WO2022191440A1 - Dispositif électronique pliable détectant un état de pliage, et son procédé de fonctionnement - Google Patents

Dispositif électronique pliable détectant un état de pliage, et son procédé de fonctionnement Download PDF

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Publication number
WO2022191440A1
WO2022191440A1 PCT/KR2022/001830 KR2022001830W WO2022191440A1 WO 2022191440 A1 WO2022191440 A1 WO 2022191440A1 KR 2022001830 W KR2022001830 W KR 2022001830W WO 2022191440 A1 WO2022191440 A1 WO 2022191440A1
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WO
WIPO (PCT)
Prior art keywords
electronic device
touch sensor
conductive plate
distance
housing
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PCT/KR2022/001830
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English (en)
Korean (ko)
Inventor
최성윤
Original Assignee
삼성전자 주식회사
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Publication of WO2022191440A1 publication Critical patent/WO2022191440A1/fr

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/0206—Portable telephones comprising a plurality of mechanically joined movable body parts, e.g. hinged housings
    • H04M1/0208—Portable telephones comprising a plurality of mechanically joined movable body parts, e.g. hinged housings characterized by the relative motions of the body parts
    • H04M1/0214—Foldable telephones, i.e. with body parts pivoting to an open position around an axis parallel to the plane they define in closed position
    • H04M1/0216—Foldable in one direction, i.e. using a one degree of freedom hinge
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1615—Constructional details or arrangements for portable computers with several enclosures having relative motions, each enclosure supporting at least one I/O or computing function
    • G06F1/1616—Constructional details or arrangements for portable computers with several enclosures having relative motions, each enclosure supporting at least one I/O or computing function with folding flat displays, e.g. laptop computers or notebooks having a clamshell configuration, with body parts pivoting to an open position around an axis parallel to the plane they define in closed position
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1675—Miscellaneous details related to the relative movement between the different enclosures or enclosure parts
    • G06F1/1681—Details related solely to hinges
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
    • H04M1/0268—Details of the structure or mounting of specific components for a display module assembly including a flexible display panel
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M2201/00—Electronic components, circuits, software, systems or apparatus used in telephone systems
    • H04M2201/34—Microprocessors
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M2250/00—Details of telephonic subscriber devices
    • H04M2250/12—Details of telephonic subscriber devices including a sensor for measuring a physical value, e.g. temperature or motion
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M2250/00—Details of telephonic subscriber devices
    • H04M2250/22—Details of telephonic subscriber devices including a touch pad, a touch sensor or a touch detector

Definitions

  • Various embodiments of the present disclosure relate to a foldable electronic device detecting a folding state and an operating method thereof.
  • Electronic devices are gradually becoming slimmer, and are being improved in order to strengthen design aspects and differentiate functional elements thereof.
  • BACKGROUND ART Electronic devices are being transformed from a uniform shape of a rectangular shape to a variety of shapes.
  • the electronic device may have a deformable structure capable of adjusting the size of the display to satisfy portability and usability of the electronic device.
  • the electronic device having a deformable structure may include a foldable electronic device in which at least two housings are folded or unfolded with respect to each other.
  • the foldable electronic device may sense a folding state (eg, an unfolded state, a folded state, and/or an intermediate state) through a sensor (eg, a hall sensor).
  • the foldable electronic device may need to include a plurality of sensors (eg, a Hall sensor) and a magnetic material for operation of the plurality of sensors in order to sense a folding state. Accordingly, it may cause an increase in material cost, and a space for mounting a plurality of sensors and magnetic bodies may be insufficient.
  • a plurality of sensors eg, a Hall sensor
  • a magnetic material for operation of the plurality of sensors in order to sense a folding state. Accordingly, it may cause an increase in material cost, and a space for mounting a plurality of sensors and magnetic bodies may be insufficient.
  • the electronic device mounts at least two touch sensors on a wiring member on the rear surface of the display to use a change in capacitance between the at least two touch sensors and a conductive plate included in the display to be in a folded state (eg, : an unfolded state, a folded state, and/or an intermediate state) can be sensed.
  • a folded state eg, : an unfolded state, a folded state, and/or an intermediate state
  • An electronic device includes a hinge module, a first housing coupled to at least a first side of the hinge module, and at least a portion coupled to a second side of the hinge module, and the hinge module a second housing configured to be foldable and expandable with the first housing based on a folding axis using a first conductive plate facing the first housing and a second conductive plate facing the second housing, disposed under the first housing and the second housing, a bent region, the bent region a wiring member including a first touch sensor disposed at a first point of A processor, comprising: a change in first capacitance according to a change in a distance between the first conductive plate and the first touch sensor and/or a change in a distance between the second conductive plate and the second touch sensor It may be configured to check a change in the second electrostatic capacity according to the , and check the folding state of the electronic device based on the change in the first electrostatic capacity and/or the change in the second electrostatic capacity.
  • the electronic device includes a hinge module, a first housing coupled to a first side of the hinge module and at least a portion of the hinge module, and the hinge module a second housing coupled to a second side of at least a part of the second housing and configured to be foldable and expandable with the first housing based on a folding axis using the hinge module; , a flexible display configured to be foldable and unfoldable, a first conductive plate disposed on a lower surface of the flexible display and facing the first housing and a second conductive plate facing the second housing, and the first housing and the and a wiring member disposed under the second housing and including a bent area, a first touch sensor disposed at a first point of the bent area, and a second touch sensor disposed at a second point of the bent area, ,
  • the operating method includes a first capacitance change according to a change in the distance between the first conductive plate and the first touch sensor and/or a
  • a foldable electronic device may use a change in capacitance between at least two touch sensors and a corresponding conductive plate to be in a folded state (eg, an unfolded state, a folded state, and/or an intermediate state). ) can be sensed. Accordingly, it is not necessary to provide a plurality of sensors and a magnetic material for the operation of the plurality of sensors, thereby minimizing space use due to the mounting of the plurality of sensors and the magnetic material, as well as reducing material costs.
  • FIG. 1 is a block diagram of an electronic device in a network environment, according to various embodiments of the present disclosure
  • FIG. 2A is a perspective view of an electronic device illustrating a flat state or unfolding state according to various embodiments of the present disclosure
  • 2B is a plan view illustrating a front surface of an electronic device in an unfolded state according to various embodiments of the present disclosure
  • 2C is a plan view illustrating a rear surface of an electronic device in an unfolded state, according to various embodiments of the present disclosure
  • 3A is a perspective view of an electronic device illustrating a folding state according to various embodiments of the present disclosure
  • 3B is a perspective view of an electronic device illustrating an intermediate state, according to various embodiments of the present disclosure
  • FIG. 4 is an exploded perspective view of an electronic device according to various embodiments of the present disclosure.
  • FIG. 5 is an exploded perspective view of a flexible display according to various embodiments of the present disclosure.
  • 6A is a view from one side of a wiring member on which a first touch sensor and a second touch sensor are disposed, according to various embodiments of the present disclosure
  • 6B is a perspective view of a wiring member on which a first touch sensor and a second touch sensor are disposed, according to various embodiments of the present disclosure
  • FIG. 7A is a diagram illustrating a folded state of an electronic device including a first touch sensor and a second touch sensor, according to various embodiments of the present disclosure
  • FIG. 7B is a diagram illustrating an unfolded state of an electronic device including a first touch sensor and a second touch sensor, according to various embodiments of the present disclosure
  • FIG. 8 is a diagram for explaining a change in capacitance according to a transition of an electronic device to a folding state and a transition to a folding state of an electronic device, according to various embodiments of the present disclosure
  • FIG. 9 is a view of a folded state, an unfolded state, and a wiring member of an electronic device including a first touch sensor and a second touch sensor viewed from one side, according to various embodiments of the present disclosure
  • 10A is a view of a wiring member including a plurality of first touch sensors and a plurality of second touch sensors as viewed from one side, according to various embodiments of the present disclosure
  • FIG. 10B is a perspective view of a wiring member including a plurality of first touch sensors and a plurality of second touch sensors, according to various embodiments of the present disclosure
  • 11A is a diagram illustrating a folded state of an electronic device including a plurality of first touch sensors and a plurality of second touch sensors, according to various embodiments of the present disclosure
  • 11B is a diagram illustrating an unfolded state of an electronic device including a plurality of first touch sensors and a plurality of second touch sensors, according to various embodiments of the present disclosure
  • FIG. 12 is a view of a folded state, an unfolded state, and a wiring member of an electronic device including a plurality of first touch sensors and a plurality of second touch sensors as viewed from one side, according to various embodiments of the present disclosure
  • FIG. 13 is a diagram illustrating a stacked structure of a wiring member according to various embodiments of the present disclosure
  • FIG. 14 is a diagram for describing a mesh pattern according to various embodiments of the present disclosure.
  • 15 is a view for explaining a second wiring layer grounded in a mesh pattern according to various embodiments of the present disclosure
  • 16 is a flowchart illustrating a method of detecting a folding state of an electronic device, according to various embodiments of the present disclosure.
  • FIG. 1 is a block diagram of an electronic device 101 in a network environment 100, according to various embodiments.
  • the electronic device 101 communicates with the electronic device 102 through a first network 198 (eg, a short-range wireless communication network) or a second network 199 . It may communicate with at least one of the electronic device 104 and the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 .
  • the electronic device 101 includes a processor 120 , a memory 130 , an input module 150 , a sound output module 155 , a display module 160 , an audio module 170 , and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or an antenna module 197 .
  • at least one of these components eg, the connection terminal 178
  • some of these components are integrated into one component (eg, display module 160 ). can be
  • the processor 120 for example, executes software (eg, a program 140) to execute at least one other component (eg, a hardware or software component) of the electronic device 101 connected to the processor 120. It can control and perform various data processing or operations. According to one embodiment, as at least part of data processing or operation, the processor 120 converts commands or data received from other components (eg, the sensor module 176 or the communication module 190 ) to the volatile memory 132 . may be stored in , process commands or data stored in the volatile memory 132 , and store the result data in the non-volatile memory 134 .
  • software eg, a program 140
  • the processor 120 converts commands or data received from other components (eg, the sensor module 176 or the communication module 190 ) to the volatile memory 132 .
  • the volatile memory 132 may be stored in , process commands or data stored in the volatile memory 132 , and store the result data in the non-volatile memory 134 .
  • the processor 120 is a main processor 121 (eg, a central processing unit or an application processor) or a secondary processor 123 (eg, a graphic processing unit, a neural network processing unit) a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor).
  • a main processor 121 eg, a central processing unit or an application processor
  • a secondary processor 123 eg, a graphic processing unit, a neural network processing unit
  • NPU neural processing unit
  • an image signal processor e.g., a sensor hub processor, or a communication processor.
  • the secondary processor 123 may, for example, act on behalf of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or when the main processor 121 is active (eg, executing an application). ), together with the main processor 121, at least one of the components of the electronic device 101 (eg, the display module 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the related functions or states.
  • the coprocessor 123 eg, an image signal processor or a communication processor
  • may be implemented as part of another functionally related component eg, the camera module 180 or the communication module 190. have.
  • the auxiliary processor 123 may include a hardware structure specialized for processing an artificial intelligence model.
  • Artificial intelligence models can be created through machine learning. Such learning may be performed, for example, in the electronic device 101 itself on which the artificial intelligence model is performed, or may be performed through a separate server (eg, the server 108).
  • the learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but in the above example not limited
  • the artificial intelligence model may include a plurality of artificial neural network layers.
  • Artificial neural networks include deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the above example.
  • the artificial intelligence model may include, in addition to, or alternatively, a software structure in addition to the hardware structure.
  • the memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176 ) of the electronic device 101 .
  • the data may include, for example, input data or output data for software (eg, the program 140 ) and instructions related thereto.
  • the memory 130 may include a volatile memory 132 or a non-volatile memory 134 .
  • the program 140 may be stored as software in the memory 130 , and may include, for example, an operating system 142 , middleware 144 , or an application 146 .
  • the input module 150 may receive a command or data to be used by a component (eg, the processor 120 ) of the electronic device 101 from the outside (eg, a user) of the electronic device 101 .
  • the input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (eg, a button), or a digital pen (eg, a stylus pen).
  • the sound output module 155 may output a sound signal to the outside of the electronic device 101 .
  • the sound output module 155 may include, for example, a speaker or a receiver.
  • the speaker can be used for general purposes such as multimedia playback or recording playback.
  • the receiver can be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from or as part of the speaker.
  • the display module 160 may visually provide information to the outside (eg, a user) of the electronic device 101 .
  • the display module 160 may include, for example, a control circuit for controlling a display, a hologram device, or a projector and a corresponding device.
  • the display module 160 may include a touch sensor configured to sense a touch or a pressure sensor configured to measure the intensity of a force generated by the touch.
  • the audio module 170 may convert a sound into an electric signal or, conversely, convert an electric signal into a sound. According to an embodiment, the audio module 170 acquires a sound through the input module 150 or an external electronic device (eg, a sound output module 155 ) directly or wirelessly connected to the electronic device 101 .
  • the electronic device 102) eg, a speaker or headphones
  • the sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, a user state), and generates an electrical signal or data value corresponding to the sensed state. can do.
  • the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, a humidity sensor, or an illuminance sensor.
  • the interface 177 may support one or more specified protocols that may be used by the electronic device 101 to directly or wirelessly connect with an external electronic device (eg, the electronic device 102 ).
  • the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.
  • the connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102 ).
  • the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).
  • the haptic module 179 may convert an electrical signal into a mechanical stimulus (eg, vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic sense.
  • the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.
  • the camera module 180 may capture still images and moving images. According to an embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.
  • the power management module 188 may manage power supplied to the electronic device 101 .
  • the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).
  • PMIC power management integrated circuit
  • the battery 189 may supply power to at least one component of the electronic device 101 .
  • battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.
  • the communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). It can support establishment and communication performance through the established communication channel.
  • the communication module 190 may include one or more communication processors that operate independently of the processor 120 (eg, an application processor) and support direct (eg, wired) communication or wireless communication.
  • the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, : It may include a local area network (LAN) communication module, or a power line communication module).
  • a wireless communication module 192 eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module
  • GNSS global navigation satellite system
  • wired communication module 194 eg, : It may include a local area network (LAN) communication module, or a power line communication module.
  • a corresponding communication module among these communication modules is a first network 198 (eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (eg, legacy It may communicate with the external electronic device 104 through a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (eg, a telecommunication network such as a LAN or a WAN).
  • a first network 198 eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)
  • a second network 199 eg, legacy It may communicate with the external electronic device 104 through a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (eg, a telecommunication network such as a LAN or a WAN).
  • a telecommunication network
  • the wireless communication module 192 uses subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199 .
  • subscriber information eg, International Mobile Subscriber Identifier (IMSI)
  • IMSI International Mobile Subscriber Identifier
  • the electronic device 101 may be identified or authenticated.
  • the wireless communication module 192 may support a 5G network after a 4G network and a next-generation communication technology, for example, a new radio access technology (NR).
  • NR access technology includes high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency) -latency communications)).
  • eMBB enhanced mobile broadband
  • mMTC massive machine type communications
  • URLLC ultra-reliable and low-latency
  • the wireless communication module 192 may support a high frequency band (eg, mmWave band) to achieve a high data rate, for example.
  • a high frequency band eg, mmWave band
  • the wireless communication module 192 uses various techniques for securing performance in a high-frequency band, for example, beamforming, massive multiple-input and multiple-output (MIMO), all-dimensional multiplexing. It may support technologies such as full dimensional MIMO (FD-MIMO), an array antenna, analog beam-forming, or a large scale antenna.
  • the wireless communication module 192 may support various requirements defined in the electronic device 101 , an external electronic device (eg, the electronic device 104 ), or a network system (eg, the second network 199 ).
  • the wireless communication module 192 may include a peak data rate (eg, 20 Gbps or more) for realizing eMBB, loss coverage (eg, 164 dB or less) for realizing mMTC, or U-plane latency for realizing URLLC ( Example: Downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) can be supported.
  • a peak data rate eg, 20 Gbps or more
  • loss coverage eg, 164 dB or less
  • U-plane latency for realizing URLLC
  • the antenna module 197 may transmit or receive a signal or power to the outside (eg, an external electronic device).
  • the antenna module 197 may include an antenna including a conductor formed on a substrate (eg, a PCB) or a radiator formed of a conductive pattern.
  • the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is connected from the plurality of antennas by, for example, the communication module 190 . can be selected. A signal or power may be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna.
  • other components eg, a radio frequency integrated circuit (RFIC)
  • RFIC radio frequency integrated circuit
  • the antenna module 197 may form a mmWave antenna module.
  • the mmWave antenna module comprises a printed circuit board, an RFIC disposed on or adjacent to a first side (eg, bottom side) of the printed circuit board and capable of supporting a designated high frequency band (eg, mmWave band); and a plurality of antennas (eg, an array antenna) disposed on or adjacent to a second side (eg, top or side) of the printed circuit board and capable of transmitting or receiving signals of the designated high frequency band. can do.
  • peripheral devices eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)
  • GPIO general purpose input and output
  • SPI serial peripheral interface
  • MIPI mobile industry processor interface
  • the command or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199 .
  • Each of the external electronic devices 102 or 104 may be the same as or different from the electronic device 101 .
  • all or part of the operations performed by the electronic device 101 may be executed by one or more external electronic devices 102 , 104 , or 108 .
  • the electronic device 101 may perform the function or service itself instead of executing the function or service itself.
  • one or more external electronic devices may be requested to perform at least a part of the function or the service.
  • One or more external electronic devices that have received the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit a result of the execution to the electronic device 101 .
  • the electronic device 101 may process the result as it is or additionally and provide it as at least a part of a response to the request.
  • cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used.
  • the electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing.
  • the external electronic device 104 may include an Internet of things (IoT) device.
  • the server 108 may be an intelligent server using machine learning and/or neural networks.
  • the external electronic device 104 or the server 108 may be included in the second network 199 .
  • the electronic device 101 may be applied to an intelligent service (eg, smart home, smart city, smart car, or health care) based on 5G communication technology and IoT-related technology.
  • the electronic device may have various types of devices.
  • the electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device.
  • a portable communication device eg, a smart phone
  • a computer device e.g., a smart phone
  • a portable multimedia device e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a wearable device e.g., a smart bracelet
  • a home appliance device e.g., a home appliance
  • first”, “second”, or “first” or “second” may simply be used to distinguish the component from other such components, and refer to those components in other aspects (e.g., importance or order) is not limited. It is said that one (eg, first) component is “coupled” or “connected” to another (eg, second) component, with or without the terms “functionally” or “communicatively”. When referenced, it means that one component can be connected to the other component directly (eg by wire), wirelessly, or through a third component.
  • module used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeable with terms such as, for example, logic, logic block, component, or circuit.
  • a module may be an integrally formed part or a minimum unit or a part of the part that performs one or more functions.
  • the module may be implemented in the form of an application-specific integrated circuit (ASIC).
  • ASIC application-specific integrated circuit
  • Various embodiments of the present document include one or more instructions stored in a storage medium (eg, internal memory 136 or external memory 138) readable by a machine (eg, electronic device 101).
  • a storage medium eg, internal memory 136 or external memory 138
  • the processor eg, the processor 120
  • the device eg, the electronic device 101
  • the one or more instructions may include code generated by a compiler or code executable by an interpreter.
  • the device-readable storage medium may be provided in the form of a non-transitory storage medium.
  • 'non-transitory' only means that the storage medium is a tangible device and does not contain a signal (eg, electromagnetic wave), and this term is used in cases where data is semi-permanently stored in the storage medium and It does not distinguish between temporary storage cases.
  • a signal eg, electromagnetic wave
  • the method according to various embodiments disclosed in this document may be provided in a computer program product (computer program product).
  • Computer program products may be traded between sellers and buyers as commodities.
  • the computer program product is distributed in the form of a machine-readable storage medium (eg compact disc read only memory (CD-ROM)), or via an application store (eg Play Store TM ) or on two user devices ( It can be distributed (eg downloaded or uploaded) directly or online between smartphones (eg: smartphones).
  • a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium such as a memory of a server of a manufacturer, a server of an application store, or a memory of a relay server.
  • each component eg, a module or a program of the above-described components may include a singular or a plurality of entities, and some of the plurality of entities may be separately disposed in other components. have.
  • one or more components or operations among the above-described corresponding components may be omitted, or one or more other components or operations may be added.
  • a plurality of components eg, a module or a program
  • the integrated component may perform one or more functions of each component of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. .
  • operations performed by a module, program, or other component are executed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations are executed in a different order, or omitted. , or one or more other operations may be added.
  • 2A is a perspective view of an electronic device 200 illustrating a flat state or unfolding state according to various embodiments of the present disclosure.
  • 2B is a plan view illustrating a front surface of the electronic device 200 in an unfolded state according to various embodiments of the present disclosure.
  • 2C is a plan view illustrating a rear surface of the electronic device 200 in an unfolded state, according to various embodiments of the present disclosure.
  • 3A is a perspective view of an electronic device 200 illustrating a folding state according to various embodiments of the present disclosure.
  • 3B is a perspective view of an electronic device 200 illustrating an intermediate state, according to various embodiments.
  • the electronic device 200 is rotated to face each other and to be folded based on a hinge device (eg, the hinge device 240 of FIG. 2B ).
  • a hinge device eg, the hinge device 240 of FIG. 2B
  • It may include a pair of housings 210 and 220 (eg, a foldable housing) that are possibly coupled.
  • the hinge device eg, the hinge device 240 of FIG. 2B
  • the hinge device may be disposed in the x-axis direction or the y-axis direction.
  • two or more hinge devices eg, the hinge device 240 of FIG. 2B
  • the electronic device 200 may include a flexible display 500 (eg, a foldable display) disposed in an area formed by a pair of housings 210 and 220 .
  • the first housing 210 and the second housing 220 may be disposed on both sides about the folding axis (axis A), and may have a substantially symmetrical shape with respect to the folding axis (axis A). have.
  • the first housing 210 and the second housing 220 may be in a state of the electronic device 200 in a flat state or an unfolding state, a folding state, or an intermediate state. (intermediate state), the angle or distance formed with each other may be different.
  • the pair of housings 210 and 220 includes a first housing 210 (eg, a first housing structure) coupled with a hinge device (eg, the hinge device 240 of FIG. 2B ) and a hinge. and a second housing 220 (eg, a second housing structure) coupled with a device (eg, the hinge device 240 of FIG. 2B ).
  • the first housing 210 in the unfolded state, the first surface 211 facing the first direction (eg, the front direction) (z-axis direction) and the first surface 211 opposite to A second surface 212 facing a second direction (eg, a rear direction) (-z-axis direction) may be included.
  • the second housing 220 in the unfolded state, has a third surface 221 facing the first direction (z-axis direction) and a fourth surface 222 facing the second direction (-z-axis direction). ) may be included.
  • the first surface 211 of the first housing 210 and the third surface 221 of the second housing 220 are substantially identical to the first electronic device 200 . It may be operated in such a way that the first surface 211 and the third surface 221 face each other in the folded state in the direction (z-axis direction).
  • the second surface 212 of the first housing 210 and the fourth surface 222 of the second housing 220 are substantially identical to the second electronic device 200 .
  • the second surface 212 and the fourth surface 222 may be operated to face opposite directions.
  • the second surface 212 may face a first direction (z-axis direction)
  • the fourth surface 222 may face a second direction (-z-axis direction).
  • the first housing 210 is coupled to the first side member 213 and the first side member 213 that at least partially form the exterior of the electronic device 200 , and the electronic device 200 .
  • ) may include a first back cover 214 forming at least a portion of the second surface 212 .
  • the first side member 213 may include a first side surface 213a, a second side surface 213b extending from one end of the first side surface 213a, and the other end of the first side surface 213a. It may include a third side surface 213c.
  • the first side member 213 may be formed in a rectangular (eg, square or rectangular) shape through the first side surface 213a, the second side surface 213b, and the third side surface 213c. have.
  • the second housing 220 is coupled to the second side member 223 and the second side member 223 that at least partially form an exterior of the electronic device 200 , and the electronic device 200 .
  • ) may include a second rear cover 224 forming at least a portion of the fourth surface 222 .
  • the second side member 223 includes a fourth side surface 223a, a fifth side surface 223b extending from one end of the fourth side surface 223a, and extending from the other end of the fourth side surface 223a. It may include a sixth side surface 223c.
  • the second side member 223 may be formed in a rectangular shape through the fourth side surface 223a, the fifth side surface 223b, and the sixth side surface 223c.
  • the pair of housings 210 and 220 is not limited to the illustrated shape and combination, and may be implemented by a combination and/or combination of other shapes or parts.
  • the first side member 213 may be integrally formed with the first back cover 214
  • the second side member 223 may be integrally formed with the second back cover 224 . can be formed.
  • the electronic device 200 in the unfolded state, has a certain gap between the second side surface 213b of the first side member 213 and the fifth side surface 223b of the second side member 223 . Can be connected without (gap).
  • a gap ( ) between the third side surface 213c of the first side member 213 and the sixth side surface 223c of the second side member 223 is any can be connected without gap).
  • the combined length of the second side surface 213b and the fifth side surface 223b of the electronic device 200 is that of the first side surface 213a and/or the fourth side surface 223a. It may be configured to be longer than the length. Also, the combined length of the third side surface 213c and the sixth side surface 223c may be longer than the length of the first side surface 213a and/or the fourth side surface 223a.
  • the first side member 213 and/or the second side member 223 may be formed of a metal or may further include a polymer injected into the metal. According to one embodiment, the first side member 213 and/or the second side member 223 may be electrically segmented through at least one segmented portion 2161 , 2162 , and/or 2261 , 2262 formed of a polymer. It may include at least one conductive portion 216 and/or 226 . In this case, at least one conductive part may be used as an antenna operating in at least one band (eg, legacy band) designated by being electrically connected to the wireless communication circuit included in the electronic device 200 .
  • at least one band eg, legacy band
  • first back cover 214 and/or second back cover 224 may be, for example, coated or colored glass, ceramic, polymer, or metal (eg, aluminum, stainless steel ( STS), or magnesium), or a combination of at least two.
  • metal eg, aluminum, stainless steel ( STS), or magnesium
  • the flexible display 500 crosses the hinge device (eg, the hinge device 240 of FIG. 2B ) from the first surface 211 of the first housing 210 to the second housing 220 . It may be arranged to extend to at least a part of the third surface 221 of the .
  • the flexible display 500 may include a first portion 230a substantially corresponding to the first surface 211 , a second portion 230b corresponding to the third surface 221 , and the first portion 230a . ) and the second part 230b, and may include a third part 230c (eg, a bendable region) corresponding to a hinge device (eg, the hinge device 240 of FIG. 2B ).
  • the electronic device 200 may include a first protective cover 215 (eg, a first protective frame or a first decorative member) coupled along an edge of the first housing 210 .
  • the electronic device 200 may include a second protective cover 225 (eg, a second protective frame or a second decorative member) coupled along an edge of the second housing 220 .
  • the first protective cover 215 and/or the second protective cover 225 may be formed of a metal or polymer material.
  • the first protective cover 215 and/or the second protective cover 225 may be used as a decoration member.
  • the flexible display 500 may be positioned such that an edge of the first portion 230a is interposed between the first housing 210 and the first protective cover 215 .
  • the flexible display 500 may be positioned such that an edge of the second portion 230b is interposed between the second housing 220 and the second protective cover 225 .
  • the flexible display 500 may be configured to correspond to the protective cap 235 through the protective cap 235 disposed in an area corresponding to the hinge device (eg, the hinge device 240 of FIG. 2B ).
  • the edge of the display 500 may be positioned to be protected. Accordingly, the edge of the flexible display 500 may be substantially protected from the outside.
  • the electronic device 200 supports a hinge device (eg, the hinge device 240 of FIG. 2B ), is exposed to the outside when the electronic device 200 is in a folded state, and is in an unfolded state.
  • a hinge housing 241 eg, an internal space of the first housing 210) and a second space (eg, an internal space of the second housing 220) disposed invisibly from the outside by being introduced into the first space (eg, the internal space of the first housing 210) : hinge cover)
  • the flexible display 500 may be arranged to extend from at least a portion of the second surface 212 to at least a portion of the fourth surface 222 . In this case, the electronic device 200 may be folded to expose the flexible display 500 to the outside (out-folding method).
  • the electronic device 200 may include a sub-display 231 that is separately disposed from the flexible display 500 .
  • the sub-display 231 is disposed to be at least partially exposed to the second surface 212 of the first housing 210 , and thus, when in a folded state, replaces the display function of the flexible display 500 . , status information of the electronic device 200 may be displayed.
  • the sub-display 231 may be disposed to be visible from the outside through at least a partial area of the first rear cover 214 .
  • the sub-display 231 may be disposed on the fourth surface 222 of the second housing 220 . In this case, the sub-display 231 may be disposed to be visible from the outside through at least a partial area of the second rear cover 224 .
  • the electronic device 200 includes an input device 203 (eg, a microphone), sound output devices 201 and 202 , a sensor module 204 , camera devices 205 and 208 , and a key input device. 206 , or at least one of a connector port 207 .
  • an input device 203 eg, a microphone
  • a sound output device 201 , 202 e.g., a microphone
  • a sensor module 204 e.g., a camera
  • a camera device 205 e.g., a camera
  • 208 e.g., a key input device 206
  • a connector port e.g., a connector port
  • Reference numeral 207 denotes a hole or shape formed in the first housing 210 or the second housing 220 , but a substantial electronic component (eg, disposed inside the electronic device 200 ) that operates through the hole or shape. : may be defined to include an input device, a sound output device, a sensor module, or a camera device).
  • the input device 203 may include at least one microphone 203 disposed in the second housing 220 .
  • the input device 203 may include a plurality of microphones 203 arranged to sense the direction of the sound.
  • the plurality of microphones 203 may be disposed at appropriate locations in the first housing 210 and/or the second housing 220 .
  • the sound output devices 201 and 202 may include speakers 201 and 202 .
  • the speakers 201 and 202 may include the receiver 201 for a call disposed in the first housing 210 and the speaker 202 disposed in the second housing 220 .
  • the input device 203 , the sound output devices 201 , 202 , and the connector port 207 are provided in the first housing 210 and/or the second housing 220 of the electronic device 200 . It is disposed in the space and may be exposed to the external environment through at least one hole formed in the first housing 210 and/or the second housing 220 .
  • at least one connector port 207 may be used to transmit/receive power and/or data to/from an external electronic device.
  • at least one connector port (eg, an ear jack hole) may accommodate a connector (eg, an ear jack) for transmitting and receiving audio signals to and from an external electronic device.
  • the holes formed in the first housing 210 and/or the second housing 220 may be commonly used for the input device 203 and the sound output devices 201 and 202 .
  • the sound output devices 201 and 202 may include a speaker (eg, a piezo speaker) that operates while excluding holes formed in the first housing 210 and/or the second housing 220 . have.
  • the sensor module 204 may generate an electrical signal or data value corresponding to an internal operating state of the electronic device 200 or an external environmental state.
  • the sensor module 204 may detect the external environment, for example, through the first surface 211 of the first housing 210 .
  • the electronic device 200 may further include at least one sensor module disposed to detect an external environment through the second surface 212 of the first housing 210 .
  • the sensor module 204 eg, an illuminance sensor
  • the sensor module 204 may include a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, and an illuminance sensor. , a proximity sensor, a biometric sensor, an ultrasonic sensor, or an illuminance sensor.
  • the camera devices 205 and 208 include a first camera device 205 (eg, a front camera device) and a first camera device 205 (eg, a front camera device) disposed on the first surface 211 of the first housing 210 . and a second camera device 208 disposed on the second side 212 of the housing 210 .
  • the electronic device 200 may further include a flash 209 disposed near the second camera device 208 .
  • the camera device 205 , 208 may include one or more lenses, an image sensor, and/or an image signal processor.
  • the flash 209 may include, for example, a light emitting diode or a xenon lamp.
  • the camera devices 205 and 208 have two or more lenses (eg, a wide-angle lens, an ultra-wide-angle lens, or a telephoto lens) and image sensors on one side (eg, a first side) of the electronic device 200 . 211), the second surface 212, the third surface 221, or the fourth surface 222).
  • the camera device 205 , 208 may include lenses and/or an image sensor for time of flight (TOF).
  • TOF time of flight
  • the key input device 206 may be disposed on the third side surface 213c of the first side member 213 of the first housing 210 .
  • the key input device 206 may use at least one of the other sides 213a , 213b of the first housing 210 and/or the sides 223a , 223b , 223c of the second housing 220 . It can also be placed on the side.
  • the electronic device 200 may not include some or all of the key input devices 206 and the not included key input devices 206 may be in another form, such as soft keys, on the flexible display 500 . may be implemented as In some embodiments, the key input device 206 may be implemented using a pressure sensor included in the flexible display 500 .
  • some of the camera devices 205 and 208 may be disposed to be exposed through the flexible display 500 .
  • the first camera device 205 or the sensor module 204 may contact the external environment through an opening (eg, a through hole) formed at least partially in the flexible display 500 in the internal space of the electronic device 200 .
  • an opening eg, a through hole
  • some sensor modules 204 may be arranged to perform their functions without being visually exposed through the flexible display 500 in the internal space of the electronic device 200 .
  • the opening of the area facing the sensor module 204 of the flexible display 500 may not be necessary.
  • the electronic device 200 may be operated to maintain an intermediate state through a hinge device (eg, the hinge device 240 of FIG. 2B ).
  • the electronic device 200 may control the flexible display 500 to display different contents on the display area corresponding to the first surface 211 and the display area corresponding to the third surface 221 .
  • the electronic device 200 is connected to the first housing 210 and the second housing (eg, when in an intermediate state) at a predetermined angle of inflection (eg, the hinge device 240 of FIG. 2B ) through a hinge device (eg, the hinge device 240 of FIG. 2B ). 220) based on the substantially unfolded state (eg, the unfolded state of FIG.
  • the substantially folded state eg, the folded state of FIG. 3A
  • a pressing force is provided in the unfolding direction (B direction) in a state in which the electronic device 200 is unfolded at a predetermined inflection angle through a hinge device (eg, the hinge device 240 of FIG. 2B )
  • It may be operated to transition to an unfolded state (eg, the unfolded state of FIG. 2A ).
  • a pressing force is applied to the electronic device 200 in a folding direction (C direction) in a state in which the electronic device 200 is unfolded at a predetermined angle of inflection through a hinge device (eg, the hinge device 240 of FIG.
  • the electronic device 200 may be operated to transition to a closed state (eg, the folded state of FIG. 3A ).
  • the electronic device 200 may be operated to maintain an unfolded state (not shown) at various angles through a hinge device (eg, the hinge device 240 of FIG. 2B ).
  • FIG 4 is an exploded perspective view of the electronic device 200 according to various embodiments of the present disclosure.
  • the electronic device 200 includes a first side member 213 (eg, a first side frame), a second side member 223 (eg, a second side frame), and a first side member 213 . ) and a hinge device 240 (eg, a hinge module) rotatably connecting the second side member 223 to each other.
  • the electronic device 200 includes at least a first support member 2131 (eg, a first support member) extending at least partially from the first side member 213 , and at least from the second side member 223 .
  • a second support member 2231 that partially extends may be included.
  • the first support member 2131 may be integrally formed with the first side member 213 or may be structurally coupled to the first side member 213 .
  • the second support member 2231 may be integrally formed with the second side member 223 or may be structurally coupled to the second side member 223 .
  • the electronic device 200 may include the flexible display 500 disposed to receive support from the first support member 2131 and the second support member 2231 .
  • the electronic device 200 is coupled to the first side member 213 and provides a first space between the first back cover 214 and the second side surface with the first support member 2131 .
  • a second rear cover 224 coupled to the member 223 and providing a second space therebetween may be included.
  • the first side member 213 and the first back cover 214 may be integrally formed.
  • the second side member 223 and the second back cover 224 may be integrally formed.
  • the electronic device 200 includes a first housing 210 (eg, FIG. 2A ) provided through the first side member 213 , the first support member 2131 , and the first rear cover 214 . of the first housing 210) (eg, a first housing structure).
  • the electronic device 200 includes a second housing (eg, the second housing of FIG. 2A ) provided through the second side member 223 , the second support member 2231 , and the second rear cover 224 . 2 housing 220) (eg, a second housing structure).
  • the electronic device 200 may include a sub-display 231 that is disposed to be visible from the outside through at least a partial area of the first rear cover 214 .
  • the electronic device 200 includes a first substrate assembly 261 (eg, a main printed circuit board) disposed in a first space between the first side member 213 and the first rear cover 214 . ), a camera assembly 263 , a first battery 271 , or a first bracket 251 .
  • the camera assembly 263 may include a plurality of camera devices (eg, the camera devices 205 and 208 of FIGS. 2A and 3A ), and may be electrically connected to the first substrate assembly 261 . can be connected to
  • the first bracket 251 may provide a support structure for supporting the first substrate assembly 261 and/or the camera assembly 263 and improved rigidity.
  • the electronic device 200 includes a second board assembly 262 (eg, a sub printed circuit board) disposed in a second space between the second side member 223 and the second rear cover 224 . , an antenna 290 (eg, a coil member), a second battery 272 , or a second bracket 252 .
  • the electronic device 200 crosses the hinge device 240 from the first substrate assembly 261 , and includes a plurality of pieces disposed between the second side member 223 and the second back cover 224 .
  • a wiring member 280 eg, a flexible substrate
  • electronic components eg, the second board assembly 262 , the second battery 272 , or the antenna 290
  • the antenna 290 may include a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna.
  • NFC near field communication
  • MST magnetic secure transmission
  • the antenna 290 may, for example, perform short-range communication with an external device or wirelessly transmit/receive power required for charging.
  • the electronic device 200 supports the hinge device 240 , is exposed to the outside when the electronic device 200 is in a folded state (eg, the folded state of FIG. 3A ), and is in an unfolded state ( Example: in the unfolded state of FIG. 2A , a hinge housing 241 (eg, a hinge cover) that is disposed invisibly from the outside by being introduced into the first space and/or the second space may be included.
  • a hinge housing 241 eg, a hinge cover
  • the electronic device 200 may include a first protective cover 215 coupled along an edge of the first side member 213 .
  • the electronic device 200 may include a second protective cover 225 coupled along an edge of the second side member 223 .
  • an edge of the first flat portion (eg, the first portion 230a of FIG. 2B ) of the flexible display 500 may be protected by the first protective cover 215 .
  • an edge of the second flat portion (eg, the second portion 230a of FIG. 2B ) of the flexible display 500 may be protected by the second protective cover 225 .
  • the electronic device 200 is disposed to protect an edge of a third portion corresponding to the hinge device 240 of the flexible display 500 (eg, the third portion 230c of FIG. 2B ).
  • a protective cap 235 may be included.
  • the first support member 2131 may have a first support surface 2131a facing a first direction (z-axis direction) and a second direction opposite to the first direction (-z-axis direction).
  • a second support surface 2131b may be included.
  • the second support member 2231 may include a third support surface 2231a facing the first direction and a fourth support surface 2231b facing the second direction in the unfolded state.
  • the flexible display 500 may be disposed to receive support from the first support surface 2131a of the first support member 2131 and the third support surface 2231a of the second support member 2231 . have.
  • FIG 5 is an exploded perspective view of the flexible display 500 according to various embodiments of the present disclosure.
  • the flexible display 500 may include an unbreakable (UB) type OLED display (eg, curved display).
  • UB unbreakable
  • the flexible display 500 includes a window layer 510 , a polarizer (POL) 520 (eg, a polarizing film) sequentially disposed on the rear surface of the window layer 510 , and a display panel.
  • a polarizer (POL) 520 eg, a polarizing film
  • the flexible display 500 may include a digitizer 560 disposed between the polymer layer 540 and the metal sheet layer 550 or between the metal sheet layer 550 and the conductive plate 570 .
  • the window layer 510 may include a glass layer.
  • the glass layer includes a plurality of openings disposed in an area corresponding to the bendable third portion of the flexible display 500 (eg, the third portion 230c of FIG. 2B ), thereby forming the flexible display ( 500) can be improved.
  • the plurality of openings are arranged to have different opening ratios for each area divided along the folding axis A, so that flexibility corresponding to the curvature of each bent area is provided, thereby smooth bending operation of the window layer 510 And it can help to reinforce the rigidity.
  • the window layer 510 , the polarization layer 520 , the display panel 530 , the polymer layer 540 , and the metal sheet layer 550 may include the first housing (eg, the first housing of FIG. 2A ).
  • the first side of the housing 210 eg, the first side 211 of FIG. 2A
  • the third side of the second housing eg, the second housing 120 of FIG. 2A
  • the conductive plate 570 includes a first conductive plate 571 and a second housing (eg, the second housing 210 of FIG.
  • the window layer 510 , the polarization layer 520 , the display panel 530 , the polymer layer 540 , the metal sheet layer 550 , and the conductive plate 570 may include adhesives P1 , P2 , P3, P4) (or adhesive) can be attached to each other.
  • the adhesives P1 , P2 , P3 , and P4 may include at least one of an optical clear adhesive (OCA), a pressure sensitive adhesive (PSA), a heat-reactive adhesive, a general adhesive, and a double-sided tape.
  • the display panel 530 may include a plurality of pixels and a wiring structure (eg, an electrode pattern).
  • the polarization layer 520 may selectively pass light generated from the light source of the display panel 530 and vibrating in a predetermined direction.
  • the display panel 530 and the polarization layer 520 may be integrally formed.
  • the flexible display 500 may include a touch panel (not shown).
  • the polymer layer 540 is disposed under the display panel 530 to provide a dark background for securing visibility of the display panel 530 and may be formed of a cushioning material for a buffering action. .
  • the polymer layer 540 may be removed or disposed under the metal sheet layer 550 .
  • the metal sheet layer 550 may be formed in a shape that provides flexibility to the flexible display 500 .
  • the metal sheet layer 550 may include steel use stainless (SUS) (eg, stainless steel (STS)), Cu, Al, or a metal CLAD (eg, a stacked member in which SUS and Al are alternately disposed). may include at least one of
  • the metal sheet layer 550 may include other alloy materials.
  • the metal sheet layer 550 can help reinforce the stiffness of an electronic device (eg, the electronic device 200 of FIG. 2A ), shield ambient noise, and prevent heat dissipation from surrounding heat dissipating components. It can be used to dissipate heat.
  • the flexible display 500 is disposed under the metal sheet layer 550 and may include a digitizer 560 as a detection member receiving an input of an electronic pen (eg, a stylus).
  • the digitizer 560 may include a coil member disposed on the dielectric substrate to detect the resonance frequency of the electromagnetic induction method applied from the electronic pen.
  • the flexible display 500 may include at least one functional member (not shown) disposed between the polymer layer 540 and the metal sheet layer 550 or below the metal sheet layer 550 .
  • the functional member may include a graphite sheet for heat dissipation, an added display, a poster touch FPCB, a fingerprint sensor FPCB, an antenna radiator for communication, or a conductive/non-conductive tape.
  • the functional member when bending is not possible, may be individually attached to the first housing (eg, the first housing 210 in FIG. 2A ) and the second housing (eg, the second housing 220 in FIG. 2A ). may be placed.
  • the first housing eg, the first housing 210 in FIG. 2A
  • a hinge device eg, the hinge device 240 in FIG. 2B
  • the second housing eg, the second housing 220 of FIG. 2A
  • the first housing passes through a hinge device (eg, the hinge device 240 in FIG. 2B ) to the second housing.
  • the second housing 220 of FIG. 2A may be disposed up to at least a portion.
  • the electronic device (eg, the electronic device 200 of FIG. 2A ) is disposed under the flexible display 500 , and a camera device (eg, the electronic device 200 of FIG. 2A ) detects an external environment through the flexible display 500 .
  • the first camera device 205 of 2a) may be included.
  • the electronic device (eg, electronic device 200 of FIG. 2A ) includes at least one sensor module (eg, sensor module 204 of FIG. 2A ) disposed below flexible display 500 (eg, illuminance) sensor, proximity sensor, or TOF sensor).
  • the polarization layer 520 , the display panel 530 , the polymer layer 540 , the metal sheet layer 550 , the digitizer 560 , and the conductive plate 570 may include the through holes 5201 and 5301 , 5401, 5501, 5601, 5701).
  • the through-holes 5201 and 5301 may be unnecessary in the display panel 530 and/or the polarization layer 520 by adjusting the transmittance of the corresponding area.
  • the size of the through holes 5201 , 5301 , 5401 , 5501 , 5601 , 5701 is the size of the camera device (eg, the first camera device 205 of FIG.
  • the size of the camera device (eg, the camera device 205 of FIG. 2A ), and/or the size of the camera device (eg, the camera device 205 of FIG. 2A ).
  • It may be formed based on the angle of view of the first camera device 205 of FIG. 2A , and sizes of the respective through holes 5201 , 5301 , 5401 , 5501 , 5601 and 5701 may be different from each other.
  • 6A is a view from one side of a wiring member 280 on which a first touch sensor and a second touch sensor are disposed, according to various embodiments of the present disclosure.
  • 6B is a perspective view of a wiring member 280 on which a first touch sensor and a second touch sensor are disposed, according to various embodiments of the present disclosure.
  • an electronic device may include a wiring member 280 (eg, a flexible printed circuit board (FPCB)).
  • the wiring member 280 crosses the hinge device (eg, the hinge device 240 of FIG. 4 ) from the first substrate assembly (eg, the first substrate assembly 261 of FIG. 4 ), the second side member (eg, the hinge device 240 of FIG. 4 ).
  • a plurality of electronic components eg, the second substrate of FIG. 4
  • the second rear cover eg, the second rear cover 224 of FIG.
  • an assembly eg, second substrate assembly 262 in FIG. 4
  • a second battery eg, second battery 272 in FIG. 4
  • an antenna eg, antenna 290 in FIG. 4 . and may provide an electrical connection.
  • the wiring member 280 includes a first area 280a facing the first housing (eg, the first housing 210 in FIG. 2A ), and a second housing (eg, the second housing 210 in FIG. 2A ). 220)), and a third region 280c disposed in the inner space of the hinge device (eg, the hinge device 240 of FIG. 2B ). In an embodiment, the third region 280c may connect the first region 280a and the second region 280b.
  • the third region 280c may include a curved region 630 .
  • the electronic device 200 may include a first touch sensor 610 and a second touch sensor 620 .
  • the first touch sensor 610 and the second touch sensor 620 may include a capacitive type touch sensor.
  • the first touch sensor 610 and the second touch sensor 620 may be disposed in the bent region 630 of the wiring member 280 .
  • the first touch sensor 610 may be disposed at a first point of the curved area 630 .
  • the second touch sensor 620 may be disposed at a second point of the curved area 630 .
  • the first touch sensor 610 and the second touch sensor 620 are in a folded state (eg, an unfolded state (eg, a state of FIG. 2A ), a folded state (eg, a state of FIG. 3A ) of the electronic device 200 , and / or to detect an intermediate state (eg, the state of FIG. 3B ).
  • the arrangement structure of the first touch sensor 610 and the second touch sensor 620 and the folding of the electronic device 200 using the first touch sensor 610 and the second touch sensor 620 according to various embodiments With respect to the embodiment of detecting the state, various embodiments will be described with reference to FIGS. 7A to 12 to be described later.
  • FIG. 7A is a diagram 700 illustrating a folded state of the electronic device 200 including the first touch sensor and the second touch sensor, according to various embodiments of the present disclosure.
  • FIG. 7B is a view 750 illustrating an unfolded state of the electronic device 200 including the first touch sensor and the second touch sensor, according to various embodiments of the present disclosure.
  • the electronic device (eg, the electronic device 200 of FIG. 2A ) includes a hinge housing 241 and a first housing 210 rotatably disposed on one side of the hinge housing 241 . and a second housing 220 rotatably disposed on the other side.
  • the first housing 210 , the second housing 220 , and the hinge housing 241 may be formed of a conductive material.
  • the electronic device 200 includes a member 710 for preventing the inflow of foreign substances (eg, dust, moisture) into the inner space of the first housing 210 and the inner space of the second housing 220 .
  • the member 710 may have a shape capable of blocking the inflow of foreign substances.
  • the member 710 may have a brush shape, a porous shape, or a mesh shape.
  • the electronic device 200 may include a flexible display 500 .
  • the flexible display 500 includes a window layer 510 and a polarization layer (eg, FIG. 5 ) sequentially disposed on a rear surface (eg, -z-axis direction in FIG. 5 ) of the window layer 510 . of a polarization layer 520 ), a display panel 530 , a polymer layer 540 , a metal sheet layer 550 , and a conductive plate 570 .
  • the conductive plate 570 may include a first conductive plate 571 and a second conductive plate 572 arranged to be separated from each other when the electronic device 200 is in a folded state.
  • the flexible display 500 includes a window layer 510 and a display panel (except for the first conductive plate 571 and the second conductive plate 572) when the electronic device 200 is in a folded state.
  • the polymer layer 540 , and the metal sheet layer 550 may be deformed to be folded together.
  • the window layer 510 when the electronic device 200 is in a folded state, the window layer 510 generally faces the first region 510a and the second region 510b to face each other, and the third region 510c It can be folded with a specified curvature.
  • the electronic device 200 is in a folded state (eg, an unfolded state (eg, a state of FIG. 2A ), a closed state (eg, a state of FIG. 3A ), and an intermediate state (eg, a state of FIG. 3A ) of the electronic device 200 .
  • a first touch sensor 610 and a second touch sensor 620 for detecting (state of FIG. 3B )).
  • the first touch sensor 610 and the second touch sensor 620 may include a capacitive touch sensor.
  • the electronic device 200 may include a wiring member 280 extending through the first housing 210 , the hinge housing 241 , and the second housing 220 .
  • the first touch sensor 610 and the second touch sensor 620 may be disposed in the bent region 630 of the wiring member 280 .
  • the first touch sensor 610 and the second touch sensor 620 may transition from a folded state of the electronic device 200 (eg, a folded state (eg, the state of FIG. 3A ) to an intermediate state (eg, the state of FIG. 3B ).
  • a conductive plate (e.g., the second state) based on transitioning from an unfolded state to a folded or intermediate state, or from an intermediate state to an unfolded or folded state) or to an unfolded state (eg, the state of FIG.
  • the first conductive plate 571 and the second conductive plate 572) may be disposed at a point of the curved region 630 where the detection is possible.
  • the first touch sensor 610 may be disposed at a first point of the curved area 630 .
  • the second touch sensor 620 may be disposed at a second point of the curved area 630 .
  • the first point of the bent region 630 may include a point corresponding to one side of the first conductive plate 571 in the folded state of the electronic device 200 (eg, the state of FIG. 3A ).
  • the second point of the bent region 630 may include a point corresponding to one side of the second conductive plate 572 in the folded state of the electronic device 200 (eg, the state of FIG. 3A ).
  • the present invention is not limited thereto.
  • the first housing 210 and the second housing 220 are An angle of 180 degrees may be formed, and the first portion (eg, the first portion 230a of FIG. 2B ) and the second portion (eg, the second portion 230b of FIG. 2B ) of the flexible display 500 are in the same direction It can be arranged to face.
  • the electronic device 200 transitions from the folded state (eg, the state of FIG. 7A ) to the unfolded state (eg, the state of FIG.
  • the first part 230a and the second part ( 230b), and a third part 230c (eg, a bendable region) corresponding to the hinge device (eg, the hinge device 240 of FIG. 2B ) is a first part 230a and a second part 230b. can be formed on the same plane as
  • a transition of the electronic device 200 from a folded state eg, a folded state (eg, the state of FIG. 3A ) to an intermediate state (eg, the state of FIG. 3B ) or an unfolded state (eg, the state of FIG. 2A )
  • a transition from an unfolded state to a folded state or an intermediate state, or a transition from an intermediate state to an unfolded state or a folded state is detected, the distance between the first touch sensor 610 and the first conductive plate 571 and /
  • the distance between the second touch sensor 620 and the second conductive plate 572 may vary.
  • the first distance 730 between the first conductive plate 571 and the first touch sensor 610 . may be changed to the third distance 760 .
  • the third distance 760 may be greater than the first distance 730 .
  • the distance between the first conductive plate 571 and the first touch sensor 610 may increase.
  • the second distance 740 between the second conductive plate 572 and the second touch sensor 620 when a transition from the folded state of the electronic device 200 of FIG. 7A to the unfolded state of FIG. 7B is detected, the second distance 740 between the second conductive plate 572 and the second touch sensor 620 .
  • the fourth distance 770 may be changed to the fourth distance 770 .
  • the fourth distance 770 may be greater than the second distance 740 .
  • the distance between the second conductive plate 572 and the second touch sensor 620 may increase.
  • the first touch A change in capacitance according to a distance between the sensor 610 and the first conductive plate 571 and/or a change in capacitance according to a distance between the second touch sensor 620 and the second conductive plate 572 may occur.
  • each of the first touch sensor 610 and the second touch sensor 620 may be connected to the sensor circuit 720 (eg, the sensor module 176 of FIG. 1 ) through wiring.
  • the electronic device 200 changes the distance between the first conductive plate 571 and the first touch sensor 610 through the sensor circuit 720 (eg, the first distance 730 to the second distance 760 ). ) as the first capacitance changes and the distance between the second conductive plate 572 and the second touch sensor 620 is changed (eg, the second distance 740 to the fourth distance 770 is changed) A change in the second capacitance may be confirmed.
  • the electronic device 200 may check a folded state (eg, an unfolded state, a folded state, or an intermediate state) of the electronic device 200 based on the change in the first capacitance and the change in the second capacitance.
  • the electronic device 200 may control the electronic device 200 to operate in an operation mode corresponding to the confirmed folding state. For example, when the electronic device 200 is in an unfolded state, the electronic device 200 may display content through the flexible display 500 . As another example, when the folded state of the electronic device 200 is the folded state, the electronic device 200 displays the state information of the electronic device 200 through the sub-display (eg, the sub-display 231 of FIG. 3A ). can be displayed As another example, when the folded state of the electronic device 200 is an intermediate state, the electronic device 200 includes a display area corresponding to the first surface (eg, the first surface 211 of FIG. 2B ); Different content may be displayed on the display area corresponding to the three surfaces (eg, the third surface 221 of FIG. 2B ).
  • the first surface eg, the first surface 211 of FIG. 2B
  • Different content may be displayed on the display area corresponding to the three surfaces (eg, the third surface 221 of FIG. 2B ).
  • FIG. 8 which will be described later, in relation to a change in capacitance due to detection of a transition of the folding state of the electronic device 200 according to various embodiments.
  • FIG. 8 is a diagram 800 for explaining a transition of the electronic device 200 to a folded state and a change in capacitance according to a transition of the electronic device 200, according to various embodiments of the present disclosure.
  • the first touch sensor 610 and the third A second touch sensor 620 disposed at a second point of the region 280c may be included.
  • the electronic device 200 when the electronic device 200 detects a transition from the folded state (eg, the state of FIG. 7A ) to the unfolded state (eg, the state of FIG. 7B ), the first conductive plate 571 and the first touch sensor The distance between the 610 and/or the second conductive plate 572 and the second touch sensor 620 may be changed.
  • the first housing ( Example: The flexible display 500 disposed to cross the first housing 210 of FIG. 2A and the second housing 220 of FIG. 2A ) may be unfolded from 90 degrees to 180 degrees.
  • the second conductive plate 572 may also be in the unfolded states 815 and 825 from 90 degrees to 180 degrees.
  • the distance between the first conductive plate 571 and the first touch sensor 610 and /or the distance between the second conductive plate 572 and the second touch sensor 620 may also be changed.
  • the distance between the first conductive plate 571 and the first touch sensor 610 is a first distance d1 ( 811 ) and a second distance ( d2 ). (812), . , the n-th distance dn 813 may be changed.
  • the distance between the second conductive plate 572 and the second touch sensor 620 is a first distance (d'1) (821), a second distance ( d'2) (822), ... , may be changed to an n-th distance (d'n) 823 .
  • the distance between the first conductive plate 571 and the first touch sensor 610 is changed (eg, a first distance d1 811 and a second distance d2 ).
  • a change in capacitance according to the changed distance may be detected.
  • the distance between the second conductive plate 572 and the second touch sensor 620 is changed (eg, a first distance d′1 821 and a second distance d′2).
  • a change in capacitance according to the changed distance may be detected.
  • the x-axis is the distance 860 between the first conductive plate 571 and the first touch sensor 610 (and the second conductive plate 572 and the second touch sensor 620). distance) can be shown.
  • the y-axis is the capacitance 870 according to the distance between the first conductive plate 571 and the first touch sensor 610 (and the capacitance according to the distance between the second conductive plate 572 and the second touch sensor 620). is shown.
  • the distance between the first conductive plate 571 and the first touch sensor 610 is a first distance d1 (811),
  • the second distance d2 (812), . . . , the n-th distance dn 813 may be changed.
  • the capacitance 870 also includes the first capacitance 870a, the second capacitance 870b, . , may be changed to the nth capacitance 870n.
  • the distance between the second conductive plate 572 and the second touch sensor 620 is a first distance (d'1) (821), a second 2 distance (d'2) (822), . . . , may be changed to an n-th distance (d'n) 823 . 2
  • the capacitance 870 also includes the first capacitance 870a, the second capacitance 870b, . , may be changed to the nth capacitance 870n.
  • a conductive plate eg, first conductive plate 571 and/or second conductive plate 572
  • a touch sensor eg, first touch sensor
  • the electronic device 200 may determine that the electronic device 200 has transitioned from the folded state to the unfolded state based on detecting a change in the capacitance decrease.
  • a conductive plate eg, first conductive plate 571 and/or second conductive plate 572
  • a touch sensor eg, first touch sensor 610 and/or second touch sensor 620
  • the capacitance 870 may increase.
  • the electronic device 200 may determine that the electronic device 200 has transitioned from the unfolded state to the folded state based on detecting a change in the increase in capacitance.
  • the first touch sensor 610 and the second A change in the distance between the first conductive plates 571 or the distance between the second touch sensor 620 and the second conductive plate 572 may be detected.
  • the distance between the first conductive plate 571 and the first touch sensor 610 is a first distance (d1) 811, a second distance ( d2) (812), ...
  • the n-th distance (dn) 813 is detected to be changed, or the distance between the second conductive plate 572 and the second touch sensor 620 is the first distance (d'1) 821, the second Distance d'2 (822), . . . , a change to the n-th distance d'n 823 may be detected.
  • one Only the conductive plate (eg, the first conductive plate 571 or the second conductive plate 573) may be in a 180-degree unfolded state.
  • only one conductive plate (eg, the first conductive plate 571 or the second conductive plate 573) is 90 degrees in a state where the first conductive plate 571 and the second conductive plate 572 are 180 degrees. can become a thief.
  • the electronic device 200 changes the folded state from the folded state to the intermediate state or from the unfolded state. It can be seen that the transition to the intermediate state is observed.
  • FIG. 9 is a view 900 of an electronic device 200 including a first touch sensor and a second touch sensor viewed from one side in a folded state, an unfolded state, and a wiring member 280 according to various embodiments of the present disclosure; .
  • the first housing 210 and the second housing 220 may be disposed on both sides about the folding axis (axis A), and may have a substantially symmetrical shape with respect to the folding axis (axis A). have.
  • the first distance between the touch sensor 610 and the first conductive plate 571 eg, the first distance 730 of FIG. 7A
  • the electronic device 200 may detect a change in the first capacitance according to a change in the distance between the first touch sensor 610 and the first conductive plate 571 by using the sensor circuit 720 .
  • the second touch sensor 620 disposed in the bent region 630 of the third region 280c of the wiring member 280 .
  • the second distance between the second conductive plate 572 eg, the second distance 740 in FIG. 7A
  • the fourth distance 770 in FIG. 7B e.g. the fourth distance 770 in FIG. 7B
  • the electronic device 200 may detect a change in the second capacitance according to a change in the distance between the second touch sensor 620 and the second conductive plate 572 using the sensor circuit 720 .
  • the electronic device 200 transitions from the folded state 700 to the unfolded state 750 , the distance between the first conductive plate 571 and the first touch sensor 610 may increase, and thus detection The first capacitance to be used may be reduced.
  • the electronic device 200 transitions from the folded state 700 to the unfolded state 750 , the distance between the second conductive plate 572 and the second touch sensor 620 may increase, and thus the detected second The capacitance can be small.
  • the electronic device 200 may determine that the electronic device 200 is in the unfolded state based on detecting a change in which the capacitance decreases.
  • the electronic device 200 transitions from the unfolded state 750 to the folded state 700 , the distance between the first conductive plate 571 and the first touch sensor 610 may become closer. , the detected first capacitance may increase accordingly.
  • the electronic device 200 transitions from the unfolded state 750 to the folded state 700 , the distance between the second conductive plate 572 and the second touch sensor 620 may become closer, and accordingly, the detected second 2 The capacitance can be large.
  • the electronic device 200 may determine that the electronic device 200 is in the folded state based on detecting a change in the increase in capacitance.
  • the electronic device 200 may control the electronic device 200 to operate in an operation mode corresponding to the folded state. For example, when the electronic device 200 is in an unfolded state, the electronic device 200 may display content through the flexible display 500 . As another example, when the folded state of the electronic device 200 is the folded state, the electronic device 200 displays the state information of the electronic device 200 through the sub-display (eg, the sub-display 231 of FIG. 3A ). can be displayed. As another example, when the folded state of the electronic device 200 is an intermediate state, the electronic device 200 includes a display area corresponding to the first surface (eg, the first surface 211 of FIG. 2B ); Different content may be displayed on the display area corresponding to the three surfaces (eg, the third surface 221 of FIG. 2B ).
  • the first surface eg, the first surface 211 of FIG. 2B
  • Different content may be displayed on the display area corresponding to the three surfaces (eg, the third surface 221 of FIG. 2B ).
  • 10A is a view of a wiring member 280 including a plurality of first touch sensors and a plurality of second touch sensors as viewed from one side, according to various embodiments of the present disclosure.
  • 10B is a perspective view of a wiring member 280 including a plurality of first touch sensors and a plurality of second touch sensors, according to various embodiments of the present disclosure.
  • FIGS. 6A and 6B Since the wiring member 280 of FIGS. 10A and 10B according to various embodiments has substantially the same configuration as the wiring member 280 of FIGS. 6A and 6B described above, a description thereof is provided in FIGS. 6A and 6B . to be replaced with In FIGS. 10A and 10B according to various embodiments, only configurations different from those of FIGS. 6A and 6B will be described.
  • the first touch sensor 610 and the second touch sensor 620 are disposed in the bent area 630 of the third area 280c of the wiring member 280 in the aforementioned FIGS. 6A to 9 according to various embodiments. has been described, but is not limited thereto.
  • the first touch sensor 610 may include a plurality of first touch sensors 610a, 610b, ..., 610n
  • the second touch sensor 620 includes a plurality of may include second touch sensors 620a, 620b, ..., 620n.
  • the plurality of first touch sensors 610a, 610b, ..., 610n and the plurality of second touch sensors 620a, 620b, ..., 620n may include a capacitive touch sensor.
  • the plurality of first touch sensors 610a, 610b, ..., 610n and the plurality of second touch sensors 620a, 620b, ..., 620n are the bent region 630 of the wiring member 280 .
  • the plurality of first touch sensors 610a, 610b, ..., 610n may be disposed at a first point of the curved area 630 .
  • the plurality of first touch sensors 610a, 610b, ..., 610n may be disposed at a first point of the curved area 630 to be spaced apart from each other at a predetermined interval.
  • the plurality of second touch sensors 620a, 620b, ..., 620n may be disposed at a second point of the curved area 630 .
  • the plurality of second touch sensors 620a, 620b, ..., 620n may be disposed at a second point of the curved area 630 to be spaced apart from each other at a predetermined interval.
  • the plurality of first touch sensors 610a, 610b, ..., 610n and the plurality of second touch sensors 620a, 620b, ..., 620n are in a folded state (eg, It may be used to detect an unfolded state (eg, the state of FIG. 2A ), a folded state (eg, the state of FIG. 3A ), and/or an intermediate state (eg, the state of FIG. 3B ).
  • a folded state eg, It may be used to detect an unfolded state (eg, the state of FIG. 2A ), a folded state (eg, the state of FIG. 3A ), and/or an intermediate state (eg, the state of FIG. 3B ).
  • 11A is a view 1100 illustrating a folded state of the electronic device 200 including a plurality of first touch sensors and a plurality of second touch sensors, according to various embodiments of the present disclosure.
  • 11B is a diagram 1150 illustrating an unfolded state of the electronic device 200 including a plurality of first touch sensors and a plurality of second touch sensors, according to various embodiments of the present disclosure.
  • FIGS. 11A and 11B have substantially the same configuration as those of FIGS. 7A and 7B, a description thereof will be replaced with FIGS. 7A and 7B.
  • FIGS. 11A and 11B according to various embodiments, only a configuration different from that of FIGS. 7A and 7B will be described.
  • the electronic device (eg, the electronic device 200 of FIG. 2A ) may be in a folded state (eg, an unfolded state (eg, the state of FIG. 2A ) and a closed state (eg, the electronic device 200 of FIG. 2A ).
  • a plurality of first touch sensors 610a, 610b, 610c, ..., 610n and a plurality of second touch sensors for detecting an intermediate state (eg, state of FIG. 3B )), and a state of FIG. 3A ) (620a, 620b, 620c, ..., 620n) may be included.
  • the plurality of first touch sensors 610a, 610b, 610c, ..., 610n and the plurality of second touch sensors 620a, 620b, 620c, ..., 620n may be bent in the wiring member 280. It may be disposed in the region 630 .
  • the folding state of the electronic device 200 transitions between the plurality of first touch sensors 610a, 610b, 610c, ..., 610n and the plurality of second touch sensors 620a, 620b, 620c, ..., 620n. (eg, a transition from a folded state (eg, the state of FIG. 3A ) to an intermediate state (eg, the state of FIG.
  • the conductive plate eg, the first conductive plate 571 and the second conductive plate 572 . can be detected at the point of the bent region 630 . can be placed.
  • the plurality of first touch sensors 610a , 610b , 610c , ..., 610n may be disposed at a first point of the curved area 630 .
  • Each of the plurality of first touch sensors 610a, 610b, 610c, ..., 610n may be disposed to be spaced apart from each other at a first point of the curved area 630 .
  • the plurality of second touch sensors 620a, 620b, 620c, ..., 620n may be disposed at a second point of the curved area 630 .
  • Each of the plurality of second touch sensors 620a, 620b, 620c, ..., 620n may be disposed to be spaced apart from each other at a second point of the curved area 630 .
  • the electronic device 200 determines the distances 1110a, 1110b, 1110c, ..., between the first conductive plate 571 and the plurality of first touch sensors 610a, 610b, 610c, ..., 610n, respectively. 1110n) and the distance between the second conductive plate 572 and the plurality of second touch sensors 620a, 620b, 620c, ..., 620n, respectively, based on the distances 1120a, 1120b, 1120c, ..., 1120n, the electronic device You can check the folding state of (200).
  • the plurality of first touch sensors 610a, 610b, 610c, ..., 610n and the plurality of second touch sensors 620a may also be unfolded from 90 degrees to 180 degrees.
  • the first conductive plate 571 and the second conductive plate 572 are unfolded from 90 degrees to 180 degrees, the first conductive plate 571 and the plurality of first touch sensors 610a, 610b, 610c, ... , 610n) and/or a distance between the second conductive plate 572 and each of the plurality of second touch sensors 620a, 620b, 620c, ..., 620n may be changed.
  • the distance between the first conductive plate 571 and each of the plurality of first touch sensors 610a, 610b, 610c, ..., 610n is the first distance ( 1110a), a second distance 1110b, a third distance 1110c ... , from the fourth distance 1110n to the fifth distance 1160a, the sixth distance 1160b, the seventh distance 1160c, ... , may be changed to the eighth distance 1160n.
  • the electronic device 200 is changed through the sensor circuit 720 It is possible to detect a change in capacitance according to the distance.
  • the distance between the second conductive plate 572 and each of the plurality of second touch sensors 620a, 620b, ..., 620n is the first distance 1120a.
  • the second distance 1120b, the third distance 1120c, ... a fifth distance 1170a, a sixth distance 1170b, a seventh distance 1170c, .
  • the electronic device 200 may change the distance through the sensor circuit 720 It is possible to detect a change in capacitance according to
  • a distance between the first conductive plate 571 and each of the plurality of first touch sensors 610a, 610b, 610c, ..., 610n is a first distance 1110a, a second distance 1110b, a third distance Distance 1110c ... , from the fourth distance 1110n to the fifth distance 1160a, the sixth distance 1160b, the seventh distance 1160c, ... , may gradually increase toward the eighth distance 1160n, and accordingly, the detected capacitance may decrease.
  • the distance between the second conductive plate 572 and each of the plurality of second touch sensors 620a, 620b, ..., 620n is a first distance 1120a, a second distance 1120b, a third distance 1120c, ... , a fifth distance 1170a, a sixth distance 1170b, a seventh distance 1170c, . , may gradually increase toward the eighth distance 1170n, and thus the detected capacitance may decrease.
  • the electronic device 200 may determine that the electronic device 200 has transitioned from the folded state to the unfolded state based on detecting a change in the capacitance decrease.
  • a distance between the first conductive plate 571 and each of the plurality of first touch sensors 610a, 610b, 610c, ..., 610n is a fifth distance 1160a, a sixth distance 1160b, Seventh distance 1160c, ... , the first distance 1110a, the second distance 1110b, the third distance 1110c at the eighth distance 1160n ... , when the fourth distance 1110n gets closer, the detected capacitance may increase.
  • a distance between the second conductive plate 572 and each of the plurality of second touch sensors 620a, 620b, ..., 620n is a fifth distance 1170a, a sixth distance 1170b, and a seventh distance 1170c.
  • the detected capacitance may increase.
  • the electronic device 200 may determine that the electronic device 200 has transitioned from the unfolded state to the folded state based on detecting a change in the increase in capacitance.
  • the electronic device 200 may determine that the electronic device 200 has transitioned from the unfolded state or the folded state to the intermediate state.
  • FIG. 12 is a view from one side of a folded state, an unfolded state, and a wiring member 280 of an electronic device 200 including a plurality of first touch sensors and a plurality of second touch sensors, according to various embodiments of the present disclosure; It is a drawing 1200 .
  • the first housing 210 and the second housing 220 may be disposed on both sides about the folding axis (axis A), and may have a substantially symmetrical shape with respect to the folding axis (axis A). have.
  • a distance between the first touch sensors 610a, 610b, 610c, ..., 610n and the first conductive plate 571 is a first distance (eg, a first distance 1110a of FIG. 10A ), a second distance (eg, FIG. 10A ) The second distance 1110b of 10a), the third distance (eg, the third distance 1110c of FIG. 10A) ... , a fourth distance (eg, a fourth distance 1110n in FIG.
  • the electronic device 200 uses the sensor circuit 720 to change the capacitance as the distance between the plurality of first touch sensors 610a, 610b, 610c, ..., 610n and the first conductive plate 571 is changed. can be detected.
  • a distance between the touch sensors 620a, 620b, 620c, ..., 620n and the second conductive plate 572 is a first distance (eg, a first distance 1120a of FIG. 10A ), a second distance (eg, FIG. 10A ) The second distance 1120b of ), the third distance (eg, the third distance 1120c of FIG. 10A ), . . . , a fourth distance (eg, a fourth distance 1120n in FIG.
  • the electronic device 200 uses the sensor circuit 720 to change the capacitance as the distance between the plurality of second touch sensors 620a, 620b, 620c, ..., 620n and the second conductive plate 572 is changed. can be detected.
  • the electronic device 200 transitions from the folded state 1200 to the unfolded state 1250 , the first conductive plate 571 and the plurality of first touch sensors 610a, 610b, 610c, ..., 610n) The distance between them may be increased, and thus the detected capacitance may be reduced.
  • the electronic device 200 transitions from the folded state 1200 to the unfolded state 1250 , between the second conductive plate 572 and the plurality of second touch sensors 620a , 620b , 620c , ..., 620n, respectively.
  • the distance may be increased, and thus the detected capacitance may be small.
  • the electronic device 200 may determine that the electronic device 200 has transitioned from the folded state 1200 to the unfolded state 1250 based on detecting a change in which the capacitance decreases.
  • the present invention is not limited thereto, and when the electronic device 200 transitions from the unfolded state 1250 to the folded state 1200 , the first conductive plate 571 and the plurality of first touch sensors 610a, 610b, 610c, ..., 610n) may become closer together, and thus the detected capacitance may increase.
  • the second conductive plate 572 and the plurality of second touch sensors 620a , 620b , 620c , ..., 620n are interposed between each other. The distance may become close, and thus the detected capacitance may increase.
  • the electronic device 200 may determine that the electronic device 200 has transitioned from the unfolded state 1250 to the folded state 1200 based on detecting a change in the increase in capacitance.
  • the electronic device 200 may control the electronic device 200 to operate in an operation mode corresponding to the folded state.
  • FIG. 13 is a view 1300 illustrating a stacked structure of the wiring member 280 according to various embodiments of the present disclosure.
  • a wiring member (eg, the wiring member 280 of FIG. 4 ) may include a plurality of wiring layers 1310 .
  • the plurality of wiring layers 1310 include a first wiring layer 1310a, a second wiring layer 1310b, . , an n-th wiring layer 1310n may be included.
  • each of the plurality of wiring layers 1310 includes conductive layers 1310aa, 1310ba, ..., 1310na (eg, Cu) and insulating layers 1310ab, 1310bb, ..., 1310nb (eg, 1310nb) disposed on the rear surface of the conductive layer. : PPG (prepreg)).
  • the first touch sensor 610 and the second touch sensor 620 may be disposed at the first and second points of the third region 280c of the wiring member 280 .
  • the first touch sensor 610 and the second touch sensor 620 may be disposed on the conductive layer 1310aa constituting the first wiring layer 1310a.
  • first and second points corresponding to the first and second points of the conductive layer 1310aa constituting the first wiring layer 1310a on which the first touch sensor 610 and the second touch sensor 620 are disposed may be grounded with a mesh pattern 1400 .
  • the first and second points of the conductive layer 1310aa constituting the first wiring layer 1310a on which the first touch sensor 610 and the second touch sensor 620 are disposed The first and second points of the conductive layer 1310ba constituting the second wiring layer 1310b corresponding to Due to the shortest distance between them, it is possible to prevent a change in capacitance due to the surrounding conductive material (eg, metal, magnetic material). Accordingly, it is possible to prevent misrecognition of the folded state of the electronic device 200 (eg, misrecognition such as recognizing an unfolded state as a folded state) due to a surrounding conductive material (eg, a metal or a magnetic material).
  • a surrounding conductive material eg, a metal or a magnetic material
  • FIG. 14 is a diagram 1400 for explaining a mesh pattern according to various embodiments of the present disclosure.
  • the mesh pattern may have a grid type.
  • the mesh pattern has specified widths 1411 and 1412 (eg, about 0.5 mm), and may be formed while forming specified intervals 1413 and 1414 (eg, about 0.25 mm).
  • the mesh pattern may have a cross type.
  • a mesh pattern may have a specified width 1431, 1432 (eg, about 0.8 mm), a specified spacing 1433 (eg, about 0.2 mm), and at a specified angle 1434 (eg, about 45 degrees). can be formed.
  • the mesh pattern may have a grid type.
  • the mesh pattern may have specified widths 1451 and 1452 (eg, about 0.25 mm), and may be formed while forming specified intervals 1453 and 1454 (eg, about 0.5 mm).
  • the widths 1411 and 1412 of the mesh pattern according to the reference number ⁇ 1450> are smaller than the widths 1451 and 1452 of the mesh pattern according to the reference number ⁇ 1410>, and the width of the mesh pattern according to the reference number ⁇ 1450>.
  • the gaps 1413 and 1414 may be larger than the gaps 1453 and 1454 of the mesh pattern indicated by the aforementioned reference number ⁇ 1410>.
  • the mesh pattern may have a cross type.
  • a mesh pattern may have a specified width 1471, 1472 (eg, about 0.2 mm), a specified spacing 1473 (eg, about 0.4 mm), and at a specified angle 1474 (eg, about 45 degrees).
  • the widths 1471 and 1472 of the mesh pattern according to the reference number ⁇ 1470> are smaller than the widths 1431 and 1432 of the mesh pattern according to the reference number ⁇ 1430>, and the width of the mesh pattern according to the reference number ⁇ 1470>.
  • the spacing 1473 may be larger than the spacing 1433 of the mesh pattern according to the aforementioned reference number ⁇ 1430>.
  • FIG. 15 is a view 1500 for explaining a second wiring layer grounded in a mesh pattern according to various embodiments of the present disclosure.
  • the wiring member (eg, the wiring member 280 of FIG. 4 ) includes a plurality of wiring layers (eg, the plurality of wiring layers 1310 of FIG. 13 ) (eg, the first wiring layer 1310a of FIG. 13 ). ), a second wiring layer 1310b, ..., an n-th wiring layer 1310n).
  • Each of the plurality of wiring layers 1310 includes a conductive layer (eg, 1310aa, 1310ba, ..., 1310na of FIG. 13 ) (eg, Cu) and an insulating layer (eg, 1310ab, 1310bb, ... of FIG. 13 ) disposed on the rear surface of the conductive layer (eg, Cu).
  • 1310nb) eg, PPG).
  • the first touch sensor 610 and the second touch sensor 620 for detecting the folding state of the electronic device are conductive of the first wiring layer 1310a. may be disposed on layer 1310aa.
  • the area of the conductive layer 1310ba of the second wiring layer 1310b corresponding to the area of the first wiring layer 1310a in which the first touch sensor 610 and the second touch sensor 620 are disposed is to be grounded in a mesh pattern.
  • the region of the first wiring layer 1310a in which the first touch sensor 610 and the second touch sensor 620 are disposed in the region of the first wiring layer 1310a in which the first touch sensor 610 and the second touch sensor 620 are disposed.
  • the region of the conductive layer 1310ba of the corresponding second wiring layer 1310b may be grounded with mesh patterns 1511 , 1521 , and 1531 having different widths and spacings of a grid type.
  • the first touch sensor 610 and the second touch sensor 620 correspond to the region of the first wiring layer 1310a disposed therein.
  • the area of the conductive layer 1310ba of the second wiring layer 1310b may be grounded with cross-type mesh patterns 1541 , 1551 , and 1561 having different widths and intervals.
  • 16 is a flowchart 1600 for explaining a method of detecting a folding state of the electronic device 200 according to various embodiments of the present disclosure.
  • the electronic device (eg, the electronic device 200 of FIG. 2A ) includes a first conductive plate (eg, the first conductive plate 571 of FIG. 7A ) and a first touch sensor (eg, the first conductive plate 571 of FIG. 7A ).
  • a change in the second capacitance as the distance between (eg, the second touch sensor 620 of FIG. 7A ) is changed may be confirmed.
  • the electronic device 200 may check the folding state of the electronic device 200 based on the change in the first capacitance and the change in the second capacitance.
  • the distance between the first conductive plate 571 and the first touch sensor 610 may increase, and accordingly, the first detected first The capacitance can be small.
  • the distance between the second conductive plate 572 and the second touch sensor 620 may increase, and thus the detected second The capacitance can be small.
  • the electronic device 200 may determine that the folded state of the electronic device 200 is the unfolded state based on detecting a decrease in the first capacitance and the second capacitance.
  • the distance between the first conductive plate 571 and the first touch sensor 610 may become closer, and accordingly, the detected first The capacitance may be large.
  • the distance between the second conductive plate 572 and the second touch sensor 620 may become close, and thus the detected second capacitance may increase. have.
  • the electronic device 200 may determine that the folded state of the electronic device 200 is the folded state based on detecting a change in which the first capacitance and the second capacitance increase.
  • the electronic device 200 when the electronic device 200 transitions from the unfolded state or the folded state to the intermediate state, only a change in capacitance of one of a change in the first capacitance and a change in the second capacitance may be detected. have.
  • a change in one of the change in the first capacitance or the change in the second capacitance may be detected, and based on this, a change in the increase in the capacitance of the electronic device 200 may be detected. It can be determined that (200) is an intermediate state.
  • the electronic device 200 transitions from the folded state to the intermediate state, a change in which one of the change in the first capacitance or the change in the second capacitance becomes smaller may be detected. Based on this, it may be determined that the folded state of the electronic device 200 is an intermediate state.
  • a change in capacitance of one of a change in the first capacitance and a change in the second capacitance may be detected.
  • the electronic device 200 transitions from the intermediate state to the folded state, it is possible to detect a change in the capacitance of one of a change in the first capacitance or a change in the second capacitance, which increases based on this. Accordingly, it may be determined that the folded state of the electronic device 200 is an intermediate state.
  • the electronic device 200 may control the electronic device 200 to operate in an operation mode corresponding to the folded state of the electronic device 200 .
  • the electronic device 200 may display content through a flexible display (eg, the flexible display 500 of FIG. 5 ).
  • a flexible display eg, the flexible display 500 of FIG. 5
  • the electronic device 200 displays state information of the electronic device 200 through a sub-display (eg, the sub-display 231 of FIG. 3A ). can be displayed.
  • a sub-display eg, the sub-display 231 of FIG. 3A
  • the electronic device 200 turns off the sub-display 231 and waits for the electronic device 200 It can be controlled to operate in a mode (eg, power saving mode).
  • the electronic device 200 when the folded state of the electronic device 200 is confirmed as the intermediate state, the electronic device 200 includes a display area corresponding to the first surface (eg, the first surface 211 of FIG. 2B );
  • the flexible display 500 may be controlled to display different contents on the display area corresponding to the three sides (eg, the third side 221 of FIG. 2B ).
  • the first touch sensor 610 may include a plurality of first touch sensors (eg, the plurality of first touch sensors 610a, 610b, ..., 610n of FIGS.
  • the second touch sensor 620 may include a plurality of second touch sensors (eg, the plurality of second touch sensors 620a, 620b, ..., 620n of FIGS. 10A and 10B ).
  • a change in first capacitance and a second conductive plate according to a change in the distance between the first conductive plate 571 and each of the plurality of first touch sensors 610a, 610b, 610c, ..., 610n Based on a change in the second capacitance as the distance between the 572 and each of the plurality of second touch sensors 620a, 620b, 620c, ..., 620n is changed, the folding state of the electronic device 200 is checked.
  • the electronic device 200 in the method of operating the electronic device 200 for detecting a folding state, includes a hinge module (eg, the hinge device 240 of FIG. 2B ) and the hinge module 240 . ) of a first housing (eg, the first housing 210 of FIG. 2A ) to which at least a part of the first side is coupled, and at least a part of the second side of the hinge module 240 is coupled, and the hinge module is used a second housing (eg, the second housing 220 of FIG.
  • a hinge module eg, the hinge device 240 of FIG. 2B
  • the flexible display 500 supported on the upper part of the 210 and the second housing 220 and configured to be foldable and unfoldable is disposed on the lower surface of the flexible display 500 and faces the first housing 210 .
  • a wiring member including a touch sensor 620 (eg, a wiring member 280 of FIGS. 6A and 6B ) is included, and the method includes the first conductive plate 571 and the first touch sensor ( 610) Checking the change of the first capacitance as the distance between them is changed and/or the change of the second capacitance as the distance between the second conductive plate 572 and the second touch sensor 620 is changed , and checking a folding state of the electronic device 200 based on a change in the first capacitance and/or a change in the second capacitance.
  • the electronic device 200 includes a hinge module (eg, the hinge device 240 of FIG. 2B ), a first housing (eg, a first side of the hinge module 240 ) coupled to at least a part of it.
  • the first housing 210 of FIG. 2A ) and at least a portion of the second side of the hinge module 240 are coupled to each other, and the first housing 210 of FIG.
  • the first housing 210 and the second housing eg, the second housing 220 of FIG.
  • a flexible display 500 configured to be foldable and unfoldable, a first conductive plate 571 and a second housing 220 disposed on a lower surface of the flexible display 500 and facing the first housing 210 and the second housing 220;
  • a second conductive plate 572 facing each other, disposed under the first housing 210 and the second housing 220, a bent region (eg, a bent region 630 in FIG. 6B ), the bent region (
  • a wiring member 280 of 6b a wiring member 280 of 6b
  • a processor operatively connected to the first touch sensor 610 and the second touch sensor 620 (eg, the processor 120 of FIG. 1 ), wherein the processor Reference numeral 120 denotes a change in first capacitance as the distance between the first conductive plate 571 and the first touch sensor 610 is changed and/or a change between the second conductive plate 572 and the second touch.
  • the first touch sensor 610 and the second touch sensor 620 may include the first conductive plate 571 and The second conductive plate 572 may be disposed at the first point and the second point of the bent region 630 at which it can be detected.
  • the first touch sensor 610 and the second touch sensor 620 are based on the folding axis (eg, the folding axis A) when the electronic device 200 is in a folded state. may be disposed at the first point and the second point of the bent region 630 at positions corresponding to each other.
  • the first point of the bent region 630 includes a point corresponding to one side of the first conductive plate 571 when the electronic device 200 is folded, and the bent region The second point 630 may include a point corresponding to one side of the second conductive plate 572 in the folded state of the electronic device 200 .
  • the wiring member 280 may include a plurality of wiring layers (eg, a plurality of wiring layers 1310 of FIG. 13 ).
  • each of the plurality of wiring layers 1310 includes a conductive layer (eg, the conductive layers 1310aa, 1310ba, ..., 1310na of FIG. 13 ) and a rear surface of the conductive layers 1310aa, 1310ba, ..., 1310na). It may be formed of an insulating layer (eg, the insulating layers 1310ab, 1310bb, ..., 1310nb of FIG. 13 ) disposed on the .
  • the first touch sensor 610 and the second touch sensor 620 may include the first of the conductive layer 1310aa of the first wiring layer 1310a among the plurality of wiring layers 1310 . It may be disposed at a point and the second point.
  • the first point and the second point of the conductive layer 1310aa of the first wiring layer 1310a on which the first touch sensor 610 and the second touch sensor 620 are disposed The first and second points of the conductive layer 1310ba of the second wiring layer 1310b disposed on the rear surface of the first wiring layer 1310a corresponding to 1400)) and may be grounded.
  • the mesh pattern 1400 is a grid-type mesh pattern (eg, reference numbers ⁇ 1410> and ⁇ 1450> of FIG. 14, reference numbers ⁇ 1510>, ⁇ 1520>, and ⁇ 1530 of FIG. >) and/or a cross-type mesh pattern (eg, reference numbers ⁇ 1430> and ⁇ 1470> of FIG. 14 and reference numbers ⁇ 1540>, ⁇ 1550>, and ⁇ 1560> of FIG. 15).
  • a grid-type mesh pattern eg, reference numbers ⁇ 1410> and ⁇ 1450> of FIG. 14, reference numbers ⁇ 1510>, ⁇ 1520>, and ⁇ 1530 of FIG. >
  • a cross-type mesh pattern eg, reference numbers ⁇ 1430> and ⁇ 1470> of FIG. 14 and reference numbers ⁇ 1540>, ⁇ 1550>, and ⁇ 1560> of FIG. 15.
  • a change in the first capacitance and the second conductive plate 572 in which the capacitance decreases as the distance between the first conductive plate 571 and the first touch sensor 610 is changed.
  • a change in the second capacitance which decreases in capacitance due to a change in the distance between the second touch sensor 620 and the second touch sensor 620, is detected, it may be set to confirm that the folded state of the electronic device 200 is an unfolded state.
  • the capacitance increases as the distance between the first conductive plate 571 and the first touch sensor 610 changes in the folded state of the electronic device 200 in the unfolded state.
  • the electronic device It may be set to confirm that the folding state of 200 is an intermediate state.
  • the capacitance increases as the distance between the first conductive plate 571 and the first touch sensor 610 is changed. Detecting a change in the second capacitance in which the capacitance increases as the first capacitance increases or the distance between the second conductive plate 572 and the second touch sensor 620 changes In this case, it may be set to confirm that the folded state of the electronic device 200 is the folded state.
  • the first capacitance increases as the capacitance increases, and the second conductive plate 572 and
  • it may be set to confirm that the folded state of the electronic device 200 is a folded state.
  • the capacitance decreases as the distance between the first conductive plate 571 and the first touch sensor 610 is changed.
  • the It may be set to confirm that the folded state of the electronic device 200 is an intermediate state.
  • the capacitance decreases as the distance between the first conductive plate 571 and the first touch sensor 610 is changed.
  • the It may be set to check that the folded state of the electronic device 200 is the unfolded state.
  • the first touch sensor 610 includes a plurality of first touch sensors 610a, 610b, ..., 610n
  • the second touch sensor 620 includes a plurality of first touch sensors 610a, 610b, ..., 610n. It may include two touch sensors 620a, 620b, ..., 620n.
  • the plurality of first touch sensors 610a , 610b , ..., 610n are disposed to be spaced apart from each other at the first point of the curved area 630 at a specified interval, and
  • the two touch sensors 620a, 620b, ..., 620n may be disposed to be spaced apart from each other at the second point of the curved area 630 at a predetermined interval.
  • a change in the first capacitance as the distance between the first conductive plate 571 and each of the plurality of first touch sensors 610a, 610b, ..., 610n is changed and/or the Based on a change in the second capacitance as the distance between the second conductive plate 572 and each of the plurality of second touch sensors 620a, 620b, ..., 620n is changed, It can be set to check the folding status.
  • the processor 120 may control to operate in an operation mode corresponding to the checked folding state.
  • the processor 120 displays content through the flexible display 500 and the electronic device 200 is in the folded state.
  • the electronic device 200 is displayed through the sub-display 231 disposed to be at least partially exposed on the second surface of the first housing 210 (the second surface 212 in FIG. 3A ).
  • a display corresponding to the first surface of the first housing 210 eg, the first surface 211 of FIG. 2B
  • it may be set to display different contents in an area and a display area corresponding to the third surface of the second housing 220 (eg, the third surface 221 of FIG. 2B ).

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Signal Processing (AREA)
  • Mathematical Physics (AREA)
  • Telephone Set Structure (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Electrophonic Musical Instruments (AREA)

Abstract

Selon divers modes de réalisation de la présente divulgation, un dispositif électronique comprend : un module charnière ; un premier boîtier ayant au moins une partie couplée à un premier côté du module charnière ; un second boîtier ayant au moins une partie couplée à un second côté du module charnière, et formé pour être plié et déplié avec le premier boîtier par rapport à un axe de pliage au moyen du module charnière ; un dispositif d'affichage flexible supporté sur la partie supérieure du premier boîtier et du second boîtier et formé pour être plié et déplié ; une première plaque conductrice et une seconde plaque conductrice qui sont disposées sur la surface inférieure du dispositif d'affichage flexible, la première plaque conductrice faisant face au premier boîtier et la seconde plaque conductrice faisant face au second boîtier ; un élément de câblage disposé en dessous du premier boîtier et du second boîtier et comprenant une zone flexible, un premier capteur tactile, qui est disposé au niveau d'un premier point de la zone flexible, et un second capteur tactile qui est disposé au niveau d'un second point de la zone flexible ; et un processeur connecté fonctionnellement au premier capteur tactile et au second capteur tactile, le processeur pouvant être configuré pour : confirmer un changement d'une première capacité en fonction d'un changement de la distance entre la première plaque conductrice et le premier capteur tactile et/ou un changement d'une seconde capacité en fonction d'un changement de la distance entre la seconde plaque conductrice et le second capteur tactile ; et confirmer un état de pliage du dispositif électronique, sur la base du changement de la première capacité et/ou du changement de la seconde capacité. Divers modes de réalisation autres que ceux divulgués dans le présent document sont également possibles.
PCT/KR2022/001830 2021-03-11 2022-02-07 Dispositif électronique pliable détectant un état de pliage, et son procédé de fonctionnement WO2022191440A1 (fr)

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WO2024158269A1 (fr) * 2023-01-27 2024-08-02 삼성전자 주식회사 Dispositif électronique comprenant un affichage flexible et procédé d'identification d'état plié ou d'état déplié

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JP2017107478A (ja) * 2015-12-11 2017-06-15 アルプス電気株式会社 折曲検知可能なタッチセンサおよび折曲検知可能な表示装置
US20180088633A1 (en) * 2016-09-28 2018-03-29 Microsoft Technology Licensing, Llc Opening state detection of a foldable device using self-capacitance
CN110109513A (zh) * 2019-04-22 2019-08-09 武汉华星光电半导体显示技术有限公司 可折叠显示屏
WO2020107401A1 (fr) * 2018-11-30 2020-06-04 华为技术有限公司 Procédé de commande de mise sous tension/hors tension d'écran, appareil de commande de mise sous tension/hors tension d'écran et dispositif électronique
KR20200140609A (ko) * 2019-06-07 2020-12-16 삼성전자주식회사 폴더블 전자 장치 및 상기 폴더블 전자 장치에서 정보를 표시하는 방법

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017107478A (ja) * 2015-12-11 2017-06-15 アルプス電気株式会社 折曲検知可能なタッチセンサおよび折曲検知可能な表示装置
US20180088633A1 (en) * 2016-09-28 2018-03-29 Microsoft Technology Licensing, Llc Opening state detection of a foldable device using self-capacitance
WO2020107401A1 (fr) * 2018-11-30 2020-06-04 华为技术有限公司 Procédé de commande de mise sous tension/hors tension d'écran, appareil de commande de mise sous tension/hors tension d'écran et dispositif électronique
CN110109513A (zh) * 2019-04-22 2019-08-09 武汉华星光电半导体显示技术有限公司 可折叠显示屏
KR20200140609A (ko) * 2019-06-07 2020-12-16 삼성전자주식회사 폴더블 전자 장치 및 상기 폴더블 전자 장치에서 정보를 표시하는 방법

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