CN206833336U - A kind of low-power consumption high density clustered computing system - Google Patents
A kind of low-power consumption high density clustered computing system Download PDFInfo
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- CN206833336U CN206833336U CN201720745703.6U CN201720745703U CN206833336U CN 206833336 U CN206833336 U CN 206833336U CN 201720745703 U CN201720745703 U CN 201720745703U CN 206833336 U CN206833336 U CN 206833336U
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- cabinet
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- high density
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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Abstract
The utility model discloses a kind of low-power consumption high density clustered computing system, and multiple stage computers mainboard is arranged in cabinet, and the cabinet depth is less than 400mm, from two cabinets of forward and backward insertion in standard server rack；The cabinet rear portion is provided with backboard, and power module is inserted in the middle part of cabinet, and multiple stage computers mainboard is plugged in the both sides of power module, cabinet bottom insertion radiating module respectively；Power module interface is provided with the middle part of the backboard, is connected with power module；Both sides in the middle part of backboard positioned at power module interface are respectively equipped with the multiple CPCI interfaces being connected with computer motherboard, and power supply is provided for computer motherboard；Backboard bottom is provided with radiating module interface, is connected with radiating module.The computer system has high density, and low-power consumption is simple in construction, and cost is low, good heat dissipation, using flexible, the advantages that calculating suitable for big data.
Description
Technical field
The utility model belongs to the meter such as big data parallel computation, mist calculating, the distribution of Internet CDN contents, Web service
A kind of calculation machine application field, and in particular to low-power consumption high density clustered computing system.
Background technology
Large data files are distributed into the software such as Hadoop of parallel computation on cluster computer to have been widely used, but it is existing
Technological cluster computer or traditional server, are not designed specially this.Server is answered for large database etc.
The computer of miscellaneous application design, and big data cluster parallel computing is only that large data files piecemeal is stored in into multiple stage computers
On, calculating speed is improved by the entirety of cluster computer, the highdensity cluster computer of low-power consumption can preferably meet
Need.
The defects of prior art blade server, prior art blade server and tower server, rack server ratio
Compared with although improving aggregation density, facilitating plug connection, but still problems with being present：(1) power consumption is high, and cutter module is set
Meter is to meet traditional server multitask, high concurrent complicated applications, using high power consumption CPU and more mechanical hard disk, non-pin
Big data parallel computation is designed, compared with tower or rack-mount server, although reducing volume, convenient plug,
Power consumption does not reduce.(2) aggregation density is low, and the blade server framework of each manufacturer's production is identical, is " the centre back of the body in the middle part of cabinet
Plate ", cutter module are connected from cabinet is previously inserted into " intermediate back-plate ", and " intermediate back-plate " inserts management module, network mould below
Block, power module, radiating module, Cabinet Size is big, can only one side insert 19 inch standard server cabinets, aggregation density is low.
(3) cutter module is unable to independent operating, and power supply, management and the network connection of cutter module are intended to " intermediate back-plate " support, work as knife
Piece module will be unable to independent operating after " intermediate back-plate " extraction.(4) heat dissipation problem, due to " intermediate back-plate " of blade server
Structure, cutter module is from " intermediate back-plate " is previously inserted into, and " intermediate back-plate " inserts radiating module below, by " intermediate back-plate "
Hinder, air is unable to smooth outflow to above, cutter module directly can not be radiated.
The content of the invention
To solve the problems, such as that prior art is present, the utility model provides a kind of low-power consumption high density cluster computer system
System, polylith low-power consumption computer motherboard is inserted into cabinet, be connected composition cluster computer, its cabinet with backboard by CPCI interfaces
Depth is less than the 1 half of 19 inches of racks of standard, can insert 2 cabinets from the front and rear two sides of rack.Heat radiation fan module is located at
The bottom of cabinet, inserting the computer motherboard of cabinet has independent Peripheral Interface and dc power interface, after cabinet extraction
Still can independent operating.
The technical solution adopted in the utility model is：
A kind of low-power consumption high density clustered computing system, multiple stage computers mainboard is arranged in cabinet, the cabinet
Depth is less than 400mm；The cabinet rear portion is provided with backboard, inserts power module in the middle part of cabinet, multiple stage computers mainboard is inserted respectively
It is located at the both sides of power module, cabinet bottom insertion radiating module；Power module interface is provided with the middle part of the backboard, with power supply mould
Block connects；Both sides in the middle part of backboard positioned at power module interface are respectively equipped with the multiple CPCI interfaces being connected with computer motherboard,
It is connected with the CPCI interfaces on computer motherboard and power supply is provided；Backboard bottom is provided with radiating module interface, is connected with radiating module
Power supply is provided；The computer motherboard uses double-sided multi-layer circuit board, its one side arrangement low power consumption CPU and cpu heat, shows
The core of the card piece and display card chip radiator, polylith SSD solid state hard discs；Its another side arranges memory bar and mechanical hard disk；The CPU
Radiator uses built-in fan；CPU TDP is less than 30W；The memory bar is SODIMM internal memories；After the computer motherboard
Portion is another to set an independent external DC DC supply inputs interface power supply in addition to setting CPCI interfaces and powering；
A kind of described low-power consumption high density clustered computing system, VGA, multiple is set before the computer motherboard
USB interface, RJ45 network interfaces, power knob and Reset buttons；CPCI interfaces, independent outer are set behind computer motherboard
Connect DC DC supply inputs interface, multiple USB interfaces, sound interface.
A kind of described low-power consumption high density clustered computing system, memory bar is set on the shell of the computer motherboard
Cover plate, memory bar cover plate is opened, the memory bar on removable computer mainboard.
A kind of described low-power consumption high density clustered computing system, a hard disk is set on the shell of the computer motherboard
Frame, the mechanical hard disk is fixed in hard disk rack, then hard disk rack is fixed on computer motherboard shell, mechanical hard disk and meter
Calculate the laptop hard slot connection in mainboard.
A kind of described low-power consumption high density clustered computing system, the CPCI interfaces on the backboard are at least provided with 12
It is individual.
A kind of low-power consumption high density clustered computing system, the cabinet insert standard server from forward and backward two sides
Rack.
The utility model has the advantages that：
1st, higher density
To make computer motherboard space more compact, the chip such as CPU, SSD solid state hard disc, video card similar in height is placed on master
The one side of plate, another side place internal memory, mechanical hard disk, reduce mainboard width, can insert more computers in the chassis, improve
Cluster computer density.
Computer motherboard is less than 30W low power consumption CPU and built-in fan radiator using TDP, is meeting the base of radiating
Reduce computer motherboard volume on plinth, to insert more computer motherboards in cabinet, improve cluster computer density.
Radiating module is arranged in cabinet bottom, rather than it is arranged in cabinet rear portion, cabinet depth dimensions is reduced with this.Machine
Case depth is 370mm, less than the half depth 400mm of standard server rack, so, can insert 2 from former and later two directions
Cabinet is to standard server rack.Compared with blade server, 1 times of density can be improved under equal special case.
Cabinet does not have " mixed-media network modules mixed-media ", " management module ", and computer is directly exchanged by RJ45 interfaces above with outside
Machine is attached, and the management to cluster is realized by software, and the space vacateed can be inserted into more mainboards in cabinet, carry
The density of high cluster computer.
2nd, low-power consumption
Mainboard using TDP be less than 30W low power consumption CPU, notebook SODIMM internal memories and hard disk, do not have " management module ",
" mixed-media network modules mixed-media ", reduce the total power consumption of cluster computer.
3rd, it is simple in construction, cost is low
Prior art blade server uses " intermediate back-plate ", connects cutter module before it, behind connection management module,
The structure of mixed-media network modules mixed-media, radiating module, " intermediate back-plate " need to arrange complicated digital signal circuit, and manufacturing cost is high, structure
It is complicated.The utility model backboard does not transmit data signal, and only dc source connects up, and simple in construction, cost is low.
4th, more preferable radiating
Prior art blade server is " intermediate back-plate " structure, and radiating module is located at behind " intermediate back-plate ", blade
Module is located at before " intermediate back-plate ",, can not be right before air can not swimmingly be flow to by the obstruction of " intermediate back-plate "
Cutter module directly radiates.The utility model radiating module is located at cabinet bottom, and directly cabinet Computer mainboard is uniformly dissipated
Heat, there is more preferable radiating effect.
5th, using flexible
The cutter module of prior art blade server is needed by " intermediate back-plate " connection " mixed-media network modules mixed-media ", " power supply mould
Block ", " management module " can just be run, and cutter module is unable to independent operating after cabinet extraction.Computer of the present utility model
Mainboard is additionally provided with independent D/C power interface, RJ45 network interfaces, VGA and shows and connect in addition to the CPCI interfaces power supply on backboard
Mouth, USB interface, still can independent operating after cabinet extraction.Both can be by insertion cabinet composition cluster, can also be as independent meter
Calculation machine is run, and cabinet can also insert rack from former and later two directions, have higher using flexible.
The 6th, the SSD of polylith M2 interfaces is installed, to be calculated suitable for big data
The utility model configures the high speed SSD solid state hard discs of polylith M2 interfaces on mainboard, more data can be deposited
It is placed on high speed SSD solid state hard discs, improves big data calculating speed.
Brief description of the drawings
A kind of cabinet assembling schematic diagram of low-power consumption high density clustered computing system of Fig. 1 the utility model.
A kind of low-power consumption high density clustered computing system Computer mainboard layout drawing A faces of Fig. 2 the utility model.
A kind of low-power consumption high density clustered computing system Computer mainboard layout drawing B faces of Fig. 3 the utility model.
A kind of cabinet insertion rack schematic diagram of low-power consumption high density clustered computing system of Fig. 4 .1 the utility model.
Fig. 4 .2 are front view shown in Fig. 4 .1.
Fig. 4 .3 are side view shown in Fig. 4 .1.
A kind of low-power consumption high density clustered computing system dorsulum interface schema of Fig. 5 the utility model.
A kind of low-power consumption high density clustered computing system Computer mainboard interface figure A faces of Fig. 6 .1 the utility model.
A kind of low-power consumption high density clustered computing system Computer mainboard interface figure B faces of Fig. 6 .2 the utility model.
A kind of Cabinet Size figure of low-power consumption high density clustered computing system of Fig. 7 the utility model.
Wherein：1- cabinets, 2- computer motherboards, 3- backboards, 4- power modules, 5- radiating modules, 6-AC power supplys in, 7-
508 serial golden finger sockets I, 8-CPCI interfaces, 9-508 series golden finger socket II, 10- mechanical hard disks, 11- racks, 12-
Cpu heat, 13- display card chip radiators, 14- computer motherboard shells, 15- memory bar cover plates, 16- hard disk racks, 17- notes
This hard disk slot, 18-DDR3 internal memory sockets, 19- cover plates.
Embodiment
As shown in figure 1, multiple stage computers mainboard 2 is arranged in cabinet 1, cabinet 1 sets backboard 3, the middle part of cabinet 1 below
Power module 4 is inserted, power module 4 is connected with backboard 3, the connection external power sources of AC power supplies in 6 on power module 4, carries out A/
D is changed, and provides DC dc sources by backboard 3 for the equipment in cabinet 1.In the both sides of power module 4, insertion calculates owner
Plate 2, radiating module 5 is inserted in the bottom of cabinet 1.
As shown in figure 5, the middle part of backboard 3 sets 508 serial golden finger sockets I 7 to be used to connect power module 4, power module 4
Interface both sides set CPCI interfaces 8, are connected with the CPCI interfaces as shown in Fig. 6 .1 on computer motherboard, are computer power supply.This
12 CPCI interfaces 8 are set altogether on embodiment dorsulum 3, and this is that the quantity of minimum CPCI interfaces 8 limits.
As shown in figure 1, radiating module 5 is inserted in the bottom of cabinet 1, the 508 golden hands of series with the bottom right face of backboard 3 as shown in Figure 5
Refer to socket II9 connections, radiating module 5 is powered by backboard 3, and radiating is provided for equipment in cabinet 1.
As shown in Fig. 6 .1,6.2, computer motherboard 2 uses double-sided multi-layer circuit board；As shown in Fig. 2 computer motherboard has
There is shell 14, the chip such as CPU and cpu heat 12, video card and display card chip radiator 13 are arranged in computer motherboard A faces
With 3 SSD solid state hard discs, and fastened by cover plate 19 and computer motherboard shell 14；As shown in Figure 2,3, in computer motherboard B
Face arrangement DDR3 internal memories 18 and 2.5 inches of notebook mechanical hard disks 10, and by memory bar cover plate 15 and hard disk rack 16 with calculating
Mainboard shell 14 fastens；To reduce the volume of computer motherboard 2, reducing power consumption, memory bar uses SODIMM internal memories.Such as Fig. 2 institutes
Show that there is detachable memory bar cover plate 15 on computer motherboard shell 14, after unloading memory bar cover plate 15, load and unload such as Fig. 3 institutes
Show the memory bar on the DDR3 internal memory sockets 18 on computer motherboard 2.As shown in Fig. 2 setting one is removable on computer motherboard 2
Formula hard disk rack 16 is unloaded, mechanical hard disk 10 is fixed in hard disk rack 16, then hard disk rack 16 is fixed on computer motherboard shell 14
On, it is connected with the laptop hard slot 17 on computer motherboard 2 as shown in Figure 3.
As shown in fig. 7, the depth of cabinet 1 is 370mm, width 440mm.But 370mm is not the restriction to cabinet depth,
User can be designed as needed, as long as the half 400mm no more than standard server cabinet depth 800mm.
As shown in Fig. 4 .1,4.2,4.3, the depth of cabinet 1 is less than standard server rack half depth, can be from forward and backward two
Two cabinets 1 in 19 inch standard server cabinets 11 are inserted in individual direction.
As shown in Fig. 6 .1 and 6.2, computer motherboard 2 above sets VGA, multiple USB interfaces, RJ45 network interfaces, power supply
Button and Reset buttons；Set below independent external DC 12V 5A DC supply inputs interface, CPCI interfaces, multiple USB,
Sound output interface.Computer motherboard 2 is powered after the extraction of cabinet 1 by DC 12V 5A DC supply input interfaces.
As shown in Fig. 2 computer motherboard 2 is less than 30W low power consumption CPU using heat power consumption TDP, cpu heat 12 uses
Small size fan, is embedded among fin, on the basis of meeting to radiate, reduces computer motherboard volume.
As shown in Fig. 6 .1 and figure .2, computer motherboard 2 can install polylith solid-state hard disk SSD, and the present embodiment installs 3 pieces of M2
The high speed SSD solid state hard discs of interface, are quickly calculated to be specially adapted for big data.
Claims (6)
1. a kind of low-power consumption high density clustered computing system, multiple stage computers mainboard is arranged in cabinet, it is characterised in that：
The cabinet depth is less than 400mm；The cabinet rear portion is provided with backboard, and power module, multiple stage computers master are inserted in the middle part of cabinet
Plate is plugged in the both sides of power module, cabinet bottom insertion radiating module respectively；Power module interface is provided with the middle part of the backboard,
It is connected with power module；Be respectively equipped with positioned at the both sides of power module interface in the middle part of backboard be connected with computer motherboard it is multiple
CPCI interfaces, it is connected with the CPCI interfaces on computer motherboard and power supply is provided；Backboard bottom is provided with radiating module interface, with radiating
Module connection provides power supply；The computer motherboard uses double-sided multi-layer circuit board, its one side arrangement low power consumption CPU and CPU
Radiator, display card chip and display card chip radiator, polylith SSD solid state hard discs；Its another side arranges that memory bar and machinery are hard
Disk；The cpu heat uses built-in fan；CPU TDP is less than 30W；The memory bar is SODIMM internal memories；The meter
Owner's postlaminar part is calculated in addition to CPCI interfaces are set and powered, it is another to set an independent external DC DC supply inputs interface to supply
Electricity.
A kind of 2. low-power consumption high density clustered computing system as claimed in claim 1, it is characterised in that：In the computer
VGA, multiple USB interfaces, RJ45 network interfaces, power knob and Reset buttons are set before mainboard；Set behind computer motherboard
Put CPCI interfaces, independent external DC DC supply inputs interface, multiple USB interfaces, sound interface.
A kind of 3. low-power consumption high density clustered computing system as claimed in claim 1, it is characterised in that：The calculating owner
Memory bar cover plate is set on the shell of plate, opens memory bar cover plate, the memory bar on removable computer mainboard.
A kind of 4. low-power consumption high density clustered computing system as claimed in claim 1, it is characterised in that：The calculating owner
One hard disk rack is set on the shell of plate, the mechanical hard disk is fixed in hard disk rack, then hard disk rack is fixed on and calculates owner
On plate shell, mechanical hard disk is connected with the laptop hard slot on computer motherboard.
A kind of 5. low-power consumption high density clustered computing system as claimed in claim 1, it is characterised in that：On the backboard
CPCI interfaces are at least provided with 12.
A kind of 6. low-power consumption high density clustered computing system as claimed in claim 1, it is characterised in that：Described cabinet the past,
Two sides insertion standard server rack afterwards.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720745703.6U CN206833336U (en) | 2017-06-26 | 2017-06-26 | A kind of low-power consumption high density clustered computing system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720745703.6U CN206833336U (en) | 2017-06-26 | 2017-06-26 | A kind of low-power consumption high density clustered computing system |
Publications (1)
| Publication Number | Publication Date |
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| CN206833336U true CN206833336U (en) | 2018-01-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720745703.6U Expired - Fee Related CN206833336U (en) | 2017-06-26 | 2017-06-26 | A kind of low-power consumption high density clustered computing system |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111427833A (en) * | 2020-05-26 | 2020-07-17 | 林沧 | Server cluster |
| CN112445290A (en) * | 2020-12-07 | 2021-03-05 | 兰州大学 | Distributed cloud computer |
| CN113434348A (en) * | 2021-06-25 | 2021-09-24 | 成都中微达信科技有限公司 | Chip interconnection test platform |
| CN115686147A (en) * | 2022-10-26 | 2023-02-03 | 超聚变数字技术有限公司 | Memory card and computing equipment |
-
2017
- 2017-06-26 CN CN201720745703.6U patent/CN206833336U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111427833A (en) * | 2020-05-26 | 2020-07-17 | 林沧 | Server cluster |
| CN112445290A (en) * | 2020-12-07 | 2021-03-05 | 兰州大学 | Distributed cloud computer |
| CN113434348A (en) * | 2021-06-25 | 2021-09-24 | 成都中微达信科技有限公司 | Chip interconnection test platform |
| CN115686147A (en) * | 2022-10-26 | 2023-02-03 | 超聚变数字技术有限公司 | Memory card and computing equipment |
| CN115686147B (en) * | 2022-10-26 | 2024-07-19 | 超聚变数字技术有限公司 | Memory card and computing device |
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180102 |