WO2024010231A1 - Dispositif électronique comprenant un module de connecteur, et son procédé de fonctionnement - Google Patents

Dispositif électronique comprenant un module de connecteur, et son procédé de fonctionnement Download PDF

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Publication number
WO2024010231A1
WO2024010231A1 PCT/KR2023/007753 KR2023007753W WO2024010231A1 WO 2024010231 A1 WO2024010231 A1 WO 2024010231A1 KR 2023007753 W KR2023007753 W KR 2023007753W WO 2024010231 A1 WO2024010231 A1 WO 2024010231A1
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WIPO (PCT)
Prior art keywords
connector
camera module
module
electronic device
circuit board
Prior art date
Application number
PCT/KR2023/007753
Other languages
English (en)
Korean (ko)
Inventor
송지윤
정지영
김종두
이한엽
임군
Original Assignee
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Priority claimed from KR1020220111181A external-priority patent/KR20240004080A/ko
Application filed by 삼성전자 주식회사 filed Critical 삼성전자 주식회사
Publication of WO2024010231A1 publication Critical patent/WO2024010231A1/fr

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/90—Arrangement of cameras or camera modules, e.g. multiple cameras in TV studios or sports stadiums
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits

Definitions

  • Various embodiments of the present disclosure relate to an electronic device including a connector module that electrically connects a printed circuit board and a camera module, and a method of operating the same.
  • the electronic device includes a printed circuit having at least one camera module for photographing the front direction, at least one camera module for photographing the rear direction, and a driving circuit unit (e.g., an image signal processor and memory) for driving the camera modules. It may include a substrate (e.g., printed circuit board (PCB), printed board assembly (PBA)).
  • PCB printed circuit board
  • PBA printed board assembly
  • a plurality of camera modules disposed inside the electronic device may be electrically connected to a printed circuit board through a plurality of connectors.
  • a processor eg, image signal processor
  • a plurality of camera modules disposed on a printed circuit board may transmit/receive signals and image signals for performing operations.
  • the number of camera modules disposed in an electronic device increases, the number of connectors for connecting a plurality of camera modules to a printed circuit board increases. Accordingly, the space for arranging a plurality of connectors on the printed circuit board increases. Due to limitations in the internal mounting space of the electronic device, it is difficult to increase the area of the printed circuit board, and there may be difficulty in arranging a plurality of connectors to connect a plurality of camera modules and the printed circuit board.
  • a connector module capable of reducing the space where a plurality of connectors are arranged on a printed circuit board, an electronic device including the connector module, and a method of operating the same can be provided.
  • An electronic device may include a first camera module, a second camera module, a printed circuit board, and a connector module.
  • the printed circuit board may be equipped with a processor and memory for driving the board connector and the first and second camera modules.
  • the connector module may electrically connect the printed circuit board and the first and second camera modules.
  • the connector module may include a first connector structure and a second connector structure.
  • the first connector structure may include a first flexible circuit board electrically connected to the first camera module, and a first connector electrically connected to the printed circuit board.
  • the second connector structure may include a second flexible circuit board electrically connected to the second camera module, and a second connector electrically connected to the printed circuit board.
  • the connector module may include a fixing cover that secures the first connector and the second connector.
  • the first connector and the second connector may be stacked and disposed on the board connector.
  • a connector module electrically connects a first camera module and a second camera module disposed in an electronic device and a printed circuit board on which a processor for driving the first and second camera modules is disposed. You can.
  • the connector module may include a first connector structure and a second connector structure.
  • the first connector structure may include a first flexible circuit board electrically connected to the first camera module, and a first connector electrically connected to the printed circuit board.
  • the second connector structure may include a second flexible circuit board electrically connected to the second camera module, and a second connector electrically connected to the printed circuit board.
  • the connector module may include a fixing cover that secures the first connector and the second connector. The first connector and the second connector may be stacked and disposed on the board connector.
  • a connector module and an electronic device including the same can reduce the area required to arrange a plurality of connectors on a printed circuit board.
  • a connector module and an electronic device including the same implement at least some of the plurality of connectors disposed on a printed circuit board in a vertically stacked (e.g., Z-axis direction stacked) structure, thereby forming a printed circuit board.
  • the area required for placement of connectors on the panel can be reduced.
  • the size of the circuit board can be reduced.
  • FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments of the present disclosure.
  • FIG. 2A is a perspective view of the front of an electronic device according to various embodiments of the present disclosure.
  • FIG. 2B is a perspective view of the rear of an electronic device according to various embodiments of the present disclosure.
  • FIG. 3A is a diagram illustrating an unfolded (e.g., open) state of an electronic device according to various embodiments of the present disclosure.
  • FIG. 3B is a diagram illustrating a folded (e.g., closed) state of an electronic device according to various embodiments of the present disclosure.
  • Figure 4 is a diagram showing a printed circuit board and a plurality of camera modules being electrically connected through a plurality of connector structures.
  • Figure 5 is a diagram showing that the connectors of the printed circuit board, the first connector of the first camera module, and the second connector of the second camera module are electrically connected.
  • Figure 6 is a diagram showing an example of a pin map of a 24-pin connector and a pin map of a 30-pin connector.
  • Figure 7 is a diagram showing an example of a pin map of a 34-pin connector and a pin map of a 40-pin connector.
  • FIG. 8 is a diagram showing a printed circuit board and a plurality of camera modules being electrically connected through a connector structure according to an embodiment of the present disclosure.
  • FIG. 9 is a view showing the fixing cover removed from the connector module of FIG. 8.
  • Figure 10 is a diagram showing that the first connector structure of the connector module is connected to the first camera module, and the second connector structure is connected to the second camera module.
  • Figure 11 is a diagram showing the first connector and the second connector of the connector module.
  • Figure 12a is a diagram showing the fixed cover in an open state.
  • FIG. 12B is a diagram showing that when the fixing cover is closed, the first connector and the second connector are fixed, and the printed circuit board and the first connector and the second connector are electrically connected.
  • 13 and 14 show that when the fixed cover is closed, the pins of the fixed cover penetrate the holes of the first connector, and the first and second connectors are pressed vertically downward (e.g., -z-axis direction) to press the first connector. and a diagram showing fixing the second connector.
  • Figure 15 is a diagram showing that when a 34-pin connector and a 40-pin connector are stacked, the pin map of the 40-pin connector is changed to the pin map of the 34-pin connector to share power pins and signal pins.
  • FIG. 16 is a diagram illustrating electrical connection of a first camera module and a second camera module that capture images in different directions to a printed circuit board through a connector module.
  • Figure 17 is a diagram showing a first camera module and a second camera module shooting in the same direction being electrically connected to a printed circuit board through a connector module.
  • FIG. 18 is a diagram illustrating switching the driving of a first camera module and a second camera module as a method of operating an electronic device including a connector module according to an embodiment of the present disclosure.
  • Figure 19 is a diagram showing an example of slave addresses of a first camera module and a second camera module.
  • FIG. 20 is a diagram illustrating a method of operating an electronic device including a connector module according to an embodiment of the present disclosure, illustrating an operation method when a first camera module and a second camera module are used simultaneously.
  • FIG. 1 is a block diagram of an electronic device 101 in a network environment 100, according to various embodiments.
  • the electronic device 101 communicates with the electronic device 102 through a first network 198 (e.g., a short-range wireless communication network) or a second network 199. It is possible to communicate with the electronic device 104 or the server 108 through (e.g., a long-distance wireless communication network). According to one embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108.
  • a first network 198 e.g., a short-range wireless communication network
  • a second network 199 e.g., a long-distance wireless communication network.
  • the electronic device 101 may communicate with the electronic device 104 through the server 108.
  • the electronic device 101 includes a processor 120, a memory 130, an input module 150, an audio output module 155, a display module 160, an audio module 170, and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or may include an antenna module 197.
  • at least one of these components eg, the connection terminal 178) may be omitted or one or more other components may be added to the electronic device 101.
  • some of these components e.g., sensor module 176, camera module 180, or antenna module 197) are integrated into one component (e.g., display module 160). It can be.
  • the processor 120 for example, executes software (e.g., program 140) to operate at least one other component (e.g., hardware or software component) of the electronic device 101 connected to the processor 120. It can be controlled and various data processing or calculations can be performed. According to one embodiment, as at least part of data processing or computation, processor 120 stores commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132. The commands or data stored in the volatile memory 132 can be processed, and the resulting data can be stored in the non-volatile memory 134.
  • software e.g., program 140
  • processor 120 stores commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132.
  • the commands or data stored in the volatile memory 132 can be processed, and the resulting data can be stored in the non-volatile memory 134.
  • the processor 120 includes the main processor 121 (e.g., a central processing unit or an application processor) or an auxiliary processor 123 that can operate independently or together (e.g., a graphics processing unit, a neural network processing unit ( It may include a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor).
  • the main processor 121 e.g., a central processing unit or an application processor
  • an auxiliary processor 123 e.g., a graphics processing unit, a neural network processing unit ( It may include a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor.
  • the auxiliary processor 123 may be set to use lower power than the main processor 121 or be specialized for a designated function. You can.
  • the auxiliary processor 123 may be implemented separately from the main processor 121 or as part of it.
  • the auxiliary processor 123 may, for example, act on behalf of the main processor 121 while the main processor 121 is in an inactive (e.g., sleep) state, or while the main processor 121 is in an active (e.g., application execution) state. ), together with the main processor 121, at least one of the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) At least some of the functions or states related to can be controlled.
  • coprocessor 123 e.g., image signal processor or communication processor
  • may be implemented as part of another functionally related component e.g., camera module 180 or communication module 190. there is.
  • the auxiliary processor 123 may include a hardware structure specialized for processing artificial intelligence models.
  • Artificial intelligence models can be created through machine learning. For example, such learning may be performed in the electronic device 101 itself, where artificial intelligence is performed, or may be performed through a separate server (e.g., server 108).
  • Learning algorithms may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but It is not limited.
  • An artificial intelligence model may include multiple artificial neural network layers.
  • Artificial neural networks include deep neural network (DNN), convolutional neural network (CNN), recurrent neural network (RNN), restricted boltzmann machine (RBM), belief deep network (DBN), bidirectional recurrent deep neural network (BRDNN), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the examples described above.
  • artificial intelligence models may additionally or alternatively include software structures.
  • the memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176) of the electronic device 101. Data may include, for example, input data or output data for software (e.g., program 140) and instructions related thereto.
  • Memory 130 may include volatile memory 132 or non-volatile memory 134.
  • the program 140 may be stored as software in the memory 130 and may include, for example, an operating system 142, middleware 144, or application 146.
  • the input module 150 may receive commands or data to be used in a component of the electronic device 101 (e.g., the processor 120) from outside the electronic device 101 (e.g., a user).
  • the input module 150 may include, for example, a microphone, mouse, keyboard, keys (eg, buttons), or digital pen (eg, stylus pen).
  • the sound output module 155 may output sound signals to the outside of the electronic device 101.
  • the sound output module 155 may include, for example, a speaker or a receiver. Speakers can be used for general purposes such as multimedia playback or recording playback.
  • the receiver can be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.
  • the display module 160 can visually provide information to the outside of the electronic device 101 (eg, a user).
  • the display module 160 may include, for example, a display, a hologram device, or a projector, and a control circuit for controlling the device.
  • the display module 160 may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of force generated by the touch.
  • the audio module 170 can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module 170 acquires sound through the input module 150, the sound output module 155, or an external electronic device (e.g., directly or wirelessly connected to the electronic device 101). Sound may be output through the electronic device 102 (e.g., speaker or headphone).
  • the electronic device 102 e.g., speaker or headphone
  • the sensor module 176 detects the operating state (e.g., power or temperature) of the electronic device 101 or the external environmental state (e.g., user state) and generates an electrical signal or data value corresponding to the detected state. can do.
  • the sensor module 176 includes, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, humidity sensor, or light sensor.
  • the interface 177 may support one or more designated protocols that can be used to connect the electronic device 101 directly or wirelessly with an external electronic device (eg, the electronic device 102).
  • the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • SD card interface Secure Digital Card interface
  • audio interface audio interface
  • connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102).
  • the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).
  • the haptic module 179 can convert electrical signals into mechanical stimulation (e.g., vibration or movement) or electrical stimulation that the user can perceive through tactile or kinesthetic senses.
  • the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.
  • the camera module 180 can capture still images and moving images.
  • the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.
  • the power management module 188 can manage power supplied to the electronic device 101.
  • the power management module 188 may be implemented as at least a part of, for example, a power management integrated circuit (PMIC).
  • PMIC power management integrated circuit
  • Battery 189 may supply power to at least one component of electronic device 101.
  • the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.
  • Communication module 190 is configured to provide a direct (e.g., wired) communication channel or wireless communication channel between electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108). It can support establishment and communication through established communication channels. Communication module 190 operates independently of processor 120 (e.g., an application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication.
  • processor 120 e.g., an application processor
  • the communication module 190 is a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., : LAN (local area network) communication module, or power line communication module) may be included.
  • a wireless communication module 192 e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module
  • GNSS global navigation satellite system
  • wired communication module 194 e.g., : LAN (local area network) communication module, or power line communication module
  • the corresponding communication module is a first network 198 (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (e.g., legacy It may communicate with an external electronic device 104 through a telecommunication network such as a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN).
  • a telecommunication network such as a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN).
  • a telecommunication network such as a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN).
  • a telecommunication network such as a cellular network, a 5G network, a next-generation communication network
  • the wireless communication module 192 uses subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199.
  • subscriber information e.g., International Mobile Subscriber Identifier (IMSI)
  • IMSI International Mobile Subscriber Identifier
  • the wireless communication module 192 may support 5G networks after 4G networks and next-generation communication technologies, for example, NR access technology (new radio access technology).
  • NR access technology provides high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low latency). -latency communications)) can be supported.
  • the wireless communication module 192 may support high frequency bands (eg, mmWave bands), for example, to achieve high data rates.
  • the wireless communication module 192 uses various technologies to secure performance in high frequency bands, for example, beamforming, massive array multiple-input and multiple-output (MIMO), and full-dimensional multiplexing. It can support technologies such as input/output (FD-MIMO: full dimensional MIMO), array antenna, analog beam-forming, or large scale antenna.
  • the wireless communication module 192 may support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., second network 199).
  • the wireless communication module 192 supports peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mmTC, or U-plane latency (e.g., 164 dB or less) for realizing URLLC.
  • peak data rate e.g., 20 Gbps or more
  • loss coverage e.g., 164 dB or less
  • U-plane latency e.g., 164 dB or less
  • the antenna module 197 may transmit or receive signals or power to or from the outside (eg, an external electronic device).
  • the antenna module 197 may include an antenna including a radiator made of a conductor or a conductive pattern formed on a substrate (eg, PCB).
  • the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is connected to the plurality of antennas by, for example, the communication module 190. can be selected. Signals or power may be transmitted or received between the communication module 190 and an external electronic device through the at least one selected antenna.
  • other components eg, radio frequency integrated circuit (RFIC) may be additionally formed as part of the antenna module 197.
  • RFIC radio frequency integrated circuit
  • the antenna module 197 may form a mmWave antenna module.
  • the mmWave antenna module includes a printed circuit board, an RFIC disposed on or adjacent to a first side (e.g., bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., mmWave band), And a plurality of antennas (e.g., array antennas) disposed on or adjacent to the second surface (e.g., top or side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band. can do.
  • peripheral devices e.g., bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)
  • signal e.g. commands or data
  • commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199.
  • Each of the external electronic devices 102 or 104 may be of the same or different type as the electronic device 101.
  • all or part of the operations performed in the electronic device 101 may be executed in one or more of the external electronic devices 102, 104, or 108.
  • the electronic device 101 may perform the function or service instead of executing the function or service on its own.
  • one or more external electronic devices may be requested to perform at least part of the function or service.
  • One or more external electronic devices that have received the request may execute at least part of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device 101.
  • the electronic device 101 may process the result as is or additionally and provide it as at least part of a response to the request.
  • cloud computing distributed computing, mobile edge computing (MEC), or client-server computing technology can be used.
  • the electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing.
  • the external electronic device 104 may include an Internet of Things (IoT) device.
  • Server 108 may be an intelligent server using machine learning and/or neural networks.
  • the external electronic device 104 or server 108 may be included in the second network 199.
  • the electronic device 101 may be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.
  • Electronic devices may be of various types.
  • Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances.
  • Electronic devices according to embodiments of this document are not limited to the above-described devices.
  • first, second, or first or second may be used simply to distinguish one component from another, and to refer to that component in other respects (e.g., importance or order) is not limited.
  • One (e.g., first) component is said to be “coupled” or “connected” to another (e.g., second) component, with or without the terms “functionally” or “communicatively.”
  • any of the components can be connected to the other components directly (e.g. wired), wirelessly, or through a third component.
  • module used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeable with terms such as logic, logic block, component, or circuit, for example. can be used
  • a module may be an integrated part or a minimum unit of the parts or a part thereof that performs one or more functions.
  • the module may be implemented in the form of an application-specific integrated circuit (ASIC).
  • ASIC application-specific integrated circuit
  • Various embodiments of the present document are one or more instructions stored in a storage medium (e.g., built-in memory 136 or external memory 138) that can be read by a machine (e.g., electronic device 101). It may be implemented as software (e.g., program 140) including these.
  • a processor e.g., processor 120
  • the one or more instructions may include code generated by a compiler or code that can be executed by an interpreter.
  • a storage medium that can be read by a device may be provided in the form of a non-transitory storage medium.
  • 'non-transitory' only means that the storage medium is a tangible device and does not contain signals (e.g. electromagnetic waves), and this term refers to cases where data is semi-permanently stored in the storage medium. There is no distinction between temporary storage cases.
  • Computer program products are commodities and can be traded between sellers and buyers.
  • the computer program product may be distributed in the form of a machine-readable storage medium (e.g. compact disc read only memory (CD-ROM)) or via an application store (e.g. Play Store TM ) or on two user devices (e.g. It can be distributed (e.g. downloaded or uploaded) directly between smart phones) or online.
  • a machine-readable storage medium e.g. compact disc read only memory (CD-ROM)
  • an application store e.g. Play Store TM
  • two user devices e.g. It can be distributed (e.g. downloaded or uploaded) directly between smart phones) or online.
  • at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.
  • each component (e.g., module or program) of the above-described components may include a single or plural entity, and some of the plurality of entities may be separately placed in other components.
  • one or more of the components or operations described above may be omitted, or one or more other components or operations may be added.
  • multiple components eg, modules or programs
  • the integrated component may perform one or more functions of each component of the plurality of components identically or similarly to those performed by the corresponding component of the plurality of components prior to the integration. .
  • operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or , or one or more other operations may be added.
  • the display module 160 shown in FIG. 1 may include a flexible display configured to fold or unfold a screen (eg, a display screen).
  • the display module 160 shown in FIG. 1 may include a flexible display that is slidably disposed to provide a screen (eg, a display screen).
  • the display module 160 shown in FIG. 1 is described as including a foldable display or a flexible display, but is not limited thereto.
  • the display module 160 may include a bar type or plate type display.
  • FIG. 2A is a perspective view of the front of an electronic device according to various embodiments of the present disclosure.
  • FIG. 2B is a perspective view of the rear of an electronic device according to various embodiments of the present disclosure.
  • the electronic device 200 (e.g., the electronic device 101 of FIG. 1) according to various embodiments of the present disclosure includes a first side (or front side) 210A and a second side. (or rear) 210B, and may include a housing 210.
  • a display 201 (eg, display module 160 of FIG. 1) may be disposed in the space formed by the housing 210.
  • the housing 210 may include a side surface 210C surrounding the space between the first surface 210A and the second surface 210B.
  • the housing 210 may refer to a structure that forms part of the first side 210A, the second side 210B, and the side surface 210C.
  • the first surface 210A may be formed at least in part by a substantially transparent front plate 202 (eg, a glass plate including various coating layers, or a polymer plate).
  • a substantially transparent front plate 202 eg, a glass plate including various coating layers, or a polymer plate.
  • the second surface 210B may be formed by a substantially opaque back plate 211.
  • the back plate 211 is formed, for example, by coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of these materials. It can be. However, it is not limited to this, and the rear plate 211 may be formed of transparent glass.
  • the side 210C is joined to the front plate 202 and the back plate 211 by a side bezel structure 218 (or “side member”) comprising metal and/or polymer. can be formed.
  • a side bezel structure 218 (or “side member”) comprising metal and/or polymer.
  • back plate 211 and side bezel structure 218 may be formed as a single piece and include the same material (eg, a metallic material such as aluminum).
  • the front plate 202 may include two first regions 210D that are curved and seamlessly extended from the first surface 210A toward the rear plate 211. Two first areas 210D may be disposed at both ends of the long edge of the front plate 202.
  • the rear plate 211 may include two second regions 210E that are bent and seamlessly extended from the second surface 210B toward the front plate 202.
  • the front plate 202 may include only one of the first areas 210D (or the second areas 210E). In some embodiments, some of the first areas 210D or the second areas 210E may not be included.
  • the side bezel structure 218 when viewed from the side of the electronic device 200, has a first bezel structure 218 on the side that does not include the first regions 210D or the second regions 210E. It may have a thickness (or width), and may have a second thickness that is thinner than the first thickness on the side including the first areas 210D or the second areas 210E.
  • the electronic device 200 includes a display 201 (e.g., the display module 160 of FIG. 1), an audio input device 203 (e.g., the input module 150 of FIG. 1), and an audio Output devices 207, 214 (e.g., audio output module 155 in FIG. 1), sensor modules 204, 219 (e.g., sensor module 176 in FIG. 1), camera modules 205, 212 (e.g. : It may include at least one of the camera module 180 of FIG. 1), a flash 213, a key input device 217, an indicator (not shown), and connectors 208 and 209.
  • the electronic device 200 may omit at least one of the components (eg, the key input device 217) or may additionally include another component.
  • the display 201 may be visually visible through the upper portion of the front plate 202. In some embodiments, at least a portion of the display 201 may be visible through the front plate 202 that forms the first side 210A and the first area 210D of the side 210C.
  • the display 201 may be combined with or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the strength (pressure) of touch, and/or a digitizer that detects a magnetic field-type stylus pen.
  • at least a portion of the sensor modules 204, 219, and/or at least a portion of the key input device 217 are disposed in the first area 210D and/or the second area 210E. It can be.
  • At least one of a sensor module 204, camera modules 205 (e.g., an image sensor), an audio module 214, and a fingerprint sensor is installed on the back of the screen display area of the display 201. It can be included.
  • the display 201 may be combined with or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of touch, and/or a digitizer that detects a magnetic field-type stylus pen. there is.
  • At least a portion of the sensor modules 204, 219, and/or at least a portion of the key input device 217 are located in the first areas 210D and/or the second areas 210E. can be placed in the field.
  • the sound input device 203 may include a microphone.
  • the input device 203 may include a plurality of microphones arranged to detect the direction of sound.
  • the sound output devices 207 and 214 may include an external speaker 207 and a receiver for a call (eg, audio module 214).
  • the audio input device 203 e.g., microphone
  • audio output devices 207 and 214, and connectors 208 and 209 are disposed in the internal space of the electronic device 200 and formed in the housing 210. It may be exposed to the external environment through at least one hole.
  • the hole formed in the housing 210 may be commonly used for the sound input device 203 (eg, microphone) and the sound output devices 207 and 214.
  • the sound output devices 207 and 214 may include speakers (eg, piezo speakers) that operate without the hole formed in the housing 210.
  • the sensor modules 204 and 219 transmit electrical signals or data corresponding to the internal operating state of the electronic device 200 or the external environmental state.
  • a value can be created.
  • the sensor modules 204, 219 may include, for example, a first sensor module 204 (e.g., a proximity sensor) disposed on the first side 210A of the housing 210 and/or a second sensor of the housing 210. It may include a second sensor module 219 (eg, HRM sensor) and/or a third sensor module (not shown) (eg, fingerprint sensor) disposed on the second side 210B.
  • the fingerprint sensor may be disposed on the first side 210A (eg, display 201) and/or the second side 210B of the housing 210.
  • the electronic device 200 may include sensor modules not shown, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, It may further include at least one of a humidity sensor or an illuminance sensor.
  • the camera modules 205 and 212 include a first camera module 205 disposed on the first side 210A of the electronic device 200, and a second camera module 205 disposed on the second side 210B. It may include 2 camera modules 212.
  • a flash 213 may be disposed around the camera modules 205 and 212.
  • Camera modules 205 and 212 may include one or more lenses, an image sensor, and/or an image signal processor.
  • the flash 213 may include, for example, a light emitting diode or a xenon lamp.
  • the first camera module 205 may be placed below the display panel of the display 201 in an under display camera (UDC) manner.
  • UDC under display camera
  • two or more lenses (wide-angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device 200.
  • a plurality of first camera modules 205 may be disposed on the first side (eg, the side on which the screen is displayed) of the electronic device 200 in an under-display camera (UDC) manner.
  • the key input device 217 may be placed on the side 210C of the housing 210.
  • the electronic device 200 may not include some or all of the key input devices 217 mentioned above, and the key input devices 217 not included may be other than soft keys on the display 201. It can be implemented in the form In some embodiments, the key input device 217 may be implemented using a pressure sensor included in the display 201.
  • the connectors 208 and 209 include a first connector hole 208 that can accommodate a connector (for example, a USB connector) for transmitting and receiving power and/or data with an external electronic device, and /Or may include a second connector hole 209 (or earphone jack) that can accommodate a connector for transmitting and receiving audio signals to and from an external electronic device.
  • the first connector hole 208 may include a universal serial bus (USB) type A or USB type C port.
  • USB Type C the electronic device 200 (eg, the electronic device 101 of FIG. 1) can support USB power delivery (PD) charging.
  • some first camera modules 205 among the camera modules 205 and 212 and/or some sensor modules 204 among the sensor modules 204 and 219 are displayed visually through the display 201. It can be placed to be visible.
  • the first camera module 205 when the first camera module 205 is arranged in an under display camera (UDC) manner, the first camera module 205 may not be visually visible to the outside.
  • UDC under display camera
  • the first camera module 205 may be arranged to overlap the display area, and may display a screen in the display area corresponding to the second camera module 205.
  • Some sensor modules 204 may be arranged to perform their functions without being visually exposed through the front plate 202 in the internal space of the electronic device.
  • FIG. 3A is a diagram illustrating an unfolded (e.g., open) state of an electronic device according to various embodiments of the present disclosure.
  • FIG. 3B is a diagram illustrating a folded (e.g., closed) state of an electronic device according to various embodiments of the present disclosure.
  • an electronic device 300 (e.g., electronic device 101 of FIG. 1) includes a housing 310 and a display 320 disposed in a space formed by the housing 310. may include.
  • the display 320 may include a flexible display or a foldable display.
  • the surface on which the display 320 is placed may be defined as the first surface or the front of the electronic device 300 (eg, the surface on which the screen is displayed when unfolded).
  • the side opposite to the front may be defined as the second side or the back of the electronic device 300.
  • the surface surrounding the space between the front and back can be defined as the third surface or the side of the electronic device 300.
  • the electronic device 300 may have its folding area 323 folded or unfolded in a first direction (e.g., x-axis direction) with respect to the folding axis (e.g., A-axis).
  • the housing 310 includes a first housing structure 311, a second housing structure 312 including a sensor area 324, a first rear cover 380, and/or a second rear surface. It may include a cover 390.
  • the housing 310 of the electronic device 300 is not limited to the shape and combination shown in FIGS. 3A and 3B, and may be implemented by other shapes or combinations and/or combinations of parts.
  • the first housing structure 311 and the first rear cover 380 may be formed integrally
  • the second housing structure 312 and the second rear cover 390 may be formed integrally. .
  • the first housing structure 311 and the second housing structure 312 are disposed on both sides about the folding axis (A), and may have an overall symmetrical shape with respect to the folding axis (A). .
  • the first housing structure 311 and the second housing structure 312 are configured to determine whether the state of the electronic device 300 is an unfolded state (e.g., a first state), a folded state (e.g., a second state), or an intermediate state ( Example: The angles they form with each other may vary depending on whether they are in the third state or not.
  • the second housing structure 312 unlike the first housing structure 311, has the sensor area 324 where various sensors (e.g., an illuminance sensor, an iris sensor, and/or an image sensor) are disposed. ) is additionally included, but may have mutually symmetrical shapes in other areas. As another example, the sensor area 324 may be placed in the first housing structure 311 or may be omitted.
  • various sensors e.g., an illuminance sensor, an iris sensor, and/or an image sensor
  • the sensor area 324 may be placed in the first housing structure 311 or may be omitted.
  • At least one sensor may be disposed in the sensor area 324 as well as in the lower and/or bezel area of the display.
  • the first housing structure 311 and the second housing structure 312 may form a recess that accommodates the display 320.
  • the recess may have two or more different widths in a direction perpendicular to the folding axis A (eg, x-axis direction).
  • the recess is formed at the edge of the sensor area 324 of the first portion 311a of the first housing structure 311 and the second housing structure 312. It may have a first width W1 between one portion 312a.
  • the recess includes the second portion 311b of the first housing structure 311 substantially parallel to the folding axis A of the first housing structure 311 and the sensor area 324 of the second housing structure 312. It may have a second width W2 formed by the second portion 312b of the second housing structure 312 that is substantially parallel to the folding axis A but does not correspond to .
  • the second width W2 may be formed to be longer than the first width W1.
  • the first portion 312a and the second portion 312b of the second housing structure 312 may have different distances from the folding axis A.
  • the width of the recess is not limited to the example shown. In various embodiments, the recess may have a plurality of widths due to the shape of the sensor area 324 or the asymmetrically shaped portion of the first housing structure 311 and the second housing structure 312.
  • At least a portion of the first housing structure 311 and the second housing structure 312 may be formed of a metal material or a non-metal material having a selected level of rigidity to support the display 320.
  • the sensor area 324 may be formed to have a predetermined area adjacent to one corner of the second housing structure 312.
  • the arrangement, shape, and size of the sensor area 324 are not limited to the illustrated example.
  • the sensor area 324 may be provided at another corner of the second housing structure 312 or at any area between the top and bottom corners.
  • components for performing various functions built into the electronic device 300 are electronically transmitted through the sensor area 324 or through one or more openings provided in the sensor area 324. It may be exposed to the front of the device 300.
  • the components may include various types of sensors.
  • the sensor may include, for example, at least one of an illumination sensor, a front camera (eg, camera module), a receiver, or a proximity sensor.
  • the first rear cover 380 is disposed on one side of the folding axis A on the rear of the electronic device 300 and may have, for example, a substantially rectangular periphery. The edge may be surrounded by the first housing structure 311.
  • the second rear cover 390 may be disposed on the other side of the folding axis (A) on the back of the electronic device, and its edge may be wrapped by the second housing structure 312.
  • the first rear cover 380 and the second rear cover 390 may have a substantially symmetrical shape about the folding axis (A).
  • the first rear cover 380 and the second rear cover 390 do not necessarily have mutually symmetrical shapes
  • the electronic device 300 includes the first rear cover 380 and the second rear cover 390 of various shapes. It may include a second rear cover 390.
  • the first rear cover 380 may be formed integrally with the first housing structure 311, and the second rear cover 390 may be formed integrally with the second housing structure 312. there is.
  • the first rear cover 380, the second rear cover 390, the first housing structure 311, and the second housing structure 312 are various parts (e.g., : Can form a space where a printed circuit board, or battery) can be placed.
  • one or more components may be placed or visually exposed on the rear of the electronic device 300.
  • at least a portion of the sub-display 330 may be visually exposed through the first rear area 382 of the first rear cover 380.
  • one or more components or sensors may be visually exposed through the second rear area 392 of the second rear cover 390.
  • the sensor may include an illumination sensor, a proximity sensor, and/or a rear camera.
  • the hinge cover 313 may be disposed between the first housing structure 311 and the second housing structure 312 and configured to cover the internal components (e.g., hinge structure). .
  • the hinge cover 313 may cover a portion where the first housing structure 311 and the second housing structure 312 come into contact when the electronic device 300 is unfolded and folded.
  • the hinge cover 313 includes a first housing structure 311 and a second housing structure ( It may be covered or exposed to the outside by a part of 312. As an example, when the electronic device 300 is in an unfolded state, the hinge cover 313 is connected to the first housing structure 311 and the second housing structure. It may be hidden and not exposed by 312. As an example, when the electronic device 300 is in a folded state (e.g., fully folded state), the hinge cover 313 is connected to the first housing structure. It may be exposed to the outside between 311 and the second housing structure 312. As an example, the first housing structure 311 and the second housing structure 312 are folded at a predetermined angle.
  • the hinge cover 313 may be partially exposed to the outside between the first housing structure 311 and the second housing structure 312. However, in this case, the exposed area may be less than the fully folded state.
  • the hinge cover 313 may include a curved surface.
  • the display 320 may be placed in the space formed by the housing 310.
  • the display 320 is seated on a recess formed by the housing 310 and may form most of the front surface of the electronic device 300.
  • the front of the electronic device 300 may include the display 320 and a partial area of the first housing structure 311 adjacent to the display 320 and a partial area of the second housing structure 312. there is.
  • the rear of the electronic device 300 includes a first rear cover 380, a partial area of the first housing structure 311 adjacent to the first rear cover 380, a second rear cover 390, and a second rear cover. It may include a portion of the second housing structure 312 adjacent to 390 .
  • the display 320 may refer to a display in which at least some areas can be transformed into a flat or curved surface.
  • the display 320 includes a folding area 323, a first area 321 disposed on one side (e.g., the left side in FIG. 3A) and the other side (e.g., in FIG. 3A) with respect to the folding area 323. It may include a second area 322 disposed on the right side.
  • the display 320 may include a top emission or bottom emission OLED display.
  • OLED displays may include a low temperature color filter (LTCF) layer, window glass (e.g., ultra-thin glass (UTG) or polymer window), and/or optical compensation film (e.g., optical compensation film (OCF)). You can.
  • the LTCF layer of the OLED display can replace the polarizing film (or polarizing layer).
  • the division of areas of the display 320 is exemplary, and the display 320 may be divided into a plurality of areas (eg, two or more) depending on the structure or function.
  • the area of the display 320 may be divided by the folding area 323 or the folding axis (A) extending parallel to the y-axis, but in another embodiment, the display 320 may be divided into different folding areas ( The regions can also be divided based on a folding axis (e.g. a folding region parallel to the x-axis) or a different folding axis (e.g. a folding axis parallel to the x-axis).
  • first region 321 and the second region 322 may have an overall symmetrical shape with the folding region 323 as the center.
  • the first housing structure 311 and the second housing structure 312 form an angle of approximately 180 degrees and are substantially It can be arranged to face the same direction.
  • the surface of the first area 321 and the surface of the second area 322 of the display 320 form approximately 180 degrees with each other and may face substantially the same direction (eg, the front direction of the electronic device).
  • the folding area 323 may form substantially the same plane as the first area 321 and the second area 322 .
  • the first housing structure 311 and the second housing structure 312 may be arranged to face each other.
  • the surface of the first area 321 and the surface of the second area 322 of the display 320 form a narrow angle (eg, between about 0 degrees and about 10 degrees) and may face each other.
  • At least a portion of the folding area 323 may be formed as a curved surface with a predetermined curvature.
  • the first housing structure 311 and the second housing structure 312 may be arranged at a certain angle to each other. there is.
  • the surface of the first area 321 and the surface of the second area 322 of the display 320 may form an angle that is larger than that in the folded state and smaller than that in the unfolded state.
  • At least a portion of the folding area 323 may be formed of a curved surface with a predetermined curvature, and the curvature at this time may be smaller than that in the folded state.
  • Electronic devices may include electronic devices such as bar type, foldable type, rollable type, sliding type, wearable type, tablet PC, and/or laptop PC.
  • the electronic device 200 according to various embodiments of the present disclosure is not limited to the above-described examples and may include various other electronic devices.
  • Figure 4 is a diagram showing a printed circuit board and a plurality of camera modules being electrically connected through a plurality of connector structures.
  • Figure 5 is a diagram showing that the connectors of the printed circuit board, the first connector of the first camera module, and the second connector of the second camera module are electrically connected.
  • an electronic device 400 (e.g., the electronic device 101 of FIG. 1, the electronic device 200 of FIGS. 2A and 2B, and the electronic device 300 of FIGS. 3A and 3B).
  • a plurality of camera modules e.g., a first camera module 420, a second camera module 440
  • a driving circuit unit e.g., an image signal processor and a memory
  • a disposed printed circuit board 410 e.g., PCB or PBA
  • a plurality of connector structures 430, 450 e.g., for electrically connecting the printed circuit board 410 and a plurality of camera modules 420, 440
  • It may include a first connector structure 430 and a second connector structure 450.
  • the first camera module 420 is electrically connected to the printed circuit board 410 through the first connector structure 430
  • the second camera module 440 has a second connector structure 450. It can be electrically connected to the printed circuit board 410 through.
  • the first connector structure 430 is electrically connected to the first connector 432, which is electrically connected to the first PCB connector 412 of the printed circuit board 410, and the first camera module 420. It may include a connected first flexible printed circuit board 434 (e.g., flexible printed circuit boards (FPCB)).
  • FPCB flexible printed circuit boards
  • the first connector 432 and the first flexible printed circuit board 434 may be electrically connected.
  • the first connector 432 may include a plurality of first connector pins 4321.
  • the first PCB connector 412 may include a plurality of connector pins 4121.
  • the plurality of first connector pins 4321 of the first connector 432 may each be electrically connected to the plurality of connector pins 4121 of the first PCB connector 412.
  • the second connector structure 450 is electrically connected to the second connector 452, which is electrically connected to the second PCB connector 414 of the printed circuit board 410, and the second camera module 440. It may include a connected second flexible circuit board 454 (eg, FPCB).
  • the second connector 452 and the second flexible printed circuit board 454 may be electrically connected.
  • the second connector 452 may include a plurality of second connector pins 4521.
  • the second PCB connector 414 may include a plurality of connector pins 4141.
  • the plurality of second connector pins 4521 of the second connector 452 may each be electrically connected to the plurality of connector pins 4141 of the second PCB connector 414.
  • the first connector 432 and the second connector 452 may be placed at different positions and electrically connected to the printed circuit board 410.
  • Figure 6 is a diagram showing an example of a pin map of a 24-pin connector and a pin map of a 30-pin connector.
  • the first camera module (e.g., the first camera module 420 in FIG. 4) supports a 24-pin pin map 610
  • the first camera module 420 and A first connector (e.g., first connector 432 in FIG. 5) that electrically connects a printed circuit board (e.g., printed circuit board 410 in FIG. 4) has 24 connector pins (e.g., a plurality of connector pins in FIG. 5). It may include first connector pins 4321).
  • the 24 first connector pins included in the first connector 432 (e.g., the plurality of first connector pins 4321 in FIG. 5) supply power and signals based on the 24-pin pin map 610. It can be used for transmission and reception.
  • a second connector that electrically connects may include 30 connector pins (e.g., a plurality of second connector pins 4521 in FIG. 5).
  • the 30 second connector pins 4521 included in the second connector 452 are configured to control the power supply based on the 30-pin pin map 620. It can be used for supply and transmission and reception of signals.
  • AVDD may mean an analog power source for driving a camera sensor (e.g., an image sensor).
  • DVDD may refer to a digital power source for driving a camera sensor (e.g., image sensor).
  • IO may refer to interface power for driving a camera sensor (e.g., image sensor).
  • AGND may refer to the ground (GND) of the analog power supply (e.g., separate from DGND to prevent noise).
  • DGND may refer to the ground (GND) of digital power.
  • I2C may refer to an I2C communication signal for driving a camera sensor (e.g., image sensor).
  • MCLK is a master clock and may be a clock supplied from a processor (e.g., application processor) to a camera sensor (e.g., image sensor).
  • MIPI mobile industry processor interface
  • RESET may refer to a signal transmitted and received between a processor (e.g., application processor) and a camera sensor (e.g., image sensor) when resetting the camera.
  • EEP may refer to a CLK/DATA signal for driving the EEPROM (electrically erasable programmable read-only memory) of a camera sensor (e.g., image sensor).
  • AF may refer to power for driving an auto focus automatic focus adjustment device.
  • the first camera module 420 and the second camera module 440 support different pin maps (e.g., a 24-pin pin map 610 and a 30-pin pin map 620), and the first connector Since the number of connector pins (e.g., the plurality of first connector pins 4321 in FIG. 5 and the plurality of second connector pins 4521 in FIG. 5) of the 432 and the second connector 452 are different, the printed circuit The first connector 432 and the second connector 452 may be disposed at different positions on the plane of the substrate 410.
  • pin maps e.g., a 24-pin pin map 610 and a 30-pin pin map 620
  • the first connector Since the number of connector pins (e.g., the plurality of first connector pins 4321 in FIG. 5 and the plurality of second connector pins 4521 in FIG. 5) of the 432 and the second connector 452 are different, the printed circuit
  • the first connector 432 and the second connector 452 may be disposed at different positions on the plane of the substrate 410.
  • Figure 7 is a diagram showing an example of a pin map of a 34-pin connector and a pin map of a 40-pin connector.
  • the first camera module (e.g., the first camera module 420 in FIG. 4) supports a 34-pin pin map 630
  • the first camera module 420 and A first connector (e.g., first connector 432 in FIG. 5) that electrically connects a printed circuit board (e.g., printed circuit board 410 in FIG. 4) has 34 connector pins (e.g., a plurality of connector pins in FIG. 5). It may include first connector pins 4321).
  • the 34 first connector pins included in the first connector 432 (e.g., the plurality of first connector pins 4321 in FIG. 5) supply and transmit power based on the 34-pin pin map 630. It can be used for transmitting and receiving signals.
  • a second connector that electrically connects may include 40 connector pins (e.g., a plurality of second connector pins 4521 in FIG. 5).
  • the 40 second connector pins included in the second connector 452 e.g., the plurality of second connector pins 4521 in FIG. 5 supply power and signal based on the 40-pin pin map 640. It can be used for transmission and reception.
  • AVDD may mean an analog power source for driving a camera sensor (e.g., an image sensor).
  • DVDD may refer to a digital power source for driving a camera sensor (e.g., image sensor).
  • IO may refer to interface power for driving a camera sensor (e.g., image sensor).
  • AGND may refer to the ground (GND) of the analog power supply (e.g., separate from DGND to prevent noise).
  • DGND may refer to the ground (GND) of digital power.
  • OIS may refer to a power source for driving an optical image stabilization (e.g., anti-shake) function.
  • OIS I2C may refer to an I2C communication signal for driving the optical image stabilization (e.g., anti-shake) function.
  • I2C may refer to an I2C communication signal for driving a camera sensor (e.g., image sensor).
  • FSYNC may refer to a synchronization signal used for synchronization of each sensor during dual camera operation (e.g., in the case of a single camera, FSYNC is unused).
  • MCLK is a master clock and may be a clock supplied from a processor (e.g., application processor) to a camera sensor (e.g., image sensor).
  • MIPI may refer to a MIPI signal for communication of image data input through a camera sensor (e.g., image sensor).
  • RESET may refer to a signal transmitted and received between a processor (e.g., application processor) and a camera sensor (e.g., image sensor) when resetting the camera.
  • EEP may refer to a CLK/DATA signal for driving the EEPROM of a camera sensor (e.g., image sensor).
  • AF may refer to power for driving an auto focus automatic focus adjustment device.
  • the first camera module 420 and the second camera module 440 support different pin maps (e.g., a 24-pin pin map 610 and a 40-pin pin map 620), and the first connector Since the number of connector pins (e.g., the plurality of first connector pins 4321 in FIG. 5 and the plurality of second connector pins 4521 in FIG. 5) of the 432 and the second connector 452 are different, the printed circuit The first connector 432 and the second connector 452 may be disposed at different positions on the plane of the substrate 410.
  • pin maps e.g., a 24-pin pin map 610 and a 40-pin pin map 620
  • the first connector Since the number of connector pins (e.g., the plurality of first connector pins 4321 in FIG. 5 and the plurality of second connector pins 4521 in FIG. 5) of the 432 and the second connector 452 are different, the printed circuit
  • the first connector 432 and the second connector 452 may be disposed at different positions on the plane of the substrate 410.
  • the area required for arrangement of the connectors 432 and 452 may be increased.
  • the number of front cameras and rear cameras included in electronic devices e.g., electronic device 101 in FIG. 1, electronic device 200 in FIGS. 2A and 2B, and electronic device 300 in FIGS. 3A and 3B
  • the area of the printed circuit board 410 may increase for arrangement of the connectors 432 and 452.
  • FIG. 8 is a diagram showing a printed circuit board and a plurality of camera modules being electrically connected through a connector structure according to an embodiment of the present disclosure.
  • FIG. 9 is a view showing the fixing cover removed from the connector module of FIG. 8.
  • an electronic device e.g., the electronic device 101 of FIG. 1, the electronic device 200 of FIGS. 2A and 2B, the electronic device of FIGS. 3A and 3B) Device 300
  • a plurality of camera modules e.g., first camera module 720, second camera module 730
  • camera module 180 in FIG. 1, camera module 205 in FIG. 2A, 212 e.g., camera module 180 in FIG. 1, camera module 205 in FIG. 2A, 212
  • a printed circuit board 710 e.g., PCB or PBA
  • a driving circuit unit eg, image signal processor 740, ISP
  • memory 750 that drive a plurality of camera modules 720 and 730 may be disposed on the printed circuit board 710.
  • the connector module 700 may electrically connect the printed circuit board 710 and a plurality of camera modules 720 and 730.
  • the connector module 700 may include a first connector structure 800, a second connector structure 900, and a fixing cover 1000.
  • the first connector structure 800 may be electrically connected to the first camera module 720 and the printed circuit board 710.
  • the first camera module 720 may be electrically connected to the printed circuit board 710 through the first connector structure 800.
  • the second connector structure 900 may be electrically connected to the second camera module 730 and the printed circuit board 710.
  • the second camera module 730 may be electrically connected to the printed circuit board 710 through the second connector structure 900.
  • the first connector structure 800 and the second connector structure 900 may be arranged in a vertical stacked structure in the vertical direction (eg, z-axis direction).
  • the first connector of the connector structure 800 e.g., the first connector 820 of FIG. 10
  • the PCB connector 712 e.g., a board connector
  • the second connector 920 of the second connector structure 900 may be disposed on the top of the first connector 820 of the first connector structure 800 (eg, in the z-axis direction).
  • the fixing cover 1000 connects the first connector 820 of the first connector structure 800 and the second connector 920 of the second connector structure 900 downward in the vertical direction (e.g., -
  • the first connector 820 and the second connector 920 can be fixed by pressing in the z-axis direction.
  • FIG. 10 is a diagram showing that the first connector structure 800 of the connector module 700 is connected to the first camera module 720, and the second connector structure 900 is connected to the second camera module 730.
  • FIG. 11 is a diagram showing the first connector 820 and the second connector 920 of the connector module 700.
  • the first connector structure 800 is a first connector 820 electrically connected to the PCB connector 712 of the printed circuit board 710. ), and a first flexible circuit board 810 (eg, FPCB) electrically connected to the first camera module 720.
  • the first connector 820 and the first flexible printed circuit board 810 may be electrically connected.
  • the first connector 820 may include a plurality of first connector pins 822.
  • the plurality of first connector pins 822 of the first connector 820 may each be electrically connected to a plurality of connector pins of the PCB connector 712 (e.g., a plurality of connector pins 7121 in FIGS. 12A and 12B). there is.
  • the plurality of first connector pins 822 may have a conductive layer formed of a conductive material.
  • a plurality of first connector pins 822 may be electrically connected to the printed circuit board 710.
  • some pins 823 e.g., connector pins indicated by dotted lines in FIGS. 9 and 10 among the plurality of first connector pins 822 may not have a conductive layer formed. there is. Since a conductive layer is not formed on some of the pins 823 of the first connector 820 on the back side (eg, the opposite side of the lens surface), some of the pins 823 may be insulated from the second connector 920. Some pins 823 may be located in portions that do not overlap the plurality of contact holes 921 of the second connector 920 in the Z-axis direction. Some pins 823 of the first connector 820 may be pins that are not shared with the second connector 920.
  • the second connector structure 900 is electrically connected to the second connector 920, which is electrically connected to the PCB connector 712 of the printed circuit board 710, and the second camera module 730. It may include a second flexible circuit board 910 (eg, FPCB). As an example, an image signal processor 740 (ISP) and a memory 750 may be disposed on the printed circuit board 710. As an example, the second connector structure 900 may include a second flexible printed circuit board 910 and a second connector 920. One side of the second connector 920 and the second flexible circuit board 910 may be electrically connected to the second camera module 730, and the other side may be electrically connected to the second connector 920. The second connector structure 900 may overlap the first connector structure 800 in the z-axis direction and be electrically connected to the first connector structure 800. The second connector structure 900 may be electrically connected to the printed circuit board 710 via the first connector structure 800.
  • ISP image signal processor 740
  • a memory 750 may be disposed on the printed circuit board 710.
  • the second connector 920 may include a plurality of contact holes 921.
  • the plurality of contact holes 921 may include a plurality of holes 924 and a plurality of contact layers 922 formed (eg, plated) on the inner surfaces of the plurality of holes 924.
  • the plurality of contact layers 922 may be formed by plating a conductive material on the inner surfaces of the plurality of holes 924.
  • the plurality of contact layers 922 may be formed not only on the inner surfaces of the plurality of holes 924 but also on at least a portion of the upper and/or lower surfaces of the second connector 920.
  • the plurality of contact holes 921 of the second connector 920 connect the plurality of connector pins (e.g., : Can be electrically connected to a plurality of connector pins 7121 of FIGS. 12A and 12B, respectively.
  • the plurality of connector pins e.g., : Can be electrically connected to a plurality of connector pins 7121 of FIGS. 12A and 12B, respectively.
  • Figure 12a is a diagram showing the fixed cover in an open state.
  • Figure 12b shows that when the fixing cover 1000 is closed, the first connector 820 and the second connector 920 are fixed, and the printed circuit board 710, the first connector 820, and the second connector 920 are fixed.
  • 13 and 14 show that when the fixing cover 1000 is closed, the pins 1010 of the fixing cover 1000 pass through the holes 921 of the second connector 920 and connect the first and second connectors in a vertical direction.
  • the fixed cover 1000 when assembling an electronic device (e.g., the electronic device 101 of FIG. 1, the electronic device 200 of FIGS. 2A and 2B, and the electronic device 300 of FIGS. 3A and 3B) , the fixed cover 1000 can be placed in a closed state.
  • an electronic device e.g., the electronic device 101 of FIG. 1, the electronic device 200 of FIGS. 2A and 2B, and the electronic device 300 of FIGS. 3A and 3B
  • the fixed cover 1000 may include a plurality of cover pins 1010.
  • the plurality of cover pins 1010 are formed of a conductive material to connect the plurality of first connector pins 822 of the first connector 820 and the plurality of contact holes 921 of the second connector 920. It can be connected electrically.
  • the plurality of cover pins 1010 penetrate the plurality of holes 924, and the plurality of cover pins 1010 penetrate the plurality of contact layers 922. It can be electrically connected by contact with.
  • the plurality of cover pins 1010 may pass through the plurality of contact holes 921 of the second connector 920 and be electrically connected to the plurality of first connector pins 822 of the first connector 820.
  • the fixed cover 1000 when the fixed cover 1000 is closed, the fixed cover 1000 connects the first connector 820 of the first connector structure 800 and the second connector 920 of the second connector structure 900. can be pressed downward in the vertical direction (e.g., -z-axis direction).
  • the first connector 820 and the second connector 920 may be fixed by closing the fixing cover 1000.
  • the fixed cover 1000 when the fixed cover 1000 is closed, the printed circuit board 710, the first connector structure 800, and the second connector structure 900 are electrically connected, so that the printed circuit board 710 and the first connector structure 900 are electrically connected.
  • the camera module 720 and the second camera module 730 may be electrically connected.
  • the number of first connector pins 822 of the first connector 820 and the number of contact holes 921 of the second connector 920 may be the same.
  • the number of first connector pins 822 of the first connector 820 and the number of contact holes 921 of the second connector 920 may be different.
  • the connector module 700 includes a first connector 820 electrically connected to the first camera module 720 and a second connector 920 electrically connected to the second camera module 730.
  • a vertically stacked (e.g., Z-axis direction stacked) structure on the printed circuit board 710, the area required for arrangement of the plurality of connectors 820 and 920 can be reduced.
  • the lens 722 of the first camera module 720 and the lens 732 of the second camera module 730 face the rear (e.g., -z-axis direction) of the electronic devices 101, 200, and 300.
  • the arrangement is shown as an example. It is not limited to this, and depending on the arrangement of the camera modules 720 and 730, the direction in which the lens 722 of the first camera module 720 and the lens 732 of the second camera module 730 face (e.g. The front orientation of the electronic device or the rear orientation of the electronic device) may change.
  • the lens 722 of the first camera module 720 and the lens 732 of the second camera module 730 may be used in the electronic device 101, 200, 300) may be arranged to face the front (e.g., z-axis direction).
  • the lens 722 of the first camera module 720 is positioned at the front (e.g., z-axis direction) of the electronic devices 101, 200, and 300. and the lens 732 of the second camera module 730 may be arranged to face the rear (eg, -z-axis direction) of the electronic devices 101, 200, and 300.
  • the lens 722 of the first camera module 720 is positioned on the rear side (e.g., -z-axis direction) of the electronic devices 101, 200, and 300. ), and the lens 732 of the second camera module 730 may be arranged to face the front (eg, z-axis direction) of the electronic devices 101, 200, and 300.
  • the electronic device (e.g., the electronic device 101 in FIG. 1, the electronic device 200 in FIGS. 2A and 2B, and the electronic device 300 in FIGS. 3A and 3B) includes two camera modules. is shown and described as including structures 720 and 820, and two connector structures 800 and 900. However, it is not limited thereto, and the electronic devices 101, 200, and 300 according to an embodiment of the present disclosure may include three camera modules and three connectors, and two or three connectors may be connected vertically. It may be placed on the printed circuit board 710 in a stacked (e.g., stacked in the Z-axis direction) structure.
  • a stacked e.g., stacked in the Z-axis direction
  • the electronic device 101, 200, and 300 may include four camera modules and four connectors, and may include two connectors, three connectors, or four connectors.
  • Connectors may be arranged on the printed circuit board 710 in a vertically stacked structure (e.g., stacked in the Z-axis direction).
  • the electronic devices 101, 200, and 300 may include five camera modules and five connectors, and may include two connectors, three connectors, or four connectors. , or five connectors may be arranged on the printed circuit board 710 in a vertically stacked structure (e.g., stacked in the Z-axis direction).
  • the connector module 700 and the electronic devices 101, 200, and 300 including the same include some connectors (e.g., 3) among a plurality of connectors disposed on the printed circuit board 710.
  • Some connectors e.g., 3
  • vertically stacked e.g. stacked in the Z-axis direction
  • the connector module 700 and the electronic devices 101, 200, and 300 including the same include all of a plurality of connectors (e.g., two connectors, By arranging three connectors, four connectors or five connectors) in a vertically stacked (e.g., Z-axis direction stacked) structure, the area required for arrangement of the connectors 820 and 920 on the printed circuit board 710 can be reduced.
  • a plurality of connectors e.g., two connectors, By arranging three connectors, four connectors or five connectors
  • a vertically stacked e.g., Z-axis direction stacked
  • Other electronic components are placed in the portion secured by the vertical stacking (e.g., Z-axis direction stacking) structure of the plurality of connectors 820 and 920, or vertical stacking (e.g., Z-axis direction stacking) of the plurality of connectors 820 and 920 is performed.
  • the size of the printed circuit board 710 can be reduced by the area secured by the axial stacking structure.
  • Figure 15 is a diagram showing that when a 34-pin connector and a 40-pin connector are stacked, the pin map of the 40-pin connector is changed to the pin map of the 34-pin connector to share power pins and signal pins.
  • a first camera module e.g., the first camera module 720 in FIGS. 8 and 14
  • a printed circuit board e.g., the printed circuit board 710 in FIGS. 8 and 14
  • a first connector e.g., the first connector 820 in FIGS. 10 and 14
  • a second connector e.g., the second connector 920 in FIGS. 10 and 14
  • electrically connects the second camera module e.g., the second camera module 730 in FIGS. 8 and 14
  • the printed circuit board 710. may include 34 contact holes (e.g., a plurality of contact holes 921 in FIG. 10).
  • the first connector 820 and the second connector 920 are arranged in a vertically stacked (e.g., Z-axis direction stacked) structure and electrically connected to the printed circuit board 710, so that the first camera module ( The pin map can be changed so that 720) and the second camera module 730 can operate.
  • the pin map can be changed so that 720
  • the second camera module 730 can operate.
  • the number of the plurality of first connector pins 822 of the first connector 820 and the number of the plurality of contact holes 921 of the second connector 920 are different from each other, the number of the plurality of first connector pins 822 of the first connector 820 is different.
  • At least one of the pin map and the pin map of the second connector 920 can be changed.
  • the power pins (AVDD, DVDD, AGND, DGND) and signal pins (I2C, FSYNC, MCLK, MIPI, RESET, EEP, IO, AF) included in the first pin map 1510 of 34-pin type.
  • the second pin map 1520 of the 40-pin type may include all of them.
  • the second pin map 1520 of the 40-pin type is connected to the first pin map of the 34-pin type so that common pins can be shared in the first pin map 1510 of the 34-pin type and the second pin map 1520 of the 40-pin type. It can be changed to fit the pin map (1510). Not limited to this, when stacking a 34-pin connector and a 40-pin connector, the pin map of the 34-pin connector can be changed to the pin map of the 40-pin connector to share power pins and signal pins.
  • power pins (AVDD, DVDD, AGND, DGND) and signal pins (I2C, FSYNC, MCLK, MIPI, RESET, EEP, IO, AF) may all be included in the 30-pin type fourth pin map (e.g., 30-pin type pin map 620 in FIG. 6).
  • the 30-pin type 4th pin map 620 is connected to the 24-pin type 3rd pin map 620 so that common pins can be shared in the 24-pin type 3rd pin map 610 and the 30-pin type 4th pin map 620. It can be changed to fit the pin map (610). Not limited to this, the 24-pin type pin map can be changed to a 30-pin type pin map to share power pins and signal pins.
  • the power pins (AVDD, DVDD, AGND, DGND) and signal pins (I2C, FSYNC, MCLK, MIPI, RESET, EEP, IO, AF) can all be included in the first pin map 1510 of the 34-pin type.
  • the first pin map 1510 of the 34-pin type is divided into the third pin map of the 24-pin type so that common pins can be shared in the third pin map 610 of the 24-pin type and the first pin map 1510 of the 34-pin type. It can be changed to fit the pin map (610).
  • the 24-pin type pin map can be changed to a 34-pin type pin map to share power pins and signal pins.
  • the power pins (AVDD, DVDD, AGND, DGND) and signal pins (I2C, FSYNC, MCLK, MIPI, RESET, EEP, IO, AF) can all be included in the second pin map 1520 of the 40-pin type.
  • the second pin map 1520 of the 40-pin type is divided into the third pin map of the 24-pin type so that common pins can be shared in the third pin map 610 of the 24-pin type and the second pin map 1520 of the 40-pin type. It can be changed to fit the pin map (610).
  • the 24-pin type pin map can be changed to a 40-pin type pin map to share power pins and signal pins.
  • the power pins (AVDD, DVDD, AGND, DGND) and signal pins (I2C, FSYNC, MCLK, MIPI, RESET, EEP, IO, AF) can all be included in the first pin map 1510 of the 34-pin type.
  • the first pin map 1510 of the 34-pin type is divided into the fourth pin map of the 30-pin type so that common pins can be shared in the fourth pin map 620 of the 30-pin type and the first pin map 1510 of the 34-pin type. It can be changed to fit the pin map (620).
  • the 30-pin type pin map can be changed to a 34-pin type pin map to share power pins and signal pins.
  • the power pins (AVDD, DVDD, AGND, DGND) and signal pins (I2C, FSYNC, MCLK, MIPI, RESET, EEP, IO, AF) can all be included in the second pin map 1520 of the 40-pin type.
  • the second pin map 1520 of the 40-pin type is divided into the fourth pin map of the 30-pin type so that common pins can be shared in the fourth pin map 620 of the 30-pin type and the second pin map 1520 of the 40-pin type. It can be changed to fit the pin map (620).
  • the 30-pin type pin map can be changed to a 40-pin type pin map to share power pins and signal pins.
  • the pin map may not be changed.
  • FIG. 16 is a diagram illustrating electrical connection of a first camera module and a second camera module that capture images in different directions to a printed circuit board through a connector module.
  • an electronic device 1600 includes a first camera module 1620 (e.g., the first camera module 720 in FIG. 8) and a second camera module 1630 (e.g., the second camera module 730 in FIG. 8).
  • a driving circuit unit e.g., image signal processor 740 in FIG. 8
  • a memory e.g., memory 750 in FIG. 8
  • It may include a printed circuit board 710 (eg, PCB or PBA) and a connector module 700 for electrically connecting the printed circuit board 710 and the plurality of camera modules 1620 and 1630.
  • the first camera module 1620 and the second camera module 1630 may be placed on substantially the same plane line (e.g., placed on the same x-axis line and different y-axis lines). .
  • the first camera module 1620 may be arranged to photograph a first direction (e.g., the rear direction of the electronic device (e.g., -z-axis direction)).
  • the second camera module ( 1630) may be arranged to capture images in a second direction (e.g., front direction of the electronic device, z-axis direction).
  • the connector module 700 may include a first connector (e.g., the first connector 820 in FIG. 12) and a second connector (e.g., the second connector 920 in FIG. 12).
  • the first connector 820 and the second connector 920 are arranged in a vertical stacked structure in the vertical direction (e.g., z-axis direction) and are electrically connected to the printed circuit board 710, and the first camera module 1620 and The second camera module 1630 may be electrically connected to the printed circuit board 710.
  • Figure 17 is a diagram showing a first camera module and a second camera module shooting in the same direction being electrically connected to a printed circuit board through a connector module.
  • an electronic device 1700 includes a first camera module 1720 (e.g., the first camera module 720 in FIG. 8) and a second camera module 1730 (e.g., the second camera module 730 in FIG. 8).
  • a driving circuit unit e.g., image signal processor 740 in FIG. 8
  • a memory e.g., memory 750 in FIG. 8
  • It may include a printed circuit board 710 (eg, PCB or PBA) and a connector module 700 for electrically connecting the printed circuit board 710 and the plurality of camera modules 1620 and 1630.
  • the first camera module 1720 and the second camera module 1730 may be placed on different plane lines (e.g., placed on different x-axis lines and different y-axis lines). .
  • the first camera module 1720 and the second camera module 1730 may be arranged to capture images in a first direction (eg, toward the back of the electronic device, -z-axis direction).
  • the first camera module 1720 and the second camera module 1730 may be arranged to capture images in a second direction (eg, the front direction of the electronic device, z-axis direction).
  • the connector module 700 may include a first connector (e.g., the first connector 820 in FIG. 12) and a second connector (e.g., the second connector 920 in FIG. 12).
  • the first connector 820 and the second connector 920 are arranged in a vertical stacked structure in the vertical direction (e.g., z-axis direction) and are electrically connected to the printed circuit board 710, and the first camera module 1720 and The second camera module 1730 may be electrically connected to the printed circuit board 1710.
  • FIG. 18 is a diagram illustrating switching the driving of a first camera module and a second camera module as a method of operating an electronic device including a connector module according to an embodiment of the present disclosure.
  • Figure 19 is a diagram showing an example of slave addresses of a first camera module and a second camera module.
  • a first camera module e.g., the first camera module 1620 in FIG. 16, the first camera module 1720 in FIG. 17
  • a second camera module e.g., the first camera module in FIG. 16
  • the camera module 1630, the second camera module 1730 of FIG. 17 is connected to a printed circuit board (e.g., the connector module 700 of FIGS. 16 and 17) by a connector module (e.g., the connector module 700 of FIGS. 16 and 17). It may be commonly connected to the printed circuit board 710).
  • a processor e.g., the electronic device 101 of FIG. 1, the electronic device 200 of FIGS. 2A and 2B, and the electronic device 300 of FIGS. 3A and 3B
  • the processor 120 in FIG. 1 controls the driving circuit unit (e.g., the image signal processor 740 in FIG. 8) to control the first camera module (e.g., the first camera module 1620 in FIG. 16, FIG. The first camera module 1720 in Figure 17) and the second camera module (e.g., the second camera module 1630 in Figure 16 and the second camera module 1730 in Figure 17) can be operated.
  • the driving circuit unit e.g., the image signal processor 740 in FIG. 8
  • the first camera module e.g., the first camera module 1620 in FIG. 16, FIG.
  • the second camera module e.g., the second camera module 1630 in Figure 16 and the second camera module 1730 in Figure 17
  • the image signal processor 740 may operate the first camera modules 1620 and 1720 and the second camera modules 1630 and 1730 based on the control of the processor 120.
  • the image signal processor 740 may stop the operation of the first camera modules 1620 and 1720 and then allow the second camera modules 1630 and 1730 to operate.
  • the image signal processor 740 turns off the power and I2C signal for a certain period of time and then turns it back on ( on) can be done.
  • the image signal processor 740 turns off the power of the operating first camera modules 1620 and 1720 to receive the stream 1830 from the first camera modules 1620 and 1720. You can block it. Thereafter, the image signal processor 740 may read the address information 1820 of the second camera modules 1630 and 1730 after a predetermined idle period 1812.
  • address information 1820 may include a slave address.
  • the slave address is used to provide the identity of the first camera modules 1620 and 1720 and the second camera modules 1630 and 1730, and may mean an address value for distinguishing the camera modules.
  • Camera modules may have different address values.
  • the image signal processor 740 may turn on the power of the second camera modules 1630 and 1730 and receive the stream 1840 from the second camera modules 1630 and 1730.
  • the image signal processor 740 may perform image processing on each of the streams 1830 from the first camera modules 1620 and 1720 and the streams 1840 from the second camera modules 1630 and 1730.
  • the image signal processor 740 processes first image data for which image processing has been completed (e.g., first image data captured by the first camera modules 1620 and 1720) and second image data (e.g., first image data captured by the first camera modules 1620 and 1720).
  • the second image data captured at 1730 may be transmitted to the processor 120.
  • the electronic device (101, 200, 300) displays the first image captured through the first camera module (1620, 1720) on the display when the first camera module (1620, 1720) operates. And, when the second camera modules 1630 and 1730 operate, the second image captured through the second camera modules 1630 and 1730 may be displayed.
  • FIG. 20 is a diagram illustrating a method of operating an electronic device including a connector module according to an embodiment of the present disclosure, illustrating an operation method when a first camera module and a second camera module are used simultaneously.
  • a first camera module e.g., the first camera module 1620 in FIG. 16, the first camera module 1720 in FIG. 17
  • a second camera module e.g., the second camera module in FIG. 16
  • a printed circuit board e.g., the printed circuit board of FIGS. 16 and 17
  • a connector module e.g., the connector module 700 of FIGS. 16 and 17. (710)
  • a processor (e.g., electronic device 101 of FIG. 1, electronic device 200 of FIGS. 2A and 2B, and electronic device 300 of FIGS. 3A and 3B) according to an embodiment of the present disclosure.
  • the processor 120 of FIG. 1) may control the image signal processor 2002 (e.g., the image signal processor 740 of FIG. 8) to operate a plurality of camera modules 2001.
  • the plurality of camera modules 2001 include a first camera module (e.g., the first camera module 1620 in FIG. 16 and the first camera module 1720 in FIG. 17) and a second camera module (e.g., in FIG. 16 It may include the second camera module 1630 of and the second camera module 1730 of FIG. 17).
  • the image signal processor 2002 operates a plurality of camera modules 2001 (e.g., first camera modules 1620 and 1720 and second camera modules 1630 and 1730) based on the control of the processor 120. ) can be operated simultaneously.
  • the image signal processor 2002 may turn on the power of both the first camera modules 1620 and 1720 and the second camera modules 1630 and 1730.
  • Image signal processor 2002 receives a first stream 2010 from a first camera module 1620, 1720 in a first period and a second stream 2010 from a second camera module 1630, 1730 in a second period. (2020) can be received.
  • Image signal processor 2002 then receives the third stream 2030 from the first camera module 1620, 1720 in a third period and the first stream 2030 from the second camera module 1630, 1730 in a fourth period. 4 streams (2040) can be received.
  • the image signal processor 2002 separates the streams 2010, 2030 from the first camera module 1620, 1720 and the streams 2020, 2040 from the second camera module 1630, 1730, and then Processing can be performed.
  • the image signal processor 2002 processes first image data for which image processing has been completed (e.g., first image data captured by the first camera modules 1620 and 1720) and second image data (e.g., first image data captured by the first camera modules 1620 and 1720).
  • the second image data captured at 1730) may be transmitted to the processor 120.
  • the electronic devices 101, 200, and 300 include streams 2010 and 2030 of the first camera modules 1620 and 1720 and the streams 2010 and 2030 of the second camera modules 1630 and 1730.
  • the image can be displayed by selecting one of the streams 2020 and 2040.
  • the electronic devices 101, 200, and 300 include streams 2010 and 2030 of the first camera modules 1620 and 1720 and the streams 2010 and 2030 of the second camera modules 1630 and 1730.
  • the first image captured by the first camera module 1620 and 1720 and the second image captured by the second camera module 1630 and 1730 may be displayed together on the display.
  • the display area of the display can be divided and the first image and the second image can be displayed separately.
  • An electronic device (e.g., the electronic device 101 of FIG. 1, the electronic device 200 of FIGS. 2A and 2B, and the electronic device 300 of FIGS. 3A and 3B) according to an embodiment of the present disclosure includes a first Camera module (e.g., the first camera module 720 in FIGS. 8 and 9, the first camera module 720 in FIG. 14, the first camera module 1620 in FIG. 16, and the first camera module 1720 in FIG. 17 )), a second camera module (e.g., the second camera module 730 in FIGS. 8 and 9, the second camera module 730 in FIG. 14, the second camera module 1630 in FIG. 16, the second camera module in FIG. 17 2 Camera module 1730), printed circuit board (e.g., printed circuit board 710 of FIGS.
  • a first Camera module e.g., the first camera module 720 in FIGS. 8 and 9, the first camera module 720 in FIG. 14, the first camera module 1620 in FIG. 16, and the first camera module 1720 in FIG. 17
  • a second camera module
  • printed circuit board 710 of FIG. 12, printed circuit board 710 of FIG. 14, FIG. 16 and It may include a printed circuit board 710 of FIG. 17), and a connector module (e.g., the connector module 700 of FIGS. 8 and 9, and the connector module 700 of FIGS. 16 and 17).
  • the printed circuit board 710 includes a board connector (e.g., the PCB connector 712 in FIGS. 8 and 9 and the PCB connector 712 in FIG. 14) and the first and second camera modules 720, 730, 1620, A processor (e.g., the image signal processor 740 of FIGS. 8 and 9) and a memory (e.g., the memory 750 of FIGS.
  • the connector module 700 may electrically connect the printed circuit board 710 and the first and second camera modules 720, 730, 1620, 1630, 1720, and 1730.
  • the connector module 700 includes a first connector structure (e.g., the first connector structure 800 in FIGS. 8 and 9) and a second connector structure (e.g., the second connector structure 900 in FIGS. 8 and 9). ) may include.
  • the first connector structure 800 includes a first flexible printed circuit board (e.g., the first flexible printed circuit board 810 of FIGS. 10 and 11) that is electrically connected to the first camera modules 720, 1620, and 1720.
  • the second connector structure 900 includes a second flexible circuit board (e.g., the second flexible circuit board 910 in FIGS. 10 and 11) electrically connected to the second camera modules 730, 1630, and 1730, and It may include a second connector (eg, the second connector 920 in FIGS. 10 and 11) that is electrically connected to the printed circuit board 710.
  • the connector module 700 includes a fixed cover that secures the first connector 820 and the second connector 920 (e.g., the fixed cover 1000 in FIG. 8 and the fixed cover 1000 in FIGS. 12 and 13). ) may include.
  • the first connector 820 and the second connector 920 may be stacked and disposed on the board connector 712.
  • a connector module and an electronic device including the same according to an embodiment of the present disclosure can reduce the area required to arrange a plurality of connectors on a printed circuit board.
  • a connector module and an electronic device including the same according to an embodiment of the present disclosure implement at least some of the plurality of connectors disposed on a printed circuit board in a vertically stacked (e.g., Z-axis direction stacked) structure, thereby forming a printed circuit board.
  • the area required for placement of connectors on the panel can be reduced.
  • the size of the circuit board can be reduced.
  • An electronic device can reduce the area required to arrange a plurality of connectors on a printed circuit board.
  • the first connector 820 may be placed in contact with the board connector 712.
  • the second connector 920 may be placed above the first connector 820.
  • An electronic device implements at least some of the plurality of connectors disposed on a printed circuit board in a vertically stacked (e.g., Z-axis direction stacked) structure, thereby enabling the arrangement of the connectors on the printed circuit board.
  • the area can be reduced. Place other electronic components in the area secured by the vertical stacking (e.g., Z-axis direction stacking) structure of multiple connectors, or print to cover the area secured by the vertical stacking (e.g., Z-axis direction stacking) structure of multiple connectors.
  • the size of the circuit board can be reduced.
  • the fixed cover 1000 includes a plurality of cover pins (e.g., a plurality of cover pins in FIG. 12) that pressurize and electrically connect the first connector 820 and the second connector 920. (1010)) may be included.
  • cover pins e.g., a plurality of cover pins in FIG. 12
  • the first connector 820 may include a plurality of connector pins (e.g., a plurality of connector pins 822 in FIGS. 10 and 11) that are electrically connected to the board connector 712. there is.
  • the second connector 920 has a plurality of contact holes (e.g., a plurality of contact holes in FIGS. 10 and 11) that are electrically connected to at least some of the plurality of connector pins 822 and at least some of the cover pins 1010. It may include contact holes 921).
  • the plurality of contact holes 921 may include a plurality of holes 922 and a contact layer 924 formed on the inner walls of the plurality of holes 922 with a conductive material.
  • the plurality of cover pins 1010 penetrate the plurality of contact holes 921 and connect the plurality of connector pins 822 and the plurality of contact holes 921 to the board connector 712. ) can be electrically connected to.
  • the plurality of cover pins 1010 may penetrate the plurality of contact holes 921 and pressurize the plurality of connector pins 822.
  • the number of the plurality of connector pins 822 and the number of the plurality of contact holes 921 may be the same.
  • the number of the plurality of connector pins 822 and the number of the plurality of contact holes 921 may be different.
  • the pin maps of power pins and signal pins of the first connector 820 and the second connector 920 are shared, so that the first and second camera modules 720, 730, 1620, 1630, 1720, 1730) and can transmit and receive signals.
  • the first connector 820 may include a first number of connector pins.
  • the second connector 920 may include a second number of contact holes less than the first number.
  • the first connector 820 may include a third number of contact holes.
  • the second connector 920 may include a fourth number of connector pins greater than the third number.
  • the first camera modules 720, 1620, and 1720 and the second camera modules 730, 1630, and 1730 may be arranged on the same plane line.
  • the first camera modules 720, 1620, and 1720 and the second camera modules 730, 1630, and 1730 may be arranged on different plane lines.
  • the first and second camera modules 720, 730, 1620, 1630, 1720, and 1730 may be arranged to photograph the front direction of the electronic device 101, 200, and 300.
  • the first and second camera modules 720, 730, 1620, 1630, 1720, and 1730 may be arranged to photograph the rear direction of the electronic devices 101, 200, and 300.
  • one of the first camera modules (720, 1620, 1720) and the second camera modules (730, 1630, 1730) is configured to photograph the front direction of the electronic device (101, 200, 300). and the other may be arranged to photograph the rear direction of the electronic devices 101, 200, and 300.
  • the processor 740 selectively turns on the power of one of the first and second camera modules 720, 730, 1620, 1630, 1720, and 1730 to 730, 1620, 1630, 1720, 1730) can be driven.
  • first camera module 720, 1620, or 1720 an image stream may be received from the first camera module 720, 1620, or 1720.
  • second camera module 730, 1630, or 1730 an image stream may be received from the second camera module 730, 1630, or 1730.
  • the processor 740 turns on the power of all the first and second camera modules 720, 730, 1620, 1630, 1720, and 1730 to (720, 730, 1620, 1630, 1720, 1730) can be driven simultaneously.
  • image streams from the first camera modules 720, 1620, and 1720 may be received.
  • image streams from the second camera modules 730, 1630, and 1730 may be received.
  • the connector module 700 includes a first camera module (720, 1620, 1720) and a second camera module (730, 1630, 1730) disposed in an electronic device (101, 200, 300). and a printed circuit board 710 on which a processor 740 for driving the first and second camera modules 720, 730, 1620, 1630, 1720, and 1730 is disposed can be electrically connected.
  • the connector module 700 may include a first connector structure 800 and a second connector structure 900.
  • the first connector structure 800 includes a first flexible circuit board 810 electrically connected to the first camera module 720, 1620, and 1720, and a first connector electrically connected to the printed circuit board 710. It may include (820).
  • the second connector structure 900 includes a second flexible printed circuit board 910 electrically connected to the second camera module 730, 1630, and 1730, and a second electrically connected printed circuit board 710. It may include a connector 920.
  • the connector module 700 may include a fixing cover 1000 that secures the first connector 820 and the second connector 920.
  • the first connector 820 and the second connector 920 may be stacked and disposed on the board connector 712.
  • the connector module according to an embodiment of the present disclosure can reduce the area required to arrange a plurality of connectors on a printed circuit board.
  • the connector module according to an embodiment of the present disclosure implements at least some of the plurality of connectors disposed on the printed circuit board in a vertically stacked (e.g., Z-axis direction stacked) structure, so that the connectors required for arrangement of the connectors on the printed circuit board are installed.
  • the area can be reduced.
  • the size of the circuit board can be reduced.

Landscapes

  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

Un dispositif électronique selon un mode de réalisation de la présente divulgation peut comprendre un premier module de caméra, un second module de caméra, une carte de circuit imprimé, et un module de connecteur. Un processeur destiné à faire fonctionner un connecteur de substrat et les premier et second modules de caméra, et une mémoire peuvent être agencés sur la carte de circuit imprimé. Le module de connecteur peut connecter électriquement la carte de circuit imprimé aux premier et second modules de caméra. Le module de connecteur peut comprendre une première structure de connecteur et une seconde structure de connecteur. La première structure de connecteur peut comprendre une première carte de circuit imprimé souple connectée électriquement au premier module de caméra, et un premier connecteur connecté électriquement à la carte de circuit imprimé. La seconde structure de connecteur peut comprendre une seconde carte de circuit imprimé souple connectée électriquement au second module de caméra, et un second connecteur connecté électriquement à la carte de circuit imprimé. Le module de connecteur peut comprendre un couvercle de fixation pour fixer le premier connecteur et le second connecteur. Le premier connecteur et le second connecteur peuvent être agencés pour être empilés sur le connecteur de substrat. Divers autres modes de réalisation sont possibles.
PCT/KR2023/007753 2022-07-04 2023-06-07 Dispositif électronique comprenant un module de connecteur, et son procédé de fonctionnement WO2024010231A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR10-2022-0082098 2022-07-04
KR20220082098 2022-07-04
KR1020220111181A KR20240004080A (ko) 2022-07-04 2022-09-02 커넥터 모듈을 포함하는 전자 장치 및 이의 동작 방법
KR10-2022-0111181 2022-09-02

Publications (1)

Publication Number Publication Date
WO2024010231A1 true WO2024010231A1 (fr) 2024-01-11

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Country Link
WO (1) WO2024010231A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20090007166A (ko) * 2007-07-13 2009-01-16 엘지전자 주식회사 카메라를 구비한 휴대 단말기
US20190174037A1 (en) * 2016-07-25 2019-06-06 Vivo Mobile Communication Co., Ltd. Mobile terminal and manufacturing method of the same
KR20190092680A (ko) * 2018-01-31 2019-08-08 삼성전자주식회사 적층 구조의 커넥터를 포함하는 전자 장치
US20200162649A1 (en) * 2017-01-11 2020-05-21 Guangdong Oppo Mobile Telecommunications Corp., Ltd. Camera module applied to terminal and terminal including same
KR20210012675A (ko) * 2019-07-26 2021-02-03 삼성전자주식회사 전자 부품 어셈블리를 포함하는 전자 장치

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20090007166A (ko) * 2007-07-13 2009-01-16 엘지전자 주식회사 카메라를 구비한 휴대 단말기
US20190174037A1 (en) * 2016-07-25 2019-06-06 Vivo Mobile Communication Co., Ltd. Mobile terminal and manufacturing method of the same
US20200162649A1 (en) * 2017-01-11 2020-05-21 Guangdong Oppo Mobile Telecommunications Corp., Ltd. Camera module applied to terminal and terminal including same
KR20190092680A (ko) * 2018-01-31 2019-08-08 삼성전자주식회사 적층 구조의 커넥터를 포함하는 전자 장치
KR20210012675A (ko) * 2019-07-26 2021-02-03 삼성전자주식회사 전자 부품 어셈블리를 포함하는 전자 장치

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