WO2024038832A1

WO2024038832A1 - Jig and positioning method

Info

Publication number: WO2024038832A1
Application number: PCT/JP2023/029305
Authority: WO
Inventors: 俊紀赤間; 信峰佐々木
Original assignee: 東京エレクトロン株式会社
Priority date: 2022-08-19
Filing date: 2023-08-10
Publication date: 2024-02-22

Abstract

Provided are: a positioning jig that is used in positioning a ring member when the ring member is transported within a plasma treatment chamber and installed; and a positioning method.　This jig is used when a ring member is installed on a ring support surface of an installation-receiving member, the jig comprising a base plate and a sheet member that has a fixed part fixed to the base plate and a protruding part protruding from a side surface of the base plate.

Description

Jig and positioning method

The present disclosure relates to a jig and an alignment method.

Patent Document 1 discloses an etching apparatus that includes an edge ring that is a ring member disposed to surround the outer periphery of a substrate supported by a substrate support in a plasma processing chamber.

Japanese Patent Application Publication No. 2022-14879

In one aspect, the present disclosure provides a jig and an alignment method used for aligning a ring member when the ring member is transported and installed in a plasma processing chamber.

In order to solve the above problems, according to one aspect, there is provided a jig used when installing a ring member on a ring support surface of an installed member, the jig comprising: a base plate; a fixing part fixed to the base plate; A jig is provided, comprising: a sheet member having a protrusion protruding from a side surface of the base plate.

According to one aspect, the ring member can be accurately aligned when the ring member is transported and installed in the plasma processing chamber.

An example of a diagram for explaining a configuration example of a plasma processing apparatus. An example of a perspective view of a positioning jig. An example of a partially enlarged perspective view of a positioning jig. An example of a flowchart illustrating processing when installing an edge ring in an annular area of the main body. An example of a partial enlarged sectional view of the substrate support part in each state. An example of a partial enlarged sectional view of the substrate support part in each state. An example of a partial enlarged sectional view of the substrate support part in each state. An example of a partial enlarged sectional view of the substrate support part in each state. An example of a partial enlarged sectional view of the substrate support part in each state. An example of a partial enlarged sectional view of the substrate support part in each state. An example of a partial enlarged sectional view of the substrate support part in each state. An example of a partial enlarged sectional view of the substrate support part in each state. An example of a partial enlarged sectional view of the substrate support part in each state. An example of a flowchart illustrating a process when installing a covering ring in an annular area of a main body. An example of a partial enlarged sectional view of the substrate support part in each state. An example of a partial enlarged sectional view of the substrate support part in each state. An example of a partial enlarged sectional view of the substrate support part in each state. An example of a partial enlarged sectional view of the substrate support part in each state. An example of a partial enlarged sectional view of the substrate support part in each state. An example of a partial enlarged sectional view of the substrate support part in each state. An example of a partial enlarged sectional view of the substrate support part in each state. An example of a partial enlarged sectional view of the substrate support part in each state. An example of a partial enlarged sectional view of the substrate support part in each state. Another example of a partially enlarged sectional view of the substrate support part. FIG. 1 is a diagram showing an example of a substrate processing system according to an embodiment.

Hereinafter, embodiments for implementing the present disclosure will be described with reference to the drawings. In each drawing, the same components are given the same reference numerals, and redundant explanations may be omitted.

<Plasma processing equipment>
First, a configuration example of the plasma processing apparatus 1 will be described using FIG. 1. FIG. 1 is a diagram for explaining a configuration example of a plasma processing apparatus 1. As shown in FIG.

The plasma processing system includes a capacitively coupled plasma processing apparatus 1 and a control section 2. The capacitively coupled plasma processing apparatus 1 includes a plasma processing chamber 10, a gas supply section 20, a power supply 30, and an exhaust system 40. Further, the plasma processing apparatus 1 includes a substrate support section 11 and a gas introduction section. The gas inlet is configured to introduce at least one processing gas into the plasma processing chamber 10 . The gas introduction section includes a shower head 13. Substrate support 11 is arranged within plasma processing chamber 10 . The shower head 13 is arranged above the substrate support section 11 . In one embodiment, showerhead 13 forms at least a portion of the ceiling of plasma processing chamber 10 . The plasma processing chamber 10 has a plasma processing space 10s defined by a shower head 13, a side wall 10a of the plasma processing chamber 10, and a substrate support 11. The plasma processing chamber 10 has at least one gas supply port for supplying at least one processing gas to the plasma processing space 10s, and at least one gas exhaust port for discharging gas from the plasma processing space 10s. Plasma processing chamber 10 is grounded. The shower head 13 and the substrate support section 11 are electrically insulated from the casing of the plasma processing chamber 10.

A side wall 10a of the plasma processing chamber 10 is provided with a substrate W, a ring member (for example, an edge ring 112 described later, a cover) between the plasma processing chamber 10 and a vacuum transfer chamber (not shown) provided adjacent to the plasma processing chamber 10. A transport port (not shown) is provided for transporting the ring 113). The transfer port is opened and closed by a gate valve (not shown).

The substrate support section 11 includes a main body section 111 and a ring assembly 114. The main body portion 111 has a central region 111a for supporting the substrate W and an annular region 111b for supporting the ring assembly 114. A wafer is an example of a substrate W. The annular region 111b of the main body 111 surrounds the central region 111a of the main body 111 in plan view. The substrate W is arranged on the central region 111a of the main body 111, and the ring assembly 114 is arranged on the annular region 111b of the main body 111 so as to surround the substrate W on the central region 111a of the main body 111. Therefore, the central region 111a is also called a substrate support surface for supporting the substrate W, and the annular region 111b is also called a ring support surface for supporting the ring assembly 114.

In one embodiment, the main body 111 includes a base 1110 and an electrostatic chuck 1111. Base 1110 includes a conductive member. The conductive member of the base 1110 can function as a bottom electrode. Electrostatic chuck 1111 is placed on base 1110. Electrostatic chuck 1111 includes a ceramic member 1111a and

electrostatic electrodes

1111b and 1111c disposed within ceramic member 1111a. Electrostatic electrode 1111b is provided in central region 111a. The electrostatic electrode 1111c is provided in the annular region 111b. Ceramic member 1111a has a central region 111a. In one embodiment, ceramic member 1111a also has an annular region 111b. Note that another member surrounding the electrostatic chuck 1111, such as an annular electrostatic chuck or an annular insulating member, may have the annular region 111b. In this case, ring assembly 114 may be placed on the annular electrostatic chuck or the annular insulation member, or may be placed on both the electrostatic chuck 1111 and the annular insulation member. Further, at least one RF/DC electrode coupled to an RF (Radio Frequency) power source 31 and/or a DC (Direct Current) power source 32, which will be described later, may be disposed within the ceramic member 1111a. In this case, at least one RF/DC electrode functions as a bottom electrode. An RF/DC electrode is also referred to as a bias electrode if a bias RF signal and/or a DC signal, as described below, is supplied to at least one RF/DC electrode. Note that the conductive member of the base 1110 and at least one RF/DC electrode may function as a plurality of lower electrodes. Further, the electrostatic electrode 1111b may function as a lower electrode. Therefore, the substrate support 11 includes at least one lower electrode.

The ring assembly 114 includes one or more ring members (annular members). In one embodiment, the one or more ring members include one or more edge rings 112 and at least one cover ring 113. Edge ring 112 is made of a conductive or insulating material, and cover ring 113 is made of an insulating material.

Further, the substrate support section 11 may include a temperature control module configured to adjust at least one of the electrostatic chuck 1111, the ring assembly 114, and the substrate W to a target temperature. The temperature control module may include a heater, a heat transfer medium, a flow path 1110a, or a combination thereof. A heat transfer fluid such as brine or gas flows through the flow path 1110a. In one embodiment, a channel 1110a is formed within the base 1110 and one or more heaters are disposed within the ceramic member 1111a of the electrostatic chuck 1111. Further, the substrate support section 11 may include a heat transfer gas supply section configured to supply heat transfer gas to the gap between the back surface of the substrate W and the central region 111a.

Further, the substrate support section 11 may include, for example, three lift pins (first lift pins) 15 that can be raised and lowered from the substrate support surface of the central region 111a. The lift pin 15 is raised or lowered by a lifting mechanism (not shown). As the lift pins 15 rise from the substrate support surface, the substrate W supported on the substrate support surface is lifted by the lift pins 15. A transport device (not shown) receives the substrate W lifted by the lift pins 15. Further, the transport device delivers the substrate W to the lift pins 15. By lowering the lift pins 15 on the substrate support surface, the substrate W supported by the lift pins 15 is transferred to and supported by the substrate support surface.

Further, the substrate support section 11 may include, for example, three lift pins (second lift pins) 16 that can be raised and lowered from the ring support surface of the annular region 111b. The lift pin 16 is raised or lowered by a lifting mechanism (not shown). As the lift pin 16 rises from the ring support surface, the lift pin 16 lifts at least one ring member (eg, edge ring 112, cover ring 113) of the ring assembly 114 supported on the ring support surface. A transport device (not shown) receives the ring member lifted by the lift pins 16. Further, the conveyance device delivers the ring member to the lift pin 16. By lowering the lift pin 16 on the ring support surface, the ring member supported by the lift pin 16 is transferred to and supported by the ring support surface.

That is, ring members such as the edge ring 112 and the cover ring 113 that have been consumed by the plasma processing are carried out from the plasma processing space 10s via the transport port. Further, new ring members such as the edge ring 112 and the cover ring 113 are carried into the plasma processing space 10s through the transfer port and installed on the ring support surface. In this way, ring members such as the edge ring 112 and the cover ring 113 are automatically replaced via the transfer port without opening the top of the plasma processing chamber 10.

The shower head 13 is configured to introduce at least one processing gas from the gas supply section 20 into the plasma processing space 10s. The shower head 13 has at least one gas supply port 13a, at least one gas diffusion chamber 13b, and a plurality of gas introduction ports 13c. The processing gas supplied to the gas supply port 13a passes through the gas diffusion chamber 13b and is introduced into the plasma processing space 10s from the plurality of gas introduction ports 13c. The showerhead 13 also includes at least one upper electrode. In addition to the shower head 13, the gas introduction section may include one or more side gas injectors (SGI) attached to one or more openings formed in the side wall 10a.

The gas supply section 20 may include at least one gas source 21 and at least one flow rate controller 22. In one embodiment, the gas supply 20 is configured to supply at least one process gas from a respective gas source 21 to the showerhead 13 via a respective flow controller 22 . Each flow controller 22 may include, for example, a mass flow controller or a pressure-controlled flow controller. Additionally, gas supply 20 may include one or more flow modulation devices that modulate or pulse the flow rate of at least one process gas.

Power supply 30 includes an RF power supply 31 coupled to plasma processing chamber 10 via at least one impedance matching circuit. RF power source 31 is configured to supply at least one RF signal (RF power) to at least one bottom electrode and/or at least one top electrode. Thereby, plasma is formed from at least one processing gas supplied to the plasma processing space 10s. Accordingly, RF power source 31 may function as at least part of a plasma generation unit configured to generate a plasma from one or more process gases in plasma processing chamber 10 . Further, by supplying a bias RF signal to at least one lower electrode, a bias potential is generated in the substrate W, and ion components in the formed plasma can be drawn into the substrate W.

In one embodiment, the RF power supply 31 includes a first RF generation section 31a and a second RF generation section 31b. The first RF generation section 31a is coupled to at least one lower electrode and/or at least one upper electrode via at least one impedance matching circuit, and generates a source RF signal (source RF power) for plasma generation. It is configured as follows. In one embodiment, the source RF signal has a frequency within the range of 10 MHz to 150 MHz. In one embodiment, the first RF generator 31a may be configured to generate multiple source RF signals having different frequencies. The generated one or more source RF signals are provided to at least one bottom electrode and/or at least one top electrode.

The second RF generating section 31b is coupled to at least one lower electrode via at least one impedance matching circuit, and is configured to generate a bias RF signal (bias RF power). The frequency of the bias RF signal may be the same or different than the frequency of the source RF signal. In one embodiment, the bias RF signal has a lower frequency than the frequency of the source RF signal. In one embodiment, the bias RF signal has a frequency within the range of 100kHz to 60MHz. In one embodiment, the second RF generator 31b may be configured to generate multiple bias RF signals having different frequencies. The generated one or more bias RF signals are provided to at least one bottom electrode. Also, in various embodiments, at least one of the source RF signal and the bias RF signal may be pulsed.

Power source 30 may also include a DC power source 32 coupled to plasma processing chamber 10 . The DC power supply 32 includes a first DC generation section 32a and a second DC generation section 32b. In one embodiment, the first DC generator 32a is connected to at least one lower electrode and configured to generate a first DC signal. The generated first bias DC signal is applied to the at least one bottom electrode. In one embodiment, the second DC generator 32b is connected to the at least one upper electrode and configured to generate a second DC signal. The generated second DC signal is applied to the at least one top electrode.

In various embodiments, at least one of the first and second DC signals may be pulsed. In this case, a sequence of voltage pulses is applied to at least one lower electrode and/or at least one upper electrode. The voltage pulse may have a pulse waveform that is rectangular, trapezoidal, triangular, or a combination thereof. In one embodiment, a waveform generator for generating a sequence of voltage pulses from a DC signal is connected between the first DC generator 32a and the at least one bottom electrode. Therefore, the first DC generation section 32a and the waveform generation section constitute a voltage pulse generation section. When the second DC generation section 32b and the waveform generation section constitute a voltage pulse generation section, the voltage pulse generation section is connected to at least one upper electrode. The voltage pulse may have positive polarity or negative polarity. Furthermore, the sequence of voltage pulses may include one or more positive voltage pulses and one or more negative voltage pulses within one cycle. Note that the first and second

DC generation units

32a and 32b may be provided in addition to the RF power source 31, or the first DC generation unit 32a may be provided in place of the second RF generation unit 31b. good.

The exhaust system 40 may be connected to a gas exhaust port 10e provided at the bottom of the plasma processing chamber 10, for example. Evacuation system 40 may include a pressure regulating valve and a vacuum pump. The pressure within the plasma processing space 10s is adjusted by the pressure regulating valve. The vacuum pump may include a turbomolecular pump, a dry pump, or a combination thereof.

The control unit 2 processes computer-executable instructions that cause the plasma processing apparatus 1 to perform various steps described in this disclosure. The control unit 2 may be configured to control each element of the plasma processing apparatus 1 to perform the various steps described herein. In one embodiment, part or all of the control unit 2 may be included in the plasma processing apparatus 1. The control unit 2 may include a processing unit 2a1, a storage unit 2a2, and a communication interface 2a3. The control unit 2 is realized by, for example, a computer 2a. The processing unit two a1 may be configured to read a program from the storage unit two a2 and perform various control operations by executing the read program. This program may be stored in the storage unit 2a2 in advance, or may be acquired via a medium when necessary. The acquired program is stored in the storage unit 2a2, and is read out from the storage unit 2a2 and executed by the processing unit 2a1. The medium may be various storage media readable by the computer 2a, or may be a communication line connected to the communication interface 2a3. The processing unit 2a1 may be a CPU (Central Processing Unit). The storage unit 2a2 may include a RAM (Random Access Memory), a ROM (Read Only Memory), an HDD (Hard Disk Drive), an SSD (Solid State Drive), or a combination thereof. Good. The communication interface 2a3 may communicate with the plasma processing apparatus 1 via a communication line such as a LAN (Local Area Network).

<Positioning jig>
Next, the positioning jig (jig) 200 will be explained using FIGS. 2 and 3. FIG. 2 is an example of a perspective view of the alignment jig 200. FIG. 3 is an example of a partially enlarged perspective view of the alignment jig 200.

The positioning jig 200 is used for positioning ring members such as the edge ring 112 and the cover ring 113 when installing the ring members on the ring support surface (annular region 111b) of the main body 111, which is the installed member. It is a jig that can be used. Specifically, the alignment jig 200 aligns the ring member with respect to the installed member by managing the gap between the alignment target surface of the ring member and the opposing surface of the installed member that faces the alignment target surface. Align. The alignment jig 200 includes a base plate 210 and a plurality of centering sheets (sheet members) 220.

The base plate 210 is a plate-shaped member. Further, the base plate 210 is formed in a shape that can be transported by a transport arm 500 (see FIG. 5 described later) of a transport device (not shown). Further, the base plate 210 is formed in a shape that can be installed in the central region 111a of the main body portion 111.

The base plate 210 is preferably formed as a disc of a conductive member such as a material that can be attracted by the electrostatic chuck 1111, such as silicon (Si). Note that the base plate 210 may be made of a material such as ceramic or resin.

Furthermore, the diameter of the base plate 210 is smaller than the diameter of the inner peripheral surface of the ring member to be aligned. That is, the diameter of the positioning jig 200 used for positioning the edge ring 112 is smaller than the diameter of the inner peripheral surface 112c of the edge ring 112 (see FIG. 8, which will be described later). The diameter of the positioning jig 200 used for positioning the cover ring 113 is smaller than the diameter of the inner circumferential surface 113c of the cover ring 113 (see FIG. 18 described later). This allows the base plate 210 to pass through the hole in the ring member.

Furthermore, it is preferable that the diameter of the base plate 210 is smaller than the diameter of the opposing surface that faces the inner circumferential surface of the ring member to be aligned. That is, the diameter of the alignment jig 200 used for aligning the edge ring 112 is smaller than the diameter of the edge ring opposing surface 111c1 (see FIG. 11 described later) that faces the inner peripheral surface 112c of the edge ring 112. It is preferable that The diameter of the positioning jig 200 used for positioning the cover ring 113 is smaller than the diameter of the cover ring facing surface 111c2 (see FIG. 21 described later) that faces the inner peripheral surface 113c of the cover ring 113. It is preferable.

Here, if the conveyance accuracy of the conveyance device is X [mm], the amount of deviation between the center positions of the base plate 210 and the ring members (edge ring 112, cover ring 113) is 2X [mm] at maximum. For this reason, it is preferable that the diameter of the base plate 210 is smaller than the diameter of the inner peripheral surface of the ring member to be aligned by at least 2X [mm]. As a result, even if the center positions of the base plate 210 and the ring member are misaligned due to the transport accuracy of the transport device, the base plate can be supported by the substrate support surface in the hole of the ring member without interfering with the ring member. 210 can be passed. For example, when the conveyance accuracy of the conveyance device is 0.3 mm, it is preferable that the diameter of the base plate 210 is smaller than the diameter of the inner peripheral surface of the ring member by 0.6 mm or more.

Furthermore, it is preferable that the base plate 210 has a thickness that allows it to be transported by a transport device. For example, the base plate 210 may have the same thickness as the substrate W. Thereby, the alignment jig 200 can be transported by the transport device that transports the substrate W.

As shown in FIG. 3, the centering sheet 220 has a fixed part 221 and a protruding part 222. The centering sheet 220 has a fixed part 221 and a protruding part 222 formed integrally with each other, and is made of a flexible material. Specifically, the centering sheet 220 is preferably formed of a resin material such as polyimide. Furthermore, the centering sheet 220 has translucency. The centering sheet 220 preferably has a transmittance of 50% or more, more preferably 60% or more. When detecting the center position of the base plate 210 by detecting the position of the edge of the base plate 210, optical sensors (such as position detection sensors S1 to S2, S11 to S72, which will be described later in FIG. 25) pass through the centering sheet 220. ) can detect the position of the edge of the base plate 210, etc. The fixing part 221 is fixed to the base plate 210. The protrusion 222 protrudes radially outward from the side surface of the base plate 210.

The disc-shaped base plate 210 has a lower surface (first surface), an upper surface (second surface), and a side surface (third surface). The lower surface of the base plate 210 is a surface that comes into contact with and is supported by the substrate support surface (center region 111a) of the main body 111 when the base plate 210 is placed on the substrate support surface (center region 111a). The upper surface of base plate 210 is a surface opposite to the lower surface of base plate 210. The side surface of the base plate 210 is a cylindrical surface whose one end is connected to the outer peripheral end of the lower surface and the other end is connected to the outer peripheral end of the upper surface.

Grooves

211, 212, and 213 are formed on the top surface of the base plate 210. The internal space formed by the groove portion 211 communicates with an external space above the base plate 210 and with an external space outside the base plate 210 in the radial direction. The fixing portion 221 of the centering sheet 220 is arranged in alignment with the groove portion 211. The centering sheet 220 is then fixed to the base plate 210 by adhesive. By bringing the side wall 221a of the fixed portion 221 of the centering sheet 220 into contact with the side wall 211a of the groove portion 211, the length of the protruding portion 222 protruding radially outward from the side surface of the base plate 210 is managed.

Furthermore, a plurality of centering sheets 220 are provided along the outer periphery of the base plate 210. In the example shown in FIG. 2, six centering sheets 220 are provided on the base plate 210 at equal intervals. In other words, the base plate 210 is provided with six grooves 211 at equal intervals, and each groove 211 is provided with a centering sheet 220, respectively. Note that the number of centering sheets 220 is not limited to this, and is preferably three or more. Moreover, it is preferable that the centering sheets 220 are provided at equal intervals in the circumferential direction of the base plate 210. Note that the centering sheets 220 do not need to be provided at equal intervals in the circumferential direction of the base plate 210.

The length of the protruding part 222 protruding from the side surface of the base plate 210 (the length of the protruding part 222 in the radial direction of the base plate 210) is the length of the protruding part 222 when the ring member is installed on the ring support surface and the protruding part 222 is bent. It is formed in a length that does not reach (do not come into contact with) the ring support surface of the member. That is, in the alignment jig 200 used for positioning the edge ring 112, the length of the protrusion 222 is such that when the edge ring 112 is installed on the ring support surface and the protrusion 222 is bent, the edge ring 112 The edge ring support surface 111b1 is formed in such a length that it does not reach (do not come into contact with) the edge ring support surface 111b1 that supports the edge ring (see FIG. 11, which will be described later). In the alignment jig 200 used for positioning the cover ring 113, the length of the protrusion 222 is such that the cover ring 113 is supported when the cover ring 113 is installed on the ring support surface and the protrusion 222 is bent. The cover ring support surface 111b2 is formed in such a length that it does not reach (do not come into contact with) the covering support surface 111b2 (see FIG. 21, which will be described later).

Further, the length of the protruding part 222 protruding from the side surface of the base plate 210 (the length of the protruding part 222 in the radial direction of the base plate 210) is determined when the ring member is installed on the ring support surface and the protruding part 222 is bent. , is formed to have a length that reaches the gap between the alignment target surface of the ring member and the opposing surface of the installed member that faces the alignment target surface. That is, in the alignment jig 200 used for positioning the edge ring 112, the length of the protrusion 222 is such that when the edge ring 112 is installed on the ring support surface and the protrusion 222 is bent, the edge ring support The length is formed to reach the gap between the inner circumferential surface 112c of the edge ring 112 installed on the surface 111b1 and the edge ring opposing surface 111c1 (see FIG. 11 described later). In the alignment jig 200 used for positioning the cover ring 113, the length of the protrusion 222 is such that when the cover ring 113 is installed on the ring support surface and the protrusion 222 is bent, the length of the protrusion 222 is equal to that of the cover ring support surface 111b2 The length is formed to reach the gap between the inner circumferential surface 113c of the cover ring 113 installed in the cover ring 113 and the cover ring facing surface 111c2 (see FIG. 21 described later).

Further, in the circumferential direction of the base plate 210, the width of the protrusion 222 (the length of the protrusion 222 in the direction perpendicular to the radial direction of the base plate 210) is not limited. It is preferable that the width of the protrusion 222 is, for example, 2.1 mm or more and 4.5 mm or less.

Furthermore, as shown in FIGS. 2 and 3, the width of the fixing part 221 may be formed wider than the width of the protruding part 222. Thereby, the contact area between the fixing part 221 and the groove part 211 of the base plate 210 can be increased, and the fixation of the centering sheet 220 fixed by adhesive can be improved. Moreover, by forming the width of the protrusion 222 to be narrower than the width of the fixing part 221, the protrusion 222 can be easily bent.

Further, the thickness of the protruding portion 222 is designed based on the controlled dimension of the gap between the alignment target surface of the ring member and the opposing surface of the installed member that faces the alignment target surface. It is preferable that the thickness of the protruding portion 222 is, for example, 0.05 mm or more and 0.125 mm or less.

Further, the groove portion 211 may have an inclined surface 211b on the outer peripheral side of the base plate 210. Thereby, when the protruding portion 222 is bent downward, it can be bent along the inclined surface 211b. Therefore, when the protruding portion 222 bends downward, stress concentration occurring in the bending centering sheet 220 is suppressed.

Additionally, six grooves 212 are provided in the base plate 210 at equal intervals. Furthermore, six grooves 213 are provided in the base plate 210 at equal intervals. The

grooves

212, 212, and 213 may have different shapes, or may have the same shape. The alignment jig 200 can be replaced with a centering sheet 220 having a different shape (for example, the length of the protrusion 222, etc.) depending on the application. For example, the length of the protrusion 222 protruding from the outer periphery of the base plate 210 may be adjusted by varying the radial lengths of the

grooves

211, 212, and 213.

Although the centering sheet 220 has been described as being fixed to the base plate 210 by adhesive, the fixing method is not limited to this. It may be physically fixed by fixing with bolts or by being sandwiched between other members. Further, the centering sheet 220 may be detachably fixed to the alignment jig 200. Accordingly, the alignment jig 200 may have a structure in which the length of the protrusion 222, the width of the protrusion 222, and the thickness of the protrusion 222 can be arbitrarily changed by replacing the centering sheet 220.

<Edge ring installation process>
Processing when installing the edge ring 112 in the annular region 111b of the main body portion 111 will be described using FIGS. 4 to 13. FIG. 4 is an example of a flowchart illustrating a process when installing the edge ring 112 in the annular region 111b of the main body portion 111. 5 to 13 are examples of partially enlarged cross-sectional views of the substrate support portion 11 in each state. Note that in the following description, the inclined surface 211b formed in the groove portion 211 of the base plate 210 is omitted from illustration.

Here, the structure of the substrate support section 11 will be further explained with reference to FIG. 5.

The main body portion 111 has a central region 111a (substrate support surface) for supporting the substrate W, and an annular region 111b for supporting the ring assembly 114. The annular region 111b has an edge ring support surface 111b1 for supporting the edge ring 112 and a cover ring support surface 111b2 for supporting the cover ring 113.

The edge ring support surface 111b1 is provided radially outside the substrate support surface and is formed at a position lower than the substrate support surface. An edge ring opposing surface 111c1 is provided between the substrate supporting surface and the edge ring supporting surface 111b1. The edge ring opposing surface 111c1 is a cylindrical surface that faces the inner circumferential surface 112c of the edge ring 112 (see FIGS. 8 to 13) when the edge ring 112 is supported by the edge ring support surface 111b1.

The cover ring support surface 111b2 is provided radially outward from the substrate support surface and the edge ring support surface 111b1, and is formed at a position lower than the substrate support surface and the edge ring support surface 111b1. A covering opposing surface 111c2 is provided between the edge ring supporting surface 111b1 and the covering supporting surface 111b2. The cover ring facing surface 111c2 is a cylindrical surface, and is a surface that faces the inner circumferential surface 113c (see FIG. 5) of the cover ring 113 when the cover ring 113 is supported by the cover ring support surface 111b2.

The cover ring 113 has a bottom surface 113a. The bottom surface 113a is a surface that comes into contact with and is supported by the cover ring support surface 111b2 when the cover ring 113 is placed on the ring support surface (annular region 111b) of the main body portion 111. The upper surface of the cover ring 113 is formed with a step that is lower on the inner circumferential side and higher on the outer circumferential side. An edge ring support surface 113b that supports the outer circumferential side of the edge ring 112 is formed on the inner circumferential upper surface of the cover ring 113. Further, the cover ring 113, which is a ring member, has a cylindrical inner peripheral surface 113c. The cover ring 113 also has a through hole 113d that penetrates from the bottom surface 113a to the edge ring support surface 113b.

As shown in FIGS. 8 to 13, the edge ring 112 has a bottom surface 112a. When the edge ring 112 is placed on the ring support surface (annular region 111b) of the main body 111, the bottom surface 112a is supported by the inner circumferential side in contact with the edge ring support surface 111b1, and the outer circumferential side in contact with the edge ring support surface 113b. It is a surface that is supported by Further, the edge ring 112, which is a ring member, has a cylindrical inner peripheral surface 112c.

Next, a process for installing the edge ring 112 in the annular region 111b of the main body portion 111 will be described with reference to FIG. 4 and FIGS. 5 to 13 as appropriate. Here, the inner circumferential surface 112c of the edge ring 112 is the alignment target surface, and the edge ring opposing surface 111c1, which is the surface facing the inner circumferential surface 112c, is the opposing surface facing the alignment target surface. The edge ring 112 is installed on the ring support surface (annular region 111b) of the main body portion 111 while controlling the gap with the opposing surface. As a result, the edge ring 112 is centered and installed with respect to the main body portion 111, which is the member to be installed.

In step S101, the alignment jig 200 is transported to the plasma processing chamber 10.

FIG. 5 is an example of a partially enlarged cross-sectional view of the substrate support section 11 in a state in which the alignment jig 200 is transported into the plasma processing chamber 10 in step S101. The control unit 2 opens the gate valve, controls the transport device, transports the transport arm 500 holding the alignment jig 200 from the transport port to the plasma processing chamber 10, and positions it above the central region 111a of the main body 111. Place the alignment jig 200.

In step S102, the alignment jig 200 is received from the transfer arm 500 by the lift pins 15 and placed on the substrate support surface of the electrostatic chuck 1111.

FIG. 6 is an example of a partially enlarged cross-sectional view of the substrate support portion 11 in a state in which the alignment jig 200 is received by the lift pins 15 in step S102. The control unit 2 controls a lifting mechanism (not shown) to raise the lift pin 15. As a result, the upper end of the lift pin 15 comes into contact with the lower surface of the alignment jig 200, the alignment jig 200 is lifted from the transport arm 500 by the lift pin 15, and the alignment jig 200 is supported by the lift pin 15. Then, the control unit 2 controls the transfer device to retreat the transfer arm 500 from the transfer port, and closes the gate valve.

FIG. 7 is an example of a partially enlarged cross-sectional view of the substrate support section 11 in a state where the alignment jig 200 is installed on the electrostatic chuck 1111 in step S102. The control unit 2 controls a lifting mechanism (not shown) to lower the lift pin 15. As a result, the alignment jig 200 supported by the lift pins 15 is installed on the substrate support surface.

Furthermore, the control unit 2 fixes the alignment jig 200 to the main body 111 by controlling an electrostatic chuck power source (not shown) and applying a voltage to the electrostatic electrode 1111b. Note that the method of fixing the positioning jig 200 to the main body portion 111 is not limited to this, and other fixing methods may be used. For example, by making the gap between the back surface of the alignment jig 200 and the central region 111a a higher vacuum than the plasma processing space 10s, and applying pressure difference between the upper surface side and the lower surface side of the alignment jig 200, the alignment jig 200 may be fixed to the main body portion 111. In this case, the base plate 210 may be made of a material such as ceramic or resin. Alternatively, the positioning jig 200 may be fixed to the main body portion 111 by its own weight.

In step S103, the edge ring 112 is transported into the plasma processing chamber 10.

FIG. 8 is an example of a partially enlarged cross-sectional view of the substrate support part 11 in a state where the edge ring 112 is transported into the plasma processing chamber 10 in step S103. The control unit 2 opens the gate valve, controls the transfer device, transfers the transfer arm 500 holding the edge ring 112 from the transfer port to the plasma processing chamber 10, and transfers the transfer arm 500 holding the edge ring 112 from the transfer port to the annular region 111b of the main body 111 (edge ring support surface 111b1). , the edge ring 112 is placed on the edge ring support surface 113b).

In step S104, the edge ring 112 is received from the transport arm 500 by the lift pin 16 and placed on the ring support surface of the electrostatic chuck 1111.

FIG. 9 is an example of a partially enlarged sectional view of the substrate support portion 11 in a state in which the edge ring 112 is received by the lift pins 16 in step S104. The control unit 2 controls a lifting mechanism (not shown) to raise the lift pin 16. Here, the lift pin 16 has an upper small diameter portion 161 and a lower large diameter portion 162. The small diameter portion 161 is inserted through the through hole 113d of the cover ring 113, and the upper end of the small diameter portion 161 of the lift pin 16 comes into contact with the lower surface of the edge ring 112. The edge ring 112 is lifted from the transport arm 500 by the lift pin 16, and the edge ring 112 is supported by the lift pin 16. Then, the control unit 2 controls the transfer device to retreat the transfer arm 500 from the transfer port, and closes the gate valve.

FIG. 10 is an example of a partially enlarged cross-sectional view of the substrate support portion 11 in a state where the lift pins 16 are being lowered in step S104. The control unit 2 controls a lifting mechanism (not shown) to lower the lift pin 16. Here, as the edge ring 112 descends, the bottom surface 112a comes into contact with the upper surface of the protrusion 222, and the protrusion 222 is deformed by the weight of the edge ring 112. Then, as the protrusion 222 further deforms, the lower surface of the protrusion 222 comes into contact with the edge of the substrate support surface and the edge ring facing surface 111c1. As a result, the protrusion 222 forms an inclination. The inclination of the protrusion 222 guides the horizontal position of the descending edge ring 112. For example, if the center position of the edge ring 112 supported by the lift pin 16 is shifted from the center position of the main body part 111, the edge ring 112 is guided by the inclination of the protruding part 222, and the edge ring 112 is horizontal. The position of the direction is adjusted. This prevents the edge ring 112 from riding on the substrate support surface and becoming unable to be installed on the ring support surface.

FIG. 11 is an example of a partially enlarged cross-sectional view of the substrate support part 11 in a state where the edge ring 112 is installed on the electrostatic chuck 1111 in step S104. The control unit 2 controls a lifting mechanism (not shown) to further lower the lift pin 16. Thereby, the edge ring 112 is supported in contact with the edge ring support surfaces 111b1 and 113b. Further, the length of the protrusion 222 is set to reach the gap between the inner circumferential surface 112c of the edge ring 112 and the edge ring facing surface 111c1. As a result, the protruding portion 222 is placed between the edge ring facing surface 111c1 and the inner circumferential surface 112c. Here, since a plurality of centering sheets 220 are provided in the circumferential direction, the gap between the edge ring facing surface 111c1 and the inner circumferential surface 112c is managed by the thickness of the protruding portion 222 at a plurality of positions in the circumferential direction. be done. As a result, the edge ring 112 is centered and installed with respect to the main body portion 111.

Furthermore, the length of the protruding portion 222 is formed to a length that does not reach the edge ring support surface 111b1. This prevents the protrusion 222 from being pinched between the bottom surface 112a of the edge ring 112 and the edge ring support surface 111b1.

In step S105, the edge ring 112 is fixed. Here, the annular region 111b of the main body portion 111 is provided with a through hole in which the lift pin 16 is arranged and a supply hole for supplying heat transfer gas to the gap between the back surface of the edge ring 112 and the edge ring support surface 111b1. ing. While the edge ring 112 is supported by the ring support surface, the pressure in the gap between the back surface of the edge ring 112 and the edge ring support surface 111b1 is reduced by exhausting air from the through hole and/or the supply hole. As a result, the gap between the back surface of the edge ring 112 and the edge ring support surface 111b1 is made into a higher vacuum than the plasma processing space 10s, and the pressure difference between the upper surface side and the lower surface side of the edge ring 112 moves the edge ring 112 into the main body. Fixed to 111 (temporarily fixed). Furthermore, the control unit 2 may fix (mainly fix) the edge ring 112 to the main body 111 by controlling an electrostatic chuck power source (not shown) and applying a voltage to the electrostatic electrode 1111c. . Note that the fixing method for fixing (temporary fixing, permanent fixing) the edge ring 112 to the main body portion 111 is not limited to this, and other fixing methods may be used.

Here, when fixing the edge ring 112 to the main body part 111 (temporary fixing, permanent fixing), there is a risk that the edge ring 112 will move in the horizontal direction due to the pressure difference or the like and be deviated from a suitable position. On the other hand, in step S105, the centering sheet 220 is fixed (temporarily fixed, permanently fixed) in a state in which the protrusion 222 of the centering sheet 220 is sandwiched between the edge ring facing surface 111c1 and the inner peripheral surface 112c. Thereby, when fixing the edge ring 112 to the main body portion 111, it is possible to prevent the edge ring 112 from shifting from a suitable position.

In step S106, the alignment jig 200 is supported by the lift pins 15.

First, in step S102, if the alignment jig 200 is fixed to the main body part 111, the alignment jig 200 is released from fixation.

Next, the control unit 2 controls a lifting mechanism (not shown) to raise the lift pin 15. As a result, the upper ends of the lift pins 15 come into contact with the lower surface of the alignment jig 200, the alignment jig 200 is lifted from the substrate support surface by the lift pins 15, and the alignment jig 200 is separated from the substrate support surface. Furthermore, the protrusion 222 that was disposed in the gap between the edge ring facing surface 111c1 and the inner circumferential surface 112c is pulled out. At this time, the edge ring 112 is fixed (temporarily or permanently fixed) to the main body 111, and when the protrusion 222 is pulled out from between the edge ring facing surface 111c1 and the inner peripheral surface 112c, the position of the edge ring 112 is to prevent it from shifting. Then, due to the restoring force of the centering sheet 220, the protrusion 222 returns to a substantially horizontal position.

In step S107, the alignment jig 200 is carried out from the plasma processing chamber 10.

FIG. 12 is an example of a partially enlarged cross-sectional view of the substrate support section 11 in a state in which the alignment jig 200 is transported into the plasma processing chamber 10 in step S107. The control section 2 opens the gate valve, controls the transfer device, transfers the transfer arm 500 from the transfer port to the plasma processing chamber 10, and places it between the main body section 111 and the alignment jig 200. Next, the control unit 2 controls a lifting mechanism (not shown) to lower the lift pin 15. As a result, the positioning jig 200 supported by the lift pins 15 is held by the transport arm 500. Then, the control unit 2 controls the transport device to retreat the transport arm 500 holding the positioning jig 200 from the transport port, and closes the gate valve.

Note that if the edge ring 112 is only temporarily fixed in step S105, the edge ring 112 may be permanently fixed before the protrusion 222 is pulled out. Further, the edge ring 112 may be permanently fixed after the protrusion 222 is pulled out.

FIG. 13 is an example of a partially enlarged cross-sectional view of the substrate support section 11 in a state where the process of step S107 has been completed. As described above, the edge ring 112 can be automatically replaced via the transfer port without opening the top of the plasma processing chamber 10. Further, the edge ring 112 is installed on the ring support surface without riding on the substrate support surface. Further, the gap between the edge ring facing surface 111c1 and the inner circumferential surface 112c is controlled by the thickness of the protrusion 222 at multiple positions in the circumferential direction, and the edge ring 112 is centered with respect to the main body 111. It will be installed. Furthermore, since the centering of the edge ring 112 can be controlled by the thickness of the centering sheet 220, it is possible to center the edge ring 112 with higher accuracy than the conveyance accuracy of the edge ring 112 by the conveyance arm 500 of the conveyance device.

<Covering installation process>
Processing when installing the cover ring 113 in the annular region 111b of the main body portion 111 will be described using FIGS. 14 to 23. FIG. 14 is an example of a flowchart illustrating a process when installing the covering ring 113 in the annular region 111b of the main body portion 111. 15 to 23 are examples of partially enlarged cross-sectional views of the substrate support portion 11 in each state. Note that in the following description, the inclined surface 211b formed in the groove portion 211 of the base plate 210 is omitted from illustration.

Processing when installing the cover ring 113 in the annular region 111b of the main body portion 111 will be described with reference to FIG. 14 and FIGS. 15 to 23 as appropriate. Here, the inner circumferential surface 113c of the cover ring 113 is the alignment target surface, and the covering opposing surface 111c2, which is the surface facing the inner circumferential surface 113c, is the opposing surface facing the alignment target surface. The cover ring 113 is installed on the ring support surface (annular region 111b) of the main body portion 111 while controlling the gap between the cover ring 113 and the opposing surface. As a result, the cover ring 113 is centered and installed with respect to the main body portion 111, which is the member to be installed.

In step S201, the alignment jig 200 is transported to the plasma processing chamber 10.

FIG. 15 is an example of a partially enlarged cross-sectional view of the substrate support section 11 in a state in which the alignment jig 200 is transported into the plasma processing chamber 10 in step S201. The control unit 2 opens the gate valve, controls the transport device, transports the transport arm 500 holding the alignment jig 200 from the transport port to the plasma processing chamber 10, and positions it above the central region 111a of the main body 111. Place the alignment jig 200.

In step S202, the alignment jig 200 is received from the transfer arm 500 by the lift pins 15 and installed on the substrate support surface of the electrostatic chuck 1111.

FIG. 16 is an example of a partially enlarged sectional view of the substrate support portion 11 in a state in which the alignment jig 200 is received by the lift pins 15 in step S202. The control unit 2 controls a lifting mechanism (not shown) to raise the lift pin 15. As a result, the upper end of the lift pin 15 comes into contact with the lower surface of the alignment jig 200, the alignment jig 200 is lifted from the transport arm 500 by the lift pin 15, and the alignment jig 200 is supported by the lift pin 15. Then, the control unit 2 controls the transfer device to retreat the transfer arm 500 from the transfer port, and closes the gate valve.

FIG. 17 is an example of a partially enlarged cross-sectional view of the substrate support section 11 in a state where the alignment jig 200 is installed on the electrostatic chuck 1111 in step S202. The control unit 2 controls a lifting mechanism (not shown) to lower the lift pin 15. As a result, the alignment jig 200 supported by the lift pins 15 is installed on the substrate support surface.

In step S203, the cover ring 113 is transported into the plasma processing chamber 10.

FIG. 18 is an example of a partially enlarged sectional view of the substrate support part 11 in a state where the cover ring 113 is transported into the plasma processing chamber 10 in step S203. The control section 2 opens the gate valve and controls the transfer device to transfer the transfer arm 500 holding the cover ring 113 from the transfer port to the plasma processing chamber 10, and transfers the transfer arm 500 holding the cover ring 113 from the transfer port to the annular region 111b of the main body section 111 (covering support surface 111b2). ) A covering ring 113 is placed on top of the cover ring 113.

In step S204, the cover ring 113 is received from the transport arm 500 by the lift pin 16 and placed on the ring support surface of the electrostatic chuck 1111.

FIG. 19 is an example of a partially enlarged sectional view of the substrate support portion 11 in a state in which the cover ring 113 is received by the lift pins 16 in step S204. The control unit 2 controls a lifting mechanism (not shown) to raise the lift pin 16. Here, the lift pin 16 has an upper small diameter portion 161 and a lower large diameter portion 162. The small diameter portion 161 is inserted through the through hole 113d of the cover ring 113, and the upper end of the large diameter portion 162 of the lift pin 16 comes into contact with the lower surface of the cover ring 113. The cover ring 113 is lifted from the transport arm 500 by the lift pin 16, and the cover ring 113 is supported by the lift pin 16. Then, the control unit 2 controls the transfer device to retreat the transfer arm 500 from the transfer port, and closes the gate valve.

FIG. 20 is an example of a partially enlarged cross-sectional view of the substrate support portion 11 in a state where the lift pins 16 are being lowered in step S204. The control unit 2 controls a lifting mechanism (not shown) to lower the lift pin 16. Here, as the cover ring 113 descends, the bottom surface 112a comes into contact with the upper surface of the protrusion 222, and the protrusion 222 is deformed by the weight of the cover ring 113. Then, as the protrusion 222 further deforms, the lower surface of the protrusion 222 comes into contact with the edge of the substrate support surface and the covering surface 111c2. As a result, the protrusion 222 forms an inclination. The horizontal position of the descending cover ring 113 is guided by the inclination of the protrusion 222. For example, if the center position of the cover ring 113 supported by the lift pin 16 is shifted from the center position of the main body part 111, the cover ring 113 is guided by the inclination of the protrusion part 222, and the cover ring 113 is horizontal. The position of the direction is adjusted. This prevents the cover ring 113 from riding on the substrate support surface and becoming unable to be installed on the ring support surface.

FIG. 21 is an example of a partially enlarged cross-sectional view of the substrate support portion 11 in a state where the cover ring 113 is installed on the electrostatic chuck 1111 in step S204. The control unit 2 controls a lifting mechanism (not shown) to further lower the lift pin 16. Thereby, the cover ring 113 is supported in contact with the cover ring support surface 111b2. Further, the length of the protrusion 222 is set to reach the gap between the inner circumferential surface 113c of the cover ring 113 and the cover ring facing surface 111c2. As a result, the protruding portion 222 is placed between the covering ring facing surface 111c2 and the inner circumferential surface 113c. Here, since a plurality of centering sheets 220 are provided in the circumferential direction, the gap between the covering facing surface 111c2 and the inner circumferential surface 113c is managed by the thickness of the protruding portion 222 at a plurality of positions in the circumferential direction. be done. Thereby, the cover ring 113 is centered and installed with respect to the main body part 111.

Further, the length of the protruding portion 222 is formed to a length that does not reach the covering ring support surface 111b2. This prevents the protrusion 222 from being pinched between the bottom surface 112a of the cover ring 113 and the cover ring support surface 111b2.

Note that the cover ring 113 is fixed to the main body part 111 by its own weight.

In step S205, the alignment jig 200 is supported by the lift pins 15.

First, in step S202, if the alignment jig 200 is fixed to the main body part 111, the alignment jig 200 is released from fixation.

Next, the control unit 2 controls a lifting mechanism (not shown) to raise the lift pin 15. As a result, the upper ends of the lift pins 15 come into contact with the lower surface of the alignment jig 200, the alignment jig 200 is lifted from the substrate support surface by the lift pins 15, and the alignment jig 200 is separated from the substrate support surface. Furthermore, the protrusion 222 that was disposed in the gap between the covering surface 111c2 and the inner circumferential surface 113c is pulled out. At this time, the cover ring 113 is fixed to the main body part 111 by its own weight, and the position of the cover ring 113 is prevented from shifting when the protrusion part 222 is pulled out from between the cover ring facing surface 111c2 and the inner peripheral surface 113c. do. Then, due to the restoring force of the centering sheet 220, the protrusion 222 returns to a substantially horizontal position.

In step S206, the alignment jig 200 is carried out from the plasma processing chamber 10.

FIG. 22 is an example of a partially enlarged cross-sectional view of the substrate support section 11 in a state in which the alignment jig 200 is transported into the plasma processing chamber 10 in step S206. The control section 2 opens the gate valve, controls the transfer device, transfers the transfer arm 500 from the transfer port to the plasma processing chamber 10, and places it between the main body section 111 and the alignment jig 200. Next, the control unit 2 controls a lifting mechanism (not shown) to lower the lift pin 15. As a result, the positioning jig 200 supported by the lift pins 15 is held by the transport arm 500. Then, the control unit 2 controls the transport device to retreat the transport arm 500 holding the positioning jig 200 from the transport port, and closes the gate valve.

FIG. 23 is an example of a partially enlarged sectional view of the substrate support section 11 in a state where the process of step S206 has been completed. As described above, the cover ring 113 can be automatically replaced via the transfer port without opening the top of the plasma processing chamber 10. Further, the cover ring 113 is installed on the ring support surface without riding on the substrate support surface. Furthermore, the gap between the covering ring facing surface 111c2 and the inner circumferential surface 113c is controlled by the thickness of the protruding portion 222 at a plurality of positions in the circumferential direction, so that the covering ring 113 is not centered with respect to the main body portion 111. It will be installed. Furthermore, since the centering of the covering ring 113 can be controlled by the thickness of the centering sheet 220, it is possible to center the covering ring 113 with higher precision than the transport accuracy of the covering ring 113 by the transport arm 500 of the transport device.

Although the alignment jig 200 and the ring member installation process using the alignment jig 200 have been described above, the present invention is not limited thereto.

Although the edge ring 112 and the cover ring 113 have been described as examples of ring members installed in alignment, the ring members are not limited thereto. The present invention may also be applied to the installation of other ring members in the plasma processing chamber 10.

Furthermore, although it has been described that a plurality of centering sheets 220 are provided along the outer periphery of the base plate 210, the centering sheet 220 is not limited to this. The centering sheet 220 may be formed in a ring shape around the entire circumference of the base plate 210.

The electrostatic electrode 1111b may be a monopolar electrostatic chuck or a bipolar electrostatic chuck. In the case of a single pole, the alignment jig 200 is attracted and held on the main body 111 by the potential difference between the plasma and the electrostatic electrode 1111b. In the case of bipolar, the electrostatic electrode 1111b is divided into an inner circumferential electrode and an outer circumferential electrode (not shown), and the positioning jig 200 is moved to the main body part 111 by the potential difference between the inner circumferential electrode and the outer circumferential electrode. Hold it by adsorption. Similarly, the electrostatic electrode 1111c may be a monopolar electrostatic chuck or a bipolar electrostatic chuck.

The length of the protrusion 222 is determined by the length of the protrusion 222 when the ring member (edge ring 112, cover ring 113) is installed on the ring support surface (edge ring support surface 111b1, cover ring support surface 111b2) and the protrusion 222 is bent. In the above description, it is assumed that the length does not reach (do not come into contact with) the ring support surface of the ring member, but the length is not limited to this.

FIG. 23 is another example of a partially enlarged cross-sectional view of the substrate support part 11. The edge ring 112 may have an annular counterbore (notch) 112d formed on the inner peripheral side of the bottom surface 112a. As a result, even if the protrusion 222 is formed in a length that reaches the edge ring support surface 111b1, when the edge ring 112 is placed on the edge ring support surface 111b1, the tip of the protrusion 222 is counter-sunk. 112d and the edge ring support surface 111b1. Note that the side surface 12d1 of the counterbore 112d is formed at a position where the tip of the protrusion 222 cannot reach (do not come into contact with). This prevents the protrusion 222 from being pinched between the bottom surface 112a of the edge ring 112 and the edge ring support surface 111b1.

Similarly, the cover ring 113 may have an annular counterbore (notch) formed on the inner peripheral side of the bottom surface 113a. As a result, even if the protrusion 222 is formed in a length that reaches the cover ring support surface 111b2, when the cover ring 113 is placed on the cover ring support surface 111b2, the tip of the protrusion 222 is counter-sunk. and the covering support surface 111b2. Note that the side surface of the counterbore is formed at a position where the tip of the protruding portion 222 cannot reach (do not come into contact with). This prevents the protrusion 222 from being pinched between the bottom surface 113a of the cover ring 113 and the cover ring support surface 111b2.

[Substrate processing system]
With reference to FIG. 25, the substrate processing system PS according to the embodiment will be described. FIG. 25 is a diagram showing an example of the substrate processing system PS according to the embodiment. As shown in FIG. 25, the substrate processing system PS is a system that can perform various treatments such as plasma processing on the substrate W. The substrate W may be, for example, a semiconductor wafer.

The substrate processing system PS includes a vacuum transfer module TM, a plurality of processing modules PM1 to PM7, a ring storage module RSM, a plurality of load lock modules LL1 to LL3, an atmospheric transfer module LM, and load ports LP1 to LP4. It has an aligner AN and a control unit CU. The vacuum transfer module TM is also referred to as a transfer module. The processing modules PM1 to PM7 are also referred to as process modules. The ring storage module RSM is also referred to as a ring stocker module. The atmospheric transport module LM is also referred to as a loader module.

The vacuum transfer module TM has a rectangular shape in plan view. Processing modules PM1 to PM7, load lock modules LL1 to LL3, and ring storage module RSM are connected to vacuum transfer module TM. The vacuum transfer module TM has a vacuum transfer chamber. The inside of the vacuum transfer chamber is maintained in a vacuum atmosphere. A transfer robot TR1 is provided in the vacuum transfer chamber (inside the vacuum transfer module TM).

The transport robot TR1 is configured to be able to rotate, extend and contract, and move up and down. The transport robot TR1 has an upper fork FK1 and a lower fork FK2. The upper fork FK1 and the lower fork FK2 of the transfer robot TR1 are configured to be able to hold each of the substrate W, the annular member (edge ring 112, cover ring 113), and positioning jig 100. The transfer robot TR1 transfers the substrate W, the annular member (edge ring 112, cover ring 113), and positioning jig 100 between the processing modules PM1 to PM7, the load lock modules LL1 to LL3, and the ring storage module RSM. Hold and transport.

The upper fork FK1 is provided with a position detection sensor S1. The lower fork FK2 is provided with a position detection sensor S2. The position detection sensors S1 and S2 detect the positions of the substrate W, the annular member (edge ring 112, cover ring 113), and alignment jig 100 placed on the processing modules PM1 to PM7. The position detection sensors S1 and S2 may be, for example, optical displacement sensors, cameras, or the like. The position detection sensors S1 and S2 detect the edges of the base plate 210 at a plurality of points, for example, and calculate the center position of the base plate 210. Note that the centering sheet 220 is translucent, and the position detection sensors S1 and S2 can transmit the centering sheet 220 and detect the edge of the base plate 210.

The vacuum transfer module TM may be provided with position detection sensors S11 and S12. The position detection sensors S11 and S12 are provided on the transport path of the substrate W, the annular member (edge ring 112, cover ring 113), and positioning jig 100 that are transported from the vacuum transport module TM to the processing module PM1. The position detection sensors S11 and S12 are used when transporting either the substrate W, the annular member (edge ring 112, cover ring 113), or positioning jig 100 from the vacuum transfer module TM to the processing module PM1, and from the processing module PM1. It is used when transporting either the substrate W, the annular member (edge ring 112, cover ring 113), or positioning jig 100 to the vacuum transport module TM. The position detection sensors S11 and S12 are provided, for example, near a gate valve (not shown) that partitions the vacuum transfer module TM and the processing module PM1. The position detection sensors S11 and S12 are arranged such that, for example, the distance between them is smaller than the outer diameter of the substrate W and smaller than the inner diameter of the edge ring 112. The position detection sensors S11 and S12 are optical sensors, and detect the edges of the base plate 210 at a plurality of points, for example, and calculate the center position of the base plate 210. Note that the centering sheet 220 is translucent, and the position detection sensors S11 and S12 can transmit through the centering sheet 220 and detect the edge of the base plate 210. As a result, if the center position of the base plate 210 detected by the position detection sensors S11 and S12 deviates from the reference position of the fork FK1 (or FK2) that holds the substrate W, the control unit CU controls the alignment jig 100. The transport robot TR1 is controlled so that its center coincides with the center of the substrate support section 11. The vacuum transfer module TM may be provided with position detection sensors S21, S22, S31, S32, S41, S42, S51, S52, S61, S62, S71, and S72 similarly to the position detection sensors S11 and S12.

The processing modules PM1 to PM7 are connected to the vacuum transfer module TM. Processing modules PM1 to PM7 have vacuum processing chambers. A substrate support section 11 (see FIG. 1) is provided inside the vacuum processing chamber. After the substrate W is placed on the substrate support 11, the processing modules PM1 to PM7 reduce the pressure inside, introduce a processing gas, apply RF power to generate plasma, and apply the plasma to the substrate W. Perform plasma treatment. The vacuum transfer module TM and the processing modules PM1 to PM7 are separated by a gate valve (not shown) that can be opened and closed.

The ring storage module RSM is an example of a device that stores annular members (edge ring 112, cover ring 113) having a larger diameter than the substrate W, and is connected to the vacuum transfer module TM. The ring storage module RSM stores, for example, an edge ring 112 and a cover ring 113 that constitute a ring assembly 114. The ring storage module RSM may be configured to store only the edge ring 112. The ring storage module RSM may be configured to store only the cover ring 113. The edge ring 112 and the cover ring 113 are transported between the processing modules PM1 to PM7 and the ring storage module RSM by the transport robot TR1. The vacuum transfer module TM and the ring storage module RSM are separated by a gate valve (not shown) that can be opened and closed.

Furthermore, the ring storage module RSM accommodates an alignment jig 200 having a larger diameter than the substrate W. The positioning jig 200 is transported between the processing modules PM1 to PM7 and the ring storage module RSM by the transport robot TR1. In this way, the alignment jig 200 having a larger diameter than the substrate W can be accommodated in the ring storage module RSM.

The load lock modules LL1 to LL3 are provided between the vacuum transfer module TM and the atmospheric transfer module LM. The load lock modules LL1 to LL3 are connected to the vacuum transfer module TM and the atmospheric transfer module LM. Each of the load lock modules LL1 to LL3 has a variable internal pressure chamber that can be switched between vacuum and atmospheric pressure. The variable internal pressure chamber is provided with a stage (not shown) on which the substrate W can be placed. When transporting the substrate W from the atmospheric transport module LM to the vacuum transport module TM, the load lock modules LL1 to LL3 maintain the internal pressure variable chamber at atmospheric pressure, receive the substrate W from the atmospheric transport module LM, and then receive the substrate W from the internal pressure variable chamber. is depressurized and the substrate W is transferred to the vacuum transfer module TM. When transporting the substrate W from the vacuum transport module TM to the atmospheric transport module LM, the load lock modules LL1 to LL3 maintain the internal pressure variable chamber in a vacuum, receive the substrate W from the vacuum transport module TM, and then transfer the internal pressure variable chamber to the atmospheric transport module LM. The pressure is increased to atmospheric pressure and the substrate W is transferred to the atmospheric transport module LM. The load lock modules LL1 to LL3 and the vacuum transfer module TM are separated by a gate valve (not shown) that can be opened and closed. The load lock modules LL1 to LL3 and the atmospheric transport module LM are separated by a gate valve (not shown) that can be opened and closed.

The atmospheric transfer module LM is provided opposite the vacuum transfer module TM. The atmospheric transport module LM may be, for example, an EFEM (Equipment Front End Module). The atmospheric transport module LM has a rectangular shape in plan view. The atmospheric transport module LM has an atmospheric transport chamber. The interior of the atmospheric transfer chamber is maintained at atmospheric pressure. A transport robot TR2 is provided inside the atmospheric transport chamber. The transport robot TR2 is configured to be able to rotate, extend and contract, and move up and down. Like the transport robot TR1, the transport robot TR2 also has two forks (an upper fork and a lower fork) capable of holding and transporting the substrate W. The transport robot TR2 holds and transports the substrate W between the load ports LP1 to LP4, the aligner AN, and the load lock modules LL1 to LL3. The atmospheric transport module LM may include an FFU (Fan Filter Unit).

The load ports LP1 to LP4 are connected to the atmospheric transport module LM. A plurality of substrate storage containers CS1 are placed in the load ports LP1 to LP4. The substrate storage container CS1 may be, for example, a FOUP (Front-Opening Unified Pod) that stores a plurality of (for example, 25) substrates W.

The aligner AN is connected to the atmospheric transport module LM. The aligner AN is configured to adjust the position of the substrate W. The aligner AN may be provided inside the atmospheric transfer chamber.

The control unit CU controls each part of the substrate processing system PS. The control unit CU controls, for example, the operation of the transfer robot TR1 provided in the vacuum transfer module TM, the operation of the transfer robot TR2 provided in the atmospheric transfer module LM, and the opening and closing of a gate valve. The control unit CU may be, for example, a computer. The control unit CU includes a CPU (Central Processing Unit) that is a processor, a RAM (Random Access Memory), a ROM (Read Only Memory), an auxiliary storage device, and the like. The CPU operates based on a program stored in the ROM or auxiliary storage device, and controls each part of the substrate processing system PS.

The embodiments disclosed above include, for example, the following aspects.
(Additional note 1)
A jig used when installing a ring member on a ring support surface of an installed member,
base plate and
a sheet member having a fixing portion fixed to the base plate and a protruding portion protruding from a side surface of the base plate;
jig.
(Additional note 2)
The base plate includes three or more of the sheet members,
The jig described in Appendix 1.
(Additional note 3)
The protruding portion is
When the ring member is installed on the ring support surface, the ring member reaches the gap between the alignment target surface of the ring member and the opposing surface of the installed member that faces the alignment target surface, and is attached to the ring support surface. unreachable, has length,
The jig described in Appendix 1 or 2.
(Additional note 4)
The sheet member is made of polyimide.
The jig according to any one of Supplementary Notes 1 to 3.
(Appendix 5)
The base plate is made of silicon.
The jig according to any one of Supplementary Notes 1 to 4.
(Appendix 6)
The base plate has a groove in which the fixing part is arranged.
The jig according to any one of Supplementary Notes 1 to 5.
(Appendix 7)
The base plate is
a first surface that comes into contact with and is supported by the substrate support surface when the base plate is placed on the substrate support surface of the installed member;
a second surface that is an opposite surface to the first surface;
The groove portion is formed on the second surface.
The jig described in Appendix 6.
(Appendix 8)
The fixing part is fixed to the groove part by adhesive.
The jig described in Appendix 6 or Appendix 7.
(Appendix 9)
installing a jig including a base plate and a sheet member having a fixing part fixed to the base plate and a protruding part protruding from a side surface of the base plate on a substrate supporting surface of the installed member;
The sheet member is arranged in a gap between the positioning target surface of the ring member and the opposing surface of the installed member opposite to the positioning target surface by deforming the protruding part, a step of installing it on a supporting surface;
separating the jig from the substrate support surface and pulling out the sheet member from the gap between the alignment target surface and the opposing surface;
Alignment method.
(Appendix 10)
The installed member is a main body part of a substrate support part,
The step of installing the jig on the substrate support surface includes:
a step of raising a first lift pin that is movable up and down from the substrate support surface;
supporting the jig with the first lift pin;
lowering the first lift pin and placing the jig on the substrate support surface,
The step of installing the ring member on the ring support surface includes:
a step of raising a second lift pin that is movable up and down from the ring support surface;
supporting the ring member with the second lift pin;
lowering the second lift pin to place the ring member on the ring support surface,
The step of separating the jig from the substrate support surface includes:
a step of raising the first lift pin to separate the jig from the substrate support surface;
The alignment method described in Appendix 9.
(Appendix 11)
the ring member is an edge ring;
The positioning method described in Appendix 9 or Appendix 10.
(Appendix 12)
The ring member is a cover ring,
The positioning method described in Appendix 9 or Appendix 10.
(Appendix 13)
After the step of installing the ring member on the ring support surface and before the step of separating the jig from the substrate support surface, the method further includes a step of fixing the ring member.
The alignment method according to any one of Supplementary notes 9 to 12.
(Appendix 14)
The step of fixing the ring member includes:
vacuum adsorbing the ring member;
The positioning method described in Appendix 13.
(Additional note 15)
The step of fixing the ring member includes:
electrostatically adsorbing the ring member;
The positioning method described in Appendix 13.

Note that the present invention is not limited to the configurations shown in the above embodiments, such as combinations with other elements, and the like. These points can be modified without departing from the spirit of the present invention, and can be appropriately determined depending on the application thereof.

Additionally, this application claims priority based on Japanese patent application No. 2022-131235 filed on August 19, 2022, and the entire contents of these Japanese patent applications are incorporated by reference into this application.

1 Plasma processing apparatus 2 Control section 11 Substrate support section 15 Lift pin (first lift pin)
16 Lift pin (second lift pin)
111 Main body portion 111a Central region 111b Annular region 111b1 Edge ring support surface 111b2 Cover ring support surface 111c1 Edge ring opposing surface (opposing surface)
111c2 Covering opposing surface (opposing surface)
112 Edge ring (ring member)
112a Bottom surface 112c Inner peripheral surface (positioning target surface)
113 Cover ring (ring member)
113a Bottom surface 113b Edge ring support surface 113c Inner peripheral surface (alignment target surface)
114 Ring assembly 1110 Base 1110a Channel 1111 Electrostatic chuck 1111a Ceramic member

1111b Electrostatic electrode

1111c Electrostatic electrode 200 Positioning jig (jig)
210 Base plate 211 Groove portion 211a Side wall 211b Inclined surface 220 Centering sheet 221 Fixed portion 221a Side wall 222 Projection portion

Claims

A jig used when installing a ring member on a ring support surface of an installed member,
base plate and
a sheet member having a fixing portion fixed to the base plate and a protruding portion protruding from a side surface of the base plate;
jig.
The base plate includes three or more of the sheet members,
The jig according to claim 1.
The protruding portion is
When the ring member is installed on the ring support surface, the ring member reaches the gap between the alignment target surface of the ring member and the opposing surface of the installed member that faces the alignment target surface, and is attached to the ring support surface. unreachable, has length,
The jig according to claim 2.
The sheet member is made of polyimide.
The jig according to claim 3.
The base plate is made of silicon.
The jig according to claim 4.
The base plate has a groove in which the fixing part is arranged.
The jig according to claim 1.
The base plate is
a first surface that comes into contact with and is supported by the substrate support surface when the base plate is placed on the substrate support surface of the installed member;
a second surface that is an opposite surface to the first surface;
The groove portion is formed on the second surface.
The jig according to claim 6.
The fixing part is fixed to the groove part by adhesive.
The jig according to claim 6.
installing a jig including a base plate, a sheet member having a fixing part fixed to the base plate and a protruding part protruding from a side surface of the base plate on a substrate supporting surface of the installed member;
The sheet member is arranged in a gap between the positioning target surface of the ring member and the opposing surface of the installed member opposite to the positioning target surface by deforming the protruding part, and the ring member is moved into the ring of the installed member. a step of installing it on a supporting surface;
separating the jig from the substrate support surface and pulling out the sheet member from the gap between the alignment target surface and the opposing surface;
Alignment method.
The installed member is a main body part of a substrate support part,
The step of installing the jig on the substrate support surface includes:
a step of raising a first lift pin that is movable up and down from the substrate support surface;
supporting the jig with the first lift pin;
lowering the first lift pin and placing the jig on the substrate support surface,
The step of installing the ring member on the ring support surface includes:
a step of raising a second lift pin that is movable up and down from the ring support surface;
supporting the ring member with the second lift pin;
lowering the second lift pin to place the ring member on the ring support surface,
The step of separating the jig from the substrate support surface includes:
a step of raising the first lift pin to separate the jig from the substrate support surface;
The alignment method according to claim 9.
the ring member is an edge ring;
The alignment method according to claim 10.
The ring member is a cover ring,
The alignment method according to claim 10.
After the step of installing the ring member on the ring support surface and before the step of separating the jig from the substrate support surface, the method further includes a step of fixing the ring member.
The alignment method according to claim 11.
The step of fixing the ring member includes:
vacuum adsorbing the ring member;
The alignment method according to claim 13.
The step of fixing the ring member includes:
electrostatically adsorbing the ring member;
The alignment method according to claim 13.