CN216487983U

CN216487983U - Bearing assembly, wafer conveying device and wafer heat treatment equipment

Info

Publication number: CN216487983U
Application number: CN202122313993.6U
Authority: CN
Inventors: 邵鑫
Original assignee: Yangtze Memory Technologies Co Ltd
Current assignee: Yangtze Memory Technologies Co Ltd
Priority date: 2021-09-23
Filing date: 2021-09-23
Publication date: 2022-05-10
Anticipated expiration: 2031-09-23

Abstract

The embodiment of the application discloses a bearing assembly, a wafer conveying device and wafer heat treatment equipment, wherein the bearing assembly comprises a supporting piece and at least three ejector pins, the ejector pins are connected with the supporting piece, each ejector pin is provided with a bearing surface used for bearing a wafer and a guide surface connected with the bearing surface, a bearing space of the wafer is limited by the bearing surface and the guide surface, and the farther the guide surface is away from the bearing surface, the farther the distance between the part of the guide surface and the central axis of the bearing space is. When the wafer is placed on the bearing device through the manipulator, the position of the manipulator for placing the wafer is likely to deviate, the wafer can be obliquely placed on the top of the ejector pin, and the guide surface of the embodiment of the application can guide the wafer placed on the top of the ejector pin to obliquely move along the bearing surface, so that the wafer is accurately placed in the bearing space.

Description

Bearing assembly, wafer conveying device and wafer heat treatment equipment

Technical Field

The present disclosure relates to the field of semiconductor manufacturing technologies, and in particular, to a carrier assembly, a wafer transfer apparatus and a wafer heat treatment apparatus.

Background

In the manufacturing process of the wafer, because a certain amount of water vapor and other volatile impurities are adsorbed on the surface of the wafer, which may adversely affect the subsequent processing of the wafer, the wafer needs to be placed into a heat treatment chamber of a heat treatment apparatus for heat treatment, so as to remove the water vapor and impurities adsorbed on the wafer.

SUMMERY OF THE UTILITY MODEL

In view of the above problems, the present application provides a carrier assembly, a wafer transfer device and a wafer heat treatment apparatus, which can effectively and accurately place a wafer in a carrier space.

In a first aspect, an embodiment of the present application provides a carrier assembly, which includes a supporting member and at least three pins, the pins are disposed on the supporting member at intervals, each pin has a carrying surface for carrying a wafer and a guiding surface connected to the carrying surface, the carrying surface and the guiding surface define a carrying space for the wafer, and a distance between a portion of the guiding surface farther away from the carrying surface and a central axis of the carrying space is farther.

Based on bearing assembly of this application embodiment, bearing space of wafer is connected and restricted out through the bearing surface and the spigot surface of design thimble, the position that the spigot surface is far away from the bearing surface is far away from with the distance between the axis of bearing space for when the position that the manipulator placed the wafer shifts, the wafer that should place on the bearing surface is placed on the spigot surface, and one end of wafer is lapped on the spigot surface to one side promptly, because the distance between the position that the spigot surface is far away from the bearing surface more and the axis of bearing space is far away, the part that the spigot top was lapped to the guide surface guide wafer to the bearing surface motion, the wafer is accurately placed in bearing space from this.

In some embodiments, the supporting member has a circular opening, and the projection of the guiding surface and the supporting surface on the supporting member along the central axis direction is located in the circular opening.

Based on the above embodiment, the circular opening formed by the supporting member can enable the bearing component to surround the periphery of the pedestal, and can generate displacement along the axis direction of the circular opening, and the projection of the guide surface along the axis direction and the projection of the bearing surface along the axis direction are both projected into the circular opening, so that the contact area between the wafer and the pedestal is increased when the wafer is in contact with the pedestal, and the thermal treatment of the wafer is facilitated.

In some embodiments, the thimble comprises a bearing part and a guide part, wherein the bearing part is connected with the support part and is provided with a bearing surface; the guide piece is provided with a guide surface, is convexly arranged on the bearing piece and is adjacent to the bearing surface.

Based on the above embodiment, the arrangement of the guide and the bearing member enables the wafer to be accurately placed in the bearing space, and the accuracy of placing the wafer is further improved.

In some embodiments, the supporting member is provided with an exhaust hole, the exhaust hole penetrates through the supporting member, and the exhaust hole is provided with an exhaust port on the supporting surface.

Based on the above embodiment, in an application scenario of wafer heat treatment, an inert gas introduced when a wafer is heated on a susceptor forms a gas film between the susceptor and between the wafer and a carrying surface, the gas film reduces friction between the wafer and the susceptor and between the wafer and the carrying surface, which may cause the wafer to slide relatively, and the exhaust holes are formed to exhaust gas between the wafer and the carrying surface, increase friction between the carrying surface and the wafer, prevent the wafer from sliding relatively, and enable the wafer to be stably located in the carrying space.

In some embodiments, the guide member further comprises an arc-shaped surface connected with a side of the guide surface away from the bearing surface.

Based on above-mentioned embodiment, the arcwall face plays the effect of transition, and the arcwall face makes the wafer more easily overlap and lean on the spigot surface to realize the accuracy of wafer and place, and because the arcwall face has the radian, be difficult for leaving the scratch on the wafer surface when making the wafer move on the arcwall face.

In some embodiments, the guide is integrally formed with the carrier.

Based on the embodiment, the guide piece and the bearing piece are integrally formed, so that the structural strength of the thimble formed by the guide piece and the bearing piece is ensured, and the thimble is convenient to manufacture and install.

In some embodiments, the angle formed between the guiding surface and the bearing surface is α, and α satisfies: alpha is more than or equal to 110 degrees and less than or equal to 130 degrees, and/or the height of the guide piece compared with the bearing surface is h, and h satisfies that h is more than or equal to 2cm and less than or equal to 3.5 cm.

Based on the embodiment, the design of the thimble meets the conditional expression, so that the wafer can be placed in the bearing space more accurately.

In some embodiments, the thimbles are evenly distributed circumferentially about the central axis.

Based on the embodiment, the thimbles are uniformly distributed in the circumferential direction of the central axis, so that the wafer is not easy to fall off from the bearing assembly in the process of sliding from the guide surface to the bearing surface, the external force applied to the wafer when the wafer is static in the bearing space is balanced, and the stability of the wafer in the bearing space is ensured.

In a second aspect, an embodiment of the present application provides a wafer transferring apparatus, which includes a carrier assembly and a driving assembly, wherein the driving assembly is connected to a supporting member.

According to the wafer conveying device, the driving assembly is connected with the supporting piece, the movement of the bearing assembly can be driven, the conveying of the wafer can be realized on the basis that the wafer is accurately placed in the bearing space, and therefore the probability that the wafer cannot be accurately placed in the bearing space to slide in the conveying process is reduced.

In a third aspect, an embodiment of the present application provides a wafer thermal processing apparatus, which includes a base, a housing, and a wafer conveying device, where the housing has a thermal processing chamber, the base is disposed in the thermal processing chamber, a driving assembly and a carrying assembly are both disposed in the thermal processing chamber, and the driving assembly drives the carrying assembly to move relative to the base.

According to the wafer heat treatment equipment, the wafer conveying device is arranged in the heat treatment cavity, so that the wafers with different qualities can be accurately placed in the bearing space, the wafers can be subjected to heat treatment, and the probability of slip sheets in the heat treatment process due to the fact that the wafers cannot be accurately placed in the bearing space is reduced.

Based on the bearing assembly, the wafer conveying device and the wafer heat treatment equipment, the bearing space of the wafer is limited by connecting the bearing surface of the thimble with the guide surface, the farther the distance between the part of the guide surface, which is far away from the bearing surface, and the central axis of the bearing space is, when the position of the manipulator for placing the wafer deviates, one end of the wafer is obliquely lapped on the guide surface, and the part of the wafer, which is obliquely lapped on the top of the thimble, is guided by the guide surface to move towards the bearing surface, so that the effect that the wafer is accurately placed in the bearing space is achieved.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is a schematic structural diagram of a load bearing assembly according to an embodiment of the present application;

FIG. 2 is an enlarged view of portion A of FIG. 1;

FIGS. 3a, 3b, and 3c are schematic diagrams illustrating the relative movement between the wafer and the base during the heat treatment process in the related art;

FIGS. 4a, 4b, and 4c are schematic diagrams illustrating a situation of wafer slipping in the related art;

FIGS. 5a, 5b and 5c are schematic views illustrating another situation of wafer slipping in the related art;

FIG. 6 is a schematic view of a susceptor bearing a wafer according to an embodiment of the present application;

FIG. 7 is a schematic cross-sectional view taken along section B-B of FIG. 1;

FIG. 8 is a schematic diagram of a wafer heat treatment apparatus according to an embodiment of the present application.

Reference numerals: 1. wafer heat treatment equipment; 10. a conveying device; 20. a wafer; 30. a base; 40. a housing; 100. a load bearing assembly; 110. a support member; 120. a thimble; 121. a bearing surface; 122. a guide surface; 123. a circular opening; 124. a carrier; 1241. a connecting portion; 1242. an extension portion; 1243. an exhaust hole; 125. a guide member; 1251. an arc-shaped surface; 200. a drive assembly; m, a central line; alpha, an included angle; h. height.

Detailed Description

In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.

In the related art, because the structural design of the ejector pins has a problem that the space formed among the ejector pins for accommodating the wafer is only slightly larger than the wafer, the manipulator is difficult to accurately place the wafer in the space for accommodating the wafer, so that the wafer can be obliquely lapped on the tops of the ejector pins and cannot be accurately placed in the space formed among the ejector pins for accommodating the wafer.

In a first aspect, referring to fig. 1 to fig. 2, an embodiment of the present application provides a carrier assembly 100, including a support 110 and at least three pins 120.

The support 110 is used for carrying the thimble 120, and the support 110 may be a circular, square, diamond, oval, irregular figure, etc. with a plate-shaped structure, and the shape of the support 110 is not limited in the embodiment of the present application.

At least three pins 120 are disposed on the supporting member 110 at intervals, each pin 120 has a carrying surface 121 for carrying the wafer 20 and a guiding surface 122 connected to the carrying surface 121, the carrying surface 121 and the guiding surface 122 define a carrying space of the wafer 20, and a distance between a portion of the guiding surface 122 farther from the carrying surface 121 and a central axis M of the carrying space is farther.

When the wafer 20 is placed in the carrying space by the robot, the position of the robot for placing the wafer 20 may be shifted, and the wafer 20 cannot be accurately placed in the carrying space, at this time, the wafer 20 is obliquely lapped on top of one or more pins 120, the surface of the wafer 20 contacts with the guide surface 122, because the farther the guide surface 122 is from the central axis M of the carrying space, that is, the obtuse angle is formed between the carrying surface 121 of the same pin 120 and the guide surface 122, the wafer obliquely lapped on top of the pin 120 slides towards the carrying surface 121 under the guiding action of the guide surface 122, so that the wafer 20 slides into the carrying space, and the wafer 20 is accurately placed in the carrying space. In addition, the guiding surface 122 plays a role of buffering when the wafer 20 slides to the carrying surface 121, so as to prevent the wafer 20 from directly falling to the carrying surface 121 from the top of the thimble 120, and prevent the wafer 20 from being damaged due to direct collision between the wafer and the carrying surface 121.

Specifically, the connection mode of the thimble 120 and the support 110 may be a welding mode, a gluing mode, a clamping mode, a screwing mode, and the like, which are common in the art, and the connection mode of the thimble 120 and the support 110 is not limited in the embodiment of the present application. In the present embodiment, at least three pins 120 are disposed on the support 110 at intervals, so that the carrier assembly 100 can more stably carry the wafer 20. It is understood that three points not on the same straight line may define a plane, and thus the embodiment of the present invention may stably support the wafer 20 by providing at least three pins 120. The number of the ejector pins 120 may also be four, five, six, etc., and the number of the ejector pins 120 is not limited herein.

It is understood that in some embodiments, the number of the pins 120 may be one, and the pins 120 may include an annular bearing surface and an annular guide surface, and a bearing space defined by the annular bearing surface and the annular guide surface may also be used for bearing the wafer 20; in other embodiments, the number of the pins 120 is two, and at this time, the bearing surface and the guiding surface of the pin 120 are circular arc-shaped, and the pins 120 are arranged symmetrically along the central axis M, so as to also realize bearing of the wafer 20.

Since the surface of the wafer 20 may absorb a certain amount of water vapor and other volatile impurities during the manufacturing process, which may adversely affect the subsequent processing of the wafer 20, the wafer 20 needs to be placed in a thermal processing chamber for heating to remove the water vapor and impurities absorbed on the wafer 20. Referring to fig. 3a to 3c, after the wafer 20 is transferred into the thermal processing chamber, as shown in fig. 3a, the robot places the wafer 20 on the ejector pin 120, and as the position of the ejector pin 120 is lowered, as shown in fig. 3b, the wafer 20 is carried on the base 30, the base 30 heats the wafer 20, and after the wafer 20 is heated, as shown in fig. 3c, the ejector pin 120 is raised to drive the wafer 20 to rise and reach the wafer transfer position, and then the robot picks up the wafer 20 and moves out of the thermal processing chamber for the subsequent processing step of the wafer 20.

As shown in fig. 4a to 4c, the process of sliding the wafer 20 off the thimble 120 is called sliding sheet. In the related art, when the position of the robot for placing the wafer 20 is shifted, as shown in fig. 4a, the wafer 20 will be obliquely lapped on the top of the thimble 120, and when the thimble 120 places the wafer 20 carried on the base 30, as shown in fig. 4b, the wafer 20 is obliquely placed on the base 30, and the wafer 20 is unevenly heated on the base 30; during the raising process of the thimble 120, as shown in fig. 4c, the wafer 20 may slide on the thimble 120 due to unbalanced force applied to the wafer 20, so as to generate a slip.

To avoid such a situation, as shown in fig. 1, in some embodiments, the supporting member 110 has a circular opening 123, and the projection of the guiding surface 122 and the supporting surface 121 on the supporting member 110 along the central axis M is located in the circular opening 123. It can be appreciated that, since the susceptor 30 is generally circular or cylindrical, the circular opening 123 of the support 110 can allow the support 110 to be sleeved around the susceptor 30, and the support 110 can be lowered along the central axis M, so as to place the wafer 20 on the thimble 120 on the susceptor 30, and thus heat the wafer 20 through the susceptor 30. The shape of the supporting member 110 in this embodiment is a circular ring, in other embodiments, the supporting member 110 may also be square, diamond, oval, or the like, and a circular opening 123 may also be formed in the supporting member 110. In the embodiment, the projections of the guiding surface 122 and the carrying surface 121 on the supporting member 110 along the central axis M are located in the circular opening 123, in other words, the projection of the carrying space limited by the pin 120 along the central axis M is located in the circular opening 123, when the pin 120 places the wafer 20 on the susceptor 30 for heating, the design not only makes the wafer 20 heated on the susceptor 30 uniformly, but also increases the contact area between the surface of the wafer 20 and the susceptor 30, which is beneficial to improving the heat treatment efficiency of the wafer.

It should be appreciated that, in order to ensure the stability of the wafer 20 placed on the susceptor 30, the central point of the circular opening 123, the central axis of the susceptor 30 and the central axis M of the carrying device 100 may be in a coincident relationship, in this embodiment, the central point of the circular opening 123, the central axis of the susceptor 30 and the central axis M of the carrying space are coincident, and when the three coincide, the wafer 20 may be placed on the susceptor 30 more stably.

As shown in fig. 1, in some embodiments, the pins 120 are evenly circumferentially distributed about the central axis M. In the process that the wafer 20 slides on the bearing surface 121, the uniform distribution of the pins 120 can make the wafer 20 receive the supporting force given by the guide surface 122, so that the wafer 20 is not easy to slide off the pins 120 in the process of sliding on the bearing surface 121; the uniform distribution of the pins 120 also enables the wafer 20 to be stably placed in the loading space when the wafer 20 is completely located in the loading space.

As shown in fig. 2, in some embodiments, the thimble 120 further includes a carrier 124 and a guide 125. The carrier 124 is connected to the support 110 and has a carrying surface 121, and the carrier 124 plays a role of carrying the wafer 20; the guiding element 125 is protruded from the carrier 124, the guiding element 125 has a guiding surface 122, and the guiding element 125 is adjacent to the carrier 121, so that the guiding surface 122 is connected to the carrier 121, and the carrier 124 and the guiding element 125 cooperate to allow the wafer 20 to be stably placed in the carrier space.

More specifically, the carrier 124 includes a connection portion 1241 and an extension portion 1242. The connecting portion 1241 is connected to the supporting member 110, the extending portion 1242 is protruded from the connecting portion 1241, and an extending direction of the extending portion 1242 faces the central line M, so that projections of the guiding surface 122 and the supporting surface 121 on the supporting member 110 along the central axis M are located in the circular opening 123.

As shown in fig. 5 a-5 c, the presence of an "air cushion effect" between the wafer 20 and the susceptor 30 may also result in another situation of slip. The "air cushion effect" means that a layer of air exists between two objects, so that the two objects are not in direct contact, and therefore, the friction force between the two objects is greatly reduced. The heating process of the wafer 20 in the heat treatment chamber is performed at a high temperature, inert gas for auxiliary heating is introduced between the wafer 20 and the base 30, so that the wafer 20 is uniformly heated, a layer of gas exists between the wafer 20 and the base 30 and between the wafer 20 and the ejector pin 120, so that a 'gas cushion effect' is generated, the friction force between the wafer 20 and the base 30 and between the wafer 20 and the ejector pin 120 is greatly reduced, and the gas blowing direction of the inert gas is not necessarily stable and constant, and the wafer 20 may move on the surface of the base 30 due to the turbulent inert gas; as shown in fig. 3b, since the wafer 20 carrying space formed by the ejector pins 120 is larger than the size of the wafer 20, the wafer 20 may move in the horizontal direction, and when the distance that the wafer 20 moves in the horizontal direction is too large, a part of the ejector pins 120 may not be able to carry the wafer 20 due to the horizontal movement of the wafer 20; as shown in fig. 3c, when the pin 120 is raised, only a portion of the pin 120 can carry the wafer 20 and drive the wafer 20 to be raised, so that the wafer 20 is unbalanced in the raising process of the pin 120 and slides.

Referring to fig. 6, in order to solve the sliding vane problem caused by the "air cushion effect", the supporting element 124 is provided with an air vent 1243, the air vent 1243 penetrates through the supporting element 124, and the air vent 1243 has an air vent on the supporting surface 121. The arrows in fig. 6 indicate the flow direction of the inert gas between the wafer 20 and the pin 120, the inert gas is sprayed toward the wafer 20 through the channel between the susceptor 30 and the pin 120, and the inert gas is spread on the surface of the wafer 20 after contacting the wafer 20, so as to form a gas film between the wafer 20 and the susceptor 30 and between the wafer 20 and the pin 120, and reduce the friction between the wafer 20 and the susceptor 30 and the carrying surface 121; after the lift pin 120 forms an exhaust opening on the carrying surface 121, the inert gas between the wafer 20 and the lift pin 120 is exhausted through the exhaust hole 1243, and the exhaust of the inert gas can reduce or eliminate the gas film formed between the wafer 20 and the lift pin 120, thereby reducing the "gas cushion effect" between the wafer 20 and the lift pin 120 and enabling the wafer 20 to directly contact with the carrying surface 121. Therefore, the friction between the wafer 20 and the thimble 120 is increased, so that the wafer 20 is not easy to move in the horizontal direction during the heating process, and the wafer 20 is prevented from sliding in the process of lifting the thimble 120.

In this embodiment, the shape of the exhaust port may be circular, oval, semicircular, square, diamond, etc., and the opening shape of the exhaust port is not limited herein. The section of the vent hole 1243 perpendicular to the hole center line may be in an irregular shape such as a circle, an ellipse, a semicircle, a square, a diamond, etc., in other embodiments, another vent hole is further opened on the bearing member 124 of the vent hole 1243, and the two vent holes of the vent hole 1243 may be in different shapes, where the structural feature of the vent hole 1243 is not limited; similarly, the arrangement position of the vent hole 1243 may not be limited, and the vent hole 1243 may be located in the center of the supporting surface 121 or near the edge of the supporting surface 121. When the air vent 1243 is opened at the center of the carrying surface 121, the "air cushion effect" can be reduced well. The exhaust holes 1243 may also be formed at the edge of the carrying surface 121, i.e. exhaust through grooves, which may also reduce the "air cushion effect" between the wafer 20 and the pins 120.

In still other embodiments, as shown in fig. 7, the guide 125 further includes an arcuate surface 1251, the arcuate surface 1251 being coupled to a side of the guide surface 122 remote from the bearing surface 121. The arc shape of the arc-shaped surface 1251 may be a circular arc, an elliptical arc, or the like, which is not limited in this embodiment. When the wafer 20 obliquely rides on the arc-shaped surface 1251, the arc of the arc-shaped surface 1251 makes it easier for the wafer 20 to slide toward the guide surface 122. During the process of sliding the wafer 20 toward the carrying surface 121, the wafer slides on the arc-shaped surface 1251 and the guide surface 122 in sequence, and finally slides to the carrying surface 121. When the wafer 20 slides on the arc-shaped surface 1251, the thimble 120 is not easy to scratch the surface of the wafer 20, so as to avoid the wafer 20 from generating surface defects during the sliding process.

In some embodiments, the guide 125 and the carrier 124 are integrally formed, so that the structural strength of the thimble 120 formed by the guide 125 and the carrier 124 can be ensured, and the manufacturing of the thimble 120 is facilitated, and the manufacturing cost is reduced.

Further, it can be understood that the guiding effect of the guiding surface 122 depends on the one hand on the included angle α formed between the guiding surface 122 and the bearing surface 121 and on the other hand on the height h of the guiding element 125 relative to the bearing surface 121.

As shown in fig. 7, in some embodiments, the intersection angle between the guiding surface 122 and the bearing surface 121 is α, and α satisfies: the constraint condition of the included angle α is 110 ≦ α ≦ 130 °, so that the wafer 20 can be placed in the carrying space more accurately, i.e., under the constraint condition, the wafer 20 can more easily realize the process of wafer rounding to the carrying surface 121. When the included angle α satisfies 0 ° < α <90 °, the wafer 20 may not be placed in the carrying space by the robot; when the included angle α satisfies 90 ° < α <110 °, the buffer effect of the guiding surface 122 is small, and the wafer 20 may collide with the carrying surface 121 to damage the wafer 20; when the included angle α satisfies 130 ° < α <180 °, the supporting force given to the wafer 20 by the guide surface 122 may not be sufficient to slide the wafer 20 toward the carrying surface 121. In other embodiments, the included angle α may be 115 °, 120 °, 125 °, or the like.

As shown in fig. 7, in some embodiments, the height of the guiding element 125 compared to the bearing surface 121 is h, and h satisfies: h is more than or equal to 2cm and less than or equal to 3.5 cm. The constraint on the height h enables the wafer 20 to be more easily placed on the guide surface 122, when the height h is lower, the supporting force applied to the wafer 20 may not be enough to make the wafer 20 slide toward the carrying surface 121, and the wafer 20 may slip during the raising process of the thimble 120; when the height h is high, the guiding surface 122 has a small buffer effect, and the wafer 20 may collide with the carrying surface 121 to damage the wafer 20. In other embodiments, the height h may take on a value of 2.5cm, 3cm, and the like.

It should be noted that the height h and the included angle α may both constrain the carrying space surrounded by the pins 120, or may both be limited independently, so that when the height h and the included angle α constrain the carrying space formed by the pins 120, the wafer 20 can be better guided to slide into the carrying space.

In a second aspect of the present application, as shown in fig. 8, the wafer transferring apparatus 10 includes the above-mentioned carrier assembly 100 and a driving assembly 200, the driving assembly 200 is connected to the carrier assembly 100, and the driving assembly 200 may be a servo motor or a stepping motor, etc., and can drive the carrier assembly 100 to move along the central axis M. According to the wafer transfer device 10 of the embodiment of the application, by installing the bearing component 100 as described above, on the basis that the wafer 20 is accurately placed in the bearing space, the wafer 20 can be prevented from sliding down from the bearing space in the moving process of the bearing component 100, and the probability that the wafer 20 slides in the moving process of the bearing component 100 along the central axis M is reduced.

In a third aspect of the present application, a wafer heat treatment apparatus 1 is provided, as shown in fig. 8, the wafer heat treatment apparatus 1 includes a pedestal 30, a housing 40 and the above wafer transferring device 10, the housing 40 has a heat treatment chamber, the pedestal 30 is disposed in the heat treatment chamber, a driving assembly 200 and a carrying assembly 100 are disposed in the heat treatment chamber, and the driving assembly 200 drives the carrying assembly 100 to move relative to the pedestal 30. According to the wafer heat treatment equipment 1 of the embodiment of the application, the wafer transmission device 10 is installed, so that on the basis that the wafer 20 is subjected to heat treatment by the wafer heat treatment equipment 1, the probability of generating the slip sheet in the heat treatment process due to the fact that the wafer 20 cannot be accurately placed in the bearing space can be reduced.

The same or similar reference numerals in the drawings of the present embodiment correspond to the same or similar parts; in the description of the present application, it is to be understood that if there is an orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", etc. based on the orientation or positional relationship shown in the drawings, it is only for convenience of description and simplification of description, but it is not intended to indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and therefore, the terms describing the positional relationship in the drawings are only for illustrative purposes and are not to be construed as limitations of the present patent, and specific meanings of the above terms may be understood by those skilled in the art according to specific situations.

The present invention is not intended to be limited to the particular embodiments shown and described, but is to be accorded the widest scope consistent with the principles and novel features herein disclosed.

Claims

1. A carrier assembly for carrying a wafer, comprising:

a support member; and

the wafer bearing device comprises at least three thimbles arranged on the supporting piece at intervals, each thimble is provided with a bearing surface for bearing the wafer and a guide surface connected with the bearing surface, the bearing surface and the guide surface limit the bearing space of the wafer, and the farther the guide surface is away from the part of the bearing surface and the farther the distance between the central axes of the bearing space is.

2. The load bearing assembly of claim 1,

the supporting piece is provided with a circular opening, and the projection of the guide surface and the bearing surface on the supporting piece along the central axis direction is positioned in the circular opening.

3. The carrier assembly of claim 1, wherein the ejector pin comprises:

the bearing part is connected with the supporting part and is provided with the bearing surface; and

the guide piece is provided with the guide surface and is convexly arranged on the bearing piece and adjacent to the bearing surface.

4. The load bearing assembly of claim 3,

the bearing part is provided with an exhaust hole which penetrates through the bearing part, and the exhaust hole is provided with an exhaust port on the bearing surface.

5. The carrier assembly of claim 3, wherein the guide further comprises:

the arc-shaped surface is connected with the side edge, far away from the bearing surface, of the guide surface.

6. The load bearing assembly of claim 3,

the guide and the bearing piece are integrally formed.

7. The load bearing assembly of claim 3,

the guide surface and the bearing surface form an included angle alpha, and alpha satisfies: 110 DEG-alpha-130 DEG and/or the height of the guide piece compared with the bearing surface is h, and h satisfies: h is more than or equal to 2cm and less than or equal to 3.5 cm.

8. The load bearing assembly of any of claims 1-7,

the ejector pins are uniformly distributed in the circumferential direction of the central axis.

9. A wafer transfer apparatus, comprising:

the load bearing assembly of any of claims 1-8; and

a drive assembly connected with the support.

10. An apparatus for heat-treating a wafer, comprising:

a base;

a housing having a thermal processing chamber, the susceptor disposed within the thermal processing chamber; and

the wafer transfer apparatus of claim 9, wherein the drive assembly and the carrier assembly are disposed within the thermal processing chamber, the drive assembly driving the carrier assembly to move relative to the pedestal.