WO2024045252A1

WO2024045252A1 - Carrying device and wafer cooling system

Info

Publication number: WO2024045252A1
Application number: PCT/CN2022/121469
Authority: WO
Inventors: 曹辉; 马龙龙; 张继勇; 张健; 何继东
Original assignee: 台湾积体电路制造股份有限公司; 台积电(中国)有限公司
Priority date: 2022-09-02
Filing date: 2022-09-26
Publication date: 2024-03-07
Also published as: CN217903099U

Abstract

The present application relates to a carrying device and a wafer cooling system. The carrying device is used in the wafer cooling system which comprises a base for supporting and cooling a wafer. The carrying device comprises a body component and a plurality of support components, wherein the body component is arranged around the base and can move in a first direction relative to the base; the plurality of support components are configured to support the wafer to move in the first direction, and are distributed on the body component at intervals and rotatably connected to the body component; and the support components extend in a second direction relative to the body component, are arranged opposite the base in the second direction, and are configured to rotate about the body component when subjected to an external force, the second direction being perpendicular to the first direction. The carrying device of the present application can reduce the probability of the wafer being damaged by squeezing when the wafer and the support components are misaligned in position, thereby improving the safety of the wafer during loading.

Description

Carrier and wafer cooling system

Cross-references to related applications

This application claims priority to Chinese patent application 202222333941.

Technical field

The present application relates to the field of semiconductor technology, and in particular to a carrying device and a wafer cooling system.

Background technique

Wafer refers to the silicon wafer used to make silicon semiconductor integrated circuits. The original material is silicon. High-purity polysilicon is dissolved and mixed with silicon crystal seeds, and then slowly pulled out to form columnar single crystal silicon. After grinding, polishing, and slicing, silicon wafers, also known as wafers, are formed. The formed wafers usually require a process of removing glue and cooling.

The cooling of the wafer is usually carried out in the cooling chamber. First, the wafer is transferred into the cooling chamber, and then the wafer is loaded onto the cooling base through the carrying device for cooling. When there is a positional deviation between the wafer and the carrying device, When moving, the wafer is easily squeezed by the carrying device and the base, causing the wafer to be squeezed and damaged, so that the safety of the wafer during loading cannot be guaranteed.

Therefore, there is an urgent need to develop a carrying device for wafer cooling systems to reduce the probability of crushing damage when loading wafers.

Contents of the invention

This application provides a carrying device and a wafer cooling system, aiming to improve the safety when loading the wafer.

On the one hand, embodiments of the present application provide a carrying device for use in a wafer cooling system. The wafer cooling system includes a base for supporting and cooling the wafer. The carrying device includes a main body member and a plurality of supporting members. The main body member The member is arranged around the base and can move in a first direction relative to the base; a plurality of support members is used to support the wafer to move in the first direction, and the plurality of support members are spaced apart on the main member and are respectively connected to the main member. Rotation connection, each support member extends along a second direction relative to the main body member, the support member and the base are arranged oppositely along the second direction, and the support member is configured to rotate around the main body member when subjected to an external force, wherein the second direction is perpendicular to First direction.

According to one aspect of the embodiment of the present application, the carrying device further includes a driving mechanism, which is connected to the main body member and drives the main body member to move in the first direction.

According to one aspect of the embodiment of the present application, the main body component includes a main body part and a plurality of extension parts connected to the main body part. The main body part is arranged around the base, and the plurality of extension parts extend along the first direction and are distributed on the main body part at intervals, each The extension parts are respectively rotatably connected with their corresponding supporting members.

According to one aspect of the embodiment of the present application, each support member is respectively embedded in the end of its corresponding extension portion away from the main body.

According to one aspect of the embodiment of the present application, the end of the extension part away from the main body part is recessed toward a direction close to the main body part to form a first recessed part. The first recessed part includes a bottom wall and two side walls connected to the bottom wall and opposite to each other, supporting The end of the component away from the base is the first end. The first end is sandwiched between the two side walls. The side of the first end facing the bottom wall is in contact with the bottom wall. The first end can extend relative to The top rotates away from the bottom wall.

According to one aspect of the embodiment of the present application, there is a gap between the first end and the two side walls.

According to one aspect of the embodiment of the present application, the support member includes a connecting part and a supporting part. The connecting part is rotationally connected to the main body member and extends along the second direction relative to the main body member; the supporting part is connected to the connecting part and extends along the second direction. The position of the support part relative to the connection part is adjustable, and at least part of the support part extends along the second direction relative to the connection part, and the support part is used to support the wafer to move in the first direction.

According to one aspect of the embodiment of the present application, along the second direction, the supporting part is detachably connected to multiple locations of the connecting part.

According to one aspect of the embodiment of the present application, the support part includes a support body and an extension end, the support body is connected to the connection part; the extension end is connected to an end of the support body away from the main body component, the extension end extends in the second direction relative to the support body, and the extension end The end is used to support the wafer to move along the first direction.

On the other hand, embodiments of the present application also provide a wafer cooling system, which includes a carrying device, a base and a cavity component as described above. The base is used to support and cool the wafer, and the cavity component is provided with Base and carrying device.

The carrying device of the embodiment of the present application is used in a wafer cooling system. The wafer cooling system includes a base for supporting and cooling the wafer. The carrying device includes a main body member and a plurality of supporting members. The main body member is arranged around the base and Able to move in a first direction relative to the base, the main member moves and drives a plurality of support members provided on the main member to move, so that the support members provided opposite to the base can load the wafer on the base. The base cools the wafer. During this process, when a positional shift occurs between the wafer and the support member, part of the support member may overlap the side of the wafer away from the base. The support member will offset the wafer and generate a force. This force can The support member is driven to rotate in a direction away from the base, thereby alleviating the force on the wafer, reducing the probability of the wafer being squeezed and damaged, and improving the safety of the wafer when loading.

Description of drawings

The present application can be better understood from the following description of specific embodiments of the present application with reference to the accompanying drawings, wherein other features, objects and advantages of the present application will become apparent by reading the following detailed description of non-limiting embodiments with reference to the accompanying drawings. It will become more apparent that identical or similar reference numbers indicate identical or similar features.

Figure 1 is a partial structural schematic diagram of a wafer cooling system provided by some embodiments of the present application;

Figure 2 is a schematic structural diagram of a carrying device provided by some embodiments of the present application;

Figure 3 is a partially exploded schematic diagram of a carrying device provided by some embodiments of the present application;

Figure 4 is a partial structural schematic diagram of a carrying device provided by some embodiments of the present application.

The drawings are not necessarily drawn to actual scale.

Explanation of reference symbols:

X, first direction; Y, second direction;

1. Carrying device;

10. Main component; 11. Main part; 12. Extension part; 120. First recessed part; 120a, side wall; 120b, bottom wall;

20. Supporting member; 21. First end; 22. Connecting portion; 23. Supporting portion; 231. Supporting body; 232. Extended end;

30. Driving mechanism;

2. Base; 3. Cavity component; 4. Wafer;

100. Wafer cooling system.

Detailed ways

The embodiments of the present application will be described in further detail below with reference to the accompanying drawings and examples. The detailed description of the following embodiments and the accompanying drawings are used to illustrate the principles of the present application, but cannot be used to limit the scope of the present application, that is, the present application is not limited to the described embodiments.

In the description of this application, it should be noted that, unless otherwise stated, "plurality" means more than two; the terms "upper", "lower", "left", "right", "inside", " The orientation or positional relationship indicated such as "outside" is only for the convenience of describing the present application and simplifying the description. It does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present application. Application restrictions. Furthermore, the terms "first," "second," etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. "Vertical" is not vertical in the strict sense, but within the allowable error range. "Parallel" is not parallel in the strict sense, but within the allowable error range.

The directional words appearing in the following description are the directions shown in the figures and do not limit the specific structure of the present application. In the description of this application, it should also be noted that, unless otherwise clearly stated and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense. For example, it can be a fixed connection or a removable connection. Detachable connection, or integral connection; it can be directly connected or indirectly connected through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in this application may be understood based on specific circumstances.

With the rapid development of science and technology, high-tech electronic products have become quite common in daily life, such as mobile phones, motherboards, digital cameras and other electronic products. These electronic products are equipped with and covered with many integrated circuits, and integrated circuits The basis of materials is wafers. In order to meet the massive demand for various high-tech electronic products, the wafer processing industry is constantly making breakthroughs in research and development and improvement with the goal of manufacturing wafers more quickly and accurately.

The processing procedures of wafers are complicated and precise, and generally include: lithography, etching, diffusion, ion implantation, thin film and other processes. Many of them are high-temperature processes. After the wafers undergo high-temperature processes, they generally need to be rapidly cooled to After reaching room temperature or the wafer material temperature required by the process, subsequent processes can be carried out.

The cooling of the wafer is usually carried out in the cooling chamber. First, a mechanical arm is used to transfer the wafer to the carrying device in the cooling chamber, and then the wafer is loaded onto the base through the carrying device for cooling. When the wafer is cooled, After reaching the target temperature, proceed to the next step. However, the inventor found that when the carrying device loads the wafer onto the base, the wafer may be displaced from the carrying device, causing the wafer to be squeezed by the carrying device and the base when the carrying device moves. As a result, the wafer is damaged and the safety of the wafer during loading cannot be guaranteed.

In view of the above problems, the inventor proposed a carrying device. The carrying device includes a main body member and a plurality of supporting members. The plurality of supporting members are rotationally connected to the main body member. When the main body member moves, it can drive the plurality of supporting members to move, thereby moving the crystal. The wafer is loaded on the base so that the base cools the wafer. During the loading process, when a positional shift occurs between the wafer and the support member, part of the support member may overlap the side of the wafer away from the base. The support member will offset the wafer and generate a force. This force can The support member is driven to rotate, thereby alleviating the impact of force on the wafer, reducing the probability of the wafer being squeezed and damaged, and improving the safety of the wafer when loading.

Figure 1 is a partial structural schematic diagram of a wafer cooling system provided by some embodiments of the present application; Figure 2 is a schematic structural diagram of a carrying device provided by some embodiments of the present application; Figure 3 is a partial decomposition of a carrying device provided by some embodiments of the present application. Schematic diagram; Figure 4 is a partial structural schematic diagram of a carrying device provided by some embodiments of the present application.

Please refer to FIGS. 1 to 4 . The carrier device 1 in the embodiment of the present application is used in a wafer cooling system 100 . The wafer cooling system 100 includes a base 2 for supporting and cooling the wafer 4 . The carrier device 1 includes a main body member 10 and a plurality of support members 20. The main member 10 is arranged around the base 2 and can move along the first direction X relative to the base 2; the plurality of support members 20 are used to support the movement of the wafer 4 along the first direction X. The support members 20 are spaced apart on the main member 10 and are respectively rotationally connected to the main member 10. Each support member 20 extends along the second direction Y relative to the main member 10. The support members 20 and the base 2 are arranged oppositely along the second direction Y. , the support member 20 is configured to rotate around the main body member 10 when subjected to an external force, wherein the second direction Y is perpendicular to the first direction X.

The bearing device 1 includes a main body member 10 and a plurality of support members 20. The main body member 10 is arranged around the base 2. The main body member 10 can have a variety of structural forms, such as a circular annular structure or a square annular structure. Of course, , the main component 10 may also be a non-closed annular structure with an opening, such as an arc-shaped structure, etc., which is not limited in this application. The shape of the main component 10 can be set according to the structure of the base 2. For example, when the base 2 is a cylindrical structure, the main component 10 can be set as a circular annular structure or an arc-shaped structure. At this time, it can be understood as a base. The axis of 2 is parallel to the first direction X.

A plurality of support members 20 are spaced apart on the main body member 10 and are respectively rotatably connected to the main body member 10. The support members 20 can be provided as two or more as needed. When there are two support members 20, the two support members 20 are 20 are arranged opposite to each other, and the two supporting members 20 have a certain supporting width to ensure a good bearing effect on the wafer 4 . When there are three or more support members 20 , the three or more support members 20 are spaced apart on the main body member 10 so that the support members 20 together form a stable bearing surface for carrying the wafer 4 . . Optionally, in the embodiment of the present application, multiple support members 20 are spaced apart and evenly distributed on the main body member 10. Uniform distribution means that the distance between adjacent support members 20 is the same, and the multiple support members 20 surround the main body member 10. 10 has uniform spacing in the 360° direction. The advantage of such an arrangement is that each support member 20 can be evenly stressed, which can improve the stability of the support member 20 in supporting the wafer 4 and reduce the probability of the wafer 4 shifting.

The support member 20 is rotationally connected to the main body member 10. The rotational connection can have a variety of connection forms. For example, the support member 20 and the main body member 10 can be connected through a rotating shaft, and the supporting member 20 rotates around the rotating shaft; or between the supporting member 20 and the main body member An elastic element such as a spring is provided at the connection point of the supporting member 20, and the supporting member 20 can compress the elastic element and rotate when it is stressed. Exemplarily, in FIGS. 1 to 4 , the support member 20 and the main body member 10 are connected through a rotating shaft. When loading the wafer 4, the plurality of supporting members 20 are used to abut the side of the wafer 4 facing the base 2 and support the wafer 4 to move along the first direction X. When the supporting members 20 support the wafer 4, they will be affected by the wafer 4. Under the gravity of the circle 4, the support member 20 can basically not rotate or rotate slightly, that is, it can be understood that when the support member 20 is subject to the gravity of the wafer 4, the support member 20 can be limited and fixed. It can also rotate without moving. When rotating, the rotation angle of the supporting member 20 is small and is not enough to affect the bearing of the wafer 4 . The support member 20 is configured to rotate around the main body member 10 when subjected to an external force. The external force mainly refers to that when the support member 20 overlaps the surface of the side of the wafer 4 away from the base 2, the movement of the support member 20 will squeeze it. The wafer 4 will exert a reaction force on the support member 20 after being subjected to the extrusion force, and the reaction force is the external force on the support member 20 .

Each support member 20 extends along the second direction Y relative to the main member 10. The second direction Y referred to herein is a single direction perpendicular to the first direction X. For two different support members 20, they respectively correspond to The second direction Y is different. For example, if the base 2 is a cylindrical structure, the second direction Y refers to the direction perpendicular to the axis of the base 2 and pointing to the axis. At this time, the second direction Y is also the radial direction of the base 2 . The support member 20 and the base 2 are arranged oppositely along the second direction Y. In the second direction Y, there is a gap between the support member 20 and the base 2. The advantage of this arrangement is that when the support member 20 moves along the first direction Y, When the 4's load-bearing is more stable and the load-bearing effect is better.

The carrying device 1 according to the embodiment of the present application includes a main body member 10 and a plurality of support members 20. The main body member 10 is arranged around the base 2 and can move along the first direction X relative to the base 2. The main body member 10 moves and drives The plurality of support members 20 provided on the main body member 10 move, so that the support members 20 provided opposite to the base 2 can load the wafer 4 on the base 2 so that the base 2 cools the wafer 4 . During this process, when a positional shift occurs between the wafer 4 and the support member 20, part of the support member 20 is on the side of the wafer 4 away from the base 2, and the support member 20 offsets the wafer 4 and generates an acting force. This force can drive the support member 20 to rotate in a direction away from the base 2 , thereby alleviating the influence of the force on the wafer 4 , reducing the probability of the wafer 4 being squeezed and damaged, and improving the safety of the wafer 4 during loading. .

Referring to FIGS. 1 to 4 , in some embodiments, the carrying device 1 further includes a driving mechanism 30 . The driving mechanism 30 is connected to the main body member 10 and drives the main body member 10 to move along the first direction X.

The driving mechanism 30 can be configured into a variety of structures according to different working principles, such as a cam mechanism, a crank slider mechanism, etc., or a cylinder, an electric cylinder or a hydraulic cylinder can be directly used as the driving mechanism 30, and the driving mechanism 30 is set to drive the main component. 10. It can improve the automation degree of the carrying device 1, improve its working efficiency, and save labor costs.

Please refer to FIGS. 1 to 4 . In some embodiments, the main body member 10 includes a main body part 11 and a plurality of extension parts 12 connected to the main body part 11 . The main body part 11 is arranged around the base 2 , and the plurality of extension parts 12 are arranged along the first One direction extends in the

As the structural body of the main body member 10, the main body 11 can have a variety of structural forms, for example, it can be a circular annular structure or a square annular structure, etc. Of course, the main body 11 can also be a non-closed annular shape with an opening. Structure, such as arc structure, etc.

The plurality of extension parts 12 are respectively connected to the main body part 11. There can be a variety of connection methods, such as bonding, welding or detachable connection. Of course, the extension parts 12 and the main body part 11 can also be an integrated structure, that is, the main body component. 10 is an integrated structure. A plurality of extension portions 12 extend along the first direction Use elastic elements to connect etc.

Providing a plurality of extension parts 12 on the main body part 11 is equivalent to increasing the height of the main body member 10 in the first direction X, and can increase the movement stroke of the main body member 10 in the first direction X to a certain extent, which is beneficial Increasing the working stroke of the bearing device 1 and arranging the extension portion 12 to be rotationally connected to the support member 20 can also simplify the difficulty of directly connecting the support member 20 to the main body member 10 .

When the extension part 12 and the support member 20 are connected through a rotating shaft, there may be various structural forms between the extension part 12 and the support member 20 .

In some examples, each support member 20 is disposed on one side of its corresponding extension part 12 , and a rotation axis passes between the support member 20 and the extension part 12 . The support member 20 can extend relative to the rotation axis when being stressed. Part 12 rotates.

In other examples, each support member 20 is respectively embedded in the end of its corresponding extension portion 12 away from the main body portion 11 . That is, part of the support member 20 is covered by the extension part 12. This arrangement can make the extension part 12 have a certain limiting effect on the support member 20, improve the connection strength and connection stability between the support member 20 and the extension part 12, and thus Improve the structural stability of the bearing device 1.

Further, the end of the extension part 12 away from the main body part 11 is recessed toward the direction close to the main body part 11 to form a first recessed part 120. The first recessed part 120 includes a bottom wall 120b and two side walls 120a connected to the bottom wall 120b and facing each other. The end of the support member 20 away from the base 2 is the first end 21. The first end 21 is sandwiched between the two side walls 120a. The side of the first end 21 facing the bottom wall 120b is in contact with the bottom wall 120b. Then, the first end 21 can rotate relative to the extension 12 in a direction away from the bottom wall 120b.

The side of the first end 21 facing the bottom wall 120b is in contact with the bottom wall 120b, that is, when the support member 20 carries the wafer 4, the support member 20 will be affected by the gravity of the wafer 4, and due to the first movement of the support member 20 The side of the end portion 21 facing the bottom wall 120 b is in contact with the bottom wall 120 b. The support member 20 will not rotate due to gravity, so that the wafer 4 can be stably carried and loaded on the base 2 . Only when the support member 20 overlaps the side surface of the wafer 4 away from the base 2, the support member 20 presses the wafer 4 and receives the reaction force given by the wafer 4. At this time, the first end 21 can be relative to the wafer 4. The extension part 12 rotates in a direction away from the bottom wall 120b.

The first end 21 is sandwiched between the two side walls 120a, and the first end 21 and the two side walls 120a may have various positional relationships. For example, in some examples, the first end 21 is in contact with at least one of the two side walls 120a. At this time, the first end 21 will generate sliding friction force with the side walls 120a when rotating under force; in In other examples, there is a gap between the first end 21 and the two side walls 120a. At this time, the first end 21 is not hindered by the friction force given by the side walls 120a when it is forced to rotate, so that the support member 20 is It can rotate when it is subjected to a small force, which is equivalent to reducing the force threshold for rotation of the support member 20, thereby reducing the squeezing force of the support member 20 on the wafer 4 and improving the stability of the wafer 4 during loading. safety.

Referring to FIGS. 1 to 4 , in some embodiments, the support member 20 includes a connecting portion 22 and a supporting portion 23 . The connecting portion 22 is rotationally connected to the main body member 10 and extends along the second direction Y relative to the main body member 10 ; The supporting portion 23 is connected to the connecting portion 22 along the second direction Y. The position of the supporting portion 23 relative to the connecting portion 22 is adjustable, and at least part of the supporting portion 23 extends along the second direction Y relative to the connecting portion 22. The supporting portion 23 is The supporting wafer 4 moves along the first direction X.

The connecting portion 22 is rotatably connected to the main body member 10 , and there can be a variety of connection methods, such as connecting through a rotating shaft, or using elastic elements. The support part 23 is connected to the connection part 22, and the position of the support part 23 relative to the connection part 22 is adjustable along the second direction Y. That is, it can be understood that the length of the support member 20 in the second direction Y is adjustable. The advantage of this arrangement is that when facing wafers 4 of different sizes, the length of the support member 20 can be adjusted to adapt to the wafers 4 of different sizes, thereby obtaining a good bearing effect.

At least part of the supporting part 23 extends along the second direction Y relative to the connecting part 22. Either a part of the supporting part 23 extends along the second direction Y relative to the connecting part 22, or the entire supporting part 23 extends relative to the connecting part 22. 22 extends along the second direction Y, and the specific extension manner can be determined according to the connection form of the connecting part 22 and the supporting part 23 .

For example, in some examples, the support portion 23 is telescopic in the second direction Y relative to the connecting portion 22 , that is, the supporting member 20 can be configured as a telescopic structure, such as a telescopic rod, etc., in which case the portion of the supporting portion 23 is telescopic relative to the connecting portion 22 . The portion 22 extends along the second direction Y.

In other examples, the support part 23 and the connection part 22 are connected through a third connection member. The third connection part extends along the second direction Y, with one end connected to the connection part 22 and the other end connected to the support part 23, and Both ends are detachably connected, so that the relative positions of the support part 23 and the connection part 22 can be adjusted by disassembling and replacing third connecting members of different lengths, that is, adjusting the length of the support member 20 . In this case, the entire support portion 23 extends in the second direction Y relative to the connecting portion 22 .

In some further examples, along the second direction Y, the supporting portion 23 is detachably connected to multiple locations of the connecting portion 22 . The detachable connection includes a variety of connection methods, such as snap-fitting between the supporting part 23 and the connecting part 22. The two achieve snap-fitting by providing protrusions and grooves. The protrusions and grooves can be provided in multiple directions along the second direction Y. The relative positions of the connecting part 22 and the supporting part 23 are adjusted through the cooperation of protrusions and grooves at different positions, thereby adjusting the length of the supporting member 20; or, a thread is used between the supporting part 23 and the connecting part 22. To connect, a plurality of threaded holes arranged along the second direction Y are provided on the supporting part 23 and the connecting part 22, and the relative positions of the connecting part 22 and the supporting part 23 are adjusted through the cooperation of the threaded holes at different positions, thereby realizing the supporting member. 20 length adjustment; Or, as shown in Figures 1 to 4, a through groove can be provided on the support part 23, and a plurality of threaded holes arranged along the second direction Y can be provided on the connecting part 22, and screws are used to connect the two Fastened together. In this case, the portion of the supporting portion 23 extends in the second direction Y relative to the connecting portion 22 .

Please refer to Figures 1 to 4. In some embodiments, the support portion 23 includes a support body 231 and an extension end 232. The support body 231 is connected to the connecting portion 22; the extension end 232 is connected to an end of the support body 231 away from the main body member 10. The extension end 232 extends along the second direction Y relative to the support body 231, and the extension end 232 is used to support the movement of the wafer 4 along the first direction X.

The support body 231 serves as the main structure of the support part 23 and is connected to the connecting part 22. The extension end 232 is connected to an end of the support body 231 away from the main body member 10 and extends along the second direction Y relative to the support body 231. The support body 231 and extension The end 232 forms a step in the first direction X. When the extension end 232 supports the wafer 4 to move along the first direction The probability that the two directions Y are offset in the opposite direction reduces the probability that the wafer 4 is squeezed by the carrying device 1 and the base 2 during loading, thereby improving the safety of the wafer 4 during loading.

This application also provides a wafer cooling system 100, which includes the carrying device 1 of any of the above embodiments, a base 2 and a cavity component 3. The base 2 is used to support and cool the wafer 4, and the cavity component 3 is provided There is a base 2 and a carrying device 1.

The base 2 is used to cool the wafer 4. There are many cooling methods, such as air cooling, water cooling, etc. Exemplarily, in the embodiment of the present application, the base 2 adopts a water cooling method. 2 is provided with a cooling water pipe inside, and the wafer 4 is cooled by the flow of cooling water. When the base 2 cools the wafer 4, the end of the base 2 facing the wafer 4 has a supporting effect on the wafer 4, and its shape can be set according to the shape of the wafer 4. For example, the wafer 4 is round. When the wafer 4 is elliptical, the base 2 can be configured to have a circular end surface, or when the wafer 4 is elliptical, the base 2 can be configured to have an elliptical end surface. In order to reduce the possibility of interference between the carrying device 1 and the base 2 when loading the wafer 4 , generally, the projection of the end surface of the base 2 facing the wafer 4 in the first direction X is usually located along the edge of the wafer 4 In the projection in the first direction on the base 2, and reduce the possibility of interference between the carrying device 1 and the base 2. Of course, in some cases, in order to ensure that the base 2 has a better cooling effect on the wafer 4 , the projection of the end surface of the base 2 facing the wafer 4 in the first direction The projection in the first direction X coincides with or covers the projection of the wafer 4 along the first direction The end of 20 close to the base 2 can move within the sunken portion corresponding to itself.

The cavity component 3 has the function of accommodating the carrying device 1 and the base 2. It can be arranged in a variety of structures according to needs, such as a cylindrical structure or a rectangular parallelepiped structure with accommodating cavity. Of course, it can also be other irregular structures. For ease of presentation, FIG. 1 only shows part of the structure of the cavity assembly 3 . The fact that the carrying device 1 is accommodated in the cavity component 3 does not mean that the carrying device 1 is completely located inside the cavity component 3, but in some cases, part of the carrying device 1 can be located outside the cavity component 3, such as in Figure 1, When the carrying device 1 includes the driving mechanism 30 , part of the driving mechanism 30 extends out of the cavity assembly 3 .

As a specific embodiment of the present application, please refer to FIGS. 1 to 4 . The carrying device 1 in the embodiment of the present application includes a main body member 10 and a plurality of supporting members 20 . The main body member 10 includes a main body part 11 and a support member connected to the main body part 11 . A plurality of extension portions 12, the main body portion 11 is arranged around the base 2, the plurality of extension portions 12 extend along the first direction When moving When the extension part 12 extends along the second direction Y, the support part 23 is connected to the connection part 22, and along the second direction Y, the position of the support part 23 relative to the connection part 22 is adjustable, and at least part of the support part 23 is relative to the connection part 22 extends along the second direction Y, the support portion 23 is used to support the wafer 4 to move along the first direction Rotation about the body member 10 with the second direction Y perpendicular to the first direction X.

The carrying device 1 according to the embodiment of the present application includes a main body member 10 and a plurality of support members 20. The main body member 10 is arranged around the base 2 and can move along the first direction X relative to the base 2. The main body member 10 moves and drives The plurality of support members 20 provided on the main body member 10 move, so that the support members 20 provided opposite to the base 2 can load the wafer 4 on the base 2 so that the base 2 cools the wafer 4 . During this process, when a positional shift occurs between the wafer 4 and the support member 20 , part of the support member 20 may overlap the side of the wafer 4 away from the base 2 , causing the support member 20 to offset the wafer 4 . Generating a force, this force can drive the support member 20 to rotate in a direction away from the base 2, thereby alleviating the influence of the force on the wafer 4, reducing the probability of the wafer 4 being squeezed and damaged, and improving the loading of the wafer 4. time security.

Moreover, the support member 20 includes a connecting part 22 and a supporting part 23. The supporting part 23 is connected to the connecting part 22 and is adjustable along the second direction Y relative to the connecting part 22. When facing wafers 4 of different types and sizes, The length of the support member 20 can be adjusted by adjusting the relative positions of the support portion 23 and the connection portion 22 to adapt to wafers 4 of different sizes to obtain a good bearing effect.

Although the application has been described with reference to preferred embodiments, various modifications may be made and equivalents may be substituted for parts thereof without departing from the scope of the application, in particular provided that no structural conflicts exist , the technical features mentioned in each embodiment can be combined in any way. The application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

A carrying device for a wafer cooling system. The wafer cooling system includes a base for supporting and cooling the wafer. The carrying device includes:

a main body member configured to surround the base, the main body member being movable in a first direction relative to the base;

A plurality of support members used to support the wafer to move along the first direction. The plurality of support members are spaced apart on the main body member and are respectively rotationally connected to the main body member. Each support member Both extend along the second direction relative to the main body member, the support member and the base are arranged oppositely along the second direction, and the support member is configured to rotate around the main body member when subjected to an external force, so The second direction is perpendicular to the first direction.
The carrying device according to claim 1, wherein the carrying device further includes a driving mechanism connected to the main body member and driving the main body member to move in the first direction.
The carrying device according to claim 1, wherein the main body member includes a main body part and a plurality of extension parts connected to the main body part, the main body part is arranged around the base, and the plurality of extension parts are arranged along The first direction extends and is distributed on the main body part at intervals, and each extension part is rotatably connected to its corresponding supporting member.
The carrying device according to claim 3, wherein each of the support members is respectively embedded in an end of its corresponding extension portion away from the main body.
The carrying device according to claim 4, wherein,

The end of the extension portion away from the main body portion is recessed toward a direction close to the main body portion to form a first recessed portion. The first recessed portion includes a bottom wall and two side walls connected to the bottom wall and facing each other,

One end of the support member away from the base is a first end. The first end is sandwiched between the two side walls. The first end faces the side of the bottom wall and The bottom wall abuts, and the first end portion is rotatable relative to the extension portion in a direction away from the bottom wall.
The carrying device according to claim 5, wherein there is a gap between the first end and the two side walls.
The load-bearing device of claim 1, wherein the support member includes:

a connecting portion, which is rotationally connected to the main body member, and the connecting portion extends along the second direction relative to the main body member;

A support portion is connected to the connection portion, the position of the support portion relative to the connection portion is adjustable along the second direction, and at least part of the support portion is along the direction relative to the connection portion. Extending in the second direction, the support portion is used to support the wafer to move in the first direction.
The carrying device according to claim 7, wherein the supporting part is detachably connected to the connecting part at multiple locations along the second direction.
The carrying device according to claim 7, wherein the supporting part includes:

a support body connected to the connecting portion; and

An extension end is connected to an end of the support body away from the main body member, the extension end extends along the second direction relative to the support body, and the extension end is used to support the wafer along the Move in the first direction.
A wafer cooling system including:

The carrying device according to any one of claims 1 to 9;

a pedestal for supporting and cooling the wafer; and

A cavity assembly is provided with the base and the carrying device.