WO2022108198A1 - Module d'affichage et dispositif électronique le comprenant - Google Patents

Module d'affichage et dispositif électronique le comprenant Download PDF

Info

Publication number
WO2022108198A1
WO2022108198A1 PCT/KR2021/015889 KR2021015889W WO2022108198A1 WO 2022108198 A1 WO2022108198 A1 WO 2022108198A1 KR 2021015889 W KR2021015889 W KR 2021015889W WO 2022108198 A1 WO2022108198 A1 WO 2022108198A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
electronic device
module
adhesive
display module
Prior art date
Application number
PCT/KR2021/015889
Other languages
English (en)
Korean (ko)
Inventor
안성호
우성관
정헌조
Original Assignee
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020200189665A external-priority patent/KR20220067458A/ko
Application filed by 삼성전자 주식회사 filed Critical 삼성전자 주식회사
Publication of WO2022108198A1 publication Critical patent/WO2022108198A1/fr

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements

Definitions

  • Embodiments disclosed in this document relate to a display module and an electronic device including the same.
  • the electronic device may include a display module that forms a partial surface of the electronic device.
  • the display module may be formed to be at least partially flexible.
  • the flexible region may have a curved surface.
  • the flexible area may form a part of a side surface of the electronic device. For example, when the electronic device is viewed from the side, at least a portion of the display module may be visually exposed.
  • the flexible area of the display module may have low brittleness and low strength. Due to the low strength, the display module may be vulnerable to external impact. For example, a defect may occur in the display panel and/or the display module due to an external impact. For example, due to defects in pixels and/or wirings constituting the display module, line defects, point defects (eg bright spots, dark spots), crosstalk ( cross talk, and/or pixel shrinkage may occur.
  • the electronic device and/or the display module may include a display panel that generally includes an additional polyimide (PI) layer and a sponge to reinforce low strength. Additional layers may increase the overall thickness of the display panel and/or display module.
  • PI polyimide
  • a display module including a different structure, shape, and/or material in an area requiring surface quality and an area requiring strength against impact, respectively, and an electronic device including the same would like to provide
  • An electronic device may include: a housing; and a display module disposed in the housing, the display module comprising a substantially planar flat area and a curved area extending from an edge of the flat area; comprising: a cover layer forming at least a portion of a surface of the electronic device; a display panel disposed under the cover layer and including a light emitting device; a first layer disposed under the display panel; a second layer disposed below the first layer and comprising a metallic material; and a support layer disposed between the first layer and the second layer, wherein the support layer includes a first portion included in the flat area and a second portion included in the curved area;
  • the support layer may be configured such that each of the first portion and the second portion includes a different structure, shape, and/or material.
  • a slideable electronic device includes a first structure; a second structure slidably coupled to the first structure and at least a portion of which surrounds the first structure; a cover coupled to the first structure, the cover forming at least a portion of a rear surface of the slideable electronic device; and a display module disposed on the second structure to move together with the second structure, wherein the slideable electronic device substantially overlaps a first edge of the first structure and a second edge of the second structure a first state, and a second state in which the second edge of the second structure is spaced apart from the first edge of the first structure in a sliding direction, wherein the display module includes the first state and the second In each of the states, a first region forming a front surface of the slideable electronic device, a second region positioned in a space between the first structure and the cover in each of the first state and the second state, and the second region and a bending region formed between the first region and the second region and deformable to a flat or curved surface, wherein
  • the display module according to the embodiments disclosed in this document may provide a relatively high strength capable of withstanding an external impact while ensuring surface quality.
  • FIG. 1 is a front perspective view of an electronic device according to an exemplary embodiment
  • FIG. 2 is a rear perspective view of an electronic device according to an exemplary embodiment
  • FIG 3 is an exploded perspective view of an electronic device according to an exemplary embodiment.
  • FIG. 4 is a plan view of a display module of an electronic device according to an exemplary embodiment.
  • 5A is a diagram illustrating a first state of an electronic device according to another exemplary embodiment.
  • 5B is a diagram illustrating a first state of an electronic device according to another exemplary embodiment.
  • FIG. 6 is a cross-sectional view of a display module of an electronic device according to an exemplary embodiment.
  • FIG. 7A is a diagram illustrating a first structure and a second structure of a display module of an electronic device according to an exemplary embodiment.
  • FIG. 7B is a diagram illustrating a first structure and a second structure of a display module of an electronic device according to an exemplary embodiment.
  • FIG. 8A is a diagram illustrating a first structure and a second structure of a display module of an electronic device according to various embodiments of the present disclosure
  • FIG. 8B is a diagram illustrating a first structure and a second structure of a display module of an electronic device according to various embodiments of the present disclosure
  • FIG. 9 is a diagram illustrating the support layer shown in FIG. 8A or FIG. 8B .
  • FIG. 10 is a diagram illustrating a part of a method of manufacturing a support layer according to various embodiments of the present disclosure
  • FIG. 11 is a block diagram of an electronic device in a network environment, according to various embodiments of the present disclosure.
  • 1 is a front perspective view of an electronic device according to an exemplary embodiment
  • 2 is a rear perspective view of an electronic device according to an exemplary embodiment
  • the electronic device 100 includes a first surface (or front surface) 110A, a second surface (or rear surface) 110B, and a first surface 110A and a second surface ( 110B) and may include a housing 110 including a side surface 110C surrounding the space therebetween.
  • the housing 110 may refer to a structure that forms part of the first surface 110A, the second surface 110B, and the side surface 110C.
  • the first surface 110A may be formed by the front plate 102 (eg, the front plate 120 of FIG. 3 ) at least a portion of which is substantially transparent.
  • the front plate 102 may include a glass plate comprising various coating layers, or a polymer plate.
  • the second surface 110B may be formed by a substantially opaque rear plate 111 (eg, the rear plate 180 of FIG. 3 ).
  • the back plate 111 is formed by, for example, coated or colored glass, ceramic, polymer, metal (eg, aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials.
  • the side surface 110C is coupled to the front plate 102 and the rear plate 111 and may be formed by a side bezel structure (or “frame structure”) 118 including a metal and/or a polymer.
  • the back plate 111 and the side bezel structure 118 may be integrally formed and made of the same material (eg, a metal material such as aluminum). may include
  • the front plate 102 may include two first regions 110D that extend seamlessly from a partial region of the first surface 110A to the rear plate 111 direction. have.
  • the first regions 110D may be positioned at both ends of a long edge of the front plate 102 .
  • the rear plate 111 may include two second regions 110E that are curved and extend seamlessly in the direction of the front plate 102 from a partial region of the second surface 110B.
  • the second regions 110E may be included at both ends of the long edge of the back plate 111 .
  • the front plate 102 (or the back plate 111 ) may include only one of the first regions 110D (or the second regions 110E). Also, in another embodiment, the front plate 102 (or the rear plate 111 ) may not include some of the first regions 110D (or the second regions 110E).
  • the first areas 110D or the second areas 110E as described above are not included in the lateral direction (eg: short side) may have a first thickness (or width), and may have a second thickness thinner than the first thickness in a lateral direction (eg, a long side) including the first regions 110D or second regions 110E. have.
  • the side bezel structure 118 may be integrally formed with the back plate 111 .
  • the electronic device 100 includes a display 101 (eg, the display 130 of FIG. 3 , the display module 1160 of FIG. 11 ), the audio modules 103 , 104 , 107 , and a sensor module (eg, the display module 1160 of FIG. 11 ).
  • the sensor module 1176 of FIG. 11 the sensor module 1176 of FIG. 11
  • camera modules 105 and 112 eg, the camera module 1180 of FIG. 11
  • a connector hole 108 may include at least one of.
  • the electronic device 100 may omit at least one of the components (eg, the key input device 117 or a light emitting device (not shown)) or additionally include other components.
  • the display 101 may be exposed through at least a portion of the front plate 102 .
  • at least a portion of the display 101 may be exposed through the front plate 102 including the first surface 110A and the first areas 110D of the side surface 110C.
  • the shape of the display 101 may be substantially the same as an adjacent outer shape of the front plate 102 .
  • the distance between the outer periphery of the display 101 and the outer periphery of the front plate 102 may be substantially the same.
  • the surface (or front plate 102 ) of the housing 110 may include a screen display area in which the display 101 is visually exposed and content is displayed via pixels.
  • the screen display area may include a first surface 110A and side first areas 110D.
  • the display 101 may include a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and/or a digitizer detecting a magnetic field type stylus pen, or adjacent to the display 101 . can be placed.
  • the screen display areas 110A and 110D may include a sensing area 110F and/or a camera area 110G.
  • the sensing region 110F may be at least partially overlapped with the screen display regions 110A and 110D.
  • the sensing area 110F may display content like other areas of the screen display areas 110A and 110D, and may additionally mean an area through which an input signal related to the second sensor module 106 passes.
  • the second sensor module 106 is disposed below the screen display areas 110A and 110D, and the sensing area 110F may be formed in at least a portion of the screen display areas 110A and 110D. have.
  • the second sensor module 106 may be configured to receive an input signal transmitted through the sensing region 110F and generate an electrical signal based on the received input signal.
  • the input signal may have a specified physical quantity (eg, heat, light, temperature, sound, pressure, ultrasound).
  • the input signal may include a signal related to the user's biometric information (eg, fingerprint).
  • the second sensor module 106 may include an optical fingerprint sensor configured to receive light.
  • the second sensor module 106 is configured to receive an optical signal emitted from a pixel included in the display 101 , reflected by a fingerprint of a user's finger, and transmitted through the sensing region 110F. can be configured.
  • the second sensor module 106 may include an ultrasonic fingerprint sensor configured to transmit and receive ultrasonic waves.
  • the second sensor module 106 may be configured to transmit an ultrasonic wave toward a fingerprint of a user's finger and receive an ultrasonic wave reflected by the finger and transmitted through the sensing region 110F.
  • the camera area may be at least partially overlapped with the screen display areas 110A and 110D.
  • the camera area 110G can display content like other areas of the screen display areas 110A and 110D, and additionally means an area (eg, a transmission area) through which an optical signal related to the first camera module 105 is transmitted. can do.
  • the camera area 110G may be configured to display content when the first camera module 105 is not operating, like other areas of the screen display areas 110A and 110D.
  • the camera region 110G of the display 110 may be formed as a transmissive region having a specified transmittance, and the transmissive region may be formed to have a transmittance in a range of about 20% to about 40%.
  • the transmission area includes an area overlapping with an effective area (eg, field of view, FOV) of the first camera module 105 through which light for generating an image by being imaged by an image sensor passes. can do.
  • the transmissive area of the display 110 may include an area having a lower pixel density and/or wiring density than the surrounding area.
  • the first camera module 105 may be disposed below the screen display areas 110A and 110D, and may be configured to receive light passing through the camera area 110G.
  • the light received by the first camera module 105 may include light reflected by or emitted from the subject.
  • the first camera module 105 may be configured to generate an electrical signal related to the image based on the received light.
  • the first camera module 105 may not be exposed as a surface (eg, the front surface 110A) of the electronic device 100 .
  • the first camera module 105 may be covered by content displayed in the camera area 110G.
  • the optical axis of the lens included in the first camera module 105 may be disposed to pass through the camera area 110G included in the display 101 .
  • the second camera module 112 may include a plurality of camera modules (eg, a dual camera, a triple camera, or a quad camera).
  • the second camera module 112 is not necessarily limited to including a plurality of camera modules, and may include one camera module.
  • the first camera module 105 and/or the second camera module 112 may include one or more lenses, an image sensor, and/or an image signal processor.
  • the flash 113 may include, for example, a light emitting diode or a xenon lamp.
  • two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors are disposed inside the housing so that one side (eg, the second side 110B) of the electronic device 100 faces. ) can be placed in
  • the sensor module eg, the sensor module 1176 of FIG. 11
  • the second sensor module 106 may include electricity corresponding to an internal operating state of the electronic device 100 or an external environmental state. It can generate signals or data values.
  • the sensor module (not shown) includes the first surface 110A, the second surface 110B, or the side surface 110C (eg, the first regions 110D and/or the housing 110 ). It may be disposed in at least a portion of the second regions 110E).
  • a sensor module eg, sensor module 1176 of FIG. 11
  • second sensor module 106 may include a proximity sensor, an HRM sensor, a fingerprint sensor, a gesture sensor, a gyro sensor, a barometric pressure sensor, and a magnetic sensor.
  • an acceleration sensor e.g., a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, and at least one of an illuminance sensor.
  • the fingerprint sensor may be disposed on the second surface 110B.
  • the audio module 103 , 104 , 107 may include a microphone hole 103 , 104 and a speaker hole 107 .
  • the microphone holes 103 and 104 may include a first microphone hole 103 formed in a partial area of the side surface 110C and a microphone hole 104 formed in a partial area of the second surface 110B. have.
  • a microphone for acquiring an external sound may be disposed inside the housing 110 .
  • the microphone may include a plurality of microphones to detect the direction of sound.
  • the second microphone hole 104 formed in a partial region of the second surface 110B may be disposed adjacent to the camera modules 105 and 112 .
  • the second microphone hole 104 may acquire a sound when the camera modules 105 and 112 are executed or a sound when other functions are executed.
  • the speaker hole 107 may include a receiver hole for a call (not shown).
  • the speaker hole 107 may be formed in a portion of the side surface 110C of the electronic device 100 .
  • the speaker hole 107 may be implemented as a single hole with the microphone hole 103 .
  • a receiver hole for a call may be formed in another part of the side surface 110C.
  • the receiver hole for a call is a part of the side 110C on which the speaker hole 107 is formed (eg, a part facing the -Y-axis direction) and another part of the side 110C facing (eg: +Y-axis direction).
  • the electronic device 100 may include a speaker fluidly connected to the speaker hole 107 so that a fluid flows.
  • the speaker may include a piezo speaker in which the speaker hole 107 is omitted.
  • the key input device 117 may be disposed on the side surface 110C of the housing 110 (eg, the first regions 110D and/or the second regions 110E).
  • the electronic device 100 may not include some or all of the key input devices 117 , and the not included key input devices 117 may be in other forms such as soft keys on the display 101 .
  • the key input device may include the second sensor module 106 forming the sensing area 110F included in the screen display areas 110A and 110D.
  • the connector hole 108 may receive a connector.
  • the connector hole 108 may be disposed on the side surface 110C of the housing 110 .
  • the connector hole 108 may be disposed on the side surface 110C to be adjacent to at least a portion of the audio module (eg, the microphone hole 103 and the speaker hole 107 ).
  • the electronic device 100 includes a first connector hole 108 that can accommodate a connector (eg, a USB connector) for transmitting/receiving power and/or data with an external electronic device and/or an external electronic device. It may include a second connector hole (not shown) capable of accommodating a connector (eg, an earphone jack) for transmitting/receiving a device and an audio signal.
  • a connector eg, an earphone jack
  • the electronic device 100 may include a light emitting device (not shown).
  • the light emitting device (not shown) may be disposed on the first surface 110A of the housing 110 .
  • the light emitting device (not shown) may provide state information of the electronic device 100 in the form of light.
  • the light emitting device (not shown) may provide a light source that is interlocked with the operation of the first camera module 105 .
  • the light emitting device (not shown) may include an LED, an IR LED, and/or a xenon lamp.
  • the electronic device 100 has a bar-type or plate-type appearance, but is not limited thereto.
  • the illustrated electronic device 100 may include a foldable electronic device, a slideable electronic device, a stretchable electronic device, and/or a rollable electronic device ( rollable electronic device).
  • the foldable electronic device, the slideable electronic device, the stretchable electronic device, and/or the rollable electronic device are configured to mechanically operate so that a screen display area is expanded or reduced according to a user's selection, and corresponds to the mechanical operation It may include a display configured to be deformed in shape.
  • the display may include an area bendable to a flat or curved surface.
  • the display may be formed to be foldable, unfolded, slidable, or rolled in response to a mechanical operation of the electronic device.
  • FIG. 3 is an exploded perspective view of an electronic device according to an exemplary embodiment
  • the electronic device 100 includes a front plate 120 (eg, the front plate 102 of FIG. 1 , the cover layer 410 of FIG. 6 ), and a display 130 (eg, of FIG. 1 ).
  • display 101 a first support member 140 (eg, a bracket), a printed circuit board 150 (eg, a printed circuit board (PCB), flexible PCB (FPCB), or rigid-flexible PCB (RFPCB));
  • the battery 152, the second support member 160 eg, the rear case), the antenna 170, the rear plate 180 (eg, the rear plate 111 of FIG. 2), the second sensor module 106, It may include a first camera module 105 and a second camera module 112 .
  • the display 130 and the front plate 120 may be referred to as the display module 200 of FIG. 4 or the display module 400 of FIG. 6 .
  • the front plate 120 may be referred to as the cover layer 410 of FIG. 6 .
  • the side bezel structure 141 of the front plate 120 , the back plate 180 , and the first support member 140 forms a housing (eg, the housing 110 of FIGS. 1 and 2 ). can do.
  • the front plate 120 , the back plate 180 , and the first support member 140 may include a detachable structure (eg, the first structure 310 and the second structure 320 of FIGS. 5A and 5B ). )), each structure in which at least a portion of the display 130 , the printed circuit board 150 , the battery 152 , the second support member 160 , and/or the antenna 170 will be disposed.
  • a detachable structure eg, the first structure 310 and the second structure 320 of FIGS. 5A and 5B ).
  • the electronic device 100 may omit at least one of the components (eg, the first support member 140 or the second support member 160 ) or additionally include other components. . At least one of the components of the electronic device 100 may be the same as or similar to at least one of the components of the electronic device 100 of FIG. 1 or FIG. 2 , and overlapping descriptions will be omitted below.
  • the display 130 may be coupled or positioned on one surface of the first support member 140 and the printed circuit board 150 may be coupled or positioned on the other surface.
  • the first support member 140 may include a side bezel structure 141 (eg, the side bezel structure 118 of FIG. 1 ) and a plate structure 142 .
  • the side bezel structure 141 may form at least a portion of a surface (eg, the side surface 110C) of the electronic device.
  • the side bezel structure 141 may be formed to connect edges of the front plate 120 and the rear plate 180, respectively.
  • the display 130 and the printed circuit board 150 may be coupled or positioned on the plate structure 142 .
  • the plate structure 142 may be positioned in a space between the front plate 120 and the rear plate 180 .
  • the plate structure 142 may at least partially face the display 130 .
  • the plate structure 142 is formed for each region (eg, the first support member 140 ) based on the structure, shape, and/or material of the rear panel of the display 130 (eg, the rear panel 400b of FIG. 6 ). ) may be formed differently for each region).
  • the first support member 140 may be formed of, for example, a metal material and/or a non-metal (eg, polymer) material.
  • the side bezel structure 141 and the plate structure 142 may be integrally formed or may be detachably coupled.
  • a processor, memory, and/or an interface may be disposed on the printed circuit board 150 .
  • the processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.
  • the memory may include, for example, volatile memory or non-volatile memory.
  • the interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface.
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • the interface may, for example, electrically or physically connect the electronic device 100 to an external electronic device, and may include a USB connector, an SD card/MMC connector, or an audio connector.
  • the battery 152 is a device for supplying power to at least one component of the electronic device 100 , for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell. may include. At least a portion of the battery 152 may be disposed substantially coplanar with the printed circuit board 150 , for example. The battery 152 may be integrally disposed inside the electronic device 100 , or may be disposed detachably from the electronic device 100 .
  • the antenna 170 may be disposed between the back plate 180 and the battery 152 .
  • the antenna 170 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna.
  • the antenna 170 may, for example, perform short-range communication with an external device or wirelessly transmit/receive power required for charging.
  • the antenna 170 may be provided by a portion of the first support member 140 .
  • the antenna 170 may be provided by a portion or combination of each of a side bezel structure and/or a plate structure.
  • the first camera module 105 (eg, an under display camera, UDC) may be at least partially accommodated in the first recess 130a formed in the display 130 .
  • the first recess 130a may include an opening passing through the rear panel (eg, the rear panel 400b of FIG. 6 ).
  • the opening or the first recess 130a may be formed in consideration of a field of view (FOV) of the first camera module 105 .
  • the first camera module 105 receives light transmitted through a partial area (eg, the camera area 110G) of the front panel of the display 130 (eg, the front panel 400a of FIG. 6 ). can do.
  • the first camera module 105 may be disposed such that the optical axis L passes through the camera area 110G.
  • the first camera module 105 may be coupled to some layer of the display 130 (eg, the display panel 420 of FIG. 6 ) or located in an internal structure (eg, the plate structure 142 ). have.
  • the first camera module 105 may be attached to the rear surface of some layers of the display 130 (eg, the display panel 420 of FIG. 6 ).
  • the second sensor module 106 may be at least partially received in the second recess 130b formed in the display 130 .
  • the second recess 130b may include an opening passing through the rear panel (eg, the rear panel 400b of FIG. 6 ).
  • the second sensor module 106 receives an input signal passing through a partial region (eg, the sensing region 110F) of the front panel of the display 130 (eg, the front panel 400a of FIG. 6 ). can do.
  • the second sensor module 106 may be disposed such that at least a part thereof is located inside the second recess 130b.
  • the second sensor module 106 may be attached to the rear surface of the front panel of the display 130 (eg, the front panel 400a of FIG. 6 ).
  • the first camera module 105 is at least partially received in the first recess 130a and the second sensor module 106 is at least partially received in the second recess 130b, such that the electronic device A thickness of (100) (eg, a thickness in the z-axis direction) may be reduced.
  • the first camera module 105 may include a punch hole camera (not shown) that is at least partially accommodated in a punch hole formed in the display 130 .
  • the punch hole may include an opening passing through the display panel 420 and the rear panel 400b of the display module 400 of FIG. 6 .
  • the punch hole may be understood as extending the illustrated first recess 130a to the display panel (eg, the display panel 420 of FIG. 6 ).
  • the punch hole camera may receive light passing through a partial area (eg, the camera area 110G) of the front plate 120 (eg, the cover layer 410 of FIG. 6 ). In the above embodiment, content may not be displayed in the camera area 110G.
  • the second camera module 112 may be configured to receive light through the second camera area 184 formed on the rear plate 180 .
  • the second camera area 184 may include a transparent area.
  • the second camera module 112 may include a plurality of camera modules (eg, a dual camera, a triple camera, or a quad camera).
  • FIG. 4 is a diagram illustrating a plan view of a display module of an electronic device according to an exemplary embodiment.
  • the display module 200 may include a flat area 201 and a curved area 202 extending from an edge of the flat area 201 .
  • the flat area 201 may form the first surface 110A of FIG. 1
  • the curved area 202 may form the first areas 110D of FIG. 1 .
  • the display module 200 may be understood to include the display 130 and the front plate 120 of FIG. 3 .
  • the display module 200 may include a flat area 201 and a curved area 202 .
  • the flat region 201 may form at least a portion of the front surface (eg, the first surface 110A of FIG. 1 ) of the electronic device 100 .
  • the flat area 201 may be formed to be substantially flat when the display module 200 is viewed from above (eg, the +z axis of FIG. 3 ).
  • the normal vector of the flat region 201 may be a vector parallel to the z-axis.
  • the flat region 201 may include a pair of first edges P1 that are substantially parallel to each other, and a pair of second edges P2 that are substantially parallel to each other.
  • the pair of first edges P1 and the pair of second edges P2 may extend in a direction substantially perpendicular to each other.
  • the pair of first edges P1 may be substantially parallel to the y-axis direction
  • the pair of second edges P2 may be substantially parallel to the x-axis direction.
  • the pair of first edges P1 and the pair of second edges P2 may be curvedly connected by corner edges.
  • the curved region 202 may be connected to at least one of the pair of first edges P1 of the flat region 201 .
  • the curved region 202 may be connected to at least one of the pair of second edges P2 of the flat region 201 .
  • a curved region 202 may be connected to a corner edge.
  • at least one of the pair of second edges P2 of the flat area 201 forms an edge of the display module 200, and a housing (eg, FIG. It may be connected to a frame structure (eg, the side bezel structure 118 of FIG. 1 ) of the housing 110 of FIG. 1 .
  • the curved region 202 may be formed to have a curved surface.
  • the curved area 202 may include a bent area extending from the flat area 201 .
  • the curved region 202 may form a part of a front surface and a part of a side surface of the electronic device 100 (eg, the first regions 110D of FIG. 1 ).
  • the curved region 202 forms the front surface of the electronic device 100 together with the flat region 201
  • the side surface of the electronic device may be formed together with the frame structure (eg, the side bezel structure 118 of FIG. 1 ).
  • the curved region 202 may be formed to surround at least a portion of the periphery of the flat region 201 when the electronic device 100 is viewed from above (eg, the +z axis of FIG. 3 ). .
  • the curved region 202 may extend from a pair of first edges P1 and a pair of second edges P2 of the flat region 201 .
  • the curved area 202 extends from a pair of first edges P1 , a pair of second edges P2 , and corner edges, and is a flat area. It may be formed to surround 201 .
  • FIG. 4A the curved area 202 extends from a pair of first edges P1 , a pair of second edges P2 , and corner edges, and is a flat area. It may be formed to surround 201 .
  • the curved region 202 may extend from a pair of first edges P1 of the flat region 201 . In various embodiments, the curved region 202 may extend from any one of the pair of first edges P1 or from any one of the pair of second edges P2 .
  • the curved area 202 may form an edge of the display module 200 .
  • the curved region 202 may be connected to a side bezel structure of the housing (eg, the side bezel structure 118 of FIG. 1 ).
  • the flat area 201 of the display module 200 may include the first structure 401 illustrated in FIGS. 7A, 7B, 8A, and 8B, and is curved
  • the de region 202 may include the second structure 402 shown in FIGS. 7A, 7B, 8A, and 8B.
  • 5A is a diagram illustrating a first state of a slideable electronic device according to an exemplary embodiment.
  • 5B is a diagram illustrating a second state of a slideable electronic device according to an exemplary embodiment.
  • the slideable electronic device 300 may include a first state illustrated in FIG. 5A and a second state illustrated in FIG. 5B .
  • the first state and the second state may be determined according to a relative position of the second structure 320 with respect to the first structure 310 .
  • the first state may include a state in which the first edge A1 of the first structure 310 and the second edge A2 of the second structure 320 substantially overlap.
  • the second state includes a state in which the first edge A1 of the first structure 310 and the second edge A2 of the second structure 320 are spaced apart in the sliding directions S1 and S2. can do.
  • the first edge A1 and the second edge A2 may be edges extending in a direction substantially perpendicular to the sliding directions S1 and S2 (eg, the extending direction of the rolling axis R), respectively. have.
  • a display area may be formed on at least a portion of a surface of the electronic device 300 .
  • the display area is an area in which content is displayed and may be formed by the display module 330 .
  • the second state may be a state in which the display area of the electronic device 300 is wider than that of the first state.
  • the second state may include a state in which the display module 330 is visually displayed more than the first state.
  • the first state may include a state in which the display area is reduced (reduced state), and the second state may include a state in which the display area is expanded (extended state).
  • the first state may be referred to as a first shape
  • the second state may be referred to as a second shape.
  • the first shape may include a normal state, a closed state, or a slide-in state
  • the second shape may include an open state, or a slide-out state
  • the electronic device 300 may further include a third state that is an arbitrary state between the first state and the second state.
  • the third state may be referred to as a third shape
  • the third shape may include a free stop state.
  • the electronic device 300 may include a first structure 310 , a second structure 320 , a display module 330 , a cover 313 , and a roller 315 . .
  • first structure 310 and the second structure 320 may be slidably coupled.
  • first structure 310 may be a fixed structure, and at least a portion of the second structure 320 may be positioned to be movable in sliding directions S1 and S2 with respect to the first structure 310 .
  • a roller 315 rotating about the rolling axis R may be coupled to the first structure 310 .
  • the second structure 320 may be configured to surround at least a partial area of the first structure 310 .
  • the second structure 320 may be coupled to the display module 330 to slide and move together with the display module 330 .
  • the roller 315 may be configured to rotate about the rolling axis (R).
  • the roller 315 may be rotatably coupled to the first structure 310 .
  • the roller 315 may be coupled to a portion of the bending area 333 of the second structure 320 and the display module 330 .
  • the roller 315 may be configured to rotate and slide a portion of the second structure 320 and the display module 330 .
  • the roller 315 comes into contact with the bending area 333 of the display module 330 and other parts of the second structure 320 according to a change in the state of the electronic device 300 (eg, the first state and the second state). can be
  • the second structure 320 may include a multi-joint module 325 coupled to the roller 315 .
  • the articulated module 325 may include a form in which a plurality of bars extending in substantially the same direction as the rolling axis R of the roller 315 are arranged. The articulated module 325 may be bent at portions having a relatively thin thickness between the plurality of bars.
  • the multi-joint module 325 is an element that supports the display module 330 and may be referred to as a 'display support structure'. In one embodiment, the articulated module 325 may be referred to by various terms, such as a flexible track.
  • the second structure 320 may further include a tension belt 318 configured to provide tension to the second structure 320 .
  • the tension belt 318 may provide tension to the second structure 320 so that the second structure 320 in the second state moves to the first state.
  • the tension applied by the tension belt 318 may act in a direction opposite to the sliding directions S1 and S2 of the second structure 320 .
  • one side of the tension belt 318 may be connected to the articulated module 325 .
  • the rear cover 313 may form the rear surface of the electronic device 300 .
  • a space may be formed between the rear cover 313 and the first structure 310 to accommodate a portion of the second area 332 and the bending area 333 of the display module 330 .
  • a transparent region (not shown) configured to visually show a portion of the second region 332 and/or the bending region 333 of the display module 330 may be formed on the cover 313 . .
  • the display module 330 includes a bending region 333 in which a shape is deformed during the sliding operation in the first state and the second state, and the first region 331 and the second region maintaining a constant shape. (332) may be included.
  • the bending region 333 may be formed to be flexible such that it can be deformed into a flat or curved surface.
  • the first area 331 , the second area 332 , and the bending area 333 may be defined according to whether the shape is deformed during the sliding operation of the electronic device 300 .
  • the first region 331 may form the front surface of the electronic device 300 in each of the first state and the second state.
  • the first region 331 may form the front surface of the electronic device 300 together with a portion of the bending region 333 in the second state.
  • the first region 331 may move together with the second structure 320 in the first sliding direction S1 .
  • the first region 331 may move together with the second structure 320 in the second sliding direction S2 .
  • the first area 331 may include a planar area formed in a flat surface and a curved area 334 formed in a curved surface.
  • the curved region 334 may be formed at a first edge portion of the first region 331 .
  • the bending region 333 may be connected to the second edge portion of the first region 331 .
  • the first area 331 may maintain the flat area and the curved area 334 irrespective of a state change and a sliding operation of the electronic device 300 .
  • the second region 332 may be located inside the electronic device in each of the first state and the second state.
  • the second region 332 may be located in a space between the rear cover 313 and the first structure 310 in each of the first state and the second state.
  • the second region 332 when the electronic device 300 slides, the second region 332 may slide inside the electronic device 300 .
  • the second region 332 may slide in the second sliding direction S2 .
  • the second region 332 may slide in the first sliding direction S1 .
  • the second region 332 may be formed as a whole in a planar shape. In various embodiments, the second area 332 may be exposed to the rear surface of the electronic device 300 through a partial area of the rear cover 313 . The second area 332 may display content through a transparent partial area of the back cover 313 .
  • the bending region 333 may be located inside or in front of the electronic device 300 according to the state of the electronic device 300 .
  • the bending region 333 may be formed to be deformable into a flat surface or a curved surface according to the state of the electronic device 300 .
  • a partial region of the bending region 333 together with the first region 331 forms the front surface of the electronic device 300
  • another partial region is positioned inside the electronic device 300 .
  • a portion of the bending region 333 may be formed to have substantially the same plane as the first region 331 .
  • at least a portion of the bending region 333 may be formed to have a curved surface in each of the first state and the second state.
  • At least a portion of the bending region 333 may be coupled to the roller 315 and/or the articulated module 325 .
  • the portion adjacent to the first area 331 moves in the first sliding direction S1
  • the portion adjacent to the second area 332 may move in the second sliding direction S2 .
  • At least a portion of the bending region 333 may move along an arc-shaped path centered on the rolling axis R during the sliding operation.
  • the bending region 333 includes the second structure 402 shown in FIGS. 7A, 7B, 8A, and 8B, and the first region 331 and the second region 332 are shown in FIG.
  • the first structure 401 shown in FIGS. 7A, 7B, 8A and 8B may be included.
  • FIG. 6 is a cross-sectional view of a display module according to an exemplary embodiment.
  • the display module illustrated in FIG. 6 may include the display module 200 illustrated in FIG. 4 and/or the display module 330 illustrated in FIGS. 5A and 5B .
  • the display module 400 may include a front panel 400a and a rear panel 400b.
  • Each of the front panel 400a and the rear panel 400b may include a plurality of layers.
  • the rear panel 400b may refer to layers located on the rear surface of the display panel 420 .
  • the front panel 400a may include a cover layer 410 and a display panel 420 .
  • the cover layer 410 may form at least a portion of the surfaces of the electronic devices 100 and 300 .
  • the cover layer 410 may be referred to as the front plate 120 of FIGS. 1 and 3 .
  • the cover layer 410 may be formed of a transparent material to allow light emitted from the display panel 420 to pass therethrough.
  • the cover layer 410 may include a polyimide (PI) material and/or a glass material (eg, ultra thin glass (UTG)).
  • PI polyimide
  • UTG ultra thin glass
  • the cover layer 410 may protect the display module 400 from the outside and may be provided in the form of a thin film that can contribute to flexibility.
  • the cover layer 410 is at least one layer including a polymer material (eg, PET (polyester), PI (polyimide), or TPU (thermoplastic polyurethane)), a plastic film (eg, PI film) ) or a form disposed on thin glass (eg, UTG).
  • the cover layer 410 may further include a plurality of layers (layers).
  • the cover layer 410 may include a first cover (not shown) and a second cover (not shown) that are sequentially stacked on the cover layer 410 .
  • the first cover may be formed of a first material
  • the second cover may be formed of a second material different from the first material.
  • the first material may include PET or PI having relatively superior optical properties than the second material
  • the second material may include TPU, which is relatively advantageous in elasticity than the first material.
  • the display panel 420 may be disposed under the cover layer 410 .
  • the display panel 420 may be attached to the rear surface of the cover layer 410 .
  • a transparent adhesive layer including a transparent adhesive material OCA, optically clear adhesive, OCR, or SVR (super view resin)
  • OCA transparent adhesive material
  • SVR super view resin
  • the display panel 420 may include a pixel array, a TFT film, an encapsulation layer, a polarizer, and a touch electrode layer.
  • the light emitting device may include an organic light emitting diode (OLED) or a micro light emitting diode (LED).
  • an encapsulation layer eg, thin-film encapsulation (TFE)
  • TFE thin-film encapsulation
  • the transistors included in the TFT film may control the current applied to the light emitting device of the pixel array to turn on or off the pixel or adjust the brightness of the pixel.
  • It may include an (amorphous silicon) TFT, a liquid crystalline polymer (LCP) TFT, a low-temperature polycrystalline oxide (LTPO) TFT, or a low-temperature polycrystalline silicon (LTPS) TFT. Outdoor visibility can be improved, and light that is generated from the light source of the display panel 420 and vibrates in a predetermined direction can be selectively transmitted. It may include a retardation layer (or retarder) According to an embodiment, the polarizer may be omitted, and a black barrier rib (eg, pixel define (PDL)) may be formed on at least a portion of the display panel 420 to replace the polarizer.
  • PDL black barrier rib
  • the touch electrode layer includes a transparent conductive layer (or film) based on a conductive material such as indium tin oxide (ITO), or It may include a conductive pattern such as a metal mesh (eg, aluminum metal mesh), for example, a curved region (eg, the curved region of FIG. 4 ) of the display module 400 that requires flexibility. 202)) or a bending region (eg, bending region 333 in FIGS. 5A and 5B), the metal mesh It may have greater durability than the transparent conductive layer it contains.
  • the touch electrode layer may further include a pressure sensor capable of sensing the intensity (pressure) of the touch.
  • the touch electrode layer may be formed in various shapes according to positions formed on the cover layer 410 and the display panel 420 .
  • the cover layer 410 and the polarizer eg, add-on type
  • formed between the polarizer and the pixel array eg, on-cell type
  • included in the display panel 420 For example: in-cell type
  • the back panel 400b may include an embossed layer 430 , a support layer 440 , and a metal layer 450 .
  • the rear panel 400b may be attached to the rear surface of the front panel 400a.
  • the rear panel 400b may be attached to the rear surface of the display panel 420 .
  • the emboss layer 430 may be an opaque layer (eg, a black layer) including an uneven pattern (eg, an embossing pattern).
  • the embossing pattern of the embossing layer 430 may include a portion protruding toward the rear surface of the display panel 420 .
  • air bubbles may be generated in the process of attaching the display panel 420 and the rear panel 400b.
  • the embossing pattern of the embossing layer 430 may form a space and/or a passage so that the air bubbles are removed.
  • the support layer 440 may be disposed between the embossing layer 430 and the metal layer 450 .
  • the support layer 440 may be formed to reinforce the strength of the display module 400 .
  • the support layer 440 may include at least one PI layer having relatively high strength. As the number of PI layers increases, overall rigidity of the display module 400 may improve and flexibility may decrease.
  • the support layer 440 may be formed to be thicker than other layers of the rear panel 400b.
  • the support layer 440 may further include a cushion layer. It may be configured to cushion an impact applied to the display module 400 (eg, the cover layer 410 and the display panel 420 ).
  • the cushion layer may be attached to the rear surface of the embossed layer 430 .
  • the cushion layer may include a cushioning material having superelasticity.
  • the cushion layer may include a sponge.
  • the cushion layer may be formed to be deformable to cover tolerances generated during the manufacturing process.
  • the metal layer 450 may be formed to diffuse, disperse, or radiate heat generated from other elements (eg, the display panel 420 and the display driving circuit). Alternatively, the metal layer 450 may be formed to shield electromagnetic waves generated from other electrical elements of the electronic device or to shield electromagnetic waves generated from the display panel 420 .
  • the metal layer 450 may include a conductive material.
  • the metal layer 450 may include a layer in which copper (Cu (copper)), aluminum (Al (aluminum)), SUS (stainless steel), or CLAD (eg, SUS and Al are alternately disposed).
  • the metal layer 450 may include graphite for heat dissipation performance.
  • the back surface of the display panel 420 (eg, between the display panel 420 and the rear panel 400b) has an additional polymer layer (eg, a layer including PI, PET, or TPU). ) may be further arranged at least one.
  • an additional polymer layer eg, a layer including PI, PET, or TPU.
  • At least one of the plurality of layers (eg, the embossed layer 430 , the support layer 440 , and the metal layer 450 ) included in the rear panel 400b may be omitted.
  • the arrangement order of the plurality of layers included in the rear panel 400b is not limited to the embodiment of FIG. 6 and may be variously changed.
  • a support sheet (not shown) may be further included under the rear panel 400b.
  • the support sheet may be attached while covering at least a portion of the rear panel 400b.
  • the support sheet may be formed of various metallic materials (stainless steel) and/or non-metallic materials (eg, polymers, engineering plastics), and a curved area of the display module 400 that requires flexibility.
  • a lattice structure, or recesses may include
  • the grating structure may include a plurality of openings (or slits). The plurality of openings may be periodically formed, have substantially the same shape, and may be repeatedly arranged at regular intervals.
  • FIGS. 7A and 7B are cross-sectional views illustrating a first structure and a second structure of a display module of an electronic device according to an exemplary embodiment.
  • FIGS. 7A and 7B the same content as that described in FIG. 6 will be omitted.
  • the first structure 401 is a detailed cross-sectional view of the flat area 201 of the display module 200 shown in FIG. 4 .
  • the first structure 401 is a detailed cross-sectional view of the first area 331 and the second area 332 of the display module 330 shown in FIGS. 5A and 5B .
  • the first region 331 and the second region 332 may be referred to as non-bending regions.
  • the second structure 402 is a detailed cross-sectional view of the curved area 202 of the display module 200 shown in FIG. 4 .
  • the second structure 402 is a detailed cross-sectional view of the bending area 333 and the curved area 334 of the display module 330 shown in FIGS. 5A and 5B .
  • the display module 400 may include a first structure 401 and a second structure 402 that are different according to regions.
  • the first structure 401 and the second structure 402 may differ in at least one of a type and thickness of stacked layers, and materials included in the stacked layers.
  • the plurality of layers included in the display module 400 include layers continuously extending to the first structure 401 and the second structure 402 (eg, the cover layer 410 and the display panel 420 ). ), an embossing layer 430 , a metal layer 450 ), and different layers (eg, a support layer 440 ) in each of the first structure 401 and the second structure 402 .
  • the support layer 440 may have different structures, shapes, and shapes in the non-bending region (eg, the first region 331 and the second region 332 ) and the bending region 333 and the curved region 334 , respectively. and/or substances.
  • the display module 400 includes a cover layer 410 , a display panel 420 , an emboss layer 430 , a first adhesive layer 461 , a support layer 440 , and a second adhesive layer 463 . , and a metal layer 450 .
  • the embossed layer 430 may continuously extend from the first structure 401 to the second structure 402 .
  • the embossed layer 430 may include a first base layer 431 and a third adhesive layer 433 formed on one surface of the embossed layer 430 .
  • the first base layer 431 may provide a predetermined strength so that the embossed layer 430 maintains the shape of the flat region 201 or the non-bending regions 331 and 332 .
  • the first base layer 431 may include a material providing flexibility to correspond to the curved regions 202 and 334 and the bending regions 333 .
  • the first base layer 431 may include, for example, a PET film.
  • an embossing pattern protruding toward the display panel 420 may be formed on the first base layer 431 or the third adhesive layer 433 .
  • the third adhesive layer 433 may be disposed between the first base layer 431 and the display panel 420 .
  • the third adhesive layer 433 may attach the embossed layer 430 and the display panel 420 to each other.
  • the emboss layer 430 is illustrated as including the first base layer 431 , but the display module according to various embodiments is not limited thereto.
  • the embossed layer 430 may include a third adhesive layer 433 in which the first base layer 431 is omitted and an embossing pattern is formed.
  • the metal layer 450 may continuously extend from the first structure 401 to the second structure 402 .
  • the metal layer 450 may be attached to the rear surface of the support layer 440 through the second adhesive layer 463 .
  • the metal layer 450 may include, for example, a conductive material.
  • the conductive material may include copper.
  • the metal layer 450 may be configured to dissipate heat from the display module 400 and/or to shield electromagnetic noise.
  • the support layer 440 may include a first portion 440a included in the first structure 401 and a second portion 440b included in the second structure 402 . have.
  • the first portion 440a and the second portion 440b of the support layer 440 may include different materials, different layers, or have different stacked structures.
  • the first portion 440a of the support layer 440 includes a cushion layer 441 , at least one second base layer 443 , 445 , and at least one fourth adhesive layer 447 . can do.
  • the support layer 440 may further include a cushion layer 441 , a fourth adhesive layer 447 , and second base layers 443 and 445 .
  • the cushion layer 441 may form a first surface (eg, an upper surface based on the drawing) of the support layer 440 .
  • the cushion layer 441 may be attached to the embossing layer 430 through the first adhesive layer 461 .
  • the fourth adhesive layer 447 may attach the layers 441 , 443 , and 445 included in the support layer 440 to each other.
  • the cushion layer 441 may include a material capable of absorbing an impact acting on the display module 400 .
  • the cushion layer 441 may include a sponge.
  • the cushion layer 441 may include a superelastic material.
  • the cushion layer 441 may be omitted and the second base layers 443 and 445 may be directly attached to the embossed layer 430 through the first adhesive layer 461 .
  • the second base layers 443 and 445 may form a second surface (eg, a lower surface based on the drawing) of the support layer 440 .
  • the second base layers 443 and 445 may be attached to the metal layer 450 through the second adhesive layer 463 .
  • the second base layers 443 and 445 may have a predetermined strength to maintain the shape of the display module 400 .
  • the second base layers 443 and 445 may reinforce the strength of the rear panel 400b so that the flat region 201 and/or the non-bending regions 331 and 332 maintain a shape.
  • the second base layers 443 and 445 may reinforce strength so that the flat regions 201 and/or the non-bending regions 331 and 332 remain substantially flat.
  • the second base layers 443 and 445 may include a PI layer. Compared to the PET material, the PI layer can provide less flexibility with greater stiffness. Accordingly, the second base layers 443 and 445 may have relatively greater rigidity than the first base layer 431 . On the other hand, the second base layers 443 and 445 may have relatively less flexibility than the first base layer 431 .
  • the first portion 440a of the support layer 440 is illustrated as including two second base layers 443 and 445 , but the display module 400 according to various embodiments is illustrated in the drawings. It is not limited to the bar shown.
  • the first portion 440a of the support layer 440 may include one second base layer 443 , 445 , or may include three or more second base layers 443 , 445 .
  • the first adhesive layer 461 , the second adhesive layer 463 , the third adhesive layer 433 , and the fourth adhesive layer 447 may include a first adhesive material.
  • the first adhesive material may include a transparent adhesive material.
  • the first adhesive material may include an optically clear adhesive (OCA).
  • OCA optically clear adhesive
  • the first adhesive material may be different from the second adhesive material of the damping layer 449 included in the second portion 440b.
  • the second portion 440b of the support layer 440 may further include a damping layer 449 .
  • the damping layer 449 may be disposed between the embossing layer 430 and the metal layer 450 .
  • the damping layer 449 may be formed to perform a damping function of absorbing an external shock.
  • the damping layer 449 may include a second adhesive material different from the first adhesive material.
  • the second adhesive material may include, for example, a pressure sensitive adhesive (PSA).
  • PSA pressure sensitive adhesive
  • the second adhesive material may have a smaller elastic modulus than the first adhesive material.
  • the second adhesive material may have a smaller hardness than the first adhesive material.
  • the damping layer 449 may be formed to be more flexible than other adhesive layers (eg, 461 , 463 , 433 , 447 ) including the first adhesive material.
  • the damping layer 449 may include a viscoelastic material.
  • damping layer 449 may have viscous and/or elastic properties when deformed.
  • the damping layer 449 absorbs an impact applied to the curved area 202 or the bending area 333 in the manufacturing process of the display module 400 or when the electronic devices 100 and 300 are used. It may have viscous properties and/or deformation back to its original shape (eg elastic properties).
  • the damping layer 449 is an embossed layer ( 430) and/or may be formed to directly attach the metal layer 450.
  • damping layer 449 may provide sufficient adhesion to attach embossed layer 430 and/or metal layer 450 .
  • a shape change eg, the bending region 333
  • a deformed shape eg, the curved region 202 of FIG. 4 , or the curve of FIGS. 5A and 5B
  • the region having the de region 334 is configured to include the damping layer 449 , defects and/or damage due to an impact occurring in the manufacturing/use process of the display module 400 may be reduced.
  • the support layer 440 of the display module has a viscosity to at least partially absorb the impact applied to the bending area 333 or the curved areas 202 and 334, and even when deformation occurs due to the impact, it returns to its original state. It may be formed to have elasticity so as to be deformed.
  • the support layer of the conventional display module may include a plurality of PI layers to reinforce rigidity required for the curved regions 202 and 334 or the bending region 333 .
  • the overall thickness of the display module 400 increases, and a greater stress may be applied to the curved regions 202 and 334 or the bending region 333 due to the increased thickness.
  • the support layer 440 of the display module 400 includes a damping material (eg, PSA) having viscous properties and elastic properties instead of the PI layers, so that the thickness of the display module 400 is is relatively reduced, and resistance to external impact can also be secured.
  • a damping material eg, PSA
  • FIGS. 8A and 8B are cross-sectional views illustrating a first structure and a second structure of a display module of an electronic device according to various embodiments of the present disclosure
  • FIGS. 8A and 8B the same content as those described in FIGS. 6, 7A, and 7B will be omitted.
  • the first structure 401 is a detailed cross-sectional view of the flat area 202 of the display module 200 shown in FIG. 4 .
  • the first structure 401 is a detailed cross-sectional view of the non-bending regions 331 and 332 of the display module 330 illustrated in FIGS. 5A and 5B .
  • the second structure is a detailed cross-sectional view of the curved area 202 of the display module 200 shown in FIG. 4 .
  • the second structure 402 is a detailed cross-sectional view of the bending area 333 and the curved area 334 of the display module 330 shown in FIGS. 5A and 5B .
  • the plurality of layers include layers continuously extending to the first structure 401 and the second structure 402 (eg, a cover layer 410 , a display panel 420 , an embossing layer 430 , metal layer 450 ), and layers (eg, support layer 540 ) including different structures in each of the first structure 401 and the second structure 402 .
  • the support layer 540 includes the first portion 540a included in the non-bending region (eg, the first region 331 and the second region 332 ) of FIGS. 5A and 5B and FIGS. 5A and 5B . It may be formed to have a second portion 540b in the bending region 333 and the curved region 334 of 5b.
  • the first part 540a and the second part 540b may be different from each other in at least one of the type, number, shape, and/or material of the layers constituting the layer.
  • the display module 400 may include a cover layer 410 , a display panel 420 , an emboss layer 430 , a support layer 540 , and a metal layer 450 . .
  • the support layer 540 may include a damping layer 541 .
  • the damping layer 541 may be formed to perform a damping function of absorbing an external shock.
  • the damping layer 541 may include a viscoelastic material.
  • the damping layer 541 may have viscous properties and/or elastic properties when deformation occurs.
  • the support layer 540 absorbs an impact applied to the curved regions 202 and 334 or the bending region 333 during the manufacturing process of the display module 400 or the use of the electronic devices 100 and 300 . It may have viscous properties that absorb and/or elastic properties that deform back to its original shape.
  • the damping layer 541 may include a second adhesive material different from a first optically clear adhesive (OCA).
  • the second adhesive material may include, for example, a pressure sensitive adhesive (PSA).
  • PSA pressure sensitive adhesive
  • the second adhesive material may have a smaller elastic modulus than the first adhesive material (OCA) included in the other adhesive layers 461 , 463 , and 433 .
  • the second adhesive material may have a smaller hardness than the first adhesive material.
  • the damping layer 541 may be formed to be more flexible than other adhesive layers 461 , 463 , and 433 including the first adhesive material.
  • the support layer 540 includes the first portion 540a included in the flat region 201 or non-bending regions 331 and 332 , and the curved regions 202 and 334 or the bending region 333 . It may include a second portion 540b included in the . In an embodiment, the second portion 540b of the support layer 540 may further include a third base layer 543 compared to the first portion 540a.
  • the third base layer 543 may be formed of a material having sufficient flexibility to correspond to the curved regions 202 and 334 or the bending regions 333 .
  • the third base layer 543 may include a PET film.
  • the second portion 540b of the support layer 540 may include two or more damping layers 541 .
  • a third base layer 543 may be positioned between two or more damping layers 541 . Referring to the drawing, the damping layer 541 included in the first part 540a may be connected to two or more damping layers 541 included in the second part 540b.
  • the metal layer 450 illustrated in FIGS. 8A and 8B may be formed to be thicker than the metal layer 450 illustrated in FIGS. 7A and 7B .
  • the second base layer (eg, PI layer) 443 and 445 illustrated in FIGS. 7A and 7B reinforces the strength of the display module 400 and/or the rear panel 400b to reinforce the flat area 201 . ) can be maintained.
  • the second base layers 443 and 445 are omitted and the display module 400 and/or the rear surface thereof are provided by including a relatively thick metal layer 450 .
  • the strength of the panel 400b may be reinforced, and the shapes of the flat region 201 and the non-bending regions 331 and 332 may be maintained.
  • the support layer 540 may be disposed such that the first adhesive layer 461 is positioned on the first surface and the second adhesive layer 463 is positioned on the second surface.
  • the support layer 540 may be attached to the embossed layer 430 through the first adhesive layer 461 and may be attached to the metal layer 450 through the second adhesive layer 463 .
  • the damping layer 541 may directly attach the embossed layer 430 and/or the metal layer 450 to the damping layer 541 .
  • the first adhesive layer 461 and/or the second adhesive layer 463 are omitted, and the damping layer 541 is formed to directly attach the embossed layer 430 and/or the metal layer 450 .
  • the damping layer 541 may provide sufficient adhesive force to attach the embossed layer 430 and/or the metal layer 450 .
  • An electronic device 100 includes a housing 110 ; and display modules 200 and 400 disposed in the housing 110 , wherein the display modules 200 and 400 have a substantially flat flat area 201 and a curved area extending from an edge of the flat area 201 . (202); including, wherein the display modules 200 and 400 include: a cover layer 410 forming at least a portion of a surface of the electronic device 100; a display panel 420 disposed under the cover layer 410 and including a light emitting device; a first layer 430 disposed under the display panel 420; a second layer 450 disposed under the first layer 430 and including a metal material; and support layers 440 and 540 disposed between the first layer 430 and the second layer 450 .
  • the support layer 440 includes a first portion 440a included in the flat region 201 ; 540a), and a second portion (440b, 540b) included in the curved region (202), wherein the support layer (440) includes the first portion (440a, 440b) and the second portion
  • Each of portions 540a and 540b may be configured to include a different structure, shape, and/or material.
  • the first layer 430 may include an embossing pattern, and the embossed pattern may include a plurality of protruding portions protruding toward the rear surface of the display panel 420 .
  • the first portion 440a of the support layer 440 includes at least one PI layer and at least one first adhesive layer 447 comprising a first adhesive material, wherein the support The second portion 440b of the layer 440 includes a damping layer 449 comprising a second adhesive material, the second adhesive material having a small elastic modulus compared to the first adhesive material.
  • the second adhesive material may have a smaller hardness than that of the first adhesive material.
  • the first adhesive material may provide greater adhesive strength than the second adhesive material.
  • the first portion 440a of the support layer 440 further includes a cushioning layer 441 disposed between the at least one PI layer and the first layer 430 for shock absorption
  • the first adhesive layer 447 may be disposed between the at least one PI layer and the cushion layer 441 .
  • the second layer 450 may include copper.
  • the first layer 430 includes at least one first base layer 431 , and a first adhesive layer 433 including a first adhesive material, and the first adhesive layer 433 .
  • a first adhesive layer 433 including a first adhesive material may be disposed between the at least one first base layer 431 and the display panel 420 and between the at least one first base layer 431 and the support layers 440 and 540 .
  • the first base layer 431 may include a PET film.
  • the first layer 430 includes a first adhesive layer 433 including a first adhesive material
  • the support layer 540 includes the first portion 540a and the second portion.
  • a damping layer 541 extending to 540b and including a second adhesive material different from the first adhesive material may be included.
  • the second adhesive material has a smaller elastic modulus than that of the first adhesive material
  • the second portion 540b of the support layer 540 is a second base layer 543 .
  • the damping layer (541) is disposed between the second base layer (543) and the second layer (450) and between the second base layer (543) and the first layer (430) can be
  • the second base layer 543 may include a PET film.
  • the first portion 440a of the support layer 440 includes a PI layer and an optically clear adhesive (OCA), and the second portion 440b of the support layer 440 .
  • OCA optically clear adhesive
  • the second portion 440b of the support layer 440 may include a damping layer 449 including a pressure sensitive adhesive (PSA).
  • PSA pressure sensitive adhesive
  • the damping layer 449 may be configured to attach the first layer 430 and the second layer 450 to each other.
  • the support layer 540 includes a damping layer 541 extending continuously to each of the first portion 540a and the second portion 540b, and
  • the second part 540b may further include at least one base layer 543 positioned between the damping layers 541 and including a PET film.
  • a slideable electronic device 300 includes a first structure 310 ; a second structure 320 slidably coupled to the first structure 310 and at least a portion of which surrounds the first structure 310; a cover 313 coupled to the first structure 310, the cover 313 forming at least a portion of a rear surface of the slideable electronic device 100; and a display module (330) disposed on the second structure (320) to move together with the second structure (320), wherein the slideable electronic device (100) includes a second structure of the first structure (310).
  • first portions 440a and 540a included in the first area 331 and the second area 332; and second portions 440b and 540b included in the bending region 333 , and the first portions 440a and 540a and the second portions 440b and 540b have different structures, shapes, and/or material may be included.
  • first edge A1 of the first structure 310 and the second edge A2 of the second structure 320 are parallel to each other and the sliding of the second structure 320 , respectively It may be an edge perpendicular to the directions S1 and S2.
  • the first portion 440a of the display module 400 includes at least one PI layer
  • the second portion 440b of the display module 400 includes at least one damping layer ( 449 , and the damping layer 449 may include a pressure sensitive adhesive (PSA).
  • PSA pressure sensitive adhesive
  • the display module 400 includes at least one damping layer 541 continuously extending to each of the first part 540a and the second part 540b, and the display module 400 ), the second portion 540b may further include a PET film 543 surrounded by the damping layer 541 .
  • the first portion 440a of the display module 400 includes the at least one PI layer and at least one first adhesive layer 447 including a first adhesive material, 1
  • the adhesive material may have a greater elastic modulus or greater hardness than the pressure-sensitive adhesive material.
  • FIG. 9 is a diagram illustrating the support layer 540 shown in FIG. 8A or 8B .
  • 9A is a cross-sectional view of the support layer 540 .
  • Fig. 9(b) is a cross-sectional view taken along line A-A' of Fig. 9(a).
  • FIG. 9C is a diagram illustrating a plurality of support layers 540 .
  • the first part 540a and the second part 540b of the support layer 540 may include a damping material.
  • the second portion 540b of the support layer 540 may further include a base material that is at least partially surrounded by a damping material.
  • the first part 540a at least partially corresponds to the flat area 201 of the display module (eg, the display module 200 of FIG. 4 ), and the second part 540b is the display module (eg, the display module 200 of FIG. 4 ). : May correspond at least partially to the curved area 202 of the display module 200 of FIG. 4 .
  • the first portion 540a at least partially corresponds to the non-bending regions 331 and 332 of the display module (eg, the display module 330 of FIGS. 5A and 5B ), and the second portion 540b ) may at least partially correspond to the bending area 333 and the curved area 334 of the display module (eg, the display module 330 of FIGS. 5A and 5B ).
  • the damping layer 541 may be formed to perform a damping function to absorb an external shock.
  • the damping material included in the damping layer 541 is the It may have a viscous property to absorb a portion of the impact, and an elastic property to return to its original shape.
  • the damping material may include a pressure sensitive adhesive (PSA).
  • the base layer 543 maintains the shape of the display module by reinforcing the strength of the display module (eg, the display module 200 of FIG. 4 and the display module 330 of FIGS. 5A and 5B ). function can be performed.
  • the base material included in the base layer 543 may include a PET material or a PI material.
  • the damping material of the support layer 540 may be at least partially surrounded by the base layer 543 .
  • the support layer 540 may be provided by forming an opening in the base layer 543 including a base material, and filling or applying a damping material to the opening.
  • the base layer 543 is where the damping material is located when the support layer 540 is attached to other layers (eg, the metal layer 450, the embossed layer 430 in FIGS. 8A and 8B ).
  • the to-be region it is possible to prevent the damping material from overflowing into other regions (eg, the curved region 202 and the bending region 333 ).
  • the support layer 540 may be provided as a single support layer 540 , or as shown in FIG. 9C , a plurality of support layers 540 may be provided in a continuously connected form. can For example, a plurality of regions in which a damping material is accommodated or applied may be formed in one base layer 543 . The received or applied damping material may form a damping layer 541 .
  • FIG. 10 is a diagram illustrating a part of a method 600 of manufacturing a support layer according to various embodiments of the present disclosure.
  • a method 600 of manufacturing the support layer 540 includes a step 601 of providing a first protective film 610 , a step 602 of forming a first damping layer 621 , and a base. It may include a step 603 of forming the layer 630 , a step 604 of forming a second damping layer 622 , and a step 605 of attaching the second protective film 640 .
  • the step 602 of forming the first damping layer 621 may include applying a damping material to one surface of the first protective film 610 .
  • the first damping layer 621 may form a part of the damping layer 541 illustrated in FIGS. 8A , 8B and 9 .
  • the step 603 of forming the base layer 630 includes forming an opening 631 in a layer made of a base material, and forming the layer in which the opening 631 is formed in the first damping layer 621 . It may include attaching.
  • the base layer 630 may include the base layer 543 illustrated in FIGS. 8A, 8B, and 9 .
  • the step 604 of forming the second damping layer 622 includes filling the inside of the opening 631 with a damping material, and applying the damping material over the filled damping material and the base layer 630 .
  • the second damping layer 622 may form a part of the damping layer 541 illustrated in FIGS. 8A , 8B and 9 .
  • the second protective film 640 may be attached to one surface of the second damping layer 622 .
  • the support layer 540 may be bonded to other layers after the first protective film 610 and the second protective film 640 are removed.
  • the first damping layer 621 is attached to a metal layer (eg, metal layer 450 in FIG. 8B ), and the second damping layer 622 is attached to an emboss layer (eg, emboss layer 430 in FIG. 8B ). )) can be attached.
  • FIG. 11 is a block diagram of an electronic device 1101 in a network environment 1100 according to various embodiments of the present disclosure.
  • the electronic device 1101 communicates with the electronic device 1102 through a first network 1198 (eg, a short-range wireless communication network) or a second network 1199 . It may communicate with the electronic device 1104 or the server 1108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 1101 may communicate with the electronic device 1104 through the server 1108 .
  • a first network 1198 eg, a short-range wireless communication network
  • a second network 1199 e.g., a second network 1199
  • the electronic device 1101 may communicate with the electronic device 1104 through the server 1108 .
  • the electronic device 1101 includes a processor 1120 , a memory 1130 , an input module 1150 , a sound output module 1155 , a display module 1160 , an audio module 1170 , and a sensor module ( 1176), interface 1177, connection terminal 1178, haptic module 1179, camera module 1180, power management module 1188, battery 1189, communication module 1190, subscriber identification module 1196 , or an antenna module 1197 may be included.
  • at least one of these components eg, the connection terminal 1178
  • some of these components are integrated into one component (eg, display module 1160 ). can be
  • the processor 1120 for example, executes software (eg, a program 1140) to execute at least one other component (eg, hardware or software component) of the electronic device 1101 connected to the processor 1120. It can control and perform various data processing or operations. According to an embodiment, as at least part of data processing or operation, the processor 1120 may store a command or data received from another component (eg, the sensor module 1176 or the communication module 1190 ) into the volatile memory 1132 . , process the command or data stored in the volatile memory 1132 , and store the result data in the non-volatile memory 1134 .
  • software eg, a program 1140
  • the processor 1120 may store a command or data received from another component (eg, the sensor module 1176 or the communication module 1190 ) into the volatile memory 1132 . , process the command or data stored in the volatile memory 1132 , and store the result data in the non-volatile memory 1134 .
  • the processor 1120 is a main processor 1121 (eg, a central processing unit or an application processor) or a secondary processor 1123 (eg, a graphic processing unit, a neural network processing unit (eg, a graphic processing unit, a neural network processing unit) a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor).
  • a main processor 1121 e.g, a central processing unit or an application processor
  • a secondary processor 1123 eg, a graphic processing unit, a neural network processing unit (eg, a graphic processing unit, a neural network processing unit) a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor.
  • the electronic device 1101 includes a main processor 1121 and a sub-processor 1123
  • the sub-processor 1123 uses less power than the main processor 1121 or is set to specialize in a specified function.
  • the auxiliary processor 1123 may be implemented separately from or as a part of the main processor
  • the coprocessor 1123 may be, for example, on behalf of the main processor 1121 while the main processor 1121 is in an inactive (eg, sleep) state, or the main processor 1121 is active (eg, executing an application). ), together with the main processor 1121, at least one of the components of the electronic device 1101 (eg, the display module 1160, the sensor module 1176, or the communication module 1190) It is possible to control at least some of the related functions or states.
  • the auxiliary processor 1123 eg, an image signal processor or a communication processor
  • the auxiliary processor 1123 may include a hardware structure specialized in processing an artificial intelligence model.
  • Artificial intelligence models can be created through machine learning. Such learning may be performed, for example, in the electronic device 1101 itself on which artificial intelligence is performed, or may be performed through a separate server (eg, the server 1108).
  • the learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but in the above example not limited
  • the artificial intelligence model may include a plurality of artificial neural network layers.
  • Artificial neural networks include deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the above example.
  • the artificial intelligence model may include, in addition to, or alternatively, a software structure in addition to the hardware structure.
  • the memory 1130 may store various data used by at least one component (eg, the processor 1120 or the sensor module 1176 ) of the electronic device 1101 .
  • the data may include, for example, input data or output data for software (eg, the program 1140 ) and instructions related thereto.
  • the memory 1130 may include a volatile memory 1132 or a non-volatile memory 1134 .
  • the program 1140 may be stored as software in the memory 1130 , and may include, for example, an operating system 1142 , middleware 1144 , or an application 1146 .
  • the input module 1150 may receive a command or data to be used in a component (eg, the processor 1120 ) of the electronic device 1101 from the outside (eg, a user) of the electronic device 1101 .
  • the input module 1150 may include, for example, a microphone, a mouse, a keyboard, a key (eg, a button), or a digital pen (eg, a stylus pen).
  • the sound output module 1155 may output a sound signal to the outside of the electronic device 1101 .
  • the sound output module 1155 may include, for example, a speaker or a receiver.
  • the speaker can be used for general purposes such as multimedia playback or recording playback.
  • the receiver may be used to receive an incoming call. According to an embodiment, the receiver may be implemented separately from or as a part of the speaker.
  • the display module 1160 may visually provide information to the outside (eg, a user) of the electronic device 1101 .
  • the display module 1160 may include, for example, a display, a hologram device, or a projector and a control circuit for controlling the corresponding device.
  • the display module 1160 may include a touch sensor configured to sense a touch or a pressure sensor configured to measure the intensity of a force generated by the touch.
  • the audio module 1170 may convert a sound into an electric signal or, conversely, convert an electric signal into a sound. According to an embodiment, the audio module 1170 acquires a sound through the input module 1150 or an external electronic device (eg, a sound output module 1155 ) directly or wirelessly connected to the electronic device 1101 .
  • the electronic device 1102) eg, a speaker or headphones
  • the sensor module 1176 detects an operating state (eg, power or temperature) of the electronic device 1101 or an external environmental state (eg, a user state), and generates an electrical signal or data value corresponding to the sensed state. can do.
  • the sensor module 1176 may include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, a humidity sensor, or an illuminance sensor.
  • the interface 1177 may support one or more specified protocols that may be used for the electronic device 1101 to directly or wirelessly connect with an external electronic device (eg, the electronic device 1102).
  • the interface 1177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • SD card interface Secure Digital Card
  • connection terminal 1178 may include a connector through which the electronic device 1101 can be physically connected to an external electronic device (eg, the electronic device 1102 ).
  • the connection terminal 1178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).
  • the haptic module 1179 may convert an electrical signal into a mechanical stimulus (eg, vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic sense.
  • the haptic module 1179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.
  • the camera module 1180 may capture still images and moving images. According to an embodiment, the camera module 1180 may include one or more lenses, image sensors, image signal processors, or flashes.
  • the power management module 1188 may manage power supplied to the electronic device 1101 .
  • the power management module 1188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).
  • PMIC power management integrated circuit
  • the battery 1189 may supply power to at least one component of the electronic device 1101 .
  • the battery 1189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.
  • the communication module 1190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 1101 and an external electronic device (eg, the electronic device 1102, the electronic device 1104, or the server 1108). It can support establishment and communication performance through the established communication channel.
  • the communication module 1190 operates independently of the processor 1120 (eg, an application processor) and may include one or more communication processors supporting direct (eg, wired) communication or wireless communication.
  • the communication module 1190 may include a wireless communication module 1192 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 1194 (eg, : It may include a LAN (local area network) communication module, or a power line communication module).
  • a wireless communication module 1192 eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module
  • GNSS global navigation satellite system
  • wired communication module 1194 eg, : It may include a LAN (local area network) communication module, or a power line communication module.
  • a corresponding communication module among these communication modules is a first network 1198 (eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 1199 (eg, legacy It may communicate with the external electronic device 1104 through a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (eg, a telecommunication network such as a LAN or WAN).
  • a first network 1198 eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)
  • a second network 1199 eg, legacy It may communicate with the external electronic device 1104 through a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (eg, a telecommunication network such as a LAN or WAN).
  • a telecommunication network such as a
  • the wireless communication module 1192 uses subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 1196 within a communication network such as the first network 1198 or the second network 1199 .
  • subscriber information eg, International Mobile Subscriber Identifier (IMSI)
  • IMSI International Mobile Subscriber Identifier
  • the electronic device 1101 may be identified or authenticated.
  • the wireless communication module 1192 may support a 5G network after a 4G network and a next-generation communication technology, for example, a new radio access technology (NR).
  • NR access technology includes high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency) -latency communications)).
  • eMBB enhanced mobile broadband
  • mMTC massive machine type communications
  • URLLC ultra-reliable and low-latency
  • the wireless communication module 1192 may support a high frequency band (eg, mmWave band) in order to achieve a high data rate, for example.
  • a high frequency band eg, mmWave band
  • the wireless communication module 1192 uses various technologies for securing performance in a high-frequency band, for example, beamforming, massive multiple-input and multiple-output (MIMO), all-dimensional multiplexing. It may support technologies such as full dimensional MIMO (FD-MIMO), an array antenna, analog beam-forming, or a large scale antenna.
  • the wireless communication module 1192 may support various requirements specified in the electronic device 1101 , an external electronic device (eg, the electronic device 1104 ), or a network system (eg, the second network 1199 ).
  • the wireless communication module 1192 provides a peak data rate (eg, 20 Gbps or more) for realization of eMBB, loss coverage for realization of mMTC (eg, 164 dB or less), or U-plane latency for realization of URLLC ( Example: downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less).
  • a peak data rate eg, 20 Gbps or more
  • mMTC eg, 164 dB or less
  • U-plane latency for realization of URLLC
  • the antenna module 1197 may transmit or receive a signal or power to the outside (eg, an external electronic device).
  • the antenna module 1197 may include an antenna including a conductor formed on a substrate (eg, a PCB) or a radiator formed of a conductive pattern.
  • the antenna module 1197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 1198 or the second network 1199 is connected from the plurality of antennas by, for example, the communication module 1190 . can be selected. A signal or power may be transmitted or received between the communication module 1190 and an external electronic device through the selected at least one antenna.
  • other components eg, a radio frequency integrated circuit (RFIC)
  • RFIC radio frequency integrated circuit
  • the antenna module 1197 may form a mmWave antenna module.
  • the mmWave antenna module comprises a printed circuit board, an RFIC disposed on or adjacent to a first side (eg, bottom side) of the printed circuit board and capable of supporting a specified high frequency band (eg, mmWave band); and a plurality of antennas (eg, an array antenna) disposed on or adjacent to a second side (eg, top or side) of the printed circuit board and capable of transmitting or receiving signals of the designated high frequency band. can do.
  • peripheral devices eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)
  • GPIO general purpose input and output
  • SPI serial peripheral interface
  • MIPI mobile industry processor interface
  • a command or data may be transmitted or received between the electronic device 1101 and the external electronic device 1104 through the server 1108 connected to the second network 1199 .
  • Each of the external electronic devices 1102 or 1104 may be the same or a different type of the electronic device 1101 .
  • all or a part of operations executed by the electronic device 1101 may be executed by one or more external electronic devices 1102 , 1104 , or 1108 .
  • the electronic device 1101 may perform the function or service itself instead of executing the function or service itself.
  • one or more external electronic devices may be requested to perform at least a part of the function or the service.
  • One or more external electronic devices that have received the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit a result of the execution to the electronic device 1101 .
  • the electronic device 1101 may process the result as it is or additionally and provide it as at least a part of a response to the request.
  • cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used.
  • the electronic device 1101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing.
  • the external electronic device 1104 may include an Internet of things (IoT) device.
  • IoT Internet of things
  • Server 1108 may be an intelligent server using machine learning and/or neural networks.
  • the external electronic device 1104 or the server 1108 may be included in the second network 1199 .
  • the electronic device 1101 may be applied to an intelligent service (eg, smart home, smart city, smart car, or health care) based on 5G communication technology and IoT-related technology.
  • the electronic device may be a device of various types.
  • the electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device.
  • a portable communication device eg, a smart phone
  • a computer device e.g., a laptop, a desktop, a tablet, or a portable multimedia device
  • portable medical device e.g., a portable medical device
  • camera e.g., a camera
  • a wearable device e.g., a smart watch
  • a home appliance device e.g., a smart bracelet
  • first”, “second”, or “first” or “second” may simply be used to distinguish the component from other such components, and refer to those components in other aspects (e.g., importance or order) is not limited. that one (eg first) component is “coupled” or “connected” to another (eg, second) component, with or without the terms “functionally” or “communicatively” When referenced, it means that one component can be connected to the other component directly (eg by wire), wirelessly, or through a third component.
  • module used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and for example, is interchangeable with terms such as logic, logic block, component, or circuit.
  • a module may be an integrally formed part or a minimum unit or a part of the part that performs one or more functions.
  • the module may be implemented in the form of an application-specific integrated circuit (ASIC).
  • ASIC application-specific integrated circuit
  • one or more instructions stored in a storage medium may be implemented as software (eg, the program 1140) including
  • a processor eg, processor 1120 of a device (eg, electronic device 1101 ) may call at least one command among one or more commands stored from a storage medium and execute it. This makes it possible for the device to be operated to perform at least one function according to the called at least one command.
  • the one or more instructions may include code generated by a compiler or code executable by an interpreter.
  • the device-readable storage medium may be provided in the form of a non-transitory storage medium.
  • 'non-transitory' only means that the storage medium is a tangible device and does not include a signal (eg, electromagnetic wave), and this term is used in cases where data is semi-permanently stored in the storage medium and It does not distinguish between temporary storage cases.
  • a signal eg, electromagnetic wave
  • the method according to various embodiments disclosed in this document may be provided by being included in a computer program product.
  • Computer program products may be traded between sellers and buyers as commodities.
  • the computer program product is distributed in the form of a machine-readable storage medium (eg compact disc read only memory (CD-ROM)), or via an application store (eg Play StoreTM) or on two user devices ( It can be distributed (eg downloaded or uploaded) directly between smartphones (eg: smartphones) and online.
  • a part of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium such as a memory of a server of a manufacturer, a server of an application store, or a relay server.
  • each component eg, a module or a program of the above-described components may include a singular or a plurality of entities, and some of the plurality of entities may be separately disposed in other components. .
  • one or more components or operations among the above-described corresponding components may be omitted, or one or more other components or operations may be added.
  • a plurality of components eg, a module or a program
  • the integrated component may perform one or more functions of each component of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. .
  • operations performed by a module, program, or other component are executed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations are executed in a different order, omitted, or , or one or more other operations may be added.

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

Un dispositif électronique est divulgué. Le dispositif électronique comprend : un boîtier ; et un module d'affichage placé dans le boîtier, le module d'affichage comprenant une région plate sensiblement plane et une région incurvée s'étendant à partir d'un bord de la région plate. Le module d'affichage comprend : une couche de recouvrement formant au moins une partie de la surface du dispositif électronique ; un panneau d'affichage placé sous la couche de recouvrement et comprenant un élément électroluminescent ; une première couche placée sous le panneau d'affichage ; une seconde couche placée sous la première couche et comprenant un matériau métallique ; et une couche de support placée entre la première couche et la seconde couche, la couche de support comprenant une première partie incluse dans la région plate et une seconde partie incluse dans la région incurvée. La couche de support peut être conçue de telle sorte que la première partie et la seconde partie comprennent chacune une structure différente, une forme différente et/ou un matériau différent. Divers autres modes de réalisation identifiés par la description sont également possibles.
PCT/KR2021/015889 2020-11-17 2021-11-04 Module d'affichage et dispositif électronique le comprenant WO2022108198A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR20200153383 2020-11-17
KR10-2020-0153383 2020-11-17
KR10-2020-0189665 2020-12-31
KR1020200189665A KR20220067458A (ko) 2020-11-17 2020-12-31 디스플레이 모듈 및 이를 포함하는 전자 장치

Publications (1)

Publication Number Publication Date
WO2022108198A1 true WO2022108198A1 (fr) 2022-05-27

Family

ID=81709234

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2021/015889 WO2022108198A1 (fr) 2020-11-17 2021-11-04 Module d'affichage et dispositif électronique le comprenant

Country Status (1)

Country Link
WO (1) WO2022108198A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023236278A1 (fr) * 2022-06-07 2023-12-14 武汉华星光电半导体显示技术有限公司 Appareil d'affichage

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160029543A (ko) * 2014-09-05 2016-03-15 엘지전자 주식회사 휴대 전자기기
KR20170095809A (ko) * 2014-12-23 2017-08-23 엘지디스플레이 주식회사 게이트-인-패널 회로를 갖는 플렉서블 디스플레이 디바이스
KR20170139175A (ko) * 2014-09-30 2017-12-18 엘지디스플레이 주식회사 플렉서블 디스플레이 디바이스
KR20190065759A (ko) * 2017-12-04 2019-06-12 서울과학기술대학교 산학협력단 조립식 휴대용 디스플레이 레이어 장치
US20200243778A1 (en) * 2018-04-09 2020-07-30 Boe Technology Group Co., Ltd. Flexible array substrate, preparation method thereof, and flexible display panel

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160029543A (ko) * 2014-09-05 2016-03-15 엘지전자 주식회사 휴대 전자기기
KR20170139175A (ko) * 2014-09-30 2017-12-18 엘지디스플레이 주식회사 플렉서블 디스플레이 디바이스
KR20170095809A (ko) * 2014-12-23 2017-08-23 엘지디스플레이 주식회사 게이트-인-패널 회로를 갖는 플렉서블 디스플레이 디바이스
KR20190065759A (ko) * 2017-12-04 2019-06-12 서울과학기술대학교 산학협력단 조립식 휴대용 디스플레이 레이어 장치
US20200243778A1 (en) * 2018-04-09 2020-07-30 Boe Technology Group Co., Ltd. Flexible array substrate, preparation method thereof, and flexible display panel

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023236278A1 (fr) * 2022-06-07 2023-12-14 武汉华星光电半导体显示技术有限公司 Appareil d'affichage

Similar Documents

Publication Publication Date Title
WO2022065624A1 (fr) Dispositif électronique comprenant un écran souple
WO2021162449A1 (fr) Dispositif électronique pliable
WO2020231232A1 (fr) Dispositif électronique pliable
WO2021246798A1 (fr) Appareil électronique comprenant un affichage souple
WO2022025464A1 (fr) Dispositif électronique comprenant un écran coulissant
WO2019156495A1 (fr) Afficheur incluant une pluralité de couches de câblage dans une région de courbure
WO2022139376A1 (fr) Dispositif électronique comprenant une antenne à cadre
WO2022019497A1 (fr) Dispositif électronique comprenant un dispositif d'affichage et un dispositif de caméra
WO2022103023A1 (fr) Dispositif électronique comprenant un boîtier
WO2022103174A1 (fr) Dispositif électronique comportant un affichage à zone d'affichage variable et procédé permettant de faire varier un rapport d'aspect au moyen d'une icône d'application
WO2022085915A1 (fr) Appareil électronique comprenant une unité d'affichage
WO2022019685A1 (fr) Dispositif électronique comprenant un écran souple et une antenne
WO2022060126A1 (fr) Dispositif électronique comprenant un module de caméra
WO2022025522A1 (fr) Antennes et dispositif électronique comprenant celles-ci
WO2022108198A1 (fr) Module d'affichage et dispositif électronique le comprenant
WO2022039498A1 (fr) Appareil électronique comprenant un écran souple
WO2022169217A1 (fr) Ensemble flexible comprenant un motif d'antenne et appareil électronique le comprenant
WO2021206380A1 (fr) Dispositif électronique comprenant des capteurs de force disposés sur la même couche et procédé de commande de celui-ci
WO2022098058A1 (fr) Dispositif électronique comprenant une unité d'affichage
WO2023018219A1 (fr) Dispositif électronique comprenant un affichage et une caméra, et son procédé de commande
WO2023018119A1 (fr) Dispositif électronique comprenant un module de caméra
WO2023018196A1 (fr) Dispositif électronique pliable
WO2022191440A1 (fr) Dispositif électronique pliable détectant un état de pliage, et son procédé de fonctionnement
WO2023282435A1 (fr) Dispositif électronique comprenant une vitre et son procédé de fabrication
WO2022215938A1 (fr) Dispositif électronique comprenant un module de caméra

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 21894969

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 21894969

Country of ref document: EP

Kind code of ref document: A1