WO2024040967A1 - 光模块 - Google Patents

光模块 Download PDF

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Publication number
WO2024040967A1
WO2024040967A1 PCT/CN2023/084071 CN2023084071W WO2024040967A1 WO 2024040967 A1 WO2024040967 A1 WO 2024040967A1 CN 2023084071 W CN2023084071 W CN 2023084071W WO 2024040967 A1 WO2024040967 A1 WO 2024040967A1
Authority
WO
WIPO (PCT)
Prior art keywords
groove
conductive member
elastic conductive
optical module
optical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2023/084071
Other languages
English (en)
French (fr)
Inventor
陈金磊
徐发部
司宝峰
潘红超
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hisense Broadband Multimedia Technology Co Ltd
Original Assignee
Hisense Broadband Multimedia Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hisense Broadband Multimedia Technology Co Ltd filed Critical Hisense Broadband Multimedia Technology Co Ltd
Publication of WO2024040967A1 publication Critical patent/WO2024040967A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements

Definitions

  • the present disclosure relates to the field of communication technology, and in particular, to an optical module.
  • optical modules are devices that realize photoelectric signal conversion and are one of the key components in optical communication equipment.
  • the present disclosure provides an optical module.
  • the optical module includes an upper housing, a lower housing and an optical fiber array.
  • a first groove is formed in the upper housing, and a first elastic conductive member is placed in the first groove.
  • a second groove is formed in the lower housing, and a second elastic conductive member is placed in the second groove.
  • the upper shell and the lower shell form a shell, and two third grooves are formed in the shell.
  • the two third grooves are located on both sides of the first groove, and the third grooves are connected with the first groove.
  • two third grooves are located on both sides of the second groove, and the third grooves are connected with the second groove.
  • a conductive rubber strip is placed in the third groove, and the conductive rubber strip is connected to the upper shell and the lower shell respectively.
  • the first elastic conductive member is connected to the second elastic conductive member.
  • the optical fiber array is located at the connection between the first elastic conductive member and the second elastic conductive member.
  • the first elastic conductive member and the second elastic conductive member are both connected to the optical fiber array.
  • the width dimension of the first groove connected with the third groove is smaller than the width dimension of the second groove, and the width dimension of the first elastic conductive member is smaller than the width dimension of the second elastic conductive member, so that the second elastic conductive member
  • the surface is connected with conductive tape.
  • the width dimension of the second groove connected to the third groove is smaller than the width dimension of the first groove, and the width dimension of the second elastic conductive member is smaller than the width dimension of the first elastic conductive member, so that the first elastic conductive member
  • the surface is connected with conductive tape.
  • Figure 1 is a partial architecture diagram of an optical communication system according to some embodiments of the present disclosure
  • Figure 2 is a partial structural diagram of a host computer provided according to some embodiments of the present disclosure.
  • Figure 3 is a structural diagram of an optical module provided according to some embodiments of the present disclosure.
  • Figure 4 is a partial exploded view of an optical module provided according to some embodiments of the present disclosure.
  • Figure 5 is a structural diagram of the lower housing of an optical module according to some embodiments of the present disclosure.
  • Figure 6 is a structural diagram of an upper housing in an optical module according to some embodiments of the present disclosure.
  • Figure 7 is a cross-sectional view of an optical module provided according to some embodiments of the present disclosure.
  • Figure 8 is a cross-sectional view from another perspective of an optical module according to some embodiments of the present disclosure.
  • Figure 9 is a structural diagram of the first elastic conductive member, the second elastic conductive member, the conductive rubber strip and the optical fiber ribbon in an optical module according to some embodiments of the present disclosure
  • Figure 10 is a second structural view of the first elastic conductive member, the second elastic conductive member, the conductive rubber strip and the optical fiber ribbon in an optical module according to some embodiments of the present disclosure
  • Figure 11 is a structural diagram three of the first elastic conductive member, the second elastic conductive member, the conductive rubber strip and the optical fiber ribbon in an optical module according to some embodiments of the present disclosure
  • Figure 12 is a structural diagram of the first elastic conductive member, the second elastic conductive member and the conductive adhesive strip in an optical module according to some embodiments of the present disclosure
  • Figure 13 is a structural diagram of a second elastic conductive member and a conductive adhesive strip in an optical module according to some embodiments of the present disclosure
  • Figure 14 is a structural view of an optical module with the upper and lower housings removed according to some embodiments of the present disclosure
  • Figure 15 is a structural view of an optical module without the upper housing and the first elastic conductive member according to some embodiments of the present disclosure
  • FIG. 16 is a structural diagram of an optical module with an upper casing removed according to some embodiments of the present disclosure.
  • first and second are configured for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Therefore, features defined as “first” and “second” may explicitly or implicitly include one or more of these features.
  • plural means two or more.
  • At least one of A, B and C has the same meaning as “at least one of A, B or C” and includes the following combinations of A, B and C: A only, B only, C only, A and B The combination of A and C, the combination of B and C, and the combination of A, B and C.
  • Group A and/or Group B includes the following three combinations: A only, B only, and a combination of A and B.
  • parallel includes absolutely parallel and approximately parallel, and the acceptable deviation range of approximately parallel may be, for example, a deviation within 5°;
  • perpendicular includes absolutely vertical and approximately vertical, and the acceptable deviation range of approximately vertical may also be, for example, Deviation within 5°.
  • equal includes absolute equality and approximate equality, wherein the difference between the two that may be equal within the acceptable deviation range of approximately equal is less than or equal to 5% of either one, for example.
  • Optical communication technology establishes information transmission between information processing equipment.
  • Optical communication technology loads information onto light and uses the propagation of light to realize the transmission of information.
  • Light loaded with information is an optical signal.
  • the propagation of optical signals in information transmission equipment can reduce the loss of optical power and achieve high-speed, long-distance, and low-cost information transmission.
  • the information that information processing equipment can process exists in the form of electrical signals.
  • Optical network terminals/gateways, routers, switches, mobile phones, computers, servers, tablets, and televisions are common information processing equipment.
  • Optical fibers and optical waveguides are common information processing equipment. transmission device.
  • optical modules The mutual conversion of optical signals and electrical signals between information processing equipment and information transmission equipment is achieved through optical modules.
  • an optical fiber is connected to the optical signal input end and/or the optical signal output end of the optical module, and an optical network terminal is connected to the electrical signal input end and/or the electrical signal output end of the optical module;
  • the first optical signal transmission from the optical fiber Entering the optical module the optical module converts the first optical signal into a first electrical signal, and the optical module transmits the first electrical signal into the optical network terminal;
  • the second electrical signal from the optical network terminal is transmitted into the optical module, and the optical module transmits the second electrical signal into the optical module.
  • the electrical signal is converted into a second optical signal, and the optical module transmits the second optical signal into the optical fiber.
  • information processing equipment can be connected to each other through electrical signal networks, at least one type of information processing equipment needs to be directly connected to the optical module. It is not required that all types of information processing equipment are directly connected to the optical module. The information of the optical module is directly connected. The processing equipment is called the host computer of the optical module.
  • Figure 1 is a partial architectural diagram of an optical communication system provided according to some embodiments of the present disclosure. As shown in Figure 1, the optical communication system is partially represented by a remote information processing device 1000, a local information processing device 2000, and a host computer. 100. Optical module 200, optical fiber 101 and network cable 103.
  • One end of the optical fiber 101 extends toward the remote information processing device 1000, and the other end is connected to the optical interface of the optical module 200.
  • the optical signal can undergo total reflection in the optical fiber 101.
  • the propagation of the optical signal in the total reflection direction can almost maintain the original optical power.
  • the optical signal undergoes total reflection multiple times in the optical fiber 101 and will come from the direction of the remote information processing device 1000.
  • the optical signal is transmitted into the optical module 200, or the light from the optical module 200 is propagated toward the remote information processing device 1000 to realize long-distance information transmission with low power loss.
  • the number of optical fibers 101 may be one or multiple (two or more); the optical fibers 101 and the optical module 200 may be pluggable or fixedly connected.
  • the host computer 100 has an optical module interface 102, and the optical module interface 102 is configured to access the optical module 200, so that the host computer 100 and the optical module 200 establish a one-way/bi-directional electrical signal connection; the host computer 100 is configured to connect to the optical module 200.
  • 200 provides data signals, or receives data signals from the optical module 200, or monitors and controls the working status of the optical module 200.
  • the host computer 100 has an external electrical interface, such as a Universal Serial Bus interface (Universal Serial Bus, USB) and a network cable interface 104.
  • the external electrical interface can be connected to an electrical signal network.
  • the network cable interface 104 is configured to connect to the network cable 103 so that the host computer 100 and the network cable 103 establish a one-way/bi-directional electrical signal connection.
  • Optical Network Unit Optical Line Terminal
  • ONT Optical Network Equipment
  • data center servers are common host computers.
  • the network cable 103 establishes an electrical signal connection between the local information processing device 2000 and the host computer 100.
  • the third electrical signal sent by the local information processing device 2000 is transmitted to the host computer 100 through the network cable 103.
  • the host computer 100 generates a second electrical signal based on the third electrical signal, and the second electrical signal from the host computer 100 is transmitted into the optical module. 200.
  • the optical module 200 converts the second electrical signal into a second optical signal.
  • the optical module 200 transmits the second optical signal into the optical fiber 101.
  • the second optical signal is transmitted to the remote information processing device 1000 in the optical fiber 101.
  • the first optical signal from the direction of the remote information processing device 1000 is propagated through the optical fiber 101.
  • the first optical signal from the optical fiber 101 is transmitted into the optical module 200.
  • the optical module 200 converts the first optical signal into a first electrical signal.
  • the optical module 200 transmits the first electrical signal to the host computer 100.
  • the host computer 100 generates a fourth electrical signal based on the first electrical signal.
  • the host computer 100 transmits the fourth electrical signal to the local information processing device 2000.
  • the optical module is a tool that realizes the mutual conversion of optical signals and electrical signals. During the above-mentioned conversion process of optical signals and electrical signals, the information does not change, and the encoding and decoding method of the information can change.
  • FIG. 2 is a partial structural diagram of a host computer provided according to some embodiments of the present disclosure.
  • the host computer 100 also includes a PCB circuit board 105 provided in the housing, a cage 106 provided on the surface of the PCB circuit board 105, a radiator 107 provided on the cage 106, and a heat sink 107 provided inside the cage 106.
  • the heat sink 107 has a protruding structure that increases the heat dissipation area, and the fin-like structure is a common protruding structure.
  • the optical module 200 is inserted into the cage 106 of the host computer 100, and the optical module 200 is fixed by the cage 106.
  • the heat generated by the optical module 200 is conducted to the cage 106, and then diffused through the heat sink 107.
  • the electrical interface of the optical module 200 is connected to the electrical connector inside the cage 106.
  • FIG. 3 is a structural diagram of an optical module provided according to some embodiments of the present disclosure
  • FIG. 4 is a partial exploded view of an optical module provided according to some embodiments of the present disclosure.
  • the optical module 200 includes a shell, a circuit board 300 disposed in the shell, an optoelectronic chip disposed on the circuit board 300 , a lens assembly 400 and an optical fiber array 500 .
  • the optoelectronic chip disposed on the circuit board 300 includes a light emitting chip and/or a light receiving chip.
  • the housing includes an upper housing 201 and a lower housing 202.
  • the upper housing 201 is covered on the lower housing 202 to form the above-mentioned housing with two openings 204 and 205; the outer contour of the housing generally presents a square body.
  • the lower case 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and perpendicular to the bottom plate 2021; the upper case 201 includes a cover plate 2011, and the cover plate 2011 covers the lower case. on the two lower side plates 2022 of 202 to form the above-mentioned housing.
  • the lower case 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and perpendicular to the bottom plate 2021;
  • the upper case 201 includes a cover plate 2011, and two lower side plates 2022 located on both sides of the cover plate 2011.
  • the two upper side plates arranged perpendicularly to the cover plate 2011 are combined with the two lower side plates 2022 to realize that the upper housing 201 is covered on the lower housing 202 .
  • the direction of the connection between the two openings 204 and 205 may be consistent with the length direction of the optical module 200 , or may be inconsistent with the length direction of the optical module 200 .
  • the opening 204 is located at the end of the optical module 200 (the right end of FIG. 3 ), and the opening 205 is also located at the end of the optical module 200 (the left end of FIG. 3 ).
  • the opening 204 is located at an end of the optical module 200 and the opening 205 is located at a side of the optical module 200 .
  • the opening 204 is an electrical interface, and the golden finger 301 of the circuit board 300 extends from the electrical interface and is inserted into the electrical connector of the host computer; the opening 205 is an optical port, configured to access the optical fiber 101, so that the optical fiber 101 is connected to the optical module 200 Fiber array 500 in.
  • the assembly method of combining the upper casing 201 and the lower casing 202 is used to facilitate the installation of the circuit board 300, the optoelectronic chip, the lens assembly 400 and the optical fiber array 500 and other components into the above casing.
  • the upper casing 201 and the lower casing 202 can Encapsulate and protect these components.
  • the upper housing 201 and the lower housing 202 are made of metal materials, which facilitates electromagnetic shielding and heat dissipation.
  • the light module 200 also includes an unlocking component 203 located outside its housing.
  • the unlocking component 203 is configured to realize a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.
  • the unlocking component 203 is located outside the two lower side plates 2022 of the lower housing 202 and includes an engaging component that matches the cage 106 of the host computer.
  • the optical module 200 is inserted into the cage 106, the optical module 200 is fixed in the cage 106 by the engaging parts of the unlocking part 203; when the unlocking part 203 is pulled, the engaging parts of the unlocking part 203 move accordingly, thereby changing the engaging parts.
  • the connection relationship with the host computer is to release the fixed connection between the optical module 200 and the host computer, so that the optical module 200 can be pulled out of the cage 106 .
  • the circuit board 300 includes circuit wiring, electronic components, chips, etc.
  • the electronic components and chips are connected together according to the circuit design through the circuit wiring to realize functions such as power supply, electrical signal transmission, and grounding.
  • Electronic components may include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs).
  • the chip may include, for example, a microcontroller unit (Microcontroller Unit, MCU), laser driver chip, transimpedance amplifier (Transimpedance Amplifier, TIA), limiting amplifier (Limiting Amplifier, LA), clock data recovery chip (Clock and Data Recovery, CDR), power management chip, digital signal processing (Digital Signal Processing, DSP) chip.
  • the circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also perform a load-bearing function. For example, the rigid circuit board can stably carry the above-mentioned electronic components and chips; the rigid circuit board can also be easily inserted into the host computer cage. in electrical connectors.
  • the circuit board 300 also includes a gold finger 301 formed on an end surface thereof, and the gold finger 301 is composed of a plurality of independent pins.
  • the circuit board 300 is inserted into the cage 106, and the golden finger 301 is connected to the electrical connector in the cage 106.
  • the golden fingers 301 may be provided only on one side of the circuit board 300 (for example, the upper surface shown in FIG. 4 ), or may be provided on the upper and lower surfaces of the circuit board 300 to provide more pins.
  • the golden finger 301 is configured to establish an electrical connection with the host computer to realize power supply, grounding, I2C signal transmission, data signal transmission, etc.
  • flexible circuit boards are also used in some optical modules.
  • Flexible circuit boards are generally used in conjunction with rigid circuit boards to supplement the rigid circuit boards.
  • the lens assembly 400 is disposed on the circuit board 300 and is placed over the optoelectronic chip in a cover-buckle manner.
  • the optoelectronic chip mainly refers to a light emitting chip, a driver chip, a light receiving chip, and a transimpedance amplification chip. Chips, limiting amplification chips and other chips related to photoelectric conversion functions.
  • the lens assembly 400 and the circuit board 300 form a cavity that encloses optoelectronic chips such as a light emitting chip and a light receiving chip.
  • the lens assembly 400 and the circuit board 300 together form a structure for packaging optoelectronic chips.
  • the light emitting chip is disposed on the surface of the circuit board 300 , and the light emitted by the light emitting chip is perpendicular to the circuit board 300 ; the light receiving chip is disposed on the surface of the circuit board 300 , and the light receiving direction of the light receiving chip is perpendicular to the circuit board 300 .
  • the light emitted by the light emitting chip enters the horizontally arranged optical fiber array 500 after being reflected by the lens assembly 400, and the light from the horizontally arranged optical fiber array 500 enters the light receiving chip after being reflected by the lens assembly 400.
  • the lens assembly is in the light emitting chip. , an optical connection is established between the light receiving chip and the optical fiber array.
  • the lens assembly not only seals the optoelectronic chip, but also establishes an optical connection between the optoelectronic chip and the optical fiber array.
  • the lens assembly 400 can be made of polymer material through an injection molding process. In some embodiments, the lens assembly 400 is made of materials with good light transmittance such as polyetherimide (PEI) plastic (Ultem series).
  • PEI polyetherimide
  • the molding mold can be greatly reduced, and the manufacturing cost and complexity are reduced.
  • the lens assembly 400 after the lens assembly 400 is placed over the optoelectronic chip on the circuit board 300, only the positions of the outgoing beam, the incident beam and the optical fiber array 500 need to be adjusted, making installation and debugging simple.
  • optical coupling structure design between the optical fiber array 500 and the lens assembly 400.
  • the multiple channels of converged light from the lens assembly 400 are incident on the multiple channels of optical fibers in the optical fiber array 500.
  • the optical structure of the lens assembly 400 is used to realize the coupling between the optical fiber array 500 and the lens assembly 400.
  • Optical connections to light-emitting chips Multiple paths of light from the optical fiber array 500 are incident into the lens assembly 400, and the optical structure of the lens assembly 400 is used to realize the optical connection between the optical fiber array 500 and the light receiving chip.
  • optical fiber adapter 600 in order to connect the optical module to an external optical fiber connector, it is often necessary to provide matching structures, such as the optical fiber adapter 600, at the upper and lower housings and the optical interface.
  • the optical fiber adapter 600 is located at the optical interface formed by the upper and lower housings, and is a connector that connects the optical module to the optical fiber connector (optical fiber) outside the optical module.
  • Fiber optic adapters generally have standard shapes and sizes to facilitate the insertion of external fiber optic connectors/plugs. They have multiple fiber optic interfaces inside, including interfaces for outgoing optical signals and interfaces for incoming optical signals. Common fiber optic connectors/plugs are MT type fiber optic connectors (such as fiber optic jumper connectors (Multi-fiber Push On, MPO)). Insert the optical fiber connector/plug into the optical fiber adapter of the optical module so that the optical signal inside the optical module can be transmitted into the external optical fiber, and the optical signal outside the optical module can be transmitted into the inside of the optical module.
  • MPO Multi-fiber Push On
  • an optical connection is established between one end of the optical fiber array 500 and the lens assembly 400, and an optical connection is established between the other end and the optical fiber adapter 600.
  • the optical fiber array 500 is composed of multiple (two or more) optical fibers, which transmits the light from the lens assembly 400 to the optical fiber adapter 600, thereby realizing the external transmission of optical signals; and the optical fiber array 500 transmits the light from the optical fiber adapter 600 to The lens assembly 400 realizes receiving optical signals from outside the optical module.
  • Figure 5 is a structural diagram of the lower housing of an optical module provided according to some embodiments of the present disclosure.
  • Figure 6 is a structural diagram of the upper housing of an optical module provided according to some embodiments of the present disclosure.
  • Figure 7 is a structural diagram of the upper housing of an optical module provided according to some embodiments of the present disclosure.
  • FIG. 8 is a cross-sectional view of an optical module provided by some embodiments of the present disclosure from another perspective.
  • a first groove 20111 is formed in the upper housing 201
  • a second groove 20211 is formed in the lower housing 202.
  • the first groove 20111 and the second groove 20211 form a storage cavity through which the optical fiber array 500 is connected to the optical fiber adapter 600 .
  • a conductive member 700 is placed in the storage cavity formed by the first groove 20111 and the second groove 20211.
  • the conductive member 700 includes a first elastic conductive member 701 and a second elastic conductive member 702.
  • the first elastic conductive member 701 is placed in In the first groove 20111
  • the second elastic conductive member 702 is placed in the second groove 20211.
  • Figure 9 is a structural diagram of the first elastic conductive member, the second elastic conductive member, the conductive rubber strip and the optical fiber ribbon in an optical module according to some embodiments of the present disclosure.
  • Figure 10 is a second structural diagram of the first elastic conductive member, the second elastic conductive member, the conductive rubber strip and the optical fiber ribbon in an optical module according to some embodiments of the present disclosure.
  • Figure 11 is a third structural view of the first elastic conductive member, the second elastic conductive member, the conductive rubber strip and the optical fiber ribbon in an optical module according to some embodiments of the present disclosure.
  • the first elastic conductive member 701 and the second elastic conductive member 702 are in contact connection, and the optical fiber array 500 is located at the connection between the first elastic conductive member 701 and the second elastic conductive member 702, and The first elastic conductive member 701 and the second elastic conductive member 702 are seamlessly connected to the optical fiber array 500, so that there is no gap between the first elastic conductive member 701, the second elastic conductive member 702 and the optical fiber array 500.
  • first elastic conductive member 701 and the second elastic conductive member 702 are elastic, when the first elastic conductive member 701 and the second elastic conductive member 702 are connected, the first elastic conductive member 701 and the second elastic conductive member 702 can be squeezed The connection is made so that the first elastic conductive member 701 and the second elastic conductive member 702 are in full contact to ensure a seamless connection between the first elastic conductive member 701 and the second elastic conductive member 702 .
  • the optical fiber array 500 is in extrusion contact with the first elastic conductive member 701 and the second elastic conductive member 702, so that the first elastic conductive member 701 and the second elastic conductive member 702 are pressed and connected.
  • the elastic conductive member 702 is in full contact with the optical fiber array 500 to ensure seamless connection between the first elastic conductive member 701 and the second elastic conductive member 702 and the optical fiber array 500 .
  • the elasticity of the first elastic conductive member 701 and the second elastic conductive member 702 can not only make the first elastic conductive member 701 , the second elastic conductive member 702 fully contact with the optical fiber array 500 , but also protect the optical fiber array 500 .
  • the first groove 20111 is formed by the cover plate 2011 of the upper housing 201 recessing into the inner side of the upper housing 201 .
  • the first groove 20111 has a bottom surface, a first side and a second side. , the first side, the bottom surface and the second side are connected in sequence, and the first side and the second side are arranged oppositely.
  • the bottom surface of the first groove 20111 is disposed correspondingly to the bottom surface of the first elastic conductive member 701
  • the first side of the first groove 20111 is disposed correspondingly to the first side of the first elastic conductive member 701
  • the second side of the first groove 20111 is disposed correspondingly.
  • the side surface is arranged corresponding to the second side surface of the first elastic conductive member 701 .
  • the bottom surface of the first groove 20111 is seamlessly connected to the bottom surface of the first elastic conductive member 701, and the first side of the first groove 20111 is connected to the first elastic member 701.
  • the first side of the conductive member 701 is seamlessly connected, and the second side of the first groove 20111 is seamlessly connected to the second side of the first elastic conductive member 701, so that the first elastic conductive member 701 and the first groove 20111 are seamlessly connected. connection to ensure full contact between the first elastic conductive member 701 and the upper housing 201 .
  • the second groove 20211 is formed by the bottom plate 2021 of the lower housing 202 recessing the inside of the lower housing 202 .
  • the second groove 20211 has a bottom surface, a first side and a second side. , the first side, the bottom surface and the second side are connected in sequence, and the first side and the second side are arranged oppositely.
  • the bottom surface of the second groove 20211 is disposed correspondingly to the bottom surface of the second elastic conductive member 702
  • the first side of the second groove 20211 is disposed correspondingly to the first side of the second elastic conductive member 702
  • the second side of the second groove 20211 is disposed correspondingly.
  • the side surface is arranged corresponding to the second side surface of the second elastic conductive member 702 .
  • the bottom surface of the second groove 20211 is seamlessly connected to the bottom surface of the second elastic conductive member 702, and the first side of the second groove 20211 is connected to the second elastic conductive member 702.
  • the first side of the conductive member 702 is seamlessly connected, and the second side of the second groove 20211 is seamlessly connected to the second side of the second elastic conductive member 702, so that the second elastic conductive member 702 and the second groove 20211 are seamlessly connected. connection to ensure full contact between the second elastic conductive member 702 and the lower housing 202 .
  • two third grooves are formed in the housing formed by the upper housing 201 and the lower housing 202 , and the third grooves are used to place the conductive adhesive strips 800 .
  • the third groove can be provided on the upper housing 201, and the two third grooves are located on both sides of the first groove 20111; or, the third groove can be provided on the lower housing 202, and the two third grooves can be provided on the lower housing 202.
  • Three grooves are located on both sides of the second groove 20211.
  • the third groove is located on both sides of the first groove 20111, the third groove is located on the cover 2011 of the upper housing 201, the third groove is connected with the first groove 20111, and the third groove is connected with the second groove 20111. Groove 20211 is not connected.
  • the third groove 20212 when the third groove 20212 is located on both sides of the second groove 20211, the third groove 20212 is located on the bottom plate 2021 of the lower housing 202, and the third groove 20212 is connected with the second groove 20211. , the third groove 20212 is not connected with the first groove 20111.
  • the third groove 20212 when the third groove 20212 is located on both sides of the second groove 20211, the third groove 20212 extends from the side wall of the second groove 20211 toward the lower side plate 2022 of the lower housing 202, The conductive adhesive strip 800 is placed in the third groove 20212.
  • the conductive adhesive strip 800 can fully contact the upper case 201 and the lower case 202 except for the first groove 20111 and the second groove 20211.
  • the conductive adhesive strip 800 is formed by directly dispensing conductive adhesive on the third groove 20212 and then solidifying, there is a certain operating error in the dispensing of the conductive adhesive, which may cause the conductive adhesive strip 800 to be in contact with the third groove 20211 in the second groove 20211 .
  • Second bomb The elastic conductive parts 702 are not connected, so that there is a gap between the first elastic conductive part 701 and the second elastic conductive part 702, causing the upper case 201 and the lower case 202 to be unable to fully contact, thereby affecting electromagnetic shielding.
  • the conductive rubber strip 800 is placed in the third groove, the first groove or the second groove that is not connected to the third groove.
  • the surface of the elastic conductive member is connected with the conductive rubber strip 800 so that the gap between the upper case 201 and the lower case 202 is filled with the conductive adhesive strip 800 .
  • the width dimension of the first groove 20111 is smaller than the width dimension of the second groove 20211, and the width dimension of the first elastic conductive member 701 is smaller than the second elastic conductive member 702
  • the conductive rubber strip 800 in the third groove is connected to the upper surface of the second elastic conductive member 702 .
  • the upper surface of the second elastic conductive member 702 refers to the surface of other areas of the second elastic conductive member 702 outside the area connected to the first elastic conductive member 701 .
  • Figure 12 is a structural diagram of the first elastic conductive member, the second elastic conductive member and the conductive tape in an optical module according to some embodiments of the present disclosure.
  • Figure 13 is an optical module provided according to some embodiments of the present disclosure. Structural diagram of the second elastic conductive member and conductive strip. As shown in Figures 8, 12 and 13, when the third groove 20212 is located on both sides of the second groove 20211, the width of the second groove 20211 is smaller than the width of the first groove 20111, and the second elasticity The width dimension of the conductive member 702 is smaller than the width dimension of the first elastic conductive member 701 , and the conductive rubber strip 800 in the third groove 20212 is connected to the lower surface of the first elastic conductive member 701 .
  • the lower surface of the first elastic conductive member 701 refers to the lower surface of other areas of the first elastic conductive member 701 except the area connected to the second elastic conductive member 702 .
  • Figure 14 is a structural diagram of an optical module provided according to some embodiments of the present disclosure, with the upper housing and lower housing removed.
  • Figure 15 is a structural diagram of an optical module provided according to some embodiments of the present disclosure, with the upper housing and lower housing removed. Structural view of the first elastic conductive member.
  • FIG. 16 is a structural view of an optical module with the upper casing removed according to some embodiments of the present disclosure. As shown in Figures 14, 15 and 16, the surface of the first elastic conductive member 701 or the second elastic conductive member 702 is connected to the conductive rubber strip 800, and the conductive rubber strip 800 is used to fill the space between the upper case 201 and the lower case 202.
  • the conductive rubber strip 800 is not only connected to the lower surface of the first elastic conductive member 701, but also connected to the side surface of the second elastic conductive member 702, so that the first elastic conductive member 701 and the second elastic conductive member 702 are connected to each other.
  • the contact surfaces are extruded and connected, and other areas where the upper housing 201 and the lower housing 202 are in contact are connected through conductive rubber strips 800, so that the upper housing 201 and the lower housing 202 are further fully contacted, so that the upper housing 201 and the first
  • the elastic conductive member 701, the second elastic conductive member 702, the conductive rubber strip 800 and the lower shell 202 form a closed cavity.
  • the electromagnetic radiation inside the closed cavity cannot penetrate, which effectively reduces the electromagnetic radiation and thereby acts as an electromagnetic shielding. effect.
  • the gap between the upper casing 201 and the lower casing 202 should be within a preset range to allow the conductive adhesive strip 800 to pass through. Fill the gap between the upper case 201 and the lower case 202.
  • the first side of the second groove 20211 is disposed corresponding to the first side of the first groove 20111 (arranged along the up and down direction), and the second side of the second groove 20211 is disposed correspondingly to the first side of the first groove 20211 .
  • the second side surface of the first groove 20111 is provided correspondingly (disposed along the up and down direction).
  • the vertical distance (distance in the up-down direction) between the first side of the second groove 20211 and the first side of the first groove 20111 is 0.5mm ⁇ 2mm.
  • the vertical distance (distance in the up and down direction) between the two side surfaces and the second side surface of the first groove 20111 is 0.5 mm to 2 mm.
  • the conductive rubber strip 800 may not be connected to the first elastic conductive member 701 in the first groove 20111, or may not be connected to the first elastic conductive member 701 in the first groove 20111.
  • the second elastic conductive member 702 in the second groove 20211 is connected so that the upper housing 201 and the lower housing 202 cannot fully contact, thereby affecting the electromagnetic shielding effect.
  • the vertical distance between the first side of the second groove 20211 and the first side of the first groove 20111 is greater than 2 mm, and the distance between the second side of the second groove 20211 and the second side of the first groove 20111 When the vertical distance between them is greater than 2 mm, the gap between the upper housing 201 and the lower housing 202 is larger, which is not suitable for some small-sized optical modules. Therefore, in some embodiments, the vertical distance between the first side of the second groove 20211 and the first side of the first groove 20111 is 0.5mm ⁇ 2mm, and the second side of the second groove 20211 and the first side of the first groove 20211 are The vertical distance between the second side surfaces of a groove 20111 is 0.5mm ⁇ 2mm.
  • the vertical distance between the first side of the second groove 20211 and the first side of the first groove 20111 is equal to the second side of the second groove 20211 and the second side of the first groove 20111 the vertical distance between them.
  • the optical fiber array 500 passes through the connection between the first elastic conductive member 701 and the second elastic conductive member 702 of the conductive member 700, and the optical fiber can be supported by the first elastic conductive member 701 and the second elastic conductive member 702.
  • the array 500 can also fill the gap between the upper housing 201 and the lower housing 202 through the first elastic conductive member 701 and the second elastic conductive member 702.
  • the conductive member 700 can be a conductive gasket or conductive foam.
  • the conductive member 700 may be a conductive pad.
  • the first elastic conductive member 701 is a first elastic conductive pad
  • the second elastic conductive member 702 is a second elastic conductive pad.
  • the conductive member 700 may also be conductive foam.
  • the first elastic conductive member 701 is a first elastic conductive foam
  • the second elastic conductive member 702 is a second elastic conductive foam.
  • a first limiting protrusion 20112 and a second limiting protrusion 20213 are also provided in the housing.
  • the first limiting protrusion 20112 extends from the cover plate 2011 of the upper housing 201 to the
  • the lower housing 202 is formed with a bulge in the direction, and the first limiting protrusion 20112 is located on one side of the first groove 20111;
  • the second limiting protrusion 20213 is protruded from the bottom plate 2021 of the lower housing 202 in the direction of the upper housing 201 Formed, the second limiting protrusion 20213 is located on one side of the second groove 20211, and the second limiting protrusion 20213 is not connected to the first limiting protrusion 20112.
  • the present disclosure is not limited thereto.
  • one of the first limiting protrusion 20112 and the second limiting protrusion 20213 is provided in the housing.
  • the optical fiber adapter 600 When the optical fiber adapter 600 is inserted into the optical interface of the optical module, one end of the optical fiber adapter 600 abuts the first limiting protrusion 20112 and/or the second limiting protrusion 20213, so as to pass through the first limiting protrusion 20112 and/or the second limiting protrusion 20213. Or the second limiting protrusion 20213 defines the position of the optical fiber adapter 600 .
  • the first limiting protrusion 20112 and the second limiting protrusion 20213 are arranged correspondingly in the up and down direction, and the second limiting protrusion 20213 and the first limiting protrusion 20112 form a first gap, and the optical fiber array 500 passes through this first gap.
  • a first supporting protrusion 20113 and a second supporting protrusion 20113 may also be provided in the housing.
  • Support protrusion 20214, the first support protrusion 20113 is formed by the cover plate 2011 of the upper housing 201 protruding in the direction of the lower housing 202, the first support protrusion 20113 is located on the other side of the first groove 20111; the second The support protrusion 20214 is formed by protruding from the bottom plate 2021 of the lower case 202 in the direction of the upper case 201.
  • the second support protrusion 20214 is located on the other side of the second groove 20211, and the first support protrusion 20113 is in contact with the second support protrusion 20214. Bump 20214 is not connected.
  • one of the first support protrusion 20113 and the second support protrusion 20214 is provided in the housing.
  • first supporting protrusion 20113 and the first limiting protrusion 20112 are respectively located at both ends of the first groove 20111
  • the second supporting protrusion 20214 and the second limiting protrusion 20213 are respectively located at the second recess. Both ends of slot 20211.
  • the first support protrusion 20113 and the second support protrusion 20214 are arranged correspondingly in the up and down direction.
  • the first support protrusion 20113 and the second support protrusion 20214 form a second gap.
  • the first gap and the second gap are respectively located in the first recess.
  • the groove 20111 and the second groove 20211 form two ends of the storage cavity.
  • the optical fiber array 500 is inserted into the optical fiber adapter 600 after the lens assembly 400 passes through the second gap, the storage cavity and the first gap in sequence.
  • the first groove 20111 is recessed in the first limiting protrusion 20112 or the first supporting protrusion 20113, and the height difference between the lower surface of the first elastic conductive member 701 and the bottom surface of the first groove 20111 is greater than the first
  • the height difference between the limiting protrusion 20112 and the bottom surface of the first groove 20111 may be greater than the height difference between the first supporting protrusion 20113 and the bottom surface of the first groove 20111.
  • there is a first height difference between the lower surface of the first elastic conductive member 701 and the bottom surface of the first groove 20111 there is a first height difference between the first limiting protrusion 20112 or the first support protrusion 20113 and the bottom surface of the first groove 20111.
  • There is a second height difference and the first height difference is greater than the second height difference.
  • the second groove 20211 is recessed in the second limiting protrusion 20213 or the second supporting protrusion 20214.
  • the height difference between the upper surface of the second elastic conductive member 702 and the bottom surface of the second groove 20211 is greater than the height difference between the second limiting protrusion 20213 and the second supporting protrusion 20214.
  • the height difference between the bottom surface of the second groove 20211 may be greater than the height difference between the second support protrusion 20214 and the bottom surface of the second groove 20211.
  • the third height difference between the upper surface of the second elastic conductive member 702 and the bottom surface of the second groove 20211, and there is a third height difference between the second limiting protrusion 20213 or the second supporting protrusion 20214 and the bottom surface of the second groove 20211.
  • There is a fourth height difference and the third height difference is greater than the fourth height difference.
  • the present disclosure provides an optical module, which includes an upper housing and a lower housing.
  • a first groove is formed in the upper housing, and a second groove is formed in the lower housing.
  • the first groove and the second groove form a storage cavity.
  • a first elastic conductive member is placed in the first groove, and the first elastic conductive member is seamlessly connected to the first groove, so that the first elastic conductive member is in full contact with the upper case.
  • a second elastic conductive member is placed in the second groove, and the second elastic conductive member is seamlessly connected to the second groove, so that the second elastic conductive member is in full contact with the lower case.
  • the optical module also includes an optical fiber array.
  • the optical fiber array is located at the connection between the first elastic conductive member and the second elastic conductive member, so that both the first elastic conductive member and the second elastic conductive member are seamlessly connected to the optical fiber array.
  • the first elastic conductive member and the second elastic conductive member have elasticity, when the first elastic conductive member and the second elastic conductive member are pressed and connected, the first elastic conductive member and the second elastic conductive member are connected seamlessly, so that the first elastic conductive member The conductive member is in full contact with the second elastic conductive member.
  • the optical fiber array passes through the connection between the first elastic conductive member and the second elastic conductive member, the first elastic conductive member and the second elastic conductive member are seamlessly connected to the optical fiber array respectively, so that the first elastic conductive member and the second elastic conductive member The conductive parts are in full contact with the optical fiber array.
  • Two third grooves are formed in the housing formed by the lower housing and the upper housing, and the two third grooves are connected with the first groove or
  • the conductive rubber strip is placed in the third groove, and the conductive rubber strip can fully contact the upper shell and the lower shell except the first groove and the second groove.
  • the third groove may be located on both sides of the first groove or on both sides of the second groove.
  • the width dimension of the first groove is smaller than the width dimension of the second groove
  • the width dimension of the first elastic conductive member is smaller than the width dimension of the second elastic conductive member.
  • the upper surface of the two elastic conductive parts is connected with the conductive adhesive strip.
  • the width dimension of the second groove connected to the third groove is smaller than the width dimension of the first groove
  • the width dimension of the second elastic conductive member is smaller than the first elastic conductive member.
  • the width dimension of the conductive member, the lower surface of the first elastic conductive member is connected to the conductive rubber strip.
  • the lower surface of the first elastic conductive member or the upper surface of the second elastic conductive member is connected to the conductive rubber strip, so that the upper housing and the lower housing are in full contact, thereby forming a closed cavity, and electromagnetic radiation inside the closed cavity cannot penetrate comes out, effectively reducing electromagnetic radiation, thereby playing the role of electromagnetic shielding.
  • the conductive rubber strip in the third groove makes full contact between the upper case and the lower case except for the first groove and the second groove
  • the first elastic conductive strip in the first groove makes The member is in full contact with the second elastic conductive member in the second groove, and the optical fiber array passes through the connection between the first elastic conductive member and the second elastic conductive member, so that the upper housing, the first elastic conductive member, the second elastic conductive member
  • the conductive parts, conductive rubber strips and lower shell form a closed cavity, which effectively reduces electromagnetic radiation and thus plays the role of electromagnetic shielding.

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  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
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Abstract

一种光模块（200），包括上壳体（201）、下壳体（202）及光纤阵列（500）。上壳体（201）内形成有第一凹槽（20111），下壳体（202）内形成有第二凹槽（20211）。上壳体（201）与下壳体（202）形成的壳体内形成有第三凹槽（20212），第三凹槽（20212）位于第一凹槽（20111）的两侧、且与第一凹槽（20111）连通，或者，第三凹槽（20212）位于第二凹槽（20211）的两侧、且与第二凹槽（20211）连通。第一凹槽（20111）内放置有第一弹性导电件（701），第二凹槽（20211）内放置有第二弹性导电件（702），第一弹性导电件（701）与第二弹性导电件（702）连接，光纤阵列（500）位于第一弹性导电件（701）与第二弹性导电件（702）的连接处。第三凹槽（20212）内放置有分别与上壳体（201）和下壳体（202）连接的导电胶条（800）。其中，与第三凹槽（20212）连通的第一凹槽（20111）的宽度小于第二凹槽（20211）的宽度，或者，与第三凹槽（20212）连通的第二凹槽（20211）的宽度小于第一凹槽（20111）的宽度。

Description

光模块
本申请要求在2022年08月22日提交中国专利局、申请号为202222210758.0的优先权，其全部内容通过引用结合在本申请中。
技术领域
本公开涉及通信技术领域，尤其涉及一种光模块。
背景技术
随着云计算、移动互联网、视频等新型业务和应用模式的发展，光通信技术的进步变的愈加重要。在光通信技术中，光模块是实现光电信号转换的器件，是光通信设备中的关键器件之一。
近年来，在数据中心和超级计算机的快速发展过程中，光模块的集成度及速率在不断提升，与此同时，光模块在工作时出现了各种电磁波辐射问题，容易造成光模块的电磁干扰(Electro Magnetic Interference，EMI)超标。
发明内容
本公开提供了一种光模块，该光模块包括上壳体、下壳体与光纤阵列，上壳体内形成有第一凹槽，该第一凹槽内放置有第一弹性导电件。下壳体内形成有第二凹槽，该第二凹槽内放置有第二弹性导电件。上壳体与下壳体形成壳体，该壳体内形成有两个第三凹槽，两个第三凹槽位于第一凹槽的两侧，且第三凹槽与第一凹槽连通，或者，两个第三凹槽位于第二凹槽的两侧，且第三凹槽与第二凹槽连通。第三凹槽内放置有导电胶条，导电胶条分别与上壳体和下壳体连接。第一弹性导电件与第二弹性导电件连接，光纤阵列位于第一弹性导电件与第二弹性导电件的连接处，第一弹性导电件和第二弹性导电件均与光纤阵列连接。其中，与第三凹槽连通的第一凹槽的宽度尺寸小于第二凹槽的宽度尺寸，第一弹性导电件的宽度尺寸小于第二弹性导电件的宽度尺寸，以使第二弹性导电件的表面与导电胶条连接。或者，与第三凹槽连通的第二凹槽的宽度尺寸小于第一凹槽的宽度尺寸，第二弹性导电件的宽度尺寸小于第一弹性导电件的宽度尺寸，以使第一弹性导电件的表面与导电胶条连接。
附图说明
为了更清楚地说明本公开实施例的技术方案，下面将对本公开一些实施例所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本公开的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。此外，以下描述中的附图可以视作示意图，并非是对本公开实施例所涉及的产品的实际尺寸、方法的实际流程、信号的实际时序等进行限制。
图1为根据本公开一些实施例提供的一种光通信系统的局部架构图；
图2为根据本公开一些实施例提供的一种上位机的局部结构图；
图3为根据本公开一些实施例提供的一种光模块的结构图；
图4为根据本公开一些实施例提供的一种光模块的局部爆炸图；
图5为根据本公开一些实施例提供的一种光模块中下壳体的结构图；
图6为根据本公开一些实施例提供的一种光模块中上壳体的结构图；
图7为根据本公开一些实施例提供的一种光模块的剖视图；
图8为根据本公开一些实施例提供的一种光模块在另一视角下的剖视图；
图9为根据本公开一些实施例提供的一种光模块中第一弹性导电件、第二弹性导电件、导电胶条和光纤带的结构图一；
图10为根据本公开一些实施例提供的一种光模块中第一弹性导电件、第二弹性导电件、导电胶条和光纤带的结构图二；
图11为根据本公开一些实施例提供的一种光模块中第一弹性导电件、第二弹性导电件、导电胶条和光纤带的结构图三；
图12为根据本公开一些实施例提供的一种光模块中第一弹性导电件、第二弹性导电件和导电胶条的结构图；
图13为根据本公开一些实施例提供的一种光模块中第二弹性导电件和导电胶条的结构图；
图14为根据本公开一些实施例提供的一种光模块的除去上壳体和下壳体后的结构图；
图15为根据本公开一些实施例提供的一种光模块的除去上壳体和第一弹性导电件后的结构图；
图16为根据本公开一些实施例提供的一种光模块的除去上壳体后的结构图。
具体实施方式
下面将结合附图，对本公开一些实施例中的技术方案进行清楚、详细地描述，显然，所描述的实施例仅仅是本公开的一部分实施例，而不是全部的实施例。基于本公开所提供的实施例，本领域普通技术人员所获得的所有其他实施例，都属于本公开保护的范围。
除非上下文另有要求，否则，在整个说明书和权利要求书中，术语“包括(comprise)”及其其他形式例如第三人称单数形式“包括(comprises)”和现在分词形式“包括(comprising)”被解释为开放、包含的意思，即为“包含，但不限于”。在说明书的描述中，术语“一个实施例(one embodiment)”、“一些实施例(some embodiments)”、“示例性实施例(exemplary embodiments)”、“示例(example)”、“特定示例(specific example)”或“一些示例(some examples)”等旨在表明与该实施例或示例相关的特定特征、结构、材料或特性包括在本公开的至少一个实施例或示例中。上述术语的示意性表示不一定是指同一实施例或示例。此外，所述的特定特征、结构、材料或特点可以以任何适当方式包括在任何一个或多个实施例或示例中。
以下，术语“第一”、“第二”仅被配置为描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本公开实施例的描述中，除非另有说明，“多个”的含义是两个或两个以上。
在描述一些实施例时，可能使用了“耦接”和“连接”及其衍伸的表达。例如，描述一些实施例时可能使用了术语“连接”以表明两个或两个以上部件彼此间有直接或间接物理接触或电接触。又如，描述一些实施例时可能使用了术语“耦接”以表明两个或两个以上部件有直接或间接物理接触或电接触。然而，术语“耦接”或“通信耦合(communicatively coupled)触也可能指两个或两个以上部件彼此间并无直接接触，但仍彼此协作或相互作用。这里所公开的实施例并不必然限制于本文内容。
“A、B和C中的至少一个”与“A、B或C中的至少一个”具有相同含义，均包括以下A、B和C的组合：仅A，仅B，仅C，A和B的组合，A和C的组合，B和C的组合，及A、B和C的组合。
“A组和/或B组，包括以下三种组合：仅A，仅B，及A和B的组合。
本文中“适用于”或“被配置为”的使用意味着开放和包容性的语言，其不排除适被配置为或被配置为执行额外任务或步骤的设备。
如本文所使用的那样，“约”、“大致”或“近似”包括所阐述的值以及处于特定值的可接受偏差范围内的平均值，其中所述可接受偏差范围如由本领域普通技术人员考虑到正在讨论的测量以及与特定量的测量相关的误差(即，测量系统的局限性)所确定。
如本文所使用的那样，“平行”、“垂直”、“相等”包括所阐述的情况以及与所阐述的情况相近似的情况，该相近似的情况的范围处于可接受偏差范围内，其中所述可接受偏差范围如由本领域普通技术人员考虑到正在讨论的测量以及与特定量的测量相关的误差(即，测量系统的局限性)所确定。例如，“平行”包括绝对平行和近似平行，其中近似平行的可接受偏差范围例如可以是5°以内偏差；“垂直”包括绝对垂直和近似垂直，其中近似垂直的可接受偏差范围例如也可以是5°以内偏差。“相等”包括绝对相等和近似相等，其中近似相等的可接受偏差范围内例如可以是相等的两者之间的差值小于或等于其中任一者的5％。
光通信技术在信息处理设备之间建立信息传递，光通信技术将信息加载到光上，利用光的传播实现信息的传递，加载有信息的光就是光信号。光信号在信息传输设备中传播，可以减少光功率的损耗，实现高速度、远距离、低成本的信息传递。信息处理设备能够处理的信息以电信号的形态存在，光网络终端/网关、路由器、交换机、手机、计算机、服务器、平板电脑、电视机是常见的信息处理设备，光纤及光波导是常见的信息传输设备。
信息处理设备与信息传输设备之间的光信号、电信号相互转换，是通过光模块实现的。例如，在光模块的光信号输入端和/或光信号输出端连接有光纤，在光模块的电信号输入端和/或电信号输出端连接有光网络终端；来自光纤的第一光信号传输进光模块，光模块将第一光信号转换为第一电信号，光模块将第一电信号传输进光网络终端；来自光网络终端的第二电信号传输进光模块，光模块将第二电信号转换为第二光信号，光模块将第二光信号传输进光纤。由于信息处理设备之间可以通过电信号网络相互连接，所以至少需要一类信息处理设备直接与光模块连接，并不需要所有类型的信息处理设备均直接与光模块连接，直接连接光模块的信息处理设备被称为光模块的上位机。
图1为根据本公开一些实施例提供的一种光通信系统的局部架构图。如图1所示，光通信系统的局部呈现为远端信息处理设备1000、本地信息处理设备2000、上位机 100、光模块200、光纤101以及网线103。
光纤101的一端向远端信息处理设备1000方向延伸，另一端接入光模块200的光接口。光信号可以在光纤101中发生全反射，光信号在全反射方向上的传播几乎可以维持原有光功率，光信号在光纤101中发生多次的全反射，将来自远端信息处理设备1000方向的光信号传输进光模块200中，或将来自光模块200的光向远端信息处理设备1000方向传播，实现远距离、功率损耗低的信息传递。
光纤101的数量可以是一根，也可以是多根(两根及以上)；光纤101与光模块200采用可插拔式的活动连接，也可采用固定连接。
上位机100具有光模块接口102，光模块接口102被配置为接入光模块200，从而使得上位机100与光模块200建立单向/双向的电信号连接；上位机100被配置为向光模块200提供数据信号，或从光模块200接收数据信号，或对光模块200的工作状态进行监测、控制。
上位机100具有对外电接口，如通用串行总线接口(Universal Serial Bus，USB)、网线接口104，对外电接口可以接入电信号网络。示例地，网线接口104被配置为接入网线103，从而使得上位机100与网线103建立单向/双向的电信号连接。
光网络终端(Optical Network Unit，ONU)、光线路终端(Optical Line Terminal，OLT)、光网络设备(Optical Network Terminal，ONT)及数据中心服务器为常见的上位机。
网线103的一端连接本地信息处理设备2000，另一端连接上位机100，网线103在本地信息处理设备2000与上位机100之间建立电信号连接。
示例地，本地信息处理设备2000发出的第三电信号通过网线103传入上位机100，上位机100基于第三电信号生成第二电信号，来自上位机100的第二电信号传输进光模块200，光模块200将第二电信号转换为第二光信号，光模块200将第二光信号传输进光纤101，第二光信号在光纤101中传向远端信息处理设备1000。
示例地，来自远端信息处理设备1000方向的第一光信号通过光纤101传播，来自光纤101的第一光信号传输进光模块200，光模块200将第一光信号转换为第一电信号，光模块200将第一电信号传输进上位机100，上位机100基于第一电信号生成第四电信号，上位机100将第四电信号传入本地信息处理设备2000。
光模块是实现光信号与电信号相互转换的工具，在上述光信号与电信号的转换过程中，信息并未发生变化，信息的编解码方式可以发生变化。
图2为根据本公开一些实施例提供的一种上位机的局部结构图。为了清楚地显示光模块200与上位机100的连接关系，图2仅示出了上位机100与光模块200相关的结构。如图2所示，上位机100还包括设置于壳体内的PCB电路板105、设置在PCB电路板105的表面的笼子106、设置于笼子106上的散热器107、以及设置于笼子106内部的电连接器(图中未示出)，散热器107具有增大散热面积的凸起结构，翅片状结构是常见的凸起结构。
光模块200插入上位机100的笼子106中，由笼子106固定光模块200，光模块200产生的热量传导给笼子106，然后通过散热器107进行扩散。光模块200插入笼子106中后，光模块200的电接口与笼子106内部的电连接器连接。
图3为根据本公开一些实施例提供的一种光模块的结构图，图4为根据本公开一些实施例提供的一种光模块的局部爆炸图。如图3和图4所示，光模块200包括壳体(shell)、设置于壳体内的电路板300、设置于电路板300上的光电芯片、透镜组件400及光纤阵列500。但本公开并不局限于此，在一些实施例中，设置于电路板300上的光电芯片包括光发射芯片和/或光接收芯片。
壳体包括上壳体201和下壳体202，上壳体201盖合在下壳体202上，以形成具有两个开口204和205的上述壳体；壳体的外轮廓一般呈现方形体。
在一些实施例中，下壳体202包括底板2021以及位于底板2021两侧、与底板2021垂直设置的两个下侧板2022；上壳体201包括盖板2011，盖板2011盖合在下壳体202的两个下侧板2022上，以形成上述壳体。
在一些实施例中，下壳体202包括底板2021以及位于底板2021两侧、与底板2021垂直设置的两个下侧板2022；上壳体201包括盖板2011，以及位于盖板2011两侧、与盖板2011垂直设置的两个上侧板，由两个上侧板与两个下侧板2022结合，以实现上壳体201盖合在下壳体202上。
两个开口204和205的连线所在方向可以与光模块200的长度方向一致，也可以与光模块200的长度方向不一致。例如，开口204位于光模块200的端部(图3的右端)，开口205也位于光模块200的端部(图3的左端)。或者，开口204位于光模块200的端部，而开口205则位于光模块200的侧部。开口204为电接口，电路板300的金手指301从电接口伸出，插入上位机的电连接器中；开口205为光口，被配置为接入光纤101，以使光纤101连接光模块200中的光纤阵列500。
采用上壳体201、下壳体202结合的装配方式，便于将电路板300、光电芯片、透镜组件400及光纤阵列500等部件安装到上述壳体中，上壳体201、下壳体202可以对这些部件形成封装保护。此外，在装配电路板300、光电芯片、透镜组件400及光纤阵列500等部件时，便于这些器件的定位部件、散热部件以及电磁屏蔽部件的部署，有利于自动化地实施生产。
在一些实施例中，上壳体201及下壳体202采用金属材料制成，利于实现电磁屏蔽以及散热。
在一些实施例中，光模块200还包括位于其壳体外部的解锁部件203。解锁部件203被配置为实现光模块200与上位机之间的固定连接，或解除光模块200与上位机之间的固定连接。
例如，解锁部件203位于下壳体202的两个下侧板2022的外侧，包括与上位机的笼子106匹配的卡合部件。当光模块200插入笼子106里时，由解锁部件203的卡合部件将光模块200固定在笼子106里；拉动解锁部件203时，解锁部件203的卡合部件随之移动，进而改变卡合部件与上位机的连接关系，以解除光模块200与上位机的卡合固定连接，从而可以将光模块200从笼子106里抽出。
电路板300包括电路走线、电子元件及芯片等，通过电路走线将电子元件和芯片按照电路设计连接在一起，以实现供电、电信号传输及接地等功能。电子元件例如可以包括电容、电阻、三极管、金属氧化物半导体场效应管(Metal-Oxide-Semiconductor Field-Effect Transistor，MOSFET)。芯片例如可以包括微控制单元(Microcontroller Unit， MCU)、激光驱动芯片、跨阻放大器(Transimpedance Amplifier，TIA)、限幅放大器(Limiting Amplifier，LA)、时钟数据恢复芯片(Clock and Data Recovery，CDR)、电源管理芯片、数字信号处理(Digital Signal Processing，DSP)芯片。
电路板300一般为硬性电路板，硬性电路板由于其相对坚硬的材质，还可以实现承载作用，如硬性电路板可以平稳的承载上述电子元件和芯片；硬性电路板还便于插入上位机笼子中的电连接器中。
电路板300还包括形成在其端部表面的金手指301，金手指301由独立的多个引脚组成。电路板300插入笼子106中，由金手指301与笼子106内的电连接器导通。金手指301可以仅设置在电路板300一侧的表面(例如图4所示的上表面)，也可以设置在电路板300上下两侧的表面，以提供更多的引脚。金手指301被配置为与上位机建立电连接，以实现供电、接地、I2C信号传递、数据信号传递等。
当然，部分光模块中也会使用柔性电路板，柔性电路板一般与硬性电路板配合使用，以作为硬性电路板的补充。
在一些实施例中，透镜组件400设置在电路板300上，采用罩扣式的方式罩设在光电芯片的上方，其中，光电芯片主要指光发射芯片、驱动芯片、光接收芯片、跨阻放大芯片、限幅放大芯片等与光电转换功能相关的芯片。透镜组件400与电路板300形成包裹光发射芯片、光接收芯片等光电芯片的腔体，透镜组件400与电路板300一起形成了封装光电芯片的结构。
光发射芯片设置在电路板300的表面上，光发射芯片发出的光垂直于电路板300；光接收芯片设置在电路板300的表面上，光接收芯片的光接收方向垂直于电路板300。光发射芯片发出的光经透镜组件400反射后进入水平设置的光纤阵列500中，以及，来自水平设置的光纤阵列500的光经透镜组件400反射后进入光接收芯片中，透镜组件在光发射芯片、光接收芯片及光纤阵列之间建立了光连接。
透镜组件不仅起到密封光电芯片的作用，同时也建立了光电芯片与光纤阵列之间的光连接。透镜组件400可以采用聚合物材料经注塑工艺一体成型制成。在一些实施例中，该透镜组件400的制成材料包括聚醚酰亚胺(Polyetherimide，PEI)塑料(Ultem系列)等透光性好的材料。
由于透镜组件400中的所有光束传播元件均采用相同的聚合物材料单片形成，从而可以大大减少成型模具，降低了制造成本和复杂度。本公开一些实施例中，将透镜组件400罩扣在电路板300上光电芯片的上方后，只需调节出射光束、入射光束以及光纤阵列500的位置，安装调试简单。
光纤阵列500与透镜组件400之间具有良好的光耦合结构设计，来自透镜组件400的多路汇聚光入射到光纤阵列500的多路光纤中，利用透镜组件400的光学结构实现了光纤阵列500与光发射芯片的光连接。将来自光纤阵列500的多路光入射到透镜组件400中，利用透镜组件400的光学结构实现了光纤阵列500与光接收芯片的光连接。
光纤阵列500与透镜组件400之间具有良好的固定结构设计，可以实现光纤阵列500与透镜组件400之间的相对固定；透镜组件400与电路板300之间具有良好的固定结构设计，可以实现透镜组件400与电路板300之间的相对固定；从而形成了透镜组件400与电路板300的相对固定、光纤阵列500与透镜组件400的相对固定。
在一些实施例中，为了光模块与外部的光纤连接器实现连接，往往需要在上、下壳体及光接口处设置匹配的结构，如光纤适配器600。光纤适配器600位于上、下壳体形成的光接口处，是光模块与光模块外部的光纤连接器(光纤)实现连接的连接件。
光纤适配器一般具有标准形状及尺寸，便于外部光纤连接器/插头插入，其内部具有多个光纤对接口，包括传出光信号的接口及传入光信号的接口。常见的光纤连接器/插头为MT型光纤连接器(如光纤跳线连接器(Multi-fiber Push On，MPO))。将光纤连接器/插头插入光模块的光纤适配器，使得光模块内部的光信号可以传入外部光纤中，以及光模块外部的光信号可以传入光模块内部。
在一些实施例中，光纤阵列500的一端与透镜组件400之间建立光连接，另一端与光纤适配器600建立光连接。光纤阵列500由多根(两根及以上)光纤组成，其将来自透镜组件400的光传输至光纤适配器600，实现了对外发出光信号；以及，光纤阵列500将来自光纤适配器600的光传输至透镜组件400，实现了从光模块外部接收光信号。
图5为根据本公开一些实施例提供的一种光模块中下壳体的结构图，图6为根据本公开一些实施例提供的一种光模块中上壳体的结构图，图7为根据本公开一些实施例提供的一种光模块的剖视图，图8为根据本公开一些实施例提供的一种光模块在另一视角下的剖视图。如图5-图8所示，上壳体201内形成有第一凹槽20111，下壳体202内形成有第二凹槽20211，将上壳体201盖合于下壳体202上时，第一凹槽20111与第二凹槽20211形成一个置物腔，光纤阵列500穿过该置物腔与光纤适配器600连接。
第一凹槽20111与第二凹槽20211形成的置物腔内放置有导电件700，该导电件700包括第一弹性导电件701和第二弹性导电件702，该第一弹性导电件701放置于第一凹槽20111内，该第二弹性导电件702放置于第二凹槽20211。
图9为根据本公开一些实施例提供的一种光模块中第一弹性导电件、第二弹性导电件、导电胶条和光纤带的结构图一。图10为根据本公开一些实施例提供的一种光模块中第一弹性导电件、第二弹性导电件、导电胶条和光纤带的结构图二。图11为根据本公开一些实施例提供的一种光模块中第一弹性导电件、第二弹性导电件、导电胶条和光纤带的结构图三。如图9、图10及图11所示，第一弹性导电件701与第二弹性导电件702接触连接，光纤阵列500位于第一弹性导电件701与第二弹性导电件702的连接处，且第一弹性导电件701与第二弹性导电件702和光纤阵列500无缝隙连接，以使第一弹性导电件701、第二弹性导电件702与光纤阵列500之间没有间隙。
由于第一弹性导电件701与第二弹性导电件702具有弹性，第一弹性导电件701与第二弹性导电件702连接时，可将第一弹性导电件701与第二弹性导电件702挤压连接，使得第一弹性导电件701与第二弹性导电件702充分接触，以保证第一弹性导电件701与第二弹性导电件702的无缝隙连接。
当第一弹性导电件701与第二弹性导电件702挤压连接时，光纤阵列500与第一弹性导电件701、第二弹性导电件702挤压接触，使得第一弹性导电件701、第二弹性导电件702与光纤阵列500充分接触，以保证第一弹性导电件701、第二弹性导电件702与光纤阵列500的无缝隙连接。
第一弹性导电件701与第二弹性导电件702的弹性不仅可以使得第一弹性导电件701、第二弹性导电件702与光纤阵列500充分接触，还可以保护光纤阵列500。
参见图6所示，在一些实施例中，第一凹槽20111由上壳体201的盖板2011向上壳体201的内侧凹陷形成，第一凹槽20111具有底面、第一侧面与第二侧面，第一侧面、底面和第二侧面依次连接，且第一侧面与第二侧面相对设置。第一凹槽20111的底面与第一弹性导电件701的底面对应设置，第一凹槽20111的第一侧面与第一弹性导电件701的第一侧面对应设置，第一凹槽20111的第二侧面与第一弹性导电件701的第二侧面对应设置。
将第一弹性导电件701放置于第一凹槽20111内时，第一凹槽20111的底面与第一弹性导电件701的底面无缝隙连接，第一凹槽20111的第一侧面与第一弹性导电件701的第一侧面无缝隙连接，第一凹槽20111的第二侧面与第一弹性导电件701的第二侧面无缝隙连接，使得第一弹性导电件701与第一凹槽20111无缝隙连接，以保证第一弹性导电件701与上壳体201的充分接触。
参见图5所示，在一些实施例中，第二凹槽20211由下壳体202的底板2021向下壳体202的内侧凹陷形成，第二凹槽20211具有底面、第一侧面与第二侧面，第一侧面、底面和第二侧面依次连接，且第一侧面与第二侧面相对设置。第二凹槽20211的底面与第二弹性导电件702的底面对应设置，第二凹槽20211的第一侧面与第二弹性导电件702的第一侧面对应设置，第二凹槽20211的第二侧面与第二弹性导电件702的第二侧面对应设置。
将第二弹性导电件702放置于第二凹槽20211内时，第二凹槽20211的底面与第二弹性导电件702的底面无缝隙连接，第二凹槽20211的第一侧面与第二弹性导电件702的第一侧面无缝隙连接，第二凹槽20211的第二侧面与第二弹性导电件702的第二侧面无缝隙连接，使得第二弹性导电件702与第二凹槽20211无缝隙连接，，以保证第二弹性导电件702与下壳体202的充分接触。
参见图5所示，在一些实施例中，上壳体201与下壳体202形成的壳体内形成有两个第三凹槽，该第三凹槽用于放置导电胶条800。该第三凹槽可设置于上壳体201上，且两个第三凹槽位于第一凹槽20111的两侧；或者，该第三凹槽设置于下壳体202上，且两个第三凹槽位于第二凹槽20211的两侧。
当第三凹槽位于第一凹槽20111的两侧时，第三凹槽位于上壳体201的盖板2011上，第三凹槽与第一凹槽20111连通，第三凹槽与第二凹槽20211不连通。
参见图5所示，当第三凹槽20212位于第二凹槽20211的两侧时，第三凹槽20212位于下壳体202的底板2021上，第三凹槽20212与第二凹槽20211连通，第三凹槽20212与第一凹槽20111不连通。
在一些实施例中，当第三凹槽20212位于第二凹槽20211的两侧时，第三凹槽20212由第二凹槽20211的侧壁向下壳体202的下侧板2022方向延伸，该第三凹槽20212内放置有导电胶条800。导电胶条800可使上壳体201与下壳体202除第一凹槽20111与第二凹槽20211之外的区域充分接触。
由于导电胶条800是由导电胶直接点涂在第三凹槽20212上固化后形成，导电胶的点涂存在一定的操作误差，可能会造成导电胶条800与第二凹槽20211内的第二弹 性导电件702不连接，使得第一弹性导电件701与第二弹性导电件702之间存在间隙，导致上壳体201与下壳体202无法充分接触，进而影响电磁屏蔽。
在一些实施例中，为了使上壳体201与下壳体202充分接触，导电胶条800放置于第三凹槽内，与第三凹槽不连通的第一凹槽或者第二凹槽内的弹性导电件的表面与导电胶条800连接，以通过导电胶条800填充上壳体201与下壳体202之间的间隙。
当第三凹槽位于第一凹槽20111的两侧时，第一凹槽20111的宽度尺寸小于第二凹槽20211的宽度尺寸，第一弹性导电件701的宽度尺寸小于第二弹性导电件702的宽度尺寸，第三凹槽内的导电胶条800与第二弹性导电件702的上表面连接。其中，第二弹性导电件702的上表面指的是第二弹性导电件702中与第一弹性导电件701连接区域外的其他区域的表面。
图12为根据本公开一些实施例提供的一种光模块中第一弹性导电件、第二弹性导电件和导电胶条的结构图，图13为根据本公开一些实施例提供的一种光模块中第二弹性导电件和导电胶条的结构图。如图8、图12及图13所示，当第三凹槽20212位于第二凹槽20211的两侧时，第二凹槽20211的宽度尺寸小于第一凹槽20111的宽度尺寸，第二弹性导电件702的宽度尺寸小于第一弹性导电件701的宽度尺寸，第三凹槽20212内的导电胶条800与第一弹性导电件701的下表面连接。其中，第一弹性导电件701的下表面指的是第一弹性导电件701中与第二弹性导电件702连接区域外的其他区域的下表面。
图14为根据本公开一些实施例提供的一种光模块的除去上壳体和下壳体后的结构图，图15为根据本公开一些实施例提供的一种光模块的除去上壳体和第一弹性导电件后的结构图，图16为根据本公开一些实施例提供的一种光模块的除去上壳体后的结构图。如图14、图15及图16所示，第一弹性导电件701或者第二弹性导电件702的表面与导电胶条800连接，通过导电胶条800填充上壳体201与下壳体202之间的间隙，使得上壳体201与下壳体202充分接触，从而使得上壳体201、第一弹性导电件701、第二弹性导电件702、导电胶条800与下壳体202形成一个封闭空腔，封闭空腔内部的电磁辐射无法渗透出来，有效降低了电磁辐射，从而起到了电磁屏蔽的作用。
参见图8所示，导电胶条800不仅与第一弹性导电件701的下表面连接，还与第二弹性导电件702的侧面连接，使得第一弹性导电件701与第二弹性导电件702的接触面挤压连接，上壳体201与下壳体202接触的其他区域通过导电胶条800连接，以使上壳体201与下壳体202进一步充分接触，从而使得上壳体201、第一弹性导电件701、第二弹性导电件702、导电胶条800与下壳体202形成一个封闭空腔，封闭空腔内部的电磁辐射无法渗透出来，有效降低了电磁辐射，从而起到了电磁屏蔽的作用。
在一些实施例中，为了保证上壳体201与下壳体202之间的密封性，上壳体201与下壳体202之间的间隙应位于预设范围内，以通过导电胶条800来填充上壳体201与下壳体202之间的间隙。
参见图5所示，在一些实施例中，第二凹槽20211的第一侧面与第一凹槽20111的第一侧面对应设置(沿上下方向设置)，第二凹槽20211的第二侧面与第一凹槽20111的第二侧面对应设置(沿上下方向设置)。第二凹槽20211的第一侧面与第一凹槽20111的第一侧面之间的垂直距离(上下方向的距离)为0.5㎜～2㎜，第二凹槽20211的第 二侧面与第一凹槽20111的第二侧面之间的垂直距离(上下方向的距离)为0.5㎜～2㎜。
当第二凹槽20211的第一侧面与第一凹槽20111的第一侧面之间的垂直距离小于0.5㎜，且第二凹槽20211的第二侧面与第一凹槽20111的第二侧面之间的垂直距离小于0.5㎜时，上壳体201与下壳体202之间的间隙较小，导电胶条800可能无法与第一凹槽20111内的第一弹性导电件701连接，或者无法与第二凹槽20211内的第二弹性导电件702连接，使得上壳体201与下壳体202无法充分接触，进而影响电磁屏蔽效果。
当第二凹槽20211的第一侧面与第一凹槽20111的第一侧面之间的垂直距离大于2㎜，且第二凹槽20211的第二侧面与第一凹槽20111的第二侧面之间的垂直距离大于2㎜时，上壳体201与下壳体202之间的间隙较大，对于一些小尺寸的光模块来说不合适。因此，在一些实施例中，第二凹槽20211的第一侧面与第一凹槽20111的第一侧面之间的垂直距离为0.5㎜～2㎜，第二凹槽20211的第二侧面与第一凹槽20111的第二侧面之间的垂直距离为0.5㎜～2㎜。
在一些实施例中，第二凹槽20211的第一侧面与第一凹槽20111的第一侧面之间的垂直距离等于第二凹槽20211的第二侧面与第一凹槽20111的第二侧面之间的垂直距离。
在一些实施例中，光纤阵列500穿过导电件700的第一弹性导电件701与第二弹性导电件702的连接处，既可以通过第一弹性导电件701与第二弹性导电件702支撑光纤阵列500，又可以通过第一弹性导电件701与第二弹性导电件702填充上壳体201与下壳体202之间的间隙。导电件700可以为导电垫片，也可以为导电泡棉。
在一些实施例中，导电件700可以为导电垫片。示例性地，第一弹性导电件701为第一弹性导电垫片，第二弹性导电件702为第二弹性导电垫片。
在一些实施例中，导电件700也可以为导电泡棉。示例性地，第一弹性导电件701为第一弹性导电泡棉，第二弹性导电件702为第二弹性导电泡棉。
参见图7所示，在一些实施例中，壳体内还设置有第一限位凸起20112和第二限位凸起20213，第一限位凸起20112由上壳体201的盖板2011向下壳体202的方向凸起形成，第一限位凸起20112位于第一凹槽20111的一侧；第二限位凸起20213由下壳体202的底板2021向上壳体201的方向凸起形成，第二限位凸起20213位于第二凹槽20211的一侧，且第二限位凸起20213与第一限位凸起20112不连接。但本公开并不局限于此，在一些实施例中，壳体内设置有第一限位凸起20112和第二限位凸起20213之一。
将光纤适配器600插入光模块的光接口处时，光纤适配器600的一端与第一限位凸起20112和/或第二限位凸起20213相抵接，以通过第一限位凸起20112和/或第二限位凸起20213限定光纤适配器600的位置。
在一些实施例中，第一限位凸起20112与第二限位凸起20213沿上下方向对应设置，第二限位凸起20213与第一限位凸起20112围成第一缺口，光纤阵列500穿过该第一缺口。
参见图7所示，在一些实施例中，壳体内还可设置有第一支撑凸起20113和第二 支撑凸起20214，第一支撑凸起20113由上壳体201的盖板2011向下壳体202的方向凸起形成，第一支撑凸起20113位于第一凹槽20111的另一侧；第二支撑凸起20214由下壳体202的底板2021向上壳体201的方向凸起形成，第二支撑凸起20214位于第二凹槽20211的另一侧，且第一支撑凸起20113与第二支撑凸起20214不连接。但本公开并不局限于此，在一些实施例中，壳体内设置有第一支撑凸起20113和第二支撑凸起20214之一。
在一些实施例中，第一支撑凸起20113与第一限位凸起20112分别位于第一凹槽20111的两端，第二支撑凸起20214与第二限位凸起20213分别位于第二凹槽20211的两端。
第一支撑凸起20113和第二支撑凸起20214沿上下方向对应设置，第一支撑凸起20113与第二支撑凸起20214围成第二缺口，第一缺口与第二缺口分别位于第一凹槽20111和第二凹槽20211形成的置物腔的两端。光纤阵列500由透镜组件400依次穿过第二缺口、置物腔和第一缺口后，插入光纤适配器600中。
在一些实施例中，第一凹槽20111凹陷于第一限位凸起20112或者第一支撑凸起20113，第一弹性导电件701的下表面与第一凹槽20111底面的高度差大于第一限位凸起20112与第一凹槽20111底面的高度差，或者大于第一支撑凸起20113与第一凹槽20111底面的高度差。示例地，第一弹性导电件701的下表面与第一凹槽20111底面之间具有第一高度差，第一限位凸起20112或者第一支撑凸起20113与第一凹槽20111底面之间具有第二高度差，第一高度差大于第二高度差。
第二凹槽20211凹陷于第二限位凸起20213或者第二支撑凸起20214，第二弹性导电件702的上表面与第二凹槽20211底面的高度差大于第二限位凸起20213与第二凹槽20211底面的高度差，或者大于第二支撑凸起20214与第二凹槽20211底面的高度差。示例地，第二弹性导电件702的上表面与第二凹槽20211底面之间具有第三高度差，第二限位凸起20213或者第二支撑凸起20214与第二凹槽20211底面之间具有第四高度差，第三高度差大于第四高度差。
本公开提供了一种光模块，包括上壳体和下壳体，上壳体内形成有第一凹槽，下壳体内形成有第二凹槽，将上壳体盖合于下壳体上时，第一凹槽与第二凹槽形成一个置物腔。第一凹槽内放置有第一弹性导电件，第一弹性导电件与第一凹槽无缝隙连接，使得第一弹性导电件与上壳体充分接触。第二凹槽内放置有第二弹性导电件，第二弹性导电件与第二凹槽无缝隙连接，使得第二弹性导电件与下壳体充分接触。
将上壳体盖合于下壳体上时，第一弹性导电件与第二弹性导电件接触连接。光模块还包括光纤阵列，光纤阵列位于第一弹性导电件与第二弹性导电件的连接处，以使第一弹性导电件和第二弹性导电件均与光纤阵列无缝隙连接。
由于第一弹性导电件与第二弹性导电件具有弹性，第一弹性导电件与第二弹性导电件挤压连接时，第一弹性导电件与第二弹性导电件无缝隙连接，使得第一弹性导电件与第二弹性导电件充分接触。当光纤阵列穿过第一弹性导电件与第二弹性导电件的连接处时，第一弹性导电件和第二弹性导电件分别与光纤阵列无缝隙连接，使得第一弹性导电件、第二弹性导电件与光纤阵列充分接触。
下壳体与上壳体形成的壳体内形成有两个第三凹槽，两个第三凹槽与第一凹槽或 者第二凹槽连通，第三凹槽内放置有导电胶条，导电胶条可使上壳体与下壳体除了第一凹槽与第二凹槽之外的区域充分接触。
第三凹槽可以位于第一凹槽的两侧，也可以位于第二凹槽的两侧。当第三凹槽位于第一凹槽的两侧时，第一凹槽的宽度尺寸小于第二凹槽的宽度尺寸，第一弹性导电件的宽度尺寸小于第二弹性导电件的宽度尺寸，第二弹性导电件的上表面与导电胶条连接。当第三凹槽位于第二凹槽的两侧时，与第三凹槽连通的第二凹槽的宽度尺寸小于第一凹槽的宽度尺寸，第二弹性导电件的宽度尺寸小于第一弹性导电件的宽度尺寸，第一弹性导电件的下表面与导电胶条连接。
第一弹性导电件的下表面或者第二弹性导电件的上表面与导电胶条连接，使得上壳体与下壳体充分接触，从而形成一个封闭空腔，封闭空腔内部的电磁辐射无法渗透出来，有效降低了电磁辐射，从而起到了电磁屏蔽的作用。
本公开中，第三凹槽内的导电胶条使得上壳体与下壳体之间除第一凹槽和第二凹槽之外的区域充分接触，第一凹槽内的第一弹性导电件和第二凹槽内的第二弹性导电件充分接触，光纤阵列穿过第一弹性导电件与第二弹性导电件的连接处，从而使得上壳体、第一弹性导电件、第二弹性导电件、导电胶条与下壳体形成一个封闭空腔，有效降低了电磁辐射，从而起到了电磁屏蔽的作用。
最后应说明的是：以上实施例仅用以说明本公开的技术方案，而非对其限制；尽管参照前述实施例对本公开进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本公开各实施例技术方案的精神和范围。

Claims (10)

  1. 一种光模块，包括：
    上壳体，内部形成有第一凹槽；
    下壳体，内部形成有第二凹槽，所述第二凹槽与所述第一凹槽形成置物腔；所述下壳体与所述上壳体形成壳体，所述壳体内形成有两个第三凹槽，两个所述第三凹槽位于所述第一凹槽的两侧，所述第三凹槽与所述第一凹槽连通；或者，所述第三凹槽位于所述第二凹槽的两侧，所述第三凹槽与所述第二凹槽连通；
    第一弹性导电件，设置于所述第一凹槽内，与所述第一凹槽连接；
    第二弹性导电件，设置于所述第二凹槽内，与所述第二凹槽连接；与所述第一弹性导电件连接；
    光纤阵列，位于所述第一弹性导电件与所述第二弹性导电件的连接处，分别与所述第一弹性导电件和所述第二弹性导电件连接；
    导电胶条，设置于所述第三凹槽内，分别与所述上壳体和所述下壳体连接；
    其中，与所述第三凹槽连通的所述第一凹槽的宽度尺寸小于所述第二凹槽的宽度尺寸，所述第一弹性导电件的宽度尺寸小于所述第二弹性导电件的宽度尺寸，以使所述第二弹性导电件的表面与所述导电胶条连接；
    或者，
    与所述第三凹槽连通的所述第二凹槽的宽度尺寸小于所述第一凹槽的宽度尺寸，所述第二弹性导电件的宽度尺寸小于所述第一弹性导电件的宽度尺寸，以使所述第一弹性导电件的表面与所述导电胶条连接。
  2. 根据权利要求1所述的光模块，其中，所述第三凹槽由所述第一凹槽的侧面或所述第二凹槽的侧面向所述壳体的侧壁方向延伸；
    所述导电胶条的一端与所述第一凹槽的侧面或所述第二凹槽的侧面连接。
  3. 根据权利要求1所述的光模块，其中，所述第二凹槽的第一侧面与所述第一凹槽的第一侧面之间的垂直距离为0.5㎜～2㎜，所述第二凹槽的第二侧面与所述第一凹槽的第二侧面之间的垂直距离为0.5㎜～2㎜；其中，所述垂直距离为所述第一凹槽的侧面与所述第二凹槽的侧面在上下方向的距离。
  4. 根据权利要求3所述的光模块，其中，所述第二凹槽的第一侧面与所述第一凹槽的第一侧面之间的垂直距离等于所述第二凹槽的第二侧面与所述第一凹槽的第二侧面之间的垂直距离。
  5. 根据权利要求1所述的光模块，所述壳体内还设置有光纤适配器、第一限位凸起和/或第二限位凸起，其中，
    所述第一限位凸起，设置于所述上壳体上，位于所述第一凹槽的一侧；
    所述第二限位凸起，设置于所述下壳体上，位于所述第二凹槽的一侧，且与所述第一限位凸起不连接；
    所述光纤适配器，通过所述第一限位凸起和/或所述第二限位凸起限位。
  6. 根据权利要求5所述的光模块，其中，所述壳体内还设置有第一支撑凸起和/或第二支撑凸起，其中，
    所述第一支撑凸起，设置于所述上壳体上，与所述第一限位凸起分别位于所述第 一凹槽的两端；
    所述第二支撑凸起，设置于所述下壳体上，与所述第二限位凸起分别位于所述第二凹槽的两端，且与所述第一支撑凸起不连接。
  7. 根据权利要求6所述的光模块，其中，所述第一弹性导电件的下表面与所述第一凹槽底面之间具有第一高度差，所述第一限位凸起或所述第一支撑凸起与所述第一凹槽底面之间具有第二高度差，所述第一高度差大于所述第二高度差；
    所述第二弹性导电件的上表面与所述第二凹槽底面之间具有第三高度差，所述第二限位凸起或所述第二支撑凸起与所述第二凹槽底面之间具有第四高度差，所述第三高度差大于所述第四高度差。
  8. 根据权利要求6所述的光模块，其中，所述第一限位凸起与所述第二限位凸起形成第一缺口，所述第一支撑凸起与所述第二支撑凸起形成第二缺口，所述第一缺口与所述第二缺口分别位于所述置物腔的两端，所述光纤阵列依次穿过所述第二缺口、所述置物腔与所述第一缺口。
  9. 根据权利要求1-8任一项所述的光模块，其中，所述第一弹性导电件为第一弹性导电垫片，所述第二弹性导电件为第二弹性导电垫片。
  10. 根据权利要求1-8任一项所述的光模块，其中，所述第一弹性导电件为第一弹性导电泡棉，所述第二弹性导电件为第二弹性导电泡棉。
PCT/CN2023/084071 2022-08-22 2023-03-27 光模块 Ceased WO2024040967A1 (zh)

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