WO2024025700A9 - Sondes souples à stabilité de pointage améliorée et comprenant au moins un ressort d'extension ou un segment de ressort - Google Patents

Sondes souples à stabilité de pointage améliorée et comprenant au moins un ressort d'extension ou un segment de ressort Download PDF

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Publication number
WO2024025700A9
WO2024025700A9 PCT/US2023/026588 US2023026588W WO2024025700A9 WO 2024025700 A9 WO2024025700 A9 WO 2024025700A9 US 2023026588 W US2023026588 W US 2023026588W WO 2024025700 A9 WO2024025700 A9 WO 2024025700A9
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WIPO (PCT)
Prior art keywords
probe
tip
spring
less
clearance
Prior art date
Application number
PCT/US2023/026588
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English (en)
Other versions
WO2024025700A1 (fr
Inventor
Ming Ting Wu
Original Assignee
Microfabrica Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US17/854,756 external-priority patent/US12078657B2/en
Priority claimed from US17/898,446 external-priority patent/US20240094250A1/en
Priority claimed from US17/898,400 external-priority patent/US20240103038A1/en
Application filed by Microfabrica Inc. filed Critical Microfabrica Inc.
Publication of WO2024025700A1 publication Critical patent/WO2024025700A1/fr
Publication of WO2024025700A9 publication Critical patent/WO2024025700A9/fr

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06738—Geometry aspects related to tip portion
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06744—Microprobes, i.e. having dimensions as IC details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/0675—Needle-like

Definitions

  • Embodiments of the present invention relate to probes for testing electronic circuits (e.g., for use in the wafer level testing, chip scale package testing, or socket testing of integrated circuits, or for use in making electrical connections to PCBs or other electronic components). More particular embodiments of the invention are related to pin-like microprobes or microspring probe with spring elements supported by relatively rigid elements wherein the probe heights may be much greater than their lateral dimensions or such dimensions may be comparable.
  • the probes may include single or multiple independent, spring biased electrical flow paths.
  • Embodiments include, or provide, probes having contact elements biased by at least one extension spring and may or may not also include one or more compression springs.
  • Probe tips compress toward one another under an elastic return force provided by one or more flat extension springs or segments that provide a return force wherein in some embodiments the extension springs may be pre-biased prior to contacting a DUT, or circuit elements, to be tested and in some embodiments the probes include relatively movable rigid elements with operational gaps that are smaller than can be generally formed in an assembled state or that have varying gap widths that provide for effective formation as well as stabilized probe operation, while still other embodiments are directed to methods for making such probes and/or assembling the probes into probe arrays.
  • Electrochemic l F b i ti Electrochemical fabrication techniques for forming three-dimensional structures from a plurality of adhered layers have been, and are being, commercially pursued by Microfabrica® Inc. (formerly MEMGen Corporation) of Van Nuys, California under the process names EFAB and MICA FREEFORM®.
  • Electrochemical fabrication provides the ability to form prototypes and commercial quantities of miniature objects, parts, structures, devices, and the like at reasonable costs and in reasonable times. In fact, Electrochemical Fabrication is an enabler for the formation of many structures that were hitherto impossible to produce. Electrochemical fabrication opens the spectrum for new designs and products in many industrial fields. Even though electrochemical fabrication offers this capability, and it is understood that electrochemical fabrication techniques can be combined with designs and structures known within various fields to produce new structures, certain uses for electrochemical fabrication provide designs, structures, capabilities and/or features not known or obvious in view of the state of the art.
  • It is an object of some embodiments of the invention to provide improved compliant pin probes or pin probe contact elements e.g. contact tips, arms, biasing elements are movable with respect to guide elements or sheaths to provide spring biased internal or external barrels or sheaths and plunger type operation
  • compliant pin probes or pin probe contact elements e.g. contact tips, arms, biasing elements are movable with respect to guide elements or sheaths to provide spring biased internal or external barrels or sheaths and plunger type operation
  • one or more substantially planar spring segments with at least one of the segments being operated in tension with the probes or probe contact elements further including barrels, sheaths or other rails, slots, channels, spring connector arms, and/or other engagement structures providing enhanced stability of probe or probe contact element performance.
  • a probe or probe contact element that has at least two movable contact tips for contacting different electronic components, different pads or bumps on the same electronic component, or two locations on a single pad or bump relative to a sheath, barrel or other non-moving portion of the probe.
  • the biasing of the springs occurs via engagement of a ratcheting mechanism that limits the amount of allowable decompression of the probe tips that can occur after an initiai compression of those tips toward one another.
  • a probe for testing a DUT includes: (a) a first tip arm connecting directly or indirectly to an attachment region of a first tip for making electrical contact to a first electrical circuit element; (b) a second tip arm connecting directly or indirectly to an attachment region of a second tip: and (c) a compliant structure comprising at least one spring segment, wherein a first region of the compliant structure joins the first tip arm and a second region of the compliant structure joins the second tip arm; wherein a relative displacement of the first and second tip arms results in elastic movement of the at least one spring segment of the compliant structure; and wherein the at least one spring segment operates under tension to provide an elastic restoration force or undergoes increased extension upon relative displacement of the first tip and the second tip toward one another along a longitudinal axis of the probe.
  • the compliant structure may comprise a feature selected from a group consisting of: (a) a single flat spring segment, (b) at least two spring segments, that are joined together in a serial configuration, (c) at least two spring segments that are joined together in a parallel configuration wherein at least one spring segment operates under compression to provide a restoring force; (d) at least two spring segments that are joined together in a serial or parallel configuration wherein the at least two joined spring segments operate in tension, (e) at least two spring segments that are joined together in a serial or parallel configuration wherein at least one of the at least two joined segments operate in tension while another of the at least two joined segments operates in compression, (f) at least two spring segments that are joined together in a serial or parailei configuration wherein the at least two spring segments are flat spring segments and are spaced from one another but at least partially overlay one another in a face-to-face configuration, and (g) at least two spring segments that are joined together in a
  • the probe may further comprise in correspondence of at least one of the first and second tips a thin rhodium feature to improve contact properties of the probe;
  • the probe may be configured in an array for wafer level testing or for socket testing of one or more packaged integrated circuits; and
  • the probe may further comprise lateral retention spring elements (1891), provided on one or both sides of the probe, to engage wails of a guide plate or other array structure to frictionally hold the probe in a desired lateral and longitudinal position.
  • FIGS. 1 A ⁇ 1 F schematically depict the formation of a first layer of a structure using adhered mask plating where the blanket deposition of a second material overlays both the openings between deposition locations of a first material and the first material itself.
  • FIG, 1G depicts the completion of formation of the first layer resulting from planarizing the deposited materials to a desired level.
  • FIGS. 1H and 11 respectively depict the state of the process after formation of the multiple layers of the structure and after release of the structure from the sacrificial material.
  • FIGS. 2.A-2J provide schematic representations of a side view of a vertically oriented probe that includes a flat tensional spring or springs.
  • FIGS. 3A - 3J provide further example embodiments of probes that are similar to those of FIGS. 2A - 2J, respectively, with the difference being that the lower contact tip of each probe is replaced by a tip that is a bonded, attached, captured, or otherwise retained electrical connection.
  • FIGS. 4A, 4B-1 to 4B-3 and 4C provide schematic illustrations of probes with a tensional spring or spring segment provided with stop plates movable during probe operation and in some cases a sheath.
  • FIGS. 5A, 5B-1, 5B-2, 5C-1 and 5C-2 provide schematic illustrations of probes with two tensional springs or spring segments functionally connected in parallel and with movable stop plates and in some cases a sheath.
  • FIGS. 6A, 6B-1 , 6B-2, 6C-1 and 6C-2 provide schematic illustrations of probes with a tensional spring and a compression spring or spring segments functionally connected side by side in series and with movable stop plates and in some cases a sheath.
  • FIGS. 7A - 7C provide a three-spring segment example probe with the upper spring segment, tower spring segment, and middle spring segment all operating in tension wherein the probe also includes upper and lower movable stop plates and in some cases a sheath.
  • FIG. 8 provides a schematic representation of a probe according to another embodiment of the invention where the probe includes a single spring segment, an upper tip arm and tip which are positioned in front of the plane or layer of the spring segment, and a lower arm and tip that are positioned behind the plane or layer of the spring segment.
  • FIG. 9 provides a side section illustration of a probe array with spring probes according to an embodiment of the invention.
  • FIG. 10 provides a schematic representation of a probe according to another embodiment of the invention where the probe includes two spring segments with a first spring segment operating in tension and a second spring segment operating in compression as well as an upper and lower frame structures, wherein the frame structures can move longitudinally relative to one another via a number of sliding guide structures.
  • FIGS. 11-1 to 11-6 provide a number of isometric views of a probe and views of expanded sections of the probe according to another embodiment of the invention where the probe is provided with spring segments and frame structures similar to that of the probe of FIG. 10 with the lower frame moving within slots or channels in the upper frame.
  • FIG. 12 provides a schematic representation of a probe according to another embodiment of the invention where the probe includes a single spring segment operating in tension by forced extension and frame structures and at least one sliding guide element,
  • FIGS. 13A1 to 13D4 provide a number of isometric views of a probe and views of expanded sections of the probe according to another embodiment of the invention where the probe provides a specific implementation of spring and guide functionality of the probe of FIG. 12.
  • FIGS. 13E1 to 13E6 provide top views of individual layers that define the probe of FIGS. 13A1 - 13D4.
  • FIGS. 14A to 14E provide five example alternative spring configurations that may be used in the variations of the embodiments of the invention wherein the examples are shown with attachment or end elements that are similar to those for the spring used in the embodiment of FIGS. 13A1 to 13E6.
  • FIGS. 15A1 to 15C2 provide three sample configurations of a layer with features that provide for enhanced pointing accuracy or probe stability.
  • FIGS. 16A - 16C provide various alternative example configurations for layers 2 and 10.
  • FIG. 17 provides an example alternative end configurations of a probe wherein a central region of the tip provides a thin rhodium layer to improve contact properties of the probe
  • FIGS. 18A - 18C provide various views of an alternative end to the probe wherein a laterally compressible spring element, is provided on one or both sides of the probe,
  • FIGS. 19A and 19B provide a top and isometric view of the left end of the engagement channels of the probe of FIGS. 13A1 - 13E6.
  • FIGS. 1A - 11 illustrate side views of various states in an alternative multi-layer, multimaterial electrochemical fabrication process.
  • FIGS. 1A - 1G illustrate various stages in the formation of a single layer of a multi-layer fabrication process where a second metal is deposited on a first metal as well as in openings in the first metal so that the first and second metals form part of the layer.
  • a side view of a substrate 82 having a surface 88 is shown, onto which paternable photoresist 84 is deposited, spread, or cast as shown in FIG. 1 B.
  • a pattern of resist is shown that results from the curing, exposing, and developing of the resist.
  • the patterning of the photoresist 84 results in openings or apertures 92(a) - 92(c) extending from a surface 86 of the photoresist through the thickness of the photoresist to surface 88 of the substrate 82.
  • a metal 94 e.g., nickel
  • FIG. 1 E the photoresist has been removed (i.e., chemically or otherwise stripped) from the substrate to expose regions of the substrate 82 which are not covered with the first metal 94.
  • FIG. 1F depicts the completed first layer of the structure which has resulted from the planarization of the first and second metals down to a height that exposes the first metal and sets a thickness for the first layer.
  • FIG. 1 H the result of repeating the process steps shown in FIGS. I B - 1G several times to form a multi-layer structure is shown where each layer consists of two materials. For most applications, one of these materials is removed as shown in FIG. 11 to yield a desired 3-D structure 98 (e.g., component or device) or multiple such structures.
  • a desired 3-D structure 98 e.g., component or device
  • the structure may be separated from the substrate.
  • release of the structure (or multiple structures if formed in a batch process) from the substrate may occur when releasing the structure from the sacrificial material, particularly when a layer of sacrificial material is positioned between the first layer of the structure and the substrate.
  • Alternative methods may involve, for example, the use of a dissolvable substrate that may be separated before, during or after removal of the sacrificial material, machining off the substrate before or after removal of the sacrificial material, or use of a different intermediate material that can be dissolved, melted or otherwise used to separate the structure(s) from the substrate before, during, or after removal of the sacrificial material that surround the structure(s).
  • FIGS. 1 A - 11 Various embodiments of various aspects of the invention are directed to formation of three- dimensional structures from materials, some, or all, of which may be electrodeposited or electroless deposited (as illustrated in FIGS. 1 A - 11). Some of these structures may be formed from a single build level (e.g., a planarized layer) that is formed from one or more deposited materials while others are formed from a plurality of build levels, each including at least two materials (e.g., two or more layers, more preferably five or more layers, and most preferably ten or more layers). In some embodiments, layer thicknesses may be as small as one micron or as large as fifty microns.
  • a single build level e.g., a planarized layer
  • layer thicknesses may be as small as one micron or as large as fifty microns.
  • microscale structures have lateral features positioned with 0.1 - 10 micron level precision and minimum feature sizes on the order of microns to tens of microns. In other embodiments, structures with less precise feature placement and/or larger minimum features may be formed. In still other embodiments, higher precision and smaller minimum feature sizes may be desirable.
  • meso-scale and millimeter-scale have the same meaning and refer to devices that may have one or more dimensions that may extend into the 0.1 - 50 millimeter range, or larger, and features positioned with a precision in the micron to 100 micron range and with minimum feature sizes on the order of several microns to hundreds of microns.
  • various embodiments, alternatives, and techniques disclosed herein may form multilayer structures using a single patterning technique on all layers or using different patterning techniques on different layers.
  • various embodiments of the invention may perform selective patterning operations using conformable contact masks and masking operations (i.e. operations that use masks which are contacted to but not adhered to a substrate), proximity masks and masking operations (i.e. operations that use masks that at least partially selectively shield a substrate by their proximity to the substrate even if contact is not made), non-conformable masks and masking operations (i.e.
  • masks and operations based on masks whose contact surfaces are not significantly conformable adhered masks and masking operations (masks and operations that use masks that are adhered to a substrate onto which selective deposition or etching is to occur as opposed to only being contacted to it), and/or selective patterned deposition of materials (e.g. via extrusion jetting, or controlled electrodeposition) as opposed to masked patterned deposition .
  • Conformable contact masks, proximity masks, and non-conformable contact masks share the property that they are preformed and brought to, or in proximity to, a surface which is to be treated (i.e., the exposed portions of the surface are fo be treated).
  • Adhered masks are generally formed on the surface to be treated (i.e., the portion of that surface that is to be masked) and bonded to that surface such that they cannot be separated from that surface without being completely destroyed or damaged beyond any point of reuse.
  • Adhered masks may be formed in a number of ways including: (1) by application of a photoresist, selective exposure of the photoresist, and then development of the photoresist, (2) selective transfer of pre-patterned masking material, and/or (3) direct formation of masks from computer-controlled depositions of material.
  • adhered mask material may be used as a sacrificial material for the layer or may be used only as a masking material which is replaced by another material (e.g., dielectric or conductive material) prior to completing formation of a layer where the replacement material will be considered the sacrificial material of the respective layer.
  • Masking material may or may not be planarized before or after deposition of material into voids or openings included therein.
  • Patterning operations may be used in selectively depositing material and/or may be used in the selective etching of material.
  • Selectively etched regions may be selectively filled in or filled in via blanket deposition, or the like, with a different desired material.
  • the layer-by-layer build up may involve the simultaneous formation of portions of multiple layers, in some embodiments, depositions made in association with some layer levels may result in depositions to regions associated with other layer levels (i.e., regions that lie within the top and bottom boundary levels that define a different layer’s geometric configuration).
  • regions associated with other layer levels i.e., regions that lie within the top and bottom boundary levels that define a different layer’s geometric configuration.
  • Temporary substrates on which structures may be formed may be of the sacrificial-type (i.e, destroyed or damaged during separation of deposited materiais to the extent that they cannot be reused) or non-sacrificial-type (i.e. not destroyed or excessively damaged, i.e. not damaged to the extent that they may not be reused, e.g.
  • Non-sacrificial substrates may be considered reusable, with litle or no rework (e.g., replanarizing one or more selected surfaces or applying a release layer, and the like) though they may or may not be reused for a variety of reasons.
  • each probe or contact element, in a multicontact element probe includes at least one substantially flat tensional spring segment that biases a test contact tip relative to a second tip, that may or may not be a contact tip, wherein the probes generally include structural elements for ensuring stable and robust probe functionality, in some embodiments, the probes further include a plurality of substantially flat spring segments, either of the extension type only or of a combination of one or more extension springs and one or more compression springs.
  • springs are configured to operate functionally in series or in parallel with the spring segments at least partially lying side-by-side or face-to-face as opposed to edge-to-edge or end-to-end.
  • probe deformation is limited to a compression along the axis of the probe (e.g., substantially longitudinal compression as probe tips or circuit joining elements move to more proximal positions).
  • references numbers are included in many of the figures wherein like numbers are used to represent similar structures or features in different embodiments.
  • the reference numbers are provided in a 3 or 4 digit format which may be followed by letters, dashes, and/or additional numbers, wherein the first digit or first two digits (from the left) represent the figure number while the final digits to the right along with any trailing letters, dashes, or numbers represent a particular general structure or feature.
  • two or more figures include a reference having the same right most digits (and following letters, dashes, and additional numbers), it is intended to indicate a similarity of the features indicated.
  • FIGS. 2A - 2J and 3A - 3J show probes according to different embodiment variations within the first group of embodiments of the invention wherein spring segments and structural elements illustrate a number of different example configurations of probes having at least one tensional spring but not a sheath.
  • spring segments and structural elements illustrate a number of different example configurations of probes having at least one tensional spring but not a sheath.
  • relative terms like “top”, “bottom, “upper” “lower” and similar ones are intended as referring to the illustrations given in the drawings, for sake of conciseness.
  • terms like “left” and “right will be used still with reference to the drawings.
  • 2A provides a schematic representation of a side view of a vertically oriented probe 200A that includes a compliant structure comprising a single flat tensionai spring or spring segment 201 connected to respective atachment regions of two tip arms, an upper tip arm 211 and a lower tip arm 212 that end with respective upper tip 211 T and lower tip 212T and extend in opposite directions relative to associated ends of the spring segment 201 such that the spring segment 201 operates in tension when the upper and lower tips 211T and 212T are pressed toward one another so as to provide an elastic restoration force.
  • a compliant structure comprising a single flat tensionai spring or spring segment 201 connected to respective atachment regions of two tip arms, an upper tip arm 211 and a lower tip arm 212 that end with respective upper tip 211 T and lower tip 212T and extend in opposite directions relative to associated ends of the spring segment 201 such that the spring segment 201 operates in tension when the upper and lower tips 211T and 212T are pressed toward one another so as to provide an elastic restoration force.
  • the tip arms 211 , 212 are shown as being located along the edges of the spring segment 201 but could alternatively be located along and spaced slightly from either face of the spring segment 201 or both could be located along a single face of the spring segment 201 and could potentially function as electrical and mechanical shields that protect a respective face of the spring segment 201 .
  • FIG. 2B provides a schematic representation of a side view of a vertically oriented probe 200B having a configuration similar to that of FIG. 2A but additionally including two coupling and guide sliding elements, generally indicated as slip rings 202 that provide for the upper and lower tip arms 211 and 212 to remain joined to the edges of a selected spring segment 201 in a slidabie configuration.
  • the slip rings 202, the tips 211T, 212T, and any other connecting elements could have been formed along one or both faces of the spring segment 201 so that the tip arms 211 , 212 could alternatively run along one or both faces of the spring segment 201 .
  • other or additional spring segments could 201 have been attached to the sliding or coupling rings 202.
  • the slip rings 202 may be replaced with channels and arms that slide through the channels, or what might be termed as barrels and plungers.
  • the siip rings 202 realize a guide structure, which provides enhanced stability to the probe 200.
  • FIG. 2C provides a schematic representation of a side view of a vertically oriented probe 200C having a configuration and functionality similar to that of the probe of FIG. 2B but with the slip rings 202 not being attached to the spring segment 201 itself but to lateral connection elements 262 and 264 of the upper and lower tip arms 211 and 212, respectively that attach to a bottom end 201 B and an upper end
  • FIG, 2D provides a schematic representation of a side view of a vertically oriented probe 200D having a configuration similar to that of FIG. 2C with the exception that two additional slip rings 202 have been added at an intermediate portion 201 M of the spring segment 201 to provide additional movement stability.
  • FIG, 2E provides a schematic representation of a side view of a vertically oriented probe 200E having a configuration that is similar to the probe of FIG. 2C but where the slip rings 202 are replaced by half rings 203 that provide for sliding but not complete lateral connection of the tip arms 211 and 212 to the lateral connection elements 262 and 264.
  • the probe may comprise sliding elements having other configurations that still allow separation of the connection between the tip arms and the lateral connection elements while still enhancing desired relative movement ability and/or inhibiting certain unwanted degrees of freedom between the components or structural elements of the probe.
  • FIG, 2F provides a schematic representation of a side view of a vertically oriented probe 200F that includes two flat tensional spring segments, a lower spring segment 201-2 and an upper spring segment 201-1 connected in-line and in series with a lower end of the lower spring segment 201-2 connecting to the upper tip arm 211 which connects to upper tip 211T and an upper end of the upper spring segment 201-1 connecting to the lower tip arm 212 which connects to lower tip 212T such that the in-line and in series spring segments 201-1 and 201-2 operate together in tension, with a combined spring constant, when the upper and lower tips 211T and 212T are pressed toward one another.
  • FIG. 2G provides a schematic representation of a side view of a vertically oriented probe 200G that includes two flat tensional spring segments, a first or left spring segment 201-1 and a second or right spring segment 201-2 positioned edge-to-edge (when unbiased) and in series with a connection bar 206 joining a lower end of the left spring segment 201-1 to an upper end of the right spring segment 201-2 with a lower end of the right spring segment 201-2 connecting to the upper tip arm 211 which connects to the upper tip 21 IT and an upper end of the left spring segment 201-1 connecting to the lower tip arm 212 which connects to lower tip 212T such that the spring segments positioned edge-to-edge and in series operate together in tension, with a combined spring constant, when the upper and lower tips 211T, 212T are pressed toward one another.
  • the spring segments may lie face-to-face with a gap between them for positioning the connection bar 206.
  • slip rings or other guidance features may be added.
  • the two longitudinally spaced upper and lower tips 211T, 212T do not need to be laterally separated (as illustrated) but could be located in-line with one another where such a line be longitudinally centered or off center.
  • FIG. 2H provides a schematic representation of a side view of a vertically oriented probe 200H that includes three flat tensional spring segments, an upper spring segment 201-1 , an intermediate spring segment 201-2, and a lower spring segment 201-3 connected in-line and in series with a lower end of the lower spring segment 201-3 connecting to the upper tip arm 211 which connects to upper tip 211T and an upper end of the upper spring segment 201-1 connecting to the lower tip arm 212 that connects to lower tip 212T.
  • the intermediate spring segment 201-2 has ends that connect to the lower spring segment 201-3 and to the upper spring segment 201-1 . In this configuration, the spring segments connected in-line and in series operate together in tension, with a combined spring constant, when the upper and lower tips 211T,
  • FIG, 2I provides a schematic representation of a side view of a vertically oriented probe 2001 having a configuration that provides two extension spring segments 201-1 and 201-2 that operate in parallel to provide a longitudinal and tensional return force when the upper and lower tips 211T and 212T of the upper tip arm 211 and lower tip arm 212, respectively, are compressed toward one another. More specifically, the two extension spring segments 201-1 and 201-2 are inserted side by side between two lateral connection elements 262 and 264 respectively connected to lower ends and upper ends of the spring segments 201-1 and 201-2, and branches 211-1 and 211-2 of the upper tip arm 211 , each being connected between lower ends and upper ends of the spring segments 201-1 and 201-2.
  • Slip rings 202 are provided between the lateral connection elements 262 and 264 and the tip arms 212 and 211 respectively.
  • the compression of the upper and lower tips 211T and 212T of the upper and lower tip arms 211 and 212 cause relative movement of the lower tip arm 212 and the branches 211-1 and 211-2 of the upper tip arm 211 which in turn cause increased spacing between the lateral connection elements 264 and 262 which slide along the branches 211-1 , 211-2 of the upper tip arm 211 , and the lower tip arm 212 via the slip rings 202 which in turn cause tensional extension (in Z) of both spring segments 201-1 , 201-2.
  • the tip arms are shown in the same plane as the spring segments, in other variations, the tip arms could lay in planes above or below (e.g., behind the sheet or in front of the sheet - in X) the spring segments to allow narrowing of the width of the probe (in Y) while providing some increase in thickness (in X).
  • FIG. 2J provides a schematic representation of a side view of a vertically oriented probe 200J having two spring segments 201-1 and 201-2 with a first spring segment 201-1 being edge-to-edge configured and operating in compression and a second spring segment 201-2 operating in tension or compression with the spring segments connected to one another by a slip ring 202 or other guide structure; in particular, the first spring segment 201-1 has an upper end connected to the upper tip arm 211 which connects to upper tip 211T and a lower end connected, through the slip ring 202, to a lower end of the second spring segment 201-2, in turn having an upper end connected to the lower tip arm 212 which connects to tower tip 212T.
  • a face-to-face configuration could have been implemented.
  • additional structural features may be added to the probe to aid in probe stability and in particular, to aid in ensuring controlled deflection of the first spring segment 201-1 operating in tension or compression (e.g., to avoid unintended buckling or deflection of the spring that might lead to inadvertent contact, shorting, and/or entanglement between neighboring probes in an array).
  • FIGS. 3A - 3J provide further example embodiments of probes 300A to 3G0J, respectively, that are similar to probes 200A ⁇ 200J of FIGS. 2A - 2J, respectively, with the difference being that a contact tip 212T of FIGS. 2A - 2J is replaced by an attached, bonded, captured, or otherwise retained electrical connection tip 312T.
  • FIGS. 2A - 2J and FIGS. 3A - 3J are represented by similar reference numerals with the exception that the reference number series is shifted from 200 to 300. In other embodiments, the roles of the contact tip and the other tip may be reversed.
  • FIG, 4A provides a schematic illustration of a probe 400A similar to that of FIG. 2C with a single tensional spring segment 401 connected on either end to two tip arms 411 and 412 with corresponding tips 411T and 412T via respective stop plates or lateral arms 462 and 464 respectively.
  • a lower portion of the upper tip arm 411 connects to a tower stop plate 462 and an upper portion of the lower tip arm 412 connects to the upper stop plate 464.
  • the upper stop plate 464 has an opening 402-1 and the lower stop plate 462 has an opening 402-2 through which the respective upper and lower tip arm 411 , 412 can pass freely with the walls of the openings functioning as longitudinal movement guide elements.
  • FIG. 4B-1 to 4B-3 provide schematic- illustrations of a probe 400B, similar to probe 400A of FIG. 4A, with the probe further including a sheath or frame structure 435 with a left side and right side thereof being shown.
  • the sheath 435 sets a minimum distance between the lower stop plate 462 and the upper stop plate 464 with the sheath 435 suitably including upper stop features 432-1 , lower stop features 432-2, and spacer or standoff sections 434.
  • FIG. 48-1 shows the probe 4Q0B in an undeflected state with the movable upper and lower stop plates 464, 462 resting against the upper and lower stop features 432-1 and 432-2 of the sheath 435, respectively.
  • FIG. 4B-2 shows the probe 400B with the lower tip 412T compressed toward the sheath 435, for instance, by contact with a lower contact structure 450, such as an electrical circuit element like a device under test, that is moved toward the bottom of the sheath 435, with the spring segment 401 being biased or stretched as the upper stop plate 464 is forced away from the top of the sheath 435.
  • a lower contact structure 450 such as an electrical circuit element like a device under test
  • FIG. 4B-3 shows the probe 400B after the upper tip 411T is compressed toward the sheath 435, for instance, by contact with an upper contact structure 455, such as an electrical circuit element like a test circuitry, that is moved toward a top portion of the sheath 435, with the spring segment 401 being further biased or stretched as the lower stop plate 462 is forced away from a lower portion of the sheath 435.
  • the sheaths 435 may be provided with solid front and back faces or front and back frame structures that help provide lateral guidance during movement of the stop plates 462, 464.
  • the sheath 435 and/or the movable stop plates 462, 464 may include additional features that allow for retention of relative lateral positions during longitudinal movement of the tip arms 411 , 412, connected stop plates 462, 464, and spring segment 401 relative to the sheath 435.
  • FIG. 4C provides another schematic illustration of a probe 400C, similar to probe 400A of FIG. 4A, with the spring segment 401 being pre-biased by use of a taller sheath or frame structure 435 that holds the movable stop plates 462, 464 at a larger relative separation, thus ensuring that an initial contact of either upper or lower tip 411T, 412T against a surface of an upper or lower contact structure (e.g. a pad, bump, or other contact surface of an electrical circuit element) will be accompanied by a non-zero restoration or back force.
  • an upper or lower contact structure e.g. a pad, bump, or other contact surface of an electrical circuit element
  • FIG. 5A provides a schematic illustration of a probe 500A similar to that of FIG. 2I with two tensional spring segments 501-1 and 501-2 functionally connected in parallel and with additional three structural members 562-1 , 562-2, and 564, that may function as movable stop plates, being in the form of crossbars, plates, or arms.
  • the two tensional spring segments 501-1 and 501-2 have respective upper ends connected to a movable upper stop plate 564 which includes two openings 502-1 for passing longitudinal branc-hes511-1 and 51 1-2 connected to the first tip arm 511 and then to the upper tip 511T by an additional movable stop plate 562-1.
  • the upper movable stop plate 564 connects to an upper end of the lower tip arm 512 which in turn ends at, or connects to, lower tip 512T,
  • the two tensional spring segments 501-1 , 501-2 have respective bottom ends connected to a movable lower stop plate 562-2 that connects to the bottom of branches 511-1 and 511-2.
  • the lower movable stop plate 562-2 comprises an opening 502-2 allowing the lower tip arm 512 to pass freely with the walls of the openings functioning as longitudinal movement guide elements.
  • 5A includes three movable stop plates but with only two degrees of freedom since the additional movable stop plate 562-1 and the lower movable stop plate 562-2 are rigidly connected to one another by the branches 511-1 and 511-2 as such viable combinations for engaging independent pairs of the potentially movable stop plates include: (1) engaging additional movable stop plate 562-1 and upper movable stop plate 564 or (2) engaging lower movable stop plate 562-2 and upper movable stop plate 564.
  • FIGS. 5B-1 to 5B-2 provide first and second variations of the probe of FIG. 5A but with the addition of sheath or frame structures 535.
  • the probes 500B of FIG. 5B-1 and 5B-2 have pairs of upper and lower stop features 532-1 and 532-2 that set the minimum distance between the upper, lower and additional movable stop plates, in particular, the upper stop feature 532-1 sets a lower position of the upper movable stop 564 by bounding the upper movable stop 564 to upward relative motion.
  • the lower stop feature 532-2 sets an upper position of the lower movable stop 562-2 by bounding the lower movable stop 562-2 to downward relative motion.
  • the minimum distance set by the upper and lower stop features of FIG. 5B-1 is the same separation distance shown in FIG.
  • the probe of FIG. 5B-2 has an initial bias that is larger than the initial bias of the probe of FIG. 5B-1 .
  • the amount of working compression range of the probes of FIGS. 5B-1 and 5B-2 may be set by the lengths of the branches 511-1 , 511-2, and of the lower tip arm 512 or by the gap between the upper movable stop plate 564 and the additional movable stop plate 562-1 because either of these elements may dictate the elastic range of motion allowed.
  • different parameters, structures, or features may be used to set the working range of motion and any desired level of pre-biasing of the spring.
  • the probes 5000 of FIGS. 50-1 and 5C-2 provide third and fourth variations of the probe of FIG. 5A with each having a pair of stop features 532-1 , 532-2 of a sheath 535 that sets a maximum distance between the upper pair of movable stop plates, in particular the additional movable stop plate 562-1 and the upper movable stop plate 564.
  • the lower stop feature 532-2 sets a lower position of the upper movable stop plate 564 by bounding the upper movable stop plate 564 to upward relative motion.
  • the upper stop feature 532-1 sets an upper position of the additional movable stop plate 562-1 (and thus an upper position of the lower movable stop plate 562-2) by bounding the additional and lower movable stop plates 562-1 and 562-2 to down-ward relative motion.
  • FIG. 50-1 should be adequate to provide a desired extent of compressive motion for the upper and lower tips of the probe.
  • the maximum distance set by the stop features of FIG. 5C-1 is the same separation distance shown in FIG. 5A while the maximum distance set by the stop features of FIG. 5C-2 is smaller than the separation distance shown in FIG. 5A wherein the maximum distance also sets a maximum allowable compression of the upper and tips of the probe toward one another.
  • the probe of FIG, 5C-2 has an initial bias that is larger than the initial bias of the probe of FIG. 5C-1 .
  • 5C-1 and 5C-2 may be set by the lengths of the branches 511-1 , 511-2, and of the lower tip arm 512 or the gap between the upper movable stop plate 564 and the additional movable stop plate 562-1 (or the gap resulting from the limitations defined by the stop features 532-1 and 532-2) because any of these elements may dictate the elastic range of motion allowed.
  • different parameters, structures, or features may be used to set the working range of motion. [90] in some variations of the embodiments of FIGS.
  • different spacing heights may be used for the fixed stop features, different iengths of arms, branches and spring segments may be used, additional guide structures may be added, tabs or other structures may be added to the sheath or frame structures to provide controlled engagement with array structures (e.g. guide plates, substrates, other probes, or the like), and dielectric features may be added to provide electric isolation of selected elements within a given probe or between neighboring probes and any desired level of pre-biasing of the spring segment.
  • array structures e.g. guide plates, substrates, other probes, or the like
  • dielectric features may be added to provide electric isolation of selected elements within a given probe or between neighboring probes and any desired level of pre-biasing of the spring segment.
  • FIG. 6A provides a schematic illustration of a probe 600A similar to that of FIG. 2J with an extension or tensions! spring or spring segment 601-2 and a compression spring segment 601-1 functionally connected side-by-side in series by a lower movable stop structure or plates 606 at their lower ends.
  • the lower movable stop plate 606 includes an opening through which a lower tip arm 612 can pass.
  • An upper end of the lower tip arm 612 along with an upper end of the extension spring segment 601-2 attach to an upper movable stop plate 664 that includes an opening for passing the compression spring segment 601-1 .
  • An upper end of the compression spring segment 601-1 connects to an additional movable stop piate 662 as does a lower end of the upper tip arm 611 which joins the upper tip 611T at its opposite end.
  • a lower end of the lower tip arm 612 joins the lower tip 612T.
  • FIGS. 6B-1 to 6B-2 provide first and second variations of a probe 600B, similar to probe 600A of FIG. 6A but with the addition of sheath or frame structures 635 having upper stop features 632-1 , lower stop features 632-2 and spacers or standoffs 634 that set a maximum distance between a pair of movable stop plates, in particular the lower movable stop plate 606 and the additional movable stop plate 662 with the maximum distance of FIG. 6B-1 being the same separation distance shown in FIG. 6A and with the maximum distance of FIG. 6B-2 being smaller than the separation distance shown in FIG.
  • the probe of FIG. 6B-2 has an initial bias that is larger than the initial bias of the probe of FIG. 6B-1.
  • the amount of working compression range of the probe of FIG. 6B-1 is greater than the working compression range of the probe of FIG.
  • the working compression range may be set by the lengths of the upper and lower tip arms 611 and 612 or the gap between the upper movable stop plate 664 and the additional movable stop plate 662 because either of these elements may dictate the elastic range of motion allowed.
  • different parameters, structures, or features may be used to set the working range of motion.
  • FIGS. 6C-1 to 6C-2 provide third and fourth variations of a probe 600C, similar to probe 600A of FIG. 6A but with the addition of sheath or frame structures 635 that set a minimum distance between a pair of movable stop plates, in particular the lower movable stop plate 606 and the upper movable stop plate 664 with the maximum distance of FIG. 6C-1 being the same separation distance shown in FIG. 6A and with the minimum distance of FIG. 6C-2 being larger than the separation distance shown in FIG.
  • the probe of FIG. 6C-2 has an initial bias that is larger than that of FIG. 6C-1 leaving a smaller working range of motion. The amount of working compression range of the probes of FIGS.
  • 6C-1 and 6C-2 may be set by the lengths of the tip arms 611 and 612 orthe gap between the upper movable stop plate 664 and the additional movable stop plate 662 because either of these elements may dictate the elastic range of motion allowed. In other embodiments, different parameters, structures, or features may be used to set the working range of motion.
  • different spacing heights may be used for the fixed stops, different lengths of arms and springs may be used, additional guide structures may be added, tabs or other structures may be added to the sheath or frame structures to provide controlled engagement with array structures (e.g. guide plates, substrates, other probes, or the like), and dielectric features may be added to provide electrical isolation of selected elements within a given probe or between neighboring probes.
  • array structures e.g. guide plates, substrates, other probes, or the like
  • dielectric features may be added to provide electrical isolation of selected elements within a given probe or between neighboring probes.
  • FIGS. 7A - 7C provide schematic illustrations of three example probes 700A - 700C having three extension spring segments 701-1 , 701-2, and 701-3, in particular an upper spring segment 701-1 , an intermediate spring segment 701-2 and a lower spring segment 701-3, located in series with the probes also having different movable stop plates or lateral extension arms, in particular an upper movable stop plate 764, a first intermediate movable stop plate 722-1 , a second intermediate movable stop plate 722-2, and a lower movable stop plate 762 as well as upper and lowertips 711T and 712T and upper and lower tip arms 711 and 712 with fixed stop features 732-1 and 732-2 of a sheath 735 also shown in FIGS, 7B and 7C.
  • Probe 700A of FIG. 7A includes an upper tip 711T at an upper end of the upper arm 711 .
  • a lower end of the upper arm 711 is attached to a lower movable stop plate 762 which has an opening that may function as a slip ring 702 that allows passage of the lower tip arm 712 and the upper movable stop plate 762 has a lower end of the lower spring segment 701-3 attached thereto.
  • the upper end of the lower spring segment 701-3 attaches to a second intermediate movable stop plate 722-2 to which a lower end of the intermediate spring segment 701-2 attaches, with the second intermediate movable stop plate 722-2 also including an opening 702 for passing another portion of the lower tip arm 712.
  • An upper end of the intermediate spring segment 701-2 attaches to the first intermediate movable stop plate 722-1 to which a botom end of the upper spring segment 701-1 attaches with the first intermediate movable stop plate 722- 1 also having an opening 702 for passage of another portion of the lower tip arm 712.
  • the upper end of the upper spring segment 701-1 and the upper end of the lowertip arm 712 attach to the upper movable stop plate 764.
  • the first intermediate movable stop plate 722-1 , the second intermediate movable stop plate 722- 2, and the upper movable stop plate 764 also include openings 702 for one or both of lower tip arm 712 and upper tip arm 711 , such openings 702 may also function as slip rings 702.
  • FIG. 7B depicts a probe 700B, similar to probe 700.A of FIG. 7A, having a fixed spacing structure or sheath 735 that sets a minimum distance between the two intermediate movable stop plates 722-1 and 722-2.
  • the spacing structure 735 includes upper and lower stop features 732-1 and 732-2 along with a spacing or standoff element 734, wherein the minimum spacing distance is the same as the separation distance shown in FIG. 7A.
  • FIG. 7C shows a probe 700C, similar to probe 700A of FIG. 7A, with the fixed spacing structure or sheath 735 of FIG. 7B but with the spacer or standoff 734 being taller.
  • Interactions between spring segments, the fixed stop features, the movable stop plates, along with pre-tensioning of one or more spring segments prior to usage can lead to overall spring constant variations (e.g., decreases) over a working compression range of the upper and lower probe tips 711T and 712T toward one another.
  • spring segments and/or the tip arms could all be overlaid in a variety of face-to-face or edge-to-edge configurations with the tip arms running outside or between the various spring segments,
  • Alternative embodiments may include a feature selected from a group consisting of: (1) configurations that can engage with features on an array structure to allow for pre-biasing of at least one spring segment, (2) at least one shunting element that directs current from one of the upper and lower tip arms through a non-compliant structure and then through the other of the upper and lower tip arms; (3) at least one shunting element that directs current from one of the upper and lower arms through a non- compliant structure and then through the other of the upper and lower tip arms wherein the at least one shunting element is a surface against which the tip arms slide.
  • FIG. 8 provides a schematic representation of a probe 800 according to another embodiment of the invention where the probe includes a single spring segment 801 (like that of FIG. 2A or 2B) that is operated by pressing on an upper tip 811T, which is connected to an upper arm 811 with both being positioned in front of the plane or layer of the spring segment 801 , and a lower tip 812T, which is connected to a lower arm 812 with both being positioned behind the plane or layer of the spring segment 801 and where the upper and lower ends of the spring segment engage the lower and upper tip arms, respectively, at connection locations or structures 867 and 868 which are longitudinally opposite to their respective tip locations and wherein the tip arms run along opposite faces of the spring segment and extend longitudinally beyond the ends of sheath 851 .
  • a single spring segment 801 like that of FIG. 2A or 2B
  • Gaps also separate the spring faces and the tip arms except at the connection locations or structures 867 and 868.
  • the front and back of the sheath 851 may be fully closed, be partially closed, or remain open.
  • the sides of the sheath 851 may be fully closed or partially open.
  • the front and back faces are shown as open.
  • the lower tip 812T is intended to abut onto a contacting element or pad of a first circuit element, for instance a device under test DUT and the upper tip 81 IT is intended to abut onto a contacting element or pad of a second circuit element, for instance a test circuitry TC such as a space transformer, an interposer or a PCB connected thereto.
  • a test circuitry TC such as a space transformer, an interposer or a PCB connected thereto.
  • tip arm positioning may be opposite to that shown, (2) both tip arms may be positioned on the same side of the spring segment, (3) both tip arms may be laterally aligned with one another in front of or behind the spring segment, (4) both tip arms may be located on either side of the spring segment with their respective tips located in line with the tip arms or with the tips translated or shifted to a common line (e.g. a center line) of the probe by Inclusion of laterally extending translating arms (e.g.
  • one or both tip arms may be located beyond either edge of the spring segment, within a plane or layer of the spring segment or in a separate plane or layer with their respective tips located in line with the tip arms or with tips translated or shifted to a different line (e.g. a center line) of the probe by laterally extending translating arms (e.g, that may be located beyond the working range of the spring segment).
  • one or more laterally extending arms set the maximum compression of the probe tip toward that respective end of the sheath. Still numerous other variations are possible with some set forth herein as features of other embodiments or as alternatives associated with other embodiments.
  • FIG. 9 A probe array comprising a plurality of spring probes according to an embodiment of the present invention is shown in FIG. 9.
  • the probe array 900 comprises a plurality of probes 910 inserted between a pair of upper guide plates 920 and a pair of lower guide plates 930, suitable standoff 940 being inserted between the upper guide plates 920 and the lower guide plates 930.
  • FIG. 10 provides a schematic representation of a probe 1000 where upper tip 1011T results in compression of a first or compression spring segment 1001-1 (on the right) while movement of the lower tip 1012T results in extension of a second or extension spring segment 1001-2 (on the left). Since the two spring segments 1001-1 and 1001-2 are joined at their lower ends by a sliding coupling and guide element, in particular a slip ring 1002, the compressing of the compression spring segment 1001-1 has an impact on the net extension of the extension spring segment 1001-2 while the extension of the extension spring segment 1001-2 has a net impact on the compression of the compression spring 1001-1 .
  • a net force applied to the upper and lower tips 101 IT and 1012T of the probe 1000 depends on several factors including the spring constant of each spring segment, the net deflection of each spring segment, and any initial bias created in each spring segment.
  • the upper tip 1011T is located at the upper end of the uppertip arm 1011 while the other end of the upper tip arm connects to a relatively rigid upper sliding frame structure 1061 via an upper lateral crossbar or arm 1062-1 with these arms in turn connecting to the upper end of the compression spring segment 1001-1 as well as to other longitudinal frame elements 1061-1 to 1061-4.
  • a lower frame structure 1063 comprises a lower lateral crossbar or arm 1064 connected to other longitudinal frame elements 1063-1 and 1063-2.
  • the longitudinal frame elements 1061-1 to 1061-4, acting as guide elements, at their lower ends connect to additional lower lateral cross bars or arms 1062-2 which are joined by another slip ring 1002.
  • An upper end of the extension spring 1001-2 connects to another slip ring 1002 which also connects to the lower tip arm 1012 which ends in the lower tip 1012T.
  • the upper sliding frame structure 1061 is held by and can slide longitudinally relative to the lower frame structure 1063 that includes longitudinal elements or arms 1063-1 and 1063-2 and the lower lateral crossbar or arm 1064 where an interface between the relatively movable frame structures 1061 and 1063 includes a plurality of slip rings 1002 on the right and on the left which are mounted to the lower frame structure 1063 while slidably engaging the upper frame structure 1061 with a relative longitudinal positioning of the frame structures being a function of the relative position of respective circuit elements (such as a device under test DUT that engage the lower probe tip 1012T, or a test circuitry TC such as a space transformer, a PCB, or other test circuit interface elements that engage the upper probe tips 1011T) along with any other movable or fixed stop to which the probe may engage, in some variations, another lateral arm, arms, or arm and slip ring elements may connect the upper portion of the longitudinal frame elements 1063-1 and 1063-2 together (e.g.
  • the longitudinal frame elements 1061-1 to 1061-4 help in stabilizing probe functionality and may help ensure that the compression spring segment 1001-1 does not deflect or bow excessively.
  • the longitudinal frame elements are stabilizing guide for the probe 1000.
  • additional guide elements may be provided in front and/or behind both faces of one or both spring segments to provide additional operational stability.
  • initial biasing of one or both spring segments may be useful in providing tailored operational characteristics to the probe.
  • selecting and setting a distance between the lower lateral arm 1064 and the additional lower lateral arms 1062-2 that is different from a nominal unbiased distance may result in pre-biasing of the spring segments 1001-1 and 1001-2 to provide an initial non-zero contact force forthe probe 1000.
  • FIGS. 11-1 to 11-6 provide a number of isometric views of a probe 1100 and views of expanded sections of the probe 1100 according to another embodiment of the invention where probe 1100 provides a specific implementation of spring and guide functionality similarto that of the probe of FIG. 10 with the lower frame structure moves within slots or channels in the upper frame structure.
  • FIG. 11-1 provides an isometric view of probe 1100 with the lower frame structure 1163 (on the left) movable in channels or slots in the upper frame structure 1161 (on the right).
  • the two frame structures 1161 and 1163 are elastically joined by two spring segments 1101-1 and 1101-2 connected in series.
  • the upper frame structure 1161 includes the first or upper tip arm 1111 and upper tip 111 IT (which may be used to make contact with a bonding pad or other connection element of a first circuit element, such as a test circuitry TC), longitudinal frame elements 1161-1 to 1161-4 (with only 1161-1 to 1161-3 being visible in FIG. 11-1 and with 1161-4 being visible in FIG.
  • the lower frame structure 1163 includes the longitudinal frame elements 1163-1 to 1163-3 and the lower lateral arm 1164 that also functions a movable stop where the upper frame structure 1161 and lower frame structure 1163 can slide relative to each other.
  • the upper frame structure 1161 and tower frame structure 1163 are connected by a spring group which indudes a tensional or extension spring segment 1101-2 that has a right end that joins the right end of the lower frame structure 1163 at an attachment iocation or structure 1168 (see FIGS. 11-5 and 11-6) and a left end that joins the left end of a compressions! spring segment 1101-1 via a slip ring 1102, or a lateral connector 1106, which can slide relative to the longitudinal frame elements of both upper frame structure 1161 and lower frame structure 1163 (see FIGS. 11-2 and 11-4).
  • the right end of the compression spring segment 1101-1 joins the upper frame structure 1161 at an attachment location or structure 1167 (see FIG.
  • lower frame structure 1163 The right end of lower frame structure 1163 is shown with a lower flat tip arm 1112 and lower tip 1112T.
  • the lower tip 1112T may be used to make electrical connection with a contact pad of a second circuit element (e.g. a device under test DUT, which may be, for example, an integrated circuit still in wafer form) and which, in alternative embodiments, may take on a variety of different forms other than the blunt flat tip configuration of the current example.
  • a second circuit element e.g. a device under test DUT, which may be, for example, an integrated circuit still in wafer form
  • the lower flat tip arm 1112 is separated from the left end of the upper frame structure 1161 by a gap 1170-3 that allows compression of tip 1112T toward tip 1111T (see FIG, 11-4).
  • the second spring segment 1101-2 takes the form of an extension spring segment and has a planar configuration as the extension spring segment self-aligns longitudinally under tension while the first spring segment 1101-1 takes the form of a compression spring and has flanged edges on either lateral side of the probe 1100 where the flanges can engage with and slide along the longitudinal frame elements 1161-1 to inhibit excess lateral displacement as the spring segment is compressed.
  • other configurations may be used to provide lateral displacement constrains on the compression spring segment including, for example, one or more slots in which the spring segment moves, laterally centralized flanges, or notches in the spring segment that engage appropriate longitudinal frame elements.
  • FIG. 11-2 provides a close up view of the left most portion of the probe of FIG. 10 so that various key elements can be better seen, including: (1) Tip 1112T; (2) Three longitudinal frame elements 1163-1 , 1163-2, and 1163-3 of the lower frame structure 1163; (3) Main longitudinal frame elements 1161-1 , 1161-2, 1161-3 of the upper frame structure 1161 (the other longitudinal frame element 1161-4 is out of view but corresponds to the longitudinal frame element 1161-3 on the opposite side of the probe 1100); (4) an upper and lower pair of sliding interfaces or slots 1103 in the upper frame structure 1161 for the T-shape rails or longitudinal frame elements of the lower frame structure 1163, wherein the slots 1103 are partially defined by the longitudinal frame elements 1161-1 and 1161-2 of the upper frame structure 1161 ; and (5) the tensional or extension spring segment 1101-2 and the compressions!
  • the longitudinal frame elements 1163-1 , 1163-2, and 1163-3 can be seen having narrowed regions 1183-1 , 1183-2, and 1183-3, respectively, that can be used to provide a larger gap between the longitudinal frame elements 1163-1 , 1163-2, and 1163-3 and inside of the slots defined by the longitudinal frame elements 1161-1 and 1161-2 during fabrication of the as-assembled but not fully engaged probe, whereafter the upper frame structure 1161 and lower frame structure 1163 are transitioned to a working or operational configuration by pressing the tips of the probe 1100 together wherein the wider regions of the longitudinal frame elements 1163-1 , 1 163-2, and 1163-3, labeled as 1181-1 , 1181-2, and 1181-3 respectively, are brought into the slots formed by the longitudinal frame elements 11
  • the gap may be larger than a minimum feature size (e.g., a size that allows formation of the features to occur with desired or required yield, e.g., 80, 90, 95, or even 99%, or more as a feature yield for a given batch fabrication process) which may be, for example, as large as 5, 10, 20, 30 microns or more.
  • a minimum feature size e.g., a size that allows formation of the features to occur with desired or required yield, e.g., 80, 90, 95, or even 99%, or more as a feature yield for a given batch fabrication process
  • the gap is smaller than the minimum feature size, for example, and the gap may be reduced to 10, 5, 2 microns or even less.
  • such configuration size changes between interface regions for fabrication and use may be designed into other probe regions to improve stability and probe operation.
  • FIG, 11-3 provides an isometric view of the left end of the upper frame structure 1161 and lower frame structure 1163 from a different angle compared to that of FIG. 11-2 so that additional features can be more readily seen such as retention flanges 1101 F at the top of a most lateral portions of undulations 1101 U of the compressive spring segment 1101-1 which engages a narrowed or recessed portion along the bottom of longitudinal frame eiementl 161-1 .
  • FIG. 11-4 provides an expanded view of the left end of the upper frame structure 1161 from a different angle compared to that of FIG. 11-2 so that additional features may be more readily seen as: (1) the double I configuration of the slip ring 1102 (lateral connector 1106) that joins the spring segments 1101-1 and 1101-2 while allowing the longitudinal frame element 1163-3 of the lower frame structure 1163 and the longitudinal frame elements 1161-3 and 1161-4 of the upper frame structure 1161 to pass through it; and (2) flanges 1101F at the ends of undulations 1101 U (i.e. the elastically deformable compliant building blocks) of the compression spring segment 1101-1.
  • the double I configuration of the slip ring 1102 lateral connector 1106) that joins the spring segments 1101-1 and 1101-2 while allowing the longitudinal frame element 1163-3 of the lower frame structure 1163 and the longitudinal frame elements 1161-3 and 1161-4 of the upper frame structure 1161 to pass through it
  • flanges 1101F at the ends of undulations 1101 U (i.e. the elastic
  • FIG. 11-5 provides an isometric view of the right most ends of the upper frame structure 1161 and lower frame structure 1163 so that select features may be more readily seen such as: (1) attachment location or structure 1167 joining the right end of the compression spring segment 1101-1 to the upper tip arm 1111 of the upper frame structure 1161 ; (2) gaps 1170-1 and 1170-2 that provide space for longitudinal frame elements 1163-1 and 1163-2 to move into during compression of the upper and lower probe tips 1111T and 1112T toward one another, and (3) attachment location or structure 1168 joining the right end of the extension spring 1101-2 to tip arm 1112 of S2.
  • FIG, 11-6 provides an isometric view of the right most ends of upper frame structure 1161 and lower frame structure 1163 from a different angle than that shown in FIG. 11 -5 so that selected features may be more readily seen such as the atachment location or structure 1168 that joins the right end of the extension spring segment 1101-2 to the right end of the lower longitudinal frame element 1163-2 and/or to the central longitudinal frame element 1163-3 of the lower frame structure 1163.
  • FIG, 12 provides a schematic representation of a probe 1200 where compression of upper and lower tips 1211T and 1212T toward one another resuits in extension of a spring segment 1201.
  • the upper probe tip 1211T is located at an upper end of an upper tip arm 1211 while the other end of the upper tip arm 1211 connects to a relatively rigid first or upper frame structure 1261 wherein the first frame structure 1261 includes two vertical or longitudinal a frame elements, labeled as 1261-1 and 1261-2, an upper lateral crossbar or arm 1262-1 and a lower crossbar or arm 1262-2 with the lower lateral arms in turn connecting to a lower end of the spring segment 1201 at an attachment location or structure 1267.
  • the upper frame structure 1261 also includes regions of expanded width 1281 on the longitudinal frame elements 1261-1 and 1261-2 that provide for tightened tolerance or reduced gap spacing in sliding connecting and guide elements or slip rings 1202 as these expanded width regions 1281 transition from outside the longitudinal frame elements to sliding within the longitudinal frame elements (e.g., they are away from the expanded width regions during fabrication and are relatively moved to surround the expanded width regions while in a working state).
  • An upper portion of the spring segment 1201 connects to a second or lower frame structure 1263 at an attachment location or structure 1268 wherein the lower frame structure 1263 includes an upper lateral crossbar or arm 1264-1 , a pair of vertical or longitudinal frame elements labeled as 1263-1 and 1263- 2, and a lower crossbar or arm 1264-2.
  • the lower frame structure 1263 also fixedly holds slip rings 1202 through which the first upper frame structure 1261 can slide including moving of the expanded width portions 1281 of the longitudinal frame elements from outside to inside the slip rings 1202.
  • the lower lateral arm 1264-2 of the lower frame structure 1263 also connects to a lower tip arm 1212 which ends in a lower tip 1212T.
  • the upper and lower frame structures 1261 , 1263 are elastically joined to one another by the spring segment 1201 and allowed to slide relative to one another by movement of the longitudinal frame elements of the upper frame structure 1261 through the slip rings 1202 that are joined to the lower frame structure.
  • the upper and lower tips 1211T and 1212T can be pressed toward one another by stretching or tensioning the spring segment 1201 while the same can move away from each other under a return force created in response to a prior compression of the spring segment 1201.
  • the interface between the slip rings 1202 and the longitudinal frame elements 1262-1 and 1262-2 of the upper frame structure 1261 and more specifically the effective gaps between these elements and longitudinal separation interface regions, define the stability of movement and the associated lateral out of line displacement or wobble that can occur between the tips on opposite ends of the probe or between the sliding frame structures. The tighter the tolerance, the more parallel the movement of the different elements will be and the more predictable tip alignment from probe- end-to-probe-end will be.
  • the gap size decreases with a resulting smaller angular displacement of the elements being allowed.
  • the frame structures 1261. 1263 and associated longitudinal frame elements may help in stabilizing probe functionality and may help ensure that the probe 1200 does not deflect or bow excessively.
  • Use of gap decreasing elements like the expanded width regions 1281 relative to interior width of the slip rings 1202 or other guide elements may provide more stable probe operation.
  • a slotted channel, or multipie slotted channels may be provided.
  • opening or slots with narrowed widths may be provided.
  • the probes will be formed without assembly of slidable frame elements (i.e. where slidable frame elements are formed with engaged or partially engaged features), it may be possible to provide gaps large enough to meet process tolerance requirements for co-fabrication of the movable elements while in fabrication positions ensure that a minimum feature size (MFS) requirement is maintained.
  • MFS feature size
  • the movable elements may be relatively longitudinally translated or otherwise moved to working regions (e.g. regions or relative positions that involve some amount of tip-to-tip compression) which have tighter tolerances than are allowed by the MFS but which provide more stable longitudinal movement of the elements while the probe is in use.
  • a first movement from a fabrication position into the working range may trigger a locking mechanism (e.g., ratcheting mechanisms) that inhibits the elements from readily transitioning from the working region back to the fabrication position.
  • initial biasing of one or both springs may be useful in providing different operational characteristics to the probe. For example, selecting and setting a maximum separation distance between upper lateral frame elements 1264-1 and 1262-1 and/or between lower lateral elements 1262-2 and 1264-2 that is smaller than a nominal unbiased distance may result in pre-biasing of the spring segment to provide an initial non-zero contact force for the probe 1200.
  • FIGS. 13A1 to 13E4 provide a number of different isometric, plane, and section views of a probe 1300 according to another embodiment of the invention where the probe provides a specific implementation similar to the probe 1200 of FIG. 12.
  • FIG. 13A1 provides a side view of probe 1300 so that the 11 layers making up the probe can be seen with layers 2, 4, 8, and 10 being thin and shown by thicker blackened lines.
  • FIG. 13A1 points out several probe elements or features including relatively moveable frame structures, in particular an upper frame structure 1361 and a lower frame structure 1363 connected to with respective upper and lower tips
  • FIG. 13A1 also shows a spring segment 1301 as well as a left side gap 1370-1 and a right side gap 1370-2 that allow for relative movement of the longitudinal frame elements as an upper tip 1311 T (at the left side) and a lower tip 1312T (at the right side) are compressed toward one another.
  • FIG. 13A2 provides an isometric view of the probe 1300 of FIG. 13A1 tilted forward so that the top of the probe can be seen which provides a view of guide tabs or frame extensions 1361 E that form part of the upper frame structure 1361 and slots with wider slot regions 1302W and narrower slot regions 1302N that form part of the lower frame structure 1363 where the frame extensions 1361 E can slide with a relatively large clearance in the wider slot regions 1302W and with a tighter clearance in the narrower slot regions 13Q2N.
  • the lower frame structure 1363 not only includes relatively long arms 1363A that longitudinally extend the length of the lower frame structure 1363 but also bridging elements 1363B that connect the frame elements that are located on opposite sides of the slot regions 1302W, 1302N.
  • a wider region 1381 of the upper frame structure 1361 is shown which reduces to a narrower region that extends into a channel or slot in the lower frame structure 1363 with the beginning of a narrower region 1383 shown.
  • the wider region 1381 enters a channel to provide another structural configuration that narrows the clearance to improve operational stability, in embodiments where the two frame structure are to be formed in a preassembled state, the wider regions can allow for sufficient clearance such that minimum feature size (MFS) requirements can be met while the narrow regions can allow for an operational range of motion with tighter tolerances and more precise relative movement for the upper and lower frame structures 1361 and 1363.
  • MFS minimum feature size
  • the smaller clearance is smaller by an amount selected from a group consisting of (a) at least two microns, (b) at least four microns, (c) at least 6 microns, (d) at least eight microns, and (e) at least 10 microns, (f) less than 7/8 of the clearance prior to biasing, (g) less than % of the clearance prior to biasing, (h) less than % of the clearance prior to biasing, (i) less than 5/8 of the clearance prior to biasin’/z(j) less than 1/2 of the clearance prior to biasing, (k) less than 3/8 of the clearance prior to biasin%(i) less than 1/4 of the clearance prior to biasing, (m) less than 1/8 of the clearance prior to biasing.
  • the stability and/or pointing accuracy when making contact with an electronic component for a given level of spring compression is selected from a group consisting of: (a) less than ten microns, (b) less than eight microns, (c) less than six microns, (d) less than four microns, and (e) less than two microns, (t) less than 7/8 of the stability and/or pointing accuracy in absence of the clearance reduction, (g) less than 7/8 of the stability and/or pointing accuracy in absence of the clearance reducfio%(h) less than 3/4 of the stability and/or pointing accuracy in absence of the clearance reduction, (i) less than 5/8 of the stability and/or pointing accuracy in absence of the clearance reductio%(j) less than 1/2 of the stability and/or pointing accuracy in absence of the clearance reduction, (k) less than 3/8 of the stability and/or pointing accuracy in absence of the clearance reduction® less than 1/4 of the stability and/or pointing accuracy in absence of the clearance reduction, (m)
  • FIG. 13A3 shows a top view (or bottom view) of the probe of FIGS, 13A1 and 13A2 with locations of frame extensions 1361 E, narrower slot regions 1302N, wider slot regions 1302W, wider region 1381 and the beginning of narrower region 1383 again referenced.
  • FIG. 13A4 shows an isometric view of the probe showing the left, upper, and front side view of the probe 1300 while FIG, 13A5 shows an isometric view of the probe showing the right, lower, and front side view of the probe 1300 wherein features noted in FIGS. 13A2 and 13A3 are again referenced.
  • FIGS. 13B1 and 13B2 show views of the upper half of the probe 1300 that has been sectioned through the middle of the middle layer of the probe.
  • FIG. 13B1 shows the probe 1300 with a slight tilt so that the top of the probe can be seen along with an edge of the top half of the probe.
  • FIG. 13B2 shows the upper half of probe 1300 with a slight backward tilt with the left end being slightly forward than the right end so that the edge of the probe may be seen along with the bottom of the upper half of the probe and left side of the probe. Because the probe was sectioned in the middle, the upper half of the spring segment 1301 and its general configuration can be seen in FIG. 13B2 along with the attachment location or structure 1367 which joins the spring segment 1301 to the upper frame structure 1361 (partly shown) and attachment location or structure 1368 which joins the spring segment 1301 to the lower frame structure 1363.
  • FIGS. 13C1 and 13C2 show the probe 1300 of FIGS. 13A1 to 13.A5 with the bottom half cut away and with the front half cut away, thus providing views of the upper, back, left quarter of probe 1300.
  • FIG. 13C1 provides a side view and
  • FIG. 13C2 provides an isometric view of the left end of the probe 1300 wherein the attachment location or structure 1368 between the right end of the spring segment 1301 and the lower frame structure 1363 can be clearly seen.
  • FIG. 13C1 also show a gap 1390 between the top portion of the string segment 1301 and the elements of the lower frame structure -363.
  • FIGS. 13D1 - 13D4 show the probe 1300 of FIGS. 13A1 to 13A5 with the bottom half cut away, with the front half cut away, and with the left half cut away, thus providing views of the upper, back, right quarter of probe 1300.
  • FIG. 13D1 provides a side view while FIGS. 13D2 to 13D4 provide several isometric views wherein the attachment location or structure 1367 between the right end of the spring segment 1301 and the upper frame structure 1361 can be clearly seen.
  • FIGS. 13E1 to 13E6 provide top views of individual layers that define the probe of
  • FIGS. 13A1 - 13D4 wherein FIG. 13E1 shows the features of layers 1 and 11 , FIG. 13E2 shows the features of layers 2 and 10, FIG. 13E3 shows the features of layers 3 and 9, FIG. 13E4 shows the features of layers 4 and 8, FIG. 13E5 shows the features of layers 5 and 7, and FIG. 13E6 shows the features of layer 6 wherein each figure also provides a dashed rectangular alignment guide that correlates the relative positions of the features from layer-to-iayer.
  • the layer views of FIGS. 13E1 to 13E6 help illustrate some of the harder to see features of probe 1300. Attachment location or structure 1367 of FIG.
  • 13D4 shows the structure that attaches the right end of the spring segment 1301 to the wider region 1381 as part of the upper frame structure 1361 while attachment location or structure 1368 shows the pair of elements (for each of layers 4 and 8) that join the left end of the spring segment 1301 to the left end of arms 1363A of the lower frame structure 1363 of layers 3 and 9.
  • the wider region 1381 of the upper frame structure 1361 distinguishes a wider part of the upper frame structure 1361 from the narrower region 1383 that extends toward the right end of the channel in the lower frame structure 1363.
  • Probe 1300 includes upper and lower frame structures 1361 and 1363, which can be longitudinally moved relative to one another, and which are connected by a spring segment 1301.
  • a left end of the upper frame structure 1361 joins an upper tip arm 1311 which connects to, or becomes, an upper tip 1311T while the right end of the lower frame structure 1363 connects to a lower tip arm 1312 which in turn connects to, or becomes, a lower tip 1312T.
  • the right end of the upper frame structure 1361 connects to the right end of the spring segment 1301 at the attachment location or structure 1367 while the left end of the lower frame structure 1363 connects to the left end of the spring segment 1301 at the attachment location or structure 1368 wherein the upper and lower frame structures 1361 and 1363 are engaged with one another by sliding arms (or plungers) and channels (or barrels) such that when the upper and lower tips 1311T, 1312T of the probe 1300 are pressed toward one another, the spring segment 1301 is biased in extension that provides an increasing force that attempts to drive the upper and lower tips apart. Upon release of the compressive force, the biased spring segment 1301 attempts to drive the upper and lower tips back to an unbiased separation.
  • Probe 1300 also includes a lateral connecting or longitudinal frame elements 1362-1 that has lateral dimensions largerthan the upper tip arm 1311 and upper tip 1311T that may engage an array structure (e.g., a guide plate or a mounting structure) by sliding the upper tip 1311T through the array structure such that engagement of the lateral connecting or longitudinal frame elements 1362-1 and the array structure can provide preload compression of the spring segment 1301 or provide other engagement functionality.
  • an array structure e.g., a guide plate or a mounting structure
  • the upper frame structure 1361 includes upper and lower longitudinal frame elements or plungers (e.g. wider region 1381 , narrower region 1383, and frame extensions 1361E that correlate to longitudinal frame elements 1261-1 and 1261-2 of FIG. 12) that move through openings or channels formed in the lower frame structure 1363, which includes the lateral connecting or longitudinal frame elements 1363- 1 and 1363-2, which correspond to longitudinal frame elements 1263-1 and 1263-2 of FIG. 12, where these elongated structures and their interplay provide a certain level of pointing accuracy of the probe (or tip-to-tip correlation) which is dictated in part by the gaps or clearance through which the interaction occurs as well as the amount of longitudinal overlap between the different elements of the frame structures.
  • upper and lower longitudinal frame elements or plungers e.g. wider region 1381 , narrower region 1383, and frame extensions 1361E that correlate to longitudinal frame elements 1261-1 and 1261-2 of FIG. 12
  • the lower frame structure 1363 which includes the lateral connecting or longitudinal frame elements 1363- 1 and 1363-2,
  • the gap or clearance may be larger or smaller.
  • narrower regions 1383 move through channels having larger clearances than do the frame extensions 1361 E when moving through their narrower slot regions 1302N such that frame extensions 1361 E provide enhanced operational stability.
  • layers may be formed with thicknesses that are less than intra-layer minimum feature size (MFS) requirements, stability of movement within a plane of the layer stacking axis and the longitudinal axis of the probe can typically be sufficiently controlled by proper setting of the layer thickness of gap layers between moving elements.
  • MFS intra-layer minimum feature size
  • Frame extensions 1361 E are initially formed in wider lateral portions of the wider slot regions or channel segments 1302W in the lower frame structure 1363 that provide sufficient separation or clearance to allow formation to occur but wherein such gaps or clearance do not provide a desired level of stability and/ortip pointing accuracy.
  • the narrower region 1383 moves longitudinally through its channel and frame extensions 1361 E move from the wider slot regions 1302W of their channel segments 1302 to laterally narrower slot regions 1302N to reduce clearance to an amount that provides enhanced probe functional stability and/or pointing accuracy.
  • the slot regions on the top and bottom of the probe are separated from other segments or openings by bridging elements 1363B that provide additional stability to the channel size and thus provide for improvement in functional operation of the probe (e.g., for both sliding and pointing stability).
  • top to bottom bridging elements may be included that provide further structural integrity where such bridging elements may be formed from one or both conductive and/or dielectric materials;
  • the probe may be formed such that an external frame exists that allows movement of both tips relative to the frame as opposed to allowing only the tips on one end of the probe to be movable;
  • different numbers of and/or different lengths of bridging elements and/or channel segments may be used;
  • different lengths, widths, working ranges, and materials for structural elements may be used; (5) enhanced alignment tolerances (e.g.
  • FIGS. 14A to 14E provide five example alternative spring segment configurations that may be used in the various embodiments of the invention wherein the examples are shown with attachment or end elements that are similar to those for the spring segment used in the embodiment of FIGS. 13A1 to 13E6.
  • the spring segment 1401 of FIG. 14A provides a rectangular spring with vertical segments and longitudinal segments.
  • FIG. 14B shows a spring segment 1401 with a saw tooth configuration wherein the vertical arms have longitudinal components that extend in a forward direction or a direction of spring extension.
  • FIG. 14C provides a spring segment 1401 that includes vertical arms which also have a component that extend in a longitudinal direction but where the longitudinal direction is backward relative to the direction of spring extension.
  • FIG. 14D provides a spring segment 1401 that is like that of FIG.
  • FIG. 14E provides another configuration of the spring segment 1401 similar to that of FIG. 14C but where the undeformed vertical segments, and even the horizontal segments, are provided with a smooth curved configuration.
  • spring configurations are possible and may be based on a balance of competing factors such as: (1) spring constant, (2) longitudinal length, width, and thickness of the spring, (3) required travel length (e.g., overtravel) with or without accounting for any pre-extension requirements, (4) ensuring that no portion of the spring upon reaching maximum overtravel exceeds an acceptable fraction of yield strength of the material/configuration used for the spring and that strain is effectually distributed or concentrated in acceptable areas.
  • consideration may also be given to spring materials, e.g., different metals, dielectrics, composites, and like, as well as temperature considerations associated with current flowing through the springs, contact resistance heating, shunting current away from the springs into thicker structural members or into members having surface or embedded materials of higher conductivity.
  • a shunting member may be incorporated near one or both ends of the spring segments, wherein the shunting member or members may be configured to provide an acceptable and reliable contact resistance.
  • Example materials include use of gold to enhance conductivity or lower contact resistance. Copper or silver may be used to improve conductivity. Rhodium may be included as a hard and low wear contact material. Palladium, nickel, alloys of palladium (e.g., palladium cobalt), alloys of nickel (e.g., nickel cobalt or nickel phosphor), beryllium copper, as well as other materials may be used as spring materials.
  • FIGS. 15A1 to 15C2 provide three sample configurations of a layer with features that provide for enhanced pointing accuracy or probe stability wherein FIG. 15A1 provides a similar configuration to that of layers 3 and 3 of the embodiment of FIGS. 13A1 to 13E6 as shown in FIG. 13E3 with FIG. 15A2 showing a wider region 1581 , a narrower region 1583, and a channel 1502 after longitudinal tip-to-tip compression provides for engagement of the wider region 1581 with the channel 1502.
  • the effective clearance or gap formed between the wider region 1581 and the channel 1502 near the left end of the channel 1502 is narrowed compared to what it was based on with only the narrower region 1583 engaging the channel 1502. in this embodiment, no narrowing is provided near the right end of the arm/channel 120 or plunger/barrel.
  • FIGS. 15B1 and 15B2 provide a similar left end initial clearance (e.g. as formed) and engaged clearance views (e.g. after some tip-to-tip compression) as were found in FIGS. 15A1 and 15A2 but where the right end of the channel 1502 narrows to become narrowed channel 1502N which provides the probe not only with a left end clearance reduction but also a right end clearance reduction as the right end of the narrower region 1583 engages the narrowed channel 1502N.
  • the clearance reduction embodiment of FIGS. 15B1 and 15B2 significantly improve the pointing accuracy of the probe tips compared to that provided by the embodiment of FIGS, 15A1 and 15A2 which in turn provide a significant improvement compared to what would have existed with no clearance reduction.
  • FIGS. 15C1 and 15C2 provide similar views as shown in FIGS. 15.A1 - 15B2 and with similar clearance reduction features as shown in FIGS. 15B1 and 15B2 but with gap narrowing features found not only at the left and right ends but at two intermediate locations as a result of two intermediate widened channel regions 1502Wthat can co-exist during formation with widened portions of the narrower region 1583 that provide width comparable to that of wider region 1581 which upon tip compression, move to the narrowed channel.
  • FIGS. 16A - 16C like 15A1 . 15B1 , and 15C1 provide various alternative example configurations for further variations to the probe of FIGS. 13A1 - 13E6 but instead of applying to layers 3 and 9, the alternatives apply to layers 2 and 10 wherein layers 2 and 10 may be understood fo be, at least in part, transition layers between adjacent layers that have features that would otherwise be joined together but for the gap formed by layers 2 and 10.
  • a stop or lateral arm 1662-1 with its longitudinal external extension arm 1661 E can be seen along with two additional external guide features or extension arms 1661 E.
  • FIGS. 13A2 - 13A5 These features move through channel segments on the layers 1 and 11 that have widened regions 1602W and narrowed regions 1602N formed as part of the lower frame structure 1363 with the segments separated from one another by side-to-side bridging elements 1363B that provide additional stability to the probe (as can be seen in FIGS. 13A2 - 13A5). These elements together provide improved stability and/or improved pointing accuracy as well as probe durability.
  • FIG. ISA like 15A, does not provide additional clearance reduction features found in layers 3 or 9 or that will be found in layers 1 and 11 .
  • FIG. 16B carries over the channel narrowed regions on the right side of the channel as it existed in FIG. 15B.
  • FIG, 16C carries toward the expanded channel areas in the intermediate portion of the channel that provide room for, and ensure no inadvertent bonding to, expanded arm elements found in the intermediate portion of the arm of FIG. 15C.
  • FIG. 17 provides an example alternative tip configuration that may be used on either end of a probe, for instance a lower tip 1711T, wherein a central region of the tip provides a thin rhodium feature (Rh) to improve contact properties of the probe, in other alternatives, the rhodium feature and the tip itself may take on different configurations which may include the use of multiple tips or multiple rhodium contact features.
  • Rh thin rhodium feature
  • FIGS. 18A - 18C provide various views of an alternative end of a probe wherein in addition to a tip, for instance an upper tip 1812T, of desired configuration, lateral engagement or retention spring elements 1891 are provided on one or both sides of the probe, as part of one or more layers wherein upon loading of the probe into an opening in a guide plate or other array structure (not shown), e.g., a block with probe capture holes, the retention spring elements can engage walls of the guide plate or other array structure to frictionally hold the probe in a desired lateral and longitudinal position to inhibit the probe from inadvertently falling out of the array structure while still allowing it to be removed if required.
  • a guide plate or other array structure not shown
  • the retention spring elements can engage walls of the guide plate or other array structure to frictionally hold the probe in a desired lateral and longitudinal position to inhibit the probe from inadvertently falling out of the array structure while still allowing it to be removed if required.
  • such retention spring elements may be located as part of the top or bottom layers, or both, or near the top of bottom layers. In still other embodiments, such retention spring elements may be located at the opposite end of the probe, at both ends, at one or more intermediate locations, at multiple locations along either, or both, sides of the probe or even extending out of the lateral top or bottom of the probe.
  • FIGS. 19A and 19B illustrate an additional feature that may be incorporated into an alternative to probe 1300 wherein top and isometric views of the left end of the probe are provided so that the left end engagement channels of the probe of FIGS. 13A1 - 13E6 can be seen wherein pointing accuracy enhancement features on either side of elements 1983 can be seen as widened arm configurations that provide narrowed gaps as they enter their respective slots or channels 1902 in frame structure 1963 wherein not only does arm 1981 (forming part of layers 3 and 9) but lateral extension arms 1961 E (forming parts of layers 1 , 1 1 , and 2, and 10) provide similar wide to narrowing features via a taper such that upon tip- to-tip compression, reduced clearance is achieved and more fully supported.
  • the probe according to anyone of the above described embodiments may have a length selected from a group consisting of: (1) less than 2 mm, (2) less than 3 mm, (3) less than 5 mm, (4) less than 8 mm, (5) more than 2 mm, (6) more than 3 mm, (7) more than 5 mm, and (8) more than 8 mm and a width selected from a group consisting of: (1) less than 100 microns, (2) less than 200 microns, (3) less than 300 microns, (4) less than 400 microns, and (5) less than 600 microns.
  • the probe may be is configured in an array for wafer level testing or for socket testing of one or more packaged integrated circuits.
  • Still other embodiments may be created by combining the various embodiments and their alternatives with other embodiments and their alternatives as set forth herein.
  • some fabrication embodiments may not use any blanket deposition process. Some embodiments may use selective deposition processes or blanket deposition processes on some layers that are not electrodeposition processes. Some embodiments may use nickel or nickel-cobalt as a structural material while other embodiments may use different materials.
  • preferred spring materials include nickel (Ni), copper (Cu) in combination with one or more other materials, beryllium copper (BeCu), nickel phosphorous (Ni-P), tungsten (W), aluminum copper (Al-Cu), steel, P7 alloy, palladium, palladium-cobalt, silver, molybdenum, manganese, brass, chrome, chromium copper (Cr-Cu), and combinations of these.
  • Some embodiments may use copper as the structural material with or without a sacrificial material.
  • Structural or sacrificial dielectric materials may be incorporated into embodiments of the present invention in a variety of different ways. Such materials may form a third material or higher deposited material on selected layers or may form one of the first two materials deposited on some layers.
  • Some embodiments may employ diffusion bonding or the like to enhance adhesion between successive layers of material or to reduce stress.
  • Some embodiments of the present invention exist. Some of these embodiments may be based on a combination of the teachings herein with various known teachings. Some methods of making embodiments may not use any blanket deposition process and/or they may not use a planarization process. Some embodiments may use selective deposition processes or blanket deposition processes on some layers that are not electrodeposition processes. Some embodiments, for example, may use nickel, nickelphosphorous, nickel-cobait, palladium, palladium-cobalt, gold, copper, tin, silver, zinc, solder, rhodium, rhenium as structural materials while other embodiments may use different materials. Some embodiments, for example, may use copper, tin, zinc, solder or other materials as sacrificial materials.
  • Some embodiments may use different structural materials on different layers or on different portions of single layers. Some embodiments may remove a sacrificial material while other embodiments may not. Some embodiments may use photoresist, polyimide, glass, ceramics, other polymers, and the like as dielectric structural materials.
  • headers are not intended that the headers be used to limit the application of teachings found in one portion of the specification from applying to other portions of the specification.
  • alternatives acknowledged in association with one embodiment are intended to apply to ail embodiments to the extent that the features of the different, embodiments make such applications functional and do not otherwise contradict or remove all benefits of the adopted embodiment.
  • Various other embodiments of the present invention exist. Some of these embodiments may be based on a combination of the teachings set forth herein with various known teachings.

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Abstract

Les sondes comprennent au moins un segment de ressort et, dans certains modes de réalisation, comprennent des segments de passage de canal rétrécis (par exemple par augmentation de la largeur d'éléments de piston ou par diminution des largeurs de canal) sur des parties de longueurs de canal (par exemple, pas toutes les longueurs de canal) pour améliorer la stabilité ou la précision de pointage tout en permettant encore la formation assemblée d'éléments de sonde mobiles.
PCT/US2023/026588 2022-06-30 2023-06-29 Sondes souples à stabilité de pointage améliorée et comprenant au moins un ressort d'extension ou un segment de ressort WO2024025700A1 (fr)

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US17/854,756 US12078657B2 (en) 2019-12-31 2022-06-30 Compliant pin probes with extension springs, methods for making, and methods for using
US17/854,756 2022-06-30
US17/898,446 2022-08-29
US17/898,446 US20240094250A1 (en) 2018-10-26 2022-08-29 Compliant Probes Including Dual Independently Operable Probe Contact Elements Including At Least One Flat Extension Spring, Methods for Making, and Methods for Using
US17/898,400 US20240103038A1 (en) 2018-10-26 2022-08-29 Compliant Probes with Enhanced Pointing Stability and Including At Least One Flat Extension Spring, Methods for Making, and Methods for Using
US17/898,400 2022-08-29

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WO2024025700A1 WO2024025700A1 (fr) 2024-02-01
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PCT/US2023/026588 WO2024025700A1 (fr) 2022-06-30 2023-06-29 Sondes souples à stabilité de pointage améliorée et comprenant au moins un ressort d'extension ou un segment de ressort
PCT/US2023/026590 WO2024006446A1 (fr) 2022-06-30 2023-06-29 Sondes à broche souples avec ressorts d'extension ou segments de ressort et éléments d'encliquetage

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