而加速組裝以及拆卸時間。 In view of the above problems, the present invention discloses a server that can quickly and hot-plug multiple motherboards and multiple expansion boards, thereby accelerating assembly and disassembly time.

根據本發明一實施例所揭露的一種服務器中,其包含一機殼、一存儲模組、一連接模組、一第一擴展板、一第二擴展板、一第一主機板以及一第二主機板。機殼包含一底殼。存儲模組設於底殼上並設有複數存儲單元。連接模組設於底殼上並連接存儲模組。第一擴展板設有至少一第一擴展芯片。第二擴展板 設有至少一第二擴展芯片。第一主機板設有至少一第一中央處理單元。第二主機板設有至少一第二中央處理單元。其中,第一擴展板、第二擴展板、第一主機板以及第二主機板分別以可插拔的方式連接於連接模組。 A server according to an embodiment of the invention includes a casing, a storage module, a connection module, a first expansion board, a second expansion board, a first motherboard, and a second motherboard. The casing includes a bottom case. The storage module is disposed on the bottom case and is provided with a plurality of storage units. The connection module is disposed on the bottom case and connected to the storage module. The first expansion board is provided with at least one first expansion chip. Second expansion board At least one second expansion chip is provided. The first motherboard is provided with at least one first central processing unit. The second motherboard is provided with at least one second central processing unit. The first expansion board, the second expansion board, the first motherboard, and the second motherboard are respectively connected to the connection module in a pluggable manner.

在本發明的部分實施例中,連接模組具有彼此相對的一第一側以及一第二側,存儲模組自第一側連接連接模組。第一擴展板、第二擴展板、第一主機板以及第二主機板分別自第二側連接連接模組。 In some embodiments of the present invention, the connection module has a first side and a second side opposite to each other, and the storage module is connected to the connection module from the first side. The first expansion board, the second expansion board, the first motherboard, and the second motherboard are respectively connected to the connection module from the second side.

在本發明的部分實施例中,存儲模組設有一存儲背板,設置於連接模組以及存儲單元之間,並連接於連接模組以及存儲單元之間。存儲模組藉由存儲背板耦接連接模組。 In some embodiments of the present invention, the storage module is provided with a storage backplane disposed between the connection module and the storage unit and connected between the connection module and the storage unit. The storage module is coupled to the connection module by the storage backplane.

在本發明的部分實施例中,其中連接模組包含相互連接的一第一連接板以及一第二連接板,第一連接板介於該第二連接板與該底殼之間。其中,第一連接板包括一第一組連接埠、一第二組連接埠以及一第三組連接埠。第一組連接埠用以連接存儲模組並與存儲模組建立電性耦接關係。第二組連接埠電性耦接至第一組連接埠,用以連接第一擴展板、第二擴展板或第一主機板、第二主機板進行數據讀寫。第三組連接埠電性耦接至第一組連接埠、第二組連接埠,用以連接第二連接板。其中,第二連接板包括一第四組連接埠以及一第五組連接埠。第四組連接埠通過與第三組連接埠建立電性耦接關係至第一連接板。第五組連接埠電性耦接至第四組連接埠,用以連接第一主機板、第二主機板或 第一擴展板、第二擴展板進行數據讀寫。 In some embodiments of the present invention, the connection module includes a first connection plate and a second connection plate connected to each other, and the first connection plate is interposed between the second connection plate and the bottom case. The first connecting plate includes a first set of connecting ports, a second set of connecting ports, and a third group of connecting ports. The first set of ports is used to connect the storage modules and establish an electrical coupling relationship with the storage modules. The second group of ports is electrically coupled to the first group of ports for connecting the first expansion board, the second expansion board, or the first motherboard and the second motherboard for data reading and writing. The third group of ports is electrically coupled to the first group of ports and the second group of ports for connecting the second connecting plate. The second connecting plate includes a fourth set of connecting ports and a fifth set of connecting ports. The fourth group of ports 埠 establishes an electrical coupling relationship with the third group of ports to the first connecting plate. The fifth group of ports is electrically coupled to the fourth group of ports for connecting the first motherboard, the second motherboard, or The first expansion board and the second expansion board perform data reading and writing.

在本發明的部分實施例中,連接模組更包含一托盤,托盤裝設於底殼上。托盤設有複數固定柱,第一連接板具有複數葫蘆孔及複數定位孔,第一連接板藉由葫蘆孔以及定位孔與固定柱的組配而安裝於托盤上。 In some embodiments of the present invention, the connection module further includes a tray, and the tray is mounted on the bottom case. The tray is provided with a plurality of fixing columns, the first connecting plate has a plurality of hoist holes and a plurality of positioning holes, and the first connecting plate is mounted on the tray by the cucurbit holes and the positioning holes and the fixing columns.

在本發明的部分實施例中,服務器更包含一風扇模組,組裝於存儲模組與第一擴展板、第二擴展板、第一主機板以及第二主機板之間。其中,風扇模組包含一主框、一底框、二側框以及至少一安裝框。底框以及二側框分別連接主框的三端並朝向第一擴展板、第二擴展板、第一主機板以及第二主機板的設置方向延伸。安裝框連接主框並朝向存儲模組延伸,安裝框容置至少一可插拔風扇。 In some embodiments of the present invention, the server further includes a fan module assembled between the storage module and the first expansion board, the second expansion board, the first motherboard, and the second motherboard. The fan module includes a main frame, a bottom frame, two side frames, and at least one mounting frame. The bottom frame and the two side frames are respectively connected to the three ends of the main frame and extend toward the setting direction of the first expansion board, the second expansion board, the first motherboard, and the second motherboard. The mounting frame is connected to the main frame and extends toward the storage module. The mounting frame houses at least one pluggable fan.

在本發明的部分實施例中,第二連接板安裝於底框上。底框具有至少一穿槽,第二連接板之第四組連接埠透過穿槽以連接第三組連接埠而建立與第一連接板電性耦接關係。 In some embodiments of the invention, the second web is mounted to the bottom frame. The bottom frame has at least one through slot, and the fourth set of connecting ports of the second connecting plate are connected to the third group of connecting ports to establish an electrical coupling relationship with the first connecting plate.

在本發明的部分實施例中,機殼更包含二側殼,側框係藉由固定件而固定於側殼。 In some embodiments of the present invention, the casing further includes two side casings, and the side frames are fixed to the side casings by fixing members.

在本發明的部分實施例中,服務器更包含一電源模組,電源模組設於第一擴展板以及第一主機板旁,或設於第二擴展板以及第二主機板旁,且電源模組連接於連接模組。 In some embodiments of the present invention, the server further includes a power module disposed on the first expansion board and the first motherboard, or disposed on the second expansion board and the second motherboard, and the power module The group is connected to the connection module.

在本發明的部分實施例中,第一擴展板包含一第一主擴展板以及一第一副擴展板,第一主擴展板分別耦接於連接模 組以及第一副擴展板;第二擴展板包含一第二主擴展板以及一第二副擴展板,第二主擴展板分別耦接於連接模組以及第二副擴展板。 In some embodiments of the present invention, the first expansion board includes a first main expansion board and a first sub-expansion board, and the first main expansion board is coupled to the connection mode. And a second sub-expansion board, the second main expansion board is coupled to the connection module and the second sub-expansion board.

在本發明的部分實施例中,機殼包含複數分隔板,分別豎立於底殼上。分隔板各具有二平齊軌道,各分隔板的二平齊軌道容置高度相異。第一擴展板、第二擴展板,第一主機板以及第二主機板分別藉由對應的分隔板的軌道的導引而分別插設或脫離於連接模組。 In some embodiments of the invention, the housing includes a plurality of divider panels that are respectively erected on the bottom shell. The partition plates each have two flush rails, and the two flush rails of the partition boards have different heights. The first expansion board, the second expansion board, the first main board and the second main board are respectively inserted or disconnected from the connection module by guiding the tracks of the corresponding partition boards.

在本發明的部分實施例中,存儲模組皆藉由連接模組與第一擴展板、第二擴展板、第一主機板以及第二主機板耦接。當第一擴展板與第二擴展板至少有一運作正常,且第一主機板與第二主機板至少有一運作正常時,運作正常之第一主機板或第二主機板可經由任一運作正常之第一擴展板或第二擴展板之路徑對全部存儲模組進行數據讀寫。 In some embodiments of the present invention, the storage module is coupled to the first expansion board, the second expansion board, the first motherboard, and the second motherboard through the connection module. When at least one of the first expansion board and the second expansion board is functioning normally, and at least one of the first motherboard and the second motherboard is functioning normally, the first board or the second board that is in normal operation can be operated normally. The path of the first expansion board or the second expansion board reads and writes data to all the storage modules.

在本發明的部分實施例中,其中第一主機板、第二主機板、第一擴展板及第二擴展板相互獨立地設於機殼內。在第一主機板、第二主機板、第一擴展板及第二擴展板全部運作正常時,更換任一運作正常之第一主機板或第二主機板、抑或任一運作正常之第一擴展板或第二擴展板,不影響伺服器的運作。 In some embodiments of the present invention, the first motherboard, the second motherboard, the first expansion board, and the second expansion board are disposed independently of each other in the casing. When the first motherboard, the second motherboard, the first expansion board, and the second expansion board all operate normally, replace any first or second motherboard that is functioning normally, or any first extension that is functioning normally The board or the second expansion board does not affect the operation of the server.

綜合上述,根據本發明揭露的服務器,第一擴展板、第二擴展板、第一主機板以及第二主機板分別以可插拔的方式連接於連接模組。如此,可快速提升第一擴展板、第二擴展板、第 一主機板以及第二主機板的更換效率。 In summary, according to the server disclosed in the present invention, the first expansion board, the second expansion board, the first motherboard, and the second motherboard are respectively connected to the connection module in a pluggable manner. In this way, the first expansion board, the second expansion board, and the The replacement efficiency of one motherboard and the second motherboard.

在部分實施例中,當第一擴展板與第二擴展板至少有一運作正常,且第一主機板與第二主機板至少有一運作正常時,運作正常之第一主機板或第二主機板可經由任一運作正常之第一擴展板或第二擴展板之路徑對全部存儲模組進行數據讀寫。在第一主機板、第二主機板、第一擴展板及第二擴展板全部運作正常時,更換任一運作正常之第一主機板或第二主機板、抑或任一運作正常之第一擴展板或第二擴展板,不影響伺服器的運作。由於第一擴展板及第二擴展板的組合與第一主機板及第二主機板的組合互為冗餘設計(Redundant Design),當其一主機板或是擴展板故障時,其另外的主機板以及擴展板可立刻接管其工作,而使服務器不需要關機而進行維護。如此,這種不需要重新關機而可直接進行更換的服務器,可持續工作,不影響服務器系統的穩定性和可靠性,進而大幅提升運作效率。 In some embodiments, when at least one of the first expansion board and the second expansion board is functioning normally, and at least one of the first motherboard and the second motherboard is in normal operation, the first motherboard or the second motherboard that is in normal operation may be Read and write data to all storage modules via the path of any functioning first expansion board or second expansion board. When the first motherboard, the second motherboard, the first expansion board, and the second expansion board all operate normally, replace any first or second motherboard that is functioning normally, or any first extension that is functioning normally The board or the second expansion board does not affect the operation of the server. Since the combination of the first expansion board and the second expansion board and the combination of the first motherboard and the second motherboard are Redundant Design, when one motherboard or the expansion board fails, another host thereof The board and the expansion board can take over their work immediately, so that the server does not need to be shut down for maintenance. In this way, the server that can be directly replaced without re-shutdown can work continuously without affecting the stability and reliability of the server system, thereby greatly improving operational efficiency.

以上之關於本發明內容之說明及以下之實施方式之說明用以示範與解釋本發明之原理,並且提供本發明之專利申請範圍更進一步之解釋。 The above description of the present invention and the following description of the embodiments of the present invention are intended to illustrate and explain the principles of the invention.

1‧‧‧機殼 1‧‧‧Shell

1000‧‧‧服務器 1000‧‧‧ server

11‧‧‧底殼 11‧‧‧ bottom case

12、13‧‧‧側殼 12, 13‧‧‧ side shell

121、131‧‧‧固定孔 121, 131‧‧‧ fixing holes

14、15、16、17‧‧‧分隔板 14, 15, 16, 17‧‧ ‧ divider

141、151、152、161、171、172‧‧‧平齊軌道 141, 151, 152, 161, 171, 172‧ ‧ aligning orbit

2‧‧‧存儲模組 2‧‧‧Memory Module

21‧‧‧存儲單元 21‧‧‧ storage unit

22‧‧‧存儲背板 22‧‧‧Storage backplane

221‧‧‧連接器 221‧‧‧Connector

3‧‧‧連接模組 3‧‧‧Connecting module

31‧‧‧第一連接板 31‧‧‧First connecting plate

311‧‧‧第一組連接埠 311‧‧‧The first group of ports埠

312‧‧‧第二組連接埠 312‧‧‧Second group of ports埠

3121‧‧‧第一擴展板連接埠 3121‧‧‧First expansion board connection埠

3122‧‧‧第二擴展板連接埠 3122‧‧‧Second expansion board connection埠

313‧‧‧第三組連接埠 313‧‧‧The third group of ports埠

314‧‧‧葫蘆孔 314‧‧‧ 葫芦孔

315‧‧‧定位孔 315‧‧‧Positioning holes

316‧‧‧穿孔 316‧‧‧Perforation

32‧‧‧第二連接板 32‧‧‧Second connection plate

321‧‧‧對位孔 321‧‧‧ alignment hole

324‧‧‧第四組連接埠 324‧‧‧Fourth set of ports埠

325‧‧‧第五組連接埠 325‧‧‧The fifth group of ports埠

3251‧‧‧第一主機板連接埠 3251‧‧‧The first motherboard connection埠

3252‧‧‧第二主機板連接埠 3252‧‧‧Second motherboard connection埠

33‧‧‧第一側 33‧‧‧ first side

34‧‧‧第二側 34‧‧‧ second side

35‧‧‧托盤 35‧‧‧Tray

351‧‧‧固定柱 351‧‧‧ fixed column

352‧‧‧定位柱 352‧‧‧Positioning column

4‧‧‧第一擴展板 4‧‧‧First expansion board

41‧‧‧第一主擴展板 41‧‧‧First main expansion board

42‧‧‧第一副擴展板 42‧‧‧First extension board

43‧‧‧第一擴展芯片 43‧‧‧First expansion chip

44‧‧‧纜線 44‧‧‧ Cable

45‧‧‧連接器 45‧‧‧Connector

46‧‧‧底盤 46‧‧‧Chassis

47‧‧‧連接埠 47‧‧‧Connector

5‧‧‧第二擴展板 5‧‧‧Second expansion board

51‧‧‧第二主擴展板 51‧‧‧Second main expansion board

52‧‧‧第二副擴展板 52‧‧‧Second extension board

53‧‧‧第二擴展芯片 53‧‧‧Second expansion chip

54‧‧‧纜線 54‧‧‧ cable

55‧‧‧連接器 55‧‧‧Connector

56‧‧‧底盤 56‧‧‧Chassis

57‧‧‧連接埠 57‧‧‧Connector

6‧‧‧第一主機板 6‧‧‧First motherboard

61‧‧‧第一中央處理單元 61‧‧‧First central processing unit

62‧‧‧連接器 62‧‧‧Connector

63‧‧‧底盤 63‧‧‧Chassis

64‧‧‧電子模組 64‧‧‧Electronic module

7‧‧‧第二主機板 7‧‧‧Second motherboard

71‧‧‧第二中央處理單元 71‧‧‧Second central processing unit

72‧‧‧連接器 72‧‧‧Connector

73‧‧‧底盤 73‧‧‧Chassis

74‧‧‧電子模組 74‧‧‧Electronic module

8‧‧‧風扇模組 8‧‧‧Fan module

81‧‧‧主框 81‧‧‧ main frame

82‧‧‧底框 82‧‧‧ bottom frame

821‧‧‧穿槽 821‧‧‧through slot

822‧‧‧對位柱 822‧‧‧ alignment column

83、84‧‧‧側框 83, 84‧‧‧ side frame

85‧‧‧安裝框 85‧‧‧Installation box

86‧‧‧可插拔風扇 86‧‧‧pluggable fan

87‧‧‧固定件 87‧‧‧Fixed parts

9‧‧‧電源模組 9‧‧‧Power Module

CMD1~CMD6‧‧‧訊號路徑 CMD 1 ~ CMD 6 ‧‧‧ Signal Path

第1圖,為根據本發明一實施例的服務器的立體示意圖。 1 is a perspective view of a server according to an embodiment of the present invention.

第2圖,為根據本發明一實施例的第二連接板以及風扇模組的分解示意圖。 2 is an exploded perspective view of a second connecting plate and a fan module according to an embodiment of the invention.

第3圖,為根據本發明一實施例的機殼以及連接模組的分解示意圖。 3 is an exploded perspective view of a casing and a connection module according to an embodiment of the invention.

第4圖,為根據本發明一實施例的機殼、第一主機板、第二主機板、第一擴展板以及第二擴展板的分解示意圖。 4 is an exploded perspective view of a casing, a first motherboard, a second motherboard, a first expansion panel, and a second expansion panel according to an embodiment of the invention.

第5圖,為根據本發明第1圖的服務器的分解示意圖。 Fig. 5 is an exploded perspective view showing the server according to Fig. 1 of the present invention.

第6圖,為根據本發明一實施例的存儲模組、第一主機板、第二主機板、第一擴展板以及第二擴展板的方塊圖。 FIG. 6 is a block diagram of a memory module, a first motherboard, a second motherboard, a first expansion board, and a second expansion board according to an embodiment of the invention.

第7圖,為根據本發明一實施例的存儲模組、第一連接板、第二連接板、第一主機板、第二主機板、第一擴展板以及第二擴展板的方塊圖。 FIG. 7 is a block diagram of a memory module, a first connection board, a second connection board, a first motherboard, a second motherboard, a first expansion board, and a second expansion board according to an embodiment of the invention.

第8圖,為根據本發明一實施例中,第7圖中的第一擴展板被移除的功能方塊圖。 Figure 8 is a functional block diagram of the first expansion board of Figure 7 removed in accordance with an embodiment of the present invention.

第9圖,為根據本發明一實施例中,第7圖中的第二擴展板被移除的功能方塊圖。 Figure 9 is a functional block diagram of the second expansion board of Figure 7 removed in accordance with an embodiment of the present invention.

第10圖,為根據本發明一實施例中,第7圖中的第一主機板被移除的功能方塊圖。 Figure 10 is a functional block diagram of the first motherboard in Figure 7 removed in accordance with an embodiment of the present invention.

第11圖,為根據本發明一實施例中,第7圖中的第二主機板被移除的功能方塊圖。 Figure 11 is a functional block diagram of the second motherboard in Figure 7 removed in accordance with an embodiment of the present invention.

以下在實施方式中詳細敘述本發明之詳細特徵以及優點,其內容足以使任何熟習相關技藝者瞭解本發明之技術內容並據以實施,且根據本說明書所揭露之內容、申請專利範圍及圖 式,任何熟習相關技藝者可輕易地理解本發明相關之目的及優點。以下之實施例係進一步詳細說明本發明之觀點,但非以任何觀點限制本發明之範疇。 The detailed features and advantages of the present invention are described in detail below in the embodiments of the present invention. The related objects and advantages of the present invention will be readily understood by those skilled in the art. The following examples are intended to describe the present invention in further detail, but are not intended to limit the scope of the invention.

本發明提供一種服務器,服務器可包含多個主機板以及多個擴展板,其可相互電性耦接並且可分別熱插拔於服務器。此外,主機板以及擴展板分別為冗餘設計,當其一主機板或是擴展板故障時,其另外的主機板以及擴展板可立刻接管其工作,而使服務器不需要關機而進行維護。 The present invention provides a server that can include a plurality of motherboards and a plurality of expansion boards that are electrically coupled to each other and can be hot swappable to the server. In addition, the motherboard and the expansion board are respectively designed to be redundant. When one of the motherboards or the expansion board fails, the other motherboard and the expansion board can take over the work immediately, so that the server does not need to be shut down for maintenance.

以下敘述本發明的服務器結構,請參照『第1圖』,其為根據本發明一實施例的服務器的立體示意圖。 The following describes the server structure of the present invention. Please refer to FIG. 1 , which is a perspective view of a server according to an embodiment of the invention.

根據本發明一實施例所揭露的一種服務器1000,其包含一機殼1、一存儲模組2、一連接模組3、一第一擴展板(First Expander Board)4、一第二擴展板(Second Expander Board)5、一第一主機板(First Mother Board)6以及一第二主機板(Second Expander Board)7。機殼1形成有一容置空間,存儲模組2、連接模組3、第一擴展板4、第二擴展板5、第一主機板6以及第二主機板7皆容置於機殼1的容置空間內。在本實施例以及部分的其他實施例中,服務器1000更包含風扇模組8以及電源模組9,風扇模組8以及電源模組9皆容置於機殼1的容置空間內。 A server 1000 according to an embodiment of the invention includes a casing 1, a storage module 2, a connection module 3, a first expansion board 4, and a second expansion board. Second Expander Board) 5. A First Mother Board 6 and a Second Expander Board 7. The housing 1 is formed with an accommodating space, and the storage module 2, the connection module 3, the first expansion board 4, the second expansion board 5, the first motherboard 6 and the second motherboard 7 are all accommodated in the casing 1. Included in the space. In this embodiment and some other embodiments, the server 1000 further includes a fan module 8 and a power module 9 . The fan module 8 and the power module 9 are accommodated in the accommodating space of the casing 1 .

以下介紹服務器1000內各元件的配置關係。請同時參照『第1圖』、『第3圖』以及『第5圖』,其中『第3圖』係為根據本發明一實施例的機殼以及連接模組的分解示意圖,『第5 圖』為根據本發明第1圖的服務器的分解示意圖。 The configuration relationship of each component in the server 1000 will be described below. Please refer to FIG. 1 , FIG. 3 and FIG. 5 , wherein FIG. 3 is an exploded view of the casing and the connection module according to an embodiment of the present invention, Figure is a schematic exploded view of a server in accordance with Figure 1 of the present invention.

機殼1包含一底殼11。在本實施例以及部分的其他實施例中,存儲模組2、連接模組3、第一擴展板4、第二擴展板5以及電源模組9皆設於底殼11上。第一擴展板4、第二擴展板5、第一主機板6以及第二主機板7分別以可插拔的方式連接於連接模組3。更進一步來說,連接模組3具有彼此相對的一第一側33以及一第二側34,存儲模組2連接至連接模組3的第一側33。第一擴展板4、第二擴展板5、第一主機板6以及第二主機板7分別連接至連接模組3的第二側34。此外,風扇模組8裝設於連接模組3上,而電源模組9亦自第二側34連接至連接模組3。換句話說,在本實施例以及部分的其他實施例中,機殼1之前端容設有第一擴展板4、第二擴展板5、第一主機板6、第二主機板7以及電源模組9,存儲模組2位於機殼1之後端,而連接模組3以及風扇模組8位於前端與後端之間。由此來看,連接模組3係用以電性連接服務器1000中各元件,元件得以彼此相互傳遞訊號。 The casing 1 includes a bottom casing 11. In this embodiment and some other embodiments, the storage module 2, the connection module 3, the first expansion board 4, the second expansion board 5, and the power module 9 are all disposed on the bottom case 11. The first expansion board 4, the second expansion board 5, the first motherboard 6 and the second motherboard 7 are respectively connected to the connection module 3 in a pluggable manner. Furthermore, the connection module 3 has a first side 33 and a second side 34 opposite to each other, and the storage module 2 is connected to the first side 33 of the connection module 3. The first expansion board 4, the second expansion board 5, the first motherboard 6 and the second motherboard 7 are respectively connected to the second side 34 of the connection module 3. In addition, the fan module 8 is mounted on the connection module 3, and the power module 9 is also connected to the connection module 3 from the second side 34. In other words, in the embodiment and some other embodiments, the front end of the casing 1 is provided with a first expansion board 4, a second expansion board 5, a first motherboard 6, a second motherboard 7, and a power module. In the group 9, the storage module 2 is located at the rear end of the casing 1, and the connection module 3 and the fan module 8 are located between the front end and the rear end. From this point of view, the connection module 3 is used to electrically connect the components in the server 1000, and the components can transmit signals to each other.

在本實施例以及部分的其他實施例中,機殼1更包含二側殼12、13以及四分隔板14、15、16、17。側殼12、13分別豎立於底殼11的相對兩側,以使底殼11與側殼12、13形成上述的容置空間。分隔板14、15之間共同形成一第一子容置空間,用以容置第一擴展板4以及第一主機板6;分隔板16、17共同形成一第二子容置空間,用以容置第二擴展板5以及第二主機板7。 更進一步來說,分隔板14、15、16、17各具有二平齊軌道141、142、151、152、161、162、171、172,各分隔板14、15、16、17的二平齊軌道141、142、151、152、161、162、171、172容置高度相異。如此,第一擴展板4、第二擴展板5、第一主機板6以及第二主機板7分別藉由對應的分隔板14、15、16、17的平齊軌道141、142、151、152、161、162、171、172的導引而分別插設或脫離於連接模組3。在本實施例中,第一主機板6位於第一擴展板4上,且彼此相隔一距離而不干涉;第二主機板7位於第二擴展板5上,且彼此相隔一距離而不干涉。如此,第一擴展板4、第二擴展板5、第一主機板6以及第二主機板7得以插設於正確位置而避免誤插。此外,第一擴展板4與第二擴展板5的厚度單位約為0.5U(一般而言,1U=1.75英寸=44.45毫米),而第一主機板6以及第二主機板7的厚度單位約為1.5U,擴展板與主機板厚度的差異亦能避免誤插。然而上述擴展板與主機板具有相異之高度非用以限定本發明。在其他實施例中,第一擴展板4、第二擴展板5第一主機板6以及第二主機板7的高度彼此相同。在本實施例中,電源模組9設於第二擴展板5以及第二主機板7旁,而第二主機板7以及第二擴展板5的相對另一側係鄰近於第一主機板6以及第一擴展板4。然而,第一擴展板4、第二擴展板5、第一主機板6、第二主機板7以及電源模組9相對之設置位置非用以限定本發明。在其他實施例中,第一擴展板4可位於第一主機板6上,而第二擴展板5可位於第二主機板7上。此外,電源 模組9係可介於第一擴展板4與第二擴展板5之間,即電源模組9亦設於第一擴展板以及第一主機板旁。综合上述,第一擴展板4、第二擴展板5、第一主機板6、第二主機板7以及電源模組9的相對設置位置可根據實際需求,進行靈活地調整。 In this embodiment and some other embodiments, the casing 1 further includes two side casings 12, 13 and four partition plates 14, 15, 16, 17. The side shells 12, 13 are respectively erected on opposite sides of the bottom shell 11, so that the bottom shell 11 and the side shells 12, 13 form the above-mentioned accommodating space. A first sub-receiving space is formed between the partition plates 14 and 15 for receiving the first expansion board 4 and the first main board 6; the partition boards 16 and 17 together form a second sub-accommodation space. The second expansion board 5 and the second motherboard 7 are accommodated. Furthermore, the partition plates 14, 15, 16, 17 each have two flush rails 141, 142, 151, 152, 161, 162, 171, 172, two of the partition plates 14, 15, 16, 17 The alignment rails 141, 142, 151, 152, 161, 162, 171, and 172 have different accommodation heights. Thus, the first expansion board 4, the second expansion board 5, the first main board 6, and the second main board 7 respectively pass the flush rails 141, 142, 151 of the corresponding partition boards 14, 15, 16, 17. The guides 152, 161, 162, 171, and 172 are respectively inserted or disconnected from the connection module 3. In the present embodiment, the first motherboard 6 is located on the first expansion board 4 and is separated from each other by a distance without interference; the second motherboard 7 is located on the second expansion board 5 and spaced apart from each other without interference. Thus, the first expansion board 4, the second expansion board 5, the first main board 6, and the second main board 7 can be inserted in the correct position to avoid mis-insertion. In addition, the thickness of the first expansion board 4 and the second expansion board 5 is about 0.5 U (generally, 1 U = 1.75 inches = 44.45 mm), and the thickness units of the first motherboard 6 and the second motherboard 7 are about For 1.5U, the difference between the thickness of the expansion board and the motherboard can also avoid mis-insertion. However, the above expansion boards have different heights from the main board and are not intended to limit the present invention. In other embodiments, the heights of the first expansion board 4, the second expansion board 5, the first main board 6, and the second main board 7 are identical to each other. In this embodiment, the power module 9 is disposed adjacent to the second expansion board 5 and the second motherboard 7, and the opposite sides of the second motherboard 7 and the second expansion board 5 are adjacent to the first motherboard 6. And a first expansion board 4. However, the relative positions of the first expansion board 4, the second expansion board 5, the first motherboard 6, the second motherboard 7, and the power module 9 are not intended to limit the present invention. In other embodiments, the first expansion board 4 can be located on the first motherboard 6 and the second expansion board 5 can be located on the second motherboard 7. In addition, the power supply The module 9 is interposed between the first expansion board 4 and the second expansion board 5, that is, the power module 9 is also disposed adjacent to the first expansion board and the first motherboard. In summary, the relative positions of the first expansion board 4, the second expansion board 5, the first motherboard 6, the second motherboard 7, and the power module 9 can be flexibly adjusted according to actual needs.

以下詳細介紹連接模組3的結構,請繼續參照『第3圖』以及『第5圖』。在本實施例以及部分的其他實施例中,連接模組3包含相互連接的一第一連接板31以及一第二連接板32,第一連接板31介於第二連接板32與底殼11之間。詳細來說,連接模組3更包含一托盤35,裝設於底殼11上。托盤35具有多個固定柱351,第一連接板31具有多個葫蘆孔314以及多個定位孔315。固定柱351穿設於葫蘆孔314以及多個定位孔315,以使第一連接板31藉由葫蘆孔314以及定位孔315與固定柱351的組配而安裝於托盤35上。 The structure of the connection module 3 will be described in detail below. Please refer to "3" and "5". In this embodiment and some other embodiments, the connection module 3 includes a first connecting plate 31 and a second connecting plate 32 connected to each other, and the first connecting plate 31 is interposed between the second connecting plate 32 and the bottom housing 11 between. In detail, the connection module 3 further includes a tray 35 mounted on the bottom case 11. The tray 35 has a plurality of fixing posts 351, and the first connecting plate 31 has a plurality of hoist holes 314 and a plurality of positioning holes 315. The fixing post 351 is disposed on the hoist hole 314 and the plurality of positioning holes 315 such that the first connecting plate 31 is mounted on the tray 35 by the cucurbit hole 314 and the positioning hole 315 and the fixing post 351.

第一連接板31包括一第一組連接埠311、一第二組連接埠312以及一第三組連接埠313。第一組連接埠311位於第一側33,第二組連接埠312位於第二側34,而第三組連接埠313面對第二連接板32。第一組連接埠311用以連接存儲模組2並與存儲模組2建立電性耦接關係。第二組連接埠312電性耦接至第一組連接埠311,用以連接第一擴展板4與第二擴展板5,以進行數據讀寫。第三組連接埠313電性耦接至第一組連接埠311與第二組連接埠313,用以連接第二連接板32。更進一步來說,第二組連接埠312包括一第一擴展板連接埠3121以及一第二擴展板連 接埠3122。第一擴展板連接埠3121用以連接第一擴展板4,而第二擴展板連接埠3122用以連接第二擴展板5。 The first connecting plate 31 includes a first set of connecting ports 311, a second set of connecting ports 312, and a third set of connecting ports 313. The first set of ports 311 are located on the first side 33, the second set of ports 312 are located on the second side 34, and the third set of ports 313 are facing the second web 32. The first set of ports 311 is used to connect to the storage module 2 and establish an electrical coupling relationship with the storage module 2. The second group of ports 312 are electrically coupled to the first group of ports 311 for connecting the first expansion board 4 and the second expansion board 5 for data reading and writing. The third group of ports 313 are electrically coupled to the first group of ports 311 and the second group of ports 313 for connecting the second connecting plate 32. Further, the second set of ports 312 includes a first expansion board connection port 311 and a second expansion board connection. Contact 3122. The first expansion board connection port 3121 is for connecting the first expansion board 4, and the second expansion board connection port 3122 is for connecting the second extension board 5.

第二連接板32包括一第四組連接埠324以及一第五組連接埠325。第四組連接埠324通過與第三組連接埠313建立電性耦接關係至第一連接板31。第五組連接埠325電性耦接至第四組連接埠324,用以連接第一主機板6、第二主機板7進行數據讀寫。 The second connecting plate 32 includes a fourth set of ports 324 and a fifth set of ports 325. The fourth set of ports 324 establishes an electrical coupling relationship with the third set of ports 313 to the first connecting plate 31. The fifth group of ports 325 are electrically coupled to the fourth group of ports 324 for connecting the first motherboard 6 and the second motherboard 7 for data reading and writing.

在其他實施例中,當第一擴展板4位於第一主機板6上,而第二擴展板5位於第二主機板7上時,第二組連接埠312電性連接第一主機板6與第二主機板7。第五組連接埠325電性連接第一擴展板4與第二擴展板5。 In other embodiments, when the first expansion board 4 is located on the first motherboard 6 and the second expansion board 5 is located on the second motherboard 7, the second group of ports 312 are electrically connected to the first motherboard 6 and The second motherboard 7. The fifth group of ports 325 is electrically connected to the first expansion board 4 and the second expansion board 5.

如此,第一連接板31與第二連接板32係以板對板的方式以第三組連接埠313與第四組連接埠324進行對接,如此的直接連接方式,省去了多餘的訊號傳輸線,如此可簡化服務器1000的結構。 In this way, the first connecting board 31 and the second connecting board 32 are connected to the fourth group connecting port 324 by the third group connecting port 313 in a board-to-board manner. Such a direct connection manner eliminates redundant signal transmission lines. This simplifies the structure of the server 1000.

在本發明的部分實施例中,服務器1000更包含一風扇模組8,組裝於存儲模組2與第一擴展板4、第二擴展板5、第一主機板6及第二主機板7之間。其中,風扇模組8包含一主框81、一底框82、二側框83、84、至少一安裝框85以及至少一可插拔風扇86。底框82以及側框83、84分別連接主框81的三端並朝向第一擴展板4、第二擴展板5、第一主機板6以及第二主機板7的設置方向延伸。安裝框85連接主框81的另一側並朝向存 儲模組2延伸,安裝框85容置可插拔風扇86。此外,側框83、84係藉由固定件87而固定於側殼12、13。 In some embodiments of the present invention, the server 1000 further includes a fan module 8 assembled in the storage module 2 and the first expansion board 4, the second expansion board 5, the first motherboard 6 and the second motherboard 7. between. The fan module 8 includes a main frame 81, a bottom frame 82, two side frames 83, 84, at least one mounting frame 85, and at least one pluggable fan 86. The bottom frame 82 and the side frames 83 and 84 are respectively connected to the three ends of the main frame 81 and extend toward the installation direction of the first expansion board 4, the second expansion board 5, the first main board 6, and the second main board 7. The mounting frame 85 is connected to the other side of the main frame 81 and faces The storage module 2 extends, and the mounting frame 85 houses the pluggable fan 86. Further, the side frames 83, 84 are fixed to the side cases 12, 13 by fixing members 87.

再者,請同時參照『第2圖』以及『第3圖』,『第2圖』為根據本發明一實施例的第二連接板以及風扇模組的分解示意圖。在本實施例以及部分的其他實施例中,連接模組3的第二連接板32安裝於風扇模組8的底框82上。底框82具有至少一穿槽821,第二連接板32之第四組連接埠324透過穿槽821以連接第三組連接埠313,以使第二連接板32建立與第一連接板31電性耦接關係。此外,底框82包括對位柱822,而第二連接板32具有對位孔321,對位柱822對應於對位孔321,一螺絲(未繪示)可穿設於對位柱822以及對位孔321,以加強第二連接板32與風扇模組8的固定效果。 In addition, please refer to FIG. 2 and FIG. 3 simultaneously, and FIG. 2 is an exploded perspective view of the second connecting plate and the fan module according to an embodiment of the present invention. In this embodiment and some other embodiments, the second connecting plate 32 of the connection module 3 is mounted on the bottom frame 82 of the fan module 8. The bottom frame 82 has at least one through slot 821, and the fourth set of connecting ports 324 of the second connecting plate 32 pass through the through slot 821 to connect the third set of connecting ports 313, so that the second connecting plate 32 is electrically connected to the first connecting plate 31. Sexual coupling relationship. In addition, the bottom frame 82 includes a aligning post 822, and the second connecting plate 32 has a aligning hole 321 corresponding to the aligning hole 321 . A screw (not shown) can be disposed on the aligning post 822 and The alignment hole 321 is for reinforcing the fixing effect of the second connecting plate 32 and the fan module 8.

在本實施例以及部分的其他實施例中,托盤35包括多個定位柱352,第一連接板31具有多個穿孔316。定位柱352穿透於第一連接板31的穿孔316,以使定位柱352固定於風扇模組8的安裝框85,藉以加強風扇模組8的固定。 In this and other embodiments of the portion, the tray 35 includes a plurality of locating posts 352 having a plurality of perforations 316. The positioning post 352 penetrates the through hole 316 of the first connecting plate 31 to fix the positioning post 352 to the mounting frame 85 of the fan module 8 , thereby reinforcing the fixing of the fan module 8 .

請參照『第5圖』,存儲模組2包括複數存儲單元21以及存儲背板22。存儲背板22設置於連接模組3以及存儲單元21之間,並連接於連接模組3以及存儲單元21之間。存儲模組2藉由存儲背板22耦接連接模組3。更進一步來說,存儲背板22包括一連接器221。連接模組3的第一組連接埠31電性連接於存儲模組2的存儲背板22的連接器221,以使存儲單元21得以與 第一擴展板4、第二擴展板5、第一主機板6、第二主機板7進行資料傳輸。 Referring to FIG. 5, the memory module 2 includes a plurality of memory cells 21 and a memory backplane 22. The storage backplane 22 is disposed between the connection module 3 and the storage unit 21 and is connected between the connection module 3 and the storage unit 21. The storage module 2 is coupled to the connection module 3 by the storage backplane 22. Furthermore, the storage backplane 22 includes a connector 221. The first group of ports 31 of the connection module 3 are electrically connected to the connector 221 of the storage backplane 22 of the storage module 2 to enable the storage unit 21 to The first expansion board 4, the second expansion board 5, the first motherboard 6, and the second motherboard 7 perform data transmission.

以下詳細介紹第一擴展板4以及第二擴展板5的結構。請參照『第4圖』,其為根據本發明一實施例的機殼、第一主機板、第二主機板、第一擴展板以及第二擴展板的分解示意圖。在本實施例以及部分的其他實施例中,第一擴展板4包含一第一主擴展板41、一第一副擴展板42、一纜線44、一連接器45以及一底盤46,第一主擴展板41以及第一副擴展板42設置於底盤46上,第一主擴展板41的相對兩端分別耦接於連接模組3的第二組連接埠312的第一擴展板連接埠3121以及第一副擴展板42。更進一步來說,第一擴展板4設有至少一第一擴展芯片43,設置於第一主擴展板41上。第一主擴展板41與第一副擴展板42間隔一距離,而第一主擴展板41與第一副擴展板42藉由纜線44彼此電性耦接。如此,其他電子元件可插設或連接於第一副擴展板42的連接埠47,進而擴充服務器1000的功能。其他電子元件例如可為一支援的JBOD(Just a Bunch Of Disks)存儲群組或一記憶體。需要注意的是,電子元件的種類非用以限定本發明。 The structure of the first expansion board 4 and the second extension board 5 will be described in detail below. Please refer to FIG. 4, which is an exploded perspective view of the casing, the first motherboard, the second motherboard, the first expansion panel, and the second expansion panel according to an embodiment of the invention. In this embodiment and some other embodiments, the first expansion board 4 includes a first main expansion board 41, a first sub-expansion board 42, a cable 44, a connector 45, and a chassis 46. The main expansion board 41 and the first sub-expansion board 42 are disposed on the chassis 46. The opposite ends of the first main expansion board 41 are respectively coupled to the first expansion board connection 埠3121 of the second group connection port 312 of the connection module 3. And a first sub-expansion plate 42. Furthermore, the first expansion board 4 is provided with at least one first expansion chip 43 disposed on the first main expansion board 41. The first main expansion board 41 is spaced apart from the first sub-expansion board 42 by a distance, and the first main expansion board 41 and the first sub-expansion board 42 are electrically coupled to each other by a cable 44. In this way, other electronic components can be inserted or connected to the port 47 of the first sub-expansion board 42, thereby expanding the function of the server 1000. The other electronic components may be, for example, a supported JBOD (Just a Bunch Of Disks) storage group or a memory. It should be noted that the type of electronic component is not intended to limit the invention.

類似於第一擴展板4,第二擴展板5包含一第二主擴展板51、一第二副擴展板52、一纜線54、一連接器55以及一底盤56,第二主擴展板51以及第二副擴展板52設置於底盤56上,第二主擴展板51的相對兩端分別耦接於連接模組3的第二組連接埠312的第二擴展板連接埠3122以及第二副擴展板52。第二擴 展板5設有至少一第二擴展芯片53,位於第二主擴展板51上。第二主擴展板51與第二副擴展板52間隔一距離,而第二主擴展板51與第二副擴展板52藉由纜線54彼此電性耦接。如此,其他電子元件可插設或連接於第二副擴展板52的連接埠57,進而擴充服務器1000的功能。 Similar to the first expansion board 4, the second expansion board 5 includes a second main expansion board 51, a second sub-expansion board 52, a cable 54, a connector 55, and a chassis 56. The second main expansion board 51 The second sub-expansion board 52 is disposed on the chassis 56. The opposite ends of the second main expansion board 51 are respectively coupled to the second expansion board connection port 3122 and the second pair of the second group connection port 312 of the connection module 3. Expansion board 52. Second expansion The display panel 5 is provided with at least one second expansion chip 53 on the second main expansion board 51. The second main expansion board 51 is spaced apart from the second sub-expansion board 52, and the second main expansion board 51 and the second sub-expansion board 52 are electrically coupled to each other by a cable 54. In this way, other electronic components can be inserted or connected to the port 57 of the second sub-expansion board 52, thereby expanding the function of the server 1000.

以下詳細介紹第一主機板6以及第二主機板7的結構。請繼續參照『第4圖』,第一主機板6設於一底盤63上,並且第一主機板6設有至少一第一中央處理單元61、一連接器62以及多個電子模組64。第一主機板6藉由連接器62電性耦接至第二連接板32的第五組連接埠325的第一主機板連接埠3251,如此得以進行訊號傳輸。再者,第二主機板7設於一底盤73上,且第二主機板7設有至少一第二中央處理單元71、一連接器72以及多個電子模組74。第二主機板7藉由連接器72電性耦接至第二連接板32的第五組連接埠325的第二主機板連接埠3252,如此得以進行訊號傳輸。 The structure of the first motherboard 6 and the second motherboard 7 will be described in detail below. Continuing to refer to FIG. 4 , the first motherboard 6 is disposed on a chassis 63 , and the first motherboard 6 is provided with at least one first central processing unit 61 , a connector 62 , and a plurality of electronic modules 64 . The first motherboard 6 is electrically coupled to the first motherboard connection port 3251 of the fifth group of ports 325 of the second connection board 32 via the connector 62, so that signal transmission is performed. Furthermore, the second motherboard 7 is disposed on a chassis 73, and the second motherboard 7 is provided with at least one second central processing unit 71, a connector 72, and a plurality of electronic modules 74. The second motherboard 7 is electrically coupled to the second motherboard connection port 3252 of the fifth group of ports 325 of the second connection board 32 by the connector 72, so that signal transmission is performed.

此外,第一主機板6以及第二主機板7上皆可設有擴充卡(例如PCIe卡),電子模組64、74可以是存儲裝置(例如固態硬碟(Solid State Disk drive,簡稱SSD)或一般硬碟)。如此,可增加了第一主機板6以及第二主機板7的功能。再者,第一擴展板4、第二擴展板5、第一主機板6以及第二主機板7係分別藉由連接器45、55、62、72而耦接於連接模組3。但這種藉由連接器45、55、62、72耦接的方式非用以限定本發明。在其他實施例中, 第一擴展板4、第二擴展板5、第一主機板6以及第二主機板7可直接插設於連接模組3。 In addition, an expansion card (for example, a PCIe card) may be disposed on the first motherboard 6 and the second motherboard 7. The electronic modules 64 and 74 may be storage devices (for example, a solid state disk drive (SSD)). Or a general hard drive). As such, the functions of the first motherboard 6 and the second motherboard 7 can be increased. Furthermore, the first expansion board 4, the second expansion board 5, the first motherboard 6 and the second motherboard 7 are coupled to the connection module 3 by connectors 45, 55, 62, 72, respectively. However, such a manner of coupling by connectors 45, 55, 62, 72 is not intended to limit the invention. In other embodiments, The first expansion board 4, the second expansion board 5, the first motherboard 6 and the second motherboard 7 can be directly inserted into the connection module 3.

以下介紹服務器2組裝方式,請先參照『第2圖』。首先,可插拔風扇8可先裝設於主框81與安裝框85之間。連接模組3的第二連接板32固定於風扇模組8的底框82上,並亦可藉由螺絲鎖附於第二連接板32的對位孔321以及底框82的對位柱822,以加強第二連接板32固定於風扇模組8的固定效果。 The following describes the assembly method of the server 2. Please refer to "Figure 2" first. First, the pluggable fan 8 can be installed between the main frame 81 and the mounting frame 85 first. The second connecting plate 32 of the connecting module 3 is fixed to the bottom frame 82 of the fan module 8 and can also be attached to the alignment hole 321 of the second connecting plate 32 and the alignment post 822 of the bottom frame 82 by screws. To enhance the fixing effect of the second connecting plate 32 fixed to the fan module 8.

請參照『第3圖』。連接模組3的第一連接板31先藉由葫蘆孔314以及多個定位孔315與托盤35的固定柱351對位,第一連接板31的第一組連接埠311再插設於存儲背板22的連接器221。同時,固定柱351得以固定於葫蘆孔314以及定位孔315內。再者,第二連接板32的第四組連接埠324穿過風扇模組8的底框82的穿槽821,而插設於第三組連接埠313。同時,托盤35的定位柱352穿透於第一連接板31的穿孔316,以使定位柱352固定於風扇模組8。然而上述第一連接板31與第二連接板32之固定方式非用以限定本發明。再者,風扇模組8的側框83、84係藉由固定件87而固定於機殼1的側殼12、13的固定孔121、131。再者,電源模組9係電性連接於第一連接板31以及第二連接板32。如此,連接模組3即安裝於機殼1上。 Please refer to "Figure 3". The first connecting plate 31 of the connecting module 3 is first aligned with the fixing post 351 of the tray 35 by the hoist hole 314 and the plurality of positioning holes 315, and the first set of connecting ports 311 of the first connecting plate 31 is inserted into the storage back. Connector 221 of board 22. At the same time, the fixing post 351 is fixed in the hoist hole 314 and the positioning hole 315. Furthermore, the fourth set of ports 324 of the second connecting plate 32 passes through the through slots 821 of the bottom frame 82 of the fan module 8 and are inserted into the third set of ports 313. At the same time, the positioning post 352 of the tray 35 penetrates through the through hole 316 of the first connecting plate 31 to fix the positioning post 352 to the fan module 8. However, the manner in which the first connecting plate 31 and the second connecting plate 32 are fixed is not intended to limit the present invention. Furthermore, the side frames 83 and 84 of the fan module 8 are fixed to the fixing holes 121 and 131 of the side cases 12 and 13 of the casing 1 by the fixing members 87. Furthermore, the power module 9 is electrically connected to the first connecting plate 31 and the second connecting plate 32. In this way, the connection module 3 is mounted on the casing 1.

請參照『第4圖』。第一擴展板4可沿著分隔板14、15的平齊軌道141、151進入機殼1內而與第一連接板31的第二組連接埠312的第一擴展板連接埠3121進行耦接。第一主機板6 可沿著分隔板14、15的平齊軌道142、152進入機殼1內而與第二連接板32的第五組連接埠325的第一主機板連接埠3251進行耦接。第二擴展板5可沿著分隔板16、17的平齊軌道161、171進入機殼1內而與第一連接板31的第二組連接埠312的第二擴展板連接埠3122進行耦接。第二主機板7係可沿著分隔板16、17的平齊軌道162、172進入機殼1內而與第二連接板32的第五組連接埠325的第二主機板連接埠3252進行耦接。如此,第一擴展板4、第二擴展板5、第一主機板6以及第二主機板7得以分別地插設以及脫離於連接模組3。 Please refer to "Figure 4". The first expansion board 4 can enter the casing 1 along the flush rails 141, 151 of the partition boards 14, 15 to be coupled with the first expansion board connection 埠 3121 of the second group connection 312 of the first connection board 31. Pick up. First motherboard 6 The first motherboard connection 埠 3251 of the fifth set of ports 325 of the second connection plate 32 can be coupled into the casing 1 along the flush rails 142, 152 of the divider plates 14, 15. The second expansion plate 5 can be coupled into the casing 1 along the flush rails 161, 171 of the partition plates 16, 17 to be coupled with the second expansion plate connection 埠 3122 of the second set of ports 312 of the first connection plate 31. Pick up. The second motherboard 7 can be inserted into the casing 1 along the flush rails 162, 172 of the partition plates 16, 17, and connected to the second motherboard connection 埠 3252 of the fifth group connection 325 of the second connecting plate 32. Coupling. In this manner, the first expansion board 4, the second expansion board 5, the first motherboard 6 and the second motherboard 7 are respectively inserted and detached from the connection module 3.

在本實施例以及部分的其他實施例中,存儲模組2皆藉由連接模組3與第一擴展板4、第二擴展板5、第一主機板6以及第二主機板7耦接。當第一擴展板4與第二擴展板5至少有一運作正常,且第一主機板6與第二主機板7至少有一運作正常時,運作正常之第一主機板6或第二主機板7可經由任一運作正常之第一擴展板4或第二擴展板5之路徑對存儲模組6的全部存儲單元21進行數據讀寫。 In other embodiments of the present embodiment, the storage module 2 is coupled to the first expansion board 4, the second expansion board 5, the first motherboard 6, and the second motherboard 7 by the connection module 3. When at least one of the first expansion board 4 and the second expansion board 5 is functioning normally, and at least one of the first motherboard 6 and the second motherboard 7 is functioning normally, the first motherboard 6 or the second motherboard 7 that is functioning normally can be The data is read and written to all the storage units 21 of the storage module 6 via the path of any of the first expansion board 4 or the second expansion board 5 that is operating normally.

在本實施例以及部分的其他實施例中,第一主機板6、第二主機板7、第一擴展板4及第二擴展板5相互獨立地以熱插拔的方式設於機殼1內的連接模組3。在第一主機板6、第二主機板7、第一擴展板4及第二擴展板5全部運作正常時,更換任一運作正常之第一主機板6或第二主機板7、抑或任一運作正常之第一擴展板4或第二擴展板5,不影響服務器2的運作。 In this embodiment and some other embodiments, the first motherboard 6, the second motherboard 7, the first expansion board 4, and the second expansion board 5 are independently and independently inserted into the casing 1 in a hot-swappable manner. Connection module 3. When the first motherboard 6, the second motherboard 7, the first expansion board 4, and the second expansion board 5 are all operating normally, replace any of the first motherboard 6 or the second motherboard 7 that is in normal operation, or any The first expansion board 4 or the second extension board 5 that operates normally does not affect the operation of the server 2.

關於本發明的服務器結構所能達成的特殊技術效果與功效,請參照『第6圖』至『第11圖』,其中第6圖係根據本發明一實施例的存儲模組、第一主機板、第二主機板、第一擴展板以及第二擴展板的方塊圖,第7圖係根據本發明一實施例的存儲模組、第一連接板、第二連接板、第一主機板、第二主機板、第一擴展板以及第二擴展板的方塊圖。由第6圖可知,當第一主機板6想要對存儲模組2所儲存的資料進行存取運作的時候,第一主機板6可以將存取指令通過第一擴展板4傳送給存儲模組2,然而,必要的時候(例如第一擴展板4處於忙錄狀態或是指令量過大時)第一主機板6也可以將存取指令通過第二擴展板5傳送給存儲模組2。同理,當第二主機板7想要對存儲模組2所儲存的資料進行存取運作的時候,第二主機板7可以將存取指令通過第二擴展板5傳送給存儲模組2,並且,必要的時候第二主機板7也可以將存取指令通過第一擴展板4傳送給存儲模組2。 Regarding the special technical effects and effects that can be achieved by the server structure of the present invention, please refer to FIG. 6 to FIG. 11 , wherein FIG. 6 is a storage module and a first motherboard according to an embodiment of the invention. a block diagram of the second motherboard, the first expansion board, and the second expansion board, and FIG. 7 is a storage module, a first connection board, a second connection board, a first motherboard, and a first embodiment according to an embodiment of the invention. A block diagram of the second motherboard, the first expansion board, and the second expansion board. As can be seen from FIG. 6, when the first motherboard 6 wants to access the data stored in the storage module 2, the first motherboard 6 can transmit the access command to the storage module through the first expansion board 4. Group 2, however, when necessary (for example, when the first expansion board 4 is in the busy recording state or when the command amount is too large), the first motherboard 6 can also transmit the access command to the storage module 2 through the second expansion board 5. Similarly, when the second motherboard 7 wants to access the data stored in the storage module 2, the second motherboard 7 can transmit the access command to the storage module 2 through the second expansion board 5. Moreover, the second motherboard 7 can also transmit the access command to the storage module 2 through the first expansion board 4 as necessary.

此外,設置於第一擴展板4的一個或多個第一裝置(例如第一擴展芯片43)通常由設置於第一主機板6的第一中央處理單元61運行作業系統來控制,而第二擴展板5上的一個或多個第二裝置(例如第二擴展芯片53)通常由設置於第二主機板7的第二中央處理單元71運行作業系統來控制。但是這樣的控制方式並非一定。在必要的時候,設置於第一擴展板4的第一裝置也可以由設置於第二主機板7的第二中央處理單元71來控制,同樣的設置於第二擴展板5的第二裝置也可以由設置於第一主機板6的第 一中央處理單元61來控制。 In addition, one or more first devices (eg, the first expansion chip 43) disposed on the first expansion board 4 are generally controlled by the first central processing unit 61 disposed on the first motherboard 6 to operate the operating system, and the second One or more second devices (e.g., second expansion chip 53) on the expansion board 5 are typically controlled by a second central processing unit 71 disposed on the second motherboard 7 to operate the operating system. But such a control method is not necessarily. When necessary, the first device disposed on the first expansion board 4 may also be controlled by the second central processing unit 71 disposed on the second motherboard 7, and the second device similarly disposed on the second expansion board 5 is also Can be set by the first motherboard 6 A central processing unit 61 controls.

由於第一連接板31與第二連接板32的應用,由第7圖可知,實際上第一主機板6要將一個第一指令傳送給存儲模組2的時候,第一指令通常經由第二連接板32與第一連接板31被送到第一擴展板4。設置於第一擴展板4的第一擴展芯片43會判斷第一指令是要傳送給存儲模組2的指令,因此第一擴展板4經由第一連接板31把第一指令傳送到存儲模組2。但是第一指令也可以不是傳送到第一擴展板4而是傳送到第二擴展板5,而第二擴展板5的判斷與作動模式一如第一擴展板4。 Due to the application of the first connecting plate 31 and the second connecting plate 32, it can be seen from FIG. 7 that when the first motherboard 6 actually transmits a first command to the storage module 2, the first command is usually via the second The connecting plate 32 and the first connecting plate 31 are sent to the first expansion board 4. The first expansion chip 43 disposed on the first expansion board 4 determines that the first instruction is an instruction to be transmitted to the storage module 2, so the first expansion board 4 transmits the first instruction to the storage module via the first connection board 31. 2. However, the first command may not be transmitted to the first expansion board 4 but to the second expansion board 5, and the determination and actuation mode of the second expansion board 5 is like the first expansion board 4.

如果第二主機板7要將一個第二指令傳送給存儲模組2的時候,第二指令通常經由第二連接板32與第一連接板31被送到第二擴展板5。設置於第二擴展板5的第二擴展芯片53會判斷第二指令是要傳送給存儲模組2的指令,因此第二擴展板5經由第一連接板31把第二指令傳送到存儲模組2。但是第二指令也可以不是傳送到第二擴展板5而是傳送到第一擴展板4,而第一擴展板4的判斷與作動模式一如第二擴展板5。 If the second motherboard 7 is to transmit a second command to the storage module 2, the second command is usually sent to the second expansion board 5 via the second connection board 32 and the first connection board 31. The second expansion chip 53 disposed on the second expansion board 5 determines that the second instruction is an instruction to be transmitted to the storage module 2, so the second expansion board 5 transmits the second instruction to the storage module via the first connection board 31. 2. However, the second command may not be transmitted to the second expansion board 5 but to the first expansion board 4, and the determination and actuation mode of the first expansion board 4 is like the second expansion board 5.

接著請參照『第8圖』,其係根據本發明一實施例中,第7圖中的第一擴展板被移除的功能方塊圖。如第8圖所示,在實際運作上,可能因為維修或故障,第7圖中的第一擴展板4會被移除,因此整個服務器剩下存儲模組2、連結模組3中的第一連接板31與第二連接板32、第二擴展板5、第一主機板6與第二主機板7。此時,當第一主機板6要對存儲模組2中所儲存的資 料進行存取運作時,由於第一擴展板4不存在了,所以第一主機板6把存取指令沿著訊號路徑CMD1經由第二連接板32、第一連接板31傳到第二擴展板5,隨後第二擴展板5(或者說設置於第二擴展板5的第二擴展芯片53)把存取指令繼續沿著訊號路徑CMD1傳到存儲模組2。而當第二主機板7要對存儲模組2進行存取時,第二主機板7把存取指令沿著訊號路徑CMD2傳送到存儲模組2。也就是說,第一擴展板4的移除不會影響到第一主機板6對於存儲模組2的存取,因為原有第一擴展板4的功能可以由第二擴展板5來分擔。 Next, please refer to FIG. 8 , which is a functional block diagram of the first expansion board in FIG. 7 removed according to an embodiment of the present invention. As shown in Fig. 8, in actual operation, the first expansion board 4 in Fig. 7 may be removed due to maintenance or failure, so the entire server has the storage module 2, and the connection module 3 A connecting plate 31 and a second connecting plate 32, a second expansion plate 5, a first motherboard 6 and a second motherboard 7. At this time, when the first motherboard 6 is to access the data stored in the storage module 2, since the first expansion board 4 does not exist, the first motherboard 6 places the access instruction along the signal path. The CMD 1 is transmitted to the second expansion board 5 via the second connection board 32 and the first connection board 31, and then the second extension board 5 (or the second extension chip 53 disposed on the second extension board 5) continues the access instruction. It is transmitted to the storage module 2 along the signal path CMD 1 . 7 when the second motherboard access to the storage module 2, the second motherboard 7 conveyed along the signal path access command to the CMD memory module 2 2. That is to say, the removal of the first expansion board 4 does not affect the access of the first motherboard 6 to the storage module 2, because the function of the original first expansion board 4 can be shared by the second expansion board 5.

同樣的,請參照『第9圖』,其係根據本發明一實施例中,第7圖中的第二擴展板被移除的功能方塊圖。如第9圖所示,在實際運作上,可能因為維修或故障,第7圖中的第二擴展板5會被移除,因此整個服務器剩下存儲模組2、連結模組3中的第一連接板31與第二連接板32、第一擴展板4、第一主機板6與第二主機板7。此時,當第一主機板6要對存儲模組2中所儲存的資料進行存取運作時,第一主機板6把存取指令沿著訊號路徑CMD3經由第二連接板32、第一連接板31傳到第一擴展板4,隨後第一擴展板4(或者說設置於第一擴展板4的第一擴展芯片43)把存取指令繼續沿著訊號路徑CMD3傳到存儲模組2。而當第二主機板7要對存儲模組2中所儲存的資料進行存取運作時,由於第二擴展板5已經不存在了,第二主機板7於是把存取指令沿著訊號路徑CMD4經由第二連接板32、第一連接板31傳到第一擴 展板4,隨後第一擴展板4(或者說設置於第一擴展板4的第一擴展芯片43)把存取指令繼續沿著訊號路徑CMD4傳送到存儲模組2。也就是說,第二擴展板5的移除不會影響到第二主機板7對於存儲模組2的存取,因為原有第二擴展板5的功能可以由第一擴展板4來分擔。 Similarly, please refer to FIG. 9 , which is a functional block diagram of the second expansion board in FIG. 7 removed according to an embodiment of the present invention. As shown in Figure 9, in actual operation, the second expansion board 5 in Figure 7 may be removed due to maintenance or failure, so the entire server has the remaining storage module 2, the connection module 3 A connecting plate 31 and a second connecting plate 32, a first expansion board 4, a first main board 6 and a second main board 7. At this time, when the first motherboard 6 is to access the data stored in the storage module 2, the first motherboard 6 places the access command along the signal path CMD 3 via the second connection board 32, first. The connecting board 31 is transmitted to the first expansion board 4, and then the first expansion board 4 (or the first expansion chip 43 disposed on the first expansion board 4) continues to transmit the access command along the signal path CMD 3 to the storage module. 2. When the second motherboard 7 is to access the data stored in the storage module 2, since the second expansion board 5 does not exist, the second motherboard 7 then places the access command along the signal path CMD. 4 is transmitted to the first expansion board 4 via the second connection board 32 and the first connection board 31, and then the first expansion board 4 (or the first expansion chip 43 disposed on the first expansion board 4) continues the access instruction. The signal path CMD 4 is transferred to the storage module 2. That is to say, the removal of the second expansion board 5 does not affect the access of the second motherboard 7 to the storage module 2, because the function of the original second expansion board 5 can be shared by the first expansion board 4.

接著,請參照『第10圖』,其係根據本發明一實施例中,第7圖中的第一主機板被移除的功能方塊圖。如第10圖所示,在實際運作上,可能因為維修或故障,第7圖中的第一主機板6會被移除,因此整個服務器剩下存儲模組2、連結模組3中的第一連接板31與第二連接板32、第一擴展板4、第二擴展板5與第二主機板7。此時,位於第一擴展板4與第二擴展板5的裝置(例如第一擴展芯片43與第二擴展芯片53),統一由位於第二主機板7的處理裝置來控制。舉例來說,第一擴展板4可以與第二主機板7之間形成一個訊號路徑CMD5以便位第二主機板7的處理裝置控制位於第一擴展板4的第一裝置與位於第二擴展板5的第二裝置。也就是說,第一主機板6的移除不會影響到位於第一擴展板4的元件的運作,因為原有第一主機板6的功能可以由第二主機板7來分擔。 Next, please refer to FIG. 10, which is a functional block diagram of the first motherboard in FIG. 7 removed according to an embodiment of the present invention. As shown in FIG. 10, in actual operation, the first motherboard 6 in FIG. 7 may be removed due to maintenance or failure, so the entire server has the remaining storage module 2 and the connection module 3 A connecting plate 31 and a second connecting plate 32, a first expansion board 4, a second expansion board 5, and a second motherboard 7. At this time, the devices (for example, the first expansion chip 43 and the second expansion chip 53) located on the first expansion board 4 and the second expansion board 5 are collectively controlled by the processing device located on the second motherboard 7. For example, the first expansion board 4 can form a signal path CMD 5 with the second motherboard 7 so that the processing device of the second motherboard 7 controls the first device located at the first expansion board 4 and is located at the second extension. The second device of the board 5. That is to say, the removal of the first motherboard 6 does not affect the operation of the components located in the first expansion board 4, since the functions of the original first motherboard 6 can be shared by the second motherboard 7.

同樣的,請參照『第11圖』,其係根據本發明一實施例中,第7圖中的第二主機板被移除的功能方塊圖。如第11圖所示,在實際運作上,可能因為維修或故障,第7圖中的第二主機板7會被移除,因此整個服務器剩下存儲模組2、連結模組3 中的第一連接板31與第二連接板32、第一擴展板4、第二擴展板5與第一主機板6。此時,位於第一擴展板4與第二擴展板5的裝置(也就是第一擴展芯片43與第二擴展芯片53),統一由位於第一主機板6的處理裝置來控制。舉例來說,第二擴展板5可以與第一主機板6之間形成一個訊號路徑CMD6以便位於第一主機板6的處理裝置控制位於第一擴展板4的第一裝置與位於第二擴展板5的第二裝置。也就是說,第二主機板7的移除不會影響到位於第二擴展板5上的元件的運作,因為原有第二主機板7的功能可以由第一主機板6來分擔。 Similarly, please refer to FIG. 11 , which is a functional block diagram of the second motherboard in FIG. 7 removed according to an embodiment of the present invention. As shown in Fig. 11, in actual operation, the second motherboard 7 in Fig. 7 may be removed due to maintenance or failure, so the entire server has the storage module 2, and the connection module 3 A connecting plate 31 and a second connecting plate 32, a first expansion board 4, a second expansion board 5 and a first motherboard 6. At this time, the devices located at the first expansion board 4 and the second expansion board 5 (that is, the first expansion chip 43 and the second expansion chip 53) are collectively controlled by the processing device located on the first motherboard 6. For example, the second expansion board 5 can form a signal path CMD 6 with the first motherboard 6 so that the processing device located at the first motherboard 6 controls the first device located at the first expansion board 4 and is located at the second extension. The second device of the board 5. That is to say, the removal of the second motherboard 7 does not affect the operation of the components located on the second expansion board 5, since the functions of the original second motherboard 7 can be shared by the first motherboard 6.

綜合上述,根據本發明揭露的服務器,第一擴展板、第二擴展板、第一主機板以及第二主機板分別以可插拔的方式連接於連接模組。如此,可快速提升第一擴展板、第二擴展板、第一主機板以及第二主機板的更換與組裝效率。 In summary, according to the server disclosed in the present invention, the first expansion board, the second expansion board, the first motherboard, and the second motherboard are respectively connected to the connection module in a pluggable manner. In this way, the replacement and assembly efficiency of the first expansion board, the second expansion board, the first motherboard, and the second motherboard can be quickly improved.

在部分實施例中,當第一擴展板與第二擴展板至少有一運作正常,且第一主機板與第二主機板至少有一運作正常時,運作正常之第一主機板或第二主機板可經由任一運作正常之第一擴展板或第二擴展板之路徑對全部存儲模組進行數據讀寫。在第一主機板、第二主機板、第一擴展板及第二擴展板全部運作正常時,更換任一運作正常之第一主機板或第二主機板、抑或任一運作正常之第一擴展板或第二擴展板,不影響伺服器的運作。由於第一擴展板及第二擴展板的組合與第一主機板及第二主機板的組合互為冗餘設計(Redundant Design),當其一主機板或是擴展 板故障時,其另外的主機板以及擴展板可立刻接管其工作,而使服務器不需要關機而進行維護。如此,這種第一主機板、第二主機板、第一擴展板及第二擴展板可熱插拔於服務器的功能,不需要重新關機而可直接進行更換的服務器,可持續工作,不影響服務器系統的穩定性和可靠性,進而大幅提升運作效率。 In some embodiments, when at least one of the first expansion board and the second expansion board is functioning normally, and at least one of the first motherboard and the second motherboard is in normal operation, the first motherboard or the second motherboard that is in normal operation may be Read and write data to all storage modules via the path of any functioning first expansion board or second expansion board. When the first motherboard, the second motherboard, the first expansion board, and the second expansion board all operate normally, replace any first or second motherboard that is functioning normally, or any first extension that is functioning normally The board or the second expansion board does not affect the operation of the server. Since the combination of the first expansion board and the second expansion board and the combination of the first motherboard and the second motherboard are Redundant Design, when one motherboard or extension When the board fails, its other motherboard and expansion board can take over its work immediately, so that the server does not need to be shut down for maintenance. In this way, the first motherboard, the second motherboard, the first expansion board, and the second expansion board can be hot-swapped to the server, and the server can be directly replaced without re-shutdown, and the work can be continued without affecting. The stability and reliability of the server system greatly increases operational efficiency.

雖然本發明以前述之較佳實施例揭露如上,然其並非用以限定本發明,任何熟習相像技藝者,在不脫離本發明之精神和範圍內,當可作許之更動與潤飾,因此本發明之專利保護範圍須視本說明書所附之申請專利範圍所界定者為準。 While the present invention has been described above in terms of the preferred embodiments thereof, it is not intended to limit the invention, and the invention may be modified and modified without departing from the spirit and scope of the invention. The patent protection scope of the invention is subject to the definition of the scope of the patent application attached to the specification.

1‧‧‧機殼 1‧‧‧Shell

1000‧‧‧服務器 1000‧‧‧ server

12、13‧‧‧側殼 12, 13‧‧‧ side shell

17‧‧‧分隔板 17‧‧‧ partition board

2‧‧‧存儲模組 2‧‧‧Memory Module

22‧‧‧存儲背板 22‧‧‧Storage backplane

3‧‧‧連接模組 3‧‧‧Connecting module

4‧‧‧第一擴展板 4‧‧‧First expansion board

5‧‧‧第二擴展板 5‧‧‧Second expansion board

6‧‧‧第一主機板 6‧‧‧First motherboard

64‧‧‧電子模組 64‧‧‧Electronic module

7‧‧‧第二主機板 7‧‧‧Second motherboard

74‧‧‧電子模組 74‧‧‧Electronic module

8‧‧‧風扇模組 8‧‧‧Fan module

87‧‧‧固定件 87‧‧‧Fixed parts

9‧‧‧電源模組 9‧‧‧Power Module

Claims (13)

一種服務器,包含:一機殼,包含一底殼;一存儲模組,設於該底殼上並設有複數存儲單元;一連接模組,設於該底殼上並連接該存儲模組;一第一擴展板,設有至少一第一擴展芯片;一第二擴展板,設有至少一第二擴展芯片;一第一主機板,設有至少一第一中央處理單元;以及一第二主機板,設有至少一第二中央處理單元;其中,該第一擴展板、該第二擴展板、該第一主機板以及該第二主機板分別以可插拔的方式連接於該連接模組。 A server comprising: a casing, comprising a bottom casing; a storage module disposed on the bottom casing and provided with a plurality of storage units; a connection module disposed on the bottom casing and connected to the storage module; a first expansion board, at least one first expansion chip; a second expansion board, at least one second expansion chip; a first motherboard, at least one first central processing unit; and a second The motherboard is provided with at least one second central processing unit; wherein the first expansion board, the second expansion board, the first motherboard, and the second motherboard are respectively connected to the connection module in a pluggable manner group. 根據申請專利範圍第1項之服務器,其中該連接模組具有彼此相對的一第一側以及一第二側,該存儲模組連接該連接模組的該第一側;該第一擴展板、該第二擴展板、該第一主機板以及該第二主機板分別連接該連接模組的該第二側。 The server of claim 1, wherein the connection module has a first side and a second side opposite to each other, the storage module is connected to the first side of the connection module; the first expansion board, The second expansion board, the first motherboard, and the second motherboard are respectively connected to the second side of the connection module. 根據申請專利範圍第1項之服務器,其中該存儲模組設有一存儲背板,設置於該連接模組以及該些存儲單元之間,並連接於該連接模組以及該些存儲單元之間,該存儲模組藉由該存儲背板耦接該連接模組。 The server of claim 1, wherein the storage module is provided with a storage backplane disposed between the connection module and the storage units and connected between the connection module and the storage units. The storage module is coupled to the connection module by the storage backplane. 根據申請專利範圍第1項之服務器,其中該連接模組包含相互連接的一第一連接板以及一第二連接板,該第一連接板介於該第二連接板與該底殼之間; 其中,該第一連接板包括:一第一組連接埠,用以連接該存儲模組並與該存儲模組建立電性耦接關係;一第二組連接埠,電性耦接至該第一組連接埠,用以連接該第一擴展板、該第二擴展板或該第一主機板、該第二主機板進行數據讀寫;以及一第三組連接埠,電性耦接至該第一組連接埠、該第二組連接埠,用以連接該第二連接板;其中,該第二連接板包括:一第四組連接埠,通過與該第三組連接埠建立電性耦接關係至該第一連接板;以及一第五組連接埠,電性耦接至該第四組連接埠,用以連接該第一主機板、該第二主機板或該第一擴展板、該第二擴展板進行數據讀寫。 The server of claim 1, wherein the connection module comprises a first connecting plate and a second connecting plate connected to each other, the first connecting plate being interposed between the second connecting plate and the bottom case; The first connection board includes: a first set of connection ports for connecting the storage module and establishing an electrical coupling relationship with the storage module; a second set of connection ports electrically coupled to the first a set of ports for connecting the first expansion board, the second expansion board or the first motherboard, the second motherboard for data reading and writing, and a third group of ports electrically coupled to the The first group of ports 埠, the second group of ports 连接 are connected to the second connecting plate; wherein the second connecting plate comprises: a fourth group of connecting ports, and electrically coupled with the third group of ports Connected to the first connecting board; and a fifth set of connecting ports electrically coupled to the fourth set of ports for connecting the first motherboard, the second motherboard or the first expansion board, The second expansion board performs data reading and writing. 根據申請專利範圍第4項之服務器,其中該連接模組更包含一托盤,該托盤裝設於該底殼上,該托盤設有複數固定柱,該第一連接板具有複數葫蘆孔及複數定位孔,該第一連接板藉由該些葫蘆孔以及該些定位孔與該些固定柱的組配而安裝於該托盤上。 The server of claim 4, wherein the connection module further comprises a tray, the tray is mounted on the bottom case, the tray is provided with a plurality of fixing columns, the first connecting plate has a plurality of hoist holes and a plurality of positioning The first connecting plate is mounted on the tray by the hoist holes and the positioning holes and the fixing posts. 根據申請專利範圍第4項之服務器,更包含一風扇模組,組裝於該存儲模組與該第一擴展板、該第二擴展板、該第一主機板以及該第二主機板之間,其中,該風扇模組包含一主框、一底 框、二側框以及至少一安裝框,該底框以及該二側框分別連接該主框的三端並朝向該第一擴展板、該第二擴展板、該第一主機板以及該第二主機板的設置方向延伸,該安裝框連接該主框並朝向該存儲模組延伸,該安裝框容置至少一可插拔風扇。 The server of claim 4 further includes a fan module assembled between the storage module and the first expansion board, the second expansion board, the first motherboard, and the second motherboard. Wherein, the fan module comprises a main frame and a bottom a frame, two side frames, and at least one mounting frame, the bottom frame and the two side frames are respectively connected to the three ends of the main frame and facing the first expansion board, the second expansion board, the first motherboard, and the second The mounting direction of the motherboard extends. The mounting frame is connected to the main frame and extends toward the storage module. The mounting frame houses at least one pluggable fan. 根據申請專利範圍第6項之服務器,其中該第二連接板安裝於該底框上,該底框具有至少一穿槽,該第二連接板之該第四組連接埠透過該穿槽以連接該第三組連接埠建立與該第一連接板電性耦接關係。 The server of claim 6, wherein the second connecting plate is mounted on the bottom frame, the bottom frame has at least one through slot, and the fourth set of connecting ports of the second connecting plate are connected through the through slot The third set of ports establishes an electrical coupling relationship with the first connection board. 根據申請專利範圍第6項之服務器,其中該機殼更包含二側殼,該二側框係分別藉由至少一固定件而固定於該二側殼。 The server of claim 6, wherein the casing further comprises two side casings, the two side frames being respectively fixed to the two side casings by at least one fixing member. 根據申請專利範圍第1項之服務器,更包含一電源模組,該電源模組設於該第一擴展板以及該第一主機板旁,或設於該第二擴展板以及第二主機板旁,且該電源模組連接於該連接模組。 The server of claim 1 further includes a power module disposed adjacent to the first expansion board and the first motherboard, or disposed adjacent to the second expansion board and the second motherboard And the power module is connected to the connection module. 根據申請專利範圍第1項之服務器,其中該第一擴展板包含一第一主擴展板以及一第一副擴展板,該第一主擴展板分別耦接於該連接模組以及該第一副擴展板;該第二擴展板包含一第二主擴展板以及一第二副擴展板,該第二主擴展板分別耦接於該連接模組以及該第二副擴展板。 According to the server of claim 1, wherein the first expansion board includes a first main expansion board and a first sub-expansion board, the first main expansion board is coupled to the connection module and the first sub- The second expansion board includes a second main expansion board and a second sub-expansion board. The second main expansion board is coupled to the connection module and the second sub-expansion board. 根據申請專利範圍第1項之服務器,其中該機殼包含複數分隔板,分別豎立於該底殼上,該些分隔板各具有二平齊軌道,各該分隔板的該二平齊軌道容置高度相異,該第一擴展板、該第二擴展板,該第一主機板以及該第二主機板分別藉由對應的該 些分隔板的該些平齊軌道的導引而分別插設或脫離於該連接模組。 The server according to claim 1, wherein the casing comprises a plurality of partition plates respectively standing on the bottom casing, the partition plates each having two flush rails, and the two flat flushes of the partition panels The first expansion board, the second expansion board, the first motherboard, and the second motherboard are respectively corresponding to each other. The guide rails of the partition plates are respectively inserted or detached from the connection module. 根據申請專利範圍第1項之服務器,其中,該些存儲模組皆藉由該連接模組與該第一擴展板、該第二擴展板、該第一主機板以及該第二主機板耦接,當該第一擴展板與該第二擴展板至少有一運作正常,且該第一主機板與該第二主機板至少有一運作正常時,運作正常的該第一主機板或該第二主機板可經由任一運作正常的該第一擴展板或該第二擴展板之路徑對該存儲模組的全部該些存儲單元進行數據讀寫。 The server of the first aspect of the invention, wherein the storage module is coupled to the first expansion board, the second expansion board, the first motherboard, and the second motherboard by the connection module When the first expansion board and the second expansion board are at least one of normal operation, and the first motherboard and the second motherboard have at least one functioning normal, the first motherboard or the second motherboard that works normally Data can be read and written to all of the storage units of the storage module via any of the working first expansion boards or the second expansion board. 根據申請專利範圍第1項之服務器,其中該第一主機板、該第二主機板、該第一擴展板及該第二擴展板相互獨立地設於該機殼內,在該第一主機板、該第二主機板、該第一擴展板及該第二擴展板全部運作正常時,更換任一運作正常之該第一主機板或該第二主機板、抑或任一運作正常之該第一擴展板或該第二擴展板,不影響該服務器的運作。 The server of claim 1, wherein the first motherboard, the second motherboard, the first expansion panel, and the second expansion panel are independently disposed in the casing, and the first motherboard When the second motherboard, the first expansion board, and the second expansion board are all in normal operation, replace the first motherboard or the second motherboard that is in normal operation, or the first one that is functioning normally The expansion board or the second expansion board does not affect the operation of the server.
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI704556B (en) * 2019-09-10 2020-09-11 英業達股份有限公司 Server
TWI752836B (en) * 2021-02-26 2022-01-11 英業達股份有限公司 Electronic assembly

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* Cited by examiner, † Cited by third party
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CN110554743B (en) * 2018-06-01 2023-07-28 技钢科技股份有限公司 Connection medium device and server using same
TWI670583B (en) * 2018-06-01 2019-09-01 技嘉科技股份有限公司 Connecting Media Device and Server with the Connecting Media Device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI704556B (en) * 2019-09-10 2020-09-11 英業達股份有限公司 Server
TWI752836B (en) * 2021-02-26 2022-01-11 英業達股份有限公司 Electronic assembly

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