WO2024019450A1 - Dispositif électronique comprenant un boîtier de moteur - Google Patents

Dispositif électronique comprenant un boîtier de moteur Download PDF

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Publication number
WO2024019450A1
WO2024019450A1 PCT/KR2023/010181 KR2023010181W WO2024019450A1 WO 2024019450 A1 WO2024019450 A1 WO 2024019450A1 KR 2023010181 W KR2023010181 W KR 2023010181W WO 2024019450 A1 WO2024019450 A1 WO 2024019450A1
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WO
WIPO (PCT)
Prior art keywords
electronic device
heat transfer
heating element
motor
substrate portion
Prior art date
Application number
PCT/KR2023/010181
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English (en)
Korean (ko)
Inventor
박충순
강정현
신효훈
안정호
윤희영
장종광
장동헌
Original Assignee
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020220114205A external-priority patent/KR20240011590A/ko
Application filed by 삼성전자 주식회사 filed Critical 삼성전자 주식회사
Priority to EP23758197.0A priority Critical patent/EP4336277A1/fr
Publication of WO2024019450A1 publication Critical patent/WO2024019450A1/fr

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    • G—PHYSICS
    • G04—HOROLOGY
    • G04G—ELECTRONIC TIME-PIECES
    • G04G17/00—Structural details; Housings
    • G04G17/02—Component assemblies
    • G04G17/04—Mounting of electronic components
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/016—Input arrangements with force or tactile feedback as computer generated output to the user

Definitions

  • Various embodiments disclosed in this document relate to electronic devices, and more particularly, to electronic devices including a motor housing.
  • Electronic devices such as wearable electronic devices, may be wearable on a user's body. Wearable electronic devices are highly portable, so their ease of use can be improved. These electronic devices include various active elements such as an application processor (AP), a radio-frequency integrated circuit (RFIC), a power management IC (PMIC), and a multimode multiband power amplifier (MMPA) to provide various functions to users. can do.
  • the various active elements may consume power for operation. As the functions of electronic devices diversify and their performance increases, the power consumed by the various active elements may also increase. The power consumed by various active elements is converted into heat, and the various active elements act as heat sources.
  • AP application processor
  • RFIC radio-frequency integrated circuit
  • PMIC power management IC
  • MMPA multimode multiband power amplifier
  • Electronic devices such as wearable electronic devices
  • components such as the substrate, housing, and support members of the electronic device can be miniaturized and lightweight.
  • the size of the structure that acts as a heat transfer area that transfers heat from the heat source and discharges it to the outside may decrease. Therefore, if the increased heat generation is not effectively discharged, the temperature of active elements such as AP may increase. An increase in temperature may cause malfunction and damage to electronic devices, and the performance of active elements may be limited to prevent the above-mentioned malfunction and damage. To solve this problem, increasing the area of the structure for heat transfer and dissipation can increase the size and weight of the electronic device.
  • Various embodiments disclosed in this document can provide electronic devices with improved heat dissipation capabilities.
  • An electronic device includes at least one heating element, a substrate portion on which the heating element is disposed, a battery, a battery support frame supporting the battery inside the electronic device, and the It may include a motor disposed between the substrate portion and the battery support frame.
  • the motor is in direct or indirect contact with the substrate portion, and is in direct or indirect contact with the battery support frame and a first surface that receives heat of the heating element from the substrate portion, and transmits heat of the heating element with respect to the battery support frame. It may have a motor housing including a second surface that transmits.
  • a first thermal interface may be disposed between the first surface of the motor and the substrate and include a thermally conductive material.
  • the thermally conductive material may include a flexible material.
  • it may include a second thermal interface disposed between the second surface of the motor and the battery support frame and including a thermally conductive material.
  • the thermally conductive material may include a flexible material.
  • the substrate portion may include a heat transfer surface formed in an area facing the first side of the motor.
  • the heating element includes at least one ground electrode, and the heat transfer surface can be electrically connected to the ground electrode of the heating element.
  • the substrate portion further includes an electrical component with a lower heating value than the heating element, and the heating element may be disposed closer to an area of the substrate portion in contact with the first surface of the motor housing than the electrical component. there is.
  • the heating element may be arranged to at least partially overlap an area of the substrate portion facing the first surface of the motor.
  • An electronic device includes at least one heating element, a substrate portion on which the heating element is disposed, a heat transfer member in contact with an area of the substrate portion on which the heating element is disposed, and the electronic device. It may include a battery disposed inside the device, a battery support frame supporting the battery inside the electronic device, and a motor disposed between the heat transfer member and the battery support frame.
  • the motor is in direct or indirect contact with the heat transfer member, is in direct or indirect contact with the first surface that receives heat of the heating element from the substrate and the battery support frame, and is in contact with the battery support frame of the heating element. It may have a motor housing that includes a second side that transfers heat.
  • it may include a first thermal interface disposed between the first surface of the motor and the heat transfer member and including a thermally conductive material.
  • the thermally conductive material may include a flexible material.
  • it may include a second thermal interface disposed between the second surface of the motor and the battery support frame and including a thermally conductive material.
  • the thermally conductive material may include a flexible material.
  • the substrate portion is disposed to face the heat transfer member on one side and face the battery support frame on the other side, and the substrate portion includes a through hole formed in at least a portion of the substrate portion.
  • the motor housing may be disposed to penetrate the through hole and directly or indirectly contact the heat transfer member and the battery support frame.
  • the substrate portion may further include an electrical component with a lower heating value than the heating element, and the heating element may be disposed closer to the through hole where the motor is disposed than the electrical component.
  • An electronic device includes a heating element, a first heat transfer surface located on a heat transfer path through which heat is emitted from the heating element, and a heat transfer surface directly or indirectly connected to the heat transfer surface.
  • a motor may include a motor housing including a first surface in contact with the first surface and a second surface located in an opposite direction to the first surface, and a second heat transfer surface directly or indirectly in contact with the second surface. The motor housing may receive the heat of the heating element from the first heat transfer surface to the first surface, and transfer the heat of the heating element to the second heat transfer surface through the second surface.
  • the motor may include a first thermal interface disposed between the first surface of the motor and the first heat transfer surface and comprising a thermally conductive material.
  • the thermally conductive material may include a flexible material.
  • the motor may include a second thermal interface disposed between the second surface of the motor and the second heat transfer surface and comprising a thermally conductive material.
  • heat from the heating element diffuses through the motor housing to the battery support frame, thereby spreading the heat to a larger area of the electronic device and expanding the heat dissipation area of the electronic device, thereby increasing the heat dissipation area of the electronic device.
  • the temperature rise can be reduced or performance degradation due to temperature rise can be reduced.
  • FIG. 1 is a block diagram of an electronic device in a network environment, according to various embodiments.
  • Figure 2 is a perspective view showing an electronic device according to some embodiments of the present invention.
  • FIG. 3 is a perspective view of the rear of the electronic device of FIG. 2 according to various embodiments of the present invention.
  • FIG. 4 is an exploded perspective view of the electronic device of FIG. 2 according to various embodiments of the present invention.
  • Figure 5A is a perspective view showing internal components of an electronic device according to various embodiments of the present invention.
  • FIG. 5B is an exploded perspective view showing internal components of an electronic device according to various embodiments.
  • FIG. 5C is a cross-sectional view showing internal components of an electronic device according to various embodiments.
  • FIG. 5D is a top plan view showing a substrate portion of an electronic device according to various embodiments.
  • FIG. 5E is a bottom plan view illustrating a substrate portion of an electronic device according to various embodiments.
  • FIG. 5F is a cross-sectional view showing internal components of an electronic device according to an embodiment.
  • FIG. 6A is an exploded perspective view showing internal components of an electronic device according to various embodiments.
  • FIG. 6B is a cross-sectional view showing internal components of an electronic device according to various embodiments.
  • FIG. 6C is a plan view illustrating a substrate portion of an electronic device according to various embodiments.
  • FIG. 1 is a block diagram of an electronic device 101 in a network environment 100, according to various embodiments.
  • the electronic device 101 communicates with the electronic device 102 through a first network 198 (e.g., a short-range wireless communication network) or a second network 199. It is possible to communicate with at least one of the electronic device 104 or the server 108 through (e.g., a long-distance wireless communication network). According to one embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108.
  • a first network 198 e.g., a short-range wireless communication network
  • a second network 199 e.g., a second network 199.
  • the electronic device 101 may communicate with the electronic device 104 through the server 108.
  • the electronic device 101 includes a processor 120, a memory 130, an input module 150, an audio output module 155, a display module 160, an audio module 170, and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or may include an antenna module 197.
  • at least one of these components eg, the connection terminal 178) may be omitted or one or more other components may be added to the electronic device 101.
  • some of these components e.g., sensor module 176, camera module 180, or antenna module 197) are integrated into one component (e.g., display module 160). It can be.
  • the processor 120 for example, executes software (e.g., program 140) to operate at least one other component (e.g., hardware or software component) of the electronic device 101 connected to the processor 120. It can be controlled and various data processing or calculations can be performed. According to one embodiment, as at least part of data processing or computation, the processor 120 stores commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132. The commands or data stored in the volatile memory 132 can be processed, and the resulting data can be stored in the non-volatile memory 134.
  • software e.g., program 140
  • the processor 120 stores commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132.
  • the commands or data stored in the volatile memory 132 can be processed, and the resulting data can be stored in the non-volatile memory 134.
  • the processor 120 includes a main processor 121 (e.g., a central processing unit or an application processor) or an auxiliary processor 123 that can operate independently or together (e.g., a graphics processing unit, a neural network processing unit ( It may include a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor).
  • a main processor 121 e.g., a central processing unit or an application processor
  • auxiliary processor 123 e.g., a graphics processing unit, a neural network processing unit ( It may include a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor.
  • the electronic device 101 includes a main processor 121 and a secondary processor 123
  • the secondary processor 123 may be set to use lower power than the main processor 121 or be specialized for a designated function. You can.
  • the auxiliary processor 123 may be implemented separately from the main processor 121 or as part of it.
  • the auxiliary processor 123 may, for example, act on behalf of the main processor 121 while the main processor 121 is in an inactive (e.g., sleep) state, or while the main processor 121 is in an active (e.g., application execution) state. ), together with the main processor 121, at least one of the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) At least some of the functions or states related to can be controlled.
  • co-processor 123 e.g., image signal processor or communication processor
  • may be implemented as part of another functionally related component e.g., camera module 180 or communication module 190. there is.
  • the auxiliary processor 123 may include a hardware structure specialized for processing artificial intelligence models.
  • Artificial intelligence models can be created through machine learning. For example, such learning may be performed in the electronic device 101 itself on which the artificial intelligence model is performed, or may be performed through a separate server (e.g., server 108).
  • Learning algorithms may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but It is not limited.
  • An artificial intelligence model may include multiple artificial neural network layers.
  • Artificial neural networks include deep neural network (DNN), convolutional neural network (CNN), recurrent neural network (RNN), restricted boltzmann machine (RBM), belief deep network (DBN), bidirectional recurrent deep neural network (BRDNN), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the examples described above.
  • artificial intelligence models may additionally or alternatively include software structures.
  • the memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176) of the electronic device 101. Data may include, for example, input data or output data for software (e.g., program 140) and instructions related thereto.
  • Memory 130 may include volatile memory 132 or non-volatile memory 134.
  • the program 140 may be stored as software in the memory 130 and may include, for example, an operating system 142, middleware 144, or application 146.
  • the input module 150 may receive commands or data to be used in a component of the electronic device 101 (e.g., the processor 120) from outside the electronic device 101 (e.g., a user).
  • the input module 150 may include, for example, a microphone, mouse, keyboard, keys (eg, buttons), or digital pen (eg, stylus pen).
  • the sound output module 155 may output sound signals to the outside of the electronic device 101.
  • the sound output module 155 may include, for example, a speaker or a receiver. Speakers can be used for general purposes such as multimedia playback or recording playback.
  • the receiver can be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.
  • the display module 160 can visually provide information to the outside of the electronic device 101 (eg, a user).
  • the display module 160 may include, for example, a display, a hologram device, or a projector, and a control circuit for controlling the device.
  • the display module 160 may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of force generated by the touch.
  • the audio module 170 can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module 170 acquires sound through the input module 150, the sound output module 155, or an external electronic device (e.g., directly or wirelessly connected to the electronic device 101). Sound may be output through the electronic device 102 (e.g., speaker or headphone).
  • the electronic device 102 e.g., speaker or headphone
  • the sensor module 176 detects the operating state (e.g., power or temperature) of the electronic device 101 or the external environmental state (e.g., user state) and generates an electrical signal or data value corresponding to the detected state. can do.
  • the sensor module 176 includes, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, humidity sensor, or light sensor.
  • the interface 177 may support one or more designated protocols that can be used to connect the electronic device 101 directly or wirelessly with an external electronic device (eg, the electronic device 102).
  • the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • SD card interface Secure Digital Card interface
  • audio interface audio interface
  • connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102).
  • the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).
  • the haptic module 179 can convert electrical signals into mechanical stimulation (e.g., vibration or movement) or electrical stimulation that the user can perceive through tactile or kinesthetic senses.
  • the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.
  • the camera module 180 can capture still images and moving images.
  • the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.
  • the power management module 188 can manage power supplied to the electronic device 101.
  • the power management module 188 may be implemented as at least a part of, for example, a power management integrated circuit (PMIC).
  • PMIC power management integrated circuit
  • the battery 189 may supply power to at least one component of the electronic device 101.
  • the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.
  • Communication module 190 is configured to provide a direct (e.g., wired) communication channel or wireless communication channel between electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108). It can support establishment and communication through established communication channels. Communication module 190 operates independently of processor 120 (e.g., an application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication.
  • processor 120 e.g., an application processor
  • the communication module 190 is a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., : LAN (local area network) communication module, or power line communication module) may be included.
  • a wireless communication module 192 e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module
  • GNSS global navigation satellite system
  • wired communication module 194 e.g., : LAN (local area network) communication module, or power line communication module
  • the corresponding communication module is a first network 198 (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (e.g., legacy It may communicate with an external electronic device 104 through a telecommunication network such as a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN).
  • a telecommunication network such as a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN).
  • a telecommunication network such as a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN).
  • a telecommunication network such as a cellular network, a 5G network, a next-generation communication network
  • the wireless communication module 192 uses subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199.
  • subscriber information e.g., International Mobile Subscriber Identifier (IMSI)
  • IMSI International Mobile Subscriber Identifier
  • the wireless communication module 192 may support 5G networks after 4G networks and next-generation communication technologies, for example, NR access technology (new radio access technology).
  • NR access technology provides high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low latency). -latency communications)) can be supported.
  • the wireless communication module 192 may support high frequency bands (eg, mmWave bands), for example, to achieve high data rates.
  • the wireless communication module 192 uses various technologies to secure performance in high frequency bands, for example, beamforming, massive array multiple-input and multiple-output (MIMO), and full-dimensional multiplexing. It can support technologies such as input/output (FD-MIMO: full dimensional MIMO), array antenna, analog beam-forming, or large scale antenna.
  • the wireless communication module 192 may support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., second network 199).
  • the wireless communication module 192 supports Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mmTC, or U-plane latency (e.g., 164 dB or less) for realizing URLLC.
  • Peak data rate e.g., 20 Gbps or more
  • loss coverage e.g., 164 dB or less
  • U-plane latency e.g., 164 dB or less
  • the antenna module 197 may transmit or receive signals or power to or from the outside (eg, an external electronic device).
  • the antenna module 197 may include an antenna including a radiator made of a conductor or a conductive pattern formed on a substrate (eg, PCB).
  • the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is connected to the plurality of antennas by, for example, the communication module 190. can be selected. Signals or power may be transmitted or received between the communication module 190 and an external electronic device through the at least one selected antenna.
  • other components eg, radio frequency integrated circuit (RFIC) may be additionally formed as part of the antenna module 197.
  • RFIC radio frequency integrated circuit
  • a mmWave antenna module includes: a printed circuit board, an RFIC disposed on or adjacent to a first side (e.g., bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., mmWave band); And a plurality of antennas (e.g., array antennas) disposed on or adjacent to the second side (e.g., top or side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band. can do.
  • a first side e.g., bottom side
  • a designated high frequency band e.g., mmWave band
  • a plurality of antennas e.g., array antennas
  • peripheral devices e.g., bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)
  • signal e.g. commands or data
  • commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199.
  • Each of the external electronic devices 102 or 104 may be of the same or different type as the electronic device 101.
  • all or part of the operations performed in the electronic device 101 may be executed in one or more of the external electronic devices 102, 104, or 108.
  • the electronic device 101 may perform the function or service instead of executing the function or service on its own.
  • one or more external electronic devices may be requested to perform at least part of the function or service.
  • One or more external electronic devices that have received the request may execute at least part of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device 101.
  • the electronic device 101 may process the result as is or additionally and provide it as at least part of a response to the request.
  • cloud computing distributed computing, mobile edge computing (MEC), or client-server computing technology can be used.
  • the electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing.
  • the external electronic device 104 may include an Internet of Things (IoT) device.
  • Server 108 may be an intelligent server using machine learning and/or neural networks.
  • the external electronic device 104 or server 108 may be included in the second network 199.
  • the electronic device 101 may be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.
  • FIG. 2 is a perspective view of the front of an electronic device according to one embodiment.
  • FIG. 3 is a perspective view of the rear of the electronic device of FIG. 2 according to one embodiment.
  • FIG. 4 is an exploded perspective view of the electronic device of FIG. 2 according to one embodiment.
  • the electronic device 101 includes a first side (or front) 210A, a second side (or back) 210B, and a first side 210A. and a housing 210 including a side 210C surrounding the space between the second surfaces 210B, and connected to at least a portion of the housing 210 and used to connect the electronic device 101 to a part of the user's body (e.g. : Wrist, ankle) may include binding members (250, 260) configured to be detachably fastened to the wrist.
  • the binding members 250 and 260 may be, for example, straps that are wrapped around the user's wrist to secure the electronic device 101.
  • the housing may refer to a structure that forms some of the first side 210A, second side 210B, and side surface 210C of FIG. 1 .
  • the first surface 210A may be formed at least in part by a substantially transparent front plate 201 (eg, a glass plate including various coating layers, or a polymer plate).
  • the second surface 210B may be formed by the rear plate 207.
  • the back plate 207 may be formed, for example, by coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. It can be.
  • the side 210C combines with the front plate 201 and the back plate 207 and may be formed by a side bezel structure (or “side member”) 206 comprising metal and/or polymer.
  • the back plate 207 and side bezel structures 206 may be integrally formed and include the same material (eg, a metallic material such as aluminum).
  • the binding members 250 and 260 may be formed of various materials and shapes. One-piece and multiple unit links may be formed to be able to flow with each other using fabric, leather, rubber, synthetic resin, metal, ceramic, or a combination of at least two of the above materials.
  • the electronic device 101 includes a display 220 (see FIG. 3), an audio module 205, 208, a sensor module 211, a key input device 202, 203, 204, and a connector hole ( 209) may include at least one of the following. In some embodiments, the electronic device 101 omits at least one of the components (e.g., the key input device 202, 203, 204, the connector hole 209, or the sensor module 211) or has another configuration. Additional elements may be included.
  • Display 220 may be visually exposed, for example, through a significant portion of front plate 201 .
  • the shape of the display 220 may correspond to the shape of the front plate 201 and may be circular, oval, or polygonal.
  • the display 220 may be combined with or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the strength (pressure) of a touch, and/or a fingerprint sensor.
  • the audio modules 205 and 208 may include a microphone hole 205 and a speaker hole 208.
  • a microphone for acquiring external sound may be placed inside the microphone hole 205, and in some embodiments, a plurality of microphones may be placed to detect the direction of sound.
  • the speaker hole 208 can be used as an external speaker and a receiver for calls.
  • the speaker hole 208 and the microphone hole 203 may be implemented as one hole, or a speaker may be included without the speaker hole 208 (e.g., piezo speaker).
  • the sensor module 211 may generate an electrical signal or data value corresponding to the internal operating state of the electronic device 101 or the external environmental state.
  • the sensor module 211 may include, for example, a biometric sensor module (e.g., HRM sensor, oxygen saturation sensor, and/or blood sugar sensor) disposed toward the second surface 210B of the housing 210.
  • the electronic device 101 includes sensor modules not shown, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, It may further include at least one of a humidity sensor or an illuminance sensor.
  • the key input devices 202, 203, and 204 include a wheel key 202 disposed on the first side 210A of the housing 210 and rotatable in at least one direction, and/or a side 210C of the housing 210. ) may include side key buttons 203 and 204 arranged in the
  • the wheel key 202 may have a shape corresponding to the shape of the front plate 201.
  • the electronic device 101 may not include some or all of the above-mentioned key input devices 202, 203, and 204, and the key input devices 202, 203, and 204 that are not included may be displayed. It may be implemented in the form of a soft key or touch key on (220).
  • the connector hole 209 can accommodate a connector (for example, a USB connector) for transmitting and receiving power and/or data with an external electronic device and can accommodate a connector for transmitting and receiving an audio signal with an external electronic device.
  • a connector for example, a USB connector
  • Other connector holes may be included.
  • the electronic device 101 may further include, for example, a connector cover (not shown) that covers at least a portion of the connector hole 209 and blocks external foreign substances from entering the connector hole 209.
  • the fastening members 250 and 260 may be detachably fastened to at least some areas of the housing 210 using locking members 251 and 261.
  • the binding members 250 and 260 may include one or more of a fixing member 252, a fixing member fastening hole 253, a band guide member 254, and a band fixing ring 255.
  • the fixing member 252 may be configured to fix the housing 210 and the binding members 250 and 260 to a part of the user's body (eg, wrist, ankle).
  • the fixing member fastening hole 253 may correspond to the fixing member 252 and fix the housing 210 and the fastening members 250 and 260 to a part of the user's body.
  • the band guide member 254 is configured to limit the range of movement of the fixing member 252 when the fixing member 252 is fastened to the fixing member fastening hole 253, so that the fastening members 250 and 260 are attached to parts of the user's body. It can be made to adhere tightly.
  • the band fixing ring 255 may limit the range of movement of the fastening members 250 and 260 when the fixing member 252 and the fixing member fastening hole 253 are fastened.
  • the electronic device 101 includes a side bezel structure 210, a wheel key 420, a front plate 201, a display 220, a first antenna 450, and a second antenna 455. , a support member 460 (e.g., bracket), battery 470, printed circuit board 480, front frame 490, rear plate 207, and fastening members 495 and 497.
  • the support member 460 may be disposed inside the electronic device 101 and connected to the side bezel structure 410, or may be formed integrally with the side bezel structure 410.
  • the support member 460 may be formed of, for example, a metallic material and/or a non-metallic (eg, polymer) material.
  • the support member 460 may have a display 220 coupled to one side and a printed circuit board 480 coupled to the other side.
  • the printed circuit board 480 includes a processor (e.g., processor 120 in FIG. 1), memory (e.g., memory 130 in FIG. 1), and/or an interface (e.g., interface 177 in FIG. 1). Can be installed.
  • the processor may include, for example, one or more of a central processing unit, an application processor, a graphic processing unit (GPU), an application processor, a sensor processor, or a communication processor.
  • Memory may include, for example, volatile memory or non-volatile memory.
  • the interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface.
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • the interface may electrically or physically connect the electronic device 101 to an external electronic device and may include a USB connector, SD card/MMC connector, or audio connector.
  • the battery 470 (e.g., battery 189 in FIG. 1) is a device for supplying power to at least one component of the electronic device 101, for example, a non-rechargeable primary battery, or a rechargeable battery. It may include a secondary battery or fuel cell. At least a portion of the battery 470 may be disposed, for example, on substantially the same plane as the printed circuit board 480 .
  • the battery 470 may be placed integrally within the electronic device 101, or may be placed to be detachable from the electronic device 101.
  • the first antenna 450 may overlap the second antenna 455 and be disposed between the circuit board 480 and the rear plate 207.
  • the first antenna 450 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna.
  • NFC near field communication
  • MST magnetic secure transmission
  • the first antenna 450 can perform short-range communication with an external device, wirelessly transmit and receive power required for charging, and transmit a short-range communication signal or a self-based signal including payment data.
  • an antenna structure may be formed by some or a combination of the side bezel structure 410 and/or the support member 460.
  • the first antenna 450 may be disposed on the circuit board 480 in the form of a chip antenna.
  • the second antenna 455 may be disposed between the circuit board 480 and the rear plate 207.
  • the second antenna 455 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna.
  • NFC near field communication
  • MST magnetic secure transmission
  • the second antenna 455 can perform short-range communication with an external device, wirelessly transmit and receive power required for charging, and transmit a short-range communication signal or a self-based signal including payment data.
  • an antenna structure may be formed by a portion or a combination of the side bezel structure 410 and/or the rear plate 207.
  • the biometric sensor module 211 may be disposed adjacent to the back plate 207 so that the back plate 207 is oriented toward the wearer's body.
  • the biometric sensor module 211 can transmit signals in various wavelength bands to the wearer's body, and various biometric information (e.g., heart rate, blood sugar level, etc.) from signals in the wavelength bands that are reflected, scattered, and/or absorbed from the user's body. and/or oxygen saturation) can be measured.
  • the rear plate 207 may include a rear window 207a through which the above-described signals are transmitted to or from the user's body.
  • the front frame 490 may be arranged to face one side of the printed circuit board 480 and may be configured to support the internal printed circuit board 480 of the electronic device 101.
  • Figure 5A is a perspective view showing internal components of an electronic device according to various embodiments of the present invention.
  • FIG. 5B is an exploded perspective view showing internal components of an electronic device according to various embodiments.
  • FIG. 5C is a cross-sectional view showing internal components of an electronic device according to various embodiments.
  • FIG. 5D is a top plan view showing the substrate portion 540 of an electronic device according to various embodiments.
  • FIG. 5E is a bottom plan view showing the substrate portion 540 of an electronic device according to various embodiments.
  • FIG. 5F is a cross-sectional view showing internal components of an electronic device according to an embodiment.
  • FIGS. 5C and 5F are cut along the A-A' direction of FIG. 5A.
  • Figure 5e is a plan view showing the opposite side of the side shown in Figure 5d.
  • the electronic device (e.g., the electronic device 101 of FIGS. 2 to 4) includes a battery 510 (e.g., the battery 510 and 470 of FIG. 4, battery support) as an internal component. It may include a frame 511, a bracket 520 (eg, the support member 460 in FIG. 4), a motor 530, and a substrate unit 540.
  • a battery 510 e.g., the battery 510 and 470 of FIG. 4, battery support
  • It may include a frame 511, a bracket 520 (eg, the support member 460 in FIG. 4), a motor 530, and a substrate unit 540.
  • the bracket 520 is a mount space formed to mount various internal components of the electronic device, such as the battery 510 and the motor 530, inside the electronic device (e.g., the motor mount space 521 ), battery mount space 522), and may be a member that protects from risk factors such as external force, deformation, and collision.
  • the bracket 520 may include non-conductive materials, such as various polymer materials such as nylon, HDPE, PP, and polycarbonate (PC).
  • the printed board assembly (PBA) 540 includes at least one printed circuit board (for example, the printed circuit board 480 of FIG. 4) and may be a region where various electrical components of an electronic device are placed.
  • the printed circuit board may be a single-layer board or a multi-layer laminated board.
  • At least one heating element 551, 552 is disposed on the substrate 540.
  • the heating elements 551 and 552 are components that generate heat by consuming power during the operation of the electronic device, such as an AP (e.g., the processor 120 of FIG. 1), a PMIC, an MMPA, or various active elements or integrated circuits similar thereto. It can be included.
  • the heating element may include ground electrodes 551a and 552a (eg, a ground pin, a ground solder ball, and/or a ground land) that ground the heating element for electrical operation of the heating element.
  • ground electrodes 551a and 552a eg, a ground pin, a ground solder ball, and/or a ground land
  • the heating elements 551 and 552 are shown as being disposed on one side of the substrate 540, but this is an example that does not limit the invention, and the heating elements 551 and 552 are shown in various embodiments below. It will be obvious to those skilled in the art that it can be disposed on one or both sides of the substrate portion 540, unless it contradicts the description.
  • the battery 510 (e.g., the batteries 510 and 470 in FIG. 4) is a device disposed inside an electronic device to supply power to at least one component, and includes a rechargeable secondary battery, such as a lithium ion battery, It may include a lithium polymer battery or similar.
  • the battery support frame 511 is a member that supports the battery 510 inside the electronic device and protects it from impact and external force.
  • the battery support frame 511 may include a metal material with good rigidity and thermal conductivity, such as stainless steel.
  • the battery support frame 511 may be combined with the bracket 520 to secure the battery 510 to the bracket 520.
  • the motor 530 is a part that is placed inside the electronic device and is rotated by electric power to generate vibration in the electronic device to transmit tactile information to the user or provide tactile feedback.
  • motor 530 includes a motor housing 531 that protects the internal components of motor 530.
  • the material of the motor housing 531 may include a metal material with good strength and thermal conductivity, such as aluminum, stainless steel, and/or various copper alloys.
  • the motor 530 may be disposed between the substrate 540 and the battery support frame 511.
  • the motor housing 531 includes a first surface 532 in direct or indirect contact with the substrate portion 540 and a second surface 533 in direct or indirect contact with the battery support frame 511. can do.
  • the first surface 532 of the motor housing 531 is in direct contact (e.g., contact capable of at least heat transfer) with the substrate portion 540, or indirectly (e.g., contact with the heat transfer member 502 or the first thermal interface). (via 534) and is brought into contact (e.g. contact capable of at least heat transfer). Accordingly, it is configured to receive heat from the heating element 551 from the substrate portion 540.
  • the second surface 533 is in direct contact (e.g., at least a contact capable of heat transfer) or indirect (e.g., through the second thermal interface 535) contact (e.g., at least a contact capable of heat transfer) with respect to the battery support frame 511. contact). Therefore, it is configured to move the heat of the heating element 551 to the battery support frame 511.
  • the electronic device may further include a heat transfer member 502.
  • the heat transfer member 502 may be a member that assists in dispersing the heat of the heating elements 551 and 552 and ultimately dissipating it to the outside of the electronic device. That is, by employing the heat transfer member 502 and the battery support frame 511, the heat generated from the heating elements 551 and 552 can be dissipated to both sides of the electric device, preventing malfunction and damage to the electronic device. The performance capacity of active elements of electronic devices can be further increased.
  • the heat transfer member 502 may be a front frame (eg, front frame 490 in FIG. 4) of an electronic device.
  • the heat transfer member 502 may be disposed to indirectly contact the thermal interface material (TIM) 503 .
  • an electronic device may include a first heat transfer surface 504 .
  • the first heat transfer surface 504 may be located on the heat transfer path H through which heat generated from the heating elements 551 and 552 is transferred.
  • the first heat transfer surface 504 may be a surface that transfers heat from the heating elements 551 and 552 to the first surface 532 of the motor housing 531.
  • the first heat transfer surface 504 may be formed on the surface of the substrate portion 540.
  • the first heat transfer surface 504 may be formed on an area of the substrate portion 540 that contacts the first surface 532 of the motor housing 531 .
  • the first surface 532 of the motor housing 531 may directly contact the first heat transfer surface 504 to receive heat; however, in another embodiment, the first surface 532 of the motor housing 531 may receive heat transfer.
  • Surface 532 may indirectly contact first heat transfer surface 504 by first thermal interface 534 .
  • the first thermal interface 534 includes a thermally conductive material and is disposed between the first side 532 of the motor housing 531 and the first heat transfer surface 504, such that the first heat transfer surface 504 and It may be a member that improves heat transfer efficiency by reducing thermal resistance between the first surfaces 532 of the motor housing 531.
  • the first thermal interface 534 may include a thermal pad, thermal tape, conductive or non-conductive thermal paste, etc.
  • the thermally conductive material may include a material with a high heat transfer coefficient, such as, for example, graphite sheet, carbon fiber, metal powder, liquid or semi-liquid metal, and/or powdered diamond. there is.
  • the thermally conductive material of the first thermal interface 534 may include a flexible material, such as a silicone binder. Since the first thermal interface 534 includes a flexible material, noise, damage, malfunction, and first surface 532 are prevented by collision between the motor housing 531 and the substrate 540 as the motor 530 vibrates. and increased thermal resistance due to lifting between the first heat transfer surfaces 504.
  • the first thermal interface 534 may be a thermal tape that is adhesive on both sides to provide an adhesive between the first side 532 and the first heat transfer surface 504. Thermal tape can secure the motor 530 inside the electronic device. The thermal tape can at least partially replace the fixing member, such as double-sided tape, used for fixing the motor 530, and can be used to secure the first heat transfer surface 504 and the first side 532 of the motor housing 531. Adhesion can be improved.
  • electronic devices may include a second heat transfer surface 505 .
  • the second heat transfer surface 505 may be a surface located on the heat transfer path (H) that receives the heat received by the motor housing 531, distributes it inside the electronic device, and ultimately radiates it to the outside of the electronic device. there is.
  • a second heat transfer surface 505 may be formed on the surface of the battery support frame 511.
  • the second heat transfer surface 505 may be formed in an area of the battery support frame 511 that contacts the second side 533 of the motor housing 531 .
  • the second surface 533 of the motor housing 531 may directly contact the second heat transfer surface 505 to receive heat; however, in another embodiment, the second surface 533 of the motor housing 531 may receive heat transfer.
  • Surface 533 may indirectly contact second heat transfer surface 505 by means of second thermal interface 535 .
  • the second thermal interface 535 includes a thermally conductive material and is disposed between the second side 533 of the motor housing 531 and the second heat transfer surface 505 to It may be a member that improves heat transfer efficiency by reducing thermal resistance between the second surface 533 of the motor housing 531.
  • the second thermal interface 535 may include a thermal pad, thermal tape, and/or conductive or non-conductive thermal paste.
  • the thermally conductive material may include, for example, a material with a high thermal conductivity coefficient, such as graphite sheet, carbon fiber, metal powder, liquid or semi-liquid metal, and/or powdered diamond.
  • the thermally conductive material of the second thermal interface 535 may include a flexible material, such as a silicone binder.
  • the second thermal interface 535 includes a flexible material, noise, damage, malfunction, and second surface 533 due to collision between the motor housing 531 and the battery support frame 511 as the motor 530 vibrates. ) and the increase in thermal resistance due to lifting between the second heat transfer surface 505 can be reduced.
  • the second thermal interface 535 may be a thermal tape that is adhesive on both sides to adhere between the second side 533 and the second heat transfer surface 505 .
  • Thermal tape can secure the motor 530 inside the electronic device.
  • the thermal tape can at least partially replace the fixing member, such as double-sided tape, used for fixing the motor 530 and the second heat transfer surface 505 and the second side 533 of the motor housing 531. Adhesion can be improved.
  • the substrate portion 540 may include a ground pad 541 and at least one ground wire 542 formed on an area of the substrate portion 540.
  • the ground pad 541 may contact the first surface 532 of the motor housing 531 directly or indirectly.
  • the side of the ground pad 541 that contacts the first side 532 of the motor housing 531 may be the first heat transfer surface 504 .
  • the ground pad 541 may be a flat metal pattern printed on the surface of the printed circuit board. In some embodiments, the shape of the ground pad 541 may be substantially the same as the first surface 532 of the motor housing 531.
  • the ground wire 542 may be an electric wire with one end electrically connected to the ground pad 541 and the other end electrically connected to the ground electrodes 551a and 551b of the heating elements 551 and 552.
  • the ground wire 542 may be a metal pattern printed on the surface of a printed circuit board of the substrate unit 540 or on the inside of a laminated printed circuit board.
  • the ground wire 542 interconnects the heating elements 551 and 552 and the ground pad 541, so that the ground wire 542 forms part of the heat transfer path (H) to transfer heat from the heating unit to the first heat transfer surface ( 504) and the motor housing 531. This has the advantage that effective heat transfer can be achieved in addition to the grounding effect of the electrical components when the heating elements 551, 552 are located further away from the motor housing 531 due to potential structural requirements.
  • the heating elements 551 and 552 are in contact with the first surface 532 of the motor housing 531 in the substrate portion 540, such as the first heat transfer surface 504 to ground. It may be placed adjacent to the pad 541. For example, the heating elements 551 and 552 may be disposed closer to the first heat transfer surface 504 to the ground pad 541 than other electrical components 543 disposed in the substrate portion 540.
  • Other electrical components 543 may include passive elements such as resistors, capacitors, and inductors, or various active elements that generate less heat during operation than the heating elements 551 and 552.
  • the heating elements 551 and 552 are disposed adjacent to the motor housing 531 on the substrate 540, thereby shortening the heat transfer path from the heating elements 551 and 552 to the motor housing 531 and reducing thermal resistance.
  • the heat dissipation efficiency of the electronic device can be increased and the temperature of the heating elements 551 and 552 can be maintained lower, or the performance of the heating elements 551 and 552 can be increased while minimizing temperature increase.
  • the heating elements 551 and 552 may be arranged to at least partially overlap the area of the substrate portion 540 facing the first surface 532 of the motor housing 531.
  • the heating elements 551 and 552 are disposed on one side of the substrate 540, and the ground pad 541 is disposed on the other side, and the heating elements 551 and 552 and the ground pad 541 are at least close to each other. They can be arranged to partially overlap.
  • the heat transfer path between the heating elements 551 and 552 and the ground pad 541 can be shortened and the thermal resistance can be reduced, so the heat dissipation efficiency of the electronic device is increased and the heating elements 551 and 552 ) can be maintained lower, or the performance of the heating elements 551 and 552 can be increased while minimizing temperature increase.
  • FIG. 5F reference may be made to the description of FIGS. 5A to 5E, as long as the technical features described with reference to FIGS. 5A to 5E are not inconsistent with the features of FIG. 5F. It will be apparent to those skilled in the art that combinations can be made.
  • FIG. 6A is an exploded perspective view showing internal components of an electronic device according to various embodiments.
  • FIG. 6B is a cross-sectional view showing internal components of an electronic device according to various embodiments.
  • FIG. 6C is a plan view showing the substrate portion 540 of an electronic device according to various embodiments.
  • FIG. 6B is a cross section taken in the B-B' direction of FIGS. 6A and 6C.
  • electronic devices may include a heat transfer member 502.
  • the heat transfer member 502 may be disposed on one side of the substrate 540 and may be a member that receives heat from the heating elements 551 and 552 and moves and disperses it.
  • the heat transfer member 502 may include a metal material with good thermal conductivity, such as aluminum or stainless steel.
  • the heat transfer member 502 may contact the heating elements 551 and 552 directly or indirectly through a thermal interface material (TIM).
  • TIM thermal interface material
  • the motor 530 may be disposed between the heat transfer member 502 and the battery support frame 511.
  • the first surface 532 of the motor housing 531 may directly or indirectly contact the heat transfer member 502.
  • the second surface 533 of the motor housing 531 may directly or indirectly contact the battery support frame 511.
  • a first heat transfer surface 504 may be located on an area of the heat transfer member 502 that abuts the first side 532 of the motor housing 531 . Between the first heat transfer surface 504 and the first side 532 of the motor housing 531 is a first thermal interface 534 comprising a thermally conductive material, such as a thermal pad or thermal tape. ) and/or conductive or non-conductive thermal paste may be placed.
  • a second heat transfer surface 505 may be located on the area of the battery support frame 511 that abuts the second side 533 of the motor housing 531 . Between the second heat transfer surface 505 and the second side 533 of the motor housing 531 is a second thermal interface 535 comprising a thermally conductive material, such as a thermal pad, thermal tape. ), conductive or non-conductive TIM (thermal interface material) may be located.
  • the first thermal interface 534 and the second thermal interface 535 may include a flexible material.
  • the heat generated from the heating elements 551 and 552 is transferred to the heat transfer member 502, and is transferred to the motor housing 531 through the first heat transfer surface 504 of the heat transfer member 502. It may be transferred to the first side 532 and from the second side 533 of the housing through the second heat transfer surface 505 to the battery support frame 511 to be dispersed and released. Since the heat transfer member 502 is made of a material with good thermal conductivity, for example, a metal material, heat from the heating elements 551 and 552 can be effectively transferred to the motor housing 531.
  • the substrate portion 540 may include a through hole 544 penetrating the substrate portion 540 in one area.
  • the motor 530 may be arranged to penetrate the substrate portion 540 through the through hole 544.
  • the shape of the through hole 544 may be substantially the same as the cross-sectional shape of the motor 530 passing through the through hole 544.
  • the motor 530 is arranged to penetrate the substrate 540 through the through hole 544, thereby forming a heat transfer member 502 and a substrate portion ( Heat may be transferred by contacting each of the battery support frames 511 located in the second direction (eg, z-direction) of 540).
  • the heating elements 551 and 552 may be disposed adjacent to the through hole 544 in the substrate portion 540.
  • the heating elements 551 and 552 may be disposed closer to the through hole 544 than other electrical components 543 disposed on the substrate portion 540.
  • Other electrical components 543 may include passive elements such as resistors, capacitors, and chip inductors, or various active elements that generate less heat during operation than the heating elements 551 and 552.
  • the heating elements 551 and 552 are disposed adjacent to the through hole 544 in the substrate portion 540, thereby shortening the heat transfer path from the heating elements 551 and 552 to the motor housing 531 and reducing thermal resistance. By reducing, the heat dissipation efficiency of the electronic device can be increased and the temperature of the heating elements 551 and 552 can be maintained lower, or the performance of the heating elements 551 and 552 can be increased while minimizing temperature increase.
  • FIGS. 6A to 6C the description of FIGS. 5A to 5E may be referred to, unless there is a contradiction between the technical features described with reference to FIGS. 5A to 5E. It will be apparent to those skilled in the art that the features of FIGS. 6A to 6C can be combined to the extent possible.
  • An electronic device includes at least one heating element 551 and 552, a substrate portion 540 on which the heating elements 551 and 552 are disposed, a battery 510,
  • the electronic device may include a battery support frame 511 supporting the battery 510 and a motor 530 disposed between the substrate 540 and the battery support frame 511.
  • the motor 530 has a first surface 532 that is in direct or indirect contact with the substrate 540 and receives heat from the heating elements 551 and 552 from the substrate 540, and the battery support frame. It may have a motor housing 531 that is in direct or indirect contact with 511 and includes a second surface 533 that transfers heat of the heating elements 551 and 552 to the battery support frame 511.
  • it may include a first thermal interface 534 disposed between the first surface 532 of the motor 530 and the substrate 540 and including a thermally conductive material. You can.
  • the thermally conductive material may include a flexible material.
  • it is disposed between the second surface 533 of the motor 530 and the battery support frame 511 and includes a second thermal interface 535 including a thermally conductive material. can do.
  • the thermally conductive material may include a flexible material.
  • the substrate portion 540 may include a heat transfer surface formed in an area facing the first surface 532 of the motor 530.
  • the heating elements 551 and 552 include at least one ground electrode 551a and 551b, and the heat transfer surface is electrically connected to the ground electrodes 551a and 551b of the heating elements 551 and 552. It can be connected to .
  • the substrate portion 540 further includes electrical components with a lower heating value than the heating elements 551 and 552, and the heating elements 551 and 552 have a lower heating value than the electrical components in the motor housing 531. It may be placed closer to the area of the substrate portion 540 that is in contact with the first surface of .
  • the heating elements 551 and 552 may be arranged to at least partially overlap an area of the substrate portion 540 facing the first surface of the motor 530.
  • An electronic device includes at least one heating element 551 and 552, a substrate portion 540 on which the heating elements 551 and 552 are disposed, and the heating element 551. , a heat transfer member in contact with the area of the substrate 540 where 552) is disposed, a battery 510 disposed inside the electronic device, and a battery support frame supporting the battery 510 inside the electronic device.
  • (511) and may include a motor 530 disposed between the heat transfer member and the battery support frame 511.
  • the motor 530 has a first surface 532 that is in direct or indirect contact with the heat transfer member and receives heat from the heating elements 551 and 552 from the substrate 540, and the battery support frame 511.
  • it may include a first thermal interface 534 that is disposed between the first surface 532 of the motor 530 and the heat transfer member and includes a thermally conductive material. .
  • the thermally conductive material may include a flexible material.
  • it is disposed between the second surface 533 of the motor 530 and the battery support frame 511 and includes a second thermal interface 535 including a thermally conductive material. can do.
  • the thermally conductive material may include a flexible material.
  • the substrate portion 540 is disposed to face the heat transfer member on one side and the battery support frame 511 on the other side, and the substrate portion 540 is disposed to face the heat transfer member. It includes a through hole 544 formed in at least a portion of the portion 540, and the motor housing 531 passes through the through hole 544 and is directly or directly connected to the heat transfer member and the battery support frame 511. It can be arranged to touch indirectly.
  • the substrate portion 540 further includes electrical components with a lower heating value than the heating elements 551 and 552, and the heating elements 551 and 552 have a lower heating value than the electrical components. It may be placed closer to the through hole 544.
  • An electronic device includes a first heating element (551, 552) located on a heat transfer path (H) through which heat is emitted from the heating elements (551, 552). Having a motor housing (531) comprising a heat transfer surface, a first side (532) directly or indirectly in contact with the heat transfer surface and a second side (533) located in an opposite direction to the first side (532).
  • the motor 530 may include a second heat transfer surface directly or indirectly in contact with the second surface 533 .
  • the motor housing 531 receives the heat of the heating elements 551 and 552 from the first heat transfer surface to the first surface 532 and transmits the heat to the second heat transfer surface through the second surface 533. The heat of the heating elements 551 and 552 can be transferred.
  • a first thermal interface 534 is disposed between the first surface 532 of the motor 530 and the first heat transfer surface and includes a thermally conductive material. You can.
  • the thermally conductive material may include a flexible material.
  • a second thermal interface 535 is disposed between the second surface 533 of the motor 530 and the second heat transfer surface and includes a thermally conductive material. You can.
  • the electronic devices 101, 102, and 104 include at least one heating element 551.
  • the electronic devices 101, 102, 104 include a printed board assembly on which the heating elements 551, 552 are disposed, batteries 189, 470, 510, and a battery support frame 511 configured to support the batteries 189, 470, 510. and a motor 530.
  • the motor 530 may be disposed between the printed board assembly 540 and the battery support frame 511. Additionally, the motor 530 includes a motor housing 531. Motor 530 (including motor housing) may be partially or fully disposed between printed board assembly 540 and battery support frame 511.
  • the motor housing 531 is in direct or indirect contact with the printed board assembly 540 and includes a first surface 532 configured to receive heat from the heating element 551 from the printed board assembly. That is, the first surface 532 of the motor housing 531 is in direct (at least thermally conductive) contact with the substrate portion 540 or indirect (at least thermally conductive) contact (e.g., with the heat transfer member 502 or the first thermal interface). (via (534)). Accordingly, it is configured to receive heat from the heating elements 551 and 552 from the printed board assembly.
  • the motor housing 531 further includes a second surface 210B, 533 that is in direct or indirect contact with the battery support frame 511 and is configured to transfer heat from the heating element to the battery support frame 511.
  • the second surface 210B, 533 is in direct (at least thermally conductive) contact or indirect (at least thermally conductive) contact (e.g., via second thermal interface 535) with the battery support frame 511. Therefore, it is configured to transfer the heat of the heating element to the battery support frame 511.
  • the electronic device may further include a heat transfer member 502 configured to contact the area of the substrate on which the heat generating element is disposed, where the motor 530 is positioned between the heat transfer member 502 and the battery support frame 511.
  • the motor 530 may be positioned completely between heat transfer member 502 and battery support frame 511 .
  • the first surface 532 of the motor housing 331 is configured to directly contact the substrate and indirectly contact the heat transfer member 502, or to indirectly contact the substrate and directly contact the heat transfer member 502 to contact the substrate portion. It may be configured to receive heat from the heating elements 551 and 552.
  • the heat generated by the heating elements 551 and 552 is distributed to both sides of the electronic device to prevent malfunction and damage to the electronic device, and to improve the performance of the active element. There is an advantage in that capacity can be further increased.
  • the electronic device may further include a first thermal interface 534 that includes a thermally conductive material.
  • the first thermal interface 534 may be disposed between the first surface 532 of the motor housing 531 and the substrate portion, or between the first surface 532 of the motor housing 531 and the heat transfer member 502. It can be placed in between.
  • the first thermal interface 534 improves heat transfer efficiency by reducing thermal resistance between the first surface 532 of the motor housing 531 and the substrate portion or heat transfer member 502.
  • the electronic device may further include a second thermal interface 535 disposed between the second side 210B, 533 of the motor housing 531 and the battery support frame 511 and comprising a thermally conductive material. You can.
  • the thermally conductive material of the above-described embodiments may include a flexible material.
  • the flexible material not only prevents damage or malfunction due to collision between the motor housing 531 and the printed board assembly 540 when the motor 530 vibrates, but also has the advantage of reducing noise. Additionally, this can prevent an increase in thermal resistance due to separation between the first surface 532 and the first heat transfer surface 504.
  • the substrate portion may include a heat transfer surface formed in an area facing the first side 532 of the motor housing 531.
  • the heating element 551 may include at least one ground electrode 551a, and the heat transfer surface is electrically connected to the ground electrode of the heating element. This has the advantage of reducing thermal resistance while grounding the device.
  • the printed board assembly 540 may include a ground pad 541 and at least one ground wire 542 formed in that area, where the ground pad 541 forms a heat transfer surface 504.
  • the ground wire 542 has one end electrically connected to the ground pad 541 and the other end to the ground electrode of the heating element 551. It is electrically connected to (551a). This has the advantage that, in addition to the grounding effect of the elements, effective heat transfer can be achieved when the heating elements 551, 552 are placed further away from the motor housing 531 due to potential structural necessities.
  • the substrate portion may further include an electrical component with a lower heat generation amount than the heat generating element, where the heat generating element is in contact with the first surface 532 of the motor housing 531 rather than the electrical component. It can be placed closer to the area of the substrate. That is, because the heating elements 551 and 552 are disposed adjacent to (i.e., closer to) the motor housing 531 in the substrate portion 540 than other electrical components, the heat from the heating elements 551 and 552 to the motor housing 531 The heat transfer path is shortened and thermal resistance is reduced, thereby increasing the heat dissipation efficiency of the electronic device and improving the performance of the heating elements 551 and 552 while keeping the temperature of the heating elements 551 and 552 low or minimizing temperature increase. .
  • the heating element may be disposed to at least partially overlap the area of the substrate portion facing the first surface 532 of the motor housing 531.
  • the heat transfer path between the heating elements 551 and 552 and the first surface 532 of the motor housing 531 is shortened by the overlapping arrangement, so the thermal resistance is reduced and the heat dissipation efficiency of the electronic device is increased.
  • the performance of the heating elements 551 and 552 can be improved while keeping the temperature of the heating elements 551 and 552 low or minimizing the temperature rise.
  • the substrate portion may be disposed to face the heat transfer member 502 on one surface and toward the battery support frame 511 on the other surface.
  • the substrate portion may include a through hole 544 formed in at least a portion of the substrate portion.
  • the motor housing 531 may be arranged to directly or indirectly contact the heat transfer member 502 and the battery support frame 511 through the through hole 544.
  • the substrate portion may include an electrical component with a lower heating value than the heating elements 551 and 552, and the heating elements 551 and 552 are located closer to the through hole 544 where the motor 530 is disposed than the electrical components. can be placed.
  • the heat transfer path from the heating elements 551 and 552 to the motor housing 531 is shortened, thereby reducing the thermal resistance. This is reduced, and there is an advantage of increasing the heat dissipation efficiency of the electronic device and improving the performance of the heating elements 551 and 552 by keeping the temperature of the heating elements 551 and 552 low or minimizing the temperature rise.
  • the material of the motor housing 531 may include a metal, preferably a metal selected from one of aluminum, stainless steel, and copper alloys.
  • the metal is an excellent heat conductor and is less prone to corrosion, which has the advantage of increasing heat transfer efficiency and improving the lifespan of electronic devices.

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • Telephone Set Structure (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

L'invention divulgue un dispositif électronique comprenant un boîtier de moteur. Un dispositif électronique selon divers modes de réalisation de la présente invention est un dispositif électronique comprenant au moins un élément chauffant, et peut comprendre : un substrat sur lequel est disposé l'élément chauffant ; une batterie ; un cadre de support de batterie qui supporte la batterie à l'intérieur du dispositif électronique ; et un moteur disposé entre le substrat et le cadre de support de batterie. Le moteur peut avoir un boîtier de moteur comprenant : une première surface qui est en contact direct ou indirect avec le substrat et reçoit de la chaleur de l'élément chauffant en provenance du substrat ; et une seconde surface qui est en contact direct ou indirect avec le cadre de support de batterie et transfère la chaleur de l'élément chauffant au cadre de support de batterie.
PCT/KR2023/010181 2022-07-19 2023-07-17 Dispositif électronique comprenant un boîtier de moteur WO2024019450A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP23758197.0A EP4336277A1 (fr) 2022-07-19 2023-07-17 Dispositif électronique comprenant un boîtier de moteur

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR10-2022-0089204 2022-07-19
KR20220089204 2022-07-19
KR1020220114205A KR20240011590A (ko) 2022-07-19 2022-09-08 모터 하우징을 포함하는 전자 장치
KR10-2022-0114205 2022-09-08

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WO2024019450A1 true WO2024019450A1 (fr) 2024-01-25

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EP (1) EP4336277A1 (fr)
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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180025126A (ko) * 2016-08-31 2018-03-08 삼성전자주식회사 안테나 및 이를 구비하는 전자 장치
KR20190064996A (ko) * 2017-12-01 2019-06-11 엘지디스플레이 주식회사 전자 기기
KR20190096593A (ko) * 2018-02-09 2019-08-20 삼성전자주식회사 방열 구조 및 이를 포함하는 전자 장치
KR20200100973A (ko) * 2019-02-19 2020-08-27 삼성전자주식회사 열전달 부재 및 이를 포함하는 전자 장치
KR20220066637A (ko) * 2020-11-16 2022-05-24 삼성전자주식회사 웨어러블 전자 장치

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180025126A (ko) * 2016-08-31 2018-03-08 삼성전자주식회사 안테나 및 이를 구비하는 전자 장치
KR20190064996A (ko) * 2017-12-01 2019-06-11 엘지디스플레이 주식회사 전자 기기
KR20190096593A (ko) * 2018-02-09 2019-08-20 삼성전자주식회사 방열 구조 및 이를 포함하는 전자 장치
KR20200100973A (ko) * 2019-02-19 2020-08-27 삼성전자주식회사 열전달 부재 및 이를 포함하는 전자 장치
KR20220066637A (ko) * 2020-11-16 2022-05-24 삼성전자주식회사 웨어러블 전자 장치

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