WO2024045307A1 - 显示面板及其制备方法、显示装置 - Google Patents

显示面板及其制备方法、显示装置 Download PDF

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Publication number
WO2024045307A1
WO2024045307A1 PCT/CN2022/128349 CN2022128349W WO2024045307A1 WO 2024045307 A1 WO2024045307 A1 WO 2024045307A1 CN 2022128349 W CN2022128349 W CN 2022128349W WO 2024045307 A1 WO2024045307 A1 WO 2024045307A1
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Prior art keywords
layer
inorganic
substrate
light
display panel
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PCT/CN2022/128349
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English (en)
French (fr)
Inventor
彭兆基
张浩瀚
甘帅燕
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Kunshan Govisionox Optoelectronics Co Ltd
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Kunshan Govisionox Optoelectronics Co Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/14—Carrier transporting layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks

Definitions

  • the present application belongs to the field of display technology, and in particular relates to a display panel, a preparation method thereof, and a display device.
  • OLED Organic Light-Emitting Diode
  • OLED has many characteristics such as low driving voltage, active light emission, wide viewing angle, high efficiency, fast response speed, easy to realize full-color large-area wall-mounted display and flexible display, and gradually replaces liquid crystal display (LCD) display.
  • LCD liquid crystal display
  • the OLED display panel includes a common layer that is continuous over the entire surface.
  • the common layer has lateral leakage problems, causing crosstalk between adjacent sub-pixels and affecting the display quality of the display panel.
  • Embodiments of the present application provide a display panel, a preparation method thereof, and a display device to improve the phenomenon of abnormal light emission of sub-pixels due to lateral current and improve the display quality of the display panel.
  • the embodiment of the first aspect of the embodiment of the present application provides a display panel, including:
  • the inorganic functional layer includes multiple inorganic layers stacked along the thickness direction of the display panel.
  • the multiple inorganic layers penetrate along the thickness direction of the display panel to form pixel openings.
  • the multi-layer inorganic layer at least includes a first inorganic layer and a second inorganic layer located on the side of the first inorganic layer facing away from the substrate, and the orthographic projection area of the second inorganic layer on the substrate is greater than The orthogonal projected area of the first inorganic layer on the substrate;
  • a carrier layer is located on a side of the inorganic functional layer facing away from the substrate.
  • the carrier layer includes a first portion located on a side of the inorganic functional layer facing away from the substrate and a third portion located in the pixel opening. Two parts, the first part and the second part are arranged spaced apart from each other.
  • the display panel includes a plurality of light-emitting units, the light-emitting unit includes at least one light-emitting device, the light-emitting device includes a light-emitting layer located at the pixel opening, the carrier layer Located on the side of the light-emitting layer facing and/or away from the substrate;
  • the carrier layer includes: a hole injection transport layer, the hole injection transport layer is located on the side of the light-emitting layer facing the substrate; and/or an electron injection transport layer, the electron injection transport layer
  • the transmission layer is located on a side of the light-emitting layer facing away from the substrate.
  • the light-emitting unit includes a plurality of the light-emitting devices, the plurality of the light-emitting devices are stacked along the thickness direction of the display panel, and are arranged between adjacent light-emitting devices.
  • There is a charge generation layer the charge generation layer includes a third part located on the side of the inorganic functional layer facing away from the substrate and a fourth part located in the pixel opening, the third part and the fourth part Mutual interval settings;
  • the light-emitting unit when the light-emitting unit includes two light-emitting devices, the light-emitting unit includes a first electrode, a first light-emitting device, the charge generation layer, a second light-emitting layer, and a first electrode, a first light-emitting device, a first light-emitting device, a first light-emitting device, a first light-emitting device, a second light-emitting device, and a second light-emitting device.
  • the first light-emitting device includes a first hole injection transport layer, a first light-emitting layer, and a first electron injection transport layer that are stacked in a direction away from the substrate
  • the second light-emitting device It includes a second hole injection and transport layer, a second luminescent layer and a second electron injection and transport layer that are stacked in a direction away from the substrate.
  • the first inorganic layer includes SiO x1 N y1
  • the second inorganic layer includes SiO x2 N y2 , where x1 is greater than x2, y1 is less than y2, and both x2 and y1 Greater than or equal to 0.
  • the shape of the inner wall surface of the inorganic functional layer facing the pixel opening is a plane, and one of the angles formed by the inner wall surface and the substrate faces the pixel opening.
  • the angle between the two sides is less than 90°; or,
  • the shape of the inner wall surface is a curved surface, and the curved surface protrudes in a direction away from the pixel opening; or,
  • the shape of the inner wall surface is a stepped surface.
  • the embodiment of the second aspect of the present application also provides a method for preparing a display panel, including:
  • An inorganic functional layer is formed on a side of the first electrode facing away from the substrate.
  • the inorganic functional layer includes multiple inorganic layers stacked along the thickness direction of the display panel.
  • the multiple inorganic layers include at least a first inorganic layer and a the second inorganic layer on the side of the first inorganic layer facing away from the substrate;
  • a pixel opening is formed in the inorganic functional layer at a position opposite to the first electrode, and the pixel opening penetrates the inorganic functional layer along the thickness direction of the display panel, so that the second inorganic layer is in the
  • the orthographic projection area on the substrate is larger than the orthographic projection of the first inorganic layer on the substrate;
  • a carrier layer is formed on a side of the inorganic functional layer facing away from the substrate.
  • the carrier layer includes a first portion located on a side of the inorganic functional layer facing away from the substrate and a third portion located in the pixel opening. Two parts, the first part and the second part are arranged spaced apart from each other.
  • an inorganic functional layer is formed on a side of the first electrode facing away from the substrate.
  • the inorganic functional layer includes multiple inorganic layers stacked along the thickness direction of the display panel.
  • the step of layering an inorganic layer including at least a first inorganic layer and a second inorganic layer located on the side of the first inorganic layer facing away from the substrate includes:
  • the inorganic functional layer is formed using a chemical vapor deposition process, and the inorganic functional layer is formed in a multi-layer stack by controlling the composition of the reaction gas and the power of the electric field at different times.
  • the reaction speed of the multiple inorganic layers and the same etching medium gradually decreases in a direction away from the substrate.
  • a pixel opening is formed in the inorganic functional layer at a position opposite to the first electrode, and the pixel opening penetrates the inorganic functional layer along the thickness direction of the display panel.
  • Functional layer, so that the orthographic projection area of the second inorganic layer on the substrate is larger than the orthographic projection of the first inorganic layer on the substrate includes:
  • An etching barrier layer is formed on a side of the inorganic functional layer facing away from the substrate, where the etching barrier layer includes a first opening opposite to the pixel opening;
  • the area of the inorganic functional layer opposite to the first opening is etched through an etching medium, which includes etching liquid and/or etching gas.
  • the embodiment of the third aspect of the present application also provides a display device, including any display panel provided by the first aspect of the present application.
  • an inorganic functional layer is provided on the substrate, and pixel openings are provided on the inorganic functional layer.
  • the inorganic functional layer includes multiple inorganic layers, and the multiple inorganic layers include at least a first inorganic layer and a second inorganic layer.
  • the second inorganic layer is located on the side of the first inorganic layer facing away from the substrate, and the orthographic projection area of the second inorganic layer on the substrate is greater than the orthographic projection area of the first inorganic layer on the substrate, so that the cross-section of the pixel opening along the thickness direction of the display panel In the direction parallel to the light-emitting surface of the display panel, the size of the portion of the pixel opening located in the second inorganic layer is smaller than the size of the portion located in the first inorganic layer.
  • the display panel also includes a carrier layer located on the side of the inorganic functional layer facing away from the substrate.
  • the above-mentioned pixel opening separates the carrier layer into a first part located on the side of the inorganic functional layer facing away from the substrate and a second part located within the pixel opening.
  • the first part and the second part are spaced apart from each other, thereby improving the lateral transfer of current in the carrier layer, improving the crosstalk problem between sub-pixels, and improving the display quality of the display panel.
  • the inorganic functional layer includes multiple inorganic layers, the preparation process of the multiple inorganic layers can be performed simultaneously, and the etching process of the multiple inorganic layers can also be performed simultaneously, thereby forming the inorganic functional layer. And when the pixel is opened, the preparation process can be reduced and the carrier layer can be well isolated.
  • Figure 1 is a schematic structural diagram of a display panel provided by an embodiment of the present application.
  • FIG. 2 is a schematic structural diagram of another display panel provided by an embodiment of the present application.
  • FIG. 3 is a schematic structural diagram of another display panel provided by an embodiment of the present application.
  • Figure 4 is a schematic structural diagram of another display panel provided by an embodiment of the present application.
  • Figure 5 is a schematic structural diagram of some film layers of another display panel provided by an embodiment of the present application.
  • Figure 6 is a schematic structural diagram of some film layers of another display panel provided by an embodiment of the present application.
  • Figure 7 is a schematic structural diagram of some film layers of another display panel provided by an embodiment of the present application.
  • Figure 8 is a schematic structural diagram of some film layers of another display panel provided by an embodiment of the present application.
  • Figure 9 is a schematic structural diagram of some film layers of another display panel provided by an embodiment of the present application.
  • Figure 10 is a schematic structural diagram of some film layers of another display panel provided by an embodiment of the present application.
  • Figure 11 is a schematic flow chart of a method for manufacturing a display panel provided by an embodiment of the present application.
  • Figures 12 to 17 are schematic diagrams of film layer changes in a method for manufacturing a display panel provided by embodiments of the present application.
  • Figure 18 is a schematic structural diagram of a display device provided by an embodiment of the present application.
  • 1-display panel 101-substrate; 102-drive circuit layer; 103-planarization layer; 10-substrate 11-inorganic functional layer; 12-inorganic layer; 121-first inorganic layer; 122-second inorganic layer; 13-pixel opening; 14-carrier layer; 141-first part; 142-second part; 15-first electrode; 16-hole injection transport layer; 161-first hole injection transport layer; 162-th Two hole injection and transport layers; 17-luminescent layer; 171-first luminescent layer; 172-second luminescent layer; 22-charge generation layer; 18-electron injection and transport layer; 181-first electron injection and transport layer; 182- Second electron injection transport layer; 19-second electrode; 20-support layer; 21-etching barrier layer; 2-display device.
  • the OLED display panel includes a first electrode, a second electrode and a luminescent layer located between the first electrode and the second electrode.
  • the luminescent layer includes a common layer that is continuous over the entire surface. Since the common layer is continuously provided over the entire surface, Therefore, when some sub-pixels emit light, current can be transferred to adjacent sub-pixels through the common layer, which may easily cause the adjacent sub-pixels to emit light abnormally, that is, crosstalk occurs between adjacent sub-pixels. That is, the lateral current in the common layer will cause the sub-pixels to turn on abnormally, causing impure chromaticity or uneven display, seriously affecting the display effect.
  • the inventor provides a display panel, a preparation method thereof, and a display device to improve the phenomenon of abnormal light emission of sub-pixels caused by lateral current and improve the display quality of the display panel.
  • an embodiment of the present application provides a display panel 1 , including a substrate 10 , an inorganic functional layer 11 and a carrier layer 14 .
  • the inorganic functional layer 11 is provided on the substrate 10.
  • the inorganic functional layer 11 includes a multi-layer inorganic layer 12 stacked along the thickness direction of the display panel 1 and a pixel opening 13 provided through the thickness direction of the display panel 1.
  • At least one of the multi-layer inorganic layers 12 is It includes a first inorganic layer 121 and a second inorganic layer 122 located on the side of the first inorganic layer 121 facing away from the substrate 10 .
  • the orthogonal projected area of the second inorganic layer 122 on the substrate 10 is larger than the orthogonal projected area of the first inorganic layer 121 on the substrate 10 . shadow area.
  • the carrier layer 14 is located on the side of the inorganic functional layer facing away from the substrate 10 .
  • the carrier layer 14 includes a first part 141 located on the side of the inorganic functional layer 11 facing away from the substrate 10 and a second part 142 located in the pixel opening 13 .
  • the first part 141 and the second portion 142 are spaced apart from each other.
  • an inorganic functional layer 11 is provided on the substrate 10, and a pixel opening 13 is provided on the inorganic functional layer 11.
  • the inorganic functional layer 11 includes a multi-layer inorganic layer 12, and the multi-layer inorganic layer 12 includes at least a third An inorganic layer 121 and a second inorganic layer 122.
  • the second inorganic layer 122 is located on the side of the first inorganic layer 121 away from the substrate 10.
  • the orthogonal projected area of the second inorganic layer 122 on the substrate 10 is larger than that of the first inorganic layer 121 on the substrate.
  • the display panel 1 also includes a carrier layer 14 located on the side of the inorganic functional layer 11 facing away from the substrate 10 .
  • the above-mentioned pixel opening 13 separates the carrier layer 14 into a first portion 141 located on the side of the inorganic functional layer 11 facing away from the substrate 10 and
  • the second part 142 located in the pixel opening 13, the first part 141 and the second part 142 are spaced apart from each other, thereby improving the lateral transfer of current in the carrier layer 14 and improving the crosstalk problem between sub-pixels. Improved the display quality of display panel 1.
  • the inorganic functional layer 11 includes a multi-layer inorganic layer 12, the preparation process of the multi-layer inorganic layer 12 can be performed simultaneously, and the etching process of the multi-layer inorganic layer 12 can also be performed simultaneously, so that When the inorganic functional layer 11 and the pixel opening 13 are formed, the preparation process can be reduced and the carrier layer 14 can be well isolated.
  • the display panel 1 includes a plurality of light-emitting units A.
  • the light-emitting units A include a first electrode 15 and a second electrode 19 located between the first electrode 15 and the second electrode 19 .
  • the light-emitting device B includes a hole injection transport layer 16, an electron injection transport layer 18 and a light-emitting layer 17.
  • the hole injection transport layer 16, the electron injection transport layer 18 and the light-emitting layer 17 are stacked on the first Between the electrode 15 and the second electrode 19, the light-emitting layer 17 is located between the hole injection and transport layer 16 and the electron injection and transport layer 18.
  • the first electrode 15 can be an anode and the second electrode 19 can be a cathode. This application does not Specially limited.
  • the first electrode 15 is an anode
  • the first electrodes 15 are formed on the substrate 10 and are patterned in plurality.
  • the pixel openings 13 in the inorganic functional layer 11 are arranged in one-to-one correspondence with the first electrodes 15. Each pixel opening 13 exposes the central position of one first electrode 15, and the edge of each first electrode 15 is covered by the inorganic functional layer 11.
  • the second electrode 19 is a cathode and is a continuous film layer arranged on the entire surface.
  • the display panel 1 includes a plurality of sub-pixels, and each sub-pixel includes one of the above-mentioned light-emitting units A.
  • the light-emitting unit A includes a light-emitting layer 17 , and the light-emitting layer 17 is located in the pixel opening 13 .
  • the inorganic functional layer 11 plays the role of defining pixels.
  • Each pixel opening 13 defines a sub-pixel (light-emitting unit A).
  • the inorganic functional layer 11 also plays the role of blocking the carrier layer 14, thereby improving the lateral leakage caused by The problem of crosstalk between adjacent sub-pixels.
  • the carrier layer 14 is located on a side of the light-emitting layer 17 facing and/or away from the substrate 10 .
  • the carrier layer 14 includes: a hole injection and transport layer 16 located on the side of the light-emitting layer 17 facing the substrate 10 ; and/or, as shown in FIG. 3 , it also includes electrons.
  • the electron injection and transport layer 18 is located on the side of the light-emitting layer 17 away from the substrate 10 .
  • Each light-emitting unit A provides the necessary conditions for light emission for the light-emitting layer 17 through the hole injection and transport layer 16 and the electron injection and transport layer 18.
  • the hole injection and transport layer 16 is blocked by the pixel opening 13 of the inorganic functional layer 11, thereby reducing the third
  • the probability of the current in one electrode 15 passing through the hole injection transport layer 16 laterally improves the crosstalk phenomenon between adjacent light-emitting units, making the display effect of the display panel 1 better; and/or, the electron injection transport layer 18 passes through
  • the pixel openings 13 of the inorganic functional layer 11 are blocked, thereby reducing the probability of lateral transmission of the current in the second electrode 19 through the electron injection transport layer 18, improving the crosstalk phenomenon between adjacent light-emitting units, and making the display of the display panel 1 Better results.
  • the hole injection and transport layer 16 includes at least one of a hole injection layer (HIL), a hole transport layer (HTL) and an electron blocking layer (EBL).
  • the electron injection and transport layer 18 includes at least one of an electron injection layer (EIL), an electron transport layer (ETL), and a hole blocking layer (HBL).
  • At least part of the film layers in the hole injection transport layer 16 is blocked by the barrier structure, so that the partial communication area of at least part of the film layers in the hole injection transport layer 16 and corresponding to different light-emitting units is reduced, and /Or, at least part of the film layers in the electron injection and transport layer 18 is blocked by a barrier structure, so that the connection area between at least some of the films in the electron injection and transport layer 18 and corresponding to different light-emitting units is reduced, thereby improving adjacent light-emitting units.
  • the crosstalk phenomenon between them makes the display effect of the display panel 1 better.
  • each light-emitting unit A only includes one light-emitting device B.
  • each light-emitting unit A includes a plurality of light-emitting devices B.
  • the plurality of light-emitting devices B are stacked along the thickness direction of the display panel, and are arranged between adjacent light-emitting devices B.
  • Each light-emitting device B includes a hole injection and transport layer 16, an electron injection and transport layer 18 and a light-emitting layer 17.
  • the hole injection and transport layer 16 is located on a side of the light-emitting layer 17 facing the substrate.
  • the electron injection and transport layer 18 is located on the side of the light-emitting layer 17 facing away from the substrate.
  • the light-emitting devices B adjacent in the thickness direction of the display panel are electrically connected through the charge generation layer 22 .
  • the charge generation layer 22 includes a third portion located on the side of the inorganic functional layer 11 facing away from the substrate 10 and a fourth portion located within the pixel opening 13 . The third portion and the fourth portion are spaced apart from each other.
  • the above embodiment is a stacked OLED device.
  • one light-emitting unit A includes a plurality of light-emitting devices B stacked along the thickness direction of the display panel. Adjacent light-emitting devices B are electrically connected through the charge generation layer 22. Therefore, the brightness of the light-emitting unit A can be improved.
  • the material of the charge generation layer 22 can be an organic material, specifically a polymer resin material, which is not particularly limited in this application.
  • the charge generation layer 22 can also be separated into a third part and a fourth part separated from each other through the pixel opening 13 of the inorganic functional layer 11 , and the third part is located away from the substrate of the inorganic functional layer 11 On the 10 side, the fourth part is located within the pixel opening 13, thereby improving the flow of lateral current in the charge generation layer 172 of different light-emitting units and further reducing the crosstalk problem between adjacent light-emitting units.
  • the light-emitting unit A includes two light-emitting devices B.
  • the two light-emitting devices B may include a first light-emitting device B1 and a second light-emitting device B2.
  • the light-emitting unit A includes a first electrode 15 stacked in a direction away from the substrate 10 , the first light-emitting device B1, the charge generation layer 22, the second light-emitting device B2, and the second electrode 19, wherein the first light-emitting device B1 includes a first hole injection transport layer 161, a first hole injection transport layer 161 stacked in a direction away from the substrate 10
  • the light-emitting layer 171, the first electron injection and transport layer 181, and the second light-emitting device B2 include a second hole injection and transport layer 162, a second light-emitting layer 172, and a second electron injection and transport layer 182 stacked in a direction away from the substrate 10.
  • the thickness of the inorganic functional layer 11 may be Specifically, the thickness of the inorganic functional layer 11 may be Etc., this application is not specifically limited. So that the pixel opening 13 of the inorganic functional layer 11 blocks the hole injection transport layer 16 and/or the electron injection transport layer 18.
  • the carrier layer (including the hole injection layer) in at least one light-emitting device is The transport layer 16 and/or the electron injection transport layer 18) are isolated.
  • the charge generation layer 22 can be isolated simultaneously to further improve the crosstalk problem between sub-pixels while ensuring the continuity of the second electrode 19.
  • the thickness of the inorganic functional layer 11 can be set according to the thickness of the film layer that needs to be isolated. This application does not specifically limit the thickness, and the upper limit of the thickness of the inorganic functional layer 11 cannot exceed each light-emitting unit and the second electrode. The total thickness of the second electrode 19 is required to ensure the continuity of the second electrode 19.
  • the first inorganic layer 121 includes SiO x1 N y1
  • the second inorganic layer 122 includes SiO x2 N y2 , where x1 is greater than x2, y1 is less than y2, and both x2 and y1 are greater than or equal to 0.
  • the first inorganic layer 121 and the second inorganic layer 122 included in the inorganic functional layer 11 are both nitrogen, oxygen, and silicon compounds. Compared with the first inorganic layer 121, the second inorganic layer 122 has a lower oxygen content.
  • the nitrogen content increases, and the oxygen content is at least zero; compared with the first inorganic layer 121 and the second inorganic layer 122, the nitrogen content is reduced, the oxygen content is increased, and the nitrogen content is at least zero; so that the reaction with the same etching medium
  • the speed of the second inorganic layer 122 is smaller than that of the first inorganic layer 121 , so that the distance between the portion of the formed pixel opening 13 located on the first inorganic layer 121 and parallel to the light-emitting surface of the display panel 1 is larger than that of the portion located on the second inorganic layer 122
  • the spacing along the edge is parallel to the light-emitting surface of the display panel 1, so that the carrier layer 14 can be blocked by the pixel opening 13 to improve the lateral transmission of lateral leakage current.
  • the shape of the inner wall surface of the inorganic functional layer 11 facing the pixel opening 13 is a plane, and the angle between the inner wall surface and the substrate 10 is formed on the side facing the pixel opening 13 .
  • the angle is less than 90°. That is, the cross section of the pixel opening 13 along the thickness direction of the display panel 1 is trapezoidal.
  • the shape of the inner wall surface of the inorganic functional layer 11 facing the pixel opening 13 is a curved surface, and the curved surface protrudes in a direction away from the pixel opening 13 .
  • the inorganic functional layer 11 may include multiple layers of inorganic layers 12 , and the multiple layers of inorganic layers 12 may all be nitrogen, oxygen, or silicon compounds.
  • the nitrogen content of the multiple layers of inorganic layers 12 Gradually increase, and the oxygen content gradually decreases.
  • the nitrogen content and oxygen content of the multi-layer inorganic layer 12 change differently in the direction away from the substrate 10 , resulting in differences in the shapes of the pixel openings 13 formed.
  • the multi-layer inorganic layer 12 includes the first inorganic layer 121 and the second inorganic layer 122, the second inorganic layer 122 is located on the side of the first inorganic layer 121 facing away from the substrate 10, and the distance between the pixel opening 13 located on the second inorganic layer 122 is smaller than that of the first inorganic layer 121 spacing, which can be used to isolate the carrier layer 14.
  • the shape of the inner wall surface of the inorganic functional layer 11 facing the pixel opening 13 is a stepped surface.
  • the number of steps may be one or more, which is not specifically limited in this application.
  • the inorganic functional layer 11 may include two stacked inorganic layers 12 , namely a first inorganic layer 121 and a second inorganic layer 122 . Between the first inorganic layer 121 and the second inorganic layer 122 The junction forms a staircase.
  • the inorganic functional layer 11 may include four layers of inorganic layers 12 arranged in a stack. Specifically, it may include a first inorganic layer 121 , a second inorganic layer 122 , and a first inorganic layer 121 arranged in a direction away from the substrate 10 . and the second inorganic layer 122 are not specifically limited in this application.
  • a support layer 20 for supporting the mask plate is also formed on the side of the inorganic functional layer 11 away from the substrate 10.
  • the support layer 20 supports the mask plate and can Prevent the mask from contacting the underlying film layer during the evaporation process and causing damage to the underlying film layer.
  • This application also provides a method for preparing the display panel 1, as shown in Figure 11, including:
  • the substrate 10 includes a substrate 101, a drive circuit layer 102 located on the substrate, a planarization layer 103 located on the side of the drive circuit layer away from the substrate, etc.
  • the first electrode 15 is formed on the planarization layer 103 and is in contact with the drive circuit.
  • Driver circuits within layer 102 are electrically connected.
  • the inorganic functional layer 11 includes a multi-layer inorganic layer 12 stacked along the thickness direction of the display panel 1.
  • the multi-layer inorganic layer 12 at least includes the first inorganic layer 11.
  • the layer 121 and the second inorganic layer 122 located on the side of the first inorganic layer 121 facing away from the substrate 10 are shown in FIG. 13 .
  • the carrier layer 14 forms the carrier layer 14 on the side of the inorganic functional layer 11 facing away from the substrate 10.
  • the carrier layer 14 includes a first portion 141 located on the side of the inorganic functional layer 11 facing away from the substrate 10 and a second portion located within the pixel opening 13. 142, the first part 141 and the second part 142 are spaced apart from each other, as shown in Figure 17 .
  • an inorganic functional layer 11 is formed on the side of the first electrode 15 facing away from the substrate 10.
  • the inorganic functional layer 11 includes a stacked multi-layer inorganic layer 12.
  • the multi-layer inorganic layer 12 is formed The process can be prepared in one process, which simplifies the preparation process and saves preparation time; the pixel opening 13 is formed on the inorganic functional layer 11, so that the second inorganic layer 122 located on the side of the first inorganic layer 121 facing away from the substrate 10 is The orthographic projection area on the substrate 10 is larger than the orthographic projection of the first inorganic layer 121 on the substrate 10, so that the carrier layer 14 is partitioned into a first portion 141 located on the side of the inorganic functional layer 11 away from the substrate 10 and a first portion 141 located at the pixel opening.
  • the second part 142 within 13 thereby improves the problem of crosstalk between sub-pixels.
  • the pixel opening 13 in the inorganic functional layer 11 exposes the first electrode 15. That is, the inorganic functional layer 11 not only blocks the carrier layer 14 but also plays a role in defining the pixels.
  • the multiplexing of the inorganic functional layer 11 is simplified.
  • the structure of the display panel 1 simplifies the preparation process of the display panel 1 and saves manufacturing costs.
  • step S200 includes:
  • the inorganic functional layer 11 is formed using a chemical vapor deposition process, and a multi-layer inorganic layer 12 is formed by controlling the composition of the reaction gas and the power of the electric field at different times.
  • the growth of the inorganic layer 12 can be performed by changing the ratio of N 2 O and SiH 4 and the power of the electric field and other film-forming parameters, so that a multi-layer laminated inorganic layer 12 with different composition ratios of Si, O, and N is generated.
  • the components of the multi-layer inorganic layer 12 are all SiO x N y , where x can be 0 to 2, and y can be 0 to 1.33.
  • the reaction speed of the multi-layer inorganic layer 12 and the same etching medium gradually decreases in the direction away from the substrate 10 , so that when forming the pixel opening 13 , it can be formed by using an etching medium. , further simplifying the preparation process.
  • step S300 includes:
  • An etching barrier layer 21 is formed on the side of the inorganic functional layer 11 facing away from the substrate 10.
  • the etching barrier layer 21 includes a first opening opposite to the pixel opening 13, as shown in Figure 14;
  • the area of the inorganic functional layer 11 opposite to the first opening is etched through an etching medium, which includes etching liquid and/or etching gas, as shown in FIG. 15 .
  • Step S300 also includes removing the etching barrier layer 21, as shown in Figure 16.
  • the inorganic layer 12 in the inorganic functional layer 11 can be SiO x N y , where x and y are greater than or equal to 0, and the etching liquid selected can be an etching liquid containing HF acid.
  • the stacked inorganic layers 12 are all SiO x N y , and at least part of the inorganic layers 12 have different proportions of Si, O, and N components, so that the multi-layer inorganic layer 12 can be etched at different speeds through an etching medium.
  • the oxygen content in the multi-layer inorganic layer 12 in the inorganic functional layer 11 can linearly decrease in the direction away from the substrate 10 , and the nitrogen content can linearly increase in the direction away from the substrate 10 , so that the etched inorganic functional layer 11 opens toward the pixel
  • the shape of the inner wall surface of 13 is a plane, and the included angle between the inner wall surface and the substrate 10 is less than 90° toward the side of the pixel opening 13 . That is, the cross section of the pixel opening 13 along the thickness direction of the display panel 1 is trapezoidal. Please refer to FIG. 5 again.
  • the oxygen content in the multi-layer inorganic layer 12 in the inorganic functional layer 11 can decrease at a slower and slower speed in the direction away from the substrate 10, and the nitrogen content can increase at a slower and slower speed in the direction away from the substrate 10.
  • the shape of the inner wall surface of the etched inorganic functional layer 11 facing the pixel opening 13 is a curved surface, and the end of the curved surface away from the substrate 10 protrudes in a direction away from the pixel opening 13 .
  • the oxygen content in the multi-layer inorganic layer 12 in the inorganic functional layer 11 can first increase and then decrease in the direction away from the substrate 10, and the nitrogen content can first decrease and then increase in the direction away from the substrate 10, thereby making the etching
  • the shape of the inner wall surface of the etched inorganic functional layer 11 facing the pixel opening 13 is a curved surface. The curved surface first expands outward in the direction away from the substrate 10 and then is recovered, and the entire body protrudes in the direction away from the pixel opening 13 .
  • the carrier layer 14 can be isolated by controlling the number of layers of the inorganic layer 12 and forming a ladder structure between adjacent inorganic layers 12.
  • the inorganic layer 12 has two layers or Four layers, etc., may specifically be a silicon oxide layer, a silicon nitride layer stacked in a direction away from the substrate 10, or a stacked silicon oxide layer, a silicon nitride layer, a silicon oxide layer, a silicon nitride layer, etc., this application does not Make special restrictions.
  • This application also provides a display device 2, as shown in Figure 18, including any display panel 1 provided in the above embodiments of this application.
  • the sub-pixel crosstalk problem of the display panel 1 is improved, so that the display effect of the display device 2 is significantly improved.
  • the inorganic functional layer 11 in the display panel 1 blocks the carrier layer 14 while It also plays a role in defining pixels, so that the film structure design in the display panel 1 changes less, and the preparation process is simple, saving preparation costs.
  • the above-mentioned display device 2 can be a mobile terminal such as a mobile phone or a tablet, a fixed terminal such as a television or a monitor, or a wearable device such as a watch, which is not particularly limited in this application.

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Abstract

本申请公开了一种显示面板及其制备方法、显示装置，显示面板包括基板和依次形成于基板上的无机功能层和载流子层。无机功能层包括沿显示面板厚度方向层叠设置的多层无机层，多层无机层沿显示面板的厚度方向贯穿形成像素开口，多层无机层中至少包括第一无机层和位于第一无机层背离基板一侧的第二无机层，第二无机层在基板上的正投影面积大于第一无机层在基板上的正投影面积。载流子层包括位于无机功能层背离基板一侧的第一部分以及位于像素开口内的第二部分，第一部分和第二部分相互间隔设置。本申请提供的显示面板显著改善了载流子层中电流横向传递的现象，改善了子像素之间的串扰问题，提升了显示面板的显示质量，同时制备工艺简单。

Description

显示面板及其制备方法、显示装置
本申请要求于2022年08月30日提交中国专利局、申请号为202211049864.3、申请名称为“显示面板及其制备方法、显示装置”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请属于显示技术领域，尤其涉及一种显示面板及其制备方法、显示装置。
背景技术
有机发光二极管(Organic Light-Emitting Diode,OLED)又称为有机电激光显示或有机发光半导体。OLED具有驱动电压低、主动发光、视角宽、效率高、响应速度快、易实现全彩色大面积壁挂式显示和柔性显示的许多特点而逐渐取代液晶显示器(LiquidCrystalDisplay，LCD)显示。
OLED显示面板中包括整面连续的共通层，共通层存在横向漏电问题，使相邻子像素之间产生串扰，影响显示面板的显示质量。
发明内容
本申请实施例提供了一种显示面板及其制备方法、显示装置，以改善由于横向电流引起子像素非正常发光的现象，提升显示面板的显示质量。
本申请实施例第一方面的实施例提供了一种显示面板，包括：
基板；
无机功能层，设置于所述基板，所述无机功能层包括沿所述显示面板厚度方向层叠设置的多层无机层和，所述多层无机层沿所述显示面板的厚度方向贯穿形成像素开口；所述多层无机层中至少包括第一无机层和位于所述第一无机层背离所述基板一侧的第二无机层，所述第二无机层在所述基板上的正投影面积大于所述第一无机层在所述基板上的正投影面积；
载流子层，位于所述无机功能层背离所述基板的一侧，所述载流子层包括位于所述无机功能层背离所述基板一侧的第一部分以及位于所述像素开口内的第二部分，所述第一部分和所述第二部分相互间隔设置。
根据本申请第一方面的实施方式，所述显示面板包括多个发光单元，所述发光单元包括至少一个发光器件，所述发光器件包括发光层，位于所述像素开口，所述载流子层位于所述发光层朝向和/或背离所述基板的一侧；
优选的，所述载流子层包括：空穴注入传输层，所述空穴注入传输层位于所述发光层朝向所述基板的一侧；和/或，电子注入传输层，所述电子注入传输层位于所述发光层背离所述基板的一侧。
根据本申请第一方面前述任一实施方式，所述发光单元包括多个所述发光器件，多个所述发光器件沿所述显示面板的厚度方向层叠设置，相邻所述发光器件之间设置有电荷产生层，所述电荷产生层包括位于所述无机功能层背离所述基板一侧的第三部分以及位于所述像素开口内的第四部分，所述第三部分和所述第四部分相互间隔设置；
优选的，当所述发光单元包括两个所述发光器件时，所述发光单元包括沿远离所述基板方向依次层叠设置的第一电极、第一发光器件、所述电荷产生层、第二发光器件、第二电极，其中，所述第一发光器件包括沿远离所述基板方向层叠设置的第一空穴注入传输层、第一发光层、第一电子注入传输层，所述第二发光器件包括沿远离所述基板方向层叠设置的第二空穴注入传输层、第二发光层、第二电子注入传输层。
根据本申请第一方面前述任一实施方式，所述第一无机层包括SiO x1N y1，所述第二无机层包括SiO x2N y2，其中，x1大于x2，y1小于y2，x2、y1均大于或等于0。
根据本申请第一方面前述任一实施方式，所述无机功能层朝向所述像素开口的内壁面的形状为平面，且所述内壁面与所述基板形成的夹角中朝向所述像素开口一侧的夹角小于90°；或者，
所述内壁面的形状为曲面，所述曲面向背离所述像素开口的方向凸出；或者，
所述内壁面的形状为阶梯面。
本申请第二方面的实施例还提供了一种显示面板的制备方法，包括：
在基板上形成图案化的第一电极；
在第一电极背离基板的一侧形成无机功能层，所述无机功能层包括沿所述显示面板厚度方向层叠设置的多层无机层，所述多层无机层中至少包括第一无机层和位于所述第一无机层背离所述基板一侧的第二无机层；
在所述无机功能层中与所述第一电极相对的位置形成像素开口，所述像素开口沿所述显示面板的厚度方向贯穿所述无机功能层，以使所述第二无机层在所述基板上的正投影面积大于所述第一无机层在所述基板上的正投影；
在所述无机功能层背离所述基板的一侧形成载流子层，所述载流子层包括位于所述无机功能层背离所述基板一侧的第一部分以及位于所述像素开口内的第二部分，所述第一部分和所述第二部分相互间隔设置。
根据本申请第二方面的实施方式，所述在第一电极背离基板的一侧形成无机功能层，所述无机功能层包括沿所述显示面板厚度方向层叠设置的多层无机层，所述多层无机层中至少包括第一无机层和位于所述第一无机层背离所述基板一侧的第二无机层的步骤包括：
采用化学气相沉积工艺形成所述无机功能层，通过控制不同时间内反应气体的组成和电场的功率形成多层层叠设置的所述无机功能层。
根据本申请第二方面前述任一实施方式，沿远离所述基板的方向，所述多层无机层与同一种刻蚀介质的反应速度逐渐减小。
根据本申请第二方面前述任一实施方式，所述在所述无机功能层中与所述第一电极相对的位置形成像素开口，所述像素开口沿所述显示面板的厚度方向贯穿所述无机功能层，以使所述第二无机层在所述基板上的正投影面积大于所述第一无机层在所述基板上的正投影的步骤包括：
在所述无机功能层背离基板的一侧形成刻蚀阻挡层，所述刻蚀阻挡层包括与所述像素开口相对的第一开孔；
通过刻蚀介质对所述无机功能层中与所述第一开孔相对的区域进行刻蚀，所述刻蚀介质包括刻蚀液和/或刻蚀气体。
本申请第三方面的实施例还提供了一种显示装置，包括本申请第一方面提供的任意一种显示面板。
本申请提供的显示面板中，在基板上设置有无机功能层，无机功能层上设置有像素开口，无机功能层包括多层无机层，多层无机层至少包括第一无机层和第二无机层，第二无机层位于第一无机层背离基板的一侧，第二无机层在基板上的正投影面积大于第一无机层在基板上的正投影面积，使得像素开口沿显示面板厚度方向的截面中，沿平行于显示面板出光面方向、像素开口中位于第二无机层中的部分的尺寸小于位于第一无机层中的部分的尺寸。该显示面板还包括位于无机功能层背离基板一侧的载流子层，上述像素开口将载流子层隔断为位于无机功能层背离基板一侧的第一部分以及位于像素开口内的第二部分，第一部分和第二部分之间相互间隔设置，从而改善了载流子层中电流横向传递的现象，改善了子像素之间的串扰问题，提升了显示面板的显示质量。同时，由于本申请提供的显示面板中，无机功能层包括多层无机层，多层无机层的制备工艺可同步进行，多层无机层的刻蚀工艺也可以同步进行，从而在形成无机功能层以及像素开口时，可减少制备工艺同时起到良好隔断载流子层的效果。
附图说明
为了更清楚地说明本申请实施例的技术方案，下面将对本申请实施例中所需要使用的附图作简单地介绍，显而易见地，下面所描述的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本申请实施例提供的一种显示面板的结构示意图；
图2是本申请实施例提供的另一种显示面板的结构示意图；
图3是本申请实施例提供的另一种显示面板的结构示意图；
图4是本申请实施例提供的另一种显示面板的结构示意图；
图5是本申请实施例提供的另一种显示面板的部分膜层的结构示意图；
图6是本申请实施例提供的另一种显示面板的部分膜层的结构示意图；
图7是本申请实施例提供的另一种显示面板的部分膜层的结构示意图；
图8是本申请实施例提供的另一种显示面板的部分膜层的结构示意图；
图9是本申请实施例提供的另一种显示面板的部分膜层的结构示意图；
图10是本申请实施例提供的另一种显示面板的部分膜层的结构示意图；
图11是本申请实施例提供的一种显示面板的制备方法的流程示意图；
图12至图17是本申请实施例提供的一种显示面板的制备方法的膜层变化示意图；
图18是本申请实施例提供的一种显示装置的结构示意图。
附图中：
1-显示面板；101-衬底；102-驱动电路层；103-平坦化层；10-基板11-无机功能层；12-无机层；121-第一无机层；122-第二无机层；13-像素开口；14-载流子层；141-第一部分；142-第二部分；15-第一电极；16-空穴注入传输层；161-第一空穴注入传输层；162-第二空穴注入传输层；17-发光层；171-第一发光层；172-第二发光层；22-电荷产生层；18-电子注入传输层；181-第一电子注入传输层；182-第二电子注入传输层；19-第二电极；20-支撑层；21-刻蚀阻挡层；2-显示装置。
具体实施方式
下面将详细描述本申请的各个方面的特征和示例性实施例。在下面的详细描述中，提出了许多具体细节，以便提供对本申请的全面理解。但是，对于本领域技术人员来说很明显的是，本申请可以在不需要这些具体细节中的一些细节的情况下实施。下面对实施例的描述仅仅是为了通过示出本申请的示例来提供对本申请的更好的理解。
需要说明的是，在本文中，诸如第一和第二等之类的关系术语仅仅用来将一个实体或者操作与另一个实体或操作区分开来，而不一定要求或者暗示这些实体或操作之间存在任何这种实际的关系或者顺序。而且，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、物品或者设备不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、物品或者设备所固有的要素。在没有更多限制的情况下，由语句“包括……”限定的要素，并不排除在包括要素的过程、方法、物品或者设备中还存在另外的相同要素。
随着显示技术的发展，对显示面板显示质量的要求越来越高。发明人经研究发现，OLED显示面板包括第一电极、第二电极以及位于第一电极与第二电极之间的发光层，发光层包括整面连续的共通层，由于共通层整面连续设置，因此当部分子像素发光时，电流可经共通层传递至相邻的子像素，从而容易造成相邻的子像素非正常发光，即使得相邻子像素之间发生串扰。即共通层内的横向电流会导致子像素的非正常开启，从而引起色度不纯或者显示不均，严重影响显示效果。基于对上述问题的研究，发明人提供了一种显示面板及其制备方法、显示装置，以改善由于横向电流引起子像素非正常发光的现象，提升显示面板的显示质量。
为了更好地理解本申请，下面结合图1至图18根据本申请实施例的显示面板及其制备方法、显示装置进行详细描述。
请参阅图1，本申请实施例提供了一种显示面板1，包括基板10、无机功能层11和载流子层14。无机功能层11设置于基板10，无机功能层11包括沿显示面板1厚度方向层叠设置的多层无机层12和沿显示面板1的厚度方向贯穿设置的像素开口13，多层无机层12中至少包括第一无机层121和位于第一无机层121背离基板10一侧的第二无机层122，第二无机层122在基板10上的正投影面积大于第一无机层121在基板10上的正投影面积。载流子层14位于无机功能层背离基板10的一侧，载流子层14包括位于无机功能层11背离基板10一侧的第一部分141以及位于像素开口13内的第二部分142，第一部分141和第二部分142相互间隔设置。
本申请提供的显示面板1中，在基板10上设置有无机功能层11，无机功能层11上设置有像素开口13，无机功能层11包括多层无机层12，多层无机层12至少包括第一无机层121和第二无机层122，第二无机层122位于第一无机层121背离基板10的一侧，第二无机层122在基板10上的正投影面积大于第一无机层121在基板10上的正投影面积，使得像素开口13沿显示面板1厚度方向的截面中，沿平行于显示面板1出光面方向、像素开口13中位于第二无机层122中的部分的尺寸小于位于第一无机层121中的部分的尺寸。该显示面板1还包括位于无机功能层11背离基板10一侧的载流子层14，上述像素开口13将载流子层14隔断为位于无机功能层11背离基板10一侧的第一部分141以及位于像素开口13内的第二部分142，第一部分141和第二部分142之间相互间隔设置，从而改善了载流子层14中电流横向传递的现象，改善了子像素之间的串扰问题，提升了显示面板1的显示质量。同时，由于本申请提供的显示面板1中，无机功能层11包括多层无机层12，多层无机层12的制备工艺可同步进行，多层无机层12的刻蚀工艺也可以同步进行，从而在形成无机功能层11以及像素开口13时，可减少制备工艺同时起到良好隔断载流子层14的效果。
本申请提供的显示面板1中，如图2所示，显示面板1包括多个发光单元A，发光单元A包括第一电极15、第二电极19和位于第一电极15与第二电极19之间的至少一个发光器件B，发光器件B包括空穴注入传输层16、电子注入传输层18和发光层17，空穴注入传输层16、电子注入传输层18和发光层17层叠设置于第一电极15与第二电极19之间，发光层17位于空穴注入传输层16和电子注入传输层18之间，其中，第一电极15可以为阳极、第二电极19为阴极，本申请不做特别限定。当第一电极15为阳极时，第一电极15形成于基板10上，且为图案化的多个，无机功能层11中的像素开口13与第一电极 15一一对应设置，每个像素开口13暴露一个第一电极15的中心位置，且每个第一电极15的边缘经无机功能层11覆盖。第二电极19为阴极且为整面设置的连续膜层。
显示面板1中包括多个子像素，每个子像素包括一个上述的发光单元A，具体地，发光单元A包括发光层17，发光层17位于像素开口13。此时无机功能层11起到像素限定的作用，每个像素开口13限定一个子像素(发光单元A)，无机功能层11同时起到隔断载流子层14的作用，从而改善横向漏流引起的相邻子像素之间串扰的问题。
在一种可行的实施方式中，载流子层14位于发光层17朝向和/或背离基板10的一侧。如图2所示，载流子层14包括：空穴注入传输层16，空穴注入传输层16位于发光层17朝向基板10的一侧；和/或，如图3所示，还包括电子注入传输层18，电子注入传输层18位于发光层17背离基板10的一侧。
每个发光单元A通过空穴注入传输层16和电子注入传输层18为发光层17提供发光的必要条件，空穴注入传输层16经无机功能层11的像素开口13隔断，从而可减小第一电极15中的电流经空穴注入传输层16的横向传递的几率，改善相邻发光单元之间的串扰现象，使得显示面板1的显示效果更好；和/或，电子注入传输层18经无机功能层11的像素开口13隔断，从而可减小第二电极19中的电流经电子注入传输层18的横向传递的几率，改善相邻发光单元之间的串扰现象，使得显示面板1的显示效果更好。
在一种可行的实施方式中，空穴注入传输层16包括空穴注入层(HIL)、空穴传输层(HTL)和电子阻挡层(EBL)中的至少一者。电子注入传输层18包括电子注入层(EIL)、电子传输层(ETL)、空穴阻挡层(HBL)中的至少一者。
上述显示面板1中，空穴注入传输层16中的至少部分膜层经阻隔结构隔断，使得空穴注入传输层16中的至少部分膜层与不同发光单元相对应的部分连通面积减小，和/或，电子注入传输层18中的至少部分膜层经阻隔结构隔断，使得电子注入传输层18中的至少部分膜层与不同发光单元相对应的部分连通面积减小，从而改善相邻发光单元之间的串扰现象，使得显示面板1的显示效果更好。
在一种可行的实施方式中，如图3所示，每个发光单元A仅包括一个发光器件B。
在另一种可行的实施方式中，如图4所示，每个发光单元A包括多个发光器件B，多个发光器件B沿显示面板的厚度方向层叠设置，相邻发光器件B之间设置有电荷产生层22，每个发光器件B均包括空穴注入传输层16、电子注入传输层18和发光层17，每个发光器件中，空穴注入传输层16位于发光层17朝向基板的一侧，电子注入传输层18位于发光层17背离基板的一侧。沿显示面板的厚度方向相邻的发光器件B之间通过电荷产生层22电连接。电荷产生层22包括位于无机功能层11背离基板10一侧的第三部分以及位于像素开口13内的第四部分，第三部分和第四部分相互间隔设置。
上述实施方式中为叠层的OLED器件，此时，一个发光单元A中包括沿显示面板的厚度方向层叠设置的多个发光器件B，相邻发光器件B之间通过电荷产生层22电连接，从而可以提升发光单元A的亮度。电荷产生层22的材质可为有机材料，具体可为高分子树脂材料，本申请不做特别限定。当发光单元中包括电荷产生层22时，电荷产生层22也可经无机功能层11的像素开口13隔断为相互分隔设置的第三部分和第四部分，第三部分位于无机功能层11背离基板10一侧，第四部分位于像素开口13内，从而改善横向电流在不同发光单元的电荷产生层172内的流通，进一步减小相邻发光单元之间的串扰问题。
在一种可行的实施方式中，如图4所示，发光单元A包括两个发光器件B。当发光单元A包括两个发光器件B时，两个发光器件B可包括第一发光器件B1和第二发光器件B2，此时，发光单元A包括沿远离基板10方向层叠设置的第一电极15、第一发光器件B1、电荷产生层22、第二发光器件B2、第二电极19，其中，第一发光器件B1包括沿远离基板10方向层叠设置的第一空穴注入传输层161、第一发光层171、第一电子注入传输层181，第二发光器件B2包括沿远离基板10方向层叠设置的第二空穴注入传输层162、第二发光层172、第二电子注入传输层182。
在一种可行的实施方式中，无机功能层11的厚度可以为
Figure PCTCN2022128349-appb-000001
具体地，无机功能层11的厚度可为
Figure PCTCN2022128349-appb-000002
Figure PCTCN2022128349-appb-000003
Figure PCTCN2022128349-appb-000004
等等，本申请不做特别限定。以使得无机功能层11的像素开口13将空穴注入传输层16和/或电子注入传输层18隔断，当为叠层OLED时，至少将一个发光器件中的载流子层(包括空穴注入传输层16和/或电子注入传输层18)隔断，可选的，可将电荷产生层22同步隔断，进一步改善子像素间的串扰问题，同时保证了第二电极19的连续性。可以理解的是，无机功能层11的厚度可根据需要隔断的膜层厚度进行设定，本申请不对其厚度做特别限定，且无机功能层11的厚度上限不能超过每个发光单元以及第二电极19的总厚度，即需要保证第二电极19的连续。
在一种可行的实施方式中，第一无机层121包括SiO x1N y1，第二无机层122包括SiO x2N y2，其中，x1大于x2，y1小于y2，x2、y1均大于或等于0。
在上述实施方式中，无机功能层11所包括的第一无机层121和第二无机层122均为氮、氧、硅化 合物，第二无机层122和第一无机层121相比，氧含量降低、氮含量升高，氧含量最低为零；第一无机层121和第二无机层122相比，氮含量降低、氧含量升高，氮含量最低为零；使得与同一种刻蚀介质的反应速度第二无机层122小于第一无机层121，从而使得形成的像素开口13中位于第一无机层121的部分的沿平行于显示面板1出光面的间距、大于位于第二无机层122的部分的沿平行于显示面板1出光面的间距，从而使得载流子层14可经像素开口13隔断，以改善横向漏流的横向传递。
在一种可行的实施方式中，如图5所示，无机功能层11朝向像素开口13的内壁面的形状为平面，且内壁面与基板10形成的夹角中朝向像素开口13一侧的夹角小于90°。即，像素开口13沿显示面板1厚度方向的截面为梯形。
在另一种可行的实施方式中，如图6和图7所示，无机功能层11朝向像素开口13的内壁面的形状为曲面，曲面向背离像素开口13的方向凸出。
在上述两种实施方式中，无机功能层11可包括多层无机层12，多层无机层12可均为氮、氧、硅化合物，沿远离基板10的方向，多层无机层12的氮含量逐渐升高、氧含量逐渐降低。上述两种实施方式中，沿远离基板10的方向，多层无机层12的氮含量、氧含量的变化不同，从而使得形成的像素开口13形状存在差异，但多层无机层12包括第一无机层121和第二无机层122，第二无机层122位于第一无机层121背离基板10的一侧，且像素开口13位于第二无机层122的部分的间距小于位于第一无机层121的部分的间距，从而可用于隔断载流子层14。
在另一种可行的实施方式中，如图8和图9所示，无机功能层11朝向像素开口13的内壁面的形状为阶梯面。具体地，阶梯的数量可以为一个或多个，本申请不做特别限定。
具体地，如图8所示，无机功能层11可包括层叠设置的两层无机层12，即第一无机层121和第二无机层122，在第一无机层121和第二无机层122的交界处形成阶梯。或者，如图9所示，无机功能层11可包括层叠设置的四层无机层12，具体可包括沿远离基板10方向排列的第一无机层121、第二无机层122、第一无机层121和第二无机层122，本申请不做特别限定。
本申请提供的显示面板1中，如图10所示，在无机功能层11背离基板10的一侧还形成有用于支撑掩膜板的支撑层20，支撑层20对掩膜板进行支撑，可防止在蒸镀过程中掩膜板与下方膜层接触对下方膜层造成损伤。
本申请还提供了一种显示面板1的制备方法，如图11所示，包括：
S100，在基板10上形成图案化的第一电极15，如图12所示。
其中，基板10包括衬底101、位于衬底上的驱动电路层102、位于驱动电路层背离衬底一侧的平坦化层103等，第一电极15形成于平坦化层103上且与驱动电路层102内的驱动电路电连接。
S200，在第一电极15背离基板10的一侧形成无机功能层11，无机功能层11包括沿显示面板1厚度方向层叠设置的多层无机层12，多层无机层12中至少包括第一无机层121和位于第一无机层121背离基板10一侧的第二无机层122，如图13所示。
S300，在无机功能层11中与第一电极15相对的位置形成像素开口13，像素开口13沿显示面板1的厚度方向贯穿无机功能层11，以使第二无机层122在基板10上的正投影面积大于第一无机层121在基板10上的正投影，如图14、图15和图16所示。
S400，在无机功能层11背离基板10的一侧形成载流子层14，载流子层14包括位于无机功能层11背离基板10一侧的第一部分141以及位于像素开口13内的第二部分142，第一部分141和第二部分142相互间隔设置，如图17所示。
本申请提供的显示面板1的制备方法中，在第一电极15背离基板10的一侧形成无机功能层11，无机功能层11包括层叠设置的多层无机层12，多层无机层12在形成过程中可采用一次工艺进行制备，简化了制备工艺并节省了制备时间；在无机功能层11上形成像素开口13，以使得位于第一无机层121背离基板10一侧的第二无机层122在基板10上的正投影面积、大于第一无机层121在基板10上的正投影，从而使得载流子层14被隔断为位于无机功能层11背离基板10一侧的第一部分141以及位于像素开口13内的第二部分142，从而改善了子像素间串扰的问题。同时，该无机功能层11中的像素开口13暴露第一电极15，即该无机功能层11在隔断载流子层14的同时还起到了像素限定的作用，无机功能层11的复用简化了显示面板1的结构，简化了显示面板1的制备工艺，节省了制造成本。
在一种可行的实施方式中，步骤S200包括：
采用化学气相沉积工艺形成无机功能层11，通过控制不同时间内反应气体的组成和电场的功率形成多层层叠设置的无机层12。
在上述实施方式中，通过改变反应气体的组成和电场的功率，形成多层被刻蚀难易程度不同的无机层12，制备工艺简单。具体地，可通过改变N 2O和SiH 4的比例以及电场的功率等成膜参数来进行无机层12的生长，从而使得生成Si、O、N成分比例不同的多层叠层无机层12，具体地，多层叠层无机层12成 分均为SiO xN y，其中x可以为0～2，y可以为0～1.33。
在一种可行的实施方式中，沿远离基板10的方向，多层无机层12与同一种刻蚀介质的反应速度逐渐减小，从而在形成像素开口13时，可通过一种刻蚀介质形成，进一步简化制备工艺。
在一种可行的实施方式中，步骤S300包括：
在无机功能层11背离基板10的一侧形成刻蚀阻挡层21，刻蚀阻挡层21包括与像素开口13相对的第一开孔，如图14所示；
通过刻蚀介质对无机功能层11中与第一开孔相对的区域进行刻蚀，刻蚀介质包括刻蚀液和/或刻蚀气体，如图15所示。
步骤S300还包括去除刻蚀阻挡层21，如图16所示。
具体地，无机功能层11中的无机层12可以为SiO xN y，其中，x、y大于或等于0，选用的刻蚀液可以为含有HF酸的刻蚀液，由于无机功能层11中层叠设置的无机层12均为SiO xN y，且至少部分无机层12中Si、O、N成分比例不同，从而可通过一种刻蚀介质实现多层无机层12的不同速度的刻蚀，以形成可用于隔断载流子层14的像素开口13。
具体地，无机功能层11中的多层无机层12中的氧含量可远离基板10方向直线降低、氮含量沿远离基板10方向直线升高，从而使得刻蚀后的无机功能层11朝向像素开口13的内壁面的形状为平面，且内壁面与基板10形成的夹角中朝向像素开口13一侧的夹角小于90°。即，像素开口13沿显示面板1厚度方向的截面为梯形，请再次参考图5。
或者，请再次参考图6，无机功能层11中的多层无机层12中的氧含量可远离基板10方向降低的速度越来越慢、氮含量沿远离基板10方向升高的速度越来越慢，从而使得刻蚀后的无机功能层11朝向像素开口13的内壁面的形状为曲面，曲面远离基板10的一端向背离像素开口13的方向凸出。
或者，请再次参考图7，无机功能层11中的多层无机层12中的氧含量可远离基板10方向先升高后降低、氮含量沿远离基板10方向先降低后升高，从而使得刻蚀后的无机功能层11朝向像素开口13的内壁面的形状为曲面，曲面沿远离基板10方向先外扩后回收，整体向背离像素开口13的方向凸出。
或者，请再次参考图8和图9，可通过控制无机层12的层数，并在相邻无机层12之间形成阶梯结构，以隔断载流子层14，例如无机层12为两层或四层等，具体可为沿远离基板10方向层叠设置的氧化硅层、氮化硅层，或者层叠设置的氧化硅层、氮化硅层、氧化硅层、氮化硅层等，本申请不做特别限定。
本申请还提供了一种显示装置2，如图18所示，包括本申请上述实施方式提供的任意一种显示面板1。
该显示装置2中因显示面板1的子像素串扰问题得以改善，从而使得显示装置2的显示效果得到显著提高，同时，由于显示面板1中的无机功能层11在隔断载流子层14的同时还起到像素限定的作用，从而使得显示面板1中的膜层结构设计变化较小，且制备工艺简单，节省了制备成本。
上述显示装置2可以为手机、平板等移动终端，或者为电视机、显示器等固定终端，还可以为手表等可穿戴设备，本申请不作特别限定。
依照本申请如上文的实施例，这些实施例并没有详尽叙述所有的细节，也不限制该发明仅为的具体实施例。显然，根据以上描述，可作很多的修改和变化。本说明书选取并具体描述这些实施例，是为了更好地解释本申请的原理和实际应用，从而使所属技术领域技术人员能很好地利用本申请以及在本申请基础上的修改使用。本申请仅受权利要求书及其全部范围和等效物的限制。

Claims (10)

  1. 一种显示面板，包括：
    基板；
    无机功能层，设置于所述基板，所述无机功能层包括沿所述显示面板厚度方向层叠设置的多层无机层，所述多层无机层沿所述显示面板的厚度方向贯穿形成像素开口；所述多层无机层中至少包括第一无机层和位于所述第一无机层背离所述基板一侧的第二无机层，所述第二无机层在所述基板上的正投影面积大于所述第一无机层在所述基板上的正投影面积；
    载流子层，位于所述无机功能层背离所述基板的一侧，所述载流子层包括位于所述无机功能层背离所述基板一侧的第一部分以及位于所述像素开口内的第二部分，所述第一部分和所述第二部分相互间隔设置。
  2. 根据权利要求1所述的显示面板，其中，所述显示面板包括多个发光单元，所述发光单元包括至少一个发光器件，所述发光器件包括发光层，位于所述像素开口，所述载流子层位于所述发光层朝向和/或背离所述基板的一侧；
    优选的，所述载流子层包括：空穴注入传输层，所述空穴注入传输层位于所述发光层朝向或者背离所述基板的一侧；和/或，电子注入传输层，所述电子注入传输层位于所述发光层背离或者朝向所述基板的一侧。
  3. 根据权利要求2所述的显示面板，其中，所述发光单元包括多个所述发光器件，多个所述发光器件沿所述显示面板的厚度方向层叠设置，相邻所述发光器件之间设置有电荷产生层，所述电荷产生层包括位于所述无机功能层背离所述基板一侧的第三部分以及位于所述像素开口内的第四部分，所述第三部分和所述第四部分相互间隔设置；
    优选的，当所述发光单元包括两个所述发光器件时，所述发光单元包括沿远离所述基板方向依次层叠设置的第一电极、第一发光器件、所述电荷产生层、第二发光器件、第二电极，其中，所述第一发光器件包括沿远离所述基板方向层叠设置的第一空穴注入传输层、第一发光层、第一电子注入传输层，所述第二发光器件包括沿远离所述基板方向层叠设置的第二空穴注入传输层、第二发光层、第二电子注入传输层。
  4. 根据权利要求1所述的显示面板，其中，所述第一无机层包括SiO x1N y1，所述第二无机层包括SiO x2N y2，其中，x1大于x2，y1小于y2，x2、y1均大于或等于0。
  5. 根据权利要求1所述的显示面板，其中，所述无机功能层朝向所述像素开口的内壁面的形状为平面，且所述内壁面与所述基板形成的夹角中朝向所述像素开口一侧的夹角小于90°；或者，
    所述内壁面的形状为曲面，所述曲面向背离所述像素开口的方向凸出；或者，
    所述内壁面的形状为阶梯面。
  6. 一种显示面板的制备方法，其中，包括：
    在基板上形成图案化的第一电极；
    在第一电极背离基板的一侧形成无机功能层，所述无机功能层包括沿所述显示面板厚度方向层叠设置的多层无机层，所述多层无机层中至少包括第一无机层和位于所述第一无机层背离所述基板一侧的第二无机层；
    在所述无机功能层中与所述第一电极相对的位置形成像素开口，所述像素开口沿所述显示面板的厚度方向贯穿所述无机功能层，以使所述第二无机层在所述基板上的正投影面积大于所述第一无机层在所述基板上的正投影；
    在所述无机功能层背离所述基板的一侧形成载流子层，所述载流子层包括位于所述无机功能层背离所述基板一侧的第一部分以及位于所述像素开口内的第二部分，所述第一部分和所述第二部分相互间隔设置。
  7. 根据权利要求6所述的制备方法，其中，所述在第一电极背离基板的一侧形成无机功能层，所述无机功能层包括沿所述显示面板厚度方向层叠设置的多层无机层，所述多层无机层中至少包括第一无机层和位于所述第一无机层背离所述基板一侧的第二无机层的步骤包括：
    采用化学气相沉积工艺形成所述无机功能层，通过控制不同时间内反应气体的组成和电场的功率形成多层层叠设置的所述无机功能层。
  8. 根据权利要求6所述的制备方法，其中，沿远离所述基板的方向，所述多层无机层与同一种刻蚀介质的反应速度逐渐减小。
  9. 根据权利要求8所述的制备方法，其中，所述在所述无机功能层中与所述第一电极相对的位置形成像素开口，所述像素开口沿所述显示面板的厚度方向贯穿所述无机功能层，以使所述第二无机层在所 述基板上的正投影面积大于所述第一无机层在所述基板上的正投影的步骤包括：
    在所述无机功能层背离基板的一侧形成刻蚀阻挡层，所述刻蚀阻挡层包括与所述像素开口相对的第一开孔；
    通过刻蚀介质对所述无机功能层中与所述第一开孔相对的区域进行刻蚀，所述刻蚀介质包括刻蚀液和/或刻蚀气体。
  10. 一种显示装置，包括如权利要求1-5任一项所述的显示面板。
PCT/CN2022/128349 2022-08-30 2022-10-28 显示面板及其制备方法、显示装置 Ceased WO2024045307A1 (zh)

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