WO2024028931A1 - Dispositif de détection de quantité physique - Google Patents

Dispositif de détection de quantité physique Download PDF

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Publication number
WO2024028931A1
WO2024028931A1 PCT/JP2022/029443 JP2022029443W WO2024028931A1 WO 2024028931 A1 WO2024028931 A1 WO 2024028931A1 JP 2022029443 W JP2022029443 W JP 2022029443W WO 2024028931 A1 WO2024028931 A1 WO 2024028931A1
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WO
WIPO (PCT)
Prior art keywords
lead frame
physical quantity
detection device
quantity detection
passage
Prior art date
Application number
PCT/JP2022/029443
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English (en)
Japanese (ja)
Inventor
憲 石橋
孝之 余語
瑞紀 芝田
和宏 太田
保夫 小野瀬
Original Assignee
日立Astemo株式会社
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Application filed by 日立Astemo株式会社 filed Critical 日立Astemo株式会社
Priority to PCT/JP2022/029443 priority Critical patent/WO2024028931A1/fr
Publication of WO2024028931A1 publication Critical patent/WO2024028931A1/fr

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
    • G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow

Definitions

  • the present invention relates to a physical quantity detection device.
  • a physical quantity sensor for measuring the flow rate of air flowing into an internal combustion engine has a structure in which a semiconductor chip is provided with a diaphragm having a detection element for measuring air flow rate, and the periphery of the element is sealed with resin while the diaphragm is exposed.
  • Patent Document 1 discloses a physical quantity detection device in which a physical quantity sensor is mounted on a lead frame.
  • Patent Document 1 has a structure in which the opening of the ventilation hole is larger than the area of the diaphragm, and the influence of the diaphragm on detection accuracy is reduced.
  • An object of the present invention is to provide a physical quantity detection device that can reduce warpage of a diaphragm and reduce fluctuations in flow characteristics.
  • a physical quantity detection device is a physical quantity detection device that detects a physical quantity of a gas to be measured flowing through a passage provided in a housing, and includes a diaphragm and a rectangular element mounted with the diaphragm,
  • the lead frame includes a physical quantity sensor that detects a flow rate, which is a physical quantity, of the gas to be measured flowing through the passage, and a lead frame on which the physical quantity sensor is mounted, and the lead frame includes an overlapping portion from a portion where the lead frame overlaps the element. An edge separating the non-contact portion is formed in a range projected onto at least one side of the element.
  • warpage of the diaphragm can be reduced, and fluctuations in flow characteristics can be reduced.
  • FIG. 1 is a system diagram of an internal combustion engine control system equipped with a physical quantity detection device according to a first embodiment.
  • FIG. 2A is a front view of the physical quantity detection device according to the first embodiment.
  • FIG. 2B is a right side view of the physical quantity detection device according to the first embodiment.
  • FIG. 2C is a rear view of the physical quantity detection device according to the first embodiment.
  • FIG. 2D is a left side view of the physical quantity detection device according to the first embodiment.
  • FIG. 2E is a plan view of the physical quantity detection device according to the first embodiment.
  • FIG. 2F is a bottom view of the physical quantity detection device according to the first embodiment.
  • FIG. 3A is a cross-sectional view taken along line AA in FIG. 2D.
  • FIG. 3B is a sectional view taken along line BB in FIG. 2A.
  • FIG. 3C is a sectional view taken along line CC in FIG. 2C.
  • FIG. 4A is a front view of the housing with the cover removed according to the first embodiment.
  • FIG. 4B is a sectional view taken along line DD in FIG. 4A.
  • FIG. 5A is a front view of a circuit board on which the chip package and circuit components according to the first embodiment are mounted.
  • FIG. 5B is a cross-sectional view taken along line EE in FIG. 5A.
  • FIG. 5C is a cross-sectional view taken along line FF in FIG. 5A.
  • FIG. 6A is a front view of the chip package according to the first embodiment.
  • FIG. 6B is a rear view of the chip package according to the first embodiment.
  • FIG. 6C is a left side view of the chip package according to the first embodiment.
  • FIG. 6D is a right side view of the chip package according to the first embodiment.
  • FIG. 6E is a bottom view of the chip package according to the first embodiment.
  • FIG. 6F is a perspective view of the chip package according to the first embodiment.
  • FIG. 7A is a perspective view of the lead frame according to the first embodiment.
  • FIG. 7B is a plan view of the diaphragm and the diaphragm around the element according to the first embodiment.
  • FIG. 7C is an enlarged view of section A in FIG. 7B.
  • FIG. 8A is a plan view of a lead frame including bonding wires according to the first embodiment.
  • FIG. 8B is a sectional view taken along line GG in FIG. 8A.
  • FIG. 9 is a perspective view of a conventional lead frame.
  • FIG. 10A is a diagram showing thermal stress analysis results of a conventional physical quantity detection device, and shows the stress analysis results in a side cross section taken along line GG in FIG. 8A.
  • FIG. 10B is a diagram showing the thermal stress analysis results of the conventional physical quantity detection device, and is a partially enlarged view of the stress analysis results in a front cross section perpendicular to the side cross section of FIG. 10A.
  • FIG. 11 is a comparison diagram of the amount of warpage of the diaphragm of the first embodiment and the conventional technology after a high temperature durability test.
  • FIG. 10A is a diagram showing thermal stress analysis results of a conventional physical quantity detection device, and shows the stress analysis results in a side cross section taken along line GG in FIG. 8A.
  • FIG. 10B is a diagram showing the thermal stress analysis results of the conventional physical quantity detection device, and
  • FIG. 12A is a plan view of a lead frame according to a modification of the first embodiment.
  • FIG. 12B shows three types of cross-sectional views taken along line HH in FIG. 12A.
  • FIG. 13 is a plan view of a lead frame according to the second embodiment.
  • FIG. 14 is a plan view of a lead frame according to the third embodiment.
  • FIG. 15 is a plan view of a lead frame according to the fourth embodiment.
  • FIG. 16A is a plan view of the lead frame according to the fifth embodiment.
  • FIG. 16B is a sectional view taken along line II in FIG. 16A.
  • FIG. 17A is a plan view of a lead frame according to the sixth embodiment.
  • FIG. 17B is a sectional view taken along line JJ in FIG. 17A.
  • FIG. 1 is a system diagram of an internal combustion engine control system 1 equipped with a physical quantity detection device 20 according to the present embodiment.
  • An example in which a physical quantity detection device 20 is used in the electronic fuel injection type internal combustion engine control system 1 is shown.
  • intake air is taken in from an air cleaner 21 as a gas to be measured 2, and is passed through a main passage 22, for example, an intake body, a throttle body 23, and an intake manifold 24. and into the combustion chamber of the engine cylinder 11.
  • the physical quantity of the measured gas 2, which is the intake air guided into the combustion chamber, is detected by the physical quantity detection device 20, and based on the detected physical quantity, fuel is supplied from the fuel injection valve 14, and the mixture is mixed with the measured gas 2. is guided into the combustion chamber in this state.
  • the fuel injection valve 14 is provided at the intake port of the internal combustion engine 10, and the fuel injected into the intake port forms an air-fuel mixture with the gas to be measured 2, which is guided to the combustion chamber via the intake valve 15 and combusted. to generate mechanical energy.
  • the fuel and the air, which is the gas to be measured 2 introduced into the combustion chamber are in a mixed state of fuel and air, and are combusted explosively by the spark ignition of the spark plug 13, generating mechanical energy.
  • the gas after combustion is guided from the exhaust valve 16 to the exhaust pipe, and is discharged from the exhaust pipe as exhaust gas 3 to the outside of the vehicle.
  • the flow rate of the measured gas 2, which is the intake air guided into the combustion chamber, is controlled by a throttle valve 25 whose opening degree changes based on the operation of the accelerator pedal.
  • the amount of fuel supplied is controlled based on the flow rate of intake air guided to the combustion chamber, and the driver controls the opening degree of the throttle valve 25 to control the flow rate of intake air guided to the combustion chamber. controls the mechanical energy generated.
  • a signal is input to the control device 4.
  • the output of a throttle angle sensor 26 that measures the opening degree of the throttle valve 25 is input to the control device 4, and furthermore, the position and state of the engine piston 12, intake valve 15, and exhaust valve 16 of the internal combustion engine 10 are inputted to the control device 4.
  • the output of the rotation angle sensor 17 is input to the control device 4 in order to measure the rotation speed of the rotation angle sensor 17 .
  • the output of the oxygen sensor 28 is input to the control device 4 in order to measure the state of the mixture ratio between the amount of fuel and the amount of air based on the state of the exhaust gas 3.
  • the control device 4 calculates the fuel injection amount and ignition timing based on the physical quantity of the intake air, which is the output of the physical quantity detection device 20, and the rotational speed of the internal combustion engine 10, which is measured based on the output of the rotation angle sensor 17. do. Based on these calculation results, the amount of fuel supplied from the fuel injection valve 14 or the ignition timing ignited by the spark plug 13 is controlled.
  • the fuel supply amount and ignition timing are actually determined based on changes in the temperature and throttle angle detected by the physical quantity detection device 20, changes in engine speed, and air-fuel ratio measured by the oxygen sensor 28. Finely controlled.
  • the control device 4 further controls the amount of air bypassing the throttle valve 25 using the idle air control valve 27 when the internal combustion engine 10 is in an idling operating state, and controls the rotational speed of the internal combustion engine 10 in the idling operating state.
  • the fuel supply amount and ignition timing which are the main control variables of the internal combustion engine 10, are both calculated using the output of the physical quantity detection device 20 as the main parameter. Therefore, improving the detection accuracy, suppressing changes over time, and improving the reliability of the physical quantity detection device 20 are important for improving the control accuracy and ensuring reliability of the vehicle.
  • a vehicle equipped with the physical quantity detection device 20 is used in an environment with large changes in temperature and humidity. It is desirable for the physical quantity detection device 20 to take into account measures such as changes in temperature and humidity in the environment in which it is used, as well as measures against dust and pollutants.
  • the physical quantity detection device 20 is attached to an intake pipe that is affected by heat generation from the internal combustion engine 10. Therefore, heat generated by the internal combustion engine 10 is transmitted to the physical quantity detection device 20 via the intake pipe, which is the main passage 22. Since the physical quantity detection device 20 detects the flow rate of the gas to be measured 2 by performing heat transfer with the gas to be measured 2, it is important to suppress the influence of heat from the outside as much as possible.
  • the physical quantity detection device 20 mounted on the vehicle merely solves the problems described in the column of problems to be solved by the invention and produces the effects described in the column of effects of the invention. Rather, as will be explained below, the various problems mentioned above have been fully taken into consideration, and the various problems required as a product have been solved, and various effects have been achieved. The specific problems solved by the physical quantity detection device 20 and the specific effects produced will be explained in the following description.
  • the physical quantity detection device 20 is used by being inserted into the main passage 22 through a mounting hole provided in the passage wall of the main passage 22.
  • the physical quantity detection device 20 includes a housing 201 and a cover 202 attached to the housing 201.
  • the housing 201 is constructed by injection molding a synthetic resin material.
  • the cover 202 is made of a plate-like member made of a conductive material such as an aluminum alloy.
  • the cover 202 is made of a press-formed aluminum alloy.
  • the cover 202 is formed into a thin plate shape and has a wide flat cooling surface.
  • the housing 201 includes a flange 211 for fixing the physical quantity detection device 20 to the intake body, which is the main passage 22, and a connector that protrudes from the flange 211 and is exposed to the outside from the intake body for electrical connection with external equipment. 212 , and a measuring portion 213 extending so as to protrude from the flange 211 toward the center of the main passage 22 .
  • the measurement part 213 has a thin and long shape extending from the flange 211 toward the center of the main passage 22, and has a wide front face 221, a wide back face 222, and a pair of narrow side faces 223 and 224.
  • the measurement unit 213 protrudes from the inner wall of the main passage 22 toward the center of the main passage 22 with the physical quantity detection device 20 attached to the main passage 22 .
  • the front surface 221 and the rear surface 222 are arranged parallel to each other along the central axis of the main passage 22.
  • the side surface 223 on one side in the transverse direction of the measurement section 213 is disposed opposite to each other on the upstream side of the main passage 22.
  • a side surface 224 on the other side in the lateral direction of the measuring section 213 is disposed opposite to the downstream side of the main passage 22 .
  • the lower surface 226 is the tip of the measurement section 213 with the physical quantity detection device 20 attached to the main passage 22 .
  • a sub-passage entrance 231 is provided at the tip of the measuring section 213 extending from the flange 211 toward the center of the main passage 22. Therefore, the physical quantity detection device 20 can take in the gas to be measured 2 not near the inner wall surface of the main passage 22 but in a portion near the center away from the inner wall surface into the sub passage 234 (see FIG. 4B).
  • the physical quantity detection device 20 detects a physical quantity in a sub passage 234 as a passage. Therefore, the physical quantity detection device 20 can measure the flow rate of gas in a portion away from the inner wall surface of the main passage 22, and can suppress a decrease in measurement accuracy due to the influence of heat or the like.
  • the vicinity of the inner wall surface of the main passage 22 is easily influenced by the temperature of the main passage 22, and the temperature of the gas to be measured 2 is different from the original temperature. Therefore, the temperature of the gas to be measured 2 near the inner wall surface of the main passage 22 is different from the average temperature inside the main passage 22.
  • the temperature of the gas to be measured 2 near the inner wall surface of the main passage 22 is maintained at a high temperature due to the influence of heat from the internal combustion engine 10.
  • the temperature of the gas to be measured 2 near the inner wall surface of the main passage 22 is often higher than the original temperature of the main passage 22, which becomes a factor that reduces measurement accuracy.
  • a sub-passage entrance 231 is provided at the tip of a thin and long measuring section 213 extending from the flange 211 toward the center of the main passage 22. Therefore, the physical quantity detection device 20 can reduce measurement errors related to a decrease in flow velocity near the inner wall surface.
  • the sub-passage entrance 231 provided at the tip of the measuring section 213 extending from the flange 211 toward the center of the main passage 22, but also the first outlet 232 and second outlet 233 of the sub-passage 234 are provided at the measuring section. It is provided at the tip of 213. Therefore, the physical quantity detection device 20 can further reduce measurement errors.
  • the measurement unit 213 of the physical quantity detection device 20 has a shape that extends long along an axis extending from the outer wall of the main passage 22 toward the center.
  • the widths of the side surfaces 223 and 224 are narrow, as shown in FIGS. 2B and 2D. Thereby, the physical quantity detection device 20 can suppress the fluid resistance against the gas to be measured 2 to a small value.
  • the physical quantity detection device 20 includes an intake air temperature sensor 203, which is a temperature detection section, in a measurement section 213.
  • the intake air temperature sensor 203 is arranged in a space near the sub-passage entrance 231. Specifically, the intake air temperature sensor 203 is disposed in the middle of a temperature detection passage that opens on the back surface 222 of the measurement section 213.
  • the temperature detection passage is constituted by a housing 201 and a cover 202.
  • the intake air temperature sensor 203 is disposed in the middle of a temperature detection passage formed by the housing 201 and the cover 202 and does not protrude to the outside. Therefore, it is possible to prevent the intake air temperature sensor 203 from coming into direct contact with other objects and being damaged during transportation or installation of the physical quantity detection device 20.
  • the intake air temperature sensor 203 is arranged upstream of the measurement section 213. Therefore, the gas to be measured 2 flowing straight from the outside hits the measurement unit 213 first and can directly hit the intake air temperature sensor 203 without being affected by temperature or the like. Therefore, the heat dissipation of the intake air temperature sensor 203 can be improved.
  • the measurement section 213 of the physical quantity detection device 20 is inserted into the interior through a mounting hole provided in the main passage 22 .
  • the flange 211 of the physical quantity detection device 20 is brought into contact with the main passage 22 and fixed to the main passage 22 with a screw.
  • the flange 211 has a substantially rectangular shape in plan view and has a predetermined thickness.
  • the flange 211 is provided with a pair of fixing holes 241 at diagonal corners.
  • the fixing hole portion 241 has a through hole 242 that passes through the flange 211.
  • the flange 211 is fixed to the main passage 22 by inserting a fixing screw (not shown) into the through hole 242 of the fixing hole portion 241 and screwing it into the screw hole of the main passage 22.
  • the connector 212 is provided with four external terminals and a correction terminal inside thereof.
  • the external terminal is a terminal for outputting physical quantities, such as flow rate and temperature, which are measurement results of the physical quantity detection device 20, and a power supply terminal for supplying DC power for operating the physical quantity detection device 20.
  • the correction terminal is a terminal used to obtain a correction value regarding the physical quantity detection device 20 and store the correction value in a memory inside the physical quantity detection device 20. In the subsequent measurement operation of the physical quantity detection device 20, the correction data representing the correction value stored in the memory described above is used, and this correction terminal is not used.
  • the correction terminal has a different shape from the external terminal so that the correction terminal does not interfere with the connection between the external terminal and other external devices.
  • the correction terminal has a shorter shape than the external terminal. Even if a connection terminal of an external device to be connected to the external terminal is inserted into the connector 212, it does not interfere with the connection.
  • FIG. 3A is a sectional view taken along line AA in FIG. 2D
  • FIG. 3B is a sectional view taken along line BB in FIG. 2A
  • FIG. 3C is a sectional view taken along line CC in FIG.
  • a front view of the housing 201 shown in FIG. 4B is a sectional view taken along the line DD in FIG. 4A.
  • the housing 201 is provided with a sub passage groove 250 for forming the sub passage 234 and a circuit chamber for accommodating the circuit board 207.
  • the circuit chamber and the sub passage groove 250 are recessed in the front of the measurement section 213.
  • the circuit chamber is provided in a region on one side in the lateral direction (side surface 223 side), which is a position on the upstream side in the flow direction of the gas to be measured 2 in the main passage 22 .
  • the sub passage groove 250 is located in a region closer to the longitudinal end of the measuring section 213 (lower surface 226 side) than the circuit chamber and downstream in the flow direction of the gas to be measured 2 in the main passage 22 than the circuit chamber. It is provided over the area on the other side in the lateral direction (side surface 224 side).
  • the sub passage groove 250 forms a sub passage 234 in cooperation with the cover 202.
  • the sub passage groove 250 has a first sub passage groove 251 and a second sub passage groove 252 that branches in the middle of the first sub passage groove 251 .
  • the first sub-passage groove 251 extends between a sub-passage entrance 231 that opens on one side surface 223 of the measurement section 213 and a first outlet 232 that opens on the other side surface 224 of the measurement section 213. It is formed to extend along the lateral direction of the measuring section 213.
  • the first sub-passage groove 251 constitutes a first sub-passage that takes in the measured gas 2 flowing in the main passage 22 from the sub-passage entrance 231 and returns the taken-in measured gas 2 to the main passage 22 from the first outlet 232. do.
  • the first sub-passage extends from the sub-passage entrance 231 along the flow direction of the gas to be measured 2 in the main passage 22, and is connected to the first outlet 232.
  • the second auxiliary passage groove 252 branches at a midway position of the first auxiliary passage groove 251 and is bent toward the proximal end side (flange side) of the measuring section 213, and extends along the longitudinal direction of the measuring section 213. Exists. Then, at the proximal end of the measuring section 213, it bends toward the other side in the transverse direction (side surface 224 side) of the measuring section 213, makes a U-turn toward the distal end of the measuring section 213, and returns to the longitudinal direction of the measuring section 213. extending along. It is bent toward the other side in the lateral direction of the measurement section 213 before the first exit 232 and is provided so as to be continuous with the second exit 233 that opens on the other side surface 224 of the measurement section 213. .
  • the second outlets 233 are arranged facing each other toward the downstream side in the flow direction of the gas to be measured 2 in the main passage 22 .
  • the second outlet 233 has an opening area approximately equal to or slightly larger than that of the first outlet 232, and is formed at a position closer to the proximal end of the measuring section 213 than the first outlet 232 is.
  • the second auxiliary passage groove 252 constitutes a second auxiliary passage through which the gas to be measured 2 that has branched from the first auxiliary passage and flowed therethrough is returned to the main passage 22 from the second outlet 233.
  • the second sub-path has a path that reciprocates along the longitudinal direction of the measuring section 213.
  • the second sub-passage is divided into a separation passage section that branches in the middle of the first sub-passage and extends toward the proximal end of the measurement section 213 (in a direction away from the first sub-passage), and a separation passage section that branches off in the middle of the first sub-passage.
  • the approach passage portion is connected to a second outlet 233 that is disposed downstream of the sub-passage inlet 231 in the flow direction of the gas to be measured 2 in the main passage 22 and facing toward the downstream side in the flow direction of the gas to be measured 2 .
  • a flow rate sensor (flow rate detection unit) 205 is disposed in the middle of the second sub-passage.
  • the second sub-path is formed to extend along the longitudinal direction of the measuring section 213 and reciprocate. Therefore, it is possible to ensure a longer passage length of the second sub-passage, and when pulsation occurs in the main passage, the influence on the flow rate sensor 205 can be reduced.
  • the physical quantity detection device 20 can be provided with the sub passage 234 having a sufficient length. Therefore, the physical quantity detection device 20 can suppress the fluid resistance to a small value and can measure the physical quantity of the gas to be measured 2 with high accuracy.
  • the first sub-passage is provided to extend from the sub-passage entrance 231 to the first exit 232 along the lateral direction of the measuring section 213. Therefore, foreign matter such as dust that has entered the first sub-passage from the sub-passage entrance 231 can be directly discharged from the first outlet 232. Therefore, it is possible to prevent foreign matter from entering the second sub-path and to prevent it from affecting the flow rate sensor 205 in the second sub-path.
  • the sub-passage inlet 231 has a larger opening area than the first outlet 232.
  • the opening area of the sub-passage entrance 231 larger than that of the first outlet 232, the gas to be measured 2 that has flowed into the first sub-passage is reliably delivered to the second sub-passage which branches off in the middle of the first sub-passage. can lead to.
  • the cover 202 is made of a metal conductive material such as an aluminum alloy or a stainless steel alloy.
  • the cover 202 has a flat plate shape that covers the front surface of the measurement section 213, and is fixed to the measurement section 213 with an adhesive.
  • the cover 202 covers the circuit chamber of the measurement section 213 and forms a sub-passage 234 in cooperation with the sub-passage groove 250 of the measurement section 213.
  • the cover 202 is electrically connected to the ground by interposing a conductive intermediate member between it and a predetermined connector terminal 214, and has a static eliminating function.
  • the cover 202 is not limited to being made of metal, and may be made of, for example, a conductive resin material.
  • the cover 202 constitutes a part of the sub passage 234.
  • the dust that has flowed into the sub passage 234 together with the gas to be measured 2 passes along the back surface of the cover 202 .
  • Cover 202 has a fixed potential. Therefore, dust passing through the back surface of the cover 202 is neutralized, and adhesion of dust to the flow rate sensor 205 can be suppressed, thereby improving stain resistance.
  • the cover 202 constitutes the auxiliary passage 234 and is a necessary component regardless of whether or not static electricity is removed, so no additional parts are required for static electricity removal.
  • FIG. 5A is a front view of the circuit board 207 on which the chip package 208 and circuit components are mounted
  • FIG. 5B is a cross-sectional view taken along line EE in FIG. 5
  • FIG. 5C is a cross-sectional view taken along line FF in FIG. 5A. .
  • the circuit board 207 is made of, for example, a printed circuit board made of glass epoxy (glass epoxy board), and has a rectangular shape extending along the longitudinal direction of the measurement section 213. A notch is provided at the center of the circuit board 207 in the longitudinal direction.
  • the chip package 208 is attached to the circuit board 207 with a portion of the chip package 208 housed in the notch.
  • the chip package 208 is mounted so that a portion thereof protrudes from the edge of the circuit board 207.
  • the chip package 208 is fixed to the circuit board 207 at a central position in the longitudinal direction of the circuit board 207 in a state of protruding laterally from an end along the width direction of the circuit board 207.
  • the chip package 208 has a base end portion fixed at a position offset to one side in the lateral direction at a central position in the longitudinal direction of the circuit board 207 .
  • the chip package 208 has a tip portion located at a position protruding from the circuit board 207 along the width direction.
  • a flow rate sensor 205 is provided at the tip of the chip package 208 .
  • the flow rate sensor 205 is arranged within the second sub passage groove 252.
  • the chip package 208 has a base end fixed to the circuit board 207 by soldering, and a distal end edge fixed to the housing 201 by molding.
  • An intake air temperature sensor 203 is attached to the circuit board 207. As shown in FIG. 5A, the intake air temperature sensor 203 is arranged to protrude from the other longitudinal end of the circuit board 207 along the longitudinal direction.
  • the intake air temperature sensor 203 is constituted by an axial lead component having a cylindrical sensor body and a pair of leads protruding from both axial ends of the sensor body in a direction away from each other.
  • the intake air temperature sensor 203 is mounted on a circuit board 207 in the measurement section 213 via a lead, and the sensor body is arranged in the temperature detection passage in a direction perpendicular to the flow direction of the gas 2 to be measured.
  • a pair of leads of the intake air temperature sensor 203 are bent along the surface of the circuit board 207 and protrude from the other longitudinal end of the circuit board 207.
  • a solder pad is provided on the surface of the circuit board 207 facing the pair of leads, and is soldered to the leads.
  • the sensor body is supported at a position a predetermined distance away from the circuit board 207.
  • a chip package 208 As shown in FIG. 5A, a chip package 208, a pressure sensor 204, and a temperature/humidity sensor 206 are mounted on the circuit board 207.
  • the chip package 208 is provided with a plurality of connecting terminals protruding from the base end of the package body. Chip package 208 is fixed to circuit board 207 by connecting these connection terminals to pads on circuit board 207 with solder.
  • a flow rate sensor 205 and an LSI 210 which is an electronic component that drives the flow rate sensor 205, are mounted on the chip package 208.
  • the flow rate sensor 205 is provided at the tip of the package body.
  • the chip package 208 constitutes a support body on which a semiconductor element having a flow rate sensor 205 and an LSI 210 which is a processing section are mounted.
  • the package surface portion which is one side in the thickness direction of the chip package 208, is located on the back side of the circuit board 207, that is, on the side facing the cover 202. , a chip package 208 is attached to a circuit board 207. Therefore, the flow rate sensor 205 can be placed facing the cover 202, which is a conductive member, and the static electricity of the gas to be measured 2 flowing to the flow rate sensor 205 can be eliminated. This static elimination prevents the dust contained in the gas to be measured 2 from being charged, and the adsorption force of the charge prevents dust from accumulating on the flow rate sensor 205 and its surroundings, thus maintaining high detection accuracy of the flow rate sensor 205. can do.
  • the pressure sensor 204 is mounted on one side in the longitudinal direction of the circuit board 207 rather than the chip package 208.
  • the temperature/humidity sensor 206 is mounted on the other side in the longitudinal direction of the circuit board 207 than the chip package 208 .
  • the lead of the intake air temperature sensor 203 is connected to the surface of the circuit board 207.
  • the intake air temperature sensor 203 has a lead connected to a position on the other longitudinal side of the circuit board 207 than the temperature/humidity sensor 206 .
  • the sensor body of the intake air temperature sensor 203 is mounted so as to protrude from the circuit board 207 in the longitudinal direction.
  • the measuring section 213 includes (1) a pressure sensor 204, (2) a flow rate sensor 205, (1) a pressure sensor 204, (2) a flow rate sensor 205, 3) temperature/humidity sensor 206 and (4) intake air temperature sensor 203 are arranged in this order.
  • Pressure sensor 204 detects the pressure of gas 2 to be measured.
  • the flow rate sensor 205 detects the flow rate of the gas 2 to be measured.
  • the temperature/humidity sensor 206 detects the humidity of the gas 2 to be measured.
  • the intake air temperature sensor 203 detects the temperature of the gas 2 to be measured.
  • the physical quantity detection device 20 is placed, for example, in the engine room of an automobile.
  • the temperature in the engine room is 60°C to 100°C, and the temperature of the gas 2 to be measured passing through the main passage 22 is 25°C on average. Therefore, the heat in the engine room is transferred to the physical quantity detection device 20 from the flange 211 side. In the temperature distribution of the transferred heat, the temperature gradually decreases as it moves from the flange 211 side toward the tip end side of the measurement section 213.
  • the (1) pressure sensor 204 which has the least thermal influence, is placed on the proximal end side.
  • (2) the flow rate sensor 205 which has a small thermal effect on the high temperature side, is arranged closer to the tip end of the measurement unit 213 than (1) the pressure sensor 204.
  • (3) the temperature/humidity sensor 206 which is on the low temperature side and has a small thermal effect, is arranged closer to the tip end of the measuring section 213 than (2) the flow rate sensor 205.
  • the intake air temperature sensor 203 (4) which is most susceptible to thermal effects, is arranged at the tip of the measurement section 213.
  • a circuit board 207 is arranged to extend along the longitudinal direction of the measurement section 213. Therefore, the heat conduction distance from the flange 211 can be ensured up to the vicinity of the central axis of the main passage 22.
  • the sensors (1) to (4) are arranged in order of decreasing thermal influence from the base end to the distal end of the measurement unit 213. Therefore, the sensor performance of each sensor can be ensured. Further, by arranging the circuit board 207 on one side of the measuring section 213 in the transverse direction, thermal conductivity to air can be promoted.
  • FIG. 6A is a front view of the chip package 208
  • FIG. 6B is a rear view of the chip package 208
  • FIG. 6C is a left side view of the chip package 208
  • FIG. 6D is a right side view of the chip package 208
  • FIG. 6E is a A bottom view of the chip package 208
  • FIG. 6F is a perspective view of the chip package 208.
  • the chip package 208 has electronic components such as the LSI 210 and the flow rate sensor 205 mounted on a mounting surface 209a that is one surface of the lead frame 209.
  • the chip package 208 is molded (sealed) with mold resin (thermosetting resin).
  • the chip package 208 includes a resin-molded package body having a substantially flat plate shape, and a flow rate sensor 205, an LSI 210, and a lead frame 209 that are integrally molded with the package body (resin part).
  • the chip package 208 has a base end disposed on the side of the second sub passage groove 252 within the housing 201, and a base end that protrudes into the second sub passage groove 252 from the base end and extends inside the second sub passage groove 252. and a distal end portion extending across the passage width direction of the second sub passage groove 252.
  • the package body is rectangular.
  • the measuring portion 213 extends along the lateral direction, and a base end portion on one side in the longitudinal direction of the package body is disposed in the circuit chamber.
  • the other end of the package body in the longitudinal direction is disposed within the second sub-passage groove 252 .
  • a plurality of connection terminals 281 are provided protruding from the base end of the package body.
  • the chip package 208 is electrically connected to the circuit board 207 and fixed integrally by soldering the plurality of connection terminals 281 to the pads of the circuit board 207.
  • a flow rate sensor 205 is provided at the tip of the package body. The flow rate sensor 205 is exposed and disposed within the sub passage 234, with the circuit board 207 and the chip package 208 integrally fixed to the housing 201 (see, for example, FIG. 4A).
  • the flow rate sensor 205 is exposed to a passage surface portion 280 provided on the surface of the package body.
  • the passage surface portion 280 is formed over the entire width from one end in the lateral direction to the other end in the lateral direction of the package body so as to extend along the passage direction within the sub-path 234.
  • the flow rate sensor 205 has a diaphragm 301 exposed to the sub passage 234 and a space chamber formed between the diaphragm 301 and the lead frame 209.
  • a detection element is mounted on the diaphragm 301.
  • the space chamber is not connected to the outside of the housing 201. Since the spatial chamber is not connected to the outside and is completely sealed, the pressure inside the spatial chamber cannot be released. Therefore, the air in the space chamber expands or contracts depending on the temperature, deforming the diaphragm 301 of the flow rate sensor 205, and potentially affecting the measured value of the flow rate.
  • the space chamber is formed to be large enough that the measured value of the flow rate is not affected by expansion or contraction depending on the temperature of the air. Therefore, it is possible to prevent the diaphragm 301 of the flow rate sensor 205 from being deformed depending on the temperature of the air in the space, and the flow rate can be accurately measured by the flow rate sensor 205.
  • FIG. 7A is a perspective view of the lead frame according to this embodiment.
  • FIG. 7B is a plan view of the diaphragm and the diaphragm around the element according to this embodiment.
  • FIG. 7C is an enlarged view of section A in FIG. 7B.
  • the physical quantity detection device 20 detects the physical quantity of the gas to be measured 2 flowing through the sub passage 234.
  • the physical quantity detection device 20 includes a flow rate sensor 205, an LSI 210 that is an electronic component, a lead frame 209, and a chip package 208.
  • a sub passage 234 through which the gas to be measured 2 flows is formed in the housing 201.
  • the flow rate sensor 205 detects the flow rate, which is a physical quantity, of the gas to be measured 2 flowing through the sub passage 234 .
  • the flow rate sensor 205 includes a diaphragm 301 equipped with a detection element for detecting the flow rate of the gas 2 to be measured, and a rectangular element 302 equipped with the diaphragm 301.
  • the diaphragm 301 is a rectangular parallelepiped that is long in the width direction of the package body, which is the direction in which the passage surface portion 280 extends.
  • the flow rate sensor 205 is a rectangular parallelepiped.
  • the thickness of the flow rate sensor 205 is thicker than the thickness of the LSI 210.
  • the flow rate sensor 205 is driven by the LSI 210. A portion of the flow rate sensor 205 including the diaphragm 301 is exposed on the surface of a passage surface portion 280 that is a part of the sub passage 234 formed in the chip package 208 and through which the gas to be measured 2 flows.
  • the lead frame 209 has a flat plate shape and has a mounting surface 209a on which the flow rate sensor 205 and the LSI 210 are mounted side by side.
  • a ventilation hole 305 smaller than the external shape of the diaphragm 301 is formed around the location where the diaphragm 301 is mounted on the element 302 (see FIG. 7C). That is, the ventilation hole 305 is formed in the thickness direction projection area of the diaphragm 301 of the lead frame 209.
  • the lead frame 209 is made of a metal member such as copper.
  • a thin resin plate 306 made of polyimide tape is attached to the back surface of the lead frame 209 opposite to the mounting surface 209a at the portion where the lead frame 209 overlaps the element 302 (see FIGS. 5C and 6B).
  • the thin resin plate 306 reduces the thickness at the location where the flow rate sensor 205 is mounted, compared to when other parts are interposed, and prevents variations in the detection accuracy of the diaphragm 301.
  • a flow rate sensor 205 is arranged on the tip end side in the longitudinal direction of the chip package 208.
  • An LSI 210 is arranged on the base end side in the longitudinal direction of the chip package 208 .
  • the other end of the package body of the chip package 208 in the longitudinal direction has a double-beam structure with respect to the wall surface.
  • An opening 303 is formed in the chip package 208 in an area where the diaphragm 301 is projected on the thin resin plate 306 (see FIG. 6B).
  • the opening 303 becomes larger as the distance from the thin resin plate 306 increases (see FIG. 5C). That is, the diameter of the ventilation hole 305 of the flow sensor 205 in which the diaphragm 301 is arranged is smaller than the diameter of the opening 303 in the chip package 208 through which the thin resin plate 306 is exposed.
  • Chip package 208 In the chip package 208, the flow rate sensor 205, the LSI 210, and the lead frame 209 are molded with mold resin. Chip package 208 exposes a part of surface portion 205a of flow sensor 205 (see FIG. 6A).
  • the chip package 208 is molded with a molding resin except for the region of the thin resin plate 306 from the region projected in the thickness direction of the diaphragm 301 to the peripheral region.
  • the chip package 208 uses a thermosetting resin, thermoplastic resin, or the like as a molding resin.
  • An edge 401 is formed on the lead frame 209 to separate a portion where the lead frame 209 is overlapped with the element 302 from a portion where the lead frame 209 is not overlapped with the element 302 in a range projected on at least one side of the element 302, specifically, three sides. Projection means to make the shape of the lead frame 209 below the element 302 the same.
  • the edge 401 is a part of the edge of the through hole 402 formed in the lead frame 209.
  • the through hole 402 is rectangular, and the edge 401 is the long edge of the through hole 402 on the element 302 side.
  • the edge 401 is flush with the ends of the three sides of the element 302 and has no unevenness.
  • through-holes 402 penetrating through the lead frame 209 are formed in the projection range of the remaining three sides of the lead frame 209 other than the one side on which the bonding location 307 of the element 302 is provided.
  • a bonding point 307 where the bonding wire 304 is bonded is located on one side where the lead frame 209 is extended without providing the edge 401 of the lead frame 209 and the lead frame 209 is overlapped with the element 302. It is provided.
  • the lead frame 209 is connected to a portion overlapped with the element 302 by extending from the LSI 210 side to a range projected onto one side of the element 302 without providing the edge 401 of the lead frame 209.
  • FIG. 8A is a plan view of the lead frame 209 including the bonding wire 304 according to this embodiment.
  • FIG. 8B is a sectional view taken along line GG in FIG. 8A.
  • the element 302 is provided with a plurality of bonding locations 307 in parallel to which bonding wires 304 connected to the LSI 210 are bonded.
  • the bonding location 307 is arranged along one side where the lead frame 209 overlaps the element 302.
  • One side where the lead frame 209 overlaps the element 302 is a range where the lead frame 209 is projected onto one side of the element 302 from the LSI 210 side without providing the edge 401 of the lead frame 209 in the element 302.
  • One side of this lead frame 209 extends from the LSI 210 side to the element 302 side.
  • the bonding wire 304 uses a gold wire or a silver wire.
  • FIG. 9 is a perspective view of a prior art lead frame 209.
  • the edges 401 of the lead frame 209 are not provided on the four sides of the element 302.
  • the lead frame 209 connects the portion where the lead frame 209 is overlapped with the element 302 and the portion where the lead frame 209 is not overlapped with the element 302 without a tear.
  • FIGS. 10A and 10B are diagrams showing thermal stress analysis results of the physical quantity detection device 20 of the prior art.
  • FIG. 10A shows the stress analysis results in a side cross section taken along line GG in FIG. 8A.
  • FIG. 10B is a partially enlarged view of stress analysis results in a front cross section perpendicular to the side cross section of FIG. 10A.
  • thermal stress analysis of the conventional physical quantity detection device 20 thermal stress is concentrated at the interface where the element 302, lead frame 209, and mold resin 308 overlap. Then, separation between the lead frame 209 and the mold resin 308 occurs starting from the location where thermal stress is concentrated. Due to this separation between the lead frame 209 and the mold resin 308, the warpage of the diaphragm 301 increases and the flow rate characteristics fluctuate.
  • FIG. 11 is a comparison diagram of the amount of warpage of the diaphragm 301 between this embodiment and the conventional technology, and is obtained from the thermal stress analysis results.
  • the amount of warpage of the diaphragm in a state simulating the state after the high temperature durability test that is, the state in which peeling has occurred between the lead frame and the mold resin
  • the amount of warpage of the diaphragm in the initial state without peeling that is, the state in which peeling has occurred between the lead frame and the mold resin
  • Criterion L is a target value of the amount of change in the amount of warpage of the diaphragm before and after the high temperature durability test.
  • the amount of warpage of the diaphragm 301 in the initial state is smaller than the amount of warpage of the diaphragm 301 in the initial state of the prior art.
  • a through hole 402 is provided around the element 302. That is, in this embodiment, the through hole 402 is provided in the lead frame 209 at the starting point of peeling that occurs in the conventional technique. Since the configuration of this embodiment eliminates the starting point of peeling in the conventional technology, peeling between the lead frame 209 and the mold resin 308 can be suppressed.
  • the difference between the amount of warpage of the diaphragm 301 when the high temperature durability test is performed and the amount of warpage in the initial state (state before the high temperature durability test), that is, the amount of warpage of the diaphragm 301 before and after the high temperature durability test is calculated. It can be expected that the amount of change in the amount of warpage can be suppressed to below Criterion L.
  • warping of the diaphragm 301 can be reduced, and fluctuations in flow characteristics can be reduced.
  • FIG. 12A is a plan view of a lead frame 209 according to a modification of this embodiment.
  • FIG. 12B shows three types of cross-sectional views taken along line HH in FIG. 12A.
  • the through hole 402 shifts toward the center as in the middle stage, or the through hole 402 as in the lower stage becomes smaller.
  • the specifications are changed to increase the size of 402.
  • FIG. 13 is a plan view of the lead frame 209 according to this embodiment.
  • a bonding location 307 to which a bonding wire 304 is bonded is provided on one side where the lead frame 209 is extended without providing the edge 401 of the lead frame 209 and the lead frame 209 is overlapped with the element 302. ing.
  • one through hole 402 is located in a range projected on one side opposite to the side on which the bonding point 307 of the element 302 is provided. It is formed.
  • FIG. 14 is a plan view of the lead frame 209 according to this embodiment.
  • a bonding location 307 to which a bonding wire 304 is bonded is provided on one side where the lead frame 209 is extended without providing the edge 401 of the lead frame 209 and the lead frame 209 is overlapped with the element 302. ing.
  • through holes 402 are formed in a range projecting two mutually opposing sides.
  • FIG. 15 is a plan view of the lead frame 209 according to this embodiment.
  • Through holes 402 are formed in the area where the lead frame 209 overlaps the element 302 and the four sides of the element 302 are projected.
  • the portion where the lead frame 209 overlaps the element 302 and the portion where the lead frame 209 does not overlap the element 302 are adjacent through holes in which the longitudinal direction of the through hole 402 is different in the orthogonal direction within the range in which each of the four corners of the element 302 is projected.
  • 402 are connected to each other by forming a corner 403 which is connected by a lead frame 209.
  • the corner portions 403 are portions obtained by projecting each of the four corners of the element 302 onto the lead frame 209 toward the center where the element 302 exists.
  • FIG. 16A is a plan view of the lead frame 209 according to this embodiment.
  • FIG. 16B is a sectional view taken along line II in FIG. 16A.
  • the edge 401 is formed closer to the center of the element 302 than the end of the element 302.
  • the portion of the lead frame 209 where the lead frame 209 overlaps the element 302 is smaller than the external shape of the element 302.
  • FIG. 17A is a plan view of the lead frame 209 according to this embodiment.
  • FIG. 17B is a sectional view taken along line JJ in FIG. 17A.
  • the lead frame 209 is not present from the edge 401 toward the outside of the edge 401.
  • the physical quantity detection device 20 detects the physical quantity of the gas to be measured 2 flowing through the sub passage 234 provided in the housing 201.
  • the physical quantity detection device 20 includes a diaphragm 301 and a rectangular element 302 equipped with the diaphragm 301, and includes a flow rate sensor 205 that detects a flow rate, which is a physical quantity, of the gas to be measured 2 flowing through the sub passage 234.
  • the physical quantity detection device 20 includes a lead frame 209 on which a flow rate sensor 205 is mounted. An edge 401 is formed on the lead frame 209 in a range projected onto at least one side of the element 302, separating a portion where the lead frame 209 overlaps the element 302 from a portion where the lead frame 209 does not overlap.
  • thermal stress is concentrated at the interface where the element 302, lead frame 209, and mold resin 308 are stacked.
  • the peeling between the lead frame 209 and the mold resin 308 starts from a thermal stress concentration point near the interface between the lower part of the element 302 and the lower part of the mold resin 308 that are in contact with the upper surface of the lead frame 209 (see FIGS. 10A and 10B). known to occur.
  • the edge portion 401 on the lead frame 209 by providing the edge portion 401 on the lead frame 209, the number of starting points for separation between the lead frame 209 and the mold resin 308 can be reduced.
  • the area of the upper surface of the lead frame 209 in contact with the mold resin 308 near the interface between the element 302 and the mold resin 308 can be reduced. Thereby, separation between lead frame 209 and mold resin 308 can be suppressed. Therefore, according to the configuration (A), the warpage of the diaphragm 301 can be reduced, and the fluctuation in flow characteristics can be reduced.
  • the edge 401 is, for example, the edge of a part of the through hole 402 formed in the lead frame 209 (see FIGS. 7A to 7C).
  • the number of starting points for peeling between the lead frame 209 and the mold resin 308 can be reduced, and peeling between the lead frame 209 and the mold resin 308 can be suppressed.
  • the length of the through hole 402 in the direction along the side of the element 302 is longer because the number of starting points for peeling can be reduced.
  • (C) Among the four sides of the element 302, on one side where the lead frame 209 is extended without providing the edge 401 of the lead frame 209 and the lead frame 209 is overlapped with the element 302, there is a bonding point 307 where the bonding wire 304 is bonded. is provided.
  • the through hole 402 is formed, for example, in a range that is projected onto one side of the lead frame 209 that is opposite to the side where the bonding location 307 of the element 302 is provided, out of the remaining three sides other than the one side where the bonding location 307 of the element 302 is provided. (See Figure 13).
  • the bonding work is performed by pressing the bonding wire 304 against the element 302. For this reason, when the through hole 402 is provided in the lead frame 209 below the bonding location 307, it is difficult to stably attach the bonding wire 304.
  • the through hole 402 is provided in the range projected on one side opposite to the side on which the bonding location 307 of the element 302 is provided, so that the above (A) and (B) In addition to the effects described above, there is an effect that the bonding work can be performed stably.
  • the through hole 402 may be formed, for example, in each of the ranges projecting two opposing sides of the remaining three sides of the lead frame 209 other than the one side on which the bonding location 307 of the element 302 is provided. (See Figure 14).
  • the increase in warpage of the diaphragm 301 is greatly influenced by the peeling of the two opposing sides on both sides of the element 302.
  • the through holes 402 may be formed, for example, in each of the ranges projecting the remaining three sides of the lead frame 209 other than the one side on which the bonding location 307 of the element 302 is provided (see FIG. 7B).
  • through holes 402 are provided in portions corresponding to three sides of the element 302. Therefore, according to the present configuration (E), compared to a case where the through hole 402 is provided only in a portion corresponding to one side of the element 302 and a case where the through hole 402 is provided only in a portion corresponding to two sides of the element 302. As a result, peeling between the lead frame 209 and the mold resin 308 can be suppressed, and warping of the diaphragm 301 can be reduced.
  • the through holes 402 may be formed in each of the ranges projecting the four sides of the element 302 in the portion where the lead frame 209 overlaps the element 302 (see FIG. 15).
  • the portion where the lead frame 209 overlaps the element 302 and the portion where the lead frame 209 does not overlap the element 302 are adjacent through holes in which the longitudinal direction of the through hole 402 is different in the orthogonal direction within the range in which each of the four corners of the element 302 is projected.
  • 402 are connected to each other by forming a corner 403 which is connected by a lead frame 209.
  • through holes 402 are provided in portions corresponding to the four sides of the element 302. Therefore, according to this configuration, peeling between the lead frame 209 and the molded resin 308 is suppressed, and the diaphragm 301 can be reduced.
  • the edge 401 may be formed closer to the center of the element 302 than the end of the element 302 (see FIGS. 16A and 16B).
  • the portion of the lead frame 209 where the lead frame 209 overlaps the element 302 is smaller than the external shape of the element 302.
  • FIGS. 17A and 17B As shown in FIGS. 17A and 17B, at the location where the edge 401 of the lead frame 209 is present, only a portion of the lead frame 209 overlapping the element 302 may be placed. In the example shown in FIGS. 17A and 17B, at the location where the edge 401 of the lead frame 209 is present, the lead frame 209 is not present from the edge 401 toward the outside of the edge 401.
  • the diaphragm 301 is not covered by the ventilation hole 305, and the influence on the detection accuracy of the diaphragm 301 can be reduced.
  • the physical quantity detection device 20 includes an LSI 210 that drives the flow rate sensor 205.
  • the lead frame 209 has a flat plate shape and has a mounting surface 209a on which the flow rate sensor 205 and the LSI 210 are mounted side by side.
  • the physical quantity detection device 20 includes a chip package 208 in which a flow rate sensor 205, an LSI 210, and a lead frame 209 are molded with a mold resin 308. A portion of the flow rate sensor 205 including the diaphragm 301 is exposed on the surface of a passage surface portion 280 that is a part of the sub passage 234 formed in the chip package 208 and through which the gas to be measured 2 flows.
  • a thin resin plate 306 is attached to the back surface of the lead frame 209, which is opposite to the mounting surface 209a at the portion where the lead frame 209 overlaps the element 302.
  • An opening 303 is formed in the chip package 208 in an area where the diaphragm 301 on the thin resin plate 306 is projected. The opening 303 becomes larger as the distance from the thin resin plate 306 increases.
  • the diaphragm 301 is a rectangular parallelepiped that is long in the direction in which the passage surface portion 280 of the chip package 208 extends.
  • the bending rigidity of the flow rate sensor 205 is greater than that in the case where the diaphragm 301 is a rectangular parallelepiped that is long in the direction orthogonal to the direction in which the passage surface portion 280 extends.
  • the lead frame 209 is connected to a portion overlapped with the element 302 by extending from the LSI 210 side to a range projected onto one side of the element 302 without providing the edge 401 of the lead frame 209.
  • the LSI 210 and the element 302 can be mounted on one lead frame 209.
  • the bonding location 307 where the bonding wire 304 connected to the LSI 210 is bonded is projected onto one side of the element 302 from the LSI 210 side without providing the edge 401 of the lead frame 209 in the element 302.
  • a plurality of lead frames 209 are arranged in parallel along one side of the element 302 extending over the area.
  • the bonding wire 304 connected to the LSI 210 can be bonded through the bonding location 307 of the element 302.
  • SYMBOLS 1 Internal combustion engine control system, 2... Gas to be measured, 3... Exhaust gas, 4... Control device, 10... Internal combustion engine, 11... Engine cylinder, 12... Engine piston, 13... Spark plug, 14... Fuel injection valve, 15 ...Intake valve, 16...Exhaust valve, 17...Rotation angle sensor, 20...Physical quantity detection device, 21...Air cleaner, 22...Main passage, 23...Throttle body, 24...Intake manifold, 25...Throttle valve, 26...Throttle angle sensor , 27...Air control valve, 28...Oxygen sensor, 201...Housing, 202...Cover, 203...Intake air temperature sensor, 204...Pressure sensor, 205...Flow rate sensor, 205a...Surface part, 205b1, 205b2...Side part, 206...
  • Temperature/humidity sensor 207... Circuit board, 208... Chip package, 209... Lead frame, 209a... Mounting surface, 210... LSI, 211... Flange, 212... Connector, 213... Measurement unit, 214... Connector terminal, 221... Front, 222...Back surface, 223...One side surface, 224...Other side surface, 226...Bottom surface, 231...Sub-passage entrance, 232...First exit, 233...Second exit, 234...Sub-passage, 241...Fixing hole portion , 242... Through hole, 250... Sub passage groove, 251... First sub passage groove, 252... Second sub passage groove, 280... Passage surface portion, 281... Connection terminal, 301...

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  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Volume Flow (AREA)

Abstract

L'invention concerne un dispositif de détection de quantité physique (20) qui détecte une quantité physique d'un gaz à mesurer s'écoulant à travers un sous-canal (234) disposé dans un boîtier (201). Le dispositif de détection de quantité physique comprend : un capteur de quantité physique qui comporte un diaphragme (301) et un élément quadrangulaire (302) sur lequel est monté le diaphragme (301), et qui détecte un volume d'écoulement en tant que quantité physique du gaz à mesurer s'écoulant à travers le sous-canal (234) ; et une grille de connexion (209) sur laquelle est monté un capteur de débit (205). Sur la grille de connexion (209), une partie de bord (401) destinée à séparer une partie où la grille de connexion (209) chevauche l'élément (302) d'une partie où elle ne chevauche pas l'élément (302) est formée dans une zone projetée sur au moins un côté de l'élément (302).
PCT/JP2022/029443 2022-08-01 2022-08-01 Dispositif de détection de quantité physique WO2024028931A1 (fr)

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PCT/JP2022/029443 WO2024028931A1 (fr) 2022-08-01 2022-08-01 Dispositif de détection de quantité physique

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PCT/JP2022/029443 WO2024028931A1 (fr) 2022-08-01 2022-08-01 Dispositif de détection de quantité physique

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000164790A (ja) * 1998-11-25 2000-06-16 Hitachi Ltd リードフレームおよびそれを用いた半導体装置ならびにその製造方法
JP2005191342A (ja) * 2003-12-26 2005-07-14 Renesas Technology Corp 半導体装置およびその製造方法
WO2015033589A1 (fr) * 2013-09-05 2015-03-12 日立オートモティブシステムズ株式会社 Capteur de débit et dispositif de capteur de débit

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000164790A (ja) * 1998-11-25 2000-06-16 Hitachi Ltd リードフレームおよびそれを用いた半導体装置ならびにその製造方法
JP2005191342A (ja) * 2003-12-26 2005-07-14 Renesas Technology Corp 半導体装置およびその製造方法
WO2015033589A1 (fr) * 2013-09-05 2015-03-12 日立オートモティブシステムズ株式会社 Capteur de débit et dispositif de capteur de débit

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