WO2024029284A1 - 固体電解コンデンサ - Google Patents

固体電解コンデンサ Download PDF

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Publication number
WO2024029284A1
WO2024029284A1 PCT/JP2023/025549 JP2023025549W WO2024029284A1 WO 2024029284 A1 WO2024029284 A1 WO 2024029284A1 JP 2023025549 W JP2023025549 W JP 2023025549W WO 2024029284 A1 WO2024029284 A1 WO 2024029284A1
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WO
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Prior art keywords
face
curvature
chamfer
solid electrolytic
electrolytic capacitor
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Ceased
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PCT/JP2023/025549
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English (en)
French (fr)
Japanese (ja)
Inventor
里佳子 岩崎
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Panasonic Intellectual Property Management Co Ltd
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Panasonic Intellectual Property Management Co Ltd
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Priority to CN202380055588.8A priority Critical patent/CN119585828A/zh
Priority to JP2024538889A priority patent/JPWO2024029284A1/ja
Publication of WO2024029284A1 publication Critical patent/WO2024029284A1/ja
Priority to US19/004,024 priority patent/US20250149257A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/08—Housing; Encapsulation
    • H01G9/10—Sealing, e.g. of lead-in wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/008—Terminals
    • H01G9/012—Terminals specially adapted for solid capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/04—Electrodes or formation of dielectric layers thereon
    • H01G9/048—Electrodes or formation of dielectric layers thereon characterised by their structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/08—Housing; Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/15—Solid electrolytic capacitors

Definitions

  • the present disclosure relates to solid electrolytic capacitors.
  • Patent Document 1 electrolytic capacitors (solid electrolytic capacitors) using solid electrolytes are known (for example, Patent Document 1).
  • the solid electrolytic capacitor of Patent Document 1 includes at least one capacitor element having an anode part and a cathode part, an exterior body that seals the at least one capacitor element, and a first external electrode electrically connected to the anode part. , and a second external electrode electrically connected to the cathode section.
  • the external electrode may include a conductive paste layer.
  • the thickness of the conductive paste layer is insufficient, air may enter the exterior body due to peeling of the external electrode at that part and reach the capacitor element.
  • the ESR characteristics of the solid electrolytic capacitor will deteriorate.
  • one of the purposes of the present disclosure is to suppress deterioration of ESR characteristics.
  • the solid electrolytic capacitor has at least one capacitor element having an anode part and a cathode part, a first end face where the anode part is exposed, and a second end face where the cathode part is exposed, and the at least one capacitor element an exterior body to be sealed; a first external electrode provided to cover the first end face, including a first conductive paste layer and electrically connected to the anode portion; and a first external electrode to cover the second end face.
  • a second external electrode that is provided on the substrate includes a second conductive paste layer, and is electrically connected to the cathode part, and a peripheral edge of the first end surface and a peripheral edge of the second end surface are each R-chamfered.
  • FIG. 1 is a cross-sectional view schematically showing an example of a solid electrolytic capacitor according to the present disclosure.
  • FIG. 2 is a cross-sectional view schematically showing the structure of a capacitor element.
  • Embodiments of the solid electrolytic capacitor according to the present disclosure will be described below by giving examples. However, the present disclosure is not limited to the examples described below. In the following description, specific numerical values and materials may be illustrated, but other numerical values and materials may be applied as long as the effects of the present disclosure can be obtained.
  • a solid electrolytic capacitor according to the present disclosure includes at least one capacitor element, an exterior body, a first external electrode, and a second external electrode.
  • At least one capacitor element has an anode part and a cathode part.
  • the at least one capacitor element may further include an insulating part that is provided between the anode part and the cathode part and electrically insulates the two.
  • the insulating portion may be made of, for example, insulating tape or insulating resin.
  • the anode portion may be composed of an anode body made of a valve metal included in the capacitor element.
  • the cathode section may include a solid electrolyte layer formed to cover a portion of the anode body, and a cathode extraction layer disposed thereon.
  • a dielectric layer is provided between the anode body and the solid electrolyte layer.
  • the cathode extraction layer may include a cathode layer covering at least a portion of the solid electrolyte layer and a metal-containing layer covering at least a portion of the cathode layer.
  • Valve metals that make up the anode body include aluminum, tantalum, niobium, titanium, and the like.
  • the anode body may be a valve metal foil or a sintered body of valve metal particles.
  • the dielectric layer is formed at least on the surface of the cathode forming portion, which is the remainder of the anode body.
  • the dielectric layer may be made of an oxide (for example, aluminum oxide) formed on the surface of the anode body by a liquid phase method such as anodic oxidation, or a vapor phase method such as vapor deposition or atomic layer deposition.
  • a solid electrolyte layer is formed on the surface of the dielectric layer.
  • the solid electrolyte layer may include a conductive polymer.
  • the solid electrolyte layer may further contain a dopant, if necessary.
  • the conductive polymer known ones used in solid electrolytic capacitors, such as ⁇ -conjugated conductive polymers, can be used.
  • the conductive polymer include polymers having a basic skeleton of polypyrrole, polythiophene, polyaniline, polyfuran, polyacetylene, polyphenylene, polyphenylene vinylene, polyacene, and polythiophene vinylene.
  • polymers having a basic skeleton of polypyrrole, polythiophene, or polyaniline are preferred.
  • the above-mentioned polymers also include homopolymers, copolymers of two or more types of monomers, and derivatives thereof (substituted products having substituents, etc.).
  • polythiophene includes poly(3,4-ethylenedioxythiophene) and the like.
  • the conductive polymers may be used singly or in combination of two or more.
  • the dopant for example, at least one selected from the group consisting of low molecular anions and polyanions is used.
  • low-molecular anions include sulfate ions, nitrate ions, phosphate ions, borate ions, organic sulfonate ions, and carboxylate ions, but are not particularly limited.
  • dopants that generate organic sulfonic acid ions include benzenesulfonic acid, p-toluenesulfonic acid, and naphthalenesulfonic acid.
  • the polyanion include polymer-type polysulfonic acids and polymer-type polycarboxylic acids.
  • polymeric polysulfonic acids examples include polyvinylsulfonic acid, polystyrenesulfonic acid, polyallylsulfonic acid, polyacrylsulfonic acid, and polymethacrylsulfonic acid.
  • polymeric polycarboxylic acids examples include polyacrylic acid and polymethacrylic acid.
  • Polyanions also include polyester sulfonic acids, phenolsulfonic acid novolac resins, and the like. However, polyanions are not limited to these.
  • the solid electrolyte layer may further contain known additives and known conductive materials other than conductive polymers, if necessary.
  • conductive materials include at least one selected from the group consisting of conductive inorganic materials such as manganese dioxide, and TCNQ complex salts.
  • the cathode layer may be composed of a carbon layer formed on the surface of the solid electrolyte layer and a conductor layer formed on the surface of the carbon layer.
  • the conductor layer may be composed of silver paste.
  • the silver paste for example, a composition containing silver particles and a resin component (binder resin) can be used.
  • a thermoplastic resin can be used as the resin component, it is preferable to use a thermosetting resin such as an imide resin or an epoxy resin.
  • the metal-containing layer may be composed of a layer containing metal powder or a metal foil.
  • the layer containing a metal layer include a metal paste layer formed using a composition containing metal powder and a resin (binder resin).
  • the metal paste layer include a silver paste layer containing silver particles and resin.
  • the metal foil include Al foil, Cu foil, metal foil made of a valve metal (aluminum, tantalum, niobium, etc.), or an alloy containing a valve metal. If necessary, the surface of the metal foil may be roughened.
  • the exterior body has a first end face where the anode part is exposed and a second end face where the cathode part is exposed, and seals at least one capacitor element.
  • the exterior body may contain, for example, a cured product of a curable resin composition, or may contain a thermoplastic resin or a curable resin composition containing the thermoplastic resin.
  • the exterior body may include a substrate on which the capacitor element is placed.
  • the substrate may be an insulating substrate or a metal substrate, or may be a laminated substrate (such as a printed circuit board) with wiring patterns formed on the front and back surfaces. It is sufficient that at least the end face of the anode portion is exposed from the first end face.
  • the end surface of the anode portion may be flush with the first end surface, may protrude outward from the first end surface, or may be recessed inward from the first other surface. At least the end face of the cathode portion may be exposed from the second end face. The end surface of the cathode portion may be flush with the second end surface, may protrude outward from the second end surface, or may be recessed inward from the second end surface.
  • the first external electrode is provided to cover the first end surface.
  • the first external electrode includes a first conductive paste layer and is electrically connected to the anode portion.
  • the first conductive paste layer may be disposed closest to the first end surface in the first external electrode.
  • the first conductive paste layer may cover the entire first end surface.
  • the first conductive paste layer may include conductive particles and a resin material. Examples of the conductive particles include particles of conductive inorganic materials.
  • the resin material may include, for example, a cured product of a curable resin composition, or may include a thermoplastic resin or a composition containing the same.
  • the first conductive paste layer may be, for example, a silver paste layer containing silver particles or silver alloy particles.
  • the second external electrode is provided to cover the second end surface.
  • the second external electrode includes a second conductive paste layer and is electrically connected to the cathode section.
  • the second conductive paste layer may be disposed closest to the second end surface in the second external electrode.
  • the second conductive paste layer may cover the entire second end surface.
  • the second conductive paste layer may include conductive particles and a resin material. Examples of the conductive particles include particles of conductive inorganic materials.
  • the resin material may include, for example, a cured product of a curable resin composition, or may include a thermoplastic resin or a composition containing the same.
  • the second conductive paste layer may be, for example, a silver paste layer containing silver particles or silver alloy particles.
  • the composition of the second conductive paste layer may be the same as or different from the composition of the first conductive paste layer.
  • the inventor of the present application has found that the thickness of the conductive paste layer included in the external electrode tends to be particularly insufficient at the portion covering the peripheral edge of the end face of the exterior body (or the corner of the exterior body). I discovered that. This seems to be because the peripheral edge of the end face of the exterior body has a sharp shape (or a pointed shape). In contrast, in the present disclosure, the peripheral edge of the first end face and the peripheral edge of the second end face are each rounded. Thereby, a sufficient thickness of the first conductive paste layer covering the peripheral edge of the first end face and a sufficient thickness of the second conductive paste layer covering the peripheral edge of the second end face can be ensured.
  • the method for forming the R chamfer is not particularly limited, and for example, it may be formed by polishing such as centrifugal barrel polishing. Polishing may be performed before forming a first plating layer, which will be described later.
  • the maximum radius of curvature of the R chamfer of the first end face may be 1.0 times or more and 1.1 times or less of the minimum radius of curvature of the R chamfer of the first end face.
  • the radius of curvature of the R chamfer is substantially constant over the entire peripheral edge of the first end face.
  • the radius of curvature of R-chamfering defines a circle or an ellipse corresponding to the outline shape of the R-chamfered part, and if it is a circle, the radius of the circle, and if it is an ellipse, it defines the radius of the circle. shall refer to 1/2 of the major axis of the ellipse.
  • the contour shape of the R-chamfered portion may be the contour shape of a solid electrolytic capacitor in a cross section perpendicular to the main surfaces of the first external electrode and the second external electrode and parallel to the stacking direction of the capacitor element.
  • the maximum radius of curvature of the R chamfer of the second end face may be 1.0 times or more and 1.1 times or less of the minimum radius of curvature of the R chamfer of the second end face.
  • the radius of curvature of the R chamfer is substantially constant over the entire peripheral edge of the second end face.
  • the maximum radius of curvature of the R chamfer on the first end face may be 0.95 times or more and no more than 1.05 times the maximum radius of curvature of the R chamfer on the second end face.
  • the maximum radius of curvature of the R chamfer of the first end face and the maximum radius of curvature of the R chamfer of the second end face may be substantially equal to each other. This makes it possible to make the thickness of the conductive paste layer corresponding to each end surface uniform, thereby further reducing variations in ESR among a plurality of solid electrolytic capacitors, and also improving the appearance of the solid electrolytic capacitor.
  • the minimum radius of curvature of the R-chamfer of the first end face may be 0.95 times or more and 1.05 times or less of the minimum radius of curvature of the R-chamfer of the second end face.
  • the minimum radius of curvature of the R chamfer of the first end face and the minimum radius of curvature of the R chamfer of the second end face may be substantially equal to each other. This makes it possible to make the thickness of the conductive paste layer corresponding to each end surface uniform, thereby further reducing variations in ESR among a plurality of solid electrolytic capacitors, and also improving the appearance of the solid electrolytic capacitor.
  • the maximum radius of curvature of the R chamfer of each of the first end face and the second end face may be 0.02 mm or more and 0.24 mm or less.
  • the maximum radius of curvature is 0.02 mm or more, it becomes easy to ensure a sufficient thickness of the conductive paste layer covering the R-chamfered portion.
  • the maximum radius of curvature is 0.24 mm or less, adverse effects such as scraping of the capacitor element inside the exterior body are unlikely to occur.
  • the maximum radius of curvature of the R chamfer of each of the first end face and the second end face may be 0.0025D or more and 0.033D or less.
  • the maximum radius of curvature is 0.0025D or more, it becomes easy to ensure a sufficient thickness of the conductive paste layer covering the R-chamfered portion.
  • the maximum radius of curvature is 0.033D or less, adverse effects such as scraping of the capacitor element inside the exterior body are less likely to occur.
  • the thickness of the first conductive paste layer may be 10 ⁇ m or more at the portion where the radius of curvature of the R chamfer on the first end face is the smallest.
  • the thickness of the second conductive paste layer may be 10 ⁇ m or more at the portion where the radius of curvature of the R chamfer on the second end face is the smallest. If the thickness of each conductive paste layer is within this range, it is possible to sufficiently suppress each external electrode from peeling off from the exterior body, and further suppress the deterioration of the ESR characteristics of the solid electrolytic capacitor. can.
  • the exterior body may contain a filler.
  • the filler content in the exterior body may be 70% by mass or more and 90% by mass or less based on the entire exterior body. When the content is 70% by mass or more, it becomes easy to adjust the radius of curvature of the R chamfer of each end face so as to be suitable for suppressing deterioration of ESR characteristics. When the content is 90% by mass or less, it becomes possible to quickly form R chamfers on each end face.
  • Examples of fillers include silica (such as fused silica), talc, calcium carbonate, aluminum oxide, and the like.
  • the elastic modulus of the exterior body at 25° C. may be 10 GPa or more and 30 GPa or less.
  • the elastic modulus is 10 GPa or more, it becomes easy to adjust the radius of curvature of the R chamfer of each end face so as to be suitable for suppressing deterioration of ESR characteristics.
  • the modulus of elasticity is 30 GPa or less, it becomes possible to quickly form an R chamfer on each end face.
  • the solid electrolytic capacitor 100 of this embodiment is a solid electrolytic capacitor of a so-called end face current collector type (a type in which the end of each capacitor element is exposed from the exterior body and the exposed part is electrically connected to an external electrode). However, it is not limited to this. As shown in FIGS. 1 and 2, the solid electrolytic capacitor 100 includes a plurality of capacitor elements 10, an exterior body 14, a first external electrode 21, and a second external electrode 22.
  • Each of the plurality of capacitor elements 10 has an anode part 3, a cathode part 6, and an insulating part 12 provided between the anode part 3 and the cathode part 6 and electrically insulating them.
  • the plurality of capacitor elements 10 are stacked on each other.
  • the plurality of capacitor elements 10 are stacked on a substrate 17 (described later) included in the exterior body 14. In this embodiment, the plurality of capacitor elements 10 are all stacked in the same direction, but the invention is not limited to this.
  • the anode section 3 is composed of an anode body made of a valve metal.
  • the anode portion 3 is, for example, an anode foil.
  • the anode part 3 has a porous part 5 on its surface, and a dielectric layer (not shown) is formed on at least a part of the surface of the porous part 5.
  • Cathode section 6 covers at least a portion of the dielectric layer.
  • Each capacitor element 10 has an anode portion 3 exposed at one end (first end) 1A without being covered with a cathode portion 6.
  • the other end (second end) 2A of each capacitor element 10 is covered with a cathode section 6.
  • a portion of the anode portion 3 covered with the cathode portion 6 (in particular, the solid electrolyte layer 7) is referred to as a second portion 2, and the other portion is referred to as a first portion 1.
  • the end of the first portion 1 is a first end 1A
  • the end of the second portion 2 is a second end 2A.
  • the second portion 2 includes a core portion 4 and a porous portion 5 formed on the surface of the core portion 4.
  • the first portion 1 may or may not have a porous portion on its surface.
  • the dielectric layer is formed at least along the surface of the porous portion 5 formed in the second portion 2 .
  • the cathode section 6 includes a solid electrolyte layer 7 that covers at least a portion of the dielectric layer, and a cathode extraction layer 19 that covers at least a portion of the solid electrolyte layer 7.
  • the cathode extraction layer 19 may include, for example, a carbon layer 8 that covers at least a portion of the solid electrolyte layer 7 and a metal foil 20 that covers at least a portion of the carbon layer 8.
  • the metal foil 20 is interposed between the second portions 2 of adjacent capacitor elements 10 in the stacking direction.
  • the metal foil 20 constitutes a part of the cathode portion 6 of the capacitor element 10, and is shared between adjacent capacitor elements 10 in the stacking direction.
  • a conductive adhesive layer 9 may be interposed between the metal foil 20 and the carbon layer 8.
  • a conductive adhesive is used for the adhesive layer 9.
  • Adhesive layer 9 contains silver, for example.
  • the exterior body 14 has a first end surface 14a where the anode section 3 is exposed and a second end surface 14b where the cathode section 6 (specifically, the metal foil 20 of the cathode section 6) is exposed, and has a plurality of capacitor elements 10. Seal.
  • the exterior body 14 is formed into a substantially rectangular parallelepiped shape, and the solid electrolytic capacitor 100 also has a substantially rectangular parallelepiped shape.
  • the exterior body 14 includes a resin composition that seals the plurality of capacitor elements 10, and a substrate 17 on which the plurality of capacitor elements 10 are laminated.
  • the exterior body 14 contains filler in an amount of 70% by mass or more and 90% by mass or less based on the entire body.
  • the elastic modulus of the exterior body 14 at 25° C. is 10 GPa or more and 30 GPa or less.
  • the first external electrode 21 is provided so as to cover the first end surface 14a of the exterior body 14.
  • the first external electrode 21 includes a first conductive paste layer 21A and is electrically connected to the anode section 3.
  • a first plating layer 15 is formed on the end surface of the anode section 3 so as to cover it.
  • An electroless Ag plating layer 18 is formed between the first end surface 14a and the first external electrode 21.
  • the electroless Ag plating layer 18 covers the entire first end surface 14a.
  • the first external electrode 21 is electrically connected to the end surface of the metal foil 20 of the cathode portion 6 via the electroless Ag plating layer 18 and the first plating layer 15 .
  • the first external electrode 21 includes, for example, a first conductive paste layer 21A such as a silver paste layer, and a Ni/Sn plating layer 21B covering the first conductive paste layer 21A.
  • the second external electrode 22 is provided to cover the second end surface 14b of the exterior body 14.
  • the second external electrode 22 includes a second conductive paste layer 22A and is electrically connected to the cathode section 6.
  • a first plating layer 15 is formed on the end surface of the metal foil 20 so as to cover it.
  • An electroless Ag plating layer 18 is formed between the second end surface 14b and the second external electrode 22.
  • the electroless Ag plating layer 18 covers the entire second end surface 14b.
  • the second external electrode 22 is electrically connected to the end surface of the metal foil 20 of the cathode portion 6 via the electroless Ag plating layer 18 and the first plating layer 15 .
  • the second external electrode 22 includes, for example, a second conductive paste layer 22A such as a silver paste layer, and a Ni/Sn plating layer 22B covering the second conductive paste layer 22A.
  • the first plating layer 15 includes, for example, at least an electroless Ni plating layer.
  • the first plating layer 15 may include, for example, an electroless Ni plating layer and an electroless Ag plating layer covering the electroless Ni plating layer.
  • the electroless Ag plating layer constituting the first plating layer 15 may have a different composition from the electroless Ag plating layer 18.
  • the illustrated example shows a case where the first plating layer 15 is formed, the present invention is not limited to this, and the first plating layer 15 may not be formed.
  • a metal particle layer for example, a Cu particle layer
  • the peripheral edge of the first end face 14a and the peripheral edge of the second end face 14b are each rounded.
  • the maximum radius of curvature of the R chamfer of the first end surface 14a is 1.0 times or more and 1.1 times or less of the minimum radius of curvature of the R chamfer of the first end surface 14a.
  • the maximum radius of curvature of the R chamfer of the second end surface 14b is 1.0 times or more and 1.1 times or less the minimum radius of curvature of the R chamfer of the second end surface 14b.
  • the maximum radius of curvature of the R chamfer of the first end surface 14a is 0.95 times or more and 1.05 times or less of the maximum radius of curvature of the R chamfer of the second end surface 14b.
  • the minimum radius of curvature of the R chamfer of the first end surface 14a is 0.95 times or more and 1.05 times or less of the minimum radius of curvature of the R chamfer of the second end surface 14b.
  • the maximum radius of curvature of the R chamfer of each of the first end surface 14a and the second end surface 14b is 0.02 mm or more and 0.24 mm or less.
  • the maximum radius of curvature of the R chamfer of each of the first end surface 14a and the second end surface 14b is 0.0025D or more and 0.033D or less.
  • the thickness of the first conductive paste layer 21A is 10 ⁇ m or more at the portion where the radius of curvature of the R chamfer on the first end face 14a is the smallest.
  • the thickness of the second conductive paste layer 22A is 10 ⁇ m or more at the portion where the radius of curvature of the R chamfer on the second end face 14b is the smallest.
  • the maximum radius of curvature of the R chamfer of the first end face is 0.95 times or more and 1.05 times or less of the maximum radius of curvature of the R chamfer of the second end face, described in any one of Techniques 1 to 3. solid electrolytic capacitor.
  • the minimum radius of curvature of the R-chamfer of the first end face is 0.95 times or more and 1.05 times or less of the minimum radius of curvature of the R-chamfer of the second end face, described in any one of Techniques 1 to 4. solid electrolytic capacitor.
  • the exterior body includes a filler, The solid electrolytic capacitor according to any one of Techniques 1 to 8, wherein the content of the filler in the exterior body is 70% by mass or more and 90% by mass or less based on the entire exterior body.
  • the present disclosure can be used for solid electrolytic capacitors.

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PCT/JP2023/025549 2022-08-04 2023-07-11 固体電解コンデンサ Ceased WO2024029284A1 (ja)

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CN202380055588.8A CN119585828A (zh) 2022-08-04 2023-07-11 固体电解电容器
JP2024538889A JPWO2024029284A1 (https=) 2022-08-04 2023-07-11
US19/004,024 US20250149257A1 (en) 2022-08-04 2024-12-27 Solid electrolytic capacitor

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001332457A (ja) * 2000-05-23 2001-11-30 Nichicon Corp 固体電解コンデンサ
WO2021049056A1 (ja) * 2019-09-11 2021-03-18 株式会社村田製作所 電解コンデンサ
JP2021192407A (ja) * 2020-06-05 2021-12-16 パナソニックＩｐマネジメント株式会社 金属皮膜の製造方法、固体電解コンデンサの製造方法、及び固体電解コンデンサ

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001332457A (ja) * 2000-05-23 2001-11-30 Nichicon Corp 固体電解コンデンサ
WO2021049056A1 (ja) * 2019-09-11 2021-03-18 株式会社村田製作所 電解コンデンサ
JP2021192407A (ja) * 2020-06-05 2021-12-16 パナソニックＩｐマネジメント株式会社 金属皮膜の製造方法、固体電解コンデンサの製造方法、及び固体電解コンデンサ

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