WO2024031978A1 - 测试夹具及测试设备 - Google Patents

测试夹具及测试设备 Download PDF

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Publication number
WO2024031978A1
WO2024031978A1 PCT/CN2023/080501 CN2023080501W WO2024031978A1 WO 2024031978 A1 WO2024031978 A1 WO 2024031978A1 CN 2023080501 W CN2023080501 W CN 2023080501W WO 2024031978 A1 WO2024031978 A1 WO 2024031978A1
Authority
WO
WIPO (PCT)
Prior art keywords
plate
housing
test
product
heat dissipation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2023/080501
Other languages
English (en)
French (fr)
Inventor
陈明亮
吴波
李欣
郝培正
王华荣
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ZTE Corp
Original Assignee
ZTE Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ZTE Corp filed Critical ZTE Corp
Publication of WO2024031978A1 publication Critical patent/WO2024031978A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L43/00—Arrangements for monitoring or testing data switching networks
    • H04L43/50—Testing arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the present disclosure relates to the technical field of product testing, and in particular, to a testing fixture and testing equipment.
  • communication products need to be tested to detect the signal reception performance, signal transmission performance and radiation level of the communication products, and ensure that the communication products shipped from the factory comply with various communication standards.
  • the test fixture is a device that connects the test system and the product under test. It is also a necessary device to implement testing. It plays an irreplaceable role in the test system and directly affects the accuracy, comprehensiveness, and safety of the test.
  • the product under test has high requirements in terms of heat dissipation during power-on testing.
  • the test fixture has technical problems with insufficient heat dissipation capabilities, which cannot meet the needs of repeated use of the product under test.
  • the main purpose of the present disclosure is to provide a test fixture and test equipment to solve the technical problem of insufficient heat dissipation capability of the test fixture.
  • the present disclosure provides a test fixture, including: a fixture assembly, including a cover plate, a needle plate and a carrier plate.
  • the carrier plate is used to carry the product to be tested, and the carrier plate is provided with through holes and through grooves; the cover plate It is used to cover the product to be tested carried by the carrier plate.
  • the needle plate is located below the carrier plate, and the needle plate is equipped with probes; the driving assembly is connected to the needle plate, and the driving assembly is used to drive the needle plate to move up and down.
  • the probe is driven through the through hole to contact the test point of the product under test to collect the test signal;
  • the heat dissipation component is connected to the pin board.
  • the heat dissipation component is driven through the through slot and the heating element of the product under test. contact to dissipate heat from the heating element.
  • the present disclosure also provides a test equipment, including a test device and the above-mentioned test fixture.
  • the probe is used to contact the test point of the product under test to collect the test signal and feed it back to the test device.
  • the test device is used to accept the test. Signals go hand in hand Perform data analysis.
  • Figure 1 is a schematic structural diagram of the first shell of the test fixture provided by the present disclosure rotated 70° counterclockwise.
  • Figure 2 is a partial enlarged schematic diagram of position A in Figure 1.
  • Figure 3 is a schematic structural diagram of the second housing of the test fixture provided by the present disclosure rotated 45° counterclockwise.
  • Figure 4 is a schematic structural diagram of the test fixture provided by the present disclosure from a first perspective.
  • Figure 5 is a schematic structural diagram of the test fixture provided by the present disclosure from a second perspective.
  • Figure 6 is a partially enlarged schematic diagram of position B in Figure 5.
  • Figure 7 is a schematic cross-sectional view of the driving assembly provided by the present disclosure when it does not drive the needle plate to move up.
  • FIG. 8 is a first cross-sectional schematic view of the product under test on the carrier board provided by the present disclosure when it is attached to the cover plate and the needle plate is attached to the carrier board.
  • 9 is a second sectional schematic diagram of the product under test on the carrier board provided by the present disclosure when it is attached to the cover plate and the needle plate is attached to the carrier board.
  • Figure 10 is a partial enlarged schematic view of C in Figure 9.
  • FIG. 11 is a schematic structural diagram of the probe provided on the pin board when inserted into the through hole on the carrier board.
  • Test fixture 10. Fixture assembly; 11. Cover plate; 111. First escape groove; 12. Needle plate; 121. Probe; 122. Elastic structure; 1221. Guide column; 1222. First elasticity 1223. Blocking part; 13. Carrier plate; 131. Through hole; 132. Through groove; 133. Second avoidance groove; 14. First shielding cavity; 15. Second shielding cavity; 16. Top plate; 20. Driving component; 21. Driving part; 22. Push plate; 30. Heat dissipation component; 31. Installation part; 32. Thermal conductive part; 33. Heat dissipation part; 331. First end; 332. Second end; 333. Heat sink; 34. First cooling fan; 40. Second cooling fan; 50. Second elastic member; 60. First housing; 70.
  • Second housing 71. Bottom plate; 80. First locking structure; 81. A buckle structure; 811, hook; 812, handle; 82, second buckle structure; 821, card holder; 822, cancel pin; 90, positioning structure; 91, positioning block; 911, positioning gap; 92, positioning column; 110. Base; 1101. Button; 120. First gas spring; 130. Second gas spring; 140. Handle; 200. Product to be tested; 201. Heating element.
  • the present disclosure provides a test fixture 100, which includes a fixture assembly 10, a driving assembly 20, and a heat dissipation assembly 30.
  • the fixture assembly 10 includes a cover plate 11, a pin plate 12, and a carrier plate 13.
  • the carrier plate 13 It is used to carry the product to be tested 200, and the carrier plate 13 is provided with through holes 131 and through grooves 132.
  • the cover plate 11 is used to cover the product to be tested 200 carried by the carrier plate 13.
  • the pin plate 12 is located below the carrier plate 13.
  • the needle plate 12 is provided with a probe 121
  • the driving assembly 20 is connected to the needle plate 12.
  • the driving assembly 20 is used to drive the needle plate 12 to move up and down.
  • the needle plate 12 When the needle plate 12 moves upward, it drives the probe 121 to pass through the through hole 131 and connect with the object to be measured. The test points of the product 200 are in contact to collect test signals.
  • the heat dissipation component 30 is connected to the pin plate 12. When the pin plate 12 moves upward, the heat dissipation component 30 is driven through the through groove 132 to contact the heating element 201 of the product 200 under test to control the heat. Component 201 dissipates heat.
  • the heat dissipation component 30 is connected to the pin plate 12 and can move synchronously with the pin plate 12.
  • the drive component 20 can drive the pin plate 12 to move upward to achieve the collection of test signals, and can also drive the floating designed heat dissipation component.
  • 30 moves through the through groove 132 and contacts the heating element 201 of the product under test 200 to dissipate heat from the heating element 201 and improve the heat dissipation capacity of the test fixture 100, thereby increasing the service life of the product under test 200 and thereby satisfying the needs of the product under test. 200 for repeated use.
  • the product to be tested 200 is a PCBA (Printed Circuit Board Assembly), hereinafter referred to as a single board.
  • the heating element 201 is a high-power consumption chip located on the single board. Through a floating design The heat dissipation component 30 can be directly attached to the high-power consumption chip to dissipate heat, and the heat dissipation effect is good.
  • the heat dissipation component 30 includes a mounting part 31 , a heat conducting part 32 and a heat dissipating part 33 .
  • the mounting part 31 is mounted on the bottom of the needle plate 12 , and the heat conducting part 32 is provided on the mounting surface.
  • the heat dissipation part 33 is provided below the mounting part 31.
  • the installation part 31 is used to install the heat dissipation component 30, the heat conduction part 32 is used to contact the heating element 201 to achieve heat transfer during the test process, and dissipate the heat through the heat dissipation part 33 to meet the core's large power consumption. Chip cooling requirements.
  • an elastic structure 122 is provided at the bottom of the needle plate 12 .
  • the mounting part 31 is connected to the elastic structure 122 .
  • the elastic structure 122 is driven to compress.
  • the thermal conductive part 32 is brought into buffer contact with the heating element 201 .
  • the elastic structure 122 is provided so that when the heat dissipation structure and the heating element 201 are docked, the heat conducting portion 32 can bufferly contact the heating element 201 to prevent damage to the heating element 201 from the impact force and ensure that the heat conducting portion 32
  • the surface is fully attached to the heating element 201 to achieve heat transfer during the testing process and meet the heat dissipation needs of the heating chip.
  • the elastic structure 122 includes a guide post 1221 and a first elastic member 1222.
  • the guide post 1221 is connected to the bottom of the needle plate 12 and extends downward in the vertical direction.
  • the guide post 1221 is provided with The blocking part 1223, the mounting part 31 is sleeved on the guide post 1221 and is movably provided between the blocking part 1223 and the bottom surface of the needle plate 12.
  • the first elastic member 1222 is sleeved on the guide column 1221, and one end of the first elastic member 1222 is in contact with In the mounting part 31, the other end of the first elastic member 1222 is in contact with the blocking part 1223.
  • the mounting part 31 drives the first elastic part 1222 to compress, so that the heat conducting part 32 and the heating element 201 are buffered. touch.
  • the mounting part 31 is movably mounted on the guide post 1221 connected to the bottom of the needle plate 12.
  • One end of the first elastic member 1222 acts on the bottom surface of the mounting part 31, and the other end acts on the blocking part 1223 at the lower end of the guide post 1221.
  • the first elastic member 1222 can be a spring
  • the guide post 1221 can be a screw or a rivet
  • the head of the screw or rivet forms the blocking portion 1223 .
  • the heat dissipation part 33 includes a first end 331 connected to the mounting part 31 and a second end 332 opposite to the first end 331 .
  • the second end 332 is provided with a plurality of heat dissipation fins 333 .
  • the heat dissipation effect is improved through the arrangement of multiple heat sinks 333 on the second end 332 .
  • the heat dissipation assembly 30 further includes a first heat dissipation fan 34 .
  • the fan 34 is provided below the heat dissipation part 33 .
  • the first cooling fan 34 is provided below the second end 332 , and the heat dissipation effect of the heat dissipation component 30 can be better improved through the arrangement of the first cooling fan 34 .
  • a heat dissipation space is formed below the heat dissipation component 30 , and the test fixture 100 further includes a second heat dissipation fan 40 .
  • the second heat dissipation fan 40 is connected with the heat dissipation space to dissipate heat. The hot air in the space is blown to the outside of the test fixture 100 to meet the heat dissipation requirements.
  • needle plate 12 is removably mounted to drive assembly 20 .
  • the matching pin board 12 can be replaced according to different single boards. Since communication products are frequently updated, series of frequency band PCBAs are similar in structure and testing methods, so By replacing the pin plate 12, different single boards can be tested without replacing the entire test fixture 100, thereby shortening the testing time of batch products and reducing costs.
  • the heat dissipation assembly 30 is detachably mounted on the needle plate 12 .
  • the heat dissipation assembly 30 is detachably arranged, which can facilitate installation, disassembly and later maintenance. Moreover, when a different needle plate 12 is replaced, the heat dissipation assembly 30 can be disassembled and installed on the replaced needle plate 12 to achieve repeated use and save costs.
  • the driving assembly 20 includes a driving member 21 and a push plate 22.
  • the driving member 21 is connected to the push plate 22, the push plate 22 is connected to the needle plate 12, and the driving member 21 is connected to the push plate 22. 21 is used to drive the push plate 22 to move up and down to realize the up and down movement of the needle plate 12.
  • the driving member 21 can be a cylinder. After the cylinder is activated, the push plate 22 is pushed upward to drive the needle plate 12 to move upward, thereby driving the probe 121 on the needle plate 12 to pass through the through hole 131 and the product to be tested 200 contact the test points to collect test signals.
  • a second elastic member 50 is provided between the needle plate 12 and the carrier plate 13.
  • the second elastic member 50 drives the carrier plate 13 to move upward. , so that the product to be tested 200 on the carrier plate 13 and the cover plate 11 are buffered.
  • the driving assembly 20 drives the needle plate 12 to move upward, it drives the carrier plate 13 to rise in a floating and buffer manner, so that the single board on the carrier plate 13 and the cover plate 11 are buffered and docked, and at the same time, the needle plate 12 and the carrier plate are driven to move upward.
  • the second elastic member 50 between 13 is elastically compressed so that the needle plate 12 and the carrier plate 13 fit together in a buffering manner, effectively reducing the impact stress when the test fixture 100 is closed, and at the same time, the probe 121 and the product under test 200 are The test points buffer contact to prevent impact damage to the test points.
  • the cover plate 11 is provided with a first escape groove 111 for avoiding the functional devices on the first side of the product to be tested 200 .
  • the cover plate 11 covers the product to be tested 200
  • the product under test 200 is covered in the first escape groove 111 to form the first shielding cavity 14 required for testing.
  • the first side is the side opposite to the cover plate 11 when the product under test 200 is placed on the carrier plate 13 .
  • the first side is the TOP surface of the single board, and the first shielding cavity 14 is provided to meet the test shielding requirements of the TOP surface of the single board.
  • the carrier 13 is provided with a second avoidance groove 133 for avoiding functional devices on the second side of the product to be tested 200 , and the product to be tested 200 is placed on the carrier.
  • the plate 13 is covered with the second escape groove 133
  • the second side is the side opposite to the carrier board 13 when the product 200 under test is placed on the carrier board 13 .
  • the functional device on the second side includes the above-mentioned heating element 201.
  • the second side is the BOT surface of the single board.
  • the second shielding cavity 15 is provided to meet the test shielding requirements of the BOT surface of the single board. .
  • the clamp assembly 10 further includes a top plate 16 , which is connected to the side of the cover plate 11 facing away from the carrier board 13 , and a power probe and a test probe are provided on the top plate 16 When the cover plate 11 is closed on the carrier board 13, the probes on the top plate 16 pass through the cover plate 11 and are automatically connected to the test points on the TOP surface of the single board to achieve the test purpose.
  • the test fixture 100 also includes a first housing 60, a second housing 70 and a first locking structure 80, and the cover 11 is installed on the first housing 60,
  • the second housing 70 is rotatably connected to the first housing 60.
  • the carrier plate 13 is installed on the second housing 70.
  • the first housing 60 rotates to cover the second housing 70, so that the cover plate 11 covers the carrier.
  • the first locking structure 80 is installed on the first housing 60 and/or the second housing 70.
  • the first locking structure 80 is used for the first housing 60 to cover the second housing 60.
  • the housing 70 locks the first housing 60 to limit the rotation of the first housing 60 .
  • a hinge or other hinge structure may be provided between the first housing 60 and the second housing 70 to achieve a rotational connection between the first housing 60 and the second housing 70 .
  • the second housing 70 and the first locking structure 80 are arranged to facilitate opening and closing of the test fixture 100 .
  • the second cooling fan 40 may be installed on the second housing 70 .
  • the heat dissipation space is located in the second housing 70, and two groups of second cooling fans 40 are provided. Each group includes one or more second cooling fans 40, and one group of the second cooling fans 40 is provided in the second housing 70. On the left side, another set of second cooling fans 40 is provided on the right side of the second housing 70. The arrangement of the second cooling fans 40 on both sides can more quickly blow the hot air in the cooling space to the outside of the test fixture 100. Meet cooling needs.
  • a bottom plate 71 is provided at the bottom of the second housing 70 , and the driving assembly 20 can be installed on the bottom plate 71 of the second housing 70 .
  • the test fixture 100 may be provided with one or more driving assemblies 20 , and the arrangement of the plurality of driving assemblies 20 can provide sufficient driving force to drive the needle plate 12 to move upward.
  • the first locking structure 80 includes a first buckle structure 81 and a second buckle structure 82 , and the first buckle structure 81 is rotationally connected to the first housing 60 , the second buckle structure 82 is installed on the second housing 70, and by rotating the first buckle structure 81, the first buckle structure 81 is locked in the second buckle structure 82 or separated from the second buckle structure 82, To achieve locking or unlocking of the first housing 60 .
  • the locking and unlocking of the first housing 60 is facilitated by the rotational arrangement of the first buckle structure 81 . It is easy to operate and can quickly lock the first buckle structure 81 and the second buckle structure 82 .
  • the first buckle structure 81 includes a hook 811 rotatably connected to the first housing 60 and a handle 812 connected to the hook 811 .
  • the buckle structure 82 includes a hook 811 for The card holder 821 is plugged in.
  • the card holder 821 is provided with a hook pin 822, and the handle 812 is used for the user to hold, so as to facilitate the operation of the hook 811 to rotate to hook the hook pin 822 or to be separated from the hook pin 822, so as to realize the first buckle structure 81 Quick lock with the second buckle structure 82 . It is easy to operate and can achieve convenient locking and fast and accurate docking, thereby saving time and improving efficiency.
  • the test fixture 100 further includes an in-position sensor.
  • the in-position sensor may be a metal distance sensor to detect the in-position state of the first buckle structure 81 .
  • the cover 11 is detachably mounted on the first housing 60 .
  • matching cover plates 11 can be replaced according to different single boards.
  • the carrier board 13 is detachably mounted on the second housing 70 .
  • matching carrier boards 13 can be replaced according to different single boards.
  • serial frequency band PCBAs are similar in structure and testing methods. Therefore, different single boards can be tested by replacing the cover plate 11, carrier plate 13 and pin plate 12 without replacing the entire test fixture. 100, shorten the testing time of batch products and reduce costs. Moreover, the cover plate 11, the carrier plate 13 and the needle plate 12 of different sizes can be replaced according to the single boards of different sizes, so that the shielding effect of the large-sized radio frequency single board can be achieved.
  • the test fixture 100 further includes a positioning structure 90 , which is used to position the product 200 under test.
  • the positioning structure 90 can be used to accurately place the single board in place.
  • the positioning structure 90 includes a positioning block 91 and/or a positioning post 92 .
  • the positioning block 91 is detachably installed on the surface of the carrier plate 13 .
  • the positioning block 91 has a positioning notch 911 .
  • the positioning notch 911 is The inner wall is used to abut the edge of the product to be tested 200 to locate the position of the product to be tested 200; the positioning post 92 is detachably installed on the surface of the carrier plate 13, and the positioning post 92 is used to pass through the reserved space on the product to be tested 200. Perforations are made to locate the position of the product 200 to be tested.
  • the placement of the positioning block 91, its positioning notch 911, and the positioning post 92 can ensure that the single board is accurately placed in place, so that the probe 121 can dock with the point to be tested on the single board to collect test signals.
  • the positioning block 91 and the positioning column 92 are both detachable, which facilitates installation, disassembly and later maintenance.
  • the positioning block 91 and the positioning column 92 can be disassembled and installed on the replaced carrier board 13 to achieve repeated use and save costs.
  • the positioning structure 90 may include one of a positioning block 91 and a positioning post 92 to position the single board. In an exemplary embodiment, the positioning structure 90 may also include a positioning block 91 and a positioning column 92, and the cooperation of the two can better realize the precise placement of the single board.
  • the test fixture 100 also includes a positioning sensor.
  • the positioning sensor may be an optical fiber sensor for detecting the placement status of the single board.
  • the test fixture 100 also includes a base 110 and a second locking structure.
  • the base 110 is provided with a cavity, and the second housing 70 is rotatably connected to the base 110.
  • the second locking structure is installed on the base 110 and/or the second housing 70.
  • the second locking structure is used to lock the second housing 70 when the second housing 70 is closed on the base 110.
  • the second housing 70 is used to limit the rotation of the second housing 70 .
  • a hinge or other hinged structure can be provided between the base 110 and the second housing 70 to realize the rotational connection between the base 110 and the second housing 70 .
  • the second locking structure can use a buckle structure or
  • the second housing 70 is locked using a magnetic structure or an electronic lock. When the base 110 needs to be opened, it is only necessary to operate the second locking structure to unlock it.
  • the cavity of the base 110 may be used to place a power supply unit and one or more control units that control the activation of the driving assembly 20 , the first cooling fan 34 , the second cooling fan 40 and other devices.
  • the outer wall of the base 110 is also provided with a button 1101 electrically connected to the control unit. The user can control the driving assembly 20, the first cooling fan 34 or the second cooling fan 40 by pressing the button 1101. Wait for the device to start.
  • the base 110 may also be provided with a touch screen, and the user can control the activation of the driving assembly 20, the first cooling fan 34 or the second cooling fan 40 and other devices by operating the touch screen.
  • the user can directly control the activation of the driving component 20, the first cooling fan 34 or the second cooling fan 40 and other components through the terminal software. How the user operates to start the driving assembly 20, the first cooling fan 34 or the second cooling fan 40 and other components is not limited here.
  • handles 140 are also provided on both sides of the base 110 and/or the second housing 70.
  • the number of handles 140 can be one or more.
  • a plurality of handles 140 are used for the user to hold to facilitate the transportation of the test fixture 100 .
  • the test fixture 100 further includes a first gas spring 120 , and the first gas spring 120 is connected between the first housing 60 and the second housing 70 . After the locking structure 80 is unlocked to enable the first housing 60 to rotate, the first gas spring 120 automatically opens the support to facilitate the insertion or removal of the single board.
  • the first housing 60 can automatically rotate to 60°-80° with the horizontal plane through the arrangement of the first gas spring 120 .
  • the first gas spring 120 can automatically open the support so that the first housing 60 is 60°, 70° (as shown in FIG. 1 ) or 80° with the horizontal plane to facilitate sufficient operation. space to insert or remove boards.
  • the test fixture 100 may be provided with two first gas springs 120 , one of which is disposed on the left side of the test fixture 100 and connected to the first housing. 60 and the second housing 70, another first gas spring 120 is disposed on the right side of the test fixture 100 and connected between the first housing 60 and the second housing 70. Through the first gas springs on the left and right sides, The spring 120 is used to support the first housing 60 and balance the force.
  • the test fixture 100 further includes a second gas spring 130.
  • the second gas spring 130 Connected between the second housing 70 and the base 110, when the second locking structure is unlocked so that the second housing 70 can rotate, the second gas spring 130 automatically opens the support to facilitate the support in the cavity of the base 110. Device for maintenance.
  • the second housing 70 can automatically rotate to 30°-60° with the horizontal plane through the arrangement of the second gas spring 130 .
  • the second gas spring 130 can automatically open the support so that the second housing 70 is 30°, 40°, 45° (as shown in Figure 3), 50° or 60° with the horizontal plane, In order to have enough operating space to inspect the devices in the cavity of the base 110.
  • the test fixture 100 may be provided with two second gas springs 130 , one of which is disposed on the left side of the test fixture 100 and connected to the second housing. 70 and the base 110, another second gas spring 130 is disposed on the right side of the test fixture 100 and connected between the second housing 70 and the base 110. The second gas spring 130 on the left and right sides is used to connect the second gas spring 130 to the base 110.
  • the housing 70 is supported and the force is balanced.
  • test fixture 100 of the present disclosure is as follows.
  • the single board is accurately placed in place.
  • the first housing 60 is rotated so that the cover plate 11 is horizontally positioned above the single board on the carrier plate 13 .
  • the needle plate 12 continues to move upward through the second elastic member 50 to bufferly fit with the carrier plate 13. At the same time, it drives the heat dissipation assembly 30 to bufferly contact with the heating element 201 of the single board through the first elastic member 1222 to prevent the impact force from impacting the heating element 201. damage, and can ensure sufficient surface adhesion to achieve heat transfer during the test process, and the hot air is blown to the outside of the test fixture 100 through the second cooling fan 40 to meet the heat dissipation requirements.
  • the present disclosure also provides a test equipment, including a test device and the test fixture 100 of any of the above embodiments.
  • the probe 121 is used to contact the test point of the product under test 200 to collect the test signal and feed it back to the test device.
  • the test device It is used to receive test signals and perform data analysis to complete the detection of various properties of the product under test 200.
  • the testing equipment proposed in this disclosure has all the beneficial effects brought by the technical solutions of any of the above embodiments, which will not be described again here.
  • the present disclosure provides a test fixture and test equipment, which can improve the heat dissipation capacity of the test fixture, thereby increasing the service life of the product under test, thereby meeting the needs of repeated use of the product under test.
  • the present disclosure provides a test fixture and test equipment.
  • the heat dissipation component of the test fixture is connected to the pin plate and can move synchronously with the pin plate.
  • the drive component can drive the pin plate to move up to achieve the collection of test signals, and can also drive the floating
  • the heat dissipation component with a special design moves through the slot and comes into contact with the heating element of the product under test to dissipate heat from the heating element and improve the heat dissipation capacity of the test fixture, thereby extending the service life of the product under test and thus meeting the needs of repeated product testing. times of use.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Tests Of Electronic Circuits (AREA)

Abstract

本公开提供一种测试夹具及测试设备，测试夹具包括夹具组件、驱动组件和散热组件，夹具组件包括盖板、针板和载板，载板用于承载待测产品，且载板上设有通孔和穿槽，盖板用于盖合于载板承载的待测产品上，针板位于载板下方，且针板设有探针，驱动组件连接于针板，驱动组件用于驱动针板上下移动，针板上移时带动探针穿过通孔与待测产品的测试点接触，以采集测试信号，散热组件连接于针板，针板上移时带动散热组件穿过穿槽与待测产品的发热元件接触，以对发热元件进行散热。

Description

测试夹具及测试设备
相关申请的交叉引用
本公开要求享有2022年08月12日提交的名称为“测试夹具及测试设备”的中国专利申请CN202222133763.6的优先权，其全部内容通过引用并入本公开中。
技术领域
本公开涉及产品检测技术领域，尤其涉及一种测试夹具及测试设备。
背景技术
为保证通信产品的质量和优良率，需对通信产品进行测试，检测该通信产品的信号接收性能、信号发送性能和辐射程度，保证出厂的通信产品符合各项通信标准。
测试夹具是连接测试系统与待测产品的装置，也是实现测试的必要装置，在测试系统中起着不可替代的作用，直接影响到测试的准确性、全面性、安全性。
待测产品在上电测试中在散热方面要求高，而一些情况下测试夹具存在散热能力不够的技术问题，不能满足待测产品反复多次使用的需求。
发明内容
本公开的主要目的在于提供一种测试夹具及测试设备，以解决测试夹具存在散热能力不够的技术问题。
第一方面，本公开提供一种测试夹具，包括：夹具组件，包括盖板、针板和载板，载板用于承载待测产品，且载板上设有通孔和穿槽，盖板用于盖合于载板承载的待测产品上，针板位于载板下方，且针板设有探针；驱动组件，连接于针板，驱动组件用于驱动针板上下移动，针板上移时带动探针穿过通孔与待测产品的测试点接触，以采集测试信号；散热组件，连接于针板，针板上移时带动散热组件穿过穿槽与待测产品的发热元件接触，以对发热元件进行散热。
第二方面，本公开还提供一种测试设备，包括测试装置和上述的测试夹具，探针用于与待测产品的测试点接触以采集测试信号并反馈至测试装置，测试装置用于接受测试信号并进 行数据分析。
附图说明
为了更清楚地说明本公开技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图是本公开的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本公开提供的测试夹具的第一壳体逆时针转动70°的结构示意图。
图2为图1中A处的局部放大示意图。
图3为本公开提供的测试夹具的第二壳体逆时针转动45°的结构示意图。
图4为本公开提供的测试夹具的第一视角结构示意图。
图5为本公开提供的测试夹具的第二视角结构示意图。
图6为图5中B处的局部放大示意图。
图7为本公开提供的驱动组件未驱动针板上移时的剖视示意图。
图8为本公开提供的载板上的待测产品贴合盖板以及针板贴合载板时的第一种剖视示意图。
图9为本公开提供的载板上的待测产品贴合盖板以及针板贴合载板时的第二种剖视示意图。
图10为图9中C处的局部放大示意图。
图11为本公开提供的针板上的探针插入载板上的通孔时的结构示意图。
图中：100、测试夹具；10、夹具组件；11、盖板；111、第一避让槽；12、针板；121、探针；122、弹性结构；1221、导向柱；1222、第一弹性件；1223、阻挡部；13、载板；131、通孔；132、穿槽；133、第二避让槽；14、第一屏蔽腔；15、第二屏蔽腔；16、天板；20、驱动组件；21、驱动件；22、推板；30、散热组件；31、安装部；32、导热部；33、散热部；331、第一端；332、第二端；333、散热片；34、第一散热风扇；40、第二散热风扇；50、第二弹性件；60、第一壳体；70、第二壳体；71、底板；80、第一锁紧结构；81、第一卡扣结构；811、挂钩；812、把手；82、第二卡扣结构；821、卡座；822、勾销；90、定位结构；91、定位块；911、定位缺口；92、定位柱；110、底座；1101、按钮；120、第一气弹簧；130、第二气弹簧；140、提手；200、待测产品；201、发热元件。
具体实施方式
下面将结合本公开中的附图，对本公开中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本公开一部分实施例，而不是全部的实施例。基于本公开中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本公开保护的范围。
应当理解，在此本公开说明书中所使用的术语仅仅是出于描述特定实施例的目的而并不意在限制本公开。如在本公开说明书和所附权利要求书中所使用的那样，除非上下文清楚地指明其它情况，否则单数形式的“一”、“一个”及“该”意在包括复数形式。
还应当理解，在本公开说明书和所附权利要求书中使用的术语“和/或”是指相关联列出的项中的一个或多个的任何组合以及所有可能组合，并且包括这些组合。
应当理解，此处所描述的具体实施例仅仅用以解释本公开，并不用于限定本公开。
下面结合附图，对本公开的一些实施例作详细说明。在不冲突的情况下，下述的实施例及实施例中的特征可以相互组合。
如图1至图11所示，本公开提供一种测试夹具100，包括夹具组件10、驱动组件20和散热组件30，夹具组件10包括盖板11、针板12和载板13，载板13用于承载待测产品200，且载板13上设有通孔131和穿槽132，盖板11用于盖合于载板13承载的待测产品200上，针板12位于载板13下方，且针板12设有探针121，驱动组件20连接于针板12，驱动组件20用于驱动针板12上下移动，针板12上移时带动探针121穿过通孔131与待测产品200的测试点接触，以采集测试信号，散热组件30连接于针板12，针板12上移时带动散热组件30穿过穿槽132与待测产品200的发热元件201接触，以对发热元件201进行散热。
在本公开中，散热组件30连接于针板12，可以与针板12同步移动，通过驱动组件20可以驱动针板12上移以实现测试信号的采集，同时还可以带动浮动式设计的散热组件30移动至穿过穿槽132与待测产品200的发热元件201接触，以对发热元件201进行散热，提升测试夹具100的散热能力，从而提升待测产品200的使用寿命，进而满足待测产品200反复多次使用的需求。
在一示例性实施例中，待测产品200为PCBA(Printed Circuit Board Assembly，印制电路板)，以下简称单板，发热元件201为设于单板上的大功耗芯片，通过浮动式设计的散热组件30可以直接贴合于大功耗芯片对其进行散热，散热效果好。
在一些实施例中，如图7至图9以及图11所示，散热组件30包括安装部31、导热部32和散热部33，安装部31安装于针板12底部，导热部32设于安装部31上方并穿设于针板12，散热部33设于安装部31下方，针板12上移时带动导热部32穿过穿槽132与待测产品200的发热元件201接触，以使导热部32将发热元件201产生的热量传导至散热部33，并通过散热部33将热量散出。在本公开中，安装部31用于散热组件30的安装，导热部32用于与发热元件201接触以实现测试过程的热传递，并通过散热部33将热量散出，以满足核心大功耗芯片的散热需求。
在一些实施例中，如图9和图10所示，针板12底部设有弹性结构122，安装部31连接于弹性结构122，导热部32与发热元件201对接时驱使弹性结构122压缩，以使导热部32与发热元件201缓冲接触。在本公开中，通过弹性结构122的设置，以使散热结构与发热元件201的对接时导热部32能够与发热元件201缓冲接触，防止冲击力对发热元件201的损伤，并且能够保证导热部32表面与发热元件201充分贴合，以实现测试过程的热传递，以满足发热芯片的散热需求。
在一些实施例中，如图10所示，弹性结构122包括导向柱1221和第一弹性件1222，导向柱1221连接于针板12底部并沿竖直方向向下延伸，导向柱1221上设有阻挡部1223，安装部31套设于导向柱1221并活动设于阻挡部1223与针板12底面之间，第一弹性件1222套设于导向柱1221，第一弹性件1222的一端抵接于安装部31，第一弹性件1222的另一端抵接于阻挡部1223，导热部32与发热元件201对接时通过安装部31驱使第一弹性件1222压缩，以使导热部32与发热元件201缓冲接触。在本公开中，将安装部31活动设于连接于针板12底部的导向柱1221，第一弹性件1222的一端作用于安装部31的底面，另一端作用于导向柱1221下端的阻挡部1223，针板12上移过程中带动导向柱1221同步上移，同时带动安装部31以及设于安装部31上方的导热部32上移，当导热部32与发热元件201接触时，会产生作用力驱使第一弹性件1222弹性压缩，以使导热部32与发热元件201缓冲接触，防止冲击力对发热元件201的损伤。
在一示例性实施例中，第一弹性件1222可以采用弹簧，导向柱1221可以采用螺钉或铆钉，则螺钉或铆钉的头部形成阻挡部1223。
在一些实施例中，如图9所示，散热部33包括连接于安装部31的第一端331和与第一端331相对的第二端332，第二端332设有多个散热片333。在本公开中，通过第二端332的多个散热片333的设置以提升其散热效果。
在一些实施例中，如图7至图9所示，散热组件30还包括第一散热风扇34，第一散热 风扇34设于散热部33下方。在本公开中，第一散热风扇34设于第二端332下方，通过第一散热风扇34的设置可以更好的提升散热组件30的散热效果。
在一些实施例中，如图1以及图3至图5所示，散热组件30下方形成散热空间，测试夹具100还包括第二散热风扇40，第二散热风扇40与散热空间连通，以将散热空间的热风吹到测试夹具100外部以满足散热需求。
在一些实施例中，针板12可拆卸安装于驱动组件20。在本公开中，通过针板12的可拆卸设置，可以根据不同的单板以更换匹配的针板12，由于通讯产品更新换代频繁，系列频段PCBA在结构上相似，在测试手段上相近，因此可以通过更换针板12，从而进行不同单板的测试，无需更换整个测试夹具100，缩短批量产品的测试时间，降低成本。
在一些实施例中，散热组件30可拆卸安装于针板12。在本公开中，将散热组件30可拆卸设置，可以便于安装拆卸以及后期维修。并且，当更换不同针板12后，可以将散热组件30拆卸下来安装到更换的针板12上，以实现反复使用，节约成本。
在一些实施例中，如图3以及图7至图9所示，驱动组件20包括驱动件21和推板22，驱动件21连接于推板22，推板22连接于针板12，驱动件21用于驱动推板22上下移动，以实现针板12的上下移动。在本公开中，驱动件21可以采用气缸，气缸启动后推动推板22上移，以带动针板12上移，从而带动针板12上的探针121穿过通孔131与待测产品200的测试点接触，以采集测试信号。
在一些实施例中，如图7和图8所示，针板12与载板13之间设有第二弹性件50，针板12上移时通过第二弹性件50带动载板13上移，以使载板13上的待测产品200与盖板11缓冲式贴合。在本公开中，驱动组件20驱动针板12上移时，带动载板13浮动缓冲式上升，以使载板13上的单板与盖板11缓冲式对接，同时驱使针板12与载板13之间的第二弹性件50弹性压缩，以使针板12与载板13之间缓冲式贴合，有效减少测试夹具100闭合时的冲击应力，同时使探针121与待测产品200的测试点缓冲接触，防止冲击力对测试点的损伤。
在一些实施例中，如图7和图8所示，盖板11设有用于避让待测产品200第一侧面的功能器件的第一避让槽111，盖板11盖合于待测产品200时，待测产品200封盖于第一避让槽111以形成测试所需的第一屏蔽腔14，第一侧面为待测产品200放置于载板13时与盖板11相对的一面。在一示例性实施例中，第一侧面为单板的TOP面，通过第一屏蔽腔14的设置以满足单板的TOP面的测试屏蔽需求。
在一些实施例中，如图7、图8和图11所示，载板13上设有用于避让待测产品200第二侧面的功能器件的第二避让槽133，待测产品200放置于载板13时封盖于第二避让槽133 以形成测试所需的第二屏蔽腔15，第二侧面为待测产品200放置于载板13时与载板13相对的一面。在一示例性实施例中，第二侧面的功能器件包括上述的发热元件201，第二侧面为单板的BOT面，通过第二屏蔽腔15的设置以满足单板的BOT面的测试屏蔽需求。
在一些实施例中，如图1所示，夹具组件10还包括天板16，天板16连接于盖板11背对载板13的一面，天板16上设有电源探针和测试探针等，当盖板11盖合于载板13上时，天板16上的探针穿过盖板11与单板的TOP面上的测试点自动对接以实现测试目的。
在一些实施例中，如图1至图5所示，测试夹具100还包括第一壳体60、第二壳体70和第一锁紧结构80，盖板11安装于第一壳体60，第二壳体70与第一壳体60转动连接，载板13安装于第二壳体70，第一壳体60转动至盖合于第二壳体70，以使盖板11盖合于载板13承载的待测产品200上，第一锁紧结构80安装于第一壳体60和/或第二壳体70，第一锁紧结构80用于第一壳体60盖合于第二壳体70时锁紧第一壳体60，以限制第一壳体60的转动。在本公开中，可在第一壳体60与第二壳体70之间设置铰链或其他铰接结构以实现第一壳体60与第二壳体70之间的转动连接，通过第一壳体60、第二壳体70和第一锁紧结构80的设置，以便于实现测试夹具100的打开与闭合。
在一示例性实施例中，如图1至图5所示，第二散热风扇40可以安装于第二壳体70。其中，散热空间位于第二壳体70内，第二散热风扇40设置有两组，每组包括一个或多个第二散热风扇40，其中一组第二散热风扇40设于第二壳体70的左侧，另一组第二散热风扇40设于第二壳体70的右侧，通过两侧的第二散热风扇40的设置能够更快速的将散热空间的热风吹到测试夹具100外部以满足散热需求。
在一示例性实施例中，如图3以及图7至图9所示，第二壳体70底部设有底板71，驱动组件20可以安装于第二壳体70的底板71。其中，测试夹具100可以设有一个或多个驱动组件20，通过多个驱动组件20的设置能够提供足够的驱动力以驱动针板12上移。
在一些实施例中，如图4和图6所示，第一锁紧结构80包括第一卡扣结构81和第二卡扣结构82，第一卡扣结构81转动连接于第一壳体60，第二卡扣结构82安装于第二壳体70，通过转动第一卡扣结构81以使第一卡扣结构81卡设于第二卡扣结构82或者从第二卡扣结构82脱离，以实现第一壳体60的锁紧或解锁。在本公开中，通过第一卡扣结构81的旋转式设置以便于实现第一壳体60的锁紧与解锁。操作方便，能够实现第一卡扣结构81与第二卡扣结构82的卡接快锁。
在一示例性实施例中，如图1、图4和图6所示，第一卡扣结构81包括与第一壳体60转动连接的挂钩811以及连接于挂钩811的把手812，第二卡扣结构82包括用于供挂钩811 插接的卡座821，卡座821内设有勾销822，把手812用于供用户握持，以便于操作挂钩811转动至勾住勾销822或者脱离于勾销822，以实现第一卡扣结构81与第二卡扣结构82的卡接快锁。在操作方便能够实现方便锁定，对接快速精准，达到节省时间，提高效率的目的。
在一些实施例中国，测试夹具100还包括到位传感器，到位传感器可以采用金属距离传感器，以检测第一卡扣结构81的到位状态。
在一些实施例中，盖板11可拆卸安装于第一壳体60。在本公开中，通过盖板11的可拆卸设置，可以根据不同的单板以更换匹配的盖板11。
在一些实施例中，载板13可拆卸安装于第二壳体70。在本公开中，通过载板13的可拆卸设置，可以根据不同的单板以更换匹配的载板13。
由于通讯产品更新换代频繁，系列频段PCBA在结构上相似，在测试手段上相近，因此可以通过更换盖板11、载板13和针板12，从而进行不同单板的测试，无需更换整个测试夹具100，缩短批量产品的测试时间，降低成本。并且，可以根据不同尺寸的单板更换对于尺寸的盖板11、载板13和针板12，可以实现大尺寸射频单板的屏蔽效能。
在一些实施例中，如图1和图2所示，测试夹具100还包括定位结构90，定位结构90用于对待测产品200的位置进行定位。在本公开中，通过定位结构90可以实现单板的精准放置到位。
在一些实施例中，如图2所示，定位结构90包括定位块91和/或定位柱92，定位块91可拆卸安装于载板13表面，定位块91具有定位缺口911，定位缺口911的内壁用于抵接于待测产品200的边沿以对待测产品200的位置进行定位；定位柱92可拆卸安装于载板13表面，定位柱92用于穿设于待测产品200上预留的穿孔以对待测产品200的位置进行定位。在本公开的实施例中，通过定位块91及其定位缺口911以及定位柱92的设置能够确保单板精准放置到位，以便于探针121对接单板的待测点以采集测试信号。其中，定位块91与定位柱92均为可拆卸设置，便于安装拆卸以及后期维修。并且，当更换不同载板13后，可以将定位块91与定位柱92拆卸下来安装到更换的载板13上，以实现反复使用，节约成本。
在一示例性实施例中，定位结构90可以包括定位块91和定位柱92中的一者，以对单板进行定位。在一示例性实施例中，定位结构90也可以包括定位块91和定位柱92，通过两者的配合以更好的实现单板的精准放置到位。
在一些实施例中，测试夹具100还包括定位传感器，定位传感器可以采用光纤传感器，用于检测单板的放置到位状态。
在一些实施例中，如图1至图5所示，测试夹具100还包括底座110和第二锁紧结构，底座110内设有空腔，第二壳体70可转动式连接于底座110，以打开或盖合底座110的空腔，第二锁紧结构安装于底座110和/或第二壳体70，第二锁紧结构用于第二壳体70盖合于底座110时锁紧第二壳体70，以限制第二壳体70的转动。在本公开中，可在底座110与第二壳体70之间设置铰链或其他铰接结构以实现底座110与第二壳体70之间的转动连接，第二锁紧结构可以采用卡扣结构或磁吸结构或电子锁等方式对第二壳体70进行锁紧，当需要打开底座110时只需操作第二锁紧结构使其解锁即可。
在一示例性实施例中，底座110的空腔可以用于放置电源单元，以及控制驱动组件20、第一散热风扇34以及第二散热风扇40等器件启动的一个或多个控制单元。如图1、凸3和图4所示，底座110外壁还设有与控制单元电连接的按钮1101，用户可以通过按压按钮1101以控制驱动组件20、第一散热风扇34或第二散热风扇40等器件的启动。或者，底座110上也可以设置有触控屏，用户可通过操作触控屏以控制驱动组件20、第一散热风扇34或第二散热风扇40等器件的启动。又或者，用户可以直接通过终端的软件控制驱动组件20、第一散热风扇34或第二散热风扇40等器件的启动。用户如何操作以启动驱动组件20、第一散热风扇34或第二散热风扇40等器件在此不做限制。
在一些实施例中，如图1、图3个图4所示，底座110和/或第二壳体70的两侧还设有提手140，提手140的数量可以设置一个，也可以设置多个，提手140用于供用户握持，以便于测试夹具100的搬运。
在一些实施例中，如图1至图5所示，测试夹具100还包括第一气弹簧120，第一气弹簧120连接于第一壳体60与第二壳体70之间，当第一锁紧结构80解锁以使第一壳体60能够转动后，第一气弹簧120自动拉开支撑，以便于放入或取出单板。
在一示例性实施例中，通过第一气弹簧120的设置可以使第一壳体60自动转动至与水平面呈60°-80°。在一示例性实施例中，第一气弹簧120可以自动拉开支撑以使第一壳体60与水平面呈60°、70°(如图1所示)或者80°，以便于有足够的操作空间进行放入或取出单板。
在一示例性实施例中，如图1所示，测试夹具100可以设置有两个第一气弹簧120，其中一个第一气弹簧120设置于测试夹具100的左侧并连接于第一壳体60与第二壳体70之间，另一个第一气弹簧120设置于测试夹具100的右侧并连接于第一壳体60与第二壳体70之间，通过左右两侧的第一气弹簧120以将第一壳体60支撑起来，受力平衡。
在一些实施例中，如图3所示，测试夹具100还包括第二气弹簧130，第二气弹簧130 连接于第二壳体70与底座110之间，当第二锁紧结构解锁以使第二壳体70能够转动后，第二气弹簧130自动拉开支撑，以便于对底座110空腔内的器件进行检修。
在一示例性实施例中，通过第二气弹簧130的设置可以使第二壳体70自动转动至与水平面呈30°-60°。在一示例性实施例中，第二气弹簧130可以自动拉开支撑以使第二壳体70与水平面呈30°、40°、45°(如图3所示)、50°或者60°，以便于有足够的操作空间以对底座110空腔内的器件进行检修。
在一示例性实施例中，如图3所示，测试夹具100可以设置有两个第二气弹簧130，其中一个第二气弹簧130设置于测试夹具100的左侧并连接于第二壳体70与底座110之间，另一个第二气弹簧130设置于测试夹具100的右侧并连接于第二壳体70与底座110之间，通过左右两侧的第二气弹簧130以将第二壳体70支撑起来，受力平衡。
本公开的测试夹具100的工作过程如下。
逆时针方向转动把手812，以使挂钩811脱离勾销822，第一壳体60可相对第二壳体70转动，此时第一壳体60以及位于第二壳体70内侧的天板16和盖板11在第一气弹簧120的作用下自动逆时针转动70°以处于开启状态(如图1所示)。
通过载板13上的定位块91与定位柱92的作用下，以使单板精准放置到位。
转动第一壳体60以使盖板11水平位于载板13上的单板上方。
按下底箱外壁的按钮1101，以使驱动件21启动，驱动推板22带动针板12上移，使针板12与载板13之间的第二弹性件50弹性压缩，有效减少测试夹具100闭合时的冲击应力，进而带动载板13推动单板上升与盖板11贴合，其中，单板的TOP面与盖板11之间形成第一屏蔽腔14、单板的BOT面与载板13之间形成第二屏蔽腔15，形成的两个屏蔽腔满足单板的测试需求。
针板12继续上移通过第二弹性件50与载板13缓冲式贴合，同时带动散热组件30通过第一弹性件1222与单板的发热元件201缓冲式接触，防止冲击力对发热元件201的损伤，并且能保证表面贴合充分，实现测试过程的热传递，热风再通过第二散热风扇40吹到测试夹具100外部满足散热需求。
本公开还提供一种测试设备，包括测试装置和上述任一项实施例的测试夹具100，探针121用于与待测产品200的测试点接触以采集测试信号并反馈至测试装置，测试装置用于接受测试信号并进行数据分析，以完成待测产品200的各种性能的检测。本公开提出的测试设备，具有上述任一实施例的技术方案所带来的所有有益效果，在此不再一一赘述。
本公开提供了一种测试夹具及测试设备，能够提升测试夹具的散热能力，从而提升待测产品的使用寿命，进而满足待测产品反复多次使用的需求。本公开提供了一种测试夹具及测试设备，测试夹具的散热组件连接于针板，可以与针板同步移动，通过驱动组件可以驱动针板上移以实现测试信号的采集，同时还可以带动浮动式设计的散热组件移动至穿过穿槽与待测产品的发热元件接触，以对发热元件进行散热，提升测试夹具的散热能力，从而提升待测产品的使用寿命，进而满足待测产品反复多次使用的需求。
上述本公开序号仅仅为了描述，不代表实施例的优劣。以上所述，仅为本公开的具体实施例，但本公开的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本公开揭露的技术范围内，可轻易想到各种等效的修改或替换，这些修改或替换都应涵盖在本公开的保护范围之内。因此，本公开的保护范围应以权利要求的保护范围为准。

Claims (10)

  1. 一种测试夹具，包括：
    夹具组件，包括盖板、针板和载板，所述载板用于承载待测产品，且所述载板上设有通孔和穿槽，所述盖板用于盖合于所述载板承载的待测产品上，所述针板位于所述载板下方，且所述针板设有探针；
    驱动组件，连接于所述针板，所述驱动组件用于驱动所述针板上下移动，所述针板上移时带动所述探针穿过所述通孔与所述待测产品的测试点接触，以采集测试信号；
    散热组件，连接于所述针板，所述针板上移时带动所述散热组件穿过所述穿槽与所述待测产品的发热元件接触，以对所述发热元件进行散热。
  2. 如权利要求1所述的测试夹具，其中，所述散热组件包括：
    安装部，安装于所述针板底部；
    导热部，设于所述安装部上方并穿设于所述针板；
    散热部，设于所述安装部下方；
    所述针板上移时带动所述导热部穿过所述穿槽与所述待测产品的发热元件接触，以使所述导热部将所述发热元件产生的热量传导至所述散热部，并通过所述散热部将热量散出。
  3. 如权利要求2所述的测试夹具，其中，所述针板底部设有弹性结构，所述安装部连接于所述弹性结构，所述导热部与所述发热元件对接时驱使所述弹性结构压缩，以使所述导热部与所述发热元件缓冲接触。
  4. 如权利要求3所述的测试夹具，其中，所述弹性结构包括：
    导向柱，连接于所述针板底部并沿竖直方向向下延伸，所述导向柱上设有阻挡部，所述安装部套设于所述导向柱并活动设于所述阻挡部与所述针板底面之间；
    第一弹性件，套设于所述导向柱，所述第一弹性件的一端抵接于所述安装部，所述第一弹性件的另一端抵接于所述阻挡部，所述导热部与所述发热元件对接时通过所述安装部驱使所述第一弹性件压缩，以使所述导热部与所述发热元件缓冲接触。
  5. 如权利要求2所述的测试夹具，其中，所述散热部包括连接于所述安装部的第一端和与所述第一端相对的第二端，所述第二端设有多个散热片；和/或，
    所述散热组件还包括第一散热风扇，所述第一散热风扇设于所述散热部下方。
  6. 如权利要求1-5任一项所述的测试夹具，其中，
    所述针板可拆卸安装于所述驱动组件；和/或，
    所述散热组件可拆卸安装于所述针板；和/或，
    所述针板与所述载板之间设有第二弹性件，所述针板上移时驱使所述第二弹性件压缩，以使所述载板上的待测产品与盖板缓冲式贴合；和/或，
    所述盖板设有用于避让所述待测产品第一侧面的功能器件的第一避让槽，所述盖板盖合于所述待测产品时，所述待测产品封盖于所述第一避让槽以形成第一屏蔽腔，所述第一侧面为所述待测产品放置于所述载板时与所述盖板相对的一面；和/或，
    所述载板上设有用于避让所述待测产品第二侧面的功能器件的第二避让槽，所述待测产品放置于所述载板时封盖于所述第二避让槽以形成第二屏蔽腔，所述第二侧面为所述待测产品放置于所述载板时与所述载板相对的一面。
  7. 如权利要求1-5任一项所述的测试夹具，其中，所述测试夹具还包括：
    第一壳体，所述盖板安装于所述第一壳体；
    第二壳体，与所述第一壳体转动连接，所述载板安装于所述第二壳体，所述第一壳体转动至盖合于所述第二壳体，以使所述盖板盖合于所述载板承载的待测产品上；
    第一锁紧结构，安装于所述第一壳体和/或第二壳体，所述第一锁紧结构用于所述第一壳体盖合于所述第二壳体时锁紧所述第一壳体，以限制所述第一壳体的转动。
  8. 如权利要求7所述的测试夹具，其中，
    所述盖板可拆卸安装于所述第一壳体；和/或，
    所述载板可拆卸安装于所述第二壳体；和/或，
    所述第一锁紧结构包括第一卡扣结构和第二卡扣结构，所述第一卡扣结构转动连接于所述第一壳体，所述第二卡扣结构安装于所述第二壳体，通过转动所述第一卡扣结构以使所述第一卡扣结构卡设于所述第二卡扣结构或者从所述第二卡扣结构脱离，以实现所述第一壳体的锁紧或解锁。
  9. 如权利要求1-5任一项所述的测试夹具，其中，所述测试夹具还包括定位结构，所述定位结构用于对所述待测产品的位置进行定位。
  10. 一种测试设备，包括测试装置和如权利要求1-9任一项所述的测试夹具，所述探针用于与所述待测产品的测试点接触以采集测试信号并反馈至所述测试装置，所述测试装置用于接受所述测试信号并进行数据分析。
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CN202256398U (zh) * 2011-09-26 2012-05-30 北京华龙通科技有限公司 晶体谐振器测试夹具
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