WO2023280089A1 - 电子设备 - Google Patents

电子设备 Download PDF

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Publication number
WO2023280089A1
WO2023280089A1 PCT/CN2022/103571 CN2022103571W WO2023280089A1 WO 2023280089 A1 WO2023280089 A1 WO 2023280089A1 CN 2022103571 W CN2022103571 W CN 2022103571W WO 2023280089 A1 WO2023280089 A1 WO 2023280089A1
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WO
WIPO (PCT)
Prior art keywords
speaker
main board
hole
space
electronic device
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PCT/CN2022/103571
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English (en)
French (fr)
Inventor
董传宇
蒋斌
丁建
伍伟竞
贾晓飞
Original Assignee
维沃移动通信有限公司
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Application filed by 维沃移动通信有限公司 filed Critical 维沃移动通信有限公司
Publication of WO2023280089A1 publication Critical patent/WO2023280089A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2869—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself
    • H04R1/2873—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself for loudspeaker transducers

Definitions

  • the present application belongs to the technical field of communication, and specifically relates to an electronic device.
  • Existing speakers are generally classified into closed speakers, semi-open speakers and open speakers.
  • most of the current electronic equipment adopts semi-open speakers or open speakers.
  • the air in the rear cavity will push the back cover, causing the back cover to vibrate, resulting in poor user experience.
  • the purpose of the embodiments of the present application is to provide an electronic device that can solve the problem of vibration of the back cover when the speaker is working.
  • An embodiment of the present application provides an electronic device, which includes:
  • the speaker is arranged on the frame
  • the main board the main board is arranged on the frame, the main board is provided with an avoidance hole, a part of the speaker is located in the avoidance hole, a first space is formed between the main board and the frame, and the main board has a first On one side, the first surface is provided with a first component, and the first component is located in the first space;
  • sealing bracket is connected to the main board, and the sealing bracket covers the speaker, and a second space is formed between the sealing bracket and the speaker;
  • the first space communicates with the second space through the escape hole to form a closed rear cavity.
  • a first space is formed between the main board and the frame, and a second space is formed between the sealing bracket and the speaker.
  • the first space communicates with the second space through the avoidance hole of the main board to form a closed rear cavity. Because the main board
  • the first space between the frame and the frame can be used as a part of the closed back cavity of the speaker, so this solution can form a sufficiently large closed back cavity, and there is no need to reserve too much space to form a closed back cavity, so as to improve the electronic
  • the sealing bracket can separate the back cover and close the back cavity, when the speaker is working, the air in the closed back cavity will not push the back cover, so the back cover will not vibrate, thus improving the user use experience.
  • FIG. 1 is an exploded view of a partial structure of an electronic device disclosed in an embodiment of the present application
  • FIG. 2 is a cross-sectional view of a partial structure of an electronic device disclosed in an embodiment of the present application.
  • 300-main board 301-avoidance hole, 310-first hole wall, 320-second hole wall, 302-first face, 303-second face;
  • an embodiment of the present application discloses an electronic device, which includes a frame 100 , a speaker 200 , a main board 300 , a sealing bracket 400 and a rear cover.
  • the frame 100 can be used as a basic component of the electronic device, which can provide a basis for installation of other components of the electronic device.
  • the frame 100 can be connected to the back cover, and the side of the frame 100 away from the back cover can be installed with a display screen of the electronic device .
  • the speaker 200 is provided on the frame 100, and the speaker 200 generates sound by vibrating the surrounding air.
  • the main board 300 is disposed on the frame 100 , and the main board 300 is provided with an avoidance hole 301 , and a part of the speaker 200 is located in the avoidance hole 301 .
  • a first space 610 is formed between the mainboard 300 and the frame 100, the mainboard 300 has a first surface 302, the first surface 302 is provided with a first component 500, and the first component 500 is located in the first space 610, in other words, the mainboard 300 deviates from At least one first component 500 may be disposed on one side of the back cover, and the first space 610 here is used to accommodate the first component 500 .
  • the sealing bracket 400 is connected to the main board 300 , and the sealing bracket 400 covers the speaker 200 , and a second space 620 is formed between the sealing bracket 400 and the speaker 200 .
  • the first space 610 may communicate with the second space 620 through the escape hole 301 to form a closed rear cavity. That is, by setting the sealing bracket 400 and opening the escape hole 301 on the main board 300 , the frame 100 , the speaker 200 , the main board 300 and the sealing bracket 400 together form a closed rear cavity.
  • this solution can form a sufficiently large closed back cavity, and there is no need to reserve an excessively large space to form a closed back cavity, so as to improve the utilization rate of the internal space of the electronic device; at the same time, the sealing bracket 400 can separate the back cover and the closed back cavity, and when the speaker 200 is working, the air in the closed back cavity will not Push the back cover, so the back cover will not vibrate, which improves the user experience.
  • the electronic device further includes a first shielding cover 700, the first shielding cover 700 is arranged on the first surface 302 of the main board 300, and the first shielding cover 700 covers at least one first component 500,
  • the first shielding case 700 is located in the first space 610.
  • the space between the first shielding case 700 and the main board 300 is the first subspace
  • the space between the first shielding case 700 and the frame 100 is the second subspace.
  • the first shielding cover 700 in order to improve the shielding effect of the first component 500, usually adopts a closed structure, so the first subspace will be separated from the second subspace, further, in order to fully utilize In the first subspace, the first shielding case 700 can be provided with a first through hole, and the first subspace communicates with the second subspace through the first through hole. At this time, the first subspace and the second subspace Both are part of the closed back cavity, so as to enlarge the closed back cavity, thereby improving the sound effect of the speaker 200 .
  • the number of the first shielding case 700 can be only one, and all the first components 500 can be covered by the first shielding case 700.
  • the electronic device further includes at least two first shielding cases 700, the first shielding case 700 is arranged on the first surface 302, and the first shielding case 700 covers at least one first component 500, and there is a gap between adjacent first shielding cases 700, which is a part of the closed rear cavity .
  • the space between adjacent first shielding shells 700 can be used as a part of the closed back cavity, thereby increasing the closed back cavity, thereby improving the sound effect of the speaker 200 .
  • this embodiment does not require the first shielding case 700 to have holes, so that the shielding effect of the first shielding case 700 on the first component 500 can be improved, and the structural strength of the first shielding case 700 can also be improved.
  • the motherboard 300 also has a second surface 303 opposite to the first surface 302 , and the second surface 303 may face the rear cover.
  • the second surface 303 is provided with a second component and a second shield, the second shield covers at least one second component, and a third space is formed between the second shield and the main board 300, in order to fully Utilizing the third space, the main board 300 can be provided with a second through hole, and the second space 620 between the main board 300 and the frame 100 can communicate with the third space through the second through hole, so that the third space is closed. part of the cavity.
  • the third space between the second shielding case and the main board 300 can also be used as a part of the closed back cavity, so as to further expand the closed back cavity, thereby improving the sound effect of the speaker 200 .
  • connection position of the sealing bracket 400 and the main board 300 may be the hole wall of the escape hole 301 , or the first surface 302 of the main board 300 , or the second surface 303 of the main board 300 .
  • the size of the avoidance hole 301 is not limited by the sealing bracket 400 , so the structural design of the main board 300 is more convenient.
  • the avoidance hole 301 can be set as small as possible under the premise of avoiding the speaker 200, thereby alleviating the weakening of the structural strength of the main board 300 by the avoidance hole 301, making the structural strength of the main board 300 higher, and at the same time increasing the number of boards of the main board 300. surface area, so that more components can be arranged on the main board 300 .
  • the sealing bracket 400 can be connected and sealed to the second surface 303 of the main board 300 through the first foam 910, so as to improve the sealing of the closed rear cavity.
  • the sealing bracket 400 has a first inner side wall 401 and a second inner side wall 402 opposite to each other, the first inner side wall 401 and the second inner side wall 402 are both facing the speaker 200, and the first inner side wall 401 is located between the first component 500 and the second inner side wall 402 , that is, the first inner wall 401 is closer to the first component 500 than the second inner wall 402 , and the second inner wall 402 is closer to the edge of the motherboard 300 than the first inner wall 401 .
  • the avoidance hole 301 has a first hole wall 310 and a second hole wall 320 opposite to each other. Both the first hole wall 310 and the second hole wall 320 face the speaker 200 .
  • the first hole wall 310 is located between the first component 500 and the second hole wall.
  • the first inner wall 401 may be at least partially aligned with the first hole wall 310 , or the first hole wall 310 may protrude relative to the first inner wall 401 in a direction close to the speaker 200 , relatively speaking, the latter arrangement will result in
  • the size of the sealing bracket 400 increases, thereby occupying too much space on the board surface of the main board 300, while the former setting method can appropriately reduce the size of the sealing bracket 400, thereby alleviating the occupation of the board space of the main board 300 by the sealing bracket 400 , and when the air in the closed rear cavity vibrates, the main board 300 will not generate resistance to the air because the second hole wall 320 protrudes relative to the first inner side wall 401 , so this structure can also improve the sound effect of the speaker 200 .
  • the second hole wall 320 may be aligned with the second inner wall 402 , or the second hole wall 320 protrudes relative to the second inner wall 402 in a direction close to the speaker 200 .
  • the second hole wall 320 can protrude relative to the second inner side wall 402 in a direction close to the speaker 200, thereby increasing the sealing.
  • the size of the bracket 400 makes the enclosed rear cavity larger, so as to improve the sound effect of the speaker 200 .
  • the side of the frame 100 facing the first component 500 is provided with a first protruding portion 110, the speaker 200 is disposed on the first protruding portion 110, and the speaker 200 is sealed and fitted with the first protruding portion 110,
  • the loudspeaker 200 can be connected with the first protruding part 110 through the double-sided adhesive tape 920 to seal fit, so as to improve the airtightness of the closed rear cavity. Since at least a part of the speaker 200 needs to pass through the avoidance hole 301 of the main board 300 and be located in the sealing bracket 400, compared with the solution in which the speaker 200 is directly installed on the side of the frame 100 facing the first component 500, this method of passing through the first component 500 is adopted.
  • the distance between the frame 100 and the main board 300 can be increased, so that more specifications of the first components 500 can be arranged on the main board 300, and the second space 620 can also be enlarged , so that the sound effect of the speaker 200 is better.
  • the side of the frame 100 facing the first component 500 is also provided with a second protruding portion 120
  • the main board 300 is arranged on the second protruding portion 120
  • the main board 300 and the second protruding portion 120 are sealed and fitted
  • the main board 300 is sealingly fitted with the second protruding part 120 through the second foam 930, so as to improve the airtightness of the closed rear cavity.
  • the height of the second protruding portion 120 may be equal to the height of the first protruding portion 110 , and the direction of the height here is a direction perpendicular to the main board 300 .
  • the part where the avoidance hole 301 is set on the main board 300 is closer to the first protruding part 110, and the gap between this part of the main board 300 and the first protruding part 110 is too small, which is unfavorable for air to vibrate in the closed cavity.
  • the height of the second protruding portion 120 can be made greater than the height of the first protruding portion 110, thereby increasing the distance between the part of the main board 300 where the avoidance hole 301 is opened and the first protruding portion 110, thereby It is convenient for air to vibrate in the closed cavity.
  • this structure can also enlarge the second space 620 , thereby further improving the sound effect of the speaker 200 .
  • the frame 100 is provided with the first protruding portion 110
  • the first protruding portion 110 is provided with the third through hole 111
  • the speaker 200 is arranged towards the third through hole 111
  • the frame 100 and the speaker 200 jointly form the speaker front cavity 800
  • the loudspeaker front chamber 800 is located on the side of the loudspeaker 200 away from the sealing bracket 400 .
  • the third through hole 111 is set on the first protruding part 110, and the speaker 200 is arranged towards the third through hole 111.
  • the frame 100 and the speaker 200 can be used to form the speaker front cavity 800, so that the structure of the speaker front cavity 800 is more compact. Simple, on the other hand, the weight of the frame 100 can be reduced, thereby making the electronic device lighter.
  • the electronic devices disclosed in the embodiments of the present application may be smart phones, tablet computers, e-book readers, wearable devices (such as smart watches), electronic game consoles and other electronic devices, and the embodiments of the present application do not specifically limit the types of electronic devices.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Health & Medical Sciences (AREA)
  • Otolaryngology (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)

Abstract

本申请公开了一种电子设备，属于通信技术领域。该电子设备包括：框架；扬声器，所述扬声器设置于所述框架；主板，所述主板设置于所述框架，所述主板开设有避让孔，所述扬声器的一部分位于所述避让孔内，所述主板与所述框架之间形成第一空间，所述主板具有第一面，所述第一面设有第一元器件，所述第一元器件位于所述第一空间内；密封支架，所述密封支架与所述主板相连，且所述密封支架覆盖所述扬声器，所述密封支架与所述扬声器之间形成第二空间；其中，所述第一空间通过所述避让孔与所述第二空间相连通，以形成封闭后腔。

Description

电子设备
交叉引用
本发明要求在2021年07月07日提交中国专利局、申请号为202110765966.4、发明名称为“电子设备”的中国专利申请的优先权，该申请的全部内容通过引用结合在本发明中。
技术领域
本申请属于通信技术领域，具体涉及一种电子设备。
背景技术
现有的电子设备中，为了满足用户不断丰富的影音需求，通常会配置多个扬声器。
现有的扬声器一般分为封闭式扬声器、半开放式扬声器和开放式扬声器等。为了提升电子设备的内部空间利用率，目前的电子设备大多采用半开放式扬声器或者开放式扬声器，但是采用此种设计方案时，由于扬声器的后腔延伸至电子设备的后盖，因此扬声器工作时，后腔中的空气会推动后盖，导致后盖振动，致使用户的使用体验变差。
发明内容
本申请实施例的目的是提供一种电子设备，能够解决扬声器工作时后盖振动的问题。
为了解决上述技术问题，本申请是这样实现的：
本申请实施例提供了一种电子设备，其包括：
框架；
扬声器，所述扬声器设置于所述框架；
主板，所述主板设置于所述框架，所述主板开设有避让孔，所述扬声器的一部分位于所述避让孔内，所述主板与所述框架之间形成第一空间，所述主板具有第一面，所述第一面设有第一元器件，所述第一元器件位于所述第一空间内；
密封支架，所述密封支架与所述主板相连，且所述密封支架覆盖所述扬声器，所述密封支架与所述扬声器之间形成第二空间；
其中，所述第一空间通过所述避让孔与所述第二空间相连通，以形成封闭后腔。
本申请实施例中，主板与框架之间形成第一空间，密封支架与扬声器之间形成第二空间，第一空间通过主板的避让孔与第二空间相连通，以形成封闭后腔，由于主板与框架之间的第一空间可以作为扬声器的封闭后腔的一部分，因此该方案可以形成足够大的封闭后腔，并且不需要额外预留过大的空间以形成封闭后腔，以此提升电子设备的内部空间利用率；与此同时，密封支架可以隔开后盖和封闭后腔，当扬声器工作时，封闭后腔中的空气不会推动后盖，因此后盖不会振动，从而改善用户的使用体验。
附图说明
图1为本申请实施例公开的电子设备的部分结构的爆炸图；
图2为本申请实施例公开的电子设备的部分结构的剖视图。
附图标记说明：
100-框架、110-第一凸出部、111-第三通孔、120-第二凸出部；
200-扬声器；
300-主板、301-避让孔、310-第一孔壁、320-第二孔壁、302-第一面、303-第二面；
400-密封支架、401-第一内侧壁、402-第二内侧壁；
500-第一元器件；
610-第一空间、620-第二空间；
700-第一屏蔽罩；
800-扬声器前腔；
910-第一泡棉、920-双面胶、930-第二泡棉。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整的描述，显然，所描述的实施例是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
本申请的说明书和权利要求书中的术语“第一”、“第二”等是用于区别类似的对象，而不用于描述特定的顺序或先后次序。应该理解这样使用的数据在适当情况下可以互换，以便本申请的实施例能够以除了在这里图示或描述的那些以外的顺序实施。此外，说明书以及权利要求中“和/或”表示所连接对象的至少其中之一，字符“/”，一般表示前后关联对象是一种“或”的关系。
下面结合附图，通过具体的实施例及其应用场景对本申请实施例提供的电子设备进行详细地说明。
参考图1至图2，本申请实施例公开一种电子设备，其包括框架100、扬声器200、主板300、密封支架400和后盖。
框架100可以作为电子设备的基础构件，其可以为电子设备的其它零部件提供安装基础，可选地，框架100可以与后盖相连，框架100背离后盖的一侧可以安装电子设备的显示屏。
扬声器200设置于框架100，扬声器200通过使其周围的空气振动，从而产生声音。
主板300设置于框架100，主板300开设有避让孔301，扬声器200的一部分位于避让孔301内，也就是说，主板300围绕扬声器200设置，主板300 与扬声器200之间具有间隙A。主板300与框架100之间形成第一空间610，主板300具有第一面302，第一面302设有第一元器件500，第一元器件500位于第一空间610内，换言之，主板300背离后盖的一侧可以设置至少一个第一元器件500，这里的第一空间610用于容纳第一元器件500。
密封支架400与主板300相连，且密封支架400覆盖扬声器200，密封支架400与扬声器200之间形成第二空间620。第一空间610可以通过避让孔301与第二空间620相连通，以形成封闭后腔。即，通过设置密封支架400并在主板300上开设避让孔301，使得框架100、扬声器200、主板300和密封支架400共同形成封闭后腔。
本申请实施例中，由于主板300与框架100之间的第一空间610可以作为扬声器200的封闭后腔的一部分，因此该方案可以形成足够大的封闭后腔，并且不需要额外预留过大的空间以形成封闭后腔，以此提升电子设备的内部空间利用率；与此同时，密封支架400可以隔开后盖和封闭后腔，当扬声器200工作时，封闭后腔中的空气不会推动后盖，因此后盖不会振动，从而改善用户的使用体验。
为了实现第一元器件500的屏蔽，电子设备还包括第一屏蔽罩700，第一屏蔽罩700设置于主板300的第一面302，且第一屏蔽罩700覆盖至少一个第一元器件500，第一屏蔽罩700位于第一空间610内，此时，第一屏蔽罩700与主板300之间的空间为第一子空间，第一屏蔽罩700与框架100之间的空间为第二子空间。一种可选的实施例中，为了改善第一元器件500的屏蔽效果，第一屏蔽罩700通常采用封闭结构，因此第一子空间将与第二子空间隔开，进一步地，为了充分利用第一子空间，可以使第一屏蔽罩700设有第一通孔，第一子空间通过该第一通孔与第二子空间相连通，此时第一子空间和所述第二子空间均为封闭后腔的一部分，从而增大封闭后腔，以此改善扬声器200的音效。
第一屏蔽罩700的数量可以仅为一个，通过该第一屏蔽罩700可以覆盖 所有的第一元器件500，另一种可选的实施例中，电子设备还包括至少两个第一屏蔽罩700，第一屏蔽罩700设置于第一面302，且第一屏蔽罩700覆盖至少一个第一元器件500，相邻的第一屏蔽罩700之间具有间隙，该间隙为封闭后腔的一部分。此实施例通过增加第一屏蔽罩700的数量，使得相邻的第一屏蔽罩700之间的空间可以作为封闭后腔的一部分，从而增大封闭后腔，以此改善扬声器200的音效。与此同时，该实施例不要求第一屏蔽罩700必须开孔，从而可以改善第一屏蔽罩700对第一元器件500的屏蔽效果，还可以提升第一屏蔽罩700的结构强度。
主板300还具有与第一面302相背的第二面303，该第二面303可以朝向后盖。进一步的实施例中，第二面303设有第二元器件和第二屏蔽罩，第二屏蔽罩覆盖至少一个第二元器件，第二屏蔽罩与主板300之间形成第三空间，为了充分利用该第三空间，可以使主板300设有第二通孔，主板300与框架100之间的第二空间620可以通过第二通孔与第三空间相连通，以使第三空间为封闭后腔的一部分。此时，第二屏蔽罩与主板300之间的第三空间也可以作为封闭后腔的一部分，从而进一步扩大封闭后腔，以此改善扬声器200的音效。
可选地，密封支架400与主板300的连接位置可以是避让孔301的孔壁，也可以是主板300的第一面302，还可以是主板300的第二面303。相对而言，当密封支架400与主板300的第二面303相连时，避让孔301的尺寸不会受到密封支架400的限制，因此更便于主板300的结构设计。同时，避让孔301可以在避让扬声器200的前提下尽量设置得小一些，从而缓解避让孔301对主板300的结构强度的削弱，使得主板300的结构强度更高，同时还可以增加主板300的板面面积，以便于在主板300上设置更多的元器件。可选地，密封支架400可以通过第一泡棉910与主板300的第二面303相连并密封配合，从而提升封闭后腔的密封性。
密封支架400具有相对的第一内侧壁401和第二内侧壁402，第一内侧 壁401和第二内侧壁402均朝向扬声器200，第一内侧壁401位于第一元器件500和第二内侧壁402之间，也就是说，第一内侧壁401比第二内侧壁402更靠近第一元器件500，第二内侧壁402则比第一内侧壁401更靠近主板300的边缘。避让孔301具有相对的第一孔壁310和第二孔壁320，第一孔壁310和第二孔壁320均朝向扬声器200，第一孔壁310位于第一元器件500和第二孔壁320之间，也就是说，第一孔壁310比第二孔壁320更靠近第一元器件500，第二孔壁320则比第一孔壁310更靠近主板300的边缘。第一内侧壁401可以与第一孔壁310至少部分对齐，或者第一孔壁310可以相对于第一内侧壁401沿靠近扬声器200的方向伸出，相对而言，后一种设置方式会导致密封支架400的尺寸增大，从而占用主板300过多的板面空间，而前一种设置方式则可以适当减小密封支架400的尺寸，从而缓解密封支架400对主板300的板面空间的占用，并且当封闭后腔中的空气振动时，主板300不会因第二孔壁320相对于第一内侧壁401伸出而对空气产生阻力，因此该结构还可以改善扬声器200的音效。
第二孔壁320可以与第二内侧壁402对齐，或者第二孔壁320相对于第二内侧壁402沿靠近扬声器200的方向伸出。考虑到主板300的边缘基本不会设置元器件，因此为了充分利用主板300的边缘空间，可以使第二孔壁320相对于第二内侧壁402沿靠近扬声器200的方向伸出，从而增大密封支架400的尺寸，使得封闭后腔更大，以此改善扬声器200的音效。
可选的实施例中，框架100朝向第一元器件500的一面设有第一凸出部110，扬声器200设置于第一凸出部110，且扬声器200与第一凸出部110密封配合，可选地，扬声器200可以通过双面胶920与第一凸出部110相连并密封配合，从而提升封闭后腔的密封性。由于扬声器200的至少一部分需要穿过主板300的避让孔301并位于密封支架400内，因此相比于扬声器200直接安装在框架100朝向第一元器件500的一面的方案，采用此种通过第一凸出部110安装扬声器200的方式后，框架100与主板300之间的距离可以 增大，从而使得主板300上可以设置更多规格的第一元器件500，同时还可以增大第二空间620，使得扬声器200的音效更好。
为了便于安装主板300，框架100朝向第一元器件500的一面还设有第二凸出部120，主板300设置于第二凸出部120，且主板300与第二凸出部120密封配合，可选地，主板300通过第二泡棉930与第二凸出部120密封配合，从而提升封闭后腔的密封性。第二凸出部120的高度可以等于第一凸出部110的高度，这里的高度所在方向为垂直于主板300的方向。此时主板300开设避让孔301的部分距离第一凸出部110较近，进而导致主板300的该部分与第一凸出部110之间的间隙过小，不利于空气在封闭后腔内振动。为了解决这一问题，可以使第二凸出部120的高度大于第一凸出部110的高度，从而增大主板300开设避让孔301的部分与第一凸出部110之间的距离，从而便于空气在封闭后腔内振动。与此同时，该结构还可以增大第二空间620，从而进一步改善扬声器200的音效。
进一步地，当框架100设有第一凸出部110时，第一凸出部110设有第三通孔111，扬声器200朝向第三通孔111设置，框架100和扬声器200共同形成扬声器前腔800，扬声器前腔800位于扬声器200背离密封支架400的一侧。当扬声器200振动时，其可以通过驱动扬声器前腔800中的空气振动，从而产生声波，进而使用户可以听到电子设备发出的声音。在第一凸出部110上设置第三通孔111，并使扬声器200朝向第三通孔111设置，一方面可以利用框架100和扬声器200形成扬声器前腔800，使扬声器前腔800的结构更加简单，另一方面可以减小框架100的重量，进而可以使电子设备更加轻盈。
本申请实施例公开的电子设备可以是智能手机、平板电脑、电子书阅读器、可穿戴设备(例如智能手表)、电子游戏机等电子设备，本申请实施例对电子设备的种类不作具体限制。
上面结合附图对本申请的实施例进行了描述，但是本申请并不局限于上述的具体实施方式，上述的具体实施方式仅仅是示意性的，而不是限制性的， 本领域的普通技术人员在本申请的启示下，在不脱离本申请宗旨和权利要求所保护的范围情况下，还可做出很多形式，均属于本申请的保护之内。

Claims (10)

  1. 一种电子设备，包括：
    框架；
    扬声器，所述扬声器设置于所述框架；
    主板，所述主板设置于所述框架，所述主板开设有避让孔，所述扬声器的一部分位于所述避让孔内，所述主板与所述框架之间形成第一空间，所述主板具有第一面，所述第一面设有第一元器件，所述第一元器件位于所述第一空间内；
    密封支架，所述密封支架与所述主板相连，且所述密封支架覆盖所述扬声器，所述密封支架与所述扬声器之间形成第二空间；
    其中，所述第一空间通过所述避让孔与所述第二空间相连通，以形成封闭后腔。
  2. 根据权利要求1所述的电子设备，其中，所述电子设备还包括第一屏蔽罩，所述第一屏蔽罩设置于所述第一面，且所述第一屏蔽罩覆盖至少一个所述第一元器件，所述第一屏蔽罩设有第一通孔；
    其中，所述第一屏蔽罩与所述主板之间的空间为第一子空间，所述第一屏蔽罩与所述框架之间的空间为第二子空间，所述第一子空间通过所述第一通孔与所述第二子空间相连通，所述第一子空间和所述第二子空间均为所述封闭后腔的一部分。
  3. 根据权利要求1所述的电子设备，其中，所述电子设备还包括至少两个第一屏蔽罩，所述第一屏蔽罩设置于所述第一面，且所述第一屏蔽罩覆盖至少一个所述第一元器件，相邻的所述第一屏蔽罩之间具有间隙，所述间隙为所述封闭后腔的一部分。
  4. 根据权利要求1所述的电子设备，其中，所述主板还具有与所述第一面相背的第二面，所述第二面设有第二元器件和第二屏蔽罩，所述第二屏蔽罩覆盖至少一个所述第二元器件，所述主板设有第二通孔，所述第二屏蔽罩与所述主板之间形成第三空间，所述第二空间通过所述第二通孔与所述第三 空间相连通，所述第三空间为所述封闭后腔的一部分。
  5. 根据权利要求1所述的电子设备，其中，所述主板还具有与所述第一面相背的第二面，所述密封支架与所述第二面相连。
  6. 根据权利要求5所述的电子设备，其中，所述密封支架具有相对的第一内侧壁和第二内侧壁，所述第一内侧壁和所述第二内侧壁均朝向所述扬声器，所述第一内侧壁位于所述第一元器件和所述第二内侧壁之间，所述避让孔具有相对的第一孔壁和第二孔壁，所述第一孔壁和所述第二孔壁均朝向所述扬声器，所述第一孔壁位于所述第一元器件和所述第二孔壁之间；
    所述第一内侧壁与所述第一孔壁至少部分对齐。
  7. 根据权利要求6所述的电子设备，其中，所述第二孔壁相对于所述第二内侧壁沿靠近所述扬声器的方向伸出。
  8. 根据权利要求1所述的电子设备，其中，所述框架朝向所述第一元器件的一面设有第一凸出部，所述扬声器设置于所述第一凸出部，且所述扬声器与所述第一凸出部密封配合。
  9. 根据权利要求8所述的电子设备，其中，所述框架朝向所述第一元器件的一面还设有第二凸出部，所述主板设置于所述第二凸出部，且所述主板与所述第二凸出部密封配合，所述第二凸出部的高度大于所述第一凸出部的高度。
  10. 根据权利要求8所述的电子设备，其中，所述第一凸出部设有第三通孔，所述扬声器朝向所述第三通孔设置，所述框架和所述扬声器共同形成扬声器前腔，所述扬声器前腔位于所述扬声器背离所述密封支架的一侧。
PCT/CN2022/103571 2021-07-07 2022-07-04 电子设备 WO2023280089A1 (zh)

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