WO2024014690A1 - Boîtier chevauchant un élément d'antenne et dispositif électronique le comprenant - Google Patents

Boîtier chevauchant un élément d'antenne et dispositif électronique le comprenant Download PDF

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Publication number
WO2024014690A1
WO2024014690A1 PCT/KR2023/006805 KR2023006805W WO2024014690A1 WO 2024014690 A1 WO2024014690 A1 WO 2024014690A1 KR 2023006805 W KR2023006805 W KR 2023006805W WO 2024014690 A1 WO2024014690 A1 WO 2024014690A1
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WIPO (PCT)
Prior art keywords
plate
area
electronic device
housing
electromagnetic wave
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PCT/KR2023/006805
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English (en)
Korean (ko)
Inventor
장지구
이정원
송금수
윤수민
조재훈
Original Assignee
삼성전자주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Priority claimed from KR1020220100891A external-priority patent/KR20240010371A/ko
Application filed by 삼성전자주식회사 filed Critical 삼성전자주식회사
Publication of WO2024014690A1 publication Critical patent/WO2024014690A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support

Definitions

  • Embodiments to be described later relate to a housing overlapping an antenna element and an electronic device including the same.
  • Portable electronic devices such as smart phones and tablet personal computers may establish communication channels with external electronic devices such as base stations or other portable electronic devices.
  • the size of signal transmission loss may vary depending on the components of the electronic device placed in the path through which a signal received from an external electronic device or a signal transmitted to an external electronic device passes.
  • An electronic device includes a housing including a first plate including ceramic and a second plate facing the first plate, and at least one antenna element disposed between the first plate and the second plate. It may include an antenna module including an antenna element, and a processor operatively coupled to the at least one antenna element.
  • the processor may be configured to transmit an electromagnetic wave signal within a range of a first frequency to a second frequency to an external electronic device or to receive the electromagnetic wave signal from the external electronic device through the at least one antenna element.
  • the second plate overlaps the at least one antenna element and surrounds the first area and a first area through which the electromagnetic wave signal passes from the at least one antenna element. It may include a second region thinner than the first region. Each of the first frequency and the second frequency may be located within a range of 28 GHz to 39 GHz.
  • An electronic device includes a housing including a first plate and a second plate facing the first plate, disposed between the first plate and the second plate, and including at least one antenna element. It may include an antenna module and a processor operatively coupled to the at least one antenna element. The processor may be configured to transmit an electromagnetic wave signal within a range of a first frequency to a second frequency to an external electronic device or to receive the electromagnetic wave signal from the external electronic device through the at least one antenna element.
  • the second plate may include a first area that is parallel to the antenna module and through which the electromagnetic wave signal passes from the at least one antenna element, and a second area that surrounds the first area and is thinner than the first area. .
  • the thickness of the first region may be thinner than a half-wavelength of the first electromagnetic wave having the first frequency and thicker than a half-wavelength of the second electromagnetic wave having the second frequency while passing through the housing.
  • Each of the first frequency and the second frequency may be located within a range of 28 GHz to 39 GHz.
  • FIG. 1 is a block diagram of an electronic device 101 in a network environment 100, according to one embodiment.
  • FIG. 2 is a block diagram 200 of an electronic device for supporting legacy network communication and 5G network communication, according to one embodiment.
  • FIG. 3 shows an embodiment of the structure of the antenna module described with reference to FIG. 2.
  • FIG. 4A is a diagram illustrating an electronic device according to an embodiment.
  • Figure 4b shows an embodiment in which electromagnetic wave signals are transmitted.
  • FIG. 4C is a graph showing the relationship between the thickness of a housing containing ceramic and the transmittance of electromagnetic waves.
  • FIGS. 5A, 5B, and 5C are partial cross-sectional views of an example electronic device taken along line B-B′ in FIG. 4A.
  • Figure 6 is a flow chart showing the manufacturing process of a housing containing ceramic.
  • FIG. 1 is a block diagram of an electronic device 101 in a network environment 100, according to one embodiment.
  • the electronic device 101 communicates with the electronic device 102 through a first network 198 (e.g., a short-range wireless communication network) or a second network 199. It is possible to communicate with the electronic device 104 or the server 108 through (e.g., a long-distance wireless communication network). According to one embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108.
  • a first network 198 e.g., a short-range wireless communication network
  • a second network 199 e.g., a long-distance wireless communication network.
  • the electronic device 101 may communicate with the electronic device 104 through the server 108.
  • the electronic device 101 includes a processor 120, a memory 130, an input module 150, an audio output module 155, a display module 160, an audio module 170, and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or may include an antenna module 197.
  • at least one of these components eg, the connection terminal 178) may be omitted or one or more other components may be added to the electronic device 101.
  • some of these components e.g., sensor module 176, camera module 180, or antenna module 197) are combined into one component (e.g., display module 160). can be integrated.
  • the processor 120 for example, executes software (e.g., program 140) to operate at least one other component (e.g., hardware or software component) of the electronic device 101 connected to the processor 120. It can be controlled and various data processing or calculations can be performed. According to one embodiment, as at least part of data processing or computation, the processor 120 stores commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132. The commands or data stored in the volatile memory 132 can be processed, and the resulting data can be stored in the non-volatile memory 134.
  • software e.g., program 140
  • the processor 120 stores commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132.
  • the commands or data stored in the volatile memory 132 can be processed, and the resulting data can be stored in the non-volatile memory 134.
  • the processor 120 includes a main processor 121 (e.g., a central processing unit or an application processor) or an auxiliary processor 123 that can operate independently or together (e.g., a graphics processing unit, a neural network processing unit ( It may include a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor).
  • a main processor 121 e.g., a central processing unit or an application processor
  • auxiliary processor 123 e.g., a graphics processing unit, a neural network processing unit ( It may include a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor.
  • the electronic device 101 includes a main processor 121 and a secondary processor 123
  • the secondary processor 123 may be set to use lower power than the main processor 121 or be specialized for a designated function. You can.
  • the auxiliary processor 123 may be implemented separately from the main processor 121 or as part of it.
  • the auxiliary processor 123 may, for example, act on behalf of the main processor 121 while the main processor 121 is in an inactive (e.g., sleep) state, or while the main processor 121 is in an active (e.g., application execution) state. ), together with the main processor 121, at least one of the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) At least some of the functions or states related to can be controlled.
  • co-processor 123 e.g., image signal processor or communication processor
  • may be implemented as part of another functionally related component e.g., camera module 180 or communication module 190. there is.
  • the auxiliary processor 123 may include a hardware structure specialized for processing artificial intelligence models.
  • Artificial intelligence models can be created through machine learning. For example, such learning may be performed in the electronic device 101 itself, where artificial intelligence is performed, or may be performed through a separate server (e.g., server 108).
  • Learning algorithms may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but It is not limited.
  • An artificial intelligence model may include multiple artificial neural network layers.
  • Artificial neural networks include deep neural network (DNN), convolutional neural network (CNN), recurrent neural network (RNN), restricted boltzmann machine (RBM), belief deep network (DBN), bidirectional recurrent deep neural network (BRDNN), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the examples described above.
  • artificial intelligence models may additionally or alternatively include software structures.
  • the memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176) of the electronic device 101. Data may include, for example, input data or output data for software (e.g., program 140) and instructions related thereto.
  • Memory 130 may include volatile memory 132 or non-volatile memory 134.
  • the program 140 may be stored as software in the memory 130 and may include, for example, an operating system 142, middleware 144, or application 146.
  • the input module 150 may receive commands or data to be used in a component of the electronic device 101 (e.g., the processor 120) from outside the electronic device 101 (e.g., a user).
  • the input module 150 may include, for example, a microphone, mouse, keyboard, keys (eg, buttons), or digital pen (eg, stylus pen).
  • the sound output module 155 may output sound signals to the outside of the electronic device 101.
  • the sound output module 155 may include, for example, a speaker or a receiver. Speakers can be used for general purposes such as multimedia playback or recording playback.
  • the receiver can be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.
  • the display module 160 can visually provide information to the outside of the electronic device 101 (eg, a user).
  • the display module 160 may include, for example, a display, a hologram device, or a projector, and a control circuit for controlling the device.
  • the display module 160 may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of force generated by the touch.
  • the audio module 170 can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module 170 acquires sound through the input module 150, the sound output module 155, or an external electronic device (e.g., directly or wirelessly connected to the electronic device 101). Sound may be output through the electronic device 102 (e.g., speaker or headphone).
  • the electronic device 102 e.g., speaker or headphone
  • the sensor module 176 detects the operating state (e.g., power or temperature) of the electronic device 101 or the external environmental state (e.g., user state) and generates an electrical signal or data value corresponding to the detected state. can do.
  • the sensor module 176 includes, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, humidity sensor, or light sensor.
  • the interface 177 may support one or more designated protocols that can be used to connect the electronic device 101 directly or wirelessly with an external electronic device (eg, the electronic device 102).
  • the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • SD card interface Secure Digital Card interface
  • audio interface audio interface
  • connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102).
  • the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).
  • the haptic module 179 can convert electrical signals into mechanical stimulation (e.g., vibration or movement) or electrical stimulation that the user can perceive through tactile or kinesthetic senses.
  • the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.
  • the camera module 180 can capture still images and moving images.
  • the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.
  • the power management module 188 can manage power supplied to the electronic device 101.
  • the power management module 188 may be implemented as at least a part of, for example, a power management integrated circuit (PMIC).
  • PMIC power management integrated circuit
  • the battery 189 may supply power to at least one component of the electronic device 101.
  • the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.
  • Communication module 190 is configured to provide a direct (e.g., wired) communication channel or wireless communication channel between electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108). It can support establishment and communication through established communication channels. Communication module 190 operates independently of processor 120 (e.g., an application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication.
  • processor 120 e.g., an application processor
  • the communication module 190 may be a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., : LAN (local area network) communication module, or power line communication module) may be included.
  • a wireless communication module 192 e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module
  • GNSS global navigation satellite system
  • wired communication module 194 e.g., : LAN (local area network) communication module, or power line communication module
  • the corresponding communication module is a first network 198 (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (e.g., legacy It may communicate with an external electronic device 104 through a telecommunication network such as a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN).
  • a telecommunication network such as a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN).
  • a telecommunication network such as a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN).
  • a telecommunication network such as a cellular network, a 5G network, a next-generation communication network
  • the wireless communication module 192 uses subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 to communicate within a communication network such as the first network 198 or the second network 199.
  • subscriber information e.g., International Mobile Subscriber Identifier (IMSI)
  • IMSI International Mobile Subscriber Identifier
  • the wireless communication module 192 may support 5G networks after 4G networks and next-generation communication technologies, for example, NR access technology (new radio access technology).
  • NR access technology provides high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low latency). -latency communications)) can be supported.
  • the wireless communication module 192 may support high frequency bands (eg, mmWave bands), for example, to achieve high data rates.
  • the wireless communication module 192 uses various technologies to secure performance in high frequency bands, for example, beamforming, massive array multiple-input and multiple-output (MIMO), and full-dimensional multiplexing. It can support technologies such as input/output (FD-MIMO: full dimensional MIMO), array antenna, analog beam-forming, or large scale antenna.
  • the wireless communication module 192 may support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., second network 199).
  • the wireless communication module 192 supports Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mmTC, or U-plane latency (e.g., 164 dB or less) for realizing URLLC.
  • Peak data rate e.g., 20 Gbps or more
  • loss coverage e.g., 164 dB or less
  • U-plane latency e.g., 164 dB or less
  • the antenna module 197 may transmit or receive signals or power to or from the outside (eg, an external electronic device).
  • the antenna module 197 may include an antenna including a radiator made of a conductor or a conductive pattern formed on a substrate (eg, PCB).
  • the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for the communication method used in the communication network, such as the first network 198 or the second network 199, is connected to the plurality of antennas by, for example, the communication module 190. can be selected Signals or power may be transmitted or received between the communication module 190 and an external electronic device through the at least one selected antenna.
  • other components eg, radio frequency integrated circuit (RFIC) may be additionally formed as part of the antenna module 197.
  • RFIC radio frequency integrated circuit
  • the antenna module 197 may form a mmWave antenna module.
  • a mmWave antenna module includes a printed circuit board, an RFIC disposed on or adjacent to one side (e.g., bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., mmWave band), and It may include a plurality of antennas (e.g., array antennas) disposed on or adjacent to another side (e.g., top or side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band.
  • a mmWave antenna module includes a printed circuit board, an RFIC disposed on or adjacent to one side (e.g., bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., mmWave band), and It may include a plurality of antennas (e.g., array antennas) disposed on or adjacent to another side (e.g., top or side) of the printed circuit board
  • peripheral devices e.g., bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)
  • signal e.g. commands or data
  • commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199.
  • Each of the external electronic devices 102 or 104 may be of the same or different type as the electronic device 101.
  • all or part of the operations performed in the electronic device 101 may be executed in one or more of the external electronic devices 102, 104, or 108.
  • the electronic device 101 may perform the function or service instead of executing the function or service on its own.
  • one or more external electronic devices may be requested to perform at least part of the function or service.
  • One or more external electronic devices that have received the request may execute at least part of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device 101.
  • the electronic device 101 may process the result as is or additionally and provide it as at least part of a response to the request.
  • cloud computing distributed computing, mobile edge computing (MEC), or client-server computing technology can be used.
  • the electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing.
  • the external electronic device 104 may include an Internet of Things (IoT) device.
  • Server 108 may be an intelligent server using machine learning and/or neural networks.
  • the external electronic device 104 or server 108 may be included in the second network 199.
  • the electronic device 101 may be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.
  • FIG. 2 is a block diagram 200 of an electronic device for supporting legacy network communication and 5G network communication, according to one embodiment.
  • the electronic device 101 includes a first communication processor 212, a second communication processor 214, a first radio frequency integrated circuit (RFIC) 222, a second RFIC 224, and a third RFIC. (226), fourth RFIC (228), first radio frequency front end (RFFE) 232, second RFFE (234), first antenna module 242, second antenna module 244, and antenna 248 ) may include.
  • the electronic device 101 may further include a processor 120 and memory (eg, memory 130 of FIG. 1).
  • the second network 199 may include a first cellular network 292 and a second cellular network 294. According to one embodiment, the electronic device 101 may further include at least one of the components shown in FIG. 1, and the second network 199 may further include at least one other network.
  • the first communication processor 212, the second communication processor 214, the first RFIC 222, the second RFIC 224, the fourth RFIC 228, the first RFFE 232, and second RFFE 234 may form at least a portion of wireless communication module 392.
  • the fourth RFIC 228 may be omitted or may be included as part of the third RFIC 226.
  • the first communication processor 212 may support establishment of a communication channel in a band to be used for wireless communication with the first cellular network 292, and legacy network communication through the established communication channel.
  • the first cellular network 292 may be a legacy network including second generation (2G), third generation (3G), fourth generation (4G), and/or long term evolution (LTE) networks.
  • the second communication processor 214 establishes a communication channel corresponding to a designated band (e.g., about 6 GHz to about 60 GHz) among the bands to be used for wireless communication with the second cellular network 294, and establishes a 5G network through the established communication channel.
  • a designated band e.g., about 6 GHz to about 60 GHz
  • the second cellular network 294 may be a 5G network defined by 3GPP.
  • the first communication processor 212 or the second communication processor 214 performs communication corresponding to another designated band (e.g., about 6 GHz or less) among the bands to be used for wireless communication with the second cellular network 294. It can support establishment of channels and 5G network communication through established communication channels.
  • the first communication processor 212 and the second communication processor 214 may be implemented in a single chip or a single package.
  • the first communication processor 212 or the second communication processor 214 may be formed within a processor 120, an auxiliary processor 123 of FIG. 1, or a communication module (and a single chip or a single package). You can.
  • the first RFIC 222 When transmitting, the first RFIC 222 converts the baseband signal generated by the first communications processor 212 to a frequency range from about 700 MHz to about 700 MHz used in the first cellular network 292 (e.g., a legacy network). It can be converted to a radio frequency (RF) signal of 3GHz.
  • RF radio frequency
  • an RF signal is obtained from a first cellular network 292 (e.g., a legacy network) via an antenna (e.g., first antenna module 242) and an RFFE (e.g., first RFFE 232). It can be preprocessed through.
  • the first RFIC 222 may convert the pre-processed RF signal into a baseband signal to be processed by the first communication processor 212.
  • the second RFIC 224 uses the first communications processor 212 or the baseband signal generated by the second communications processor 214 to a second cellular network 294 (e.g., a 5G network). It can be converted into an RF signal (hereinafter referred to as a 5G Sub6 RF signal) in the Sub6 band (e.g., approximately 6 GHz or less).
  • a 5G Sub6 RF signal is obtained from the second cellular network 294 (e.g., 5G network) via an antenna (e.g., second antenna module 244) and RFFE (e.g., second RFFE 234) ) can be preprocessed.
  • the second RFIC 224 may convert the preprocessed 5G Sub6 RF signal into a baseband signal so that it can be processed by a corresponding communication processor of the first communication processor 212 or the second communication processor 214.
  • the third RFIC 226 converts the baseband signal generated by the second communication processor 214 into a 5G Above6 band (e.g., about 6 GHz to about 60 GHz) to be used in the second cellular network 294 (e.g., a 5G network). It can be converted to an RF signal (hereinafter referred to as 5G Above6 RF signal).
  • the 5G Above6 RF signal may be obtained from a second cellular network 294 (e.g., a 5G network) via an antenna (e.g., antenna 248) and preprocessed via a third RFFE 236.
  • the third RFFE 236 may perform signal preprocessing using a phase shifter 238.
  • the third RFIC 226 may convert the pre-processed 5G Above 6 RF signal into a baseband signal to be processed by the second communication processor 214.
  • the third RFFE 236 may be formed as part of the third RFIC 226.
  • the electronic device 101 may include a fourth RFIC 228 separately from the third RFIC 226 or at least as a part thereof.
  • the fourth RFIC 228 converts the baseband signal generated by the second communication processor 214 into an RF signal (hereinafter referred to as an intermediate frequency (IF)) in an intermediate frequency band (e.g., about 9 GHz to about 11 GHz).
  • IF intermediate frequency
  • the IF signal can be transmitted to the third RFIC (226).
  • the third RFIC 226 can convert the IF signal into a 5G Above6 RF signal.
  • a 5G Above6 RF signal may be received from a second cellular network 294 (e.g., a 5G network) via an antenna (e.g., antenna 248) and converted into an IF signal by a third RFIC 226. there is.
  • the fourth RFIC 228 may convert the IF signal into a baseband signal so that the second communication processor 214 can process it.
  • the first RFIC 222 and the second RFIC 224 may be implemented as a single chip or at least part of a single package.
  • the first RFFE 232 and the second RFFE 234 may be implemented as at least part of a single chip or a single package.
  • at least one antenna module of the first antenna module 242 or the second antenna module 244 may be omitted or combined with another antenna module to process RF signals of a plurality of corresponding bands.
  • the third RFIC 226 and the antenna 248 may be disposed on the same substrate to form the third antenna module 246.
  • the wireless communication module 192 or the processor 120 may be disposed on the first substrate (eg, main PCB).
  • the third RFIC 226 is located in some area (e.g., bottom surface) of the second substrate (e.g., sub PCB) separate from the first substrate, and the antenna 248 is located in another part (e.g., top surface). is disposed, so that the third antenna module 246 can be formed.
  • antenna 248 may include an antenna array that may be used for beamforming, for example.
  • the third RFIC 226 and the antenna 248 By placing the third RFIC 226 and the antenna 248 on the same substrate, it is possible to reduce the length of the transmission line therebetween. This, for example, can reduce the loss (e.g. attenuation) of signals in the high frequency band (e.g., about 6 GHz to about 60 GHz) used in 5G network communication by transmission lines. Because of this, the electronic device 101 can improve the quality or speed of communication with the second cellular network 294 (eg, 5G network).
  • the second cellular network 294 eg, 5G network
  • the second cellular network 294 may operate independently (e.g., Stand-Alone (SA)) or connected to the first cellular network 292 (e.g., legacy network) ( Example: Non-Stand Alone (NSA)).
  • SA Stand-Alone
  • a 5G network may have only an access network (e.g., 5G radio access network (RAN) or next generation RAN (NG RAN)) and no core network (e.g., next generation core (NGC)).
  • the electronic device 101 may access the access network of the 5G network and then access an external network (eg, the Internet) under the control of the core network (eg, evolved packed core (EPC)) of the legacy network.
  • EPC evolved packed core
  • Protocol information for communication with a legacy network e.g., LTE protocol information
  • protocol information for communication with a 5G network e.g., New Radio (NR) protocol information
  • LTE protocol information e.g., LTE protocol information
  • 5G network e.g., New Radio (NR) protocol information
  • FIG. 3 shows an embodiment of the structure of the antenna module described with reference to FIG. 2.
  • 300a in FIG. 3 is a perspective view of the third antenna module 246 from one side
  • 300b in FIG. 3 is a perspective view of the third antenna module 246 from the other side
  • 300c of FIG. 3 is a cross-sectional view taken along line A-A' of the third antenna module 246.
  • the third antenna module 246 includes a printed circuit board 310, an antenna array 330, a radio frequency integrate circuit (RFIC) 352, a power manage integrate circuit (PMIC) 354, and a module. It may include an interface (not shown). Optionally, the third antenna module 246 may further include a shielding member 390. According to one embodiment, at least one of the above-mentioned parts may be omitted, or at least two of the above parts may be formed integrally.
  • RFIC radio frequency integrate circuit
  • PMIC power manage integrate circuit
  • the printed circuit board 310 may include a plurality of conductive layers and a plurality of non-conductive layers alternately stacked with the conductive layers.
  • the printed circuit board 310 may provide electrical connections between the printed circuit board 310 and/or various electronic components disposed externally using wires and conductive vias formed on the conductive layer.
  • Antenna array 330 may include a plurality of antenna elements 332, 334, 336, or 338 arranged to form a directional beam.
  • the antenna elements may be formed on the first side of the printed circuit board 310 as shown.
  • the antenna array 330 may be formed inside the printed circuit board 310.
  • the antenna array 330 may include a plurality of antenna arrays (eg, a dipole antenna array and/or a patch antenna array) of the same or different shapes or types.
  • RFIC 352 may be connected to another area of printed circuit board 310 that is spaced apart from the antenna array 330 (e.g., opposite the first side). It can be placed on the second side).
  • the RFIC 352 may be configured to process signals in a selected frequency band that are transmitted/received through the antenna array 330.
  • RFIC 352 when transmitting, baseband signals obtained from a communications processor (e.g., first communications processor 212, second communications processor 214 of FIG. 2) (not shown). can be converted to an RF signal in a designated band.
  • the RFIC 352 may convert the RF signal received through the antenna array 330 into a baseband signal and transmit it to the communication processor.
  • the RFIC 352 when transmitting, receives an IF signal (e.g., from about 9 GHz to about 11 GHz) can be up-converted to an RF signal of the selected band.
  • the RFIC 352 may down-convert the RF signal obtained through the antenna array 330, convert it into an IF signal, and transmit it to the IFIC.
  • the PMIC 354 may be disposed in another area (eg, the second side) of the printed circuit board 310, spaced apart from the antenna array.
  • the PMIC 354 may receive voltage from the main PCB (not shown) and provide the necessary power to various components (e.g., RFIC 352) on the antenna module.
  • the shielding member 390 may be disposed on a portion (eg, the second side) of the printed circuit board 310 to electromagnetically shield at least one of the RFIC 352 or the PMIC 354. According to one embodiment, the shielding member 390 may include a shield can.
  • the third antenna module 246 may be electrically connected to another printed circuit board (eg, main circuit board) through a module interface.
  • the module interface may include a connection member, for example, a coaxial cable connector, a board to board connector, an interposer, or a flexible printed circuit board (FPCB).
  • FPCB flexible printed circuit board
  • FIG. 4A is a diagram illustrating an electronic device according to an embodiment.
  • the electronic device 400 may include a housing 410 that forms the exterior of the electronic device 400 .
  • housing 410 may include a front 400A, a back 400B, and a side 400C surrounding the space between the front 400A and the back 400B.
  • the housing 410 may refer to a structure that forms at least a portion of the front 400A, the back 400B, and/or the side 400C.
  • the electronic device 400 may include a first plate 402 that is substantially transparent. According to one embodiment, the first plate 402 may form at least a portion of the front surface 400A. According to one embodiment, the first plate 402 may include, for example, a glass plate including various coating layers, or a polymer plate, but is not limited thereto.
  • the electronic device 400 may include a second plate 411 that is substantially opaque.
  • the second plate 411 may form at least a portion of the rear surface 400B.
  • the second plate 411 is coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. can be formed.
  • the second plate 411 may face the first plate 402. At least one electronic component of the electronic device 400 may be disposed between the first plate 402 and the second plate 411.
  • the substrate on which the third RFIC 226 and the antenna 248 of FIG. 2 are disposed may be disposed between the first plate 402 and the second plate 411.
  • the second plate 411 may include a first area 411a and a second area 411b surrounding the first area 411a.
  • the first area 411a is an antenna module included in the electronic device 400 (e.g., the antenna module 197 in FIG. 1, the first antenna module 242 in FIG. 2, the second antenna module 244, For wireless communication between the third antenna module 246) and an external electronic device (e.g., the electronic device 102, electronic device 104, or server 108 in FIG. 1), an area through which an electromagnetic wave signal penetrates. You can.
  • the electronic device 400 may include a side bezel structure (or side member) 418.
  • the side bezel structure 418 may be combined with the first plate 402 and/or the second plate 411 to form at least a portion of the side 400C of the electronic device 400.
  • side bezel structure 418 may entirely form side 400C of electronic device 400, and in other examples, side bezel structure 418 may include first plate 402 and/or first plate 402. 2 Together with the plate 411, the side 400C of the electronic device 400 may be formed.
  • the first plate 402 and/or The second plate 411 may include a region that is bent toward the second plate 411 and/or the first plate 402 at its edge and extends seamlessly.
  • the extended area of the first plate 402 and/or the second plate 411 may be, for example, located at both ends of a long edge of the electronic device 400, but in the above-described example It is not limited by .
  • side bezel structure 418 may include metal and/or polymer.
  • the second plate 411 and the side bezel structure 418 may be formed integrally and may include the same material (eg, a metal material such as aluminum), but are not limited thereto.
  • the second plate 411 and the side bezel structure 418 may be formed of separate configurations and/or may include different materials.
  • the electronic device 400 includes a display 401, an audio module 403, 404, and 407, a sensor module (not shown), a camera module 405, 412, and 413, and a key input device 417. , a light emitting device (not shown), and/or a connector hole 408 may be included. According to one embodiment, the electronic device 400 may omit at least one of the components (e.g., key input device 417 or a light emitting device (not shown)) or may additionally include other components. .
  • the display 401 may be visually exposed through a significant portion of the first plate 402. For example, at least a portion of display 401 may be visible through first plate 402 forming front surface 400A. According to one embodiment, the display 401 may be disposed on the back of the first plate 402.
  • the outer shape of the display 401 may be substantially the same as the outer shape of the first plate 402 adjacent to the display 401. According to one embodiment, in order to expand the area to which the display 401 is visually exposed, the distance between the outer edge of the display 401 and the outer edge of the first plate 402 may be formed to be substantially the same.
  • the display 401 (or the front 400A of the electronic device 400) may include a screen display area 401A.
  • the display 401 may provide visual information to the user through the screen display area 401A.
  • the screen display area 401A is shown to be located inside the front surface 400A, spaced apart from the outer edge of the front surface 400A, but is not limited thereto. no.
  • at least a portion of the edge of the screen display area 401A may substantially coincide with the edge of the front surface 400A (or the first plate 402). .
  • the screen display area 401A may include a sensing area 401B configured to obtain biometric information of the user.
  • the meaning of “the screen display area 401A includes the sensing area 401B” can be understood as at least a portion of the sensing area 401B being overlapped with the screen display area 401A.
  • the sensing area 401B can display visual information by the display 401 like other areas of the screen display area 401A, and can additionally acquire the user's biometric information (e.g., fingerprint). It can mean area.
  • the sensing area 401B may be formed in the key input device 417.
  • the display 401 may include an area where the first camera 405 is located.
  • an opening is formed in the area of the display 401, and the first camera 405 (e.g., a punch hole camera) may be at least partially disposed within the opening to face the front surface 400A.
  • the screen display area 401A may surround at least a portion of the edge of the opening.
  • the first camera 405 eg, under display camera (UDC)
  • UDC under display camera
  • the display 401 may provide visual information to the user through the area, and additionally, the first camera 405 may provide an image corresponding to the direction toward the front 400A through the area of the display 401. can be obtained.
  • the display 401 may be combined with or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the strength (pressure) of touch, and/or a digitizer that detects a magnetic field-type stylus pen. there is.
  • the audio modules 403, 404, and 407 may include microphone holes 403 and 404 and speaker holes 407.
  • the microphone holes 403 and 404 may include a first microphone hole 403 formed in a partial area of the side 400C and a second microphone hole 404 formed in a partial area of the rear 400B. You can. Microphones (not shown) may be placed inside the microphone holes 403 and 404 to acquire external sounds.
  • the microphone may include a plurality of microphones to detect the direction of sound.
  • the second microphone hole 404 formed in a portion of the rear surface 400B may be placed adjacent to the camera modules 405, 412, and 413.
  • the second microphone hole 404 may acquire sound according to the operation of the camera modules 405, 412, and 413.
  • it is not limited to this.
  • the speaker hole 407 may include an external speaker hole 407 and a receiver hole (not shown) for a call.
  • the external speaker hole 407 may be formed on a portion of the side 400C of the electronic device 400.
  • the external speaker hole 407 may be implemented as one hole with the microphone hole 403.
  • a receiver hole (not shown) for a call may be formed in another part of the side surface 400C.
  • the receiver hole for a call may be formed on the side opposite to the external speaker hole 407 on the side 400C. For example, based on the illustration in FIG.
  • the external speaker hole 407 is formed on the side 400C corresponding to the lower part of the electronic device 400, and the receiver hole for calls is formed on the upper part of the electronic device 400. It may be formed on the corresponding side (400C). However, it is not limited to this, and according to one embodiment, the call receiver hole may be formed in a location other than the side surface 400C.
  • a receiver hole for a call may be formed by a spaced space between the first plate 402 (or display 401) and the side bezel structure 418.
  • the electronic device 400 includes at least one speaker (not shown) configured to output sound to the outside of the housing through the external speaker hole 407 and/or the call receiver hole (not shown). It can be included.
  • a sensor module may generate an electrical signal or data value corresponding to the internal operating state of the electronic device 400 or the external environmental state.
  • the sensor module may include a proximity sensor, HRM sensor, fingerprint sensor, gesture sensor, gyro sensor, barometric pressure sensor, magnetic sensor, acceleration sensor, grip sensor, color sensor, IR (infrared) sensor, biometric sensor, temperature sensor, It may include at least one of a humidity sensor or an illuminance sensor.
  • the camera modules 405, 412, and 413 include a first camera 405 arranged to face the front 400A of the electronic device 400, and a second camera 405 arranged to face the rear 400B. It may include a camera 412 and a flash 413.
  • the second camera 412 may include a plurality of cameras (eg, a dual camera, a triple camera, or a quad camera).
  • the second camera 412 is not necessarily limited to including a plurality of cameras and may include one camera.
  • the first camera 405 and the second camera 412 may include one or more lenses, an image sensor, and/or an image signal processor.
  • the flash 413 may include, for example, a light emitting diode or a xenon lamp.
  • two or more lenses an infrared camera, a wide-angle lens, and a telephoto lens
  • image sensors may be disposed on one side of the electronic device 400.
  • the key input device 417 may be placed on the side 400C of the electronic device 400.
  • the electronic device 400 may not include some or all of the key input devices 417, and the key input devices 417 that are not included may be other than soft keys on the display 401. It can be implemented in the form
  • the connector hole 408 may be formed on the side 400C of the electronic device 400 to accommodate a connector of an external device.
  • a connection terminal electrically connected to a connector of an external device may be disposed within the connector hole 408.
  • the electronic device 400 may include an interface module for processing electrical signals transmitted and received through the connection terminal.
  • the electronic device 400 may include a light emitting device (not shown).
  • the light emitting device (not shown) may be disposed on the front 400A of the housing.
  • the light emitting device (not shown) may provide status information of the electronic device 400 in the form of light.
  • the light emitting device (not shown) may provide a light source linked to the operation of the first camera 405.
  • the light emitting device (not shown) may include an LED, an IR LED, and/or a xenon lamp.
  • Figure 4b shows an embodiment in which electromagnetic wave signals are transmitted.
  • an electronic device 400 may include a housing 410 .
  • the electromagnetic wave signal 450 may be incident from the air toward the housing 410.
  • the electromagnetic wave signal 450 may be transmitted through air before being incident on the housing 410.
  • a portion of the electromagnetic wave signal 450 may pass through the housing 410. Except for the part of the electromagnetic wave signal 450, the remainder may be reflected on the incident surface of the housing 410 where the electromagnetic wave signal 450 is incident.
  • the intrinsic impedance of the medium through which the electromagnetic wave signal 450 is transmitted may be Z.
  • the intrinsic impedance may be a specified resistance size according to the medium through which the electromagnetic wave signal 450 is transmitted.
  • the intrinsic impedance (Z) can be expressed as the following formula:
  • Equation 1 e may be the permeability of the medium through which the electromagnetic wave signal 450 is transmitted.
  • m may be the permittivity of the medium through which the electromagnetic wave signal 450 is transmitted.
  • the inherent impedance (Z) of the medium through which the electromagnetic wave signal 450 is transmitted may vary depending on the permeability (e) and dielectric constant (m) of the medium.
  • the permeability (e) and the dielectric constant (m) may have specified values depending on the medium.
  • the intrinsic impedance of air may be Z1.
  • the specific impedance of housing 410 may be Z2.
  • the input impedance on the incident surface on which the electromagnetic wave signal 450 is incident may be Z3.
  • the input impedance Z3 is the resistance at the incident surface of the housing 410 corresponding to the input of the electromagnetic wave signal 450 when the electromagnetic wave signal 450 is incident on the housing 410. It can mean. Assuming that the housing 410 into which the electromagnetic wave signal 450 is incident is a finite transmission line through which the electromagnetic wave signal 450 passes, and is lossless, the thickness of the housing 410
  • the input impedance (Z3) according to the equation may be expressed as follows.
  • Equation 2 may be a propagation constant that represents changes according to the amplitude and phase of the waveform when the electromagnetic wave signal 450 propagates toward the housing 410.
  • b may be a phase constant of the electromagnetic wave signal 450.
  • w may be the wavelength of the electromagnetic wave signal 450 incident on the boundary surface of the housing 410.
  • d may be the thickness of the housing 410 corresponding to a finite transmission line.
  • the input impedance (Z3) value is equal to the specific impedance (Z2) value of the housing 410.
  • the minimum value of the thickness d of the housing 410 that is not zero, at which the tan function becomes 0, may be half the wavelength (w/2) of the electromagnetic wave signal 450. If the input impedance (Z3) value is the same as the specific impedance (Z2) value of the housing 410, the electromagnetic wave signal 450 is reflected on the incident surface of the housing 410 due to impedance matching. Reflection loss can be minimized.
  • the electronic device 400 can reduce the reflection loss of the electromagnetic wave signal 450 by adjusting the thickness of the housing 410 through which the electromagnetic wave signal 450 passes.
  • FIG. 4C is a graph showing the relationship between the thickness of a housing containing ceramic and the transmittance of electromagnetic waves.
  • the horizontal axis of the graph 470 represents the housing (e.g., the electronic device 101 of FIG. 1 and the electronic device 400 of FIG. 4A) through which the electromagnetic wave signal 450 passes. This shows the thickness of the housing 410 in Figure 4a.
  • the vertical axis of the graph 470 represents the transmittance of the electromagnetic wave signal 450 to the housing 410. The transmittance may be calculated by dividing the size of the electromagnetic wave signal 460 passing through the housing 410 by the size of the total electromagnetic wave signal 450 incident on the housing 410.
  • the speed of the electromagnetic wave signal 450 may be c.
  • the frequency of the electromagnetic wave signal 450 is f
  • the wavelength (w) of the electromagnetic wave signal 450 incident on the housing 410 may be expressed as the following equation.
  • the speed (c) of the electromagnetic wave signal 450 may be constant at a specified value.
  • the wavelength (w) of the electromagnetic wave signal 450 may be inversely proportional to the frequency (f) of the electromagnetic wave signal 450.
  • the transmittance of the electromagnetic wave signal 450 may vary depending on the frequency (f) of the electromagnetic wave signal 450.
  • the graph 471 shows the transmittance of the first electromagnetic wave 451 having the first frequency f1.
  • the graph 472 represents the transmittance of the second electromagnetic wave 452 having the second frequency f2.
  • the first frequency (f1) may be smaller than the second frequency (f2).
  • the first frequency f1 and the second frequency f2 may be included in a high frequency band (eg, mmWave band) (eg, approximately 28 GHz to 39 GHz).
  • the frequency (f) is inversely proportional to the wavelength (w), so the wavelength (w1) of the first electromagnetic wave 451 may be greater than the wavelength (w2) of the second electromagnetic wave 452. there is.
  • the transmittance of the electromagnetic wave signal 450 may vary depending on the thickness d of the housing 410.
  • the thickness d of the housing 410 is the quarter wavelength (w1/4) of the first electromagnetic wave 451
  • the transmittance of the housing 410 of the first electromagnetic wave 451 may be minimal.
  • the thickness d of the housing 410 is half the wavelength (w1/2) of the first electromagnetic wave 451, the transmittance of the housing 410 of the first electromagnetic wave 451 may be maximum.
  • the thickness d of the housing 410 is the quarter wavelength (w2/4) of the second electromagnetic wave 452, the second electromagnetic wave The transmittance of the housing 410 at 452 may be minimal. If the thickness d of the housing 410 is half the wavelength (w2/2) of the second electromagnetic wave 452, the transmittance of the housing 410 of the second electromagnetic wave 452 may be maximum.
  • the minimum value of the thickness d of the housing 410 at which the tan function of Equation 2 becomes 0 is the electromagnetic wave signal 450 that penetrates the housing 410.
  • the electromagnetic wave signal 450 can correspond to a half wavelength (w/2).
  • the minimum value of the thickness d of the housing 410 at which the tan function of Equation 2 becomes 0 when the first electromagnetic wave 451 passes through the housing 410 is the first electromagnetic wave 451. It may be a half wavelength (w1/2) of the electromagnetic wave 451.
  • the minimum value of the thickness d of the housing 410 at which the tan function of Equation 2 becomes 0 when the second electromagnetic wave 452 passes through the housing 410 is the second electromagnetic wave 452. It may be a half wavelength (w2/2) of the electromagnetic wave 452. Since the half-wavelength (w1/2) of the first electromagnetic wave 451 is larger than the half-wavelength (w2/2) of the second electromagnetic wave 452, the thickness of the housing 410 at which reflection loss is minimized ( As for the minimum value of d), the value in the graph 471 may be larger than the value in the graph 472.
  • the housing 410 may have a thickness d within a specified range in order to reduce reflection loss of the first electromagnetic wave 451 and the second electromagnetic wave 452.
  • the thickness d of the housing 410 is within a range that is greater than the half-wavelength (w2/2) of the second electromagnetic wave 452 and smaller than the half-wavelength (w1/2) of the first electromagnetic wave 451. It may have a thickness (d).
  • the first thickness (a1) and the second thickness (a2) may be the thickness (d) of the housing 410 within the above range.
  • the first thickness (a1) may be smaller than the second thickness (a2).
  • the thickness d of the housing 410 may be located within a range between the first thickness a1 and the second thickness a2.
  • the electronic device 400 adjusts the thickness of the housing 410 through which the electromagnetic wave signal 450 passes according to the frequency of the electromagnetic wave signal 450, thereby causing reflection of the electromagnetic wave signal 450. Losses can be reduced.
  • FIGS. 5A, 5B, and 5C are partial cross-sectional views of an example electronic device taken along line B-B′ in FIG. 4A.
  • the electronic device 400 may include a third antenna module 246 .
  • the electronic device 400 may include a housing 410.
  • the housing 410 may include an internal space for placing electronic components.
  • the housing 410 may define the internal space.
  • the housing 410 includes a first plate 402, a second plate 411 facing the first plate 402, and a space between the first plate 402 and the second plate 411. It may include a side bezel structure 418 surrounding the space.
  • the internal space may be defined as a space surrounded by the first plate 402, the second plate 411, and the side bezel structure 418.
  • the first plate 402 may include a transparent portion.
  • the first plate 402 may include glass or a transparent polymer (eg, polyimide (PI), polyethylene terephthalate (PET)).
  • PI polyimide
  • PET polyethylene terephthalate
  • the first plate 402 on which at least a portion of the display (e.g., the display module 160 in FIG. 1 and the display 401 in FIG. 2) is disposed can provide visual information to the outside from the display 401. .
  • the first area 411a of the second plate 411 may face the third antenna module 246.
  • the first area 411a may be an area through which the electromagnetic wave signal 450 transmitted from or received from the antenna element 332 of the third antenna module 246 passes through.
  • the first area 411a may face the first surface 310a of the printed circuit board 310 included in the antenna module 246.
  • the first area 411a can transmit the electromagnetic wave signal 450 radiated from the antenna element 332 of the third antenna module 246.
  • the second area 411b of the second plate 411 may protect the internal components of the electronic device 400 from external shock by surrounding the first area 411a.
  • the thickness d1 of the first region 411a of the second plate 411 is, while passing through the housing 410, It may be thinner than a half wavelength (w1/2) of the first electromagnetic wave 451 having a frequency of 1 (f1).
  • the thickness d1 of the first area 411a may be thicker than the half wavelength (w2/2) of the second electromagnetic wave 452 having the second frequency f2.
  • the first area 411a of the second plate 411 may be an area through which the first electromagnetic wave 451 and the second electromagnetic wave 452 pass through the housing 410.
  • the thickness d1 of the first area 411a is adjusted to the half wavelength (w1/2) of the first electromagnetic wave 451 and the second electromagnetic wave ( 452) may be located within a range between the half-wavelength (w2/2) (e.g., a range between the first thickness (a1) and the second thickness (a2)).
  • the housing 410 may further include a ceramic material.
  • the second plate 411 of the housing 410 may include a ceramic material. Since the second plate 411 includes a ceramic material, the electronic device 400 can reduce damage to the second plate 411 caused by external impacts of the electronic device 400. By including a ceramic material, the housing 410 can provide a metal texture to the user of the electronic device 400.
  • the housing 410 may further include ceramics including ZrO2 with a weight ratio of 80 to 95, AlO3 with a weight ratio of 0.5 to 3, and Y2O3.
  • the housing 410 may have physical properties (eg, rigidity) or electrical properties (eg, dielectric constant) within a designated range by including ZrO2 having a weight ratio within a designated range.
  • the housing 410 may include a ceramic containing ZrO2 at a weight ratio of 80 to 95, thereby having a dielectric constant within a specified range.
  • the housing 410 may have a unique impedance (Z2) value within a specified range based on the dielectric constant.
  • the housing 410 including ceramics including ZrO2 with a weight ratio of 80 to 95 may have higher rigidity than the housing 410 including glass with a weight ratio of 80 to 95.
  • the dielectric constant of the housing 410 may be 25 F/m to 35 F/m.
  • the thickness d2 of the second area 411b of the second plate 411 may be thinner than the thickness d1 of the first area 411a of the second plate 411.
  • the thickness of the first region 411a of the second plate 411 may be within a specified range in order to reduce reflection loss of the electromagnetic wave signal 450 in the high frequency band (eg, mmWave band).
  • the second plate 411 of the housing 410 may include a ceramic containing ZrO2 at a weight ratio of 80 to 95, and thus may have a dielectric constant in the range of 25 F/m to 35 F/m.
  • the first electromagnetic wave 451 passing through the second plate 411 may have a first frequency f1 of 28 GHz.
  • the second frequency f2 of the second electromagnetic wave 452 passing through the second plate 411 may be 39 GHz.
  • the first electromagnetic wave 451 having a first frequency (f1) of 28 GHz is generated by the second plate 411 having a dielectric constant in the range of 25 F/m to 35 F/m. ), it can have a half-wavelength (w1/2) of approximately 0.9mm.
  • the second electromagnetic wave 452 having a second frequency (f2) of 39 GHz has a half-wavelength of approximately 0.6 mm when passing through the second plate 411 having a dielectric constant in the range of 25 F/m to 35 F/m.
  • the thickness (d1) of the first area (411a) through which the first electromagnetic wave 451 and the second electromagnetic wave 452 transmit is 0.6 mm, which is the half wavelength (w2/2) of the second electromagnetic wave 452. It is large and can be located within a range smaller than 0.9 mm, which is the half wavelength (w1/2) of the first electromagnetic wave 451.
  • the first thickness a1 may be 0.7 mm.
  • the second thickness (a2) may be 0.8 mm.
  • the thickness d1 of the first area 411a may range between 0.7 mm, which is the first thickness a1, and 0.8 mm, which is the second thickness a2.
  • the thickness d1 of the first area 411a has a thickness within a specified range, it may be thicker than the thickness d2 of the second area 411b of the second plate 411.
  • the thickness d1 of the first area 411a within a specified range, the reflection loss of the electromagnetic waves 451 and 452 can be reduced.
  • the thickness d2 of the second area 411b is thinner than the thickness of the first area 411a, the weight of the housing 410 can be reduced.
  • the second plate 411 may include an outer surface 411c and an inner surface 411d facing the outer surface 411c.
  • the outer surface 411c may form at least part of the exterior of the electronic device 400.
  • the inner surface 411d may face the inside of the electronic device 400.
  • the second plate 411 may include a protrusion 520 that protrudes from the second plate 411 into the interior of the housing 410 in the first area 411a.
  • the protrusion 520 may be disposed on the inner surface 411d of the second plate 411.
  • the protrusion 520 may include a third surface 520a having a shape corresponding to the outer surface 411c of the second plate 411.
  • the protrusion 520 may protrude from the inner surface 411d of the second plate 411 within the first area 411a of the second plate 411.
  • the third surface 520a of the protrusion 520 faces the outer surface 411c of the second plate 411 and may extend in a direction parallel to the outer surface 411c.
  • the second plate 411 can provide continuity to the outer surface 411c by including the protrusion 520 on the inner surface 411d.
  • the first area 411a is a portion of the second area 411b of the second plate 411. It may have a thickness (d1) thicker than the thickness (d2).
  • the protrusion 520 can maintain the thickness d1 of the first region 411a constant.
  • the distance ( d3) may be 0.05 mm to 0.45 mm.
  • the distance d3 is the difference between the thickness d1 of the first area 411a where the protrusion 520 is disposed and the thickness d2 of the second area 411b surrounding the first area 411a. You can.
  • the distance d3 may be the thickness of the protrusion 520.
  • the second plate 411 containing ZrO2 at a weight ratio of 80 to 95 is used to reduce the reflection loss of the electromagnetic wave signal 450 having a frequency in the range of 28 GHz to 39 GHz penetrating the first region 411a.
  • the thickness d1 of the first area 411a may be the thickness of the second area 411b ( It may be the sum of d2) and distance (d3).
  • the distance d3 has a specified range (e.g., 0.05 mm to 0.45 mm)
  • the thickness d1 of the first area 411a and the first area surrounding the first area 411a reduce reflection loss.
  • the thickness d2 of area 2 411b can be calculated.
  • the electronic device 400 may further include an anti-scattering film 530 disposed on the inner surface 411d of the second plate 411.
  • the anti-scattering film 530 may cover the inner surface 411d of the second plate 411.
  • the anti-scattering film 530 may cover the protrusion 520 of the first region 411a that protrudes toward the inside of the electronic device 400.
  • the anti-scattering film 530 may have a shape corresponding to the inner surface (411d).
  • the shatterproof film 530 covers the inner surface 411d to prevent shatter of the second plate 411 generated by external impact from scattering into the internal space of the electronic device 400. It can be reduced.
  • the second plate 411 may include a step 540 at the boundary between the first area 411a and the second area 411b.
  • the second plate 411 includes a protrusion 520 in the first area 411a, thereby including a step 540 at the boundary between the first area 411a and the second area 411b. can do.
  • the third surface 520a of the protrusion 520 may extend from the step 540 within the first area 411a.
  • the second plate 411 is between the inner surface 411d of the second plate 411 facing the inside of the housing 410 and the protrusion 520 facing the inside of the housing 410. It can have curvature.
  • the radius of curvature (R) may be approximately 0.3 mm to 0.6 mm.
  • the second plate 411 may include a step 540 having a curvature by including a protrusion 520 in the first area 411a.
  • the radius of curvature (R) of the step 540 has a length within a specified range (ranging from 0.3 mm to 0.6 mm), so that the anti-scattering film 530 disposed on the inner surface 411d is buckled, or the Due to the step 540, peeling from the inner surface 411d can be reduced.
  • the electronic device 400 further includes a deposition layer 550 disposed on the outer surface 411c of the second plate 411 and including a color different from the color of the second plate 411. It can be included.
  • the electronic device 400 can provide aesthetics to the user of the electronic device 400 by including the deposition layer 550.
  • the deposition layer 550 may be omitted.
  • the electronic device 400 may further include an anti-fingerprint film 560 disposed on the outer surface 511a of the second plate 411.
  • the anti-fingerprint film 560 may be disposed on the deposition layer 550 disposed on the outer surface 411c.
  • the electronic device 400 can reduce traces generated by external objects (eg, a user's finger) by including the anti-fingerprint film 560.
  • the anti-fingerprint film 560 may be omitted.
  • the third antenna module 246 may be disposed in the internal space of the housing 410.
  • the third antenna module 246 may be disposed between the first plate 402 and the second plate 411.
  • the third antenna module 246 may include an antenna array 330 including an antenna element 332 and a printed circuit board 310 on which the antenna array 330 is disposed.
  • the printed circuit board 310 may be arranged so that the antenna array 330 faces the inner surface 411d of the second plate 411.
  • the antenna array 330 including the antenna elements 332 may be disposed on the first side 310a of the printed circuit board 310. As the first surface 310a faces the inner surface 411d of the second plate 411, the electromagnetic wave signal 450 radiated from the antenna array 330 penetrates the second plate 411. can do.
  • the first area 411a of the second plate 411 may overlap the antenna element 332 when the second plate 411 is viewed from above.
  • the first area 411a may overlap the antenna array 330 including the antenna element 332 when viewed from above.
  • the first surface 310a of the printed circuit board 310 on which the antenna element 332 is disposed may be parallel to the third surface 520a of the protrusion 520.
  • the antenna array 330 including the antenna element 332 may face the first area 411a.
  • the antenna array 330 may overlap the third surface 520a of the protrusion 520 disposed in the first area 411a.
  • the electromagnetic wave signal 450 radiated from the antenna array 330 is generated in the first area ( 411a) can be transmitted. Since the first surface 310a of the printed circuit board 310 on which the antenna array 330 is disposed is parallel to the third surface 520a of the protrusion 520, the electromagnetic wave radiated from the antenna array 330 The signal 450 may pass through the first area 411a in a direction perpendicular to the third surface 520a.
  • the third area 246a where the antenna element 332 is disposed may be narrower than the first area 411a.
  • the third area 246a may be an area where the antenna array 330 including the antenna element 332 is disposed.
  • the area s1 of the first area 411a may be larger than the area s2 of the third area 246a.
  • the area of the first surface 310a of the printed circuit board 310 on which the third area 246a is disposed may be smaller than the area s1 of the first area 411a. Since the area s2 of the third area 246a is smaller than the area s1 of the first area 411a, the electromagnetic wave signal 450 radiated from the third area 246a is transmitted to the first area 411a. (411a) can be transmitted.
  • the second communication processor (e.g., auxiliary processor 123 in FIG. 1, second communication processor 214 in FIG. 2) may be operatively coupled to the antenna element 332. there is.
  • the second communication processor 214 may transmit an electromagnetic wave signal 450 within the range of the first frequency f1 to the second frequency f2 to an external electronic device through the antenna element 332.
  • the second communication processor 214 may be configured to receive the electromagnetic wave signal 450 within the range of the first frequency f1 to the second frequency f2 from the external electronic device.
  • each of the first frequency f1 and the second frequency f2 may be located within a range of 28 GHz to 39 GHz.
  • the second communication processor 214 may transmit a baseband signal to a third RFIC (eg, the third RFIC 226 in FIG. 2).
  • the third RFIC 226 up-converts the baseband signal received from the second communication processor 214 into an RF signal and transmits it to the electronic device 400 through the antenna element 332. ) can be radiated to the outside.
  • the third RFIC 226 receives an RF signal transmitted from an external electronic device (e.g., the electronic device 102, electronic device 104, or server 108 of FIG. 1) through the antenna element 332. By receiving, the RF signal can be down-converted into a baseband signal.
  • the third RFIC 226 may transmit the down-converted baseband signal to the second communication processor 214.
  • the RF signal may include a first electromagnetic wave 451 having a first frequency f1 and/or a second electromagnetic wave 452 having a second frequency f2.
  • the first frequency (f1) and the second frequency (f2) may be located within a mmWave band (eg, 29 GHz to 39 GHz band).
  • the second plate 411 may include a third plate 570 and an adhesive layer 580, unlike FIG. 5B which includes a protrusion 520.
  • the third plate 570 may be disposed on the inner surface 411d of the second plate 411, within the first area 411a of the second plate 411, toward the inside of the housing 410.
  • the adhesive layer 580 may be disposed between the second plate 411 and the third plate 570.
  • the third plate 570 may be made of substantially the same or similar material as the second plate 411.
  • the adhesive layer 580 disposed between the second plate 411 and the third plate 570 may have a low dielectric constant (eg, a dielectric constant in the range of 5 F/m to 6 F/m).
  • the second plate 411 and the third plate 570 may further include ceramics including ZrO2 with a weight ratio of 80 to 95, AlO3 with a weight ratio of 0.5 to 3, and Y2O3.
  • the third plate 570 may have a dielectric constant that is substantially the same or similar to that of the second plate 411 (eg, a dielectric constant in the range of 25 F/m to 35 F/m).
  • the adhesive layer 580 may have a low dielectric constant by including OCA.
  • the second plate 411 includes a third plate 570 made of a material substantially the same or similar to the second plate 411 in the first region 411a, thereby causing the first plate 570 to be formed due to a change in dielectric constant. The reflection loss of the electromagnetic wave signal 450 passing through the area 411a can be reduced.
  • the second plate 411 includes an adhesive layer 580 disposed between the third plate 570 and the second plate 411, thereby connecting the third plate 570 to the second plate 411. ) can be attached to the inner surface of the.
  • the adhesive layer 580 has a low dielectric constant, thereby reducing reflection loss of the mmWave band electromagnetic wave signal 450 that passes through the first region 411a.
  • the sum of the thickness d2 of the second plate 411 and the thickness d4 of the third plate 570 disposed in the first area 411a is within the range of 0.7 mm to 0.8 mm. can do.
  • the thickness of the adhesive layer 580 may be within the range of 0.05 mm to 0.2 mm.
  • the anti-scattering film 530 may be disposed in the second area 411b of the first area 411a and the second area 411b of the second plate 411.
  • the anti-scattering film 530 may be spaced apart from the third plate 570.
  • the anti-scattering film 530 may be disposed in the second area 411b surrounding the first area 411a where the third plate 570 is disposed.
  • the fourth surface 570a of the third plate 570 facing the inside of the electronic device 400 may be exposed to the internal space of the electronic device 400.
  • the adhesive layer 580 fixes the third plate 570 disposed in the first area 411a to the inner surface 411d, thereby preventing the third plate 570 from being damaged by an external impact of the electronic device 400.
  • the shatterproof film 530 covers the second area 411b, thereby preventing fragments of the second plate 411 disposed in the second area 411b generated by external impact from entering the interior of the electronic device 400. Dispersion into space can be reduced.
  • the second plate 411 of the electronic device 400 includes ceramic containing ZrO2 with a weight ratio of 80 to 95, thereby reducing damage to the electronic device 400 due to external impact and protecting the user from damage. It can provide a metal texture to the user.
  • the second plate 411 which includes the ceramic and has a dielectric constant within a specified range (e.g., a dielectric constant within a range of 25 F/m to 35 F/m), has a frequency in the mmWave band (e.g., a frequency in the 28 GHz to 39 GHz band). It may include a first area 411a through which the electromagnetic wave signal 450 passes.
  • the electronic device 400 transmits the electromagnetic wave signal ( 450) can reduce the reflection loss.
  • the second plate 411 includes a protrusion 520 or a third plate 570 in the first area 411a, thereby maintaining the thickness d1 of the first area 411a within a specified range. there is.
  • Figure 6 is a flow chart showing the manufacturing process of a housing containing ceramic.
  • ceramic powder may be prepared to mold a housing for forming the exterior of an electronic device (e.g., electronic device 101 in FIG. 1 or electronic device 400 in FIG. 4A).
  • the ceramic powder may include ZrO2.
  • the ceramic powder for forming the third plate 570 of FIG. 5B may be prepared separately from the ceramic powder for forming the second plate 570.
  • the ceramic powder may be molded.
  • ceramic powder may be molded to include a flat or curved surface based on the shape of the housing of the electronic device 400 (eg, housing 410 in FIG. 4A).
  • the second plate eg, the second plate 411 in FIG. 4A
  • the third plate 570 of FIG. 5B may be compression molded using a mold that is different in size and/or shape from the second plate 570.
  • the formed second plate 411 may be processed.
  • the second plate 411 has a first area (e.g., first area 411a in FIG. 4A) and a second area (e.g., second area 411b in FIG. 4A) surrounding the first area 411a. )) can be processed to be thicker than.
  • the first area 411a includes an antenna array 330 including an antenna structure (e.g., antenna element 332 in FIG. 5a) through which an electromagnetic wave signal (e.g., electromagnetic wave signal 450 in FIG. 4b) is radiated. It may be an area you encounter.
  • the second plate 411 may be processed to include a protrusion 520 in the first area 411a.
  • the second plate 411 may be processed through a CNC (computerized numerical control) machining process to have a specified thickness (eg, a thickness in the range of 0.7 mm to 0.8 mm) in the first area 411a.
  • a specified thickness eg, a thickness in the range of 0.7 mm to 0.8 mm
  • the sum of the thickness of the third plate 570 and the thickness of the second plate 411 has a specified thickness (e.g., a thickness in the range of 0.7 mm to 0.8 mm).
  • the second plate 411 and the third plate 570 may be processed through a CNC machining process.
  • the molded second plate 411 has a shatterproof film (e.g., shatterproof film 530 in FIG. 5a) on its inner surface (e.g., inner surface 411d in FIG. 5a). )) can be attached.
  • the anti-scattering film 530 in which the area corresponding to the first area 411a is removed, may be attached to the first area 411a where the third plate 570 of FIG. 5B is disposed.
  • the second plate 411 is formed by disposing an adhesive layer (e.g., adhesive layer 580 in FIG. 5B) on the first area 411a, so that the third plate 570 is in the first area 411a. It can be attached.
  • the second plate 411 to which the anti-shatter film 530 is attached has an anti-fingerprint film (e.g., the anti-fingerprint film 560 in FIG. 5A) on its outer surface (e.g., the outer surface 411c in FIG. 5A). )) and/or a deposition layer of a different color from that of the second plate 411 (e.g., the deposition layer 550 in FIG. 5A) may be coated. According to one embodiment, process 609 may be omitted.
  • an anti-fingerprint film e.g., the anti-fingerprint film 560 in FIG. 5A
  • a deposition layer of a different color from that of the second plate 411 e.g., the deposition layer 550 in FIG. 5A
  • process 609 may be omitted.
  • the second plate 411 can reduce the reflection loss of the electromagnetic wave signal 450 by processing the first area 411a through which the electromagnetic wave signal 450 is transmitted to within a specified thickness range.
  • an electronic device e.g., the electronic device 101 of FIG. 1 or the electronic device 400 of FIG. 4a
  • a first plate e.g., the first plate 402 of FIG. 4a
  • a housing e.g., housing 410 in FIG. 4a
  • a second plate e.g., second plate 411 in FIG. 4a
  • An antenna module e.g., third antenna module 246 in FIG. 2 including at least one antenna element (e.g., antenna element 332 in FIG. 4A) disposed between the plates and operating with the at least one antenna element.
  • It may include a processor (e.g., the auxiliary processor 123 in FIG.
  • the processor through the at least one antenna element, electromagnetic waves within the range of a first frequency (e.g., the first frequency (f1) in FIG. 4C) to a second frequency (e.g., the second frequency (f2) in FIG. 4C).
  • a signal e.g., the electromagnetic wave signal 450 in FIG. 4B, the first electromagnetic wave signal 451, and the second electromagnetic wave signal 452 in FIG. 4C
  • an external electronic device e.g., the electronic device 102 in FIG. 1, electronic device. It may be configured to transmit to (104), server (108), or receive the electromagnetic wave signal from the external electronic device.
  • the second plate overlaps the at least one antenna element and has a first area through which the electromagnetic wave signal passes from the at least one antenna element (e.g., the first area in FIG. 4A). (411a)) and a second region that surrounds the first region 411a and is thinner than the first region 411a (eg, the second region 411b in FIG. 4A).
  • Each of the first frequency and the second frequency may be located within a range of 28 GHz to 39 GHz.
  • the electronic device includes a housing containing ceramic, thereby providing a metal texture to the user and reducing damage to the electronic device due to external impact.
  • the second plate includes a first region that is thicker than the second region, thereby reducing reflection loss of the electromagnetic wave signal passing through the first region.
  • the above-mentioned embodiments may have various effects including the above-mentioned effects.
  • the housing may include ceramics including ZrO2 with a weight ratio of 80 to 95, AlO3 with a weight ratio of 0.5 to 3, and Y2O3.
  • the electronic device includes a ceramic containing ZrO2 at a weight ratio of 80 to 95, thereby reducing damage to the electronic device 400 due to external impact and providing a metal texture to the user.
  • the electronic device may have a dielectric constant within a specified range (eg, a dielectric constant within the range of 25 F/m to 35 F/m).
  • the above-mentioned embodiments may have various effects including the above-mentioned effects.
  • the thickness of the first region is such that the first electromagnetic wave having the first frequency (e.g., the first electromagnetic wave signal 451 in FIG. 4C) while passing through the housing. )) is thinner than the half-wavelength (e.g., w1/2 in FIG. 4C) and has the second frequency (e.g., the second electromagnetic wave signal 452 in FIG. 4C). It can be thicker than w2/2).
  • the housing having a dielectric constant within a specified range is capable of transmitting the electromagnetic waves having a frequency in the mmWave band (e.g., a frequency in the 28 GHz to 39 GHz band). It may include a first area through which a signal passes. By having the first area have a thickness within a half-wavelength range of the electromagnetic wave signal in which reflection of the electromagnetic wave signal is reduced, the electronic device can reduce reflection loss of the electromagnetic wave signal passing through the first area.
  • the above-mentioned embodiments may have various effects including the above-mentioned effects.
  • the dielectric constant of the housing may be 25 F/m to 35 F/m, and the thickness of the first region may be 0.7 mm to 0.8 mm.
  • the housing having a dielectric constant within a specified range may include a first region through which an electromagnetic wave signal having a frequency in the mmWave band (eg, a frequency within the 28 GHz to 39 GHz band) is transmitted.
  • an electromagnetic wave signal having a frequency in the mmWave band eg, a frequency within the 28 GHz to 39 GHz band
  • the electronic device can reduce reflection loss of the electromagnetic wave signal passing through the first area.
  • the above-mentioned embodiments may have various effects including the above-mentioned effects.
  • the second plate may include a step (eg, step 540 in FIG. 5A) at the boundary between the first area and the second area.
  • the first plate may have a thickness of the first region that is different from a thickness of the second region by including the step.
  • the above-mentioned embodiments may have various effects including the above-mentioned effects.
  • the second plate may further include a protrusion (eg, protrusion 520 in FIG. 5A) that protrudes from the second plate into the interior of the housing in the first area.
  • a protrusion eg, protrusion 520 in FIG. 5A
  • the second plate may have a thickness of the first region that is different from the thickness of the second region by including the protrusion.
  • the second plate can maintain the thickness of the first region within a specified range by including the protrusion in the first region.
  • the above-mentioned embodiments may have various effects including the above-mentioned effects.
  • the second plate has a curvature between one surface of the second plate facing the inside of the housing (e.g., the inner surface 411d in FIG. 5A) and the protrusion facing the inside of the housing. You can.
  • the radius of curvature (eg, R in FIG. 5A) may be 0.3 mm to 0.6 mm.
  • the second plate includes a radius of curvature having a length within a specified range between the one surface of the second plate and the protrusion, so that the anti-shatter film disposed on the one surface is buckled or , peeling from one side can be reduced.
  • the above-mentioned embodiments may have various effects including the above-mentioned effects.
  • the distance from one side of the second plate facing the inside of the housing to one side of the protrusion (e.g., the third side 520a in FIG. 5A) facing the inside of the housing is 0.05 mm. It may be from 0.45 mm.
  • the second plate includes a protrusion having a thickness in a specified range, so that the reflection loss of the electromagnetic wave signal is reduced, the thickness of the second area and the thickness of the second area surrounding the first area are reduced. The thickness can be calculated.
  • the above-mentioned embodiments may have various effects including the above-mentioned effects.
  • the second plate is disposed on one side of the second plate, within the first region, toward the inside of the housing, and includes a third plate including ceramic (e.g., the third plate in FIG. 5B It may further include a plate 570) and an adhesive layer disposed between the third plate and the second plate (e.g., the adhesive layer 580 in FIG. 5B).
  • the second plate includes an adhesive layer disposed between the third plate and the second plate, thereby allowing the third plate to be attached to the inner surface of the second plate.
  • the adhesive layer can reduce reflection loss of an electromagnetic wave signal in the mmWave band that passes through the first region.
  • the second plate can maintain the thickness of the first region within a specified range by including the third plate in the first region.
  • the above-mentioned embodiments may have various effects including the above-mentioned effects.
  • the area where the at least one antenna element is placed may be narrower than the first area.
  • the electronic device has an area in which the at least one antenna element is disposed being narrower than the first area, so that an electromagnetic wave signal radiated from the at least one antenna element penetrates the first area. can do.
  • the above-mentioned embodiments may have various effects including the above-mentioned effects.
  • the electronic device may further include an anti-scattering film 530 disposed on the inner surface of the second plate.
  • the second plate includes an anti-scattering film on the inner surface, thereby reducing the scattering of fragments of the second plate generated by external impact into the internal space of the electronic device.
  • the above-mentioned embodiments may have various effects including the above-mentioned effects.
  • the anti-scattering film may be disposed in the second area among the first area and the second area.
  • the second plate includes an anti-shattering film disposed in the second area, so that fragments of the second plate disposed in the second area generated by external impact may not be inside the electronic device. Dispersion into space can be reduced.
  • the above-mentioned embodiments may have various effects including the above-mentioned effects.
  • one side (e.g., the first side 310a of FIG. 5A) of the substrate (e.g., printed circuit board 310 of FIG. 3) of the antenna module on which the at least one antenna element is disposed is, It may be parallel to the second plate.
  • the electronic device may transmit an electromagnetic wave signal radiated from the at least one antenna element in a direction perpendicular to the first area by having the one surface of the substrate parallel to the second plate. You can.
  • the above-mentioned embodiments may have various effects including the above-mentioned effects.
  • the electronic device may further include an anti-fingerprint film (eg, anti-fingerprint film 560 of FIG. 5A) disposed on the outer surface of the second plate.
  • an anti-fingerprint film eg, anti-fingerprint film 560 of FIG. 5A
  • the electronic device can reduce traces generated by external objects (eg, a user's finger) by including the anti-fingerprint film.
  • the above-mentioned embodiments may have various effects including the above-mentioned effects.
  • the electronic device includes a deposition layer disposed on the outer surface of the second plate (e.g., the outer surface 411c in FIG. 5A) and including a color different from the color of the second plate (e.g., the deposition layer in FIG. 5a). It may further include a layer 550). According to the above-mentioned embodiment, the electronic device can provide aesthetics to the user of the electronic device by including the deposition layer. The above-mentioned embodiments may have various effects including the above-mentioned effects.
  • an electronic device includes a housing including a first plate and a second plate facing the first plate, disposed between the first plate and the second plate, and including at least one antenna element. and a processor operatively coupled to the antenna module and the at least one antenna element.
  • the processor may be configured to transmit an electromagnetic wave signal within a range of a first frequency to a second frequency to an external electronic device or to receive the electromagnetic wave signal from the external electronic device through the at least one antenna element.
  • the second plate may include a first area that is parallel to the antenna module and through which the electromagnetic wave signal passes from the at least one antenna element, and a second area that surrounds the first area and is thinner than the first area. .
  • the thickness of the first region may be thinner than a half-wavelength of the first electromagnetic wave having the first frequency and thicker than a half-wavelength of the second electromagnetic wave having the second frequency while passing through the housing.
  • Each of the first frequency and the second frequency may be located within a range of 28 GHz to 39 GHz.
  • the housing may include a first area through which the electromagnetic wave signal having a frequency in the mmWave band (eg, a frequency in the 28 GHz to 39 GHz band) transmits.
  • the electronic device can reduce reflection loss of the electromagnetic wave signal passing through the first area.
  • the above-mentioned embodiments may have various effects including the above-mentioned effects.
  • the second plate is disposed on one side of the second plate facing the inside of the housing, within the first region, and includes a third plate and the third plate and the third plate and the third plate and the third plate and the third plate including ceramic. It may further include an adhesive layer disposed between the two plates.
  • the electronic device may further include an anti-scattering film within the second region and spaced apart from the third plate.
  • the second plate includes an adhesive layer disposed between the third plate and the second plate, thereby allowing the third plate to be attached to the inner surface of the second plate. By having a low dielectric constant, the adhesive layer can reduce reflection loss of an electromagnetic wave signal in the mmWave band that passes through the first region.
  • the second plate can maintain the thickness of the first region within a specified range by including the third plate in the first region.
  • the second plate includes a shatterproof film disposed in the second area, thereby reducing the scattering of fragments of the second plate disposed in the second area generated by external impact into the internal space of the electronic device. .
  • the above-mentioned embodiments may have various effects including the above-mentioned effects.
  • the second plate may include a step at a boundary between the first area and the second area.
  • the second plate may have a thickness of the first region that is different from the thickness of the second region by including the step.
  • the above-mentioned embodiments may have various effects including the above-mentioned effects.
  • the dielectric constant of the housing may be 25 F/m to 35 F/m, and the thickness of the first region may be 0.7 mm to 0.8 mm.
  • the housing having a dielectric constant within a specified range may include a first region through which an electromagnetic wave signal having a frequency in the mmWave band (eg, a frequency within the 28 GHz to 39 GHz band) is transmitted.
  • an electromagnetic wave signal having a frequency in the mmWave band eg, a frequency within the 28 GHz to 39 GHz band
  • the electronic device can reduce reflection loss of the electromagnetic wave signal passing through the first area.
  • the above-mentioned embodiments may have various effects including the above-mentioned effects.
  • the housing may include ceramics including ZrO2 with a weight ratio of 80 to 95, AlO3 with a weight ratio of 0.5 to 3, and Y2O3.
  • the electronic device includes a ceramic containing ZrO2 at a weight ratio of 80 to 95, thereby reducing damage to the electronic device 400 due to external impact and providing a metal texture to the user.
  • the electronic device may have a dielectric constant within a specified range (eg, a dielectric constant within the range of 25 F/m to 35 F/m).
  • the above-mentioned embodiments may have various effects including the above-mentioned effects.
  • the second plate may further include a protrusion protruding from the second plate into the interior of the housing in the first area.
  • the second plate may have a thickness of the first region that is different from the thickness of the second region by including the protrusion.
  • the second plate can maintain the thickness of the first region within a specified range by including the protrusion in the first region.
  • the above-mentioned embodiments may have various effects including the above-mentioned effects.
  • the distance from one side of the second plate facing the inside of the housing to one side of the protrusion facing the inside of the housing may be 0.05 mm to 0.45 mm.
  • the second plate includes a protrusion having a thickness in a specified range, so that the reflection loss of the electromagnetic wave signal is reduced, the thickness of the first area and the second area surrounding the first area. The thickness can be calculated.
  • the above-mentioned embodiments may have various effects including the above-mentioned effects.
  • Electronic devices may be of various types.
  • Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, electronic devices, or home appliances.
  • Electronic devices according to embodiments of this document are not limited to the above-described devices.
  • first, second, or first or second may be used simply to distinguish one element from another, and may be used to distinguish such elements in other respects, such as importance or order) is not limited.
  • One (e.g. first) component is said to be “coupled” or “connected” to another (e.g. second) component, with or without the terms “functionally” or “communicatively”.
  • any of the components can be connected to the other components directly (e.g. wired), wirelessly, or through a third component.
  • module used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeable with terms such as logic, logic block, component, or circuit, for example. It can be used as A module may be an integrated part or a minimum unit of the parts or a part thereof that performs one or more functions. For example, according to one embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).
  • ASIC application-specific integrated circuit
  • Various embodiments of the present document are one or more instructions stored in a storage medium (e.g., built-in memory 136 or external memory 138) that can be read by a machine (e.g., electronic device 101). It may be implemented as software (e.g., program 140) including these.
  • a processor e.g., processor 120
  • the one or more instructions may include code generated by a compiler or code that can be executed by an interpreter.
  • a storage medium that can be read by a device may be provided in the form of a non-transitory storage medium.
  • 'non-transitory' only means that the storage medium is a tangible device and does not contain signals (e.g. electromagnetic waves), and this term refers to cases where data is semi-permanently stored in the storage medium. There is no distinction between temporary storage cases.
  • Computer program products are commodities and can be traded between sellers and buyers.
  • the computer program product may be distributed in the form of a machine-readable storage medium (e.g. compact disc read only memory (CD-ROM)) or through an application store (e.g. Play StoreTM) or on two user devices (e.g. It can be distributed (e.g. downloaded or uploaded) directly between smart phones) or online.
  • a machine-readable storage medium e.g. compact disc read only memory (CD-ROM)
  • an application store e.g. Play StoreTM
  • two user devices e.g. It can be distributed (e.g. downloaded or uploaded) directly between smart phones) or online.
  • at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.
  • each component (e.g., module or program) of the above-described components may include a single or plural entity, and some of the plurality of entities may be separately placed in other components. there is.
  • one or more of the components or operations described above may be omitted, or one or more other components or operations may be added.
  • multiple components eg, modules or programs
  • the integrated component may perform one or more functions of each component of the plurality of components in the same or similar manner as those performed by the corresponding component of the plurality of components prior to the integration. .
  • operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, or omitted. Alternatively, one or more other operations may be added.

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Abstract

Un dispositif électronique selon un mode de réalisation peut comprendre : un boîtier comprenant au moins un élément d'antenne et une plaque qui inclut des céramiques ; et un processeur couplé de manière fonctionnelle à cet élément d'antenne. La plaque comprend : une première zone qui recouvre le ou les éléments d'antenne lorsqu'on regarde la plaque par le haut, et à travers laquelle un signal d'onde électromagnétique passe depuis le ou les éléments d'antenne ; et une seconde zone qui entoure la première zone et qui est plus étroite que celle-ci, le signal d'onde électromagnétique pouvant être localisé dans la plage de 28GHz à 39GHz. D'autres modes de réalisation sont possibles.
PCT/KR2023/006805 2022-07-15 2023-05-18 Boîtier chevauchant un élément d'antenne et dispositif électronique le comprenant WO2024014690A1 (fr)

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KR10-2022-0087571 2022-07-15
KR20220087571 2022-07-15
KR10-2022-0100891 2022-08-11
KR1020220100891A KR20240010371A (ko) 2022-07-15 2022-08-11 안테나 엘리먼트와 중첩되는 하우징 및 이를 포함하는 전자 장치

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WO2024014690A1 true WO2024014690A1 (fr) 2024-01-18

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KR20200052096A (ko) * 2018-11-06 2020-05-14 삼성전자주식회사 안테나, 안테나와 적어도 일부 중첩하여 배치되는 유전체를 포함하는 전자 장치
CN112235438A (zh) * 2019-06-30 2021-01-15 Oppo广东移动通信有限公司 壳体组件及其制备方法、天线组件、电子设备
KR20210050267A (ko) * 2019-10-28 2021-05-07 삼성전자주식회사 안테나 구조체를 포함하는 전자 장치
KR20210112642A (ko) * 2020-03-05 2021-09-15 삼성전자주식회사 디스플레이의 주름 방지층을 포함하는 폴더블 전자 장치

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